Electronic device comprising printed circuit board

Abstract

This electronic device comprises an antenna radiator, a printed circuit board, an antenna contact, and an impedance circuit. The printed circuit board includes a first printed circuit board (PCB) portion including at least one ground layer electrically connected to a ground of the electronic device, a second PCB portion insulated from the at least one ground layer; an opening defined by a side surface of an edge portion of the first PCB portion and a side surface of an edge portion of the second PCB portion, and a conductive material plated on the side surface of the edge portion of the first PCB portion and electrically connected to the at least one ground layer. The impedance circuit may be electrically connected to the at least one ground layer through the conductive material.

Description

Electronic devices including printed circuit boards

[0001] The present disclosure relates to an electronic device including a printed circuit board.

[0002] An electronic device may include an antenna for communicating with an external electronic device. The antenna may include a conductive portion forming at least a portion of an edge portion of the electronic device. The conductive portion may be configured to function as an antenna radiator for transmitting or receiving signals. The antenna radiator may be electrically connected to wireless communication circuitry via a printed circuit board. Electronic components for the antenna (e.g., a matching circuit) may be disposed on the printed circuit board.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device is disclosed. The electronic device may include an antenna radiator. The electronic device may include a printed circuit board (PCB). The printed circuit board may include a first PCB portion comprising a plurality of layers. The plurality of layers of the first PCB portion may include at least one ground layer electrically connected to a ground of the electronic device. The printed circuit board may include a second PCB portion disposed next to the first PCB portion and comprising a plurality of layers. The second PCB portion may be electrically insulated from the at least one ground layer of the first PCB portion. The printed circuit board may include an opening defined by both a side surface of an edge portion of the first PCB portion and a side surface of an edge portion of the second PCB portion. The printed circuit board may include a conductive material plated on the side surface of the edge portion of the first PCB portion and electrically connected to the at least one ground layer of the first PCB portion. The electronic device may include an antenna contact electrically connected to the antenna radiator and mounted on the second PCB portion. The electronic device may include an impedance circuit mounted on an area of ​​the first PCB portion that includes at least a portion of the edge portion of the first PCB portion and electrically connected to the antenna contact. The impedance circuit may also be electrically connected to the at least one ground layer of the first PCB portion through the conductive material.

[0005] An electronic device is disclosed. The electronic device may include wireless communication circuitry. The electronic device may include an antenna radiator configured to transmit and / or receive radio frequency (RF) signals. The electronic device may include a printed circuit board configured to electrically connect the wireless communication circuitry and the antenna radiator. The electronic device may include a bracket configured to support the printed circuit board and to function as a ground for the electronic device. The printed circuit board may include a first PCB portion including at least one ground layer electrically connected to the bracket, a second PCB portion disposed next to the first PCB portion, insulated from the at least one ground layer of the first PCB portion, and having an antenna contact electrically connected to the antenna radiator, an opening defined by both a side surface of an edge portion of the first PCB portion and a side surface of an edge portion of the second PCB portion, and a conductive material plated on the side surface of the edge portion of the first PCB portion and electrically connected to the at least one ground layer of the first PCB portion. The thickness of the above conductive material can substantially correspond to the thickness of the first PCB portion of the printed circuit board.

[0006] The above and other aspects, features and advantages of specific embodiments of the present invention will become more apparent when considered in conjunction with the accompanying drawings, in which:

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments;

[0008] FIG. 2 illustrates an electronic device according to one embodiment;

[0009] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment;

[0010] FIG. 4 is a block diagram of an electronic device according to one embodiment;

[0011] FIG. 5 illustrates a portion of an electronic device according to one embodiment;

[0012] FIG. 6 is a plan view of a printed circuit board according to one embodiment;

[0013] FIG. 7 is a perspective view of a printed circuit board according to one embodiment;

[0014] Fig. 8 is a cross-sectional view of the printed circuit board of Fig. 6 taken along line AA';

[0015] Fig. 9 illustrates a portion of a printed circuit board according to a comparative example;

[0016] FIGS. 10 and 11 illustrate a portion of a printed circuit board according to one embodiment including an opening;

[0017] FIG. 12 is a plan view of a printed circuit board according to one embodiment;

[0018] Figure 13 illustrates an example of the X region of Figure 12 on a printed circuit board;

[0019] Figure 14 illustrates an example of the Y region of Figure 12 in a printed circuit board;

[0020] Fig. 15 is a flowchart showing a process for forming a conductive material of a printed circuit board according to one embodiment; and

[0021] Figures 16, 17, 18, 19, and 20 illustrate the processes of forming an opening.

[0022] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0023] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In various embodiments, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In various embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0024] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a subprocessor (123), the subprocessor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The subprocessor (123) may be implemented separately from the main processor (121) or as a part thereof. Accordingly, the processor (120) may include various processing circuits and / or a plurality of processors. For example, the term “processor” as used in the present specification and claims may mean various processing circuits including at least one processor, and at least one of the processors may be configured to perform various functions described herein individually and / or in a distributed manner.When the present disclosure describes a "processor," "at least one processor," or "one or more processors" as being configured to perform multiple functions, these terms include (but are not limited to): one processor performing some functions and other processor(s) performing other functions, or a single processor performing all functions. Furthermore, the at least one processor may be a combination of multiple processors performing various functions in a distributed manner. The at least one processor may execute program instructions to realize or perform various functions.

[0025] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0026] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0027] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0028] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0029] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0030] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0031] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0032] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0033] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0034] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0036] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0037] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0038] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0040] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0041] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator made of a conductor or a conductive material formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0042] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0043] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0044] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0045] Figure 2 illustrates an electronic device according to one embodiment.

[0046] Referring to FIG. 2, an electronic device (101) according to one embodiment may include a housing (210) forming an exterior of the electronic device (101). For example, the housing (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side surface) (200C) surrounding a space between the first side (200A) and the second side (200B).

[0047] An electronic device (101) according to one embodiment may include a display (e.g., a display module (160) of FIG. 1). The display (201) may include a substantially transparent window (e.g., a window (201b) of FIG. 3). The window (201b) may form at least a portion of the first surface (200A). For example, the window (201b) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0048] An electronic device (101) according to one embodiment may include a substantially opaque cover plate (211). According to one embodiment, the cover plate (211) may form at least a portion of the second surface (200B). According to one embodiment, the cover plate (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0049] An electronic device (101) according to one embodiment may include a frame (218). The frame (218) may be combined with a window (201b) and / or a cover plate (211) to form at least a portion of a third surface (200C) of the electronic device (101). For example, the frame (218) may form the entire third surface (200C) of the electronic device (101). For example, the frame (218) may form the third surface (200C) of the electronic device (101) together with the window (201b) and / or the cover plate (211).

[0050] An electronic device (101) according to one embodiment may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light-emitting element (not shown), and / or a connector hole (208). According to one embodiment, the electronic device (101) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element (not shown)) or may additionally include other components.

[0051] In one embodiment, at least a portion of the display (201) may be viewed through a window (201b) forming the first surface (200A). In one embodiment, the display (201) may include a display panel (e.g., display panel (201a) of FIG. 3) disposed on the back surface of the window (201b).

[0052] According to one embodiment, the display (201) may include a display area (201A). According to one embodiment, the display (201) may provide visual information to a user through the display area (201A).

[0053] In one embodiment, the display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, "the display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0054] In one embodiment, the display (201) may include an area where a first camera module (205) (e.g., the camera module (180) of FIG. 1) is positioned. In one embodiment, an opening is formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). For example, the display area (201A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned under the display (201) so as to overlap the area of ​​the display (201). For example, the display (201) can provide visual information to the user through the above area, and additionally, the first camera module (205) can obtain an image corresponding to a direction toward the first surface (200A) through the above area of ​​the display (201).

[0055] According to one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0056] According to one embodiment, the audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1) may include a microphone hole (203, 204) and / or a speaker hole (207).

[0057] According to one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the third surface (200C) and / or a second microphone hole (204) formed in a portion of the second surface (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include multiple microphones to detect the direction of the sound.

[0058] According to one embodiment, the second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present disclosure is not limited thereto.

[0059] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (101). In one embodiment, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the city of FIG. 2, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower portion of the electronic device (101), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper portion of the electronic device (101). However, the present disclosure is not limited thereto, and according to one embodiment, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by a spaced space between the display (201) and the frame (218).

[0060] According to one embodiment, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a call receiver hole (not shown).

[0061] According to one embodiment, a sensor module (not shown) (e.g., sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0062] According to one embodiment, a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1) may include a first camera module (205) arranged to face a first side (200A) of an electronic device (101), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0063] According to one embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0064] According to one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0065] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0066] According to one embodiment, a key input device (217) (e.g., input module (150) of FIG. 1) may be disposed on a third side (200C) of the electronic device (101). According to one embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0067] According to one embodiment, a connector hole (208) may be formed on the third surface (200C) of the electronic device (101) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (101) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0068] According to one embodiment, the frame (218) may include a vent hole (206). For example, air outside the housing (210) may be introduced into the housing (210) through the vent hole (206). For example, air inside the housing (210) may be discharged out of the housing (210) through the vent hole (206). The location of the vent hole (206) is not limited to the location illustrated in FIG. 2.

[0069] According to one embodiment, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. According to one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0070] Figure 3 is an exploded perspective view of an electronic device according to one embodiment.

[0071] In the following, duplicate descriptions of configurations having the same reference numerals as the configurations described above are not duplicated.

[0072] Referring to FIG. 3, an electronic device (101) according to one embodiment may include a frame (218), a bracket (243), a printed circuit board (250), a cover plate (260), and / or a battery (270). The printed circuit board (250) may include a first printed circuit board (251), which is a main board, and a second printed circuit board (252), which is a sub board.

[0073] According to one embodiment, the first printed circuit board (251) and the second printed circuit board (252) may be disposed on the bracket (243). For example, the first printed circuit board (251) and the second printed circuit board (252) may be disposed on one side (e.g., the side facing the -z direction) of the bracket (243). The first printed circuit board (251) may include a first side (251a) facing the rear side (e.g., the -z direction) of the electronic device (101) and a second side (251b) facing the front side (e.g., the +z direction) of the electronic device (101). The first printed circuit board (251) may be disposed on the bracket (243) such that the second side (251b) faces the one side of the bracket (243). The second printed circuit board (252) may include a third side (252a) facing the rear side of the electronic device (101) and a fourth side (252b) facing the front side of the electronic device (101). The second printed circuit board (252) may be placed on the bracket (243) such that the fourth side (252b) faces the one side of the bracket (243). The second printed circuit board (252) may be spaced apart from the first printed circuit board (251).

[0074] An electronic device (101) according to one embodiment may include a frame (218) forming an exterior of the electronic device (101) (e.g., a third surface (200C) of FIG. 2) and a bracket (243) coupled to the inside of the frame (218). According to one embodiment, the frame (218) and the bracket (243) may be disposed between a display (201) and a cover plate (211). For example, the frame (218) may surround a space between the cover plate (211) and the display (201). A window (201b) may be attached to the frame (218).

[0075] In one embodiment, the bracket (243) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be disposed on one side of the bracket (243) facing one direction (e.g., +z direction), and a portion of the display (201) may be supported by the bracket (243). For example, a first printed circuit board (251), a second printed circuit board (252), a battery (270), and a second camera module (212) may be disposed on the other side of the bracket (243) facing the opposite direction (e.g., -z direction). For example, the first printed circuit board (251), the second printed circuit board (252), the battery (270), and the second camera module (212) may be respectively seated in recesses defined by the frame (218) and / or the bracket (243).

[0076] According to one embodiment, the first printed circuit board (251), the second printed circuit board (252), and the battery (270) may be respectively coupled to the bracket (243). For example, the first printed circuit board (251) and the second printed circuit board (252) may be fixedly disposed on the bracket (243) through a coupling member such as a screw. For example, the battery (270) may be fixedly disposed on the bracket (243) through an adhesive member (e.g., double-sided tape). However, the present disclosure is not limited to the above-described examples.

[0077] According to one embodiment, the cover plate (260) may be disposed between the first printed circuit board (251) and the cover plate (211). According to one embodiment, the cover plate (260) may be disposed on the first printed circuit board (251). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (251) facing the -z direction.

[0078] According to one embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (251) with respect to the z-axis. According to one embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (251). Through this, the cover plate (260) may protect the first printed circuit board (251) from physical impact or prevent detachment (or reduce the possibility of detachment) of a connector coupled to the first printed circuit board (251).

[0079] According to one embodiment, the cover plate (260) may be fixedly positioned on the first printed circuit board (251) via a joining member (e.g., a screw), or may be coupled to the bracket (243) together with the first printed circuit board (251) via the joining member.

[0080] According to one embodiment, the display (201) may be positioned between a bracket (243) and a window (201b). For example, the window (201b) may be positioned on one side (e.g., in the +z direction) of the display panel (201a), and the bracket (243) may be positioned on the other side (e.g., in the -z direction).

[0081] According to one embodiment, the window (201b) may be coupled with the display panel (201a). For example, the window (201b) and the display panel (201a) may be adhered to each other through an optical adhesive material (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0082] According to one embodiment, the window (201b) may be coupled with the frame (218). For example, the window (201b) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the frame (218) through an adhesive member (e.g., waterproof tape) disposed between the outer portion of the window (201b) and the frame (218). However, the present disclosure is not limited to the above-described example.

[0083] According to one embodiment, a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (251) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. According to one embodiment, the first printed circuit board (251) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0084] In one embodiment, a battery (270) (e.g., battery (189) of FIG. 1 ) may power at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (251) and / or the second printed circuit board (252).

[0085] An electronic device (101) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (197) of FIG. 1). According to one embodiment, the antenna module may be disposed between a cover plate (211) and a battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0086] According to one embodiment, a first camera module (205) (e.g., a front camera) may be positioned on at least a portion of the bracket (243) such that the lens can receive external light through a portion (e.g., the camera area (237)) of the window (201b) (e.g., the front (200A) of FIG. 2).

[0087] In one embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the bracket (243) and the cover plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (251) via a connecting member (e.g., a connector). In one embodiment, the second camera module (212) may be disposed such that a lens can receive external light through the camera area (284) of the cover plate (211) of the electronic device (101).

[0088] According to one embodiment, the camera area (284) may be formed on a surface of the cover plate (211) (e.g., the rear surface (200B) of FIG. 2). According to one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). According to one embodiment, at least a portion of the camera area (284) may protrude from the surface of the cover plate (211) by a predetermined height. However, the present invention is not limited thereto, and according to one embodiment, the camera area (284) may form a plane substantially identical to the surface of the cover plate (211).

[0089] According to one embodiment, the housing (210) of the electronic device (101) may be referred to as, for example, a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the window (201b), the frame (218), the bracket (243), and / or the cover plate (211) that form the exterior of the electronic device (101) may be referred to as the housing (210) of the electronic device (101).

[0090] An electronic device (101) according to one embodiment may include a cover plate (211). The cover plate (211) may define at least a portion of a rear surface (e.g., a second surface (200B) of FIG. 2) of the electronic device (101). The cover plate (211) may be referred to as a rear cover or a back cover in terms of defining at least a portion of the rear surface of the electronic device (101). For example, the cover plate (211) may be opposite a display (or a window (201b) of the display) that forms at least a portion of a front surface (e.g., a first surface (200A) of FIG. 2) of the electronic device (101). The window (201b) of the display (201) may form at least a portion of the front surface of the electronic device (101), and the cover plate (211) may form at least a portion of the rear surface of the electronic device (101). The display can be oriented substantially in the +z direction, and the cover plate (211) can be oriented substantially in the -z direction.

[0091] Figure 4 is a block diagram of an electronic device according to one embodiment.

[0092] Referring to FIG. 4, an electronic device (101) according to one embodiment may include at least one processor (e.g., processor (120) of FIG. 1). The at least one processor (120) may include a processing circuit. The at least one processor (120) may include, but is not limited to, an application processor (AP, e.g., a central processing unit (CPU)) and / or a communication processor (CP, e.g., a modem). The at least one processor (120) may include, but is not limited to, a graphics processing unit (e.g., a GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a wireless-fidelity (Wi-Fi) chip, a Bluetooth TMIt may include a chip, a global positioning system (GPS) chip, a near field communication (NFC) chip, connectivity chips, a sensor controller, a touch controller, a finger-print sensor controller, a display drive integrated circuit (DDI), an audio CODEC chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on chip (SoC), an IC, or a similar circuit.

[0093] An electronic device (101) according to one embodiment may include a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1). The wireless communication circuit (192) may include a radio frequency transceiver (RF transceiver) (401) and an RF front end (RFFE) circuit (402).

[0094] According to one embodiment, at least one processor (120) may generate a baseband signal. At least one processor (120) may control an RF transceiver (401) to process the generated baseband signal. At least one processor (120) may control the RF transceiver (401) to transmit a transmission signal through an antenna radiator (420). At least one processor (120) may control the RF transceiver (401) to transmit the transmission signal in a frequency band that can communicate with an external electronic device.

[0095] According to one embodiment, the RF transceiver (401) may be implemented as a single chip (e.g., an RFIC chip) or as part of a single package. The RF transceiver (401) may include a digital to analog converter (DAC) for converting a digital signal to an analog signal. The RF transceiver (401) may include a mixer and an oscillator (e.g., a local oscillator (LO)) for up-conversion. The RF transceiver (401) may convert a baseband signal generated by at least one processor (120) into an RF signal. The RF transceiver (401) may include an analog to digital converter (ADC) for converting an analog signal to a digital signal. The RF transceiver (401) may include a mixer and an oscillator for down-conversion. The RF transceiver (401) can convert an RF signal received from an antenna radiator (420) into a baseband signal so that it can be processed by at least one processor (120).

[0096] According to one embodiment, the RFFE circuit (402) may include a plurality of components electrically connected between the RF transceiver (401) and the antenna radiator (420). For example, the RFFE circuit (402) may include components such as a coupler, a power amplifier (PA), a low noise amplifier (LNA), a switch circuit, and / or a duplexer, but the present disclosure is not limited thereto.

[0097] According to one embodiment, the wireless communication circuit (192) may be configured to communicate with an external electronic device using an antenna radiator (420). According to one embodiment, the antenna radiator (420) may include a feed point to which a feed signal from the wireless communication circuit (192) is provided and a ground point connected to the ground of the electronic device (101).

[0098] An electronic device (101) according to one embodiment may include a first printed circuit board (251) and / or a second printed circuit board (252). The first printed circuit board (251) and the second printed circuit board (252) may include a plurality of conductive layers and a plurality of non-conductive layers alternately laminated with the plurality of conductive layers. The first printed circuit board (251) and the second printed circuit board (252) may provide electrical connections between various electronic components using wires and conductive vias formed on the plurality of conductive layers. The second printed circuit board (252) may be spaced apart from the first printed circuit board (251). For example, the first printed circuit board (251) may be referred to as a main printed circuit board, and the second printed circuit board (252) may be referred to as a sub-printed circuit board. For example, at least one processor (120) and wireless communication circuit (192) may be disposed on a first printed circuit board (251), which is a main printed circuit board. A second printed circuit board (252) may be electrically connected to an antenna radiator (420). In FIG. 4, the antenna radiator (420) is illustrated as being electrically connected to the second printed circuit board (252), but the electronic device (101) may further include other antenna radiators that are electrically connected to the first printed circuit board (251).

[0099] The antenna radiator (420), as a physical component of the antenna, may be configured to be powered by the wireless communication circuit (192) and to radiate and / or receive electromagnetic waves. The antenna radiator (420) may be configured to radiate RF signals to the outside of the electronic device (101) based on the power supplied from the wireless communication circuit (192). The type and performance of the antenna may be based on the physical structure of the antenna radiator (420). The antenna radiator (420) may include a first antenna radiator (421) and a second antenna radiator (422), but the present disclosure is not limited thereto.

[0100] According to one embodiment, the wireless communication circuit (192) is disposed on the first printed circuit board (251), and the antenna radiator (420) is electrically connected to the second printed circuit board (252). Therefore, an electrical connection between the first printed circuit board (251) and the second printed circuit board (252) may be required to electrically connect the wireless communication circuit (192) and the antenna radiator (420). The electronic device (101) according to one embodiment may include a flexible printed circuit board (410) configured to electrically connect the first printed circuit board (251) and the second printed circuit board (252).

[0101] An electronic device (101) according to one embodiment may include an impedance circuit (430). The impedance circuit (430) may be configured to be electrically connected to a transmission line electrically connected to an antenna radiator (420), to match a characteristic impedance of the impedance of the transmission line with the impedance of the antenna, and to adjust a resonant frequency of the antenna. For example, the impedance circuit (430) may include one or more passive elements, such as a capacitor and / or an inductor, and a switch circuit. The impedance circuit (430) may be configured to electrically connect the transmission line and one or more passive elements. For example, the impedance circuit (430) may include a first impedance circuit (431) electrically connected to a first antenna radiator (421) and a second impedance circuit (432) electrically connected to a second antenna radiator (422).

[0102] FIG. 5 illustrates a portion of an electronic device according to one embodiment.

[0103] Referring to FIG. 5, the frame (218) may form at least a portion of an edge of the electronic device (101). The bracket (243) may be surrounded by the frame (218).

[0104] According to one embodiment, the frame (218) may include a first edge portion (218a), a second edge portion (218b), and a third edge portion (218c). For example, the first edge portion (218a) may be a lower edge portion of the electronic device (101). The second edge portion (218b) may be connected to one side of the first edge portion (218a) and may extend perpendicularly to the first edge portion (218a). The third edge portion (218c) may be opposite the second edge portion (218b). The third edge portion (218c) may be connected to the other side of the first edge portion (218a) and may extend perpendicularly to the first edge portion (218a). Although not shown in FIG. 5 , the frame (218) may include a fourth edge portion (not shown) opposite the first edge portion (218a). For example, the first edge portion (218a) may be parallel to the x-axis of FIG. 5, and the second edge portion (218b) and the third edge portion (218c) may be parallel to the y-axis of FIG. 5.

[0105] According to one embodiment, the frame (218) forming at least a portion of an edge of the electronic device (101) may include one or more conductive portions (510) and one or more non-conductive portions (520). The one or more conductive portions (510) may be formed of a conductive material (e.g., metal). The one or more non-conductive portions (520) may be formed of a non-conductive material. The one or more non-conductive portions (520) may be in contact with the one or more conductive portions (510) to physically separate the one or more conductive portions (510).

[0106] According to one embodiment, one or more conductive portions (510) may be configured to function as an antenna radiator (e.g., antenna radiator (420) of FIG. 4). The one or more conductive portions (510) may be configured, as a physical component of an antenna, to be powered by wireless communication circuitry (e.g., wireless communication module (192) of FIG. 1) to radiate and / or receive electromagnetic waves. The one or more conductive portions (510) may include a feed point that receives power via a transmission line. For example, the wireless communication circuitry may be configured to communicate with an external electronic device by powering the feed point of the one or more conductive portions (510). When the feed point of the one or more conductive portions (510) is powered, current (e.g., a radiating current) may flow along the one or more conductive portions (510). The current forms an electromagnetic wave around one or more conductive portions (510), and radio frequency (RF) signals can be radiated or received through the electromagnetic wave. Since the electrical length of the antenna, which affects the radiation characteristics of the antenna, is based on the structure of the antenna radiator (420), the type and performance of an antenna that includes at least a portion of one or more conductive portions (510) configured to function as the antenna radiator (420) can be based on the physical structure of the one or more conductive portions (510).

[0107] According to one embodiment, the one or more conductive portions (510) may include a first conductive portion (511) and / or a second conductive portion (512). The first conductive portion (511) may extend between a first non-conductive portion (521) and a second non-conductive portion (522) disposed within the first edge portion (218a). The second conductive portion (512) may extend between the first non-conductive portion (521) and a third non-conductive portion (523) disposed within the second edge portion (218b). The structures of the one or more conductive portions (510) and the one or more non-conductive portions (520) described above are merely exemplary for convenience of description, and embodiments of the present disclosure are not limited thereto. The frame (218) may further include other conductive portions in addition to the first conductive portion (511) and the second conductive portion (512).

[0108] According to one embodiment, the first conductive portion (511) and / or the second conductive portion (512) may be configured to be powered from a wireless communication circuit and function as an antenna radiator (420). For example, the first conductive portion (511) may correspond to a first antenna radiator (e.g., the first antenna radiator (421) of FIG. 4 ), and the second conductive portion (512) may correspond to a second antenna radiator (e.g., the second antenna radiator (422) of FIG. 4 ). When the first edge portion (218a) is a lower edge portion of the electronic device (101), the first conductive portion (511) and / or the second conductive portion (512) may be adjacent to the second printed circuit board (252). The first conductive portion (511) and / or the second conductive portion (512) may be electrically connected to the second printed circuit board (252) via an antenna contact (e.g., antenna contact (610) of FIG. 6). In the present disclosure, the first conductive portion (511) and / or the second conductive portion (512) of the frame (218) forming at least a portion of an edge of the electronic device is described as an example of an antenna radiator, but embodiments of the present disclosure are not limited thereto. For example, an antenna including an antenna radiator (e.g., antenna radiator (420) of FIG. 4) may include a laser direct structuring (LDS) antenna or an FPCB antenna, and may also include an antenna provided in a module form (e.g., a mmWave module).

[0109] According to one embodiment, the bracket (243) may be configured to function as a ground of the electronic device (101). The printed circuit board (250) may be electrically connected to the bracket (243) configured to function as a ground. For example, the printed circuit board (250) may include at least one ground layer (e.g., the fourth conductive layer (814) of FIG. 8) electrically connected to the bracket (243). Electronic components electrically connected to the printed circuit board (250) may be electrically connected to the bracket (243) through the at least one ground layer. For example, since the printed circuit board (250) is disposed on one side of the bracket (243), the at least one ground layer may be a layer adjacent to the other side of the printed circuit board (250) facing the bracket (243) (e.g., the second side (251b) or the fourth side (252b) of FIG. 3).

[0110] The current flow in a closed circuit forms a closed circuit that flows from the positive electrode of the battery to the load and then back to the negative electrode of the battery. The ground of the electronic device (101) is electrically connected to the negative electrode of the battery, so that the current from the load (e.g., the electronic component) flows to the ground. The path of the current that passes through the electronic component and flows to the ground may be referred to as a ground path or a return path. For example, the current from an impedance circuit (e.g., the impedance circuit (430) of FIG. 4) arranged on the second printed circuit board (252) may flow to the ground layer of the second printed circuit board (252) and to the bracket (243) configured to function as the ground through the ground layer. The printed circuit board (250) may include a conductive via for the return path. The conductive vias may be configured to electrically connect the ground layer to the conductive layers of the printed circuit board (250).

[0111] The flow of current along the return path may cause a parasitic effect. The flow of current along the return path may cause a virtual parasitic impedance, such as a parasitic inductance, around the return path. The parasitic impedance may cause harmonic noise when one or more conductive portions (510) are energized, which may result in radiated spurious emissions (RSE), which are unintentional electromagnetic waves. The electromagnetic waves may electromagnetically interfere with RF signals transmitted and / or received through the one or more conductive portions (510), causing noise, signal distortion, or communication failure. To reduce the above problems, the conductive via connected to the ground layer may be formed as a through-via that penetrates all layers of the printed circuit board (250). By using a through-via, the length of the return path can be reduced, thus reducing the parasitic inductance.

[0112] The printed circuit board (250) may include a fill cut area (e.g., the second PCB portion (602) of FIG. 6). The fill cut area is an area where at least a portion of the copper foil of the printed circuit board (250) is cut, and is distinguished from a fill area (e.g., the first PCB portion (601) of FIG. 6) where the copper foil is not cut. At least a portion of the copper foil cut within the fill cut area may be a ground layer. For example, the fill cut area may be formed in an area of ​​the printed circuit board (250) that is electrically connected to the antenna radiator (420). When the antenna radiator (420) is electrically connected to the fill area, since the copper foil in the fill area includes a conductive material (e.g., copper), the copper foil in the fill area may affect the radiation characteristics of the antenna radiator (420). To reduce the length of the return path, a through-via may be arranged adjacent to the boundary of the fill area that is in contact with the fill cut area.

[0113] For example, in the case of a through-via, since it is formed by penetrating through all layers of the printed circuit board (250), the area where electronic components can be placed may be reduced by the area where the through-via is formed. In order to implement various functions of the electronic device (101), as various electronic components are placed within the housing, the complexity of the wiring of the printed circuit board (250) may increase. In order to reduce parasitic inductance, if the printed circuit board (250) includes a through-via, the area for electrically connecting electronic components to the printed circuit board (250) may be insufficient. In order to place electronic components on the printed circuit board (250), if the through-via is far from the boundary of the fill area, the length of the return path may increase, which may cause parasitic inductance.

[0114] A printed circuit board (250) according to one embodiment may include a conductive material (e.g., conductive material (710) of FIG. 7) to provide a return path flowing to a ground layer instead of a through-via. The conductive material (710) may be referred to as a conductive trace. The fill cut region may include an opening (e.g., opening (620) of FIG. 6) that partially exposes a side surface of the fill region (e.g., side surface (603) of FIG. 6) that is in contact with the fill cut region, and the conductive material (710) may be formed by plating the side surface of the fill region exposed through the opening (620).

[0115] Hereinafter, the structure of a printed circuit board (250) including a conductive material (710) plated on the side of a fill area is described. The structure of the printed circuit board (250) described below can be applied to both the first printed circuit board (251) and the second printed circuit board (252). For convenience of explanation, the electronic device (101) is described as including a first antenna radiator (e.g., the first antenna radiator (421) of FIG. 4) and a second antenna radiator (e.g., the second antenna radiator (422) of FIG. 4), but as described above, embodiments of the present disclosure are not limited thereto.

[0116] Fig. 6 is a plan view of a printed circuit board according to one embodiment. Fig. 7 is a part of a perspective view of a printed circuit board according to one embodiment. Fig. 8 is a cross-sectional view of the printed circuit board of Fig. 6 taken along line AA'.

[0117] The structure of the printed circuit board (250) described below may be referred to as the structure of the first printed circuit board (251) and / or the second printed circuit board (252) of FIG. 3.

[0118] Referring to FIG. 6, the printed circuit board (250) may include a first PCB portion (601) and a second PCB portion (602). The second PCB portion (602) may be positioned alongside the first PCB portion (601). The first PCB portion (601) may be referred to as a fill region, as described above, which is an area of ​​the printed circuit board (250) that includes at least one ground layer (e.g., the fourth conductive layer (814) of FIG. 8). For example, the first PCB portion (601) may include at least one ground layer electrically connected to the ground of the electronic device (101). The second PCB portion (602) may be referred to as a fill cut region, where the ground layer is cut, which is an area of ​​the printed circuit board (250) that does not include a ground layer. The ground layer may be included in the first PCB portion (601) and may not be included in the second PCB portion (602). For example, the second PCB portion (602) may be insulated from at least one ground layer of the first PCB portion (601). The insulated second PCB portion (602) from at least one ground layer of the first PCB portion (601) may be referred to as the second PCB portion (602) not including a ground layer that is electrically connected to the ground of the electronic device (101).

[0119] According to one embodiment, the antenna radiator (420) may be electrically connected to a second PCB portion (602) of the printed circuit board (250). For example, an antenna contact (610) for electrically connecting the printed circuit board (250) and the antenna radiator (420) may be disposed (or mounted) on the second PCB portion (602). A power supply signal provided from a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) may be provided to the antenna radiator (420) through the printed circuit board (250) and the antenna contact (610). Since the antenna radiator (420) is electrically connected to the second PCB portion (602), the antenna radiator (420) and the ground layer may be spaced apart from each other. As the ground layer and the antenna radiator (420) are separated by the second PCB portion (602), the electromagnetic interaction between the ground layer and the antenna radiator (420) may be reduced. As described above, the antenna radiator (420) may include one or more conductive portions (e.g., one or more conductive portions (510) of FIG. 5) contained within a frame (e.g., frame (218) of FIG. 5). However, the antenna radiator (420) of the present disclosure is not limited to the one or more conductive portions. For example, the antenna radiator (420) may include a radiator of an LDS (laser direct structuring) antenna, a radiator of an FPCB antenna, or a radiator of an antenna module (e.g., a mmWave module). In addition to these, various embodiments may be possible.

[0120] According to one embodiment, the printed circuit board (250) may include an opening (620). The opening (620) may be formed from one side (e.g., the first side (251a), the third side (252a) of FIG. 3) of the printed circuit board (250) to another side (e.g., the second side (251b), the fourth side (252b) of FIG. 3). The opening (620) may be positioned within the second PCB portion (602) to contact a portion of a side surface (603) of the first PCB portion (601) (e.g., the first portion (603a) or the second portion (603b)). Before a conductive material (e.g., the conductive material (710) of FIG. 7) described below is plated, the opening (620) may expose the portion of the side surface (603) of the first PCB portion (601). A side surface (603) of the first PCB portion (601) partially exposed through the opening (620) may be in contact with a second PCB portion (602). For example, the side surface (603) of the first PCB portion (601) exposed through the opening (620) may be referred to as a boundary or edge of the first PCB portion (601). Since the first PCB portion (601) is a region of the printed circuit board (250) including a ground layer, the side surface (603) exposed through the opening (620) may include a ground layer. According to one embodiment, the opening (620) may be provided in plurality. For example, the opening (620) may include a first opening (621) and / or a second opening (622). For example, the first opening (621) may expose a first portion (603a) of a side surface (603) of the first PCB portion (601). The second opening (622) may expose a second portion (603b) of a side surface (603) of the first PCB portion (601).

[0121] As described above, the antenna radiator (420) can be electrically connected to the second PCB portion (602) of the printed circuit board (250). As the second PCB portion (602) from which the ground layer is cut is electrically connected to the antenna radiator (420), the influence of the ground layer on the antenna radiator (420) can be reduced.

[0122] According to one embodiment, the impedance circuit (430) may be disposed on the first PCB portion (601) of the printed circuit board (250). The impedance circuit (430) may be configured to be electrically connected to a transmission line electrically connected to the antenna radiator (420) to match the characteristic impedance of the impedance of the transmission line with the impedance of the antenna and to adjust the resonant frequency of the antenna. Since the antenna radiator (420) is electrically connected to the second PCB portion (602) of the printed circuit board (250), the impedance circuit (430) may be disposed on the first PCB portion (601) adjacent to the second PCB portion (602) to reduce signal loss. For example, the impedance circuit (430) may be disposed adjacent to the opening (620). For example, the impedance circuit (430) may include a first impedance circuit (431) for the first antenna radiator (421) and / or a second impedance circuit (432) for the second antenna radiator (422). For example, the second antenna contact (612) may be electrically connected to the second antenna radiator (422). The second antenna radiator (422) may be electrically connected to the printed circuit board (250) via the second antenna contact (612).

[0123] Referring to FIG. 7, the first opening (621) may be defined by a side surface (603a) of an edge portion (701) of the first PCB portion (601) and a side surface of an edge portion (702) of the second PCB portion (602). The second opening (622) may be defined by a side surface (603b) of another edge portion (703) of the first PCB portion (601) and a side surface of another edge portion (704) of the second PCB portion (602). The second opening (622) may be spaced apart from the first opening (621). The second opening (622) may be formed within the second PCB portion (602).

[0124] According to one embodiment, a conductive material (710) may be plated on a side surface (603) of a first PCB portion (601) exposed through an opening (620) formed in a second PCB portion (602). The conductive material (710) may be plated on a side surface (e.g., the side surface (603a) or the side surface (603b)) of the first PCB portion (601) exposed through the opening (620). As the conductive material (710) is plated on the side surfaces (603a, 603b), the side surfaces (603a, 603b) may not be visible from the outside. For example, the conductive material (710) may be plated on the side surface (603a) of the edge portion (701) of the first PCB portion (601) defining the first opening (621) and the side surface (603a) of the edge portion (702) of the second PCB portion (602).

[0125] According to one embodiment, a conductive material (710) disposed on a side surface (603a, 603b) of a first PCB portion (601) exposed through an opening (620) can be physically and electrically connected to at least one ground layer of the first PCB portion (601). The at least one ground layer included in the first PCB portion (601) can be exposed through the side surface (603a, 603b) of the first PCB portion (601) exposed through the opening (620). Since the conductive material (710) is plated on the side surface (603a, 603b) of the first PCB portion (601), the conductive material (710) can be connected to at least one ground layer. The connection of the conductive material (710) to at least one ground layer can be referred to as the conductive material (710) contacting at least one ground layer.

[0126] In one embodiment, the conductive material (710) can be configured to provide substantially the same function as a through-via. Since the opening (620) is formed to penetrate the printed circuit board (250), the side surfaces (603a, 603b) of the first PCB portion (601) exposed through the opening (620) can expose all of the layers included in the first PCB portion (601). When the conductive material (710) is plated on the side surfaces (603a, 603b) of the first PCB portion (601), the conductive material (710) is electrically connected to substantially all of the layers included in the first PCB portion (601) and is electrically connected to at least one ground layer, so the conductive material (710) can be configured to provide substantially the same function as a through-via.

[0127] Referring to FIG. 8, the printed circuit board (250) may include a plurality of conductive layers (810). For example, the printed circuit board (250) may include, but is not limited to, four conductive layers. The plurality of conductive layers (810) may be electrically connected through conductive vias. A non-conductive layer may be interposed between the plurality of conductive layers (810). For example, the plurality of conductive layers (810) may include a first conductive layer (811) (e.g., wiring), a second conductive layer (812), a third conductive layer (813), and a fourth conductive layer (814). The first conductive layer (811), the second conductive layer (812), the third conductive layer (813), and the fourth conductive layer (814) may be sequentially stacked with non-conductive layers therebetween. For example, the first conductive layer (811) may be disposed on one side (e.g., the first side (251a) or the third side (252a)) of the printed circuit board (250) facing the rear side (e.g., facing the -z direction) of the electronic device (101). The fourth conductive layer (814) may be disposed on the other side (e.g., the second side (251b) or the fourth side (252b)) of the printed circuit board (250) facing the front side (e.g., facing the +z direction) of the electronic device (101). The second conductive layer (812) and the third conductive layer (813) may be disposed between the first conductive layer (811) and the fourth conductive layer (814).

[0128] According to one embodiment, the other side of the printed circuit board (250) may be electrically connected to a ground of the electronic device (101). For example, the ground layer may be electrically connected to a bracket (e.g., bracket (243) of FIG. 5) configured to function as a ground of the electronic device (101) via a conductive connection (830). The conductive connection (830) may electrically connect the ground layer to the bracket (243) by contacting the ground layer and the bracket (243). The conductive connection (830) may be referred to as a conductive clip, a conductive pin, or a conductive contact. The other side (251b or 252b) of the printed circuit board (250) on which the fourth conductive layer (814) is disposed may face the bracket (243) so that the ground layer can be connected to the bracket (243) via the conductive connection (830). The fourth conductive layer (814) may be referred to as a ground layer.

[0129] In one embodiment, the conductive material (710) may be configured to provide a portion (P) of a return path to ground by being physically and electrically connected to at least one ground layer included within the first PCB portion (601). For example, the return path may be formed from the impedance circuit (430) along the conductive material (710), the ground layer, the conductive connection (830), and the bracket (243). For example, the first antenna contact (611) may be electrically connected to a first antenna radiator (e.g., the first antenna radiator (421) of FIG. 4). The first impedance circuit (431) may be electrically connected to a transmission line (820) connected to the first antenna contact (611). A portion of the return path flowing from the first impedance circuit (431) to the ground may be formed from the first impedance circuit (431) along the first conductive material (711) disposed on the first portion (603a) of the side surface (603) to the fourth conductive layer (814). A portion (P) of the return path provided by the conductive material (710) may be referred to as a portion formed from the first conductive layer (811) along the conductive material (710) to the fourth conductive layer (814), which corresponds to the ground layer, in the entire return path formed from the impedance circuit (430) to the bracket (243).

[0130] As described above, since the opening (620) is formed to penetrate from one side of the printed circuit board (250) to the other side of the printed circuit board (250), the thickness of the side surface (603) of the first PCB portion (601) exposed through the opening (620) can correspond to the minimum distance between the first conductive layer (811) and the fourth conductive layer (814). Since the conductive material (710) is disposed on the side surface, the thickness of the conductive material (710) can substantially correspond to the thickness of the first PCB portion (601) of the printed circuit board (250). A portion (P) of the return path formed along the conductive material (710) can be configured to function substantially the same as a conductive via. A portion (P) of the return path formed along the conductive material (710) can be formed with a minimum distance from the first conductive layer (811) to the fourth conductive layer (814), so that the overall length of the return path can be reduced. Since the overall length of the return path including the portion of the return path formed through the conductive material (710) can be reduced, the conductive material (710) can reduce parasitic impedance. By reducing the parasitic impedance, harmonic noise can be reduced, and the communication quality of the electronic device (101) can be improved.

[0131] Fig. 9 illustrates a portion of a printed circuit board according to a comparative example. Figs. 10 and 11 illustrate a portion of a printed circuit board according to one embodiment including an opening.

[0132] FIG. 9 illustrates a printed circuit board (900) according to a comparative example that does not include an opening (620). The printed circuit board (900) according to the comparative example may include a fill area (901) that includes a ground layer and a fill cut area (902) that does not include a ground layer. Through vias (903) adjacent to a boundary between the fill area (901) and the fill cut area (902) may be arranged within the fill area (901). The through vias (903) may be formed to penetrate the printed circuit board (900) according to the comparative example.

[0133] Since the printed circuit board (900) according to the comparative example includes through vias (903), the area in which electronic components and wirings electrically connected to the electronic components can be arranged may be reduced. Since the through vias (903) are formed by penetrating the printed circuit board (900) according to the comparative example, electronic components and wirings for the electronic components cannot be arranged within the area in which the through vias (903) are arranged. In the case of the printed circuit board (900) according to the comparative example, since the distance between the antenna contact (904) and the fill area (901) including the ground layer is relatively close, electromagnetic interaction between the antenna and the ground layer can occur relatively easily.

[0134] Referring to FIG. 10, a printed circuit board (250) according to one embodiment may include an opening (620). A conductive material (710) may be disposed on a side surface (603) of a first PCB portion (601) exposed through the opening (620). Since the conductive material (710) may replace a through via, the printed circuit board (250) may have a relatively large area on which electronic components may be disposed. In order to provide various functions through an electronic device (e.g., the electronic device (101) of FIG. 5), the number of electronic components included in the electronic device (101) may increase. In the case of the printed circuit board (250) including the opening (620), since it does not include a through via, a relatively large number of electronic components may be disposed.

[0135] In one embodiment, when the area of ​​the opening (620) is increased, the distance between the antenna contact (610) and the first PCB portion (601) including the ground layer can be relatively increased. When the through vias are removed and the opening (620) is expanded by the area where the removed through vias were placed, the distance between the antenna contact (610) and the first PCB portion (601) can be increased. As the distance between the antenna contact (610) and the first PCB portion (601) is relatively increased, the distance between the antenna and the ground layer can be relatively increased. In one embodiment, the performance of the antenna can be improved because the electromagnetic interaction between the antenna and the ground layer can be reduced.

[0136] Referring to FIG. 11, the printed circuit board (250) can secure an area capable of including at least one wiring (1110) for electronic components by removing through-vias arranged within the first PCB portion (601). For example, when the through-vias are replaced with a conductive material (710), at least a portion of the area occupied by the through-vias can be additionally secured. At least one wiring (1110) for electrical connection with an electronic component can be added within the area secured by removing the through-vias. By adding the at least one wiring (1110), the printed circuit board (250) can be electrically connected to a relatively large number of electronic components.

[0137] Fig. 12 is a plan view of a printed circuit board according to one embodiment. Fig. 13 illustrates an example of an X region of Fig. 12 in a printed circuit board. Fig. 14 illustrates an example of a Y region of Fig. 12 in a printed circuit board.

[0138] Referring to FIG. 12, the printed circuit board (250) may include a plurality of openings (1200) (e.g., opening (620) of FIG. 6). For example, the plurality of openings (1200) may include a first opening (1201), a second opening (1202), and a third opening (1203) which are positioned at different locations within a second PCB portion (602) of the printed circuit board (250). At locations where the first opening (1201), the second opening (1202), and the third opening (1203) are formed, portions of a side surface (603) of the first PCB portion (601) may be exposed. Conductive materials (e.g., the first conductive material (711) and the second conductive material (712) of FIG. 7) may be plated on portions of the side surface (e.g., the side surface (603) of FIG. 6) of the first PCB portion (601) exposed through the first opening (1201), the second opening (1202), and the third opening (1203), respectively. Each of the conductive materials may be configured to function substantially the same as a through-via. In one embodiment, the printed circuit board (250) may provide a portion of a ground path by removing the through-vias and through the conductive materials (710) plated in the corresponding area. The first opening (1201), the second opening (1202), and the third opening (1203) are merely examples for explaining a plurality of openings (1200) arranged at different locations of the printed circuit board (250), and embodiments of the present disclosure are not limited to the structure illustrated in FIG. 12.

[0139] Referring to FIG. 13, the antenna radiators (1311, 1312) (e.g., the antenna radiator (430) of FIG. 4) may be electrically connected to one side of the second PCB portion (602). For example, the one side of the second PCB portion (602) to which the antenna radiators (1311, 1312) are electrically connected may face the -x direction of FIG. 13. As the antenna radiators (1311, 1312) are electrically connected to one side of the second PCB portion (602), the openings (1300) (e.g., the openings (620) of FIG. 6) may be formed on the other side of the second PCB portion (602) opposite to the one side of the second PCB portion (602). For example, the antenna radiators (1311, 1312) may include a first antenna radiator (1311) and a second antenna radiator (1312), and the opening (1300) may include a first opening (1301) adjacent to the first antenna radiator (1311) and a second opening (1302) adjacent to the second antenna radiator (1312). The first opening (1301) and the second opening (1302) may be formed along a portion of an edge facing the x direction of the second PCB portion (602).

[0140] According to one embodiment, the shape of the opening (1300) may vary depending on the shape or structure of the boundary between the first PCB portion (601) and the second PCB portion (602). For example, the opening (1300) may include an inclined surface that is at least partially inclined. When the opening (1300) includes an inclined surface, a side surface of the first PCB portion (601) exposed through the opening (1300) (e.g., side surface (603) of FIG. 6) may include an inclined portion (1320) by being exposed through the inclined surface. The inclined portion (1320) may be referred to as a portion having an incline with respect to the x-axis or the y-axis of FIG. 13. The boundary between the first PCB portion (601) and the second PCB portion (602) can be formed in various shapes depending on the size and structure of the printed circuit board (250), the number, shape, and size of electronic components electrically connected to the printed circuit board (250), or the position of the printed circuit board (250) within the electronic device (101). Depending on the shape between the first PCB portion (601) and the second PCB portion (602), the opening (1300) can be formed in various shapes, and thus the side surface (603) of the first PCB portion (601) exposed through the opening (1300) can have various shapes other than a linearly extending portion or an inclined portion (1320).

[0141] Referring to FIG. 14, the antenna radiators (1411, 1412) (e.g., the antenna radiator (420) of FIG. 4) may be electrically connected to a lower portion of the second PCB portion (602). For example, the lower portion of the second PCB portion (602) to which the antenna radiators (1411, 1412) are electrically connected may face the -y direction of FIG. 14. For example, as the antenna radiators (1411, 1412) are electrically connected to the lower portion of the second PCB portion (602), the opening (1400) may be formed in an upper portion (e.g., in the +y direction) of the second PCB portion (602) opposite to the lower portion (e.g., in the -y direction) of the second PCB portion (602). For example, the upper portion of the second PCB portion (602) may face the +y direction. For example, the opening (1400) may include a first opening (1401), a second opening (1402), and a third opening (1403), and the antenna radiators (1411, 1412) may include a first antenna radiator (1411) positioned between the first opening (1401) and the second opening (1402), and a second antenna radiator (1412) positioned between the second opening (1402) and the third opening (1403). The first opening (1401), the second opening (1402), and the third opening (1403) may be formed along a portion of an edge of the second PCB portion (602) facing the +y direction. For example, the opening (1400) may be formed in various ways depending on the shape of the boundary surface of the first PCB portion (601) and the second PCB portion (602). The conductive materials (e.g., the first conductive material (711) and the second conductive material (712) of FIG. 7) can be formed according to the shape of the side surface (603) of the first PCB portion (601).

[0142] FIGS. 13 and 14 may illustrate an example of a printed circuit board (250) to illustrate that openings (620) may be formed at various locations on the printed circuit board (250). Embodiments of the present disclosure are not limited to the structure of the printed circuit board (250) illustrated in FIGS. 13 and 14.

[0143] Fig. 15 is a flowchart illustrating a process for forming a conductive material of a printed circuit board according to one embodiment. Figs. 16, 17, 18, 19, and 20 illustrate processes for forming an opening.

[0144] According to one embodiment, the conductive material (710) may be formed by forming an opening (620) in a printed circuit board (250) and then plating a portion of a side surface (603) of the first PCB portion (601) exposed through the opening (620) with a conductive material. An exemplary process for forming the conductive material (710) is described below.

[0145] Referring to FIG. 15, in process 1501, a hole may be machined through a portion of a second PCB portion (602) of a printed circuit board (250).

[0146] Fig. 16 illustrates a portion of a printed circuit board (250) in which a hole (1610) is machined. Referring to Fig. 16, a hole (1610) may be machined in a second PCB portion (602). The hole (1610) may be positioned in the second PCB portion (602) that contacts the first PCB portion (601) to expose a side surface (603) of the first PCB portion (601). For example, the hole (1610) may be formed through computerized numerical control (CNC) machining. Referring to a cross-sectional view of the printed circuit board (250) of Fig. 16 taken along line BB', the hole (1610) may be formed by penetrating a non-conductive layer (1601) and a conductive layer (1602) of the printed circuit board (250).

[0147] Referring again to FIG. 15, in process 1503, a metal material is plated on the inner surface of the hole (1610) to form a plated layer, and a land (e.g., land (1810) of FIG. 18) may be formed.

[0148] Referring to FIG. 17, a metal material (e.g., copper) may be plated on the inner surface of a hole (1610) to form a plating layer (1710). Referring to a cross-sectional view taken along line CC' of the printed circuit board (250) of FIG. 17, the plating layer (1710) may be formed on the inner surface of the hole (1610) and the conductive layer (1602).

[0149] Referring to Fig. 18, a land including a plating layer (1710) formed on the inner surface of a hole (1610) can be formed. The land (1810) is a portion to which an electronic component can be coupled and may be referred to as a pad. Referring to a cross-sectional view taken along the line DD' of the printed circuit board (250) of Fig. 18, the land (1810) can be formed by processing the conductive layer (1602) and the plating layer (1710).

[0150] Referring again to FIG. 15, in process 1505, a conductive material (710) may be plated on the plating layer.

[0151] Referring to FIG. 19, a conductive material (710) can be formed by plating a metal material (e.g., gold) on a plating layer (1710). Referring to a cross-sectional view taken along line EE' of the printed circuit board (250) of FIG. 19, the conductive material (710) can be formed by plating a metal material through a hole (1610), and thus, the conductive material (710) can be formed on the plating layer (1710) included in the first PCB portion (601) and the second PCB portion (602) around the hole (1610).

[0152] Referring again to FIG. 15, in process 1507, a hole (1610) may be machined to form an opening (620).

[0153] Referring to FIG. 20, an opening (620) can be formed by drilling an area around the hole (1610) of FIG. 19. Referring to a cross-sectional view taken along the FF' line of the printed circuit board (250) of FIG. 20, an opening (620) can be formed by drilling a second PCB portion (602). A conductive material (710) exposed through the opening (620) can be electrically connected to a conductive layer (1602) within the first PCB portion (601) through a plating layer (1710).

[0154] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure pertains.

[0155] An electronic device (101) is disclosed. The electronic device (101) may include an antenna radiator (420). The electronic device (101) may include a printed circuit board (PCB) (251, 252). The printed circuit board (251, 252) may include a first PCB portion (601) including a plurality of layers. The plurality of layers of the first PCB portion (601) may include at least one ground layer (814) electrically connected to a ground of the electronic device (101). The printed circuit board (251, 252) may include a second PCB portion (602) disposed next to the first PCB portion (601) and including a plurality of layers. The second PCB portion may be electrically insulated from the at least one ground layer of the first PCB portion (601). The printed circuit board (251, 252) may include an opening (621) defined by both a side surface of an edge portion of the first PCB portion (601) and a side surface of an edge portion of the second PCB portion (602). The printed circuit board (251, 252) may include a conductive material (711) plated on the side surface of the edge portion of the first PCB portion and electrically connected to the at least one ground layer of the first PCB portion (601). The electronic device (101) may include an antenna contact (610) electrically connected to the antenna radiator (420) and mounted on the second PCB portion (602). The electronic device (101) may include an impedance circuit (430) mounted on an area of ​​the first PCB portion (601) including at least a portion of the edge portion of the first PCB portion (601) and electrically connected to the antenna contact (610).The above impedance circuit (430) can also be electrically connected to at least one ground layer (814) of the first PCB portion (601) through the conductive material (711).

[0156] In one embodiment, the through via electrically connected to the impedance circuit (430) may be omitted from the first PCB portion (601).

[0157] According to one embodiment, the conductive material (711) may be configured to provide a portion (P) of a return path from the impedance circuit (430) to the at least one ground layer (814) of the first PCB portion (601).

[0158] According to one embodiment, the impedance circuit (430) may be positioned adjacent to the second PCB portion (602) of the printed circuit board (251, 252).

[0159] According to one embodiment, the electronic device (101) may further include a bracket (243) corresponding to the ground of the electronic device (101) and supporting the printed circuit board (251, 252). The at least one ground layer (814) of the first PCB portion (601) may be disposed on one surface of the bracket (243).

[0160] According to one embodiment, the one side of the bracket (243) may face the rear side of the electronic device.

[0161] According to one embodiment, the electronic device (101) may further include a conductive connection portion (830) connected to each of the one surface of the bracket (243) and the at least one ground layer (814).

[0162] According to one embodiment, the length of a portion (P) of the return path from the impedance circuit (430) to the at least one ground layer (814) of the first PCB portion (601) may correspond to the thickness of the printed circuit board (251, 252).

[0163] According to one embodiment, the electronic device (101) may further include a frame (218) defining at least a portion of an edge of the electronic device and including a conductive portion (511, 512) electrically connected to the antenna contact (610). The antenna radiator (420) may correspond to the conductive portion (511, 512) of the frame (218).

[0164] According to one embodiment, the first PCB portion (601) may correspond to a fill area, and the second PCB portion (602) may correspond to a fill cut area.

[0165] According to one embodiment, the conductive material (711) may be plated only on the edge portion of the first PCB portion (601) among the side surface of the edge portion of the first PCB portion (601) and the side surface of the edge portion of the second PCB portion (602).

[0166] According to one embodiment, the printed circuit board (251, 252) may further include another opening (622) defined by both a side surface of the other edge portion of the first PCB portion (601) and a side surface of the other edge portion of the second PCB portion (602), and another conductive material (712) plated on the side surface of the other edge portion of the first PCB portion and electrically connected to the at least one ground layer of the first PCB portion (601).

[0167] According to one embodiment, the printed circuit board (251, 252) may include wiring (811) (e.g., a conductive layer) disposed within the first PCB portion (601), adjacent to the opening (621), and electrically connected to an electronic component mounted on the first PCB portion (601).

[0168] According to one embodiment, the side surface of the edge portion of the first PCB portion (601) or the side surface of the edge portion of the second PCB portion (602), which defines the opening (621), may include an inclined portion.

[0169] According to one embodiment, the electronic device (101) may further include another printed circuit board (252, 251) on which a wireless communication circuit (192) is arranged. The electronic device (101) may further include a flexible printed circuit board (410) that electrically connects the printed circuit board (251, 252) and the other printed circuit board (252, 251).

[0170] An electronic device (101) is disclosed. The electronic device (101) may include a wireless communication circuit (192). The electronic device (101) may include an antenna radiator (420) configured to transmit or receive RF signals. The electronic device (101) may include a printed circuit board (251, 252) configured to electrically connect the wireless communication circuit (192) and the antenna radiator (420). The electronic device (101) may include a bracket (243) configured to support the printed circuit board (251, 252) and function as a ground for the electronic device (101). The printed circuit board (251, 252) may include a first PCB portion (601) including at least one ground layer (814) electrically connected to the bracket (243), a second PCB portion (602) disposed next to the first PCB portion (601), insulated from the at least one ground layer (814) of the first PCB portion (601), and having an antenna contact (610) electrically connected to the antenna radiator disposed thereon, an opening (621) defined by both a side surface of an edge portion of the first PCB portion (601) and a side surface of an edge portion of the second PCB portion (602), and a conductive material (711) plated on the side surface of the edge portion of the first PCB portion (601) and electrically connected to the at least one ground layer (814) of the first PCB portion (601). The thickness of the above conductive material (711) can substantially correspond to the thickness of the first PCB portion (601) of the printed circuit board (251, 252).

[0171] According to one embodiment, the electronic device (101) may further include an impedance circuit (430) mounted on an area of ​​the first PCB portion (601) including at least a portion of the edge portion of the first PCB portion (601) and electrically connected to the antenna contact (610). The impedance circuit (430) may also be electrically connected to at least one ground layer (814) of the first PCB portion (601) through the conductive material (711).

[0172] According to one embodiment, the conductive material (711) may be configured to provide a portion (P) of a return path from the impedance circuit (430) to the at least one ground layer (814).

[0173] In one embodiment, the through via electrically connected to the impedance circuit (430) may be omitted from the first PCB portion (601).

[0174] According to one embodiment, the electronic device (101) may further include a frame (218) defining at least a portion of an edge of the electronic device (101) and laterally surrounding the bracket (243). The frame (218) may include one or more conductive portions (510) corresponding to the antenna radiator (420).

[0175] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0176] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0177] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0178] The term "module" used in various embodiments of this document may include a unit implemented by hardware, software, or firmware, or a combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0179] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (120) (e.g., the processor (120)) of a machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0180] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium, such as a memory (130) of a manufacturer's server, an application store's server, or an intermediary server.

[0181] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0182] While the present disclosure has been described and illustrated by way of example through the drawings, it should be understood that these embodiments are illustrative and not limiting. Those skilled in the art will appreciate that various modifications, alternatives, and variations are possible without departing from the true spirit and scope of the present disclosure, including the appended claims and their equivalents. Furthermore, it should be understood that any one embodiment described in the present disclosure may be combined with other embodiments.

Claims

1. In electronic devices, antenna radiator; and Printed circuit board (PCB), the printed circuit board, A first PCB portion comprising a plurality of layers, wherein the plurality of layers of the first PCB portion include at least one ground layer electrically connected to a ground of the electronic device; A second PCB portion disposed next to the first PCB portion and including a plurality of layers, the second PCB portion being electrically insulated from at least one ground layer of the first PCB portion; An opening defined by both the side surface of the edge portion of the first PCB portion and the side surface of the edge portion of the second PCB portion, and A conductive material plated on the side surface of the edge portion of the first PCB portion and electrically connected to at least one ground layer of the first PCB portion; An antenna contact electrically connected to the antenna radiator and mounted on the second PCB portion; and An impedance circuit mounted on an area of ​​the first PCB portion including at least a portion of the edge portion of the first PCB portion and electrically connected to the antenna contact, The above impedance circuit, electrically connected to at least one ground layer of the first PCB portion through the conductive material; Electronic devices.

2. In paragraph 1, A through via electrically connected to the above impedance circuit is omitted from the first PCB portion; Electronic devices.

3. In paragraph 1, The above challenging material is, configured to provide a portion of a return path from said impedance circuit to said at least one ground layer of said first PCB portion; Electronic devices.

4. In paragraph 1, The above impedance circuit, Positioned adjacent to the second PCB portion of the printed circuit board, Electronic devices.

5. In paragraph 1, Further comprising a bracket corresponding to the ground of the electronic device and supporting the printed circuit board, At least one of the ground layers of the first PCB portion, Placed on one side of the above bracket, Electronic devices.

6. In paragraph 5, The above one side of the above bracket is, Facing the rear side of the above electronic device, Electronic devices.

7. In paragraph 5, Further comprising a conductive connection portion electrically connected to each of said one side of said bracket and said at least one ground layer, Electronic devices.

8. In paragraph 1, The length of a portion of the return path from the impedance circuit to the at least one ground layer of the first PCB portion is Corresponding to the thickness of the above printed circuit board, Electronic devices.

9. In paragraph 1, further comprising a frame defining at least a portion of an edge of the electronic device and including a conductive portion electrically connected to the antenna contact; The above antenna radiator corresponds to the conductive portion, Electronic devices.

10. In paragraph 1, The above first PCB part, It corresponds to the field area, The above second PCB part, Corresponding to the fill cut area, Electronic devices.

11. In paragraph 1, The above challenging material is, Plated on the edge portion of the first PCB portion, Electronic devices.

12. In paragraph 1, The above printed circuit board, another opening defined by both a side surface of another edge portion of the first PCB portion and a side surface of another edge portion of the second PCB portion, and Further comprising a conductive material plated on the side surface of the other edge portion of the first PCB portion and electrically connected to the at least one ground layer of the first PCB portion. Electronic devices.

13. In paragraph 1, The above printed circuit board, A wiring positioned within the first PCB portion, adjacent to the opening, and electrically connected to an electronic component mounted on the first PCB portion, Electronic devices.

14. In paragraph 1, The side surface of the edge portion of the first PCB portion and / or the side surface of the edge portion of the second PCB portion defining the opening, including the inclined part, Electronic devices.

15. In paragraph 1, another printed circuit board on which wireless communication circuitry is arranged; and Further comprising a flexible printed circuit board electrically connecting the printed circuit board and the other printed circuit board, Electronic devices.

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