Metallized glass substrate structure and preparation method therefor

Abstract

A metallized glass substrate structure and a preparation method therefor. The metallized glass substrate structure comprises a roughened and chemically modified glass plate (1) and a metallized circuit structure (4), wherein the glass plate (1) is connected to the metallized circuit structure (4) by means of an adhesive layer (3).

Description

Structure and fabrication method of metallized glass substrate

[0001] This application claims priority to Chinese Patent Application No. 202411194090.2, filed with the Chinese Patent Office on August 28, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of semiconductor technology, and for example to a metallized glass substrate structure and its fabrication method. Background Technology

[0003] In integrated circuit packaging technology, to improve the bonding strength between the substrate and the metallized circuit structure, it is usually necessary to roughen the surface of the substrate. The conventional approach is to use a roughening solution to etch and roughen the substrate surface to create a roughened structure. For glass substrates, the roughening time needs to be 30 minutes to ensure sufficient bonding strength between the circuitry and the substrate during subsequent circuit fabrication. The disadvantages of this roughening process are: long roughening time; and due to the high brittleness of glass, a high roughness can lead to the glass plate being prone to breakage.

[0004] Summary of the Invention

[0005] This application provides a metallized glass substrate structure and its preparation method. The metallized glass substrate structure prepared by this method can reduce the surface stress of the glass plate, improve the bonding strength between the metallized circuit structure and the glass plate, and make the glass plate less prone to breakage.

[0006] On one hand, this application provides a metallized glass substrate structure, including a glass plate that has undergone roughening and chemical modification treatment and a metallized circuit structure, wherein the glass plate is connected to the metallized circuit structure through an adhesive layer.

[0007] On the other hand, this application provides a method for preparing a metallized glass substrate structure, comprising:

[0008] A glass plate is provided, and the glass plate is subjected to roughening treatment and chemical modification treatment in sequence;

[0009] An adhesive layer is applied to the surface of the glass plate after roughening and chemical modification.

[0010] Metallized circuit structures are fabricated on the surface of the adhesive layer to obtain a metallized glass substrate structure. Attached Figure Description

[0011] The accompanying drawings used in the embodiments of this application will be briefly described below.

[0012] Figure 1 is a schematic diagram of the metallized glass substrate structure described in Embodiment 1 of this application.

[0013] In the picture:

[0014] 1. Glass plate; 1a. Roughened interface; 2. Bonding layer; 3. Adhesive layer; 4. Metallized circuit structure; 41. Seed layer; 42. Redistribution layer. Detailed Implementation

[0015] The technical solution of this application will be described below with reference to the accompanying drawings and specific embodiments.

[0016] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this patent. To better illustrate the embodiments of this application, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual product dimensions. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0017] In the accompanying drawings of the embodiments of this application, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0018] In the description of this application, unless otherwise expressly specified and limited, the term "connection" or similar designation indicating a connection between components should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0019] Embodiments of this application provide a low-stress, high-bonding-strength metallized glass substrate structure, comprising a glass plate that has undergone roughening and chemical modification treatment and a metallized circuit structure, wherein the glass plate is connected to the metallized circuit structure through an adhesive layer.

[0020] As an intermediary layer between the glass plate and the metallized circuit structure, the adhesive layer can absorb and reduce the stress on the glass plate, thereby reducing the probability of the glass plate breaking. Furthermore, after the glass plate undergoes roughening and chemical modification treatment, the bonding strength between the metallized circuit structure and the glass plate can be improved.

[0021] In an optional embodiment, the glass plate has a plurality of through holes along its thickness direction, and the surface of the glass plate along its thickness direction and the walls of the through holes are roughened and chemically modified. The adhesive layer extends from both sides of the glass plate along its thickness direction to cover the walls of the through holes.

[0022] In an optional embodiment, the adhesive layer is made of any one or a composite of at least two of the following: benzocyclobutene (BCB) resin, polyimide (PI) resin, aromatic biphenyl formaldehyde (ABF) resin, epoxy resin, phenolic resin, polytetrafluoroethylene resin, acrylic resin, and their derivatives.

[0023] In an optional embodiment, the thickness of the adhesive layer is 0.01 μm to 0.25 mm.

[0024] In an optional embodiment, after the glass plate is roughened, a roughened interface is formed on the surface of the glass plate, and a bonding layer obtained by chemical modification is attached to the roughened interface, the bonding layer being located between the roughened interface and the adhesive layer.

[0025] In an alternative implementation, the roughness Ra of the roughened interface is 1 nm to 10 μm.

[0026] On the other hand, embodiments of this application provide a method for preparing a low-stress, high-bonding-strength metallized glass substrate structure, comprising the following steps:

[0027] S10. Provide a glass plate, and subject the glass plate to roughening treatment and chemical modification treatment in sequence;

[0028] S20. An adhesive layer is applied to the surface of the glass plate after roughening and chemical modification.

[0029] S30. A metallized circuit structure is fabricated on the surface of the adhesive layer to obtain a metallized glass substrate structure with low stress and high bonding strength.

[0030] In an optional implementation, step S10 includes:

[0031] S10a. Provide a glass plate and perform a hole-making process along the thickness direction of the glass plate to form a through hole;

[0032] S10b: The surface of the glass plate and the walls of the through holes are structurally treated by a roughening process to form a roughened interface;

[0033] S10c. Chemical modification treatment is performed on the roughened interface to form a bonding layer attached to the roughened interface.

[0034] Step S20 involves attaching an adhesive layer to the surface of the bonding layer.

[0035] The roughening process involves using a roughening solution to roughen the surface of the glass plate (structural treatment), creating a roughened interface and increasing the surface area of ​​the glass plate to improve the bonding strength between the glass plate and the subsequently fabricated metallized circuit structure. The composition of the roughening solution and the roughening process can adopt those found in related technologies.

[0036] In an optional embodiment, after step S10b, the method further includes: performing a surface hardening treatment on the glass plate with a roughened interface, so that the hardened glass plate can bond more firmly and stably with the bonding layer and adhesive layer.

[0037] In an optional embodiment, surface hardening treatment refers to tempering or alkali metal infiltration strengthening treatment of the glass plate. The alkali metal infiltration strengthening treatment refers to immersing the glass plate in an alkali metal solution, so that the alkali metal penetrates into the crystal structure of the glass plate surface, thereby changing the crystal structure of the glass plate surface and making the crystal lattice of the glass plate surface denser.

[0038] The tempering process can be performed using conventional tempering methods.

[0039] Alkali metal strengthening treatment is selected from any one of K strengthening treatment, Na strengthening treatment, and Li strengthening treatment.

[0040] In one optional embodiment, the temperature of the alkali metal solution is 400℃-800℃. In another optional embodiment, the temperature of the alkali metal solution is 450℃-750℃. In one optional embodiment, the immersion time of the glass plate in the alkali metal solution is 10 min-6 h. In another optional embodiment, the immersion time of the glass plate in the alkali metal solution is 30 min-5 h.

[0041] In an optional embodiment, the concentration of the alkali metal solution is 10 wt.% to 55 wt.%.

[0042] In one optional embodiment, the alkali metal solution is selected from any one of the chlorides, sulfates, or nitrates of Na, K, or Li. For example, the alkali metal solution is selected from any one of NaCl solution, KCl solution, LiCl solution, Na₂SO₄ solution, K₂SO₄ solution, Li₂SO₄ solution, NaNO₃ solution, KNO₃ solution, and LiNO₃ solution. In other embodiments, a combination of at least two of the alkali metal solutions may also be selected, and specific details will not be elaborated further.

[0043] In an optional implementation, the structuring process in step S10 takes no more than 20 minutes, which can give the metallized circuit structure good bonding strength.

[0044] In an optional embodiment, the roughness of the roughened interface formed after the structuring treatment of the glass plate is Ra = 1nm-10μm, which can be Ra = 10nm-100nm, or Ra = 20nm-60nm, or Ra = 25nm-50nm.

[0045] In an optional embodiment, in step S20, the bonding layer is made of a nitrogen-containing silane coupling agent, water glass, or glass powder sintered together, which can improve the bonding strength between the metallized circuit structure and the glass plate.

[0046] In an optional embodiment, in step S30, the adhesive layer is made of PI resin, ABF resin, epoxy resin, or phenolic resin.

[0047] In an optional embodiment, in step S30, the thickness of the adhesive layer is 0.01μm-0.25mm, optionally 0.05μm-0.2mm.

[0048] The bonding layer is formed by the hydrolysis products of a silane coupling agent adhering to the glass plate surface. This reduces the surface stress of the glass plate and, combined with the roughened interface, maximizes the bonding strength between the metallized circuit structure and the glass plate. The silane coupling agent can be a nitrogen-containing silane coupling agent. For example, immersing the structured glass plate in the hydrolysis products of the nitrogen-containing silane coupling agent for 5 seconds to 10 minutes, optionally 1 minute to 8 minutes, will form a bonding layer on the glass plate surface. The hydrolysis process of the nitrogen-containing silane coupling agent can employ methods from related technologies.

[0049] In an optional embodiment, the metallized circuit structure includes conductive pillars within a through-hole and circuit layers attached to adhesive layers on both sides of a glass plate. The circuit layers on both sides are connected by conductive pillars. The hole wall of the through-hole is a roughened interface, and a bonding layer and an adhesive layer are attached to the hole wall. The conductive pillar includes a seed layer attached to the adhesive layer and a columnar conductive structure attached to the seed layer. The circuit layer includes a seed layer and a redistribution layer located on the seed layer.

[0050] The technical solution of this application will be described below with specific embodiments.

[0051] Example 1

[0052] The steps for fabricating the metallized glass substrate structure in this embodiment are as follows:

[0053] (1) Provide a glass plate 1 and use a roughening liquid to roughen the glass plate 1 (i.e. use a roughening process to perform structural treatment). The treatment time is 3 min, and a roughened interface 1a is formed. The roughness of the roughened interface 1a is Ra = 35 nm.

[0054] (2) Place glass plate 1 in a 20 wt.% NaCl solution and soak it at 500°C for 4 hours to allow Na ions to penetrate into the surface of glass plate 1.

[0055] (3) A bonding layer 2 is formed on the roughened interface 1a of the glass plate 1. The bonding layer 2 is prepared by providing a nitrogen-containing silane coupling agent and hydrolyzing the nitrogen-containing silane coupling agent to obtain a hydrolysis product (refer to the coating formation method in patent CN112951800A). The hydrolysis product is dipped onto the surface of the glass plate 1 with the roughened interface 1a. Dipping is equivalent to immersion, and the dipping time is 3 minutes.

[0056] (4) PI resin (i.e. adhesive layer 3) is attached to bonding layer 2. The thickness of PI resin (the maximum distance between the outer surface of PI resin and the glass plate) is 6μm.

[0057] (5) A seed layer 41 is prepared on the surface of PI resin by vacuum sputtering;

[0058] (6) Press a photosensitive film onto the seed layer 41, and expose and develop the photosensitive film to form a patterned window;

[0059] (7) Create a redline layer 42 in the graphical window by electroplating;

[0060] (8) Remove the residual photosensitive film and etch the seed layer 41 exposed to the redistribution layer 42 to obtain the metallized glass substrate structure shown in Figure 1.

[0061] As shown in Figure 1, the metallized glass substrate structure prepared by the above method includes:

[0062] Glass plate 1, the surface of glass plate 1 has a roughened interface 1a, the roughness of the roughened interface 1a Ra = 35nm, the roughness range Rz is less than 1μm; metallic Na is diffused into the roughened interface 1a;

[0063] A bonding layer 2 is attached to the surface of a glass plate 1 having a roughened interface 1a;

[0064] A PI resin layer (adhesive layer 3) with a thickness of 6μm is attached to the bonding layer 2;

[0065] Referring to Figure 1, the metallized circuit structure 4 includes a seed layer 41 attached to the PI resin layer and a redistribution layer 42 located on the seed layer 41.

[0066] Example 2

[0067] Referring to Figure 1, the steps for fabricating the metallized glass substrate structure in this embodiment are as follows:

[0068] (1) A glass plate 1 is provided, and a roughening liquid is used to roughen the glass plate 1 (i.e., the roughening process is used to perform structural treatment). The treatment time is 2 min, and a roughened interface 1a is formed. The roughness of the roughened interface 1a is Ra = 25 nm.

[0069] (2) Place glass plate 1 in a KNO3 solution with a concentration of 50 wt.% and soak it at 700°C for 1 hour to allow metal K to penetrate into the crystal lattice on the surface of glass plate 1.

[0070] (3) A bonding layer 2 is formed on the roughened interface 1a of the glass plate 1. The bonding layer 2 is prepared by providing a nitrogen-containing silane coupling agent and hydrolyzing the nitrogen-containing silane coupling agent to obtain a hydrolysis product (refer to the coating formation method in patent CN112951800A). The hydrolysis product is dipped onto the surface of the glass plate 1 with the roughened interface 1a. Dipping is equivalent to immersion, and the dipping time is 5 minutes.

[0071] (4) Apply epoxy resin (i.e., adhesive layer 3) to bonding layer 2. The thickness of epoxy resin (the maximum distance between the outer surface of epoxy resin and the glass plate) is 0.1 mm.

[0072] (5) A seed layer 41 is prepared on the surface of epoxy resin by vacuum sputtering;

[0073] (6) Press a photosensitive film onto the seed layer 41, and expose and develop the photosensitive film to form a patterned window;

[0074] (7) Create a redline layer 42 in the graphical window by electroplating;

[0075] (8) Remove the residual photosensitive film and etch the seed layer 41 exposed to the redistribution layer 42 to obtain the metallized glass substrate structure shown in Figure 1.

[0076] The structure of the metallized glass substrate in this embodiment is basically the same as that in Embodiment 1 above, except that:

[0077] The roughness Ra of the roughened interface 1a of glass plate 1 is 25 nm; metal K is incorporated into the roughened interface 1a.

[0078] The thickness of the epoxy resin (adhesive layer 3) is 0.1 mm.

[0079] Example 3

[0080] Referring to Figure 1, the steps of the fabrication method of the metallized glass substrate structure in this embodiment are as follows:

[0081] (1) Provide a glass plate 1 and use a roughening liquid to roughen the glass plate 1 (i.e. use a roughening process to perform structural treatment). The treatment time is 4 min to form a roughened interface. The roughness of the roughened interface Ra = 45 nm is measured.

[0082] (2) Place glass plate 1 in a 20 wt.% Li2SO4 solution and soak it at 550°C for 2.5 h to allow metallic Li to penetrate into the crystal lattice on the surface of glass plate 1.

[0083] (9) A bonding layer 2 is formed on the roughened interface 1a of the glass plate 1. The bonding layer 2 is prepared by providing a nitrogen-containing silane coupling agent and hydrolyzing the nitrogen-containing silane coupling agent to obtain a hydrolysis product (refer to the coating formation method in patent CN112951800A). The hydrolysis product is dipped onto the surface of the glass plate 1 with the roughened interface 1a. Dipping is equivalent to immersion, and the dipping time is 6 minutes.

[0084] (3) ABF resin (i.e. adhesive layer 3) is vacuum-pressed onto the surface of bonding layer 2, and the thickness of ABF resin layer (the maximum distance between the outer surface of ABF resin and the glass plate) is 0.4 mm;

[0085] (4) A seed layer 41 is prepared on the surface of the ABF resin layer by vacuum sputtering;

[0086] (5) Press a photosensitive film onto the seed layer 41 and expose and develop the photosensitive film to form a patterned window;

[0087] (6) Create a redline layer 42 in the graphical window by electroplating;

[0088] (7) Remove the residual photosensitive film and etch the seed layer 41 exposed to the redistribution layer 42.

[0089] The structure of the metallized glass substrate in this embodiment is basically the same as that in Embodiment 1 above, except that:

[0090] The roughness Ra of the roughened interface 1a of glass plate 1 is 45 nm; metallic Li is incorporated into the roughened interface 1a.

[0091] The thickness of the ABF resin layer (adhesive layer 3) is 0.4 mm.

[0092] Example 4

[0093] This embodiment is basically the same as the above embodiment 1, except that step (2) is performed on the surface of the glass plate 1 with the roughened interface 1a.

[0094] Example 5

[0095] This embodiment is basically the same as Embodiment 1 above, except that step (2) is not included.

[0096] Comparative Example 1

[0097] The fabrication steps of the metallized glass substrate structure in this comparative example are as follows:

[0098] (1) Provide a glass plate, and attach a PI resin layer to the surface of the glass plate. The thickness of the PI resin layer (the maximum distance between the outer surface of the PI resin and the glass plate) is 6μm.

[0099] (2) A seed layer is prepared on the surface of the PI resin layer by vacuum sputtering;

[0100] (3) Press a photosensitive film onto the seed layer and expose and develop the photosensitive film to form a patterned window;

[0101] (4) Create a redline layer in the graphical window by electroplating;

[0102] (5) Remove the residual photosensitive film and etch the seed layer exposed to the redistribution layer.

[0103] The metallized glass substrate structure prepared by the above method includes:

[0104] A glass plate and a PI resin layer (adhesive layer) are attached to the surface of the glass plate, the PI resin layer (adhesive layer) having a thickness of 6μm.

[0105] The metallized circuit structure includes a seed layer attached to a PI resin layer and a redistribution layer located on the seed layer.

[0106] Comparative Example 2

[0107] This comparative example is basically the same as Example 1 above, except that steps (2) and (3) are not included.

[0108] Comparative Example 3

[0109] This comparative example is basically the same as Example 1 above, except that step (3) is not included.

[0110] In the above embodiments, the roughening fluid used is the roughening fluid in the related art.

[0111] The metallized glass substrate structure samples prepared in Examples 1-5 and Comparative Examples 1-3 were tested according to the test standard "IPC-TM-650 2.4.8C:1994" to test the peel strength between the metallized circuit structure and the glass plate, that is, the bonding strength between the metallized circuit structure and the glass plate of the metallized glass substrate structure. The results are shown in Table 1.

[0112] Table 1. Bond strength between metallized circuit structure and glass plate

[0113] As can be seen from Table 1, the method of this application can effectively improve the bonding strength between the metallized circuit structure and the glass plate.

Claims

1. A metallized glass substrate structure, comprising a glass plate that has undergone roughening and chemical modification treatment, and a metallized circuit structure, wherein the glass plate is connected to the metallized circuit structure through an adhesive layer.

2. The metallized glass substrate structure according to claim 1, wherein, The glass plate has multiple through holes along its thickness direction. The surface of the glass plate along its thickness direction and the walls of the through holes are both subjected to the roughening treatment and chemical modification treatment. The adhesive layer extends from both sides of the glass plate along its thickness direction to cover the walls of the through holes.

3. The metallized glass substrate structure according to claim 1, wherein, The adhesive layer is made of at least one of the following: benzocyclobutene (BCB) resin, polyimide (PI) resin, aromatic diphenylformaldehyde (ABF) resin, epoxy resin, phenolic resin, polytetrafluoroethylene (PTFE) resin, acrylic resin, and derivatives of the aforementioned ABF resin, epoxy resin, phenolic resin, PTFE resin, and acrylic resin.

4. The metallized glass substrate structure according to claim 1, wherein, The thickness of the adhesive layer is 0.01μm-0.25mm.

5. The metallized glass substrate structure according to claim 1, wherein, After the roughening treatment, a roughened interface is formed on the surface of the glass plate, and a bonding layer obtained by the chemical modification treatment is attached to the roughened interface. The bonding layer is located between the roughened interface and the adhesive layer.

6. The metallized glass substrate structure according to claim 5, wherein, The roughness of the roughened interface is Ra = 1 nm - 10 μm.

7. A method for preparing a metallized glass substrate structure, used to prepare the metallized glass substrate structure according to any one of claims 1-6, the method comprising: A glass plate is provided, and the glass plate is subjected to roughening treatment and chemical modification treatment in sequence; An adhesive layer is applied to the surface of the glass plate after the roughening and chemical modification treatment. A metallized circuit structure is fabricated on the surface of the adhesive layer to obtain a metallized glass substrate structure.

8. The method for preparing a metallized glass substrate structure according to claim 7, wherein, The glass plate is provided, and the glass plate is subjected to roughening treatment and chemical modification treatment in sequence, including: The glass plate is provided, and a hole is formed along the thickness direction of the glass plate to form a through hole; The surface of the glass plate and the walls of the through holes are structurally treated by a roughening process to form a roughened interface. The roughened interface is chemically modified to form a bonding layer attached to the roughened interface; The process of attaching an adhesive layer to the surface of the modified glass plate includes: An adhesive layer is attached to the surface of the bonding layer.

9. The method for preparing a metallized glass substrate structure according to claim 8, further comprising, after performing a roughening process on the surface of the glass plate and the hole walls of the through-hole to form a roughened interface: The glass plate with the roughened interface is subjected to surface hardening treatment.

10. The method for preparing a metallized glass substrate structure according to claim 9, wherein, The surface hardening treatment of the glass plate with a roughened interface includes: The glass plate having the roughened interface is tempered; or The glass plate having the roughened interface is subjected to alkali metal infiltration strengthening treatment, which includes immersing the glass plate in an alkali metal solution to allow the alkali metal to infiltrate into the glass plate.

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