Interposer and electronic device comprising same

Abstract

An electronic device according to an embodiment of the present disclosure may comprise: a printed circuit board including at least one first connection part; a cover including at least one second connection part and disposed so as to cover at least a portion of the printed circuit board; a memory module that includes at least one third connection part formed at a position corresponding to the at least one second connection part and is disposed between the printed circuit board and the cover; and an interposer that includes at least one first fastening part protruding in a first direction and at least one second fastening part protruding in a second direction opposite to the first direction, at least a portion of the interposer being disposed between the memory module and the printed circuit board. The at least one first fastening part is inserted into the at least one first connection part to fasten the interposer to the printed circuit board, and may be configured such that at least a portion of the at least one first fastening part is visually exposed when the printed circuit board is viewed in the second direction. The at least one second fastening part is inserted into the at least one second connection part and the at least one third connection part to fasten the interposer to the cover and the memory module, and may be configured such that at least a portion of the at least one second fastening part is visually exposed when the cover is viewed in the first direction.

Description

Interposer and electronic device including same

[0001] The present disclosure relates to an interposer and an electronic device including the same.

[0002] As electronic devices become smaller and smaller, while their functions become more diverse, it has become increasingly important to secure space where electronic components (e.g., processors, communication circuits, or memories) that perform various functions of the electronic devices can be densely arranged.

[0003] Recently, electronic devices that utilize interposers to form a stacked structure of multiple printed circuit boards to secure space for arranging electronic components have been on the rise. For example, an electronic device can secure space for arranging electronic components by stacking multiple printed circuit boards and placing an interposer, which includes at least one via for electrically connecting the printed circuit boards, between the stacked printed circuit boards.

[0004] Meanwhile, as electronic components such as memory modules become smaller and more integrated, an interposer for mounting a memory module on a printed circuit board is placed between the memory module and the printed circuit board to electrically connect the memory module and the printed circuit board and perform various functions such as memory heat management and electromagnetic interference prevention, thereby optimizing system performance and increasing reliability.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0006] An electronic device according to one embodiment may include a printed circuit board including at least one first connecting portion, a cover including at least one second connecting portion and arranged to cover at least a portion of the printed circuit board, at least one third connecting portion formed at a position corresponding to the at least one second connecting portion, a memory module disposed between the printed circuit board and the cover, and an interposer including at least one first fastening portion protruding in a first direction and at least one second fastening portion protruding in a second direction opposite to the first direction, at least a portion of which is disposed between the memory module and the printed circuit board.

[0007] At least one first fastener may be configured to be inserted into the at least one first connecting portion to fasten the interposer to the printed circuit board, and at least a portion of the at least one first fastener may be visually exposed when the printed circuit board is viewed in the second direction.

[0008] At least one second fastening portion may be inserted into the at least one second connecting portion and the at least one third connecting portion to fasten the interposer to the cover and the memory module, and may be configured such that at least a portion of the at least one second fastening portion is visually exposed when the cover is viewed in the first direction.

[0009] An interposer according to one embodiment includes at least one first fastening portion protruding in a first direction and inserted into at least one first connecting portion included in a printed circuit board, at least one second connecting portion protruding in a second direction opposite to the first direction and included in a cover arranged to cover at least a portion of the printed circuit board, and at least one second fastening portion inserted into at least one third connecting portion included in a memory module arranged between the printed circuit board and the cover and formed at a position corresponding to the at least one second connecting portion, wherein the interposer is fastened to the printed circuit board through the first fastening portion and configured such that at least a portion of the at least one first fastening portion is visually exposed when the printed circuit board is viewed in the second direction, and the interposer is fastened to the cover and the memory module through the second fastening portion and configured such that at least a portion of the at least one second fastening portion is visually exposed when the cover is viewed in the first direction, and at least a portion of the at least one second fastening portion can be disposed between the memory module and the printed circuit board.

[0010] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0011] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present invention.

[0012] FIG. 2 is a front perspective view illustrating a state in which a memory module included in an electronic device according to one embodiment is coupled to a printed circuit board.

[0013] FIG. 3 is an exploded perspective view illustrating components for bonding a memory module included in an electronic device to a printed circuit board according to one embodiment.

[0014] FIG. 4 is a front perspective view of a cover included in an electronic device according to one embodiment.

[0015] FIG. 5 is a front perspective view of a memory module included in an electronic device according to one embodiment.

[0016] FIG. 6 is a front perspective view of an interposer included in an electronic device according to one embodiment.

[0017] FIG. 7 is a rear perspective view of an interposer included in an electronic device according to one embodiment.

[0018] FIG. 8 is a bottom view of an interposer included in an electronic device according to one embodiment.

[0019] FIG. 9 is a side view of an interposer included in an electronic device according to one embodiment.

[0020] FIG. 10 is a front view of an interposer included in an electronic device according to one embodiment.

[0021] FIG. 11 is an enlarged perspective view of the first protrusion and the fourth protrusion portion of the interposer included in an electronic device according to one embodiment.

[0022] FIG. 12 is an enlarged front view of the first protrusion and the fourth protrusion portion of the interposer included in an electronic device according to one embodiment.

[0023] FIG. 13 is a cross-sectional view of a portion taken along the line A-A' of FIG. 2 when the first hook and the second hook are caught on the first opening edge of an electronic device according to various embodiments.

[0024] FIG. 14 is a drawing for explaining a case where a first hook and a second hook are caught on a first opening edge in an electronic device according to various embodiments.

[0025] FIG. 15 is a cross-sectional view of a portion taken along the line B-B' of FIG. 2 when the third hook and the fourth hook are caught on the first opening edge in an electronic device according to various embodiments.

[0026] FIG. 16 is a drawing for explaining a case where a third hook and a fourth hook are caught on a first opening edge in an electronic device according to various embodiments.

[0027] FIG. 17 is an enlarged view of a first groove portion of a cover included in an electronic device according to one embodiment.

[0028] FIG. 18 is a front perspective view showing a first area of ​​a memory module included in an electronic device according to one embodiment.

[0029] FIG. 19 is a rear perspective view illustrating a second area of ​​a memory module included in an electronic device according to one embodiment.

[0030] FIG. 20 is a rear perspective view of a cover included in an electronic device according to one embodiment.

[0031] FIG. 21 is a cross-sectional view of a portion taken along the line C-C' of FIG. 2 in an electronic device according to one embodiment.

[0032] FIG. 22 is a cross-sectional view of a portion taken along the C-C' section of FIG. 2 during an assembly process in an electronic device according to one embodiment.

[0033] FIG. 23 is a side view of an interposer included in an electronic device according to various embodiments.

[0034] FIG. 24 is a front view of an interposer included in an electronic device according to various embodiments.

[0035] FIG. 25 is an enlarged perspective view of the first protrusion and the fourth protrusion portion of the interposer included in an electronic device according to various embodiments.

[0036] Below, embodiments of the present disclosure are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In addition, for the purpose of clearly explaining the present disclosure in the drawings, parts irrelevant to the description are omitted, and similar parts are designated with similar reference numerals throughout the specification.

[0037] The terms used in this disclosure are described as currently common terms, taking into account the functions mentioned herein. However, these terms may mean various other terms depending on the intentions of those skilled in the art, precedents, the emergence of new technologies, etc. Therefore, the terms used in this disclosure should not be interpreted solely based on their names, but rather based on the meanings of the terms and the overall content of this disclosure.

[0038] Additionally, while terms such as first, second, etc. may be used to describe various components, the components should not be limited by these terms. These terms are used to distinguish one component from another.

[0039] Throughout the specification, when a part is said to be "connected" to another part, this includes not only the cases where the parts are "directly connected" but also the cases where the parts are "electrically connected" with other elements intervening. Furthermore, when a part is said to "include" a component, this does not exclude other components, but rather includes other components, unless otherwise stated.

[0040] An embodiment of the present disclosure may be represented by functional block configurations and various processing steps. Some or all of these functional blocks may be implemented by various hardware and / or software configurations that perform specific functions. For example, the functional blocks of the present disclosure may be implemented by one or more microprocessors or by circuit configurations for a given function. Furthermore, for example, the functional blocks of the present disclosure may be implemented using various programming or scripting languages. The functional blocks may be implemented by algorithms that execute on one or more processors. Furthermore, the present disclosure may employ conventional techniques for electronic configuration, signal processing, and / or data processing. Terms such as "mechanism," "element," "means," and "configuration" may be used broadly and are not limited to mechanical and physical configurations.

[0041] Additionally, the connecting lines or connecting members between components depicted in the drawings are merely exemplary representations of functional connections and / or physical or circuit connections. In an actual device, connections between components may be represented by various functional connections, physical connections, or circuit connections that may be replaced or added.

[0042] The present disclosure will be described in detail with reference to the attached drawings below.

[0043] FIG. 1 is a block diagram of an electronic device (901) within a network environment (900) according to various embodiments.

[0044] The electronic device (901) of FIG. 1 may include at least a portion of the memory assembly (1) of FIGS. 2 to 3, or may include other embodiments of the memory assembly (1).

[0045] The electronic device (901) according to various embodiments disclosed in this document may take various forms. The electronic device (901) may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to the embodiments of this document is not limited to the aforementioned devices.

[0046] Referring to FIG. 1, in a network environment (900), an electronic device (901) may communicate with an electronic device (902) via a first network (998) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (904) or a server (908) via a second network (999) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (901) may communicate with the electronic device (904) via the server (908). According to one embodiment, the electronic device (901) may include a processor (920), a memory (930), an input module (950), an audio output module (955), a display module (960), an audio module (970), a sensor module (976), an interface (977), a connection terminal (978), a haptic module (979), a camera module (980), a power management module (988), a battery (989), a communication module (990), a subscriber identification module (996), or an antenna module (997). In some embodiments, the electronic device (901) may omit at least one of these components (e.g., the connection terminal (978)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (976), the camera module (980), or the antenna module (997)) may be integrated into one component (e.g., the display module (960)).

[0047] The processor (920) may, for example, execute software (e.g., a program (940)) to control at least one other component (e.g., a hardware or software component) of the electronic device (901) connected to the processor (920) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (920) may store commands or data received from other components (e.g., a sensor module (976) or a communication module (990)) in a volatile memory (932), process the commands or data stored in the volatile memory (932), and store result data in a non-volatile memory (934). According to one embodiment, the processor (920) may include a main processor (921) (e.g., a central processing unit or an application processor) or an auxiliary processor (923) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (921). For example, when the electronic device (901) includes the main processor (921) and the auxiliary processor (923), the auxiliary processor (923) may be configured to use less power than the main processor (921) or to be specialized for a given function. The auxiliary processor (923) may be implemented separately from the main processor (921) or as a part thereof.

[0048] The auxiliary processor (923) may control at least a portion of functions or states associated with at least one component (e.g., a display module (960), a sensor module (976), or a communication module (990)) of the electronic device (901), for example, on behalf of the main processor (921) while the main processor (921) is in an inactive (e.g., sleep) state, or together with the main processor (921) while the main processor (921) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (923) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (980) or a communication module (990)). In one embodiment, the auxiliary processor (923) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (901) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (908)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0049] The memory (930) can store various data used by at least one component (e.g., the processor (920) or the sensor module (976)) of the electronic device (901). The data can include, for example, software (e.g., the program (940)) and input data or output data for commands related thereto. The memory (930) can include a volatile memory (932) or a non-volatile memory (934).

[0050] The program (940) may be stored as software in the memory (930) and may include, for example, an operating system (942), middleware (944), or an application (946).

[0051] The input module (950) can receive commands or data to be used in a component of the electronic device (901) (e.g., a processor (920)) from an external source (e.g., a user) of the electronic device (901). The input module (950) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0052] The audio output module (955) can output audio signals to the outside of the electronic device (901). The audio output module (955) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0053] The display module (960) can visually provide information to an external party (e.g., a user) of the electronic device (901). The display module (960) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (960) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0054] The audio module (970) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (970) can acquire sound through the input module (950), output sound through the sound output module (955), or an external electronic device (e.g., electronic device (902)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (901).

[0055] The sensor module (976) can detect the operating status (e.g., power or temperature) of the electronic device (901) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (976) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0056] The interface (977) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (901) with an external electronic device (e.g., the electronic device (902)). In one embodiment, the interface (977) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0057] The connection terminal (978) may include a connector through which the electronic device (901) may be physically connected to an external electronic device (e.g., the electronic device (902)). In one embodiment, the connection terminal (978) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0058] The haptic module (979) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (979) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0059] The camera module (980) can capture still images and videos. According to one embodiment, the camera module (980) may include one or more lenses, image sensors, image signal processors, or flashes.

[0060] The power management module (988) can manage the power supplied to the electronic device (901). According to one embodiment, the power management module (988) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0061] A battery (989) may power at least one component of the electronic device (901). In one embodiment, the battery (989) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0062] The communication module (990) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (901) and an external electronic device (e.g., electronic device (902), electronic device (904), or server (908)), and the performance of communication through the established communication channel. The communication module (990) may operate independently from the processor (920) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (990) may include a wireless communication module (992) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (994) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (904) via a first network (998) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (999) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (992) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (996) to verify or authenticate the electronic device (901) within a communication network such as the first network (998) or the second network (999).

[0063] The wireless communication module (992) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency communications (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (992) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (992) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (992) may support various requirements specified in the electronic device (901), an external electronic device (e.g., the electronic device (904)), or a network system (e.g., the second network (999)). According to one embodiment, the wireless communication module (992) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0064] The antenna module (997) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (997) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (997) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (998) or the second network (999), may be selected from the plurality of antennas, for example, by the communication module (990). A signal or power may be transmitted or received between the communication module (990) and the external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (997).

[0065] According to various embodiments, the antenna module (997) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0066] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0067] According to one embodiment, commands or data may be transmitted or received between the electronic device (901) and an external electronic device (904) via a server (908) connected to a second network (999). Each of the external electronic devices (902 or 904) may be the same or a different type of device as the electronic device (901). According to one embodiment, all or part of the operations executed in the electronic device (901) may be executed in one or more of the external electronic devices (902, 904, or 908). For example, when the electronic device (901) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (901) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (901). The electronic device (901) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (901) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (904) may include an Internet of Things (IoT) device. The server (908) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (904) or the server (908) may be included in the second network (999).The electronic device (901) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0068] FIG. 2 is a front perspective view illustrating a state in which a memory module (30) included in an electronic device (901) according to one embodiment is coupled to a printed circuit board (10). FIG. 3 is an exploded perspective view illustrating components for coupling a memory module (30) included in an electronic device (901) according to one embodiment to a printed circuit board (10). Referring to FIGS. 2 and 3, a memory assembly (1) including a memory module (30) according to one embodiment may include a printed circuit board (PCB, printed circuit board) (10), a cover (20), a memory module (30), and an interposer (40). The printed circuit board (10) may include at least one first connecting portion (100). According to one embodiment, the first connecting portion (100) (or first opening) may include an opening.

[0069] For example, a printed circuit board (10) may constitute at least a portion of a main board in an electronic device (901). The main board may be composed of printed circuit boards (10) having various thicknesses (e.g., 0.65T, 0.84T, or 1.0T). An interposer (40) according to one embodiment may be configured to fasten printed circuit boards (10) having at least two thicknesses. For example, the printed circuit board (10) may have a thickness of 0.84T or 1.0T.

[0070] FIG. 4 is a front perspective view of a cover (20) included in an electronic device (e.g., the electronic device (901) of FIG. 1) according to one embodiment.

[0071] Referring to FIGS. 2 to 4, an electronic device (901) according to one embodiment may include at least one second connecting portion (200) and a cover (20) arranged to cover at least a portion of a printed circuit board (10). For example, the cover (20) may be made of a metal (e.g., stainless steel). For example, the cover (20) may perform the functions of physically protecting internal electronic components (e.g., memory module (30)) and dissipating heat generated from the electronic components and blocking electromagnetic interference (EMI). For example, the cover (20) may include a shield can. According to one embodiment, the second connecting portion (200) (or second opening) may include an opening.

[0072] FIG. 5 is a front perspective view of a memory module (30) included in an electronic device (901) according to one embodiment.

[0073] Referring to FIGS. 2 to 3 and 5, an electronic device (901) according to one embodiment may include at least one third connection portion (300) formed at a position corresponding to at least one second connection portion (200), and may include a memory module (30) disposed between a printed circuit board (10) and a cover (20). According to one embodiment, the third connection portion (300) (or third opening) may include an opening.

[0074] The volatile memory (932) of FIG. 1 may be at least partially similar to the memory module (30) of FIGS. 2 to 3 and 5, or may include other embodiments of the electronic device (901). Additionally, the memory module (30) may be at least partially similar to a low-power compression attached memory module (LPCAMM2), or may include other memory modules used in the electronic device (901).

[0075] Fig. 6 is a front perspective view of an interposer (40) included in an electronic device (901) according to one embodiment. Fig. 7 is a rear perspective view of an interposer (40) included in an electronic device (901) according to one embodiment.

[0076] The first direction may be the direction corresponding to the -X direction on the drawing.

[0077] The second direction may be the direction corresponding to the +X direction in the drawing.

[0078] Referring to FIGS. 2 to 3 and 6 to 7, an electronic device (901) according to one embodiment may include at least one first fastening portion (400) protruding in a first direction and at least one second fastening portion (500) protruding in a second direction opposite to the first direction, and may include an interposer (40) at least a portion of which is disposed between a memory module (30) and a printed circuit board (10).

[0079] For example, an interposer (40) is a component responsible for connecting chips and substrates in semiconductor technology. It supports electrical signal transmission and can effectively dissipate heat to prevent or reduce chip overheating. Furthermore, it can enable the integration of multiple chips into a single package and optimize high-speed signal transmission to improve data transmission accuracy.

[0080] The cover (20), memory module (30), and interposer (40) can be placed on the main board and then fastened to the printed circuit board (10) by fastening with screws. However, if the positions of each electronic component are different due to the occurrence of assembly play during placement, the screws may not be properly fastened or the electronic component or its surroundings may be damaged. In addition, if the screws are fastened while the assembly play is present, the circuit of the main board may not operate or the main board may be damaged.

[0081] In the case of an electronic device (901) according to one embodiment of the present invention, the interposer (40) can be assembled with the printed circuit board (10) by inserting and fastening the first fastening portion (400) into the first connecting portion (100), and can be assembled with the cover (20) and the memory module (30) by inserting and fastening the second fastening portion (500) into the second connecting portion (200) and the third connecting portion (300). This allows for assembly in a simple and accurate manner with each electronic component aligned in position, and thus, even if assembly play occurs, it can be dealt with at the assembly stage.

[0082] Referring to FIGS. 2 to 3 and FIGS. 6 to 7, in an electronic device (901) according to one embodiment, at least one first fastening portion (400) may be inserted into at least one first connecting portion (100) to fasten an interposer (40) to a printed circuit board (10). When the printed circuit board (10) is viewed in a second direction while the interposer (40) is fastened to the printed circuit board (10), at least a portion of at least one first fastening portion (400) may be configured to be visually exposed.

[0083] For example, when the printed circuit board (10) is viewed in the second direction while the first fastening portion (400) is inserted and fastened to the first connecting portion (100), at least a portion of the first fastening portion (400) fastened to the first connecting portion (100) may be configured to be visually exposed by penetrating the first connecting portion (100) and being caught on one side of the edge of the first connecting portion (100). By visually exposing the first fastening portion (400), the state in which the printed circuit board (10) and the interposer (40) are coupled can be easily confirmed with the naked eye. By checking the visually exposed first fastening portion (400) during the assembly stage, the worker can determine whether the assembly between the interposer (400) and the printed circuit board (10) is accurately performed. The surface of the visually exposed portion of the first fastening portion (400) may be configured with a different color from other portions of the interposer (40).

[0084] Additionally, in an electronic device (901) according to one embodiment, at least one second fastening portion (500) may be inserted into at least one second connecting portion (200) and at least one third connecting portion (300) to fasten the interposer (40) to the cover (20) and the memory module (30). When the interposer (40) is fastened to the cover (20) and the memory module (30), at least a portion of at least one second fastening portion (500) may be configured to be visually exposed when the cover (20) is viewed in the first direction.

[0085] For example, when the second fastening portion (500) is inserted into the third fastening portion (300) and the second fastening portion (200) and is fastened to the second fastening portion (200) and the cover (20) is viewed in the first direction, the second fastening portion (500) fastened to the second fastening portion (200) may be configured to be visually exposed at least in part by penetrating through the third fastening portion (300) and the second fastening portion (200) and being caught on one side of the edge of the second fastening portion (200). By visually exposing the second fastening portion (500), the state in which the cover (20), the memory module (30), and the interposer (40) are coupled can be easily confirmed with the naked eye. By confirming the visually exposed second fastening portion (500) during the assembly stage, the worker can determine whether the assembly between the interposer (40), the memory module (30), and the cover (20) has been accurately performed. The surface of the visually exposed portion of the second fastener (500) may be composed of a different color from other portions of the interposer (40).

[0086] Referring to FIG. 3, in an electronic device (901) according to one embodiment, a first connection portion (100) may include a first opening (110), a second opening (120), and a third opening (130) formed at different points.

[0087] Referring to FIG. 7, in an electronic device (901) according to one embodiment, a first fastening portion (400) may include a first protrusion (410) inserted into a first opening (110), a second protrusion (420) inserted into a second opening (120), and a third protrusion (430) inserted into a third opening (130).

[0088] In one embodiment, the first protrusion (410), the second protrusion (420), and the third protrusion (430) may be positioned at positions spaced apart from each other. For example, the first protrusion (410) and the third protrusion (430) may be positioned on opposite edge sides of the interposer (40). For example, the first protrusion (410) may be positioned on one side of the interposer (40), and the third protrusion (430) may be positioned on the other side of the interposer (40). For example, the second protrusion (420) may be positioned between the first protrusion (410) and the third protrusion (430) (e.g., at the center point). For example, the first protrusion (410) and the third protrusion (430) may be placed on one side of the interposer (40), and the second protrusion (420) may be placed on the other side of the interposer (40).

[0089] For example, the first protrusion (410) may be positioned at the end point in the +Z direction from the end point in the -Y direction of the interposer (40) in FIG. 7. The first opening (110) may be formed at a position corresponding to the first protrusion (410).

[0090] For example, the second protrusion (420) may be positioned at the end point in the -Z direction on the central side of the interposer (40) in FIG. 7. The second opening (120) may be formed at a position corresponding to the second protrusion (420).

[0091] For example, the third protrusion (430) may be positioned at the +Z direction end point from the +Y direction end of the interposer (40) in FIG. 7. The third opening (130) may be formed at a position corresponding to the third protrusion (430).

[0092] In one embodiment, the first protrusion (410) may be connected to the printed circuit board (10) by penetrating the first opening (110) and being caught on one side of the edge of the first opening (110). The second protrusion (420) may be connected to the printed circuit board (10) by penetrating the second opening (120) and being caught on one side of the edge of the second opening (120). The third protrusion (430) may be connected to the printed circuit board (10) by penetrating the third opening (130) and being caught on one side of the edge of the third opening (130).

[0093] The first protrusion (410) may be formed integrally with the interposer (40) or may be formed as a separate component. The second protrusion (420) may be formed integrally with the interposer (40) or may be formed as a separate component. The third protrusion (430) may be formed integrally with the interposer (40) or may be formed as a separate component.

[0094] Referring to FIG. 4, in an electronic device (901) according to one embodiment, the second connection portion (200) may include a fourth opening (210), a fifth opening (220), and a sixth opening (230) formed at different points.

[0095] Referring to FIG. 5, in an electronic device (901) according to one embodiment, a third connection portion (300) may include a seventh opening (310) formed at a position corresponding to the fourth opening (210), an eighth opening (320) formed at a position corresponding to the fifth opening (220), and a ninth opening (330) formed at a position corresponding to the sixth opening (230).

[0096] Referring to FIG. 6, in an electronic device (901) according to one embodiment, the second fastening portion (500) may include a fourth protrusion (510) inserted into the fourth opening (210) and the seventh opening (310), a fifth protrusion (520) inserted into the fifth opening (220) and the eighth opening (320), and a sixth protrusion (530) inserted into the sixth opening (230) and the ninth opening (330).

[0097] In one embodiment, the fourth protrusion (510), the fifth protrusion (520), and the sixth protrusion (530) may be positioned at positions spaced apart from each other. For example, the fourth protrusion (510) and the sixth protrusion (530) may be positioned on opposite edge sides of the interposer (40). For example, the fourth protrusion (510) may be positioned on one side of the interposer (40), and the sixth protrusion (530) may be positioned on the other side of the interposer (40). For example, the fifth protrusion (520) may be positioned between the fourth protrusion (510) and the sixth protrusion (530) (e.g., at the center point). For example, the fourth protrusion (510) and the sixth protrusion (530) may be placed on one side of the interposer (40), and the fifth protrusion (520) may be placed on the other side of the interposer (40).

[0098] For example, the fourth protrusion (510) may be positioned from the -Y direction end of the interposer (40) to the +Z direction end in FIG. 6. The fourth protrusion (510) may be formed integrally with the first protrusion (410) or may be formed as a separate configuration. The fourth opening (210) and the seventh opening (310) may be formed at positions corresponding to the fourth protrusion (510).

[0099] For example, the fifth protrusion (520) may be positioned at the end point in the -Z direction from the center side of the interposer (40) in FIG. 6. The fifth protrusion (520) may be formed integrally with the second protrusion (420) or may be formed as separate components. The fifth opening (220) and the eighth opening (320) may be formed at positions corresponding to the fifth protrusion (520).

[0100] For example, the sixth protrusion (530) may be positioned at the +Z end from the +Y end of the interposer (40) in FIG. 6. The sixth protrusion (530) may be formed integrally with the third protrusion (430) or may be formed as separate components. The sixth opening (230) and the ninth opening (330) may be formed at positions corresponding to the sixth protrusion (530).

[0101] In one embodiment, the fourth protrusion (510) may penetrate the seventh opening (310) and the fourth opening (210) and be caught on one side of the edge of the fourth opening (210), thereby fastening the interposer (40) to the memory module (30) and the cover (20). The fifth protrusion (520) may penetrate the eighth opening (320) and the fifth opening (220), thereby fastening the interposer (40) to the memory module (30) and the cover (20), by fastening the interposer (40) to the memory module (30) and the cover (20). The sixth protrusion (530) may penetrate the ninth opening (330) and the sixth opening (230), thereby fastening the interposer (40) to the memory module (30) and the cover (20).

[0102] The fourth protrusion (510) may be formed integrally with the interposer (40) or may be formed as a separate component. The fifth protrusion (520) may be formed integrally with the interposer (40) or may be formed as a separate component. The sixth protrusion (530) may be formed integrally with the interposer (40) or may be formed as a separate component.

[0103] Fig. 8 is a bottom view of an interposer (40) included in an electronic device (901) according to one embodiment. Fig. 9 is a side view of an interposer (40) included in an electronic device (901) according to one embodiment. Fig. 10 is a front view of an interposer (40) included in an electronic device (901) according to one embodiment.

[0104] The third direction may be the direction corresponding to the +Z direction in the drawing.

[0105] The fourth direction may be the direction corresponding to the -Z direction in the drawing.

[0106] The fifth direction may be the direction corresponding to the -Y direction in the drawing.

[0107] The sixth direction may be the direction corresponding to the +Y direction in the drawing.

[0108] Meanwhile, the fact that the hook is oriented in a certain direction may mean that the '「 ' shaped protrusion that the hook catches is positioned so that it faces that direction. For example, the fact that the first hook (1010) is oriented in the third direction may mean that the '「 ' shaped protrusion that the first hook (1010) catches is positioned so that it faces the +Z direction.

[0109] Referring to FIGS. 3, 7, and 10, in an electronic device (901) according to one embodiment, a first protrusion (410) may include a first hook (1010) facing in a third direction perpendicular to the first direction, a second hook (1020) facing in a fourth direction opposite to the third direction, a third hook (1030) facing in a fifth direction perpendicular to the first direction and different from the third direction, and a fourth hook (1040) facing in a sixth direction opposite to the fifth direction.

[0110] For example, the first hook (1010), the second hook (1020), the third hook (1030), and the fourth hook (1040) may be configured as an integral part of the interposer (40). The first hook (1010), the second hook (1020), the third hook (1030), and the fourth hook (1040) may be configured as a pair of at least two of each other. The first hook (1010), the second hook (1020), the third hook (1030), and the fourth hook (1040) may each be configured as an individual component.

[0111] In an electronic device (901) according to one embodiment, the second protrusion (420) may include a fifth hook (1050) facing in a third direction, a sixth hook (1060) facing in a fourth direction, a seventh hook (1070) facing in a fifth direction, and an eighth hook (1080) facing in a sixth direction.

[0112] For example, the fifth hook (1050), the sixth hook (1060), the seventh hook (1070), and the eighth hook (1080) may be configured as an integral part of the interposer (40). The fifth hook (1050), the sixth hook (1060), the seventh hook (1070), and the eighth hook (1080) may be configured as a pair of at least two of each other. The fifth hook (1050), the sixth hook (1060), the seventh hook (1070), and the eighth hook (1080) may each be configured as an individual component.

[0113] In an electronic device (901) according to one embodiment, the third protrusion (430) may include a ninth hook (1090) facing in a third direction, a tenth hook (1100) facing in a fourth direction, an eleventh hook (1100) facing in a fifth direction, and a twelfth hook (1120) facing in a sixth direction.

[0114] For example, the ninth hook (1090), the tenth hook (1100), the eleventh hook (1110), and the twelfth hook (1120) may be configured as an integral part of the interposer (40). The ninth hook (1090), the tenth hook (1100), the eleventh hook (1110), and the twelfth hook (1120) may be configured as a pair of at least two of each other. The ninth hook (1090), the tenth hook (1100), the eleventh hook (1110), and the twelfth hook (1120) may each be configured as an individual configuration.

[0115] In an electronic device (901) according to one embodiment, the interposer (40) can be fastened to the printed circuit board (10) by having the first hook (1010) and the second hook (1020), or the third hook (1030) and the fourth hook (1040) hook at least a portion of the edge of the first opening (110), the fifth hook (1050) and the sixth hook (1060), or the seventh hook (1070) and the eighth hook (1080) hook at least a portion of the edge of the second opening (120), and the ninth hook (1090) and the tenth hook (1100), or the eleventh hook (1110) and the twelfth hook (1120) hook at least a portion of the edge of the third opening (130).

[0116] For example, the interposer (40) can be fastened to a printed circuit board (10) having a first thickness (e.g., 1.0T thickness) or a printed circuit board (10) having a second thickness (e.g., 0.84T thickness) different from the first thickness.

[0117] When the interposer (40) is fastened to a printed circuit board (10) having a first thickness, the first hook (1010) and the second hook (1020) can be caught on at least a part of the edge of the first opening (110), the fifth hook (1050) and the sixth hook (1060) can be caught on at least a part of the edge of the second opening (120), and the ninth hook (1090) and the tenth hook (1100) can be caught on at least a part of the edge of the third opening (130).

[0118] When the interposer (40) is fastened to a printed circuit board (10) having a second thickness, the third hook (1030) and the fourth hook (1040) can be caught on at least a part of the edge of the first opening (110), the seventh hook (1070) and the eighth hook (1080) can be caught on at least a part of the edge of the second opening (120), and the eleventh hook (1110) and the twelfth hook (1120) can be caught on at least a part of the edge of the third opening (130).

[0119] Referring to FIGS. 3 to 6 and 9 to 10, in an electronic device (901) according to one embodiment, the fourth protrusion (510) may include a 13th hook (1130) facing in a third direction perpendicular to the first direction and a 14th hook (1140) facing in a fourth direction opposite to the third direction.

[0120] For example, the 13th hook (1130) and the 14th hook (1140) may be configured as an integral part of the interposer (40). The 13th hook (1130) and the 14th hook (1140) may be configured as a pair. The 13th hook (1130) and the 14th hook (1140) may each be configured as individual parts.

[0121] In an electronic device (901) according to one embodiment, the fifth protrusion (520) may include a fifteenth hook (1150) facing in a third direction and a sixteenth hook (1160) facing in a fourth direction.

[0122] For example, the fifteenth hook (1150) and the sixteenth hook (1160) may be configured as an integral part of the interposer (40). The fifteenth hook (1150) and the sixteenth hook (1160) may be configured as a pair. The fifteenth hook (1150) and the sixteenth hook (1160) may each be configured as individual parts.

[0123] In an electronic device (901) according to one embodiment, the sixth protrusion (530) may include a seventeenth hook (1170) facing in a third direction and an eighteenth hook (1180) facing in a fourth direction.

[0124] For example, the 17th hook (1170) and the 18th hook (1180) may be configured as an integral part of the interposer (40). The 17th hook (1170) and the 18th hook (1180) may be configured as a pair. The 17th hook (1170) and the 18th hook (1180) may each be configured as individual parts.

[0125] In an electronic device (901) according to one embodiment, the interposer (40) can be fastened to the cover (20) and the memory module (30) by having the 13th hook (1130) and the 14th hook (1140) pass through the 7th opening (310) and hook at least a portion of the edge of the 4th opening (210), the 15th hook (1150) and the 16th hook (1160) pass through the 8th opening (320) and hook at least a portion of the edge of the 5th opening (220), and the 17th hook and the 18th hook (1180) pass through the 9th opening (330) and hook at least a portion of the edge of the 6th opening (230).

[0126] The method by which the interposer (40) is connected to the printed circuit board (10), the memory module (30), and the cover (20) may be a snap fit method that allows two parts to be easily connected without a separate tool or additional parts. When a pair of corresponding hooks enters the opening (the distance between the protruding parts so that the hooks are caught in the opening is formed to be at least wider than the width of the opening), the inner circumferential surface of the opening contacts the outer inclined surface of the hook, thereby applying an external force to the hook, so that the hook can be elastically deformed toward the center of the opening. When the opening passes through the protruding portion for the hook to be caught in the opening (the distance between the protruding portion for the hook to be caught in the opening and the portion connecting the interposer (40) is formed to be at least equal to or less than the width of the opening), the deformed portion of the hook is restored by elastic force, and the printed circuit board (10) can be fastened to the interposer (40) by the hook being caught in at least a part of the edge of the opening.

[0127] For example, referring to FIG. 9, the width of the first opening (110) may be formed to be narrower than the distance between the protruding portions of a pair of corresponding first hooks (1010) and second hooks (1020) so as to be caught in the opening. Accordingly, when the first hook (1010) and the second hook (1020) enter the first opening, the inner surface of the first opening (110) may contact the first hook (1010) and the second hook (1020) to apply an external force. The first hook (1010) and the second hook (1020) may be elastically deformed toward each other (toward the inside) by the external force. When the first opening (110) passes through the protruding portion so that the first hook (1010) and the second hook (1020) are caught in the opening, the deformed portions of the first hook (1010) and the second hook (1020) are restored by elastic force, and the hooks are caught in at least a part of the opening edge, so that the printed circuit board (10) can be fastened to the interposer (40).

[0128] Fig. 11 is an enlarged perspective view of the first protrusion (410) and the fourth protrusion (510) of the interposer (40) included in the electronic device (901) according to one embodiment. Fig. 12 is an enlarged front view of the first protrusion (410) and the fourth protrusion (510) of the interposer (40) included in the electronic device (901) according to one embodiment.

[0129] The first protrusion (410), the second protrusion (420), and the third protrusion (430) may be formed in similar or identical shapes. The fourth protrusion (510), the fifth protrusion (520), and the sixth protrusion (530) may be formed in similar or identical shapes.

[0130] In an electronic device (901) according to one embodiment, the first hook (1010), the second hook (1020), the fifth hook (1050), the sixth hook (1060), the ninth hook (1090), and the tenth hook (1100) may be formed such that the height from the point at which each hook is caught to one side of the interposer (40) is a first height (e.g., h1 of FIG. 12). For example, when the interposer (40) is connected to a printed circuit board (10) having a first thickness, the first height may be a height corresponding to the first thickness or the depth of the first connection portion (100). Accordingly, a printed circuit board (10) having a first thickness can be fastened to an interposer (40) with a minimized or reduced clearance by the first hook (1010), the second hook (1020), the fifth hook (1050), the sixth hook (1060), the ninth hook (1090), and the tenth hook (1100).

[0131] In an electronic device (901) according to one embodiment, the third hook (1030), the fourth hook (1040), the seventh hook (1070), the eighth hook (1080), the eleventh hook (1110), and the twelfth hook (1120) may be formed to have a second height (e.g., h2 in FIG. 12) different from the first height in height from the point at which each hook is caught to one side of the interposer (40). For example, when the interposer (40) is connected to a printed circuit board having a second thickness, the second height may be a height corresponding to the second thickness or the depth of the first connecting portion (100). Accordingly, the printed circuit board (10) having the second thickness can be fastened to the interposer (40) with the play minimized or reduced by the third hook (1030), the fourth hook (1040), the seventh hook (1070), the eighth hook (1080), the eleventh hook (1110), and the twelfth hook (1120).

[0132] In an electronic device (901) according to one embodiment, the first opening (110) may have a first width in a direction in which the first hook (1010) and the second hook (1020) are arranged. The first opening (110) may have a second width different from the first width in a direction in which the third hook (1030) and the fourth hook (1040) are arranged.

[0133] For example, the distance between the outermost sides of the first hook (1010) and the second hook (1020) from the center of the protruding portion that is to be hooked onto the first opening (110) and the portion that connects the interposer (40) (e.g., the portion that becomes the pillar of the hook) may be formed as a third width corresponding to the first width.

[0134] For example, the distance between the outermost sides of the protruding portion that allows the third hook (1030) and the fourth hook (1040) to be hooked onto the first opening (110) and the portion connecting the interposer (40) (e.g., the portion that becomes the pillar of the hook) with respect to the center can be formed as a fourth width corresponding to the second width.

[0135] In an electronic device (901) according to one embodiment, the second opening (120) may have a first width in a direction in which the fifth hook (1050) and the sixth hook (1060) are arranged. The second opening (120) may have a second width in a direction in which the seventh hook (1070) and the eighth hook (1080) are arranged.

[0136] For example, the distance between the outermost sides of the fifth hook (1050) and the sixth hook (1060) from the center of the protruding portion that is to be hooked onto the second opening (120) and the portion that connects the interposer (40) (e.g., the portion that becomes the pillar of the hook) can be formed as the third width.

[0137] For example, the distance between the outermost sides of the protruding portion that allows the seventh hook (1070) and the eighth hook (1080) to be caught in the second opening (120) and the portion that connects the interposer (40) (e.g., the portion that becomes the pillar of the hook) based on the center can be formed as the fourth width.

[0138] In an electronic device (901) according to one embodiment, the third opening (130) may have a first width in a direction in which the ninth hook (1090) and the tenth hook (1100) are arranged. The third opening (130) may have a second width in a direction in which the eleventh hook (1110) and the twelfth hook (1120) are arranged.

[0139] For example, the distance between the outermost sides of the 9th hook (1090) and the 10th hook (1100) from the center of the protruding portion that is hooked to the third opening (130) and the portion that connects the interposer (40) (e.g., the portion that becomes the pillar of the hook) can be formed as the third width.

[0140] For example, the distance between the outermost sides of the protruding portion that allows the 11th hook (1110) and the 12th hook (1120) to be hooked onto the third opening (130) and the portion that connects the interposer (40) (e.g., the portion that becomes the pillar of the hook) based on the center can be formed as the fourth width.

[0141] FIG. 13 is a cross-sectional view of a portion taken along the line A-A' of FIG. 2, illustrating a case where a first hook (1010) and a second hook (1020) are caught on the edge of a first opening (110) in an electronic device (901) according to various embodiments. FIG. 14 is a drawing for explaining a case where a first hook (1010) and a second hook (1020) are caught on the edge of a first opening (110) in an electronic device (901) according to various embodiments. In FIGS. 13 and 14, an interposer (40) can be fastened to a printed circuit board (10) having a first thickness.

[0142] FIG. 15 is a cross-sectional view of a portion taken along the line B-B' of FIG. 2, showing a case where the third hook (1030) and the fourth hook (1040) are caught on the edge of the first opening (110) in an electronic device (901) according to various embodiments. FIG. 16 is a drawing for explaining a case where the third hook (1030) and the fourth hook (1040) are caught on the edge of the first opening (110) in an electronic device (901) according to various embodiments. In FIGS. 15 and 16, the interposer (40) can be fastened to a printed circuit board (10) having a second thickness.

[0143] Referring to FIGS. 13 to 16, in an electronic device (901) according to one embodiment, when an interposer (40) is fastened to a printed circuit board (10) having a first thickness, the first opening (110) may have a first width (e.g., w1 in FIG. 14) that is smaller than a third width that allows the first hook (1010) and the second hook (1020) to be caught on at least a portion of the edge of the first opening (110) in the protruding direction. The first opening (110) may have a second width (e.g., w2 in FIG. 14) that is larger than or equal to a fourth width that allows the third hook (1030) and the fourth hook (1040) to not be caught on at least a portion of the edge of the first opening (110) in the protruding direction.

[0144] In an electronic device (901) according to one embodiment, when the interposer (40) is fastened to a printed circuit board (10) having a second thickness, the first opening (110) may have a first width (e.g., w1 in FIG. 16) that is greater than or equal to a third width that prevents the first hook (1010) and the second hook (1020) from being caught on at least a portion of the edge of the first opening (110) in a protruding direction. The first opening (110) may have a second width (e.g., w2 in FIG. 16) that is smaller than the fourth width that allows the third hook (1030) and the fourth hook (1040) to be caught on at least a portion of the edge of the first opening (110).

[0145] Referring to FIGS. 13 to 16, in an electronic device (901) according to one embodiment, when an interposer (40) is fastened to a printed circuit board (10) having a first thickness, the second opening (120) may have a first width (e.g., w1 in FIG. 14) that is smaller than a third width that allows the fifth hook (1050) and the sixth hook (1060) to be caught on at least a portion of the edge of the second opening (120) in the protruding direction. The second opening (120) may have a second width (e.g., w2 in FIG. 14) that is larger than a fourth width that allows the seventh hook (1070) and the eighth hook (1080) to not be caught on at least a portion of the edge of the first opening (110) in the protruding direction.

[0146] In an electronic device (901) according to one embodiment, when the interposer (40) is fastened to a printed circuit board (10) having a second thickness, the second opening (120) may have a first width (e.g., w1 in FIG. 16) that is greater than or equal to a third width that prevents the fifth hook (1050) and the sixth hook (1060) from being caught on at least a portion of the edge of the second opening (120) in the protruding direction. The second opening (120) may have a second width (e.g., w2 in FIG. 16) that is smaller than a fourth width that allows the seventh hook (1070) and the eighth hook (1080) to be caught on at least a portion of the edge of the second opening (120) in the protruding direction.

[0147] Referring to FIGS. 13 to 16, in an electronic device (901) according to one embodiment, when an interposer (40) is fastened to a printed circuit board (10) having a first thickness, the third opening (130) may have a first width (e.g., w1 in FIG. 14) that is smaller than a third width that allows the ninth hook (1090) and the tenth hook (1100) to be caught on at least a portion of the edge of the third opening (130) in a protruding direction, and a second width (e.g., w2 in FIG. 14) that is larger than a fourth width that allows the eleventh hook (1110) and the twelfth hook (1120) to not be caught on at least a portion of the edge of the third opening (130). The third opening (130) may have a first width (e.g., w1 in FIG. 16) that is greater than or equal to a third width that prevents the ninth hook (1090) and the tenth hook (1100) from being caught on at least a portion of the edge of the third opening (130) in the protruding direction, and a second width (e.g., w2 in FIG. 16) that is less than a fourth width that allows the eleventh hook (1110) and the twelfth hook (1120) to be caught on at least a portion of the edge of the third opening (130).

[0148] FIG. 17 is an enlarged view of a first groove (240) portion of a cover (20) included in an electronic device (901) according to one embodiment.

[0149] Referring to FIGS. 4 and 17, in an electronic device (901) according to one embodiment, the second connection portion (200) may further include a first groove (240) recessed in the first direction along the periphery of the fourth opening (210), a second groove (250) recessed in the first direction along the periphery of the fifth opening (220), and a third groove (260) recessed in the first direction along the periphery of the sixth opening (230).

[0150] For example, the 13th hook (1130) and the 14th hook (1140) that pass through the 7th opening (310) and are caught on at least a portion of the edge of the 4th opening (210) have ends positioned on the inside of the first groove (240), and when the cover (20) is viewed in the first direction, at least a portion of the 13th hook (1130) and the 14th hook (1140) positioned on the inside of the first groove (240) can be visually exposed.

[0151] The 15th hook (1150) and the 16th hook (1160) that pass through the 8th opening (320) and are caught on at least a portion of the edge of the 5th opening (220) have ends positioned on the inside of the 2nd groove (250), and when the cover (20) is viewed in the first direction, at least a portion of the 13th hook (1130) and the 14th hook (1140) that are positioned on the inside of the 2nd groove (250) can be visually exposed.

[0152] The 17th hook and the 18th hook (1180) that pass through the 9th opening (330) and are caught on at least a portion of the edge of the 6th opening (230) have ends positioned on the inside of the 3rd groove (260), and when the cover (20) is viewed in the first direction, at least a portion of the 17th hook and the 18th hook (1180) positioned on the inside of the 3rd groove (260) can be visually exposed.

[0153] Fig. 18 is a front perspective view illustrating a first region (340) of a memory module (30) included in an electronic device (901) according to one embodiment. Fig. 19 is a rear perspective view illustrating a second region (350) of a memory module (30) included in an electronic device (901) according to one embodiment. Fig. 20 is a rear perspective view of a cover (20) included in an electronic device (901) according to one embodiment.

[0154] Referring to FIGS. 4 and 20, in an electronic device (901) according to one embodiment, the cover (20) may further include at least one grounding portion (270) formed on one side. The grounding portion (270) may be provided in multiple pieces as shown in the drawing, or may be provided in a shape that surrounds at least a part or all of the cover (20) along the edge side of the cover (20).

[0155] Referring to FIGS. 18 and 19, in an electronic device (901) according to one embodiment, a memory module (30) may include a first region (340) having at least a portion of a border formed of a conductive pattern on one side facing in a second direction, and a second region (350) having at least a portion formed of a conductive pattern except for an area where an interposer (40) is disposed on the other side facing in the first direction. The first region (340) and the second region (350) may be connected to a ground region of a printed circuit board.

[0156] For example, the first region (340) may be at least a portion of the shaded portion arranged along the border side in FIG. 18. The second region (350) may be at least a portion of the shaded portion excluding the portion (355) in contact with the interposer (40) in FIG. 19.

[0157] In an electronic device (901) according to one embodiment, at least one grounding portion (270) may be grounded to the first region (340), the second region (350), and the printed circuit board (10). The grounding portion (270) may be grounded to all of the first region (340), the second region (350), and the printed circuit board (10), thereby performing a function of electrically connecting the memory module (30) and the printed circuit board.

[0158] FIG. 21 is a cross-sectional view of a portion taken along the C-C' section of FIG. 2 in an electronic device (901) according to one embodiment.

[0159] Referring to FIGS. 18 to 21, in an electronic device (901) according to one embodiment, at least one ground portion (270) may include a first ground portion (272), a second ground portion (274), and a third ground portion (276). The first ground portion (272) may be formed by bending at least a portion of the cover (20) toward the inside of the cover (20). The first ground portion (272) may be in contact with the first region (340). The second ground portion (274) may be formed by bending at least a portion of the cover (20) toward the inside of the cover (20). The second ground portion (274) may be formed by bending the second ground portion (274) that is grounded to the second region (350) and at least a portion of the second ground portion (274) extending and bending toward the outside of the ground portion. The third ground portion (276) may be in contact with the printed circuit board (10). The grounding portion (270) can electrically connect the first region (340) and the second region (350) of the memory module (30) to the grounding region of the printed circuit board (10).

[0160] For example, the first ground (272) may have a part of the upper surface of the cover (20) bent inward and at least a part of the end may be grounded to the first area (340) of the memory module (30). The second ground (274) may have a part of the side surface of the cover (20) bent inward and formed in a shape that surrounds a part of the memory module (30), and may be grounded to the second area (350) of the memory module (30). The third ground (276) may have a shape in which at least a part of the end of the second ground (274) grounded to the second area (350) extends toward the outside of the cover (20), and the end may be grounded to the upper surface of the printed circuit board (10).

[0161] FIG. 22 is a cross-sectional view of a portion taken along the C-C' section of FIG. 2 during the assembly process in an electronic device (901) according to one embodiment.

[0162] Referring to FIGS. 18 to 19 and FIG. 22, in an electronic device (901) according to one embodiment, when the interposer (40) is connected to the cover (20) while being connected to the memory module (30), the first ground (272) may be grounded to the first region (340), and the second ground (274) may be grounded to the second region (350). For example, when the cover (20) is coupled after the memory module (30) and the interposer (40) are connected, the edge side of the memory module (30) may be in contact with at least a portion of the third ground (276) extending from the second ground (274) to the outside of the cover (20), and an external force may be applied to the third ground (276) outward. The second ground (274) and the third ground (276) elastically deformed by the memory module (30) are restored when the first area (340) of the memory module (30) is grounded to the first ground (272), so that the second ground (274) can be grounded to the second area (350) of the memory module (30). The distance between the first ground (272) and the second ground (274) can be configured to be at least equal to or narrower than the thickness of the memory module (30).

[0163] In an electronic device (901) according to one embodiment, when the interposer (40) is connected to the printed circuit board (10) while being connected to the memory module (30) and the cover (20), the third ground (276) may be grounded to the printed circuit board (10). For example, the third ground (276) may be grounded to the printed circuit board (10) in a state where the first ground (272) is grounded to the first region (340) and the second ground (274) is grounded to the second region (350). The first ground (272), the second ground (274), and the third ground (276) may maintain grounding with each electronic component through the elasticity of the bent portion.

[0164] Referring to FIGS. 2 to 3 and 22, in an electronic device (901) according to one embodiment, an interposer (40) can be connected to a memory module (30) by inserting a second connection portion (500) into a third connection portion (300).

[0165] In an electronic device (901) according to one embodiment, the cover (20) can be fastened to the interposer (40) and the memory module (30) by inserting the second fastening portion (500) into the second connecting portion (200) while the interposer (40) and the memory module (30) are fastened.

[0166] In an electronic device (901) according to one embodiment, a printed circuit board (10) can be fastened to an interposer (40), a memory module (30), and a cover (20) by inserting a first fastening portion (400) into a first connecting portion (100) while the interposer (40), the memory module (30), and the cover (20) are fastened.

[0167] That is, the interposer (40) can be sequentially connected to the memory module (30), the cover (20), and the printed circuit board (10). When the interposer (40) is connected to the memory module (30) and the cover (20), at least a part of at least one second connection portion (500) is visually exposed when the cover (20) is viewed in the first direction, so that the worker can visually check the assembly state of the interposer (40), the memory module (30), and the cover (20) during the assembly process. When the interposer (40) is connected to the printed circuit board (10), at least a part of at least one first connection portion (400) is visually exposed when the printed circuit board (10) is viewed in the second direction, so that the worker can visually check the assembly state of the interposer (40) and the printed circuit board during the assembly process.

[0168] Fig. 23 is a side view of an interposer (40) included in an electronic device (901) according to various embodiments. Fig. 24 is a front view of an interposer (40) included in an electronic device (901) according to various embodiments. Fig. 25 is an enlarged perspective view of a first protrusion (410) and a fourth protrusion (510) of an interposer (40) included in an electronic device (901) according to various embodiments.

[0169] Referring to FIGS. 23 to 25, in an electronic device (901) according to various embodiments, a first protrusion (410) may include a first hook (1010) and a third hook (1030) facing in a third direction perpendicular to the first direction, and a second hook (1020) and a fourth hook (1040) facing in a fourth direction opposite to the third direction.

[0170] In an electronic device (901) according to various embodiments, the second protrusion (420) may include a fifth hook (1050) and a seventh hook (1070) facing in a third direction, and a sixth hook (1060) and an eighth hook (1080) facing in a fourth direction.

[0171] In an electronic device (901) according to various embodiments, the third protrusion (430) may include a ninth hook (1090) and an eleventh hook (1110) facing in a third direction, and a tenth hook (1100) and a twelfth hook (1120) facing in a fourth direction.

[0172] In an electronic device (901) according to various embodiments, the interposer (40) can be fastened to the printed circuit board (10) by having the first hook (1010) and the second hook (1020), or the third hook (1030) and the fourth hook (1040) hook at least a portion of the edge of the first opening (110), the fifth hook (1050) and the sixth hook (1060), or the seventh hook (1070) and the eighth hook (1080) hook at least a portion of the edge of the second opening (120), and the ninth hook (1090) and the tenth hook (1100), or the eleventh hook (1110) and the twelfth hook (1120) hook at least a portion of the edge of the third opening (130).

[0173] In an electronic device (901) according to various embodiments, the first hook (1010) and the third hook (1030) may be formed as a single body, and the second hook (1020) and the fourth hook (1040) may be formed as a single body. For example, the first hook (1010) may be formed in a form extending in a first direction from the third hook (1030), and a portion protruding to be caught in the opening may be formed to protrude further in the third direction than the third hook (1030). The second hook (1020) may be formed in a form extending in the first direction from the fourth hook (1040), and a portion protruding to be caught in the opening may be formed to protrude further in the fourth direction than the fourth hook (1040).

[0174] In an electronic device (901) according to various embodiments, the fifth hook (1050) and the seventh hook (1070) may be formed as a single body, and the sixth hook (1060) and the eighth hook (1080) may be formed as a single body. For example, the fifth hook (1050) may be formed in a form extending in a first direction from the seventh hook (1070), and a portion protruding to be caught in the opening may be formed to protrude further in a third direction than the seventh hook (1070). The sixth hook (1060) may be formed in a form extending in a first direction from the eighth hook (1080), and a portion protruding to be caught in the opening may be formed to protrude further in a fourth direction than the eighth hook (1080).

[0175] In an electronic device (901) according to various embodiments, the ninth hook and the eleventh hook (1110) may be formed as a single body, and the tenth hook (1100) and the twelfth hook (1120) may be formed as a single body. For example, the ninth hook (1090) may be formed in a form extending in a first direction from the eleventh hook (1110), and a portion protruding to be caught in the opening may be formed to protrude further in a third direction than the eleventh hook (1110). The tenth hook (1100) may be formed in a form extending in a first direction from the twelfth hook (1120), and a portion protruding to be caught in the opening may be formed to protrude further in a fourth direction than the twelfth hook (1120).

[0176] In an electronic device (901) according to various embodiments, the first hook (1010), the second hook (1020), the fifth hook (1050), the sixth hook (1060), the ninth hook (1090), and the tenth hook (1100) may be formed such that the height from the point at which each hook is caught to one side of the interposer (40) is a first height.

[0177] In an electronic device (901) according to various embodiments, the third hook (1030), the fourth hook (1040), the seventh hook (1070), the eighth hook (1080), the eleventh hook (1110), and the twelfth hook (1120) may be formed such that the height from the point where each hook is caught to one side of the interposer (40) is a second height different from the first height.

[0178] The first height can be formed to be higher than the second height.

[0179] Referring to FIGS. 2 to 7, an interposer (40) according to one embodiment may include at least one first fastening portion (400) protruding in a first direction and inserted into at least one first connecting portion (100) included in a printed circuit board (10).

[0180] An interposer (40) according to one embodiment may include at least one second connecting portion (200) included in a cover (20) positioned to protrude in a second direction opposite to the first direction and cover at least a portion of a printed circuit board (10), and at least one second fastening portion (500) inserted into at least one third connecting portion (300) included in a memory module (30) positioned between the printed circuit board (10) and the cover (20) and formed at a position corresponding to at least one second connecting portion (200).

[0181] According to one embodiment, an interposer (40) can be fastened to a printed circuit board (10) through a first fastening portion (400).

[0182] An interposer (40) according to one embodiment may be configured so that at least a portion of at least one first fastening portion (400) is visually exposed when the printed circuit board (10) is viewed in the second direction.

[0183] According to one embodiment, the interposer (40) can be fastened to the cover (20) and the memory module (30) through the second fastening portion (500).

[0184] An interposer (40) according to one embodiment may be configured such that at least a portion of at least one second fastening portion (500) is visually exposed when the cover (20) is viewed in the first direction.

[0185] An interposer (40) according to one embodiment may be disposed, at least in part, between a memory module (30) and a printed circuit board (10).

[0186] Referring to FIGS. 3 and 7, in an interposer (40) according to one embodiment, the first connection portion (100) may include a first opening (110), a second opening (120), and a third opening (130) formed at different points.

[0187] In an interposer (40) according to one embodiment, the first fastening portion (400) may include a first protrusion (410) inserted into a first opening (110), a second protrusion (420) inserted into a second opening (120), and a third protrusion (430) inserted into a third opening (130).

[0188] In an interposer (40) according to one embodiment, the second connecting portion (200) may include a fourth opening (210), a fifth opening (220), and a sixth opening (230) formed at different points.

[0189] In an interposer (40) according to one embodiment, the third connecting portion (300) may include a seventh opening (310) formed at a position corresponding to the fourth opening (210), an eighth opening (320) formed at a position corresponding to the fifth opening (220), and a ninth opening (330) formed at a position corresponding to the sixth opening (230).

[0190] Referring to FIGS. 3 to 6, in an interposer (40) according to one embodiment, the second fastening portion (500) may include a fourth protrusion (510) inserted into the fourth opening (210) and the seventh opening (310), a fifth protrusion (520) inserted into the fifth opening (220) and the eighth opening (320), and a sixth protrusion (530) inserted into the sixth opening (230) and the ninth opening (330).

[0191] Referring to FIGS. 8 to 11, in an interposer (40) according to one embodiment, a first protrusion (410) may include a first hook (1010) facing in a third direction perpendicular to the first direction, a second hook (1020) facing in a fourth direction opposite to the third direction, a third hook (1030) facing in a fifth direction perpendicular to the first direction and different from the third direction, and a fourth hook (1040) facing in a sixth direction opposite to the fifth direction.

[0192] In an interposer (40) according to one embodiment, the second protrusion (420) may include a fifth hook (1050) facing in the third direction, a sixth hook (1060) facing in the fourth direction, a seventh hook (1070) facing in the fifth direction, and an eighth hook (1080) facing in the sixth direction.

[0193] In an interposer (40) according to one embodiment, the third protrusion (430) may include a ninth hook (1090) facing in a third direction, a tenth hook (1100) facing in a fourth direction, an eleventh hook (1100) facing in a fifth direction, and a twelfth hook (1120) facing in a sixth direction.

[0194] According to one embodiment, the interposer (40) can be fastened to the printed circuit board (10) by having the first hook (1010) and the second hook (1020), or the third hook (1030) and the fourth hook (1040) hook at least a portion of the edge of the first opening (110), the fifth hook (1050) and the sixth hook (1060), or the seventh hook (1070) and the eighth hook (1080) hook at least a portion of the edge of the second opening (120), and the ninth hook (1090) and the tenth hook (1100), or the eleventh hook (1110) and the twelfth hook (1120) hook at least a portion of the edge of the third opening (130).

[0195] Referring to FIGS. 6, 9, and 11, in an interposer (40) according to one embodiment, the fourth protrusion (510) may include a 13th hook (1130) facing in a third direction perpendicular to the first direction and a 14th hook (1140) facing in a fourth direction opposite to the third direction.

[0196] In an interposer (40) according to one embodiment, the fifth protrusion (520) may include a fifteenth hook (1150) facing in the third direction and a sixteenth hook (1160) facing in the fourth direction.

[0197] In an interposer (40) according to one embodiment, the sixth protrusion (530) may include a seventeenth hook (1170) facing in the third direction and an eighteenth hook (1180) facing in the fourth direction.

[0198] According to one embodiment, the interposer (40) can be fastened to the cover (20) and the memory module (30) by having the 13th hook (1130) and the 14th hook (1140) pass through the 7th opening (310) and hook at least a portion of the edge of the 4th opening (210), the 15th hook (1150) and the 16th hook (1160) pass through the 8th opening (320) and hook at least a portion of the edge of the 5th opening (220), and the 17th hook and the 18th hook (1180) pass through the 9th opening (330) and hook at least a portion of the edge of the 6th opening (230).

[0199] Referring to FIG. 12, in an interposer (40) according to one embodiment, the 13th hook (1130), the 14th hook (1140), the 15th hook (1150), the 16th hook (1160), the 17th hook (1170), and the 18th hook (1180) may be formed such that the height from the point at which each hook is caught to one side of the interposer (40) is a third height (e.g., h3 in FIG. 12). For example, the height from the part where the 13th hook (1130) and the 14th hook (1140) catch at least a portion of the edge of the fourth opening (210) to one side of the interposer (40) may be formed to be the third height, and the sum of the depths of the fourth opening (210) and the seventh opening (310) may be formed to be the same height as the third height. Accordingly, the cover (20) and the memory module (30) can be fastened to the interposer (40) with the play minimized or reduced by the 13th hook (1130), the 14th hook (1140), the 15th hook (1150), the 16th hook (1160), the 17th hook (1170), and the 18th hook (1180).

[0200] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0201] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0202] Various embodiments of the present document may be implemented as software (e.g., a program (940)) including one or more instructions stored in a storage medium (e.g., an internal memory (936) or an external memory (938)) readable by a machine (e.g., an electronic device (901)). For example, a processor (e.g., a processor (920)) of the machine (e.g., an electronic device (901)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0203] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0204] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0205] In the present disclosure, the functions or operations performed by the electronic device may be performed by one or more processors executing one or more instructions stored in a memory. The functions or operations of the electronic device mentioned in the present disclosure may be performed by one processor executing one or more instructions, or may be performed by a combination of multiple processors executing one or more instructions. The processor mentioned in the present disclosure may be understood to include circuitry for performing calculations or controlling other components of the electronic device. For example, the one or more processors may include a central processing unit (CPU), a microprocessor unit (MPU), an application processor (AP), a communication processor (CP), a neural processing unit (NPU), a system on a chip (SoC), or an integrated circuit (IC) configured to execute one or more instructions. The one or more processors may be configured to perform the operations of the electronic device described above.

[0206] In the present disclosure, a program (software module, software) may be stored in a non-volatile memory including a random access memory (RAM), a flash memory, a read only memory (ROM), an electrically erasable programmable read only memory (EEPROM), a magnetic disc storage device, a compact disc ROM (CD-ROM), digital versatile discs (DVDs) or other forms of optical storage devices, a magnetic cassette. Or, it may be stored in a memory formed by a combination of some or all of these. The memory may be formed by a single storage medium, or may be formed by a combination of a plurality of storage media. The one or more commands may be stored in a single storage medium, or may be distributed and stored in a plurality of storage media.

[0207] Additionally, the program may be stored on an attachable storage device that is accessible via a communication network such as the Internet, an intranet, a local area network (LAN), a wide LAN (WLAN), or a storage area network (SAN), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure via an external port. Additionally, a separate storage device on the communication network may be connected to a device performing an embodiment of the present disclosure.

[0208] In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed in the singular or plural form, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in the plural form may be composed of singular elements, or components expressed in the singular form may be composed of plural elements.

[0209] The specific implementations described in this disclosure are merely exemplary and do not limit the scope of the present disclosure in any way. For the sake of brevity, descriptions of conventional electronic components, control systems, software, and other functional aspects of the systems may be omitted.

[0210] Additionally, in the present disclosure, “comprising at least one of a, b, or c” may mean “comprising only a, including only b, including only c, or including a combination of two or more (including a and b, including b and c, including a and c, or including all of a, b, and c).

[0211] While the detailed description of this disclosure has described specific embodiments, it should be understood that various modifications are possible without departing from the scope of this disclosure. Therefore, the scope of this disclosure should not be limited to the described embodiments, but should be defined not only by the scope of the claims described below, but also by equivalents thereof.

[0212] In this disclosure, the term "if" will be understood to mean "when, upon," "in response to determining," or "in response to detecting," as the context requires. Similarly, "if it is determined to do," or "if [a stated condition or event] is detected," will optionally be understood to mean "upon determining," or "in response to determining," "upon detecting [a stated condition or event]," or "in response to detecting [a stated condition or event]."

[0213] The devices described above may be implemented as hardware components, software components, and / or a combination of hardware components and software components. For example, the devices and components described in the embodiments may be implemented using one or more general-purpose computers or special-purpose computers, such as a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a programmable logic unit (PLU), a microprocessor, or any other device capable of executing instructions and responding to them. A processing device (or processing circuit) may execute an operating system (OS) and one or more software applications running on the operating system. In addition, the processing device may access, store, manipulate, process, and generate data in response to the execution of the software. For ease of understanding, the processing device is sometimes described as being used alone; however, one of ordinary skill in the art will recognize that the processing device may include multiple processing elements and / or multiple types of processing elements. For example, a processing unit may include multiple processors, or a processor and a controller. Other processing configurations, such as parallel processors, are also possible.

[0214] Software may include a computer program, code, instructions, or a combination of one or more of these, which may configure a processing device to perform a desired operation or may independently or collectively command the processing device. The software and / or data may be embodied in any type of machine, component, physical device, computer storage medium, or device for interpretation by the processing device or for providing instructions or data to the processing device. The software may also be distributed over networked computer systems and stored or executed in a distributed manner. The software and data may be stored on one or more computer-readable recording media.

[0215] The method according to the embodiment may be implemented in the form of program commands that can be executed through various computer means and recorded on a computer-readable medium. In this case, the medium may be one that continuously stores a computer-executable program or one that temporarily stores it for execution or download. In addition, the medium may be various recording or storage means in the form of a single or multiple hardware combinations, and is not limited to a medium directly connected to a computer system, but may also be distributed over a network. Examples of the medium may include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical recording media such as CD-ROMs and DVDs, magneto-optical media such as floptical disks, and those configured to store program commands, including ROM, RAM, and flash memory. In addition, examples of other media may include recording or storage media managed by app stores that distribute applications, sites that supply or distribute various software, servers, etc.

[0216] Although the embodiments described above have been described by way of limited examples and drawings, those skilled in the art will appreciate that various modifications and variations can be made based on the above teachings. For example, appropriate results can still be achieved even if the described techniques are performed in a different order than described, and / or components of the described systems, structures, devices, circuits, etc. are combined or combined in a different manner than described, or are replaced or substituted with other components or equivalents.

Claims

1. In electronic devices, A printed circuit board comprising at least one first connector; A cover comprising at least one second connecting portion and arranged to cover at least a portion of the printed circuit board; A memory module comprising at least one third connector formed at a position corresponding to at least one second connector, and disposed between the printed circuit board and the cover; and An interposer comprising at least one first fastening portion protruding in a first direction and at least one second fastening portion protruding in a second direction opposite to the first direction, at least a portion of which is disposed between the memory module and the printed circuit board; At least one of the first fasteners: Inserted into at least one of the first connecting portions, the interposer is connected to the printed circuit board, When the printed circuit board is viewed in the second direction, at least a portion of the at least one first fastening portion is configured to be visually exposed, At least one second fastener is: The interposer is inserted into the at least one second connecting portion and the at least one third connecting portion to connect the interposer with the cover and the memory module, An electronic device configured such that at least a portion of the at least one second fastening portion is visually exposed when the cover is viewed in the first direction.

2. In claim 1, The above first connecting part is, comprising a first opening, a second opening and a third opening formed at different points; The above first fastening part is, An electronic device comprising a first protrusion inserted into the first opening, a second protrusion inserted into the second opening, and a third protrusion inserted into the third opening.

3. In claim 1, The above second connecting part is, Including the fourth opening, the fifth opening and the sixth opening formed at different points, The third connecting part is, It includes a seventh opening formed at a position corresponding to the fourth opening, an eighth opening formed at a position corresponding to the fifth opening, and a ninth opening formed at a position corresponding to the sixth opening. The above second fastening part is, An electronic device comprising a fourth protrusion inserted into the fourth opening and the seventh opening, a fifth protrusion inserted into the fifth opening and the eighth opening, and a sixth protrusion inserted into the sixth opening and the ninth opening.

4. In claim 2, The above first protrusion is, It includes a first hook facing in a third direction perpendicular to the first direction, a second hook facing in a fourth direction opposite to the third direction, a third hook facing in a fifth direction perpendicular to the first direction and different from the third direction, and a fourth hook facing in a sixth direction opposite to the fifth direction. The above second protrusion is, It includes a fifth hook facing in the third direction, a sixth hook facing in the fourth direction, a seventh hook facing in the fifth direction, and an eighth hook facing in the sixth direction, The third protrusion above is, including a ninth hook facing in the third direction, a tenth hook facing in the fourth direction, an eleventh hook facing in the fifth direction, and a twelfth hook facing in the sixth direction; The above interposer, An electronic device, wherein the first hook and the second hook, or the third hook and the fourth hook, are hooked to at least a portion of the first opening edge, the fifth hook and the sixth hook, or the seventh hook and the eighth hook are hooked to at least a portion of the second opening edge, and the ninth hook and the tenth hook, or the eleventh hook and the twelfth hook are hooked to at least a portion of the third opening edge, thereby being fastened to the printed circuit board.

5. In claim 3, The above fourth protrusion is, It includes a 13th hook facing in a third direction perpendicular to the first direction and a 14th hook facing in a fourth direction opposite to the third direction, The fifth protrusion above is, It includes a 15th hook facing in the third direction and a 16th hook facing in the fourth direction, The above sixth protrusion is, Including a 17th hook facing in the third direction, and an 18th hook facing in the fourth direction, The above interposer, An electronic device, wherein the cover and the memory module are fastened by the 13th hook and the 14th hook penetrating through the 7th opening and hooking on at least a portion of the 4th opening edge, the 15th hook and the 16th hook penetrating through the 8th opening and hooking on at least a portion of the 5th opening edge, and the 17th hook and the 18th hook penetrating through the 9th opening and hooking on at least a portion of the 6th opening edge.

6. In claim 4, The first hook, the second hook, the fifth hook, the sixth hook, the ninth hook and the tenth hook are, The height from the point where each hook is caught to one side of the interposer is formed as the first height, The third hook, the fourth hook, the seventh hook, the eighth hook, the eleventh hook and the twelfth hook are, An electronic device in which the height from the point where each hook is caught to one side of the interposer is formed as a second height different from the first height.

7. In claim 4, The above first opening is, The width in the direction in which the first hook and the second hook are arranged is formed as a first width, and the width in the direction in which the third hook and the fourth hook are arranged is formed as a second width different from the first width. The above second opening, The width in the direction in which the fifth hook and the sixth hook are arranged is formed as the first width, and the width in the direction in which the seventh hook and the eighth hook are arranged is formed as the second width. The above third opening is, An electronic device in which the width in the direction in which the 9th hook and the 10th hook are arranged is formed as the first width, and the width in the direction in which the 11th hook and the 12th hook are arranged is formed as the second width.

8. In claim 7, The above first opening is, The first hook and the second hook have a first width that allows them to be caught on at least a portion of the first opening edge, and the third hook and the fourth hook have a second width that allows them to not be caught on at least a portion of the first opening edge, or The first hook and the second hook have a first width that prevents them from being caught on at least a portion of the first opening edge, and a second width that allows the third hook and the fourth hook to be caught on at least a portion of the first opening edge. The above second opening, The fifth hook and the sixth hook have a first width that allows them to be caught on at least a portion of the second opening edge, and the seventh hook and the eighth hook have a second width that allows them to not be caught on at least a portion of the first opening edge, or The fifth hook and the sixth hook have a first width that prevents them from being caught on at least a portion of the second opening edge, and a second width that allows the seventh hook and the eighth hook to be caught on at least a portion of the second opening edge. The above third opening is, The ninth hook and the tenth hook have a first width that allows them to be caught on at least a portion of the third opening edge, and a second width that allows the eleventh hook and the twelfth hook to not be caught on at least a portion of the third opening edge, or An electronic device having a first width that prevents the ninth hook and the tenth hook from being caught on at least a portion of the third opening edge, and a second width that allows the eleventh hook and the twelfth hook to be caught on at least a portion of the third opening edge.

9. In claim 3, The above second connecting part is, An electronic device further comprising a first groove recessed in the first direction along the periphery of the fourth opening, a second groove recessed in the first direction along the periphery of the fifth opening, and a third groove recessed in the first direction along the periphery of the sixth opening.

10. In claim 1, The above cover, further comprising at least one grounding portion formed on one side, The above memory module, A first region having at least a portion of a border formed of a conductive pattern on one side facing the second direction, and a second region having at least a portion formed of a conductive pattern except for an area where the interposer is arranged on the other side facing the first direction, An electronic device, wherein at least one grounding portion is grounded to the first region, the second region, and the printed circuit board.

11. In claim 10, At least one of the grounding parts, A first ground formed by bending at least a portion of the cover toward the inside of the cover and grounded to the first area, A second ground formed by bending at least a portion of the cover toward the inside of the cover and grounded to the second area; and An electronic device comprising a third ground formed by extending at least a portion of the second ground and bending toward the outside of the second ground, and grounding the printed circuit board.

12. In claim 11, When the interposer is connected to the cover while being connected to the memory module, The first ground is grounded to the first area, and the second ground is grounded to the second area, When the interposer is connected to the printed circuit board while being connected to the memory module and the cover, An electronic device wherein the third ground is grounded to the printed circuit board.

13. In claim 1, The above interposer, The second fastening portion is inserted into the third connecting portion, thereby being fastened to the memory module, The above cover, In a state where the interposer and the memory module are connected, the second connection part is inserted into the second connection part, thereby connecting the interposer and the memory module. The above printed circuit board, An electronic device in which the interposer, the memory module, and the cover are connected, and the first connection part is inserted into the first connection part, thereby connecting the interposer, the memory module, and the cover.

14. In claim 2, The above first protrusion is, It includes a first hook and a third hook facing in a third direction perpendicular to the first direction, and a second hook and a fourth hook facing in a fourth direction opposite to the third direction, The above second protrusion is, It includes a fifth hook and a seventh hook facing in the third direction, and a sixth hook and an eighth hook facing in the fourth direction, The third protrusion above is, Including the 9th hook and the 11th hook facing in the third direction, and the 10th hook and the 12th hook facing in the fourth direction, The above interposer, An electronic device, wherein the first hook and the second hook, or the third hook and the fourth hook, are hooked to at least a portion of the first opening edge, the fifth hook and the sixth hook, or the seventh hook and the eighth hook are hooked to at least a portion of the second opening edge, and the ninth hook and the tenth hook, or the eleventh hook and the twelfth hook are hooked to at least a portion of the third opening edge, thereby being fastened to the printed circuit board.

15. At least one first fastening portion protruding in the first direction and inserted into at least one first connecting portion included in the printed circuit board; and At least one second connecting portion included in a cover that protrudes in a second direction opposite to the first direction and is arranged to cover at least a portion of the printed circuit board, and at least one second fastening portion included in a memory module arranged between the printed circuit board and the cover and inserted into at least one third connecting portion formed at a position corresponding to the at least one second connecting portion; It is connected to the printed circuit board through the first connection part, When the printed circuit board is viewed in the second direction, at least a portion of the at least one first fastening portion is configured to be visually exposed, It is connected to the cover and the memory module through the second connecting portion, When the cover is viewed in the first direction, at least a portion of the at least one second fastening portion is configured to be visually exposed, An interposer, at least a portion of which is disposed between the memory module and the printed circuit board.

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