Fiber array and method for manufacturing same

Abstract

This fiber array (10) comprises an optical chip (110), a fiber (100), and a lid (120), the optical chip being provided with a substrate (115), a waveguide (112) disposed on one surface of the substrate, and a V-groove (111) disposed on one surface of the substrate, the tip of the fiber being disposed in the V-groove so that the core of the fiber and the waveguide are optically connected, and a portion of the lid being disposed so as to cover at least the tip of the fiber.　Thus, the present invention can provide a fiber array in which a fiber and a waveguide of an optical chip can be optically connected with high accuracy.

Description

Fiber array and manufacturing method thereof

[0001] The present invention relates to a fiber array for optically connecting fibers and optical elements, and a method for manufacturing the same.

[0002] Fiber arrays are used for optically connecting fibers to optical chips. In fiber arrays, multiple fibers are stripped of their coating, arranged on a substrate at a pitch of 250 μm or so, and fixed with a lid. The end faces of these fibers are flattened. The fibers with their coatings removed are placed in V- or U-shaped grooves formed in the substrate, and the lid is fixed with an adhesive. The end faces of the fibers, lid, and substrate are polished together, and each end face is flattened. In fiber arrays, light is optically emitted from the fibers (see Patent Document 1).

[0003] Patent No. 2958628

[0004] However, in conventional fiber arrays, the pitch and mode field diameter are equivalent to the size of the fiber, making it difficult to apply a small mode field diameter or a narrower array pitch for silicon photonics.

[0005] Furthermore, since the fiber is placed in glass in which a V-groove has been formed by a dicer, the propagation of light is limited to a linear direction according to the shape of the V-groove in which the fiber is placed.

[0006] Furthermore, when fiber arrays are assembled one by one by hand, the fiber end faces must be polished to eliminate tolerances during assembly, which poses a problem of many manufacturing steps.

[0007] In order to solve the above-mentioned problems, the fiber array of the present invention comprises an optical chip, a fiber, and a lid, wherein the optical chip comprises a substrate, a waveguide disposed on one surface of the substrate, and a V-groove disposed on one surface of the substrate, wherein the tip of the fiber is disposed in the V-groove so that the core of the fiber and the waveguide are optically connected, and a portion of the lid is disposed so as to cover at least the tip of the fiber.

[0008] Furthermore, a method for manufacturing a fiber array according to the present invention is a method for manufacturing a fiber array including an optical chip having a waveguide, a fiber optically connected to the waveguide, and a lid, the method comprising the steps of: periodically fabricating, on a surface of a wafer, a plurality of optical chip regions each having the waveguide and a V-groove extending in one direction and in which the fiber is disposed; and fabricating a plurality of optical chip continua arranged in another direction perpendicular to the one direction; attaching tape to the back surface of the wafer; and dicing the wafer into the optical chip continua so that the V-groove is exposed on an end surface of the optical chip continua parallel to the other direction. the step of arranging the end faces of the plurality of fibers facing the end faces of the plurality of V-grooves; the step of arranging the tip ends of the plurality of fibers collectively in the plurality of V-grooves; the step of abutting the end faces of the tip ends of the plurality of fibers collectively against the end faces of the plurality of waveguides; the step of adhering the lid continuum to at least the V-grooves and some of the fibers in the optical chip continuum; the step of peeling the optical chip continuum from the tape; and the step of dividing the lid continuum into the lids and dividing the optical chip continuum into the optical chips.

[0009] A method for manufacturing a fiber array according to the present invention is a method for manufacturing a fiber array including an optical chip having a waveguide, a fiber optically connected to the waveguide, and a lid, the method comprising the steps of: periodically fabricating, on a front surface of a wafer, a plurality of optical chip regions each having the waveguide and a V-groove extending in one direction and in which each of the fibers is disposed; and fabricating, in a plurality of rows of optical chips disposed in another direction perpendicular to the one direction; attaching tape to a rear surface of the wafer; dicing the wafer into the plurality of optical chips disposed in a row; and attaching the V-groove to the other optical chips of the optical chips. the step of exposing the fibers at end faces parallel to the direction of the optical chip; the step of arranging the end faces of the plurality of fibers so as to face the end faces of the plurality of V-grooves; the step of arranging the tip ends of the plurality of fibers collectively in the plurality of V-grooves; the step of abutting the end faces of the tip ends of the plurality of fibers collectively against the end faces of the plurality of waveguides; the step of adhering the lid continuum to at least the V-grooves and a portion of the fibers in the optical chip; the step of peeling off the plurality of optical chips arranged in a row from the tape; and the step of dividing the lid continuum into the lids.

[0010] According to the present invention, it is possible to provide a fiber array that can optically connect fibers and waveguides of an optical chip with high precision, and a method for manufacturing the same.

[0011] FIG. 1A is a schematic top view showing the configuration of a fiber array according to a first embodiment of the present invention. FIG. 1B is a schematic IB-IB' cross-sectional view showing the configuration of a fiber array according to a first embodiment of the present invention. FIG. 1C is a schematic IC-IC' cross-sectional view showing the configuration of a fiber array according to a first embodiment of the present invention. FIG. 1D is a schematic ID-ID' cross-sectional view showing the configuration of a fiber array according to a first embodiment of the present invention. FIG. 1E is a schematic IE-IE' cross-sectional view showing the configuration of a fiber array according to a first embodiment of the present invention. FIG. 1F is a schematic rear view showing the configuration of a fiber array according to a first embodiment of the present invention. FIG. 1G is a schematic external view showing the configuration of a fiber array according to a first embodiment of the present invention. FIG. 2 is a diagram for explaining a method for manufacturing a fiber array according to a first embodiment of the present invention. FIG. 3A is a schematic top view for explaining a method for manufacturing a fiber array according to a first embodiment of the present invention. FIG. 3B is a IIIB-IIIB' cross-sectional view for explaining a method for manufacturing a fiber array according to a first embodiment of the present invention. FIG. 3C is a IIIC-IIIC' cross-sectional view for explaining a method for manufacturing a fiber array according to a first embodiment of the present invention. Fig. 4 is a diagram for explaining a method for manufacturing a fiber array according to the first embodiment of the present invention. Fig. 5 is a diagram for explaining a method for manufacturing a fiber array according to the first embodiment of the present invention. Fig. 6 is a diagram for explaining a method for manufacturing a fiber array according to the first embodiment of the present invention. Fig. 7 is a diagram for explaining a method for manufacturing a fiber array according to the first embodiment of the present invention. Fig. 8 is a diagram for explaining a method for manufacturing a fiber array according to the first embodiment of the present invention. Fig. 9 is a diagram for explaining a method for manufacturing a fiber array according to the first embodiment of the present invention. Fig. 10 is a diagram for explaining a method for manufacturing a fiber array according to the first embodiment of the present invention. Fig. 11 is a diagram for explaining a method for manufacturing a fiber array according to the first embodiment of the present invention. Fig. 12 is a diagram for explaining a method for manufacturing a fiber array according to the first embodiment of the present invention. Fig. 13 is a diagram for explaining a method for manufacturing a fiber array according to the first embodiment of the present invention.Fig. 14 is a diagram for explaining a method for manufacturing a fiber array according to the first embodiment of the present invention. Fig. 15 is a diagram for explaining a method for manufacturing a fiber array according to the first embodiment of the present invention. Fig. 16 is a diagram for explaining a method for manufacturing a fiber array according to the first embodiment of the present invention. Fig. 17 is a schematic top view showing an example of the configuration of a fiber array according to the first embodiment of the present invention. Fig. 18 is a schematic top view showing an example of the configuration of an optical chip in the fiber array according to the first embodiment of the present invention. Fig. 19 is a diagram for explaining an example of a fiber array according to the first embodiment of the present invention.

[0012] First Embodiment A fiber array according to a first embodiment of the present invention will be described with reference to FIGS.

[0013] 1A and 1B, the fiber array 10 according to the present embodiment is connected to an MT connector 130, for example. The fiber array 10 is not limited to being connected to an MT connector, and may be connected to a plurality of single-core connectors formed by dividing the fibers of a tape fiber.

[0014] The fiber array 10 includes a tape fiber 100, a PLC chip 110, and a lid 120. Here, the end of the fiber array 10 that is connected to an MT connector or the like is referred to as the base end, and the opposite end is referred to as the tip. In each of the tape fiber 100, the PLC chip 110, and the lid 120, the end on the base end side of the fiber array 10 is referred to as the base end, and the opposite end is referred to as the tip. In the following, to make the configuration of the fiber array easier to understand, the lid 120 is indicated by a dotted line in the top view schematic diagram.

[0015] The tape fiber 100 is composed of multiple fibers. Each fiber has a core and a cladding around the core. The tape fiber 100 has a coated portion 101 where the cladding of each of the multiple fibers is coated with a resin or the like, and an exposed portion 102 where the coating is removed to expose the cladding.

[0016] PLC chip 110 includes waveguide 112 and V-groove 111 formed on the surface of Si substrate 115 by PLC technology. PLC chip 110 has an end face of waveguide 112, and a plane perpendicular to the light guiding direction (or the extension direction of the V-groove), which has an end face of waveguide 112, including end face 113 on the side where V-groove 111 is arranged (hereinafter referred to as "V-groove side end face"), and a surface opposite V-groove side end face 113 (hereinafter referred to as "waveguide side end face") 114.

[0017] In a plane perpendicular to the light guiding direction (or the extending direction of the V-groove) of the PLC chip 110, the plane having the end face of the V-groove 111 and the plane having the end face of the waveguide 112 are coincident with or close to each other. The plane having the end face of the V-groove 111 and the plane having the end face of the waveguide 112 are close enough to each other that the tape fiber 100 placed in the V-groove 111 and the waveguide 112 are optically connected.

[0018] A portion of the exposed portion 102 of the tape fiber 100 that is a predetermined length (the length of the V-groove 111) from the tip of the tape fiber 100 (hereinafter referred to as the "tip portion") is placed in the V-groove 111 of the PLC chip 110.

[0019] With this configuration, the tape fiber 100 placed in the V-groove 111 of the PLC chip 110 is optically connected to the waveguide 112 of the PLC chip 110. In detail, the cores of the multiple fibers that make up the tape fiber 100 are optically connected to the waveguide 112 of the PLC chip 110.

[0020] 1B and 1E, the lid 120 has a recess 121 on the surface of the lid 120. The recess 121 is composed of an end face on the tip side, a side face perpendicular to the end face, and a face parallel to the bottom surface of the lid 120, and has an opening on the end face on the base side of the lid 120. The recess 121 is composed of two steps, with the base side being deeper than the tip side.

[0021] The lid 120 is placed so that its surface faces the surface of the PLC chip 110 where the V-groove 111 is formed, and the surface on the tip side that does not have the recess 121 comes into contact with the PLC chip 110 .

[0022] The tape fiber 100 is inserted into the recess 121 of the lid 120 and is guided and positioned by the sidewall of the recess 121 .

[0023] 1B , in the lid 120, a portion on the tip side of the recess 121 is arranged so as to cover the V-groove 111 in the PLC chip 110, i.e., the tip end of the tape fiber 100, and is fixed with adhesive 140. A portion on the base side of the recess 121 is arranged so as to cover a portion of the tape fiber 100 that is connected to the tip end of the tape fiber 100, and the portion of the tape fiber 100 is fixed with adhesive 140. In this way, a portion of the lid 120 is arranged so as to cover at least the tip end of the tape fiber 100.

[0024] 1D, in the V-groove region, the adhesive 140 sandwiches and fixes the exposed fiber portion 102 between the V-groove 111 and the lid recess 121. In the lid recess region, the adhesive 140 positions the tape fiber 100 using the recess 121 of the lid 120, and fixes the tape fiber 100 to the lid 120, as shown in FIG.

[0025] 1G shows a schematic view of the rear surface of the fiber array 10. As shown in FIG. 1G, the tape fiber 100 is guided by a recess 121 in the lid 120, connected to a V-groove 111 formed in the PLC chip 110, and fixed with an adhesive 140.

[0026] In this way, in the fiber array 10, the tape fiber 100 is accommodated and fixed in the recess 121 of the lid 120, and is optically connected to the waveguide 112 of the PLC chip 110. The tape fiber 100 is led out from the opening on the end surface of the recess 121 of the lid 120.

[0027] Although the recess 121 of the lid 120 has been shown as having two stages, the recess 121 may have three or more stages or may have only one stage. The recess 121 having one stage may be disposed so as to cover the V-groove 111 and a portion of the tape fiber 100.

[0028] 1B and 1F , in the MT connector 130 connected to the fiber array 10, the ribbon fiber 100 is fixed to the MT connector 130 via a boot 131 with adhesive sealed in through an adhesive sealing port 133 of the MT connector 130. The end face of the exposed portion 102 of the ribbon fiber 100 is exposed at the end face opposite to the side where the boot 131 is secured, through a hole formed in the MT connector 130. The end faces of the exposed portion 102 of the ribbon fiber 100 and the end face 132 of the MT connector 130 are polished.

[0029] In the conventional configuration, a V-groove is formed in the substrate of the fiber array, a ribbon fiber is fixed in the V-groove, and a lid is placed on top of the substrate and the ribbon fiber. The lid is a flat plate with a flat surface. The ribbon fiber fixed on the fiber array substrate is optically connected to the PLC chip.

[0030] On the other hand, in the fiber array 10, a V-groove 111 for fixing the tape fiber 100 is formed in the PLC chip 110. Also, the lid has a recess for guiding and fixing the tape fiber 100. These points make it different from conventional configurations.

[0031] In this way, by forming the V-groove 111 and the waveguide 112 on the same PLC chip 110, optical connection can be achieved with high precision using the lithography precision of microfabrication technology.

[0032] 1B , the waveguide-side end face 114 protrudes from the end face of the lid 120. As a result, the end face of the waveguide 112 is flattened and exposed by dicing during manufacturing, which will be described later, and the polishing step for aligning the end faces of the lid 120 and the PLC chip 110 can be omitted.

[0033] The PLC chip 110 has a size of, for example, 4 mm square and 625 μm thick, and a glass waveguide is formed on a Si substrate 115 by microfabrication technology with an accuracy of 1 μm or less.

[0034] The lid 120 is approximately 4 mm x 8 mm x 500 μm thick, is made of a glass substrate 115, and has a recess formed on its surface. The recess 121 is several tens to several hundreds of μm in size, and is sufficient as long as it allows for rough positioning of the ribbon fiber or cladding-exposed fiber, with processing precision of up to approximately 10 μm being acceptable.

[0035] The tape fiber 100 has eight fibers with an outer diameter of 125 μm arranged at a pitch of 250 μm, a cross-sectional size of about 250 μm×2 mm, and glass fibers coated with resin.

[0036] According to this embodiment, in the PLC chip, a fiber is placed in a V-groove formed adjacent to the waveguide by PLC technology, enabling a highly accurate passive connection between the fiber and the PLC waveguide. Furthermore, the configuration of the optical waveguide in the PLC chip allows the pitch and mode field diameter of the waveguide to be adjusted, enabling the utilization of functions such as waveguide, multiplexing / branching, and mode field diameter conversion by PLC technology.

[0037] <Method for Manufacturing Fiber Array> A method for manufacturing the fiber array 10 according to this embodiment will be described with reference to FIGS.

[0038] First, a wafer 200 on which a plurality of chip regions 210 are periodically arranged is manufactured using PLC technology (wafer process, FIG. 2).

[0039] 3A to 3C, the chip region 210 includes a V-groove 111 and a waveguide 112, and includes scribe lines 211 around the periphery of the chip region 210. The chip region 210 may include an optical circuit using PLC technology that has a function of multiplexing / branching or multiplexing / demultiplexing light of different wavelengths.

[0040] Next, the back surface of the wafer 200 is attached to a dicing tape (not shown) (attaching step).

[0041] Next, wafer 200 is diced in two orthogonal directions (x and y directions in the figure) along scribe lines 211 (wafer dicing step, FIG. 4). As a result, a plurality of PLC chips 110 are arranged in a row on the dicing tape. Hereinafter, the PLC chips 110 arranged in a row will be referred to as a "chip row." Wafer 200 may be diced in only one direction (y direction in the figure) to form a strip-shaped chip structure (hereinafter also referred to as a "chip continuum").

[0042] A blade dicing tool is used for dicing, with a dicing width of approximately 50 μm. PLC chip 110 is divided within this width with its end faces flattened ( FIG. 5 ). That is, PLC chip 110 is divided with the ends of V-groove 111 and waveguide 112 flattened, so that the end of V-groove 111 is exposed on one end face of PLC chip 110 and the end of waveguide 112 is exposed on the other end face (the end face opposite the end face where the V-groove is exposed, i.e., waveguide-side end face 114).

[0043] If the dicing position is significantly misaligned, i.e., if the PLC chip 110 is divided outside the set dicing width, the V-groove will not be exposed on the end surface of the PLC chip 110, making it impossible to mount a fiber in the process described below. Also, the end of the waveguide will not be exposed.

[0044] In the wafer dicing process, the surface on the waveguide end side is diced in the same way as the polished surface, without unevenness or chipping, which eliminates the conventional polishing process.

[0045] Next, a plurality of tape fibers 100 are mounted in the same direction on the holding mechanism 300 using image recognition using a camera and an automatic mounting robot (not shown) (alignment process, FIG. 6). Fig. 6 shows a chip row 212 and a plurality of tape fibers 100 mounted on the holding mechanism 300. Fig. 6 shows the state in which the manufacture of the fiber array progresses in order from the first chip row, and the alignment process is performed for the Nth chip row.

[0046] 7, the tape fiber 100 has an exposed fiber portion 102 at its tip. An MT connector 130 is connected to the base end (the end opposite the exposed fiber portion) of the tape fiber 100. In this step, the MT connector 130 does not have to be connected, and the MT connector 130 may be connected after the fiber array 10 is manufactured.

[0047] The holding mechanism 300 includes, for example, a suction mechanism, which suctions and temporarily fixes the mounted ribbon fiber 100. The ribbon fiber 100 may be fixed with a positional accuracy of about 10 μm. The end face of the tip of the exposed fiber portion 102 of the ribbon fiber is positioned facing the end face of the V-groove 111 of the PLC chip 110 exposed during the wafer dicing process.

[0048] Next, the holding mechanism 300 is brought close to the chip row 212, and the exposed fiber portions 102 are mounted in the V-grooves 111 of the PLC chips 110 (collectively mounting step).

[0049] 8 and 9 show the state of the chip row 212 and the tape fibers 110_1 to 110_3 in the collective mounting process. In Figures 8 and 9, the tips of the exposed fiber portions 102 of the tape fibers 110_1 and 110_2 reach the waveguide-side end of the V-groove 111 and abut against the end face 113 of the waveguide 112. Due to processing errors when removing the coating of the tape fiber to form the exposed portions, the lengths of the exposed portions of the tape fibers 110_1 and 110_2 are different.

[0050] Furthermore, since the mounting accuracy in the alignment process is approximately 10 μm, for example, the tip of the exposed fiber portion 102 of the fiber 100_3 does not reach the end of the V-groove 111 on the waveguide side, resulting in a gap 310 between the end face of the waveguide 112 and the exposed fiber portion 102 (FIG. 8).

[0051] 9 , the holding force (e.g., suction force) of the holding mechanism 300 on the tape fiber is reduced, and the holding mechanism 300 is moved toward the chip 110, so that the entire plurality of tape fibers 100 (100_1, 2, ... N) are pushed collectively toward the chip 110. As a result, the tip of the exposed fiber portion 102 having a gap 310 between it and the end face of the waveguide 112, for example, the tip of the exposed fiber portion 102 of the tape fiber 100_3, moves to the end of the V-groove 111 on the waveguide side and abuts against the end face 113 of the waveguide 112 at the end of the V-groove 111 on the waveguide side.

[0052] Furthermore, a fiber that does not have a gap 310 between itself and the end face 113 of the waveguide 112, for example, the tape fiber 100_1, slides on the holding mechanism 300 when the holding mechanism 300 is moved, and its position relative to the V-groove 111 does not change. As a result, the end of the V-groove 111 on the waveguide side remains in contact with the end face 113 of the waveguide 112. As a result, the tape fibers 100 can be adjusted collectively so that the end of the V-groove 111 on the waveguide side abuts the end face 113 of the waveguide 112 (collectively abutment adjustment process).

[0053] Here, the tip of the tape fiber 100 may be abutted against a predetermined surface of an abutting tool or the like in advance to align the position of the tip of the tape fiber 100. However, when the tip of the tape fiber 100 is abutted against the predetermined surface of an abutting tool or the like in advance, if minute scratches or dust adhere to the fiber core at the tip of the tape fiber, this will cause problems with light propagation in the fiber. Managing the adhesion of such dust and particles is difficult using conventional individual and manual processes.

[0054] In the collective contact adjustment process described above, the end face of the exposed fiber portion 102 of the ribbon fiber 100 can be contacted in an exposed and clean state with the end face 113 of the waveguide 112 at the end of the V-groove 111 formed in the wafer process. Furthermore, by processing at the wafer level and under automatic control, productivity can be improved.

[0055] Next, an adhesive (not shown) is locally applied to the strip-shaped lid (hereinafter referred to as the "continuous lid body") 220 (adhesive application step).

[0056] Next, an automatic pickup head (not shown) uses image recognition to align the exposed fiber portion 102 of the tape fiber 100 in a recess (corresponding to the recess 121 of the lid 120) in the lid continuum 220, and presses the lid continuum 220 against the PLC chip 110 and the tape fiber 100 from above (the side opposite to the side where the holding mechanism is located), thereby holding the tape fiber 100 with the holding mechanism 300 ( FIG. 10 ). Subsequently, the adhesive is cured by ultraviolet (UV) irradiation, and the tape fiber 100 is fixed to the lid continuum 220 (lid fixing process).

[0057] Next, only one row of PLC chips 110 (chip row 212) fixed by the lid continuum 220 from the back surface of the dicing tape is heated, and the chip row 212 is selectively peeled off from the tape (chip peeling step). A thermal peeling tape whose adhesive strength decreases when heated is used as the dicing tape.

[0058] This allows only one chip row 212 to be separated from the wafer (FIGS. 11 and 12). The chip row 212 (plurality of PLC chips 110) is indirectly held by the holding mechanism 300 because the holding mechanism 300 holds (for example, by suction) the plurality of ribbon fibers 100 and the continuum 220 of the lids.

[0059] Next, the lid continuum 220 is divided into a plurality of lids 120 along the lid scribe lines 221 by laser dicing (lid dicing step, FIG. 13).

[0060] When the wafer is divided into strip-shaped chips in the wafer dicing process described above, the lid continuum 220 and the wafer 200 are diced together in the lid dicing process, so that the PLC chips 110 to which the lids 120 are attached can be individually divided.

[0061] As a result of the above, a plurality of fiber arrays 10 shown in FIG. 14 are arranged in a line on the holding mechanism 300 (FIG. 15).

[0062] Finally, each fiber array 10 is transferred from the holding mechanism 300 to a tray 400 by an automatic pickup device (FIG. 16). This makes the fiber array 10 ready for shipment.

[0063] According to this embodiment, a fiber array is manufactured by mounting and fixing fibers on each row of PLC chips 110 from a PLC wafer, thereby making maximum use of the clean and aligned state of the end faces of the PLCs after wafer processing, thereby improving productivity.

[0064] If all the separated PLC chips were to be peeled off the dicing tape and placed in a tray after the wafer dicing process, the alignment of the PLC chips arranged in rows would be lost. If a fiber were then to be mounted on each separated PLC chip, alignment would require time and effort, preventing productivity from improving.

[0065] Furthermore, since the holding mechanism allows processing of a row of PLC chips at once, productivity can be improved compared to when a fiber is mounted on each PLC chip individually.

[0066] Although the present embodiment has been described with reference to an example in which a PLC chip is used, the present invention is not limited to this, and other optical chips such as a silicon photonics chip may also be used.

[0067] According to the fiber array of this embodiment, the fibers are arranged in V-grooves formed adjacent to the waveguides in the optical chip, so that the fibers can be optically connected to the waveguides of the optical chip with high precision.

[0068] Furthermore, the fiber array according to this embodiment can utilize the functions of the optical chip, such as waveguide, combining / branching, and mode field diameter conversion.

[0069] Furthermore, according to the method for manufacturing a fiber array according to the present embodiment, fibers are mounted and fixed simultaneously for each row (chip row) composed of a plurality of optical chips on a wafer on which optical chips are formed, thereby improving productivity. Furthermore, optical connection can be performed while maintaining a clean state after the wafer process, and the end faces of the optical chips and the fibers can be aligned, allowing for efficient manufacturing of fiber arrays with good characteristics.

[0070] 17, the fiber array 50 may include a PLC chip 510. The PLC chip 510 has a curved waveguide 512.

[0071] In the above-described PLC chip 110, the waveguide is formed in the extending direction of the V-groove, and has its end on an end surface parallel to the end surface of the V-groove.

[0072] On the other hand, the PLC chip 510 is fabricated using PLC technology, and the waveguide 512 in the PLC chip may be wavelength multiplexed, or the waveguide 512 may be curved and the end of the waveguide may be positioned on a plane perpendicular to the end face of the V-groove 111 of the PLC chip (Figure 18).

[0073] As a result, as shown in Figure 19, when connecting multiple optical fibers to a single silicon photonics chip 550, the optical fibers can be connected not only to one end face of the silicon photonics chip 550, but also to other end faces parallel to the direction in which the tape fiber 100 is arranged.

[0074] In conventional configurations, when connecting a tape fiber to an end face of a silicon photonics chip that is perpendicular to the end face to which the tape fiber is connected, it becomes necessary to bend (curve) the other tape fiber by 90 degrees. However, because the tape fiber has a flatter shape than a single-core fiber, it is difficult to bend (curve) the tape fiber.

[0075] According to the fiber array 50 using the PLC chip 510, there is no need to bend (curve) the tape fiber, so the connection between the optical chip such as a silicon photonics chip and the fiber can be made smaller, and the degree of freedom in the configuration of the optical connection can be increased.

[0076] In the embodiment of the present invention, an example using a tape fiber has been shown, but the present invention is not limited to this. A fiber composed of multiple fibers such as a ribbon fiber may also be used. Alternatively, a single fiber may also be used.

[0077] Although the embodiment of the present invention has been described with reference to an example in which a Si substrate is used, the present invention is not limited to this and other substrates such as a glass substrate may also be used.

[0078] In the embodiments of the present invention, examples of the structure, dimensions, materials, etc. of each component in the configuration and manufacturing method of the fiber array are shown, but the present invention is not limited to these. Anything that can demonstrate the function and effect of the fiber array can be used.

[0079] It should be noted that the present invention is not limited to the above-described embodiments, and it is clear that many modifications and combinations can be made by a person having ordinary knowledge in the art within the technical concept of the present invention.

[0080] A part or all of the above-described embodiment or an example thereof can be described as, but is not limited to, the following supplementary notes.

[0081] (Appendix 1) A fiber array comprising an optical chip, a fiber, and a lid, the optical chip comprising a substrate, a waveguide disposed on one surface of the substrate, and a V-groove disposed on one surface of the substrate, wherein the tip of the fiber is disposed in the V-groove and a portion of the lid is disposed to cover at least the tip of the fiber so that the core of the fiber and the waveguide are optically connected.

[0082] (Supplementary Note 2) The fiber array according to Supplementary Note 1, wherein the lid fixes the tip of the fiber and a portion of the fiber connected to the tip.

[0083] (Appendix 3) A fiber array as described in Appendix 2, wherein the lid has a recess on the surface of the lid facing the optical chip, and the tip and a portion of the fiber are positioned and fixed in the recess.

[0084] (Supplementary Note 4) The fiber array according to Supplementary Note 3, wherein the recess has an opening on the end surface on the base end side of the lid, and the fibers are led out from the opening.

[0085] (Supplementary Note 5) A method for manufacturing a fiber array including an optical chip having a waveguide, a fiber optically connected to the waveguide, and a lid, the method comprising the steps of: periodically fabricating, on a surface of a wafer, a plurality of optical chip regions each having the waveguide and a V-groove extending in one direction and in which the fiber is disposed; and fabricating, in another direction perpendicular to the one direction, a plurality of optical chip continuums; attaching tape to the back surface of the wafer; dicing the wafer into the optical chip continuum to expose the V-groove on an end surface parallel to the other direction of the optical chip continuum; and fabricating, on a surface of a wafer, a plurality of optical chip regions each having the waveguide and a V-groove extending in one direction and in which the fiber is disposed, the plurality of optical chip continuums being disposed in another direction perpendicular to the one direction. abutting the end faces of the tips of the fibers against the end faces of the waveguides; adhering the lid continuum to at least the V grooves and some of the fibers in the optical chip continuum; peeling the optical chip continuum from the tape; and dividing the lid continuum into the lids and dividing the optical chip continuum into the optical chips.

[0086] (Supplementary Note 6) A method for manufacturing a fiber array including an optical chip having a waveguide, a fiber optically connected to the waveguide, and a lid, the method comprising the steps of: periodically fabricating, on a surface of a wafer, a plurality of optical chip regions each having the waveguide and a V-groove extending in one direction and in which each of the fibers is disposed; and fabricating a plurality of rows of optical chips disposed in another direction perpendicular to the one direction; attaching tape to the back surface of the wafer; and dicing the wafer into a plurality of the optical chips disposed in a row, exposing the V-groove on an end surface of the optical chip parallel to the other direction. a step of arranging the end faces of the plurality of fibers so that they face the end faces of the plurality of V-grooves; a step of arranging the tip ends of the plurality of fibers collectively in the plurality of V-grooves; a step of abutting the end faces of the tip ends of the plurality of fibers collectively against the end faces of the plurality of waveguides; a step of adhering the continuum of lids to at least the V-grooves and some of the fibers in the optical chip; a step of peeling the plurality of optical chips arranged in a row from the tape; and a step of dividing the continuum of lids into the lids.

[0087] The present invention can be applied to optical communication systems and optical communication devices that use fibers.

[0088] REFERENCE SIGNS LIST 10 Fiber array 100 Fiber 110 Optical chip 111 V-groove 112 Waveguide 115 Substrate 120 Lid

Claims

1. A fiber array comprising an optical chip, fibers, and a lid, wherein the optical chip comprises a substrate, a waveguide disposed on one surface of the substrate, and a V-groove disposed on one surface of the substrate, wherein the tips of the fibers are disposed in the V-groove so that the cores of the fibers and the waveguides are optically connected, and wherein a portion of the lid is disposed so as to cover at least the tips of the fibers.

2. The fiber array according to claim 1, wherein the lid fixes the tips of the fibers and the portions of the fibers connected to the tips.

3. The fiber array according to claim 2, wherein the lid has a recess on a surface of the lid facing the optical chip, and the tip and a portion of the fiber are disposed and fixed in the recess.

4. The fiber array according to claim 3, wherein the recess has an opening on the end face on the base end side of the lid, and the fibers are led out from the opening.

5. A method for manufacturing a fiber array comprising an optical chip having a waveguide, a fiber optically connected to the waveguide, and a lid, comprising the steps of: periodically fabricating, on the surface of a wafer, a plurality of optical chip regions each having the waveguide and a V-groove extending in one direction and in which the fiber is disposed, and a plurality of optical chip continua arranged in another direction perpendicular to the one direction; attaching tape to the back surface of the wafer; dicing the wafer into the optical chip continua to expose the V-groove on an end surface parallel to the other direction of the optical chip continua; arranging the end surfaces of the plurality of fibers so as to face the end surfaces of the plurality of V-grooves; arranging the tip ends of the plurality of fibers collectively in the plurality of V-grooves; abutting the end surfaces of the tip ends of the plurality of fibers collectively against the end surfaces of the plurality of waveguides; and fixing the lid continuum to at least the V-grooves and some of the fibers in the optical chip continuum. A method for manufacturing a fiber array, comprising the steps of: peeling the optical chip continuum from the tape; and dividing the lid continuum into the lids and dividing the optical chip continuum into the optical chips.

6. A method for manufacturing a fiber array comprising an optical chip having a waveguide, fibers optically connected to the waveguide, and a lid, comprising the steps of: periodically fabricating, on the surface of a wafer, a plurality of optical chip regions each having the waveguide and a V-groove extending in one direction and in which each of the fibers is disposed; and a plurality of rows of optical chips disposed in another direction perpendicular to the one direction; attaching tape to the back surface of the wafer; dicing the wafer into a plurality of optical chips disposed in a row, exposing the V-grooves on end faces of the optical chips parallel to the other direction; arranging end faces of a plurality of the fibers so as to face end faces of a plurality of the V-grooves; arranging tip ends of a plurality of the fibers collectively in a plurality of the V-grooves; abutting end faces of the tip ends of a plurality of the fibers collectively against end faces of a plurality of the waveguides; and fixing the contiguous lid to at least the V-grooves and some of the fibers in the optical chip. A method for manufacturing a fiber array, comprising: a step of peeling off the plurality of optical chips arranged in a row from the tape; and a step of dividing the continuous body of lids into the lids.

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