Packaging structure

Abstract

Disclosed in the present application is a packaging structure. The packaging structure comprises a frame, a chip to be packaged and a plastic encapsulation layer, wherein the frame comprises a main body portion and at least one pin, and said chip is provided on a surface of the main body portion; the plastic encapsulation layer is provided on the surface of the frame provided with said chip; a first cavity is formed between the plastic encapsulation layer and the frame, and said chip is disposed in the first cavity; and the plastic encapsulation layer fills a gap between the main body portion and the pin. The present application prevents the plastic encapsulation layer from setting on fire and melting during a short-circuit test, thereby improving the safety of the packaging structure.

Description

A packaging structure

[0001] The present application claims priority to the Chinese patent application No. 202411099627.7, filed on August 12, 2024, with the Chinese Patent Office, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the packaging technical field, in particular to a packaging structure. BACKGROUND

[0003] The plastic packaging of semiconductor devices mainly includes double-sided flat no-pin packaging and square flat no-pin packaging. According to the material, the plastic packaging can be divided into plastic packaging, metal packaging and ceramic packaging. Compared with metal and ceramic packaging, the plastic packaging has small packaging size, low packaging cost and good process automation capability, and becomes the mainstream packaging form in the market.

[0004] Fig. 1 is a top view of a packaging structure, and Fig. 2 is a sectional view of a packaging structure. As shown in Figs. 1 and 2, a whole copper-based island 20 in the middle of the frame structure carries a chip 23. The part of the back of the copper-based island 20 not covered by the plastic sealing material 24 serves as a heat dissipation channel. The chip 23 is connected with the pin 101 through the copper wire 22, and the chip 23 and the copper wire 22 are packaged by the plastic sealing material 24. The plastic sealing material 24 is a combustible material. When the chip 23 is tested for short circuit, the chip 23 passes a large current instantaneously. The large current generated by the short circuit of the chip 23 will cause the plastic sealing material 24 in contact with the chip 23 to melt and expand rapidly, resulting in explosion and fire. SUMMARY

[0005] The present application provides a packaging structure to avoid the plastic sealing layer from catching fire and melting during short circuit test, and improve the safety of the packaging structure.

[0006] According to an aspect of the present application, the present application provides a packaging structure, comprising:

[0007] a frame, a chip to be packaged and a plastic sealing layer;

[0008] The frame comprises a main body part and at least one pin, and the chip to be packaged is arranged on the surface of the main body part.

[0009] The plastic sealing layer is arranged on the surface of the frame where the chip to be packaged is arranged. The plastic sealing layer and the frame have a first cavity therebetween, and the chip to be packaged is arranged in the first cavity. The plastic sealing layer is filled in the gap between the main body part and the pin.

[0010] Optionally, the at least one pin comprises a preset pin, the preset pin is provided with a connecting piece adjacent to a surface of the chip to be packaged, the connecting piece comprises an insulating thermal deformation part and a conductive part, the insulating thermal deformation part and the conductive part are fixedly connected, one end of the insulating thermal deformation part is fixedly connected with the preset pin;

[0011] The chip pin of the chip to be packaged is electrically connected with the conductive part through a connecting line; when the temperature is less than a preset temperature, part of the conductive part is in contact with the preset pin; when the temperature is greater than or equal to the preset temperature, the insulating thermal deformation part is heated and the volume is increased, so that the conductive part is separated from the preset pin.

[0012] Optionally, the insulating thermal deformation part and the conductive part are located on the same plane, and the conductive part is arranged on a side of the insulating thermal deformation part adjacent to the chip to be packaged;

[0013] Alternatively, the conductive part is located on a surface of the insulating thermal deformation part away from the preset pin, and the conductive part extends from the surface of the insulating thermal deformation part away from the preset pin to a surface of the preset pin.

[0014] Optionally, the insulating thermal deformation part is fixedly connected with the preset pin through a fixing bolt, wherein the fixing bolt extends through the insulating thermal deformation part and into the preset pin; or the surface of the preset pin adjacent to the insulating thermal deformation part has a first protrusion, and the first protrusion is inserted into the insulating thermal deformation part;

[0015] The conductive part and the insulating thermal deformation part are fixedly connected through a glue layer, or the conductive part and the insulating thermal deformation part are fixedly connected through a fixing bolt, or the surface of the conductive part adjacent to the insulating thermal deformation part has a second protrusion, and the second protrusion is inserted into the insulating thermal deformation part.

[0016] Optionally, the connecting piece is located in the first cavity; or the plastic sealing layer and the frame further have a second cavity, and the connecting piece is located in the second cavity.

[0017] Optionally, the plastic sealing layer comprises a side wall surrounding the chip to be packaged and the connecting piece, and a top cover arranged on a side of the chip to be packaged and the connecting piece away from the frame, the top cover and the side wall are integrally connected.

[0018] Optionally, the main body part and the chip to be packaged are electrically connected through a connecting line, and the pin and the chip to be packaged are electrically connected through a connecting line; at least part of the connecting line is located in the plastic sealing layer.

[0019] Optionally, the packaging structure further comprises:

[0020] A first shielding piece;

[0021] The first shielding piece is located in the first cavity, and the first shielding piece is arranged on the surface of the main body part; the first shielding piece is arranged on at least one side of the chip to be packaged, and the surface of the first shielding piece away from the chip to be packaged is in contact with the plastic sealing layer.

[0022] Optionally, the first shielding member comprises at least one baffle, the baffle is arranged on the surface of the main body, and each baffle is arranged on one side of the chip to be packaged.

[0023] Alternatively, the first shielding member comprises a shielding shell, the shielding shell comprises a first surface, a second surface and a third surface, two edges of the second surface are connected with the first surface and the third surface respectively, the second surface is arranged on the side of the chip to be packaged away from the frame, and the first surface and the third surface are vertically arranged on the surface of the frame.

[0024] Optionally, the packaging structure further comprises:

[0025] a second shielding member;

[0026] The second shielding member is arranged in the second cavity and on the surface of the preset pin, the second shielding member is arranged on at least one side of the connecting member, and the surface of the second shielding member away from the connecting member is in contact with the plastic encapsulation layer.

[0027] In the embodiment of the application, the frame comprises a main body and at least one pin, the chip to be packaged is arranged on the surface of the main body, the plastic encapsulation layer is arranged on the surface of the frame where the chip to be packaged is arranged, and the plastic encapsulation layer fills the gap between the main body and the pin, the first cavity is formed between the plastic encapsulation layer and the frame, the chip to be packaged is arranged in the first cavity, so that the plastic encapsulation layer is not in contact with the chip to be packaged, when the chip to be packaged generates heat by passing a large current, the air in the first cavity expands and presses the plastic encapsulation layer, so that the plastic encapsulation layer is burst, thereby avoiding fire and melting of the plastic encapsulation layer during the short circuit test, and the safety of the packaging structure is improved.

[0028] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the application, nor is it used to limit the scope of the application. Other features of the application will become apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed in the embodiment description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0030] FIG. 1 is a top view of a packaging structure;

[0031] FIG. 2 is a cross-sectional view of a packaging structure;

[0032] FIG. 3 is a cross-sectional view of a packaging structure along one section according to an embodiment of the application;

[0033] FIG. 4 is a cross-sectional view of a packaging structure along another section according to an embodiment of the application;

[0034] Fig. 5 is a schematic diagram of another packaging structure provided by the embodiment of the present application along a section plane;

[0035] Fig. 6 is a schematic diagram of another packaging structure provided by the embodiment of the present application along another section plane;

[0036] Fig. 7 is a schematic diagram of another packaging structure provided by the embodiment of the present application;

[0037] Fig. 8 is a schematic diagram of a connecting member in a normal temperature state provided by the embodiment of the present application;

[0038] Fig. 9 is a schematic diagram of a connecting member in a high temperature state provided by the embodiment of the present application;

[0039] Fig. 10 is a schematic diagram of a connecting member provided by the embodiment of the present application;

[0040] Fig. 11 is a schematic diagram of the connection between an insulating thermal deformation part and a conductive part provided by the embodiment of the present application;

[0041] Fig. 12 is a schematic diagram of the connection between another insulating thermal deformation part and a conductive part provided by the embodiment of the present application;

[0042] Fig. 13 is a schematic diagram of another packaging structure provided by the embodiment of the present application;

[0043] Fig. 14 is a schematic diagram of another packaging structure provided by the embodiment of the present application;

[0044] Fig. 15 is a schematic diagram after etching of a frame;

[0045] Fig. 16 is a schematic diagram after plastic packaging of a frame;

[0046] Fig. 17 is a schematic diagram of pasting a chip to be packaged and a soldering connecting line on a frame;

[0047] Fig. 18 is a schematic diagram of pasting a plastic packaging top cover;

[0048] Fig. 19 is a schematic diagram after pasting a first shielding member. DETAILED DESCRIPTION

[0049] In order to make the person skilled in the art better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application.

[0050] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; for example, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It must be noted that as used herein:

[0051] The embodiment of the present application provides a packaging structure, Figure 3 is a cross-sectional view of a packaging structure provided by the embodiment of the present application along a cross section, Figure 4 is a cross-sectional view of a packaging structure provided by the embodiment of the present application along another cross section, Figure 5 is a cross-sectional view of another packaging structure provided by the embodiment of the present application along a cross section, and Figure 6 is a cross-sectional view of another packaging structure provided by the embodiment of the present application along another cross section. Referring to Figures 3-6, the packaging structure comprises a frame 1, a chip to be packaged 2 and a plastic sealing layer 3; wherein the frame 1 comprises a main body part 10 and at least one pin 101, the chip to be packaged 2 is arranged on the surface of the main body part 10; the plastic sealing layer 3 is arranged on the surface of the frame 1 where the chip to be packaged 2 is arranged, the plastic sealing layer 3 and the frame 1 have a first cavity 4 therebetween, and the chip to be packaged 2 is arranged in the first cavity 4; and the plastic sealing layer 3 is filled in the gap between the main body part 10 and the pin 101.

[0052] Wherein, Figure 3 and Figure 4 are cross-sectional views of the same packaging structure along different cross sections respectively. Figure 5 and Figure 6 are cross-sectional views of the same packaging structure along different cross sections respectively. The main body part 10 and the pin 101 are connected with the chip to be packaged 2 through a connecting line 6, part of the connecting line 6 is embedded in the plastic sealing layer 3, or the whole connecting line 6 is located in the first cavity 4. The first cavity 4 can be formed by arranging a first shielding part 7 on the surface of the frame 1, specifically, the first shielding part 7 can be arranged before the plastic sealing layer 3 is arranged, and the first cavity 4 is formed under the shielding effect of the first shielding part 7 when the plastic sealing layer 3 is formed. In addition, the plastic sealing layer 3 can also be formed in several times, for example, the side wall of the plastic sealing layer 3 is formed first, then the top cover is covered on the side wall, and the plastic sealing layer 3 is formed after the side wall and the top cover are connected.

[0053] The main body 10 can serve as one pin 101 of the chip 2 to be packaged, and the chip 2 to be packaged is electrically connected to external devices through the at least one pin 101 and the main body 10. The main body 10 can also support and dissipate heat for the chip 2 to be packaged. The plastic sealing layer 3 is used to protect the chip 2 to be packaged, and filling the plastic sealing layer 3 in the gap between the main body 10 and the pin 101 can serve as plastic sealing and insulation, preventing the main body 10 from being electrically connected to the pin 101.

[0054] The first cavity 4 contains the chip 2 to be packaged, so that the chip 2 to be packaged is not in contact with the plastic sealing layer 3. The first cavity 4 has air therein. When the chip 2 to be packaged generates heat by passing a large current, the air in the first cavity 4 expands and presses the plastic sealing layer 3, so that the plastic sealing layer 3 bursts, thereby avoiding fire of the plastic sealing layer 3. In addition, other thermal expansion gases can also be filled in the first cavity 4.

[0055] In the embodiment of the present application, the frame 1 includes the main body 10 and the at least one pin 101. The chip 2 to be packaged is located on the surface of the main body 10. The plastic sealing layer 3 is arranged on the surface of the frame 1 where the chip 2 to be packaged is arranged, and is filled in the gap between the main body 10 and the pin 101. The plastic sealing layer 3 has the first cavity 4 with the frame 1. The chip 2 to be packaged is arranged in the first cavity 4, so that the plastic sealing layer 3 is not in contact with the chip 2 to be packaged. When the chip 2 to be packaged generates heat by passing a large current, the air in the first cavity 4 expands and presses the plastic sealing layer 3, so that the plastic sealing layer 3 bursts, thereby avoiding fire and melting of the plastic sealing layer 3 during short circuit test, and improving the safety of the packaging structure.

[0056] Fig. 7 is a cross-sectional view of another packaging structure provided by the embodiment of the present application. Fig. 8 is a structure schematic view of a connecting piece in a normal temperature state. Fig. 9 is a structure schematic view of the connecting piece in a high temperature state. Referring to Figs. 7-9, optionally, on the basis of the above embodiment, the at least one pin 101 includes a preset pin 11. The preset pin 11 is provided with a connecting piece 5 adjacent to the surface of the chip 2 to be packaged. The connecting piece 5 includes an insulating thermal deformation part 50 and a conductive part 51. The insulating thermal deformation part 50 and the conductive part 51 are fixedly connected. One end of the insulating thermal deformation part 50 is fixedly connected with the preset pin 11. The pin of the chip 2 to be packaged is electrically connected with the conductive part 51 through a connecting line 6. When the temperature is less than a preset temperature, part of the conductive part 51 is in contact with the preset pin 11. When the temperature is greater than or equal to the preset temperature, the insulating thermal deformation part 50 is heated and expands in volume, so that the conductive part 51 is separated from the preset pin 11.

[0057] The preset pin 11 can be a pin connected with a source electrode, a drain electrode or a gate electrode of the chip to be packaged 2, and can be a pin connected with the gate electrode of the chip to be packaged 2. The insulating thermal deformation part 50 can be made of a heat-sensitive non-conductive material. The insulating thermal deformation part 50 increases in size with the increase of temperature. When the temperature is less than a preset temperature, the insulating thermal deformation part 50 has a small size, and part of the conductive part 51 is in contact with the preset pin 11. The chip to be packaged 2 works, and the heat generated by the chip to be packaged 2 increases with the increase of temperature. When the temperature is greater than the preset temperature, the insulating thermal deformation part 50 increases in size to a certain extent, and drives the conductive part 51 to move, so that the conductive part 51 is separated from the preset pin 11, and the chip to be packaged 2 stops working and no longer generates heat.

[0058] In the embodiment of the present application, the insulating thermal deformation part 50 is arranged to separate the conductive part 51 from the preset pin 11 at high temperature, so that the chip to be packaged 2 stops working and generating heat, and further avoids the plastic sealing layer 3 from catching fire and melting, and further improves the safety of the packaging structure.

[0059] FIG. 10 is a structural schematic view of a connecting piece provided in an embodiment of the present application; as shown in FIGS. 7-10, optionally, on the basis of the above embodiment, the insulating thermal deformation part 50 and the conductive part 51 are located on the same plane. The conductive part 51 is arranged on the side of the insulating thermal deformation part 50 adjacent to the chip to be packaged 2 (FIGS. 7-9); or the conductive part 51 is located on the surface of the insulating thermal deformation part 50 away from the preset pin 11, and the conductive part 51 extends from the surface of the insulating thermal deformation part 50 away from the preset pin 11 to the surface of the preset pin 11 (FIG. 10).

[0060] Specifically, FIGS. 7-9 show that the insulating thermal deformation part 50 and the conductive part 51 are located on the same plane, and the insulating thermal deformation part 50 and the conductive part 51 are arranged side by side on the surface of the preset pin 11. At high temperature, the size of the insulating thermal deformation part 50 in the direction parallel to the surface of the preset pin 11 increases, and pushes the conductive part 51 to move, so that the conductive part 51 is separated from the preset pin 11.

[0061] FIG. 10 shows that the conductive part 51 is located on the surface of the insulating thermal deformation part 50 away from the preset pin 11. At high temperature, the size of the insulating thermal deformation part 50 in the direction perpendicular to the surface of the preset pin 11 increases, so that the height of the conductive part 51 increases, and the conductive part 51 is separated from the preset pin 11.

[0062] In the embodiment of the present application, the insulating thermal deformation part 50 and the conductive part 51 are located on the same plane, or the conductive part 51 is located on the surface of the insulating thermal deformation part 50 away from the preset pin 11, so that the conductive part 51 is separated from the preset pin 11 at high temperature, and the subsequent heat generated by the chip to be packaged 2 is avoided to cause the plastic sealing layer 3 to catch fire and melt.

[0063] Fig. 11 is a schematic view of another connection between the insulating thermal deformation part and the conductive part according to an embodiment of the present application; Fig. 12 is a schematic view of another connection between the insulating thermal deformation part and the conductive part according to an embodiment of the present application; referring to Figs. 9-12, optionally, on the basis of the above embodiment, the insulating thermal deformation part 50 is fixedly connected with the preset pin 11 through the fixing bolt 52, wherein the fixing bolt 52 extends through the insulating thermal deformation part 50 and into the preset pin 11 (Figs. 9-10); or the preset pin 11 has the first protrusion 53 adjacent to the surface of the insulating thermal deformation part 50, and the first protrusion 53 is inserted into the insulating thermal deformation part 50 (Fig. 11).

[0064] The conductive part 51 and the insulating thermal deformation part 50 are fixedly connected through the adhesive layer 55 (Fig. 11), or the conductive part 51 and the insulating thermal deformation part 50 are fixedly connected through the fixing bolt 52 (Fig. 10), or the conductive part 51 has the second protrusion 54 adjacent to the surface of the insulating thermal deformation part 50, and the second protrusion 54 is inserted into the insulating thermal deformation part 50 (Fig. 12).

[0065] In this way, the insulating thermal deformation part 50 is stably connected with the preset pin 11 and the insulating thermal deformation part 50 is stably connected with the conductive part 51, so that the insulating thermal deformation part 50 and the conductive part 51 are prevented from falling off.

[0066] Fig. 13 is a schematic view of another packaging structure according to an embodiment of the present application; Fig. 14 is a schematic view of another packaging structure according to an embodiment of the present application; referring to Figs. 7 and 13-14, optionally, on the basis of the above embodiment, the connecting member 5 is located in the first cavity 4 (Fig. 7); or the plastic sealing layer 3 and the frame 1 further have the second cavity 8, and the connecting member 5 is located in the second cavity 8 (Figs. 13 and 14).

[0067] In the embodiments of the present application, the connecting member 5 is arranged in the first cavity 4 or the second cavity 8, so that there is a gap between the connecting member 5 and the plastic sealing layer 3, so that the insulating thermal deformation part 50 has a deformation space and the conductive part 51 has a moving space at high temperature, so that the conductive part 51 and the preset pin 11 can be separated at high temperature, and the plastic sealing layer 3 is prevented from catching fire and melting due to the continued heat generation of the chip 2 to be packaged.

[0068] Referring to Fig. 7, optionally, on the basis of the above embodiment, the plastic sealing layer 3 includes the side wall 30 surrounding the chip 2 to be packaged and the connecting member 5, and the top cover 31 arranged on the side away from the frame 1 of the chip 2 to be packaged and the connecting member 5, and the top cover 31 and the side wall 30 are integrally connected.

[0069] The plastic sealing layer 3 further comprises a part between the pin 101 and the main body 10. After the side wall 30 is integrally connected with the top cover 31, the space between the top cover 31, the side wall 30 and the frame 1 is the first cavity 4. In the process of manufacturing the packaging structure, the chip 2 to be packaged and the connecting piece 5 can be arranged on the frame 1, the side wall 30 and the plastic sealing layer between the pin 101 and the main body 10 are formed, and then the top cover 31 is arranged to form the entire plastic sealing layer 3.

[0070] The chip 2 to be packaged and the connecting piece 5 are arranged in the first cavity 4, the space of the first cavity 4 is larger, the plastic sealing layer 3 is farther away from the chip 2 to be packaged, the plastic sealing layer 3 is less likely to catch fire and melt, the connecting piece 5 and the chip 2 to be packaged are in the same cavity and have the same temperature, the connecting piece 5 can quickly disconnect the connection between the chip 2 to be packaged and the preset pin 11 when the temperature rises, the chip 2 to be packaged stops working faster, and the chip 2 to be packaged continues to generate heat to cause the plastic sealing layer 3 to catch fire and melt.

[0071] Referring to FIGS. 3 and 5, optionally, on the basis of the above embodiment, the main body 10 and the chip 2 to be packaged are electrically connected through the connecting line 6, and the preset pin 11 and the chip 2 to be packaged are electrically connected through the connecting line 6; at least part of the connecting line 6 is located in the plastic sealing layer 3.

[0072] Specifically, as shown in FIGS. 3 and 5, when the chip 2 to be packaged generates too much heat in the first cavity 4, the air in the first cavity 4 expands, causing the plastic sealing layer 3 to burst, at this time, part of the connecting line 6 in the plastic sealing layer 3 is disconnected, the connection between the chip 2 to be packaged and the preset pin 11 is blocked, the chip 2 to be packaged stops working, and the chip 2 to be packaged continues to generate heat to cause the plastic sealing layer 3 to catch fire and melt. As shown in FIGS. 13 and 14, when at least part of the connecting line 6 is located in the plastic sealing layer 3 and the connecting piece 5 is arranged at the preset pin 11, the plastic sealing layer 3 is double-protected, and the safety of the packaging structure is further improved.

[0073] Referring to FIGS. 4-6, optionally, on the basis of the above embodiment, the packaging structure further comprises a first shielding piece 7; the first shielding piece 7 is located in the first cavity 4, and the first shielding piece 7 is arranged on the surface of the main body 10; the first shielding piece 7 is arranged on at least one side of the chip 2 to be packaged, and the surface of the first shielding piece 7 away from the chip 2 to be packaged is in contact with the plastic sealing layer 3.

[0074] Specifically, the first shielding piece 7 is used to block the plastic sealing material during the formation of the plastic sealing layer 3, so that one side of the first shielding piece 7 forms the first cavity 4. The plastic sealing layer 3 is formed in the form of the first shielding piece 7, which simplifies the manufacturing process of the packaging structure.

[0075] Optionally, based on the above-mentioned embodiments, referring to FIG. 4, the first shielding member 7 comprises at least one baffle, the baffle is arranged on the surface of the main body 10, and each baffle is arranged on one side of the chip 2 to be packaged; or, referring to FIG. 5 and FIG. 6, the first shielding member 7 comprises a shielding shell, the shielding shell comprises a first surface 71, a second surface 72 and a third surface 73, two edges of the second surface 72 are connected with the first surface 71 and the third surface 73 respectively, the second surface 72 is arranged on the side of the chip 2 to be packaged away from the frame 1, and the first surface 71 and the third surface 73 are vertically arranged on the surface of the frame 1.

[0076] The baffle and the shielding shell are used for blocking the plastic sealing material, and the first cavity is formed under the shielding effect of the baffle and the shielding shell. By arranging the baffle and the shielding shell, the forming process of the first cavity is simplified.

[0077] Optionally, based on the above-mentioned embodiments, referring to FIG. 13 and FIG. 14, the packaging structure further comprises: a second shielding member 9; the second shielding member 9 is located in the second cavity 8, and the second shielding member is arranged on the surface of the preset pin 11; the second shielding member 9 is arranged on at least one side of the connecting member 5, and the surface of the second shielding member 9 away from the connecting member 5 is in contact with the plastic sealing layer 3.

[0078] The second shielding member 9 is used for forming the second cavity 8. The second shielding member 9 can be a baffle or a shielding shell. By arranging the second shielding member 9, the second cavity 8 can be formed in the same process as the first cavity 4, thereby simplifying the process.

[0079] FIG. 15-FIG. 18 show the forming process of the packaging structure shown in FIG. 7, FIG. 15 is a schematic view after etching the frame, FIG. 16 is a schematic view after plastic sealing the frame, FIG. 17 is a schematic view of pasting the chip to be packaged and welding the connecting wire on the frame, and FIG. 18 is a schematic view of pasting the plastic sealing top cover, referring to FIG. 15, the frame 1 is provided, and the main body 10 and the pin 101 are formed on the frame 1 by using the etching process. Referring to FIG. 16, the plastic sealing layer 3 is plastic sealed on the frame 1 to form the side wall 30, and the connecting member is fixed on the pin 101. Referring to FIG. 17, the chip 2 to be packaged is pasted on the main body 10, and the connecting wire is welded to connect the chip 2 to be packaged and the pin 101. Referring to FIG. 18, the plastic sealing top cover 31 is pasted, then the surface of the pin 101 away from the connecting member is electroplated with tin, and is cut into a single one to form the packaging structure shown in FIG. 7.

[0080] Fig. 19 is a schematic view after attaching the first shielding member; Figs. 15 and 19 show the forming process of the package structure shown in Figs. 3 and 4, referring to Fig. 15, a frame 1 is provided, and a main body 10 and a preset pin 11 are formed on the frame 1 by using an etching process. Referring to Fig. 19, a chip to be packaged 2 is attached on the main body 10, and a first shielding member 7 is attached on one side of the chip to be packaged 2, and a connecting wire is welded to connect the chip to be packaged 2 and the preset pin 11. Referring to Figs. 3 and 4, a plastic layer 3 is molded on the frame 1, and due to the effect of the shielding member, the plastic flow is affected to form a first cavity, then the surface of the preset pin 11 away from the chip to be packaged 2 is electroplated with tin, and cut into single pieces to form the package structure shown in Figs. 3 and 4.

[0081] The forming process of the package structure shown in Figs. 5 and 6 is similar to that of the structure shown in Figs. 3 and 4, and will not be described here again.

[0082] It should be understood that the above-mentioned various forms of flow can be reordered, added or deleted steps. For example, each step described in the present application can be executed in parallel, sequentially or in different order, as long as the desired results of the technical solution of the present application can be achieved, and the present application is not limited herein.

[0083] The above detailed description does not constitute a limitation on the scope of protection of the present application. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A packaging structure, comprising: a frame, a chip to be packaged, and a plastic packaging layer; wherein the frame comprises a main body and at least one pin, and the chip to be packaged is arranged on a surface of the main body; the plastic packaging layer is arranged on a surface of the frame where the chip to be packaged is arranged, and a first cavity is formed between the plastic packaging layer and the frame, the chip to be packaged is arranged in the first cavity, and the plastic packaging layer fills a gap between the main body and the pin. 2.The packaging structure of claim 1, wherein: the at least one pin comprises a preset pin, a connecting piece is arranged on a surface of the preset pin adjacent to the chip to be packaged, the connecting piece comprises an insulating thermal deformation part and a conductive part, the insulating thermal deformation part and the conductive part are fixedly connected, and one end of the insulating thermal deformation part is fixedly connected with the preset pin; a chip pin of the chip to be packaged is electrically connected with the conductive part through a connecting line; when the temperature is less than a preset temperature, a part of the conductive part is in contact with the preset pin; when the temperature is greater than or equal to the preset temperature, the insulating thermal deformation part is heated and expands in volume, so that the conductive part is separated from the preset pin. 3.The packaging structure of claim 2, wherein: the insulating thermal deformation part and the conductive part are located on the same plane, and the conductive part is arranged on a side of the insulating thermal deformation part adjacent to the chip to be packaged; alternatively, the conductive part is located on a surface of the insulating thermal deformation part away from the preset pin, and the conductive part extends from the surface of the insulating thermal deformation part away from the preset pin to a surface of the preset pin. 4.The packaging structure of claim 2, wherein: the insulating thermal deformation part is fixedly connected with the preset pin through a fixing peg, wherein the fixing peg extends through the insulating thermal deformation part and into the preset pin; or a first protrusion is arranged on a surface of the preset pin adjacent to the insulating thermal deformation part, and the first protrusion is inserted into the insulating thermal deformation part; the conductive part and the insulating thermal deformation part are fixedly connected through a glue layer, or the conductive part and the insulating thermal deformation part are fixedly connected through a fixing peg, or a second protrusion is arranged on a surface of the conductive part adjacent to the insulating thermal deformation part, and the second protrusion is inserted into the insulating thermal deformation part. 5.The packaging structure of claim 2, wherein: the connecting piece is located in the first cavity; or the packaging structure further comprises a second cavity between the plastic packaging layer and the frame, and the connecting piece is located in the second cavity. 6.The packaging structure of claim 2, wherein: the plastic packaging layer comprises a side wall surrounding the chip to be packaged and the connecting piece, and a top cover arranged on a side of the chip to be packaged and the connecting piece away from the frame, and the top cover and the side wall are integrally connected. 7.The packaging structure of claim 1 or 2, wherein: the main body and the chip to be packaged, and the pin and the chip to be packaged are electrically connected through connecting lines, and at least part of the connecting lines are located in the plastic packaging layer. 8.The packaging structure of claim 7, further comprising: The first shielding member is located in the first cavity, and the first shielding member is arranged on the surface of the main body part; The first shielding member is arranged on at least one side of the chip to be packaged, and a surface of the first shielding member away from the chip to be packaged is in contact with the plastic package layer.

9. The packaging structure according to claim 8, wherein: The first shielding member comprises at least one baffle plate arranged on the surface of the main body part, and each baffle plate is arranged on one side of the chip to be packaged. Alternatively, the first shielding member comprises a shielding housing, the shielding housing comprises a first surface, a second surface and a third surface, two edges of the second surface are connected with the first surface and the third surface respectively, the second surface is arranged on a side of the chip to be packaged away from the frame, and the first surface and the third surface are vertically arranged on the surface of the frame.

10. The packaging structure according to claim 5, further comprising: The second shielding member is located in the second cavity, and the second shielding member is arranged on the surface of the preset pin; The second shielding member is arranged on at least one side of the connecting member, and a surface of the second shielding member away from the connecting member is in contact with the plastic package layer. ​ ​

Images