Thermal management apparatus and coolant flow channel assembly

Abstract

A thermal management apparatus (1) and a coolant flow channel assembly (100). The thermal management apparatus (1) comprises a coolant flow channel assembly (100) and a fluid assembly (2); the coolant flow channel assembly (100) is provided with a mounting cavity (106), a liquid storage cavity (104), and at least two spaced coolant channels (101); at least part of the fluid assembly (2) is located in the mounting cavity (106), and the coolant channels (101) can be communicated with the mounting cavity (106); the coolant flow channel assembly (100) comprises at least two flow channel plates (107), adjacent flow channel plates (107) are arranged in a sealed manner, at least some of the flow channel plates (107) define part of a wall of the liquid storage cavity (104) and part of a wall of each coolant channel (101), and in at least one flow channel plate (107), at least part of the liquid storage cavity (104) is located between the coolant channels (101) that are spaced apart from each other. The present application is conducive to improving the integration level of the coolant flow channel assembly (100) and reducing the space occupied by the coolant flow channel assembly (100).

Description

Heat management device and coolant flow channel assembly

[0001] The present application claims priority to the Chinese patent application No. 2024112605719, filed on September 9, 2024, entitled "Heat management device and coolant flow channel assembly", the content of which is incorporated herein by reference in its entirety; the present application also claims priority to the Chinese patent application No. 2024118366675, filed on December 12, 2024, entitled "Heat management device and coolant flow channel assembly", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of heat management, in particular to a heat management device and a coolant flow channel assembly. BACKGROUND

[0003] The heat management system includes a storage structure of coolant, which is used to provide coolant for the flow path in the heat management system. In the related art, multiple fluid components in the heat management system are integrated and arranged in the storage structure, for example, a coolant storage structure is arranged in one segment arranged in the axial direction of the storage structure, and a flow channel for fluid circulation is arranged in another segment arranged in the axial direction, which causes the storage structure to occupy a large space. SUMMARY

[0004] Therefore, the technical scheme of the present application provides a heat management device and a coolant flow channel assembly, which is beneficial to improve the integration of the coolant flow channel assembly and reduce the occupied space of the coolant flow channel assembly.

[0005] In one aspect, the technical scheme of the present application provides a heat management device, which includes a coolant flow channel assembly and a fluid assembly. The coolant flow channel assembly has a mounting cavity, a liquid storage cavity, and at least two spaced cooling liquid channels. At least part of the fluid assembly is located in the mounting cavity. The coolant flow channel assembly includes at least two flow channel plates, and adjacent flow channel plates are sealingly arranged. At least part of the number of flow channel plates defines part of the wall of the liquid storage cavity and part of the wall of the cooling liquid channel. In at least one flow channel plate, at least part of the liquid storage cavity is located between the spaced cooling liquid channels.

[0006] According to the heat management device provided in the technical solution of the present application, at least part of the fluid assembly is located in the mounting cavity of the cooling liquid flow channel assembly, which facilitates the integrated arrangement of the fluid assembly in the cooling liquid flow channel assembly. The cooling liquid flow channel assembly comprises at least two flow channel plates, and at least part of the flow channel plates define part of the wall of the liquid storage cavity and part of the wall of the cooling liquid channel, which facilitates the integrated arrangement of the liquid storage function and the cooling liquid flow function in the cooling liquid flow channel assembly. Further, in at least one flow channel plate, at least part of the liquid storage cavity is located between the cooling liquid channels arranged at intervals, which facilitates the formation of the liquid storage cavity by using the gap between the cooling liquid channels. When the adjacent flow channel plates are arranged in a sealed manner, one part of the sealed area formed between the adjacent flow channel plates forms a cooling liquid channel, and the gap between the cooling liquid channels arranged at intervals forms a liquid storage cavity. Compared with the separate arrangement of the parallel storage space and the flow channel space, the technical solution of the present application is advantageous in reducing the occupied space of the cooling liquid flow channel assembly.

[0007] In another aspect, the technical solution of the present application also provides a cooling liquid flow channel assembly, which has a liquid storage cavity and at least two cooling liquid channels arranged at intervals. The cooling liquid flow channel assembly comprises at least two flow channel plates, and the adjacent flow channel plates are arranged in a sealed manner. At least part of the flow channel plates define part of the wall of the liquid storage cavity and part of the wall of the cooling liquid channel. In at least one flow channel plate, at least part of the liquid storage cavity is located between the cooling liquid channels arranged at intervals.

[0008] According to the cooling liquid flow channel assembly provided in the technical solution of the present application, the cooling liquid flow channel assembly comprises at least two flow channel plates, and at least part of the flow channel plates define part of the wall of the liquid storage cavity and part of the wall of the cooling liquid channel, which facilitates the integrated arrangement of the liquid storage function and the cooling liquid flow function in the cooling liquid flow channel assembly. Further, in at least one flow channel plate, at least part of the liquid storage cavity is located between the cooling liquid channels arranged at intervals, which facilitates the formation of the liquid storage cavity by using the gap between the cooling liquid channels. When the adjacent flow channel plates are arranged in a sealed manner, one part of the sealed area formed between the adjacent flow channel plates forms a cooling liquid channel, and the gap between the cooling liquid channels arranged at intervals forms a liquid storage cavity. Compared with the separate arrangement of the parallel storage space and the flow channel space, the technical solution of the present application is advantageous in reducing the occupied space of the cooling liquid flow channel assembly.

[0009] In another aspect, the technical solution of the present application also provides a cooling liquid flow channel assembly, which has a liquid storage cavity and at least two cooling liquid channels arranged at intervals. The cooling liquid flow channel assembly comprises at least two flow channel plates, and the adjacent flow channel plates are arranged in a sealed manner. At least part of the flow channel plates define part of the wall of the liquid storage cavity and part of the wall of the cooling liquid channel. In at least one flow channel plate, at least part of the liquid storage cavity is located between the cooling liquid channels arranged at intervals.

[0010] According to the cooling liquid flow channel assembly provided in the technical scheme, the cooling liquid flow channel assembly comprises at least two flow channel plates, a sealing space is defined between adjacent flow channel plates, the sealing space comprises a liquid storage cavity and a cooling liquid channel, at the same height region of the cooling liquid flow channel assembly, the liquid storage cavity is arranged around at least part of the outer circumferential side of the cooling liquid channel, so that one part of the sealing region formed between the adjacent flow channel plates forms the cooling liquid channel, and another part of the sealing region forms the liquid storage cavity. Compared with the separately arranged axial parallel storage space and flow channel space, the liquid storage cavity and the cooling liquid channel in the technical scheme can be located in the sealing space defined by the same group of adjacent flow channel plates, and the technical scheme is beneficial to reduce the occupied space of the cooling liquid flow channel assembly. BRIEF DESCRIPTION OF DRAWINGS

[0011] Fig. 1 is a schematic diagram of an exploded structure of a heat management device according to an embodiment of the present application;

[0012] Fig. 2 is a schematic diagram of a perspective structure of a heat management device shown in Fig. 1 at an angle;

[0013] Fig. 3 is a schematic diagram of a perspective structure of a heat management device shown in Fig. 2 at another angle;

[0014] Fig. 4 is a schematic diagram of a cross-sectional structure of a heat management device shown in Fig. 2;

[0015] Fig. 5 is a schematic diagram of an exploded structure of a cooling liquid flow channel assembly shown in Fig. 1;

[0016] Fig. 6 is a schematic diagram of a perspective structure of a cooling liquid flow channel assembly shown in Fig. 5 at a position;

[0017] Fig. 7 is a schematic diagram of a perspective structure of a cooling liquid flow channel assembly shown in Fig. 5 at another position;

[0018] Fig. 8 is a schematic diagram of a perspective structure of a first flow channel plate shown in Fig. 5 at a position;

[0019] Fig. 9 is a schematic diagram of a perspective structure of a first flow channel plate shown in Fig. 5 at another position;

[0020] Fig. 10 is a schematic diagram of a cross-sectional structure of a first flow channel plate shown in Fig. 9;

[0021] Fig. 11 is a schematic diagram of a perspective structure of a second flow channel plate shown in Fig. 5 at a position;

[0022] Fig. 12 is a schematic diagram of a perspective structure of a second flow channel plate shown in Fig. 5 at a position;

[0023] Fig. 13 is a schematic diagram of a third flow channel plate shown in Fig. 5;

[0024] Fig. 14 is a schematic diagram of a fourth flow channel plate shown in Fig. 5;

[0025] Fig. 15 is a schematic diagram of a partial structure of a combination of the first flow channel plate and the second flow channel plate according to an embodiment of the present application;

[0026] Fig. 16 is a schematic diagram of a partial structure of the second flow channel plate shown in Fig. 15 at one position;

[0027] Fig. 17 is a schematic diagram of a partial structure of the second flow channel plate shown in Fig. 15 at another position. DETAILED DESCRIPTION

[0028] The features and exemplary embodiments of various aspects of the present application will be described in detail below with reference to the accompanying drawings and specific embodiments. In this context, relational terms such as“first” and“second”, and the like, are used solely to distinguish one from another entity of the same name, and do not require or imply any actual relationship or order between or among such entities.

[0029] The thermal management system 1000 includes a coolant system and a refrigerant system, coolant in the coolant system and refrigerant can exchange heat in the heat exchange assembly 300 to realize the heat exchange function of the thermal management system 1000 to the heat exchange element. The coolant system is provided with coolant, and the thermal management system includes a liquid supplement branch.

[0030] As shown in Figs. 1-9, the present application provides a thermal management device 1, which can be used in a thermal management system, such as a vehicle thermal management system. The thermal management device 1 includes a coolant flow channel assembly 100 and a fluid assembly 2, the coolant flow channel assembly 100 has a mounting cavity 106, a liquid storage cavity 104, and at least two spaced cooling liquid channels 101, at least part of the fluid assembly 2 is located in the mounting cavity 106, and the cooling liquid channel 101 and the mounting cavity 106 can communicate. In the present application, the mounting cavity 106 can include a pump mounting cavity PU0 and / or a valve mounting cavity VA0. Specifically, the mounting cavity 106 of the present application includes three pump mounting cavities PU0 and three valve mounting cavities VA0.

[0031] To reduce the space occupied by the thermal management system 1000, the liquid supplement branch in the thermal management system is integrated in the cooling liquid flow channel assembly 100. Based on this, the embodiments of the present application also provide a cooling liquid flow channel assembly 100, which comprises at least two flow channel plates 107, at least one flow channel plate 107 is provided with a mounting cavity 106, and adjacent flow channel plates 107 are sealingly arranged. The sealingly arranged adjacent flow channel plates 107 define a sealed space, and the sealed space comprises a liquid storage cavity 104 and a cooling liquid channel 101. In the same height region of the cooling liquid flow channel assembly 100, the liquid storage cavity 104 surrounds at least part of the outer circumferential side of the cooling liquid channel 101. At this time, in the same height region of the cooling liquid flow channel assembly 100, the liquid storage cavity 104 and the cooling liquid channel 101 can be arranged side by side as a whole, or the liquid storage cavity 104 and the cooling liquid channel 101 are arranged alternately, and at least part of the liquid storage cavity 104 is located between the spaced cooling liquid channels 101. Through the above arrangement, compared with arranging the liquid storage cavity in one section in the height direction of the cooling liquid storage structure and arranging the flow channel in the other section in the height direction, the cooling liquid flow channel assembly 100 of the embodiments of the present application has a smaller axial height.

[0032] In specific implementation, at least part of the flow channel plates 107 define part of the wall of the liquid storage cavity 104 and part of the wall of the cooling liquid channel 101, and in at least one flow channel plate 107, at least part of the liquid storage cavity 104 is located between the spaced cooling liquid channels 101. Through the above arrangement, one part of the sealed region formed between the adjacent flow channel plates 107 forms the cooling liquid channel, and the gap between the spaced cooling liquid channels forms the liquid storage cavity. Compared with separately arranging the parallel storage space and the flow channel space, the technical solution of the present application is beneficial to reducing the occupied space of the cooling liquid flow channel assembly.

[0033] In some embodiments, the at least two flow channel plates 107 comprise a first flow channel plate 14, at least part of the mounting cavities 106 are located in the first flow channel plate 14, the first flow channel plate 14 defines part of the wall of the liquid storage cavity 104 and part of the wall of the cooling liquid channel 101, and in the first flow channel plate 14, the wall defining the cooling liquid channel 101 is spaced apart from the wall defining the mounting cavity 106, part of the liquid storage cavity 104 is located between the mounting cavity 106 and the cooling liquid channel 101, and part of the liquid storage cavity 104 is located between the spaced cooling liquid channels 101. Through the above arrangement, it is convenient to improve the space utilization rate of the first flow channel plate 14, that is, in the first flow channel plate 14, one part defines the mounting cavity 106, another part defines the liquid storage cavity 104, and the remaining part defines the cooling liquid channel 101. Compared with using multiple flow channel plates to arrange the above different cavities and channels, the embodiments of the present application are beneficial to improving the integration degree of the first flow channel plate 14 and reducing the occupied space of the cooling liquid flow channel assembly 100.

[0034] As shown in FIGS. 4-8, in some embodiments, the mounting cavity 106 has a first pump mounting cavity 171, the fluid assembly 2 includes a first pump assembly 721, at least part of the first pump assembly 721 is located in the first pump mounting cavity 171, the first pump mounting cavity 171 is in communication with a corresponding coolant passage 101, in the first flow channel plate 14, the coolant passage 101 has a liquid supplement flow channel BY, the first pump mounting cavity 171 can be in communication with the liquid storage cavity 104 through the corresponding liquid supplement flow channel BY. Through the above arrangement, the coolant in the liquid storage cavity 104 can supplement the fluid of the first pump mounting cavity 171, which facilitates to improve the stability of the thermal management device 1.

[0035] Please further refer to FIGS. 7-10, in some embodiments, the mounting cavity 106 further has a valve mounting cavity VA0, the fluid assembly 2 includes a valve assembly 600, part of the valve assembly 600 is located in the valve mounting cavity VA0, the first flow channel plate 14 further has a liquid storage port 105, the liquid storage port 105 is located at the side end face of the first flow channel plate 14, at least part of the liquid storage port 105 is at the same height as the valve mounting cavity VA0 in the first flow channel plate 14, through the above arrangement, it is convenient to improve the compactness of the first flow channel plate 14. The thermal management device 1 further includes a liquid storage cover 56, the liquid storage cover 56 is detachably connected with the first flow channel plate 14, and the liquid storage cover 56 can seal the liquid storage port 105 to reduce or prevent the overflow of the coolant. Optionally, the thermal management device 1 further includes a pressure regulating valve assembly, the pressure regulating valve assembly is limitingly arranged with the liquid storage cover 56 or the pressure regulating valve assembly is limitingly arranged with the flow channel plate 107, which facilitates to adjust the pressure in the liquid storage cavity 104.

[0036] In specific implementation, as shown in FIG. 10, since at least part of the liquid storage port 105 is at the same height as the valve mounting cavity VA0 in the first flow channel plate 14, at this time, the liquid storage cavity 104 can also be located at the outer peripheral side of the valve mounting cavity VA0, which facilitates to form the liquid storage cavity 104 by using the space at the outer peripheral side of the valve mounting cavity VA0, improves the space utilization rate of the first flow channel plate 14, and further reduces the occupied space of the first flow channel plate 14.

[0037] In some embodiments, the at least two flow channel plates 107 further include a second flow channel plate 13 and a third flow channel plate 11, one end of the second flow channel plate 13 is sealingly arranged with the first flow channel plate 14, the other end of the second flow channel plate 13 is sealingly arranged with one end of the third flow channel plate 11, the second flow channel plate 13 and the third flow channel plate 11 each define part of the wall of the liquid storage cavity 104 and part of the wall of the cooling liquid channel 101, and in at least one of the second flow channel plate 13 and the third flow channel plate 11, at least part of the liquid storage cavity 104 is located between the cooling liquid channels 101 arranged at intervals. Through the above arrangement, the space outside the cooling liquid channel 101 arranged in the second flow channel plate 13 and the third flow channel plate 11 is provided with the liquid storage cavity 104, so that the liquid storage cavity 104 is arranged between the cooling liquid channels 101, which facilitates increasing the capacity of the liquid storage cavity 104 while improving the space utilization of the second flow channel plate 13 and the third flow channel plate 11, and is conducive to realizing the miniaturization of the cooling liquid flow assembly 100.

[0038] In order to meet the capacity requirement of the liquid storage cavity 104, in some embodiments, the liquid storage cavity 104 defined by the first flow channel plate 14, the liquid storage cavity 104 defined by the combination of the first flow channel plate 14 and the second flow channel plate 13, and the liquid storage cavity 104 defined by the combination of the second flow channel plate 13 and the third flow channel plate 11 are in communication with each other. Further, part of the number of cooling liquid channels 101 defined between the first flow channel plate 14 and the second flow channel plate 13, and part of the number of cooling liquid channels 101 defined between the second flow channel plate 13 and the third flow channel plate 11 are in communication with each other, and through the above arrangement, the cooling liquid channel 101 can be arranged on different flow channel plates 107, which facilitates meeting the flow requirements in the thermal management system.

[0039] Please further refer to FIG. 4 and FIG. 5, in some embodiments, the thermal management device 1 further includes a circuit board 181 and an electrical connector 103, the circuit board 181 is located in the space defined by the second flow channel plate 13 and the third flow channel plate 11, and the space where the circuit board 181 is located is fluidly isolated from the liquid storage cavity 104 and the cooling liquid channel 101, preventing fluid leakage into the space where the circuit board 181 is located from damaging the circuit board 181.

[0040] In order to limit the electrical connector 103 and protect the electrical connector 103, as shown in FIG. 4, in some embodiments, at least part of the number of flow channel plates 107 includes a pin mounting portion 141, the electrical connector 103 is located in the space defined by the pin mounting portion 141, the space defined by the pin mounting portion 141 is fluidly isolated from the liquid storage cavity 104 and the cooling liquid channel 101, and at least part of the outer surface of the pin mounting portion 141 defines part of the wall of the liquid storage cavity 104. Compared with arranging the pin mounting portion 141 side by side with the liquid storage cavity 104, the pin mounting portion 141 in the embodiments of the present application is arranged in the space occupied by the liquid storage cavity 104, further reducing the space occupied by the cooling liquid flow assembly 100.

[0041] In some embodiments, the heat management device 1 can further comprise a heat exchange assembly 300, and in particular, the heat exchange assembly 300 can comprise a first heat exchange assembly 310 and a second heat exchange assembly 320, the heat exchange assembly 300 having heat exchange channels with the cooling liquid passages 101. Based on this, to realize the communication between the heat exchange assembly and the cooling liquid passages 101, the at least two flow channel plates 107 further comprise a fourth flow channel plate 12, the fourth flow channel plate 12 having a connection port 121 exposed to an outer surface of the fourth flow channel plate 12, the connection port 121 being capable of being used to communicate with the heat exchange assembly 300. Through the above arrangement, it is convenient to omit the pipeline between the cooling liquid flow channel assembly 100 and the heat exchange assembly 300.

[0042] Further, at least part of the fourth flow channel plate 12 is located on a side of the third flow channel plate 11 away from the second flow channel plate 13, and the fourth flow channel plate 12 is sealingly arranged at the other end of the third flow channel plate 11, the fourth flow channel plate 12 defining part of the wall of the liquid storage cavity 104 and part of the wall of the cooling liquid passages 101. In the fourth flow channel plate 12, at least part of the liquid storage cavity 104 is located between the cooling liquid passages 101 arranged at intervals, the liquid storage cavity 104 defined by the combination of the second flow channel plate 13 and the third flow channel plate 11, the liquid storage cavity 104 defined by the third flow channel plate 11 and the fourth flow channel plate 12 are in communication with each other, and part of the cooling liquid passages 101 defined between the second flow channel plate 13 and the third flow channel plate 11, part of the cooling liquid passages 101 defined between the third flow channel plate 11 and the fourth flow channel plate 12 are in communication with each other. Through the above arrangement, it is convenient to arrange the liquid storage cavity 104 in the space outside the cooling liquid passages 101 of the fourth flow channel plate 12, and to communicate the liquid storage cavities 104 between the flow channel plates 107, so as to make the capacity of the liquid storage cavity 104 meet the requirements.

[0043] As shown in FIGS. 9-13, in some embodiments, the flow channel plate 107 defining part of the wall of the liquid storage cavity 104 and part of the wall of the cooling liquid passages 101 comprises a plurality of partition plate portions 1071, the thickness direction of the partition plate portions 1071 intersects the height direction of the flow channel plate 101, that is, the plurality of partition plate portions 1071 are arranged in a direction intersecting the height direction of the cooling liquid flow channel assembly 100, one side surface of the partition plate portions 1071 defines part of the wall of the cooling liquid passages 101 or one side of the partition plate portions 1071 defines the outer surface of the cooling liquid flow channel assembly 100, and the other side surface of at least part of the plurality of partition plate portions 1071 defines part of the wall of the liquid storage cavity 104.

[0044] In particular, the adjacent flow channel plates 107 can be sealingly arranged by welding corresponding partition plate portions 1071, and the partition plate portions 1071 after welding sealing form a sealed space, which can form the liquid storage cavity 107 and the cooling liquid passages 101.

[0045] In the embodiments of the present application, the pump mounting cavity PU0 can include the first pump mounting cavity 171, the second pump mounting cavity 174 and the third pump mounting cavity 175, which are all located in the first flow channel plate 14. The pump assembly 700 can include the first pump assembly 721, the second pump assembly 722 and the third pump assembly 723. At least part of the first pump assembly 721 is located in the first pump mounting cavity 171. At least part of the second pump assembly 722 is located in the second pump mounting cavity 174. At least part of the third pump assembly 723 is located in the third pump mounting cavity 175. The valve mounting cavity VA0 of the first flow channel plate 14 can include the first valve mounting cavity VA1, the second valve mounting cavity VA2 and the third valve mounting cavity VA3. The valve assembly 600 can include the first valve assembly 621, the second valve assembly 622 and the third valve assembly 623. At least part of the first valve assembly 621 is located in the first valve mounting cavity VA1. At least part of the second valve assembly 622 is located in the second valve mounting cavity VA2. At least part of the third valve assembly 623 is located in the third valve mounting cavity VA3. The partial valve mounting cavity VA0 and the pump mounting cavity PU0 can be connected through the cooling liquid channel 101. The first valve assembly 621 and the third valve assembly 623 can be three-way proportional valve assemblies. The second valve assembly 622 can be a multi-way valve structure such as a ten-way valve assembly, a nine-way valve assembly or a twelve-way valve assembly. The number of pump assemblies and valve assemblies can be set according to the structure of the thermal management system.

[0046] Further referring to FIGS. 1 to 4, in some embodiments, the first flow channel plate 14 can further be provided with a one-way valve mounting cavity. The thermal management device 1 can further include a one-way valve 57, at least part of which is located in the one-way valve mounting cavity.

[0047] The thermal management device 1 can further include a compressor 200 and a pipeline assembly 400. The compressor 200 and the heat exchange assembly 300 can be installed on the cooling liquid flow channel assembly 100. When the compressor 200 is working, the compressor 200, the heat exchange assembly 300 and the cooling liquid flow channel assembly 100 vibrate synchronously as a whole, reducing the vibration difference between different parts of the compressor 200 and the heat exchange assembly 300. When the compressor 200 and the heat exchange assembly 300 can be connected through the pipeline assembly 400, the pipeline assembly 400 of the embodiments of the present application can be an integrated metal pipe structure, for example, the pipeline assembly 400 can include an integrated aluminum pipe structure, which simplifies the structural complexity of the pipeline assembly 400 and reduces the cost. Further, the thermal management device 1 can further include a liquid accumulator 54 and an expansion valve 58, which are connected and communicated with the corresponding heat exchange assembly 300, improving the integration of the thermal management device 1.

[0048] Please further refer to FIGS. 15-17. When the installation cavity 106 has a first pump installation cavity 171 located in the first flow channel plate 14, the first pump installation cavity 171 has a first pump inlet 1710. In some embodiments, the second flow channel plate 13 has a fluid supplement hole 130, and the liquid storage cavity 104 communicates with the first pump inlet 1710 through the fluid supplement hole 130. At least part of the first pump inlet 1710 is arranged opposite to the fluid supplement hole 130. Through the above arrangement, the pump assembly installed in the first pump installation cavity 171 can be easily supplemented with liquid. Compared with the first pump inlet 1710 being far away from the fluid supplement hole 130, at least part of the first pump inlet 1710 in the embodiment of the present application is arranged opposite to the fluid supplement hole 130, and the distance between the first pump inlet 1710 and the fluid supplement hole 130 is short, which facilitates the pump assembly to absorb water.

[0049] Specifically, in some embodiments, the second flow channel plate 13 includes a body portion 131, a first partition portion 132, and a second partition portion 133, which are integrated. The first partition portion 132 protrudes from one side of the body portion 131 in the thickness direction, and the second partition portion 133 protrudes from the other side of the body portion 131 in the thickness direction. Along the thickness direction of the body portion 131, the body portion 131 includes a first end surface S1 and a second end surface S2. The first partition portion 132 extends away from the body portion 131 from the first end surface S1. The second partition portion 133 extends away from the body portion 131 from the second end surface S2. The first partition portion 132 and the first end surface S1 of the body portion 131 define part of the wall of the cooling liquid passage 101. The second partition portion 133 and the second end surface S2 of the body portion 131 define part of the wall of the liquid storage cavity 104. The fluid supplement hole 130 has openings in both the first end surface S1 and the second end surface S2. The opening of the fluid supplement hole 130 in the first end surface S1 is located in the cooling liquid passage 101 defined by the first partition portion 132. The opening of the fluid supplement hole 130 in the second end surface S2 is located in the liquid storage cavity 104 defined by the second partition portion 132. Through the above arrangement, the liquid storage cavity 104 can communicate with the first pump inlet 1710 through the fluid supplement hole 130.

[0050] To reduce the distance between the fluid supplement hole 130 and the first pump inlet 1710, in some embodiments, the wall portion defining the first pump inlet 1710 projects on the first end surface S1 at least partially overlaps the wall portion defining the opening of the fluid supplement hole 130 on the first end surface S1. As shown in FIG. 15, optionally, the wall portion defining the first pump inlet 1710 projects on the first end surface S1 surrounds the outer periphery of the wall portion defining the opening of the fluid supplement hole 130 on the first end surface S1. At this time, the liquid in the liquid storage cavity 104 can directly enter the first pump inlet 1710 through the fluid supplement hole 130 to supplement the pump assembly corresponding to the first pump inlet 1710.

[0051] Optionally, the first pump inlet 1710 has a smaller cross-sectional area than the first pump inlet 1710, for example, the diameter of the first pump inlet 1710 can be less than or equal to 5 mm, which facilitates a small amount of water supplement to the pump assembly corresponding to the first pump inlet 1710 during the operation of the heat management device 1, reduces or prevents the liquid in the cooling liquid channel 101 from flowing into the liquid storage cavity 104 through the fluid supplement hole 130, and reduces or prevents a large amount of fluid in the liquid storage cavity 104 from entering the cooling liquid channel 101, affecting the heat exchange performance of the heat management device 1.

[0052] During the operation of the heat management device 1, gas is likely to be generated in the cooling liquid channel 101. To reduce the influence of the gas on the flow of the fluid in the cooling liquid channel 101, in some embodiments, the second flow channel plate 13 further has a gas exhaust hole 134, which communicates the cooling liquid channel 101 and the liquid storage cavity 104. Optionally, the gas exhaust hole 134 penetrates the second partition plate portion 133, which further defines part of the wall portion of the cooling liquid channel 101, and the gas exhaust hole 134 communicates the cooling liquid channel 101 and the liquid storage cavity 104. The heat management device 1 has a first installation position, in which the gas exhaust hole 134 is arranged close to the top of the heat management device 1. Through the above arrangement, it is convenient to realize the separation of the gas to the upper position of the liquid storage cavity 104 according to the density between the gas and the liquid fluid, and further, the pressure in the liquid storage cavity 104 can be adjusted by the pressure regulating valve assembly.

[0053] As shown in FIG. 17, in some embodiments, the second flow channel plate 13 further comprises a flow guide plate 135 and a top edge plate 136, the flow guide plate 135 is located in the liquid storage cavity 104 and protrudes from the body portion 131, and the top edge plate 136 is located at the top of the cooling liquid flow channel assembly 100 in the first installation position of the thermal management device 1. Specifically, the flow guide plate 135 extends from the second end surface S2 of the body portion 131 away from the body portion 131, and the flow guide plate 135 extends from the second partition portion 133 defining the exhaust hole 134 towards the top edge plate 136, the top edge plate 136 defines part of the wall of the liquid storage cavity 104, and the flow guide plate 135 and the top edge plate 136 have a gap therebetween. During operation of the thermal management device 1, the highest liquid level of the liquid storage cavity 104 changes. Through the above arrangement, the gas generated in the cooling liquid passage 101 is guided to the top of the liquid storage cavity 104, reducing or preventing the exhaust gas from re-entering the liquid in the liquid storage cavity 104.

[0054] Further, in order to facilitate water replenishment to the pump assembly, the fluid replenishment hole 130 is arranged closer to the bottom of the thermal management device 1 than the exhaust hole 134. As shown in FIG. 17, the exhaust hole 134 is arranged close to the top edge plate 136 of the cooling liquid flow channel assembly 100, and the fluid replenishment hole 130 is arranged close to the bottom edge plate 137 of the cooling liquid flow channel assembly 100. Through the above arrangement, the fluid replenishment hole 130 is arranged as close to the bottom edge plate 137 as possible to prevent the liquid level in the liquid storage cavity 104 from falling below the fluid replenishment hole 130, which prevents the pump assembly from being replenished with water.

[0055] In order to realize the communication of the liquid storage cavity 104 on the first end surface S1 side and the liquid storage cavity 104 on the second end surface S2 side as a whole, in some embodiments, the body portion 131 has a plurality of communication holes 139, the communication holes 139 extend through the body portion 131 along the thickness direction of the body portion 131, and the body portion 131 has a communication hole 139 extending through the first end surface S1 and the second end surface S2, the communication hole 139 communicates the liquid storage cavity 104 defined by the first partition portion 132 and the liquid storage cavity 104 defined by the second partition portion 132, so as to communicate the liquid storage cavity 104 on the first end surface S1 side and the liquid storage cavity 104 on the second end surface S2 side.

[0056] In summary, according to the heat management device 1 and the cooling liquid flow channel assembly 100 provided by the embodiment of the present application, at least part of the fluid assembly 2 is located in the installation cavity 106 of the cooling liquid flow channel assembly 100, which facilitates the integrated arrangement of the fluid assembly 2 in the cooling liquid flow channel assembly 100. The cooling liquid flow channel assembly 100 includes at least two flow channel plates 107, and at least part of the number of flow channel plates 107 defines part of the wall of the liquid storage cavity 104 and part of the wall of the cooling liquid channel 101, which facilitates the integrated arrangement of the liquid storage function and the cooling liquid flow function in the cooling liquid flow channel assembly 100. Further, in at least one flow channel plate 107, at least part of the liquid storage cavity 104 is located between the spaced cooling liquid channels 101, which facilitates the formation of the liquid storage cavity 104 by using the gap between the cooling liquid channels 101. When the adjacent flow channel plates 107 are sealingly arranged, one part of the sealing area formed between the adjacent flow channel plates 107 forms the cooling liquid channel 101, and the gap between the spaced cooling liquid channels 101 forms the liquid storage cavity 104. Compared with the separately arranged parallel storage space and flow channel space, the technical solution of the present application is advantageous in reducing the occupied space of the cooling liquid flow channel assembly 100.

[0057] It should be noted that the above technical solutions are only used to illustrate the present application and are not limited to the technical solutions described in the present application. For example, the definitions of "front", "rear", "left", "right", "up", "down" and the like are directional. Although the present application has been described in detail with reference to the above technical solutions, those skilled in the art should understand that the skilled in the art can still modify or equivalently replace the present application. All technical solutions and improvements that do not deviate from the spirit and scope of the present application should be covered within the protection scope of the present application.

Claims

1. A thermal management device (1), characterized in that, The heat management device (1) comprises a cooling liquid flow channel assembly (100) and a fluid assembly (2), the cooling liquid flow channel assembly (100) has a mounting cavity (106), a liquid storage cavity (104) and at least two spaced cooling liquid channels (101), at least part of the fluid assembly (2) is located in the mounting cavity (106); The cooling liquid flow channel assembly (100) comprises at least two flow channel plates (107), the adjacent flow channel plates (107) are sealingly arranged, at least part of the number of flow channel plates (107) define part of the wall of the liquid storage cavity (104) and part of the wall of the cooling liquid channel (101), and at least part of the liquid storage cavity (104) is located between the spaced cooling liquid channels (101) in at least one of the flow channel plates (107).

2. The thermal management device (1) according to claim 1, characterized in that The at least two flow channel plates (107) comprise a first flow channel plate (14), at least part of the number of mounting cavities (106) are located in the first flow channel plate (14), the first flow channel plate (14) defines part of the wall of the liquid storage cavity (104) and part of the wall of the cooling liquid channel (101), and the wall defining the cooling liquid channel (101) is spaced from the wall defining the mounting cavity (106) in the first flow channel plate (14), part of the liquid storage cavity (104) is located between the mounting cavity (106) and the cooling liquid channel (101), and part of the liquid storage cavity (104) is located between the spaced cooling liquid channels (101).

3. The thermal management device (1) according to claim 2, characterized in that The mounting cavity (106) has a first pump mounting cavity (171), the fluid assembly (2) comprises a first pump assembly (721), at least part of the first pump assembly (721) is located in the first pump mounting cavity (171), the first pump mounting cavity (171) is in communication with the corresponding cooling liquid channel (101), and the first pump mounting cavity (171) is in communication with the liquid storage cavity (104) through the corresponding cooling liquid channel (101) in the first flow channel plate (14); And / or, the mounting cavity (106) further has a valve mounting cavity (VA0), the fluid assembly (2) comprises a valve assembly (600), part of the valve assembly (600) is located in the valve mounting cavity (VA0), the first flow channel plate (14) further has a liquid storage port (105), the liquid storage port (105) is located at the side end face of the first flow channel plate (14), at least part of the liquid storage port (105) is located at the same height as the valve mounting cavity (VA0) in the first flow channel plate (14), and part of the liquid storage cavity (104) is located at the outer peripheral side of the valve mounting cavity (VA0); The heat management device (1) further comprises a liquid storage cover (56), the liquid storage cover (56) is detachably connected with the first flow channel plate (14), and the liquid storage cover (56) can seal the liquid storage port (105); The heat management device (1) further comprises a pressure regulating valve assembly, which is positioned with the liquid storage cover (56) or positioned with the flow channel plate (107).

4. The thermal management device (1) according to claim 2 or 3, characterized in that The at least two flow channel plates (107) further comprise a second flow channel plate (13) and a third flow channel plate (11), one end of the second flow channel plate (13) is sealingly arranged with the first flow channel plate (14), the other end of the second flow channel plate (13) is sealingly arranged with one end of the third flow channel plate (11), the second flow channel plate (13) and the third flow channel plate (11) both define part of the wall of the liquid storage cavity (104) and part of the wall of the cooling liquid channel (101), at least part of the liquid storage cavity (104) is located between the cooling liquid channels (101) which are spaced apart in at least one of the second flow channel plate (13) and the third flow channel plate (11); The liquid storage cavity (104) defined by the first flow channel plate (14), the liquid storage cavity (104) defined by the combination of the first flow channel plate (14) and the second flow channel plate (13), and the liquid storage cavity (104) defined by the combination of the second flow channel plate (13) and the third flow channel plate (11) are in communication with each other, and part of the cooling liquid channels (101) defined between the first flow channel plate (14) and the second flow channel plate (13) and part of the cooling liquid channels (101) defined between the second flow channel plate (13) and the third flow channel plate (11) are in communication with each other.

5. The thermal management device (1) according to claim 4, characterized in that The heat management device (1) further comprises a circuit board (181) and an electrical connector (103), the circuit board (181) is located in the space defined by the second flow channel plate (13) and the third flow channel plate (11), the space where the circuit board (181) is located is fluidly isolated from the liquid storage cavity (104) and the cooling liquid channel (101), at least part of the flow channel plates (107) comprise a pin mounting portion (141), the electrical connector (103) is located in the space defined by the pin mounting portion (141), the space defined by the pin mounting portion (141) is fluidly isolated from the liquid storage cavity (104) and the cooling liquid channel (101), at least part of the outer surface of the pin mounting portion (141) defines part of the wall of the liquid storage cavity (104).

6. The thermal management device (1) according to claim 4, characterized in that The at least two flow channel plates (107) further comprise a fourth flow channel plate (12), the fourth flow channel plate (12) has a connection port (121), the connection port (121) is exposed to the outer surface of the fourth flow channel plate (12), and the connection port (121) can be used to communicate with a heat exchange assembly (300); At least part of the fourth flow channel plate (12) is located on the side of the third flow channel plate (11) away from the second flow channel plate (13), and the fourth flow channel plate (12) is sealingly arranged at the other end of the third flow channel plate (11). The fourth flow channel plate (12) defines part of the wall of the liquid storage cavity (104) and part of the wall of the cooling liquid channel (101). In the fourth flow channel plate (12), at least part of the liquid storage cavity (104) is located between the cooling liquid channels (101) arranged at intervals. The liquid storage cavity (104) defined by the combination of the second flow channel plate (13) and the third flow channel plate (11) and the liquid storage cavity (104) defined by the third flow channel plate (11) and the fourth flow channel plate (12) are in communication with each other. Part of the cooling liquid channels (101) defined between the second flow channel plate (13) and the third flow channel plate (11) and part of the cooling liquid channels (101) defined between the third flow channel plate (11) and the fourth flow channel plate (12) are in communication with each other.

7. The thermal management device (1) according to any one of claims 1 to 6, characterized in that The flow channel plate (107) defining part of the wall of the liquid storage cavity (104) and part of the wall of the cooling liquid channel (101) includes a plurality of partition plate portions (1071). The plurality of partition plate portions (1071) are arranged in a direction intersecting the height direction of the cooling liquid flow channel assembly (100). One side surface of the partition plate portion (1071) defines part of the wall of the cooling liquid channel (101), and the other side surface of at least part of the partition plate portion defines part of the wall of the liquid storage cavity (104).

8. The thermal management device (1) according to any one of claims 2 to 6, characterized in that The mounting cavity (106) has a first pump mounting cavity (171). The at least two flow channel plates (107) further include a second flow channel plate (13). One end of the second flow channel plate (13) is sealingly arranged with the first flow channel plate (14). The first pump mounting cavity (171) is located in the first flow channel plate (14). The first pump mounting cavity (171) has a first pump inlet (1710). The second flow channel plate (13) has a fluid supplement hole (130). The liquid storage cavity (104) communicates with the first pump inlet (1710) through the fluid supplement hole (130). At least part of the first pump inlet (1710) is arranged opposite to the fluid supplement hole (130).

9. The thermal management device (1) according to claim 8, characterized in that The second flow channel plate (13) includes a body portion (131), a first partition plate portion (132), and a second partition plate portion (133). The first partition plate portion (132) protrudes from one side of the thickness direction of the body portion (131). The second partition plate portion (133) protrudes from the other side of the thickness direction of the body portion (131). The first partition plate portion (132) and the first end surface (S1) of the body portion (131) define part of the wall of the cooling liquid channel (101). The second partition plate portion (133) and the second end surface (S2) of the body portion (131) define part of the wall of the liquid storage cavity (104). The fluid supplement hole (130) has openings in the first end surface (S1) and the second end surface (S2), and the opening of the fluid supplement hole (130) in the first end surface (S1) is located in the cooling liquid passage (101) defined by the first partition portion (132), and the opening of the fluid supplement hole (130) in the second end surface (S2) is located in the liquid storage cavity (104) defined by the second partition portion (132), and the wall portion defining the first pump inlet (1710) is at least partially overlapped with the wall portion defining the opening of the fluid supplement hole (130) in the first end surface (S1) in the projection of the first end surface (S1); and / or, the first partition portion (132) and the first end surface (S1) of the body portion (131) define part of the wall portion of the liquid storage cavity (104), and the body portion (131) further has a communication hole (139) penetrating through the first end surface (S1) and the second end surface (S2), and the communication hole (139) communicates the liquid storage cavity (104) defined by the first partition portion (132) and the liquid storage cavity (104) defined by the second partition portion (132).

10. The thermal management device (1) according to claim 9, characterized in that The second flow channel plate (13) further has an exhaust hole (134) penetrating through the second partition portion (133) which also defines part of the wall portion of the cooling liquid passage (101), and the exhaust hole (134) communicates the cooling liquid passage (101) and the liquid storage cavity (104), and the thermal management device (1) has a first installation position, in which the exhaust hole (134) is arranged close to the top of the thermal management device (1), and the fluid supplement hole (130) is arranged closer to the bottom of the thermal management device (1) than the exhaust hole (134); The second flow channel plate (13) further includes a flow guide plate (135) and a top edge plate (136), the flow guide plate (135) is located in the liquid storage cavity (104), the flow guide plate (135) extends away from the body portion (131) from the second end surface (S2), and the flow guide plate (135) extends from the second partition portion (133) defining the exhaust hole (134) to the direction close to the top edge plate (136), the top edge plate (136) defines part of the wall portion of the liquid storage cavity (104), and the flow guide plate (135) and the top edge plate (136) have a gap therebetween, and in the first installation position, the top edge plate (136) is located at the top of the cooling liquid flow channel assembly (100).

11. A coolant runner assembly (100) characterized by, The cooling liquid flow channel assembly (100) has a liquid storage cavity (104) and at least two spaced cooling liquid passages (101); The cooling liquid flow channel assembly (100) comprises at least two flow channel plates (107), the adjacent flow channel plates (107) are sealingly arranged, at least part of the flow channel plates (107) define part of the wall of the liquid storage cavity (104) and part of the wall of the cooling liquid channel (101), and at least part of the liquid storage cavity (104) is located between the cooling liquid channels (101) which are spaced apart in at least one of the flow channel plates (107).

12. The cooling fluid runner assembly (100) of claim 11, wherein, The cooling liquid flow channel assembly (100) further comprises a mounting cavity (106) for mounting a fluid assembly (2), and the mounting cavity (106) is in communication with part of the cooling liquid channel (101). The at least two flow channel plates (107) comprise a first flow channel plate (14), and the mounting cavity (106) is located in the first flow channel plate (14), the first flow channel plate (14) defines part of the wall of the liquid storage cavity (104) and part of the wall of the cooling liquid channel (101), the wall defining the cooling liquid channel (101) and the wall defining the mounting cavity (106) are spaced apart in the first flow channel plate (14), part of the liquid storage cavity (104) is located between the mounting cavity (106) and the cooling liquid channel (101), and part of the liquid storage cavity (104) is located between the cooling liquid channels (101) which are spaced apart.

13. The cooling fluid runner assembly (100) of claim 12, wherein, The at least two flow channel plates (107) further comprise a second flow channel plate (13) and a third flow channel plate (11), one end of the second flow channel plate (13) is sealingly arranged with the first flow channel plate (14), the other end of the second flow channel plate (13) is sealingly arranged with the third flow channel plate (11), and the second flow channel plate (13) and the third flow channel plate (11) both define part of the wall of the liquid storage cavity (104) and part of the wall of the cooling liquid channel (101), and at least part of the liquid storage cavity (104) is located between the cooling liquid channels (101) which are spaced apart in at least one of the second flow channel plate (13) and the third flow channel plate (11). The liquid storage cavity (104) defined by the first flow channel plate (14), the liquid storage cavity (104) defined by the combination of the first flow channel plate (14) and the second flow channel plate (13), and the liquid storage cavity (104) defined by the combination of the second flow channel plate (13) and the third flow channel plate (11) are in communication with each other, and part of the cooling liquid channels (101) defined between the first flow channel plate (14) and the second flow channel plate (13) and part of the cooling liquid channels (101) defined between the second flow channel plate (13) and the third flow channel plate (11) are in communication with each other.

14. The cooling fluid runner assembly (100) according to claim 12 or 13, characterized in that The mounting cavity (106) has a first pump mounting cavity (171), the at least two flow channel plates (107) further comprise a second flow channel plate (13), one end of the second flow channel plate (13) is sealingly arranged with the first flow channel plate (14), the first pump mounting cavity (171) is located at the first flow channel plate (14), the first pump mounting cavity (171) has a first pump inlet (1710), the second flow channel plate (13) has a fluid supplement hole (130), the liquid storage cavity (104) communicates with the first pump inlet (1710) through the fluid supplement hole (130), at least part of the first pump inlet (1710) is arranged opposite to the fluid supplement hole (130); The second flow channel plate (13) comprises a body part (131), a first partition part (132) and a second partition part (133), the first partition part (132) protrudes from one side of the thickness direction of the body part (131), the second partition part (133) protrudes from the other side of the thickness direction of the body part (131), the first partition part (132) and the first end surface (S1) of the body part (131) define part of the wall of the cooling liquid channel (101), the second partition part (133) and the second end surface (S2) of the body part (131) define part of the wall of the liquid storage cavity (104), the fluid supplement hole (130) has openings at the first end surface (S1) and the second end surface (S2), and the opening of the fluid supplement hole (130) at the first end surface (S1) is located in the cooling liquid channel (101) defined by the first partition part (132), the opening of the fluid supplement hole (130) at the second end surface (S2) is located in the liquid storage cavity (104) defined by the second partition part (132), the wall part defining the first pump inlet (1710) is at least partially overlapped with the wall part defining the opening of the fluid supplement hole (130) at the first end surface (S1) in projection on the first end surface (S1); The second flow channel plate (13) further has a vent hole (134), the vent hole (134) penetrates the second partition part (133), the second partition part (133) further defines part of the wall of the cooling liquid channel (101), the vent hole (134) communicates the cooling liquid channel (101) and the liquid storage cavity (104), the cooling liquid flow channel assembly (100) has a first mounting position, in the first mounting position, the vent hole (134) is arranged close to the top of the cooling liquid flow channel assembly (100), the fluid supplement hole (130) is arranged closer to the bottom of the cooling liquid flow channel assembly (100) than the vent hole (134).

15. A coolant runner assembly (100) characterized by, The cooling liquid flow channel assembly (100) comprises at least two flow channel plates (107), the adjacent flow channel plates (107) are sealingly arranged, the adjacent flow channel plates (107) arranged sealingly define a sealed space, the sealed space comprises a liquid storage cavity (104) and a cooling liquid channel (101), the liquid storage cavity (104) surrounds at least a part of the outer circumferential side of the cooling liquid channel (101) at the same height region of the cooling liquid flow channel assembly (100).

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