Electronic device including fingerprint sensor

Abstract

An electronic device according to an embodiment of the present disclosure comprises: a display; a fingerprint sensor arranged under the display; an electromagnetic resonance (EMR) panel arranged under the display, wherein an opening is formed in the EMR panel at a position corresponding to the fingerprint sensor; and a flexible printed circuit board (FPCB) spaced apart from the fingerprint sensor by a certain distance or more, wherein the FPCB includes a plurality of first signal lines arranged on a first layer in a first direction, a plurality of second signal lines arranged on a second layer in a second direction orthogonal to the first direction, and at least two dummy lines arranged parallel to opposite edge regions of the first layer, respectively, and the at least two dummy lines may be in contact with an inactive region of the fingerprint sensor to maintain a predefined gap between the opposite edge regions of the FPCB and the fingerprint sensor.

Description

Electronic device containing a fingerprint sensor

[0001] The present disclosure relates to an electronic device including a fingerprint sensor.

[0002] Biometrics is a method of user identification using physical or behavioral characteristics. For biometrics to be effective, they must possess uniqueness, permanence, and retrieval. Biometric characteristics used for biometrics include fingerprints, faces, irises, and vein patterns. Generally, a person's fingerprints are unique and remain largely unchanged throughout their life. Due to these unique characteristics and user convenience, fingerprint recognition is the most widely used biometric method.

[0003] Fingerprint recognition involves identifying the curvature patterns of different fingerprints, photographing the split points, connecting points, and end points of the fingerprint to obtain coordinates for each fingerprint feature, and then verifying the identity by comparing the obtained coordinates with existing data.

[0004] Ultrasonic fingerprint sensors are directly attached to the display to facilitate the transmission of ultrasonic signals and avoid signal reflection due to acoustic impedance.

[0005] Meanwhile, electronic devices can receive user input through displays, and additional input methods such as stylus pens are provided to enable more precise touch input (or hovering input). Electronic devices are used by attaching an electro-magnetic resonance (EMR) panel to the display to transmit and / or receive pen input.

[0006] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0007] The electronic device of the present disclosure may include a display.

[0008] The electronic device of the present disclosure may include a fingerprint sensor disposed below the display.

[0009] The electronic device of the present disclosure includes an electro magnetic resonance (EMR) panel disposed below the display, and an opening may be formed in the EMR panel at a position corresponding to the fingerprint sensor.

[0010] The electronic device of the present disclosure may include a flexible printed circuit board (FPCB) spaced apart from the fingerprint sensor by a certain distance or more.

[0011] The FPCB included in the electronic device of the present disclosure may include a first plurality of signal lines arranged in a first direction in a first layer.

[0012] The FPCB included in the electronic device of the present disclosure may include a second plurality of signal lines arranged in a second direction orthogonal to the first direction in a second layer.

[0013] The FPCB included in the electronic device of the present disclosure may include at least two dummy lines arranged parallel to opposite corner regions of the first layer, respectively.

[0014] The at least two dummy lines included in the electronic device of the present disclosure may be brought into contact with an inactive area of ​​the fingerprint sensor to maintain a predefined gap distance between opposite edge areas of the FPCB and the fingerprint sensor.

[0015] The flexible printed circuit board (FPCB) of the present disclosure may include a first plurality of signal lines arranged in a first direction on a first layer.

[0016] The FPCB of the present disclosure may include a second plurality of signal lines arranged in a second direction orthogonal to the first direction in the second layer.

[0017] The FPCB of the present disclosure may include at least two dummy lines arranged parallel to opposite corner regions of the first layer, respectively.

[0018] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0019] FIG. 1 is a block diagram of an exemplary electronic device capable of performing the operations described within the present disclosure.

[0020] FIG. 2 is a drawing showing an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 3 is a drawing showing a cross-section of a fingerprint detection area (200) of an electronic device according to one embodiment of the present disclosure, cut in the AB direction.

[0022] FIG. 4 is a drawing showing a cross-section of a fingerprint detection area (200) of an electronic device according to one embodiment of the present disclosure, cut in the AB direction.

[0023] FIG. 5 is a diagram showing a third FPCB and a fingerprint sensor according to one embodiment of the present disclosure.

[0024] FIG. 6A is a diagram showing a fourth FPCB and an EMR panel electrically connected in an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 6b is a drawing showing an EMR panel and a fingerprint sensor in an electronic device according to one embodiment of the present disclosure with the fourth FPCB removed, and showing an area where dummy lines can be placed.

[0026] FIG. 7 is a drawing for explaining an area and thickness in which dummy lines of a fourth FPCB can be settled in an electronic device according to one embodiment of the present disclosure.

[0027] FIG. 8A is a diagram illustrating a fifth FPCB including at least two dummy lines according to one embodiment of the present disclosure.

[0028] FIG. 8b is a drawing showing an area where at least two dummy lines of a fifth FPCB according to one embodiment of the present disclosure are arranged.

[0029] FIG. 8c is a drawing showing an area where at least two dummy lines of a fifth FPCB according to one embodiment of the present disclosure are arranged.

[0030] FIG. 9A is a diagram illustrating a sixth FPCB including at least two dummy lines according to one embodiment of the present disclosure.

[0031] FIG. 9b is a drawing showing an area where two or more dummy lines of a sixth FPCB are arranged according to one embodiment of the present disclosure.

[0032] FIG. 10A is a diagram illustrating a seventh FPCB including at least two dummy lines according to one embodiment of the present disclosure.

[0033] FIG. 10b is a drawing showing an area where two or more dummy lines of the 7th FPCB are arranged according to one embodiment of the present disclosure.

[0034] FIG. 10c is a drawing showing an area where at least two dummy lines of the 7th FPCB are arranged according to one embodiment of the present disclosure.

[0035] FIG. 11A is a drawing showing an eighth FPCB including at least two dummy lines according to one embodiment of the present disclosure.

[0036] FIG. 11b is a drawing showing an area where at least two dummy lines of the 8th FPCB are arranged according to one embodiment of the present disclosure.

[0037] FIG. 12A is a diagram illustrating a ninth FPCB including at least two dummy lines according to one embodiment of the present disclosure.

[0038] FIG. 12b is a drawing showing an area where at least two dummy lines of the 9th FPCB according to one embodiment of the present disclosure are arranged.

[0039] FIG. 13 is a drawing showing a tenth FPCB including at least two dummy lines according to one embodiment of the present disclosure.

[0040] FIG. 14 is a drawing showing an eleventh FPCB including at least two dummy lines according to one embodiment of the present disclosure.

[0041] Typically, electronic devices may cut at least a portion of an EMR panel to place an ultrasonic fingerprint sensor to prevent the EMR panel from affecting the fingerprint sensor, and connect the cut signal lines of the EMR panel using a flexible printed circuit board (FPCB). At this time, an air gap may be secured to connect the cut signal lines to avoid contact between the fingerprint sensor and the FPCB.

[0042] Contact between the fingerprint sensor and the FPCB may occur due to bending caused by the weight of the multi-layered FPCB or due to pressure applied for fingerprint input.

[0043] If contact occurs between the fingerprint sensor and the FPCB, the fingerprint recognized by the electronic device may be distorted.

[0044] An electronic device including a fingerprint sensor of the present disclosure can prevent contact between the fingerprint sensor and the FPCB.

[0045] An electronic device including a fingerprint sensor of the present disclosure may include a device and structure for maintaining an FPCB connecting a cut signal line of an EMR panel at a distance from the fingerprint sensor.

[0046] An electronic device including a fingerprint sensor of the present disclosure can maintain the FPCB at a certain distance or more from the fingerprint sensor by including a support structure in the FPCB.

[0047] FIG. 1 is a block diagram of an exemplary electronic device (100) capable of performing the operations described within the present disclosure.

[0048] Referring to FIG. 1, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable) type smartphone (191-3)), a tablet (192), a cellular phone (not shown), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1 are exemplary only and do not limit the implementations described or claimed within the present disclosure. The electronic device (100) may be referred to as a mobile device, a user device, a multi-function device, a portable device, or a server.

[0049] The electronic device (100) may include components including at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The above components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuitry, an antenna, a rechargeable battery, or an input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into one component.

[0050] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing. The processor (110) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data, etc.) stored in the memory (120). The processor (110) may include a processor assembly including one or more processing circuits. The processor (110) may include any processing circuit operative to control the performance and operations of one or more components (e.g., the memory (120), the display (140), the image sensor (150), the communication circuit (160), and / or the sensor (170)) of the electronic device (100). For example, the processor (110) (e.g., the application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (110) may be implemented with multiple cores (or at least one core circuit), multiple chips, or multiple chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to individually and / or collectively perform various functions of the present disclosure. As a non-limiting example, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) that is different from the first chip of the electronic device (100).

[0051] For example, the processor (110) may include a central processing unit (CPU) (111), a graphics processing unit (GPU) (112), a neural processing unit (NPU) (113), an image signal processor (ISP) (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (CP) (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may further include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included within other components (e.g., at least a portion of memory (120), an interface (e.g., available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0052] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in the memory (120). The CPU (111) (or central processing circuit) may be configured to control components of the processor (110) based on the execution of instructions stored in the memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or artificial intelligence (AI) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). The ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through the image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). The display controller (115) (or display control circuit, or display processing unit (DPU)) may be configured to process an image acquired from the CPU (111), the GPU (112), the ISP (114), or the memory (120) (e.g., the volatile memory (121)) into a format suitable for the display (140). The memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). The storage controller (117) (or storage control circuit) may be configured to control reading data from the nonvolatile memory (122) and writing data to the nonvolatile memory (122).The CP (118) (communication processing circuit) may be configured to process data acquired from a component of the processor (110) into a format suitable for transmission to another electronic device via the communication circuit (160), or to process data acquired from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data about the state of the electronic device (100) and / or the state of the surroundings of the electronic device (100), acquired via the sensor (170), into a format suitable for the component of the processor (110).

[0053] The memory (120) may include one or more storage media (or one or more storage devices). For example, the memory (120) may include a memory assembly including one or more storage media. For example, the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory (121)) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof. The memory (120) may include cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As a non-limiting example, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and / or a secure digital (SD) card) that may be repeatedly inserted into and removed from the electronic device (100).

[0054] For example, the memory (120) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, the memory (120) may store instructions callable by an application programming interface (API). For example, the memory (120) may store instructions within a library.

[0055] FIG. 2 is a drawing showing an electronic device (100) according to one embodiment of the present disclosure.

[0056] FIG. 3 is a drawing showing a cross-section of a fingerprint detection area (200) of an electronic device (100) according to one embodiment of the present disclosure, cut in the AB direction.

[0057] Referring to FIGS. 2 and 3, the electronic device (100) may include a fingerprint detection area (200) on at least a portion of the display (140).

[0058] Referring to FIG. 3, the electronic device (100) may include a display (140), a fingerprint sensor (310), an electro magnetic resonance (EMR) panel (320), a first flexible printed circuit board (FPCB) (330), and a support structure (340).

[0059] In one embodiment, the fingerprint sensor (310) may include an ultrasonic fingerprint sensor. However, the present invention is not limited thereto, and the fingerprint sensor (310) may include at least one of an optical fingerprint sensor, a capacitive fingerprint sensor, a thermal fingerprint sensor, or a piezoelectric fingerprint sensor.

[0060] In one embodiment, the first FPCB (330) can connect signal lines of the EMR panel (320). The first FPCB (330) can be attached to the EMR panel (320) by a solder jetting method. The first FPCB (330) may include signal lines made of polyimide (PI), copper, and an insulator (e.g., a clad laminate (CL)) that surrounds the signal lines, at least in part. The first FPCB (330) may be a flexible copper clad laminate (FCCL) in which at least one copper clad is laminated on at least a part of at least one region of the top or bottom of a polyimide (PI) film. The flexible copper clad laminate (FCCL) may be, for example, a form in which a flexible material such as a polyester film or a polyimide film and a copper clad are bonded together with an adhesive (e.g., an acrylic adhesive).

[0061] In one embodiment, the area of ​​the EMR panel (320) may substantially correspond to the area of ​​the display (140). For example, referring to the xy plane of FIG. 2, the size of the EMR panel (320) may correspond to the size of the display (140). The display (140) may display information and detect a user's touch input. The electronic device (100) may detect a pen (e.g., a stylus) input through the EMR panel (320).

[0062] In one embodiment, the support structure (340) may include a structure (not shown) to which the display (140) may be secured within the electronic device (100). The support structure (340) may comprise a portion of the housing of the electronic device (100) and may provide rigidity to the electronic device (100).

[0063] For example, the x-axis direction and the y-axis direction are orthogonal to each other, and the z-axis direction can be orthogonal to the xy plane.

[0064] In one embodiment, the EMR panel (320) may have at least a portion of the area corresponding to the fingerprint sensor (310) cut out. For example, referring to FIGS. 2 and 3 , the EMR panel (320) generally corresponds to the area of ​​the display (140), and at least a portion of the portion corresponding to the fingerprint detection area (200) may be cut out.

[0065] In one embodiment, the EMR panel (320) may include an opening in which at least a portion corresponding to the fingerprint detection area (200) is cut away.

[0066] In one embodiment, the fingerprint detection area (200) may include the display (140), the fingerprint sensor (310), the first FPCB (330), and the support structure (340) in a direction toward the interior of the electronic device (100) from the display (140) (e.g., from the +z-axis to the -z-axis).

[0067] In one embodiment, the electronic device (100) may include a display (140), a fingerprint sensor (310), a first FPCB (330), and a support structure (340) on a fingerprint detection area (200) in a direction toward the interior of the electronic device (100) from the display (140) (e.g., in a direction from the +z axis to the -z axis).

[0068] In one embodiment, the fingerprint detection area (200) may include the display (140), the EMR panel (320), the first FPCB (330), and the support structure (340) in a direction toward the interior of the electronic device (100) from the display (140) (e.g., from the +z-axis to the -z-axis).

[0069] In one embodiment, the electronic device (100) may include a display (140), an EMR panel (320), a first FPCB (330), and a support structure (340) in a direction toward the inside of the electronic device (100) from the display (140) on the fingerprint detection area (200) (e.g., in a direction from the +z axis to the -z axis).

[0070] In one embodiment, the electronic device (100) may include an EMR panel (320) and a fingerprint sensor (310) substantially on the same plane (e.g., an xy plane).

[0071] In one embodiment, the EMR panel (320) may include an opening in which at least a portion corresponding to the fingerprint detection area (200) is cut out. The fingerprint sensor (310) may be positioned on the electronic device (100) substantially corresponding to the opening of the EMR panel (320).

[0072] In one embodiment, other areas than the fingerprint detection area (200) may include the display (140), the EMR panel (320), and the support structure (340) in a direction toward the interior of the electronic device (100) from the display (140) (e.g., from the +z-axis to the -z-axis).

[0073] In one embodiment, the electronic device (100) may include a display (140), an EMR panel (320), and a support structure (340) in a direction toward the interior of the electronic device (100) from the display (140) on an area other than the fingerprint detection area (200) (e.g., a direction from the +z axis to the -z axis).

[0074] In one embodiment, the EMR panel (320) may include a plurality of first direction signal lines in a first direction (e.g., y-axis direction) and a plurality of second direction signal lines in a second direction (e.g., x-axis direction). The first direction and the second direction may be orthogonal to each other. The plurality of first direction signal lines and the plurality of second direction signal lines included in the EMR panel (320) may form an orthogonal coordinate system. The electronic device (100) may detect an input position of a pen (e.g., stylus) on the EMR panel (320) based on the orthogonal coordinate system using the plurality of first direction signal lines and the plurality of second direction signal lines.

[0075] Referring to FIG. 3, the first FPCB (330) may include a first layer (331), a second layer (332), a third layer (333), and a first shielding layer (334).

[0076] In one embodiment, the first layer (331) is disposed on a first side (e.g., a side facing the +z-axis direction) of the first FPCB (330) and may face the fingerprint sensor (310) and / or the EMR panel (320). The second layer (332) may be disposed between the first layer (331) and the third layer (333). The third layer (333) may be disposed between the second layer (332) and the first shielding layer (334). The first shielding layer (334) is disposed on a second side (e.g., a side facing the -z-axis direction) of the first FPCB (330) and may face the support structure (340).

[0077] In one embodiment, the first layer (331) may include a first plurality of signal lines (3313) arranged in a first direction (e.g., y-axis direction) and at least two dummy lines (3311, 3312).

[0078] In one embodiment, each of the first plurality of signal lines (3313) may include a plurality of wires or a bundle of wires. However, this is not limited thereto, and each of the first plurality of signal lines (3313) may include a single wire.

[0079] In one embodiment, the first dummy line (3311) and the second dummy line (3312) may be arranged in a second direction (e.g., in the x-axis direction) on the first layer (331). However, the present invention is not limited thereto, and the first dummy line (3311) and the second dummy line (3312) may be arranged in a first direction (e.g., in the y-axis direction) on the first layer (331).

[0080] In one embodiment, the first layer (331) may further include at least two dummy lines (not shown) arranged in the first direction (e.g., in the y-axis direction), as well as a first dummy line (3311) and a second dummy line (3312) arranged in the second direction (e.g., in the x-axis direction).

[0081] In one embodiment, the first layer (331) may include at least two dummy lines (3311, 3312) at a first edge (S1) of the first FPCB (330) and a second edge (S2) of the first FPCB (330). The first edge (S1) of the first FPCB (330) may be arranged in the -y-axis direction with respect to the first plurality of signal lines (3313), and the second edge (S2) of the first FPCB (330) may be arranged in the +y-axis direction with respect to the first plurality of signal lines (3313). Although not shown in the drawing, at least two dummy lines (3311, 3312) may be respectively arranged in edge areas (not shown) on both sides of the first plurality of signal lines (3313) with respect to the first plurality of signal lines (3313).

[0082] In one embodiment, at least two dummy lines (3311, 3312) may be substantially parallel to each other.

[0083] In one embodiment, the first layer (331) may have a first dummy line (3311) and a second dummy line (3312) arranged at both ends of the first plurality of signal lines (3313). For example, the first layer (331) may include the first dummy line (3311) adjacent to the first end (E1) of the first plurality of signal lines (3313). The first layer (331) may include the second dummy line (3312) adjacent to the second end (E2) of the first plurality of signal lines (3313).

[0084] In one embodiment, the first layer (331) may surround at least two dummy lines (3311, 3312) and the first plurality of signal lines (3313) with a first insulator (3314). The first insulator (3314) may include a clad laminate (CL).

[0085] In one embodiment, the first plurality of signal lines (3313) and at least two dummy lines (3311, 3312) may include a conductive material. For example, the first plurality of signal lines (3313) and at least two dummy lines (3311, 3312) may include copper foil and / or copper wire.

[0086] In one embodiment, at least two dummy lines (3311, 3312) may be electrically disconnected. The at least two dummy lines (3311, 3312) may include fake wiring or non-electrical wiring. The at least two dummy lines (3311, 3312) may provide mechanical strength to the first FPCB (330), thereby preventing at least a portion of the first FPCB (330) from contacting the fingerprint sensor (310).

[0087] In one embodiment, even if the first FPCB (330) is bent or sagged, or the fingerprint sensor (310) is adjacent to the first FPCB (330) due to an external force, at least two dummy lines (3311, 3312) may have a specified thickness (D3) or greater so that the distance (D1) between the first FPCB (330) and the fingerprint sensor (310) does not become 0 (e.g., in contact). For example, the specified thickness (D3) may be about 39.4 micrometers (μm) or greater.

[0088] Referring to FIG. 7, the first distance (D4), the second distance (D5), and the third distance (D6) may represent the distance of the fingerprint sensor (310) according to the amount of sagging of the fourth FPCB (610). When the degree of sagging or the amount of sagging of the fourth FPCB (610) is D, the degree of sagging (D) may include a larger number among the difference between the first distance (D4) and the second distance (D5) or the difference between the first distance (D4) and the third distance (D6). For example, the first distance (D4) of the fourth FPCB (610) may be about 14.9 micrometers (μm), the second distance (D5) may be about 36.3 micrometers (μm), and the third distance (D6) may be 36 micrometers (μm). In this case, the degree of sagging (D) may be approximately 21.4 micrometers (μm).

[0089] In one embodiment, the first FPCB (330) may be spaced apart from the support structure (340) by a distance (D2) of about 50-100 micrometers (μm).

[0090] In one embodiment, the second layer (332) may include a first signal connection line (3321), a second signal connection line (3322), and a first film layer (3323). The first film layer (3323) may include polyimide (PL) in at least a portion.

[0091] In one embodiment, the first signal connection line (3321) and the second signal connection line (3322) may be electrically connected to the first plurality of signal lines (3313) of the first layer (331) and the second plurality of signal lines (3331) of the third layer (333).

[0092] In one embodiment, the first signal connection line (3321) and the second signal connection line (3322) may be made of a conductive material and may be connected to the cut signal lines of the EMR panel (320). For example, the first signal connection line (3321) and the second signal connection line (3322) may be connected to the cut signal lines of the EMR panel (320) through soldering or a solder jet.

[0093] In one embodiment, in the manufacturing step, a first plurality of signal lines (3313) and at least two dummy lines (3311, 3312) may be formed on a first surface of a first film layer (3323) (e.g., polyimide (PI)) and wrapped with a first insulator (3314) to form a first FPCB (330). A second plurality of signal lines (3331) may be formed on a second surface of the first film layer (3323) and wrapped with a second insulator (3332) to form a first FPCB.

[0094] In one embodiment, the third layer (333) may include a second plurality of signal lines (3331) arranged in a second direction (e.g., in the x-axis direction).

[0095] In one embodiment, each of the second plurality of signal lines (3331) may include a plurality of wires or a bundle of wires. However, the present invention is not limited thereto, and each of the second plurality of signal lines (3331) may include a single wire.

[0096] In one embodiment, the third layer (333) may surround the second plurality of signal lines (3331) with a second insulator (3332). The second insulator (3332) may include a clad laminate (CL).

[0097] In one embodiment, the second plurality of signal lines (3331) may include a conductive material. For example, the second plurality of signal lines (3331) may include copper foil and / or copper wire.

[0098] In one embodiment, the first shielding layer (334) may shield electromagnetic waves generated from the first FPCB (330) and / or electromagnetic waves directed toward the first FPCB (330). For example, the first shielding layer (334) may include a magnetic metal in at least a portion. The first shielding layer (334) may be formed by first forming the first layer (331), the second layer (332), and the third layer (333) during manufacturing, and then applying magnetic metal powder (MMP) to the surface of the third layer (333). As another example, the first shielding layer (334) may be formed through a deposition process. The first shielding layer (334) may be formed through a sputtering process during a PVD (physical vapor deposition) process. For another example, the first shielding layer (334) may include a carbon nanotube (CNT) having conductivity as a material.

[0099] FIG. 4 is a drawing showing a cross-section of a fingerprint detection area (200) of an electronic device (100) according to one embodiment of the present disclosure, cut in the AB direction.

[0100] The dummy lines of FIG. 4 may be arranged differently from the dummy lines of FIG. 3. For example, the dummy lines of FIG. 3 may be arranged on the same plane (e.g., xy plane) as the first plurality of signal lines (3313), but the dummy lines of FIG. 4 may be arranged on a different plane from the first plurality of signal lines (3313).

[0101] In explaining Fig. 4, description of components that are identical or overlapping with those in Fig. 3 may be omitted.

[0102] Referring to FIG. 4, the electronic device (100) may include a display (140), a fingerprint sensor (310), an EMR panel (320), a second FPCB (430), and a support structure (340).

[0103] In one embodiment, the second FPCB (430) can connect signal lines of the EMR panel (320). The second FPCB (430) can be attached to the EMR panel (320) by a solder jetting method. The second FPCB (430) can include signal lines made of polyimide and copper at least in part, and an insulator (e.g., clad laminate (CL)) surrounding the signal lines.

[0104] In one embodiment, the area of ​​the EMR panel (320) may substantially correspond to the area of ​​the display (140). For example, referring to the xy plane of FIG. 2, the size of the EMR panel (320) may correspond to the size of the display (140). The display (140) may display information and detect a user's touch input. The electronic device (100) may detect a pen (e.g., a stylus) input through the EMR panel (320).

[0105] In one embodiment, the support structure (340) may include a structure (not shown) to which the display (140) may be secured within the electronic device (100). The support structure (340) may comprise a portion of the housing of the electronic device (100) and may provide rigidity to the electronic device (100).

[0106] For example, the x-axis direction and the y-axis direction are orthogonal to each other, and the z-axis direction can be orthogonal to the xy plane.

[0107] In one embodiment, the EMR panel (320) may have at least a portion of the area corresponding to the fingerprint sensor (310) cut out. The EMR panel (320) generally corresponds to the area of ​​the display (140), and at least a portion of the portion corresponding to the fingerprint detection area (200) may be cut out.

[0108] In one embodiment, the fingerprint detection area (200) may include the display (140), the fingerprint sensor (310), the second FPCB (430), and the support structure (340) in a direction toward the interior of the electronic device (100) from the display (140) (e.g., from the +z-axis to the -z-axis).

[0109] In one embodiment, the electronic device (100) may include a display (140), a fingerprint sensor (310), a second FPCB (430), and a support structure (340) on a fingerprint detection area (200) in a direction toward the interior of the electronic device (100) from the display (140) (e.g., in a direction from the +z axis to the -z axis).

[0110] In one embodiment, the fingerprint detection area (200) may include the display (140), the EMR panel (320), the second FPCB (430), and the support structure (340) in a direction toward the interior of the electronic device (100) from the display (140) (e.g., from the +z-axis to the -z-axis).

[0111] In one embodiment, the electronic device (100) may include a display (140), an EMR panel (320), a second FPCB (430), and a support structure (340) in a direction toward the inside of the electronic device (100) from the display (140) on the fingerprint detection area (200) (e.g., in a direction from the +z axis to the -z axis).

[0112] In one embodiment, the electronic device (100) may include an EMR panel (320) and a fingerprint sensor (310) substantially on the same plane (e.g., an xy plane).

[0113] In one embodiment, other areas than the fingerprint detection area (200) may include the display (140), the EMR panel (320), and the support structure (340) in a direction toward the interior of the electronic device (100) from the display (140) (e.g., from the +z-axis to the -z-axis).

[0114] In one embodiment, the electronic device (100) may include a display (140), an EMR panel (320), and a support structure (340) in a direction toward the interior of the electronic device (100) from the display (140) on an area other than the fingerprint detection area (200) (e.g., a direction from the +z axis to the -z axis).

[0115] Referring to FIG. 4, the second FPCB (430) may include a fourth layer (431), a fifth layer (432), a sixth layer (433), a seventh layer (434), and a second shielding layer (435).

[0116] In one embodiment, the fourth layer (431) and the fifth layer (432) are disposed on a first side (e.g., a side facing the + z-axis direction) of the second FPCB (430) and may face the fingerprint sensor (310) and / or the EMR panel (320). The sixth layer (433) may be disposed between the fifth layer (432) and the seventh layer (434). The seventh layer (434) may be disposed between the sixth layer (433) and the second shielding layer (435). The second shielding layer (435) is disposed on a second side (e.g., a side facing the - z-axis direction) of the second FPCB (430) and may face the support structure (340).

[0117] In one embodiment, the fourth layer (431) may include a third dummy line (4311) and a fourth dummy line (4312).

[0118] In one embodiment, the fifth layer (432) may include a third plurality of signal lines (4313) arranged in a first direction (e.g., in the y-axis direction). The third plurality of signal lines (4313) may be substantially identical to the first plurality of signal lines (3313).

[0119] In one embodiment, each of the third plurality of signal lines (4313) may include a plurality of wires or a bundle of wires. However, this is not limited thereto, and each of the third plurality of signal lines (4313) may include a single wire.

[0120] In one embodiment, the third dummy line (4311) and the fourth dummy line (4312) may be arranged in a second direction (e.g., in the x-axis direction) on the fourth layer (431). However, this is not limited thereto, and the third dummy line (4311) and the fourth dummy line (4312) may be arranged in a first direction (e.g., in the y-axis direction) on the fourth layer (431).

[0121] In one embodiment, the fourth layer (431) may further include at least two dummy lines (not shown) arranged in the first direction (e.g., in the y-axis direction), as well as a third dummy line (4311) and a fourth dummy line (4312) arranged in the second direction (e.g., in the x-axis direction).

[0122] In one embodiment, the fourth layer (431) may include at least two dummy lines (4311, 4312) at a first edge (SS1) of the second FPCB (430) and a second edge (SS2) of the second FPCB (430). The first edge (SS1) of the second FPCB (430) may be arranged in the -y-axis direction with respect to the third plurality of signal lines (4313), and the second edge (SS2) of the second FPCB (430) may be arranged in the +y-axis direction with respect to the third plurality of signal lines (4313). Although not shown in the drawing, at least two dummy lines (4311, 4312) may be arranged at corner areas (not shown) on both sides of the third plurality of signal lines (4313) or at opposite corner areas, respectively, based on the third plurality of signal lines (4313).

[0123] In one embodiment, at least two dummy lines (4311, 4312) may be substantially parallel to each other.

[0124] In one embodiment, the fourth layer (431) and the fifth layer (432) may surround at least two dummy lines (4311, 4312) and a third plurality of signal lines (4313) with a third insulator (4314). The third insulator (4314) may include a clad laminate (CL). The third insulator (4314) may be substantially the same as the first insulator (3314).

[0125] In one embodiment, at least two dummy lines (4311, 4312) and the third plurality of signal lines (4313) may include a conductive material. For example, at least two dummy lines (4311, 4312) and the third plurality of signal lines (4313) may include copper foil and / or copper wire.

[0126] In one embodiment, at least two dummy lines (4311, 4312) may be electrically disconnected. The at least two dummy lines (4311, 4312) may include fake wiring or non-electrical wiring. The at least two dummy lines (4311, 4312) may provide mechanical strength to the second FPCB (430), thereby preventing at least a portion of the second FPCB (430) from contacting the fingerprint sensor (310).

[0127] In one embodiment, even if bending or sagging of the second FPCB (430) occurs or the fingerprint sensor (310) is adjacent to the second FPCB (430) due to an external force, at least two or more dummy lines (4311, 4312) and the third plurality of signal lines (4313) may have a specified thickness (D3) or more so that the distance (D1) between the second FPCB (430) and the fingerprint sensor (310) does not become 0 (e.g., in a contact state). For example, the specified thickness (D3) may be about 39.4 micrometers (μm) or more.

[0128] In one embodiment, the second FPCB (430) may be spaced apart from the support structure (340) by a distance (D2) of about 50-100 micrometers (μm).

[0129] In one embodiment, the sixth layer (433) may include a third signal connection line (4321), a fourth signal connection line (4322), and a second film layer (4323). The second film layer (4323) may include polyimide (PI) at least in part. The second film layer (4323) may be substantially identical to the first film layer (3323). The third signal connection line (4321) may be substantially identical to the first signal connection line (3321). The fourth signal connection line (4322) may be substantially identical to the second signal connection line (3322).

[0130] In one embodiment, the third signal connection line (4321) and the fourth signal connection line (4322) may be electrically connected to the third plurality of signal lines (4313) of the fifth layer (432) and the fourth plurality of signal lines (4331) of the seventh layer (434).

[0131] In one embodiment, the third signal connection line (4321) and the fourth signal connection line (4322) may be made of a conductive material and may be connected to the cut signal lines of the EMR panel (320). For example, the third signal connection line (4321) and the fourth signal connection line (4322) may be connected to the cut signal lines of the EMR panel (320) through soldering or solder jetting.

[0132] In one embodiment, in the manufacturing step, a third plurality of signal lines (4313) may be formed on a first surface of a second film layer (4323) and wrapped with a third insulator (4314) to form a second FPCB (430). At least two or more dummy lines (4311, 4312) may be formed again on a fifth layer (432) formed by wrapping the third plurality of signal lines (4313) with a third insulator (4314) and wrapped with an insulator (e.g., the third insulator (4314)) to form a second FPCB (430). A fourth plurality of signal lines (4331) may be formed on a second surface of the second film layer (4323) and wrapped with a fourth insulator (4332) to form a second FPCB (430).

[0133] In one embodiment, the seventh layer (434) may include a fourth plurality of signal lines (4331) arranged in a second direction (e.g., in the x-axis direction).

[0134] In one embodiment, each of the fourth plurality of signal lines (4331) may include a plurality of wires or a bundle of wires. However, this is not limited thereto, and each of the fourth plurality of signal lines (4331) may include a single wire.

[0135] In one embodiment, the seventh layer (434) may surround the fourth plurality of signal lines (4331) with a fourth insulator (4332). The fourth insulator (4332) may include a clad laminate (CL).

[0136] In one embodiment, the fourth plurality of signal lines (4331) may include a conductive material. For example, the fourth plurality of signal lines (4331) may include copper foil and / or copper wire.

[0137] In one embodiment, the second shielding layer (435) can shield electromagnetic waves generated from the second FPCB (430) and / or electromagnetic waves directed toward the second FPCB (430). For example, the second shielding layer (435) can include magnetic metal in at least a portion. The second shielding layer (435) can be formed by first forming the fourth layer (431), the fifth layer (432), the sixth layer (433), and the seventh layer (434) during manufacturing, and then applying magnetic metal powder (MMP) to the surface of the seventh layer (434).

[0138] FIG. 5 is a drawing showing a third FPCB (530) and a fingerprint sensor (310) according to one embodiment of the present disclosure.

[0139] The third FPCB (530) of FIG. 5 is a drawing that roughly represents the first FPCB (330) of FIG. 3 or the second FBCB (430) of FIG. 4.

[0140] In one embodiment, the third FPCB (530) may include a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, and the fourth plurality of signal lines (4331) of FIG. 4) connecting the cut signal lines of the EMR pad (e.g., the EMR pad (320) of FIG. 3 and the EMR pad (320) of FIG. 4).

[0141] In one embodiment, the third FPCB (530) may include a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, and the fourth plurality of signal lines (4331) of FIG. 4) and at least two dummy lines (531, 532) that are electrically disconnected. The at least two dummy lines (531, 532) may include fake wiring or non-electrical wiring. The at least two dummy lines (531, 532) may provide mechanical strength to the third FPCB (530), thereby preventing at least a portion of the third FPCB (530) from contacting the fingerprint sensor (310).

[0142] FIG. 6A is a drawing showing a fourth FPCB (610) and an EMR panel (320) electrically connected in an electronic device (100) according to one embodiment of the present disclosure.

[0143] FIG. 6b is a drawing showing an EMR panel (320) and a fingerprint sensor (310) in an electronic device (100) according to one embodiment of the present disclosure with the fourth FPCB (610) removed, and showing an area where dummy lines can be settled.

[0144] FIG. 7 is a drawing for explaining an area and thickness in which dummy lines of a fourth FPCB (610) can be settled in an electronic device (100) according to one embodiment of the present disclosure.

[0145] The fourth FPCB (610) of FIG. 6a may be identical to the first FPCB (330) of FIG. 3, the second FBCB (430) of FIG. 4, and / or the third FPCB (530) of FIG. 5.

[0146] In one embodiment, the first FPCB (330) of FIG. 3, the second FBCB (430) of FIG. 4, and / or the third FPCB (530) of FIG. 5 may schematically represent the fourth FPCB (610) of FIG. 6a.

[0147] In one embodiment, the fourth FPCB (610) may include a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, or the fourth plurality of signal lines (4331) of FIG. 4) connecting the cut signal lines of the EMR pad (e.g., the EMR pad (320) of FIG. 3 or the EMR pad (320) of FIG. 4).

[0148] In one embodiment, the fourth FPCB (610) includes a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, the fourth plurality of signal lines (4331) of FIG. 4) and at least two dummy lines (not shown) that are electrically disconnected, and at least two or more dummy lines (not shown) may include fake wiring or non-electrical wiring.

[0149] Referring to FIG. 6b, the fingerprint sensor (310) can be mounted in the cut-out area of ​​the EMR panel (320).

[0150] In one embodiment, the fingerprint sensor (310) may include an active area (620). The active area (620) of the fingerprint sensor (310) is an area that detects a fingerprint using ultrasonic waves. If there is contact or electromagnetic influence on the active area (620), the fingerprint sensor (310) may have difficulty accurately recognizing a fingerprint.

[0151] In one embodiment, an area in which at least two dummy lines (e.g., at least two dummy lines (3311, 3312) or at least two dummy lines (4311, 4312) of FIG. 3) included in the fourth FPCB (610) can be placed may correspond to an outer area outside the active area (620) or an area of ​​the EMR panel (320).

[0152] In one embodiment, the fourth FPCB (610) may have at least two dummy lines (e.g., at least two dummy lines (3311, 3312) or at least two dummy lines (4311, 4312) of FIG. 3) disposed in an outer region outside the active region (620) or an area of ​​the EMR panel (320) included in the fourth FPCB (610).

[0153] In an embodiment, the electronic device (100) may have at least two dummy lines (e.g., at least two dummy lines (3311, 3312) or at least two dummy lines (4311, 4312) of FIG. 3) included in the fourth FPCB (610) arranged in an outer area outside the active area (620) or an area of ​​the EMR panel (320).

[0154] In one embodiment, the fourth FPCB (610) may have at least two dummy lines (e.g., at least two dummy lines (3311, 3312) or at least two dummy lines (4311, 4312) of FIG. 3) arranged in a pair of first placement areas (630) in the second direction (e.g., in the x-axis direction).

[0155] In one embodiment, the electronic device (100) may have at least two dummy lines (e.g., at least two dummy lines (3311, 3312) or at least two dummy lines (4311, 4312) of FIG. 3) arranged in a pair of first arrangement areas (630) in a second direction (e.g., in the x-axis direction).

[0156] In one embodiment, the fourth FPCB (610) may have at least two dummy lines (e.g., at least two dummy lines (3311, 3312) or at least two dummy lines (4311, 4312) of FIG. 3) arranged in a pair of second placement areas (640) in the first direction (e.g., in the y-axis direction).

[0157] In one embodiment, the electronic device (100) may have at least two dummy lines (e.g., at least two dummy lines (3311, 3312) or at least two dummy lines (4311, 4312) of FIG. 3) arranged in a pair of second arrangement areas (640) in a first direction (e.g., in the y-axis direction).

[0158] In one embodiment, the first deployment area (630) and / or the second deployment area (640) may correspond to an area outside the active area (620) or an area of ​​the EMR panel (320).

[0159] In one embodiment, the fourth FPCB (610) may have at least two dummy lines (e.g., at least two dummy lines (3311, 3312) or at least two dummy lines (4311, 4312) of FIG. 3) arranged in the first arrangement area (630) or the second arrangement area (640).

[0160] In one embodiment, the electronic device (100) may have at least two dummy lines (e.g., at least two dummy lines (3311, 3312) or at least two dummy lines (4311, 4312) of FIG. 3) arranged in the first arrangement area (630) or the second arrangement area (640).

[0161] However, it is not limited thereto, and the fourth FPCB (610) may have at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) or at least two or more dummy lines (4311, 4312) of FIG. 3) arranged in the first arrangement area (630) and the second arrangement area (640). For example, the fourth FPCB (610) may include at least four or more dummy lines. The fourth FPCB (610) may include at least four or more dummy lines that may be arranged in the first arrangement area (630) and the second arrangement area (640).

[0162] In one embodiment, the electronic device (100) may have at least two dummy lines (e.g., at least two dummy lines (3311, 3312) or at least two dummy lines (4311, 4312) of FIG. 3) arranged in the first arrangement area (630) and the second arrangement area (640).

[0163] Referring to FIGS. 6A, 6B, and 7, the fingerprint sensor (310) can be divided into a central region (P1) and peripheral regions (P2, P3). The peripheral regions (P2, P3) can include regions outside the active region (620) of the fingerprint sensor (310).

[0164] In one embodiment, the first distance (D4), the second distance (D5), and the third distance (D6) may represent the distance of the fingerprint sensor (310) according to the amount of deflection of the fourth FPCB (610).

[0165] In one embodiment, at least two dummy lines (e.g., at least two dummy lines (3311, 3312) or at least two dummy lines (4311, 4312) of FIG. 3) may have a thickness that prohibits a central region (P1) of the FPCB (e.g., the fourth FPCB (610)) from contacting the fingerprint sensor (310) due to sagging of the FPCB.

[0166] In one embodiment, when the degree of sagging or the amount of sagging of the fourth FPCB (610) is D, the degree of sagging (D) may include a larger number among the difference between the first distance (D4) and the second distance (D5) or the difference between the first distance (D4) and the third distance (D6).

[0167] For example, the first distance (D4) of the fourth FPCB (610) may be about 14.9 micrometers (μm), the second distance (D5) may be about 36.3 micrometers (μm), and the third distance (D6) may be 36 micrometers (μm). In this case, the degree of sagging (D) may be about 21.4 micrometers (μm).

[0168] In one embodiment, the thickness of at least two dummy lines (e.g., at least two dummy lines (3311, 3312) or at least two dummy lines (4311, 4312) of FIG. 3) of the fourth FPCB (610) may have a designated thickness (D3) (e.g., the thickness (D3) of FIGS. 3 and 4) that is greater than or equal to the sum of the sag degree (D) of about 21.4 micrometers (μm) and the thickness of the signal wiring (about 18 micrometers (μm)). The thickness of at least two dummy lines (e.g., at least two dummy lines (3311, 3312) or at least two dummy lines (4311, 4312) of FIG. 3) may be less than or equal to about 39.4 micrometers (μm).

[0169] In one embodiment, the thickness of at least two dummy lines (e.g., at least two dummy lines (3311, 3312) of FIG. 3 or at least two dummy lines (4311, 4312) of FIG. 3) may include a value that adds the thickness of the plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3 or the third plurality of signal lines (4313) of FIG. 4) and the degree of sagging of the FPCB (e.g., the first FPCB (330) or the second FPCB (430)).

[0170] In one embodiment, the thickness of at least two dummy lines (e.g., at least two dummy lines (3311, 3312) of FIG. 3 or at least two dummy lines (4311, 4312) of FIG. 3) may be determined by the thickness of the plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3 or the third plurality of signal lines (4313) of FIG. 4) and the degree of sagging of the FPCB (e.g., the first FPCB (330) or the second FPCB (430)).

[0171] FIG. 8A is a drawing showing a fifth FPCB (800) including at least two dummy lines (811, 812) according to one embodiment of the present disclosure.

[0172] FIG. 8b is a drawing showing an area where at least two dummy lines (811, 812) of a fifth FPCB (800) according to one embodiment of the present disclosure are arranged.

[0173] FIG. 8c is a drawing showing an area where at least two dummy lines (811, 812) of a fifth FPCB (800) according to one embodiment of the present disclosure are arranged.

[0174] The fifth FPCB (800) of FIG. 8a may be identical to the first FPCB (330) of FIG. 3, the second FBCB (430) of FIG. 4, the third FPCB (530) of FIG. 5, and / or the fourth FPCB (610) of FIG. 6a.

[0175] Referring to FIGS. 8A, 8B, and 8C, the fifth FPCB (800) may include a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, or the fourth plurality of signal lines (4331) of FIG. 4) connecting the cut signal lines of the EMR pad (e.g., the EMR pad (320) of FIG. 3 or the EMR pad (320) of FIG. 4).

[0176] In one embodiment, the fifth FPCB (800) may include a plurality of signal lines (3331a, 3331b, 3331c, 3331d, 3313a, 3313b) connecting cut signal lines of an EMR pad (e.g., EMR pad (320) of FIG. 3 or EMR pad (320) of FIG. 4). For example, the first plurality of signal lines (3313) may include a first wiring (3313a) and a second wiring (3313b) arranged in a first direction (e.g., y-axis direction). The second plurality of signal lines (3331) may include a third wiring (3331a), a fourth wiring (3331b), a fifth wiring (3331c), and a sixth wiring (3331d) arranged in a second direction (e.g., in the x-axis direction).

[0177] In one embodiment, the fifth FPCB (800) includes a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, the fourth plurality of signal lines (4331) of FIG. 4) and at least two dummy lines (811, 812) that are electrically disconnected, and the at least two dummy lines (811, 812) may include fake wiring or non-electrical wiring.

[0178] In one embodiment, a fingerprint sensor (310) may be mounted in a cut-out area of ​​an EMR panel (320). The fingerprint sensor (310) may include an active area (620).

[0179] In one embodiment, the area in which at least two dummy lines (811, 812) included in the fifth FPCB (800) can be placed may correspond to an outer area outside the active area (620) or an area of ​​the EMR panel (320).

[0180] In one embodiment, the fifth FPCB (800) may have at least two dummy lines (811, 812) included in the fifth FPCB (800) placed in an outer area (841, 842) outside the active area (620) or in an area (821, 822) of the EMR panel (320).

[0181] In one embodiment, the EMR panel (320) area (821, 822) may include a pair of third placement areas (821, 822). The outer area (841, 842) outside the active area (620) may include a pair of fourth placement areas (841, 842).

[0182] In one embodiment, the fifth FPCB (800) may have at least two dummy lines (811, 812) arranged in an area corresponding to a pair of third arrangement areas (821, 822) in the first direction (e.g., y-axis direction) among the areas of the fifth FPCB (800).

[0183] In one embodiment, at least two dummy lines (811, 812) may be substantially parallel to each other. The at least two dummy lines (811, 812) may be arranged at each of the two corner regions or the opposite corner regions of the side facing the fingerprint sensor (310) when the fifth FPCB (800) is mounted on the electronic device (100).

[0184] In one embodiment, at least two dummy lines (811, 812) of the fifth FPCB (800) may be arranged across the third wiring (3331a), the fourth wiring (3331b), the fifth wiring (3331c), and the sixth wiring (3331d).

[0185] In one embodiment, the fifth FPCB (800) may have at least two dummy lines (811, 812) arranged in an area corresponding to a pair of third arrangement areas (821, 822) in the first direction (e.g., y-axis direction) among the areas of the fifth FPCB (800).

[0186] In one embodiment, at least two dummy lines (811, 812) may be of equal or different sizes.

[0187] In one embodiment, at least two dummy lines (811, 812) may have a cross-section that is rectangular, circular, polygonal, or a combination thereof.

[0188] In one embodiment, at least two dummy lines (811, 812) may be arranged symmetrically or asymmetrically on the fifth FPCB (800).

[0189] In one embodiment, at least two dummy lines (811, 812) may be arranged singly or in plurality on the fifth FPCB (800).

[0190] In one embodiment, the fifth FPCB (800) may have one dummy line missing from at least two dummy lines (811, 812), or a dummy line added to at least two dummy lines (811, 812).

[0191] FIG. 9A is a drawing showing a sixth FPCB (900) including at least two dummy lines (911, 912) according to one embodiment of the present disclosure.

[0192] FIG. 9b is a drawing showing an area where two or more dummy lines (911, 912) of a sixth FPCB (900) according to one embodiment of the present disclosure are arranged.

[0193] The sixth FPCB (900) of FIG. 9a may be the same as the first FPCB (330) of FIG. 3, the second FBCB (430) of FIG. 4, the third FPCB (530) of FIG. 5, the fourth FPCB (610) of FIG. 6a, and / or the fifth FPCB (800) of FIG. 8a.

[0194] Referring to FIGS. 9A and 9B, the sixth FPCB (900) may include a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, or the fourth plurality of signal lines (4331) of FIG. 4) connecting the cut signal lines of the EMR pad (e.g., the EMR pad (320) of FIG. 3 or the EMR pad (320) of FIG. 4).

[0195] In one embodiment, the sixth FPCB (900) may include a plurality of signal lines (3331a, 3331b, 3331c, 3331d, 3313a, 3313b) connecting cut signal lines of an EMR pad (e.g., EMR pad (320) of FIG. 3 or EMR pad (320) of FIG. 4). For example, the first plurality of signal lines (3313) may include a first wiring (3313a) and a second wiring (3313b) arranged in a first direction (e.g., y-axis direction). The second plurality of signal lines (3331) may include a third wiring (3331a), a fourth wiring (3331b), a fifth wiring (3331c), and a sixth wiring (3331d) arranged in a second direction (e.g., in the x-axis direction).

[0196] In one embodiment, the sixth FPCB (900) includes a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, the fourth plurality of signal lines (4331) of FIG. 4) and at least two dummy lines (911, 912) that are electrically disconnected, and the at least two dummy lines (911, 912) may include fake wiring or non-electrical wiring.

[0197] In one embodiment, the area in which at least two dummy lines (911, 912) included in the sixth FPCB (900) can be placed may correspond to an outer area outside the active area (620) or an area of ​​the EMR panel (320).

[0198] In one embodiment, the sixth FPCB (900) may have at least two dummy lines (911, 912) included in the sixth FPCB (900) placed in the EMR panel (320) area (921, 922).

[0199] In one embodiment, at least two dummy lines (911, 912) may be substantially parallel to each other. At least two dummy lines (911, 912) may be arranged at each of the two corner regions or the opposite corner regions of the side facing the fingerprint sensor (310) when the sixth FPCB (900) is mounted on the electronic device (100).

[0200] In one embodiment, the EMR panel (320) area (921, 922) may include a pair of fifth placement areas (921, 922).

[0201] In one embodiment, the sixth FPCB (900) may have at least two dummy lines (911, 912) arranged in an area corresponding to a pair of fifth arrangement areas (921, 922) in the second direction (e.g., x-axis direction) among the areas of the sixth FPCB (900).

[0202] In one embodiment, the sixth FPCB (900) may have at least two dummy lines (911, 912) arranged in a space between the first wiring (3313a) and the second wiring (3313b).

[0203] In one embodiment, the length of each of at least two dummy lines (911, 912) included in the sixth FPCB (900) may be less than or equal to the spacing between the first wiring (3313a) and the second wiring (3313b).

[0204] In one embodiment, at least two dummy lines (911, 912) may be of equal or different sizes.

[0205] In one embodiment, at least two dummy lines (911, 912) may have a cross-section that is rectangular, circular, polygonal, or a combination thereof.

[0206] In one embodiment, at least two dummy lines (911, 912) may be arranged symmetrically or asymmetrically on the sixth FPCB (900).

[0207] In one embodiment, at least two dummy lines (911, 912) may be arranged singly or in plurality on the sixth FPCB (900).

[0208] In one embodiment, the sixth FPCB (900) may have one dummy line missing from at least two dummy lines (911, 912), or a dummy line added to at least two dummy lines (911, 912).

[0209] FIG. 10A is a drawing showing a seventh FPCB (1000) including at least two dummy lines (1011, 1012) according to one embodiment of the present disclosure.

[0210] FIG. 10b is a drawing showing an area where two or more dummy lines (1011, 1012) of a 7th FPCB (1000) according to one embodiment of the present disclosure are arranged.

[0211] FIG. 10c is a drawing showing an area where at least two dummy lines (1011, 1012) of the 7th FPCB (1000) according to one embodiment of the present disclosure are arranged.

[0212] The seventh FPCB (1000) of FIG. 10a may be the same as the first FPCB (330) of FIG. 3, the second FBCB (430) of FIG. 4, the third FPCB (530) of FIG. 5, the fourth FPCB (610) of FIG. 6a, the fifth FPCB (800) of FIG. 8a, and / or the sixth FPCB (900) of FIG. 9a.

[0213] Referring to FIGS. 10A, 10B, and 10C, the seventh FPCB (1000) may include a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, or the fourth plurality of signal lines (4331) of FIG. 4) connecting the cut signal lines of the EMR pad (e.g., the EMR pad (320) of FIG. 3 or the EMR pad (320) of FIG. 4).

[0214] In one embodiment, the seventh FPCB (1000) may include a plurality of signal lines (3331a, 3331b, 3331c, 3331d, 3313a, 3313b) connecting cut signal lines of an EMR pad (e.g., EMR pad (320) of FIG. 3 or EMR pad (320) of FIG. 4). For example, the first plurality of signal lines (3313) may include a first wiring (3313a) and a second wiring (3313b) arranged in a first direction (e.g., y-axis direction). The second plurality of signal lines (3331) may include a third wiring (3331a), a fourth wiring (3331b), a fifth wiring (3331c), and a sixth wiring (3331d) arranged in a second direction (e.g., in the x-axis direction).

[0215] In one embodiment, the seventh FPCB (1000) includes a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, the fourth plurality of signal lines (4331) of FIG. 4) and at least two dummy lines (1011, 1012) that are electrically disconnected, and the at least two dummy lines (1011, 1012) may include fake wiring or non-electrical wiring.

[0216] In one embodiment, a fingerprint sensor (310) may be mounted in a cut-out area of ​​an EMR panel (320). The fingerprint sensor (310) may include an active area (620).

[0217] In one embodiment, an area in which at least two dummy lines (1011, 1012) included in the 7th FPCB (1000) can be placed may correspond to an outer area outside the active area (620) or an area of ​​the EMR panel (320). In one embodiment, the 7th FPCB (1000) may have at least two dummy lines (1011, 1012) included in the 7th FPCB (1000) placed in an outer area (1041, 1042) outside the active area (620) or an area (1021, 1022) of the EMR panel (320).

[0218] In one embodiment, at least two dummy lines (1011, 1012) may be substantially parallel to each other. The at least two dummy lines (1011, 1012) may be arranged at each of the corner regions of the side facing the fingerprint sensor (310) or the opposite corner regions when the seventh FPCB (1000) is mounted on the electronic device (100).

[0219] In one embodiment, the EMR panel (320) area (1021, 1022) may include a pair of sixth placement areas (1021, 1022).

[0220] In one embodiment, the seventh FPCB (1000) may have at least two dummy lines (1011, 1012) arranged in an area corresponding to a pair of sixth arrangement areas (1021, 1022) in the second direction (e.g., x-axis direction) among the areas of the seventh FPCB (1000).

[0221] Referring to FIGS. 9A and 10A, the 6th FPCB (900) of FIG. 9A has at least two dummy lines (911, 912) arranged in a space between the first wiring (3313a) and the second wiring (3313b), whereas the 7th FPCB (1000) of FIG. 10A has at least two dummy lines (1011, 1012) arranged across the first wiring (3313a) and the second wiring (3313b).

[0222] In one embodiment, at least two dummy lines (1011, 1012) may be of equal or different sizes.

[0223] In one embodiment, at least two dummy lines (1011, 1012) may have a cross-section that is rectangular, circular, polygonal, or a combination thereof.

[0224] In one embodiment, at least two dummy lines (1011, 1012) may be arranged symmetrically or asymmetrically on the seventh FPCB (1000).

[0225] In one embodiment, at least two dummy lines (1011, 1012) may be arranged singly or in plurality on the seventh FPCB (1000).

[0226] In one embodiment, the seventh FPCB (1000) may have one dummy line missing from at least two dummy lines (1011, 1012), or a dummy line added to at least two dummy lines (1011, 1012).

[0227] FIG. 11A is a drawing showing an eighth FPCB (1100) including at least two dummy lines (1111, 1112, 1113, 1114) according to one embodiment of the present disclosure.

[0228] FIG. 11b is a drawing showing an area where at least two dummy lines (1111, 1112, 1113, 1114) of the 8th FPCB (1100) according to one embodiment of the present disclosure are arranged.

[0229] The eighth FPCB (1100) of FIG. 11a may be the same as the first FPCB (330) of FIG. 3, the second FBCB (430) of FIG. 4, the third FPCB (530) of FIG. 5, the fourth FPCB (610) of FIG. 6a, the fifth FPCB (800) of FIG. 8a, the sixth FPCB (900) of FIG. 9a, and / or the seventh FPCB (1000) of FIG. 10a.

[0230] Referring to FIGS. 11A and 11B, the 8th FPCB (1100) may include a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, or the fourth plurality of signal lines (4331) of FIG. 4) connecting the cut signal lines of the EMR pad (e.g., the EMR pad (320) of FIG. 3 or the EMR pad (320) of FIG. 4).

[0231] In one embodiment, the eighth FPCB (1100) may include a plurality of signal lines (3331a, 3331b, 3331c, 3331d, 3313a, 3313b) connecting cut signal lines of an EMR pad (e.g., EMR pad (320) of FIG. 3 or EMR pad (320) of FIG. 4). For example, the first plurality of signal lines (3313) may include a first wiring (3313a) and a second wiring (3313b) arranged in a first direction (e.g., y-axis direction). The second plurality of signal lines (3331) may include a third wiring (3331a), a fourth wiring (3331b), a fifth wiring (3331c), and a sixth wiring (3331d) arranged in a second direction (e.g., in the x-axis direction).

[0232] In one embodiment, the eighth FPCB (1100) includes a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, the fourth plurality of signal lines (4331) of FIG. 4)) and at least two dummy lines (1111, 1112, 1113, 1114) that are electrically disconnected, and the at least two dummy lines (1111, 1112, 1113, 1114) may include fake wiring or non-electrical wiring.

[0233] In one embodiment, a fingerprint sensor (310) may be mounted in a cut-out area of ​​an EMR panel (320). The fingerprint sensor (310) may include an active area (620).

[0234] In one embodiment, an area in which at least two dummy lines (1111, 1112, 1113, 1114) included in the 8th FPCB (1100) can be placed may correspond to an outer area outside the active area (620) or an area of ​​the EMR panel (320).

[0235] In one embodiment, the eighth FPCB (1100) may have at least two dummy lines (1111, 1112, 1113, 1114) included in the eighth FPCB (1100) placed in an outer region (1121, 1122, 1123, 1124) outside the active region (620).

[0236] In one embodiment, the fifth dummy line (1111) and the sixth dummy line (1112) may be substantially parallel to each other. The fifth dummy line (1111) and the sixth dummy line (1112) may be arranged at each of the two corner regions or the opposite corner regions of the side facing the fingerprint sensor (310) when the eighth FPCB (1100) is mounted on the electronic device (100).

[0237] In one embodiment, the seventh dummy line (1113) and the eighth dummy line (1114) may be substantially parallel to each other. The seventh dummy line (1113) and the eighth dummy line (1114) may be arranged at each of the opposite corner regions or the opposite corner regions of the side facing the fingerprint sensor (310) when the eighth FPCB (1100) is mounted on the electronic device (100). The fifth dummy line (1111) and the seventh dummy line (1113) may be orthogonal to each other. The sixth dummy line (1112) and the eighth dummy line (1114) may be orthogonal to each other.

[0238] In one embodiment, the peripheral regions (1121, 1122, 1123, 1124) outside the active region (620) may include a pair of seventh placement regions (1121, 1122) and a pair of eighth placement regions (1123, 1124).

[0239] In one embodiment, a pair of seventh placement areas (1121, 1122) may be arranged in a second direction (e.g., in the x-axis direction) in the electronic device (100).

[0240] In one embodiment, a pair of eighth placement areas (1123, 1124) may be arranged in a first direction (e.g., in the y-axis direction) in the electronic device (100).

[0241] In one embodiment, the eighth FPCB (1100) may have at least two dummy lines (1111, 1112) arranged in an area corresponding to a pair of seventh arrangement areas (1121, 1122) in the second direction (e.g., x-axis direction) among the areas of the eighth FPCB (1100).

[0242] In one embodiment, the eighth FPCB (1100) may have at least two dummy lines (1113, 1114) arranged in an area corresponding to a pair of eighth placement areas (1123, 1124) in a first direction (e.g., y-axis direction) among the areas of the eighth FPCB (1100).

[0243] In one embodiment, at least two dummy lines (1111, 1112) arranged in an area corresponding to a pair of seventh arrangement areas (1121, 1122) may be arranged in a space between the first wiring (3313a) and the second wiring (3313b).

[0244] In one embodiment, the length of each of at least two dummy lines (1111, 1112) arranged in an area corresponding to a pair of seventh arrangement areas (1121, 1122) may be less than or equal to the spacing between the first wiring (3313a) and the second wiring (3313b).

[0245] In one embodiment, at least two dummy lines (1113, 1114) may be arranged across the third wiring (3331a), the fourth wiring (3331b), the fifth wiring (3331c), and the sixth wiring (3331d) in an area corresponding to a pair of eighth placement areas (1123, 1124).

[0246] In one embodiment, at least two dummy lines (1111, 1112) may be of equal or different sizes.

[0247] In one embodiment, at least two dummy lines (1111, 1112) may have a cross-section that is rectangular, circular, polygonal or a combination thereof.

[0248] In one embodiment, at least two dummy lines (1111, 1112) may be arranged symmetrically or asymmetrically on the eighth FPCB (1100).

[0249] In one embodiment, at least two dummy lines (1111, 1112) may be arranged singly or in plurality on the eighth FPCB (1100).

[0250] In one embodiment, the 8th FPCB (1100) may have one dummy line missing from at least two dummy lines (1111, 1112), or a dummy line added to at least two dummy lines (1111, 1112).

[0251] FIG. 12A is a drawing showing a ninth FPCB (1200) including at least two dummy lines (1211, 1212, 1213, 1214) according to one embodiment of the present disclosure.

[0252] FIG. 12b is a drawing showing an area where at least two dummy lines (1211, 1212, 1213, 1214) of the 9th FPCB (1200) according to one embodiment of the present disclosure are arranged.

[0253] The ninth FPCB (1200) of FIG. 12a may be the same as the first FPCB (330) of FIG. 3, the second FPCB (430) of FIG. 4, the third FPCB (530) of FIG. 5, the fourth FPCB (610) of FIG. 6a, the fifth FPCB (800) of FIG. 8a, the sixth FPCB (900) of FIG. 9a, the seventh FPCB (1000) of FIG. 10a, and / or the eighth FPCB (1100) of FIG. 11a.

[0254] In one embodiment, the first FPCB (330) of FIG. 3, the second FPCB (430) of FIG. 4, the third FPCB (530) of FIG. 5, the fourth FPCB (610) of FIG. 6a, the fifth FPCB (800) of FIG. 8a, the sixth FPCB (900) of FIG. 9a, the seventh FPCB (1000) of FIG. 10a, the eighth FPCB (1100) of FIG. 11a, and / or the ninth FPCB (1200) of FIG. 12a can be manufactured in a substantially rectangular film shape.

[0255] Referring to FIGS. 12A and 12B, the 9th FPCB (1200) may include a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, or the fourth plurality of signal lines (4331) of FIG. 4) connecting the cut signal lines of the EMR pad (e.g., the EMR pad (320) of FIG. 3 or the EMR pad (320) of FIG. 4).

[0256] In one embodiment, the ninth FPCB (1200) may include a plurality of signal lines (3331a, 3331b, 3331c, 3331d, 3313a, 3313b) connecting cut signal lines of an EMR pad (e.g., EMR pad (320) of FIG. 3 or EMR pad (320) of FIG. 4). For example, the first plurality of signal lines (3313) may include a first wiring (3313a) and a second wiring (3313b) arranged in a first direction (e.g., y-axis direction). The second plurality of signal lines (3331) may include a third wiring (3331a), a fourth wiring (3331b), a fifth wiring (3331c), and a sixth wiring (3331d) arranged in a second direction (e.g., in the x-axis direction).

[0257] In one embodiment, the ninth FPCB (1200) includes a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, the fourth plurality of signal lines (4331) of FIG. 4)) and at least two dummy lines (1211, 1212, 1213, 1214) that are electrically disconnected, and the at least two dummy lines (1211, 1212, 1213, 1214) may include fake wiring or non-electrical wiring.

[0258] In one embodiment, a fingerprint sensor (310) may be mounted in a cut-out area of ​​an EMR panel (320). The fingerprint sensor (310) may include an active area (620).

[0259] In one embodiment, an area in which at least two dummy lines (1211, 1212, 1213, 1214) included in the ninth FPCB (1200) can be placed may correspond to an outer area outside the active area (620) or an area of ​​the EMR panel (320).

[0260] In one embodiment, the ninth FPCB (1200) may have at least two dummy lines (1211, 1212, 1213, 1214) included in the ninth FPCB (1200) placed in an outer region (1211, 1212, 1213, 1214) outside the active region (620).

[0261] In one embodiment, the ninth dummy line (1211) and the tenth dummy line (1212) may be parallel to each other. The ninth dummy line (1211) and the tenth dummy line (1212) may be arranged at each of the two corner regions or the opposite corner regions of the side facing the fingerprint sensor (310) when the ninth FPCB (1200) is mounted on the electronic device (100).

[0262] In one embodiment, the eleventh dummy line (1213) and the twelfth dummy line (1214) may be parallel to each other. The eleventh dummy line (1213) and the twelfth dummy line (1214) may be arranged at each of the two corner regions or the opposite corner regions of the side facing the fingerprint sensor (310) when the ninth FPCB (1200) is mounted on the electronic device (100). The ninth dummy line (1211) and the eleventh dummy line (1213) may be orthogonal to each other. The tenth dummy line (1212) and the twelfth dummy line (1214) may be orthogonal to each other.

[0263] In one embodiment, the peripheral regions (1221, 1222, 1223, 1224) outside the active region (620) may include a pair of ninth placement regions (1221, 1222) and a pair of tenth placement regions (1223, 1224).

[0264] In one embodiment, a pair of ninth placement areas (1221, 1222) may be arranged in a second direction (e.g., in the x-axis direction) in the electronic device (100).

[0265] In one embodiment, a pair of tenth arrangement areas (1223, 1224) may be arranged in a first direction (e.g., in the y-axis direction) in the electronic device (100).

[0266] In one embodiment, the ninth FPCB (1200) may have at least two dummy lines (1211, 1212) arranged in an area corresponding to a pair of ninth placement areas (1221, 1222) in a second direction (e.g., x-axis direction) among the areas of the ninth FPCB (1200).

[0267] In one embodiment, the ninth FPCB (1200) may have at least two dummy lines (1213, 1214) arranged in an area corresponding to a pair of tenth arrangement areas (1223, 1224) in a first direction (e.g., y-axis direction) among the areas of the ninth FPCB (1200).

[0268] In one embodiment, at least two dummy lines (1211, 1212) arranged in areas corresponding to a pair of ninth arrangement areas (1221, 1222) may be arranged across the third wiring (3331a), the fourth wiring (3331b), the fifth wiring (3331c), and the sixth wiring (3331d).

[0269] In one embodiment, at least two dummy lines (1213, 1214) arranged in areas corresponding to a pair of tenth arrangement areas (1223, 1224) may be arranged in the gap between the fourth wiring (3331b) and the fifth wiring (3331c).

[0270] In one embodiment, the length of each of at least two dummy lines (1213, 1214) arranged in an area corresponding to a pair of tenth arrangement areas (1223, 1224) may be less than or equal to the spacing between the fourth wiring (3331b) and the fifth wiring (3331c).

[0271] In one embodiment, at least two dummy lines (1213, 1214) may be of equal or different sizes.

[0272] In one embodiment, at least two dummy lines (1213, 1214) may have a cross-section that is rectangular, circular, polygonal, or a combination thereof.

[0273] In one embodiment, at least two dummy lines (1213, 1214) may be arranged symmetrically or asymmetrically on the ninth FPCB (1200).

[0274] In one embodiment, at least two dummy lines (1213, 1214) may be arranged singly or in plurality on the ninth FPCB (1200).

[0275] In one embodiment, the 9th FPCB (1200) may have one dummy line missing from at least two dummy lines (1213, 1214), or a dummy line added to at least two dummy lines (1213, 1214).

[0276] FIG. 13 is a drawing showing a tenth FPCB (1300) including at least two dummy lines (1311, 1312, 1313, 1314) according to one embodiment of the present disclosure.

[0277] The 10th FPCB (1300) of FIG. 13 may be the same as the 1st FPCB (330) of FIG. 3, the 2nd FPCB (430) of FIG. 4, the 3rd FPCB (530) of FIG. 5, the 4th FPCB (610) of FIG. 6a, the 5th FPCB (800) of FIG. 8a, the 6th FPCB (900) of FIG. 9a, the 7th FPCB (1000) of FIG. 10a, the 8th FPCB (1100) of FIG. 11a, and / or the 9th FPCB (1200) of FIG. 12a.

[0278] Referring to FIG. 13, the 10th FPCB (1300) may include a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, or the fourth plurality of signal lines (4331) of FIG. 4) connecting the cut signal lines of the EMR pad (e.g., the EMR pad (320) of FIG. 3 or the EMR pad (320) of FIG. 4).

[0279] In one embodiment, the 10th FPCB (1300) may include a plurality of signal lines (3331a, 3331b, 3331c, 3331d, 3313a, 3313b) connecting cut signal lines of an EMR pad (e.g., EMR pad (320) of FIG. 3 or EMR pad (320) of FIG. 4). For example, the first plurality of signal lines (3313) may include a first wiring (3313a) and a second wiring (3313b) arranged in a first direction (e.g., y-axis direction). The second plurality of signal lines (3331) may include a third wiring (3331a), a fourth wiring (3331b), a fifth wiring (3331c), and a sixth wiring (3331d) arranged in a second direction (e.g., in the x-axis direction).

[0280] In one embodiment, the 10th FPCB (1300) includes a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, the fourth plurality of signal lines (4331) of FIG. 4)) and at least two or more dummy lines (1311, 1312, 1313, 1314) that are electrically disconnected, and the at least two or more dummy lines (1311, 1312, 1313, 1314) may include fake wiring or non-electrical wiring.

[0281] Referring to FIG. 9b and FIG. 13, an area in which at least two dummy lines (1311, 1312, 1313, 1314) included in the 10th FPCB (1300) can be placed may correspond to an outer area outside the active area (620) or an area of ​​the EMR panel (320).

[0282] Referring to FIG. 9b and FIG. 13, the 10th FPCB (1300) may have at least two dummy lines (1311, 1312, 1313, 1314) included in the 10th FPCB (1300) placed in the EMR panel (320) area (921, 922).

[0283] In one embodiment, at least two dummy lines (1311, 1312, 1313, 1314) may be substantially parallel to each other. The at least two dummy lines (1311, 1312, 1313, 1314) may be arranged at each of the two corner regions or the opposite corner regions of the side facing the fingerprint sensor (310) when the 10th FPCB (1300) is mounted on the electronic device (100).

[0284] Referring to FIG. 9b and FIG. 13, the 10th FPCB (1300) may have at least two dummy lines (1311, 1312, 1313, 1314) arranged in an area corresponding to a pair of fifth arrangement areas (921, 922) in the second direction (e.g., x-axis direction) among the areas of the 10th FPCB (1300).

[0285] In one embodiment, the 10th FPCB (1300) may have at least two dummy lines (1311, 1312, 1313, 1314) arranged in a space between the first wiring (3313a) and the second wiring (3313b).

[0286] In one embodiment, the length of each of at least two dummy lines (1311, 1312, 1313, 1314) included in the 10th FPCB (1300) may be less than or equal to the spacing between the first wiring (3313a) and the second wiring (3313b).

[0287] In one embodiment, the 10th FPCB (1300) may have at least two dummy lines (1311, 1312, 1313, 1314) arranged in a space between the fourth wire (3313b) and the fifth wire (3313c).

[0288] In one embodiment, the 10th FPCB (1300) may be spaced apart in an area surrounding at least two dummy lines (1311, 1312, 1313, 1314) by the fourth wiring (3313b), the fifth wiring (3313c), and the first wiring (3313a).

[0289] In one embodiment, the 10th FPCB (1300) may be spaced apart in an area surrounding at least two dummy lines (1311, 1312, 1313, 1314) by the fourth wiring (3313b), the fifth wiring (3313c), and the second wiring (3313b).

[0290] In one embodiment, at least two dummy lines (1311, 1312, 1313, 1314) may be of equal or different sizes.

[0291] In one embodiment, at least two dummy lines (1311, 1312, 1313, 1314) may have a cross-section that is rectangular, circular, polygonal, or a combination thereof.

[0292] In one embodiment, at least two dummy lines (1311, 1312, 1313, 1314) may be arranged symmetrically or asymmetrically on the 10th FPCB (1300).

[0293] In one embodiment, at least two or more dummy lines (1311, 1312, 1313, 1314) may be arranged singly or in plurality on the 10th FPCB (1300).

[0294] In one embodiment, the 10th FPCB (1300) may have one dummy line missing from at least two dummy lines (1311, 1312, 1313, 1314), or may have a dummy line added to at least two dummy lines (1311, 1312, 1313, 1314).

[0295] FIG. 14 is a drawing showing an eleventh FPCB (1400) including at least two dummy lines (1411, 1412, 1413, 1414) according to one embodiment of the present disclosure.

[0296] The 11th FPCB (1400) of FIG. 14 may be the same as the 1st FPCB (330) of FIG. 3, the 2nd FPCB (430) of FIG. 4, the 3rd FPCB (530) of FIG. 5, the 4th FPCB (610) of FIG. 6a, the 5th FPCB (800) of FIG. 8a, the 6th FPCB (900) of FIG. 9a, the 7th FPCB (1000) of FIG. 10a, the 8th FPCB (1100) of FIG. 11a, the 9th FPCB (1200) of FIG. 12a, and / or the 10th FPCB (1300) of FIG. 13.

[0297] Referring to FIG. 14, the 11th FPCB (1400) may include a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, or the fourth plurality of signal lines (4331) of FIG. 4) connecting the cut signal lines of the EMR pad (e.g., the EMR pad (320) of FIG. 3 or the EMR pad (320) of FIG. 4).

[0298] In one embodiment, the 11th FPCB (1400) may include a plurality of signal lines (3331a, 3331b, 3331c, 3331d, 3313a, 3313b) connecting cut signal lines of an EMR pad (e.g., EMR pad (320) of FIG. 3 or EMR pad (320) of FIG. 4). For example, the first plurality of signal lines (3313) may include a first wiring (3313a) and a second wiring (3313b) arranged in a first direction (e.g., y-axis direction). The second plurality of signal lines (3331) may include a third wiring (3331a), a fourth wiring (3331b), a fifth wiring (3331c), and a sixth wiring (3331d) arranged in a second direction (e.g., in the x-axis direction).

[0299] In one embodiment, the 11th FPCB (1400) includes a plurality of signal lines (e.g., the first plurality of signal lines (3313) of FIG. 3, the second plurality of signal lines (3331) of FIG. 3, the third plurality of signal lines (4313) of FIG. 4, the fourth plurality of signal lines (4331) of FIG. 4)) and at least two dummy lines (1411, 1412, 1413, 1414) that are electrically disconnected, and the at least two dummy lines (1411, 1412, 1413, 1414) may include fake wiring or non-electrical wiring.

[0300] Referring to FIGS. 8b, 8c and 14, an area where at least two dummy lines (1411, 1412, 1413, 1414) included in the 11th FPCB (1400) can be placed may correspond to an outer area outside the active area (620) or an area of ​​the EMR panel (320).

[0301] In one embodiment, the 11th FPCB (1400) may have at least two dummy lines (1411, 1412, 1413, 1414) included in the 11th FPCB (1400) placed in an outer area (841, 842) outside the active area (620) or in an area (821, 822) of the EMR panel (320).

[0302] In one embodiment, the EMR panel (320) area (821, 822) may include a pair of third placement areas (821, 822). The outer area (841, 842) outside the active area (620) may include a pair of fourth placement areas (841, 842).

[0303] In one embodiment, the 11th FPCB (1400) may have at least two dummy lines (1411, 1412, 1413, 1414) arranged in an area corresponding to a pair of third arrangement areas (821, 822) in a first direction (e.g., y-axis direction) among the areas of the 11th FPCB (1400).

[0304] In one embodiment, at least two dummy lines (1411, 1412, 1413, 1414) may be substantially parallel to each other. The at least two dummy lines (1411, 1412, 1413, 1414) may be arranged at each of the two corner regions or the opposite corner regions of the side facing the fingerprint sensor (310) when the 11th FPCB (1400) is mounted on the electronic device (100).

[0305] In one embodiment, at least two dummy lines (1411, 1412, 1413, 1414) of the 11th FPCB (1400) may be arranged in at least one of an area surrounded by the first wiring (3313a) and the third wiring (3331a), an area surrounded by the second wiring (3313b) and the third wiring (3331a), an area surrounded by the first wiring (3313a), the fourth wiring (3331b), and the fifth wiring (3331c), and an area surrounded by the second wiring (3313b), the fourth wiring (3331b), and the fifth wiring (3331c).

[0306] In one embodiment, at least two dummy lines (1411, 1412, 1413, 1414) may be of equal or different sizes.

[0307] In one embodiment, at least two dummy lines (1411, 1412, 1413, 1414) may have a cross-section that is rectangular, circular, polygonal, or a combination thereof.

[0308] In one embodiment, at least two dummy lines (1411, 1412, 1413, 1414) may be arranged symmetrically or asymmetrically on the eleventh FPCB (1400).

[0309] In one embodiment, at least two or more dummy lines (1411, 1412, 1413, 1414) may be arranged singly or in plurality on the 11th FPCB (1400).

[0310] In one embodiment, the 11th FPCB (1400) may have one dummy line missing from at least two dummy lines (1411, 1412, 1413, 1414), or may have a dummy line added to at least two dummy lines (1411, 1412, 1413, 1414).

[0311] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure pertains.

[0312] In one embodiment, the electronic device (100) includes a display (140), a fingerprint sensor (310) disposed under the display (140), an electro magnetic resonance (EMR) panel (320) disposed under the display (140), an opening formed in the EMR (320) at a position corresponding to the fingerprint sensor (310) and an FPCB (flexible printed circuit board) spaced apart from the fingerprint sensor (310) by a predetermined distance or more (e.g., the first FPCB (330) of FIG. 3, the second FPCB (430) of FIG. 4, the third FPCB (530) of FIG. 5, the fourth FPCB (610) of FIG. 6a, the fifth FPCB (800) of FIG. 8a, the sixth FPCB (900) of FIG. 9a, the seventh FPCB (1000) of FIG. 10a, the eighth FPCB (1100) of FIG. 11a, and the eighth FPCB (1100) of FIG. 12a). The 9th FPCB (1200), the 10th FPCB (1300) of FIG. 13 and / or the 11th FPCB (1400) of FIG. 14) includes an FPCB (e.g., the 1st FPCB (330) of FIG. 3, the 2nd FPCB (430) of FIG. 4, the 3rd FPCB (530) of FIG. 5, the 4th FPCB (610) of FIG. 6a, the 5th FPCB (800) of FIG. 8a, the 6th FPCB (900) of FIG. 9a, the 7th FPCB (1000) of FIG. 10a, the 8th FPCB (1100) of FIG. 11a, the 9th FPCB (1200) of FIG. 12a, the 10th FPCB (1300) of FIG. 13 and / or the 11th FPCB (1400) of FIG. 14 FPCB (1400)) includes a first plurality of signal lines (3313) arranged in a first direction on a first layer (331), a second plurality of signal lines (3331) arranged in a second direction orthogonal to the first direction on a second layer (332), and at least two or more dummy lines arranged parallel to each of the opposite corner regions of the first layer (331) (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4).At least two dummy lines (531, 532) of FIG. 5, at least two dummy lines (811, 812) of FIG. 8a, at least two dummy lines (911, 912) of FIG. 9a, at least two dummy lines (1011, 1012) of FIG. 10a, at least two dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two dummy lines (1311, 1312, 1313, 1314) of FIG. 13 and / or at least two dummy lines (1411, 1412, 1413, 1414) of FIG. 14 and at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, 1312, 1313, 1314) and / or at least two or more dummy lines (1411, 1412, 1413, 1414) of FIG. 14) are connected to a flexible printed circuit board (FPCB) (e.g., the first FPCB (330) of FIG. 3, the second FBCB (430) of FIG. 4, the third FPCB (530) of FIG. 5, the fourth FPCB (610) of FIG. 6a, the fifth FPCB (800) of FIG. 8a, the sixth FPCB (900) of FIG. 9a, the seventh FPCB (1000) of FIG. 10a,The 8th FPCB (1100) of FIG. 11a, the 9th FPCB (1200) of FIG. 12a, the 10th FPCB (1300) of FIG. 13 and / or the 11th FPCB (1400) of FIG. 14) includes an FPCB (e.g., the 1st FPCB (330) of FIG. 3, the 2nd FPCB (430) of FIG. 4, the 3rd FPCB (530) of FIG. 5, the 4th FPCB (610) of FIG. 6a, the 5th FPCB (800) of FIG. 8a, the 6th FPCB (900) of FIG. 9a, the 7th FPCB (1000) of FIG. 10a, the 8th FPCB (1100) of FIG. 11a, the 9th FPCB (1200) of FIG. 12a, the 10th FPCB (1400) of FIG. 13 In order to maintain a predefined gap distance between the opposite corner areas of the FPCB (1300) and / or the 11th FPCB (1400) of FIG. 14 and the fingerprint sensor (310), it may come into contact with the inactive area of ​​the fingerprint sensor (310).

[0313] In one embodiment, at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, 1312, 1313, 1314) and / or at least two or more dummy lines (1411, 1412, 1413, 1414) of FIG. 14) are connected to an FPCB (e.g., the first FPCB (330) of FIG. 3, the second FPCB (430) of FIG. 4, the third FPCB (530) of FIG. 5, the fourth FPCB (610) of FIG. 6a, the fifth FPCB (800) of FIG. 8a, the sixth FPCB (900) of FIG. 9a, the seventh FPCB (1000) of FIG. 10a, the eighth FPCB (1100) of FIG. 11a, the ninth FPCB (1200) of FIG. 12a, the tenth FPCB (1300) of FIG. 13 and / or the eleventh FPCB (1411) of FIG. 14). Due to the sagging of the FPCB (1400), the FPCB (e.g., the first FPCB (330) of FIG. 3, the second FPCB (430) of FIG. 4, the third FPCB (530) of FIG. 5, the fourth FPCB (610) of FIG. 6a, the fifth FPCB (800) of FIG. 8a, the sixth FPCB (900) of FIG. 9a, the seventh FPCB (1000) of FIG. 10a, the eighth FPCB (1100) of FIG. 11a, the ninth FPCB (1200) of FIG. 12a)The central region of the 10th FPCB (1300) of FIG. 13 and / or the 11th FPCB (1400) of FIG. 14 may have a thickness that prevents contact with the fingerprint sensor (310).

[0314] In one embodiment, at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, Each of the at least two dummy lines (1312, 1313, 1314) and / or the at least two dummy lines (1411, 1412, 1413, 1414) of FIG. 14 may be arranged in the first direction or the second direction.

[0315] In one embodiment, at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, Each of the at least two dummy lines (1411, 1412, 1413, 1414) and / or the at least two dummy lines (1411, 1412, 1413, 1414) of FIG. 14 may be arranged across the first plurality of signal lines (3313) when arranged in the first direction.

[0316] In one embodiment, at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, Each of the at least two dummy lines (1312, 1313, 1314) and / or the at least two dummy lines (1411, 1412, 1413, 1414) of FIG. 14 may be arranged between the first plurality of signal lines (3313) when arranged in the first direction.

[0317] In one embodiment, at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, Each of the at least two dummy lines (1411, 1412, 1413, 1414) and / or the at least two dummy lines (1411, 1412, 1413, 1414) of FIG. 14 may be arranged across the second plurality of signal lines (3331) when arranged in the second direction.

[0318] In one embodiment, at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, Each of the at least two dummy lines (1312, 1313, 1314) and / or the at least two dummy lines (1411, 1412, 1413, 1414) of FIG. 14 may be arranged between the second plurality of signal lines (3331) when arranged in the second direction.

[0319] In one embodiment, each of the first pair of dummy lines may be arranged across the first plurality of signal lines (3313) in the first direction.

[0320] In one embodiment, each of the second pair of dummy lines may be positioned between the second plurality of signal lines (3331) in the second direction.

[0321] In one embodiment, each of the first pair of dummy lines may be positioned between the first plurality of signal lines (3313) in the first direction.

[0322] In one embodiment, each of the second pair of dummy lines may be arranged across the second plurality of signal lines (3331) in the second direction.

[0323] In one embodiment, an FPCB (e.g., a first FPCB (330) of FIG. 3, a second FPCB (430) of FIG. 4, a third FPCB (530) of FIG. 5, a fourth FPCB (610) of FIG. 6a, a fifth FPCB (800) of FIG. 8a, a sixth FPCB (900) of FIG. 9a, a seventh FPCB (1000) of FIG. 10a, an eighth FPCB (1100) of FIG. 11a, a ninth FPCB (1200) of FIG. 12a, a tenth FPCB (1300) of FIG. 13 and / or an eleventh FPCB (1400) of FIG. 14) is disposed between the first layer (331) and the second layer (332), and includes a first plurality of signal lines (3313) and a second plurality of It may include a third layer including signal connection lines that are electrically connected to the signal lines (3331) and soldered to the EMR panel (320).

[0324] In one embodiment, the first plurality of signal lines and the second plurality of signal lines may be electrically connected to signal stones included in the EMR panel (320).

[0325] In one embodiment, at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, Each of the at least two dummy lines (1312, 1313, 1314) and / or the at least two dummy lines (1411, 1412, 1413, 1414) of FIG. 14 may be arranged to correspond to an inactive area or an area corresponding to the EMR panel (320).

[0326] In one embodiment, the fingerprint sensor (310) may include a fourth layer that contacts the inactive area or EMR panel (320).

[0327] In one embodiment, at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, 1312, 1313, 1314) and / or at least two or more dummy lines (1411, 1412, 1413, 1414) of FIG. 14 may be included in the fourth layer.

[0328] In one embodiment, the shielding layer (334) may include at least a portion of a magnetic metal.

[0329] In one embodiment, the first layer (331) and the second layer (332) may be insulated to surround the first plurality of signal lines (3313), the second plurality of signal lines (3331) and at least two dummy lines.

[0330] In one embodiment, at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, 1312, 1313, 1314) and / or at least two dummy lines (1411, 1412, 1413, 1414) of FIG. 14 may be electrically disconnected from the first plurality of signal lines (3313) and the second plurality of signal lines (3331).

[0331] In one embodiment, a flexible printed circuit board (FPCB) (e.g., a first FPCB (330) of FIG. 3, a second FPCB (430) of FIG. 4, a third FPCB (530) of FIG. 5, a fourth FPCB (610) of FIG. 6a, a fifth FPCB (800) of FIG. 8a, a sixth FPCB (900) of FIG. 9a, a seventh FPCB (1000) of FIG. 10a, an eighth FPCB (1100) of FIG. 11a, a ninth FPCB (1200) of FIG. 12a, a tenth FPCB (1300) of FIG. 13 and / or an eleventh FPCB (1400) of FIG. 14) has a first plurality of signal lines (3313) arranged in a first direction in a first layer (331), and a second layer (332). A second plurality of signal lines (3331) arranged in a second direction orthogonal to the first direction, and at least two or more dummy lines arranged parallel to the opposite corner regions of the first layer (331), respectively (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines of FIG. 12a) It may include lines (1211, 1212, 1213, 1214), at least two or more dummy lines (1311, 1312, 1313, 1314) of FIG. 13 and / or at least two or more dummy lines (1411, 1412, 1413, 1414) of FIG. 14.

[0332] In one embodiment, at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, 1312, 1313, 1314) and / or at least two or more dummy lines (1411, 1412, 1413, 1414) of FIG. 14) each correspond to a first plurality of signal lines (3313) and an FPCB (e.g., a first FPCB (330) of FIG. 3, a second FPCB (430) of FIG. 4, a third FPCB (530) of FIG. 5, a fourth FPCB (610) of FIG. 6a, a fifth FPCB (800) of FIG. 8a, a sixth FPCB (900) of FIG. 9a, a seventh FPCB (1000) of FIG. 10a, an eighth FPCB (1100) of FIG. 11a, a ninth FPCB (1200) of FIG. 12a, a tenth FPCB (1300) of FIG. 13) And / or the thickness can be determined by the degree of sagging of the 11th FPCB (1400) of FIG. 14.

[0333] In one embodiment, at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, Each of the at least two dummy lines (1312, 1313, 1314) and / or the at least two dummy lines (1411, 1412, 1413, 1414) of FIG. 14 may be arranged in the first direction or the second direction.

[0334] In one embodiment, at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, Each of the at least two dummy lines (1411, 1412, 1413, 1414) and / or the at least two dummy lines (1411, 1412, 1413, 1414) of FIG. 14 may be arranged across the first plurality of signal lines (3313) when arranged in the first direction.

[0335] In one embodiment, at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, Each of the at least two dummy lines (1411, 1412, 1413, 1414) and / or the at least two dummy lines (1411, 1412, 1413, 1414) of FIG. 14 may be arranged across the second plurality of signal lines (3331) when arranged in the second direction.

[0336] In one embodiment, at least two or more dummy lines (e.g., at least two or more dummy lines (3311, 3312) of FIG. 3, at least two or more dummy lines (4311, 4312) of FIG. 4, at least two or more dummy lines (531, 532) of FIG. 5, at least two or more dummy lines (811, 812) of FIG. 8a, at least two or more dummy lines (911, 912) of FIG. 9a, at least two or more dummy lines (1011, 1012) of FIG. 10a, at least two or more dummy lines (1111, 1112, 1113, 1114) of FIG. 11a, at least two or more dummy lines (1211, 1212, 1213, 1214) of FIG. 12a, at least two or more dummy lines (1311, Each of the at least two dummy lines (1312, 1313, 1314) and / or the at least two dummy lines (1411, 1412, 1413, 1414) of FIG. 14 may be arranged between the second plurality of signal lines (3331) when arranged in the second direction.

[0337] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0338] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0339] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0340] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0341] An embodiment of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device (100)). For example, a processor (e.g., processor (110)) of the machine (e.g., electronic device (100)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0342] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0343] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

In electronic devices, display; A fingerprint sensor placed underneath the display; An electro magnetic resonance (EMR) panel disposed below the display, an opening being formed in the EMR panel at a position corresponding to the fingerprint sensor; and It includes a flexible printed circuit board (FPCB) spaced a certain distance from the fingerprint sensor, The above FPCB A first plurality of signal lines arranged in a first direction in a first layer; A second plurality of signal lines arranged in a second direction orthogonal to the first direction in the second layer; and comprising at least two dummy lines arranged parallel to opposite edge regions of the first layer, An electronic device in which at least two dummy lines are in contact with an inactive area of ​​the fingerprint sensor to maintain a predefined gap distance between opposite edge areas of the FPCB and the fingerprint sensor. In paragraph 1, Each of the above at least two dummy lines An electronic device having a thickness that prohibits a central region of the FPCB from contacting the fingerprint sensor due to sagging of the FPCB. In paragraph 1, Each of the above at least two dummy lines An electronic device arranged in the first direction or the second direction. In paragraph 1, Each of the above at least two dummy lines An electronic device arranged across the first plurality of signal lines when arranged in the first direction. In paragraph 1, Each of the above at least two dummy lines An electronic device disposed between the first plurality of signal lines when arranged in the first direction. In paragraph 1, Each of the above at least two dummy lines An electronic device arranged across the second plurality of signal lines when arranged in the second direction. In paragraph 1, Each of the above at least two dummy lines An electronic device disposed between the second plurality of signal lines when arranged in the second direction. In paragraph 1, Each of the first pair of dummy lines is In the first direction, the first plurality of signal lines are arranged across each other, Each of the second pair of dummy lines is An electronic device disposed between the second plurality of signal lines in the second direction. In paragraph 1, Each of the first pair of dummy lines is In the first direction, it is arranged between the first plurality of signal lines, Each of the second pair of dummy lines is An electronic device arranged across the second plurality of signal lines in the second direction. In paragraph 1, The above FPCB is placed between the first layer and the second layer, An electronic device comprising a third layer including signal connection lines electrically connected to the first plurality of signal lines and the second plurality of signal lines and soldered to the EMR panel. In paragraph 1, The first plurality of signal lines and the second plurality of signal lines An electronic device electrically connected to the signal lines included in the above EMR panel. In paragraph 1, A fourth layer that contacts the inactive area of ​​the fingerprint sensor or the EMR panel, Each of the above at least two dummy lines An electronic device included in the fourth layer. In paragraph 1, An electronic device further comprising a shielding layer comprising at least a magnetic metal. In paragraph 13, The above first layer and the above second layer An electronic device that surrounds the first plurality of signal lines, the second plurality of signal lines, and the at least two dummy lines with an insulator. In paragraph 13, At least two dummy lines above An electronic device electrically disconnected from the first plurality of signal lines and the second plurality of signal lines.

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