Batch-type substrate processing apparatus

Abstract

The present invention relates to a batch-type substrate processing apparatus capable of effectively suppressing the generation of particles generated in the vicinity of a seal cap unit. A batch-type substrate processing apparatus according to an embodiment of the present invention may comprise: a reaction tube providing a substrate processing space extending in a first direction; a hollow manifold for supporting the reaction tube; a substrate boat for loading a plurality of substrates in the first direction; a seal cap unit provided with a seal cap flange having a first through-hole formed in a central portion thereof, supporting the substrate boat, and configured to open and close an open lower end of the manifold; a nozzle unit extending along the first direction to provide a processing gas to the substrate processing space; a rotation driving unit provided with a rotation shaft inserted into the first through-hole to transmit a rotational force to the substrate boat; and a first purge gas supply unit for supplying a purge gas so that the purge gas flows along an upper surface of the seal cap flange.

Description

Batch substrate processing device

[0001] The present invention relates to a batch-type substrate processing device, and more particularly, to a batch-type substrate processing device capable of effectively suppressing the generation of particles generated near a seal cap portion.

[0002] In a batch-type substrate processing device capable of simultaneously performing substrate processing on multiple substrates, the temperature of not only the processing space but also the substrates is increased by a hot wall type heating means surrounding the processing space.

[0003] As the processing gas supplied by the nozzle rises to a high temperature in the processing space and then moves to the lower part of the processing space where the exhaust part is located, the temperature decreases, and as a result, insufficient thermal energy may be provided near the seal cap, resulting in unreacted processing gas being introduced or particles being generated in a state where sufficient reaction has not occurred.

[0004] Unreacted processing gases and particles can act as contaminants during the substrate processing process or deteriorate components of the substrate processing device, which not only reduces the quality of the thin film on the substrate but also reduces the efficiency of the processing for the substrate.

[0005] Methods are being attempted to supply purge gas near the seal cap to prevent unreacted treated gas from flowing in or to suppress particle generation, but there is still a problem that particle generation is not effectively suppressed in the dead zone due to the internal space adjacent to the seal cap or the internal structure of the seal cap where the supply of purge gas is not smooth.

[0006] (Patent Document 1) Korean Patent No. 10-1750633

[0007] The present invention provides a substrate processing device capable of effectively suppressing the generation of particles in the adjacent space and inside of a seal cap portion.

[0008] A batch type substrate processing device according to an embodiment of the present invention may include: a reaction tube providing a substrate processing space extending in a first direction; a hollow manifold supporting the reaction tube; a substrate boat loading a plurality of substrates in the first direction; a seal cap portion having a seal cap flange having a first through hole formed in a central portion, supporting the substrate boat and opening and closing an open lower portion of the manifold; a nozzle portion extending along the first direction and providing a processing gas to the substrate processing space; a rotation driving portion having a rotation shaft inserted into the first through hole and transmitting a rotational force to the substrate boat; and a first purge gas supply portion supplying a purge gas so as to flow along an upper surface of the seal cap flange.

[0009] The above seal cap portion further includes a seal cap plate provided on the seal cap flange and having a second through hole in the central portion, and the first purge gas supply portion can supply purge gas between the seal cap flange and the seal cap plate.

[0010] The seal cap flange may further include a first ring-shaped concave portion provided to surround the first through hole on the upper surface, and the first purge gas supply portion may include an injection portion that penetrates the seal cap flange and injects purge gas into the first concave portion.

[0011] The seal cap flange further includes an injection unit receiving groove provided on the upper surface to receive one end of the injection unit, and the injection unit can inject purge gas from the side of the first concave portion.

[0012] The above seal cap plate may further include a second concave portion provided on the lower surface, connected to the first concave portion in the ring shape, and extending outward toward the edge.

[0013] The above second concave portions may be provided in multiple numbers spaced apart from each other.

[0014] The second concave portion may include a nozzle-facing concave portion extending in the direction in which the nozzle portion is provided.

[0015] The device may further include a temperature measuring unit extending in the first direction to measure the temperature of the substrate processing space; or a cleaning gas nozzle unit connected to the manifold to provide a cleaning gas to the hollow portion of the manifold; and the second concave unit may include a temperature measuring unit-facing concave unit extending in the direction in which the temperature measuring unit is provided; or a cleaning gas nozzle-facing concave unit extending in the direction in which the cleaning gas nozzle unit is provided.

[0016] The above second concave portion may further include an auxiliary concave portion extending in a direction intersecting the extension direction of the nozzle-facing concave portion.

[0017] The above seal cap plate may further include a third concave portion having a ring shape and extending along an edge of the seal cap plate and connected to the second concave portion.

[0018] The above seal cap flange may further include an alignment pin that determines the assembly position of the seal cap flange and the seal cap plate.

[0019] It may include a second purge gas supply unit that supplies purge gas to a space between the first through hole and the rotational axis.

[0020] The seal cap portion may further include a guide block that is at least partially inserted into the second through hole and coupled to the upper end of the rotation shaft; and a turntable that is coupled to the upper end of the guide block and rotates according to the rotation of the rotation shaft to rotate the substrate boat.

[0021] A gap between the lower surface of the guide block and the upper surface of the seal cap flange; a gap between the side surface of the second through hole and the side surface of the guide block; and a gap between the upper surface of the seal cap plate and the lower surface of the turntable; may be connected to each other to form a flow path through which the purge gas supplied by the second purge gas supply unit flows.

[0022] A batch type substrate processing device further comprising a pedestal having an upper end connected to the substrate boat and a lower end connected to cover at least a portion of an upper surface and a side surface of the turntable, wherein the seal cap plate further comprises a partition wall portion provided to protrude from the upper surface and extending along an edge of the lower end of the pedestal to at least partially surround the edge of the lower end of the pedestal.

[0023] The above bulkhead portion may be formed of a plurality of bulkhead portions spaced apart from each other by a separation space.

[0024] The first purge gas supply unit and the second purge gas supply unit can be driven independently of each other.

[0025] According to the batch substrate processing device according to the present invention, by stably supplying purge gas along the upper surface of the seal cap flange of the seal cap portion, a dead zone in which the supply of purge gas is insufficient is not generated in the space near the seal cap portion including the edge of the seal cap portion, and the inflow of unreacted processing gas or gaseous processing byproducts and the generation of particles can be effectively suppressed.

[0026] In addition, by supplying purge gas through the seal cap flange and seal cap plate constituting the seal cap part, a dead zone where the supply of purge gas is insufficient is not generated inside the seal cap part, and the inflow of unreacted processed gas or gaseous processed byproducts and the generation of particles can be effectively suppressed.

[0027] By directly supplying purge gas toward the mounting location of a structure such as a nozzle section that is mounted to be exposed to substrate processing gas flowing into the internal space of the manifold, the inflow of unreacted processing gas into the structure such as the nozzle section and the generation of particles can be more effectively suppressed.

[0028] By using a second purge gas supply unit that supplies purge gas between the seal cap flange and the seal cap plate and a second purge gas supply unit that supplies purge gas to the gap between the inner wall of the through hole of the seal cap flange and the rotating shaft, the inflow of unreacted processing gas and the generation of particles in the space near the seal cap can be more effectively suppressed.

[0029] In addition, by forming a path through which purge gas can flow using the structure of the seal cap flange, the seal cap plate, the guide block, and the turntable, purge gas can be supplied with a simple structure without using additional parts.

[0030] Furthermore, the first purge gas supply unit and the second purge gas supply unit can be independently controlled to finely control the local pressure or flow of the processing gas within the processing space.

[0031] FIG. 1 is a drawing illustrating a batch substrate processing device according to an embodiment of the present invention.

[0032] Figure 2 is an exploded perspective view of a seal cap portion according to an embodiment of the present invention.

[0033] Figure 3 is a rear perspective view showing the shape of a seal cap plate according to an embodiment of the present invention.

[0034] Fig. 4 is a drawing showing the assembled state of a seal cap portion according to an embodiment of the present invention.

[0035] Fig. 5 is a rear view showing the shape of a seal cap plate according to another embodiment of the present invention.

[0036] FIG. 6 is a drawing illustrating a flow path of a purge gas in a batch substrate processing device according to an embodiment of the present invention.

[0037] Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms. These embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. In the description, identical reference numerals are assigned to identical components, and the drawings may be partially exaggerated in size to accurately describe the embodiments of the present invention, and identical numerals in the drawings indicate identical elements.

[0038] FIG. 1 is a drawing illustrating a batch type substrate processing device according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of a seal cap part according to an embodiment of the present invention, FIG. 3 is a rear perspective view illustrating the shape of a seal cap plate according to an embodiment of the present invention, FIG. 4 is a drawing illustrating an assembled state of a seal cap part according to an embodiment of the present invention, FIG. 5 is a rear view illustrating the shape of a seal cap plate according to another embodiment of the present invention, and FIG. 6 is a drawing illustrating a flow path of a purge gas in a batch type substrate processing device according to an embodiment of the present invention.

[0039] Referring to FIGS. 1 to 6, a batch substrate processing device according to an embodiment of the present invention may include: a reaction tube (100) providing a substrate processing space extending in a first direction; a hollow manifold (110) supporting the reaction tube (100); a substrate boat (200) loading a plurality of substrates in the first direction; a seal cap portion (300) having a seal cap flange (310) having a first through-hole (311) formed in the center thereof, supporting the substrate boat (200) and opening and closing an open lower end of the manifold (110); a nozzle portion (400) extending along the first direction and providing a processing gas to the substrate processing space; a rotational driving portion (500) having a rotational shaft (510) inserted into the first through-hole (311) and transmitting a rotational force to the substrate boat (200); and a first purge gas supply portion (720) supplying a purge gas so as to flow along an upper surface of the seal cap flange.

[0040] The reaction tube (100) may extend in a first direction (e.g., vertically) to provide a substrate processing space extending in the first direction. The reaction tube (100) has a cylindrical shape with a closed upper portion and an open lower portion, and may be made of a material such as quartz or silicon carbide (SiC) that can withstand high temperatures. The reaction tube (100) may have a double structure of an outer tube and an inner tube, and a nozzle portion (400) may be provided in a space between the outer tube and the inner tube, and the inner tube may have a through hole through which a processing gas may pass.

[0041] The processing space of the reaction tube (100) is a space that accommodates a substrate boat (200) in which multiple substrates are stacked during a substrate processing process, and where a substrate processing process such as a deposition process or a cleaning process is performed. A heating unit (130) for heating the processing space of the reaction tube (100) to a processing temperature may be arranged to surround the reaction tube (100).

[0042] The manifold (110) is a hollow cylinder-shaped structure with an upper end and an lower end that are open and have a central hollow portion that supports the reaction tube (100) and is coupled to the lower portion of the reaction tube (100). The manifold (110) may be made of a metal material. An exhaust portion (120) through which process gas, purge gas, and reaction byproducts can be exhausted may be provided on one side of the manifold (110).

[0043] The substrate boat (200) is configured to support a plurality of substrates, and can be formed so that the plurality of substrates are stacked in multiple stages while being spaced apart at predetermined intervals in a first direction, and a plurality of unit processing spaces in which the plurality of substrates are individually processed can also be formed. The substrate boat (200) can be brought into or taken out of the processing space of the reaction tube (100) through the hollow portion of the manifold (110) by raising and lowering the seal cap portion (300). The substrate boat (200) can be made of a heat-resistant material such as quartz or SiC.

[0044] A pedestal (210) may be provided at the bottom of the substrate boat (200) to suppress heat from the heating unit (130) from being transferred to the seal cap unit (300) and the rotary drive unit (500) by installing a plurality of insulating plates, which are insulating members made of heat-resistant materials such as quartz and SiC.

[0045] The seal cap portion (300) has a seal cap flange (310) having a first through hole (311) formed in the central portion, supports the substrate boat (200), and can open and close the open lower portion of the manifold (110). The seal cap flange (310) may be made of metal, and forms a space (hollow portion) separated from the external environment by being in close contact with the lower surface of the manifold (110) by a sealing member (111) accommodated between a pair of protrusions (314, 3315) formed at the edge, so it must have rigidity to withstand exhaust pressure.

[0046] The batch substrate processing device of the present invention includes a loading chamber (600) that communicates with a reaction tube (100) and provides a loading space for loading a substrate onto the substrate boat (200). The substrate boat (200) can move between a loading position and a processing position by a moving shaft (610) that is fixed between the upper and lower portions of the loading chamber (600) and extends in a first direction, and a linear moving member (620) that is movably connected to the moving shaft (610) and linearly moves a seal cap portion (300) along the first direction. When the substrate boat (200) reaches the processing position, the seal cap portion (300) coupled to the linear moving member (620) can close the open lower portion of the manifold (110). A sealing member (111) may be interposed between the reaction tube (100) and the manifold (110), and between the manifold (110) and the seal cap portion (300) to provide sealing.

[0047] The nozzle unit (400) may extend in a first direction to provide a processing gas to the substrate processing space. The nozzle unit (400) may include a processing gas injection port formed along the first direction in a gas supply pipe extending in the first direction to supply a processing gas for processing a substrate to the processing space of the reaction tube (100). For example, the processing gas may be a source gas or reaction gas for thin film deposition, a purge gas for purging the processing space, a cleaning gas for cleaning the processing space, etc.

[0048] The rotary drive unit (500) may be provided with a rotary shaft (510) that is inserted into the first through hole (311) and transmits rotary force to the substrate boat (200). The rotary drive unit (500) may rotate the substrate boat (200) and the pedestal (210) to ensure uniformity of substrate processing (e.g., uniformity of thin film deposition thickness) by the processing gas supplied by the nozzle unit (400).

[0049] Meanwhile, the hollow portion, which is the internal space of the manifold (110), can be formed to have a relatively lower temperature than the processing space of the reaction tube (100). The processing gas supplied through the nozzle portion (400) fixed to one side of the manifold (110) can flow along the surface of the loaded substrate and then move to be exhausted through the exhaust portion (120) provided on the other side of the manifold (110). When the unreacted processing gas and gaseous processing byproducts reach the space above the seal cap portion (300) that comes into contact with the hollow portion of the manifold (110) that has a lower temperature than the processing space of the reaction tube (100), components such as the seal cap portion (300) and the rotary drive portion (500) may be deteriorated or solid byproducts in the form of particles may be generated due to insufficient thermal energy.

[0050] In particular, during the substrate processing process, the side wall of the manifold (110) and the edge of the seal cap portion (300) intersect with each other to close the open lower portion of the manifold (110), so that when unreacted processing gas and gaseous processing byproducts reach the intersection area of ​​the side wall of the manifold (110) and the edge of the seal cap portion (300), they are trapped and it is not easy for them to escape again, and solid byproducts in the form of particles can be generated more easily than in other areas.

[0051] The first purge gas supply unit (720) of the present invention supplies purge gas so that it flows along the upper surface of the seal cap flange, thereby allowing the supplied purge gas to more easily reach the intersection area of ​​the side wall of the manifold (110) and the edge of the seal cap portion (300), thereby effectively purging the intersection area of ​​the side wall of the manifold (110) and the edge of the seal cap portion (300).

[0052] The purge gas may be an inert gas such as nitrogen (N2) gas so as to purge without contaminating the parts and processing space of the batch substrate processing device including the seal cap unit (300), the rotating unit (510), etc.

[0053] The seal cap portion (300) further includes a seal cap plate (320) provided on the seal cap flange (310) and having a second through hole (321) in the central portion, and a first purge gas supply portion (720) can supply purge gas between the seal cap flange (310) and the seal cap plate (320).

[0054] The seal cap plate (320) may have a second through hole (321) in the center and may be provided on the seal cap flange (310). The seal cap flange (310) is made of metal and may be corroded or deteriorated by processing gases, etc. For example, the surface may be corroded and blackened by cleaning gases. On the other hand, the seal cap plate (320) is made of quartz, which is a very stable material, and may not be corroded or deteriorated by processing gases. Therefore, the seal cap plate (320) may be provided on the seal cap flange (310) to prevent the processing gas, etc. from directly contacting the seal cap flange (310), thereby suppressing corrosion or deterioration of the seal cap flange (310). The second through hole (321) may be aligned with the first through hole (311) so that the rotation shaft (510) and the guide block (330) may be inserted and connected to each other.

[0055] The first purge gas supply unit (720) can supply the purge gas between the lower surface of the seal cap plate (320) and the upper surface of the seal cap flange (310) so that the purge gas supplied by the first purge gas supply unit (720) can flow along the upper surface of the seal cap flange (310) and stably reach the edge of the seal gap portion (300) or the inner wall of the manifold (110). The purge gas flowing between the lower surface of the seal cap plate (320) and the upper surface of the seal cap flange (310) can be ejected into the space between the edge of the seal cap plate (320) and the inner wall of the manifold (110) to effectively purge the space near the inner wall of the manifold (110) (in particular, the intersection area of ​​the inner wall of the manifold (110) and the edge of the seal cap portion (300).

[0056] The seal cap part (300) is formed by assembling a seal cap flange (310) and a seal cap plate (320), etc., and when a process gas or a gaseous byproduct flows into the seal cap part (300), particles may be generated inside the seal cap part (300). The first purge gas supply part (720) supplies a purge gas between the seal cap flange (310) and the seal cap plate (320) to purge the inside of the seal cap part (300) or the inner side (or upper surface) of the seal cap flange, thereby effectively suppressing the generation of particles inside the seal cap part (300).

[0057] The purge gas supplied by the first purge gas supply unit (720) must spread out in a 360° omnidirectional direction between the lower surface of the seal cap plate (320) and the upper surface of the seal cap flange (310) centered on the first through hole (311) and the second through hole (321) to effectively purge the space between the edge of the seal cap plate (320) and the inner wall of the manifold (110). Although a separate injection device can be installed to inject the purge gas in a 360° omnidirectional direction, it is not easy to secure sufficient space in the seal cap unit (300) or an adjacent area to which the separate injection device can be installed, and even if space is secured, the additional injection device may capture the process gas, etc., or provide a location where particles can be easily generated.

[0058] In the present invention, the seal cap flange (310) may further include a first ring-shaped concave portion (313) provided to surround a first through hole (311) on the upper surface, and the first purge gas supply unit (720) may include an injection unit (723) that penetrates the seal cap flange (310) and injects a purge gas into the first concave portion. The purge gas supplied through the injection unit (723) of the first purge gas supply unit (720) may fill the first ring-shaped concave portion (313) provided to surround the first through hole (311) formed on the upper surface of the seal cap flange (310). Even if the purge gas is supplied from a single location, it may be distributed at an overall uniform pressure within the first concave portion (313) while filling the first concave portion (313), which is a space wider than the injection port of the injection unit (723).

[0059] After filling the first concave portion (313) in a ring shape provided to surround the first through hole (311), the purge gas can spread outward in an omnidirectional 360° direction from the first concave portion (313) through the lower surface of the seal cap plate (320) and the upper surface of the seal cap flange (310). The first concave portion (313) can have a circular ring shape.

[0060] The seal cap flange (310) further includes an injection unit receiving groove (312) provided on the upper surface to receive one end of the injection unit (723), and the injection unit (723) can inject purge gas from the side of the first concave portion (313).

[0061] When the injection unit (723) supplies purge gas to the first concave portion (313) in a ring shape, the injection unit (723) can inject the purge gas laterally from the side of the first concave portion (313) so that the first concave portion (313) can be filled more smoothly. To this end, the injection unit (723) may have a plurality of circular injection holes arranged laterally parallel to the extension direction of the first concave portion (313), or may have rectangular or oval injection holes (723a) having a laterally wider width than a vertical height.

[0062] And, since it is effective for uniform distribution to inject the purge gas from the middle height of the first concave portion (313) of the injection portion (723), one end of the injection portion (723) can be inserted and received into the injection portion receiving groove (312) provided on the upper surface of the seal cap flange (310) so that the injection port of the injection portion (723) can be located at the middle height of the first concave portion (313).

[0063] The seal cap plate (320) is provided on the lower surface (324) and may further include a second concave portion (325) connected to the ring-shaped first concave portion (313) and extending outward toward the edge.

[0064] After the purge gas supplied through the injection unit (723) fills the first ring-shaped concave portion (313), it must flow along the lower surface of the seal cap plate (320) and continuously spread out to the edge of the seal cap plate (320). In order to provide a path through which the purge gas can quickly flow along the lower surface of the seal cap plate (320) to the edge, a second concave portion (325) may be formed on the lower surface (324) of the seal cap plate (320), with one end overlapping the first ring-shaped concave portion (313) and communicating with each other, and the other end extending outward toward the edge of the seal cap plate (320).

[0065] A plurality of second concave portions (325) that provide a path for the high-temperature purge gas supplied to the first concave portion (313) to move to the edge of the seal cap plate (320) may be provided spaced apart from each other.

[0066] If the second concave portion (325) is formed in too wide an area of ​​the lower surface (324) of the seal cap plate (320), the thickness of the portion where the second concave portion (325) is formed becomes thin, which may weaken the strength of the seal cap plate (320) made of brittle quartz. In the present invention, by forming a plurality of second concave portions (325) spaced apart from each other on the lower surface (324) of the seal cap plate (320) and leaving the space between the plurality of second concave portions (325) as the lower surface (324), not only can the purge gas flow quickly through the plurality of second concave portions (325), but also the strength of the seal cap plate (320) can be well secured through the lower surface (324) which maintains the thickness of the original plate of the seal cap plate (320). In addition, the lower surface (324) between the plurality of second concave portions (325) can be firmly supported by being in contact with the upper surface of the seal cap flange (310), thereby further stabilizing the structure.

[0067] The nozzle part (400) and nozzle part fixing part (420) provided in the hollow part of the manifold (110) on the seal cap part (300) have a complex structure in an exposed state, so gaseous byproducts may stay for a long time or be captured, making it easier to generate particles than in other locations. Once particles are generated, they may not be easily removed even through a cleaning process.

[0068] Therefore, it is necessary to supply more high-temperature purge gas to the exposed structures such as the nozzle unit (400) and the nozzle unit fixing unit (420) to remove the processing gas, etc. In particular, the nozzle unit (400) may be provided with a plurality of nozzle units (400a to 400f) so as to supply various processing gases and ensure uniformity of substrate processing. Since a plurality of nozzle units (400a to 400f) and the nozzle unit fixing unit (420) for fixing them are provided in a narrow area, a large amount of purge gas must be able to be quickly provided below where the nozzle unit (400) is provided. The second concave portion (325) may be provided so as to be directed toward the exposed structures such as the nozzle unit (400) so that more high-temperature purge gas can be supplied below where the exposed structures such as the nozzle unit (400) are located.

[0069] To this end, the second concave portion (325) may include a nozzle-facing concave portion (325a) extending toward the direction in which the nozzle portion (400) is provided. The nozzle-facing concave portion (325a) extends from the hollow portion of the manifold (110) toward the direction in which the nozzle portion (400) is provided to form a flow path through which purge gas can quickly flow, thereby continuously supplying a large amount of purge gas around the nozzle portion (400) and the nozzle portion fixing portion (420), thereby removing the incoming process gas and gaseous byproducts and suppressing the generation of particles.

[0070] The batch type substrate processing device may further include a temperature measuring unit (900) extending in the first direction to measure the temperature of the substrate processing space in addition to the nozzle unit (400) in the hollow portion of the manifold (110) on the seal cap unit (300); or a cleaning gas nozzle unit (800) connected to the manifold and providing a cleaning gas to the hollow portion of the manifold.

[0071] The temperature measuring unit (900), temperature measuring unit fixing unit (910), cleaning gas nozzle unit (800), etc., which are provided in the hollow portion of the manifold (110) on the seal cap unit (300), also have a complex structure that is exposed, similar to the nozzle unit (40) and nozzle unit fixing unit (420), so that the incoming processing gas may stay for a long time or be captured, and thus particles may be more easily generated than in other locations. Once particles are generated, they may not be easily removed even through a cleaning process.

[0072] Accordingly, the second concave portion (325) may include a temperature measurement portion-facing concave portion (325c) extending toward the direction in which the temperature measurement portion (900) is provided; or a cleaning gas nozzle portion-facing concave portion (325b) extending toward the direction in which the cleaning gas nozzle portion (800) is provided.

[0073] The temperature measuring unit-facing concave portion (325c); or the cleaning gas nozzle-facing concave portion (325b) extending toward the direction in which the cleaning gas nozzle portion (800) is provided, respectively, extends toward the direction in which the temperature measuring unit (900) or the cleaning gas nozzle portion (800) is provided to form a flow path through which the purge gas can quickly flow, thereby supplying a large amount of purge gas to the temperature measuring unit (900) and the temperature measuring unit fixing portion (910) or the surroundings of the cleaning gas nozzle portion (800). The temperature measuring unit-facing concave portion (325c) and the cleaning gas nozzle-facing concave portion (325b) may be provided simultaneously so as to be spaced apart from each other.

[0074] In order for the processing gas supplied from the nozzle unit (400) to flow uniformly over the substrate surface and for the purge effect of the first purge gas supply unit to be uniform, the temperature measurement unit-facing concave unit (325c) and the cleaning gas nozzle unit-facing concave unit (325b) may be provided to be symmetrical with respect to the center line of the seal cap plate (320) passing through the center of the nozzle unit-facing concave unit (325a). Correspondingly, the positions at which the temperature measurement unit (900) and the cleaning gas nozzle unit (800) are provided may also be determined.

[0075] In order to correspond to a plurality of nozzle sections (400a to 400f), the nozzle-facing concave section (325a) may have a relatively wider width than the temperature-measuring section-facing concave section (325c) or the cleaning gas nozzle section (800), so that the amount of purge gas flowing through the nozzle-facing concave section (325a) and the amount of purge gas flowing through the temperature-measuring section-facing concave section (325c) and the cleaning gas nozzle-facing concave section (325b) may not be balanced with each other. In order to solve this problem, the second concave section (325) may further include auxiliary concave sections (325d, 325e) that extend in a direction intersecting the extension direction of the nozzle-facing concave section (325a). By additionally flowing the purge gas through the plurality of auxiliary concave portions (325d, 325e), the flow amount of the purge gas through the nozzle-facing concave portion (325a) and the flow amount of the purge gas through the remaining second concave portions can be harmonized. The plurality of auxiliary concave portions (325d, 325e) are provided to be symmetrical with respect to the center line of the seal cap plate (320) passing through the center of the nozzle-facing concave portion (325a), so that the flow of the purge gas can be balanced overall, thereby enabling more effective purging (see FIG. 5). In addition, when only one of the temperature measurement portion-facing concave portion (325c) or the cleaning gas nozzle portion (800) is provided, one auxiliary concave portion may be provided to be symmetrical with respect to the center line of the seal cap plate (320) passing through the center of the temperature measurement portion-facing concave portion (325c) or the cleaning gas nozzle portion (800) and the nozzle-facing concave portion (325a).

[0076] In order for the purge gas to effectively purge the space around the edge of the seal cap plate (320) or the inner wall of the manifold (110), it must be ejected in all directions of 360°, not just in the direction in which the exposed structure such as the nozzle portion (400) is provided. To this end, the seal cap plate (320) may further include a third concave portion (326) provided on the lower surface, extending along the edge of the seal cap plate (320) to have a ring shape, and connected to a plurality of second concave portions (325a to 325e) spaced apart from each other.

[0077] One end of the second concave portion (325) may be connected to the first concave portion (313), and the other end of the second concave portion (325) may be connected to the third concave portion (326). The purge gas supplied to the first concave portion (313) may quickly flow to the edge of the seal cap plate (320) by the second concave portion (325) and then be stably ejected into the space between the seal cap plate (320) and the inner wall of the manifold (110) through the third concave portion (326) formed on the lower surface of the edge of the seal cap plate (320).

[0078] The seal cap flange (310) may further include an alignment pin (316) that determines the assembly position of the seal cap flange (310) and the seal cap plate (320).

[0079] The assembly positions of the plurality of second concave portions (325) discussed above and the plurality of bulkhead portions (322) described below must be determined based on the position of the nozzle portion (400), temperature measuring portion (900), or cleaning gas nozzle portion (800) connected to the manifold (110).

[0080] Since the seal cap flange (310) coupled to the moving shaft (610) and the linear moving member (620) provided within the loading chamber (600) is fixed in its relative position with respect to the manifold (110), when the seal cap plate (320) is assembled at the correct position of the seal cap flange (310), the relative positions of the plurality of partition walls (322) and the plurality of second concave portions (325) with respect to the nozzle portion (400), etc. can be determined. Accordingly, by aligning the alignment pin (316) provided on the upper surface of the seal cap flange (310) with the alignment groove (327) provided on the lower surface of the seal cap plate (320) and then assembling, the plurality of partition walls (322) and the plurality of second concave portions (325) can be arranged based on the provided positions of the nozzle portion (400), etc. Since the seal cap flange (310) and the seal cap plate (320) must be accurately aligned not only in position but also in direction, a plurality of alignment pins (316) and alignment grooves (327) may be provided to correspond to each other.

[0081] The first purge gas supply unit (720) of the present invention may further include a first flow rate control unit (721) that controls the flow rate of the purge gas; and a first heat exchanger (722) that supplies thermal energy to the purge gas to increase the temperature of the purge gas.

[0082] The first flow control unit (721) can control the flow rate of purge gas provided between the lower portion of the seal cap plate (320) and the upper portion of the seal cap flange (310). The first flow control unit (721) may be a mass flow controller (MFC), which is a flow control device.

[0083] The first heat exchanger (722) can exchange heat with the purge gas supplied at room temperature to increase the temperature of the purge gas to a temperature higher than room temperature. The first heat exchanger (722) may be a heater unit provided to surround a gas pipe through which the purge gas passes.

[0084] In order to suppress the deterioration of components or the generation of solid by-products in the form of particles, a purge gas is supplied to the space near the seal cap to prevent unreacted processed gas and gaseous processed by-products from approaching the space near the seal cap. However, there may be a problem in that the temperature near the seal cap is locally lowered by the supplied room temperature purge gas, causing a cold spot, thereby reducing the efficiency of suppressing particle generation. In order to solve this problem, the first purge gas supply unit (720) of the present invention can supply high-temperature purge gas by increasing the temperature of the purge gas using the first heat exchanger (722).

[0085] The first flow rate control unit (721) and the first heat exchanger (722) can control the temperature and flow rate of the purge gas according to the substrate processing process (supply amount of processing gas, pressure of the substrate processing space, etc.) and the amount of particles to be removed, etc., by means of a control unit (not shown) provided in the batch substrate processing device.

[0086] The purge gas supplied by the first purge gas supply unit (720) flows along the upper surface of the seal cap flange (310) and is ejected into the space between the edge of the seal cap plate (320) and the inner wall of the manifold (110), so that the purge gas may not reach the space near the rotating shaft (510). That is, the purge gas may not sufficiently reach the space near the rotating shaft (510), resulting in the generation of a dead zone, and thus byproducts of the process gas or gaseous phase may flow into the area near the rotating shaft (510), resulting in the generation of particles.

[0087] Accordingly, the batch-type substrate processing device of the present invention may further include a second purge gas supply unit (710) that supplies purge gas to a space between the first through hole (311) and the rotation shaft (510).

[0088] In the present invention, the purge gas supplied using the first purge gas supply unit (720) is ejected between the edge of the seal cap plate (320) and the inner wall of the manifold (110) (see the solid arrow in FIG. 5), and the purge gas supplied using the second purge gas supply unit (710) is ejected between the partition wall (322) of the first seal cap plate (320) and the pedestal (210) (see the dotted arrow in FIG. 5), thereby removing unreacted processing gas and gaseous processing byproducts from the entire hollow space of the manifold (110) on the seal cap unit (300), thereby effectively suppressing particle generation.

[0089] The rotary drive unit (500) may further include a housing (520) that provides a rotary shaft hollow portion (530) that accommodates a rotary shaft (510), and a rotary shaft sealing member (540) that seals the rotary shaft (510) and the housing (520) while rotatably supporting the rotary shaft (510).

[0090] When the second purge gas supply unit (710) supplies purge gas to the rotating shaft hollow portion (530), which is an internal space of the housing (520), the purge gas can be discharged into the space between the first through hole (311) and the rotating shaft (510). By the purge gas supplied to and discharged from the rotating shaft hollow portion (530), a substrate processing gas or the like can be prevented from entering the rotating shaft hollow portion (530) and corroding the rotating shaft (510) or generating particles within the rotating shaft hollow portion (530).

[0091] The seal cap portion (300) may further include a guide block (330) that is at least partially inserted into the second through hole (321) and coupled to the upper end of the rotation shaft (510); and a turntable (340) that is coupled to the upper end of the guide block (330) and rotates according to the rotation of the rotation shaft (510) to rotate the substrate boat (200).

[0092] The guide block (330) can be at least partially inserted into the second through hole (321) and coupled to the upper end of the rotation shaft (510). The guide block (330) is configured to connect the rotation shaft (510) and the turntable (340) so that they can rotate as one piece, and the guide block (330) and the rotation shaft (510), and the guide block (330) and the turntable (340) can be firmly fixed by bolting passing through holes (333 and 511, 334 and 341) formed therein, respectively.

[0093] The turntable (340) is coupled to the upper part of the guide block (330) and rotates according to the rotation of the rotation shaft (510), and rotates the substrate boat (200) supported on the upper side to ensure uniformity of the processing process. A pedestal (210) made of a heat-resistant material such as quartz or SiC is provided between the substrate boat (200) and the turntable (340). In order to prevent the turntable (340) made of metal from being corroded or deteriorated by processing gas, etc., the pedestal (210) covers at least the upper surface and side surfaces of the turntable (340) so that the processing gas, etc. do not come into direct contact with the turntable (340). A pedestal alignment pin (316) for aligning with the pedestal (210) may be provided on the upper surface of the turntable (340).

[0094] In order for the purge gas supplied by the second purge gas supply unit (710) to the space between the side of the first through hole (311) and the rotation shaft (510) to push out the processing gas and particles, etc., into the space above the seal cap unit (300) and be exhausted to the exhaust unit (120), the purge gas must be able to flow and spread out into the space above the seal cap unit (300). That is, since the rotational force of the rotation shaft (510) is transmitted to the turntable (340) via the guide block (330) that is at least partially inserted into the second through hole (321), the high-temperature purge gas supplied to the space between the side of the first through hole (311) and the rotation shaft (510) must be able to flow along the guide block (330) and the turntable (340).

[0095] To this end, in the present invention, a gap between the lower surface of the guide block (330) and the upper surface of the seal cap flange (210); a gap between the side surface of the second through hole (321) and the side surface of the guide block (330); and a gap between the upper surface of the seal cap plate (320) and the lower surface of the turntable (340) can be connected to each other to form a flow path through which the purge gas supplied by the second purge gas supply unit (710) flows. At this time, in order for the high-temperature purge gas to stably flow and be discharged through the gap between the respective components constituting the seal cap unit (300), the gap must be stably maintained at a constant interval.

[0096] In the present invention, by adjusting the structure or size of the guide block (330), not only can a separation space be effectively formed between each component constituting the seal cap portion (300), but the assembled state of the seal cap portion (300) can also be stably maintained.

[0097] The lower surface of the guide block (330) includes a concave portion into which the upper end of the rotation shaft (510) is inserted, and the depth of the concave portion is shallower than the height of the rotation shaft (510) protruding from the upper surface of the seal cap flange (310), so that a gap space can be formed between the lower surface of the guide block (330) and the upper surface of the seal cap flange (310).

[0098] The diameter of the lower guide block (330) inserted into the second through hole (321) can be made smaller than the diameter of the second through hole (321) to form a gap between the side of the second through hole (321) and the side of the guide block (330).

[0099] The upper portion (332) having a smaller diameter than the lower portion (331) of the guide block (330) is inserted into a concave portion formed on the lower surface of the turntable (340), and the lower portion (331) and the upper portion (332) of the guide block (330) form a step (or a step) due to different diameters so that the upper surface of the lower portion of the guide block (330) (or the upper surface of the step) can support the lower surface of the turntable (340). The height of the lower portion (331) of the guide block (330) can be made higher than the thickness of the seal cap plate (320) to form a gap between the upper surface of the seal cap plate (320) and the lower surface of the turntable (340). In addition, a concave portion into which a turntable (340) is inserted can be formed on the lower surface of the pedestal (210), and the depth of the concave portion of the pedestal (210) and the thickness of the turntable (340) can be made to match so that the flow of purge gas through the gap between the upper surface of the seal cap plate (320) and the lower surface of the turntable (340) is not obstructed.

[0100] The batch type substrate processing device may further include a pedestal (210) having an upper end connected to the substrate boat (200) and a lower end connected to cover at least a portion of the upper surface and side surfaces of the turntable (340). The seal cap plate (320) may further include a partition wall (322) provided to protrude from the upper surface (323) and extending along an edge of the lower end of the pedestal (210) to at least partially surround the edge of the lower end of the pedestal (210).

[0101] In order to suppress corrosion of parts and particle generation caused by processing gas flowing in toward the rotation axis (510), the baffle (322) is provided to at least partially surround the edge of the lower part of the pedestal (210) to block the entire space between the upper surface of the seal cap plate (320) and the lower surface of the turntable (340), thereby primarily preventing the processing gas from flowing in.

[0102] The nozzle part (400) extends in a first direction by penetrating the side surface of the manifold (110) to form an L shape, and may further include a nozzle part fixing part (420) that fixes and supports the vicinity of the bent part of the nozzle part (400) so that the nozzle part (400) that extends long does not vibrate or move. Since the nozzle part fixing part (420) and the extended portion of the nozzle part (400) are positioned above the seal cap plate (320), the partition part (322) may not be provided in the relevant section so that physical interference between the nozzle part fixing part (420) and the nozzle part (400) does not occur, and the upper surface (323a) of the empty space may be left as it is.

[0103] The batch type substrate processing device may further include a cleaning gas nozzle unit (800) connected to the manifold (110) and providing a cleaning gas to the hollow portion of the manifold (110).

[0104] When a cleaning gas is supplied through the nozzle unit (400) during a cleaning process of a batch substrate processing device, the cleaning gas is exhausted through the exhaust unit (120) after cleaning the processing space, so the hollow portion of the manifold (110) and the upper portion of the seal cap unit (300) may not be sufficiently cleaned. Therefore, the cleaning gas can be supplied to the hollow portion of the manifold (110) using the cleaning gas nozzle unit (800) penetrating the side wall of the manifold (110) to clean the hollow portion of the manifold (110) and the upper portion of the seal cap unit (300). Since the cleaning gas nozzle unit (800) supplies the cleaning gas to the hollow portion of the manifold (110), unlike the nozzle unit (400) extending along the first direction, it is sufficient to supply the cleaning gas by penetrating the side wall of the manifold (110) in a second direction (for example, a horizontal direction) intersecting the first direction without being bent.

[0105] Due to the complex structure of the nozzle unit (400) and the nozzle unit fixing unit (420), particles may be more easily generated at that location than at other locations, and once particles are generated, they may not be easily removed even through a cleaning process. To solve this problem, the end of the cleaning gas nozzle unit (800) provided with the injection port is provided so as to face the outer surface of the partition wall unit (322) from the outside, so that the supplied cleaning gas flows along the outer surface of the partition wall and a large amount of the cleaning gas reaches the nozzle unit (400) and the nozzle unit fixing unit (420), thereby enabling effective cleaning. The injection port at the end of the cleaning gas nozzle unit (800) can inject the cleaning gas in both directions so that the cleaning gas can flow along the outer surface of the partition wall.

[0106] The batch type substrate processing device may further include a temperature measuring unit (900) that extends in the first direction and measures the temperature of the substrate processing space. The temperature measuring unit (900) is also formed in an L shape like the nozzle unit (400), and the bent portion of the temperature measuring unit (900) may be fixedly supported by the temperature measuring unit fixing unit (910). Since the extended portions of the temperature measuring unit fixing unit (910) and the temperature measuring unit (900) are positioned above the seal cap plate (320), the partition wall (322) may not be provided in the relevant section so that physical interference between the temperature measuring unit fixing unit (910) and the temperature measuring unit (900) does not occur. Accordingly, the partition wall (322) may be formed of a plurality of partition walls spaced apart from each other by a spaced apart space, and the nozzle unit (400) and the temperature measuring unit (900), etc., may be provided in the spaced apart space without physical interference.

[0107] The second purge gas supply unit (710) may include a second flow rate control unit (711) that controls the flow rate of the purge gas; and a second heat exchanger (712) that supplies thermal energy to the purge gas to increase the temperature of the purge gas. The second purge gas supply unit (710) may further include a valve that opens and closes a path through which the purge gas flows.

[0108] The second flow control unit (711) can control the flow rate of the purge gas provided between the first through hole (311) and the rotation shaft (510). The second flow control unit (711) may be a mass flow controller (MFC), which is a flow control device.

[0109] When a room temperature purge gas is supplied to the space near the seal cap to suppress the generation of solid byproducts in the form of particles or deterioration of parts, there still exists a problem in which the temperature near the seal cap is locally lowered by the room temperature purge gas, resulting in the generation of a cold spot, thereby reducing the efficiency of suppressing particle generation.

[0110] To solve this problem, the second purge gas supply unit (710) of the present invention can supply purge gas at a temperature higher than room temperature to the space between the first through hole (311) and the rotation shaft (510).

[0111] The second heat exchanger (712) can exchange heat with the purge gas supplied at room temperature to increase the temperature of the purge gas to a temperature higher than room temperature. The second heat exchanger (712) may be a heater unit provided to surround a gas pipe through which the purge gas passes.

[0112] 2 When the purge gas supply unit (710) supplies purge gas having a temperature higher than room temperature to the space between the first through hole (311) and the rotation shaft (510), the purge gas pushes out unreacted process gas and gaseous process byproducts that flow in while being injected between the first through hole (311) and the rotation shaft (510) so that they can be exhausted through the exhaust unit (120), thereby effectively suppressing corrosion of the internal components of the rotation drive unit (500) or generation of particles. In particular, by heating the purge gas having a temperature higher than room temperature, which can be generally used, and using the purge gas having a temperature higher than room temperature, the generation of a cold spot, which is a local low-temperature area near the seal cap unit (300) that reduces the particle generation suppression effect, can be suppressed.

[0113] The temperature of the purge gas supplied to the rotary shaft hollow portion (530) may be higher than room temperature, and may be selected from a temperature higher than room temperature and lower than 200°C. The temperature of the purge gas may be selected within a range in which the sealing performance of the rotary shaft sealing member (540) is not deteriorated. If the temperature of the purge gas is too low, the formation of cold spots cannot be effectively suppressed, and if the temperature of the purge gas is too high, the sealing performance of the rotary shaft sealing member (540) is deteriorated, which may cause gas leakage.

[0114] As the rotary shaft sealing member (540), a magnetic sealing member such as a magnetic fluid M-Seal or PTFE mechanical M-Seal that enables sealing while allowing the rotary shaft (510) to rotate smoothly may be used. When a magnetic sealing member is used, the temperature of the purge gas may be 70°C to 180°C.

[0115] The second flow rate control unit (711) and the second heat exchanger (712) can control the temperature and flow rate of the purge gas according to the substrate processing process (supply amount of processing gas, pressure of the substrate processing space, etc.) and the amount of particles to be removed, etc., by means of a control unit (not shown) provided in the batch substrate processing device.

[0116] Meanwhile, the first purge gas supply unit (720) and the second purge gas supply unit (710) can be driven independently of each other.

[0117] Depending on the substrate processing process, the locations where particles are generated may also be different, and since the first purge gas supply unit (720) and the second purge gas supply unit (710) supply purge gas to different locations, the substrate processing process quality may be affected by the temperature and flow rate of the purge gas supplied to different locations. Accordingly, the first purge gas supply unit (720) and the second purge gas supply unit (710) may be independently controlled depending on the substrate processing process or the amount of particles generated at each location.

[0118] The first purge gas supply unit (720) and the second purge gas supply unit (710) can be mounted on the lower surface of the seal cap unit (300), and the purge gas distribution unit (700) that distributes purge gas to the first purge gas supply unit (720) and the second purge gas supply unit (710) is mounted on the linear moving member (620) and can move linearly along the first direction. The purge gas distribution unit (700) can receive purge gas from an external purge gas supply source by means of a flexible gas supply pipe.

[0119] As described above, according to the batch substrate processing device of the present invention, by stably supplying purge gas along the upper surface of the seal cap flange of the seal cap portion, a dead zone in which the supply of purge gas is insufficient is not generated in the space near the seal cap portion including the edge of the seal cap portion, and the inflow of unreacted processing gas or gaseous processing byproducts and the generation of particles can be effectively suppressed.

[0120] In addition, by supplying purge gas through the seal cap flange and seal cap plate constituting the seal cap part, a dead zone where the supply of purge gas is insufficient is not generated inside the seal cap part, and the inflow of unreacted processed gas or gaseous processed byproducts and the generation of particles can be effectively suppressed.

[0121] By directly supplying purge gas toward the mounting location of a structure such as a nozzle section that is mounted to be exposed to substrate processing gas flowing into the internal space of the manifold, the inflow of unreacted processing gas into the structure such as the nozzle section and the generation of particles can be more effectively suppressed.

[0122] By using a second purge gas supply unit that supplies purge gas between the seal cap flange and the seal cap plate and a second purge gas supply unit that supplies purge gas to the gap between the inner wall of the through hole of the seal cap flange and the rotating shaft, the inflow of unreacted processing gas and the generation of particles in the space near the seal cap can be more effectively suppressed.

[0123] In addition, by forming a path through which purge gas can flow using the structure of the seal cap flange, the seal cap plate, the guide block, and the turntable, purge gas can be supplied with a simple structure without using additional parts.

[0124] Furthermore, the first purge gas supply unit and the second purge gas supply unit can be independently controlled to finely control the local pressure or flow of the processing gas within the processing space.

[0125] The meaning of 'on' used in the above description includes cases where they are in direct contact and cases where they are not in direct contact but are positioned opposite the upper or lower surface, and it is possible to be positioned opposite the entire upper or lower surface as well as partially opposite, and it is used to mean that they are positionally opposite or directly in contact with the upper or lower surface. In addition, the terms 'above', 'below', 'leading end', 'rear end', 'upper part', 'lower part', 'top', 'bottom', etc. used in the above description are defined based on the drawings for convenience, and the shape and position of each component are not limited by these terms.

[0126] While preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the above-described embodiments, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible without departing from the spirit and scope of the present invention as claimed in the claims. Accordingly, the technical protection scope of the present invention should be defined by the following claims.

[0127]

Claims

1. A reaction tube providing a substrate processing space extending in the first direction; A hollow manifold supporting the above reaction tube; A substrate boat for loading a plurality of substrates in the first direction; A seal cap portion having a seal cap flange having a first through hole formed in the central portion, supporting the substrate boat and opening and closing the open lower portion of the manifold; A nozzle section extending along the first direction and providing a processing gas to the substrate processing space; A rotary drive unit having a rotary shaft inserted into the first through hole and transmitting rotary force to the substrate boat; and A batch type substrate processing device comprising a first purge gas supply unit for supplying purge gas so as to flow along the upper surface of the seal cap flange.

2. In claim 1, The above seal cap part, Further comprising a seal cap plate provided on the above seal cap flange and having a second through hole in the central portion, The above first purge gas supply unit is a batch-type substrate processing device that supplies purge gas between the seal cap flange and the seal cap plate.

3. In claim 2, The above seal cap flange further includes a first ring-shaped concave portion provided on the upper surface to surround the first through hole, A batch type substrate processing device, wherein the first purge gas supply unit includes an injection unit that injects purge gas into the first concave portion through the seal cap flange.

4. In claim 3, The above seal cap flange further includes an injection unit receiving groove provided on the upper surface to receive one end of the injection unit, A batch type substrate processing device in which the above injection unit injects purge gas from the side of the first concave portion.

5. In claim 3, A batch type substrate processing device wherein the seal cap plate is provided on a lower surface and further includes a second concave portion connected to the first concave portion in the ring shape and extending outward toward an edge.

6. In claim 5, A batch-type substrate processing device in which the second concave portions are provided in multiple numbers spaced apart from each other.

7. In claim 5, A batch type substrate processing device, wherein the second concave portion includes a nozzle-facing concave portion extending in the direction in which the nozzle portion is provided.

8. In claim 5, It further includes a temperature measuring unit that extends in the first direction and measures the temperature of the substrate processing space; or a cleaning gas nozzle unit that is connected to the manifold and provides cleaning gas to the hollow portion of the manifold; The above second concave portion is, A batch type substrate processing device comprising a temperature measuring unit-facing concave portion extending in the direction in which the temperature measuring unit is provided; or a cleaning gas nozzle-facing concave portion extending in the direction in which the cleaning gas nozzle portion is provided.

9. In claim 7, A batch type substrate processing device, wherein the second concave portion further includes an auxiliary concave portion extending in a direction intersecting with the extension direction of the nozzle-facing concave portion.

10. In claim 5, A batch type substrate processing device wherein the seal cap plate has a ring shape extending along an edge of the seal cap plate and further includes a third concave portion connected to the second concave portion.

11. In claim 2, A batch type substrate processing device wherein the seal cap flange further includes an alignment pin that determines the assembly position of the seal cap flange and the seal cap plate.

12. In claim 2, A batch type substrate processing device further comprising a second purge gas supply unit for supplying purge gas to a space between the first through hole and the rotational axis.

13. In claim 12, The above seal cap part, A guide block at least partially inserted into the second through hole and coupled to the upper end of the rotation shaft; and A batch type substrate processing device further comprising a turntable coupled to the upper end of the guide block and rotating according to the rotation of the rotation axis to rotate the substrate boat.

14. In claim 13, A gap between the lower surface of the guide block and the upper surface of the seal cap flange; A space between the side of the second through hole and the side of the guide block; and A batch type substrate processing device in which the space between the upper surface of the seal cap plate and the lower surface of the turntable is connected to each other to form a flow path through which the purge gas supplied by the second purge gas supply unit flows.

15. In claim 13, Further comprising a pedestal having an upper end connected to the substrate boat and a lower end connected to cover at least a portion of the upper surface and side of the turntable; The above seal cap plate, A batch type substrate processing device further comprising a partition wall portion provided to protrude from an upper surface and extending along an edge of the lower portion of the pedestal to at least partially surround the edge of the lower portion of the pedestal.

16. In claim 15, The above-mentioned bulkhead section is a batch-type substrate processing device comprising a plurality of bulkhead sections spaced apart from each other by a separation space.

17. In claim 12, A batch type substrate processing device in which the first purge gas supply unit and the second purge gas supply unit are driven independently of each other.

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