Electronic device including electrostatic discharge path

Abstract

An electronic device is provided. The electronic device may include: a first housing including a conductive first side frame; a second housing including a conductive second side frame; a flexible display disposed on the first housing and the second housing; a hinge module rotatably coupled between the first housing and the second housing; and a printed circuit board disposed in the first housing or the second housing and including: a conductive member electrically connected to the conductive first side frame or the conductive second side frame; a signal layer; a ground layer; and an insulating layer. The printed circuit board may include at least one discharge hole that is recessed from the surface of the printed circuit board such that the ground layer is visible from the outside and that forms a gap between the ground layer and any one of the signal layer and the conductive member.

Description

Electronic devices containing electrostatic discharge paths

[0001] The present disclosure relates to an electronic device including an electrostatic discharge path.

[0002] With the advancement of electronics, information, and communication technologies, a variety of functions are being integrated into a single portable communication device or electronic device. For example, smartphones incorporate functions such as audio playback, photography, and electronic notebooks in addition to communication functions. Furthermore, the installation of additional applications allows smartphones to offer even more diverse functions.

[0003] As the use of personal or portable communication devices such as smartphones becomes more widespread, user demand for portability and ease of use is increasing. For example, a touchscreen display, while functioning as an output device that displays visual information, can also provide a virtual keypad that replaces mechanical input devices (e.g., button-type input devices). This allows portable communication devices or electronic devices to be miniaturized while still offering the same or improved usability (e.g., larger screens). On the other hand, the commercialization of flexible displays, such as foldable or rollable displays, is expected to further enhance the portability and ease of use of electronic devices.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] Aspects of the present disclosure address at least the problems and / or disadvantages mentioned above, and provide at least the advantages described below. Accordingly, an aspect of the present disclosure provides an electronic device including an electrostatic discharge path.

[0006] Additional aspects will be described in part in the description below, and in part will be obvious from the description, or may be learned by practicing the embodiments provided.

[0007] According to one aspect of the present disclosure, an electronic device is provided. The electronic device may include a first housing including a first conductive side frame, a second housing including a second conductive side frame, a flexible display disposed on the first housing and the second housing, a hinge module rotatably coupled between the first housing and the second housing, and a printed circuit board disposed on the first housing or the second housing, the printed circuit board including a conductive member, a signal layer, a ground layer, and an insulating layer electrically connected to the first conductive side frame or the second conductive side frame. The printed circuit board may include at least one discharge hole recessed from a surface of the printed circuit board such that the ground layer is visible from the outside and forms a gap between the signal layer or the conductive member and the ground layer.

[0008] According to one aspect of the present disclosure, an electronic device is provided. The electronic device may include a first housing including a first conductive side frame, a second housing including a second conductive side frame, a flexible display disposed on the first housing and the second housing, a hinge module rotatably coupled between the first housing and the second housing, and a printed circuit board disposed on the first housing or the second housing, the printed circuit board including a conductive pad, a signal layer, a ground layer, and an insulating layer electrically connected to the first conductive side frame or the second conductive side frame. The ground layer may include a plurality of conductive layers. At least one of the plurality of conductive layers may include a discharge portion disposed on the same plane as one side of the printed circuit board so as to be visible from the outside.

[0009] According to one aspect of the present disclosure, an electronic device is provided. The electronic device may include a housing including a conductive side frame, a printed circuit board disposed in the housing, the printed circuit board including a conductive member electrically connected to the side frame, a signal layer, a ground layer, and an insulating layer. The printed circuit board may include at least one discharge hole recessed from a surface of the printed circuit board such that the ground layer is visible from the outside, and forming a gap between either the signal layer or the conductive member and the ground layer.

[0010] Other aspects, advantages, and important features of the present disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments of the present disclosure taken in conjunction with the accompanying drawings.

[0011] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0012] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0013] FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 3 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 5A is a plan view of a first housing according to one embodiment of the present disclosure.

[0017] FIG. 5b is a plan view of a second housing according to one embodiment of the present disclosure.

[0018] FIG. 6 is a cross-sectional view of an electronic device including an ESD path according to one embodiment of the present disclosure.

[0019] FIG. 7 is an enlarged view of portion A of FIG. 6 according to one embodiment of the present disclosure.

[0020] FIG. 8 is a cross-sectional view of an electronic device including an ESD path according to one embodiment of the present disclosure.

[0021] FIG. 9a is an enlarged view of portion B of FIG. 8 according to one embodiment of the present disclosure.

[0022] FIG. 9b is a plan view of a printed circuit board viewed from above, enlarged from part C of FIG. 9a, according to one embodiment of the present disclosure.

[0023] FIG. 10 is a schematic diagram of an electronic device including an ESD path according to one embodiment of the present disclosure.

[0024] FIG. 11 is a schematic diagram of a printed circuit board according to one embodiment of the present disclosure.

[0025] The same reference numbers are used throughout the drawing to indicate the same elements.

[0026] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While this description includes numerous specific details to facilitate this understanding, these are to be considered merely exemplary. Accordingly, those skilled in the art will recognize that various modifications and variations to the various embodiments described herein may be made without departing from the scope and spirit of the present invention. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0027] The terms and words used in the following description and claims are not intended to be limited to their bibliographic meanings, but are merely used to ensure a clear and consistent understanding of the present disclosure by the inventors. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the present disclosure, which is defined by the appended claims and their equivalents.

[0028] The singular forms "a," "an," and "the" should be understood to include the plural unless the context clearly indicates otherwise. Thus, for example, reference to "a component aspect or surface" includes reference to one or more such aspects or surfaces.

[0029] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0030] The embodiments and terminology used in this document are not intended to limit the technical features described herein to specific embodiments, but should be understood to encompass various modifications, equivalents, or alternatives of the embodiments. In connection with the description of the drawings, similar reference numerals may be used to refer to similar or related components.

[0031] In this document, phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another component (e.g., a second) with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0032] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0033] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0034] It should be understood that each block of the flowchart and the combination of flowcharts can be performed by one or more computer programs containing instructions. One or more computer programs may be stored in their entirety on a single memory device, or one or more computer programs may be divided into multiple parts and stored on multiple memory devices.

[0035] All functions or operations described herein may be performed by a single processor or a combination of processors. A single processor or a combination of processors is a circuit that performs processing and includes circuits such as an application processor (AP, e.g., a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a wireless fidelity (Wi-Fi) chip, a Bluetooth® chip, a global positioning system (GPS) chip, a near-field communication (NFC) chip, a connection chip, a sensor controller, a touch controller, a fingerprint sensor controller, a display driver integrated circuit (IC), an audio codec chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on a chip (SoC), an IC, and the like.

[0036] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0037] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0038] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0039] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0040] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or nonvolatile memory (134). The nonvolatile memory (134) can include built-in memory (136) and external memory (138).

[0041] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0042] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0043] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0044] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0045] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0046] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0047] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0048] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0049] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0050] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0051] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0052] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0053] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0054] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0055] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0056] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0057] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0058] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0059] FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0060] FIG. 3 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0061] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0062] The electronic devices illustrated in FIGS. 2 to 4 are for illustrative purposes only, and the present disclosure is not limited by the drawings. The XYZ coordinate systems illustrated in FIGS. 2 to 4 are for illustrative purposes only, and do not limit the scope of the invention.

[0063] Referring to FIGS. 2 to 4, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include at least one pair of housings (210, 220). The pair of housings (210, 220) may be rotatably coupled to face each other and folded based on, for example, a hinge (e.g., the hinge (240) of FIG. 4).

[0064] According to one embodiment, a pair of housings (210, 220) may include a first housing (210) and a second housing (220). The first housing (210) and the second housing (220) may be arranged on opposite sides with a folding axis (F) as the center. One end region of the first housing (210) and one end region of the second housing (220) may be arranged side by side with a hinge (240) therebetween. The first housing (210) and the second housing (220) may have a shape that is symmetrical with respect to a plane that includes the folding axis (F) and extends in the Z-axis direction. The folding axis (F) may be an axis extending in the X-direction formed by the hinge (240).

[0065] In one embodiment, the first housing (210) may have substantially the same length (e.g., length in the Y-axis direction) as the second housing (220), but is not limited thereto. The first housing (210) may have substantially the same width (e.g., width in the X-axis direction) as the second housing (220), but is not limited thereto.

[0066] Hereinafter, the 'unfolded state' or 'flat state' may refer to a state in which the angle formed by the first housing (210) and the second housing (220) is substantially 180 degrees. The 'folded state' or 'folding state' may refer to a state in which the angle formed by the first housing (210) and the second housing (220) is substantially 0 degrees. The 'intermediate state' may refer to any state between the unfolded state and the folded state. According to one embodiment, in the electronic device (101), the first housing (210) and the second housing (220) may rotate about the hinge (240) to form an angle of 0 to 180 degrees. According to one embodiment, in the electronic device (101), the first housing (210) and the second housing (220) may rotate about the hinge (240) between 180 degrees and 360 degrees.

[0067] According to one embodiment, the first housing (210) may include a first surface (210a) and a second surface (210b). The first surface (210a) may be, for example, provided to face upward (e.g., in the +Z-axis direction). The first surface (210a) may be, for example, a surface on which at least a portion of the flexible display (230) is disposed. The first surface (210a) may refer to, for example, a virtual surface that overlaps at least a portion of the flexible display (230). The second surface (210b) may be, for example, provided to face downward (e.g., in the -Z-axis direction). The second surface (210b) may be, for example, a surface on which the sub-display (280) is disposed. The second surface (210b) may be, for example, a surface on which the first rear cover (212) is disposed. The second surface (210b) may be parallel to the first surface (210a). The second surface (210b) may refer to a plane defined by, for example, the first rear cover (212).

[0068] According to one embodiment, the second housing (220) may include a third surface (220a) and a fourth surface (220b). The third surface (220a) may be, for example, provided to face upward (e.g., in the +Z-axis direction). The third surface (220a) may be, for example, a surface on which at least a portion of the flexible display (230) is disposed. The third surface (220a) may refer to, for example, a virtual surface that overlaps at least a portion of the flexible display (230). The fourth surface (220b) may be, for example, provided to face downward (e.g., in the -Z-axis direction). The fourth surface (220b) may be, for example, a surface on which the second rear cover (222) is disposed. The fourth surface (220b) may be parallel to the third surface (220a). The fourth surface (220b) may refer to a plane defined by, for example, the second rear cover (222).

[0069] According to one embodiment, when the electronic device (101) is unfolded, the first side (210a) and the third side (220a) may be positioned within one arbitrary virtual plane (e.g., XY plane). For example, the first side (210a) and the third side (220a) may form the same plane when the electronic device (101) is unfolded. For example, the first side (210a) and the third side (220a) may be arranged to form a substantially 180 degree angle with respect to the XY plane when the electronic device (101) is unfolded. When the electronic device (101) is unfolded, the second side (210b) and the fourth side (220b) may be positioned within another arbitrary virtual plane (e.g., XY plane). For example, the second side (210b) and the fourth side (220b) may form the same plane when the electronic device (101) is unfolded. For example, the second side (210b) and the fourth side (220b) can be arranged to form a substantially 180 degree angle with respect to the XY plane in an unfolded state.

[0070] According to one embodiment, when the electronic device (101) is folded, at least a portion of the first side (210a) and at least a portion of the third side (220a) may face each other. For example, when the electronic device (101) is folded, the angle formed by the first side (210a) and the third side (220a) may be 0 degrees with respect to the XY plane. As the electronic device (101) is folded from an unfolded state, the angle formed by the first side (210a) and the third side (220a) with respect to the XY plane may gradually decrease. For example, in an intermediate state, the angle formed by the first side (210a) and the third side (220a) with respect to the XY plane may be determined between about 0 degrees and about 180 degrees. When the electronic device (101) is folded, the second side (210b) and the fourth side (220b) may be parallel to each other. For example, the second side (210b) and the fourth side (220b) may face opposite directions when the electronic device (101) is folded.

[0071] According to one embodiment, a pair of housings (210, 220) included in an electronic device (101) are not limited to the illustrated shape and combination, and may be implemented by other shapes or combinations and / or combinations of parts.

[0072] According to one embodiment, the first housing (210) may include a first side frame (211). The first side frame (211) may constitute a side of the first housing (210). The first side frame (211) may constitute a portion of the exterior of the first housing (210). The first side frame (211) may be provided to protect components housed inside the electronic device (101) from the outside.

[0073] According to one embodiment, the first side frame (211) may include a first side member (211a), a second side member (211b), and / or a third side member (211c). The first side member (211a) may have a first length along a first longitudinal direction (e.g., a Y-axis direction). The second side member (211b) may extend from the first side member (211a) in a substantially perpendicular direction (e.g., an X-axis direction). The second side member (211b) may extend to have a second length that is the same as or different from the first length. The third side member (211c) may extend from the second side member (211b) in a substantially perpendicular direction (e.g., a Y-axis direction). The third side member (211c) may extend in a direction that is substantially parallel to the first side member (211a). The third side member (211c) may have a first length along a first longitudinal direction (e.g., Y-axis direction).

[0074] According to one embodiment, the first side member (211a), the second side member (211b), and the third side member (211c) may be arranged to be visible from the outside. At least a portion of the first side member (211a), the second side member (211b), and / or the third side member (211c) may be formed as a curved surface. The first side frame (211) may be formed into a rectangular (e.g., square or rectangular) shape by the first side member (211a), the second side member (211b), and the third side member (211c). The first side member (211a), the second side member (211b), and the third side member (211c) may be formed integrally, but is not limited thereto.

[0075] According to one embodiment, the second housing (220) may include a second side frame (221). The second side frame (221) may constitute a side of the second housing (220). The second side frame (221) may constitute a part of the exterior of the second housing (220). The second side frame (221) may be provided to protect components housed inside the electronic device (101) from the outside.

[0076] According to one embodiment, the second side frame (221) can include a fourth side member (221a), a fifth side member (221b), and / or a sixth side member (221c). The fourth side member (221a) can have a third length along a first longitudinal direction (e.g., a Y-axis direction). The fifth side member (221b) can extend from the fourth side member (221a) in a substantially perpendicular direction (e.g., a X-axis direction). The fifth side member (221b) can extend to have a fourth length that is the same as or different from the third length. The sixth side member (221c) can extend from the fifth side member (221b) in a substantially perpendicular direction (e.g., a Y-axis direction). The sixth side member (221c) can extend in a direction substantially parallel to the fourth side member (221a). The sixth side member (221c) may have a third length along the first longitudinal direction (e.g., the Y-axis direction).

[0077] According to one embodiment, the fourth side member (221a), the fifth side member (221b), and the sixth side member (221c) may be arranged to be visible from the outside. At least a portion of the fourth side member (221a), the fifth side member (221b), and / or the sixth side member (221c) may be formed as a curved surface. The second side frame (221) may be formed into a rectangular (e.g., square or rectangular) shape by the fourth side member (221a), the fifth side member (221b), and the sixth side member (221c). The first length may be substantially equal to the third length. The second length may be substantially equal to the fourth length. The fourth side member (221a), the fifth side member (221b), and the sixth side member (221c) may be formed integrally, but is not limited thereto.

[0078] According to one embodiment, when the electronic device (101) is unfolded, the first side member (211a) and the fourth side member (221a) may be positioned substantially in a straight line. When the electronic device (101) is unfolded, the second side member (211b) and the fifth side member (221b) may be parallel to each other. When the electronic device (101) is unfolded, the third side member (211c) and the sixth side member (221c) may be positioned substantially in a straight line.

[0079] According to one embodiment, when the electronic device (101) is folded, the first side member (211a) and the fourth side member (221a) may be positioned to overlap each other. When the electronic device (101) is folded, the second side member (211b) and the fifth side member (221b) may be positioned to overlap each other. When the electronic device (101) is folded, the third side member (211c) and the sixth side member (221c) may be positioned to overlap each other.

[0080] According to one embodiment, the first housing (210) may include a first rear cover (212). The first rear cover (212) may form at least a portion of the second side (210b) of the first housing (210). The first rear cover (212) may be coupled to a first side frame (211). The first rear cover (212) may, for example, be formed integrally with the first side frame (211).

[0081] In one embodiment, the second housing (220) may include a second rear cover (222). The second rear cover (222) may form at least a portion of the fourth side (220b) of the second housing (220). The second rear cover (222) may be coupled to a second side frame (221). The second rear cover (222) may be formed integrally with the second side frame (221), for example.

[0082] According to one embodiment, the first rear cover (212) and / or the second rear cover (222) may be formed of at least one or a combination of coated or colored glass, ceramic, glassic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium).

[0083] According to one embodiment, the electronic device (101) may include a flexible display (230) (e.g., a foldable display or a main display). The flexible display (230) may be arranged across the first housing (210), the hinge (240), and the second housing (220). The flexible display (230) may be arranged to extend from a first side (210a) of the first housing (210) across the hinge (240) to at least a portion of a third side (220a) of the second housing (220). The flexible display (230) may be arranged to overlap the first side (210a) of the first housing (210) and / or the third side (220a) of the second housing (220). The flexible display (230) can have a portion corresponding to the hinge (240) that can be bent according to the rotation of the hinge (240).

[0084] In one embodiment, the flexible display (230) may be arranged so as to be visible from the outside when in an unfolded state. The flexible display (230) may be arranged so as to be invisible from the outside when in a folded state.

[0085] According to one embodiment, the electronic device (101) may include a sub-display (280) (or auxiliary display). The sub-display (280) may be arranged to be at least partially exposed on the second side (210b) of the first housing (210). The sub-display (280) may display status information of the electronic device (101) when the electronic device (101) is in a folded state. The sub-display (280) may be arranged to be visible from the outside through at least a portion of the first rear cover (212).

[0086] According to one embodiment, the electronic device (101) may include a protective cover (231). The protective cover (231) may be positioned to protect an edge or an edge portion of the flexible display (230). The protective cover (231) may form part of the exterior of the electronic device (101).

[0087] According to one embodiment, the electronic device (101) may include at least one of an input device (e.g., a microphone (203)), an audio output device (e.g., a call receiver (201) or a speaker (202)), a sensor module (204), a camera module (a first camera module (205) or a second camera module (208)), a physical button (206), a connector port (207), a key input device (not shown), or an indicator (not shown) disposed in a first internal space (214) of a first housing (210) or a second internal space (224) of a second housing (220). The electronic device (101) may be configured such that at least one of the above-described components is omitted, or other components are additionally included.

[0088] According to one embodiment, the input device may include a plurality of microphones arranged to detect the direction of sound. The audio output device may include, for example, a call receiver (201) and a speaker (202). The audio output device (e.g., receiver (201), speaker (202)) may be arranged to face the outside through at least one speaker hole formed in the first housing (210) or the second housing (220). The connector port (207) may be arranged to face the outside through a connector port hole formed in the first housing (210) or the second housing (220).

[0089] According to one embodiment, the sensor module (204) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204) can include at least one of a proximity sensor, an illuminance sensor, a time of flight (TOF) sensor, an ultrasonic sensor, a fingerprint recognition sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, or a humidity sensor.

[0090] According to one embodiment, the camera module may include a first camera module (205) disposed on the front (e.g., +Z-axis direction side) of the electronic device (101) or a second camera module (208) disposed on the rear (e.g., -Z-axis direction side). The first camera module (205) and / or the second camera module (208) may include one or more lenses, an image sensor, and / or an image signal processor. As an example, the first camera module (205) may be disposed under the flexible display (230) and configured to capture an object through a portion of an active area of ​​the flexible display (230). A flash (209) may be positioned on the second camera module (208). The flash (209) may include, for example, a light-emitting diode or a xenon lamp.

[0091] According to one embodiment, the electronic device (101) may include an antenna. The antenna may include, for example, an ultra-wide band (UWB) antenna, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, enable short-range communication with an external device or wirelessly transmit and receive power required for charging.

[0092] In one embodiment, an antenna structure may be formed by a portion or a combination of the housings (210 and / or 220). For example, the antenna may include a communication antenna that is at least partially exposed to the exterior of the electronic device (101) and forms at least a portion of the exterior of the electronic device (101). The communication antenna may be used for communication with an external electronic device (e.g., Wi-Fi).

[0093] In the detailed description below, a configuration in which a pair of housings (or, "housings") are rotatably coupled by a hinge structure (or, "hinge structure") may be exemplified. However, it should be noted that this embodiment does not limit the electronic device according to various embodiments disclosed in the present document. For example, the electronic device according to various embodiments disclosed in the present document may include three or more housings, and "a pair of housings" in the embodiments disclosed below may mean "two housings rotatably coupled to each other among the three or more housings."

[0094] FIG. 5A is a plan view of a first housing according to one embodiment of the present disclosure.

[0095] FIG. 5b is a plan view of a second housing according to one embodiment of the present disclosure.

[0096] The embodiments of FIGS. 5a and 5b can be optionally combined with the embodiments of FIGS. 1 to 4 and the embodiments of FIGS. 6 to 8, 9a, 9b, 10, and 11.

[0097] Referring to FIGS. 5A and 5B, an electronic device (101) according to one embodiment may include a first housing (210) and a second housing (220) forming an exterior of the electronic device (101).

[0098] According to one embodiment, the first housing (210) may include a first side frame (211) that constitutes a portion of the exterior of the first housing (210). For example, the first side frame (211) may constitute a side of the first housing (210).

[0099] According to one embodiment, the first side frame (211) may be formed of a conductive material such as a metal material. For example, the first side frame (211) may be formed of a metal material including aluminum (Al) or titanium.

[0100] According to one embodiment, the first side frame (211) may be made of a conductive material and thus may function as an antenna (or antenna radiator) of the electronic device (101). The first side frame (211) may transmit or receive a communication signal (e.g., an RF signal) to or from an external electronic device (e.g., an electronic device (102), an electronic device (104), or a server (108)). The first side frame (211) may be electrically connected to a communication module (e.g., a communication module (190) of FIG. 1) of the electronic device (101). For example, the first side frame (211) may be electrically connected to the communication module via an RF wire. The RF wire may be configured to transmit an RF (radio frequency) signal. For example, the RF wiring may be configured to transmit an RF signal processed by a communication module of the electronic device (101) to a first side frame (211) that acts as an antenna, or to transmit an RF signal received by the first side frame (211) to the communication module.

[0101] According to one embodiment, the first side frame (211) may include a plurality of first segments (212). The first side frame (211) may be physically segmented into a plurality of portions by the plurality of first segments (212). The first segments (212) may be spaces (or gaps) formed in the first side frame (211) such that one first side frame (211) is segmented into a plurality of portions. The first segments (212) may be spaces (or gaps) formed between the plurality of first side frames (211) as the plurality of first side frames (211) are spaced apart from each other.

[0102] According to one embodiment, the first side frame (211) may include a first-first side frame (211a) and a first-second side frame (211b) physically segmented by a plurality of first segments (212). The first-first side frame (211a) may be a portion of the first side frame (211) disposed between corners of the first housing (210). The first-second side frame (211b) may be a portion of the first side frame (211) that includes a corner of the first housing (210).

[0103] According to one embodiment, the first side frame (211) may include a plurality of first insulating members (213) arranged on corresponding first insulating portions (212). The first side frame (211) may be electrically segmented by the first insulating members (213). The first insulating members (213) may include a material having low conductivity or a material having low permittivity. When the first side frame (211) is used as an antenna of the electronic device (101), the resonant frequency of the antenna may be determined according to the physical length of the first side frame (211). The first side frame (211) may be segmented into a plurality of portions (e.g., a first-first side frame (211a) and a first-second side frame (211b)) having different lengths by the first insulating members (213) arranged on the first segmented portions (212) of the first side frame (211). The segmented frames (e.g., the first-first side frame (211a) and the first-second side frame (211b)) may have different resonant frequencies. The electronic device (101) may perform communication (e.g., short-range communication or long-range communication) in various frequency bands through the segmented frames (e.g., the first-first side frame (211a) and the first-second side frame (211b)) having different resonant frequencies.

[0104] According to one embodiment, the first side frame (211) may be electrically connected to an electronic component (e.g., a communication module (190) of FIG. 1 or a printed circuit board (300) of FIG. 6) disposed within the housing (210, 220) via a conductive member (215). For example, the conductive member (215) may include at least one of a C-clip, a conductive foam, a conductive gasket, or a conductive tape.

[0105] According to one embodiment, the second housing (220) may include a second side frame (221) that forms part of the exterior of the second housing (220). For example, the second side frame (221) may form a side of the second housing (220).

[0106] According to one embodiment, the second side frame (221) of the second housing (220) may have the same shape, structure, and / or function as the first side frame (211) of the first housing (210) in whole or in part. For example, the second side frame (221) may be used as an antenna (or antenna radiator) like the first side frame (211).

[0107] According to one embodiment, the second side frame (221) may include a second-first side frame (221a) and a second-second side frame (221b) that are physically segmented by a plurality of second segments (222). According to one embodiment, the second side frame (221) may include a plurality of second insulating members (223) that are arranged on corresponding second insulating members (222). According to one embodiment, the second side frame (221) may be electrically connected to an electronic component (e.g., a communication module (190) of FIG. 1 or a printed circuit board (300) of FIG. 6) arranged within the housing (210, 220) through a conductive member (215).

[0108] According to one embodiment, the side frames (211, 221) may be electrically connected to at least one printed circuit board (e.g., the printed circuit board (300) of FIG. 6). The printed circuit board may be electrically connected to a ground or may include a ground. Charges accumulated in the electronic device (101) may be conducted to the side frames (211, 221) and may move to a ground having a relatively low potential through the printed circuit board. Herein, the accumulated charge may refer to charges generated by the operation of electronic components disposed inside the electronic device (101). Alternatively, the accumulated charge may refer to charges accumulated on the outside (or surface) of the electronic device (101) and conducted into the electronic device (101) through a gap formed in the electronic device (101). Hereinafter, the accumulated charge may mean all of the charges described above.

[0109] According to one embodiment, an electrostatic discharge (ESD) phenomenon may occur in the electronic device (101) due to the accumulated charge. The ESD phenomenon may refer to an electrical phenomenon that occurs when charges (or static electricity) accumulated in one part of the electronic device (101) due to various factors instantaneously move to another part of the electronic device (101).

[0110] According to one embodiment, charges accumulated in the electronic device (101) may move into the interior of the electronic device (101) through a gap formed by the design of the electronic device (101). If a grounding structure (or ESD path) for discharging charges accumulated in the electronic device (101) is not designed (or provided), the accumulated charges may be discharged to electronic components (e.g., the communication module (190) of FIG. 1) disposed inside the electronic device (101) and damage the electronic components.

[0111] In general, the electronic device may include an inductor (or shunt inductor) connected in parallel with the electronic component or antenna (e.g., the first side frame (211) or the second side frame (221)) for discharging the accumulated charge.

[0112] The above inductor can be electrically connected to the ground to form an ESD path through which accumulated charges move. By including the inductor, the electronic device can secure an ESD path for controlling ESD flowing in from a metal housing (e.g., first side frame (211), second side frame (221), or conductive member (215)).

[0113] However, when the frequency band is above a certain range (e.g., 4 GHz), the inductor connected to the antenna may operate like a capacitor due to the self resonant frequency (SRF), thereby reducing the performance of the antenna.

[0114] Various embodiments disclosed herein can provide a path for accumulated charge to travel (e.g., an ESD path) without the presence of an inductor.

[0115] Hereinafter, with reference to FIGS. 6 to 8, 9a, 9b, 10 and 11, an electronic device (101) including an ESD path will be described.

[0116] FIG. 6 is a cross-sectional view of an electronic device including an ESD path according to one embodiment of the present disclosure.

[0117] FIG. 7 is an enlarged view of portion A of FIG. 6 according to one embodiment of the present disclosure.

[0118] The embodiments of FIGS. 6 and 7 can be optionally combined with the embodiments of FIGS. 1 to 4, 5a and 5b, and the embodiments of FIGS. 8, 9a, 9b, 10, and 11.

[0119] The printed circuit board (300) of FIGS. 6 and 7 is described based on the case where it is connected to the first side frame (211) of the first housing (e.g., the first housing (210) of FIG. 4), but the same description may also be applied when the printed circuit board (300) is connected to the second side frame (221) of the second housing (e.g., the second housing (220)).

[0120] Referring to FIGS. 6 and 7, an electronic device (101) according to one embodiment may include a printed circuit board (PCB) (300) electrically connected to a side frame (e.g., a first side frame (211)) of a housing (e.g., a first housing (210) of FIG. 5A).

[0121] According to one embodiment, the printed circuit board (300) may include at least one of a conductive member (215), a signal layer (310), a ground layer (320), an insulating layer (330), an electronic component (340) (e.g., a communication module (190) of FIG. 1), a discharge hole (350), or a coating layer (360).

[0122] According to one embodiment, the conductive member (215) may be disposed on a printed circuit board (300). For example, the conductive member (215) may be disposed on a first surface (e.g., a surface facing the +Z-axis direction) of the printed circuit board (300). The conductive member (215) may be attached to the surface of the printed circuit board (300) through soldering. The conductive member (215) may be electrically connected to a signal layer (310) of the printed circuit board (300). For example, the conductive member (215) may be connected to a first conductive layer (or, uppermost signal layer, first signal layer) (3111) disposed at the uppermost among a plurality of first conductive layers (311) of the signal layer (310). The electronic device (101) can transmit an electrical signal (e.g., static electricity or a communication signal) from a side frame (e.g., a first side frame (211)) to a printed circuit board (300) through a conductive member (215).

[0123] According to one embodiment, the signal layer (310) may be configured to transmit an electrical signal (e.g., static electricity or a communication signal) to an electronic component (340) or a ground layer (320).

[0124] According to one embodiment, the signal layer (310) may include a plurality of conductive layers (or conductive layers) (311, 312). For example, the conductive layers of the signal layer (310) may have a copper foil form.

[0125] According to one embodiment, the signal layer (310) may include a plurality of first conductive layers (311) and a plurality of second conductive layers (312) that are alternately arranged in a vertical direction (or, up-down direction) (e.g., ±Z-axis direction). The plurality of first conductive layers (311) and the plurality of second conductive layers (312) may be arranged to be spaced apart from each other in the vertical direction.

[0126] According to one embodiment, the plurality of first conductive layers (311) may include odd-numbered layers (first, third, fifth, seventh layers, etc.) of signal layers (310) sequentially arranged from the upper side (e.g., +Z-axis direction) to the lower side (e.g., -Z-axis direction) of the printed circuit board (300). The plurality of first conductive layers (311) may be referred to as an odd-numbered conductive layer group. The plurality of first conductive layers (311) may be connected to each other through the first connecting portion (313).

[0127] According to one embodiment, the first conductive layer (or, uppermost signal layer) (3111) disposed at the uppermost among the plurality of first conductive layers (311) may be disposed across the capacitor area (A1) and the ground area (A2) to be described later. For example, the uppermost signal layer (3111) may extend in the horizontal direction (e.g., ±Y-axis direction) to span the capacitor area (A1) and the ground area (A2). The length of the uppermost signal layer (3111) may be designed to be longer (or greater) than the length of the remaining layers of the signal layer (310). The length of the uppermost signal layer (3111) may be designed to be longer (or greater) than the length of the layer (or, uppermost ground layer) (321) disposed at the uppermost among the plurality of layers of the ground layer (320).

[0128] According to one embodiment, the plurality of second conductive layers (312) may include even-numbered layers (second, fourth, sixth, eighth layers, etc.) of the signal layer (310) sequentially arranged from the upper side (e.g., in the +Z-axis direction) to the lower side (e.g., in the -Z-axis direction) of the printed circuit board (300). The plurality of second conductive layers (312) may be referred to as an even-numbered conductive layer group. The plurality of second conductive layers (312) may be connected to each other through the second connecting portion (314).

[0129] According to one embodiment, the signal layer (310) may function as a capacitor by being separated into a plurality of first conductive layers (311) and a plurality of second conductive layers (312). An area including the signal layer (310) in the printed circuit board (300) may be referred to as a capacitor area (A1).

[0130] According to one embodiment, a ground layer (320) may be provided for grounding the electronic device (101). The ground layer (320) may be electrically connected to a ground area (not shown) of the electronic device (101) or may form a separate ground area (A2).

[0131] According to one embodiment, the ground layer (320) may include a plurality of conductive layers. For example, the conductive layers of the ground layer (320) may have a copper foil form. The plurality of conductive layers of the ground layer (320) may be spaced apart from each other in a vertical direction (or, up-down direction) (e.g., ±Z-axis direction). An area including the ground layer (320) in the printed circuit board (300) may be referred to as a ground area (A2). For example, the ground area (A2) may include a ground layer (320) composed of a single layer that is in communication with the discharge hole (350).

[0132] According to one embodiment, the signal layer (310) and the ground layer (320) may be spaced apart in a horizontal direction (e.g., in the ±Y-axis direction).

[0133] In one embodiment, the insulating layer (330) can fill a space between the signal layer (310) and the ground layer (320). For example, the insulating layer (330) can be disposed between a plurality of conductive layers of the signal layer (310) (e.g., a plurality of conductive layers (311, 312)) or can surround a plurality of conductive layers of the signal layer (310). For example, the insulating layer (330) can be disposed between a plurality of conductive layers of the ground layer (320) or can surround a plurality of conductive layers of the ground layer (320). At least a portion of the insulating layer (330) can be exposed to the outside to form an exterior of the printed circuit board (300). For example, the insulating layer (330) can include FR-4, Teflon, epoxy, aluminum, fiberglass, or ceramic.

[0134] According to one embodiment, the electronic component (340) may be disposed on a printed circuit board (300). For example, the electronic component (340) may be disposed on a second side (e.g., a side facing the -Z-axis direction) of the printed circuit board (300) opposite to the first side. The electronic component (340) may be electrically connected to a signal layer (310) of the printed circuit board (300). For example, the electronic component (340) may be connected to a second conductive layer (or, a lowermost signal layer) (3121) disposed at the lowermost of a plurality of second conductive layers (312) of the signal layer (310) of the printed circuit board (300).

[0135] According to one embodiment, a discharge hole (350) may be provided for discharging electric charges (or static electricity) (E) accumulated in the electronic device (101). At least one discharge hole (350) may be provided. The discharge hole (350) may be formed by being recessed to a predetermined depth in a vertical direction (or up-down direction) (e.g., in the ±Z-axis direction) from a surface (e.g., a first surface) of the printed circuit board (300). For example, the discharge hole (350) may be recessed from a first conductive layer (or an uppermost signal layer) (3111) disposed at the uppermost among a plurality of first conductive layers (311) of the signal layer (310) to a second ground layer (or an exposed ground layer) (322) among a plurality of layers of the ground layer (320). The second ground layer (322) of the ground layer (320) may be visible (or exposed) from the outside by the discharge hole (350). The discharge hole (350) can be defined by one side (3112) of the first conductive layer (3111), one side (331) of the insulating layer (330), and the upper surface (3221) of the ground layer (320) (e.g., the second ground layer (322)).

[0136] According to one embodiment, the discharge hole (350) can induce discharge of accumulated charge (or static electricity) (E) of the electronic device (101) from the signal layer (310) to the ground layer (320). For example, the accumulated charge of the electronic device (101) can be discharged between a signal layer (e.g., the topmost signal layer (3111)) and a ground layer (e.g., the exposed ground layer (322)) that are vertically spaced apart through the space occupied by the discharge hole (350). The electronic device (101) can include an ESD path (P1) composed of a side frame (e.g., the first side frame (211)), a conductive member (215), a signal layer (e.g., the topmost signal layer (3111)), and an exposed ground layer (e.g., the second ground layer (322)) through the discharge hole (350).

[0137] According to one embodiment, a plurality of discharge holes (350) may be provided. When the number of discharge holes (350) provided on the printed circuit board (300) increases, the discharge effect may be improved by increasing the movement of charges through the discharge holes (350).

[0138] According to one embodiment, the coating layer (360) may cover at least a portion of the surface of the printed circuit board (300). The coating layer (360) may be provided to prevent corrosion of a layer of the printed circuit board (300) that is exposed to the outside. For example, the coating layer (360) may be gold-plated, but the present disclosure is not limited thereto. The coating layer (360) may cover the surface (3112) of the signal layer (310) that is exposed to the outside. For example, the coating layer (360) may cover the upper surface (3112a) and the side surface (3112b) of the uppermost signal layer (3111) of the signal layer (310). The coating layer (360) may cover the surface (3221) of the ground layer (320) that is exposed to the outside. For example, the coating layer (360) may cover the upper surface (3221) of the second ground layer (322) of the externally exposed ground layer (320). On the other hand, the coating layer (360) may not be provided on the surface (331) of the externally exposed insulating layer (330) for electrostatic discharge (ESD).

[0139] FIG. 8 is a cross-sectional view of an electronic device including an ESD path according to one embodiment of the present disclosure.

[0140] FIG. 9a is an enlarged view of portion B of FIG. 8 according to one embodiment of the present disclosure.

[0141] FIG. 9b is a plan view of a printed circuit board viewed from above, enlarged from part C of FIG. 9a, according to one embodiment of the present disclosure.

[0142] The embodiments of FIGS. 8, 9a and 9b can be optionally combined with the embodiments of FIGS. 1 to 4, 5a, 5b, 6 and 7, and the embodiments of FIGS. 10 and 11.

[0143] The printed circuit board (300-1) of FIGS. 8 and 9b may be entirely or partially identical to the printed circuit board (300) of FIGS. 6 and 7.

[0144] Referring to FIGS. 8, 9a, and 9b, a printed circuit board (300-1) according to one embodiment may include at least one of a conductive member (215), a signal layer (310-1), a ground layer (320-1), an insulating layer (330), an electronic component (340), or a protective layer (370).

[0145] According to one embodiment, the first conductive layer (or, uppermost signal layer) (3111-1) disposed at the uppermost among the plurality of first conductive layers (311-1) of the signal layer (310-1) may overlap with the conductive member (215). For example, the uppermost signal layer (3111-1) may be covered by the conductive member (215) when the printed circuit board (300-1) is viewed from above (e.g., in the +Z-axis direction). The length of the uppermost signal layer (3111-1) may be designed to be shorter (or smaller) than the lengths of the remaining layers of the signal layer (310-1).

[0146] According to one embodiment, the uppermost layer (or, uppermost ground layer) (321-1) among the plurality of layers of the ground layer (320-1) may be arranged across the capacitor area (A1) and the ground area (A2). For example, the uppermost ground layer (321-1) may extend horizontally (e.g., in the ±Y-axis direction) to span the capacitor area (A1) and the ground area (A2). The length of the uppermost ground layer (321-1) may be designed to be longer (or greater) than the length of the remaining layers of the ground layer (320-1). The length of the uppermost ground layer (321-1) may be designed to be longer (or greater) than the length of the uppermost signal layer (3111-1) of the signal layer (310-1).

[0147] According to one embodiment, the conductive member (215) can be attached (or soldered) onto the printed circuit board (300-1) via a solder member (216).

[0148] According to one embodiment, the protective layer (370) may form at least a portion of the surface of the printed circuit board (300-1). The protective layer (370) may be provided by coating (e.g., polymer coating) the surface of the printed circuit board (300-1) to protect the printed circuit board (300-1) from the outside. For example, the protective layer (370) may reduce physical damage to the printed circuit board (300-1) due to scratches or friction, or chemical damage such as corrosion due to the external environment. For example, the protective layer (370) may include a solder resist or a solder mask. The protective layer (370) may be arranged to extend over the insulating layer (330) and / or the ground layer (320-1), as illustrated in FIG. 9A.

[0149] According to one embodiment, the protective layer (370) may include a discharge hole (350-1) penetrating the protective layer (370). The discharge hole (350-1) may be formed by being recessed to a predetermined depth in a vertical direction (or, up-down direction) (e.g., in the ±Z-axis direction) from the surface of the printed circuit board (300-1) (e.g., the protective layer (370)). For example, the discharge hole (350-1) may be recessed from the protective layer (370) to the uppermost ground layer (321-1) among the multiple layers of the ground layer (320-1). At least a portion of the uppermost ground layer (321-1) of the ground layer (320-1) may be opened at the upper side by the discharge hole (350-1).

[0150] According to one embodiment, the discharge hole (350-1) may be located on the lower side of the conductive member (215). The discharge hole (350-1) may be arranged between the conductive member (215) and the uppermost ground layer (321-1) of the ground layer (320-1). The discharge hole (350-1) may be defined by a lower surface of the conductive member (215) (e.g., a surface facing the -Z-axis direction), a side of the protective layer (370), and an upper surface (e.g., a surface facing the +Z-axis direction) of the uppermost ground layer (321-1) of the ground layer (320-1).

[0151] According to one embodiment, a plurality of discharge holes (350-1) may be provided. The plurality of discharge holes (350-1) may be located in an area occupied by a protective layer (370) on the surface of the printed circuit board (300-1), as illustrated in FIG. 9B. For example, the plurality of discharge holes (350-1) may be arranged between solder members (e.g., solder pads) (216) on the area occupied by the protective layer (370).

[0152] According to one embodiment, the discharge hole (350-1) may be provided for discharging the charge (or static electricity) (E) accumulated in the electronic device (101). The discharge hole (350-1) may induce the discharge of the accumulated charge (or static electricity) (E) of the electronic device (101) from the conductive member (215) to the ground layer (320-1). For example, the accumulated charge of the electronic device (101) may be discharged between the conductive member (215) and the ground layer (e.g., the uppermost ground layer (321-1)) that are vertically spaced apart through the space occupied by the discharge hole (350-1). The electronic device (101) may include an ESD path (P2) consisting of a side frame (e.g., a first side frame (211)), a conductive member (215) and a ground layer (e.g., a top ground layer (321-1)) through a discharge hole (350-1).

[0153] According to one embodiment, the thickness of the protective layer (370) may be thinner (or smaller) than the thickness of the insulating layer (330). For example, the thickness of the protective layer (370) may be about 20 μm, and the thickness of the insulating layer (330) may be about 30 μm. In this case, as illustrated in FIGS. 9A and 9B, the vertical separation distance between the conductive member (215) and the ground layer (320) may be shorter than the vertical separation distance between the first signal layer (310) and the ground layer (320) as illustrated in FIG. 7, thereby facilitating the discharge of static electricity.

[0154] FIG. 10 is a schematic diagram of an electronic device including an ESD path according to one embodiment of the present disclosure.

[0155] The embodiment of FIG. 10 can be optionally combined with the embodiments of FIGS. 1 to 4, FIGS. 5a, 5b, FIGS. 6 to 8, FIGS. 9a and 9b, and the embodiment of FIG. 11.

[0156] The printed circuit board (300-2) of FIG. 10 may be the same as all or part of the printed circuit boards (300, 300-1) of FIGS. 6 to 8, FIGS. 9a and 9b.

[0157] Referring to FIG. 10, a printed circuit board (300-2) according to one embodiment may include at least one of a conductive member (215-1), a signal layer (e.g., a signal layer (310-1) of FIG. 8), a ground layer (e.g., a ground layer (320-1) of FIG. 8), an insulating layer (330), an electronic component (e.g., an electronic component (340) of FIG. 8), or a protective layer (370).

[0158] According to one embodiment, the conductive member (215-1) may include a discharge protrusion (2151) protruding toward the discharge hole (350-2). The discharge protrusion (2151) may protrude from one side of the conductive member (215-1) (e.g., one side facing the -Y-axis direction). The discharge protrusion (2151) may be positioned on the upper side of the discharge hole (350-2) (e.g., in the +Z-axis direction).

[0159] According to one embodiment, the protective layer (370) may include a discharge hole (350-2) penetrating the protective layer (370). The discharge hole (350-2) may be recessed to a predetermined depth in a vertical direction (or, up-down direction) (e.g., in the ±Z-axis direction) from the surface of the printed circuit board (300-2) (e.g., the protective layer (370)). For example, the discharge hole (350-2) may be recessed from the protective layer (370) to the uppermost ground layer (321-1) of the ground layer (320-1). The uppermost layer (321-1) of the ground layer (320-1) may be visible (or exposed) from the outside by the discharge hole (350-2).

[0160] According to one embodiment, the discharge hole (350-2) may be arranged on the lower side (e.g., in the -Z-axis direction) of the discharge protrusion (2151) of the conductive member (215-1). The discharge hole (350-2) may be arranged between the discharge protrusion (2151) of the conductive member (215-1) and the uppermost ground layer (321-1) of the ground layer (320-1). The discharge hole (350-2) may be defined by one side of the protective layer (370) and the upper surface of the uppermost ground layer (321-1) of the ground layer (320-1). Although not specified in the drawing, a coating layer (e.g., the coating layer (360) of FIG. 7) for corrosion prevention may be provided on the upper surface of the uppermost ground layer (321-1).

[0161] According to one embodiment, the discharge hole (350-2) of FIG. 10 may be positioned further in the horizontal direction (e.g., in the ±Y-axis direction) from the side frame (e.g., the first side frame (211) of FIG. 8) than the discharge hole (350-1) of FIG. 9.

[0162] According to one embodiment, the discharge hole (350-2) may be provided for discharging the charge (or static electricity) (E) accumulated in the electronic device (101). The discharge hole (350-2) may induce the discharge of the accumulated charge (or static electricity) (E) of the electronic device (101) from the conductive member (215-1) to the ground layer (320-1). For example, the accumulated charge of the electronic device (101) may be discharged between the discharge protrusion (2151) of the conductive member (215-1) and the ground layer (e.g., the uppermost ground layer (321-1)) that are vertically spaced apart through the space occupied by the discharge hole (350-2). The electronic device (101) may include an ESD path (P3) consisting of a side frame (e.g., a first side frame (211)), a conductive member (215-1) and a ground layer (e.g., a top ground layer (321-1)) through a discharge hole (350-2).

[0163] FIG. 11 is a schematic diagram of a printed circuit board according to one embodiment of the present disclosure.

[0164] The embodiment of FIG. 11 can be optionally combined with the embodiments of FIGS. 1 to 4, FIGS. 5a, 5b, FIGS. 6 to 8, FIGS. 9a, 9b and FIG. 10.

[0165] The printed circuit board (300-3) of FIG. 11 may be the same as all or part of the printed circuit boards (300, 300-1, 300-2) of FIGS. 6 to 8, FIGS. 9a, 9b, and FIG. 10.

[0166] Referring to FIG. 11, a printed circuit board (300-3) according to one embodiment may include at least one of a conductive pad (217), a signal layer (e.g., a signal layer (310) of FIG. 6), a ground layer (320-2), an insulating layer (330), an electronic component (e.g., an electronic component (340) of FIG. 6), or a protective layer (e.g., a protective layer (370) of FIGS. 9A and 9B).

[0167] According to one embodiment, the conductive pad (217) may be mounted on the surface of the printed circuit board (300-3). Although not specified in the drawing, the conductive pad (217) may be electrically connected to the aforementioned conductive member (e.g., the conductive member (215) of FIG. 6). For example, the conductive pad (217) and the conductive member (215) may be electrically connected to each other by physically contacting each other. For example, the conductive member (215) may contact at least a portion of the conductive pad (e.g., the body portion (2171) or the extension portion (2172)). The conductive pad (217) may be electrically connected to the signal layer (310) of the printed circuit board (300-3) through soldering.

[0168] According to one embodiment, the conductive pad (217) may include a body portion (2171) and an extension portion (2172) extending from the body portion (2171) to an edge of the printed circuit board (300-3). An end (or free end) of the extension portion (2172) of the conductive pad (217) may be disposed on the same plane as a discharge portion (3231, 3241) of a ground layer (320-2) described later (e.g., one side of the printed circuit board (300-3) parallel to the YZ plane).

[0169] According to one embodiment, the ground layer (320-2) may include a plurality of conductive layers. The ground layer (320-2) may include a first ground layer (323) disposed at the top of the plurality of conductive layers, and a second ground layer (324) spaced apart in a vertical direction (or, up-down direction) (e.g., in the ±Z-axis direction) from the first ground layer (323) through an insulating layer (330). At least one ground layer (323, 324) among the plurality of conductive layers of the ground layer (320-2) may include a discharge portion (3231, 3241) visible (or exposed) at an edge of the printed circuit board (300-3). For example, the first ground layer (323) of the ground layer (320-2) may be disposed on the same plane (e.g., YZ plane) as one side of the printed circuit board (300-3) and may include a first discharge portion (3231) that is visible (or exposed) to the outside. For example, the second ground layer (324) of the ground layer (320-2) may be disposed on the same plane (e.g., YZ plane) as one side of the printed circuit board (300-3) and may include a second discharge portion (3241) that is visible (or exposed) to the outside.

[0170] According to one embodiment, the discharge portions (3231, 3241) of the ground layer (320-2) can induce discharge of charges (or static electricity) accumulated in the electronic device (101). For example, the accumulated charges of the electronic device (101) can be discharged between the discharge portions (3231, 3241) of the ground layer (320-2) spaced apart in a vertical direction (or up-down direction) (e.g., in the ±Z-axis direction) from the end of the extension portion (2172) of the conductive pad (217) on one side of the printed circuit board (300-3). The electronic device (101) may include an ESD path (P4) composed of a side frame (e.g., a first side frame (211)), a conductive member (215), a conductive pad (217), and a ground layer (320-2) through externally visible (or exposed) discharge portions (3231, 3241). The ESD path (P4) may include a first discharge path (P4-1) formed between an extension portion (2172) of the conductive pad (217) and a first discharge portion (3231) of the first ground layer (323), and a second discharge path (P4-2) formed between the extension portion (2172) of the conductive pad (217) and a second discharge portion (3241) of the second ground layer (324). Since the first discharge path (P4-1) is made shorter than the second discharge path (P4-2), electrostatic discharge can occur more smoothly in the first discharge path (P4-1) than in the second discharge path (P4-2).

[0171] Although various embodiments of the printed circuit boards (300, 300-1, 300-2, 300-3) disclosed in this document have been described based on an in-folding foldable type electronic device (101), the present disclosure is not limited thereto. For example, the printed circuit boards (300, 300-1, 300-2, 300-3) disclosed in this document can be substantially equally applied to an out-folding electronic device that can rotate in a direction opposite to in-folding and a multi-folding foldable type electronic device that can perform both in-folding and out-folding. In addition, in an electronic device composed of a single housing (e.g., a bar-type electronic device), when the single housing functions as an antenna radiator, the printed circuit boards (300, 300-1, 300-2, 300-3) disclosed in this document can be substantially equally applied.

[0172] An electronic device (101) according to one embodiment of the present disclosure comprises a first housing (210) including a first conductive side frame (211), a second housing (220) including a second conductive side frame (221), a flexible display (230) disposed on the first housing (210) and the second housing (220), a hinge module (240) rotatably coupled between the first housing (210) and the second housing (220), and a printed circuit board (300, 300-1, 300-2) disposed on the first housing (210) or the second housing (220), the printed circuit board comprising a conductive member (215) electrically connected to the first side frame (211) or the second side frame (221), a signal layer (310, 310-1), a ground layer (320, 320-1), and an insulating layer (330). It may include a substrate (300, 300-1, 300-2). The printed circuit board (300, 300-1, 300-2) may be recessed from the surface of the printed circuit board (300, 300-1, 300-2) so that the ground layer (320, 320-1) is visible from the outside, and may include at least one discharge hole (350, 350-1, 350-2) that forms a gap between either the signal layer (310, 310-1) or the conductive member (215) and the ground layer (320, 320-1).

[0173] According to one embodiment, the printed circuit board (300, 300-1, 300-2) may include a capacitor area (A1) in which the signal layer (310, 310-1) is arranged, and a ground area (A2) in which the ground layer (320, 320-1) is arranged.

[0174] According to one embodiment, the signal layer (310) may include a plurality of first conductive layers (311) and a plurality of second conductive layers (312) alternately arranged with the plurality of first conductive layers (311) in a first direction. The plurality of first conductive layers (311) may include a first signal layer (3111) arranged at the uppermost of the plurality of first conductive layers (311) and extending across the capacitor area (A1) and the ground area (A2) in a second direction perpendicular to the first direction.

[0175] According to one embodiment, the ground layer (320) may include a plurality of conductive layers. The plurality of conductive layers of the ground layer (320) may include a first ground layer (321) disposed at the uppermost layer among the plurality of conductive layers, and a second ground layer (322) disposed below the first signal layer (3111) and overlapping at least a portion of the first signal layer (3111). The at least one discharge hole (350) may extend in the first direction from the first signal layer (3111) to the second ground layer (322).

[0176] According to one embodiment, the at least one discharge hole (350) may be a space surrounded by the first signal layer (3111), the insulating layer (330), and the second ground layer (322).

[0177] According to one embodiment, the length of the first signal layer (3111) along the second direction may be longer than the length of the first ground layer (321) along the second direction.

[0178] According to one embodiment, the printed circuit board (300, 300-1, 300-2) may include a coating layer (360) of a conductive material covering the surface of the first signal layer (3111) exposed to the outside and the surface of the second ground layer (322).

[0179] According to one embodiment, the electronic device (101) may include a discharge path (P1) composed of the first side frame (211) or the second side frame (221), the conductive member (215), the first signal layer (3111), and the second ground layer (322). Charges accumulated in the electronic device (101) may move along the discharge path (P1) through the at least one discharge hole (350).

[0180] According to one embodiment, the ground layer (320-1) may include a plurality of conductive layers. The plurality of conductive layers of the ground layer (320-1) may include a first ground layer (321-1) that is disposed at the uppermost layer among the plurality of conductive layers and extends across the capacitor area (A1) and the ground area (A2) in a second direction perpendicular to the first direction.

[0181] According to one embodiment, the printed circuit board (300-1, 300-2) may include a protective layer (370) of an insulating material disposed on the first ground layer (321-1) of the ground layer (320-1). The at least one discharge hole (350-1, 350-2) may extend in the first direction from the protective layer (370) to the first ground layer (321-1).

[0182] According to one embodiment, the at least one discharge hole (350) may be a space surrounded by at least a portion of the conductive member (215, 215-1), the protective layer (370), and the first ground layer (321-1).

[0183] According to one embodiment, the signal layer (310-1) may include a plurality of first conductive layers (311-1) and a plurality of second conductive layers (312) alternately arranged with the plurality of first conductive layers (311-1) in a first direction. The plurality of first conductive layers (311-1) may include a first signal layer (3111-1) arranged at the uppermost layer among the plurality of first conductive layers (311). The length of the first ground layer (321-1) in the second direction may be longer than the length of the first signal layer (3111-1) in the second direction.

[0184] According to one embodiment, the at least one discharge hole (350-1, 350-2) may be arranged on the lower side of at least a portion of the conductive member (215, 215-1).

[0185] According to one embodiment, the conductive member (215-2) may include a discharge protrusion (2151) protruding from a side of the conductive member (215-2) and positioned above the at least one discharge hole (350-2).

[0186] According to one embodiment, the electronic device (101) may include a discharge path (P2, P3) composed of the first side frame (211) or the second side frame (221), the conductive member (215, 215-1), and the first ground layer (321-1). Charges accumulated in the electronic device (101) may move along the discharge path (P2, P3) through the at least one discharge hole (350-1, 350-2).

[0187] An electronic device (101) according to one embodiment of the present disclosure may include a first housing (210) including a first conductive side frame (211), a second housing (220) including a second conductive side frame (221), a flexible display (230) disposed on the first housing (210) and the second housing (220), a hinge module (240) rotatably coupled between the first housing (210) and the second housing (220), and a printed circuit board (300-3) disposed on the first housing (210) or the second housing (220), wherein the printed circuit board (300-3) includes a conductive pad (217), a signal layer (310), a ground layer (320-2), and an insulating layer (330) electrically connected to the first side frame (211) or the second side frame (221). The above ground layer (320-2) may include a plurality of conductive layers. At least one of the plurality of conductive layers may include a discharge portion (3231, 3241) arranged on the same plane as one side of the printed circuit board (300-3) so as to be visible from the outside.

[0188] According to one embodiment, the conductive pad (217) may include a body portion (2171) and an extension portion (2172) extending from the body portion (2171) to the edge of the printed circuit board (300-3).

[0189] According to one embodiment, the discharge portion (3231, 3241) may be spaced apart from the end of the extension portion (2172) of the conductive pad (217) and one side of the printed circuit board (300-3).

[0190] According to one embodiment, the electronic device (101) may include a discharge path (P4) composed of the first side frame (211) or the second side frame (221), the conductive pad (217), and the ground layer (320-2). Charge accumulated in the electronic device (101) may be discharged between an extension of the conductive pad (217) and the discharge portion (3231, 3241).

[0191] According to one embodiment, the ground layer (320-2) may include a first ground layer (323) and a second ground layer (324). Each of the first ground layer (323) and the second ground layer (324) may include a discharge portion (3231, 3241) disposed on the same plane as one side of the printed circuit board (300-3).

[0192] An electronic device according to one embodiment of the present disclosure may include a housing including a conductive side frame, a printed circuit board disposed in the housing, the printed circuit board including a conductive member electrically connected to the side frame, a signal layer, a ground layer, and an insulating layer. The printed circuit board may include at least one discharge hole that is recessed from a surface of the printed circuit board such that the ground layer is visible from the outside and forms a gap between either the signal layer or the conductive member and the ground layer.

[0193] While the present disclosure has been illustrated and described with reference to various embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. In an electronic device (101), A first housing (210) including a first side frame (211) of the challenge; A second housing (220) including a second side frame (221) of the challenge; A flexible display (230) placed on the first housing (210) and the second housing (220); A hinge module (240) rotatably coupled between the first housing (210) and the second housing (220); and A printed circuit board (300, 300-1, 300-2) disposed in the first housing (210) or the second housing (220), comprising a printed circuit board (300, 300-1, 300-2) including a conductive member (215, 215-1), a signal layer (310, 310-1), a ground layer (320, 320-1), and an insulating layer (330) electrically connected to the first conductive side frame (211) or the second conductive side frame (221), The above printed circuit board (300, 300-1, 300-2) is An electronic device comprising at least one discharge hole (350, 350-1, 350-2) that is recessed from the surface of the printed circuit board (300, 300-1, 300-2) so that the ground layer (320, 320-1) is visible from the outside and forms a gap between either the signal layer (310, 310-1) or the conductive member (215) and the ground layer (320, 320-1).

2. In paragraph 1, The above printed circuit board (300, 300-1, 300-2) is An electronic device further comprising a capacitor area (A1) in which the signal layer (310, 310-1) is arranged, and a ground area (A2) in which the ground layer (320, 320-1) is arranged.

3. In paragraph 2, The above signal layer (310) is It includes a plurality of first conductive layers (311) and a plurality of second conductive layers (312) alternately arranged in the first direction with the plurality of first conductive layers (311). The above plurality of first challenge layers (311) are: An electronic device comprising a first signal layer (3111) disposed at the uppermost of the plurality of first conductive layers (311) and extending across the capacitor area (A1) and the ground area (A2) in a second direction perpendicular to the first direction.

4. In paragraph 3, The above ground layer (320) includes a plurality of conductive layers, The plurality of conductive layers of the above ground layer (320) are: It includes a first ground layer (321) arranged at the top of the plurality of conductive layers, and a second ground layer (322) arranged below the first signal layer (3111) and overlapping at least a portion of the first signal layer (3111). At least one of the above discharge holes (350) is An electronic device extending in the first direction from the first signal layer (3111) to the second ground layer (322).

5. In paragraph 4, At least one of the above discharge holes (350) is An electronic device, which is a space surrounded by the first signal layer (3111), the insulating layer (330), and the second ground layer (322).

6. In paragraph 4, An electronic device in which the length of the first signal layer (3111) in the second direction is longer than the length of the first ground layer (321) in the second direction.

7. In paragraph 4, The above printed circuit board (300, 300-1, 300-2) is An electronic device further comprising a coating layer (360) of a conductive material covering the surface of the first signal layer (3111) exposed to the outside and the surface of the second ground layer (322).

8. In paragraph 2, The above ground layer (320-1) includes a plurality of conductive layers, The plurality of conductive layers of the above ground layer (320-1) are An electronic device comprising a first ground layer (321-1) disposed at the uppermost of the plurality of conductive layers and extending across the capacitor area (A1) and the ground area (A2) in a second direction perpendicular to the first direction.

9. In paragraph 8, The above printed circuit board (300-1, 300-2) is It further includes a protective layer (370) of insulating material placed on the first ground layer (321-1) of the above ground layer (320-1), At least one of the above discharge holes (350-1, 350-2) is An electronic device extending in the first direction from the protective layer (370) to the first ground layer (321-1).

10. In paragraph 9, At least one of the above discharge holes (350-1, 350-2) is An electronic device, wherein the space is surrounded by at least a portion of the plurality of conductive members (215, 215-1), the protective layer (370), and the first ground layer (321-1).

11. In paragraph 8, The above signal layer (310-1) is It includes a plurality of first conductive layers (311-1) and a plurality of second conductive layers (312) alternately arranged in the first direction with the plurality of first conductive layers (311-1). The above plurality of first challenge layers (311-1) are It includes a first signal layer (3111-1) arranged at the top among the plurality of first conductive layers (311), An electronic device in which the length of the first ground layer (321-1) in the second direction is longer than the length of the first signal layer (3111-1) in the second direction.

12. In paragraph 8, An electronic device, wherein at least one discharge hole (350-1, 350-2) is disposed on the lower side of at least a portion of the conductive member (215, 215-1).

13. In paragraph 8, The above conductive member (215-2) is An electronic device comprising a discharge projection (2151) protruding from the side of the conductive member (215-2) and positioned above at least one discharge hole (350-2).

14. In the electronic device (101), A first housing (210) including a first side frame (211) of the challenge; A second housing (220) including a second side frame (221) of the challenge; A flexible display (230) disposed on the first housing (210) of the above-mentioned conductive material and the second housing (220) of the above-mentioned conductive material; A hinge module (240) rotatably coupled between the first housing (210) and the second housing (220); and A printed circuit board (300-3) disposed in the first housing (210) or the second housing (220), comprising a printed circuit board (300-3) including a conductive pad (217), a signal layer (310), a ground layer (320-2), and an insulating layer (330) electrically connected to the first side frame (211) or the second side frame (221), The above ground layer (320-2) includes a plurality of conductive layers, At least one of the above plurality of conductive layers, An electronic device comprising a discharge portion (3231, 3241) arranged on the same plane as one side of the printed circuit board (300-3) so as to be visible from the outside.

15. In electronic devices, A housing comprising a side frame of the challenger; A printed circuit board (300, 300-1, 300-2) disposed in the housing, comprising a printed circuit board (300, 300-1, 300-2) including a conductive member (215) electrically connected to the side frame, a signal layer (310, 310-1), a ground layer (320, 320-1), and an insulating layer (330), The above printed circuit board (300, 300-1, 300-2) is An electronic device comprising at least one discharge hole (350, 350-1, 350-2) that is recessed from the surface of the printed circuit board (300, 300-1, 300-2) so that the ground layer (320, 320-1) is visible from the outside and forms a gap between either the signal layer (310, 310-1) or the conductive member (215, 251-1) and the ground layer (320, 320-1).

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