Electronic device comprising heat dissipation structure, and method for forming heat dissipation structure

Abstract

An electronic device according to an embodiment of the present invention comprises: a PCB; an electromagnetic shielding member coupled to the PCB; a flexible member disposed on the electromagnetic shielding member; and a heat transfer material filled between the PCB and the electromagnetic shielding member, wherein a solder paste is applied over a plurality of conductive pads of the PCB and a plurality of non-conductive areas between the plurality of conductive pads such that, during soldering, the solder paste forms a first bonding portion with the conductive pads, and a flux of the solder paste can form a second bonding portion that seals a gap with the electromagnetic shielding member in the non-conductive areas.

Description

Electronic device including a heat dissipation structure, and method for forming the heat dissipation structure

[0001] The present disclosure relates to an electronic device including a heat dissipation structure, and a method for forming the heat dissipation structure.

[0002] An electronic device may include a heat dissipation structure to reduce heat dissipation from one or more electronic components included in a printed circuit board (PCB). For example, the electronic device may include a heat sink disposed on the PCB to cover one or more electronic components, and a thermal interface material filled between the PCB and the heat sink to thermally connect the one or more electronic components and the heat sink.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] When filling the space between the PCB and the heat sink with thermal transfer material, problems such as leakage or backflow of the thermal transfer material may occur.

[0005] Various embodiments of the present disclosure provide an electronic device including a heat dissipation structure for stably filling a heat transfer material between a PCB and a heat sink.

[0006] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

[0007] According to various embodiments of the present disclosure, an electronic device is provided, which may include a printed circuit board (PCB), an electromagnetic shielding member, and a thermally conductive material. The PCB may include a plurality of conductive pads spaced apart from each other. The electromagnetic shielding member may be coupled to the plurality of conductive pads of the PCB by soldering a solder paste through a soldering process to cover one or more electronic components disposed on the PCB. The electromagnetic shielding member may include a first hole. A flexible member may be disposed in the electromagnetic shielding member. The flexible member may include a cut line aligned with the first hole of the electromagnetic shielding member. A thermally conductive material may be filled between the PCB and the electromagnetic shielding member to thermally connect one or more electronic components and the electromagnetic shielding member. The first hole of the electromagnetic shielding member and the cut line of the flexible member may allow the thermally conductive material to be injected between the PCB and the electromagnetic shielding member. To seal the electromagnetic shielding member to first regions of the PCB corresponding to the plurality of conductive pads, solder of the solder paste can form a plurality of spaced-apart first joints disposed between the electromagnetic shielding member and the plurality of conductive pads of the PCB. To at least partially seal the electromagnetic shielding member to second regions of the PCB between the plurality of conductive pads, flux of the solder paste can form a plurality of second joints disposed between the electromagnetic shielding member and the second regions of the PCB. The PCB can include a first conductive pad of the plurality of conductive pads, a second conductive pad adjacent to the first conductive pad of the plurality of conductive pads, and a first non-conductive region between the first conductive pad and the second conductive pad of the plurality of second regions.Prior to applying heat to the solder paste in a soldering process, a first portion of the solder paste may be disposed on at least a portion of a first conductive pad of the PCB, at least a portion of a second conductive pad of the PCB, and at least a portion of a first non-conductive region of the PCB between the first conductive pad and the second conductive pad.

[0008] According to various embodiments of the present disclosure, a method of forming a heat dissipation structure is provided, the method comprising forming a solder paste to be disposed on at least a portion of a first conductive pad of a PCB, at least a portion of a second conductive pad of the PCB adjacent to the first conductive pad, and at least a portion of a non-conductive region of the PCB between the first conductive pad and the second conductive pad. The method may comprise disposing an electromagnetic shielding member over the PCB such that the electromagnetic shielding member is disposed over the solder paste. The method may comprise providing heat to the solder paste. After providing the heat, solder in the solder paste may form a first joint disposed between the electromagnetic shielding member and the first conductive pad, and another first joint disposed between the electromagnetic shielding member and the second conductive pad. After providing the heat, a flux in the solder paste may form a second joint disposed between the electromagnetic shielding member and the non-conductive region to seal between a sidewall of the electromagnetic shielding member and the PCB.

[0009] An electronic device including a heat dissipation structure according to various embodiments of the present disclosure, and a method of forming a heat dissipation structure, can provide a heat dissipation structure for stably filling a heat transfer material between a PCB and an electromagnetic shielding member (e.g., a heat sink), thereby improving heat dissipation performance.

[0010] In addition, the effects that can be obtained or expected from various embodiments of the present disclosure are disclosed directly or implicitly in the detailed description of the embodiments of the present disclosure.

[0011] The above and other aspects, features, and advantages of the embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0012] FIG. 1 is a drawing showing appearances of a foldable electronic device in an unfolded state according to various embodiments of the present disclosure.

[0013] FIG. 2 is a drawing showing appearances of a foldable electronic device in a folded state according to various embodiments of the present disclosure.

[0014] FIG. 3 is a cross-sectional view of a foldable electronic device in an unfolded state taken along line D-D' of FIG. 1 according to various embodiments of the present disclosure.

[0015] FIG. 4 is a diagram illustrating a portion of a foldable electronic device in an unfolded state according to various embodiments of the present disclosure.

[0016] FIG. 5 is a diagram illustrating a portion of a foldable electronic device according to various embodiments of the present disclosure.

[0017] FIG. 6 is a diagram illustrating a portion of a foldable electronic device according to various embodiments of the present disclosure.

[0018] FIG. 7 is a cross-sectional view of a portion of a foldable electronic device taken along line E-E' of FIG. 6 according to various embodiments of the present disclosure.

[0019] FIG. 8 is a cross-sectional view of a portion of a foldable electronic device taken along line F-F' of FIG. 6 according to various embodiments of the present disclosure.

[0020] FIG. 9 is a cross-sectional view of a portion of a foldable electronic device taken along line G-G' of FIG. 6, according to various embodiments of the present disclosure.

[0021] FIG. 10 is a cross-sectional view showing a metal cover, a first PCB, and solder paste during reflow soldering, in relation to FIG. 8, according to various embodiments of the present disclosure.

[0022] FIG. 11 is a cross-sectional view showing a metal cover, a first PCB, and solder paste during reflow soldering, in relation to FIG. 8, according to various embodiments of the present disclosure.

[0023] FIG. 12 is a cross-sectional view of a portion of a foldable electronic device taken along line E-E' of FIG. 6 according to various embodiments of the present disclosure.

[0024] FIG. 13 is a cross-sectional view of a portion of a foldable electronic device taken along line E-E' of FIG. 6, according to various embodiments of the present disclosure.

[0025] FIG. 14 is a cross-sectional view of a portion of a foldable electronic device taken along line E-E' of FIG. 6, according to various embodiments of the present disclosure.

[0026] FIG. 15 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0027] Hereinafter, various embodiments of the present disclosure will be described in more detail. The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. While numerous specific details are included herein to aid understanding, they are to be considered merely exemplary. Accordingly, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0028] The terms and words used in the following description and claims are not limited to their bibliographic meanings, but are merely used to ensure a clear and consistent understanding of the present disclosure by the inventors. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0029] The various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In the present disclosure, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When one element (e.g., a first component) is referred to as being “coupled” or “connected” to another element (e.g., a second component), with or without the terms “functionally” or “communicatively,” the element may be connected to the other element, either directly or indirectly (e.g., through a third component).

[0030] Each component (e.g., a module or a program) of the above-described components may comprise a single or multiple entities. One or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each component of the multiple components in a manner identical to or similar to that performed by the corresponding component of the multiple components prior to integration.

[0031] In the present disclosure, when the term "substantially" is used to limit or define a structural member, the expression including the term "substantially" is understood or interpreted as a technical feature produced within the technical tolerances of the method used to manufacture it.

[0032] In this disclosure, the expression "comprising" means that a particular effect or result can be achieved within a certain tolerance, and that a person skilled in the art knows how to achieve the tolerance. It should be understood that terms such as "comprising" or "having" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in this disclosure, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0033] In the present disclosure, “disposed on XX” may be understood as disposed adjacent to or substantially in contact with XX, coupled to XX, or included in XX.

[0034] In the present disclosure, “located on XX” may be understood as being located adjacent to or substantially in contact with XX, located on XX, or included in XX.

[0035] When a heat transfer material (e.g., a heat transfer material (6) of FIG. 7) is filled between a PCB (e.g., a first PCB (31) of FIG. 5) and a heat sink (e.g., a metal cover (5) of FIG. 6), a problem of leakage or reverse flow of the heat transfer material may occur. Therefore, embodiments of the present disclosure provide an electronic device including a heat dissipation structure for stably filling the heat transfer material between the PCB and the heat sink. Various embodiments of the present disclosure are provided to solve or at least alleviate the above-mentioned problem. The technical problem to be achieved in the present disclosure is not limited to the technical problem mentioned above, and other technical problems that are not mentioned can be understood by a person having ordinary skill in the art pertaining to the present disclosure from the description below.

[0036] FIG. 1 is a drawing showing the appearance of a foldable electronic device (1) in an unfolded state (also referred to as an unfolding state or a flat state) according to various embodiments of the present disclosure.

[0037] FIG. 2 is a drawing showing the appearance of a foldable electronic device (1) in a folded state (also referred to as a folding state) according to various embodiments of the present disclosure.

[0038] FIG. 3 is a cross-sectional view of a foldable electronic device (1) in an unfolded state taken along line D-D' of FIG. 1 according to various embodiments of the present disclosure.

[0039] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed with respect to FIGS. 1, 2, and 3. All combinations of the features described below with respect to FIGS. 1, 2, and 3 may be considered to be encompassed by the present disclosure as specific examples.

[0040] Referring to FIGS. 1, 2, and 3, a foldable electronic device (1) may include a foldable housing (10) and a first display module (15).

[0041] According to various embodiments, the unfolded state and the folded state of the foldable electronic device (1) may be provided (or formed) by the foldable housing (20). The "unfolded state of the foldable electronic device (1)" and the "unfolded state of the foldable housing (10)" may be understood as the same. The "folded state of the foldable electronic device (1)" and the "folded state of the foldable housing (10)" may be understood as the same.

[0042] According to various embodiments, the foldable housing (10) may include a first housing (also referred to as a first housing portion or a first housing structure) (11), a second housing (also referred to as a second housing portion or a second housing structure) (12), a hinge cover (13), and / or a hinge portion (14). The first housing (11) and the second housing (12) may be rotatably connected via the hinge portion (14). The first housing (11) and the second housing (12) may be rotatable relative to each other with respect to the hinge portion (14). The hinge portion (also referred to as a hinge structure, a hinge module, or a hinge assembly) (14) may include, for example, one or more hinges (e.g., a first hinge (141), a second hinge (142), and / or a third hinge (143)).

[0043] According to various embodiments, a first display module (also referred to as a first display) (15) may be disposed in a foldable housing (10). The first display module (15) may include, for example, a flexible display module (also referred to as a flexible display) or a foldable display module (also referred to as a foldable display) that can be deformed in response to a transition between an unfolded state and a folded state of the foldable electronic device (1).

[0044] According to various embodiments, the first display module (15) may include a display area (150). The display area (150) may include an active area or a screen area capable of displaying an image based on an electrical signal. The display area (150) may include a first display area (151) disposed in the first housing (11), a second display area (152) disposed in the second housing (12), and a third display area (153) disposed in the hinge portion (14). The third display area (153) may extend the first display area (151) and the second display area (152). The shape of the first display area (151) may be maintained by the support of the first housing (11). The first display area (151) may be provided (or formed) substantially flat by being supported by, for example, the first housing (11). The shape of the second display area (152) may be maintained by being supported by the second housing (12). The second display area (152) may be provided (or formed) substantially flat by being supported by, for example, the second housing (12). The third display area (153) may be positioned corresponding to the hinge portion (14). When the foldable electronic device (1) is switched between an unfolded state and a folded state, the third display area (153) may be deformed corresponding to the relative position between the first display area (151) and the second display area (152). In the unfolded state of the foldable electronic device (1), the third display area (153) may be arranged substantially flat. In the folded state of the foldable electronic device (1), the third display area (153) may be arranged in a bent form. The unfolded state of the foldable electronic device (1) may be understood as a state in which the third display area (153) is arranged flat.The folded state of the foldable electronic device (1) can be understood as a state in which the third display area (153) is arranged in a bent form.

[0045] According to various embodiments, in the unfolded state of the foldable electronic device (1), the first display area (151) and the second display area (152) may form an angle of about 180 degrees, and the display area (150) of the first display module (15) may be provided (or arranged) in a substantially flat form. Due to the relative positions between the first display area (151) arranged in the first housing (11) and the second display area (152) arranged in the second housing (12) in the unfolded state of the foldable electronic device (1), the third display area (153) may be arranged in a substantially flat form. In the unfolded state of the foldable electronic device (1), the third display area (153) can be pulled from both sides by the first display area (151) and the second display area (152), and the pulling force can be provided so as to reduce damage to the third display area (153) while placing the third display area (153) flat. The third display area (153) can be provided (or formed) with an extended width so as to be placed flat while reducing stress due to being pulled by the first display area (151) and the second display area (152) in the unfolded state of the foldable electronic device (1).

[0046] According to various embodiments, in the unfolded state of the foldable electronic device (1), the hinge portion (14) can support the third display area (153) of the first display module (15) substantially flat. The hinge portion (14) can, for example, support the third display area (153) so that the third display area (153) can be placed flat without sagging or with reduced sagging in the unfolded state of the foldable electronic device (1), thereby reducing a crease phenomenon.

[0047] According to various embodiments, the display area (150) of the first display module (15) may substantially provide (or form) the front surface of the exterior of the foldable electronic device (1). The front surface of the foldable electronic device (1) may include a first front surface area provided (or formed) by the first display area (151), a second front surface area provided (or formed) by the second display area (152), and a third front surface area provided (or formed) by the third display area (153). The illustrated coordinate axis of the foldable electronic device (1) is illustrated, for example, with reference to the first housing (11), and a direction parallel to the positive direction of the z-coordinate axis may be defined or interpreted as a direction in which the substantially flat first front surface area faces. For example, the first front surface area provided (or formed) by the first display area (151) may be substantially parallel to the xy plane. In the unfolded state of the foldable electronic device (1), the front surface of the foldable electronic device (1) can be provided (or formed) as a substantially flat surface.

[0048] According to various embodiments, the foldable electronic device (1) may be implemented in an infolding manner in which the display area (150) of the first display module (15) (or the front surface of the foldable electronic device (1) where the display area (150) is visually visible) can be folded inward. FIG. 2 illustrates a fully folded state of the foldable electronic device (1) in which the first housing (11) and the second housing (12) are positioned so that they no longer come close to each other. In the fully folded state of the foldable electronic device (1), the first display area (151) and the second display area (152) (or the first front surface area and the second front surface area) may face each other. For example, in a fully folded state of the foldable electronic device (1), the angle between the first housing (11) and the second housing (12) (or, the angle between the first display area (151) and the second display area (152), or the angle between the first front area and the second front area) may be from about 0 degrees to about 10 degrees. In a fully folded state of the foldable electronic device (1), the display area (150) of the first display module (15) may be substantially invisible. Although not illustrated separately, the foldable electronic device (1) may be arranged in an intermediate state between the unfolded state and the fully folded state. For example, in an intermediate state of the foldable electronic device (1) in which the angle between the first housing (11) and the second housing (12) is greater than a certain angle, the foldable electronic device (1) may be configured to provide a user environment in which a user can utilize the display area (150). The “folded state of the foldable electronic device (1)” of the present disclosure can be understood as a completely folded state.

[0049] According to various embodiments, when the foldable electronic device (1) is viewed in an unfolded state, the display area (150) of the first display module (15) may be provided (or formed) in a symmetrical shape with respect to a center line (A) of the foldable electronic device (1). The center line (A) of the foldable electronic device (1) may correspond to the middle of a width of the third display area (153) extending from a first boundary between the first display area (151) and the third display area (153) to a second boundary between the second display area (151) and the third display area (153) when the foldable electronic device (1) is viewed in an unfolded state. The positive and negative directions of the x-coordinate axis may be, for example, substantially perpendicular to the center line (A), and the positive and negative directions of the y-coordinate axis may be substantially parallel to the center line (A). In various embodiments, the center line (A) of the foldable electronic device (1) may be configured as a “folding axis” of the foldable housing (10) or the foldable electronic device (1). The folding axis may be substantially provided (or formed) by the hinge portion (14). The third display area (153) arranged in a bent shape in the folded state of the foldable electronic device (1) may be provided (or formed) in a substantially symmetrical shape with respect to the center line (A) of the foldable electronic device (1).

[0050] According to various embodiments, the first housing (11) may include a first frame (also referred to as a first frame structure or a first framework) (111), and a first back cover (also referred to as a first rear cover, a first rear plate, or a first back plate) (112) disposed on (or coupled to) the first frame (111). The combination of the first frame (111) and the first back cover (112) may provide (or form) a first rear area and a first side area of ​​an exterior of the foldable electronic device (1). The first frame (111) may provide (or form) at least a portion of the first side area of ​​the foldable electronic device (1). The first back cover (112) may provide (or form) at least a portion of the first rear area of ​​the foldable electronic device (1). The first rear area may be oriented in the opposite direction to the first front area of ​​the foldable electronic device (1) provided (or formed) by the first display area (151) of the first display module (15).

[0051] According to various embodiments, the first frame (111) may include a first side (also referred to as a first side member, a first side structure, or a first side bezel structure) (1112). The first side (1112) may surround at least a portion of the space between the first display area (151) and the first back cover (112), and may provide (or form) at least a portion of the first side area of ​​the exterior of the foldable electronic device (1).

[0052] According to various embodiments, the first frame (111) may include a first support plate (also referred to as a first support member, a first support structure, a first support portion, or a first bracket) (1111) extending from or connected to the first side (1112). The first support plate (1111) may be a structural element positioned inside the foldable electronic device (1) corresponding to the first housing (11).

[0053] According to various embodiments, the first frame (111) may be provided (or formed) as an integrated or single structure (e.g., a single continuous structure or a complete structure) including a first support plate (1111) and a first side (1112).

[0054] According to various embodiments, the first frame (111) may be provided as a combination of a conductive body (or metal body) (not shown separately) including one or more conductive portions and a non-conductive body (or non-metal body) (not shown separately) including one or more non-conductive portions.

[0055] According to various embodiments, the first support plate (1111) may be positioned at least partially between the first display area (151) and the first back cover (112). The first display area (151) may be disposed on the first support plate (1111), and the first support plate (1111) may support the first display area (151).

[0056] According to various embodiments, a plurality of electrical components, such as at least one printed circuit board (PCB) (e.g., the first PCB (31) of FIGS. 3 and 4 and the third PCB (33) of FIG. 4) and a first battery (e.g., the first battery (41) of FIG. 4), may be at least partially disposed or coupled to the first support plate (1111) of the first frame (111) between the first frame (111) and the first back cover (112).

[0057] According to various embodiments, electrical components (or electronic parts), or various members related to electrical components, may be disposed or coupled to the first frame (111) or the first support plate (1111), or may be supported by the first frame (111) or the first support plate (1111). The first support plate (1111) may include, for example, a first support surface (1111A) and a third support surface (1111B). The first support surface (1111A) may be substantially oriented toward the first display area (151) of the first display module (15). The third support surface (1111B) may be positioned on the opposite side from the first support surface (1111A). The third support surface (1111B) may be substantially oriented toward the first back cover (112). Electrical components (or electronic parts), or various members related to electrical components, may be arranged or coupled to the first support surface (1111A) and / or the third support surface (1111B), or may be supported by the first support surface (1111A) and / or the third support surface (1111B).

[0058] According to various embodiments, the second housing (12) may include a second frame (also referred to as a second frame structure or a second framework) (121) and / or a second back cover (also referred to as a second rear cover, a second rear plate, or a second back plate) (122) disposed on the second frame (121). The combination of the second frame (121) and the second back cover (122) may provide (or form) a second rear area and a second side area of ​​the exterior of the foldable electronic device (1). The second frame (121) may provide (or form) at least a portion of the second side area of ​​the foldable electronic device (1). The second back cover (122) may provide (or form) at least a portion of the second rear area of ​​the foldable electronic device (1). The second rear area may be oriented in an opposite direction to the second front area of ​​the foldable electronic device (1) provided (or formed) by the second display area (152).

[0059] According to various embodiments, the second frame (121) may include a second side (also referred to as a second side member, a second side structure, or a second side bezel structure) (1212). The second side (1212) may surround at least a portion of the space between the second display area (152) and the second back cover (122), and may provide (or form) at least a portion of the second side area of ​​the exterior of the foldable electronic device (1).

[0060] According to various embodiments, the second frame (121) may include a second support plate (also referred to as a second support member, a second support structure, a second support portion, or a second bracket) (1211) extending from or connected to the second side (1212). The second support plate (1211) may be a structural element positioned inside the foldable electronic device (1) corresponding to the second housing (12).

[0061] According to various embodiments, the second frame (121) may be provided as an integral or single structure (e.g., a single continuous structure or a complete structure) comprising a second support plate (1211) and a second side (1212).

[0062] According to various embodiments, the second frame (121) may be provided as a combination of a conductive body (or metal body) (not shown separately) including one or more conductive portions and a non-conductive body (or non-metal body) (not shown separately) including one or more non-conductive portions.

[0063] According to various embodiments, the second support plate (1211) may be positioned at least partially between the second display area (152) and the second cover (122). The second display area (152) may be disposed on the second support plate (1211), and the second support plate (1211) may support the second display area (152).

[0064] According to various embodiments, a plurality of electrical components, such as at least one PCB (e.g., the second PCB (32) of FIGS. 3 and 4 and the fourth PCB (34) of FIG. 4) and a second battery (e.g., the second battery (42) of FIG. 4), may be at least partially disposed or coupled to the second support plate (1211) of the second frame (121) between the second frame (121) and the second back cover (122).

[0065] According to various embodiments, electrical components (or electronic parts), or various members related to electrical components, may be disposed or coupled to the second frame (121) or the second support plate (1211), or may be supported by the second frame (121) or the second support plate (1211). The second support plate (1211) may include, for example, a second support surface (1211A) and a fourth support surface (1211B). The second support surface (1211A) may be substantially oriented toward the second display area (152) of the first display module (15). The fourth support surface (1211B) may be positioned opposite the second support surface (1211A). The fourth support surface (1211B) may be substantially oriented toward the second back cover (122). Electrical components (or electronic parts), or various members related to electrical components, may be arranged or coupled to the second support surface (1211A) and / or the fourth support surface (1211B), or may be supported by the second support surface (1211A) and / or the fourth support surface (1211B).

[0066] According to various embodiments, the first side (1112) of the first frame (111) may include a first side portion (B1), a third side portion (B3), a fifth side portion (B5), and / or a seventh side portion (B7). The first side portion (B1) may extend in a direction perpendicular to the center line (A) of the foldable electronic device (1) (e.g., a direction parallel to the x-coordinate axis). The third side portion (B3) may be spaced apart from the first side portion (B1) in a direction parallel to the center line (A) of the foldable electronic device (1) (e.g., a direction parallel to the y-coordinate axis) and may be substantially parallel to the first side portion (B1). The fifth side portion (B5) may extend or connect one end of the first side portion (B1) and one end of the third side portion (B3). The seventh side portion (B7) may extend or connect the other end of the first side portion (B1) and the other end of the third side portion (B3). The fifth side portion (B5) and the seventh side portion (B7) may extend in a direction parallel to the center line (A) of the foldable electronic device (1) and may be substantially parallel to each other. The seventh side portion (B7) may be positioned closer to the center line (A) of the foldable electronic device (1) than the fifth side portion (B5). The first corner from which the first side portion (B1) and the fifth side portion (B5) extend or connect, and / or the second corner from which the third side portion (B3) and the fifth side portion (B5) extend or connect, may be provided (or formed) in a smooth curved shape.

[0067] According to various embodiments, when viewed from above the first back cover (112), the first side portion (B1), the third side portion (B3), the fifth side portion (B5), and the seventh side portion (B7) may surround the first back cover (112). "When viewed from above the first back cover (112)" may be understood as "when viewed in a direction perpendicular to the first back cover (112)." "When viewed from above the first back cover (112)" may refer to, for example, when viewed in the positive direction of the z-coordinate axis.

[0068] According to various embodiments, the second side (1212) of the second frame (121) may include a second side portion (B2), a fourth side portion (B4), a sixth side portion (B6), and / or an eighth side portion (B8). The second side portion (B2) may extend in a direction perpendicular to the center line (A) of the foldable electronic device (1). The fourth side portion (B4) may be spaced apart from the second side portion (B2) in a direction parallel to the center line (A) of the foldable electronic device (1) and may be substantially parallel to the second side portion (B2). The sixth side portion (B6) may extend or connect one end of the second side portion (B2) and one end of the fourth side portion (B4). The eighth side portion (B8) may extend or connect the other end of the second side portion (B2) and the other end of the fourth side portion (B4). The sixth side portion (B6) and the eighth side portion (B8) may extend in a direction parallel to the center line (A) of the foldable electronic device (1) and may be substantially parallel to each other. The eighth side portion (B8) may be positioned closer to the center line (A) of the foldable electronic device (1) than the sixth side portion (B6). The third corner from which the second side portion (B2) and the sixth side portion (B6) extend or connect, and / or the fourth corner from which the fourth side portion (B4) and the sixth side portion (B6) extend or connect, may be provided (or formed) in a smooth curved shape.

[0069] According to various embodiments, when viewed from above the second back cover (122), the second side portion (B2), the fourth side portion (B4), the sixth side portion (B6), and the eighth side portion (B8) may surround the second back cover (122). "When viewed from above the second back cover (122)" may be understood as "when viewed in a direction perpendicular to the second back cover (122)." "When viewed from above the second back cover (122)" may refer to, for example, when viewed in the positive direction of the z-coordinate axis in an unfolded state of the foldable electronic device (1).

[0070] According to various embodiments, in the folded state of the foldable electronic device (1), the first side (1112) of the first frame (111) and the second side (1212) of the second frame (121) can be aligned and overlapped. In the folded state of the foldable electronic device (1), the first side portion (B1) and the second side portion (B2) can be aligned and overlapped. In the folded state of the foldable electronic device (1), the third side portion (B3) and the fourth side portion (B4) can be aligned and overlapped. In the folded state of the foldable electronic device (1), the fifth side portion (B5) and the sixth side portion (B6) can be aligned and overlapped.

[0071] According to various embodiments, the first side portion (B1), the third side portion (B3), and the fifth side portion (B5) may be one-side bezels (or first screen bezels) surrounding one area of ​​the first display module (15) based on the center line (A) of the foldable electronic device (1). The second side portion (B2), the fourth side portion (B4), and the sixth side portion (B6) may be the other-side bezels (or second screen bezels) surrounding the other area of ​​the first display module (15) based on the center line (A) of the foldable electronic device (1). The seventh side portion (B7) and the eighth side portion (B8) may be positioned on opposite sides of the third display area (153). When viewed from above on the front of the foldable electronic device (1) in an unfolded state, the seventh side portion (B7) and the eighth side portion (B8) may not be visible.

[0072] According to various embodiments, the hinge cover (also called hinge housing) (13) may be connected to one or more hinges (e.g., a first hinge (141), a second hinge (142), and a third hinge (143)) included in the hinge portion (14).

[0073] According to various embodiments, when the foldable electronic device (1) is converted from an unfolded state to a folded state, a gap between the first frame (111) and the second frame (121) connected through the hinge portion (14) may open on the opposite side of the third display area (153) due to a change in the relative position between the first frame (111) and the second frame (121) and a change in the state of the hinge portion (14) coupled with the hinge cover (13). The hinge cover (13) may be exposed to the outside through the opened gap. For example, in the folded state of the foldable electronic device (1), the hinge cover (13) may be visually exposed to the outside through the opened gap between the seventh side portion (B7) of the first frame (111) and the eighth side portion (B8) of the second frame (121). The width of the gap between the seventh side portion (B7) of the first frame (111) and the eighth side portion (B8) of the second frame (121) may vary depending on the angle between the first frame (111) and the second frame (121). The hinge cover (13) may be more visually exposed to the outside in the folded state of the foldable electronic device (1) than in the intermediate state of the foldable electronic device (1). In the folded state of the foldable electronic device (1), the hinge cover (13) may become a part of the exterior that covers the inside of the foldable electronic device (1). In the folded state of the foldable electronic device (1), the side of the foldable electronic device (1) may include a first side area provided by a first side (1112) of a first frame (111), a second side area provided by a second side (1212) of a second frame (121), and a third side area provided by a hinge cover (13).

[0074] According to various embodiments, when the foldable electronic device (1) is switched from a folded state to an unfolded state, a gap between the first frame (111) and the second frame (121) on the opposite side of the third display area (153) may be closed due to a change in the relative position between the first frame (111) and the second frame (121) connected through the hinge portion (14) and a change in the state of the hinge portion (14) coupled with the hinge cover (13). For example, in the unfolded state of the foldable electronic device (1), a gap between the seventh side portion (B7) of the first frame (111) and the eighth side portion (B8) of the second frame (121) may be closed, and the hinge cover (13) may not be visually exposed to the outside.

[0075] According to various embodiments, the foldable electronic device (1) may include a second display module (16) (also referred to as a second display). The second display module (16) may be positioned between the second back cover (122) and the second support plate (1211) of the second frame (121). The second display module (16) may be disposed or coupled to the second back cover (122) and / or the second support plate (1211). A display area of ​​the second display module (16) may be visually visible through the second cover (122). The foldable electronic device (1) may be configured to display an image through the second display module (16) instead of the first display module (15) in a folded state.

[0076] According to various embodiments, the foldable electronic device (1) may include a first camera module (201), a second camera module (202), a third camera module (203), a fourth camera module (204), and / or a fifth camera module (205). The first camera module (201), the second camera module (202), the third camera module (203), the fourth camera module (204), or the fifth camera module (205) may include a camera including one or more lenses, image sensor(s), and / or an image signal processor (ISP).

[0077] According to various embodiments, the first camera module (201), the second camera module (202), and the third camera module (203) may be accommodated in the first housing (11) corresponding to the first back cover (112) (or the first rear area of ​​the foldable electronic device (1)). For example, the first back cover (112) may include a first camera hole (or a first light-transmitting area) corresponding to the first camera module (201), a second camera hole (or a second light-transmitting area) corresponding to the second camera module (202), and / or a third camera hole (or a third light-transmitting area) corresponding to the third camera module (203). The positions or numbers of the camera modules accommodated in the first housing (11) corresponding to the first back cover (112) are not limited to the illustrated examples.

[0078] According to various embodiments, the first camera module (201), the second camera module (202), or the third camera module (203) may include, but is not limited to, a wide-angle camera, a telephoto camera, a color camera, a black and white camera, or an IR camera (e.g., a time of flight (TOF) camera, a structured light camera).

[0079] According to various embodiments, the first camera module (201), the second camera module (202), and the third camera module (203) may have different properties (e.g., angle of view) or functions.

[0080] According to various embodiments, the first camera module (201), the second camera module (202), or the third camera module (203) may provide different angles of view (or lenses with different angles of view). The foldable electronic device (1) may be configured to selectively use the angles of view of the first camera module (201), the second camera module (202), or the third camera module (203) based on a user's selection regarding the angle of view.

[0081] According to various embodiments, the fourth camera module (204) may be accommodated in the first housing (11) corresponding to the first front area of ​​the foldable electronic device (1).

[0082] According to various embodiments, the fourth camera module (204) may overlap the first display area (151) of the first display module (15) when viewed from above the first front area of ​​the foldable electronic device (1). The fourth camera module (204) may be positioned on the back surface of the first display area (151) or below the first display area (151). When viewed from the outside of the foldable electronic device (1), the fourth camera module (204), or the position of the fourth camera module (204), may be substantially not visually distinguishable (or exposed). The fourth camera module (204) may include, for example, a hidden display rear camera (e.g., an under display camera (UDC)). External light may pass through the first display module (15) to reach the fourth camera module (204).

[0083] According to various embodiments, although not shown separately, the fourth camera module (204) may be accommodated in the second housing (12) corresponding to the second front area of ​​the foldable electronic device (1).

[0084] According to various embodiments, although not shown separately, an additional camera module (not shown separately) may be accommodated in the second housing (12) corresponding to the second front area of ​​the foldable electronic device (1).

[0085] According to various embodiments, the fifth camera module (205) may be accommodated in the second housing (12) corresponding to the second back cover (122) (or the second rear area of ​​the foldable electronic device (1)).

[0086] According to various embodiments, the fifth camera module (205) may be positioned in alignment with or at least partially inserted into an opening provided in the second display module (16). External light may pass through the opening provided in the second cover (122) and the second display module (16) to reach the fifth camera module (205). The opening of the second display module (16) aligned with or overlapping the fifth camera module (205) may be a through hole. In various embodiments, the opening of the second display module (16) aligned with or overlapping the fifth camera module (205) may be provided as a notch (not separately illustrated).

[0087] According to various embodiments, the fifth camera module (205) may overlap the second display module (16) when viewed from above the second rear area of ​​the foldable electronic device (1). The fifth camera module (205) may be positioned on the back surface of the second display module (16) or below the second display module (16). When viewed from the outside of the foldable electronic device (1), the fifth camera module (205), or the position of the fifth camera module (205), may be substantially not visually distinguishable (or exposed). The fifth camera module (205) may include, for example, a hidden display rear camera (e.g., UDC). External light may pass through the second back cover (122) and the second display module (16) to reach the fifth camera module (205).

[0088] According to various embodiments, the first camera module (201), the second camera module (202), the third camera module (203), the fourth camera module (204), or the fifth camera module (205) may be configured to operate as at least a portion of the sensor module. For example, the IR camera module may operate as at least a portion of the sensor module.

[0089] According to various embodiments, the foldable electronic device (1) may include a light-emitting module (206). The light-emitting module (206) may be accommodated in the first housing (11) corresponding to the first back cover (112) (or the first rear area of ​​the foldable electronic device (1)). The first back cover (112) may include a flash hole (or a fourth light-transmitting area) corresponding to the light-emitting module (206). The light-emitting module (206) may include, for example, an LED or a xenon lamp. The light-emitting module (206) may include a light source for the first camera module (201), the second camera module (202), and / or the third camera module (203).

[0090] According to various embodiments, the foldable electronic device (1) may include a first sensor module (207). The first sensor module (207) may be accommodated in a foldable housing (10) corresponding to the front surface of the foldable electronic device (1).

[0091] According to various embodiments, the first sensor module (207) may include an optical sensor module. The optical sensor module may include, for example, a proximity sensor module or a light sensor module.

[0092] According to various embodiments, the first sensor module (207) may overlap the first display area (151) of the first display module (15) when viewed from above the first front area of ​​the foldable electronic device (1). The first sensor module (207) may be positioned on the back surface of the first display area (151) or below the first display area (151). When viewed from the outside of the foldable electronic device (1), the first sensor module (207) or the position of the first sensor module (207) may be substantially not visually distinguishable (or exposed). External light may pass through the first display module (15) to reach the first sensor module (207).

[0093] According to various embodiments, the foldable electronic device (1) may include a second sensor module (208). The second sensor module (208) may be accommodated in a foldable housing (10) corresponding to the rear surface of the foldable electronic device (1).

[0094] According to various embodiments, the second sensor module (208) may include an optical sensor module. The optical sensor module may include, for example, a proximity sensor module or a light sensor module.

[0095] According to various embodiments, the second sensor module (208) may overlap the display area of ​​the second display module (16) when viewed from above the second rear area of ​​the foldable electronic device (1). The second sensor module (208) may be positioned on the back surface of the display area of ​​the second display module (16), or below the display area of ​​the second display module (16). When viewed from the outside of the foldable electronic device (1), the second sensor module (208), or the position of the second sensor module (208), may be substantially not visually distinguishable (or exposed). External light may pass through the second back cover (122) and the second display module (16) to reach the second sensor module (208).

[0096] According to various embodiments, the foldable electronic device (1) may further include various other sensor modules (e.g., a biometric sensor module) (not shown separately).

[0097] According to various embodiments, the foldable electronic device (1) may include a first audio input module (not shown separately), a second audio input module (not shown separately), a third audio input module (not shown separately), and / or a fourth audio input module (not shown separately). The first audio input module may include a first microphone (also referred to as a first microphone) (not shown separately). The first microphone may be accommodated in the first housing (11) corresponding to, for example, a first microphone hole (H11) included in a first side portion (B1) of the first side (1112). The second audio input module may include a second microphone (also referred to as a second microphone) (not shown separately). The second microphone may be accommodated in the first housing (11), for example, corresponding to the second microphone hole (H12) included in the first side portion (B1) of the first side (1112). The third sound input module may include a third microphone (also referred to as a third microphone) (not shown separately). The third microphone may be accommodated in the first housing (11), for example, corresponding to the third microphone hole (H13) included in the third side portion (B3) of the first side (1112). The fourth sound input module may include a fourth microphone (also referred to as a fourth microphone) (not shown separately). The fourth microphone may be accommodated in the second housing (12), for example, corresponding to the fourth microphone hole (H14) included in the second side portion (B2) of the second side (1212). The position or number of microphones and microphone holes corresponding to the microphones are not limited to the examples shown.

[0098] According to various embodiments, the foldable electronic device (1) may include a first audio output module (e.g., the first speaker module (213) of FIG. 4), a second audio output module (e.g., the second speaker module (214) of FIG. 4), and / or a third audio output module (not shown separately). The first audio output module may include a first speaker. The first speaker may be accommodated in the second housing (12) corresponding to a first speaker hole (H21) included in, for example, a second side portion (B2) of the second side (1212). The second audio output module may include a second speaker. The second speaker may be accommodated in the second housing (12) corresponding to a second speaker hole (H22) included in, for example, a fourth side portion (B4) of the second side (1212). The first speaker or the second speaker may be a speaker for multimedia playback or recording playback. The position or number of the speaker for multimedia playback or recording playback and the corresponding speaker holes are not limited to the illustrated examples. The third audio output module may include a third speaker (not illustrated separately). The third speaker may be accommodated in the second housing (12), for example, between the second back cover (122) and the second side portion (B2) of the second side (1212), or corresponding to a third speaker hole (H23) provided (or formed) in the second back cover (122). The third speaker may include a call receiver. The position or number of the call receiver and the corresponding speaker holes (also referred to as receiver holes) for the call receiver are not limited to the illustrated examples.

[0099] According to various embodiments, the foldable electronic device (1) may include a key input module. The key input module may include, for example, a first key (also referred to as a first side key) (209) and / or a second key (also referred to as a second side key) (210). The key input module may include a key signal generating unit (not separately illustrated). The first key (209) may be positioned in a first key hole included in a fifth side portion (B5) of the first side (1112), and the second key (210) may be positioned in a second key hole included in the fifth side portion (B5) of the first side (1112). The key signal generating unit may be configured to generate a first key signal in response to a press or touch on the first key (209), and a second key signal in response to a press or touch on the second key (210). The location or number of key input modules is not limited to the illustrated example.

[0100] According to various embodiments, the foldable electronic device (1) may include a first connection terminal (also referred to as a first connector or a first interface terminal) (211). The first connection terminal (211) may be accommodated in the first housing (11) in correspondence with a first connection terminal hole (e.g., a first connector hole) included in a third side portion (B3) of the first side (1112), for example. The foldable electronic device (1) may transmit and / or receive power and / or data to and from an external electronic device electrically connected to the first connection terminal (211). The first connection terminal (211) may include, for example, a USB connector or an HDMI connector. The positions of the first connection terminal (211) and the first connection terminal hole corresponding to the first connection terminal (211) are not limited to the illustrated example.

[0101] According to various embodiments, the foldable electronic device (1) may include a second connection terminal (also referred to as a second connector or a second interface terminal) (212). The second connection terminal (212) may be accommodated in the second housing (12) in correspondence with a second connection terminal hole (e.g., a second connector hole) included in, for example, a sixth side portion (B6) of the second side (1212). An external storage medium such as a secure digital memory (SD) card, a SIM card, or a universal SIM (USIM) card may be connected to the second connection terminal (212). The positions of the second connection terminal (212) and the second connection terminal hole corresponding to the second connection terminal (212) are not limited to the illustrated example.

[0102] FIG. 4 is a drawing showing a portion of a foldable electronic device (1) in an unfolded state according to various embodiments of the present disclosure.

[0103] FIG. 5 is a drawing showing a portion of a foldable electronic device (1) according to various embodiments of the present disclosure.

[0104] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed with respect to FIGS. 4 and 5. All combinations of the features described below with respect to FIGS. 4 and 5 may be considered to be encompassed by the present disclosure as specific examples. Descriptions of some components identical to those described in the preceding embodiments may not be repeated.

[0105] Referring to FIGS. 4 and 5, the foldable electronic device (1) may include a first PCB (31), a third PCB (33), and a first battery (41) arranged or coupled to a first support plate (1111) of a first frame (111). The first PCB (31), the third PCB (33), and the first battery (41) may be positioned between the first support plate (1111) and the first back cover (112) (see FIG. 1). The first PCB (31), the third PCB (33), and / or the first battery (41) may be coupled to the first support plate (1111) through mechanical fastening, such as screw fastening, and / or bonding. When viewed from above the first back cover (112) (see FIG. 1), the first PCB (31) may be positioned closer to the first side portion (B1) of the first frame (111) than the third PCB (33). When viewed from above the first back cover (112) (see FIG. 1), the third PCB (33) may be positioned closer to the third side portion (B3) of the first frame (111) than the first PCB (31). When viewed from above the first back cover (112) (see FIG. 1), the first battery (41) may be positioned between the first PCB (31) and the third PCB (33).

[0106] According to various embodiments, the foldable electronic device (1) may include a first flexible printed circuit board (FPCB) (43) and a second FPCB (44) electrically connecting a first PCB (31) and a third PCB (33). The first FPCB (43) and the second FPCB (44) may be disposed across a space between a first battery (41) and a first back cover (112) (see FIG. 1). The first FPCB (43) and the second FPCB (44) may be disposed across the first battery (41) and may be disposed or coupled to the first battery (41). When viewed from above the first back cover (112) (see FIG. 1), the first FPCB (43) and the second FPCB (44) may overlap the first battery (41). The number or position of the FPCBs electrically connecting the first PCB (31) and the third PCB (33) is not limited to the illustrated example.

[0107] According to various embodiments, the foldable electronic device (1) may include a camera bracket (200) disposed or coupled to a first support plate (1111) of a first frame (111). The camera bracket (200) may be positioned between the first support plate (1111) and the first back cover (112) (see FIG. 1). When viewed from above the first back cover (112) (see FIG. 1), the camera bracket (200) may be positioned closer to the first side portion (B1) of the first frame (111) than to the first battery (41). A first camera module (201), a second camera module (202), and a third camera module (203) may be disposed and coupled to the camera bracket (200). When viewed from above the first back cover (112) (see FIG. 1), the first camera module (201), the second camera module (202), and / or the third camera module (203) may not overlap the first PCB (31).

[0108] According to various embodiments, the foldable electronic device (1) may include a fourth camera module (204). The fourth camera module (204) may be positioned or coupled to the first support plate (1111) between the first support plate (1111) and the first back cover (112) (see FIG. 1). When viewed from above the first back cover (112) (see FIG. 1), the fourth camera module (204) may not overlap the first PCB (31).

[0109] According to various embodiments, the foldable electronic device (1) may include a second PCB (32), a fourth PCB (34), and a second battery (42) disposed or coupled to a second support plate (1211) of a second frame (121). The second PCB (32), the fourth PCB (34), and the second battery (42) may be positioned between the second support plate (1211) and the second back cover (122) (see FIG. 1). The second PCB (31), the fourth PCB (34), and / or the second battery (42) may be coupled to the second support plate (1211) through mechanical fastening, such as screw fastening, and / or bonding. At least a portion of the second PCB (32), at least a portion of the fourth PCB (34), and / or at least a portion of the second battery (42) may be positioned between the second display module (16) (or the display area of ​​the second display module (16)) (see FIG. 1) and the second support plate (1211). When viewed from above the second back cover (122) (see FIG. 1), the second PCB (32) may be positioned closer to the second side portion (B2) of the second frame (121) than the fourth PCB (34). When viewed from above the second back cover (122) (see FIG. 1), the fourth PCB (34) may be positioned closer to the fourth side portion (B4) of the second frame (121) than the second PCB (32). When viewed from above the second back cover (122) (see FIG. 1), the second battery (42) can be positioned between the second PCB (32) and the fourth PCB (34).

[0110] According to various embodiments, the foldable electronic device (1) may include a third FPCB (45) electrically connecting the second PCB (32) and the fourth PCB (34). The third FPCB (45) may be disposed across a space between the second battery (42) and the second back cover (122) (see FIG. 1). The third FPCB (45) may be disposed across the second battery (42) and may be disposed or coupled to the second battery (42). When viewed from above the second back cover (122) (see FIG. 1), the third FPCB (45) may overlap the second battery (42). The number or position of the FPCBs electrically connecting the second PCB (32) and the fourth PCB (34) is not limited to the illustrated example.

[0111] According to various embodiments, the foldable electronic device (1) may include a fourth FPCB (46) electrically connecting the first PCB (31) and the second PCB (32). The fourth FPCB (46) may penetrate a first hole (H31) formed in a first support plate (1111) of the first frame (111) and a second hole (H32) formed in a second support plate (1211) of the second frame (121). The fourth FPCB (46) may be arranged across the hinge portion (14) (see FIG. 1). In various embodiments, when viewed from above the second back cover (122) (see FIG. 1), a portion of the fourth FPCB (46) may overlap the second battery (42) and be arranged or coupled to the second battery (42).

[0112] According to various embodiments, the foldable electronic device (1) may include a fifth camera module (205). The fifth camera module (205) may be positioned or coupled to the second support plate (1211) between the second support plate (1211) and the second back cover (122) (see FIG. 1). When viewed from above the second back cover (122) (see FIG. 1), the fifth camera module (205) may not overlap the second PCB (32).

[0113] According to various embodiments, the foldable electronic device (1) may include a first speaker module (213) and / or a second speaker module (214). The first speaker module (213) may be accommodated in the second housing (12). When viewed from above the second back cover (122) (see FIG. 1), the first speaker module (213) may be positioned between the second battery (42) and the second side portion (B2) of the second frame (121). The second speaker module (214) may be accommodated in the second housing (12). When viewed from above the second back cover (122) (see FIG. 1), the second speaker module (214) may be positioned between the second battery (42) and the fourth side portion (B4) of the second frame (121).

[0114] According to various embodiments, the foldable electronic device (1) may include a heat radiation structure. The heat radiation structure may include, for example, a heat spreader and / or a heat sink. The heat radiation structure may be configured to diffuse, dissipate, and / or dissipate heat emitted from one or more electrical elements (e.g., electronic components). The heat radiation structure may prevent heat emitted from one or more electrical elements from remaining on the one or more electrical elements through heat conduction, heat convection, and / or heat radiation. The heat radiation structure may reduce or prevent overheating of the one or more electrical elements, thereby reducing or preventing performance degradation or damage to the one or more electrical elements.

[0115] In the present disclosure, one or more heat-conducting members included in the heat dissipation structure of the foldable electronic device (1) may include good conductors for heat. Bad conductors for heat (e.g., members of a non-metallic material such as a gas or a polymer) may be interpreted as not being substantially included in one or more heat conductors of the heat dissipation structure.

[0116] In the present disclosure, heat conduction between the first component and the second component may include "direct heat conduction" or "indirect or mediated heat conduction." Direct heat conduction between the first component and the second component may be understood as heat being transferred between the first component and the second component through direct (or physical) contact between the first component and the second component. Indirect heat conduction between the first component and the second component may be understood as heat being transferred between the first component and the second component through (or as a medium) a third component (e.g., a medium or intermediate material) between the first component and the second component. Indirect heat conduction between the first component and the second component may include direct heat conduction between the first component and the third component, and direct heat conduction between the second component and the third component. In the scheme of indirect heat conduction, the third component may be understood to include a good conductor of heat that can smoothly transfer heat between the first component and the first component. In the scheme of indirect heat conduction, the third component may be understood to be substantially free of a poor conductor of heat.

[0117] In the present disclosure, indirect heat conduction between the first component and the second component may be interpreted as heat being transferred between the first component and the second component by “indirect or mediate contact” between the first component and the second component via a third component.

[0118] According to various embodiments, the heat dissipation structure of the foldable electronic device (1) can provide (or form) convective heat transfer, which is a method of transferring heat energy between a solid surface (e.g., a surface of one or more heat conductors) and a gas between one or more heat conductors and the surrounding air.

[0119] According to various embodiments, the foldable electronic device (1) may include a ground structure (not shown separately). The ground structure may include, for example, one or more ground regions included in one or more printed circuit boards included in the foldable electronic device (1). The ground structure may include, for example, a first conductor (also referred to as a first conductive structure or a first metal) (not shown separately) included in a first housing (11). The ground structure may include, for example, a second conductor (also referred to as a second conductive structure or a second metal) (not shown separately) included in a second housing (12). The ground structure may include, for example, a third conductor (also referred to as a third conductive structure or a third metal) (not shown separately) included in a hinge cover (13). The ground structure may include, for example, a fourth conductor (also referred to as a fourth conductive structure or a fourth metal) (not shown separately) included in the hinge portion (14). The ground structure may include, for example, a fifth conductor (also referred to as a fifth conductive structure or a fifth metal) (not shown separately) included in the first display module (15). The ground structure may include, for example, a sixth conductor (also referred to as a sixth conductive structure or a sixth metal) (not shown separately) included in the second display module (16) (see FIG. 3). One or more of the ground regions, the first conductor, the second conductor, the third conductor, the fourth conductor, the fifth conductor, and the sixth conductor, may be electrically connected. The ground structure may further include at least one other conductor (not shown) electrically connected to one or more of the ground regions, the first conductor, the second conductor, the third conductor, the fourth conductor, the fifth conductor, and / or the sixth conductor.The ground structure may be provided (or formed) by various other combinations. In various embodiments, the ground structure of the foldable electronic device (1) may reduce or prevent electromagnetic interference (EMI) to electrical elements included in the foldable electronic device (1). In various embodiments, the heat dissipation structure of the foldable electronic device (1) may include at least a portion of the ground structure of the foldable electronic device (1).

[0120] According to various embodiments, the foldable electronic device (1) may include a metal cover (also referred to as a metal structure or an electromagnetic shielding member) (5) (see FIGS. 5 and 6) for electromagnetic shielding of one or more electronic components (311) disposed on a first PCB (31). The metal cover (5) may be understood as a part of a ground structure of the foldable electronic device (1). The first PCB (31) may include a first side (31A) and a second side (e.g., the second side (31B) of FIG. 7) facing in an opposite direction to the first side (31A). The first side (31A) of the first PCB (31) may face the first back cover (112) (see FIG. 1), and the second side of the first PCB (31) may face the first support plate (1111). In various embodiments, the metal cover (5) may be positioned between the first PCB (31) and the first back cover (112) (see FIG. 1) and may be disposed or coupled to the first surface (31A) of the first PCB (31) to cover one or more electronic components (311) disposed (e.g., surface mounted) on the first surface (31A) of the first PCB (31). In various embodiments, the metal cover (5) may be surface mounted on the first surface (31A) of the first PCB (31).

[0121] According to various embodiments, the metal cover (5) may be bonded (or surface mounted) to the first side (31A) of the first PCB (31) through a soldering process (also referred to as reflow soldering or solder reflow). The soldering process for the metal cover (5) and the first PCB (31) may include a first operation of positioning the metal cover (5) and the first PCB (31) within a chamber (not shown separately) and disposing (e.g., applying) solder paste (also referred to as solder cream) between the metal cover (5) and the first PCB (31), and a second operation of controlling the temperature within the chamber according to a temperature profile. The second operation may be understood as an operation for providing heat to the solder paste between the metal cover (5) and the first PCB (31) in the soldering process. The first operation may be understood as an operation before providing heat to the solder paste between the metal cover (5) and the first PCB (31) in the soldering process. The solder paste may be a cream-type bonding material mixed with solder powder and flux. During the soldering process, as the solder paste melts and flows and then solidifies, a joint (e.g., joint (C) in FIG. 7) connecting the metal cover (5) and the first surface (31A) of the first PCB (31) may be formed.

[0122] According to various embodiments, the first PCB (31) may include a conductive pad portion (also referred to as a conductive pad group, a conductive land portion, or a conductive land group) (P) arranged on the first surface (31A). The conductive pad portion (P) of the first PCB (31) may include a plurality of conductive pads (also referred to as a plurality of conductive lands). The conductive pad portion (P) of the first PCB (31) may include, for example, first to 36th conductive pads (also referred to as first to 36th PCB pads) (P1, P2, P3, ..., and P36) spaced apart from each other, but is not limited thereto. In various embodiments, the first to 36th conductive pads (P1, P2, P3, …, and P36) may be arranged along the edge of the metal cover (5) when viewed from above the first back cover (112) (see FIG. 1). “When viewed from above the first back cover (122)” may be understood as “when viewed from above the first side (31A) of the first PCB (31)”, “when viewed in a direction perpendicular to the first side (31A) of the first PCB (31)”, or “when viewed in a direction perpendicular to the first PCB (31)”. A first surface (31A) of a first PCB (31) may include first to 36th non-conductive regions (also referred to as non-conductive surface regions) (N1, N2, N3, …, and N36) between first to 36th conductive pads (P1, P2, P3, …, and P36). The plurality of non-conductive regions (N1, N2, N3, …, and N36) may be arranged along the edge of the metal cover (5) when viewed from above the first back cover (112) (see FIG. 1) and may be spaced apart from each other. The plurality of first to 36th conductive pads (P1, P2, P3, …, and P36) and the plurality of first to 36th non-conductive regions (N1, N2, N3, …, and M36) may be arranged one by one in repetition.In various embodiments, a joint (e.g., joint (C) in FIG. 7) connecting the metal cover (5) and the first side (31A) of the first PCB (31) through a soldering process may include a plurality of first joints (e.g., a plurality of first joints (C1) in FIGS. 8 and 9) and a plurality of second joints (e.g., a plurality of second joints (C2) in FIGS. 8 and 9). The plurality of first joints are arranged between the metal cover (5) and the first to 36th conductive pads (P1, P2, P3, ..., and P36) of the first PCB (31), and may connect the metal cover (5) and the first to 36th conductive pads (P1, P2, P3, ..., and P36) of the first PCB (31). A plurality of first joints may be arranged along an edge of the metal cover (5) when viewed from above the first back cover (112) (see FIG. 1) and may be spaced apart from each other. A plurality of second joints may be arranged between the metal cover (5) and the first to 35th non-conductive regions (N1, N2, N3, …, and N35) of the first PCB (31) and may connect the metal cover (5) and the first to 35th non-conductive regions (N1, N2, N3, …, and N35) of the first PCB (31). A plurality of second joints may be arranged along an edge of the metal cover (5) when viewed from above the first back cover (112) (see FIG. 1) and may be spaced apart from each other. In various embodiments, the plurality of first joints and the plurality of second joints may seal between the metal cover (5) and the first side (31A) of the first PCB (31). In various embodiments, the second joint may not be disposed in the 36th non-conductive area (N36) of the first PCB (31), and the foldable electronic device (1) may have an air vent (e.g., an air vent (AV) of FIG. 9) between the metal cover (5) and the 36th non-conductive area (N36) of the first PCB (31).

[0123] According to various embodiments, a plurality of first joints (e.g., a plurality of first joints (C1) of FIGS. 8 and 9) may substantially include solder (e.g., solder powder particles (91) of FIGS. 8 and 9) of a solder paste (e.g., solder paste (9) of FIGS. 8 and 9) through a soldering process. The metal cover (5) may be electrically and physically connected to the first to 36th conductive pads (P1, P2, P3, ..., and P36) of the first PCB (31) through the plurality of first joints. The first to 36th conductive pads (P1, P2, P3, …, and P36) can form first areas (also called multiple conductive areas or multiple conductive surface areas) on which solder of the solder paste is placed on the first surface (31A) of the first PCB (31).

[0124] According to various embodiments, the first to 36th conductive pads (P1, P2, P3, ..., and P36) of the first PCB (31) may be electrically connected to a ground area (e.g., a ground plane or a ground layer) (not shown separately) included in the first PCB (31). The metal cover (5) may be electrically connected to the ground area of ​​the first PCB (31) through a plurality of first joints (e.g., a plurality of first joints (C1) of FIGS. 8 and 9).

[0125] According to various embodiments, the metal cover (5) may be configured to be in an electrically floating state. The metal cover (5) may be electrically and physically isolated from a surrounding conductor, such as a ground area of ​​the first PCB (31).

[0126] According to various embodiments, the plurality of second joints (e.g., the plurality of first joints (C2) of FIGS. 8 and 9) may include flux (e.g., flux residue) (e.g., flux (92) of FIGS. 8 and 9) of solder paste (solder paste (9) of FIGS. 8 and 9) through a soldering process. The first to 35th non-conductive regions (N1, N2, N3, ..., and N35) of the first PCB (31) may be understood as second regions (also referred to as a plurality of conductive regions or a plurality of conductive surface regions) of the first surface (31A) of the first PCB (31) on which flux of the solder paste is disposed.

[0127] According to various embodiments, the foldable electronic device (1) may include a heat transfer material (e.g., a heat transfer material (6) of FIG. 7) disposed (e.g., filled) between the metal cover (5) and the first PCB (31) to thermally connect one or more electronic components (311) disposed on the first side (31A) of the metal cover (5) and the first PCB (31). Heat emitted from the one or more electronic components (311) may be moved or transferred to the metal cover (5) through the heat transfer material.

[0128] In various embodiments, a plurality of first joints (e.g., a plurality of first joints (C1) of FIGS. 8 and 9) and a plurality of second joints (e.g., a plurality of second joints (C2) of FIGS. 8 and 9) can seal between the metal cover (5) and the first PCB (31) to reduce or prevent leakage of the heat transfer material between the metal cover (5) and the first face (31A) of the first PCB (31) during filling. In various embodiments, an air vent between the metal cover (5) and the 36 non-conductive region (N36) of the first face (31A) of the first PCB (31) can be configured to allow air within the metal cover (5) and the first PCB (31) to be discharged due to a pressure difference during filling of the heat transfer material, thereby allowing smooth filling of the heat transfer material.

[0129] FIG. 6 is a drawing showing a portion of a foldable electronic device (1) according to various embodiments of the present disclosure.

[0130] FIG. 7 is a cross-sectional view of a portion of a foldable electronic device (1) taken along line E-E' of FIG. 6 according to various embodiments of the present disclosure.

[0131] FIG. 8 is a cross-sectional view of a portion of a foldable electronic device (1) taken along line F-F' of FIG. 6 according to various embodiments of the present disclosure.

[0132] FIG. 9 is a cross-sectional view of a portion of a foldable electronic device (1) taken along line G-G' of FIG. 6 according to various embodiments of the present disclosure.

[0133] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed with respect to FIGS. 6, 7, 8, and 9. All combinations of the features described below with respect to FIGS. 6, 7, 8, and 9 may be considered to be encompassed by the present disclosure as specific examples. Descriptions of some components identical to those of the preceding embodiments may not be repeated.

[0134] Referring to FIGS. 6, 7, 8, and 9, the foldable electronic device (1) may include a first PCB (31) and a metal cover (5). The foldable electronic device (1) may include a heat-conducting material (6). The foldable electronic device (1) may include a flexible member (7). The foldable electronic device (1) may include a light-transmitting member (8).

[0135] According to various embodiments, the first PCB (31) may include a first side (31A) and a second side (31B) facing in an opposite direction to the first side (31A). The first side (31A) of the first PCB (31) may face the first back cover (112) (see FIG. 1), and the second side (31B) of the first PCB (31) may face the first support plate (1111) of the first frame (111) (see FIGS. 3 and 4). The foldable electronic device (1) may include a plurality of first electronic components arranged on the first side (31A) of the first PCB (31). The foldable electronic device (1) may include a plurality of second electronic components arranged on the second side (31B) of the first PCB (31).

[0136] According to various embodiments, the first PCB (31) may include one or more electronic components (311) disposed on a first surface (31A) to be covered by a metal cover (5). The one or more electronic components (311) may be disposed (e.g., surface mounted) on the first surface (31A) of the first PCB (31). The first PCB (31) may include one or more conductive pads (also referred to as conductive lands) (312) disposed on the first surface (31A). The foldable electronic device (1) may include one or more conductive joints (313) disposed between the one or more electronic components (311) and the one or more conductive pads (312). The one or more electronic components (311) may be electrically and physically connected to the one or more conductive pads (312) via the one or more conductive joints (313). At least a portion of one or more conductive joints (313) may include a conductive adhesive material (or conductive bonding material) (e.g., solder). One or more conductive pads (312) may be electrically connected to one or more electrical paths (e.g., electrical wires) included in the first PCB (31). A plurality of electrical components including one or more electronic components (311) may exchange signals via the first PCB (31).

[0137] According to various embodiments, a metal cover (5) may be disposed or coupled to a first surface (31A) of the first PCB (31) to cover one or more electronic components (even electrical elements) (311) disposed (e.g., surface-mounted) on the first surface (31A) of the first PCB (31). In various embodiments, the metal cover (5) may be surface-mounted on the first surface (31A) of the first PCB (31). The one or more electronic components (311) may be positioned (e.g., housed) in a space between the first PCB (31) and the metal cover (5). The metal cover (5) may be positioned between the first PCB (31) and the first back cover (112) (see FIG. 1). The metal cover (5) may be configured to reduce or prevent electromagnetic interference (EMI) to the one or more electronic components (311). The metal cover (5) may include an electromagnetic shielding member (e.g., a shield can). The position or number of one or more electronic components (311) is not limited to the illustrated example. The position, shape, or number of the metal cover (5) is not limited to the illustrated example.

[0138] According to various embodiments, the metal cover (5) may be electrically connected to a ground area (e.g., a ground plane or a ground layer) (not shown separately) included in the first PCB (31). The metal cover (5) electrically connected to the ground area of ​​the first PCB (31) may be understood as a part of the ground structure of the foldable electronic device (1) for reducing electromagnetic influence (e.g., EMI) on one or more electronic components (311).

[0139] According to various embodiments, the metal cover (5) may be formed of a metal material such as, but not limited to, titanium, an amorphous alloy, a metal-ceramic composite material (e.g., cermet), stainless steel, magnesium, a magnesium alloy, aluminum, an aluminum alloy, a zinc alloy, or a copper alloy.

[0140] According to various embodiments, the metal cover (5) can reduce or prevent overheating of one or more electronic components (311), thereby reducing or preventing performance degradation or damage to the one or more electronic components (311). The metal cover (5) can be understood as not only an electromagnetic shielding structure for the one or more electronic components (311), but also a part of a heat dissipation structure of the foldable electronic device (1) for the one or more electronic components (311). Heat emitted from the one or more electronic components (311) can move or be transferred to the metal cover (5), and at least a portion of the heat emitted from the one or more electronic components (311) can be diffused, dispersed, and / or dissipated by the metal cover (5). The metal cover (5) can prevent heat emitted from the one or more electronic components (311) from remaining on the one or more electronic components (311) through heat conduction, heat convection, and / or heat radiation.

[0141] According to various embodiments, the metal cover (5) may be thermally connected to a heat spreading member (e.g., a metal sheet such as a graphite sheet, a copper sheet, a heat pipe, or a vapor chamber) (not shown separately) disposed between the first back cover (112) (see FIG. 1) and the metal cover (5). Heat emitted from one or more electronic components (311) may be transferred to the heat spreading member through the metal cover (5). In various embodiments, the foldable electronic device (1) may include a thermal interface material (TIM) (not shown separately) disposed between the metal cover (5) and the heat spreading member to enhance heat transfer performance from the metal cover (5) to the heat spreading member.

[0142] According to various embodiments, the metal cover (5) may include a first portion (51). The first portion (51) may be positioned between the first PCB (31) and the first back cover (112) (see FIG. 1). In various embodiments, the first portion (51) may include a plate that is substantially parallel to the first PCB (31), or a first side (31A) of the first PCB (31). The first portion (51) may include a third side (51A) and a fourth side (51B) that faces substantially opposite to the third side (51A). A third side (51A) of the first portion (51) may be substantially oriented toward the first back cover (112) (see FIG. 1), and a fourth side (51B) of the first portion (51) may be substantially oriented toward the first side (31A) of the first PCB (31). The third side (51A) and the fourth side (51B) of the first portion (51) may be substantially parallel to the first side (31A) of the first PCB (31). A thickness of the first portion (51) (e.g., a thickness in a direction parallel to the z-coordinate axis) may be substantially constant over the entire area of ​​the first portion (51).

[0143] According to various embodiments, although not shown separately, the first thickness of a portion of the first part (51) of the metal cover (5) in a direction parallel to the direction in which the first surface (31A) of the first PCB (31) faces may be implemented differently from the second thickness of another portion of the first part (51) of the metal cover (5).

[0144] According to various embodiments, although not shown separately, in the direction in which the first surface (31A) of the first PCB (31) faces, a first distance by which a portion of the first part (51) of the metal cover (5) is spaced apart from the first surface (31A) of the first PCB (31) may be implemented differently from a second distance by which another portion of the first part (51) of the metal cover (5) is spaced apart from the first surface (31A) of the first PCB (31).

[0145] According to various embodiments, the first portion (51) of the metal cover (5) may be spaced apart from the first surface (31A) of the first PCB (31) in a direction that the first surface (31A) faces (e.g., in the negative direction of the z-coordinate axis) so as to be physically spaced from one or more electronic components (311).

[0146] According to various embodiments, although not shown separately, the first portion (51) of the metal cover (5) may be configured to contact at least one of the one or more electronic components (311), but not substantially pressurize the at least one electronic component. Heat emitted from the at least one electronic component may be directly transferred to the first portion (51) of the metal cover (5).

[0147] According to various embodiments, the metal cover (5) may include a second portion (52) extending from the first portion (51). The second portion (52) may, for example, extend from the edge of the first portion (51) toward the first side (31A) of the first PCB (31). The second portion (52) may be provided (or formed) in the form of a side wall that is substantially perpendicular to the first portion (51). The second portion (52) may be referred to as a side wall of the metal cover (5). The first portion (51) of the metal cover (5) may be supported by the second portion (52) of the metal cover (5) and spaced apart from the first side (31A) of the first PCB (31).

[0148] According to various embodiments, the second portion (52) of the metal cover (5) may be physically separated from one or more electronic components (311).

[0149] According to various embodiments, the second part (52) of the metal cover (5) may be disposed or coupled to the first side (31A) of the first PCB (31). The foldable electronic device (1) may include a joint (C) disposed between the second part (52) of the metal cover (5) and the first side (31A) of the first PCB (31). The metal cover (5) may be electrically and / or physically connected to the first PCB (31) through the joint (C). In various embodiments, the metal cover (5) may be electrically connected to a ground area of ​​the first PCB (31) through the joint (C).

[0150] According to various embodiments, the metal cover (5) may be placed or joined to the first side (31A) of the first PCB (31) through a soldering process. During the soldering process, the solder paste may melt and flow and then solidify, thereby forming a joint (C) connecting the metal cover (5) and the first side (31A) of the first PCB (31). In various embodiments, the solder powder included in the solder paste may include, but is not limited to, SAC305. SAC305 may include, for example, about 96.5% tin (Sn), about 3% silver (Ag), and about 0.5% copper (Cu). The temperature profile during the soldering process may include, for example, a temperature rising section, a preheating section, a main heating section, and a cooling section.

[0151] According to various embodiments, as a condition for forming a joint (C) between a metal cover (5) and a first PCB (31), in the preheating section of the soldering process, the preheating start temperature is about 140 degrees (℃) to about 150 degrees, the preheating end temperature (also called peak temperature) is about 200 degrees to about 250 degrees, and the preheating time may be about 60 seconds to about 120 seconds, but is not limited thereto.

[0152] According to various embodiments, as a condition for forming a joint (C) between the metal cover (5) and the first PCB (31), in the main heating section of the soldering process, the heating start temperature may be about 200 degrees, the heating end temperature may be about 220 degrees, and the heating time may be about 45 to 90 seconds, but is not limited thereto.

[0153] According to various embodiments, as a condition for forming a joint (C) between the metal cover (5) and the first PCB (31), the oxygen concentration in the chamber during the soldering process may be about 1000 ppm (parts per million) to about 3000 ppm, but is not limited thereto.

[0154] According to various embodiments, the first PCB (31) may include a plurality of first to 36th conductive pads (P1, P2, P3, …, and P36) (see FIGS. 5, 8, and 9) arranged on a first surface (31A). The first surface (31A) of the first PCB (31) may include first to 36th non-conductive regions (N1, N2, N3, …, and N36) (see FIGS. 5, 8, and 9) between the first to 36th conductive pads (P1, P2, P3, …, and P36) (see FIGS. 5, 8, and 9).

[0155] According to various embodiments, the joint (C) connecting the metal cover (5) and the first side (31A) of the first PCB (31) through a soldering process may include a plurality of first joints (C1) and a plurality of second joints (C2). The plurality of first joints (C1) are arranged between the second part (52) of the metal cover (5) and the first to 36th conductive pads (P1, P2, P3, ..., and P36) of the first PCB (31) (see FIGS. 5, 8, and 9), and may connect the second part (52) of the metal cover (5) and the first to 36th conductive pads (P1, P2, P3, ..., and P36) of the first PCB (31). A plurality of second joints (C2) are arranged between the second part (52) of the metal cover (5) and the first to 35th non-conductive regions (N1, N2, N3, …, and N35) of the first PCB (31) (see FIGS. 5, 8, and 9), and can connect the second part (52) of the metal cover (5) and the first to 35th non-conductive regions (N1, N2, N3, …, and N35) of the first PCB (31). A plurality of second joints (C2) are arranged between the plurality of first joints (C1), and can connect between the plurality of first joints (C1).

[0156] According to various embodiments, the plurality of first joints (C1) may substantially include solder powder particles (91) of the solder paste (9) through a soldering process. The plurality of first joints (C1) may be understood as conductive joints. In various embodiments, the plurality of first joints (C1) may include a relatively large amount of solder powder particles (91) compared to the flux (92) of the solder paste (9). The plurality of first joints (C1) may include, for example, about 95% or more of the solder powder particles (91), but is not limited thereto. In various embodiments, the soldering process can be configured such that solder powder particles (91) of the solder paste (9) can be smoothly disposed between the second portion (52) of the metal cover (5) and the first to 36th conductive pads (P1, P2, P3, ..., and P36) of the first PCB (31) (see FIGS. 5, 8, and 9).

[0157] According to various embodiments, the plurality of second joints (C2) may include a flux (92) of the solder paste (9) through the soldering process. The plurality of second joints (C2) may substantially not include solder powder particles (91) of the solder paste (9). The plurality of second joints (C2) may be understood as non-conductive joints. In various embodiments, the soldering process may be configured such that the flux (92) of the solder paste (9) can be smoothly disposed between the second portion (52) of the metal cover (5) and the first to 35th non-conductive regions (N1, N2, N3, ..., and N35) of the first PCB (31) (see FIGS. 5, 8, and 9).

[0158] According to various embodiments, a plurality of first joints (C1) and a plurality of second joints (C2) can seal between a second portion (52) of a metal cover (5) and a first side (31A) of a first PCB (31).

[0159] According to various embodiments, the second joint (i.e., the plus (92) of the solder paste (9)) may not be disposed in the 36th non-conductive area (N36) of the first side (31A) of the first PCB (31), thereby forming a gap between the second part (52) of the metal cover (5) and the 36th non-conductive area (N36) of the first side (31A) of the first PCB (31). The gap between the second part (52) of the metal cover (5) and the 36th non-conductive area (N36) of the first side (31A) of the first PCB (31) may be an air vent (AV) (see FIG. 9). The position or number of the air vents (AV) is not limited to the illustrated example. In various embodiments, the air vent (AV) may be provided (or formed) corresponding to any one of the first to 36 non-conductive areas (N1, N2, N3, …, and N36) of the first surface (31A) of the first PCB (31).

[0160] According to various embodiments, the second portion (52) of the metal cover (5) may include a notch (503). When the metal cover (5) and the first PCB (31) are joined through the joint (C), the notch (503) of the metal cover (5) may be aligned with the 36th non-conductive area (N36) of the first side (31A) of the first PCB (31). The notch (503) of the metal cover (5) may expand the size of the air vent (AV) compared to an example in which the notch (503) is omitted (not shown separately), thereby facilitating smoother air discharge.

[0161] According to various embodiments, the notch (503) of the metal cover (5) may have a width (W1) that substantially matches the 36th non-conductive region (N36) of the first side (31A) of the first PCB (31). The width (W1) of the notch (503) may, for example, correspond to a separation distance between the first conductive pad (P1) and the 36th conductive pad (P36). The width (W1) of the notch (503) may be, for example, about 0.5 mm (millimeter) to about 10 mm, but is not limited thereto. In various embodiments, although not separately illustrated, the width (W1) of the notch (503) may be provided (or formed) differently from the 36th non-conductive region (N36) of the first side (31A) of the first PCB (31).

[0162] According to various embodiments, the depth (W2) of the notch (503) of the metal cover (5) in the direction in which the first surface (31A) of the first PCB (31) faces (e.g., in the negative direction of the z-coordinate axis) may be about 0.2 mm to about 0.8 mm, but is not limited thereto.

[0163] According to various embodiments, if air discharge is smooth even when the notch (503) is omitted, the second part (52) of the metal cover (5) may be provided (or formed) in a form in which the notch (503) is omitted.

[0164] According to various embodiments, although not shown separately, the metal cover (5) may include a through hole as an air vent (AV) in place of the notch (503). The through hole may be provided (or formed) in the first portion (51) or the second portion (52) of the metal cover (5).

[0165] According to various embodiments, a heat transfer material (6) may be disposed (e.g., filled) between the metal cover (5) and the first PCB (31) to thermally connect the metal cover (5) and one or more electronic components (311). Heat emitted from the one or more electronic components (311) may be transferred or moved to the metal cover (5) through the heat transfer material (6). The heat transfer material (6) may serve as a medium or intermediate material for indirect heat conduction between the one or more electronic components (311) and the metal cover (5). Indirect thermal conduction between one or more electronic components (311) and the metal cover (5) may include direct thermal conduction in which heat is transferred from one or more electronic components (311) to the thermal conduction material (6) through direct (or physical) contact between the one or more electronic components (311) and the thermal conduction material (6), and direct thermal conduction in which heat is transferred from the thermal conduction material (6) to the metal cover (5) through direct (or physical) contact between the thermal conduction material (6) and the metal cover (5).

[0166] According to various embodiments, the first portion (51) of the metal cover (5) may be configured to physically contact at least one of the one or more electronic components (311), but not substantially pressurize the at least one electronic component.

[0167] According to various embodiments, a joint (C) comprising a plurality of first joints (C1) and a plurality of second joints (C2) can reduce or prevent heat transfer material (6) from leaking between a metal cover (5) and a first PCB (31).

[0168] According to various embodiments, the metal cover (5) may include a first hole (also referred to as a first opening) (501) formed (or provided) in the first portion (511). The first hole (501) may, for example, penetrate the third side (51A) and the fourth side (51B) of the first portion (51). The first hole (501) of the metal cover (5) may allow a heat transfer material (6) to be injected between the metal cover (5) and the first PCB (31). The heat transfer material (6) may be injected between the metal cover (5) and the first PCB (31) through a tip (e.g., a nozzle) of an injector (not shown separately) positioned in the first hole (501) of the metal cover (5). The heat transfer material (6) may be provided in a liquid state having fluidity. The heat transfer material (6) may have properties (e.g., viscosity and / or modulus) that allow it to flow smoothly between the metal cover (5) and the first PCB (31) and to be in close contact with the metal cover (5) and one or more electronic components (311).

[0169] According to various embodiments, when viewed from above on the first side (31A) of the first PCB (31), the first hole (501) of the metal cover (5) may be circular. The first hole (501) may have a diameter of, for example, about 1.2 mm to about 2.2 mm, but is not limited thereto. In various embodiments, although not separately illustrated, the first hole (501) may be oval or polygonal.

[0170] According to various embodiments, the heat transfer material (6) may include a thermal interface material (TIM). The TIM may include, but is not limited to, thermal grease, thermal paste, thermal compound, or heat transfer paste (HTP), for example.

[0171] According to various embodiments, a flexible member (also referred to as a cap) (7) may be disposed or coupled to a first portion (51) of the metal cover (5) corresponding to a first hole (501) of the metal cover (5). In various embodiments, the flexible member (7) may be coupled (e.g., attached) to a third side (51A) of the metal cover (5) via a first adhesive member (or first bonding member) (701) disposed between the flexible member (7) and the metal cover (5). The first adhesive member (701) may include, but is not limited to, a double-sided tape or an adhesive layer for bonding, for example. When viewed from above the first back cover (112) (see FIG. 1), the flexible member (7) may overlap the first hole (501) of the metal cover (5). In various embodiments, the flexible member (7) may include a cutout (71). The cutout (71) of the flexible member (7) may include at least one cut line (also referred to as a cutting line). The cutout (71) of the flexible member (7) may be aligned with (or overlapped with) the first hole (501) of the metal cover (5) when viewed from above the third side (51A) of the metal cover (5). The first adhesive member (701) may include an opening aligned with the first hole (501) of the metal cover (5) and the cutout (71) of the flexible member (7). The first hole (501) of the metal cover (5) and the cutout (71) of the flexible member (7) may allow the thermal transfer material (6) to be injected between the metal cover (5) and the first PCB (31). The heat transfer material (6) can be injected between the metal cover (5) and the first PCB (31) through the tip (e.g., nozzle) of an injector (not shown separately) positioned in the first hole (501) of the metal cover (5) through the cutout (71) of the flexible member (7).When the tip of the injector is positioned in the first hole (501) of the metal cover (5) to inject the heat transfer material (6), the flexible member (7) can reduce or prevent the heat transfer material (6) from flowing back and leaking between the tip of the injector and the first hole (501) of the metal cover (5). The cut portion (71) of the flexible member (7) can be configured to resiliently close the gap when the tip of the injector is separated. When the injector is separated after the heat transfer material (6) is filled between the metal cover (5) and the first PCB (31), the cut portion (71) of the flexible member (7) can be restored to resiliently close the gap so as to reduce or prevent the heat transfer material (6) from leaking.

[0172] According to various embodiments, the cut portion (71) of the flexible member (7) may include cut lines intersecting each other in a cross shape. The cut lines may be, for example, about 1.2 mm to about 2.0 mm, but are not limited thereto. Although not specifically illustrated, the cut portion (71) may have various shapes, such as a "*", a "Y", or a "-" shape.

[0173] According to various embodiments, the cut portion (71) of the flexible member (7) may be formed through a mold (e.g., a blade mold) including a blade corresponding to at least one cut line of the cut portion (71), but is not limited thereto.

[0174] According to various embodiments, the flexible member (7) may be formed of silicone, but is not limited thereto. In various embodiments, the flexible member (7) may be formed of rubber.

[0175] According to various embodiments, the first portion (51) of the metal cover (5) may include a first recess (not shown separately) corresponding to the flexible member (7). The flexible member (7) may be coupled to the first recess via a first adhesive member (701). The flexible member (7) may be inserted into the first recess. The first recess allows the combination of the first portion (51) of the metal cover (5), the flexible member (7), and the first adhesive member (701) to have a slim structure, while allowing the flexible member (7) to be stably placed in the first portion (51) of the metal cover (5).

[0176] According to various embodiments, the flexible member (7) may be a flexible pad having a substantially constant thickness. The flexible member may be a square pad, but is not limited thereto. The flexible member (7) may have a thickness of, for example, about 0.1 mm, but is not limited thereto. The first adhesive member (701) may have a thickness of, for example, about 0.1 mm, but is not limited thereto.

[0177] In various embodiments, the position or number of the first hole (501) of the metal cover (5) and the flexible member (7) corresponding to the first hole (501) are not limited to the illustrated example. In various embodiments, although not illustrated separately, the first hole (501) may be formed (or provided) in the second portion (52) of the metal cover (5).

[0178] According to various embodiments, the flexible member (7) and the first adhesive member (701) disposed between the flexible member (7) and the metal cover (5) may have heat resistance that can reduce or prevent deformation and / or breakage during a soldering process. The flexible member (7) and / or the first adhesive member (701) may have heat resistance that can reduce or prevent deformation and / or breakage under conditions such as, for example, a temperature of about 220 degrees Celsius or higher (e.g., about 245 degrees Celsius as a peak temperature) for about 1 minute or longer.

[0179] According to various embodiments, although not separately illustrated, the foldable electronic device (1) may further include a metal plate (e.g., also referred to as a metal pad) disposed between the first adhesive member (701) and the first portion (51) of the metal cover (5). The metal plate may include an opening aligned with the first hole (501) of the metal cover (5). The metal plate may be joined to the metal cover (5) through welding (e.g., electron beam welding (EBW)). The metal material included in the metal cover (5) and the metal material included in the metal plate may be determined so as to reduce the occurrence of burrs during welding. The metal plate may be formed of copper, but is not limited thereto. The metal plate may be formed of a different metal material from that of the metal cover (5). The melting point of the metal material included in the metal cover (5) and the melting point of the metal material included in the metal plate may be different. In various embodiments, the melting point of the metal material included in the metal cover (5) may be higher than the melting point of the metal material included in the metal plate. In various embodiments, the metal plate may be formed of the same metal material as the metal cover (5).

[0180] According to various embodiments, the metal cover (5) may include a first hole (501) and a second hole (also referred to as a second opening) (502) spaced apart from the air vent (AV). The second hole (502) may be provided (or formed) in the first portion (51) of the metal cover (5). In various embodiments, the light-transmitting member (8) may be coupled (e.g., attached) to the third side (51A) of the first portion (51) of the metal cover (5) corresponding to the second hole (502) of the metal cover (5). When viewed from above the third side (51A) of the metal cover (5), the light-transmitting member (8) may overlap the second hole (502) of the metal cover (5). The light-transmitting member (8) may block the second hole (502) of the metal cover (5). The light-transmitting member (8) can be coupled (e.g., attached) to the third side (51A) of the metal cover (5) via a second adhesive member (or second bonding member) (not shown separately) disposed between the light-transmitting member (8) and the metal cover (5). The second adhesive member may include, but is not limited to, a double-sided tape or an adhesive layer for bonding. In various embodiments, the second adhesive member may include an opening aligned with the second hole (502) of the metal cover (5) and the light-transmitting member (8). The light-transmitting member (8) may include, for example, a transparent member or a translucent member.

[0181] According to various embodiments, when viewed from above the first side (31A) of the first PCB (31), the second hole (502) of the metal cover (5) may be circular. The second hole (502) may have a diameter of, for example, about 1.2 mm to about 2.2 mm, but is not limited thereto. In various embodiments, although not separately illustrated, the second hole (502) may be oval or polygonal.

[0182] According to various embodiments, the light-transmitting member (8) may be a rectangular plate having a substantially constant thickness, but is not limited thereto.

[0183] According to various embodiments, the light-transmitting member (8) can visually confirm whether the heat-conducting material (6) is filled without defects between the metal cover (5) and the first PCB (31). For example, when the heat-conducting material (6) overlaps the entire second hole (502) of the metal cover (5) when viewed from above on the third side (51A) of the metal cover (5), it can be understood that the filling of the heat-conducting material (6) between the metal cover (5) and the first PCB (31) has been performed without defects. In various embodiments, the relative position of the second hole (502) of the metal cover (5) with respect to the first hole (501) of the metal cover (5) can be determined so that the filling of a specified amount of the heat-conducting material (6) can be confirmed. In various embodiments, the fact that the heat transfer material (6) is filled between the metal cover (5) and the first PCB (31) without defects may be understood as a state in which one or more electronic components (311) are thermally connected to the metal cover (5) (e.g., the first part (51) of the metal cover (5)) through the heat transfer material (6) at a level capable of securing heat transfer performance. In various embodiments, the fact that the heat transfer material (6) is filled between the metal cover (5) and the first PCB (31) without defects may be understood as a state in which a hot spot including at least one electronic component among the one or more electronic components (311) that substantially requires heat generation control is thermally connected to the metal cover (5) (e.g., the first part (51) of the metal cover (5)) through the heat transfer material (6) at a level capable of securing heat transfer performance. In various embodiments, the hot spot may include at least one processor (e.g., the processor (1520) of FIG. 15). At least one processor may include, for example, an application processor (AP). At least one processor may include, for example, a processor assembly including one or more processing circuits.At least one processor may be implemented as a system on chip (SoC) (e.g., a single chip or chipset). The at least one processor may be implemented as, for example, multiple cores (or at least one core circuit), multiple chips, or multiple chipsets. The at least one processor may include, for example, one or more processing circuits configured to individually and / or collectively perform various functions. The at least one processor may include, for example, a central processing unit (CPU), a graphics processing unit (GPU), an NPU, an image signal processor (ISP), a display controller, a memory controller, a storage controller, a communication processor (CP), and / or a sensor interface. In various embodiments, the hot spot may include wireless communication circuitry (also referred to as a wireless communication module). The wireless communication circuitry may include, for example, a radio-frequency integrated circuit (RFIC). In various embodiments, the hot spot may include power management circuitry (also referred to as a power management module). The power management circuit may include, for example, a power management integrated circuit (PMIC). The electronic components included in the hot spot may also vary.

[0184] According to various embodiments, the first hole (501) and the second hole (502) of the metal cover (5) may overlap the hot spot when viewed from above the third side (51A) of the metal cover (5). In various embodiments, the first hole (501) of the metal cover (5) may overlap the center of the hot spot, and the second hole (502) of the metal cover (5) may overlap the periphery of the hot spot surrounding the center of the hot spot.

[0185] According to various embodiments, the first part (51) of the metal cover (5) may include a second recess (not shown separately) corresponding to the light-transmitting member (8). The light-transmitting member (8) may be coupled to the second recess via a second adhesive member. The light-transmitting member (8) may be inserted into the second recess. The second recess allows the combination of the first part (51) of the metal cover (5), the light-transmitting member (8), and the second adhesive member to have a slim structure, while allowing the light-transmitting member (8) to be stably positioned in the first part (51) of the metal cover (5).

[0186] According to various embodiments, although not separately illustrated, a structure (e.g., a heat dissipation structure) including a metal cover (5), a heat-conducting material (6), a flexible member (7), and / or a light-transmitting member (8) for one or more electronic components (311) disposed on a first side (31A) of a first PCB (31) may be implemented for one or more electronic components disposed on a second side (31B) of the first PCB (31) in a manner substantially at least partially identical or similar.

[0187] According to various embodiments, although not separately illustrated, a structure (e.g., a heat dissipation structure) including a metal cover (5), a heat-conducting material (6), a flexible member (7), and / or a light-transmitting member (8) for one or more electronic components (311) disposed on a first surface (31A) of a first PCB (31) may be implemented as a heat dissipation structure for one or more electronic components disposed on a second PCB (32) (see FIG. 4) in a manner substantially at least partially identical or similar.

[0188] According to various embodiments, although not separately illustrated, a structure (e.g., a heat dissipation structure) including a metal cover (5), a heat-conducting material (6), a flexible member (7), and / or a light-transmitting member (8) for one or more electronic components (311) disposed on a first surface (31A) of a first PCB (31) may be implemented as a heat dissipation structure for one or more electronic components disposed on a third PCB (33) (see FIG. 4) in a manner substantially at least partially identical or similar.

[0189] According to various embodiments, although not separately illustrated, a structure (e.g., a heat dissipation structure) including a metal cover (5), a heat-conducting material (6), a flexible member (7), and / or a light-transmitting member (8) for one or more electronic components (311) disposed on a first surface (31A) of a first PCB (31) may be implemented as a heat dissipation structure for one or more electronic components disposed on a fourth PCB (34) (see FIG. 4) in a manner substantially at least partially identical or similar.

[0190] FIG. 10 is a cross-sectional view showing a metal cover (5), a first PCB (31), and solder paste (9) during reflow soldering, in relation to FIG. 8, according to various embodiments of the present disclosure. Descriptions of some components that are the same as those in the previous embodiments may not be repeated.

[0191] Referring to FIG. 10, during a soldering process, a metal cover (5) and a first PCB (31) may be positioned within a chamber (not shown separately), and solder paste (9) may be placed between the metal cover (5) and the first PCB (31). The solder paste (9) may be placed between a second portion (52) of the metal cover (5) and a plurality of first to 36th conductive pads (P1, P2, P3, ..., and P36) of the first PCB (31) (see FIGS. 5 and 10).

[0192] According to various embodiments, the solder paste (9) may be separated into a plurality of partial solder pastes and placed between the second portion (52) of the metal cover (5) and the plurality of first to 36th conductive pads (P1, P2, P3, ..., and P36) (see FIGS. 5 and 10) of the first PCB (31). In various embodiments, as a condition for forming a joint (C) (see FIG. 7) including a plurality of first joints (C1) (see FIGS. 8 and 9) and a plurality of second joints (C2) (see FIGS. 8 and 9) when an operation of controlling a temperature within a chamber according to a temperature profile is performed, in a direction orthogonal to the first PCB (31), the plurality of partial solder pastes may overlap two adjacent conductive pads and a non-conductive region between two adjacent conductive pads, respectively. A plurality of partial solder pastes may be disposed across a non-conductive region between two adjacent conductive pads, respectively. In various embodiments, the plurality of first through 36th conductive pads (P1, P2, P3, ..., and P36) (see FIGS. 5 and 10) may include a plurality of conductive planar regions (1000) that form a portion of a substantially flat first surface (31A) (see FIG. 6) together with the plurality of first through 36th non-conductive regions (N1, N2, N3, ..., and N36) (see FIGS. 5 and 10). The plurality of conductive planar regions (1000) and the plurality of first through 36th non-conductive regions (N1, N2, N3, ..., and N36) (see FIGS. 5 and 10) may form a pattern on the first PCB (31) on which the joint (C) (see FIG. 7) is disposed. The joint portion (C) (see FIG. 7) may extend from one side of the air vent (AV) (see FIG. 9) along the pattern to the other side. The plurality of first joint portions (C1) (see FIGS. 8 and 9) and the plurality of second joint portions (C2) (see FIGS. 8 and 9) may be formed at substantially the same height.In various embodiments, the plurality of conductive planar regions (1000) may protrude relative to the plurality of first to 36th non-conductive regions (N1, N2, N3, ..., and N36) (see FIGS. 5 and 10). The plurality of first joints (C1) (see FIGS. 8 and 9) may be formed at a lower height than the plurality of second joints (C2) (see FIGS. 8 and 9).

[0193] Hereinafter, in order to understand the relative positions between the plurality of first to 36th conductive pads (P1, P2, P3, …, and P36) (see FIGS. 5 and 10) and the plurality of partial solder pastes, reference will be made to three conductive pads arranged in sequence, namely, a fourteenth conductive pad (P14), a fifteenth conductive pad (P15), and a sixteenth conductive pad (P16).

[0194] According to various embodiments, the fifteenth conductive pad (P15) may extend to a length of a first value (L1). The fifteenth conductive pad (P15) and the sixteenth conductive pad (P16) may be spaced apart from each other by a distance of a second value (L2). When viewed from above on the first side (31A) of the first PCB (31) (see FIG. 6), the first portion of solder paste (1011) overlapping the fourteenth conductive pad (P14) and the fifteenth conductive pad (P15) may extend to a length of a third value (L3). When viewed from above on the first side (31A) of the first PCB (31) (see FIG. 6), the second partial solder paste (1012) overlapping the fifteenth conductive pad (P15) and the sixteenth conductive pad (P16) can be spaced apart from the first partial solder paste (1011) overlapping the fourteenth conductive pad (P14) and the fifteenth conductive pad (P15) by a distance of the fourth value (L4). The length of the first value (L1), the distance of the second value (L2), the length of the third value (L3), and the distance of the fourth value (L4) may correspond to a partial pattern formed by the fourteenth conductive pad (P14), the fourteenth non-conductive region (N14), the fifteenth conductive pad (P15), the fifteenth non-conductive region (N15), and the sixteenth conductive pad (P16) among the patterns on the first PCB (31) on which the joint (C) (see FIG. 7) is arranged. In the illustrated example, the partial pattern may be a straight section, and the length of the first value (L1), the distance of the second value (L2), the length of the third value (L3), and the distance of the fourth value (L4) may correspond to a straight direction of the straight section. Although not shown separately, the partial pattern may be a curved section, and the length of the first value (L1), the distance of the second value (L2), the length of the third value (L3), and the distance of the fourth value (L4) may correspond to the curve direction of the curved section.

[0195] According to various embodiments, when an operation of controlling the temperature within a chamber according to a temperature profile is performed, as a condition for forming a joint (C) (see FIG. 7) including a plurality of first joints (C1) (see FIGS. 8 and 9) and a plurality of second joints (C2) (see FIGS. 8 and 9), a fourth center line (1024) of a separation distance of a fourth value (L4) and a first center line (1021) of a fifteenth conductive pad (P15) of a first value (L1) in a direction orthogonal to the first PCB (31) can substantially coincide. The fourth center line (1024) of the separation distance of the fourth value (L4) is parallel to the direction perpendicular to the first PCB (31) and may be positioned between the first partial solder paste (1011) and the second partial solder paste (1012) at the same distance (e.g., half of the fourth value (L4)) from the first partial solder paste (1011) and the second partial solder paste (1012). The first center line (1021) of the fifteenth conductive pad (P15) of the first value (L1) is parallel to the direction perpendicular to the first PCB (31) and may indicate the center position of the fifteenth conductive pad (P15). The first center line (1021) of the 15th conductive pad (P15) may be positioned between one end and the other end of the 15th conductive pad (P15) at the same distance (e.g., half of the first value (L1)) from one end and the other end of the 15th conductive pad (P15).

[0196] According to various embodiments, as a condition for forming a joint (C) (see FIG. 7) including a plurality of first joints (C1) (see FIGS. 8 and 9) and a plurality of second joints (C2) (see FIGS. 8 and 9) when an operation of controlling a temperature within a chamber according to a temperature profile is performed, a third center line (1023) of the first partial solder paste (1011) of the third value (L3) and a second center line (1022) of the separation distance of the second value (L2) may be substantially aligned in a direction perpendicular to the first PCB (31). The third center line (1023) of the first partial solder paste (1011) of the third value (L3) may be parallel to the direction perpendicular to the first PCB (31) and may indicate a center position of the first partial solder paste (1011). The third center line (1023) of the first partial solder paste (1011) may be positioned between one end and the other end of the first partial solder paste (1011) at the same distance (e.g., half of the third value (L3)) from one end and the other end of the first partial solder paste (1011). The second center line (1022) of the separation distance of the second value (L2) may be parallel to the direction perpendicular to the first PCB (31) and may be positioned between the fifteenth conductive pad (P15) and the sixteenth conductive pad (P16) at the same distance (e.g., half of the second value (L2)) from the fifteenth conductive pad (P15) and the sixteenth conductive pad (P16).

[0197] According to various embodiments, as a condition for forming a joint (C) (see FIG. 7) including a plurality of first joints (C1) (see FIGS. 8 and 9) and a plurality of second joints (C2) (see FIGS. 8 and 9) when an operation of controlling the temperature within a chamber according to a temperature profile is performed, the ratio of the first value (L1) and the second value (L2) can be formed to be about 5:1 or about 2:1.

[0198] According to various embodiments, the extended length of at least one of two adjacent first joints among the plurality of first joints (C1) (see FIGS. 8 and 9) may have substantially a first value (L1). The separation distance between two adjacent first joints among the plurality of first joints (C1) (see FIGS. 8 and 9) may have substantially a second value (L2). The ratio of the first value (L1) and the second value (L2) may be formed to be about 5:1 or about 2:1.

[0199] According to various embodiments, as a condition for forming a joint (C) (see FIG. 7) including a plurality of first joints (C1) (see FIGS. 8 and 9) and a plurality of second joints (C2) (see FIGS. 8 and 9) when an operation of controlling the temperature within the chamber according to a temperature profile is performed, the ratio of the third value (L3) and the fourth value (L4) can be formed to be about 5:1 or about 2:1.

[0200] According to various embodiments, the first joint disposed on the fifteenth conductive pad (P15) may have a length of substantially the first value (L1), and the first joint disposed on the fifteenth conductive pad (P15) and the other first joint disposed on the sixteenth conductive pad (P16) may be spaced apart by a distance of the second value (L2).

[0201] According to various embodiments, the first value (L1) may be, but is not limited to, about 0.5 mm to about 5.0 mm.

[0202] According to various embodiments, the second value (L2) may be, but is not limited to, about 0.3 mm to 1.0 mm.

[0203] According to various embodiments, the third value (L3) may be, but is not limited to, about 0.5 mm to about 5.5 mm.

[0204] According to various embodiments, the fourth value (L4) may be, but is not limited to, about 0.25 mm to about 1.0 mm.

[0205] FIG. 11 is a cross-sectional view showing a metal cover (5), a first PCB (31), and solder paste (9) during reflow soldering, in relation to FIG. 8, according to various embodiments of the present disclosure. Descriptions of some components that are the same as those in the previous embodiments may not be repeated.

[0206] Referring to FIG. 11, during a soldering process, a metal cover (5) and a first PCB (31) may be positioned within a chamber (not shown separately), and solder paste (9) may be placed between the metal cover (5) and the first PCB (31). The solder paste (9) may be placed between a second portion (52) of the metal cover (5) and a plurality of first to 36th conductive pads (P1, P2, P3, ..., and P36) of the first PCB (31) (see FIGS. 5 and 11). In various embodiments, the solder paste (9) may not overlap with the notch (503) of the metal cover (5) and the 36th non-conductive region (N36) of the first PCB (31) in a direction perpendicular to the first PCB (31).

[0207] FIG. 12 is a cross-sectional view of a portion of a foldable electronic device (1) taken along line E-E' of FIG. 6 according to various embodiments of the present disclosure.

[0208] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed in connection with FIG. 12. All combinations of the features described below in connection with FIG. 12 may be considered to be encompassed by the present disclosure as specific examples.

[0209] Referring to FIG. 12, the foldable electronic device (1) may include a first PCB (31), one or more electronic components (311), a metal cover (5), a heat-conducting material (6), and a flexible member (7). The foldable electronic device (1) may include a metal plate (1200) (e.g., a metal pad). Descriptions of some components that are the same as those in the previous embodiment may not be repeated.

[0210] According to various embodiments, a metal plate (1200) may be disposed between a flexible member (7) and a first portion (51) of a metal cover (5). The metal plate (1200) may include an opening aligned with a first hole (501) of the metal cover (5). The flexible member (7) may be joined to the metal plate (1200) via an adhesive material (e.g., the first adhesive material (701) of FIG. 7 ). The metal plate (1200) may be joined to the first portion (51) of the metal cover (5) via welding (e.g., electron beam welding (EBW)). The metal material included in the metal cover (5) and the metal material included in the metal plate (1200) may be determined to reduce the occurrence of burrs during welding. The metal plate (1200) may be formed of copper, but is not limited thereto. The metal plate (1200) may be formed of a different metal material than the metal cover (5). The melting point of the metal material included in the metal cover (5) and the melting point of the metal material included in the metal plate (1200) may be different. In various embodiments, the melting point of the metal material included in the metal cover (5) may be higher than the melting point of the metal material included in the metal plate (1200). In various embodiments, the metal plate (1200) may be formed of the same metal material as the metal cover (5).

[0211] According to various embodiments, the flexible member (7) may be a flexible pad having a substantially constant thickness. The flexible member (7) may have a thickness of, for example, about 0.1 mm, but is not limited thereto. The metal plate (1200) may have a thickness of, for example, about 0.1 mm, but is not limited thereto.

[0212] FIG. 13 is a cross-sectional view of a portion of a foldable electronic device (1) taken along line E-E' of FIG. 6 according to various embodiments of the present disclosure.

[0213] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed in connection with FIG. 13. All combinations of the features described below in connection with FIG. 13 may be considered to be encompassed by the present disclosure as specific examples.

[0214] Referring to FIG. 13, the foldable electronic device (1) may include a first PCB (31), one or more electronic components (311), a metal cover (5), a heat-conducting material (6), a flexible member (7), and / or a metal plate (1200) (e.g., a metal pad). Descriptions of some components that are the same as those in the previous embodiment may not be repeated.

[0215] According to various embodiments, a portion of the first portion (51) of the metal cover (5) overlapping the metal plate (1200) in a direction perpendicular to the first PCB (31) may be provided (or formed) in a protruding shape in a direction toward the first surface (31A) of the first PCB (31) to reduce or prevent a burr (1300) that may be formed during welding of the metal plate (1200) and the first portion (51) of the metal cover (5) from shorting one or more components (311) disposed on the first surface (31A) of the first PCB (31) or pressurizing one or more electronic components (311).

[0216] FIG. 14 is a cross-sectional view of a portion of a foldable electronic device (1) taken along line E-E' of FIG. 6 according to various embodiments of the present disclosure.

[0217] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed in connection with FIG. 14. All combinations of the features described below in connection with FIG. 14 may be considered to be encompassed by the present disclosure as specific examples.

[0218] Referring to FIG. 14, the foldable electronic device (1) may include a first PCB (31), one or more electronic components (311), a metal cover (5), a heat transfer material (6), a flexible member (7), and / or a metal plate (1200) (e.g., a metal pad). Descriptions of some components that are the same as those in the previous embodiment may not be repeated.

[0219] According to various embodiments, for slimming, a part of the first part (51) of the metal cover (5) overlapping the metal plate (1200) in a direction perpendicular to the first PCB (31) may be provided (or formed) in a recessed form in the direction in which the second surface (31B) of the first PCB (31) faces.

[0220] According to various embodiments, although not shown separately, the technical features of the present disclosure can be applied to electronic devices of other external shapes (e.g., a bar type electronic device, a plate type electronic device, a slidable electronic device, a stretchable electronic device, or a rollable electronic device) that are not limited to the foldable electronic device (1).

[0221] FIG. 15 is a block diagram of an electronic device (1501) within a network environment (1500) according to various embodiments of the present disclosure.

[0222] Referring to FIG. 15, in a network environment (1500), an electronic device (1501) may communicate with an external electronic device (1502) via a first network (1598) (e.g., a short-range wireless communication network), or may communicate with at least one of an external electronic device (1504) or a server (1508) via a second network (1599) (e.g., a long-range wireless communication network). The electronic device (1501) may communicate with the external electronic device (1504) via the server (1508). The electronic device (1501) may include a processor (1520), a memory (1530), an input module (1550), an audio output module (1555), a display module (1560), an audio module (1570), a sensor module (1576), an interface (1577), a connection terminal (1578), a haptic module (1579), a camera module (1580), a power management module (1588), a battery (1589), a communication module (1590), a subscriber identification module (1596), and / or an antenna module (1597). In various embodiments of the present disclosure, at least one of these components (e.g., the connection terminal (1578)) may be omitted, or one or more other components may be added to the electronic device (1501). In various embodiments of the present disclosure, some of these components may be implemented as a single integrated circuitry. For example, a sensor module (1576), a camera module (1580), or an antenna module (1597) may be implemented embedded in one component (e.g., a display module (1560)).

[0223] According to various embodiments, the electronic device (1501) may include the foldable electronic device (1) of FIG. 1.

[0224] According to various embodiments, one or more electronic components (311) of FIGS. 5 and 6 may include at least one of a plurality of components included in an electronic device (1501) (e.g., a processor (1520), a memory (1530), an input module (1550), an audio output module (1555), a display module (1560), an audio module (1570), a sensor module (1576), an interface (1577), a connection terminal (1578), a haptic module (1579), a camera module (1580), a power management module (1588), a battery (1589), a communication module (1590), a subscriber identification module (1596), and / or an antenna module (1597)).

[0225] The processor (1520) may control at least one other component (e.g., hardware or software component) of the electronic device (1501) connected to the processor (1520) by executing, for example, software (e.g., program (1540)), and may perform various data processing or operations. As at least part of the data processing or operations, the processor (1520) may load commands or data received from other components (e.g., sensor module (1576) or communication module (1590)) into the volatile memory (1532), process the commands or data stored in the volatile memory (1532), and store the resulting data in the non-volatile memory (1534). The processor (1520) may include a main processor (1521) (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor (1523) (e.g., a graphics processing unit (GPU)), a neural processing unit (NPU)), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that can operate independently or together with the main processor (1521). Additionally or alternatively, the auxiliary processor (1523) may be configured to use less power than the main processor (1521) or to be specialized for a given function. The auxiliary processor (1523) may be implemented separately from the main processor (1521) or as a part thereof.

[0226] The auxiliary processor (1523) may control at least a portion of functions or states associated with at least one component (e.g., a display module (1560), a sensor module (1576), or a communication module (1590)) of the electronic device (1501), for example, on behalf of the main processor (1521) while the main processor (1521) is in an inactive (e.g., sleep) state, or together with the main processor (1521) while the main processor (1521) is in an active (e.g., application execution) state. The auxiliary processor (1523) (e.g., an image signal processor (ISP) or a communication processor (CP)) may be implemented as a part of another functionally related component (e.g., a camera module (1580) or a communication module (1590)). According to various embodiments of the present disclosure, the auxiliary processor (1523) (e.g., a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. An AI model can be generated through machine learning. This learning can be performed, for example, on the electronic device (1501) where the AI ​​model is executed, or through a separate server (e.g., server (1508)). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The AI ​​model may include multiple artificial neural network layers.The artificial neural network may be any one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent DNN (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may additionally or alternatively include a software structure.

[0227] The memory (1530) can store various data used by at least one component (e.g., the processor (1520) or the sensor module (1576)) of the electronic device (1501). The various data can include, for example, software (e.g., the program (1540)) and input data or output data for commands related thereto. The memory (1530) can include volatile memory (1532) and / or nonvolatile memory (1534).

[0228] The program (1540) may be stored as software in memory (1530) and may include, for example, an operating system (1542), middleware (1544), and / or applications (1546).

[0229] The input module (1550) can receive commands or data to be used by other components of the electronic device (1501) (e.g., the processor (1520)) from an external source (e.g., a user) of the electronic device (1501). The input module (1550) can include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[0230] The audio output module (1555) can output audio signals to the outside of the electronic device (1501). The audio output module (1555) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback, and the receiver can be used for incoming calls. The receiver can be implemented separately from the speaker or as part of the speaker.

[0231] The display module (1560) can visually provide information to an external party (e.g., a user) of the electronic device (1501). The display module (1560) can include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. The display module (1560) can include a touch circuit configured to detect a touch (e.g., a touch sensor), or a sensor circuit configured to measure the intensity of a force generated by the touch (e.g., a pressure sensor).

[0232] The audio module (1570) can convert sound into an electrical signal, or vice versa. The audio module (1570) can acquire sound through the input module (1550), or output sound through an audio output module (1555), or an external electronic device (e.g., an external electronic device (1502)) (e.g., a speaker or headphones) directly or wirelessly connected to the electronic device (1501).

[0233] The sensor module (1576) can detect the operating status (e.g., power or temperature) of the electronic device (1501) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. The sensor module (1576) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0234] The interface (1577) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1501) with an external electronic device (e.g., the external electronic device (1502)). The interface (1577) may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface.

[0235] The connection terminal (1578) may include a connector through which the electronic device (1501) may be physically connected to an external electronic device (e.g., an external electronic device (1502)). The connection terminal (1578) may include, for example, an HDMI connector, a USB connector, an SD card connector, and / or an audio connector (e.g., a headphone connector).

[0236] A haptic module (1579) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. The haptic module (1579) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0237] The camera module (1580) can capture still images and videos. The camera module (1580) may include one or more lenses, image sensors, image signal processors (ISPs), or flashes.

[0238] The power management module (1588) can manage power supplied to or consumed by the electronic device (1501). The power management module (1588) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0239] A battery (1589) may power at least one component of the electronic device (1501). The battery (1589) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell.

[0240] The communication module (1590) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1501) and an external electronic device (e.g., external electronic device (1502), external electronic device (1504), or server (1508)), and the performance of communication through the established communication channel. The communication module (1590) may operate independently from the processor (1520) (e.g., application processor (AP)) and may include one or more communication processors (CPs) that support direct (e.g., wired) communication or wireless communication. The communication module (1590) may include a wireless communication module (1592) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1594) (e.g., a local area network (LAN) communication module, or a power line communication module). Of these communication modules, the corresponding communication module is configured to be a first network (1598) (e.g., a short-range communication network such as BLUETOOTH, WiFi (wireless fidelity) direct, or IrDA (IR data association)) or a second network (1599) (e.g., a legacy cellular network, 5G (5 thThe wireless communication module (1592) can communicate with an external electronic device (1504) via a wide area network (e.g., a LAN or WAN), a next generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1592) can use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in a subscriber identity module (SIM) (1596) to identify or authenticate the electronic device (1501) within a communication network, such as a first network (1598) or a second network (1599).

[0241] The wireless communication module (1592) is 4G (4 thThe wireless communication module (1592) can support 5G networks and next-generation communication technologies after the 5G network, such as new radio access technology (NR). The NR access technology can support high-speed transmission of high-capacity data (i.e., enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency communications (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (1592) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1592) may support various technologies for securing performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (1592) may support various requirements specified in the electronic device (1501), an external electronic device (e.g., an external electronic device (1504)), or a network system (e.g., a second network (1599)). According to various embodiments of the present disclosure, the wireless communication module (1592) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0242] The antenna module (1597) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). The antenna module (1597) may include an antenna including a radiator including a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). The antenna module (1597) may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1598) or the second network (1599), may be selected from the plurality of antennas by, for example, the communication module (1590). A signal or power may be transmitted or received between the communication module (1590) and the external electronic device via the at least one selected antenna. In addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1597).

[0243] According to various embodiments of the present disclosure, the antenna module (1597) may form a mmWave antenna module. According to various embodiments of the present disclosure, the mmWave antenna module may include a printed circuit board (PCB), an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0244] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0245] Commands or data may be transmitted or received between the electronic device (1501) and an external electronic device (1504) via a server (1508) connected to a second network (1599). Each of the external electronic devices (1502 or 1504) may be the same or a different type of device as the electronic device (1501). All or part of the operations performed on the electronic device (1501) may be performed on one or more external electronic devices among the external electronic devices (1502, 1504, or 1508). For example, when the electronic device (1501) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1501) may, instead of or in addition to, perform the function or service on its own, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1501). The electronic device (1501) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1501) may provide an ultra-low delay service using, for example, distributed computing or mobile edge computing (MEC). In other embodiments of the present disclosure, the external electronic device (1504) may include an Internet of Things (IoT) device. The server (1508) may be an intelligent server utilizing machine learning and / or a neural network.According to various embodiments of the present disclosure, an external electronic device (1504) or server (1508) may be included within a second network (1599). The electronic device (1501) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0246] Electronic devices according to various embodiments of the present disclosure may take various forms. Electronic devices may include portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. However, electronic devices are not limited to the aforementioned devices.

[0247] The term "module" may include a unit implemented in hardware, software, or firmware, or any combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or portion of such a component that performs one or more functions. For example, according to various embodiments of the present disclosure, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0248] Various embodiments of the present disclosure may be implemented as software (e.g., a program (1540)) including one or more instructions stored in a storage medium (e.g., an internal memory (1536) or an external memory (1538)) readable by a machine (e.g., an electronic device (1501)). For example, a processor (e.g., a processor (1520)) of the machine (e.g., an electronic device (1501)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0249] The methods according to various embodiments of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., CD-ROM (compact disc read-only memory)) or an application store (e.g., PLAYSTORE). TM) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0250] Each component (e.g., a module or a program) of the above-described components may comprise one or more entities. One or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the multiple components identically or similarly to those performed by the corresponding component of the multiple components prior to the integration. The operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0251] According to various embodiments of the present disclosure, an electronic device (e.g., a foldable electronic device (1)) includes a PCB (e.g., a first PCB (31)), an electromagnetic shielding member (e.g., a metal cover (5)), a flexible member (e.g., a flexible member (7)), and a heat transfer material (e.g., a heat transfer material (6)). The electromagnetic shielding member is coupled to the PCB via solder (e.g., solder powder particles (91)) to cover one or more electronic components (e.g., one or more electronic components (311)) disposed on the PCB, and includes a first hole (e.g., a first hole (501)). The flexible member is attached to the electromagnetic shielding member and includes a cut line (e.g., a cut portion (71)) aligned with the first hole of the electromagnetic shielding member. A heat transfer material is filled between the PCB and the electromagnetic shielding member to thermally connect the one or more electronic components and the electromagnetic shielding member. The first hole of the electromagnetic shielding member and the cut line of the flexible member allow a heat transfer material to be injected between the PCB and the electromagnetic shielding member. An electronic device according to the present disclosure can stably fill the heat transfer material between the electromagnetic shielding member and the PCB. In addition, the effects that can be obtained or expected from various embodiments of the present disclosure are disclosed directly or implicitly in the detailed description of the embodiments of the present disclosure.

[0252] According to various embodiments of the present disclosure, an electronic device (e.g., a foldable electronic device (1)) may include a PCB (e.g., a first PCB (31)), an electromagnetic shielding member (e.g., a metal cover (5)), and a heat-conducting material (e.g., a heat-conducting material (6)). The PCB may include a plurality of conductive pads (e.g., first to 36th conductive pads (P1, P2, P3, ..., and P36)) that are spaced apart from each other. The electromagnetic shielding member may be coupled to the plurality of conductive pads of the PCB through solder (e.g., solder powder particles (91)) of a solder paste (e.g., solder (9)) by a soldering process to cover one or more electronic components (e.g., one or more electronic components (311)) arranged on the PCB. The electromagnetic shielding member may include a first hole (e.g., a first hole (501)). A flexible member (e.g., flexible member (7)) may be disposed on the electromagnetic shielding member. The flexible member may include a cut line (e.g., cut line (71)) aligned with a first hole of the electromagnetic shielding member. A thermally conductive material may be filled between the PCB and the electromagnetic shielding member to thermally connect one or more electronic components and the electromagnetic shielding member. The first hole of the electromagnetic shielding member and the cut line of the flexible member may allow the thermally conductive material to be injected between the PCB and the electromagnetic shielding member. To seal the electromagnetic shielding member to first regions of the PCB corresponding to the plurality of conductive pads, a solder paste solder may form a plurality of spaced-apart first joints (e.g., a plurality of first joints (C1)) disposed between the electromagnetic shielding member and the plurality of conductive pads of the PCB.To at least partially seal the electromagnetic shielding member to the second regions of the PCB (e.g., the first to 36th non-conductive regions (N1, N2, N3, ..., and N36)) between the plurality of conductive pads, a flux of the solder paste (e.g., flux (92)) can form a plurality of second joints (e.g., a plurality of second joints (C2)) disposed between the electromagnetic shielding member and the second regions of the PCB (31). The PCB may include a first conductive pad (e.g., a fifteenth conductive pad (P15)) among a plurality of conductive pads, a second conductive pad (e.g., a sixteenth conductive pad (P16)) adjacent to the first conductive pad among the plurality of conductive pads, and a first non-conductive region (e.g., a fifteenth non-conductive region (N15)) between the first conductive pad and the second conductive pad among the plurality of second regions. Prior to providing heat to the solder paste in a soldering process, a first portion of the solder paste (e.g., the first portion of the solder paste (1011)) may be disposed on at least a portion of the first conductive pad of the PCB, at least a portion of the second conductive pad of the PCB, and at least a portion of the first non-conductive region of the PCB between the first conductive pad and the second conductive pad.

[0253] According to various embodiments of the present disclosure, a flux (e.g., flux (92)) of a solder paste (e.g., solder paste (9)) is not disposed between a second non-conductive region (e.g., the 36th non-conductive region (N36)) of second regions (e.g., first to 36th non-conductive regions (N1, N2, N3, 쪋, and N36)) of a PCB (e.g., first PCB (31)) and an electromagnetic shielding member (e.g., metal cover (5)), so that a gap between the second non-conductive region and the electromagnetic shielding member can be configured as an air vent (VN).

[0254] According to various embodiments of the present disclosure, an electromagnetic shielding member (e.g., a metal cover (5)) may include a notch (e.g., a notch (503)) facing a second non-conductive region (e.g., a 36th non-conductive region (N36)) of a PCB (e.g., a first PCB (31)).

[0255] According to various embodiments of the present disclosure, a center line (e.g., a third center line (1023)) of a first portion of solder paste (e.g., a first portion of solder paste (1011)) of a solder paste (e.g., a solder paste (9)) and a center line (e.g., a first center line (1021)) between a first conductive pad (e.g., a fifteenth conductive pad (P15)) and a second conductive pad (e.g., a sixteenth conductive pad (P16)) may be parallel to a direction perpendicular to a PCB (e.g., a first PCB (31)) and may coincide with each other.

[0256] According to various embodiments of the present disclosure, a first conductive pad (e.g., a fifteenth conductive pad (P15)) of a plurality of conductive pads (e.g., first to thirty-sixth conductive pads (P1, P2, P3, ..., and P36)) may be positioned between a second conductive pad (e.g., a sixteenth conductive pad (P16)) of the plurality of conductive pads and a third conductive pad (e.g., a fourteenth conductive pad (P14)) of the plurality of conductive pads. Before applying heat to the solder paste (e.g., solder paste (9)) in a soldering process, a second part solder paste (e.g., second part solder paste (1012)) of the solder paste may be disposed on at least a portion of a first conductive pad of a PCB (e.g., first PCB (31)), at least a portion of a third conductive pad of the PCB, and at least a portion of a third non-conductive region (e.g., fourteenth non-conductive region (N14)) of the PCB between the first conductive pad and the second conductive pad, and may be spaced apart from the first part solder paste (e.g., first part solder paste (1011)). The center line of the first conductive pad (e.g., the first center line (1021)) and the center line between the first partial solder paste and the second partial solder paste (e.g., the fourth center line (1024)) are parallel to the direction perpendicular to the PCB and can be coincident with each other.

[0257] According to various embodiments of the present disclosure, a ratio of a separation distance between two adjacent first joints to an extended length of one of the plurality of first joints (e.g., the plurality of first joints (C1)) may be 5:1.

[0258] According to various embodiments of the present disclosure, a ratio of a separation distance between two adjacent first joints to an extended length of one of the plurality of first joints (e.g., the plurality of first joints (C1)) may be 2:1.

[0259] According to various embodiments of the present disclosure, a ratio of a distance between the first conductive pad (e.g., the fifteenth conductive pad (P15)) and the second conductive pad (e.g., the sixteenth conductive pad (P16)) to an extended length (e.g., the first value (L1)) of either the first conductive pad and the second conductive pad (e.g., the sixteenth conductive pad (P16)) may be 5:1.

[0260] According to various embodiments of the present disclosure, a ratio of a distance (e.g., a second value (L2)) between the first conductive pad and the second conductive pad to an extended length (e.g., a first value (L1)) of either the first conductive pad (e.g., a fifteenth conductive pad (P15)) or the second conductive pad (e.g., a sixteenth conductive pad (P16)) may be 2:1.

[0261] According to various embodiments of the present disclosure, a plurality of first joints (e.g., a plurality of first joints (C1)) and a plurality of second joints (e.g., a plurality of second joints (C2)) can be formed at the same height.

[0262] According to various embodiments of the present disclosure, a plurality of first joints (e.g., a plurality of first joints (C1)) may be formed at a lower height than a plurality of second joints (e.g., a plurality of second joints (C2)).

[0263] According to various embodiments of the present disclosure, an electronic device (e.g., a foldable electronic device (1)) may include an adhesive member (e.g., a first adhesive member (701)) disposed between an electromagnetic shielding member (e.g., a metal cover (5)) and a flexible member (e.g., a flexible member (7)). The adhesive member may have heat resistance for a soldering process.

[0264] According to various embodiments of the present disclosure, an electronic device (e.g., a foldable electronic device (1)) may include a light-transmitting member (e.g., a light-transmitting member (8)) disposed on an electromagnetic shielding member (e.g., a metal cover (5)) to block a second hole (e.g., a second hole (502)) of the electromagnetic shielding member. The second hole and the light-transmitting member of the electromagnetic shielding member may be configured such that a heat-transmitting material (e.g., a heat-transmitting material (6)) filled between a PCB (e.g., a first PCB (31)) and the electromagnetic shielding member is visible.

[0265] According to various embodiments of the present disclosure, in a direction orthogonal to a PCB (e.g., a first PCB (31)), a first hole (e.g., a first hole (501)) of an electromagnetic shielding member (e.g., a metal cover (5)) may overlap with a center of a hot spot, and a second hole (e.g., a second hole (502)) of the electromagnetic shielding member may overlap with a periphery of the hot spot surrounding the center.

[0266] According to various embodiments of the present disclosure, an electronic device (e.g., a foldable electronic device (1)) may include a metal pad (e.g., a metal plate (1200)) disposed between an electromagnetic shielding member (e.g., a metal cover (5)) and a flexible member (e.g., a flexible member (7)). The metal pad may include an opening aligned with a first hole (e.g., a first hole (501)) and a cut line (e.g., a cut line (71)).

[0267] According to various embodiments of the present disclosure, a metal pad (e.g., a metal plate (1200)) can be joined to an electromagnetic shielding member (e.g., a metal cover (5)) through welding.

[0268] According to various embodiments of the present disclosure, a method of forming a heat dissipation structure may include forming a solder paste (e.g., a first portion solder paste (1011)) so as to be disposed on at least a portion of a first conductive pad (e.g., a fifteenth conductive pad (P15)) of a PCB (e.g., a first PCB (31)), at least a portion of a second conductive pad (e.g., a sixteenth conductive pad (P16)) of a PCB adjacent to the first conductive pad, and at least a portion of a non-conductive region (e.g., a fifteenth non-conductive region (N15)) of the PCB between the first conductive pad and the second conductive pad. The method may include disposing an electromagnetic shielding member (e.g., a metal cover (5)) over the PCB so that a sidewall (e.g., a second portion (52)) of the electromagnetic shielding member is disposed over the solder paste. The method may include providing heat to the solder paste. After providing heat, solder (e.g., solder powder particles (91)) of the solder paste can form one first joint disposed between the electromagnetic shielding member and the first conductive pad, and another first joint disposed between the electromagnetic shielding member and the second conductive pad. After providing heat, flux (e.g., flux (92)) of the solder paste can form a second joint disposed between the electromagnetic shielding member and the non-conductive region to seal between the sidewall of the electromagnetic shielding member and the PCB.

[0269] According to various embodiments of the present disclosure, a center line (e.g., a third center line (1023)) of a solder paste (e.g., a first partial solder paste (1011)) and a center line (e.g., a first center line (1021)) between a first conductive pad (e.g., a fifteenth conductive pad (P15)) and a second conductive pad (e.g., a sixteenth conductive pad (P16)) may be parallel to a direction perpendicular to a PCB (e.g., a first PCB (31)) and may coincide with each other.

[0270] According to various embodiments of the present disclosure, a ratio of a distance between the first conductive pad (e.g., the fifteenth conductive pad (P15)) and the second conductive pad (e.g., the sixteenth conductive pad (P16)) to an extended length (e.g., the first value (L1)) of either the first conductive pad and the second conductive pad (e.g., the sixteenth conductive pad (P16)) may be 5:1.

[0271] According to various embodiments of the present disclosure, a ratio of a distance (e.g., a second value (L2)) between the first conductive pad and the second conductive pad to an extended length (e.g., a first value (L1)) of either the first conductive pad (e.g., a fifteenth conductive pad (P15)) or the second conductive pad (e.g., a sixteenth conductive pad (P16)) may be 2:1.

[0272] The embodiments disclosed in this disclosure and the drawings are merely examples to more easily explain the technical content and to help understand the present disclosure, and are not intended to limit the scope of the present disclosure. Therefore, it should be understood that the scope of the various embodiments of the present disclosure includes various modifications or variations in addition to the embodiments disclosed herein. Additionally, it should be understood that any embodiment(s) described herein can be used in conjunction with any of the various embodiments described herein. For example, although the present disclosure is presented in a form that provides multiple embodiments each defining multiple features, it is emphasized that some of these embodiments may be connected only by reference to the same drawing or drawings. The present disclosure should be understood to include all combinations of these embodiments, unless there is an apparent contradiction between two (or more) embodiments. For example, if features are presented as optional in the present disclosure, all combinations of such optional features are included in the present disclosure.

Claims

In an electronic device (1), A printed circuit board (PCB) (31) comprising a plurality of conductive pads (P1, P2, P3, …, and P36) spaced apart from each other; An electromagnetic shielding member (5) including a first hole (501) and coupled to the plurality of conductive pads (P1, P2, P3, ..., and P36) of the PCB (31) through solder (91) of solder paste (9) by a soldering process to cover one or more electronic components (311) arranged on the PCB (31); A flexible member (7) disposed on the electromagnetic shielding member (5) and including a cut line (71) aligned with the first hole (501) of the electromagnetic shielding member (5); and Including a heat transfer material (6) filled between the PCB (31) and the electromagnetic shielding member (5) to thermally connect the one or more electronic components (311) and the electromagnetic shielding member (5), The first hole (501) of the electromagnetic shielding member (5) and the cut line (71) of the flexible member (7) enable the heat transfer material (6) to be injected between the PCB (31) and the electromagnetic shielding member (5). In order to seal the electromagnetic shielding member (5) to the first areas of the PCB (31) corresponding to the plurality of conductive pads (P1, P2, P3, …, and P36), the solder (91) of the solder paste (9) forms a plurality of first joints (C1) spaced apart from each other, which are arranged between the electromagnetic shielding member (5) and the plurality of conductive pads (P1, P2, P3, …, and P36) of the PCB (31). In order to at least partially seal the electromagnetic shielding member (5) to the second regions (N1, N2, N3, …, and N36) of the PCB (31) between the plurality of conductive pads (P1, P2, P3, …, and P36), the flux (92) of the solder paste (9) forms a plurality of second joints (C2) arranged between the electromagnetic shielding member (5) and the second regions (N1, N2, N3, …, and N36) of the PCB (31), The PCB (31) includes a first conductive pad (P15) among the plurality of conductive pads (P1, P2, P3, …, and P36), a second conductive pad (P16) adjacent to the first conductive pad (P15) among the plurality of conductive pads (P1, P2, P3, …, and P36), and a first non-conductive region (N15) between the first conductive pad (P15) and the second conductive pad (P16) among the plurality of second regions (N1, N2, N3, …, and N36), and An electronic device in which, before applying heat to the solder paste (9) in the soldering process, a first portion of the solder paste (1011) of the solder paste (9) is disposed on at least a portion of the first conductive pad (P15) of the PCB (31), at least a portion of the second conductive pad (P16) of the PCB (31), and at least a portion of the first non-conductive area (N15) of the PCB (31) between the first conductive pad (P15) and the second conductive pad (P16). In the first paragraph, An electronic device in which the flux (92) of the solder paste (9) is not disposed between the second non-conductive region (N36) of the second regions (N1, N2, N3, …, and N36) of the PCB (31) and the electromagnetic shielding member (5), so that the gap between the second non-conductive region (N36) and the electromagnetic shielding member (5) is configured as an air vent (VN). In the second paragraph, An electronic device in which the electromagnetic shielding member (5) includes a notch (503) facing the second non-conductive area (N36) of the PCB (31). In the first paragraph, An electronic device in which the center line (1023) of the first portion of the solder paste (1011) of the solder paste (9) and the center line (1021) between the first conductive pad (P15) and the second conductive pad (P16) are parallel to the direction perpendicular to the PCB (31) and coincide with each other. In the first paragraph, The first conductive pad (P15) of the plurality of conductive pads (P1, P2, P3, …, and P36) is positioned between the second conductive pad (P16) of the plurality of conductive pads (P1, P2, P3, …, and P36) and the third conductive pad (P14) of the plurality of conductive pads (P1, P2, P3, …, and P36). Before providing heat to the solder paste (9) in the soldering process, the second part solder paste (1012) of the solder paste (9) is disposed on at least a part of the first conductive pad (P15) of the PCB (31), at least a part of the third conductive pad (P14) of the PCB (31), and at least a part of the third non-conductive area (N14) of the PCB (31) between the first conductive pad (P15) and the second conductive pad (P16), and is spaced apart from the first part solder paste (1011), and An electronic device in which the center line (1021) of the first conductive pad (P15) and the center line (1024) between the first partial solder paste (1011) and the second partial solder paste (1012) are parallel to the direction perpendicular to the PCB (31) and coincide with each other. In the first paragraph, An electronic device wherein a ratio of a distance between two adjacent first joints (C1) to an extended length of one of the two adjacent first joints is 5:

1. In the first paragraph, An electronic device wherein a ratio of a distance between two adjacent first joints (C1) to an extended length of one of the two adjacent first joints is 2:

1. In the first paragraph, An electronic device wherein a ratio of a distance (L2) between the first conductive pad (P15) and the second conductive pad (P16) to an extended length (L1) of either the first conductive pad (P15) or the second conductive pad (P16) is 5:

1. In the first paragraph, An electronic device wherein a ratio of a distance (L2) between the first conductive pad (P15) and the second conductive pad (P16) to an extended length (L1) of either the first conductive pad (P15) or the second conductive pad (P16) is 2:

1. In the first paragraph, An electronic device in which the plurality of first joints (C1) are formed at a lower height than the plurality of second joints (C2). In the first paragraph, The electronic device (1) includes an adhesive member (701) disposed between the electromagnetic shielding member (5) and the flexible member (7), and the adhesive member (701) is an electronic device having heat resistance for the soldering process. In the first paragraph, Further comprising a light-transmitting member (8) arranged in the electromagnetic shielding member (5) to block the second hole (502) of the electromagnetic shielding member (5), and An electronic device in which the second hole (502) and the light-transmitting member (8) of the electromagnetic shielding member (5) are configured so that the heat-conducting material (6) filled between the PCB (31) and the electromagnetic shielding member (5) can be seen. In paragraph 12, An electronic device in which, in a direction perpendicular to the PCB (31), the first hole (501) of the electromagnetic shielding member (5) overlaps with the center of a hot spot, and the second hole (502) of the electromagnetic shielding member (5) overlaps with the periphery of the hot spot surrounding the center. In the first paragraph, An electronic device further comprising a metal pad (1200) disposed between the electromagnetic shielding member (5) and the flexible member (7), the metal pad including an opening aligned with the first hole (501) and the cut line (71). In terms of method, An operation of forming a solder paste (1011) to be disposed on at least a portion of a first conductive pad (P15) of a PCB (31), at least a portion of a second conductive pad (P16) of the PCB (31) adjacent to the first conductive pad (P15), and at least a portion of a non-conductive area (N15) of the PCB (31) between the first conductive pad (P15) and the second conductive pad (P16); An operation of placing the electromagnetic shielding member (5) on the PCB (31) so that the side wall (52) of the electromagnetic shielding member (5) is placed on the solder paste (1011); and Including an action of providing heat to the above solder paste (1011), After providing heat, the solder (91) of the solder paste (1011) forms one first joint disposed between the electromagnetic shielding member (5) and the first conductive pad (P15), and another first joint disposed between the electromagnetic shielding member (5) and the second conductive pad (P16), and After providing heat, the flux (92) of the solder paste (1011) forms a second joint disposed between the electromagnetic shielding member (5) and the non-conductive region (N15) to seal between the side wall (52) of the electromagnetic shielding member (5) and the PCB (31).

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