Thermally conductive pad and electronic device

Abstract

Provided in the present application are a thermally conductive pad and an electronic device. The thermally conductive pad comprises a thermally conductive layer and an edge-wrapping layer, wherein the thermally conductive layer comprises electrically conductive materials, the thermally conductive layer having a first surface and a second surface arranged opposite each other, and the thermally conductive layer having a peripheral surface located between the first surface and the second surface; the edge-wrapping layer comprises a side edge-wrapping portion, the side edge-wrapping portion surrounding the peripheral surface of the thermally conductive layer, and the side edge-wrapping portion having no hollowed-out structure; and the edge-wrapping layer further comprises extension portions that extend from the side edge-wrapping portion to the first surface and the second surface of the thermally conductive layer, at least some extension portions having a hollowed-out structure. In the present application, the side surface of the thermally conductive layer having no hollowed-out structure can reduce the risk of a short circuit caused by particle shedding from the thermally conductive layer. The provision of hollowed-out structures on the first surface and the second surface of the thermally conductive layer reduces the area of the edge-wrapping layer covering the thermally conductive layer, such that the area of the thermally conductive layer exposed to the external environment is increased, improving the thermal conduction efficiency of the thermally conductive layer, thereby improving the heat dissipation effect and prolonging the service life of the thermally conductive pad when applied to the electronic device.

Description

Thermal pads and electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202411187060.9, filed on August 27, 2024, entitled “Thermal Conductive Pad and Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic equipment technology, and more specifically to a thermal pad and an electronic device. Background Technology

[0003] With the rapid development of various electronic products, the performance of electronic components has also improved dramatically. However, this performance enhancement has also increased the heat generated by these devices. If the heat generated during operation is not dissipated in a timely manner, it can significantly affect the working condition of internal components, and in severe cases, even reduce their lifespan or cause them to fail, resulting in serious quality problems.

[0004] To address the heat dissipation problem of electronic products, conductive pads and heat dissipation devices are typically used on electronic components to cool down the heat-generating components. To improve the thermal conductivity of thermal pads, researchers use conductive materials as the base material to increase their thermal conductivity coefficient. However, the addition of conductive materials can reduce the mechanical properties of the thermal pads. Under long-term pressure and use, debris may fall from the edges of the thermal pads, causing short circuits on the circuit boards and affecting the safety of electronic products.

[0005] Application content

[0006] In view of this, the present application provides a thermally conductive pad and an electronic device. The thermally conductive pad of the present application has the characteristics of high protection and low thermal resistance, which can not only improve the thermal conduction efficiency of the thermally conductive pad, but also improve the safety of the thermally conductive pad in use, thereby improving the overall performance of the thermally conductive pad.

[0007] In a first aspect, embodiments of this application provide a thermally conductive pad, comprising:

[0008] A thermally conductive layer comprising a conductive material, the thermally conductive layer having a first surface and a second surface disposed opposite to each other, and the thermally conductive layer having a peripheral surface located between the first surface and the second surface;

[0009] The edge-sealing layer includes a side edge portion surrounding the peripheral surface of the heat-conducting layer, the side edge portion not having a hollow structure; the edge-sealing layer also includes an extension portion extending from the side edge portion to the first surface and the second surface of the heat-conducting layer, at least a portion of the extension portion having a hollow structure.

[0010] In the above-described solution, this application provides a side-edge portion on the peripheral surface of the thermally conductive layer containing conductive material. This side-edge portion does not have a perforated structure, effectively protecting the peripheral surface of the thermally conductive layer and preventing powder and debris shedding from the conductive material, thus improving the safety of the thermal pad. By providing extensions on the first and second surfaces of the thermally conductive layer, at least a portion of these extensions have a perforated structure. The presence of this perforated structure reduces the area covered by the edge layer on the thermally conductive layer, thereby increasing the area of ​​the thermally conductive layer exposed to the external environment. This not only improves the heat conduction efficiency of the thermally conductive layer but also reduces thermal resistance. Furthermore, due to the perforated structure, the width of the extension does not need to be sacrificed to ensure the connection quality between the extension and the thermally conductive layer. This application can effectively balance the thermal resistance degradation of the edge layer and the connection effectiveness between the edge layer and the thermally conductive layer, improving the overall performance of the thermal pad.

[0011] In some possible implementations, the hollow structure includes a hollow portion and a solid portion, with at least a portion of the solid portion completely covering the periphery of the hollow portion.

[0012] In some embodiments of the above scheme, all the perforated portions are completely covered by the solid portions, which can ensure the mechanical properties of the perforated structure, improve the structural stability of the perforated structure, and extend the service life of the thermal pad. In other embodiments, some of the perforated portions are completely covered by the solid portions, while some of the perforated portions are not completely covered by the solid portions; these parts of the perforated portions can be partially covered by the solid portions. For example, the perforated structure is a mesh structure. The mesh structure can increase the contact points between the extension and the thermal conductive layer, and make the stress distribution applied by the extension on the thermal conductive layer more uniform, improving the tightness of the connection between the extension and the thermal conductive layer, and extending the service life of the thermal pad. When preparing the perforated structure, a whole film layer can be prepared on the first and second surfaces of the thermal conductive layer, and then the film layer can be perforated to prepare the perforated portions; the untreated parts are the solid portions.

[0013] In some possible implementations, the hollow structure includes a hollow portion and a solid portion, with the solid portion partially covering the periphery of the hollow portion.

[0014] In the above scheme, the solid portion partially covers the periphery of the hollow portion. For example, the solid portion B can be multiple protrusions arranged in the edge regions of the first surface 1A and the second surface, with gaps between adjacent protrusions; these gaps constitute the hollow portion. This arrangement ensures the mechanical properties of the hollow structure. The hollow portion is partially exposed to the external environment, which helps increase the contact area between the heat-conducting layer and the electronic components, improving the heat conduction efficiency of the heat-conducting pad. When fabricating the hollow structure, a complete film layer can be prepared on the first and second surfaces of the heat-conducting layer, and then the film layer can be hollowed out to create the hollow portion; the untreated portion is the solid portion.

[0015] In some possible implementations, the area of ​​the hollowed-out portion in the hollowed-out structure accounts for 10% to 90%.

[0016] In the above scheme, the area ratio of the hollowed-out portion in the hollowed-out structure can be 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, or 90%, etc. Within the above-mentioned limits, it is possible to ensure contact between the extension and the heat-conducting layer to effectively protect the heat-conducting layer, while also allowing the heat-conducting layer to contact the electronic components and heat dissipation devices separately during compression, thereby improving heat conduction efficiency. If the area ratio of the hollowed-out portion in the hollowed-out structure is less than 10%, the contact area between the extension and the heat-conducting layer is too large, and the effect of improving heat dissipation and reducing thermal resistance degradation is not obvious. If the area ratio of the hollowed-out portion in the hollowed-out structure is greater than 90%, there are too many hollowed-out portions, which reduces the mechanical strength of the extension, making it prone to deformation or damage under mechanical pressure, and also resulting in insufficient protection of the peripheral surface of the heat-conducting layer by the extension.

[0017] In some possible implementations, the extension includes a first extension and a second extension, the first extension being disposed on the first surface and having a hollow structure, and the second extension being disposed on the second surface and not having a hollow structure.

[0018] In the above solution, the heat transferred between the first extension with the hollow structure and the thermal pad during pressure or operation is mainly conducted from the first extension to the heat dissipation device, achieving high single-sided protection and low thermal resistance of the thermal pad. The second extension is used to provide electrical insulation and prevent contamination around electronic components, thereby preventing short circuits or arcing inside the electronic equipment.

[0019] In some possible implementations, the extension includes a first extension and a second extension, the first extension being disposed on the first surface and having a first cutout, and the second extension being disposed on the second surface and having a second cutout.

[0020] In the above solution, during the use of the thermal pad, the thermally conductive layer protrudes from the first and second hollow parts of the hollow structure, so that the thermally conductive layer comes into contact with the electronic device and the heat dissipation device respectively, thereby improving the heat dissipation efficiency of the thermal pad and reducing the thermal resistance degradation of the thermal pad.

[0021] In some possible implementations, the first cutout portion and the second cutout portion are arranged opposite to each other.

[0022] In the above scheme, the first and second hollowed-out parts are arranged opposite to each other, and the heat-conducting layer directly contacts the electronic components and heat dissipation devices after compression, which is beneficial to improving the heat conduction efficiency of the heat-conducting pad.

[0023] In some possible implementations, the first cutout portion and the second cutout portion are offset.

[0024] In the above solution, the first and second cutout portions are staggered. During the compression process of the thermal pad, the two-layer structure of the extension portion can be compressed into a single layer, reducing the thickness of the thermal pad and thus reducing its volume percentage within the electronic device. Furthermore, the staggered arrangement of the first and second cutout portions improves the uniformity of stress distribution on the thermal pad, preventing localized overheating and extending the lifespan of both the thermal pad and the electronic device containing it.

[0025] In some possible implementations, the maximum extension width of the extension from the side edge to the first surface of the heat-conducting layer is 0.1 mm to 1 mm; and / or the maximum extension width of the extension from the side edge to the second surface of the heat-conducting layer is 0.1 mm to 1 mm.

[0026] In the above scheme, the maximum extension width of the extension portion extending from the side edge to the first surface of the heat-conducting layer can be 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, or 1mm, etc. The maximum extension width of the extension portion extending from the side edge to the second surface of the heat-conducting layer can be 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, or 1mm, etc. Within the above-mentioned limits, the maximum extension width adjustment range of the extension portion in this application is relatively wide. This not only avoids the warping and delamination problems caused by the excessively small width of the existing extension portion, ensuring a tight connection between the extension portion and the heat-conducting layer without sacrificing part of the extension portion's width to guarantee the connection quality between the extension portion and the heat-conducting layer; it also promotes the heat transfer of electronic devices and improves the heat transfer efficiency of the heat-conducting pad.

[0027] In some possible implementations, the material of the edging layer includes at least one of polymer, foam, woven fabric and metal.

[0028] In the above-mentioned solutions, the polymer includes at least one of silicone rubber, polyimide (PI), polyether ether ketone (PEEK), polytetrafluoroethylene (PTFE), and polyurethane (PU). The metal material can be at least one of stainless steel, gold, silver, copper, aluminum, zinc, and tin foil. The polymer-based edge layer provides excellent insulation and beneficial chemical stability, preventing electrical short circuits with electronic devices and extending the lifespan of the thermal pad. The foam-based edge layer facilitates the compression and application of the thermal pad. The fiber-woven fabric and metal-based edge layers possess good thermal conductivity and mechanical strength, contributing to improved overall thermal conductivity and lifespan of the thermal pad.

[0029] In some possible implementations, the thickness of the edging layer is 1 μm to 100 μm.

[0030] In the above-described scheme, the thickness of the edge-sealing layer can be 1μm, 10μm, 30μm, 50μm, 80μm, or 100μm, etc. Within the above-described limits, the edge-sealing layer of this application is relatively thin, which can significantly reduce the size of the thermal pad, thus facilitating the miniaturization of the thermal pad and reducing its volume percentage in electronic devices. If the thickness of the edge-sealing layer is less than 1μm, it is too thin to completely cover the thermal pad, and there is still a risk of powder shedding. If the thickness of the edge-sealing layer is greater than 100μm, it is too thick and affects the thermal conductivity of the thermal pad.

[0031] Secondly, embodiments of this application provide an electronic device, which includes stacked electronic components and a heat dissipation device, with a thermally conductive pad disposed between the electronic components and the heat dissipation device, the thermally conductive pad being the thermally conductive pad described in the first aspect.

[0032] In the above solution, the thermally conductive pad containing conductive material of this application is applied to electronic devices. The thermally conductive pad includes a thermally conductive layer and an edge-covering layer. The side surface of the thermally conductive layer does not have a hollow structure, which can reduce the risk of short circuits caused by shedding debris inside the electronic device. The first and second surfaces of the thermally conductive layer are provided with hollow structures, which reduces the area covered by the edge-covering layer, thereby increasing the area of ​​the thermally conductive layer exposed to the external environment, improving the heat conduction efficiency of the thermally conductive layer and reducing thermal resistance, thereby improving the heat dissipation effect and service life of the electronic device. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 is a schematic diagram of the structure of the electronic device provided in an embodiment of this application;

[0035] Figure 2 is a schematic diagram of a thermal pad provided in an embodiment of this application;

[0036] Figure 3 is a front view schematic diagram of a thermal pad provided in an embodiment of this application;

[0037] Figure 4 is a schematic cross-sectional structure of a thermal pad provided in an embodiment of this application;

[0038] Figures 5(a)-(e) are top views of the extension provided in the embodiments of this application;

[0039] Figures 6(a)-(b) are schematic diagrams of the structure of the extension provided in the embodiments of this application;

[0040] Figure 7 is a schematic diagram of a structure following sections AA and BB in Figure 1;

[0041] Figure 8 is a schematic diagram of another structure following the AA and BB sections in Figure 1.

[0042] In the attached figures: 100 - Electronic device; 10 - Thermal pad; 1 - Thermal layer; 1A - First surface; 1B - Second surface; 1C - Peripheral surface; 2 - Edge layer; 21 - Side edge portion; 22 - Extension portion; 22A - Hollowed-out portion; 22B - Solid portion; 221 - First extension portion; 2211 - First hollowed-out portion; 2212 - First solid portion; 222 - Second extension portion; 2221 - Second hollowed-out portion; 2222 - Second solid portion; 20 - Electronic device; 30 - Heat dissipation device. Detailed Implementation

[0043] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0044] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0045] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0046] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0047] To address the heat dissipation problem of electronic products, conductive pads and heat dissipation devices are typically placed on the heat-generating electronic components. The thermal pads are placed between the electronic components and the heat dissipation devices, and the heat generated by the electronic components is transferred to the heat dissipation devices through the thermal pads. The thermal pads can fill the microscopic gaps between the electronic components and the heat dissipation devices, reduce the air layer, and improve the heat transfer efficiency.

[0048] To further improve heat transfer efficiency, researchers used conductive materials as the substrate for thermal pads. These conductive materials could be carbon-based or metallic. The addition of these conductive materials gives the thermal pads a high thermal conductivity, significantly improving their thermal performance. In the manufacturing process of thermal pads, they are typically made by stacking multiple layers of conductive material and then slicing them. Because conductive materials are relatively brittle, the edges are often porous during processing and cutting. This can lead to fragments easily falling off the edges during pressure and use, causing short circuits on the circuit board and potentially damaging electronic products.

[0049] Furthermore, researchers have adopted an edge-wrapping treatment for the thermal pads to solve the problem of edge shedding. However, in order to ensure a good connection between the edge and the thermal pad, the edge inevitably extends into the interior of the thermal pad, resulting in a severe deterioration of the thermal resistance of the thermal pad and limiting the application of conductive materials in the field of thermal pads.

[0050] Therefore, this application provides a thermally conductive pad that can be applied to electronic devices, such as mobile phones, tablets, e-readers, laptops, digital cameras, televisions, wearable devices, virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, etc. This application does not limit the specific form of the electronic device.

[0051] Figure 1 shows a schematic diagram of the structure of the electronic device provided in the embodiment of this application. Referring to Figure 1, the electronic device 100 includes stacked electronic devices 20 and heat dissipation devices 30. A conductive pad 10 is disposed between the electronic devices 20 and the heat dissipation devices 30. As a thermal interface material, the thermal pad 10 can fill the microscopic gaps between the electronic devices 20 and the heat dissipation devices 30, reduce the air layer, thereby improving the heat conduction efficiency. Then, heat dissipation is carried out through the heat dissipation devices 30 to ensure that the electronic devices 20 operate at a safe temperature, extend the service life of the electronic devices 20 and improve performance stability.

[0052] In some embodiments, the electronic device 20 may be, for example, a processor, graphics processor, battery, memory chip, power amplifier, radio frequency module, camera module, and wireless charging module, which are prone to generating heat. The memory chip may be a packaged chip or an unpackaged chip.

[0053] For example, the thermal pad 10 of this application can be applied in fields where high thermal conductivity is required in electronic devices 100, such as 3C products and communication base stations. For instance, the thermal pad 10 of this application can be used for heat dissipation of heat-generating chips, transferring heat from the chip to the heat dissipation device 30, making it easier for the chip to exchange heat with the outside environment. It is understood that the thermal pad 10 of this application can also be applied to other fields with high thermal conductivity requirements, such as 5G-related applications.

[0054] In some embodiments, the heat dissipation device 30 includes a radiator, which may be, for example, an air-cooled radiator, a down-draft radiator, a water-cooled radiator, a heat pipe radiator, or a liquid-cooled radiator.

[0055] Figure 2 shows a schematic diagram of a thermal pad 10 provided in an embodiment of this application. Referring to Figure 2, the thermal pad 10 includes a thermally conductive layer 1 and an edge-sealing layer 2. The thermally conductive layer 1 is mainly used to realize the heat conduction and heat dissipation function of the thermal pad 10, and the edge-sealing layer 2 is used to improve the heat conduction efficiency of the thermally conductive layer 1, reduce thermal resistance, and form protection for the surrounding edge area of ​​the thermally conductive layer 1. Specifically:

[0056] The thermally conductive layer 1 includes a conductive material, which may include at least one of a carbon-based conductive material and a metallic conductive material. Examples of carbon-based conductive materials include carbon fibers, graphene, natural graphite, artificial graphite, and carbon nanotubes. Examples of metallic conductive materials include sheet-like silver. These conductive materials have high thermal conductivity and offer a variety of thickness and size options. Using these conductive materials in the fabrication of the conductive pad can provide a low thermal resistance contact between the electronic device 20 and the heat dissipation device 30, thereby improving heat dissipation efficiency.

[0057] Optionally, the thermally conductive layer 1 is a multi-layer composite structure, that is, the thermally conductive layer 1 includes multiple stacked conductive material layers, with an adhesive between adjacent conductive material layers. Multiple conductive material layers can be stacked and cut into a specified size using a slicing process.

[0058] Optionally, the thickness of the thermal conductive layer 1 is 0.1mm to 5mm, specifically 0.1mm, 0.5mm, 1mm, 2mm, 3mm, 4mm or 5mm, etc.

[0059] Optionally, the thickness of the adhesive between two adjacent conductive material layers is 10μm to 50μm, specifically 10μm, 20μm, 30μm, 40μm, or 50μm. The adhesive mainly serves to bond adjacent graphene film layers, preventing the 10 layers of the thermal pad from separating. If the adhesive thickness is greater than 50μm, the thermal conductivity in the interlayer direction of the 10 thermal pads will deteriorate; if the adhesive thickness is less than 10μm, the multiple conductive material layers will not achieve a good bonding effect.

[0060] Figure 3 shows a schematic front view of one possible structure of the heat-conducting layer 1. Referring to Figure 3, the surface of the heat-conducting layer 1 includes a first surface 1A, a second surface 1B, and a peripheral surface 1C. The first surface 1A and the second surface 1B are disposed opposite to each other. In some embodiments, the first surface 1A may be, for example, the upper surface of the heat-conducting layer 1, and the second surface 1B may be the lower surface of the heat-conducting layer 1. In other embodiments, the first surface 1A may be, for example, the lower surface of the heat-conducting layer 1, and the second surface 1B may be the upper surface of the heat-conducting layer 1. The peripheral surface 1C is disposed between the first surface 1A and the second surface 1B, that is, the peripheral surface 1C surrounds the heat-conducting layer 1.

[0061] The following description uses the first surface 1A as the upper surface of the thermal conductive layer 1 and the second surface 1B as the lower surface of the thermal conductive layer 1. When the thermal pad 10 is applied to the electronic device 100, the electronic device 20 is disposed on the lower surface of the thermal conductive layer 1 and the heat dissipation device 30 is disposed on the upper surface of the thermal conductive layer 1 as an example.

[0062] Figure 4 shows a schematic cross-sectional view of a thermal pad. Referring to Figure 4, the edge layer 2 includes a side edge portion 21 and an extension portion 22. Wherein:

[0063] The side edge portion 21 surrounds the peripheral surface 1C of the heat-conducting layer 1, and the side edge portion 21 does not have a hollow structure. For the heat-conducting layer 1 containing conductive material, its peripheral surface 1C is usually obtained by slicing. By setting the side edge portion 21 without a hollow structure, this application can fully wrap and protect the peripheral surface 1C of the heat-conducting layer 1, avoiding the impact of debris generated on the peripheral surface 1C of the heat-conducting layer during pressure or long-term operation on other devices, and improving the safety of use.

[0064] The extension 22 extends from the side edge 21 to the first surface 1A and the second surface 1B, and at least a portion of the extension 22 has a hollow structure (the hollow structure is not shown in FIG. 4). During compression, the heat-conducting layer 1 corresponding to the hollow area of ​​the hollow structure can directly contact the electronic device 20 and the heat dissipation device 30, reducing the area covered by the electronic device 20 and the heat dissipation device 30, effectively reducing the thermal resistance of the thermal pad 10, and improving the thermal conduction efficiency and safety of the thermal pad 10.

[0065] Optionally, the side edge portion 21 and the extension portion 22 are integrally formed, which is beneficial to improving the overall mechanical properties of the edge layer.

[0066] Figure 5 shows a top view of the extension structure. Referring to Figure 5, the hollow structure includes several hollow parts 22A and several solid parts 22B.

[0067] Optionally, at least part of the solid portion 22B completely covers the periphery of the cutout portion 22A. The shape of the cutout portion 22A can be a regular geometric shape such as a square, circle, rhombus, triangle, trapezoid, or parallelogram, or other complex irregular shapes.

[0068] In some embodiments, all the cutout portions 22A are completely covered by the solid portions 22B, which can ensure the mechanical properties of the cutout structure, improve the structural stability of the cutout structure, and extend the service life of the thermal pad. For example, as shown in Figure 5(a), the cutout portion 22A is square, and all square cutout portions 22A are completely covered by the solid portions 22B. As shown in Figure 5(b), all the circular cutout portions 22A are completely covered by the solid portions 22B.

[0069] In some embodiments, a portion of the cutout portion 22A is completely covered by the solid portion 22B, meaning that a portion of the cutout portion 22A is completely covered by the solid portion 22B, while a portion of the cutout portion 22A is not completely covered by the solid portion 22B; this portion of the cutout portion 22A can be partially covered by the solid portion 22B. For example, as shown in Figure 5(c), the cutout structure is a mesh structure. The mesh structure not only increases the heat conduction area of ​​the thermal pad 10 and improves the heat transfer efficiency, but also provides more contact points, which is beneficial to improving the adhesion and stability between the thermally conductive layer 1 and the extension portion 22.

[0070] In this application, the shape of the hollow portion 22A can be single or can be one of the various patterns mentioned above; this application does not impose any limitations. The presence of the hollow portion 22A allows the thermally conductive layer 1 to protrude from the hollow portion 22A and directly contact the electronic device 20 and the heat dissipation device 30 during the compression process of the thermally conductive pad 10, thereby improving the thermal conductivity of the thermally conductive pad 10. At the same time, the extension portion 22 with the hollow structure can reduce the film area covering the surface of the thermally conductive layer 1, which can effectively reduce the degradation of the thermal resistance of the thermally conductive pad 10.

[0071] Optionally, referring to Figures 5(d) and 5(e), the solid portion 22B partially covers the periphery of the hollow portion 22A, that is, the solid portion 22B partially covers the hollow portion 22A. For example, the solid portion 22B may be a plurality of protrusions arranged in the edge regions of the first surface 1A and the second surface 1B, with gaps between adjacent protrusions; these gaps constitute the hollow portion 22A. This application does not limit the shape of the protrusions; they may be geometric or irregular shapes. For example, the cross-section of the protrusion may be a serrated straight line (Figure 5(d)), a serrated curve, a triangle (Figure 5(e)), etc.

[0072] As can be understood, full enclosure refers to an object or structure being completely covered or wrapped within another object or structure, with no part exposed to the external environment. Partial enclosure, also known as partial coverage, refers to an object or structure being only partially covered by another object or structure, with at least a portion exposed to the external environment.

[0073] In preparing the hollow structure of this application, a complete film layer can be prepared on the peripheral surface 1C, the first surface 1A, and the second surface 2B of the heat-conducting layer 1. Then, the film layer located on the first surface 1A and the second surface 2B is hollowed out to prepare the hollow portion 22A. The untreated portion is the solid portion 22B. This application does not limit the specific process of hollowing out. For example, laser cutting, etching, or methods such as CAD modeling for additive manufacturing and 3D printing technology can be used to directly form the hollow structure.

[0074] In some embodiments, the area of ​​the hollow portion 22A in the hollow structure accounts for 10% to 90%, that is, the area of ​​the hollow portion 22A is 10% to 90% of the total area of ​​the hollow structure, specifically it can be 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, or 90%, etc. Within the above-mentioned range, it is possible to ensure contact between the extension portion 22 and the heat-conducting layer 1 to effectively protect the heat-conducting layer 1, and at the same time, it is possible to ensure good contact between the heat-conducting layer 1 and the electronic device 20 and the heat dissipation device 30 respectively during compression, thereby improving the heat conduction efficiency. It can be understood that in this application, the area of ​​the hollow portion 22A refers to the sum of the areas of all hollow portions 22A within the hollow structure. If the area of ​​the hollow part 22A in the hollow structure is less than 10%, the contact area between the extension part 22 and the heat-conducting layer 1 is too large, and the effect of improving heat dissipation and reducing thermal resistance is not obvious. If the area of ​​the hollow part 22A in the hollow structure is greater than 90%, there are too many hollow parts 22A, which reduces the mechanical strength of the extension part 22. It is easy to deform or be damaged under mechanical pressure, and it will also lead to insufficient edge protection of the heat-conducting layer 1 by the extension part 22.

[0075] In some embodiments, FIG6 shows a schematic diagram of the extension. Referring to FIG6, the extension 22 includes a first extension 221 and a second extension 222, wherein the first extension 221 is disposed on the first surface 1A and the second extension 222 is disposed on the second surface 1B. Typically, the first extension 221 is disposed between the heat-conducting layer 1 and the heat dissipation device 30, and the second extension 222 is disposed between the heat-conducting layer 1 and the electronic device 20.

[0076] Referring to Figure 6(a), the first extension 221 has a perforated structure, while the second extension 222 does not. During pressure or operation, the heat transferred between the first extension 221 (with the perforated structure) and the thermal pad 10 is primarily conducted from the first extension 221 to the heat dissipation device 30, achieving high single-sided protection and low thermal resistance for the thermal pad 10. The second extension 222 provides electrical insulation and prevents contamination around the electronic device 20, thus preventing short circuits or arcing inside the electronic device 100.

[0077] Please refer to Figure 6(b). The first extension 221 has a hollow structure, and the second extension 222 has a hollow structure. Thus, during the use of the thermal pad 10, the thermally conductive layer 1 protrudes from the hollow part of the hollow structure and contacts the electronic device 20 and the heat dissipation device 30 respectively, thereby improving the heat dissipation efficiency of the thermal pad 10 and reducing the thermal resistance of the thermal pad 10.

[0078] Further, please refer to Figure 6(b). The first extension 221 has a first hollow structure, and the second extension 222 has a second hollow structure. Specifically, the first hollow structure includes a first hollow portion 2211 and a first solid portion 2212, and the second hollow structure includes a second hollow portion 2221 and a second solid portion 2222.

[0079] Figure 7 shows a structural schematic diagram along the AA and BB sections of Figure 1. Referring to Figure 7, the first hollow part 2211 and the second hollow part 2221 are arranged opposite to each other. The heat generated by the electronic device 20 is dissipated along the dotted line and arrow direction shown in Figure 7. After being compressed along the Z-axis, the heat-conducting layer 1 is in direct contact with the electronic device 20 and the heat dissipation device 30, which is beneficial to improving the heat conduction efficiency of the heat-conducting pad 10.

[0080] Figure 8 shows another structural schematic diagram along sections AA and BB of Figure 1. Referring to Figure 8, the first cutout portion 2211 and the second cutout portion 2221 are staggered, and the heat generated by the electronic device 20 is dissipated along the dotted line and arrow direction shown in Figure 8. During the compression of the thermal pad 10, along the Z-axis direction shown in Figure 8, the two-layer structure of the extension portion 22 can be compressed into a single layer, reducing the thickness of the thermal pad 10 and thus reducing the volume ratio of the thermal pad 10 within the electronic device 100. Furthermore, the staggered arrangement of the first cutout portion 2211 and the second cutout portion 2221 can improve the uniformity of stress distribution of the thermal pad 10, avoid local overheating, and extend the service life of the thermal pad 10 and the electronic device 100 containing the thermal pad 10.

[0081] Optionally, the first cutout portion 2211 and the second cutout portion 2221 have the same shape. In other embodiments, the first cutout portion 2211 and the second cutout portion 2221 have different shapes. Those skilled in the art can set the specific shapes of the first cutout portion 2211 and the second cutout portion 2221 according to actual heat dissipation and thermal resistance requirements.

[0082] Optionally, the first cutout portion 2211 and the second cutout portion 2221 have the same dimensions. In other embodiments, the first cutout portion 2211 and the second cutout portion 2221 have different dimensions. This application does not limit the dimensions of the first cutout portion 2211 and the second cutout portion 2221, and those skilled in the art can set the specific dimensions of the first cutout portion 2211 and the second cutout portion 2221 according to actual heat dissipation and thermal resistance requirements.

[0083] Optionally, multiple first hollow portions 2211 and multiple second hollow portions 2221 are provided. The number of first hollow portions 2211 and second hollow portions 2221 directly affects the thermal conductivity of the thermal pad 10. Those skilled in the art can set the number of first hollow portions 2211 and second hollow portions 2221 according to actual thermal conductivity requirements. Furthermore, multiple first hollow portions 2211 are evenly spaced on the first extension 221. Multiple second hollow portions 2221 are evenly spaced on the second extension 222, which can improve the thermal conductivity uniformity of the thermal pad 10.

[0084] Optionally, the maximum extension width of the extension portion 22 extending from the side edge portion 21 to the first surface 1A of the heat-conducting layer 1 is 0.1mm to 1mm, specifically 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, or 1mm, etc. It can be understood that the extension width of the extension portion 22 extending from the side edge portion 21 to the first surface 1A of the heat-conducting layer 1 is the width L shown in Figure 2.

[0085] Optionally, the maximum extension width of the extension 22 extending from the side edge 21 to the second surface 1B of the heat-conducting layer 1 is 0.1mm to 1mm, specifically 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm, etc.

[0086] The maximum extension width of the extension portion 22 in this application has a wide adjustment range, which can not only avoid the problems of warping and delamination caused by the extension portion 22 being too narrow, but also ensure the connection quality between the extension portion 22 and the heat-conducting layer 1 without sacrificing part of the width of the extension portion 22, thus ensuring a tight connection between the extension portion 22 and the heat-conducting layer 1; it can also promote the heat transfer of the electronic device 20 and improve the heat transfer efficiency of the heat-conducting pad 10.

[0087] For applications where the electronic device 20 is an unpackaged chip, the maximum extension width of the extension 22 can be appropriately reduced to reduce the entry of the thermal pad 10 edge layer 2 into the chip area, thereby effectively reducing thermal resistance.

[0088] When the thermal pad 10 is applied to the electronic device 100, considering that the thermal pad 10 has a certain thickness and needs to be compressed during application to compensate for the gap tolerance between the electronic device 20 and the heat dissipation device 30, the edge layer 2 has a certain compressibility and is easy to spring back.

[0089] Optionally, the material of the edging layer 2 includes at least one of polymer, foam, woven fabric and metal.

[0090] The polymer includes at least one of silicone rubber, polyimide (PI), polyether ether ketone (PEEK), polytetrafluoroethylene (PTFE), and polyurethane (PU). The polymer has good flexibility to adapt to electronic devices 20 of different shapes and sizes, and the polymer has insulation and beneficial chemical stability to prevent electrical short circuits with electronic devices 20 and improve the service life of thermal pad 10.

[0091] The foam has good flexibility and compressibility, with a compression capacity in the kilopascal range, and good rebound after stress relief, facilitating the compression and application of the thermal pad 10. Preferably, the foam is flame-retardant foam.

[0092] Fiber woven fabrics have good thermal conductivity. For example, carbon fiber cloth has high thermal conductivity, which helps to improve the overall thermal conductivity of the thermal pad 10. At the same time, it has good mechanical strength, which can improve the edge strength of the thermal pad 10, making it more tear-resistant and wear-resistant.

[0093] The metal material can be at least one of stainless steel, gold, silver, copper, aluminum, zinc, and tin foil. In some embodiments, the side edge portion 21 and the extension portion 22 are made of any one of the metals selected from gold, silver, copper, aluminum, and zinc, or an alloy composed of at least two of these metals. The metal material has high thermal conductivity, which can quickly conduct heat from the electronic device 20 to the heat dissipation device 30. At the same time, the high mechanical strength of the metal material can provide additional physical protection to prevent the thermal pad 10 from being mechanically damaged.

[0094] Optionally, the thickness of the edge-sealing layer 2 is 1μm to 100μm, that is, the thickness of the extension 22 can be 1μm to 100μm, and the thickness of the side edge-sealing portion 21 can be 1μm to 100μm, specifically 1μm, 10μm, 30μm, 50μm, 80μm, or 100μm, etc. Within the above-mentioned limits, the thickness of the edge-sealing layer 2 in this application is relatively thin, which can significantly reduce the size of the thermal pad 10, which is beneficial to the miniaturization of the thermal pad 10, thereby reducing the volume ratio of the thermal pad 10 in the electronic device 100. If the thickness of the edge-sealing layer 2 is less than 1μm, the edge-sealing layer 2 is too thin to completely cover the thermal pad 1, and there is still a risk of powder shedding. If the thickness of the edge-sealing layer 2 is greater than 100μm, the edge-sealing layer 2 is too thick and affects the thermal conductivity of the thermal pad 10.

[0095] Optionally, the side edge portion 21 includes a plurality of sheets, which are connected together and surrounded on the peripheral surface 1C of the heat-conducting layer 1 to form the side edge portion 21.

[0096] In some embodiments, the edge-covering layer 2 and the thermally conductive layer 1 are bonded together. Bonding the edge-covering layer 2 and the thermally conductive layer 1 ensures a tight bond between them, improving the overall structural stability of the thermal pad 10. Furthermore, bonding reduces the air gap between the edge-covering layer 2 and the thermally conductive layer 1, thereby reducing thermal resistance and improving heat transfer efficiency.

[0097] During the bonding process, since the edge-sealing layer 2 has a hollow structure, adhesive can be applied to the extension 22 with the hollow structure, then bonded to the thermally conductive layer 1, and cured. In some embodiments, the curing method includes, but is not limited to, at least one of room temperature curing, heat curing, and UV curing.

[0098] Optionally, the adhesive may include, but is not limited to, silicone rubber, acrylic resin, epoxy resin or polyurethane.

[0099] In other embodiments, the edging layer 2 and the thermally conductive layer 1 are snap-fitted together. The edging layer 2 and the thermally conductive layer 1 are mechanically connected, which is simple to operate and allows for quick connection. Furthermore, the mechanical connection facilitates the disassembly of the edging layer 2, which can be cleaned and reused after disassembly, improving material utilization.

[0100] The same or similar parts between the various embodiments in this specification can be referred to mutually. In particular, the device embodiments and terminal embodiments are basically similar to the method embodiments, so the description is relatively simple.

[0101] The above descriptions are merely specific implementations of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A thermally conductive pad, characterized in that, include: A thermally conductive layer comprising a conductive material, the thermally conductive layer having a first surface and a second surface disposed opposite to each other, and the thermally conductive layer having a peripheral surface located between the first surface and the second surface; The edge-sealing layer includes a side edge-sealing portion, which surrounds the peripheral surface of the heat-conducting layer and does not have a hollow structure. The edge-sealing layer also includes an extension extending from the side edge-sealing portion to the first and second surfaces of the heat-conducting layer, and at least a portion of the extension has a hollow structure.

2. The thermally conductive pad according to claim 1, characterized in that, The hollow structure includes a hollow part and a solid part, with at least a portion of the solid part completely covering the periphery of the hollow part.

3. The thermally conductive pad according to claim 1, characterized in that, The hollow structure includes a hollow part and a solid part, with the solid part partially covering the periphery of the hollow part.

4. The thermally conductive pad according to claim 2 or 3, characterized in that, The area of ​​the hollowed-out portion in the hollowed-out structure accounts for 10% to 90%.

5. The thermally conductive pad according to any one of claims 1 to 4, characterized in that, The extension includes a first extension and a second extension. The first extension is disposed on the first surface and has a hollow structure. The second extension is disposed on the second surface and does not have a hollow structure.

6. The thermally conductive pad according to any one of claims 1 to 4, characterized in that, The extension includes a first extension and a second extension. The first extension is disposed on the first surface and has a first hollow portion. The second extension is disposed on the second surface and has a second hollow portion.

7. The thermally conductive pad according to claim 6, characterized in that, The first hollowed-out portion and the second hollowed-out portion are arranged opposite to each other.

8. The thermally conductive pad according to claim 6, characterized in that, The first and second hollowed-out portions are offset from each other.

9. The thermally conductive pad according to any one of claims 1 to 8, characterized in that, The maximum extension width of the extension portion extending from the side edge portion to the first surface of the heat-conducting layer is 0.1 mm to 1 mm; and / or the maximum extension width of the extension portion extending from the side edge portion to the second surface of the heat-conducting layer is 0.1 mm to 1 mm.

10. The thermally conductive pad according to any one of claims 1 to 9, characterized in that, The material of the edging layer includes at least one of polymer, foam, woven fabric and metal.

11. The thermally conductive pad according to any one of claims 1 to 10, characterized in that, The thickness of the edging layer is 1μm to 100μm.

12. An electronic device, characterized in that, The electronic device includes stacked electronic components and a heat dissipation device, with a thermally conductive pad disposed between the electronic components and the heat dissipation device, and the thermally conductive pad being the thermally conductive pad according to any one of claims 1 to 11.

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