Shielding structure and electronic equipment

Abstract

The utility model relates to a shielding structure and an electronic device, the shielding structure comprises a shielding frame and a connecting rib, the shielding frame comprises a frame plate and a plurality of independent hollow areas penetrating through the frame plate, the connecting rib is arranged at a target edge position of at least one hollow area, and the connecting rib is arranged on the frame plate. The target edge position comprises at least part of the hollow area and at least part of the target edge, close to the adjacent hollow area, of the hollow area, and each hollow area is used for being corresponding to a circuit module and allowing at least part of the circuit module to penetrate through. The utility model further provides electronic equipment which comprises a plurality of circuit modules and the shielding structure. According to the shielding structure and the electronic equipment provided by the utility model, the electromagnetic shielding effect between different circuit modules can be improved, and the stability of a system is improved.

Description

Technical Field

[0001] This utility model relates to a shielding structure, specifically a shielding structure and an electronic device. Background Technology

[0002] As the space on motherboards in electronic products gradually shrinks while their functionality increases, the speed and frequency of system operation also rise. This trend leads to increased power-on noise on the motherboard, which in turn causes greater interference to the receiving system of the radio frequency (RF) front-end. Therefore, to ensure the proper functioning of the equipment, improving the electromagnetic shielding effect for the RF front-end becomes particularly important. However, existing shielding frame structures fail to properly seal the gaps and joints between the ribs. Utility Model Content

[0003] The purpose of this invention is to provide a shielding structure and an electronic device to solve the problems mentioned in the background art.

[0004] To address the aforementioned problems, in a first aspect, this utility model provides a shielding structure comprising a shielding frame and connecting ribs. The shielding frame includes a frame plate and multiple independent hollow regions penetrating the frame plate. The connecting ribs are disposed at the target edge position of at least one hollow region. The target edge position includes at least a portion of the target edge of the hollow region and adjacent hollow regions. Each hollow region is used to correspond to a circuit module, and at least a portion of the circuit module passes through it.

[0005] In one embodiment, the shielding frame further includes a shielding plate located at least on the target edge of each hollow region, the target edge location including locations where no shielding plate is provided.

[0006] In one embodiment, the shielding structure further includes a shielding cover that covers the shielding frame to form a shielding structure with an internal receiving cavity, the receiving cavity being used to receive at least a portion of each circuit module, and at least a portion of each circuit module passing through a corresponding hollow area.

[0007] The aforementioned shielding structure, by providing connecting ribs at the target edge, allows the shielding frame and the shielding plate to connect properly, resulting in a more complete boundary of the shielding area. This ensures that electromagnetic shielding can cover the originally weaker areas, improving the protection effect for different circuit modules. The connecting ribs also increase the mechanical strength of the shielding frame, allowing the shielding cover to fit more tightly and securely when covering the frame. This not only further enhances the electromagnetic shielding effect but also ensures that the entire shielding structure will not experience electromagnetic leakage or other malfunctions due to loosening between components during operation.

[0008] In one embodiment, the connecting ribs extend from the frame plate of the shielding frame toward the shielding cover side and are located between adjacent circuit modules, thereby shielding the multiple circuit modules housed in the receiving cavity from each other.

[0009] In one embodiment, the shielding cover includes a cover plate and a peripheral side plate connected to the cover plate. The shielding cover is fixed to the periphery of the shielding frame by the peripheral side plate. The cover plate and the shielding frame are arranged opposite to each other. The dimension of the connecting rib along a first direction is less than or equal to the dimension of the peripheral side plate along the first direction. The first direction is the direction in which the cover plate and the shielding frame of the shielding cover are spaced apart.

[0010] In one embodiment, the shape of the projection of the connecting rib onto the plane of the shielding frame includes a straight line, an L-shape, or an arc.

[0011] In one embodiment, the connection between the connecting rib and the shielding frame includes a welding connection, wherein the contact surfaces of the connecting rib and the shielding frame are fixed by welding.

[0012] In one embodiment, thermally conductive adhesive is provided on the inner side of the cover plate of the shielding cover to conduct away the heat generated inside the cavity.

[0013] In one embodiment, thermally conductive adhesive is disposed in multiple areas of the shielding cover that are directly opposite multiple hollow areas of the shielding frame.

[0014] Secondly, this utility model also provides an electronic device, comprising:

[0015] Multiple circuit modules; and,

[0016] The shielding structure as described in the first aspect is used to enhance the shielding capability between the different circuit modules, wherein at least a portion of each circuit module is disposed in the shielding structure.

[0017] The shielding structure and electronic device of this utility model, by providing connecting ribs at the target edge position, which is the position where the shielding plate is not set, allows the connecting ribs and the shielding plate to cooperate with each other to form a seamless electromagnetic shielding. In the circuits of some complex electronic devices, the shape and arrangement of circuit modules are irregular, and the shielding plate is difficult to adapt to all areas. At this time, the connecting ribs, as a supplementary structure, can extend to corners or edges that are difficult for the shielding plate to reach, making the shielding boundary between different circuit modules more continuous and complete, thereby effectively preventing electromagnetic energy from crossing interference between modules.

[0018] The connecting ribs can also enhance the connection stability between the shielding frame and the shielding cover, so that the components can work closely together and be stably connected during the operation of the circuit, thereby ensuring the electromagnetic shielding effect and the basis for the normal operation of the circuit, and ensuring the normal operation of the equipment.

[0019] Additional aspects and advantages of embodiments of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of this application. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the shielding frame of the shielding structure in one embodiment of the present invention.

[0022] Figure 2 This is a schematic diagram of the shielding cover in one embodiment of the present invention.

[0023] Figure 3 This is a schematic diagram of a shielding structure with an added connecting rib at the edge of the target in one embodiment of the present invention.

[0024] Figure 4 This is a schematic diagram of another structure of the shielding frame in one embodiment of the present invention.

[0025] Figure 5 This is a schematic diagram of the structure of the shielding cover and the shielding frame in one embodiment of the present invention.

[0026] Figure 6 This is a structural block diagram of an electronic device according to one embodiment of the present invention.

[0027] Figure 7 This is a schematic diagram of the circuit board structure of an electronic device according to one embodiment of the present invention.

[0028] In all the accompanying drawings, the same reference numerals are used to denote the same parts. The reference numerals in the specific embodiments are as follows:

[0029] Shielding frame 100, frame plate 101, hollow area 102, perimeter 103, shielding plate 104, target edge position 105, connecting rib 110, frame plate area 120;

[0030] Shielding cover 200, peripheral side plate 201, thermally conductive adhesive 202, cover plate 203;

[0031] Electronic device 300, circuit board 310, circuit module 311, shielding structure 1. Detailed Implementation

[0032] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0033] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0034] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0035] Figure 1 This is a schematic diagram of the shielding frame of the shielding structure in one embodiment of the present utility model. For ease of explanation, only the content related to the embodiment of the present utility model is shown.

[0036] Please see Figure 1 The diagram shown is a schematic representation of the shielding frame of a shielding structure in one embodiment of this utility model. Figure 1As shown, the shielding structure includes a shielding frame 100 and connecting ribs 110. The shielding frame 100 includes a frame plate 101 and a plurality of independent hollow regions 102 penetrating the frame plate 101. The connecting ribs 110 are disposed at a target edge position 105 of at least one hollow region 102. The target edge position 105 includes at least a portion of the target edge of the hollow region 102 and adjacent hollow regions 102. Each hollow region 102 is used to correspond to a circuit module, and at least a portion of the circuit module passes through it.

[0037] In some embodiments, the target edge location 105 includes locations where there is a risk of electromagnetic leakage between the circuit modules. For example, it may be gaps between electromagnetic shielding components caused by various reasons. The connection ribs 110 can effectively fill these gaps, enhance the integrity of the shielding, and make the entire shielding frame 100 form a continuous electromagnetic shield, preventing electromagnetic interference signals from leaking from these gaps and interfering with other circuit modules.

[0038] Therefore, in this application, by providing the connecting rib 110 at the target edge position 105, the connecting rib 110 can act as an electromagnetic barrier at the target edge position 105, thereby generating an electromagnetic shielding effect at the location where there is an existing risk of electromagnetic leakage, reducing interference between different circuit modules, and thus improving the effectiveness of electromagnetic shielding.

[0039] Please refer to the following: Figure 3 , Figure 3 This is a schematic diagram of a shielding structure with added connecting ribs at the target edge position in one embodiment of the present invention. In some embodiments, the shielding frame 100 further includes a shielding plate 104 located at least on the target edge of each hollow region 102, and the target edge position 105 is the position on the target edge where the shielding plate 104 is not provided. The connecting ribs 110 are provided at at least one target edge position 105 of the hollow region 102. The number of connecting ribs 110 is determined according to actual needs. For example, based on the functional characteristics of different circuit modules or factors such as electromagnetic radiation intensity, it is determined which circuit modules have electromagnetic interference risks, thereby clarifying the target edge position 105 and the number of connecting ribs 110 required.

[0040] The shielding plate 104 can be the aforementioned electromagnetic shielding component. Generally, a shielding plate 104 is provided at the target edge of each hollow region 102 as an electromagnetic shielding component to electromagnetically shield the circuit modules disposed in adjacent hollow regions 102. The shielding plate 104 and the shielding frame 100 can be integrally formed. However, due to various reasons, gaps may exist between two adjacent shielding plates 104, allowing electromagnetic signals to be conducted through these gaps, resulting in interference between the circuit modules disposed in adjacent hollow regions 102. In this application, the connecting rib 110 is added to the target edge position 105 where the shielding plate 104 is not provided, thereby sealing the gap and forming a complete electromagnetic shielding plate with the shielding plate 104, thus improving the effectiveness of electromagnetic shielding.

[0041] Since each circuit module is distributed in an orderly manner in a specific area according to its functional characteristics, and there is a possibility of electromagnetic signal interference between adjacent circuit modules, or in order to prevent the electromagnetic radiation of some circuit modules from affecting other sensitive circuit modules, the connecting rib 110 can be added at the target edge position 105 between the circuit modules, thereby avoiding mutual interference between adjacent circuit modules and ensuring the stability of the system.

[0042] Among them, such as Figure 4 As shown, Figure 4 This is another structural schematic diagram of the shielding frame in one embodiment of the present invention, wherein each hollow region 102 is surrounded by a frame plate region 120.

[0043] In some embodiments, the target edge is the edge connecting the hollow region 102 and the frame plate region 120 with a width less than a preset width.

[0044] In some embodiments, the width of the frame plate area 120 determines the distance between circuit modules located in adjacent hollow areas 102. When the width of the frame plate area 120 is wider, the distance between circuit modules located in adjacent hollow areas 102 is farther, and a greater distance has a reduction effect on electromagnetic interference. Therefore, for the side connecting the hollow area 102 to the frame plate area 120 with a width greater than or equal to a preset width, the frame plate area 120 between adjacent hollow areas 102 of the shielding frame 100 has sufficient width. Even if there is a gap between the shielding frame 102 and the adjacent hollow area 102 that is not blocked by the shielding plate 104, it is not necessary to further provide the connecting rib 110.

[0045] Therefore, in some embodiments, the target edge may only be the edge connecting the hollow region 102 and the frame plate region 120 with a width less than a preset width. That is, when the connecting rib 110 is set at the target edge position 105, the target edge position 105 includes at least a portion of the target edge of the hollow region 102 and the adjacent hollow region 102 that is close to each other. In this case, the target edge may only be the edge connecting the hollow region 102 and the frame plate region 120 with a width less than a preset width.

[0046] By providing the connecting rib 110 only at the target edge position 105 where the target edge connects the hollow region 102 and the frame plate region 120 with a width less than a preset width, the risk of electromagnetic interference between different circuit modules can be reduced. Furthermore, between adjacent hollow regions 102 surrounded by the frame plate region 120 with a width greater than or equal to the preset width, the frame plate region 120 itself already forms effective electromagnetic shielding. That is, the wider frame plate region 120 itself can sufficiently shield the electromagnetic radiation generated during the operation of different circuit modules. In this case, the connecting rib 110 does not need to be added between adjacent hollow regions 102 separated by the frame plate region 120. Therefore, the number of ribs 110 is specifically set according to the actual situation and is not specifically limited here.

[0047] In some embodiments, the target edge may also include all edges of the hollow region 102 that are close to adjacent hollow regions 102, thereby improving the electromagnetic shielding effect. For example, when the circuit module corresponding to the adjacent hollow region 102 includes a sensitive circuit module, and the sensitive circuit module has high requirements for the stability of the electromagnetic environment, even if the frame plate area 120 connected to the target edge is greater than or equal to a preset width, the target edge position can, to a certain extent, ensure electromagnetic shielding between adjacent circuit modules. However, the electromagnetic signals generated by the sensitive circuit modules corresponding to adjacent hollow regions 102 during operation still have the risk of mutual interference. By further setting the connecting rib 110 for electromagnetic shielding, electromagnetic signal interference between adjacent circuit modules can be more effectively prevented. Therefore, the target edge also includes all edges of the hollow region 102 that are close to adjacent hollow regions 102. By setting the connecting rib 110 at the target edge position 105 where the target edge is located, it can be ensured that each sensitive circuit module can work normally in a relatively independent and stable electromagnetic space, ensuring the stability of the entire system.

[0048] The preset width can be flexibly set according to the size of the shielding frame 100 and the hollow region 102, the shape of the hollow region 102, and its layout. For example, when the size of the shielding frame 100 is large, the preset width will also increase accordingly, thereby ensuring the stability of the overall structure and the uniform electromagnetic shielding effect. At the same time, the size of the hollow region 102 also affects the setting of the preset width. For circuit modules with larger volumes, the corresponding hollow region 102 will also be set to a larger size. The space occupied by the circuit module in the shielding structure and its electromagnetic interaction with adjacent circuit modules require that the surrounding frame plate area 120 has an appropriate width.

[0049] The material of the shielding frame 100 may include metallic materials, such as copper or aluminum, which have good electromagnetic shielding performance, or conductive plastic materials or metal-plastic composite materials. The material of the shielding frame 100 needs to be set according to the actual situation, and no specific limitation is made here.

[0050] Please see Figure 2 , Figure 2 This is a schematic diagram of the shielding cover in one embodiment of the present invention. In some embodiments, the shielding structure 1 further includes a shielding cover 200, which covers the shielding frame 100 to form a shielding structure with an internal receiving cavity. The shielding cover 200 and the shielding frame 100 can be closed together by means of a snap-fit ​​structure, screw fixing, welding, or magnetic attraction, thereby forming a closed receiving cavity. For example, welding can be used at the connection between the shielding cover 200 and the shielding frame 100 to make them a single unit; or screw holes can be provided at corresponding positions on the shielding cover 200 and the shielding frame 100 to securely connect them together with screws. The receiving cavity is used to accommodate at least a portion of each circuit module, and at least a portion of each circuit module passes through the corresponding hollow region 102. When the shielding frame 100 passes through the circuit module, at least a portion of the circuit module passes through the corresponding hollow region 102 and is thus accommodated within the receiving cavity.

[0051] The material of the shielding cover 200 may include highly conductive metals such as copper and aluminum, or conductive plastics, and may also be the same as the material of the shielding frame 100. For example, when the shielding requirements are very high, copper, which has good electromagnetic shielding performance, can be used, so that the shielding cover 200 can effectively shield external electromagnetic interference and prevent external electromagnetic interference from entering the cavity and interfering with the circuit module. The material of the shielding cover 200 needs to be set according to specific circumstances and is not specifically limited here.

[0052] In the above embodiments, when the shielding cover 200 is closed with the shielding frame 100, at least a portion of the circuit module will be accommodated in the accommodating cavity, thereby effectively shielding the circuit module from external electromagnetic interference and preventing the electromagnetic signals generated by the circuit module itself from radiating outward.

[0053] Wherein, after at least a portion of the circuit module is housed within the receiving cavity, the pins and other connectors of the circuit module can be exposed from the hollow region 102 and electrically connected to other circuit structures. For example, the pins of the circuit module can be exposed from the hollow region 102 and soldered onto a circuit board.

[0054] In some embodiments, the main body of the circuit module corresponding to the hollow region 102 can be completely housed within the receiving cavity, with only the pins and other connectors exposed. In this case, the circuit module is completely located within the space of the receiving cavity, and the electronic components in the circuit module are all located within the receiving cavity. Thus, the shielding structure can provide electromagnetic shielding for the internal circuit module, ensuring its normal operation.

[0055] In some embodiments, the main body of the circuit module corresponding to the hollow region 102 may also be partially housed in the receiving cavity, that is, a part of the main body of the circuit module is inside the receiving cavity, and another part extends outside the receiving cavity. Due to the nature or setting requirements of the electronic components in the circuit module, a part of the circuit module may not be completely housed in the receiving cavity. For example, when the circuit module is connected to a circuit board, and the circuit board has a groove, the main body of the circuit module needs to extend partially from the hollow region 102 and be fixed to the circuit board after cooperating with the groove.

[0056] The body of the circuit module can refer to the part of the circuit module other than its pins.

[0057] Therefore, by accommodating at least a portion of the circuit module within the accommodating cavity, the shielding structure formed by the shielding frame 100 and the shielding cover 200 can effectively limit the electromagnetic radiation generated by the circuit module during operation within the accommodating cavity, thereby preventing it from interfering with other circuit modules or electronic devices in the vicinity. By accommodating at least a portion of the circuit module within the accommodating cavity, external electromagnetic interference can also be effectively blocked, protecting the internal circuit module from the influence of external electromagnetic interference, thus ensuring its normal operation.

[0058] In some embodiments, the connecting rib 110 extends from the frame plate 101 of the shielding frame 100 toward the shielding cover 200 and is located between adjacent circuit modules, thereby shielding the multiple circuit modules housed in the receiving cavity from each other. By providing the connecting rib 110 extending toward the shielding cover 200 at the target edge position 105, electromagnetic shielding is formed between the individual circuit modules that are at risk of electromagnetic interference within the receiving cavity, preventing adjacent circuit modules from being affected by electromagnetic interference and thus affecting their normal operation.

[0059] The connecting rib 110 originates from the frame plate 101 of the shielding frame 100 and extends directly toward the shielding cover 200, located in a specific area between the adjacent hollow regions 102. During the operation of each circuit module, at least a portion of the circuit module is housed within this relatively enclosed space. The connecting rib 110 forms an electromagnetic barrier between the circuit modules. When a circuit module operates and generates electromagnetic interference, the connecting rib 110 can prevent electromagnetic interference between adjacent circuit modules, thereby ensuring the stable operation of each circuit module and improving the stability of the system.

[0060] Please see Figure 5 , Figure 5 This is a schematic diagram of the structure of the shielding cover and the shielding frame in one embodiment of the present invention. The shielding cover 200 includes a cover plate 203 and a peripheral side plate 201 connected to the cover plate 203. The shielding cover 200 is fixed to the periphery 103 of the shielding frame 100 through the peripheral side plate 201, and the cover plate 203 and the shielding frame 100 are arranged opposite to each other.

[0061] The cover plate 203 is fixedly connected to the periphery 103 of the shielding frame 100 via the peripheral side plate 201, ensuring a tight connection between the shielding frame 100 and the shielding cover 200 and preventing possible electromagnetic leakage. Furthermore, the relative arrangement of the cover plate 203 and the shielding frame 100 forms a closed and complete receiving cavity. When the circuit module housed within this cavity is operating, the shielding structure provides a stable working environment free from electromagnetic interference, thereby ensuring the stability of the system operation.

[0062] The shielding frame 100 and the shielding cover 200 can be fitted together by means of a snap-fit ​​structure, welding, screw fixing, etc. Specifically, when the shielding frame 100 and the shielding cover are fitted together by a snap-fit ​​structure, a protruding snap is provided on the periphery 103 of the shielding frame 100, and a groove is provided at a corresponding position on the periphery plate 201 of the shielding cover 200. Thus, when the shielding cover 200 is placed on top of the shielding frame 100 and pressed down, the snap will be embedded in the groove, achieving a tight connection between the two.

[0063] In other embodiments, when the shielding frame 100 and the shielding cover 200 are connected by welding, a number of welding points are provided at the contact points between the periphery 103 of the shielding frame 100 and the shielding cover. The welding points enable the shielding frame 100 and the shielding cover 200 to close together, thereby forming a well-sealed cavity, which effectively prevents electromagnetic leakage or electromagnetic interference.

[0064] Wherein, the dimension of the connecting rib 110 along the first direction is less than or equal to the dimension of the peripheral side plate 201 along the first direction. The first direction is the direction in which the cover plate 203 of the shielding cover 200 and the shielding frame 100 are spaced apart. The first direction extends along the covering direction of the cover plate 203 of the shielding cover 200 and is perpendicular to the frame plate 101 of the shielding frame 100. In some embodiments, the dimension of the connecting rib 110 along the first direction can be equal to the dimension of the peripheral side plate 201 along the first direction. When the dimension of the connecting rib 110 along the first direction is equal to the dimension of the peripheral side plate 201 along the first direction, the connecting rib 110 can just fit with the cover plate 203 in the first direction, so as not to affect the overall structure of the shielding cover 200. Moreover, the connection rib 110 and the cover plate 203 fit together in the first direction, forming electromagnetic shielding between the circuit modules corresponding to the adjacent hollow areas 102, thereby improving the shielding effect.

[0065] In some embodiments, the dimension of the connecting rib 110 along the first direction may also be smaller than the dimension of the peripheral side plate 201 along the first direction. For example, when it is necessary to avoid a specific structure of the circuit module, the dimension of the connecting rib 110 must be smaller than the dimension of the peripheral side plate 201 in the first direction, so as not to damage the original electronic components or structure of the circuit module and ensure that it can work normally.

[0066] Therefore, the dimensions of the connecting rib 110 along the first direction can be specifically set according to the actual situation, so that it can be flexibly laid out in the receiving cavity and its size can be adjusted according to the actual situation. At the same time, the connecting rib 110 can also provide electromagnetic shielding between the various circuit modules in the receiving cavity to prevent electromagnetic interference.

[0067] The dimensions (e.g., width, thickness) of the connecting rib 110 in other directions can be set according to actual conditions. In actual setting, appropriate dimensions are selected based on the shielding requirements of the shielding structure, the sensitivity or structural strength requirements of different circuit modules, and the layout requirements within the receiving cavity, so as to better provide electromagnetic shielding for the circuit modules within the receiving cavity. For example, when the circuit module corresponding to the adjacent hollow region 102 includes a sensitive circuit module, the thickness or width of the connecting rib 110 can be appropriately adjusted according to the width of the frame plate region 120 between the circuit modules, thereby providing better electromagnetic shielding for the adjacent sensitive circuit module and further ensuring that the sensitive circuit is not subject to electromagnetic interference.

[0068] In some embodiments, the shape of the projection of the connecting rib 110 onto the plane of the frame plate 101 includes a straight line, an L-shape, or an arc shape, etc. The shape of the connecting rib 110 can be set according to specific circumstances and is not limited here. For example, when the target edge position 105 of the connecting rib 110 between the two adjacent circuit modules needs to be in an L-shaped geometry, the shape of the connecting rib 110 is also L-shaped. The connecting rib 110 is closely attached to the frame plate 101 of the shielding frame 100, and one side of the connecting rib 110 extends along one side of the target edge position 105, while the other side extends along the other side perpendicular to it. Thus, the connecting rib 110 can effectively isolate the electromagnetic interference present between the two adjacent circuit modules.

[0069] In some embodiments, the connection method between the connecting rib 110 and the shielding frame 100 includes welding connection, wherein the contact surfaces of the connecting rib 110 and the shielding frame 100 are fixed by welding. The welding connection can not only maintain the original performance of the connecting rib 110 and the shielding frame 100, but also make the connecting rib 110 and the shielding frame 100 fit tightly together.

[0070] In other embodiments, the connection between the connecting rib 110 and the shielding frame 100 can also be achieved by snap-fit ​​connection or riveting. The specific connection method needs to take into account various factors. For example, different materials may require different connection methods, and the different requirements of electromagnetic shielding effectiveness, mechanical strength, etc., for different devices will also result in different connection methods. In practical applications, multiple different connection methods may be combined to achieve various specific requirements.

[0071] In some embodiments, a thermally conductive adhesive 202 is further provided on the inner side of the shielding cover 200. The thermally conductive adhesive 202 is disposed on the inner side of the shielding cover 200. When a circuit module is accommodated within the cavity formed by the shielding cover 200 and the shielding frame 100, it contacts the circuit module and conducts the heat generated by the circuit module to the shielding cover 200 for heat dissipation. The position of the thermally conductive adhesive 202 should be specifically set according to the heat generation of the circuit module. For example, when the heat-generating electronic components in the circuit module are relatively concentrated, i.e., the heat generation area is relatively concentrated, the thermally conductive adhesive 202 is disposed in the corresponding area on the inner side of the shielding cover 200; while when there are multiple heat-generating electronic components in the circuit module and they are relatively dispersed, multiple thermally conductive adhesives 202 can be disposed on the inner side of the shielding cover 200 corresponding to the position of each heat-generating electronic component.

[0072] By precisely placing the thermally conductive adhesive 202 at a key position between the heat-generating electronic component and the shielding cover 200, heat can be directly transferred from the electronic component to the shielding cover 200, thereby avoiding internal heat accumulation and ensuring that heat can be conducted away immediately, thus significantly reducing the temperature of the heat-generating electronic component.

[0073] In some embodiments, the amount of thermally conductive adhesive 202 needs to be set according to specific circumstances. When there are electronic components with high heat intensity in the circuit module, multiple thermally conductive adhesives 202 need to be placed at the positions corresponding to the electronic components inside the shielding cover 200 to increase the heat conduction path and ensure rapid heat dissipation; while for electronic components with low heat intensity in the circuit module, which generate less heat, a small amount of thermally conductive adhesive 202 can be placed at the corresponding positions inside the shielding cover 200 to meet the heat dissipation requirements.

[0074] In some embodiments, the thermally conductive adhesive 202 is disposed in multiple regions of the shielding cover 200 that are directly opposite the multiple hollow regions 102. Thus, with the thermally conductive adhesive 202 disposed in each of the multiple regions of the shielding cover 200 opposite the multiple hollow regions 102, and a circuit module being accommodated at a position corresponding to the hollow region 102, the thermally conductive adhesive 202 can contact the circuit module, thereby conducting the heat generated by the circuit module to the shielding cover 200 for heat dissipation.

[0075] The size of the thermally conductive adhesive 202 should match the size of the corresponding heat-generating electronic component, but no specific limitation is made here. The size and quantity of the thermally conductive adhesive 202 can also be determined based on the thermal conductivity of its material. If the thermal conductivity of the thermally conductive adhesive 202 is high, its area or quantity can be appropriately reduced to a certain extent. Conversely, if the thermal conductivity of the material of the thermally conductive adhesive 202 is low, its area or quantity needs to be increased to ensure sufficient heat conduction.

[0076] In the above embodiments, the material of the thermally conductive adhesive 202 may include silicone-based thermally conductive adhesive, epoxy resin-based thermally conductive adhesive, etc. The material of the thermally conductive adhesive can be set according to specific circumstances and is not specifically limited here. For example, when the equipment needs to operate in a high-temperature environment, it is necessary to select a material that can withstand the high-temperature environment and maintain its thermal conductivity for a long time; while when there is a high-voltage circuit in the circuit module, a material with strong electrical insulation is required to prevent short circuits between the circuit modules and further ensure the safe operation of the equipment. In practical applications, multiple different thermally conductive materials may be selected based on the actual situation to achieve various specific requirements.

[0077] By properly configuring the thermally conductive adhesive 202 according to actual setup requirements, its thermal conductivity can be enhanced, ensuring effective heat transfer under various conditions and enabling heat to be conducted away quickly.

[0078] In some embodiments, the material of the connecting rib 110 may include the same material as the shielding frame 100. The material of the connecting rib 110 can be chosen depending on the specific circumstances. When the electromagnetic shielding requirements of the shielding structure are very high, the material of the connecting rib 110 needs to be a material with excellent conductivity; while when the mechanical strength requirements of the shielding structure are very high, a material with good strength and toughness needs to be chosen. In practical applications, multiple different materials may be selected based on the actual situation to achieve various specific requirements.

[0079] By rationally selecting and setting the material of the connecting rib 110, the interference of external electromagnetic interference on the circuit modules inside the cavity can be reduced, and the electromagnetic shielding effectiveness between different circuit modules inside the cavity can be effectively improved, thereby enhancing the stability of the system operation. Selecting appropriate materials can also enhance the structural strength of the shielding frame 100 and improve the stability of the structure.

[0080] Please see Figure 6 , Figure 6 This is a structural block diagram of an electronic device according to an embodiment of the present invention. Figure 6 As shown, the electronic device 300 includes a circuit module 311 and a shielding structure 1 as described in any of the foregoing embodiments, with at least a portion of each circuit module 311 disposed within the shielding structure 1.

[0081] By placing at least a portion of each circuit module 311 within the aforementioned shielding structure 1, the electronic device 300 can improve its electromagnetic shielding effect and ensure normal operation of the device.

[0082] Please refer to the following: Figure 7 The electronic device 300 further includes a circuit board 310, wherein after at least a portion of each circuit module 311 is disposed within the shielding structure 1, the pins of each circuit module 311 can extend from the corresponding hollow region 102 and be soldered onto the circuit board 310.

[0083] The specific structure of the shielding structure 1 can be found in any of the foregoing embodiments, and will not be repeated here.

[0084] In the above embodiment, the shielding frame 100 of the shielding structure 1 is provided with a hollow area 102 on the frame plate 101 corresponding to the positions of different circuit modules 311 on the circuit board 310, providing a passage space for the corresponding circuit modules 311 on the circuit board 310, so that the circuit modules 311 can pass smoothly through the hollow area 102 of the shielding frame 100. Thus, the shielding frame 100 can effectively accommodate the circuit modules 311 in the accommodating cavity without hindering the normal operation of the circuit modules 311.

[0085] The shielding frame 100 and the circuit board 310 can be fixedly connected, for example, by welding. A strong connection is formed by welding the connection points on the shielding frame 100 to the metal pads on the circuit board 310. In other embodiments, the shielding frame 100 and the circuit board 310 can also be connected by snap-fit ​​mechanisms. For example, matching snap-fit ​​and slot structures are provided on the shielding frame 100 and the circuit board 310. Other connection methods include screw fixing. The connection method between the shielding frame 100 and the circuit board 310 can be selected according to actual conditions and is not specifically limited here.

[0086] Through the above configuration, the shielding frame 100 and the circuit board 310 form a tightly fitted structure. This tightly fitted structure allows the shielding frame 100 to better surround the circuit modules 311 on the circuit board 310, forming continuous electromagnetic shielding, making the electromagnetic shielding effect more effective. Furthermore, the tight fit between the shielding frame 100 and the circuit board 310 can effectively prevent electromagnetic interference that may exist between different circuit modules 311, thus playing an electromagnetic shielding role. The tightly fitted structure can also provide a more stable working environment and reduce interference from external electromagnetic noise, i.e., electromagnetic interference signals. Therefore, the shielding structure 1 can effectively prevent electromagnetic interference between different circuit modules 311 within the cavity and can also block the influence of external electromagnetic interference signals on the circuit modules 311 located inside the shielding structure 1.

[0087] In the above embodiments, the descriptions of each embodiment have their own emphasis. Parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments. The embodiments of this utility model have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this application. Furthermore, for those skilled in the art, based on the ideas of this application, there will be changes in specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the above embodiments should be included within the protection scope of the described technical solutions.

Claims

1. A shielding structure, characterized by, The shielding structure comprises: a shielding frame, which comprises a frame plate and a plurality of independent hollow regions penetrating through the frame plate; a connecting rib, which is arranged at a target edge position of at least one hollow region, the target edge position comprising at least part of a target edge where the hollow region is adjacent to a neighboring hollow region. Each hollow region is used to correspond to a circuit module, and at least part of the circuit module passes through the hollow region.

2. The shielding structure of claim 1, wherein The shielding frame further comprises a shielding plate arranged at least at a target edge of each hollow region, and the target edge position is a position where the shielding plate is not arranged.

3. The shielding structure of claim 1, wherein, The shielding structure further comprises a shielding cover, which is combined with the shielding frame to form a shielding structure with a containing cavity inside, the containing cavity being used to contain at least part of each circuit module, and at least part of each circuit module passes through the corresponding hollow region.

4. The shielding structure of claim 3, wherein, The connecting rib extends from the frame plate of the shielding frame to the side of the shielding cover, and is located between adjacent circuit modules to mutually shield a plurality of circuit modules contained in the containing cavity.

5. The shielding structure of claim 3, wherein, The shielding cover comprises a cover plate and a peripheral side plate connected to the cover plate, the shielding cover is fixed to the peripheral edge of the shielding frame through the peripheral side plate, the cover plate is arranged opposite to the shielding frame, the size of the connecting rib in a first direction is less than or equal to the size of the peripheral side plate in the first direction, and the first direction is the direction in which the cover plate of the shielding cover and the shielding frame are spaced apart.

6. The shielding structure of claim 1, wherein The projection of the connecting rib on the plane of the frame plate comprises a straight line type, an L type or a circular arc shape.

7. The shielding structure of claim 1, wherein The connecting rib and the shielding frame are connected by welding, and the contact surface of the connecting rib and the shielding frame is fixed by welding.

8. The shielding structure of claim 3, wherein, The inside of the shielding cover is provided with a heat-conducting adhesive.

9. The shielding structure of claim 8, wherein, The heat-conducting adhesive is arranged in a plurality of regions of the shielding cover opposite to the plurality of hollow regions of the shielding frame.

10. An electronic device, comprising: The shielding structure comprises a plurality of circuit modules and the shielding structure according to any one of claims 1-9, and at least part of each circuit module is arranged in the shielding structure.

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