Thermal management device and cooling liquid flow channel assembly

Abstract

A thermal management device (1) and a cooling liquid flow channel assembly (100). The thermal management device (1) comprises the cooling liquid flow channel assembly (100), a circuit board (181), and at least two electric fluid assemblies (2). The cooling liquid flow channel assembly (100) comprises a first flow channel plate (13) and a second flow channel plate (11) which are arranged in a sealed manner; the cooling liquid flow channel assembly (100) is provided with a cooling liquid channel (101) and an accommodating cavity (108); the cooling liquid channel (101) is in fluid isolation from the accommodating cavity (108); at least a part of the cooling liquid channel (101) and at least a part of the accommodating cavity (108) are located between the first flow channel plate (13) and the second flow channel plate (11), and at least one of the first flow channel plate (13) and the second flow channel plate (11) defines a part of the wall portion of the accommodating cavity (108); the circuit board (181) is located in the accommodating cavity (108); a part of each electric fluid assembly (2) is connected to the cooling liquid flow channel assembly (100); the electric fluid assembly (2) comprises a stator assembly (201); and stator assemblies (201) of the at least two electric fluid assemblies (2) are electrically connected to the circuit board (181), thereby facilitating improving the integration level of a control system of the thermal management device (1), and facilitating reducing the space occupied by the thermal management device (1).

Description

Heat management device and coolant flow channel assembly

[0001] The present application claims priority to the Chinese patent application No. 202411260159.7, filed on September 9, 2024, and entitled "Heat management device and coolant flow channel assembly", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of heat management, in particular to a heat management device and a coolant flow channel assembly. BACKGROUND

[0003] A heat management system usually includes at least two fluid assemblies, and each fluid assembly needs to be provided with a corresponding driving assembly to enable the fluid assembly to act. In order to improve the integration of the heat management system, the control parts of the at least two fluid assemblies are integrated in the same control board in the related art, so that one control board can control the actions of the at least two fluid assemblies. In order to limit the control board, a driving assembly is usually arranged to accommodate the control board, and the heat management system occupies a larger space. SUMMARY

[0004] Therefore, the technical scheme of the present application provides a heat management device and a coolant flow channel assembly, which are beneficial to improve the integration of the control system of the heat management device and reduce the occupied space of the heat management device.

[0005] In one aspect, the technical scheme of the present application provides a heat management device, which includes a coolant flow channel assembly, a circuit board, and at least two electric fluid assemblies. The coolant flow channel assembly includes a first flow channel plate and a second flow channel plate which are sealingly arranged. The coolant flow channel assembly has a coolant passage and a containing cavity. The coolant passage and the containing cavity are fluidly isolated. At least part of the coolant passage and at least part of the containing cavity are located between the first flow channel plate and the second flow channel plate. At least one of the first flow channel plate and the second flow channel plate defines part of the wall of the containing cavity. The circuit board is located in the containing cavity. Part of the electric fluid assembly is connected to the coolant flow channel assembly. The electric fluid assembly includes a stator assembly. The stator assemblies of the at least two electric fluid assemblies are electrically connected to the circuit board.

[0006] According to the heat management device provided in the technical solution of the present application, at least part of the cooling liquid channel and at least part of the accommodation cavity are located in the cooling liquid flow channel assembly, so that the space of the cooling liquid flow channel assembly can not only enable fluid to flow through the cooling liquid channel, but also can be used for accommodating the circuit board. Compared with separately arranging the mounting shell for accommodating the circuit board, the heat management device provided in the technical solution of the present application is beneficial to reducing the occupied space. By arranging the cooling liquid channel and the accommodation cavity to be fluidly isolated, it is beneficial to reduce or prevent the fluid from entering the accommodation cavity to cause damage to the circuit board. By arranging the stator assemblies of the at least two electric fluid assemblies to be electrically connected with the circuit board, it is beneficial to improve the integration of the control system of the heat management device.

[0007] In another aspect, the technical solution of the present application also provides a cooling liquid flow channel assembly. The cooling liquid flow channel assembly comprises a first flow channel plate, a second flow channel plate and a circuit board. The first flow channel plate and the second flow channel plate are sealingly connected. The cooling liquid flow channel assembly has a cooling liquid channel and an accommodation cavity. The cooling liquid channel is fluidly isolated from the accommodation cavity. At least part of the cooling liquid channel and at least part of the accommodation cavity are located between the first flow channel plate and the second flow channel plate. At least one of the first flow channel plate and the second flow channel plate defines part of the wall of the accommodation cavity. The circuit board is located in the accommodation cavity. The cooling liquid flow channel assembly has a mounting cavity. The mounting cavity can be used for mounting an electric fluid assembly. The electric fluid assembly comprises a stator assembly. The stator assembly can be electrically connected with the circuit board.

[0008] According to the cooling liquid flow channel assembly provided in the technical solution of the present application, at least part of the cooling liquid channel and at least part of the accommodation cavity are located between the first flow channel plate and the second flow channel plate, so that the space between the first flow channel plate and the second flow channel plate can not only enable fluid to flow through the cooling liquid channel, but also can be used for accommodating the circuit board. Compared with separately arranging the mounting shell for accommodating the circuit board, the heat management device provided in the technical solution of the present application is beneficial to reducing the occupied space. By arranging the cooling liquid channel and the accommodation cavity to be fluidly isolated, it is beneficial to reduce or prevent the fluid from entering the accommodation cavity to cause damage to the circuit board. When the cooling liquid flow channel assembly is applied to the heat management device, by arranging the stator assemblies of the at least two electric fluid assemblies to be electrically connected with the circuit board, it is beneficial to improve the integration of the control system of the heat management device. BRIEF DESCRIPTION OF DRAWINGS

[0009] Fig. 1 is an exploded structural schematic view of a heat management device provided in an embodiment of the present application;

[0010] Fig. 2 is a perspective structural schematic view of a heat management device shown in Fig. 1 from one angle;

[0011] Fig. 3 is a perspective structural schematic view of a heat management device shown in Fig. 2 from another angle;

[0012] Fig. 4 is a schematic diagram of a partial cross-sectional structure of a heat exchange assembly according to an embodiment of the present application;

[0013] Fig. 5 is a schematic diagram of a perspective structure of one of the cooling liquid flow channel assemblies shown in Fig. 2 at one angle;

[0014] Fig. 6 is a schematic diagram of a partial perspective structure of a thermal management device according to another embodiment of the present application;

[0015] Fig. 7 is a schematic diagram of an exploded structure of one of the compressors and first seals shown in Fig. 2;

[0016] Fig. 8 is a schematic diagram of another exploded structure of one of the thermal management devices shown in Fig. 2;

[0017] Fig. 9 is a schematic diagram of a cross-sectional structure of one of the thermal management devices shown in Fig. 2 at one position;

[0018] Fig. 10 is a schematic diagram of a partial flow path connection of one of the thermal management devices shown in Fig. 2;

[0019] Fig. 11 is a schematic diagram of a partial flow path connection of another one of the thermal management devices shown in Fig. 2;

[0020] Fig. 12 is a schematic diagram of a cross-sectional structure of one of the cooling liquid flow channel assemblies shown in Fig. 5 at one position;

[0021] Fig. 13 is a schematic diagram of an enlarged structure of one of the cooling liquid flow channel assemblies shown in Fig. 12 at Q1;

[0022] Fig. 14 is a schematic diagram of a connection structure of one of the circuit boards and electrical connectors shown in Fig. 2;

[0023] Fig. 15 is a schematic diagram of a perspective structure of one of the electric pump assemblies shown in Fig. 2;

[0024] Fig. 16 is a schematic diagram of a perspective structure of one of the electric valve assemblies shown in Fig. 2;

[0025] Fig. 17 is a schematic diagram of a cross-sectional structure of one of the thermal management devices shown in Fig. 2 at another position;

[0026] Fig. 18 is a schematic diagram of an exploded structure of one of the cooling liquid flow channel assemblies shown in Fig. 5;

[0027] Fig. 19 is a schematic diagram of a partial perspective structure of one of the cooling liquid flow channel assemblies shown in Fig. 5 at another angle;

[0028] Fig. 20 is a schematic diagram of a perspective structure of one of the cooling liquid flow channel assemblies shown in Fig. 5 at yet another angle;

[0029] FIG. 21 is a structural schematic diagram of another embodiment of the cooling liquid flow channel assembly shown in FIG. 5. DETAILED DESCRIPTION

[0030] The features and exemplary embodiments of various aspects of the present application will be described in detail below with reference to the drawings. For the purpose of clarity, technical terms in the description of the present application are used as generally accepted in the technical field to which the present application belongs. Unless specifically defined in the description of the present application, technical terms used in the description of the present application should not be interpreted in an idealized or overly formal sense.

[0031] The embodiments of the present application provide a heat management device 1, which can be applied to a heat management system, and the heat management system can be a vehicle heat management system, such as a new energy vehicle heat management system.

[0032] As shown in FIGS. 1 to 4, in order to reduce the occupied space of the heat management system, the embodiments of the present application provide a heat management device 1, which includes a cooling liquid flow channel assembly 100, a compressor 200, a refrigerant side fluid assembly 3, and a pipeline assembly 400. The compressor 200 and the refrigerant side fluid assembly 3 can be installed on the cooling liquid flow channel assembly 100. Optionally, the refrigerant side fluid assembly 3 includes a heat exchange assembly 300, and the flow path corresponding to the heat exchange assembly 300 is communicated with the flow path in the cooling liquid flow channel assembly 100. At this time, the cooling liquid system includes the flow path in the cooling liquid flow channel assembly 100 and the corresponding flow path in the heat exchange assembly 300. Compared with the case that the compressor 200, the heat exchange assembly 300, and the cooling liquid flow channel assembly 100 are separately arranged and communicated through a connecting pipe, the heat management device 1 of the embodiments of the present application has a smaller occupied space, which is beneficial to improve the integration of the heat management device 1.

[0033] Further, the embodiment of the present application also provides a cooling liquid flow channel assembly 100, which comprises at least two flow channel plates 107. In the embodiment of the present application, the at least two flow channel plates 107 comprise a first flow channel plate 13, a second flow channel plate 11 and a third flow channel plate 14, and the adjacent flow channel plates 107 are sealingly arranged, for example, the adjacent flow channel plates 107 are sealingly arranged by welding. By sealingly arranging the adjacent flow channel plates 107 by welding, not only the sealing performance of the cooling liquid flow channel assembly 100 can be achieved, but also the structural strength of the cooling liquid flow channel assembly 100 can be improved, thereby providing better support for the installation of the compressor 200 and the refrigerant-side fluid assembly 3. The cooling liquid flow channel assembly 100 has a cooling liquid passage 101, in which the cooling liquid can flow, and the at least two flow channel plates 107 are sealingly arranged to define the cooling liquid passage 101. The heat exchange assembly 300 has a first heat exchange passage 340 and a second heat exchange passage 350, and the first heat exchange passage 340 and the second heat exchange passage 350 are fluidly isolated. The cooling liquid passage 101 is in communication with the first heat exchange passage 340, and the flow path in the compressor 200 is in communication with the second heat exchange passage 350. The pipeline assembly 400 is in communication with the compressor 200 and at least a part of the second heat exchange passages 350, and / or the pipeline assembly 400 is in communication with the second heat exchange passages 350 in different heat exchange assemblies 300, thereby facilitating the flow of the refrigerant among the above-mentioned components.

[0034] In order to install the compressor 200 and the heat exchange assembly 300 on the cooling liquid flow channel assembly 100, in some embodiments, the cooling liquid flow channel assembly 100 comprises a first mounting portion 110 and a second mounting portion 120 which are arranged at intervals and are fixedly connected as an integral structure. Optionally, the first mounting portion 110 and the second mounting portion 120 can be located on the same flow channel plate 107, or the first mounting portion 110 and the second mounting portion 120 are located on different flow channel plates 107 and are sealingly arranged by welding. The compressor 200 is fixedly arranged on the first mounting portion 110, and the refrigerant-side fluid assembly 3 is fixedly arranged on the second mounting portion 120. Optionally, the heat exchange assembly 300 is fixedly arranged on the second mounting portion 120. Specifically, the thermal management device 1 can comprise a fastener 52, and at least one of the compressor 200 and the heat exchange assembly 300 can be connected to the cooling liquid flow channel assembly 100 by the fastener 52. At least one of the inlet of the compressor 200 and the outlet of the compressor 200 is in communication with the second heat exchange passage 350 through the pipeline assembly 400. In a specific implementation, the compressor 200 has a first inlet 210 and a first outlet 220 which are in communication, and at least one of the first inlet 210 and the first outlet 220 is in communication with the second heat exchange passage 350 through the pipeline assembly 400. Through the above arrangement, the communication relationship between the compressor 200 and the heat exchange assembly 300 can be achieved.

[0035] Since the compressor 200 generates vibration when working, generally, the connecting pipe between the compressor and the heat exchange assembly includes metal pipes at both ends and rubber pipes between the metal pipes to compensate for the vibration difference between the compressor and the heat exchange assembly, at this time, the structure of the connecting pipe is complex and the cost is high. In the embodiment of the present application, by installing the compressor 200 and the heat exchange assembly 300 on the cooling liquid flow channel assembly 100, the compressor 200 and the heat exchange assembly 300 can realize synchronous vibration or approximately synchronous vibration through the cooling liquid flow channel assembly 100, which reduces the vibration difference between the compressor 200 and the heat exchange assembly 300, and is beneficial to reduce the deformation degree of the pipeline assembly 400. Compared with the case that the pipeline assembly needs to have a certain deformability when there is a large vibration difference between the compressor and the heat exchange assembly, the thermal management device 1 of the embodiment of the present application is beneficial to simplify the complexity of the pipeline assembly 400.

[0036] Please further refer to FIGS. 1 to 7, in some embodiments, the first mounting portion 110 and the second mounting portion 120 are located on the same side of the cooling liquid flow channel assembly 100, at this time, the compressor 200 and the heat exchange assembly 300 are located on the same side of the cooling liquid flow channel assembly 100, which is beneficial to simplify the complexity and length of the pipeline assembly 400 between the compressor 200 and the heat exchange assembly 300.

[0037] The pipeline assembly 400 includes a first connecting block 41, a second connecting block 42 and a connecting pipe 43, the first connecting block 41 is connected with the heat exchange assembly 300, the second connecting block 42 is connected with the compressor 200, for example, the first connecting block 41 is welded with the heat exchange assembly 300 to realize sealing, and the second connecting block 42 is welded with the compressor 200 to realize sealing. The connecting pipe 43 is connected between the first connecting block 41 and the second connecting block 42, the connecting pipe 43 is a one-piece structure or includes at least two sub-connecting pipes, the sub-connecting pipes are sealingly arranged, and the material of the connecting pipe 43 includes metal. By arranging the first connecting block 41 and the second connecting block 42 to be connected with the corresponding structural member, it is convenient to increase the connection strength between the pipeline assembly 400 and the corresponding structural member, and it is convenient to insert the connecting pipe 43 into the first connecting block 41 and the second connecting block 42 and sealingly arrange, which is beneficial to simplify the structure of the pipeline assembly 400. In the embodiment of the present application, since the compressor 200 and the heat exchange assembly 300 can realize synchronous vibration or approximately synchronous vibration through the cooling liquid flow channel assembly 100, the connecting pipe 43 can include a one-piece metal pipe structure, compared with the combined pipe structure of the metal pipe and the rubber pipe, the connecting pipe 43 of the embodiment of the present application has lower cost and can reduce the volume of the pipeline assembly 400.

[0038] As shown in FIG. 3, in some embodiments, at least part of the connecting pipe 43 comprises a straight pipe segment 431 and a bent pipe segment 432, the straight pipe segment 431 and the bent pipe segment 432 are in one-piece structure, and at least part of the projection of the straight pipe segment 431 and / or at least part of the projection of the bent pipe segment 432 is located between the projection of the compressor 200 and the projection of the heat exchange assembly 300 along the axial projection of the compressor 200. By the above arrangement, it is beneficial to reduce the length of the connecting pipe 43, and thus it is beneficial to reduce the amount of vibration transmitted by the compressor 200 through the connecting pipe 43. And by arranging the straight pipe segment 431 and the bent pipe segment 432, it is convenient to communicate the port of the compressor 200 and the connecting port of the heat exchange assembly 300 which are located at different positions in space. In the embodiments of the present application, the port of the compressor 200 comprises the inlet and outlet of the compressor, and the connecting port of the heat exchange assembly 300 comprises the inlet and outlet of the heat exchange assembly 300.

[0039] Or as shown in FIG. 6, in other embodiments, in order to better absorb the vibration transmitted by the compressor 200, at least part of the connecting pipe 43 comprises a wave segment 433, and at least part of the projection of the wave segment 433 is located between the projection of the compressor 200 and the projection of the heat exchange assembly 300 along the axial projection of the compressor 200. Optionally, at least part of the wave segment 433 is designed as a curved surface.

[0040] In order to meet the working requirements of the thermal management system, in some embodiments, the heat exchange assembly 300 comprises a first heat exchange assembly 310 and a second heat exchange assembly 320, and optionally, the first heat exchange assembly 310 can be a condenser and the second heat exchange assembly 320 can be an evaporator. At least part of the first heat exchange assembly 310 and at least part of the second heat exchange assembly 320 are arranged on the same side of the cooling liquid flow channel assembly 100, and one end of the first heat exchange assembly 310 and one end of the second heat exchange assembly 320 are arranged in a staggered manner, and the other end of the first heat exchange assembly 310 and the other end of the second heat exchange assembly 320 can be arranged in a flush manner. For example, as shown in FIG. 6, the length of the first heat exchange assembly 310 is smaller than the length of the second heat exchange assembly 320, one side of the length direction of the first heat exchange assembly 310 and one side of the length direction of the second heat exchange assembly 320 are arranged opposite to each other, and the other side of the length direction of the first heat exchange assembly 310 and the other side of the length direction of the second heat exchange assembly 320 are arranged in a staggered manner, which is beneficial to the arrangement of other components and improves the compactness of the thermal management device 1.

[0041] In a specific implementation, the projection of the first heat exchange assembly 310 is at least partially located within the second heat exchange assembly 320, and the projection of the compressor 200 is located within the second heat exchange assembly 320. At this time, the part of the compressor 200 is compactly arranged on one side of the first heat exchange assembly 310. One of the connecting ports of the first heat exchange assembly 310 and the first outlet 220 of the compressor 200 are in communication through the pipeline assembly 400. One of the connecting ports of the second heat exchange assembly 320 and the first inlet 210 of the compressor 200 are in communication through the pipeline assembly 400. Through the above arrangement, it is beneficial to improve the compactness of the heat management device 1, while it is beneficial to shorten the length of the pipeline assembly 400 between the compressor and the first heat exchange assembly 310 and the second heat exchange assembly 320, and thus it is beneficial to reduce the transmission of the pipeline assembly 400 to the amplitude of the compressor 200.

[0042] As shown in FIGS. 3 and 6, in some embodiments, the pipeline assembly 400 includes a first pipeline assembly 401 and a second pipeline assembly 402. The first pipeline assembly 401 communicates one of the connecting ports of the first heat exchange assembly 310 and the first outlet 220 of the compressor 200. The second pipeline assembly 402 communicates one of the connecting ports of the second heat exchange assembly 320 and the first inlet 210 of the compressor 200. The first pipeline assembly 401 includes a first connecting pipe 43 with a flow cross-sectional area smaller than that of the first connecting pipe 43 included in the second pipeline assembly 402. Since the first outlet 220 of the compressor 200 outputs high-temperature and high-pressure refrigerant, through the above arrangement, it is beneficial to reduce the pressure drop of the fluid flowing from the first outlet 220 into the first heat exchange assembly 310, or the fluid pressure flowing from the first outlet 220 into the first heat exchange assembly 310 can be improved, thereby facilitating the working performance of the heat management system 1.

[0043] In order to facilitate the installation and sealing of the first heat exchange assembly 310 and the second heat exchange assembly 320 and the cooling liquid flow channel assembly 100, in some embodiments, the heat exchange assembly 300 further includes a connecting plate 330. The connecting plate 330 is sealingly connected with the cooling liquid flow channel assembly 100. At least two of the first heat exchange assembly 310, the second heat exchange assembly 320, and the compressor 200 are arranged side by side on the side of the connecting plate 330 away from the cooling liquid flow channel assembly 100. The connecting plate 330 has a hole 331. The first heat exchange assembly 310 and / or the second heat exchange assembly 320 arranged on the connecting plate 330 are in communication with the cooling liquid channel 101 through the corresponding hole 331, which is beneficial to realize the flow of the cooling liquid between the first heat exchange assembly 310, the second heat exchange assembly 320, and the cooling liquid channel 101.

[0044] In a specific implementation, the first heat exchange assembly 310 and the second heat exchange assembly 320 are both mounted on the connecting plate 330, and the installation and fixation of the heat exchange assembly 300 are realized by the connection of the connecting plate 330 and the cooling liquid flow channel assembly 100. Compared with the installation and fixation of the first heat exchange assembly 310 and the second heat exchange assembly 320 and the cooling liquid flow channel assembly 100, the embodiment of the present application is beneficial to reduce the number of installation parts on the cooling liquid flow channel assembly 100 and facilitate the simplification of the structure of the cooling liquid flow channel assembly 100. In other embodiments, the compressor 200 can also be fixedly connected with the cooling liquid flow channel assembly 100 through the connecting plate 330. In this paper, the fixed arrangement or fixed connection between two components can be direct contact connection or fixed arrangement between two components, or indirect fixed connection between two components through other components.

[0045] In some embodiments, the cooling liquid flow channel assembly 100 includes a second flow channel plate 11, which defines part of the wall of the cooling liquid passage 101, and the first installation part 110 is located on the second flow channel plate 11. Please further refer to FIG. 5, the first installation part 110 includes a support part 111 and at least two connecting ribs 113, which are located on the outer circumferential side of the support part 111, for example, the at least two connecting ribs 113 are arranged along the outer circumferential side of the support part 111 or at least part of the connecting ribs 113 are arranged along the radial direction of the support part 111, and the connecting ribs 113 are connected with the support part 111. The first installation part 110 has a mounting hole 114 located on the outer circumferential side of the support part 111. The end of the compressor 200 can be supported and arranged through the support part 111, and the compressor 200 and the first installation part 110 are connected through the fastener 52, and part of the fastener 52 is located in the mounting hole 114. Through the above arrangement, the structural strength of the second flow channel plate 11 at the position corresponding to the first installation part 110 can be improved, and in turn the connection strength between the compressor 200 and the second flow channel plate 11 can be improved.

[0046] In some embodiments, as shown in FIG. 5, the second installation part 120 has a connecting hole 122, and the refrigerant side fluid assembly 3 is connected with the second installation part 120 through a rigid connecting piece, and part of the rigid connecting piece is located in the connecting hole 122. Optionally, the rigid connecting piece can be a bolt structure, and the connection of the refrigerant side fluid assembly 3 and the second installation part 120 through the rigid connecting piece improves the connection strength between the refrigerant side fluid assembly 3 and the second installation part 120.

[0047] Please further refer to FIGS. 5 to 8, in order to drive the compressor 200 to work, the compressor 200 includes a mounting shell 230 and an electric control board 240 located in the mounting shell 230. The electric control board 240 can control the compressor 200 to work according to the electric signal. Specifically, the mounting shell 230 has a receiving cavity 231, and the electric control board 240 is located in the receiving cavity 231.

[0048] In combination with FIGS. 5-11, in some embodiments, the first mounting portion 110 has a heat dissipation opening K1, the cooling liquid passage 101 communicates with the heat dissipation opening K1, the heat dissipation opening K1 is located on the outer surface of the cooling liquid flow channel assembly 100, the compressor 200 includes a mounting shell 230 and an electric control board 240, the mounting shell 230 has a receiving cavity 231, the electric control board 240 is located in the receiving cavity 231, the mounting shell 230 is sealingly connected with the first mounting portion 110, and the mounting shell 230 covers the heat dissipation opening K1, the cooling liquid passage 101 communicating with the heat dissipation opening K1 and the receiving cavity 231 can be in heat transfer arrangement through the mounting shell 230. Through the above arrangement, the electric control board 240 of the compressor 200 can be conveniently cooled by the cooling liquid flow channel assembly 100. In this document, the heat transfer arrangement means that heat can be transferred between two structures.

[0049] Specifically, in some embodiments, the support portion 111 has a heat dissipation opening K1, at least part of the projection of the electric control board 240 is located inside the support portion 111, part of the cooling liquid passage 101 communicates with the heat dissipation opening K1 or the heat dissipation opening K1 is part of the cooling liquid passage 101, and the cooling liquid can flow out of the cooling liquid flow channel assembly 100 through the heat dissipation opening K1.

[0050] To prevent the cooling liquid from flowing out of the heat management device 1 through the heat dissipation opening K1, the heat management device 1 further includes a first sealing member 511 clamped between the mounting shell 230 and the first mounting portion 110. Specifically, the first sealing member 511 abuts between the mounting shell 230 and the support portion 111, the first sealing member 511 is located on the outer circumferential side of the opening part defining the heat dissipation opening K1, at this time the first sealing member 511 surrounds the outer circumference of the heat dissipation opening K1, and the mounting shell 230 covers the heat dissipation opening K1 to improve the sealing performance of the heat management device 1 and reduce the external leakage of the cooling liquid. Through the above arrangement, the fluid can contact the mounting shell 230 through the heat dissipation opening K1, at this time the cooling liquid passage 101 communicating with the heat dissipation opening K1 and the receiving cavity 231 can be in heat transfer arrangement through the mounting shell 230, which is conducive to cooling the electric control board 240 located in the mounting shell 230 by the cooling liquid and improving the working stability of the electric control board 240. By arranging the heat dissipation opening K1 on the support portion 111, the heat dissipation flow path of the compressor 200 can be integrated and arranged in the cooling liquid flow channel assembly 100, and compared with separately arranging the heat dissipation system of the compressor 200, the embodiments of the present application are conducive to improving the integration and multifunctionality of the heat management device 1.

[0051] To achieve the installation of the first seal 511, as shown in FIG. 7, an installation groove 232 can be arranged at the end of the mounting shell 230, and the first seal 511 is located in the installation groove 232. When the compressor 200 and the first mounting portion 110 are connected by the fastener 52, the first seal 511 located in the installation groove 232 is deformed by extrusion, thereby achieving the sealing of the heat dissipation port K1. Alternatively, an installation groove can also be arranged on the first mounting portion 110, or installation grooves can be arranged on both the mounting shell 230 and the first mounting portion 110 to limit the first seal 511. The sealing performance of the first seal 511 is improved. The material of the mounting shell 230 can include metal, such as aluminum or aluminum alloy, and the heat exchange coefficient of the mounting shell 230 can be 121 W / (m·k)~151 W / (m·k).

[0052] To improve the heat dissipation performance of the electric control board 240, in some embodiments, the heat dissipation port K1 extends along the circumference of the support portion 111, and the heat dissipation port K1 includes a first terminal E1 and a second terminal E2, which are arranged adjacent to each other. Please further refer to FIGS. 5 to 8, the heat dissipation port K1 has a "C" type structure, and the extension path and the occupied area of the heat dissipation port K1 on the support portion 111 are large, which is beneficial to increase the flow of the cooling liquid circulating in the heat dissipation port K1, facilitate to increase the heat dissipation area of the cooling liquid, and further improve the heat dissipation performance of the electric control board 240.

[0053] As shown in FIGS. 9 to 11, to achieve various working modes of the thermal management system, in some embodiments, the thermal management device 1 has a plurality of cooling liquid channels 101, and a part of the number of cooling liquid channels 101 includes a first flow passage section FP1, a second flow passage section FP2, and a third flow passage section FP3, the extension directions of the first flow passage section FP1, the second flow passage section FP2, and the third flow passage section FP3 are different or located on different flow passage plates 107, and the second flow passage section FP2 has the heat dissipation port K1 on the first mounting portion 110. As shown in FIG. 10, one end of the first flow passage section FP1 communicates with one end of the third flow passage section FP3 through the second flow passage section FP2, at this time, the second flow passage section FP2 is part of the cooling liquid channel 101, and the cooling liquid for heat exchange of the to-be-heated elements in the thermal management system flows in the cooling liquid channel 101. Alternatively, as shown in FIG. 11, the cooling liquid channel 101 further includes a fourth flow passage section FP4, one end of the first flow passage section FP1 communicates with one end of the third flow passage section FP3 through the fourth flow passage section FP4, and along the flow direction of the fluid, the second flow passage section FP2 and the fourth flow passage section FP4 are arranged in parallel, at this time, the second flow passage section FP2 with the heat dissipation port K1 can be used as a bypass branch to dissipate heat for the electric control board 240.

[0054] In some embodiments, the cooling liquid flow channel assembly 100 has a first connecting port 172 and a second connecting port 173, the first connecting port 172 is in communication with the other end of the first flow channel segment FP1 or the first connecting port 172 is the other port of the first flow channel segment FP1, and the second connecting port 173 is in communication with the other end of the third flow channel segment FP3 or the second connecting port 173 is the other port of the third flow channel segment FP3, and the first connecting port 172 and the second connecting port 173 can be in communication with different electric fluid assemblies 2.

[0055] As shown in FIG. 12, in some embodiments, the cooling liquid flow channel assembly 100 further includes a pump mounting cavity PU0 and a valve mounting cavity VA0, the pump mounting cavity PU0 includes a first pump mounting cavity 171, the thermal management device 1 includes a pump assembly 700, which can be an electric pump assembly, and the pump assembly 700 includes a first pump assembly 721, which can include a conventional structure of an electric pump assembly such as an impeller assembly, a rotor assembly, etc., and optionally, the first pump assembly 721 can further include a pump housing structure. Part of the first pump assembly 721 is located in the first pump mounting cavity 171, the first connecting port 172 is in communication with or defines the outlet of the first pump mounting cavity 171, and the second connecting port 173 can be in communication with the inlet of the condenser. At this time, the driving action of the first pump assembly 721 is counted so that the cooling liquid flows out of the outlet of the first pump assembly 721, then enters the inlet of the condenser through the first flow channel segment FP1, the second flow channel segment FP2 and the third flow channel segment FP3 or through the first flow channel segment FP1, the second flow channel segment FP2, the fourth flow channel segment FP4 and the third flow channel segment FP3, at this time, the temperature of the cooling liquid before entering the condenser is low, which is convenient for better cooling of the electric control board 240.

[0056] Alternatively, in other embodiments, the third flow channel segment FP3 can be in communication with the outlet of the evaporator, at this time, the temperature of the cooling liquid flowing out of the outlet of the evaporator is low, which is convenient for the cooling liquid to dissipate heat to the electric control board 240 through the second flow channel segment FP2 or the fourth flow channel segment FP4.

[0057] In some embodiments, the pump assembly 700 in the embodiments of the present application is an electric pump assembly. In order to control the operation of the electric pump assembly, as shown in FIGS. 12-14, in some embodiments, the heat management device 1 further comprises a circuit board 181, which is located in the cooling liquid channel assembly 100. When the heat management device 1 comprises at least two electric pump assemblies, the control parts of the electric pump assemblies can be integrated in the circuit board 181, so that one circuit board 181 can control the operation of at least two electric pump assemblies 700. This facilitates the integration of the control of the electric pump assemblies. In other embodiments, the heat management device 1 can further comprise an electric valve assembly 600, and the control part of the electric valve assembly can also be integrated in the circuit board 181, which is conducive to further improving the integration of the control components of the heat management device 1.

[0058] The heat management device 1 can further comprise a sensor, part of which is located in the cooling liquid channel 101, and the sensor is electrically connected to the circuit board 181. Optionally, the sensor is used to detect the pressure and / or temperature of the fluid in the cooling liquid channel 101. For example, the sensor can be a PT sensor.

[0059] During the operation of the circuit board 181, the electrical components of the circuit board 181 will generate heat during operation, for example, the electrical components such as capacitors or resistors of the circuit board 181 will generate heat during operation. In order to achieve heat dissipation of the circuit board 181, in some embodiments, as shown in FIGS. 10-13, part of the number of cooling liquid channels 101 further comprises a fifth flow passage segment FP5, part of which is adjacent to the circuit board 181, and part of which is in heat transfer with the chamber where the circuit board 181 is located. The two ends of the fifth flow passage segment FP5 can communicate with different electric fluid assemblies 2. As shown in FIG. 11, the fifth flow passage segment FP5 comprises flow paths in series with each other. At this time, the cooling liquid channel 101 can be used to dissipate heat from the circuit board 181, or as shown in FIG. 10, the fifth flow passage segment FP5 comprises two parts arranged in parallel, one part forms part of the cooling liquid channel 101, and the other part serves as a bypass branch to dissipate heat from the circuit board 181.

[0060] In some embodiments, as shown in FIG. 1, FIG. 12 to FIG. 20, the cooling liquid flow channel assembly 100 further has a valve mounting cavity VA0, the valve mounting cavity VA0 includes a first valve mounting cavity VA1, the thermal management device 1 further includes an electric valve assembly 600, the electric valve assembly 600 includes a first valve assembly 621, part of the first valve assembly 621 is located in the first valve mounting cavity VA1, the first valve assembly 621 includes a through cavity. A part of the cooling liquid passage 101 further includes a fifth flow path segment FP5, one end of the fifth flow path segment FP5 is capable of communicating with the through cavity of the first valve assembly 621, the other end of the fifth flow path segment FP5 communicates with the inlet of the first pump mounting cavity 171, and the fifth flow path segment FP5 communicates with the first flow path segment FP1 through the inlet of the first pump mounting cavity 171, the outlet of the first pump mounting cavity 171. Through the above setting, the heat dissipation branch for dissipating heat from the circuit board 181 is located upstream of the heat dissipation branch for dissipating heat from the electric control board 240, the part of the fifth flow path segment FP5 for dissipating heat from the circuit board 181 is defined as the first heat dissipation flow path 132, and the second flow path segment FP2 for dissipating heat from the electric control board 240 is defined as the second heat dissipation flow path 142, at this time, the first heat dissipation flow path 132 is located upstream of the second heat dissipation flow path 142. Through the above setting, it is beneficial to improve the rational use of the temperature of the cooling liquid, and by setting the heat dissipation branch in the cooling liquid passage 101 between the first valve assembly 621 and the first pump assembly 721, compared with separately setting a branch specially used for dissipating heat from the circuit board 181, the thermal management device 1 of the embodiment has a simple structure.

[0061] In order to further dissipate heat from the circuit board 181, as shown in FIG. 8, FIG. 12 and FIG. 13, in some embodiments, the cooling liquid flow channel assembly 100 further includes a heat dissipation plate 182, along the thickness direction of the circuit board 181, the heat dissipation plate 182 is located between the circuit board 181 and the first flow channel plate 13, the first flow channel plate 13 has an open port 131 and a first heat dissipation flow path 132 which are in communication with each other, the open port 131 is located on the surface of the first flow channel plate 13 facing the heat dissipation plate 182, the heat dissipation plate 182 covers the open port 131 and the heat dissipation plate 182 is sealingly connected with the first flow channel plate 13, the first heat dissipation flow path 132 is part of the cooling liquid passage 101, or the first heat dissipation flow path 132 is arranged in parallel with part of the cooling liquid passage 101, the first heat dissipation flow path 132 and the circuit board 181 are capable of heat transfer through the heat dissipation plate 182.

[0062] In combination with the above possible implementation manners, the second flow channel plate 11 has a second heat dissipation flow path 142, which is part of the cooling liquid passage 101 or is arranged in parallel with part of the cooling liquid passage 101, and the second heat dissipation flow path 142 and the chamber in which the electric control plate 240 is arranged are in heat transfer, which is conducive to heat dissipation of the electric control plate 240 of the compressor by the second heat dissipation flow path 142, and the first heat dissipation flow path 132 is located upstream of the second heat dissipation flow path 142 in the flow direction of the fluid. Since the heat generation of the electric control plate 240 of the compressor can be greater than that of the circuit board 181, through the above arrangement, the cooling liquid can first dissipate heat of the circuit board 181 and then dissipate heat of the electric control plate 240 of the compressor, which is conducive to reasonable utilization of heat in the cooling liquid flow channel assembly 100.

[0063] In some embodiments, the cooling liquid flow channel assembly 100 includes the second flow channel plate 11, the first flow channel plate 13, and the third flow channel plate 14, at least part of the first flow channel plate 13 is located between the third flow channel plate 14 and the second flow channel plate 11, one side of the first flow channel plate 13 is sealingly connected with the third flow channel plate 14, and the other side of the first flow channel plate 13 is sealingly connected with the second flow channel plate 11. The first pump mounting cavity 171 is located in the third flow channel plate 14, the circuit board 181 is located in the space defined by the first flow channel plate 13 and the second flow channel plate 11, the first mounting portion 110 is located in the second flow channel plate 11, the third flow channel plate 14 and the first flow channel plate 13 respectively define part of the wall of the fifth flow path segment FP5, the third flow channel plate 14, the first flow channel plate 13, and the second flow channel plate 11 all define part of the wall of the first flow path segment FP1, and the second flow channel plate 11 defines part of the wall of the third flow path segment FP3.

[0064] Alternatively, as shown in FIG. 21, in another embodiment, the cooling liquid flow channel assembly 100 can further include a cover plate 15, at least part of the cover plate 15 is located on one side of the flow channel plate 107, and the cover plate 15 and the flow channel plate 107 together define the accommodation cavity 108, and the circuit board 181 is located in the accommodation cavity 108, and the cover plate 15 can not be provided with the cooling liquid passage 101 structure.

[0065] When the heat management device 1 of the embodiment of the present application is applied to a vehicle heat management system, it is necessary to stably install the heat management device of the embodiment of the present application on the vehicle, and to achieve the above-mentioned purpose, in some embodiments, the cooling liquid flow channel assembly 100 comprises a first connecting portion 161 and a second connecting portion 162, the compressor 200 comprises a third connecting portion 250, the first connecting portion 161, the second connecting portion 162 and the third connecting portion 250 are located in three regions of the heat management device 1, and the heat management device 1 further comprises a damping member 53, and at least one damping member 53 is sleeved in the first connecting portion 161, the second connecting portion 162 and the third connecting portion 250. Through the above-mentioned arrangement, it is beneficial to reduce the influence of the vibration generated by the operation of the compressor 200 on the vehicle and reduce the vibration of the vehicle.

[0066] The heat management device 1 further comprises a liquid reservoir 54 and a mounting block 55, the heat exchange assembly 300 comprises a first heat exchange assembly 310, the liquid reservoir 54 is connected with the first heat exchange assembly 310 through the mounting block 55, and the liquid reservoir 54 is located on the side of the first heat exchange assembly 310 away from the cooling liquid flow channel assembly 100, and the liquid reservoir 54 is in communication with the first heat exchange assembly 310. In other embodiments, the heat management device further comprises an expansion valve and a connecting member, and the expansion valve is connected and communicated with the corresponding heat exchange assembly 300 through the connecting member.

[0067] As shown in FIGS. 12 to 16, in order to position the circuit board 181, the cooling liquid flow channel assembly 100 comprises a first flow channel plate 13 and a second flow channel plate 11 arranged in a sealed manner, and the cooling liquid flow channel assembly 100 has a cooling liquid passage 101 and a containing cavity 108, the cooling liquid passage 101 is fluidly isolated from the containing cavity 108, that is, the cooling liquid passage 101 and the containing cavity 108 are not communicated in the cooling liquid flow channel assembly 100, at least part of the cooling liquid passage 101 and at least part of the containing cavity 108 are located between the first flow channel plate 13 and the second flow channel plate 11, and at least one of the first flow channel plate 13 and the second flow channel plate 11 defines part of the wall of the cooling liquid passage 101, and at least one of the first flow channel plate 13 and the second flow channel plate 11 defines part of the wall of the containing cavity 108, the circuit board 181 is located in the containing cavity 108, part of the electric fluid assembly 2 is connected with the cooling liquid flow channel assembly 100, and the electric fluid assembly 2 comprises a stator assembly 201, and the stator assembly 201 is electrically connected with the circuit board 181. Through the above-mentioned arrangement, it is beneficial to improve the integration of the control device of the heat management device 1, prevent the cooling liquid from leaking into the containing cavity 108, and improve the protection performance of the circuit board 181. In the embodiment of the present application, the stator assembly 201 comprises a stator assembly or a motor structure.

[0068] In some embodiments, the circuit board 181 is arranged in position with at least one of the first flow channel plate 13 and the second flow channel plate 11, the electric fluid assembly 2 comprises at least one electric valve assembly 600 and at least one electric pump assembly 700, the cooling fluid flow channel assembly 100 has a pump mounting cavity PU0 and a valve mounting cavity VA0, a part of the electric valve assembly 600 is arranged in the valve mounting cavity VA0, a part of the electric pump assembly 700 is arranged in the pump mounting cavity PU0, and the stator assembly 201 of the electric valve assembly 600 and the stator assembly 201 of the electric pump assembly 700 are electrically connected with the circuit board 181. The electric valve assembly 600 can comprise a valve core assembly and a driving assembly for driving the valve core assembly to rotate, the driving assembly can comprise a motor or a combination of a motor and a speed reduction gear, and the motor is the stator assembly 201 of the electric valve assembly 600. The electric pump assembly 700 can comprise a stator assembly, a rotor assembly and an impeller assembly, the stator assembly can be the stator assembly 201 of the electric pump assembly 700, the stator assembly generates a magnetic field after being electrified, the rotor assembly rotates under the action of the magnetic field, and then drives the impeller assembly to rotate.

[0069] In combination with FIGS. 1-4 and 14-17, in some embodiments, the thermal management device 1 further comprises an electric connector 103, at least a part of the electric connector 103 is arranged in the cooling fluid flow channel assembly 100, and the area where the electric connector 103 is arranged is arranged in fluid isolation with the cooling fluid channel 101 to prevent fluid from entering the area where the electric connector 103 is arranged. The stator assembly 201 of the electric valve assembly 600 and the stator assembly 201 of the electric pump assembly 700 are arranged in fluid isolation with the cooling fluid channel 101, and the stator assembly 201 of the electric valve assembly 600 and / or the stator assembly 201 of the electric pump assembly 700 are electrically connected with the circuit board 181 through the corresponding electric connector 103.

[0070] As shown in FIGS. 1 and 17, in some embodiments, at least a part of the third flow channel plate 14 is arranged on the side of the first flow channel plate 13 away from the second flow channel plate 11, and the third flow channel plate 14 is sealingly connected with the first flow channel plate 13, the first flow channel plate 13 and the third flow channel plate 14 both define part of the wall of the cooling fluid channel 101, and at least one of the pump mounting cavity PU0 and the valve mounting cavity VA0 is arranged in the third flow channel plate 14. Optionally, in the embodiments of the present application, the cooling fluid flow channel assembly 100 has three pump mounting cavities PU0 and three valve mounting cavities VA0, and the three pump mounting cavities PU0 and the three valve mounting cavities VA0 can all be arranged in the third flow channel plate 14.

[0071] At least part of the stator assembly 201 of the electric valve assembly 600 and at least part of the stator assembly 201 of the electric pump assembly 700 are located on the side of the third flow channel plate 14 away from the first flow channel plate 13. To form an electrical connection relationship between the stator assembly 201 and the electrical connector 103, i.e., electrical signals can be transmitted between the stator assembly 201 and the electrical connector 103, as shown in FIG. 14, the electrical connector 103 includes a connection pin PIN, one end of the connection pin PIN is in position with and electrically connected to the circuit board 181, the third flow channel plate 14 includes a pin mounting portion 141, the connection pin PIN is located in the pin mounting portion 141, the other end of the connection pin PIN is located on the outer surface of the pin mounting portion 141, and the connection pin PIN can be electrically connected to the corresponding stator assembly 201 of the electric valve assembly 600 or the stator assembly 201 of the electric pump assembly 700.

[0072] To improve the installation stability of the connection pin PIN and prevent the shaking of the connection pin PIN from causing the electrical connection relationship to fail, in some embodiments, the coolant flow channel assembly 100 further includes a fixing block 109, the connection pin PIN can be integrally formed with the fixing block 109, and the fixing block 109 is in interference fit or clearance fit with the pin mounting portion 141 to achieve the positional stability of the connection pin PIN.

[0073] In some embodiments, as shown in FIG. 16, the electric valve assembly 600 includes a first connector terminal 630, the first connector terminal 630 includes a first pin 631, the first pin 631 is electrically connected to the stator assembly 201 of the electric valve assembly 600, part of the first connector terminal 630 extends in the height direction of the coolant flow channel assembly 100, one of the first connector terminal 630 and the pin mounting portion 141 is embedded in the other, and the first pin 631 is in position with and electrically connected to one end of the connection pin PIN. In this context, the height direction of the coolant flow channel assembly 100 is parallel to or coincides with the axial direction of the electric pump assembly 700 and the electric valve assembly 600. Through the above arrangement, it is beneficial to realize the butt joint installation of the first connector terminal 630 and the pin mounting portion 141 when assembling the drive assembly and the valve core assembly of the electric valve assembly 600, which facilitates the in-position setting and electrical connection of the first pin 631 and one end of the connection pin PIN. In specific implementation, a guide structure can be provided on at least one of the first connector terminal 630 and the corresponding pin mounting portion 141 to facilitate the butt joint of the first pin 631 and the connection pin PIN.

[0074] And / or, the electric pump assembly 700 comprises a second connector terminal 730, the second connector terminal 730 comprises a second pin 731, the second pin 731 is electrically connected with the stator assembly 201 of the electric pump assembly 700, part of the second connector terminal 730 extends along the axial direction of the cooling liquid flow channel assembly 100, one of the second connector terminal 730 and the pin mounting portion 141 is embedded in the other, and the second pin 731 is arranged in position and electrically connected with one end of the connection pin PIN. Through the above arrangement, the second connector terminal 730 and the pin mounting portion 141 can be docked and mounted when the electric pump assembly 700 is assembled with the third flow channel plate 14, and the second pin 731 can be arranged in position and electrically connected with one end of the connection pin PIN. In specific implementation, a guide structure can be arranged on at least one of the second connector terminal 730 and the corresponding pin mounting portion 141, so as to facilitate the docking of the second pin 731 and the connection pin PIN.

[0075] In some embodiments, the heat management device 1 comprises three electric pump assemblies 700 and three electric valve assemblies 600, part of each electric pump assembly 700 is located in a corresponding pump mounting cavity PU0, part of each electric valve assembly 600 is located in a corresponding valve mounting cavity VA0, and a part of the pump mounting cavities PU0 and the corresponding valve mounting cavities VA0 are connected by the cooling liquid channel 101.

[0076] Please further refer to FIG. 8, the cooling liquid flow channel assembly 100 further comprises a fourth flow channel plate 12, at least part of the fourth flow channel plate 12 is located on the side of the second flow channel plate 11 away from the first flow channel plate 13, and the fourth flow channel plate is sealingly connected with the second flow channel plate 11, the second flow channel plate 11 and the fourth flow channel plate both define part of the wall of the cooling liquid channel 101, the fourth flow channel plate comprises a connection port 121, and the heat management device 1 further comprises the heat exchange assembly 300 provided in any of the above embodiments, the heat exchange assembly 300 has a first heat exchange channel 340, and the connection port 121 is in communication with the first heat exchange channel 340. Specifically, the heat exchange assembly 300 can be connected with the fourth flow channel plate 12 through the above-mentioned connection plate 330 to realize the mounting and fixation of the heat exchange assembly 300.

[0077] Further, the cooling liquid flow channel assembly 100 of the embodiment of the present application further comprises a fifth flow channel plate 15, the fifth flow channel plate 15 is located on the side of the third flow channel plate 14 away from the first flow channel plate 11, and the fifth flow channel plate 15 is sealingly arranged with the third flow channel plate 14, so as to seal the cooling liquid flow channel 101 and facilitate the manufacturing of the third flow channel plate 14. The fifth flow channel plate 15 can comprise multiple independent parts or be an integral structure, and the shape of the fifth flow channel plate 15 can match the shape of the groove structure on the side of the third flow channel plate 14 away from the first flow channel plate 11, so as to facilitate the sealing of the cooling liquid flow channel 101 after the fifth flow channel plate 15 is sealingly welded with the third flow channel plate 14.

[0078] In the embodiments of the present application, the pump mounting cavity PU0 can include a first pump mounting cavity 171, a second pump mounting cavity 174 and a third pump mounting cavity 175 all located in the third flow channel plate 14, and the pump assembly 700 can include a first pump assembly 721, a second pump assembly 722 and a third pump assembly 723, at least part of the first pump assembly 721 is located in the first pump mounting cavity 171, at least part of the second pump assembly 722 is located in the second pump mounting cavity 174, and at least part of the third pump assembly 723 is located in the third pump mounting cavity 175. The valve mounting cavity VA0 of the third flow channel plate 14 can include a first valve mounting cavity VA1, a second valve mounting cavity VA2 and a third valve mounting cavity VA3, and the valve assembly 600 can include a first valve assembly 621, a second valve assembly 622 and a third valve assembly 623, at least part of the first valve assembly 621 is located in the first valve mounting cavity VA1, at least part of the second valve assembly 622 is located in the second valve mounting cavity VA2, and at least part of the third valve assembly 623 is located in the third valve mounting cavity VA3. The part of the valve mounting cavity VA0 and the pump mounting cavity PU0 can be communicated through the cooling liquid channel 101. The first valve assembly 621 and the third valve assembly 623 can be three-way proportional valve assemblies, and the second valve assembly 622 can be a multi-way valve structure such as a ten-way valve assembly, a nine-way valve assembly or a twelve-way valve assembly. The number of pump assemblies and valve assemblies can be set according to the structure of the thermal management system.

[0079] In summary, according to the thermal management device and the cooling liquid flow channel assembly provided in the embodiments of the present application, at least part of the cooling liquid channel 101 and the accommodating cavity 108 are located between the first flow channel plate 13 and the second flow channel plate 11, so that the space between the first flow channel plate 13 and the second flow channel plate 11 can not only make the fluid flow through the cooling liquid channel 101, but also can be used to accommodate the circuit board 181. Compared with separately setting the mounting shell for accommodating the circuit board, it is beneficial to reduce the occupied space of the thermal management device 1 provided in the embodiments of the present application. By setting the cooling liquid channel 101 and the accommodating cavity 108 to be fluidly isolated, it is beneficial to reduce or prevent the fluid from entering the accommodating cavity 108 to cause damage to the circuit board. By setting the stator assembly 201 of at least two electric fluid assemblies 2 to be electrically connected with the circuit board 181, it is beneficial to improve the integration of the control system of the thermal management device 1.

[0080] It should be noted that the above technical solutions are only used to illustrate the present application and are not limited to the technical solutions described in the present application. For example, the directions such as "front", "rear", "left", "right", "up", "down" and the like are defined. Although the present application has been described in detail with reference to the above technical solutions, it should be understood by those skilled in the art that the technical personnel in the technical field can still modify or equivalently replace the present application. All technical solutions and improvements that do not deviate from the spirit and scope of the present application shall be covered within the protection scope of the present application.

Claims

1. A thermal management device (1), characterized in that, The heat management device (1) comprises a cooling liquid flow channel assembly (100), a circuit board (181) and at least two electric fluid assemblies (2), the cooling liquid flow channel assembly (100) comprises a first flow channel plate (13) and a second flow channel plate (11) which are sealingly arranged, the cooling liquid flow channel assembly (100) has a cooling liquid channel (101) and a receiving cavity (108), the cooling liquid channel (101) is fluidly isolated from the receiving cavity (108), the circuit board (181) is located in the receiving cavity (108), and a part of the electric fluid assembly (2) is connected to the cooling liquid flow channel assembly (100), the electric fluid assembly (2) comprises a stator assembly (201), and the stator assemblies (201) of the at least two electric fluid assemblies (2) are electrically connected to the circuit board (181).

2. The thermal management device (1) according to claim 1, characterized in that At least part of the cooling liquid channel (101) and at least part of the receiving cavity (108) are located between the first flow channel plate (13) and the second flow channel plate (11), and at least one of the first flow channel plate (13) and the second flow channel plate (11) defines a partial wall of the receiving cavity (108), the circuit board (181) is located and arranged with at least one of the first flow channel plate (13) and the second flow channel plate (11), the electric fluid assembly (2) comprises at least one electric valve assembly (600) and at least one electric pump assembly (700), the cooling liquid flow channel assembly (100) has a pump mounting cavity (PU0) and a valve mounting cavity (VA0), a part of the electric valve assembly (600) is located in the valve mounting cavity (VA0), and a part of the electric pump assembly (700) is located in the pump mounting cavity (PU0), and the stator assemblies (201) of the electric valve assembly (600) and the electric pump assembly (700) are electrically connected to the circuit board (181).

3. The thermal management device (1) according to claim 2, characterized in that The heat management device (1) further comprises an electrical connector (103), at least part of the electrical connector (103) is located in the cooling liquid flow channel assembly (100), and the area where the electrical connector (103) is located is fluidly isolated from the cooling liquid channel (101), and the stator assemblies (201) of the electric valve assembly (600) and / or the electric pump assembly (700) are electrically connected to the circuit board (181) through the corresponding electrical connector (103).

4. The thermal management device (1) according to claim 3, characterized in that The cooling liquid runner assembly (100) further comprises a third runner plate (14), at least part of the third runner plate (14) is located on the side of the first runner plate (13) away from the second runner plate (11), and the third runner plate (14) and the first runner plate (13) are sealingly connected, the first runner plate (13) and the third runner plate (14) both define part of the wall of the cooling liquid passage (101), at least one of the pump mounting cavity (PU0) and the valve mounting cavity (VA0) is located on the third runner plate (14), at least part of the stator assembly (201) of the electric valve assembly (600) and at least part of the stator assembly (201) of the electric pump assembly (700) are both located on the side of the third runner plate (14) away from the first runner plate (13); The electric connection (103) comprises a connection pin (PIN), one end of the connection pin (PIN) is located and electrically connected with the circuit board (181), the third runner plate (14) comprises a pin mounting portion (141), the connection pin (PIN) is located in the pin mounting portion (141), the other end of the connection pin (PIN) is located on the outer surface of the pin mounting portion (141), and the connection pin (PIN) can be electrically connected with the corresponding stator assembly (201) of the electric valve assembly (600) or the stator assembly (201) of the electric pump assembly (700).

5. The thermal management device (1) according to claim 4, characterized in that The electric valve assembly (600) comprises a first connector terminal (630), the first connector terminal (630) comprises a first pin (631), the first pin (631) is electrically connected with the stator assembly (201) of the electric valve assembly (600), part of the first connector terminal (630) extends in the height direction of the cooling liquid runner assembly (100), one of the first connector terminal (630) and the pin mounting portion (141) is embedded in the other, and one end of the first pin (631) is located and electrically connected with the connection pin (PIN); And / or, the electric pump assembly (700) comprises a second connector terminal (730), the second connector terminal (730) comprises a second pin (731), the second pin (731) is electrically connected with the stator assembly (201) of the electric pump assembly (700), part of the second connector terminal (730) extends in the axial direction of the cooling liquid runner assembly (100), one of the second connector terminal (730) and the pin mounting portion (141) is embedded in the other, and one end of the second pin (731) is located and electrically connected with the connection pin (PIN).

6. The thermal management device (1) according to claim 4 or 5, characterized in that The heat management device (1) comprises three electric pump assemblies (700) and three electric valve assemblies (600), parts of each of the electric pump assemblies (700) are located in a corresponding pump mounting cavity (PU0), parts of each of the electric valve assemblies (600) are located in a corresponding valve mounting cavity (VA0), a part of the pump mounting cavities (PU0) and the corresponding valve mounting cavities (VA0) are communicated through the coolant channel (101), the stator assemblies (201) of the three electric pump assemblies (700) and the stator assemblies (201) of the three electric valve assemblies (600) are electrically connected with the circuit board (181).

7. The thermal management device (1) according to claim 4 or 5, characterized in that The coolant channel assembly (100) further comprises a fourth channel plate (12), at least part of the fourth channel plate (12) is located on the side of the second channel plate (11) away from the first channel plate (13), and the fourth channel plate (12) is sealingly connected with the second channel plate (11), the second channel plate (11) and the fourth channel plate (12) both define part of the wall of the coolant channel (101), the fourth channel plate (12) comprises a connection port (121), and the heat management device (1) further comprises a heat exchange assembly (300), the heat exchange assembly (300) has a first heat exchange channel (340), and the connection port (121) is communicated with the first heat exchange channel (340).

8. The thermal management device (1) according to any one of claims 2 to 8, characterized in that The coolant channel assembly (100) further comprises a heat dissipation plate (182), along the thickness direction of the circuit board (181), the heat dissipation plate (182) is located between the circuit board (181) and the first channel plate (13), the first channel plate (13) has an open port (131) and a first heat dissipation flow path (132) which are communicated with each other, the open port (131) is located on the surface of the first channel plate (13) facing the heat dissipation plate (182), the heat dissipation plate (182) covers the open port (131) and is sealingly connected with the first channel plate (13), the first heat dissipation flow path (132) is part of the coolant channel (101), or the first heat dissipation flow path (132) is arranged in parallel with part of the coolant channel (101), and the first heat dissipation flow path (132) and the circuit board (181) can be heat-transferred through the heat dissipation plate (182).

9. The thermal management device (1) according to claim 8, characterized in that The heat management device (1) further comprises a compressor (200) connected with the second flow channel plate (11), the compressor (200) comprises an electric control board (240), the second flow channel plate (11) has a second heat dissipation flow path (142), the second heat dissipation flow path (142) is part of the cooling liquid channel (101), or the second heat dissipation flow path (142) is arranged in parallel with part of the cooling liquid channel (101), the second heat dissipation flow path (142) and the chamber where the electric control board (240) is located are in heat transfer arrangement, and the first heat dissipation flow path (132) is located upstream of the second heat dissipation flow path (142).

10. The thermal management device (1) according to claim 8, characterized in that The heat management device (1) further comprises a sensor, part of the sensor is located in the cooling liquid channel (101), and the sensor is electrically connected with the circuit board (181).

11. A coolant runner assembly (100) characterized by, The cooling liquid flow channel assembly (100) comprises a circuit board (181), the cooling liquid flow channel assembly (100) has a cooling liquid channel (101) and a containing cavity (108), the cooling liquid channel (101) is fluidly isolated from the containing cavity (108), the circuit board (181) is located in the containing cavity (108), the cooling liquid flow channel assembly (100) has a mounting cavity, the mounting cavity can be used for mounting an electric fluid assembly (2), the electric fluid assembly (2) comprises a stator assembly (201), and the stator assembly (201) can be electrically connected with the circuit board (181).

12. The cooling fluid runner assembly (100) of claim 11, wherein, The cooling liquid flow channel assembly (100) further comprises a first flow channel plate (13) and a second flow channel plate (11), at least part of the cooling liquid channel (101) and at least part of the containing cavity (108) are located between the first flow channel plate (13) and the second flow channel plate (11), at least one of the first flow channel plate (13) and the second flow channel plate (11) defines part of a wall of the containing cavity (108), the cooling liquid flow channel assembly (100) further comprises a third flow channel plate (14), at least part of the third flow channel plate (14) is located on a side of the first flow channel plate (13) away from the second flow channel plate (11), and the third flow channel plate (14) and the second flow channel plate (11) are sealingly connected, the first flow channel plate (13) and the third flow channel plate (14) each define part of a wall of the cooling liquid channel (101), and the mounting cavity of the cooling liquid flow channel assembly (100) has a pump mounting cavity (PU0) and a valve mounting cavity (VA0), at least one of the pump mounting cavity (PU0) and the valve mounting cavity (VA0) is located in the third flow channel plate (14).

13. The cooling fluid runner assembly (100) of claim 12, wherein, The cooling liquid flow channel assembly (100) further comprises an electrical connector (103) including a connecting pin (PIN), one end of which is in position and electrically connected with the circuit board (181), the third flow channel plate (14) includes a pin mounting portion (141), the connecting pin (PIN) is located in the pin mounting portion (141), the other end of the connecting pin (PIN) is located on the outer surface of the pin mounting portion (141), and the connecting pin (PIN) can be in position and electrically connected with the stator assembly (201) of the corresponding electric valve assembly (600) or the stator assembly (201) of the electric pump assembly (700).

14. The cooling fluid runner assembly (100) according to claim 12 or 13, characterized in that The cooling liquid flow channel assembly (100) further comprises a heat dissipation plate (182), which is located between the circuit board (181) and the first flow channel plate (13) along the thickness direction of the circuit board (181), the first flow channel plate (13) has an open port (131) and a first heat dissipation flow path (132) that are in communication with each other, the open port (131) is located on the surface of the first flow channel plate (13) facing the heat dissipation plate (182), the heat dissipation plate (182) covers the open port (131) and is sealingly connected with the first flow channel plate (13), the first heat dissipation flow path (132) is part of the cooling liquid passage (101), or the first heat dissipation flow path (132) is arranged in parallel with part of the cooling liquid passage (101), and the first heat dissipation flow path (132) and the circuit board (181) can be in heat transfer arrangement through the heat dissipation plate (182).

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