Communication module and communication module assembly

Abstract

Provided are a communication module and a communication module assembly that make it possible to sufficiently cover a heat-generating component with a heat dissipation resin and efficiently cool the heat-generating component. This communication module comprises: a substrate; an IC, which is a heat-generating component, disposed on the substrate; a cover that covers the substrate together with the IC; and a heat dissipation resin that is disposed on the IC. The cover has an upper wall that covers the substrate from above. The upper wall has a first portion in a region that faces the IC, and a second portion that is lowered by one step toward the IC side in the region that faces the IC. The upper wall comprises a first through-hole and a second through-hole that penetrate the upper wall. The first through-hole is provided in the second portion, and the second through-hole is provided in the first portion or the second portion. The heat dissipation resin is visible through the first through-hole and the second through-hole in a top view, and does not block at least a portion of the second through-hole.

Description

Communication module and communication module assembly

[0001] The present disclosure relates to communication modules and communication module assemblies.

[0002] Japanese Patent Application Laid-Open No. 2003-122222 discloses a cooling structure for an electronic device.

[0003] Japanese Patent Application Publication No. 5-47968

[0004] Patent Document 1 discloses an electronic device in which a ceramic substrate is housed in a metal case with a metal cover. The metal cover has a recess in a position facing a high-heat-generating component on the ceramic substrate, and a hole is drilled in the bottom plate of the recess. The high-heat-generating component is covered with a high-thermal-conductivity resin that fills the recess and flows out through the hole. As a result, heat generated by the high-heat-generating component is efficiently dissipated from the metal cover via the high-thermal-conductivity resin, thereby cooling the electronic device.

[0005] This type of highly thermally conductive resin (heat dissipating resin) hardens after reaching the high-heat-generating components through the holes. Therefore, the holes are blocked by the resin, and it is impossible to see from the surface of the metal cover whether the resin is adequately covering the high-heat-generating components. If the resin does not adequately cover the high-heat-generating components, sufficient cooling effect cannot be expected.

[0006] The present disclosure aims to provide a communication module and a communication module assembly in which heat-dissipating resin can sufficiently cover heat-generating components, thereby efficiently cooling the heat-generating components.

[0007] The present disclosure provides a communication module comprising: a substrate; an IC that is a heat-generating component arranged on the substrate; and a cover that covers the substrate and the IC, wherein the cover has an upper wall that covers the substrate from above, and the upper wall has a first portion in an area that does not face the IC and a second portion that is one step lower toward the IC in an area that faces the IC, and the upper wall is provided with a first through hole and a second through hole that penetrate the upper wall, the first through hole being provided in the second portion, and the second through hole being provided in either the first portion or the second portion; and a heat dissipation resin that is arranged on the IC, is visible from the first through hole and the second through hole in a top view, and does not block at least a portion of the second through hole.

[0008] According to the communication module of the present disclosure, the heat dissipating resin is filled through the first through hole and placed on the IC. Therefore, most of the first through hole is blocked with the heat dissipating resin. Meanwhile, the heat dissipating resin is not filled through the second through hole. Therefore, at least a portion of the second through hole is not blocked with the heat dissipating resin. As a result, during manufacturing of the communication module, the second through hole can function as an observation hole for checking whether the heat dissipating resin has spread to the desired area, i.e., whether it sufficiently covers the IC. Therefore, the second through hole makes it easy to sufficiently cover the heat-generating component with the heat dissipating resin, allowing the heat-generating component to be cooled efficiently.

[0009] Fig. 1 is a schematic plan view of a communication module assembly according to a first embodiment; Fig. 2 is a cross-sectional view of the communication module assembly taken along section II-II in Fig. 1; Fig. 3 is a schematic plan view of a portion of a communication module according to a second embodiment; Fig. 4 is a cross-sectional view of a communication module according to a third embodiment, similar to Fig. 2;

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0011] [First Embodiment] Fig. 1 shows a schematic plan view of a communication module assembly 100 according to a first embodiment. A communication module is a small communication terminal that is incorporated into a product device to acquire location information, operating status, and the like of the product device. A communication module assembly is an assembly that includes a communication module and peripheral components of the communication module. It should be noted that some of the components of the communication module 1 shown in Fig. 1 are omitted.

[0012] Fig. 2 shows a cross-sectional view of the communication module assembly 100 taken along a cross-sectional line II-II extending in the longitudinal direction of the communication module assembly 100 shown in Fig. 1 and passing through the center of an IC 3 (described later). The structures of the communication module 1 and the communication module assembly 100 according to the first embodiment will be described below with reference to Figs. 1 and 2.

[0013] The communication module 1 has a printed circuit board 2 (hereinafter referred to as the board 2), an IC 3 and other electronic components 4 (e.g., a filter, FEM, etc.) arranged on the board 2, and a cover 5 that covers the board 2, the IC 3, and the electronic components 4. The communication module assembly 100 has the communication module 1 and a heat sink 7 arranged on the cover 5 of the communication module 1. The communication module assembly 100 may include components other than the heat sink 7.

[0014] A large number of electric circuits (not shown) are mounted on the substrate 2. The IC 3 is electrically connected to the electronic component 4 and other electronic components (not shown) via the electric circuits. The IC 3 is an integrated circuit. Because the IC 3 is composed of a large number of electric circuits, elements, etc., it is a heat-generating component that is more likely to generate heat than other electronic components when current flows through the electric circuits. The shape of the IC 3 is approximately rectangular when viewed from above.

[0015] 1 corresponds to the left-right direction of the communication module 1, the up-down direction corresponds to the front-rear direction of the communication module 1, and the up-down direction in FIG. 2 corresponds to the up-down direction of the communication module 1. Therefore, the long side direction of the IC 3 corresponds to the left-right direction, and the short side direction of the IC 3 corresponds to the front-rear direction. Furthermore, the side of the board 2 on which the IC 3 and electronic components 4 are arranged corresponds to the upper side.

[0016] The cover 5 is a metal plate for shielding against electromagnetic noise. The cover 5 is disposed along the periphery of the substrate 2. The cover 5 has a peripheral wall 51 that rises from the periphery of the substrate 2, and a flat upper wall 50 that is connected to the upper edge of the peripheral wall 51 and covers the substrate 2 from above. The cover 5 is also preferably made of metal in order to efficiently transfer heat generated by the IC 3 to the heat sink 7.

[0017] The upper wall 50 has a first portion 50a that is an area that does not face the IC 3, and a second portion 50b that is an area that faces the IC 3. The first portion 50a and the second portion 50b are flat wall surfaces that are parallel to the substrate 2 and the IC 3. The second portion 50b is one step lower than the first portion 50a toward the IC 3, i.e., downward. In other words, the height H1 of the second portion 50b relative to the substrate 2 is lower than the height H2 of the first portion 50a relative to the substrate 2. The shape of the second portion 50b is generally rectangular with long sides in the left-right direction and short sides in the front-to-back direction when viewed from above.

[0018] The cover 5 further has side walls 52 connecting the first portion 50a and the second portion 50b. In the first embodiment, the side walls 52 extend upward from the periphery of the second portion 50b and are connected to the first portion 50a. That is, four side walls 52 are provided. In other words, a recess is provided near the center of the top wall 50, defined by the four side walls 52 and the second portion 50b, and recessed toward the IC 3. The side walls 52 are inclined in a direction away from the second portion 50b in a top view (see FIG. 2).

[0019] As shown in FIG. 2 , the second portion 50b is formed by drawing the cover 5. The height H3 from the top surface of the IC 3 to the bottom surface of the second portion 50b is smaller than the height H4 from the top surface of the second portion 50b to the top surface of the first portion 50a. The second portion 50b may also be formed by cutting three of the four sides of the portion of the top wall 50 corresponding to the second portion 50b to form a so-called rectangular tongue, bending the tongue downward, and then bending it horizontally. In this case, the side wall 52 is provided on only one side of the second portion 50b, and not on the other three sides of the second portion 50b.

[0020] The second portion 50b is provided with a first through hole 5a and a second through hole 5b that penetrate the second portion 50b in the vertical direction. The first through hole 5a is provided at the center of the second portion 50b in top view, i.e., at the center of the IC 3. The shape of the first through hole 5a is a square with sides of approximately 2 mm.

[0021] At least two second through holes 5b are provided, and in the first embodiment, four are provided. In FIG. 1 , the four second through holes 5b are arranged around the first through hole 5a at 90° angular intervals around a rotation axis that passes through the center position C of the first through hole 5a and is perpendicular to the second portion 50b, surrounding the first through hole 5a. In other words, the four second through holes 5b are arranged on the front, right, rear, and left sides of the first through hole 5a, respectively. The second through holes 5b are shaped like squares with sides of approximately 1 mm. That is, the opening area of ​​the first through hole 5a is larger than the opening area of ​​the second through hole 5b. As will be described in detail below, the second through holes 5b are holes for confirming that the heat dissipation resin 6 described below adequately covers the IC 3. To fully fulfill this function, the second through holes 5b are preferably arranged within an area surrounded by an imaginary periphery that passes through a position that is approximately 70% of the length from the center of the IC 3 to the periphery of the IC 3 when viewed from above. In another embodiment, the second through-hole 5b may be provided in the first portion 50a.

[0022] When two second through holes 5b are provided, the two second through holes 5b are preferably arranged (symmetrically) on both sides of the first through hole 5a (for example, in the vertical or horizontal direction). When three second through holes 5b are provided, the three second through holes 5b are preferably arranged at an angular pitch of 120° around the rotation axis so as to surround the first through hole 5a.

[0023] The first portion 50a is provided with third through holes 5c that penetrate the first portion 50a in the up-down direction. In the first embodiment, the number of third through holes 5c is four, similar to the number of second through holes 5b. The number of third through holes 5c may or may not be the same as the number of second through holes 5b. The shape of the third through holes 5c is the same as the shape of the second through holes 5b, i.e., a square with sides of approximately 1 mm.

[0024] The third through hole 5c is provided along the outside of the outer periphery of the second portion 50b. In another embodiment, the third through hole 5c may be provided along the inside of the outer periphery of the second portion 50b, i.e., in the second portion 50b. In a top view, the distance L2 between the third through hole 5c and the first through hole 5a (the distance between the centers of the holes) is greater than the distance L1 between the second through hole 5b and the first through hole 5a. In other words, the third through hole 5c is farther from the first through hole 5a than the second through hole 5b. In the first embodiment, the third through hole 5c is located on a straight line connecting the second through hole 5b and the first through hole 5a.

[0025] In this embodiment, the third through hole 5c does not overlap with the IC 3 in top view. The third through hole 5c is preferably arranged near the periphery of the IC 3 in top view. Specifically, the shortest distance L3 between the third through hole 5c and the periphery of the IC 3 in top view is preferably within a range of 0 mm to 1 mm. The third through hole 5c does not overlap with the electronic components 4 arranged around the IC 3 in top view. In other embodiments, the third through hole 5c may overlap with the IC 3 in top view. If the third through hole 5c overlaps with the IC 3, the third through hole 5c is preferably arranged in a region outside the above-mentioned virtual outer periphery in top view.

[0026] The heat sink 7 is disposed on the upper wall 50 of the cover 5 so that the lower surface of the heat sink 7 is in close contact with the upper surface of the upper wall 50. The heat sink 7 is a heat dissipation component that absorbs heat from the cover 5 and dissipates the heat to the outside.

[0027] The communication module 1 further includes a heat dissipation resin 6 that transfers heat generated by the IC 3 to the cover 5. The heat dissipation resin 6 is a so-called high thermal conductivity material (Thermal Interface Material (TIM)). Specific materials for the heat dissipation resin 6 include, for example, silicone resin (a silicon compound) and graphite. The heat dissipation resin 6 has fluidity before being filled, but once filled, i.e., once exposed to air, it hardens over time.

[0028] The heat dissipation resin 6 is filled in the first portion 50a and passes through the first through-hole 5a and is placed on the IC 3. The heat dissipation resin 6 also spreads in the planar direction (left-right and front-rear directions) from the center position of the IC 3 in the space (vertical direction) between the cover 5 and the IC 3. The heat dissipation resin 6 contacts the top surface of the IC 3 and the cover 5, but does not contact the board 2 or other electronic components 4.

[0029] In a top view, the heat dissipating resin 6 is visible through the first through hole 5a and the second through hole 5b, but not through the third through hole 5c. Here, "visible" refers not only to visual confirmation but also to recognition of an object by a machine with a visual recognition function, such as a measuring device or a robot. The heat dissipating resin 6 also blocks the first through hole 5a and protrudes upward from the first through hole 5a. The heat dissipating resin 6 further blocks the rear and right second through holes 5b, but does not block the left and front second through holes 5b (see FIG. 1). That is, the heat dissipating resin 6 does not block at least some of the second through holes 5b. The heat dissipating resin 6 does not have to block all of the second through holes 5b. On the other hand, the heat dissipating resin 6 is visible from all of the second through holes 5b. Furthermore, the heat dissipating resin 6 may be visible from only some of the second through holes 5b. For example, in a top view, the heat dissipation resin 6 in the second through hole 5 b on the left side is partially visible, while the heat dissipation resin 6 in the second through hole 5 b on the right side is visible throughout the entire second through hole 5 b. In addition, the heat dissipation resin 6 remains within the recess, i.e., does not protrude above the upper wall 50.

[0030] Next, a process of filling the heat dissipation resin 6 in the manufacturing of the communication module 1 and the communication module assembly 100 according to the first embodiment will be described.

[0031] Before the heat dissipation resin 6 is filled, the IC 3, electronic components 4, etc. are placed on the substrate 2, and the cover 5 covers the substrate 2. The heat sink 7 is not placed on the cover 5. In this state, the heat dissipation resin 6 passes through the first through-hole 5a and fills the space between the IC 3 and the second portion 50b.

[0032] When the heat dissipating resin 6 is filled, it spreads in the planar direction from the first through-holes 5a. While the heat dissipating resin 6 is being filled, it can be confirmed by checking the second through-holes 5b whether the heat dissipating resin 6 is sufficiently covering the IC 3. If the presence of the heat dissipating resin 6 is confirmed through the second through-holes 5b, it is deemed that the heat dissipating resin 6 is sufficiently filled. This completes the filling of the heat dissipating resin 6. On the other hand, if the presence of the heat dissipating resin 6 is not confirmed through any of the second through-holes 5b, it is deemed that the heat dissipating resin 6 is not sufficiently filled. Therefore, the filling of the heat dissipating resin 6 continues until the presence of the heat dissipating resin 6 is confirmed through the second through-holes 5b. Once the filling of the heat dissipating resin 6 is complete, the heat dissipating resin 6 begins to harden and adhere to the surfaces of the IC 3 and the second portion 50b. The heat dissipating resin 6 can also be filled to a degree that does not protrude above the upper wall 50, i.e., does not overflow from the recess.

[0033] If the heat dissipation resin 6 spreads too much due to overfilling or the like, and the presence of the heat dissipation resin 6 is confirmed through the third through-hole 5c, the heat dissipation resin 6 may spread between the IC 3 and the substrate 2, or onto the surfaces of other electronic components 4. In such a case, when the communication module 1 is activated, there is a risk that the IC 3 or the electronic components 4 may be deformed or damaged due to thermal contraction of the heat dissipation resin 6 caused by heat generated by the IC 3. Therefore, a communication module 1 in which the presence of the heat dissipation resin 6 is confirmed through the third through-hole 5c may be deemed defective. In other words, a defect in the communication module 1 can be detected through the third through-hole 5c.

[0034] After the filling of the heat dissipation resin 6 is completed, the heat sink 7 is placed on the upper wall 50. The placement of the heat sink 7 may be performed in a separate process.

[0035] During operation of the communication module 1 , heat generated by the IC 3 is dissipated through the heat dissipation resin 6 , the cover 5 and the heat sink 7 .

[0036] Therefore, in the communication module 1 according to the first embodiment, the first through hole 5 a is a hole for filling with the heat dissipation resin 6. Therefore, the opening area of ​​the first through hole 5 a is large enough to allow the heat dissipation resin 6 to be filled through the hole 5 a.

[0037] On the other hand, the second through hole 5b and the third through hole 5c are so-called inspection holes for confirming the presence of the heat dissipation resin 6. In particular, the second through hole 5b allows confirmation that the heat dissipation resin 6 adequately covers the IC 3, making it easy to manufacture a communication module 1 that is adequately filled with the heat dissipation resin 6. This allows for efficient cooling of heat-generating components. Furthermore, the third through hole 5c prevents overfilling of the heat dissipation resin 6, making it possible to detect defects due to such overfilling.

[0038] The inspection using the second through hole 5 b and the third through hole 5 c may be performed visually or mechanically. Note that, since the side wall 52 is inclined in a direction away from the second portion 50 b, the range of the field of view in which the presence of the heat dissipation resin 6 can be confirmed can be expanded, for example, by being visible from an oblique direction, compared to when the side wall 52 is upright perpendicular to the second portion 50 b.

[0039] When the second through holes 5b are arranged on both sides of the first through hole 5a, it is possible to confirm the spread of the heat dissipation resin 6 in at least two directions (e.g., left and right) when viewed from above. When the second through holes 5b are arranged surrounding the first through hole 5a at a rotational pitch of 90° around the rotation axis, it is possible to confirm the spread of the heat dissipation resin 6 in further directions (e.g., left and right and front and rear directions).

[0040] The height of the IC 3 may be lower than that of other electronic components. In order to reduce the amount of heat dissipation resin 6 to be filled without forming the second portion 50b, it is possible to bring the top wall 50 closer to the IC 3, i.e., to reduce the height of the top wall 50, but this may result in interference with other electronic components. By lowering the area of ​​the top wall 50 facing the IC 3 by one step (i.e., by forming the second portion 50b), it is possible to reduce the amount of heat dissipation resin 6 to be filled and prevent interference between the top wall 50 and other electronic components.

[0041] Providing the first through-holes 5a in the second portion 50b reduces the possibility that the filled heat dissipation resin 6 will protrude above the upper wall 50. This allows the heat sink 7 to be in close contact with the upper wall 50, allowing the heat sink 7 to dissipate heat efficiently.

[0042] Furthermore, by providing the second through hole 5b in the second portion 50b, the distance between the second through hole 5b and the IC 3 becomes small, making it easier to check the heat dissipation resin 6 through the second through hole 5b.

[0043] Furthermore, since the height H3 is smaller than the height H4, the space between the IC 3 and the second portion 50b can be filled with a smaller amount of heat dissipation resin 6, and the possibility of the heat dissipation resin 6 overflowing from the second portion 50b can be reduced.

[0044] The communication module 1 and the communication module assembly 100 according to the first embodiment have the following advantages.

[0045] (1) A communication module 1 includes: a substrate 2; an IC 3 which is a heat-generating component arranged on the substrate 2; and a cover which covers the substrate 2 and the IC 3, the cover 5 having an upper wall 50 which covers the substrate 2 from above, the upper wall 50 having a first portion 50a in an area not facing the IC 3 and a second portion 50b which is one step lower towards the IC 3 in an area facing the IC 3, the upper wall 50 having a first through hole 5a and a second through hole 5b which penetrate the upper wall 50, the first through hole 5a being arranged in the second portion 50b, and the second through hole 5b being arranged in either the first portion 50a or the second portion 50b; and a heat dissipation resin 6 which is arranged on the IC 3, is visible from the first through hole 5a and the second through hole 5b in a top view, and does not block at least a portion of the second through hole 5b.

[0046] As a result, during manufacturing of the communication module 1, the second through-hole 5b can function as an observation hole for checking whether the heat dissipation resin 6 sufficiently covers the IC 3. Therefore, the second through-hole 5b makes it easy to cover as wide an area of ​​the IC 3 as possible with the heat dissipation resin 6, and the IC 3 can be cooled efficiently.

[0047] (2) The opening area of ​​the first through hole 5a is larger than the opening area of ​​the second through hole 5b.

[0048] As a result, the heat dissipation resin 6 is easily filled through the first through holes 5a.

[0049] (3) The second through holes 5b are provided in plurality and are arranged on both sides of the first through hole 5a.

[0050] As a result, it is possible to confirm that the heat dissipation resin 6 spreads in at least two directions when viewed from above.

[0051] (4) At least three second through holes 5b are provided, and are arranged to surround the first through hole 5a.

[0052] As a result, it can be seen that the heat dissipation resin 6 spreads in further directions.

[0053] (5) Four second through holes 5b are provided, and the four second through holes 5b are arranged surrounding the first through hole 5a at a rotational pitch of 90° around a rotation axis that passes through the center position C of the first through hole 5a and is perpendicular to the second part 50b.

[0054] As a result, it can be seen that the heat dissipation resin 6 spreads in further directions.

[0055] (6) A third through hole 5c is provided in the upper wall 50, and the distance between the third through hole 5c and the first through hole 5a is greater than the distance between the second through hole 5b and the first through hole 5a, so that the heat dissipation resin 6 cannot be seen from the third through hole 5c when viewed from above.

[0056] As a result, the third through-hole 5c makes it possible to check whether the heat dissipation resin 6 has spread to an undesired area, and to detect a defect in the communication module 1.

[0057] (7) The third through hole 5c does not overlap the IC 3 in top view.

[0058] As a result, defects in the communication module 1 can be detected with higher accuracy.

[0059] (8) The third through hole 5c overlaps with the IC 3 in a top view.

[0060] As a result, defects in the communication module 1 can be detected with higher accuracy.

[0061] (9) The cover 5 has the side wall 52 that connects the first portion 50a and the second portion 50b, and the side wall 52 is inclined in a direction away from the second portion 50b in a top view.

[0062] As a result, the range of the field of view in which the presence of the heat dissipating resin 6 can be confirmed can be expanded.

[0063] (10) The communication module assembly 100 includes a communication module 1 in which the heat dissipation resin 6 does not protrude above the upper wall 50 , and a heat sink 7 disposed on the first portion 50 a of the communication module 1 .

[0064] As a result, the heat sink 7 can be brought into close contact with the upper wall 50, so that the heat sink 7 can efficiently dissipate heat.

[0065] Second Embodiment Next, a communication module 1a according to a second embodiment will be described with reference to Fig. 3. Only the configuration that differs from the first embodiment will be described below.

[0066] 3 is a schematic plan view showing only the second part 50b of the communication module 1a according to the second embodiment, in which the heat sink 7 and the heat dissipation resin 6 are omitted.

[0067] In the second embodiment, the second through hole 5b has a linear slit shape. The second through hole 5b communicates with the first through hole 5a. In other words, the second through hole 5b extends linearly across the first through hole 5a.

[0068] In the second embodiment, the second through holes 5b are configured with one second through hole 5b extending in the front-rear direction and one second through hole 5b extending in the left-right direction. The two second through holes 5b intersect perpendicularly in a region communicating with the first through holes 5a, specifically at the center position C of the first through holes 5a.

[0069] The second through-holes 5b configured in this manner facilitate inspection by allowing continuous observation of the spread of the heat dissipation resin 6 during filling with the heat dissipation resin 6. Furthermore, because the two slit-shaped second through-holes 5b intersect perpendicularly, the spread of the heat dissipation resin 6 can be observed over an even wider area.

[0070] The communication module 1a according to the second embodiment has the following advantages.

[0071] (11) The second through hole 5b has a linear slit shape and communicates with the first through hole 5a.

[0072] As a result, the spread of the heat dissipating resin 6 can be more easily observed.

[0073] (12) Two second through holes 5b are provided, and the two second through holes 5b intersect perpendicularly in the region communicating with the first through holes 5a.

[0074] As a result, the spread of the heat dissipating resin 6 can be easily observed over a wide range.

[0075] Third Embodiment Next, a communication module 1b according to a third embodiment will be described with reference to Fig. 4. Only the configuration that differs from the first embodiment will be described below.

[0076] Fig. 4 shows a cross section of a communication module 1b according to a third embodiment, similar to Fig. 2. In Fig. 4, the heat sink 7 and the heat dissipation resin 6 are omitted.

[0077] The upper wall 50 according to the third embodiment further includes a third portion 50c that is one step higher than the second portion 50b toward the first portion 50a. That is, the third portion 50c is located between the first portion 50a and the second portion 50b in the up-down direction. Therefore, the recess according to the third embodiment is formed in a stepped shape. The third portion 50c is formed to surround the second portion 50b.

[0078] The first through hole 5a and the second through hole 5b are provided in the second portion 50b. The third through hole 5c is provided in the third portion 50c. This reduces the distance between the third through hole 5c and the substrate 2 or the IC 3, making it easier to check the heat dissipation resin 6 through the third through hole 5c compared to when the third through hole 5c is provided in the first portion 50a. As a result, it is easier to inspect the heat dissipation resin 6 using the third through hole 5c. This structure is also advantageous in that it makes it easier for the metal cover 5 to come into contact with the convex housing.

[0079] According to the communication module 1b of the third embodiment, the upper wall 50 has a third portion 50c that is one step higher than the second portion 50b toward the first portion 50a, the first through hole 5a and the second through hole 5b are provided in the second portion 50b, and the third through hole 5c is provided in the third portion 50c.

[0080] As a result, it is easier to check the heat dissipation resin 6 through the third through hole 5c compared to when the third through hole 5c is provided in the first portion 50a.

[0081] The communication module according to the present disclosure is not limited to the configuration of the above embodiment, and various modifications are possible.

[0082] A plurality of second portions 50b may be provided on one cover 5. For example, a plurality of second portions 50b may be provided facing one heat-generating component, or one second portion 50b may be provided facing each of a plurality of heat-generating components.

[0083] A plurality of first through holes 5a may be provided in one second portion 50b.

[0084] The shapes of the first through hole 5 a, the second through hole 5 b, and the third through hole 5 c are not limited to squares and may be any shapes such as circles, rectangles, etc. Similarly, the shape of the second portion 50 b is not limited to rectangles and may be any shapes such as circles, squares, etc.

[0085] [Additional Notes] The communication module and communication module assembly according to the present disclosure provide the following aspects.

[0086] [Aspect 1] A communication module comprising: a substrate; an IC that is a heat-generating component arranged on the substrate; and a cover that covers the substrate and the IC, wherein the cover has an upper wall that covers the substrate from above, and the upper wall has a first portion in an area that does not face the IC and a second portion that is one step lower toward the IC in an area that faces the IC, and the upper wall is provided with a first through hole and a second through hole that penetrate the upper wall, and the first through hole is provided in the second portion, and the second through hole is provided in either the first portion or the second portion; and a heat dissipation resin that is arranged on the IC, is visible from the first through hole and the second through hole in a top view, and does not block at least a portion of the second through hole.

[0087] [Aspect 2] The communication module according to aspect 1, wherein an opening area of ​​the first through hole is larger than an opening area of ​​the second through hole.

[0088] [Aspect 3] The communication module according to aspect 1 or 2, wherein a plurality of the second through holes are provided and are arranged on both sides of the first through hole.

[0089] [Aspect 4] The communication module according to any one of Aspects 1 to 3, wherein at least three of the second through holes are provided and are arranged to surround the first through hole.

[0090] [Aspect 5] The communication module according to any one of aspects 1 to 3, wherein the second through hole has a linear slit shape and communicates with the first through hole.

[0091] [Aspect 6] The communication module according to aspect 5, wherein two second through holes are provided, and the two second through holes intersect perpendicularly in a region communicating with the first through hole.

[0092] [Aspect 7] The communication module according to any one of Aspects 1 to 4, wherein four second through holes are provided, and the four second through holes are arranged surrounding the first through hole at a rotational pitch of 90° around a rotation axis that passes through the center position of the first through hole and is perpendicular to the second portion.

[0093] [Aspect 8] A communication module according to any one of Aspects 1 to 7, wherein a third through hole is provided in the upper wall, the distance between the third through hole and the first through hole is greater than the distance between the second through hole and the first through hole, and the heat dissipation resin is not visible from the third through hole when viewed from above.

[0094] [Aspect 9] The communication module according to Aspect 8, wherein the upper wall has a third portion that is one step higher from the second portion toward the first portion, the first through hole and the second through hole are provided in the second portion, and the third through hole is provided in the third portion.

[0095] [Aspect 10] The communication module according to Aspect 8 or Aspect 9, wherein the third through hole does not overlap with the IC in a top view.

[0096] [Aspect 11] The communication module according to Aspect 8 or 9, wherein the third through hole overlaps with the IC in a top view.

[0097] [Aspect 12] The communication module according to any one of Aspects 1 to 11, wherein the cover has a side wall connecting the first portion and the second portion, and the side wall is inclined in a direction away from the second portion in a top view.

[0098] [Aspect 13] A communication module assembly comprising: the communication module according to any one of aspects 1 to 12, wherein the heat dissipation resin does not protrude above the upper wall; and a heat sink disposed on the first portion of the communication module.

[0099] 1, 1a, 1b: Communication module 2: Substrate 3: IC 4: Electronic component 5: Cover 5a: First through-hole 5b: Second through-hole 5c: Third through-hole 50: Upper wall 50a: First part 50b: Second part 50c: Third part 51: Peripheral wall 52: Side wall 6: Heat dissipation resin 7: Heat sink

Claims

1. A communications module comprising: a substrate; an IC that is a heat-generating component arranged on the substrate; and a cover that covers the substrate and the IC, the cover having an upper wall that covers the substrate from above, the upper wall having a first portion that is not facing the IC and a second portion that is one step lower toward the IC in the region that faces the IC, the upper wall having a first through hole and a second through hole that penetrate the upper wall, the first through hole being arranged in the second portion, and the second through hole being arranged in either the first portion or the second portion; and a heat dissipation resin that is arranged on the IC, is visible from the first through hole and the second through hole in a top view, and does not block at least a portion of the second through hole.

2. The communication module according to claim 1, wherein the opening area of ​​the first through hole is larger than the opening area of ​​the second through hole.

3. The communication module according to claim 1 or 2, wherein a plurality of the second through holes are provided, and are arranged at least on both sides of the first through hole.

4. A communications module according to any one of claims 1 to 3, wherein at least three of the second through holes are provided and are arranged surrounding the first through hole.

5. A communications module according to any one of claims 1 to 3, wherein the second through-hole is shaped like a straight slit and communicates with the first through-hole.

6. The communication module according to claim 5, wherein two second through holes are provided, and the two second through holes intersect perpendicularly in a region communicating with the first through hole.

7. A communications module according to any one of claims 1 to 4, wherein four second through holes are provided, and the four second through holes are arranged surrounding the first through hole at a rotational pitch of 90° around a rotation axis that passes through the center position of the first through hole and is perpendicular to the second part.

8. A communication module according to any one of claims 1 to 7, wherein a third through hole is provided in the upper wall, the distance between the third through hole and the first through hole is greater than the distance between the second through hole and the first through hole, and the heat dissipation resin is not visible from the third through hole when viewed from above.

9. A communication module as described in claim 8, wherein the upper wall has a third section that is one step higher from the second section toward the first section, the first through hole and the second through hole are provided in the second section, and the third through hole is provided in the third section.

10. The communication module according to claim 8 or 9, wherein the third through hole does not overlap with the IC in a top view.

11. The communication module according to claim 8 or 9, wherein the third through hole overlaps with the IC in a top view.

12. A communications module according to any one of claims 1 to 11, wherein the cover has a side wall connecting the first part and the second part, and the side wall is inclined in a direction away from the second part when viewed from above.

13. A communications module assembly comprising: a communications module according to any one of claims 1 to 12, wherein the heat dissipation resin does not protrude above the upper wall; and a heat sink disposed on the first portion of the communications module.

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