Power supply

Abstract

Provided is a power supply, comprising an insulating piece, a circuit board and an adhesive. The insulating piece comprises a plurality of side walls to form an accommodating space. The circuit board comprises a top surface and a bottom surface, the bottom surface facing the insulating piece. The adhesive is accommodated in the accommodating space, and the adhesive covers the top surface and the bottom surface of the circuit board.

Description

Power supply TECHNICAL FIELD

[0001] The present invention relates to a power supply, in particular, to a thin potting power supply. BACKGROUND

[0002] The protection of a power supply is to protect electronic components on a circuit board by a glue material. The industry generally coats (Coating) the glue material on the circuit board or pott the glue material to the circuit board; however, coating the glue material on the circuit board results in a limited protection area and poor protection ability; pott the glue material to the circuit board results in the use of a large amount of glue material, easy to cause leakage, and poor heat dissipation, etc.

[0003] Therefore, there is a need for a power supply that effectively protects electronic components on a circuit board without using a large amount of glue material and effectively dissipating heat.

[0004] SUMMARY

[0005] The present disclosure provides a power supply, including an insulating sheet, a circuit board, and a glue material. The insulating sheet includes a plurality of side walls to form a containing space. The circuit board includes a top surface and a bottom surface. The bottom surface faces the insulating sheet. The glue material is contained in the containing space, and the glue material covers the top surface and the bottom surface of the circuit board.

[0006] In an embodiment, the insulating sheet includes a bottom plate, wherein the bottom plate of the insulating sheet faces the bottom surface of the circuit board, and the bottom surface of the circuit board is located between the top surface of the circuit board and the bottom plate of the insulating sheet.

[0007] In an embodiment, the side walls of the insulating sheet extend upward from the bottom plate of the insulating sheet beyond the top surface of the circuit board.

[0008] In an embodiment, the bottom plate of the insulating sheet, the top surface of the circuit board, and the bottom surface of the circuit board are parallel to each other.

[0009] In an embodiment, the side walls of the insulating sheet extend along a direction perpendicular to the bottom plate of the insulating sheet.

[0010] In an embodiment, the height of the side walls of the insulating sheet is higher than the glue material.

[0011] In an embodiment, the insulating sheet further includes a front wall, the front wall extending upward from the bottom plate of the insulating sheet beyond the top surface of the circuit board.

[0012] In an embodiment, the front wall of the insulating sheet extends along a direction perpendicular to the bottom plate of the insulating sheet.

[0013] In an embodiment, the height of the front wall of the insulating sheet is lower than the height of the side walls of the insulating sheet.

[0014] In one embodiment, the height of the front wall of the insulating sheet is higher than the adhesive material.

[0015] In one embodiment, the power supply further comprises a first gasket disposed between the bottom plate of the insulating sheet and the bottom surface of the circuit board.

[0016] In one embodiment, the first gasket abuts against the side wall, the bottom plate of the insulating sheet, and the bottom surface of the circuit board.

[0017] In one embodiment, the power supply further comprises a second gasket disposed on the top surface of the circuit board, wherein the second gasket is higher than the adhesive material.

[0018] In one embodiment, the power supply further comprises a connector disposed on the top surface of the circuit board, the second gasket is disposed between the connector and the adhesive material, and the adhesive material does not cover the connector.

[0019] In one embodiment, the connector does not directly contact the adhesive material.

[0020] In one embodiment, the power supply further comprises a housing, wherein the housing is a sheet metal housing.

[0021] In one embodiment, the housing is not sealed.

[0022] In one embodiment, the power supply further comprises a fan disposed on the housing, wherein the fan supplies an airflow to the circuit board.

[0023] In one embodiment, the insulating sheet further comprises a front wall, and the front wall is disposed between the fan and the adhesive material.

[0024] In one embodiment, the fan does not directly contact the adhesive material. BRIEF DESCRIPTION OF DRAWINGS

[0025] Although this specification concludes with claims particularly pointing out and distinctly claiming that which is regarded as the application, advantages of some embodiments of the application can be made more readily understood by turning to the detailed description and examples describing certain embodiments, taken together with the accompanying drawings.

[0026] FIG. 1 is an exploded view of a power supply according to some embodiments of the disclosure;

[0027] FIG. 2 is a perspective view of a power supply according to some embodiments of the disclosure, with the upper cover omitted.

[0028] LIST OF SYMBOLS

[0029] 10: housing

[0030] 11: bottom shell

[0031] 12: upper cover

[0032] 20: insulating sheet

[0033] 21: bottom plate

[0034] 22: side wall

[0035] 23: front wall

[0036] 30: circuit board

[0037] 30a: top surface

[0038] 30b: bottom surface

[0039] 31: connector

[0040] 40: first gasket

[0041] 50: second gasket

[0042] 60: fan

[0043] 70: adhesive material

[0044] 100: power supply DETAILED DESCRIPTION

[0045] The present disclosure can be more clearly understood by reference to the following detailed description together with the appended drawings, in which:

[0046] Throughout this disclosure the term "comprising" or "containing" or "including" or "having" are used interchangeably. The term "comprising" means "including, but not limited to". It will be understood that the terms "because", "although" and "although not limited to" do not indicate a reference point, a limitation or an instruction. The terms "comprising", "containing", "including" and "having" are open-ended, and also mean "consisting essentially of" and "consisting of". The phrase "consisting essentially of" means the composition, process, or method as described excludes other elements that affect the basic and novel characteristics of the composition, process, or method. The phrase "consisting of" means the composition, process, or method as described excludes all but the recited elements of any additional elements. The terms "a" and "an" are defined as one or more unless indicated otherwise by context or it is clear from the context that the term is used in the sense of "one and only one". The term "another" is defined as one or more, unless indicated otherwise by context or it is clear from the context that the term is used in the sense of "one and only one".

[0047] Furthermore, relative terms such as "below" or "bottom" and "above" or "top" can be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the figures. It will be understood that these relative terms are intended to encompass different orientations of the device in its operation or use, in which the device can be installed upside down or oriented in the opposite direction than shown in the figures. As used herein, the term "about" generally refers to a range of values within 10% of a given value or range, or within 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0048] When a corresponding component (e.g., an element or a film layer or a region) is referred to as "on" or "connected to" another component, it can be directly on or connected to the other component, or one or more intervening components can be present. On the other hand, when a component is referred to as being "directly on" or "directly connected to" another component, then there are no intervening components present. In addition, when a component is referred to as being "on" another component, the two components are in a top-down relationship in a plan view, and the component can be above or below the other component, depending on the orientation of the device.

[0049] The terms "about," "substantially," or "approximately" generally refer to a range of values within 10% of a given value or range, or within 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0050] In the present disclosure, when it is said that an element A overlaps with an element B, it means that at least partial overlap is included.

[0051] It will be understood that, although the terms "first," "second," etc. can be used herein to describe various elements, layers, and / or sections, these elements, layers, and / or sections should not be limited by these terms. These terms are only used to distinguish one element, layer, or section from another. Thus, a first element, layer, and / or section discussed below could be termed a second element, layer, and / or section without departing from the teachings of some embodiments. Additionally, relative terms can be used in the description to describe the position of one element, layer, and / or section relative to another element, layer, and / or section. These relative terms can be used to describe the position of one element, layer, and / or section relative to another element, layer, and / or section. These relative terms are used only to more conveniently relate one element, layer, and / or section to another element, layer, and / or section as described herein. Thus, a first element, layer, and / or section discussed below could be termed a second element, layer, and / or section without departing from the teachings of some embodiments.

[0052] In the present disclosure, the measurement of thickness, length, and width can be obtained by optical microscope measurement, and the thickness can be measured from a cross-sectional image in an electron microscope, but the present disclosure is not limited thereto. In addition, there can be an error in any two values or directions used for comparison. If a first direction is perpendicular to a second direction, the angle between the first direction and the second direction can be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction can be between 0 degrees and 10 degrees.

[0053] It should be noted that the technical solutions provided by different embodiments below can be used in combination or mixed to form another embodiment without violating the spirit of the disclosure.

[0054] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the disclosure and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0055] Referring to FIG. 1 and FIG. 2, FIG. 1 is an exploded view of a power supply 100 according to some embodiments of the present disclosure. FIG. 2 is a perspective view of the power supply 100 according to some embodiments of the present disclosure, in which the upper cover 12 is omitted.

[0056] As shown in FIG. 1, the power supply 100 includes a housing 10, an insulating sheet 20, a circuit board 30, a first gasket 40, a second gasket 50, a fan 60, and a glue material 70.

[0057] The housing 10 includes a bottom shell 11 and an upper cover 12. The bottom shell 11 and the upper cover 12 can form an internal space to accommodate other elements of the power supply 100.

[0058] According to some embodiments of the present disclosure, the housing 10 can be a sheet metal shell, and the housing 10 can be non-sealed. In other words, the housing 10 can have a gap such that the inside of the power supply 100 can be in communication with the outside.

[0059] According to some embodiments of the present disclosure, the housing 10 can include a metal material, and the insulating sheet 20 is electrically insulating. The insulating sheet 20 can be formed by an adhesive method to be a semi-open (non-closed) insulating sheet.

[0060] The insulating sheet 20 is disposed on the bottom shell 11. The insulating sheet 20 includes a bottom plate 21, a plurality of side walls 22, and a front wall 23. The bottom plate 21 is parallel to the bottom shell 11, and the side walls 22 and the front wall 23 extend upward from the bottom plate 21 in a direction perpendicular to the bottom plate 21.

[0061] As shown in FIG. 1 and FIG. 2, the side walls 22 can be opposite to each other, and the front wall 23 can be substantially perpendicular to the side walls 22. The side walls 22 and the front wall 23 can form a substantially U-shaped continuous wall.

[0062] The side wall 22 (or the side wall 22 and the front wall 23) can form a receiving space to receive the adhesive 70. The side wall 22 extends from the bottom plate 21 to a height higher than that of the front wall 23 from the bottom plate 21, such that the height of the side wall 22 is higher than that of the front wall 23 (the height of the front wall 23 is lower than that of the side wall 22). In this way, the adhesive 70 can be effectively received in the receiving space, and the elements on the circuit board 30 can be protected.

[0063] As shown in FIGS. 1 and 2, the front wall 23 can not be a continuous plane. The front wall 23 can have a recessed portion facing the circuit board 30 to form a space between the front wall 23 and the housing 10 to receive the fan 60.

[0064] The circuit board 30 is disposed above the insulating sheet 20, and a gap can be formed between the circuit board 30 and the insulating sheet 20. The gap can be filled with the adhesive 70, such that the pins of the electronic elements or electronic devices of the circuit board 30 can be covered by the adhesive 70, thereby protecting the pins of the electronic elements or electronic devices and preventing dust from accumulating on the pins.

[0065] According to some embodiments of the present disclosure, the circuit board 30 can include a plurality of electronic elements or electronic devices, such as surface mount devices (SMDs).

[0066] The circuit board 30 includes a top surface 30a, a bottom surface 30b, and a connector 31. The bottom surface 30b faces the bottom plate 21 of the insulating sheet 20 and is located between the top surface 30a and the bottom plate 21. The top surface 30a, the bottom surface 30b, the bottom shell 11, and the bottom plate 21 can be parallel to each other. The connector 31 is disposed on the top surface 30a and a portion of the connector 31 is located outside the housing 10 to connect with other external devices.

[0067] The first gasket 40 is disposed between the bottom plate 21 of the insulating sheet 20 and the bottom surface 30b of the circuit board 30. The first gasket 40 abuts against the side wall 22 and the bottom plate 21 of the insulating sheet 20 and the bottom surface 30b of the circuit board 30. In this way, the adhesive 70 filled between the circuit board 30 and the insulating sheet 20 can be prevented from overflowing outside the first gasket 40.

[0068] As shown in FIGS. 1 and 2, the second gasket 50 is disposed on the top surface 30a of the circuit board 30 and can abut against the top surface 30a. The second gasket 50 is higher than the adhesive 70 to prevent the adhesive 70 from overflowing outside the second gasket 50.

[0069] The second gasket 50 is also disposed between the connector 31 and the adhesive 70, such that the adhesive 70 does not cover the connector 31, and the connector 31 does not directly contact the adhesive 70.

[0070] According to some embodiments of the present disclosure, the first gasket 40 and the second gasket 50 can be soft gaskets. In some embodiments, there can be a gap between the first gasket 40 and the second gasket 50 and the circuit board 30; however, since the adhesive 70 has a high viscosity, the adhesive 70 will not leak out in large quantities.

[0071] Please continue to refer to FIG. 1 and FIG. 2, the fan 60 is disposed on the housing 10, and the fan 60 can be disposed on the opposite side of the connector 31. For example, when the fan 60 is disposed on the front side of the power supply 100, the connector 31 can be disposed on the rear side of the power supply 100.

[0072] The fan 60 is disposed adjacent to the front wall 23 of the insulating sheet 20, such that the front wall 23 is disposed between the fan 60 and the adhesive 70. In this way, the adhesive 70 does not cover the fan 60, and the fan 60 does not directly contact the adhesive 70.

[0073] As shown in FIG. 1 and FIG. 2, the fan 60 is also adjacent to the circuit board 30, such that the fan 30 can supply an airflow to the circuit board 30 to cool the electronic components or electronic devices on the circuit board 30. Since the housing 10 can have a gap, the fan 30 can introduce lower-temperature air from outside the power supply 100 into the power supply 100, and use the lower-temperature air to cool the electronic components or electronic devices on the circuit board 30. In this way, the electronic components or electronic devices on the circuit board 30 can be effectively cooled, thereby making the power supply 100 more stable.

[0074] The adhesive 70 is disposed in the receiving space of the side wall 22, and the adhesive 70 can cover the top surface 30a and the bottom surface 30b of the circuit board 30. The side wall 22 and the front wall 23 of the insulating sheet 20 extend upward from the bottom plate 21 beyond the top surface 30a of the circuit board 30, and the height of the side wall 22 and the height of the front wall 23 are higher than the adhesive 70. Therefore, the adhesive 70 can be well retained on the circuit board 30 without flowing to other places.

[0075] According to some embodiments of the present disclosure, the adhesive 70 can be a potting adhesive such as PU, Silicone, or EPOXY glue. According to some embodiments of the present disclosure, the thickness of the adhesive 70 on the top surface 30a of the circuit board 30 is 1 mm to 5 mm. In this way, the adhesive 70 can effectively protect the electronic components or electronic devices on the circuit board 30, and the amount of the adhesive 70 will not be excessive.

[0076] Therefore, the power supply 100 of the embodiments of the present disclosure is configured such that the power supply 100 can have the advantage of "thin potting". Therefore, the power supply 100 of the embodiments of the present disclosure has the advantage of saving adhesive.

[0077] Furthermore, the adhesive 70 of the power supply 100 of the present disclosure can cover the top surface 30a and the bottom surface 30b of the circuit board 30 to protect the electronic components or the electronic devices and the pins of the electronic devices on the circuit board 30.

[0078] Moreover, the coating process has a forbidden spraying area and cannot achieve complete protection due to the limitation of the machine, resulting in that some substrates and parts cannot be sprayed, affecting the outdoor service life of the power supply. Therefore, compared with the coating process, the power supply 100 of the present disclosure can improve the product reliability and achieve the effect of shock absorption.

[0079] In addition, the power supply 100 of the present disclosure can assemble the circuit board 30 and the first gasket 40 according to the process and set them on the insulating sheet 20, and then pour the adhesive 70 on the surface of the circuit board 30. The pouring of the adhesive is performed in a pouring manner to cover the circuit board 30 and the electronic components thereon. The pouring position is controlled to save pouring time, and the flow distance of the adhesive can be effectively shortened, so that additional jigs and demolding processes are not required as in the conventional method. Therefore, the power supply 100 of the present disclosure has the advantages of simplifying the process and reducing the cost, and the power supply 100 of the present disclosure has the advantage of avoiding damage to the components during demolding. Alternatively, in other embodiments, the adhesive 70 can be poured on the insulating sheet 20 first, and then the circuit board 30 is placed. Alternatively, in other embodiments, part of the adhesive 70 can be poured on the insulating sheet 20 first, and then the circuit board 30 is placed, and then part of the adhesive 70 is poured on the surface of the circuit board 30.

[0080] In the present disclosure, the adhesive 70 is thin and covers the entire top surface 30a and the entire bottom surface 30b of the circuit board 30, so that the gap between the circuit board 30 and the insulating sheet 20 can be completely filled with the adhesive 70. However, the present disclosure is not limited thereto, and in other embodiments, the adhesive 70 can be used to cover only part of the top surface 30a and part of the bottom surface 30b of the circuit board 30 as needed, so that the gap between the circuit board 30 and the insulating sheet 20 can be partially filled with the adhesive 70.

[0081] In summary, the elements and configurations of the power supply of the present disclosure have the advantages of simplifying the process, reducing the cost, lightening, good heat dissipation, and improved stability.

[0082] Although the above has been described the embodiments and advantages of the present disclosure, it should be understood that various changes, substitutions and alterations can be made hereto without departing from the spirit and scope of the present disclosure. It is intended that the different embodiments can be combined in any combination to other embodiments as long as the combination is within the spirit of the present disclosure. In addition, the scope of the present disclosure is not limited to the processes, machines, manufacture, compositions of matter, means, methods and steps described in the specific embodiments described in the specification. Those skilled in the art can understand the existing or developing processes, machines, manufacture, compositions of matter, means, methods and steps from some embodiments of the present disclosure. Therefore, the scope of the present disclosure includes the aforementioned processes, machines, manufacture, compositions of matter, means, methods and steps. In addition, each claim in the claims constitutes a separate embodiment and the scope of the present disclosure also includes each combination of claims and embodiments.

Claims

1. A power supply, characterized by, Comprising: a housing having an interior space, an insulating sheet disposed in the interior space, the insulating sheet comprising a bottom plate and a plurality of side walls extending upwardly from the bottom plate, the bottom plate and the plurality of side walls forming a receiving space; a circuit board disposed in the receiving space, the circuit board comprising: a top surface; and a bottom surface facing the bottom plate of the insulating sheet; and an adhesive material received in the receiving space, and the adhesive material covering at least part of the top surface and at least part of the bottom surface of the circuit board.

2. The power supply of claim 1, wherein, The bottom plate of the insulating sheet faces the bottom surface of the circuit board, and the bottom surface of the circuit board is located between the top surface of the circuit board and the bottom plate of the insulating sheet.

3. The power supply of claim 2, wherein, The plurality of side walls of the insulating sheet extend upwardly from the bottom plate of the insulating sheet beyond the top surface of the circuit board.

4. The power supply of claim 2, wherein, The bottom plate of the insulating sheet, the top surface of the circuit board, and the bottom surface of the circuit board are parallel to each other.

5. The power supply of claim 2, wherein, The plurality of side walls of the insulating sheet extend along a direction perpendicular to the bottom plate of the insulating sheet.

6. The power supply of claim 2, wherein, The plurality of side walls of the insulating sheet have a height higher than the adhesive material.

7. The power supply of claim 2, wherein, The insulating sheet further comprises a front wall extending upwardly from the bottom plate of the insulating sheet beyond the top surface of the circuit board.

8. The power supply of claim 7, wherein, The front wall of the insulating sheet extends along a direction perpendicular to the bottom plate of the insulating sheet.

9. The power supply of claim 7, wherein, The front wall of the insulating sheet has a height lower than the height of the plurality of side walls of the insulating sheet.

10. The power supply of claim 7, wherein, The front wall of the insulating sheet has a height higher than the adhesive material.

11. The power supply of claim 1, wherein, Further comprising a first gasket disposed between the bottom plate of the insulating sheet and the bottom surface of the circuit board.

12. The power supply of claim 11, wherein, The first gasket abuts against the plurality of side walls, the bottom plate of the insulating sheet, and the bottom surface of the circuit board.

13. The power supply of claim 1, wherein, Further comprising a second gasket disposed on the top surface of the circuit board, wherein the second gasket is higher than the adhesive material.

14. The power supply of claim 13, wherein, Further comprising a connector disposed on the top surface of the circuit board, wherein the second gasket is disposed between the connector and the adhesive material, and the adhesive material does not cover the connector.

15. The power supply of claim 14, wherein, The connector does not directly contact the adhesive material.

16. The power supply of claim 1, wherein, The housing is a sheet metal housing.

17. The power supply of claim 16, wherein, The housing is non-sealed.

18. The power supply of claim 16, wherein, Further comprising a fan disposed on the housing, wherein the fan supplies an airflow to the circuit board.

19. The power supply of claim 18, wherein, The insulating sheet further comprises a front wall, and the front wall is disposed between the fan and the adhesive material.

20. The power supply of claim 18, wherein, The fan does not directly contact the adhesive material.

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