Passive filtration for improved tank efficiency

Abstract

An immersion cooling system includes an immersion tank defining a cavity retaining a dielectric fluid, an electrical component disposed within the cavity, wherein at least a portion of the electrical component is immersed in the dielectric fluid retained within the cavity, and a sorbent material disposed within the cavity and in fluid communication with the dielectric fluid, wherein dielectric fluid in contact with the sorbent material is circulated by boiling of the dielectric fluid in thermal communication with the electrical component to adsorb contaminants within the dielectric fluid.

Description

FL2136-US01-PRVTITLEPASSIVE FILTRATION FOR IMPROVED TANK EFFICIENCYFIELD

[0001] The present disclosure related to the field of cooling systems, and in particular, immersion cooling.BACKGROUND

[0002] Contamination is one of the most significant concerns for end users of immersion cooling, such as two-phase immersion cooling systems. In two-phase immersion cooling systems, contaminants can come from many different sources, including plasticizers from cables and other flexible components, from thermal interface materials, such as thermal greases, and from other components. Contaminants can have a significant impact on the two-phase immersion cooling system, such as depositing on different components in the two-phase immersion cooling tank, notably boiler plates, servers, and other heat transfer surfaces. As can be appreciated, deposits of contaminants on these components of the two-phase immersion cooling system can lead to an increase in chip temperature and a decrease in performance and IT hardware lifespan. Some of these contaminants can also be absorbed by materials in the immersion cooling tank, leading to secondary swelling. Additionally, contaminants can impact the properties of the working fluid, potentially by a reaction between the working fluid and contaminants, or by changing the dielectric properties of the working fluid.

[0003] As can be appreciated, sorbent materials and filters used to filter the contaminants from the working fluid are a critical component to maintaining the cleanliness of the immersion cooling tank by continually removing contaminants before they reach levels that are high enough to lead to detrimental effects.SUMMARY

[0004] An immersion cooling system includes an immersion tank defining a cavity retaining a dielectric fluid, an electrical component disposed within the cavity, wherein at least a portion of the electrical component is immersed in the dielectricFL2136-US01-PRV fluid retained within the cavity, and a sorbent material disposed within the cavity and in fluid communication with the dielectric fluid, wherein dielectric fluid in contact with the sorbent material is circulated by boiling of the dielectric fluid in thermal communication with the electrical component to adsorb contaminants within the dielectric fluid.

[0005] In aspects, the sorbent material may be buoyant in the dielectric fluid.

[0006] In other aspects, the sorbent material may be disposed within a buoyant pouch.

[0007] In certain aspects, the buoyant pouch may be wholly submerged within the dielectric fluid.

[0008] In other aspects, the buoyant pouch may be partially submerged within the dielectric fluid.

[0009] In aspects, the sorbent material may be disposed within a perforate container.

[0010] In other aspects, the perforate container may be selectively coupled to an inner surface of the cavity.

[0011] In certain aspects, the perforate container may be selectively coupled to the electrical component.

[0012] In aspects, the perforate container is integrally formed within an interior surface of the cavity.

[0013] In certain aspects, the circulation of the dielectric fluid in contact with the sorbent material is passively generated.

[0014] In other aspects, the immersion cooling system may not include a pump for effectuating circulation of the dielectric fluid in contact with the sorbent material.

[0015] In aspects, the immersion cooling system may not include a pump for effectuating circulation of the dielectric fluid within the cavity and does not include a pump for effectuating circulation of the dielectric fluid in contact with the sorbent material.FL2136-US01-PRV

[0016] In certain aspects, the immersion cooling system may include a controller including a processor and a memory operably coupled to the processor, the memory storing instructions, which when executed, cause the processor to intermittently actuate a pump in fluid communication with the dielectric fluid to effectuate circulation of the dielectric fluid within the cavity.

[0017] In accordance with another aspect of the disclosure, an immersion cooling system includes an immersion tank defining a cavity retaining a fluid, an electrical component disposed within the cavity and at least partially immersed within the fluid, and a passive filter disposed within the cavity and at least partially immersed within the fluid, the passive filter including a container and a sorbent material selectively retained within the container and in fluid communication with the fluid retained in the cavity, wherein a flow of dielectric fluid through the passive filter is effectuated by natural circulation of the fluid within the cavity.

[0018] In certain aspects, the fluid may be a two-phase dielectric fluid.

[0019] In aspects, the natural circulation of the fluid within the cavity may be effectuated by boiling of fluid in thermal communication with the electrical component.

[0020] In other aspects, the container may be coupled to an inner surface of the cavity.

[0021] In certain aspects, the container may be selectively coupled to the electrical component.

[0022] In aspects, the immersion cooling system may into include a pump for effectuating the flow of the fluid through the passive filter.

[0023] In certain aspects, the immersion cooling system may not include a pump for effectuating the flow of fluid through the passive filter and circulation of the fluid within the cavity is effectuated without the use of the pump.

[0024] In other aspects, the immersion cooling system may include a controller including a processor and a memory operably coupled to the processor, the memory storing instructions, which when executed, cause the processor to intermittentlyFL2136-US01-PRV actuate a pump in fluid communication with the fluid to effectuate circulation of the fluid within the cavity.

[0025] In accordance with another embodiment of the disclosure, an immersion cooling system includes a receptacle defining a cavity retaining a fluid, an energy source disposed within the cavity and at least partially immersed within the fluid, and a passive filter at least partially immersed within the fluid, the passive filter including a sorbent material, wherein a flow of fluid through the passive filter is effectuated by natural circulation of the fluid within the cavity.

[0026] In aspects, the natural circulation of the fluid within the cavity may be effectuated by boiling of fluid in thermal communication with the energy source.

[0027] In other aspects, the fluid may be a two-phase dielectric fluid.

[0028] In certain aspects, the passive filter may be integrally formed with a wall of the receptacle.

[0029] In aspects, the immersion cooling system may include a second passive filter at least partially immersed within the fluid, wherein the second passive filter is selectively coupled to the energy source.

[0030] In other aspects, the immersion cooling system may not include a pump for effectuating the flow of the fluid through the passive filter.

[0031] In certain aspects, the immersion cooling system may not include a pump for effectuating the flow of the fluid through the passive filter and circulation of the fluid within the cavity is effectuated without the use of a pump.

[0032] In aspects, the immersion cooling system may include a controller including a processor and a memory operably coupled to the processor, the memory storing instructions, which when executed, cause the processor to intermittently actuate a pump in fluid communication with the fluid to effectuate circulation of the fluid within the cavity.

[0033] In accordance with another aspect of the disclosure, a method for filtering contaminants from a dielectric fluid retained in an immersion tank includes boiling dielectric fluid in thermal communication with an electrical component disposed within a cavity defined by an immersion tank, wherein at least a portion of theFL2136-US01-PRV electrical component is immersed in the dielectric fluid, circulating the dielectric fluid, without the use of a pump, about a sorbent material disposed within the cavity and in fluid communication with the dielectric fluid, and adsorbing contaminants from dielectric fluid in contact with and circulating about the sorbent material.

[0034] In aspects, circulating the dielectric fluid may include circulating the dielectric fluid, without the use of a pump, within the cavity using natural convection.

[0035] In certain aspects, circulating the dielectric fluid may include circulating the dielectric fluid, without the use of a pump, within the cavity and about the sorbent material using natural convection.

[0036] In other aspects, the method may include intermittently actuating a pump in fluid communication with the dielectric fluid to circulate the dielectric fluid within the cavity.

[0037] In certain aspects, circulating the dielectric fluid may include circulating the dielectric fluid within the cavity and about the sorbent material using natural convection and intermittently actuating a pump in fluid communication with the dielectric fluid.

[0038] In aspects, circulating the dielectric fluid may include circulating the dielectric fluid about sorbent material disposed within walls of the immersion tank.

[0039] In other aspects, circulating the dielectric fluid may include circulating the dielectric fluid about sorbent material disposed within a buoyant pouch.

[0040] In certain aspects, circulating the dielectric fluid may include circulating the dielectric fluid about a sorbent material that is partially immersed within the dielectric fluid.

[0041] In aspects, circulating the dielectric fluid may include circulating the dielectric fluid about a sorbent material that is entirely immersed within the dielectric material.

[0042] In other aspects, circulating the dielectric fluid may include circulating the dielectric fluid about a sorbent material that is disposed on a portion of the electrical component.FL2136-US01-PRV

[0043] In aspects, the sorbent material includes activated carbon. In some such aspects, the activated carbon is particulate activated carbon. In some such aspects, the particulate activated carbon has a mean diameter between 0.42 millimeters (mm) to 2.36 mm, such as between 0.59 mm and 2.36 mm, or between 0.42 mm and 1.4 mm.

[0044] In aspects, the dielectric fluid includes HFO-153-10mczz(E), HFO-153- 10mzzy(E), or a combination thereof.

[0045] In aspects, plasticizers present in the dielectric fluid have a solubility of at least 100 parts per million (ppm), at least 250 ppm, at least 500 ppm, at least 1000 ppm, at least 2000 ppm, at least 3000 ppm, at least 4000 ppm, at least 5000 ppm, at least 6000 ppm, or at least 7000 ppm. The plasticizers may be selected from the group consisting of Diisodecyl phthalate (DIDP), Dioctyl phthalate (DOP), Bis[2-(2- butoxyethoxy)ethyl] adipate (BBOEA), Acetyl Tributyl Citrate (ATBC), Bis(2- ethylhexyl) adipate (DOA), dioctyl terephthalate (DOTP), trioctyl trimellitate (TOTM), diisononylphthalate and diisodecylphthalate, and a combination of two or more thereof.

[0046] In aspects, plasticizers present in the dielectric fluid have a solubility of between 100 parts per million (ppm) to 7500 ppm. The plasticizers may be selected from the group consisting of Diisodecyl phthalate (DIDP), Dioctyl phthalate (DOP), Bis[2-(2-butoxyethoxy)ethyl] adipate (BBOEA), Acetyl Tributyl Citrate (ATBC), Bis(2- ethylhexyl) adipate (DOA), dioctyl terephthalate (DOTP), trioctyl trimellitate (TOTM), diisononylphthalate and diisodecylphthalate, and a combination of two or more thereof.

[0047] In aspects, the dielectric fluid is configured to undergo a phase transition from a liquid to a gaseous state over an operational temperature range of the immersion cooling system. In some such aspects, the operational temperature is at least 25° C, at least 30° C, at least 40° C, at least 50° C, at least 60° C, less than 100° C, less than 90° C, less than 80° C, less than 70° C, less than 60° C, or any combination or range thereof or sub-range therebetween.

[0048] Other features and advantages of the present invention will be apparent from the following more detailed description, taken in conjunction with theFL2136-US01-PRV accompanying drawings which illustrate, by way of example, the principles of the invention.BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Various aspects and embodiments of the disclosure are described hereinbelow with references to the drawings, wherein:

[0050] FIG. 1 is a schematic view of an immersion cooling system in accordance with the disclosure;

[0051] FIG. 2 is a schematic view of an electrical component of the immersion cooling system of FIG. 1 ;

[0052] FIG. 3 is a schematic view of an immersion cooling tank of the immersion cooling system of FIG. 1 ;

[0053] FIG. 4 is a schematic view of another embodiment of an immersion cooling tank of the immersion cooling system of FIG. 1 ;

[0054] FIG. 5 is a schematic view of yet another embodiment of an immersion cooling tank of the immersion cooling system of FIG. 1 ;

[0055] FIG. 6 is a schematic view of still another embodiment of an immersion cooling tank of the immersion cooling system of FIG. 1 ;

[0056] FIG. 7 is a plot showing sorption of various plasticizers from immersion fluids onto particulate activated carbon at 22°C;

[0057] FIG. 8 is a schematic view of a workstation of the immersion cooling system of FIG. 1; and

[0058] FIG. 9 is a flow diagram of a method for filtering contaminants from dielectric fluid retained in an immersion tank in accordance with the disclosure.

[0059] Wherever possible, the same reference numbers will be used throughout the drawings to represent the same parts.DETAILED DESCRIPTION

[0060] Large scale computer server systems can perform significant workloads and generate a large amount of heat during their operation. A significant portion ofFL2136-US01-PRV the heat is generated from their operation. Due in part to the amount of heat generated, these systems are typically mounted in stacked configurations with large internal cooling fans and heat dissipating fins. As the size and density of these systems increases the thermal challenges are even greater, and eventually outpace the ability for forced air systems.

[0061] Two-phase immersion cooling is an emerging cooling technology for the high-performance cooling market as applied to high performance server systems. It relies on the heat absorbed in the process of vaporizing a liquid immersion fluid to a gas. The fluids used in this application must meet certain requirements to be viable in use. For example, the normal boiling temperature of the fluid should be in the range between 30-75°C. Generally, this range accommodates maintaining the server components at a sufficiently cool temperature while allowing generated heat to be rejected effectively to an external heat sink. Alternatively, the operating temperature of the server, and the immersion cooling system could be raised or lowered, by using an enclosed system and raising or lowering the pressure within the system to raise or lower the boiling point of a given fluid.

[0062] Single phase immersion cooling has a long history in computer server cooling. There is no phase change in single phase immersion cooling. Instead, the liquid warms as it circulates through the computer server and or heat exchanger, and then is circulated with a pump to a heat exchanger for cooling prior to returning to the server, thus transferring heat away from the computer server. Fluids used for single phase immersion cooling typically have similar requirements as those for two-phase immersion cooling, except that the normal boiling temperatures are typically higher than 30-75°C.

[0063] Turning to the drawings, FIG. 1 illustrates an embodiment of an immersion cooling system in accordance with the disclosure and generally identified by reference numeral 10. The immersion cooling system 10 generally includes a receptacle or immersion tank 12 and a fluid cooling loop 50 operably coupled to the immersion tank 12.

[0064] The immersion tank 12 defines a generally rectangular box shaped configuration having side surfaces 14 extending between a lower surface 16 and an opposed, upper surface 18. Although generally described as defining a rectangularFL2136-US01-PRV configuration, it is envisioned that the immersion tank 12 may define any suitable configuration, such as circular, elliptical, racetrack, square, hexagonal, and combinations thereof, without departing from the scope of the disclosure. The immersion tank 12 includes an inner surface 20 defining a cavity 22. The cavity 22 extends longitudinally through the upper surface 18 towards the lower surface 16 and terminates at a bottom surface 24. In embodiments, the cavity 22 may extend through both the lower surface 16 and the upper surface 18, depending upon the design needs of the immersion cooling system 10.

[0065] The cavity 22 is configured to retain a fluid 26, which in embodiments, may be a dielectric working fluid. It is envisioned that the fluid 26 may be any suitable fluid configured for use with an immersion cooling system, such as FK-5-1-12 (perfluoro(2-methyl-3-pentanone)), HFE-7100 (methoxy-nonafluorobutane), FC- 3284, FC-72, HT-55, HFO-153-10mczz(E), HFO-153-10mzzy(E), etc.

[0066] In some embodiments, the composition of the fluid 26 includes one or more fluorinated compounds. In some embodiments, the fluid 26 includes one or more compounds including both fluorine and chlorine. In some embodiments, the fluid 26 includes one or more hydrofluorinated olefins. The fluid 26 can be selected to exhibit a dielectric constant, volume resistivity, dielectric strength, and / or loss tangent (e.g., dissipation factor) suitable for direct contact with electrical components. In this manner, materials exhibiting a low dielectric constant, low loss tangent or dissipation factor, high volume resistivity, and / or large dielectric strength provide increased electrical insulation, and in some instances, reduced signal loss. In embodiments, the dielectric constant of the fluid 26 may be less than about 8 over the operational frequency range (which may go as high as 100 GHz). Suitable fluids 26 include compounds and mixtures having a dielectric constant over the operational frequency range (up to about 100 GHz) of less than 2.5, or less than 2.0, or less than 1.9.Other embodiments include compounds and mixtures having a dielectric constant about greater than 1.0 and less than 2.0 or about greater than 1.5 and less than 2.5. The dielectric constant can be measured using ASTM D924, which provides a procedure for making referee tests at a commercial frequency of between 45 to 65 Hz. Suitable test methods for measuring the dielectric constant are also described in U.S. Patent No. 11,765,859, issued September 19, 2023, the disclosure of which is incorporated by reference in its entirety. For example, U.S. Patent No. 11 ,765,859FL2136-US01-PRV describes a method for measuring dielectric constant for high frequencies up to 67GHz. In embodiments, the fluid 26 may be selected based upon properties such as being non-flammable or presenting no flash point. Standards such as ASTM D56, D1310, D92, D93 and E681 can be used to assess flammability.

[0067] In some embodiments, the fluid 26 undergoes a phase transition from a liquid to a gaseous state over the operational temperature range of the immersion cooling system 10. In some embodiments, the operational temperature is at least 25° C, at least 30° C, at least 40° C, at least 50° C, at least 60° C, less than 100° C, less than 90° C, less than 80° C, less than 70° C, less than 60° C, and any combination or range thereof or sub-range therebetween.

[0068] In certain embodiments, the fluid 26 includes HFO-153-10mczz(E), HFO- 153-10mzzy(E), or a combination thereof. As described in U.S. / PCT Patent Application No. PCT / US2024 / 034654, filed June 20, 2024, titled “COMPOSITIONS OF IMMERSION FLUIDS WITH CONTAMINANTS” (Docket No. FL2072), the disclosure of which is incorporated by reference in its entirety, HFO-153-10mczz(E) and HFO-153-10mzzy(E) are environmentally friendly (i.e. , have a low global warming potential (GWP) and low ozone depletion potential (ODP)). Additionally, HFO-153-10mczz(E) and HFO-153-10mzzy(E) have equivalent or superior heat transfer properties, including electronic surface-to-fluid thermal resistance, critical heat flux and fluid-to-condenser thermal resistance, compared to relatively higher GWP immersion fluids such as FC-72 and FC-3284. Additionally, HFO-153- 10mczz(E) and HFO-153-10mzzy(E) have suitable dielectric properties required by the application, or even superior dielectric properties, including, for example, high volume resistivity, low dielectric constant, high dielectric strength and low loss tangent, compared to relative higher GWP fluids such as such as FC-72 and FC- 3284. Additionally, HFO-153-10mczz(E) and HFO-153-10mzzy(E) are compatible with the electrical components contained within immersion cooling systems, e.g., do not attack or significantly swell any of the electrical components, and do not extract anything from any of the computer components which would degrade or compromise the dielectric properties of the working fluids. Additionally, HFO-153-10mczz(E) and HFO-153-10mzzy(E) have similar normal boiling points compared to relative higher GWP fluids such as such as FC-72 and FC-3284 and, suitably, have an appropriate normal boiling point to be an effective immersion cooling working fluid. In thisFL2136-US01-PRV regard, HFO-153-10mczz(E) and HFO-153-10mzzy(E) can suitably replace higher GWP fluids in immersion cooling systems without significant loss in thermal performance or mechanical modifications.

[0069] HFO-153-10mczz(E) and / or HFO-153-10mzzy(E) are also advantageously used as the fluid 26 in certain embodiments due to the relatively higher solubility of contaminants (e.g., plasticizers) in these dielectric working fluids, as compared to higher GWP fluids such as FC-72, FC-3284, and FK-5-1-12, in which the solubility of contaminants such as plasticizers is relatively low. Solubility data for contaminants such as plasticizers in dielectric fluids such as HFO-153-10mczz, HFO-153-10mzzy, FK-5-1-12, and FC-72, is described below and U.S. / PCT Patent Application No. PCT / US2024 / 034654, filed June 20, 2024, titled “COMPOSITIONS OF IMMERSION FLUIDS WITH CONTAMINANTS” (Docket No. FL2072), the disclosure of which is incorporated by reference in its entirety.

[0070] Plasticizers can include but are not limited to: tris-2-ethylhexyl trimellitate, dioctyl terephthalate (DOTP), diisobutyl terephthalate, N-butyl benzene sulfonamide, diethylsuccinate, dimethylsuccinate, Di-isodecyl sebacate, Di-2-ethylhexyl sebacate, Dibutyl sebacate, Dibutyl sebacate, Hexanedioic acid polymer with 2,2-dimethyl-1,3- propanediol and 1,2-propanediol isononyl ester, Hexanedioic acid polymer with 1 ,2- propanediol octyl ester, Hexanedioic acid polymer with 1,2-propanediol, acetate, Tris(2-ethylhexyl) phosphate, 2-ethylhexyl diphenyl phosphate, Triphenyl phosphate, 2,2,4-trimethyl-1 ,3 pentanediol di-isobutyrate, Pentaerythritol ester of valeric acid (PETV), Alkylsulphonic acid ester with phenol (ASE), Di-C16-18 alkyl phthalate, Benzyl C7-9-branched and linear alkyl phthalate, Diisotridecyl phthalate, Diisoundecyl phthalate, Di(2-propyl heptyl) phthalate, Diisodecyl phthalate (DI DP), Diisononyl phthalate, Bis(2-ethylhexyl) phthalate (DOA), Diisooctyl phthalate, Di-n- octyl phthalate, Diisoheptyl phthalate, Dicyclohexyl phthalate, Diisohexyl phthalate, Di-n-hexyl phthalate, Di-n-pentyl phthalate, Benzyl butyl phthalate, Diisobutyl phthalate, Di-n-butyl phthalate. Di-n-propyl phthalate, Diethyl phthalate, Dimethyl phthalate, Epoxidised soybean oil, Epoxidised linseed oil, Di-isononyl cyclohexane dicarboxylate, Acetyl tributyl citrate (ATBC), Tributyl citrate, Triethyl citrate, Triethylene glycol dibenzoate, Isodecyl benzoate, isononyl benzoate, dipropylene glychol dibenzoate, diethylene glycol dibenzoate, neopetnylglycol dibenzoate, diisodecyl azelate, Bis[2-(2-butoxyethoxy)ethyl]adipate (BBOEA), Di-(2-FL2136-US01-PRV butoxyethyl)adipate, Di-n-butyl adipate, Ditridecyl adipate, Diisodecyl adipate, diisononyl adipate, Di-2-ethylhexyl adipate, Benzyl 2-ethylhexyl adipate, Diisobutyl adipate, Glyceryl triacetate, trioctyl trimellitate (TOTM), and combinations thereof.

[0071] In embodiments, the plasticizers include Diisodecyl phthalate (DIDP), Dioctyl phthalate (DOP), Bis[2-(2-butoxyethoxy)ethyl] adipate (BBOEA), Acetyl Tributyl Citrate (ATBC), Bis(2-ethylhexyl) adipate (DOA), dioctyl terephthalate (DOTP), trioctyl trimellitate (TOTM), diisononylphthalate and diisodecylphthalate, and combinations thereof.

[0072] In some embodiments, the fluid 26 is selected such that a solubility of plasticizers (e.g., DIDP, DOP, BBOEA, ATBC, DOA, DOTP, and / or TOTM) in the fluid 26 is at least 100 parts per million (ppm), at least 250 ppm, at least 500 ppm, at least 1000 ppm, at least 2000 ppm, at least 3000 ppm, at least 4000 ppm, at least 5000 ppm, at least 6000 ppm, or at least 7000 ppm. In some embodiments, the solubility of plasticizers in the fluid 26 is between 100 ppm to 7500 mm, or any subrange therebetween.

[0073] Contaminants other than plasticizers could include other extractables from thermal pastes, solder fluxes, and other process fluids originating from tank and server components, such as polydimethylsulfoxides.

[0074] Still referring to FIG. 1, one or more electrical components 28 are selectively supported within the cavity 22 using any suitable method, such as fasteners, adhesives, friction or interference fit, etc. and oriented in any suitable direction. In one non-limiting embodiment, the one or more electrical components 28 are selectively supported within the cavity 22 in a vertical orientation extending in a lower surface 16 to upper surface 18 direction. Although generally illustrated as being immersed in the fluid 26, it is envisioned that any or all of the electrical components 28 may be partially or wholly submerged in the fluid 26 depending upon the design needs of the immersion cooling system 10. It is contemplated that the electrical components 28 may be any electrical component, such as an energy storage device, a computer chip, a motherboard, a server, etc., and combinations thereof. In one non-limiting embodiment, the electrical components form part of a data center.FL2136-US01-PRV

[0075] It is envisioned that the one or more electrical components 28 may be disposed in spaced apart relation in a direction that is transverse to the vertical orientation. In this manner, the fluid 26 is permitted to flow between and immerse each of the one or more electrical components 28. It is envisioned that the one or more electrical components may be a processor or a microprocessor or an energy storage device.

[0076] Continuing with FIG. 1 and with additional reference to FIG. 2, in embodiments, one or more of the electrical components 28 may include a substrate 30, upon which a chip 32 is operably supported. In one non-limiting embodiment, each electrical component of the one or more electrical components 28 is substantially similar to one another and therefore, only one electrical component 28 will be described in detail hereinbelow in the interest of brevity. As can be appreciated, the chip 32 is in thermal communication with, and operably coupled to, the substrate 30 using any suitable means, such as thermal paste, welding, adhesives, etc. to enable the substrate 30 to act as a heat sink and absorb and / or release thermal energy generated by the chip 32. In one non-limiting embodiment, a boiler plate 34 is operably coupled to the chip 32 and disposed in a manner in which the chip 32 is interposed between the substrate 30 and the boiler plate 34. The boiler plate is in thermal communication with, and operably coupled to, the chip 32 using any suitable means, such as thermal paste, welding, adhesives, etc. to enable the boiler plate 34 to act as a heat sink and absorb and / or release thermal energy generated by the chip 32.

[0077] As can be appreciated, the substrate 30, the chip 32, and the boiler plate 34 cooperate to absorb and spread thermal energy generated by the chip 32 over a greater mass and surface area. When immersed in the fluid 26, the wetted area, or surface area, of the electrical component 28 is greater than if the chip 32 is immersed within the fluid 26 on its own or if coupled to the substrate 30 and immersed within the fluid 26. In this manner, the increased wetted area of the electrical component 28 enables a greater amount of thermal energy to transfer from the electrical component 28 to the fluid 26 and enable the electrical component 28 to maintain a more even heat distribution during steady state conditions and / or spikes in thermal energy generated due to the load applied to the chip 32.FL2136-US01-PRV

[0078] In operation, stagnant fluid 26 boils when in contact with the electrical components 28, which when under load or steady state operating conditions, may have a surface temperature that is above a fluid saturation temperature of the fluid 26. The boiling fluid 26, and resultant vapor, becomes less dense than the surrounding fluid 26, which causes the boiling fluid 26 to rise or otherwise flow towards the upper surface 18 of the immersion tank 12. This natural convection is a natural phenomenon that effectuates movement (e.g., circulation) of the fluid 26 within the immersion tank 12 without the aid of a pump or other mechanical fluid transfer device. Additionally or alternatively, a pump or other mechanical fluid transfer device can be included to effectuate movement (e.g., circulation) of the fluid 26 within the immersion tank 12.

[0079] The vapor resulting from the fluid 26 boiling emerges from the fluid 26 in a portion of the cavity 22 between a surface of the fluid 36 and the upper surface 18 of the immersion tank 12, mixes with vapor and / or other gases present in the cavity 22 forming a gas-vapor mixture 38 including non-condensable gases, such as nitrogen and oxygen. These non-condensable gases may be present in the fluid 26 and can be detrimental to boiling and condensation heat transfer. In embodiments, the immersion cooling system 10 may include a supplemental device (not shown) that at least partially removes or controls the level of non-condensable gases in the fluid 26.

[0080] As can be appreciated, the gas-vapor mixture 38 includes differing densities and temperatures dependent upon the proximity of the gas-vapor mixture 38 to the surface of the fluid 36. This density gradient or stratified gas-vapor mixture 38 may separate into two portions; a vapor rich mixture 40 adjacent to the surface of the fluid 36 and an air rich mixture 42 interposed between the vapor rich mixture 40 and the upper surface 18 of the immersion tank 12.

[0081] Returning to FIG. 1, in embodiments, the gas-vapor mixture 38 is condensed or otherwise liquified by a fluid cooling loop 50 operably coupled to the immersion tank 12. Although generally described herein as being a water / glycol loop, it is envisioned that the fluid cooling loop 50 may be any suitable type of cooling loop and may use any suitable type of cooling and / or working fluid without departing from the scope of the disclosure. The fluid cooling loop 50 includes a condenser 52 disposed within the cavity 22 and in thermal communication with theFL2136-US01-PRV gap-vapor mixture 38. It is envisioned that the condenser 52 may be any suitable condenser configured to condense gas and / or vapor and compatible with the fluid 26. In embodiments, fluid cooling loop 50 may include one or more condensers 52 depending upon the design needs of the immersion cooling system 10. In one nonlimiting embodiment, the condenser 52 is immersed in the gas-vapor mixture 38 to enable the gas-vapor mixture 38 to contact or otherwise be in thermal communication with a majority or entirety of the outer surface area of the condenser 52, although it is envisioned that any amount of the condenser 52 may be in thermal communication with the gas-vapor mixture 38 without departing from the scope of the disclosure.

[0082] The fluid cooling loop 50 includes a fluid cooler 54 in fluid communication with the condenser 52. It is envisioned that the fluid cooler 54 may be an air-cooled fluid cooler, a chiller, or any suitable fluid cooler depending upon the design needs of the immersion cooling system 10. In embodiments, the thermal energy transferred from the fluid cooling loop 50 may be released into the environment as opposed to using a fluid cooler 54. In one non-limiting embodiment, the thermal energy released by the fluid cooling loop 50 may be recovered and used for heating applications or for energy generation such as Rankine cycles.

[0083] The fluid cooling loop 50 includes a pump 56 in fluid communication with the condenser 52 and the fluid cooler 54. Although generally illustrated as being interposed between an outlet 52a of the condenser 52 and an inlet 54a of the fluid cooler 54, it is envisioned that the pump 56 may be disposed at any suitable location on the fluid cooling loop 50. As can be appreciated, the pump 56 circulates the fluid (not shown) within the fluid cooling loop 50 through the condenser 52 and the fluid cooler 54. In this manner, cooled fluid within the condenser absorbs thermal energy from the gas-vapor mixture 38 within the cavity 22 and causes the gas-vapor mixture 38 to cool and condense back into the liquid 26. The pump 56 transfers the fluid within the condenser that has been heated by the gas-vapor mixture 38 to the fluid cooler 54 where the heated fluid within the fluid cooling loop 50 is cooled and returned to the condenser 52.

[0084] In embodiments, a temperature of the fluid of the fluid cooling loop 50 exiting the condenser 52 may be between about 35° C and 45° C and a temperatureFL2136-US01-PRV of the fluid of the fluid cooling loop 50 exiting the fluid cooler 54 may be between about 30° C and 40° C. As can be appreciated, the immersion cooling system 10 may utilize any suitable system for condensing the gas-vapor mixture 38, and in embodiments, may be a mechanical cooling system or a free-cooling system without departing from the scope of the disclosure. As can be appreciated, the temperature of the fluid of the fluid cooling loop 50 exiting the condenser 52, and the temperature of the fluid of the cooling fluid loop 50 exiting the fluid cooler 54 may be between about 10°C and a predetermined temperature below (e.g., between 1°C to 10°C below, such as between 1° to 5°C below) the normal boiling temperature of the cooling fluid without departing from the scope of the disclosure.

[0085] The performance of the fluid 26 within the cavity 26 may be dependent upon the purity or contamination level of the fluid 26. For example, contaminants such as plasticizers, including those described above, from cables and other flexible components, from oils, such as hydrocarbon based or silicone oils, and from other components within the immersion tank 12 can change a dielectric constant of the fluid 26 and lead to deposits of contaminants on components of the immersion tank 12 and heat transfer surfaces, cause a degradation in the ability of the fluid 26 to transfer heat from the electrical components 28. Degradation in heat transfer properties or deposits of contaminants on heat transfer surfaces or other server and tank components can lead to increases in electrical component 28 temperatures and a corresponding decrease in electrical component 28 performance, as well as other functionality issues. In some instances, contaminants may be absorbed by materials within the immersion tank 12, leading to secondary swelling, increase the flammability of the fluid 26 or other components of the immersion tank 12, etc. As can be appreciated, these concerns may be of particular importance if the fluid 26 is a reactive fluid.

[0086] Turning to FIG. 3, the immersion tank 12 includes a passive filter, which in embodiments, may be a sorbent material or filter 60 in fluid communication with the fluid 26. In this manner, the sorbent material can be any suitable material that adsorbs contaminants from the fluid 26 as the fluid 26 is circulated within the cavity 22. In some embodiments, the sorbent material 60 is activated carbon. In some embodiments, the sorbent material 60 includes particulate activated carbon. In such embodiments, the particulate activated carbon included in the sorbent material has aFL2136-US01-PRV mean diameter between 0.42 millimeters (mm) to 2.36 mm, such as between 0.59 mm to 2.36 mm, or between 0.42 mm to 1.4 mm, or any value or sub-range therebetween. In some embodiments, the sorbent material 60 includes a single slab of activated carbon (e.g., in a monolithic structure).

[0087] In embodiments, the sorbent material 60 may be retained within a receptacle 62 or other suitable container. As can be appreciated, the receptacle 62 may be formed from a porous or perforate material or otherwise include one or more apertures permitting the flow of the fluid 26 into and out of the receptacle 62 and enabling wetting of the sorbent material 60. In embodiments, the immersion tank 12 may include a buffer tank 70 in fluid communication with the cavity 22. Although generally illustrated as being disposed external to the cavity 22, it is envisioned that the buffer tank 70 may be disposed wholly or partially within the cavity 22 or remote from the immersion tank 12 without departing from the scope of the disclosure.

[0088] The immersion tank 12 includes a circulation pump 72 in fluid communication with the fluid 26 to draw fluid 26 into the buffer tank 70 and return the fluid to the cavity 22. It is envisioned that the circulation pump 72 may be any suitable fluid transfer device, and in embodiments, may be a submersible pump or a pump disposed external to the immersion tank 12. The circulation pump 72 is in fluid communication with the sorbent material 60 and when in operation, effectuates the flow of the fluid 26 from the buffer tank 70, through the sorbent material 60, and back into the cavity 22. In this manner, the fluid 26 flowing through the sorbent material is filtered or otherwise decontaminated by the sorbent material 60. In embodiments, the circulation pump 72 may be configured to effectuate circulation of the fluid 26 retained within the cavity 22. In one non-limiting embodiment, the circulation pump 72 may be configured to effectuate circulation of the fluid 26 retained within the cavity 22 and fluid 26 in contact with the sorbent material 60 may be circulated without using a pump, and rather, using natural convection resulting from boiling the fluid 26.

[0089] As can be appreciated, the use of the circulation pump 72 or other mechanical fluid transfer device to circulate the fluid 26 through the sorbent material 60 may decrease the energy efficiency or increase the power usage effectiveness (PUE) of the immersion cooling system 10 by consuming power that is not beingFL2136-US01-PRV used for operating the electrical components 28, may increase the number of components of the immersion cooling system 10, may increase the amount of maintenance needed to operate the immersion cooling system 10, and may increase the number of failure points within the immersion cooling system 10, leading to increased downtime for the electrical components 28. To alleviate these concerns, it is envisioned that the circulation pump 72 may be intermittently operated rather than being continuously operated. In this manner, the immersion cooling system 10 may only operate the circulation pump 72 at predetermined time intervals, predetermined times of day, and / or when a level of contamination of the fluid 26 approaches or exceeds a predetermined threshold contamination value, such as an immiscibility level or insolubility point for one or more plasticizers. For example, with reference to Table 1 below, the working fluids HFO-153-10mczz(E)and Novec™ 649 (FK- 5-1-12) become insoluble at various ppm of plasticizers. As can be appreciated, the frequency at which the circulation pump 72 operates may be dependent upon the type of fluid 26 retained within the cavity 22, the type of sorbent material 60 retained within the receptacle 62, and the amount of sorbent material 60 (e.g., the wetted area) retained within the receptacle 62.Table 1 Insolubility Point of Plasticizers in Working Fluids

[0090] FIG. 7 plots sorption of various plasticizers from immersion fluids onto particulate activated carbon at 22°C. An ability of the sorption material 60, such as particulate activated carbon, to adsorb or otherwise filter plasticizers from the fluid 26 may be dependent upon the type of fluid 26 retained within the cavity 22. In this manner, the amount of sorbent material 60, the size and / or dimensions of theFL2136-US01-PRV receptacle 62, and / or the number of receptacles 62 needed to adequately filter contaminants from the fluid 26 may also be dependent upon the type of fluid 26 retained within the cavity 22.

[0091] Turning to FIG. 4, it is envisioned that the immersion cooling system 10 may not have a buffer tank 70 or circulation pump 72. In embodiments, in lieu of a pump, the immersion cooling system 10 may utilize the natural circulation of the fluid 26 caused by boiling to pass the fluid 26 through the sorbent material 60. As can be appreciated, a pumpless or passive filtration system may enable a simpler immersion cooling system 10 design, a reduction in maintenance, a reduced number of moving parts and / or failure points, minimize the amount of fluid 26 required to fill the immersion cooling unit 12, and reduce energy consumption as compared to immersion cooling systems utilizing pumps to circulate fluid 26 through the sorbent material 60.

[0092] In embodiments, the sorbent material 60 may be a buoyant material or may be contained within a buoyant pouch 80 or other porous or otherwise perforate container, such as a mesh bag, a cage, and combinations thereof. It is envisioned that one or more pouches 80 may be disposed within the cavity 22 depending upon the fluid 26 retained within the cavity 22 or the design needs of the immersion cooling system 10. The pouch 80 may be sized and / or dimensioned to provide a desired wetted surface area and provide a desired level of filtration of the fluid 26. In this manner, the size and or dimensions of the pouch 80, the number of pouches 80, and the amount of sorbent material 60 may be determined based on the volume of the fluid 26 retained within the cavity 22 and the flowrate of the fluid 26 through the pouches 80.

[0093] As can be appreciated, a location of the pouch 80 within the cavity may impact the flowrate of fluid 26 through the sorbent material 60 or the wetted surface area of the sorbent material 60. It is envisioned that the pouch 80 may be retained or otherwise anchored within the cavity 22 to maintain a desired position of the pouch 80 within the cavity 22. In one non-limiting embodiment, the pouch 80 may be anchored to one or more servers disposed within the cavity 22. It is contemplated that the pouch 80 may be retained or otherwise anchored within the cavity 22 using any suitable means, such as a rode 82, a barrier 84, and combinations thereof.FL2136-US01-PRVAlthough generally illustrated as floating on the surface of fluid 36, it is envisioned that the pouch 80 may be partially or wholly submerged within the fluid 26 without departing from the scope of the disclosure.

[0094] With reference to FIG. 5, it is envisioned that the sorbent material 60 may be disposed in one or more cartridges or containers 90. The cartridges 90 may be formed from a resilient material or a rigid material depending upon the design needs of the immersion tank 12. In one non-limiting embodiment, the cartridges 90 are selectively coupled to the inner surface 20 of the immersion tank 12 using any suitable means, such as fasteners, adhesives, tongue and groove, resilient fingers, mechanical latches, metallic or nonmetallic bars, and combinations thereof. In this manner, the cartridges 90 may be selectively removed from the cavity 22 for replacement or maintenance. It is contemplated that the cartridges 90 may be integrally formed within interior surface 20 (e.g., the walls) of the immersion tank 12. In this manner, the cartridges 90 may be formed from a porous or perforate material or device (e.g., a cage, a mesh, etc.) enabling the fluid 26 to flow within the cartridges 90 and wet the sorbent material 60 retained within the cartridges 90.

[0095] In embodiments, the cartridges 90 include a thickness of between about 1 / 8 inch and 1 / 2 inch, although it is envisioned that the cartridges 90 may include any thickness without departing from the scope of the disclosure. The cartridges 90 may disposed on one or more of the walls of the inner surface 20 of the immersion tank 12, such as the side walls and in embodiments, a bottom wall. The cartridges 90 may cover or otherwise form a portion of the inner surface 20 of the immersion tank 12 or cover the entirety of the inner surface 20 depending upon the type of fluid 26 being used, the volume of fluid 26 retained in the cavity 22, and the flowrate of the fluid 26 through the cartridges 90. As can be appreciated, the size and or dimensions of the cartridges 90 and the amount of sorbent material 60 contained in the cartridges 90 may be at least partially based upon the miscibility or solubility of the contaminants on the sorbent material 60 and the contaminants within the fluid 26, as shown in Table 1 above. Although generally described and illustrated as being disposed on or within the inner surface 20 of the immersion tank 12, it is envisioned that one or more cartridges 90 may be coupled to or supported on the electrical components 28 without departing from the scope of the disclosure.FL2136-US01-PRV

[0096] Turning to FIG. 6, in embodiments, the sorbent material 60, the pouch 80, or the cartridges 90 may be disposed or otherwise selectively or fixedly supported on one or more of the electrical components 28. It is envisioned that the sorbent material 60, the pouch 80, and / or the cartridges 90 may be coupled to the electrical components 28 using any suitable means, such as fasteners, adhesives, latches, tongue and groove, slots, and combinations thereof. As can be appreciated, any number of the sorbent material 60, pouches 80, or cartridges 90 may be disposed on the electrical components 28 and may be disposed at any location on the electrical components depending upon the design needs of the immersion cooling system 10.

[0097] In the embodiments of FIGS. 4-6, in which the sorbent material 60 is used to passively filtrate the immersion fluid 26, e.g., without the use of a buffer tank 70 or circulation pump 72 (FIG. 3), the fluid 26 experiences much less vigorous flow since the fluid 26 is not being actively recirculated through a filtration system via a pump or other mechanical fluid transfer device. Instead, movement (e.g., circulation) of the fluid 26 within the immersion tank 12 and into contact with the sorbent material 60 is caused primarily, or solely, by natural convection. As described above, the natural convection occurs due to the fluid 26 boiling as thermal energy is transferred from the electrical components 28 to the fluid 26. Thermal energy transfer, and therefore the source of the natural convection as a motive force for the fluid 26, is localized or concentrated in the vicinity of the electrical components 28. As a result, there may be “dead spaces” within the tank 12, relatively far removed or remote from the thermal energy transfer zones proximate the electrical components 28, that contain portions of the fluid 26 which experience a significantly weaker, if any, convective motive force. Without an additional pump or other mechanical fluid transfer device inducing additional mixing of the fluid 26, the portions of the fluid 26 in any such dead space will infrequently, if ever, mix with the other portions of the fluid 26 that experience a greater convective motive force. Additionally, in some instances, the portions of the fluid 26 in any such dead space will infrequently, if ever, contact the sorbent material 60.

[0098] As a result, when the sorbent material 60 is used in a “passive filtration mode” of the immersion cooling system 10, such as shown in and described with respect to FIGS. 4-6, the portions of the fluid 26 contained in any such dead space will likely have a contaminant content that is not reduced as effectively throughFL2136-US01-PRV filtration compared to the portions of the fluid 26 in the tank 12 that are closer in proximity to the thermal energy transfer zones. Even if there is non-zero mixing between the portions of the fluid 26 in the dead spaces and the remaining fluid 26 that regularly or frequently contacts the sorbent material 60, the mixing will be relatively low. As a result, a contaminant concentration gradient may exist between the dead spaces and the regions within the tank in closer proximity to the thermal energy transfer zones (i.e. , in closer proximity to the electrical components 28).

[0099] In instances in which the immersion cooling system 10 operates in the passive filtration mode, such as shown in FIGS. 4-6, e.g., without the use of a buffer tank 70 or circulation pump 72 (FIG. 3), the fluid 26 suitably includes a dielectric fluid in which contaminants (e.g., plasticizers) exhibit relatively higher solubilities. For example, in embodiments, the fluid 26 used in conjunction with the immersion cooling system 10 in a passive filtration mode is selected such that a solubility of plasticizers (e.g., DIDP, DOP, BBOEA, ATBC, DOA, DOTP, and / or TOTM) in the fluid 26 is at least 100 parts per million (ppm), at least 250 ppm, at least 500 ppm, at least 1000 ppm, at least 2000 ppm, at least 3000 ppm, at least 4000 ppm, at least 5000 ppm, at least 6000 ppm, at least 7000 ppm, such as between 100 ppm to 7500 mm or any sub-range therebetween. In some embodiments, the fluid 26 used in conjunction with the immersion cooling system 10 in a passive filtration mode includes HFO-153-10mczz(E), HFO-153-10mzzy(E), or a combination thereof. As demonstrated and described herein, plasticizers exhibit relatively higher solubilities in these dielectric fluids as compared to, for example, FC-72, FC-3284, and FK-5-1- 12 dielectric fluids. The use of dielectric fluids in which contaminants (e.g., plasticizers) exhibit relatively higher solubility, such as HFO-153-10mczz(E) and / or HFO-153-10mzzy(E), can advantageously mitigate or eliminate the risk that the relatively higher contaminant level in fluid 26 located in dead spaces of the tank 12 in a passive filtration mode will result in the contaminants reaching their solubility limit. In this way, the above-described disadvantages associated with contaminant deposits (e.g., degradation in heat transfer properties, changes in the dielectric constant of the immersion fluid, secondary swelling, etc.) can be avoided when operating the immersion cooling system 10 in the passive filtration mode.

[0100] With reference to FIG. 8, it is envisioned that during operation, a workstation 100 may monitor or otherwise control the operation of the fluid coolingFL2136-US01-PRV loop 50 and in embodiments where the immersion tank 12 include the circulation pump 72, the operation of the circulation pump 72 based on one or more sensors (not shown) such as temperature sensors, flowmeters, and any other suitable sensor for measuring any other parameter of the immersion cooling system 10. As described hereinabove, it is envisioned that the workstation 100 may intermittently actuate the circulation pump 72 rather than continuously running the pump 72. The workstation 100 may monitor a level of contamination of the fluid 26 and actuate the circulation pump 72 when the level of contamination of the fluid 26 approaches or exceeds the predetermined threshold contamination value. In embodiments, the workstation 100 may intermittently actuate the circulation pump 72 at predetermined intervals of time, at predetermined times of day, and combinations thereof.

[0101] The workstation 100 includes a computer 102 and in embodiments, a display 104 that is configured to display one or more user interfaces 106. The workstation 100 may be a desktop computer or a tower configuration with the display 104 or may be a laptop computer or other computing device. The workstation 100 includes a processor 110 which executed software stored in a memory 112. The memory 112 may store data associated with the immersion cooling system 10, the fluid 26, the fluid cooling loop 50, etc. and may store one or more software applications 114 and / or algorithms 126 to be executed by the processor 110.

[0102] In embodiments, the workstation 100 may include a network interface 116 that enables the workstation 100 to communicate with a variety of other devices and systems via the Internet. The network interface 116 may connect the workstation 100 to the Internet via a wired or wireless connection. Additionally, or alternatively, the communication may be via an ad-hoc Bluetooth® or wireless network enabling communication with a wire-area-network (WAN) and / or a local area network (LAN). The network interface 116 may connect to the Internet via one or more gateways, routers, and network address translation (NAT) devices. The network interface 116 may communicate with a cloud storage system 118, in which further data may be stored. The cloud storage system 118 may be remote from or on the premises of the immersion cooling system 10. In embodiments, an input module 120 receives inputs from an input device, such as a keyboard, a mouse, or voice commands. An output module 122 connects the processor 110 and the memory 112 to a variety of outputFL2136-US01-PRV devices, such as the display 104. In embodiments, the workstation 100 may include its own display (not shown), which may be a touchscreen display.

[0103] With reference to FIG. 9, a method of filtering contaminants from a dielectric fluid retained in an immersion tank is illustrated and generally identified by reference numeral 900. At step 902, dielectric fluid retained within a cavity defined by the immersion tank and in thermal communication with an electrical component disposed within the cavity is boiled. At step 904, the dielectric fluid is circulated, without the use of a pump, within the cavity and about a sorbent material disposed within the cavity and in fluid communication with the dielectric fluid. Optionally, at step 906, a pump in fluid communication with the dielectric fluid may be intermittently actuated to effectuate circulation of the dielectric fluid within the cavity and / or about the sorbent material. Optionally, at step 908, the dielectric fluid in contact with the sorbent material may be circulated without the use of a pump, and in parallel with step 908, at step 910, the pump in fluid communication with the dielectric fluid may be intermittently actuated to effectuate circulation of the dielectric fluid within the cavity. At step 912, contaminants within the dielectric fluid circulating about and in contact with the sorbent material are adsorbed by the sorbent material. As can be appreciated, the method 900 may be performed as many times as necessary and the steps of the method 900 may be performed in any order without departing from the scope of the disclosure.

[0104] The fluids 26 (e.g., the dielectric working fluids) of the immersion cooling system 10 are selected to be in the liquid state over the operational temperature range of the immersion cooling system 10 and may include any suitable dielectric fluid or mixture of one or more dielectric fluids. In some embodiments, the composition of the fluid 26 includes one or more fluorinated compounds. In some embodiments, the fluids 26 include one or more compounds including both fluorine and chlorine. In some embodiments, the operational temperature is at least 25°C, at least 30°C, at least 40°C, at least 50°C, at least 60°C, less than 100°C, less than 90°C, less than 80°C, less than 70°C, and combinations thereof.

[0105] While the invention has been described with reference to one or more embodiments, it will be understood by those skilled in the art that various changes may be made, and equivalents may be substituted for elements thereof withoutFL2136-US01-PRV departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention is not limited to the particular embodiments disclosed as the best mode contemplated for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims. In addition, all numerical values identified in the detailed description shall be interpreted as though the precise and approximate values are both expressly identified.

Claims

FL2136-US01-PRVCLAIMSWhat is claimed is:

1. An immersion cooling system, comprising: an immersion tank defining a cavity retaining a dielectric fluid; an electrical component disposed within the cavity, wherein at least a portion of the electrical component is immersed in the dielectric fluid retained within the cavity; and a sorbent material disposed within the cavity and in fluid communication with the dielectric fluid, wherein dielectric fluid in contact with the sorbent material is circulated by boiling of the dielectric fluid in thermal communication with the electrical component to adsorb contaminants within the dielectric fluid.

2. The immersion cooling system according to claim 1, wherein the sorbent material is buoyant in the dielectric fluid.

3. The immersion cooling system according to claim 1, wherein the sorbent material is disposed within a buoyant pouch.

4. The immersion cooling system according to claim 3, wherein the buoyant pouch is wholly submerged within the dielectric fluid.

5. The immersion cooling system according to claim 3, wherein the buoyant pouch is partially submerged within the dielectric fluid.

6. The immersion cooling system according to claim 1, wherein the sorbent material is disposed within a perforate container.

7. The immersion cooling system according to claim 6, wherein the perforate container is selectively coupled to an inner surface of the cavity.

8. The immersion cooling system according to claim 6, wherein the perforate container is selectively coupled to the electrical component.

9. The immersion cooling system according to claim 6, wherein the perforate container is integrally formed within an interior surface of the cavity.

10. The immersion cooling system according to claim 1, wherein the circulation of the dielectric fluid in contact with the sorbent material is passively generated.FL2136-US01-PRV11. The immersion cooling system according to claim 1 , wherein the immersion cooling system does not include a pump for effectuating circulation of the dielectric fluid in contact with the sorbent material.

12. The immersion cooling system according to claim 1, wherein the immersion cooling system does not include a pump for effectuating circulation of the dielectric fluid within the cavity and does not include a pump for effectuating circulation of the dielectric fluid in contact with the sorbent material.

13. The immersion cooling system according to claim 1, further comprising: a controller including a processor and a memory operably coupled to the processor, the memory storing instructions, which when executed, cause the processor to intermittently actuate a pump in fluid communication with the dielectric fluid to effectuate circulation of the dielectric fluid within the cavity.

14. An immersion cooling system, comprising: an immersion tank defining a cavity retaining a fluid; an electrical component disposed within the cavity and at least partially immersed within the fluid; and a passive filter disposed within the cavity and at least partially immersed within the fluid, the passive filter including: a container; and a sorbent material selectively retained within the container and in fluid communication with the fluid retained in the cavity, wherein a flow of fluid through the passive filter is effectuated by natural circulation of the fluid within the cavity.

15. The immersion cooling system according to claim 14, wherein the fluid is a two- phase dielectric fluid.

16. The immersion cooling system according to claim 14, wherein the natural circulation of the fluid within the cavity is effectuated by boiling of fluid in thermal communication with the electrical component.

17. The immersion cooling system according to claim 14, wherein the container is coupled to an inner surface of the cavity.FL2136-US01-PRV18. The immersion cooling system according to claim 14, wherein the container is selectively coupled to the electrical component.

19. The immersion cooling system according to claim 14, wherein the immersion cooling system does not include a pump for effectuating the flow of the fluid through the passive filter.

20. The immersion cooling system according to claim 14, wherein the immersion cooling system does not include a pump for effectuating the flow of fluid through the passive filter and circulation of the fluid within the cavity is effectuated without the use of a pump.

21. The immersion cooling system according to claim 14, further comprising: a controller including a processor and a memory operably coupled to the processor, the memory storing instructions, which when executed, cause the processor to intermittently actuate a pump in fluid communication with the fluid to effectuate circulation of the fluid within the cavity.

22. An immersion cooling system, comprising: a receptacle defining a cavity retaining a fluid; an energy source disposed within the cavity and at least partially immersed within the fluid; and a passive filter at least partially immersed within the fluid, the passive filter including a sorbent material, wherein a flow of fluid through the passive filter is effectuated by natural circulation of the fluid within the cavity.

23. The immersion cooling system according to claim 22, wherein the natural circulation of the fluid within the cavity is effectuated by boiling of fluid in thermal communication with the energy source.

24. The immersion cooling system according to claim 22, wherein the fluid is a two- phase dielectric fluid.

25. The immersion cooling system according to claim 22, wherein the passive filter is integrally formed with a wall of the receptacle.FL2136-US01-PRV26. The immersion cooling system according to claim 22, further comprising a second passive filter at least partially immersed within the fluid, wherein the second passive filter is selectively coupled to the energy source.

27. The immersion cooling system according to claim 22, wherein the immersion cooling system does not include a pump for effectuating the flow of the fluid through the passive filter.

28. The immersion cooling system according to claim 22, wherein the immersion cooling system does not include a pump for effectuating the flow of fluid through the passive filter and circulation of the fluid within the cavity is effectuated without the use of a pump.

29. The immersion cooling system according to claim 22, further comprising: a controller including a processor and a memory operably coupled to the processor, the memory storing instructions, which when executed, cause the processor to intermittently actuate a pump in fluid communication with the dielectric fluid to effectuate circulation of the dielectric fluid within the cavity.

30. The immersion cooling system of any one of the preceding claims, wherein the sorbent material includes activated carbon.

31. The immersion cooling system of claim 30, wherein the activated carbon is particulate activated carbon.

32. The immersion cooling system of claim 31, wherein the particulate activated carbon has a mean diameter between 0.42 millimeters (mm) to 2.36 mm, such as between 0.59 mm to 2.36 mm, or between 0.42 mm to 1 .4 mm.

33. The immersion cooling system of any one of the preceding claims, wherein the dielectric fluid includes HFO-153-10mczz(E), HFO-153-10mzzy(E), or a combination thereof.

34. The immersion cooling system of any one of the preceding claims, wherein plasticizers present in the dielectric fluid have a solubility of at least 100 parts per million (ppm), at least 250 ppm, at least 500 ppm, at least 1000 ppm, at least 2000 ppm, at least 3000 ppm, at least 4000 ppm, at least 5000 ppm, at least 6000 ppm, or at least 7000 ppm.FL2136-US01-PRV35. The immersion cooling system of any one of the preceding claims, wherein plasticizers present in the dielectric fluid have a solubility of between 100 parts per million (ppm) to 7500 ppm.

36. The immersion cooling system of claim 34 or claim 35, wherein the plasticizers are selected from the group consisting of Diisodecyl phthalate (DI DP), Dioctyl phthalate (DOP), Bis[2-(2-butoxyethoxy)ethyl] adipate (BBOEA), Acetyl Tributyl Citrate (ATBC), Bis(2-ethylhexyl) adipate (DOA), dioctyl terephthalate (DOTP), trioctyl trimellitate (TOTM), diisononylphthalate and diisodecylphthalate, and a combination of two or more thereof.

37. The immersion cooling system of any one of the preceding claims, wherein the dielectric fluid is configured to undergo a phase transition from a liquid to a gaseous state over an operational temperature range of the immersion cooling system.

38. The immersion cooling system of claim 37, wherein the operational temperature is at least 25° C, at least 30° C, at least 40° C, at least 50° C, or at least 60° C.

39. The immersion cooling system of claim 37 or claim 38, wherein the operational temperature is less than 100° C, less than 90° C, less than 80° C, less than 70° C, or less than 60° C.

40. A method for filtering contaminants from a dielectric fluid retained in an immersion tank, comprising: boiling dielectric fluid in thermal communication with an electrical component disposed within a cavity defined by an immersion tank, wherein at least a portion of the electrical component is immersed in the dielectric fluid; circulating the dielectric fluid, without the use of a pump, about a sorbent material disposed within the cavity and in fluid communication with the dielectric fluid; and adsorbing contaminants from dielectric fluid in contact with and circulating about the sorbent material.

41. The method according to claim 40, wherein circulating the dielectric fluid includes circulating the dielectric fluid, without the use of a pump, within the cavity using natural convection.FL2136-US01-PRV42. The method according to claim 40, wherein circulating the dielectric fluid includes circulating the dielectric fluid, without the use of a pump, within the cavity and about the sorbent material using natural convection.

43. The method according to claim 40, further comprising intermittently actuating a pump in fluid communication with the dielectric fluid to circulate the dielectric fluid within the cavity.

44. The method according to claim 40, wherein circulating the dielectric fluid includes circulating the dielectric fluid within the cavity and about the sorbent material using natural convection and intermittently actuating a pump in fluid communication with the dielectric fluid.

45. The method according to claim 40, wherein circulating the dielectric fluid includes circulating the dielectric fluid about sorbent material disposed within walls of the immersion tank.

46. The method according to claim 40, wherein circulating the dielectric fluid includes circulating the dielectric fluid about sorbent material disposed within a buoyant pouch.

47. The method according to claim 40, wherein circulating the dielectric fluid includes circulating the dielectric fluid about a sorbent material that is partially immersed within the dielectric fluid.

48. The method according to claim 40, wherein circulating the dielectric fluid includes circulating the dielectric fluid about a sorbent material that is entirely immersed within the dielectric fluid.

49. The method according to claim 40, wherein circulating the dielectric fluid includes circulating the dielectric fluid about a sorbent material that is disposed on a portion of the electrical component.

50. The immersion cooling system of any one of claims 40 to 49, wherein the sorbent material includes activated carbon.

51. The immersion cooling system of claim 50, wherein the activated carbon is particulate activated carbon.FL2136-US01-PRV52. The immersion cooling system of claim 51, wherein the particulate activated carbon has a mean diameter between 0.42 millimeters (mm) to 2.36 mm, such as between 0.59 mm to 2.36 mm, or between 0.42 mm to 1 .4 mm.

53. The immersion cooling system of any one of claims 40 to 52, wherein the dielectric fluid includes HFO-153-10mczz(E), HFO-153-10mzzy(E), or a combination thereof.

54. The method of any one of claims 40 to 53, wherein plasticizers present in the dielectric fluid have a solubility of at least 100 parts per million (ppm), at least 250 ppm, at least 500 ppm, at least 1000 ppm, at least 2000 ppm, at least 3000 ppm, at least 4000 ppm, at least 5000 ppm, at least 6000 ppm, or at least 7000 ppm.

55. The method of any one of claims 40 to 54, wherein plasticizers present in the dielectric fluid have a solubility of between 100 parts per million (ppm) to 7500 ppm.

56. The method of claim 54 or claim 55, wherein the plasticizers are selected from the group consisting of Diisodecyl phthalate (DIDP), Dioctyl phthalate (DOP), Bis[2-(2-butoxyethoxy)ethyl] adipate (BBOEA), Acetyl Tributyl Citrate (ATBC), Bis(2-ethylhexyl) adipate (DOA), dioctyl terephthalate (DOTP), trioctyl trimellitate (TOTM), diisononylphthalate and diisodecylphthalate, and a combination of two or more thereof.

57. The method of any one of claims 40 to 56, wherein the dielectric fluid undergoes a phase transition from a liquid to a gaseous state over an operational temperature range of the immersion tank.

58. The method of claim 57, wherein the operational temperature is at least 25° C, at least 30° C, at least 40° C, at least 50° C, or at least 60° C.

59. The method of claim 57 or claim 58, wherein the operational temperature is less than 100° C, less than 90° C, less than 80° C, less than 70° C, or less than 60° C.

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