Exposure apparatus, field stop, and device manufacturing method

Abstract

This exposure apparatus comprises: a stage that moves a substrate in a first direction; a first optical system that includes a first field stop for setting a first illumination region (PId); and a second optical system that includes a second field stop for setting a second illumination region (PIe). The first and second illumination regions (PId, PIe) respectively include first and second central portions of which the widths in the first direction have a predetermined size, and first and second peripheral portions of which the widths in the first direction decrease toward the ends of the first and second illumination regions in a second direction orthogonal to the first direction. A section of the first central portion and a section of the second peripheral portion are located on a straight line parallel to the first direction, and the first peripheral portion and another section of the second peripheral portion are located on a straight line parallel to the first direction. It is possible to make a modification such that the area of a section corresponding to an overlap region in a peripheral portion of an exposure field changes, thereby making it possible to adjust the exposure amount in the overlap region.

Description

Exposure apparatus, field stop, and device manufacturing method

[0001] The present invention relates to an exposure apparatus, a field stop, and a device manufacturing method.

[0002] A scanning exposure apparatus is known as an apparatus for exposing and transferring a pattern formed on a mask onto a large substrate by scanning the mask and substrate relative to a projection optical system. Scanning exposure expands the exposure field in the scanning direction (scanning direction), but exposure apparatuses are also known that perform multiple scanning exposures with the exposure fields overlapping in the non-scanning direction in order to further expand the exposure field in a direction intersecting the scanning direction (non-scanning direction).

[0003] Furthermore, a method is also known in which a plurality of projection optical systems are arranged in parallel in the non-scanning direction, and exposure is performed while overlapping portions of the exposure fields exposed by the plurality of projection optical systems, thereby exposing and transferring a pattern onto a substrate in a single scan (see, for example, Patent Document 1).

[0004] Japanese Patent Application Publication No. 10-116774

[0005] According to a first aspect of the disclosure, an exposure apparatus includes a stage that moves a substrate in a first direction, a first optical system that includes a first field stop and irradiates light onto a first illumination area on the substrate that is set by the first field stop, and a second optical system that includes a second field stop and irradiates light onto a second illumination area on the substrate that is set by the second field stop, wherein the first illumination area includes a first central portion that has a predetermined width in the first direction and a first peripheral portion that decreases in width in the first direction toward an end of the first illumination area in a second direction perpendicular to the first direction, and the second illumination area includes a second central portion that has a predetermined width in the first direction and a second peripheral portion that decreases in width in the first direction toward the end of the second illumination area in the second direction, and a portion of the first central portion and a portion of the second peripheral portion are located on a straight line parallel to the first direction, and the first peripheral portion and other portions of the second peripheral portion are located on a straight line parallel to the first direction.

[0006] According to a second aspect of the disclosure, an exposure apparatus includes a stage that moves a substrate in a first direction, an optical system that includes a first field stop and irradiates light onto an illumination area on the substrate set by the first field stop, and a control device, wherein the control device irradiates the light onto a first area on the substrate extending in the first direction while moving the substrate in the first direction relative to the illumination area, then moves the substrate a first length in a second direction perpendicular to the first direction, and then irradiates the light onto a second area on the substrate extending in a direction parallel to the first direction while moving the substrate in a direction parallel to the first direction relative to the illumination area, wherein the illumination area includes a first central portion having a predetermined width in the first direction and a first peripheral portion whose width in the first direction decreases toward an end of the illumination area in the second direction perpendicular to the first direction, and the first length is greater than the length of the first central portion in the second direction and less than the sum of the length of the first central portion in the second direction and the length of the first peripheral portion in the second direction.

[0007] According to a third aspect of the disclosure, the field stop is provided in a projection optical system that projects an image of an object onto an image plane, and sets a projection area of ​​the image of the object on the image plane, and includes a first part and a second part that are arranged spaced apart in a first direction in a plane perpendicular to the optical axis of the projection optical system, a third part and a fourth part that are arranged spaced apart in a second direction perpendicular to the first direction in the plane, and that form a first opening that sets the projection area together with the first part and the second part, and a drive unit that drives at least one of the first part, the second part, the third part, and the fourth part within the plane to change the shape of the first opening.

[0008] According to a fourth aspect of the disclosure, a field stop is provided in a projection optical system that projects an image of an object onto an image plane, and sets a projection area of ​​the image of the object on the image plane, and comprises a first portion and a second portion that are arranged spaced apart in a first direction in a plane perpendicular to the optical axis of the projection optical system, and a third portion and a fourth portion that are arranged spaced apart in a second direction perpendicular to the first direction in the plane and form a first opening together with the first portion and the second portion, and the third portion has a plurality of components, and the shape of the edge that forms the first opening of the third portion changes depending on the posture of each of the plurality of components.

[0009] According to a fifth aspect of the disclosure, an exposure apparatus includes an illumination optical system that illuminates a mask with light from a light source, a projection optical system that projects a pattern formed on the mask onto a substrate, and the above-mentioned field stop, and exposes the substrate while moving the mask and the substrate in a scanning direction.

[0010] According to a sixth aspect of the disclosure, a device manufacturing method includes developing the substrate exposed by the exposure apparatus.

[0011] The configurations of the embodiments described below may be modified as appropriate, and at least a portion of the configuration may be replaced with other components. Furthermore, components that are not particularly limited in terms of their placement may be placed in any position that can achieve their function, not limited to the placement disclosed in the embodiments.

[0012] FIG. 1 is a diagram illustrating the configuration of an exposure apparatus according to the first embodiment. FIG. 2 is a perspective view showing a portion of the exposure apparatus according to the first embodiment. FIG. 3 is a perspective view showing an enlarged view from the fly's eye lens to the mask of the exposure apparatus according to the embodiment. FIG. 4A is a diagram showing the exposure field on a photosensitive substrate of each projection optical system, and FIG. 4B is a diagram showing the exposure area formed on the photosensitive substrate. FIG. 5A is a plan view showing the configuration of a field stop provided in the projection optical system. FIG. 5B is a cross-sectional view taken along line A-A in FIG. 5A. FIG. 5C is a cross-sectional view taken along line B-B in FIG. 5A. FIG. 5D is a cross-sectional view taken along line C-C in FIG. 5A. FIG. 6A shows the case where the third member is driven in the -X direction by the first drive unit. FIGS. 6B and 6C are diagrams for explaining the change in the exposure field when the third member is driven in the -X direction. FIG. 7(A) shows a case where the third member is driven in the +X direction by the first drive unit, and FIGS. 7(B) and 7(C) are diagrams for explaining changes in the exposure field when the third member is driven in the +X direction. FIG. 8(A) is a diagram showing the exposure field when the third member is in the initial position, and FIG. 8(B) is a diagram showing the exposure field when the third member is driven in the -X direction. FIG. 9(A) is a plan view showing a schematic configuration of a field diaphragm according to Modification 1, and FIG. 9(B) is a plan view showing a schematic configuration of a field diaphragm according to Modification 2. FIG. 10 is a plan view showing a schematic configuration of a field diaphragm according to Modification 3. FIG. 11 is a plan view showing a schematic configuration of a field diaphragm according to Modification 4. Fig. 12(A) is a diagram showing a schematic configuration of a field stop according to Modification 5, Fig. 12(B) is a plan view showing an example of the operation of the link mechanism, Fig. 12(C) shows the exposure field obtained when the link mechanism is in the state shown in Fig. 12(A), and Fig. 12(D) shows the exposure field obtained when the link mechanism is in the state shown in Fig. 12(B). Fig. 13(A) is a plan view showing a schematic configuration of a field stop according to Modification 6, and Fig. 13(B) is a plan view showing a schematic configuration of a field stop according to Modification 7. Figs. 14(A) and 14(B) are plan views showing a schematic configuration of a field stop according to Modification 8.FIG. 15(A) is a diagram showing the relationship between the exposure field and the exposure dose when the third member and the fourth member are in their initial positions, and FIG. 15(B) is a diagram showing the relationship between the exposure field and the exposure dose when the third member is driven to increase the width of the central part of the exposure field in the Y direction and change the shape of the exposure field. FIG. 16 is a diagram showing the configuration of an exposure apparatus according to a second embodiment. FIG. 17(A) is a diagram showing the fly's eye lens, the light attenuation unit, and the drive unit provided in the illumination optical system, as viewed from the input lens side, and FIG. 17(B) is a diagram for explaining a method of adjusting the exposure dose using a light-shielding member. FIG. 18 is a diagram showing the schematic configuration of an exposure apparatus according to a third embodiment. FIG. 19 is a diagram showing an example of multiple shot areas set on a substrate.

[0013] First Embodiment An exposure apparatus 100 according to a first embodiment will be described with reference to FIGS. 1 to 8B.

[0014] (Configuration of Exposure Apparatus) Fig. 1 is a diagram illustrating the configuration of an exposure apparatus 100 according to the first embodiment. Fig. 2 is a perspective view showing a portion of the exposure apparatus 100.

[0015] As shown in Figure 2, exposure apparatus 100 is equipped with seven projection optical systems 19a to 19g. Note that only two of these, projection optical systems 19a and 19b, are shown in Figure 1. Note that the number of projection optical systems equipped in exposure apparatus 100 is not limited to seven, and may be any number as long as there is more than one, for example, six or less, or eight or more.

[0016] 2, of the seven projection optical systems 19a to 19g, four projection optical systems 19a, 19c, 19e, and 19g are aligned in the Y direction. The three projection optical systems 19b, 19d, and 19f are aligned in the Y direction and are positioned on the +X side of the first row of projection optical systems 19a, 19c, 19e, and 19g. Hereinafter, the projection optical systems 19a, 19c, 19e, and 19g may be referred to as the first row of projection optical systems 19a, 19c, 19e, and 19g, and the projection optical systems 19b, 19d, and 19f may be referred to as the second row of projection optical systems 19b, 19d, and 19f.

[0017] The first row of projection optical systems 19a, 19c, 19e, and 19g are arranged such that their optical axes are spaced apart at a predetermined interval in the Y direction. Similarly to the first row of projection optical systems 19a, 19c, 19e, and 19g, the second row of projection optical systems 19b, 19d, and 19f are also arranged such that their optical axes are spaced apart at a predetermined interval in the Y direction.

[0018] Projection optical system 19b is disposed so that the position of its optical axis in the Y direction coincides with approximately the center of the line connecting the optical axis of projection optical system 19a with the optical axis of projection optical system 19c. Projection optical system 19d is disposed so that the position of its optical axis in the Y direction coincides with approximately the center of the line connecting the optical axis of projection optical system 19c with the optical axis of projection optical system 19e. Projection optical system 19f is disposed so that the position of its optical axis in the Y direction coincides with approximately the center of the line connecting the optical axis of projection optical system 19e with the optical axis of projection optical system 19g.

[0019] The projection optical systems 19a to 19g are optical systems that form erect images with a projection magnification (lateral magnification) of +1, and transfer the pattern drawn on the mask 15 onto the photosensitive material 222 of the photosensitive substrate 22 by exposure.

[0020] 1, the photosensitive substrate 22 includes a substrate 221 and a photosensitive material 222 formed on the upper surface of the substrate 221. The photosensitive substrate 22 is held by a substrate stage 27 via a substrate holder (not shown). The substrate stage 27 is capable of scanning in the X direction on a substrate stage surface plate 28 and moving in the Y direction by a linear motor (not shown) or the like. The position of the substrate stage 27 in the X direction is measured by a laser interferometer 25 via the position of a movable mirror 24 attached to the substrate stage 27. Similarly, the position of the substrate stage 27 in the Y direction is measured by a laser interferometer (not shown).

[0021] The position detection optical system 23 detects the position of an existing pattern such as an alignment mark formed on the photosensitive substrate 22 .

[0022] The mask 15 is held by a mask stage 16. The mask stage 16 is scanned in the X direction on a mask stage base 17 by a linear motor (not shown) or the like, and is also capable of slight movement in the Y direction. The position of the mask stage 16 in the X direction is measured by a laser interferometer 14 via the position of a movable mirror 13 attached to the mask stage 16. Similarly, the position of the mask stage 16 in the Y direction is measured by a laser interferometer (not shown).

[0023] The control device CTR controls linear motors (not shown) and the like based on measurement values ​​from the laser interferometers 14, 25, etc., to control the XY positions of the mask stage 16 and the substrate stage 27. When exposing the pattern of the mask 15 onto the photosensitive substrate 22, the control device CTR scans the mask 15 and the photosensitive substrate 22 at approximately the same speed in the X direction relative to the projection optical systems 19a to 19g while maintaining the imaging relationship between the mask 15 and the photosensitive substrate 22 formed by the projection optical systems 19a to 19e.

[0024] The control device CTR also controls the amount of illumination light (exposure light) emitted from illumination optical systems ILa to ILg (described later) and the relative scanning speed of the mask 15 and photosensitive substrate 22 with respect to projection optical systems 19a to 19g (the scanning speed in the X direction of the mask stage 16 and substrate stage 27), etc. The control device CTR also controls the shape of the exposure field that is set by field stops 21a to 21g (described later).

[0025] In this specification, the direction (X direction) in which the photosensitive substrate 22 is scanned during exposure is also referred to as the "scanning direction." Furthermore, the direction (Y direction) that is included within the plane of the photosensitive substrate 22 and is perpendicular to the X direction is also referred to as the "non-scanning direction." For example, the non-scanning direction is a direction that is perpendicular to the optical axis of the projection optical system and intersects (is perpendicular to) the scanning direction. The Z direction is a direction that is perpendicular to the X and Y directions. Note that the X, Y, and Z directions indicated by arrows in FIG. 1 and the following figures are positive directions.

[0026] As shown in Fig. 2, the exposure apparatus 100 includes multiple illumination optical systems ILa-ILg corresponding to the projection optical systems 19a-19g, respectively. As an example, as shown in Fig. 1, the illumination optical system ILa corresponding to the projection optical system 19a includes an input lens 8a, a fly's eye lens 11a, and a condenser lens 12a along the optical axis IXa. Furthermore, the illumination optical system ILb corresponding to the projection optical system 19b includes an input lens 8b, a fly's eye lens 11b, and a condenser lens 12b along the optical axis IXb. Similarly, the other illumination optical systems ILc-ILg include input lenses 8c-8g, fly's eye lenses 11c-11g, and condenser lenses 12c-12g, respectively.

[0027] Of the components of each of the illumination optical systems ILa to ILg, only the fly-eye lenses 11a to 11g and the condenser lenses 12a to 12g are shown in Fig. 2. Furthermore, Fig. 1 does not show the projection optical systems 19c to 19g because their positions in the X direction overlap with those of the projection optical systems 19a and 19b. Similarly, the illumination optical systems ILc to ILg are not shown because their positions in the X direction overlap with those of the illumination optical systems ILa and ILb.

[0028] As shown in FIG. 1 , illumination light supplied from a light source 1 such as a lamp is supplied to each of illumination optical systems ILa-ILg via a light-guiding optical system including an elliptical mirror 2, a bending mirror 3, a relay lens 4, a bending mirror 5, a relay lens 6, and an optical fiber 7. The optical fiber 7 splits the illumination light incident on a single incident side 71 approximately evenly and outputs it to seven exit sides 72a-72g. The illumination light output from each of the seven exit sides 72a-72g (72c-72g not shown) of the optical fiber 7 enters input lenses 8a-8g in each of illumination optical systems ILa-ILg. The illumination light then passes through fly-eye lenses 11a-11g and condenser lenses 12a-12g to irradiate each of illumination regions MIa-MIg on a mask 15.

[0029] FIG. 3 is an enlarged perspective view of a fly-eye lens 11c and a condenser lens 12c included in the illumination optical system ILc, and an illumination area MIc on the mask 15, as an example.

[0030] The fly's eye lens 11c is formed by arranging a plurality of lens elements 110 in the X and Y directions. Each lens element 110 has a rectangular cross-sectional shape (shape in the XY plane) elongated in the Y direction, similar to the illumination area MIc. The incident surface of each lens element 110 (the upper surface in FIG. 3 , i.e., the surface on the +Z side) is a conjugate plane with respect to the illumination area MIc on the mask 15, due to the optical system consisting of each lens element 110 and the condenser lens 12c. Therefore, it is also a conjugate plane with respect to the exposure field PIc on the photosensitive substrate 22. The illumination light irradiated onto the incident surface of each lens element 110 is superimposed on and irradiated onto the illumination area MIc on the mask 15. This results in a substantially uniform illuminance of the illumination light within the illumination area MIc.

[0031] The configurations of the other illumination optical systems ILa to ILg, excluding the illumination optical system ILc, are similar to the configuration shown in Fig. 3. The fly-eye lenses 11a to 11g are examples of optical integrators that irradiate the respective illumination regions MIa to MIg with superimposed illumination light.

[0032] Each of the projection optical systems 19a to 19g is configured, for example, as a double-imaging optical system in order to form an erect, normal image. In this case, an intermediate image of the pattern of the mask 15 is formed on an intermediate image plane 20 located near the middle of each of the projection optical systems 19a to 19g in the direction of the optical axes PXa to PXg (Z direction) by the optical system that constitutes the upper half of each of the projection optical systems 19a to 19g. The intermediate image is then re-imaged by the optical system that constitutes the lower half of each of the projection optical systems 19a to 19g, and an image corresponding to the pattern of the mask 15 is formed on the photosensitive substrate 22.

[0033] Since the intermediate image plane 20 is conjugate with the photosensitive substrate 22, by placing field stops 21a to 21g at the intermediate image plane 20 in each of the projection optical systems 19a to 19g, respectively, it is possible to define the exposure fields (also called projection areas or illumination areas) PIa to PIg on the photosensitive substrate 22 by each of the projection optical systems 19a to 19g.

[0034] 4A is a diagram showing the exposure fields PIa to PIg of the seven projection optical systems 19a to 19g on the photosensitive substrate 22. The exposure fields PIa, PIc, PIe, and PIg of the first row of projection optical systems 19a, 19c, 19e, and 19g are trapezoids with the shorter side of the two sides parallel to the Y direction on the +X side and the longer side on the -X side. However, the exposure field PIa located at the end in the -Y direction has its -Y end parallel to the X direction. Furthermore, the exposure field PIg located at the end in the +Y direction has its +Y end parallel to the X direction.

[0035] The exposure fields PIb, PId, and PIf of the second row of projection optical systems 19b, 19d, and 19f are trapezoids with the shorter side of the two sides parallel to the Y direction on the -X side and the longer side on the +X side.

[0036] 4B is a diagram showing exposure areas (scanning exposure fields) formed on the photosensitive substrate 22 when the photosensitive substrate 22 is scanned in the X direction by the substrate stage 27 and exposed by the exposure fields PIa to PIg shown in FIG. 4A. Exposure areas SIa to SIg exposed by the respective exposure fields PIa to PIg through scanning exposure are formed on the photosensitive substrate 22. In FIG. 4B, the exposure areas SIa, SIc, SIe, and SIg formed by the first row of projection optical systems 19a, 19c, 19e, and 19g are indicated by dashed-dotted lines, and the exposure areas SIb, SId, and SIf formed by the second row of projection optical systems 19b, 19d, and 19f are indicated by dashed-two-dot lines.

[0037] These exposure areas SIa to SIg are the exposure fields PIa to PIg extended in the X direction by scanning exposure in the X direction. That is, each of the exposure areas SIa to SIg is an area extending in the X direction on the photosensitive substrate 22.

[0038] The Y-direction (non-scanning direction) end of each exposure field SIa-SIg overlaps the non-scanning direction end of the adjacent other exposure fields SIa-SIg. For example, the exposure field formed by the +Y side region of exposure field PIa overlaps with the exposure field formed by the -Y side region of exposure field PIb. This is similar for the other exposure fields, so a description thereof will be omitted.

[0039] Overlapped regions Oa-Of, where adjacent exposure regions overlap, are first exposed by the first row of projection optical systems 19a, 19c, 19e, and 19g, and then by the second row of projection optical systems 19b, 19d, and 19f. Non-overlapped regions Sa-Sg, where adjacent exposure regions do not overlap, are exposed by the projection optical systems 19a-19g, respectively.

[0040] In the overlap regions Oa to Of, when the sum (accumulated exposure amount) of the exposure amount of the photosensitive material 222 by the exposure light patterned by the pattern of the mask 15 through the first row of projection optical systems 19a, 19c, 19e, and 19g and the exposure amount of the photosensitive material 222 by the exposure light patterned by the pattern of the mask 15 through the second row of projection optical systems 19b, 19d, and 19f exceeds a predetermined threshold, the portion where the accumulated exposure amount exceeds the threshold is dissolved by development (in the case of a positive type) or remains (in the case of a negative type), and a resist image is formed.

[0041] On the other hand, if the integrated exposure amount of the photosensitive material 222 in the overlap region is less than the threshold, the exposure will be insufficient. If the exposure amount in the overlap region can be increased when the exposure amount of the photosensitive material 222 is insufficient, the exposure will be reduced.

[0042] Therefore, in this embodiment, the projection optical systems 19a to 19g of the exposure apparatus 100 are each equipped with field stops 21a to 21g that can change (increase / decrease) the exposure amount in the overlap region. Specifically, the projection optical systems 19a to 19g are each equipped with field stops 21a to 21g that can change the shape of the exposure fields PIa to PIg.

[0043] For example, the field stops 21a, 21c, 21e, 21g provided in the first row of projection optical systems 19a, 19c, 19e, 19g may be field stops in which the shapes of the exposure fields PIa, PIc, PIe, PIg can be changed, and the field stops 21b, 21d, 21f provided in the second row of projection optical systems 19b, 19d, 19f may be field stops in which the shapes of the exposure fields PIb, PId, PIf are fixed. Furthermore, the field stops 21b, 21d, and 21f provided in the second row of projection optical systems 19b, 19d, and 19f may be field stops in which the shapes of the exposure fields PIb, PId, and PIf can be changed, and the field stops 21a, 21c, 21e, and 21g provided in the first row of projection optical systems 19a, 19c, 19e, and 19g may be field stops in which the shapes of the exposure fields PIa, PIc, PIe, and PIg are fixed.

[0044] Fig. 5(A) is a plan view showing, as an example, the structure of field stop 21d provided in second row projection optical system 19d, Fig. 5(B) is a cross-sectional view taken along line A-A in Fig. 5(A), Fig. 5(C) is a cross-sectional view taken along line B-B in Fig. 5(A), and Fig. 5(D) is a cross-sectional view taken along line C-C in Fig. 5(A). Note that while the structure of field stop 21d will be described, the configurations of field stops 21a to 21g other than field stop 21d are the same as those shown in Figs. 5(A) to 5(D).

[0045] As shown in FIG. 5A , the field stop 21d includes a first member 211, a second member 212, a third member 213, and a fourth member 214. The first member 211 and the second member 212 are spaced apart in the X direction within the XY plane. The third member 213 and the fourth member 214 are spaced apart in the Y direction (non-scanning direction) perpendicular to the X direction within the XY plane, and together with the first member 211 and the second member 212, form an aperture OP that sets an exposure field (projection area, illumination area). In this embodiment, the field stop 21d is provided in the projection optical system 19d, but the field stop 21d may also be provided in the illumination optical system ILd. Alternatively, the field stop 21d may be provided in both the projection optical system 19d and the illumination optical system ILd. It is sufficient for the field stop 21d to set an illumination area (exposure field PId) on the photosensitive substrate 22 using light from the illumination optical system ILd.

[0046] In this embodiment, the aperture OP may be formed by multiple members arranged on different conjugate planes as long as it defines an area through which light from the illumination optical system ILd passes. For example, the aperture OP may be formed by providing the first member 211 and the second member 212 that define the edge in the scanning direction in the illumination optical system ILd, and the third member 213 and the fourth member 214 that define the edge in the non-scanning direction in the projection optical system 19d. Alternatively, the aperture OP may be formed by providing the first member 211 and the second member 212 that define the edge in the scanning direction in the projection optical system 19d, and the third member 213 and the fourth member 214 that define the edge in the non-scanning direction in the illumination optical system ILd.

[0047] 5C , a side surface 211s on the opening OP side of the first member 211 and a side surface 212s on the opening OP side of the second member 212 are inclined so as not to eclipse light incident on the field stop 21d from the +Z direction. The width in the X direction of the top surface (the surface on the +Z side) of the first member 211 is narrower than the width in the X direction of the bottom surface (the surface on the -Z side). Furthermore, the width in the X direction of the top surface (the surface on the +Z side) of the second member 212 is narrower than the width in the X direction of the bottom surface (the surface on the -Z side).

[0048] Because light emitted from field stop 21d diffracts and spreads, as shown in FIG. 5(D), side surface 213s on the opening OP side of third member 213 and side surface 214s on the opening OP side of fourth member 214 are inclined so as not to eclipse the light emitted from field stop 21d. The width in the Y direction of the top surface (+Z side surface) of third member 213 is wider than the width in the Y direction of the bottom surface (-Z side surface). In addition, the width in the Y direction of the top surface (+Z side surface) of fourth member 214 is wider than the width in the Y direction of the bottom surface (-Z side surface).

[0049] 5D , in this embodiment, the conjugate plane (intermediate image plane 20) with respect to the photosensitive substrate 22 is located in the optical axis direction (Z direction) between the first member 211 and the second member 212 and the third member 213 and the fourth member 214. The distance d in the Z direction between the first member 211 and the third member 213 and the fourth member 214 is set to, for example, less than 1000 nm, less than 500 nm, less than 300 nm, or less than 100 nm.

[0050] The field stop 21d is configured to be able to change the shape of the exposure field PId so that the area of ​​the portions of the exposure field PId that correspond to the overlap regions Oc and Od changes.

[0051] Specifically, field stop 21d includes a first driver 215 that drives third member 213 in the X direction, and a second driver 216 that drives fourth member 214 in the X direction. Note that, when projection optical systems 19a to 19g include field stops configured so that the shape of their respective exposure fields can be changed, only one of third member 213 and fourth member 214 may be drivable in the X direction.

[0052] Fig. 6A shows a case where the third member 213 is driven in the -X direction (the direction indicated by the arrow AR1) by the first driving unit 215. In Fig. 6A, the initial position of the third member 213 (the position in Fig. 5A) is indicated by a dotted line.

[0053] 6(B) and 6(C) are diagrams for explaining changes in the exposure field PId when the third member 213 is driven in the −X direction (the direction indicated by the arrow AR1). Fig. 6(B) shows the exposure field PId when the third member 213 is in the initial position, and Fig. 6(C) shows the exposure field PId when the third member 213 is in the position shown in Fig. 6(A).

[0054] As shown in FIG. 6B, the exposure field PId includes a central portion Pc having a predetermined width in the X direction and peripheral portions Pp1 and Pp2 whose width in the X direction decreases toward the ends in the Y direction. When the third member 213 is driven in the −X direction, the width of the central portion Pc in the Y direction increases by the amount indicated by the hatching, as shown in FIG. 6C. This increases the area of ​​the region in the exposure field PId corresponding to the overlap region Od_in in FIG. 6B. Also, as shown in FIG. 6C, the Y direction width of the overlap region Od_ac obtained when the third member 213 is driven in the −X direction is larger than the Y direction width of the overlap region Od_in shown in FIG. 6B. The third member 213 is an example of a setting member that can be moved in the X direction to change the Y direction width of the central portion Pc.

[0055] Fig. 7A shows a case where the third member 213 is driven in the +X direction (the direction indicated by the arrow AR2) by the first driving unit 215. In Fig. 7A, the initial position of the third member 213 (the position in Fig. 5A) is indicated by a dotted line.

[0056] 7B and 7C are diagrams for explaining changes in the exposure field PId when the third member 213 is driven in the +X direction (the direction indicated by the arrow AR2). Fig. 7B shows the exposure field PId when the third member 213 is in the initial position, and Fig. 7C shows the exposure field (projection area, illumination area) PId when the third member 213 is in the position shown in Fig. 7A.

[0057] When the third member 213 is driven in the +X direction, the width of the central portion Pc in the Y direction decreases, as shown in FIG. 7C. This reduces the area of ​​the region in the exposure field PId that corresponds to the overlap region Od_in in FIG. 7B. Furthermore, the width in the Y direction of the overlap region Od_ac shown in FIG. 7C becomes smaller than the width in the Y direction of the overlap region Od_in shown in FIG. 7B. In this way, the field stop 21d can change the shape of the exposure field PId so that the area of ​​the portion corresponding to the overlap region changes.

[0058] Here, the reason why the exposure amount in the overlap region can be changed by changing the area of ​​the portion of the exposure field PId that corresponds to the overlap region will be explained.

[0059] FIG. 8A shows the exposure field PId when the third member 213 is in the initial position, and FIG. 8B shows the exposure field PId when the third member 213 is driven in the −X direction.

[0060] In FIG. 8A, the width in the X direction of the peripheral portion Pp1 of the exposure field PId at the position Pos1 is set to Wxdi, and the width in the X direction of the peripheral portion Pp1 of the exposure field PIe at the position Pos1 is set to Wxei.

[0061] When the third member 213 is driven in the -X direction, the width in the Y direction of the central portion Pc of the exposure field PId increases, and the position of the peripheral portion Pp1 shifts in the Y direction, as shown in Figure 8(B). As a result, the width Wxdac in the X direction of the peripheral portion Pp1 of the exposure field PId at position Pos1 becomes larger than the width Wxdi shown in Figure 8(A). The width Wxeac in the X direction of the peripheral portion Pp1 of the exposure field PIe at position Pos1 remains the same as the width Wxei shown in Figure 8(B).

[0062] Here, the exposure amount of the photosensitive material 222 at position Pos1 is determined by the illuminance of the exposure light multiplied by the irradiation time of the exposure light. The irradiation time of the exposure light is proportional to the sum of the width in the X direction of the peripheral portion Pp1 of the exposure field PId at position Pos1 and the width in the X direction of the peripheral portion Pp1 of the exposure field PIe at position Pos1.

[0063] 8B, when the third member 213 is driven in the −X direction, the width in the X direction of the peripheral portion Pp1 of the exposure field PId at the position Pos1 increases, and the irradiation time of the exposure light increases, thereby increasing the amount of exposure of the photosensitive material 222 at the position Pos1.

[0064] On the other hand, although not shown, when the third member 213 is driven in the +X direction, the width in the X direction of the peripheral portion Pp1 of the exposure field PId at position Pos1 becomes smaller, and the irradiation time of the exposure light becomes shorter, thereby reducing the amount of exposure of the photosensitive material 222 at position Pos1.

[0065] In this way, by driving the third member 213 in the X direction to change the shape of the exposure field PId, it is possible to adjust the amount of exposure of the photosensitive material 222 in the overlap region.

[0066] If the exposure amount is insufficient in the overlap region, the width of the central portion Pc of the exposure field PId in the Y direction can be increased to increase the exposure amount of the photosensitive material 222 in the overlap region. This makes it possible to suppress exposure defects caused by insufficient integrated exposure amount. The fourth member 214 and the second drive unit 216 have the same configuration as the third member 213 and the first drive unit 215, and therefore detailed description thereof will be omitted.

[0067] As described above in detail, according to the first embodiment, the exposure apparatus 100 comprises the substrate stage 27 that holds the photosensitive substrate 22, the projection optical systems 19d and 19e that each irradiate the photosensitive substrate 22 with light, the field stop 21d that sets an exposure field (illumination area) PId on the photosensitive substrate 22 by light from the projection optical system 19d, and the projection optical systems 19d and 19e that project light onto the exposure field SId extending in the X direction on the photosensitive substrate 22 while moving the photosensitive substrate 22 in the X direction relative to the projection optical systems 19d and 19e. and a control device CTR that causes light to be emitted via the projection optical system 19e onto an exposure area SIe that is different from the exposure area SId and that includes an overlap area Od that overlaps with the exposure area SId and a non-overlapping area Se other than the overlap area Od and extends in the X direction on the photosensitive substrate 22, wherein the field stop 21d is capable of changing the shape of the exposure field PId so that the area of ​​the portion of the exposure field PId that corresponds to the overlap area Od changes. This makes it possible to increase or decrease the exposure amount in the overlap area Od, as described in Figures 8A and 8B.

[0068] In the first embodiment, the exposure field PId includes a central portion Pc having a predetermined width in the X direction and peripheral portions Pp1 and Pp2 whose width in the X direction decreases toward the ends of the exposure field PId in the Y direction, and the width in the Y direction of the central portion Pc is variable so that the area of ​​the portion corresponding to the overlap region Od changes, thereby adjusting the exposure amount of the photosensitive material 222 in the overlap region Od.

[0069] In the first embodiment, the field stop 21d includes a third member 213 that can change the shape of the exposure field PId, and the third member 213 is movable in the X direction so as to change the width of the central portion Pc in the Y direction. This makes it possible to adjust the exposure amount of the photosensitive material 222 in the overlap region Od with a simple configuration.

[0070] Furthermore, according to the first embodiment, the field stop 21d is provided in the projection optical system 19d that projects an image of a pattern formed on the mask 15 onto the photosensitive substrate 22, and is a field stop that sets a projection region (exposure field PId) of the pattern image on the photosensitive substrate 22. The field stop includes a first member 211 and a second member 212 that are spaced apart in the X direction in an XY plane that is perpendicular to the optical axis of the projection optical system 19d, a third member 213 and a fourth member 214 that are spaced apart in the Y direction (non-scanning direction) that is perpendicular to the X direction in the XY plane, and form an opening OP that sets the exposure field PId together with the first member 211 and the second member 212, and a first drive unit 215 that drives the third member 213 in the XY plane to change the shape of the opening OP. Driving the third member 213 changes the width in the X direction of the opening OP in a portion corresponding to the overlap region Od, thereby changing the irradiation time of the exposure light. This makes it possible to adjust the amount of exposure of the photosensitive material 222 in the overlap area Od.

[0071] In the exposure apparatus 100, the projection optical system 19f, which irradiates the photosensitive substrate 22 with light, includes a field stop 21f that sets an exposure field PIf on the photosensitive substrate 22 using light from the projection optical system 19f. The control device CTR irradiates the light via the projection optical system 19f onto an exposure field SId and an exposure field SIf that extend in the X direction on the photosensitive substrate 22, including an overlap region Oe that overlaps with the exposure field SIe and a non-overlapping region Sf other than the overlap region Oe, while moving the photosensitive substrate 22 in the X direction relative to the projection optical system 19f. The field stop 21f can change the shape of the exposure field PIf so that the area of ​​the portion of the exposure field PIf set using the field stop 21f that corresponds to the overlap region Oe changes. This allows the exposure amount of the photosensitive material 222 in the overlap region Oe to be increased or decreased.

[0072] The field stops 21d and 21f can change the shapes of the exposure fields PId and PIf so that the area of ​​the portion of the exposure field PId corresponding to the overlap region Od differs from the area of ​​the portion of the exposure field PIf corresponding to the overlap region Oe, thereby making it possible to make the amount of exposure of the photosensitive material 222 in the overlap region Od different from the amount of exposure of the photosensitive material 222 in the overlap region Oe.

[0073] (Variation 1) Fig. 9(A) is a plan view showing a schematic configuration of field stop 21A according to Variation 1. Field stop 21A includes a first driver 215A that drives third member 213 in the Y direction and a second driver 216A that drives fourth member 214 in the Y direction. As shown in Fig. 9(A), by driving third member 213 and fourth member 214 in the Y direction (the direction indicated by arrow AR3), the shape of the exposure field may be changed to increase / decrease the exposure amount of photosensitive material 222 in the overlap region.

[0074] (Variation 2) Figure 9(B) is a plan view showing a schematic configuration of field stop 21B according to Variation 2. Field stop 21B includes a first driver 215B that drives third member 213 in a direction intersecting the X and Y directions (the direction indicated by arrow AR4), and a second driver 216B that drives fourth member 214 in a direction intersecting the X and Y directions (the direction indicated by arrow AR5). As shown in Figure 9(B) , by driving third member 213 in the direction indicated by arrow AR4 and driving fourth member 214 in the direction indicated by arrow AR5, the shape of the exposure field may be changed to increase or decrease the exposure amount of photosensitive material 222 in the overlap region.

[0075] 10 is a plan view showing a schematic configuration of field stop 21C according to Modification 3. Field stop 21C includes a first driver 215C that drives third member 213 in at least one of the X direction and the θz direction (direction around the Z axis), and a second driver 216C that drives fourth member 214 in at least one of the X direction and the θz direction.

[0076] The first driving unit 215C includes a first portion 215a and a second portion 215b. The first portion 215a and the second portion 215b move in the X direction, as indicated by arrow AR11. When the movement amount of the first portion 215a and the movement amount of the second portion 215b are the same, the third member 213 is driven in the X direction. When the movement amount of the first portion 215a and the movement amount of the second portion 215b are made different, the third member 213 is driven in the θz direction.

[0077] The second driving unit 216C includes a first portion 216a and a second portion 216b. The first portion 216a and the second portion 216b move in the X direction. When the movement amount of the first portion 216a and the movement amount of the second portion 216b are the same, the fourth member 214 is driven in the X direction. When the movement amount of the first portion 216a and the movement amount of the second portion 216b are made different, the fourth member 214 is driven in the θz direction.

[0078] In this way, by moving the first portion 215a and the second portion 215b of the first driving unit 215C in the X direction and changing the amount of movement thereof, the shape of the exposure field set by the field stop 21C can be changed, and the amount of exposure of the photosensitive material 222 in the overlap region can be changed. Also, by moving the first portion 216a and the second portion 216b of the second driving unit 216C in the X direction and changing the amount of movement thereof, the shape of the exposure field set by the field stop 21C can be changed, and the amount of exposure of the photosensitive material 222 in the overlap region can be changed.

[0079] 11 is a plan view showing a schematic configuration of a field stop 21D according to Modification 4. In field stop 21D, a first member 211 and a second member 212 are driven instead of a third member 213 and a fourth member 214.

[0080] The field stop 21D includes a third drive unit 217 that drives the first member 211 in the X direction (the direction indicated by the arrow AR21) and a fourth drive unit 218 that drives the second member 212 in the X direction (the direction indicated by the arrow AR22).

[0081] As in Modification 4, the shape of the exposure field may be changed by driving the first member 211 and the second member 212 instead of the third member 213 and the fourth member 214. In this case, for example, if the area of ​​the exposure field is expanded by moving the first member 211 in the +X direction and the second member 212 in the −X direction, the exposure amount in the scanning direction can be increased.

[0082] In the first embodiment and Modifications 1 to 4, the shape of the exposure field may be changed by driving either the first member 211 or the second member 212, or either the third member 213 or the fourth member 214. Furthermore, the shape of the exposure field may be changed by driving three or more members among the first member 211, the second member 212, the third member 213, and the fourth member 214.

[0083] 12A is a diagram showing a schematic configuration of a field stop 21E according to Modification 5. Field stop 21E has a link mechanism 213D and a link mechanism 214D.

[0084] Link mechanism 213D includes link members 213a to 213d and joints 220a to 220c. In Fig. 12(A), link mechanism 213D has four link members 213a to 213d, but the number of link members is not limited to four and may be three or less, or five or more, as long as there is a plurality of link members. The configuration of link mechanism 214D is similar to that of link mechanism 213D, and therefore detailed description thereof will be omitted.

[0085] 12B is a plan view showing an example of the operation of the link mechanism 213D. As shown in FIG. 12B, the link mechanism 213D is deformed by each of the link members 213a to 213d rotating around the joints 220a to 220c, respectively.

[0086] Figure 12(C) shows the exposure field PI obtained when the link mechanism 213D is in the state shown in Figure 12(A), and Figure 12(D) shows the exposure field PI obtained when the link mechanism 213D is in the state shown in Figure 12(B).

[0087] By using the link mechanism 213D, as shown in FIG. 12D, the shape of the peripheral portion Pp1 can be changed to one in which the width in the X direction decreases nonlinearly as the width approaches the end in the Y direction. This allows the exposure amount of the overlap region to be changed gradually. Furthermore, by using the link mechanism 213D, the shape of the peripheral portion Pp1 can be changed from one in which the width in the X direction decreases linearly or nonlinearly as the width approaches the end in the Y direction.

[0088] (Variation 6) FIG. 13A is a plan view showing the configuration of a field stop 21F according to Variation 6. The field stop 21F according to Variation 6 includes a stop main body 219, a third member 213, and a first drive unit 215. The stop main body 219 functions as the first member 211, the second member 212, and the fourth member 214 of the field stop 21d according to the first embodiment. The other configurations are the same as those of the first embodiment, and therefore detailed description will be omitted. In this manner, only the third member 213 may be movable. Alternatively, only the fourth member 214 may be movable. Note that in the first embodiment and other variations, only the third member 213 may be movable, and the positional relationships of the other members may be fixed.

[0089] 13B is a plan view showing the configuration of field stop 21G according to modification 7. Field stop 21G according to modification 7 includes a stop main body 219a, a third member 213, and a first drive unit 215. Stop main body 219a has an opening OP2. Opening OP2 includes a central portion OPc having a constant width in the X direction, a peripheral portion OPp1 whose width in the X direction decreases nonlinearly toward the ends in the Y direction, and a peripheral portion OPp2 whose width in the X direction decreases linearly toward the ends in the Y direction.

[0090] When changing the exposure amount of the photosensitive material 222 in the overlap region, the third member 213 is driven so that at least a portion of the third member 213 overlaps with the peripheral portion OPp1. The edge on the +Y side of the peripheral portion OPp1 is curved. This allows the exposure amount in the overlap region to be changed gradually. Note that the peripheral portion OPp2 may also be shaped so that its width in the X direction decreases nonlinearly toward the end in the Y direction, and a fourth member 214 and a second drive unit 216 may be provided.

[0091] (Modification 8) The shape of the opening of the field stop is not limited to a trapezoid, but may be an arc shape, etc. Figures 14(A) and 14(B) are plan views showing a schematic configuration of a field stop 21H according to Modification 8.

[0092] The field stop 21H includes a plurality of first light-shielding members 231a, a drive unit 232a that drives each of the plurality of first light-shielding members 231a in the X direction, a plurality of second light-shielding members 231b, and a drive unit 232b that drives each of the plurality of second light-shielding members 231b in the X direction.

[0093] The plurality of first light blocking members 231a are arranged adjacent to each other in the Y direction. The plurality of second light blocking members 231b are arranged on the +X side of the plurality of first light blocking members 231a. The plurality of second light blocking members 231b are arranged adjacent to each other in the Y direction.

[0094] 14A and 14B, the shape of the opening OP that defines the exposure field can be changed by adjusting the X-direction position of each of the multiple first light-shielding members 231a with the drive unit 232a and adjusting the X-direction position of each of the multiple second light-shielding members 231b with the drive unit 232b. For example, the shape of the opening OP can be a trapezoid or an arc. The first light-shielding members 231a and the second light-shielding members 231b function as setting members that set the exposure field.

[0095] In this way, field stop 21H includes a plurality of light blocking members 231a and 231b that can change the shape of the exposure field, and the positions of each of the light blocking members 231a and 231b in the X direction can be changed so that the area of ​​the portion corresponding to the overlap region in the peripheral part of the exposure field changes, thereby adjusting the exposure amount in the overlap region.

[0096] When performing arc-shaped splice exposure, it is preferable that the edge at the end in the non-scanning direction be inclined with respect to the scanning direction. Furthermore, the inclination of the Y-direction edge (edge ​​extending in the X-direction) of the arc-shaped exposure field may be changed between when scanning exposure is performed by moving the photosensitive substrate 22 in the +X direction and when scanning exposure is performed by moving the photosensitive substrate 22 in the -X direction.

[0097] Second Embodiment When the aperture of the field stop is enlarged to increase the exposure amount in the overlap region, the exposure amount also increases in part of the non-overlapping region when the aperture is not enlarged. This point will be explained below.

[0098] 15A is a diagram showing the relationship between the exposure field and the exposure amount when the third member 213 and the fourth member 214 are in their initial positions. As shown in Fig. 15A, the exposure amount is calculated by multiplying the illuminance of the exposure light by the irradiation time of the exposure light, and therefore corresponds to the width in the X direction of the exposure field that passes over the photosensitive substrate 22 when the photosensitive substrate 22 is scanned (in the overlap region Od, this is the sum of the X direction width of the exposure field PId and the X direction width of the exposure field PIe).

[0099] Figure 15(B) shows a case where the third member 213 is driven to increase the width of the central portion Pc of the exposure field PId in the Y direction, thereby changing the shape of the exposure field PId. As a result, the exposure dose in the overlap region Od where the exposure fields PId and PIe overlap increases, but the non-overlapping region in Figure 15(A) also becomes included in the overlap region. As a result, as shown by the left-sloping hatching in Figure 15(B), the exposure dose increases in the newly overlapping region (part of the non-overlapping region when the opening OP was not enlarged).

[0100] Therefore, the exposure apparatus 100A according to the second embodiment has a mechanism that prevents the exposure amount in the area corresponding to the original non-overlapping area from increasing when the shape of the exposure field is changed so that the non-overlapping area becomes an overlapping area.

[0101] 16 is a diagram showing the configuration of an exposure apparatus 100A according to the second embodiment. In illumination optical systems ILa to ILg, light attenuating units 10a to 10g are arranged on the incident surface side (on the input lens 8a to 8g side) of fly-eye lenses 11a to 11g, respectively.

[0102] 17A is a view of the fly-eye lens 11e, the attenuation unit 10e, and the driver 9e provided in the illumination optical system ILe, as viewed from the input lens 8e side. The attenuation unit 10e and the driver 9e provided in the illumination optical system ILe will be described below with reference to FIG. 17A, but the same applies to the attenuation units 10a to 10g and the drivers 9a to 9g provided in the other illumination optical systems ILa to ILg.

[0103] The fly's eye lens 11g has a plurality of lens blocks arranged in the Y direction, each of which has a rectangular cross section elongated in the Y direction and arranged in the X direction. As described above, FIG. 17A is a view of the fly's eye lens 11g as seen from the input lens 8g side, which is the incident surface side. The incident side of each lens element 110 forms a conjugate plane CP (see FIG. 16) with respect to the exposure field PIe formed on the photosensitive substrate 22. Therefore, in FIG. 17A, an exposure field corresponding area IPIe, which is the area corresponding to the exposure field PIe, is indicated by a dashed line within each lens element 110.

[0104] The attenuation unit 10e includes attenuation units 10e1 to 10e4. Each of the attenuation units 10e1 to 10e4 includes a plurality of attenuation members 111 and a plurality of attenuation member holding members 112 that respectively hold the plurality of attenuation members 111. The number of attenuation members 111 included in each of the attenuation units 10e1 to 10e4 is set based on the width in the Y direction of the central portion Pc of the exposure field PIe. More specifically, the number is set based on the width in the Y direction of the central portion of an exposure field corresponding region IPIe, which is a region that corresponds to the exposure field PIe.

[0105] The driving unit 9e includes a control unit 9e1 and a slider 9e2. The slider 9e2 holds the dimming member holding member 112 so that the member can move in the X and Z directions. The positions in the X direction (the amount of insertion into the fly's eye lens 11e) and the Z direction of each of the plurality of dimming members 111 included in each of the dimming units 10e1 to 10e4 are controlled in accordance with a control signal SigE transmitted from the control device CTR to the control unit 9e1.

[0106] The position in the X direction of each of the plurality of light-reducing members 111 provided in each of the light-reducing units 10e1 to 10e4 (the amount of insertion into the fly-eye lens 11e) is measured by an encoder or the like.

[0107] As shown in Figure 17(B), by moving the light-attenuating member 111 in the X direction using the slider 9e2, it is possible to cover with the light-attenuating member 111 a portion of the center of the exposure field corresponding region IPIe of the lens elements 110 aligned in the X direction (a portion of the region that was a non-overlapping region when the field stop aperture was not enlarged). This reduces the illuminance of the exposure light in the portion where the light-attenuating member 111 is inserted, thereby suppressing an increase in the exposure amount in the portion of the region that was a non-overlapping region when the aperture was not enlarged. Note that in Figure 17(B), the light-attenuating member 111 that covers a portion of the center of the exposure field corresponding region IPIe of the lens elements 110 is shown painted black.

[0108] The light-reducing member 111 may be a thin metal plate or a light-shielding film formed of a light-reducing member on a transparent glass plate. The light-reducing member 111 is not limited to a member that completely blocks illumination light, such as a metal plate, but may be a member that blocks or transmits only a portion of illumination light. In other words, the light-reducing member 111 may be any illuminance changing member that changes illuminance.

[0109] The light attenuating units 10a-10g and driving units 9a-9g provided in the other illumination optical systems ILa-ILg have the same structures as the light attenuating unit 10e and driving unit 9e described above, and therefore detailed descriptions thereof will be omitted. Control signals SigA-SigG are transmitted from the control device CTR to the control units 9a1-9g1 of the driving units 9a-9g provided in the light attenuating units 10a-10g, respectively. The other configurations are the same as those in the first embodiment, and therefore detailed descriptions thereof will be omitted.

[0110] Third Embodiment The exposure apparatus may have a single projection optical system instead of a plurality of projection optical systems 19a to 19g. Figure 18 is a diagram showing the schematic configuration of an exposure apparatus 100B according to a third embodiment.

[0111] Exposure apparatus 100B includes illumination optical system IL, mask stage 16 that holds mask 15, projection optical system 19 including field stop 21, substrate stage 27 that holds photosensitive substrate 22, and a control device CTR for these components. As field stop 21, any one of the field stops described in the first embodiment and its modifications can be used. Furthermore, illumination optical system IL of exposure apparatus 100B may include the light-reducing unit described in the second embodiment.

[0112] The control device CTR of exposure apparatus 100B synchronously scans mask 15 and photosensitive substrate 22, and exposes photosensitive substrate 22 with exposure light patterned with the pattern formed on mask 15. In exposure apparatus 100B, when an area larger than the image of the pattern formed on mask 15 is to be exposed on a region on photosensitive substrate 22 where the pattern is to be formed (referred to as a pattern formation region), multiple shot regions are set for one pattern formation region, and exposure is performed multiple times with portions of the pattern image overlapping, a process known as overlapping exposure (spliced ​​exposure).

[0113] 19 , for example, a first shot region SR1, a second shot region SR2 that partially overlaps the first shot region, and a third shot region SR3 that partially overlaps the second shot region SR2 are set for one pattern formation region PFR1 set on the photosensitive substrate 22. That is, the first shot region SR1 includes an overlap region OR2 that partially overlaps with the second shot region SR2 and a non-overlap region NOR1. The second shot region SR2 includes an overlap region OR2 that partially overlaps with the first shot region SR1, a non-overlap region NOR2, and an overlap region OR3 that partially overlaps with the third shot region SR3. The third shot region SR3 includes an overlap region OR3 that partially overlaps with the second shot region SR2 and a non-overlap region NOR3. Overlap exposure (spliced ​​exposure) is performed in the overlapping regions OR2 and OR3 by exposing each pattern image to each shot area using one mask 15. The field stop 21 defines the exposure field PI.

[0114] Specifically, the control device CTR first moves the mask 15 to its initial position and also moves the photosensitive substrate 22 to its initial position when exposure to the first shot area SR1 begins. Thereafter, the mask 15 and the photosensitive substrate 22 are synchronously scanned, for example, in the −X direction, and the first shot area SR1 is irradiated with exposure light patterned by the pattern formed on the mask 15 via the projection optical system 19. Next, the control device CTR moves the mask 15 to its initial position and also moves the photosensitive substrate 22 stepwise to its initial position when exposure to the second shot area SR2 begins. The control device CTR then synchronously scans the mask 15 and the photosensitive substrate 22 in the +X direction, and the second shot area SR2 is irradiated with exposure light patterned by the pattern formed on the mask 15 via the projection optical system 19. At this time, for example, if the exposure amount in the overlap region OR2 is insufficient, the control device CTR changes the area of ​​the portion of the exposure field PI of the field stop 21 that corresponds to the overlap region OR2, thereby changing the exposure amount of the photosensitive material 222 in the overlap region OR2. In this case, the shape of the exposure field PI will be different when the exposure light is irradiated onto the first shot region SR1 and when the exposure light is irradiated onto the second shot region SR2.

[0115] Next, the mask 15 is moved to its initial position, and the photosensitive substrate 22 is stepped to its initial position when exposure of the third shot area SR3 begins. The mask 15 and the photosensitive substrate 22 are synchronously scanned in the −X direction, and the exposure light patterned by the pattern formed on the mask 15 is irradiated onto the third shot area SR3 via the projection optical system 19. This allows a pattern to be formed in the pattern formation area PFR1, which has an area larger than the pattern image of the mask 15.

[0116] According to the third embodiment, exposure apparatus 100B includes: a substrate stage 27 that holds photosensitive substrate 22; a projection optical system 19 that irradiates photosensitive substrate 22 with light; and a control device CTR that irradiates a first shot region SR1 that extends in the X direction orthogonal to the X direction on photosensitive substrate 22 with light via projection optical system 19 while moving photosensitive substrate 22 in the X direction relative to projection optical system 19, and then irradiates a second shot region SR2 that extends in the X direction on photosensitive substrate 22 with light via projection optical system 19, the second shot region SR2 including an overlap region OR2 that overlaps with first shot region SR1 and a non-overlap region NOR2 while moving photosensitive substrate 22 in a direction parallel to the X direction relative to projection optical system 19, the second shot region SR2 being different from first shot region SR1. The projection optical system 19 includes a field stop 21 that sets an exposure field (illumination area) PI of the photosensitive substrate 22 by light, and the field stop 21 is capable of changing the shape of the exposure field PI so that the area of ​​the portion of the exposure field PI that corresponds to the overlap area OR2 changes.

[0117] This allows the exposure amount of the photosensitive material 222 in the overlapping area to be adjusted even when multiple scanning exposures are performed with the exposure field overlapping in the non-scanning direction in order to expand the exposure field in the direction intersecting the scanning direction (non-scanning direction) in the exposure apparatus 100B equipped with one projection optical system 19.

[0118] The above-described embodiment is a preferred example of the present invention, but the present invention is not limited to this and can be modified in various ways without departing from the spirit of the present invention.

[0119] 11a to 11g Fly's eye lens 15 Mask 16 Mask stage 19a to 19g, 19 Projection optical system 21a to 21g, 21 Field stop 22 Photosensitive substrate 27 Substrate stage 100, 100A, 100B Exposure apparatus 110 Lens element 111 Light attenuating member 211 First member 212 Second member 213 Third member 213D Link mechanism 214 Fourth member 214D Link mechanism 215, 215A, 215B, 215C First drive unit 216, 216A, 216B, 216C Second drive unit 217 Third drive unit 218 Fourth drive unit 219, 219a Stop main body 231a First light-shielding member 231b Second light-shielding member 222 Photosensitive material CTR control device ILa to ILg, IL illumination optical system PIa to PIg, PI exposure field SIa to SIg exposure area Sa to Sg non-overlap area Oa to Of overlap area Pc central area Pp1, Pp2 peripheral area

Claims

1. An exposure apparatus comprising: a stage that moves a substrate in a first direction; a first optical system that includes a first field stop and irradiates light onto a first illumination area on the substrate that is set by the first field stop; and a second optical system that includes a second field stop and irradiates light onto a second illumination area on the substrate that is set by the second field stop; wherein the first illumination area comprises a first central portion having a predetermined width in the first direction and a first peripheral portion whose width in the first direction decreases toward an end of the first illumination area in a second direction perpendicular to the first direction; wherein the second illumination area comprises a second central portion having a predetermined width in the first direction and a second peripheral portion whose width in the first direction decreases toward the end of the second illumination area in the second direction; a part of the first central portion and a part of the second peripheral portion are located on a straight line parallel to the first direction; and wherein the first peripheral portion and other parts of the second peripheral portion are located on a straight line parallel to the first direction.

2. The exposure apparatus of claim 1, wherein the shape of the first field stop and the shape of the second field stop are changeable so that the area of ​​the portion on the substrate corresponding to the first overlapping region irradiated with the light by both the first illumination region and the second illumination region changes.

3. The exposure apparatus according to claim 2, further comprising a third optical system that irradiates light onto a third illumination area on the substrate, a portion of the third illumination area overlapping a portion of the first illumination area.

4. The exposure apparatus of claim 3, wherein the first field stop is capable of changing the shape of the first illumination area so that the area of ​​a portion of the first illumination area corresponding to the first overlapping area is different from the area of ​​a portion of the first illumination area corresponding to a second overlapping area on the substrate to which the light is irradiated by both the first illumination area and the third illumination area.

5. An exposure apparatus comprising: a stage that moves a substrate in a first direction; an optical system that includes a first field stop and irradiates light onto an illumination area on the substrate that is set by the first field stop; and a control device, wherein the control device irradiates the light onto a first area on the substrate extending in the first direction while moving the substrate in the first direction relative to the illumination area, then moves the substrate a first length in a second direction perpendicular to the first direction, and then irradiates the light onto a second area on the substrate extending in a direction parallel to the first direction while moving the substrate in a direction parallel to the first direction relative to the illumination area, wherein the illumination area comprises a first central portion having a predetermined width in the first direction and first peripheral portions whose width in the first direction decreases toward an end of the illumination area in the second direction perpendicular to the first direction, and wherein the first length is greater than the length of the first central portion in the second direction and less than the sum of the length of the first central portion in the second direction and the length of the first peripheral portion in the second direction.

6. An exposure apparatus according to claim 5, wherein the shape of the first field stop is changeable so that the area of ​​the portion corresponding to a first overlap region where the first region and the second region overlap varies.

7. The exposure apparatus according to claim 5, wherein the shape of the illumination area is different when the light is irradiated onto the first area and when the light is irradiated onto the second area.

8. The exposure apparatus of claim 6, wherein the control device irradiates the second region with the light via the optical system, and then, while moving the substrate in a direction parallel to the first direction relative to the optical system, irradiates the light via the optical system onto a third region different from the first region and the second region, which extends in the first direction on the substrate and includes a second overlapping region that overlaps with the second region and a region other than the second overlapping region, and wherein the first field stop is capable of deforming the shape of the illumination region so that an area of ​​a portion of the illumination region corresponding to the first overlapping region when the light is irradiated onto the first region or the second region is different from an area of ​​a portion of the illumination region corresponding to the second overlapping region when the light is irradiated onto the second region or the third region.

9. An exposure apparatus according to any one of claims 6 and 8, wherein the width of the first central portion in the second direction is variable so that the area of ​​the portion corresponding to the first overlap region changes.

10. An exposure apparatus according to any one of claims 6 and 8, wherein the shape of the first peripheral portion is changeable so that the area of ​​the portion corresponding to the first overlap region is changed.

11. The exposure apparatus according to claim 10, wherein the shape of the first peripheral portion is changeable from one of a shape in which the width in the first direction decreases linearly toward the end in the second direction and a shape in which the width decreases nonlinearly toward the end.

12. The exposure apparatus according to claim 9, wherein the first field stop includes a setting member that is capable of changing the shape of the illumination area, and the setting member is movable in the first direction so as to change the width of the first central portion in the second direction.

13. An exposure apparatus as described in claim 10 or 11, wherein the first field stop includes a plurality of setting members that can change the shape of the illumination area, and the position of each of the plurality of setting members in the first direction can be changed so that the area of ​​the portion in the first peripheral portion that corresponds to the first overlapping area changes.

14. The exposure apparatus of claim 9, comprising: a fly's eye lens including a plurality of lens elements, the incident surface of which the light is incident being positioned conjugate with the substrate; and a plurality of light-reducing members positioned on the incident surface side of the fly's eye lens and shielding at least a first lens element among the plurality of lens elements, wherein the number of the plurality of light-reducing members overlapping with the first lens element is set based on the width of the first central portion in the second direction.

15. A field stop provided in a projection optical system that projects an image of an object onto an image plane, and that sets a projection area of ​​the image of the object on the image plane, comprising: a first portion and a second portion that are arranged spaced apart in a first direction in a plane perpendicular to the optical axis of the projection optical system; a third portion and a fourth portion that are arranged spaced apart in a second direction perpendicular to the first direction in the plane, and that form a first opening that sets the projection area together with the first portion and the second portion; and a drive unit that drives at least one of the first portion, the second portion, the third portion, and the fourth portion within the plane, to change the shape of the first opening.

16. The field stop according to claim 15, wherein the drive unit drives at least one of the first portion, the second portion, the third portion, and the fourth portion in the first direction, the second direction, a third direction intersecting the first direction and the second direction within the plane, or around an axis parallel to the optical axis.

17. A field stop according to claim 15 or claim 16, wherein the first portion, the second portion, and the fourth portion are fixed in positional relationship to form a field stop main body, and the drive unit drives the third portion relative to the field stop main body.

18. A field stop according to claim 17, wherein the field stop main body has a second opening formed by the first portion, the second portion, the fourth portion and another portion, and the first opening is formed by the third portion overlapping with a part of the second opening.

19. A field stop according to claim 18, wherein the edge of said other portion forming said second opening is curved.

20. A field stop according to any one of claims 15 to 19, wherein the first portion and the second portion extend in the second direction, and the third portion and the fourth portion are inclined with respect to the second direction.

21. A field stop provided in a projection optical system that projects an image of an object onto an image plane, and that sets a projection area of ​​the image of the object on the image plane, comprising: a first portion and a second portion that are arranged spaced apart in a first direction in a plane perpendicular to the optical axis of the projection optical system; and a third portion and a fourth portion that are arranged spaced apart in a second direction perpendicular to the first direction in the plane, and that form a first opening together with the first and second portions, wherein the third portion has a plurality of components, and the shape of the edge that forms the first opening of the third portion changes depending on the attitude of each of the plurality of components.

22. The field stop according to claim 21, wherein the fourth portion has a plurality of components, and the shape of the edge that forms the first opening of the fourth portion changes depending on the posture of each of the plurality of components.

23. A field stop as claimed in any one of claims 15 to 22, wherein the third and fourth portions are located closer to the image plane than the first and second portions, and the side surfaces of the third and fourth portions on the first opening side are inclined so that the width of the first opening increases from the image plane side towards the object side in a cross section along the first direction.

24. An exposure apparatus comprising: an illumination optical system that illuminates a mask with light from a light source; a projection optical system that projects a pattern formed on the mask onto a substrate; and a field stop according to any one of claims 15 to 23; and exposing the substrate while moving the mask and the substrate in a scanning direction.

25. The exposure apparatus according to claim 24, wherein the projection optical system includes a first projection optical system and a second projection optical system, the field stop includes a first field stop provided in the first projection optical system and a second field stop provided in the second projection optical system, and the illumination optical system includes an illuminance changing member that covers at least a part of an area through which illumination light that exposes the second area passes, so that the illuminance of at least a part of a second area other than the first area is relatively lower than the illuminance of illumination light that exposes a first area where a first projection area set by the first field stop and a second projection area set by the second field stop overlap.

26. An exposure apparatus according to claim 24 or claim 25, wherein the first direction is the scanning direction.

27. A device manufacturing method, comprising developing the substrate exposed by the exposure apparatus according to any one of claims 1 to 14 and claims 24 to 26.

28. An exposure apparatus according to any one of claims 2 to 4, 6 and 8, wherein the first field stop is capable of changing the shape of the first illumination region so that the area of ​​the portion of the first illumination region that corresponds to the first overlap region increases.

29. An exposure apparatus according to any one of claims 1 to 14, wherein the first field stop is capable of deforming the shape of the first peripheral portion so that the area of ​​the first peripheral portion increases.

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