Apparatus for assembling camera modules using induction heating

Abstract

The present invention relates to an apparatus for assembling camera modules using induction heating, wherein the apparatus aligns the optical axes of an image sensor and a lens module and performs both the alignment and solder bonding within a single piece of equipment, thereby simplifying the workflow and improving the efficiency of camera module assembly.

Description

Camera module assembly device using induction heating

[0001] The present invention relates to a camera module assembly device using induction heating, and more particularly, to a camera module assembly device using induction heating capable of precisely aligning the optical axes of an image sensor and a lens module.

[0002] Recently, the number of cameras installed in vehicles for purposes such as parking guidance and surrounding surveillance is increasing. There is also a growing demand for cameras to monitor autonomous driving functions, such as lane keeping and sign recognition.

[0003] Typically, cameras mounted on vehicles are constructed in the form of modules assembled with an image sensor PCB containing an image sensor and a lens holder containing a lens.

[0004] However, if the optical axis between the lens and the image sensor is not precisely aligned when assembling the camera module, it is difficult to implement a camera module with the desired high-performance functions.

[0005] In other words, when taking a picture of a subject with a camera module, the light coming from the subject through the lens must be focused at the exact location on the image sensor to obtain a clear image. However, if the camera module is assembled without the optical axis being properly aligned, the image information received from the image sensor will be inaccurate, significantly reducing the reliability of the camera module. Therefore, in order to implement a highly reliable, high-performance camera module, the optical axis between the lens and the image sensor must be precisely aligned when assembling the camera module.

[0006] To achieve this, the image sensor PCB and lens are currently precisely aligned, epoxy is sprayed between the image sensor and the lens, the epoxy is irradiated with UV light to harden the outer surface, and then the camera module is placed in a high-temperature oven to be completely hardened, even on the inside.

[0007] However, epoxy takes a long time to cure, taking several days to cure, so the time invested in the pre-curing and main curing processes is too much, and the equipment for the process is large and cumbersome, which is inconvenient.

[0008] The present invention has been devised to solve the problems of the above-mentioned prior art, and its purpose is to provide a camera module assembly device using induction heating that can precisely align the optical axes of an image sensor and a lens module, increase the assembly efficiency of a camera module, and implement a high-performance camera with high reliability.

[0009] In order to solve the above-described problem, a camera module assembly device using induction heating according to the present invention comprises: a lens alignment unit having a lens gripper for holding a lens module mounted on a support; a sensor alignment unit having a sensor gripper for holding an image sensor inserted on an upper side of the lens module mounted on the support; a soldering bonding head for soldering the lens module and the image sensor, which are each held by the lens gripper and the sensor gripper while mounted on the support, by induction heating; and a bonding head transfer for transferring the soldering bonding head to a soldering position.

[0010] In addition, the present invention further comprises a chart unit that determines whether the shooting area of ​​the image sensor mounted on the support matches the setting area set in the image sensor.

[0011] Meanwhile, the soldering joint head comprises an induction heating coil that inductively heats and solders the lens module and the image sensor; a coil fixing body on which the induction heating coil is wound; and an upper cover and a side cover that are respectively coupled to the upper surface and the side surface of the coil fixing body.

[0012] Here, the induction heating coil is formed in a tube shape and has a cooling water supply pipe connected to the top, so that it is cooled by cooling water supplied to the inside through the cooling water supply pipe.

[0013] And, a solder pin made of steel is provided on the upper surface of the lens module, a pinhole through which the solder pin passes is formed in the image sensor, and a solder ring made of solder paste is installed through the solder pin, and the lens module and the image sensor are assembled by welding the solder ring by the induction heating coil.

[0014] Additionally, a magnetic core is installed on the upper cover, the lower side of which is adjacent to the upper surface of the solder pin.

[0015] Here, the magnetic core is configured with a vertical adjustment jig that is spirally connected to the upper cover and whose position is adjusted vertically; and a magnetic flux-concentrating core that is inserted and fixed into the vertical adjustment jig and whose lower end is adjacent to the upper surface of the solder pin.

[0016] The camera module assembly device using induction heating of the present invention configured as described above has the advantage of being able to automate a series of processes for assembling a camera module by aligning the lens module and the image sensor along their optical axes.

[0017] In addition, the assembly efficiency of the camera module can be improved by simplifying the process, and since the UV curing process of the epoxy and the main curing process in the oven are omitted, there is an advantage in that facility costs, operating costs, and power consumption are reduced.

[0018] Additionally, since the alignment and soldering processes are performed within a single piece of equipment, the equipment becomes smaller and the process becomes simpler, which has the advantage of reducing costs and manpower.

[0019] Additionally, there is an advantage of being able to realize a fast process yield through induction heating solder joints.

[0020] Fig. 1 is a drawing showing the external appearance of a camera module assembly device using induction heating according to the present invention.

[0021] Figures 2 and 3 are drawings showing the inside of a camera module assembly device using induction heating according to the present invention.

[0022] Fig. 4 is a diagram showing a lens alignment unit according to the present invention.

[0023] Fig. 5 is a diagram showing a sensor alignment unit according to the present invention.

[0024] Figures 6 to 8 are drawings showing a soldering joint head according to the present invention.

[0025] Figure 9 is a diagram briefly showing the process of assembling a lens module and an image sensor according to the present invention.

[0026] Hereinafter, an embodiment of a camera module assembly device using induction heating according to the present invention will be described in detail with reference to the attached drawings.

[0027] Fig. 1 is a drawing showing the external appearance of a camera module assembly device using induction heating according to the present invention, and Figs. 2 and 3 are drawings showing the internal appearance of a camera module assembly device using induction heating according to the present invention.

[0028] And, FIG. 4 is a drawing showing a lens alignment unit according to the present invention, FIG. 5 is a drawing showing a sensor alignment unit according to the present invention, and FIGS. 6 to 8 are drawings showing a soldering bonding head according to the present invention.

[0029] In addition, FIG. 9 is a diagram simply showing a process of assembling a lens module and an image sensor according to the present invention.

[0030] The camera module assembly device using induction heating according to the present invention comprises a lens alignment unit (20) for positioning a lens module (L), a sensor alignment unit (30) for positioning an image sensor (S), a soldering bonding head (40) for soldering the lens module (L) and the image sensor (S), a bonding head transfer (50) for transferring the soldering bonding head (40) to a soldering position, and a chart unit (60) for setting a reference when capturing an image of the image sensor (S).

[0031] The above lens alignment unit (20) is configured to include a frame (21), a support (22) installed on the upper surface of the frame (21), an actuator (23) installed on the lower surface of the support (22), and a lens gripper (24) that operates by receiving power from the actuator (23) to hold a lens module (L) mounted on the support (22).

[0032] The above support (22) is composed of a table (22a) and a mounting plate (22b) installed on the table (22a).

[0033] The above table (22a) has one end bolted to the upper surface of the frame (21) and the other end protrudingly extending toward the sensor alignment unit (30). A mounting hole (22c) in which a mounting plate (22b) and a lens gripper (24) are installed is formed in the table (22a).

[0034] The above mounting base (22b) is installed at the end of the mounting hole (22c) of the table (22a), and the lens module (L) and image sensor (S) are mounted thereon.

[0035] The above actuator (23) is a pneumatic cylinder that is dynamically connected to the lens gripper (24) to operate the lens gripper (24).

[0036] The above lens gripper (24) grips or releases the lens module (L) by having two horizontally arranged pressure plates move closer or further apart within the mounting hole (22c). Here, since the end of the lens gripper (24) enters the lower part of the mounting plate (22b), the lens gripper (24) grips the lower part of the lens module (L) that protrudes downward from the mounting plate (22b).

[0037] The above sensor alignment unit (30) is configured to include a 6-axis movement unit (31), an actuator (32) connected to the 6-axis movement unit (31), and a sensor gripper (33) that operates by receiving power from the actuator (32) to hold an image sensor (S) inserted into the upper side of a lens module (L) mounted on a support (22).

[0038] The above 6-axis movement unit (31) performs 6-axis movement in the directions of X / Y / Z / Tx / R / Ty, and by this 6-axis movement, the position of the image sensor (S) can be accurately determined when it is placed on the upper side of the lens module (L).

[0039] The above actuator (32) is a pneumatic cylinder that is dynamically connected to the sensor gripper (33) to operate the sensor gripper (33).

[0040] The above sensor gripper (33) grips or releases the image sensor (S) by moving two horizontally arranged pressure plates closer or further apart from each other. Here, since the sensor gripper (33) operates above the mounting plate (22b), it grips the image sensor (S) assembled on the upper part of the lens module (L) protruding above the mounting plate (22b).

[0041] The above soldering joint head (40) is mounted on the mounting base (22b) of the support base (22) and solders the lens module (L) and the image sensor (S), which are respectively held by the lens gripper (24) and the sensor gripper (33), by fluid heating.

[0042] This soldering joint head (40) is configured to include an induction heating coil (41) that inductively heats and solders a lens module (L) and an image sensor (S), a coil fixing body (42) on which the induction heating coil (41) is wound, an upper cover (43) and a side cover (44) that are respectively coupled to the upper surface and the side surface of the coil fixing body (42), and a magnetic core (45) installed on the upper cover (43).

[0043] The above induction heating coil (41) solders the lens module (L) and the image sensor (S). The soldering of the lens module (L) and the image sensor (S) will be described in more detail as follows.

[0044] A plurality of solder pins (L1) are provided on the upper surface of the lens module (L), and a plurality of pinholes (S1) through which the solder pins (L1) pass are formed in the image sensor (S), and a solder ring (L2) in the shape of a circular ring made of solder paste is installed through the solder pins (L1). At this time, the solder pins (L1) and the pinholes (S1) are formed at points where the optical axes exactly align when the lens module (L) and the image sensor (S) are assembled.

[0045] In this state, when power is supplied, the solder pin (L1) and solder ring (L2) are heated and fused by the induction heating coil (41), thereby completing the assembly of the lens module (L) and the image sensor (S). Here, the solder pin (L1) is made of a steel material with good heat conductivity, for example, a stainless steel series or a metal plated with tin or nickel on stainless steel, so that when the solder pin (L1) is heated, heat is quickly transferred, which can help the solder ring (L2) to be fused more quickly.

[0046] Meanwhile, it is also possible to preheat the solder pin (L1) by irradiating the solder pin (L1) with a laser generator (not shown) before heating the solder pin (L1) and solder ring (L2) with the induction heating coil (41), thereby quickly completing the subsequent induction heating of the solder pin (L1) by the induction heating coil (41).

[0047] Such an induction heating coil (41) can be configured in a tube shape to adopt water-cooling. Accordingly, a cooling water supply pipe (46) is connected to the upper end of the induction heating coil (41), and cooling water is supplied to the interior of the induction heating coil (41) through the cooling water supply pipe (46) so that the induction heating coil (41) can be quickly cooled by the cooling water.

[0048] The above magnetic core (45) is installed so as to penetrate the upper cover (43) so that the lower part is adjacent to the upper surface of the solder pin (L1).

[0049] This magnetic core (45) is composed of a top-bottom adjustment jig (45a) and a core (45b) for magnetic flux concentration that is inserted and fixed into the top-bottom adjustment jig (45a).

[0050] The above upper and lower adjustment jig (45a) is spirally connected to the upper cover (43) and can adjust the position in the upper and lower direction.

[0051] The above flux-focusing core (45b) is made of a ferrite material in the shape of a small cylinder and is inserted and fixed into the up-and-down adjustment jig (45a) so that it moves together when the up-and-down adjustment jig (45a) rises or falls. Accordingly, the distance between the flux-focusing core (45b) and the solder pin (L1) can be adjusted.

[0052] Accordingly, when the induction heating reaction is very slow, the distance between the flux-focusing core (45b) and the solder pin (L1) is shortened, and conversely, when the induction heating reaction is excessively fast, the distance between the flux-focusing core (45b) and the solder pin (L1) is increased. In this way, the induction heating reaction can be controlled by adjusting the distance between the flux-focusing core (45b) and the solder pin (L1).

[0053] The above bonding head transfer (50) is configured to include a frame (51), a rail (52) installed on the frame (51), and a driving motor (53) installed at one end of the rail (52).

[0054] The above rail (52) is installed and fixed at the upper end of the frame (51).

[0055] The above driving motor (53) is dynamically connected to the soldering joint head (40), and when the driving motor (53) operates and the motor shaft rotates, this rotational force is transmitted to the soldering joint head (40), causing it to move linearly along the rail (52).

[0056] The above chart unit (60) is used to set a standard when capturing an image of an image sensor (S), and is provided on the lower side of a support (22) to determine whether the capturing area of ​​the image sensor (S) mounted on the support (22) matches the setting area set in the image sensor (S). At this time, the image values ​​captured by the image sensor (S) are displayed through a monitor (11) provided on the outside of the housing (10) corresponding to the exterior of the present invention.

[0057] The operation of the camera module assembly device according to the present invention configured as described above is briefly described as follows.

[0058] The lens module (L) is inserted into the mounting base (22b) to be mounted, and the lower part of the lens module (L) protruding from the lower side of the mounting base (22b) is gripped and fixed using the lens gripper (24).

[0059] Afterwards, the image sensor (S) is inserted into the upper surface of the lens module (L) to assemble the lens module (L) and the image sensor (S). At this time, the solder pin (L1) of the lens module (L) is made to penetrate the pinhole (S1) of the image sensor (S).

[0060] When the image sensor (S) is mounted on the upper surface of the lens module (L), the image sensor (S) is gripped and fixed using the sensor gripper (33).

[0061] After the lens module (L) and image sensor (S) are firmly gripped by the lens gripper (24) and sensor gripper (33) respectively through the above process, an alignment process is performed to accurately align the optical axis.

[0062] That is, an alignment step using an image is performed through a chart unit (60), and then the lens gripper (24) of the lens alignment unit (20) and the sensor gripper (33) of the sensor alignment unit (30) are finely adjusted to align the optical axes of the lens module (L) and the image sensor (S).

[0063] When the optical axes of the lens module (L) and the image sensor (S) are aligned, the solder pin (L1) and solder ring (L2) are fused through the induction heating coil (41) of the soldering joint head (40) to complete the assembly.

[0064] The embodiments of the present invention described above do not limit the present invention, and may be modified and embodied in various forms within the scope described in the claims of the present invention and equivalent scopes.

Claims

1. A lens alignment unit (20) equipped with a lens gripper (24) that holds a lens module (L) mounted on a support (22); A sensor alignment unit (30) equipped with a sensor gripper (33) that grips an image sensor (S) inserted into the upper side of a lens module (L) mounted on the above support (22); A soldering head (40) that inductively heats and solders a lens module (L) and an image sensor (S), which are each gripped by a lens gripper (24) and a sensor gripper (33) while being secured to the above support (22); A camera module assembly device using induction heating, characterized in that it comprises a soldering head transfer (50) that moves the soldering bonding head (40) to a soldering position.

2. In claim 1, A camera module assembly device using induction heating, characterized in that it further comprises a chart unit (60) that determines whether the shooting area of ​​the image sensor (S) mounted on the above support (22) matches the setting area set in the image sensor (S).

3. In claim 1, The above soldering joint head (40) includes an induction heating coil (41) that inductively heats and solders the lens module (L) and the image sensor (S); A coil fixing body (42) on which the above induction heating coil (41) is wound; A camera module assembly device using induction heating, characterized in that it comprises an upper cover (43) and a side cover (44) which are respectively coupled to the upper surface and the side surface of the coil fixing body (42).

4. In claim 3, A camera module assembly device using induction heating, characterized in that the above induction heating coil (41) is formed in a tube shape and has a cooling water supply pipe connected to the upper end, and is cooled by cooling water supplied to the inside through the cooling water supply pipe (46).

5. In claim 3, A steel solder pin (L1) is provided on the upper surface of the lens module (L), a pinhole (S1) through which the solder pin (L1) passes is formed in the image sensor (S), and a solder ring (L2) made of solder paste is installed through the solder pin (L1). A camera module assembly device using induction heating, characterized in that the lens module (L) and the image sensor (S) are assembled by welding the solder ring (L2) by the induction heating coil (41).

6. In claim 5, A camera module assembly device using induction heating, characterized in that a magnetic core (45) is installed on the upper cover (43) so that the lower end thereof is adjacent to the upper surface of the solder pin (L1).

7. In claim 6, The magnetic core (45) is connected to the upper cover (43) in a spiral manner and has an upper and lower adjustment jig (45a) whose position is adjusted up and down; A camera module assembly device using induction heating, characterized in that it comprises a core (45b) for magnetic flux concentration, which is inserted and fixed into the upper and lower adjustment jig (45a) and has a lower end adjacent to the upper surface of the solder pin (L1).

8. In claim 5, The above solder pin (L1) is a camera module assembly device using induction heating characterized by being made of stainless steel metal with tin or nickel.

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