Film for forming resin layer, and method for producing film for forming resin layer

Abstract

A film for forming a resin layer, comprising a base material film, wherein: a dispersion component γd1 of surface free energy of a first surface is 45 mJ / m2 or less, and a polar component γp1 is 10 mJ / m2 or more; a polar component γp2 of surface free energy of a second surface is 20 mJ / m2 or less; [√((γd1-γd2)2+(γp1-γp2)2) ≥ 10] is satisfied (γp2 indicates a polar component of surface free energy of the second surface of the film); the surface resistance value of at least one surface is 1012 Ω / sq or less; a coefficient of dynamic friction measured by bringing the first surface and the second surface into close contact with each other is 0.9 or less; and the glass transition temperature is 200°C or higher.

Description

Film for forming a resin layer and method for manufacturing film for forming a resin layer

[0001] The present invention relates to a film for forming a resin layer, which has good adhesion to other resins and good antistatic properties, blocking resistance, transportability, and heat resistance, and a method for producing the same. In particular, the film for forming a resin layer of the present invention is used for a roll-form laminate produced by a process of applying (drying) or laminating a resin (single or in a solution state) onto the film for forming a resin layer in a roll-to-roll manner to adhere the resin.

[0002] In the production of a laminate film, which is produced by providing a resin layer (hereinafter also referred to as a functional layer) on the surface of a substrate film as a support, or by laminating another functional layer on the surface of the functional layer, if the compositions of the functional layers are significantly different when providing the functional layer on the support or laminating another functional layer on the functional layer, sufficient adhesion may not be obtained. Such insufficient adhesion may cause peeling in the next process or a shortened product life.

[0003] Conventionally, a surface activation treatment has been attempted to hydrophilize the surface by immersing the surface to be laminated or adhered in a strong alkaline solution and performing a saponification treatment. Other known surface activation treatments include corona treatment, UV ozone treatment, and plasma treatment. For example, as disclosed in Patent Document 1, plasma treatment is used to improve adhesion when producing a laminate film having two or more functional layers.

[0004] From the viewpoint of productivity, it is preferable that the process of applying a resin solution or molten resin to a resin layer-forming film that has been treated to improve adhesion, or the process of laminating another film, be carried out by roll-to-roll. On the other hand, when a laminate film is produced by roll-to-roll in this manner, problems may occur during storage, transportation, or when passing through a process. For example, when a resin layer-forming film that has been treated to improve adhesion before lamination of a functional layer is stored or transported in a rolled state, so-called blocking occurs, where the treated surface is pressed against the opposite surface and adheres tightly due to tightening of the winding. Furthermore, when a roll-shaped resin layer-forming film is used, if it is electrically charged, it can cause foreign matter such as dust to adhere, and static electricity generated when unwinding, etc., can cause ignition or direct problems with the product depending on the production environment.

[0005] In Patent Document 2, such problems due to blocking and charging are solved by providing a conductive layer on one surface and setting the arithmetic mean roughness (Ra) of the opposite surface to a specific value or more.

[0006] JP 2007-245454 A JP 2017-19273 A

[0007] However, when blocking is prevented by roughening the surface as in Patent Document 2, if a hard coat as in Patent Document 2 is not used, new problems such as scratches on the surface caused by rubbing against the opposite surface occur.

[0008] Furthermore, in Patent Document 2, no surface activation treatment is performed for the purpose of improving adhesion. If a surface activation treatment is performed, blocking occurs more significantly, making it more difficult to select the surface state.

[0009] Furthermore, if a drying process or the like is required, the film must have heat resistance to withstand the process, and transportability that can prevent wrinkles and other abnormalities that occur during transport and winding.

[0010] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a film for forming a resin layer that has good adhesion to other resins and good antistatic properties, blocking resistance, transportability, and heat resistance, and to provide a method for producing the film for forming a resin layer.

[0011] The present inventors have conducted extensive research to solve the above problems and have completed the present invention. That is, the present invention provides the following.

[0012] [1] A substrate film is provided, and the dispersion component γd1 of the surface free energy of the first surface is 45 mJ / m ２ The range is as follows, and the polar component γp1 is 10 mJ / m ２ or more, and the polar component γp2 of the surface free energy of the second surface opposite to the first surface is 20 mJ / m ２ is less than or equal to, satisfies the following formula (1), √((γd1-γd2) ２ + (γp1-γp2) ２ ) ≧ 10 (1) (γd1: dispersive component of surface free energy of the first surface of the film, γd2: dispersive component of surface free energy of the second surface of the film, γp1: polar component of surface free energy of the first surface of the film, γp2: polar component of surface free energy of the second surface of the film) When the surface resistance of at least one surface is 10 １２ a coefficient of dynamic friction of 0.9 or less when measured by bringing the first surface and the second surface into close contact with each other; and a glass transition temperature of 200°C or more.

[0013] The film for forming a resin layer is used by forming a resin layer on the first surface. According to the above configuration, the dispersion component γd1 of the surface free energy of the first surface is 45 mJ / m ２ Since the polar component γp1 of the surface free energy of the first surface is within the range below 10 mJ / m, the value is close to that of the target resin (resin layer) to be adhered. ２Since the polar component γp2 of the surface free energy of the second surface is low and the difference in surface free energy between the first surface and the second surface is large, blocking between the first surface and the second surface can be suppressed when the film is wound into a roll. Specifically, the polar component γp2 of the surface free energy of the second surface is 20 mJ / m ２ Since the surface resistance is 10 or less and satisfies the formula (1), blocking can be suppressed. １２ The tensile strength is Ω / sq or less, which means excellent antistatic properties. The kinetic friction coefficient is 0.9 or less, which means excellent transportability. The glass transition temperature is 200°C or higher, which means excellent heat resistance.

[0014] [2] The film for forming a resin layer according to [1], wherein 80% by mass or more of the resin constituting the base film is a polyimide resin.

[0015] When 80% by mass or more of the resin constituting the base film is a polyimide-based resin, the base film has better heat resistance.

[0016] [3] The film for forming a resin layer according to [1] or [2], wherein 80% by mass or more of the resin constituting the base film is polyimidebenzoxazole.

[0017] When 80% by mass or more of the resin constituting the base film is polyimidebenzoxazole, the CTE is low, making it less likely to curl in subsequent processes, and since the CTE is low (approximately the same as that of glass), it is particularly suitable for laminating with a layer having a low CTE such as glass.

[0018] [4] At least one surface of the base film has a surface resistance of 10 １２ The film for forming a resin layer according to any one of [1] to [3] above, characterized in that it has a conductive layer of Ω / sq or less.

[0019] At least one surface of the base film has a surface resistance of 10 １２ When the conductive layer has a resistivity of Ω / sq or less, antistatic properties can be suitably exhibited.

[0020] [5] The film for forming a resin layer according to [4], wherein the conductive layer is a layer containing a thiophene-based conductive polymer.

[0021] When the conductive layer is a layer containing a thiophene-based conductive polymer, the polar component γp2 of the surface free energy of the second surface can be suitably reduced, and as a result, the difference in surface free energy between the first surface and the second surface can be suitably increased, thereby further suppressing blocking between the first surface and the second surface.

[0022] [6] The film for forming a resin layer according to any one of [1] to [5], characterized in that at least one surface thereof is subjected to a plasma treatment.

[0023] When at least one of the surfaces is subjected to plasma treatment, the value of the polar component of the surface free energy of that surface can be suitably increased.

[0024] [7] The film for forming a resin layer according to any one of [1] to [6], characterized in that the arithmetic mean roughness (Sa) of at least one surface is 0.5 nm or more and 2.5 nm or less.

[0025] When the arithmetic mean roughness (Sa) of at least one surface is 0.5 nm or more and 2.5 nm or less, the coefficient of dynamic friction of that surface can be suitably reduced.

[0026] [8] The film for forming a resin layer according to any one of [1] to [7], characterized in that the haze is 2% or less.

[0027] When the haze is 2% or less, the film for forming a resin layer can be suitably used in places where light transmission is required, such as optical waveguides.

[0028] [9] The method for producing a film for forming a resin layer according to [4], comprising: a step A of preparing a base film; and a step B of applying a conductive material solution to a first surface of the base film, a second surface opposite to the first surface, or both surfaces of the base film, and drying the solution to form a conductive layer.

[0029] According to the above-mentioned configuration, the film for forming a resin layer can be suitably produced.

[0030]

[10] The method for producing a film for forming a resin layer according to [9] above, wherein the conductive material solution contains a lubricant.

[0031] If the conductive material solution contains a lubricant, the coefficient of dynamic friction on the surface of the conductive layer can be suitably reduced.

[0032]

[11] The method for producing a film for forming a resin layer according to [9] or

[10] , comprising a step C of performing a surface activation treatment on at least one surface of the base film.

[0033] By carrying out step C of subjecting at least one surface of the substrate film to a surface activation treatment, the value of the polar component of the surface free energy of that surface can be suitably increased.

[0034] According to the present invention, it is possible to provide a film for forming a resin layer that has good adhesion to other resins and good antistatic properties, blocking resistance, transportability, and heat resistance, and also to provide a method for producing the film for forming a resin layer.

[0035] FIG. 10 is a diagram for explaining a method for measuring the amount of peeling charge.

[0036] Hereinafter, an embodiment of the present invention will be described.

[0037] The film for forming a resin layer according to this embodiment has a base film, and the dispersion component γd1 of the surface free energy of the first surface is 15 mJ / m ２ 45mJ / m or more ２ The range is as follows, and the polar component γp1 is 10 mJ / m ２ or more, and the polar component γp2 of the surface free energy of the second surface opposite to the first surface is 20 mJ / m ２ is less than or equal to, satisfies the following formula (1), √((γd1-γd2) ２ + (γp1-γp2) ２) ≧ 10 (1) (γd1: dispersive component of surface free energy of the first surface of the film, γd2: dispersive component of surface free energy of the second surface of the film, γp1: polar component of surface free energy of the first surface of the film, γp2: polar component of surface free energy of the second surface of the film) When the surface resistance of at least one surface is 10 １１ the coefficient of dynamic friction measured by bringing the first surface and the second surface into close contact is 0.8 or less; and the glass transition temperature is 200°C or higher.

[0038] <Resin Adhesion: Surface Free Energy> The dispersion component γd1 of the surface free energy of the first surface is 15 mJ / m ２ More than 18 mJ / m is preferable. ２ More preferably, 20 mJ / m or more ２ On the other hand, the dispersion component γd1 of the surface free energy of the first surface is 45 mJ / m from the viewpoint of manufacturing costs. ２ Preferably, 40 mJ / m or less ２ More preferably, 35 mJ / m or less ２ The following is even more preferable: The dispersion component γd1 of the surface free energy of the first surface can be a combination of these upper and lower limits. For example, the dispersion component γd1 of the surface free energy of the first surface is 15 mJ / m ２ 45mJ / m or more ２ The dispersion component γd1 of the surface free energy of the first surface is 15 mJ / m ２ 45mJ / m or more ２ Within the following range, the dispersion component γd1 of the surface free energy of the first surface is close to that of the target resin (resin layer) to be adhered. ２ 40mJ / m or more ２ The following range is preferred: 20 mJ / m ２ 35mJ / m or more ２ The following ranges are more preferred:

[0039] The dispersion component γd1 of the surface free energy of the first surface can be controlled by the material (resin) constituting the resin layer-forming film, molecular weight, molecular density, etc. The dispersion component γd1 of the surface free energy of the first surface can also be controlled by a surface activation treatment described later. That is, the molecular weight, molecular density, etc. of the resin constituting the resin layer-forming film can be controlled by a surface activation treatment described later.

[0040] Examples of the resin layer to be adhered to the first surface include layers containing epoxy resins (particularly, photosensitive epoxy resins and fluorine-based epoxy resins), PEEK resins (polyether ether ketone resins), polyimide resins, polyamide resins, polyamideimide resins, polyetherimide resins, etc.

[0041] The resin layer has a surface free energy dispersion component γd of 15 mJ / m ２ 45mJ / m or more ２ The range is preferably 18 mJ / m ２ 40mJ / m or more ２ More preferably, the range is 20 mJ / m ２ 35mJ / m or more ２ It is more preferable that the dispersion component γd of the surface free energy of the surface of the resin layer is 15 mJ / m ２ 56mJ / m or more ２ Within the following range, it can be said that the value is close to the dispersion component γd1 of the surface free energy of the first surface of the film for resin layer formation.

[0042] The film for forming a resin layer has a polar component γp1 of the surface free energy of the first surface of 10 mJ / m ２ The polar component γp1 of the surface free energy of the first surface is preferably 15 mJ / m or more. This improves the adhesion between the film for resin layer formation and the resin layer. ２ More preferably, 20 mJ / m or more ２On the other hand, the polar component γp1 of the surface free energy of the first surface is preferably 50 mJ / m ２ Preferably, 45 mJ / m or less ２ The polar component γp1 of the surface free energy of the first surface can be set to a value in combination with the upper and lower limits, and is preferably 10 mJ / m ２ 40mJ / m or more ２ The following are examples.

[0043] The polar component γp1 of the surface free energy of the first surface can be controlled by surface activation treatment. When the surface of the resin layer-forming film is subjected to a surface activation treatment for the purpose of improving resin adhesion, for example, saponification treatment increases the hydrophilicity of the surface, and plasma treatment increases the polarity by precipitating functional groups on the surface. When the polar component γp1 of the surface free energy increases, resin adhesion tends to improve.

[0044] <Blocking> In this specification, blocking refers to a defect in which films come into contact with each other and adhere to each other in a state that makes them difficult to peel, and when the films that have become difficult to peel are peeled off, visually observable abnormalities in appearance such as whitening, surface roughness, turbidity, peeling, etc. occur on the surfaces of the parts of the films that were in contact with each other.

[0045] <Blocking Resistance: Surface Free Energy> As described above, when the surface with improved resin adhesion (the first surface) comes into contact with the other surface (the second surface), blocking is likely to occur. Therefore, when the two surfaces come into contact with each other, for example, when the surface is wound into a roll or stored in a stacked state, it is necessary to control the surface free energy of the contact surface.

[0046] This control of surface free energy involves, first, setting a low polar component of the surface free energy, which can improve surface adhesion, and, second, increasing the difference in surface free energy between the two contacting surfaces (the upper and lower surfaces of the film, i.e., the first surface and the second surface) in order to reduce the affinity between the two surfaces.

[0047] The film for forming a resin layer has a polar component γp2 of the surface free energy of the second surface of 20 mJ / m２ The polar component γp2 of the surface free energy of the second surface is preferably smaller, and more preferably 15 mJ / m or less. ２ Less than or equal to 10 mJ / m ２ On the other hand, the polar component γp2 of the surface free energy of the second surface is preferably 0.5 mJ / m or less from the viewpoint of manufacturing costs. ２ More preferably, 1.0 mJ / m ２ The polar component γp2 of the surface free energy of the second surface can be a combination of these upper and lower limits, and can be, for example, 0.5 mJ / m ２ Above, 20mJ / m ２ The polar component γp2 of the surface free energy of the second surface can be controlled by a conductive layer, which will be described later.

[0048] The difference between the surface free energy of the first surface and the surface free energy of the second surface is calculated by dividing the surface free energy into a dispersion component γd and a polar component γp, and using the Pythagorean theorem to obtain the following formula (1). It is preferable that the film for forming a resin layer satisfies the following formula (1): √((γd1 - γd2) ２ + (γp1-γp2) ２ ) ≧ 10 (1) (γd1: dispersive component of surface free energy of the first surface of the film, γd2: dispersive component of surface free energy of the second surface of the film, γp1: polar component of surface free energy of the first surface of the film, γp2: polar component of surface free energy of the second surface of the film) Since the formula (1) is satisfied, blocking can be suppressed. ２ + (γp1-γp2) ２ ) )] is preferably larger, is preferably 14 or more, and is more preferably 17 or more. ２ + (γp1-γp2) ２ ) )] is preferably 50 or less, more preferably 40 or less, from the viewpoint of production costs. ２+ (γp1-γp2) ２ ) )] may be a combination of these upper and lower limits, for example, 10 or more and 50 or less.

[0049] The dispersion component γd1, the dispersibility component γd2, the polar component γp1, and the polar component γp2 refer to values ​​obtained by the method described in the examples.

[0050] <Surface Resistivity> The film for forming a resin layer has a surface resistance of 10 １２ That is, the surface resistance of the first surface, the second surface, or both surfaces is preferably 10 １２ The surface resistance is preferably 10 Ω / sq or less. １１ Ω / sq or less, more preferably 10 １０ From the viewpoint of manufacturing costs, the surface resistance is preferably 10 ５ Ω / sq or more, more preferably 10 ６ The surface resistance value can be a combination of the upper and lower limits. ５ Ω / sq or more, 10 １２ Ω / sq or less. The surface resistance value can be controlled, for example, by adding a conductive agent to the resin layer-forming film. Specifically, the conductive agent may be added to the substrate film, or, when the resin layer-forming film has a conductive layer described later, the conductive agent may be added to the conductive layer. The surface resistance value refers to a value obtained by the method described in the examples.

[0051] <Dynamic Friction Coefficient> The film for resin layer formation preferably has a dynamic friction coefficient of 0.9 or less, measured by closely contacting the first surface and the second surface. This provides the film for resin layer formation with excellent transportability. The smaller the dynamic friction coefficient, the better, and it is preferably 0.8 or less, more preferably 0.7 or less. From the viewpoint of production costs, the dynamic friction coefficient is preferably 0.1 or more, more preferably 0.3 or more. The dynamic friction coefficient can be a combination of these upper and lower limits, for example, 0.1 or more and 0.9 or less. The dynamic friction coefficient can be controlled by the surface roughness of the first surface and the second surface. The dynamic friction coefficient can also be controlled by adding a lubricant to the film for resin layer formation. The lubricant may be added to the substrate film, or, if the film for resin layer formation has a conductive layer described below, it may be added to the conductive layer. The dynamic friction coefficient refers to a value obtained by the method described in the examples.

[0052] <Glass Transition Temperature> The resin layer forming film has a glass transition temperature of 200°C or higher. Preferably, it is 250°C or higher, more preferably 300°C or higher. The higher the glass transition temperature of the resin layer forming film, the better, for example, 700°C or lower, 600°C or lower, etc. Note that a glass transition temperature of 200°C or higher of the resin layer forming film means that the glass transition temperature of the entire resin layer forming film is 200°C or higher. For example, when the resin layer forming film is composed of only a substrate film, this means that the glass transition temperature of the substrate film is 200°C or higher. When the resin layer forming film is composed of two layers, a substrate film and a conductive layer, this means that the glass transition temperature of the resin layer forming film in the two-layer structure of the substrate film and the conductive layer is 200°C or higher. The glass transition temperature refers to a value obtained by the method described in the examples.

[0053] <Coefficient of Linear Expansion (CTE)> The resin layer forming film preferably has an average coefficient of linear expansion (CTE) in the MD direction between 30° C. and 300° C. of 5.0 ppm / ° C. or less, more preferably 4.0 ppm / ° C. or less, and even more preferably 3.0 ppm / ° C. or less. The resin layer forming film preferably has an average coefficient of linear expansion (CTE) in the MD direction between 30° C. and 300° C. of -5.0 ppm / ° C. or more, more preferably -4.0 ppm / ° C. or more, and even more preferably -3.0 ppm / ° C. or more.

[0054] The resin layer forming film preferably has an average linear expansion coefficient (CTE) in the TD direction between 30 ° C. and 300 ° C. of 5.0 ppm / ° C. or less, more preferably 4.0 ppm / ° C. or less, and even more preferably 3.0 ppm / ° C. or less. The resin layer forming film preferably has an average linear expansion coefficient (CTE) in the TD direction between 30 ° C. and 300 ° C. of -5.0 ppm / ° C. or more, more preferably -4.0 ppm / ° C. or more, and even more preferably -3.0 ppm / ° C. or more. The linear expansion coefficient (CTE) of the resin layer forming film means the linear expansion coefficient (CTE) of the resin layer forming film as a whole. The linear expansion coefficient (CTE) refers to the value obtained by the method described in the examples.

[0055] When the CTE is within the above range, the difference in the coefficient of linear expansion from that of a general support (inorganic substrate) can be kept small, and peeling between the resin layer-forming film and the inorganic substrate or warping of the entire support can be more suitably prevented even when subjected to a heat application process.

[0056] <Arithmetic mean roughness (Sa)> The resin layer-forming film preferably has an arithmetic mean roughness (Sa) of 0.5 nm or more and 2.5 nm or less on at least one surface. When the arithmetic mean roughness (Sa) of at least one surface is 0.5 nm or more and 2.5 nm or less, the dynamic friction coefficient of the surface can be suitably reduced. The arithmetic mean roughness (Sa) is more preferably 0.6 nm or more, and even more preferably 0.7 nm or more. The arithmetic mean roughness (Sa) is more preferably 2.0 nm or less, and even more preferably 1.5 nm or less. The arithmetic mean roughness (Sa) may be within the above numerical range on both surfaces. The arithmetic mean roughness (Sa) refers to a value obtained by the method described in the implementation.

[0057] <Haze> The haze of the resin layer forming film is preferably 2% or less, more preferably 1.5% or less, and even more preferably 1.0% or less. There is no particular lower limit, but industrially, a haze of 0.1% or more is acceptable, and even 0.5% or more is acceptable. When the haze is 2% or less, the resin layer forming film can be suitably used in places where light transmission is required. Examples of applications requiring light transmission include optical waveguides. The haze of the resin layer forming film refers to the haze of the entire resin layer forming film. The haze refers to a value obtained by the method described in the examples.

[0058] <Base Film> As described above, the film for forming a resin layer according to this embodiment has a base film.

[0059] The substrate film is not particularly limited, and examples thereof include films containing polyimide resins such as polyimide, polyamideimide, polyetherimide, and fluorinated polyimide (e.g., aromatic polyimide resins, alicyclic polyimide resins); copolymer polyesters such as polyethylene, polypropylene, polyethylene terephthalate, polybutylene terephthalate, and polyethylene-2,6-naphthalate (e.g., wholly aromatic polyesters, semi-aromatic polyesters); copolymer (meth)acrylates typified by polymethyl methacrylate; polycarbonate; polyamide; polysulfone; polyethersulfone; polyetherketone; cellulose acetate; cellulose nitrate; aromatic polyamide; polyvinyl chloride; polyphenol; polyarylate; polyphenylene sulfide; polyphenylene oxide; and polystyrene.

[0060] In particular, the base film preferably contains a polyimide resin in an amount of 80% by mass or more of the resin constituting the base film. Alternatively, the base film may be composed solely of a polyimide resin. When the polyimide resin accounts for 80% by mass or more of the resin constituting the base film, the base film has better heat resistance.

[0061] In particular, the base film preferably contains 80% by mass or more of the resin constituting the base film as polyimidebenzoxazole. The base film may also be composed solely of polyimidebenzoxazole. When 80% by mass or more of the resin constituting the base film is polyimidebenzoxazole, the CTE is low, making the film less likely to curl in subsequent processes. Furthermore, because the CTE is low (similar to that of glass), the film is particularly suitable for lamination with a layer having a low CTE, such as glass.

[0062] A polyimide-based resin film (sometimes referred to as a polyimide film), which is an example of the substrate film, will be described in detail below. In general, a polyimide-based resin film is obtained by applying a polyamic acid (polyimide precursor) solution obtained by reacting a diamine with a tetracarboxylic acid in a solvent to a support for preparing a polyimide film, drying the solution to form a green film (hereinafter also referred to as a "polyamic acid film"), and further subjecting the green film to high-temperature heat treatment on the support for preparing a polyimide film or in a state where it has been peeled off from the support to cause a dehydration ring-closing reaction.

[0063] The polyamic acid (polyimide precursor) solution can be applied by any of the conventionally known solution application methods, such as spin coating, doctor blade, applicator, comma coater, screen printing, slit coating, reverse coating, dip coating, curtain coating, and slit die coating.

[0064] The diamines constituting the polyamic acid are not particularly limited, and aromatic diamines, aliphatic diamines, alicyclic diamines, etc., commonly used in polyimide synthesis, can be used. From the viewpoint of heat resistance, aromatic diamines are preferred, and among aromatic diamines, aromatic diamines having a benzoxazole structure are more preferred. The use of aromatic diamines having a benzoxazole structure makes it possible to achieve high heat resistance as well as a high elastic modulus, low thermal shrinkage, and a low coefficient of linear expansion. The diamines may be used alone or in combination of two or more.

[0065] The thickness of the base film is preferably 3 μm or more, more preferably 11 μm or more, even more preferably 24 μm or more, and still more preferably 35 μm or more. The upper limit of the thickness of the base film is not particularly limited, but from the viewpoint of being able to be wound into a roll, it is preferably 250 μm or less, more preferably 150 μm or less, and even more preferably 90 μm or less.

[0066] The substrate film is preferably subjected to a surface activation treatment. By performing the surface activation treatment, the surface free energy can be controlled. In particular, by performing the surface activation treatment on the first surface side, the dispersion component γd1 of the surface free energy of the first surface can be reduced to 15 mJ / m ２ 45mJ / m or more ２ The range is as follows, and the polar component γp1 is 10 mJ / m ２ The surface activation treatment modifies the film surface to a state where functional groups are present (a so-called activated state), improving the affinity with the resin layer. The surface activation treatment can be a dry or wet surface treatment. Examples of the dry treatment include treatments in which the surface is irradiated with active energy rays such as ultraviolet rays, electron beams, and X-rays, corona treatment, vacuum plasma treatment, and atmospheric pressure plasma treatment. Examples of the wet treatment include treatments in which the film surface is contacted with an acid or alkaline solution. Among the surface activation treatments, plasma treatment is preferred. The plasma treatment is not particularly limited, but includes RF plasma treatment in a vacuum, microwave plasma treatment, microwave ECR plasma treatment, atmospheric pressure plasma treatment, and corona treatment, as well as fluorine-containing gas treatment, ion implantation treatment using an ion source, treatment using the PBII method, flame treatment involving exposure to thermal plasma, and itro treatment. Among these, RF plasma treatment in a vacuum, microwave plasma treatment, and atmospheric pressure plasma treatment are preferred. Examples of the plasma treatment include oxygen plasma, CF ４ , C ２ F ６ It is desirable to use plasma that is known to have a high chemical etching effect, such as fluorine-containing plasma, or plasma that has a high physical etching effect by applying physical energy to the polymer surface, such as Ne, Ar, Kr, or Xe plasma. ２ , CO, H ２ , N ２ , N.H. ４ , C.H. ４ It is also preferable to add plasma such as OH, N, etc., and mixed gases thereof, or water vapor. ２ , N, CO, CO ２H, H ２ O ２ ,NH ,NH ２ ,NH ３ 、COOH、NO、NO ２ 、He、Ne、Ar、Kr、Xe、CH ２ O, Si(OCH) ３ )4, Si(OC) ２ H ５ ) ４ C ３ H ７ Si(OCH) ３ ) ３ C ３ H ７ Si(OC) ２ H ５ ) ３It is preferable to create a plasma containing one or more components selected from the group consisting of (a) and (b) as a gas or as a decomposition product in the plasma. For short-term processing, plasma with high energy density, high kinetic energy of ions in the plasma, and high number density of active species are desirable. However, the need for surface smoothness limits the increase in energy density. Furthermore, plasma using Ar gas is affected by purely physical collisions, which also results in significant surface roughness. Considering these factors comprehensively, microwave plasma treatment, microwave ECR plasma treatment, plasma irradiation using an ion source that can easily implant high-energy ions, and the PBII method are also desirable. Such surface activation treatments clean the polymer surface (the surface of the substrate film) and generate more active functional groups. The generated functional groups bond with the resin layer through hydrogen bonding or chemical reaction, enabling strong adhesion between the substrate film and the resin layer. The surface activation treatment may be performed on only one side or both sides of the substrate film. If performed on only one side of the substrate film, it is preferably performed on the first side. When performing plasma treatment on one side, by placing the film on one of the electrodes in a plasma treatment using parallel plate electrodes, plasma treatment can be performed only on the side of the film that is not in contact with the electrode. Plasma treatment can also be performed on both sides by placing the film in an electrically floating state in the space between the two electrodes. Single-sided treatment is also possible by performing plasma treatment with a protective film attached to one side of the film. PET film or olefin film with adhesive can be used as the protective film.

[0067] <Conductive Layer> The resin layer-forming film has a conductive layer having a surface resistance of 10 １２ It is preferable that the substrate film has a conductive layer having a surface resistance of 10 Ω / sq or less on at least one surface thereof. １２ When the conductive layer has a surface resistance of Ω / sq or less, antistatic properties can be suitably exhibited. １１ Ω / sq or less, more preferably 10 １０Ω / sq or less, particularly preferably 10 ９ The surface resistance of the conductive layer is preferably as small as possible. ５ Ω / sq or more, 10 ６ Ω / sq or more. The conductive layer is preferably present on the second surface side of the film for forming a resin layer. The conductive layer may also be present on the first surface side of the film for forming a resin layer. The conductive layer may also be present on both the second surface side and the first surface side of the film for forming a resin layer.

[0068] The material constituting the conductive layer is a material having a surface resistance of 10 １１ There are no particular limitations on the conductive filler as long as it can achieve a surface resistivity of Ω / sq or less, and conductive fillers such as thiophene-based conductive polymers, carbon nanotube-based conductive materials, and metal powders can be used. Among these, when the conductive layer is disposed on the second surface side of the resin layer-forming film, the polar component γp2 of the surface free energy of the second surface can be easily reduced to 20 mJ / m ２ Thiophene-based conductive polymers and carbon nanotube-based conductive materials are preferred from the viewpoint of being able to achieve the following.

[0069] (Particles in Conductive Layer) The conductive layer preferably contains a lubricant (particles) to impart slipperiness to the surface. The particles may be inorganic or organic, and are not particularly limited. Examples of suitable particles include: (1) inorganic particles such as silica, kaolinite, talc, light calcium carbonate, heavy calcium carbonate, zeolite, alumina, barium sulfate, carbon black, zinc oxide, zinc sulfate, zinc carbonate, zirconium oxide, titanium dioxide, satin white, aluminum silicate, diatomaceous earth, calcium silicate, aluminum hydroxide, hydrated halloysite, calcium carbonate, magnesium carbonate, calcium phosphate, magnesium hydroxide, and barium sulfate; and (2) organic particles such as acrylic or methacrylic, vinyl chloride, vinyl acetate, nylon, styrene / acrylic, styrene / butadiene, polystyrene / acrylic, polystyrene / isoprene, polystyrene / isoprene, methyl methacrylate / butyl methacrylate, melamine, polycarbonate, urea, epoxy, urethane, phenol, diallyl phthalate, and polyester. Nanosilica particles are particularly preferred in order to provide the conductive layer with adequate slip properties.

[0070] The average particle size of the particles is preferably 10 nm or more, more preferably 20 nm or more, and even more preferably 30 nm or more. When the average particle size of the particles is 10 nm or more, the particles are less likely to aggregate and lubricity can be ensured, which is preferable.

[0071] The average particle size of the particles is preferably 1000 nm or less, more preferably 800 nm or less, and even more preferably 600 nm or less. When the average particle size of the particles is 1000 nm or less, transparency is maintained and the particles do not fall off, which is preferable.

[0072] The average particle size of the particles is measured by observing the cross section of the conductive layer with a transmission electron microscope or a scanning electron microscope, observing 100 non-aggregated particles, and taking the average value as the average particle size.

[0073] The shape of the particles is not particularly limited as long as it satisfies the objectives of the present invention, and spherical particles or irregular, non-spherical particles can be used. The particle diameter of irregular particles can be calculated as the equivalent circle diameter. The equivalent circle diameter is calculated by dividing the observed particle area by π, calculating the square root, and then multiplying it by two.

[0074] The ratio of the particles to the total solid content of the conductive layer is preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 30% by mass or less. When the ratio of the particles to the total solid content of the conductive layer is 50% by mass or less, transparency is maintained and significant particle detachment from the conductive layer does not occur, which is preferable.

[0075] The ratio of the particles to the total solid content of the conductive layer is preferably 1% by mass or more, more preferably 1.5% by mass or more, and even more preferably 2% by mass or more. When the ratio of the particles to the total solid content of the conductive layer is 1% by mass or more, slipperiness can be ensured, which is preferable.

[0076] <Method for manufacturing a film for resin layer formation> Hereinafter, a method for manufacturing a film for resin layer formation according to this embodiment will be described. The method for manufacturing a film for resin layer formation according to this embodiment includes a step A of preparing a base film, and a step B of applying a conductive material solution to a first surface of the base film, a second surface opposite to the first surface, or both surfaces of the base film, and drying the solution to form a conductive layer.

[0077] In the method for producing a resin layer-forming film according to the present embodiment, first, a base film is prepared (step A). ​​The base film is prepared in a roll shape. The base film has already been described, so its description will be omitted here.

[0078] Next, a conductive material solution is applied to the first surface of the base film, the second surface opposite to the first surface, or both surfaces, and dried to form a conductive layer (step B).

[0079] The conductive material solution is a solution containing a solvent and a material (such as a resin) for forming a conductive layer. Examples of the solvent include organic solvents such as ethanol and toluene, water, and mixtures of water and a water-soluble organic solvent. From the viewpoint of environmental concerns, water-based solvents, such as water alone or a mixture of water and a water-soluble organic solvent, are preferred.

[0080] The conductive material solution may further contain a lubricant (particles). If the conductive material solution contains a lubricant, the coefficient of dynamic friction of the surface of the conductive layer can be suitably reduced. The lubricant has already been described, so a detailed description thereof will be omitted here.

[0081] The coating method may be any known method, such as reverse roll coating, gravure coating, kiss coating, die coater, roll brush, spray coating, air knife coating, wire bar coating, pipe doctor coating, impregnation coating, or curtain coating.

[0082] The solid content of the conductive material solution varies depending on the type of material (resin, lubricant) and the type of solvent, but is preferably 0.5% by mass or more, more preferably 1.0% by mass or more, and is preferably 8% by mass or less, more preferably 5% by mass or less.

[0083] The drying temperature after application also depends on the type of material (resin, lubricant), the type of solvent, the solids concentration, etc., but is preferably 100°C or higher and 400°C or lower, and more preferably 120°C or higher and 300°C or lower.

[0084] In this step B, a roll of substrate film is unwound, the conductive material solution is applied, the coating is then dried, and the film is rewound into a roll.

[0085] If necessary, a surface activation treatment is performed on at least one surface of the base film (step C). When the surface activation treatment is performed, the surface activation treatment may be performed on only one surface of the base film or on both surfaces. When the surface activation treatment is performed on only one surface of the base film, it is preferable to perform the treatment on the first surface side. Details of the surface activation treatment have already been described, so a detailed description thereof will be omitted here.

[0086] When performing this step C, a roll-shaped film (a laminated film of a base film and a conductive layer when a conductive layer is present) is unwound, subjected to plasma treatment in a roll-to-roll manner, and then rewound into a roll. In this way, a film for forming a resin layer according to the present embodiment can be obtained.

[0087] The method for producing a film for forming a resin layer according to this embodiment has been described above.

[0088] The present invention will be described in detail below using examples, but the present invention is not limited to the following examples as long as it does not depart from the gist of the invention.

[0089] <Substrate Film> A roll (width 380 mm, length 100 m) of product name: Xenomax (Xenomax Japan Co., Ltd., thickness 38 μm, commercially available product, model number: F38-100P0) was used as polyimide film X1. In addition, polyimide film X2, which differs from polyimide film X1 in the arithmetic mean roughness Sa of one side, was produced as in the following production example. The film thicknesses and arithmetic mean roughnesses (Sa) of polyimide film X1 and polyimide film X2 are shown in Table 1. Hereinafter, for convenience, the side with the smaller Sa will be referred to as side A, and the side with the larger Sa will be referred to as side B. In both polyimide film X1 and polyimide film X2, 80 mass % or more of the resin constituting the film is polyimidebenzoxazole.

[0090]

[0091] <Production of Polyimide Film X2> [Polyimide Acid Solution] After replacing the atmosphere in a reaction vessel equipped with a nitrogen inlet tube, a thermometer, and a stirrer with nitrogen, 223 parts by mass of 5-amino-2-(p-aminophenyl)benzoxazole and 4,416 parts by mass of N,N-dimethylacetamide were added and completely dissolved, and then 217 parts by mass of pyromellitic dianhydride and Snowtex (DMAC-ST30, manufactured by Nissan Chemical Industries, Ltd.) prepared by dispersing colloidal silica in dimethylacetamide were added, followed by stirring at a reaction temperature of 25°C for 24 hours to obtain a brown, viscous polyimide acid solution. Polyimide acid solution A1 was obtained by incorporating 0 Snowtex, and polyimide acid solution A2 was obtained by adjusting the amount of Snowtex incorporated so that the arithmetic mean roughness Sa after heat treatment and film formation was 1.1 nm.

[0092] [Polyimide Film X2] Polyamic acid solution A1 and polyamic acid solution A2 were coated onto a stainless steel belt using a three-layer coextrusion T-die. Polyamic acid solution A1 was used on the air side, and polyamic acid solution A2 was used on the stainless steel belt side. The self-supporting polyamic acid film obtained by drying at 110°C for 5 minutes was peeled off from the stainless steel belt and passed through a pin tenter with three heat treatment zones. The film was heat-treated at 150°C for 2 minutes in the first stage, 220°C for 2 minutes in the second stage, and 475°C for 4 minutes in the third stage. After passing through the tenter, the film was passed through six rolls for 20 minutes to allow both sides to be free-formed. Finally, the film was slit into a 380mm width to obtain polyimide film X2.

[0093] Preparation Example 1 (Preparation of Coating Agent A for Conductive Layer) 6.0 kg of ion-exchanged water and 6.0 kg of ethanol were placed in a container, and stirring was started. Then, while continuing stirring, a lubricant (trade name: IPA-ST-ZL (Nissan Chemical Co., Ltd., SiO ２2.1 g of a mixture of Denatron P-400MP-B (Nagase ChemteX Corporation) and Denatron P-400MP-A (Nagase ChemteX Corporation) was added. While stirring was continued, 0.6 kg of Denatron P-400MP-B (Nagase ChemteX Corporation) and 2.4 kg of Denatron P-400MP-A (Nagase ChemteX Corporation) were added in that order (solids content of the mixture of Denatron P-400MP-A and Denatron P-400MP-B: 7 wt%). The mixture was stirred for 10 minutes and recovered, and designated Coating Agent A. Hereinafter, the mixture of Denatron P-400MP-A and Denatron P-400MP-B is also referred to as Denatron P. Denatron P is a thiophene-based conductive polymer.

[0094] Preparation Example 2 (Preparation of Coating Agent B for Conductive Layer) Coating agent B was obtained in the same manner as in Preparation Example 1, except that no lubricant was added.

[0095] Preparation Example 3 (Preparation of Coating Agent C for Conductive Layer) 6.0 kg of ion-exchanged water and 6.0 kg of ethanol were placed in a container, and stirring was started. Then, while continuing stirring, a lubricant (trade name: IPA-ST-ZL (Nissan Chemical Co., Ltd., SiO ２ To the mixture, 1.2 g of a powder containing Denatron C-169PF-B (Nagase ChemteX Corporation) was added (30%, particle size: 70-100 nm). Furthermore, while continuing to stir, 1.2 kg of Denatron C-169PF-B (Nagase ChemteX Corporation) and 1.8 kg of Denatron C-169PF-A (Nagase ChemteX Corporation) were added in that order (solids content of the mixture of Denatron C-169PF-A and Denatron C-169PF-B: 4 wt%). The mixture was stirred for 10 minutes and recovered, and designated Coating Agent C. Hereinafter, the mixture of Denatron C-169PF-A and Denatron C-169PF-B will also be referred to as Denatron C. Denatron C is a carbon nanotube-based conductive paint.

[0096] Preparation Example 4 (Preparation of Coating Agent D for Conductive Layer) 7.5 kg of IPA (isopropyl alcohol) was placed in a container and stirring was started. Then, while continuing stirring, 7.5 kg of IPA (isopropyl alcohol) was added to a container with a trade name of IPA-ST-ZL (Nissan Chemical Co., Ltd., SiO ２1.5 g of a soluble polymer (30% active ingredient, particle size: 70-100 nm) was added. Furthermore, while continuing to stir, 7.5 kg of Colcoat N-103X (Colcoat Co., Ltd., active ingredient: 2.0 wt%) was added. After stirring for 10 minutes, the recovered material was designated as Coating Agent D.

[0097] Preparation Example 5 (Preparation of Coating Agent E for Conductive Layer) 7.5 kg of IPA (isopropyl alcohol) was placed in a container and stirring was started. Then, while continuing stirring, 7.5 kg of IPA (isopropyl alcohol) was added to a container with a trade name of IPA-ST-ZL (Nissan Chemical Co., Ltd., SiO ２ 2.1 g of a soluble polymer (soluble polymer: 30%, particle size: 70-100 nm) was added. Furthermore, while stirring was continued, 7.5 kg of Colcoat PC-309 (Colcoat Co., Ltd., active ingredient: 2.8 wt%) was added. After stirring for 10 minutes, the recovered material was designated as Coating Agent E.

[0098]

[0099] (Example 1) A roll of polyimide film X1 was unwound, and using a gravure coater, coating agent A was applied to the entire surface of side B while being conveyed so that the wet film thickness was 5 μm. Thereafter, the film was passed through a drying oven stabilized at 130°C for 2 minutes to dry the coating film, and then rewound into a roll. The above roll sample (a roll sample having polyimide film X1 as a base film and a conductive layer formed from coating agent A laminated thereon) was conveyed while being unwound, and plasma treatment was performed on side A by roll-to-roll. The plasma treatment was performed according to the <Plasma Treatment Conditions> below. This was then rewound to obtain roll sample 1. <Plasma Treatment Conditions> Vacuum plasma treatment was performed using a roll-to-roll device, and the inside of a vacuum chamber was heated to 1×10 －３ The chamber was evacuated to a vacuum of 10 Pa or less, and argon gas was introduced into the vacuum chamber until the internal pressure reached 20 Pa. The sample surface was subjected to argon gas plasma treatment while conveying the roll under conditions of a discharge power of 100 W and a frequency of 15 kHz for a treatment time of 20 seconds.

[0100] Example 2 A roll-shaped sample 2 was obtained in the same manner as in Example 1, except that coating agent C was used instead of coating agent A.

[0101] Example 3 A roll-shaped sample 3 was obtained in the same manner as in Example 1, except that the polyimide film X2 was used instead of the polyimide film X1 and the coating agent B was used instead of the coating agent A.

[0102] Comparative Example 1 The polyimide film X1 was used as a roll-shaped sample 4.

[0103] Comparative Example 2 A roll of polyimide film X1 was transported while being unwound, and both surfaces of the film were subjected to plasma treatment in a roll-to-roll manner. The plasma treatment conditions for both surfaces were the same as those in Example 1. The film was then rewound to obtain roll sample 5.

[0104] Comparative Example 3 The polyimide film X2 was used as a roll-shaped sample 6.

[0105] Comparative Example 4 The roll-shaped polyimide film X2 was transported while being unwound, and plasma treatment was performed on the A-side in a roll-to-roll manner under the same plasma treatment conditions as in Example 1. The film was then rewound to obtain roll-shaped sample 7.

[0106] (Comparative Example 5) Roll-shaped polyimide film X2 was unwound, and using a gravure coater, coating agent A was applied to the entire A-side surface while conveying it so that the wet film thickness was 5 μm. Thereafter, the film was passed through a drying oven stabilized at 130° C. for 2 minutes to dry the coating film, and the film was rewound to obtain roll-shaped sample 8.

[0107] Comparative Example 6 Roll-shaped sample 9 was obtained in the same manner as in Example 1, except that coating agent D was used instead of coating agent A.

[0108] Comparative Example 7 A roll-shaped sample 10 was obtained in the same manner as in Example 1, except that Coating Agent E was used instead of Coating Agent A.

[0109] Comparative Example 8 A roll-shaped sample 11 was obtained in the same manner as in Example 1, except that the polyimide film X2 was used instead of the polyimide film X1 and the coating agent D was used instead of the coating agent A.

[0110] <Preparation of Evaluation Sample> A part of the roll sample was cut into a size of 300 mm x 300 mm to be used as an evaluation sample. Unless otherwise specified below, the evaluation sample was used for evaluation and measurement.

[0111] <Surface Free Energy> Droplets of water (droplet volume 1.8 μL) and diiodomethane (droplet volume 0.9 μL) were prepared on the surface of a sample using a contact angle meter (Kyowa Interface Science Co., Ltd.: Fully Automatic Contact Angle Meter DM-701) under conditions of 25°C and 50% RH, and the contact angles were measured. The contact angles measured 10 seconds after each liquid was dropped onto the film were used. The contact angle data for water and diiodomethane obtained by the above method were calculated according to the "Kealbel-Uy" theory, and the dispersion component γd and polar component γp of the surface free energy of the sample (resin layer-forming film) were determined. This was performed on both sides A and B of the sample. Table 3 shows the surface free energy difference [√((γd1 - γd2) ２ + (γp1-γp2) ２ In addition, in all of Example 1, Example 2, Comparative Example 2, Comparative Example 4, Comparative Example 6, and Comparative Example 7, the base film is X1, and the A side is plasma-treated, so the surface free energy values ​​(γd1, γp1) can be said to be almost the same, and the values ​​in Table 3 are within the measurement error range.

[0112] <Surface Resistivity Value> Using a high resistivity meter, Hiresta UP MCP-HT450 (manufactured by Mitsubishi Chemical Corporation), the surface resistance value was determined under the conditions of a measurement voltage of 100 V and a measurement time of 10 seconds. The measurement was performed on both sides A and B, and the average value of measurements taken at three locations on each sample, namely, a location 50 mm from the left end, a location in the center, and a location 50 mm from the right end, was calculated as the surface resistance value.

[0113] <Dynamic Friction Coefficient> In accordance with JIS K-7125 (1999), a tensile tester (Tensilon RTG-1210 manufactured by A&D Co., Ltd.) was used to determine the dynamic friction coefficient when surfaces A and B of the sample were joined together in an environment of 23°C and 65% RH. The weight of the thread (weight) around which the upper sample was wrapped was 200 g, and the size of the base area of ​​the thread was 39.7 mm ２The pulling speed during the friction measurement was 200 mm / min.

[0114] <Glass transition temperature> The sample was subjected to DSC measurement under the following conditions, and the melting point (melting peak temperature Tpm) and glass transition temperature (Tmg) were determined in accordance with JIS K 7121 under the following measurement conditions: Apparatus name: DSC3100S manufactured by MAC Science Co., Ltd. Pan: Aluminum pan (non-airtight type) Sample weight: 4 mg Heat-up starting temperature: 30°C Heat-up rate: 20°C / min Atmosphere: Argon

[0115] <CTE (coefficient of linear thermal expansion)> The expansion / contraction rate of the sample was measured in the machine direction (MD) and width direction (TD) during application under the following conditions. The expansion / contraction rate / temperature was measured at 15°C intervals, such as from 30°C to 45°C and from 45°C to 60°C. This measurement was performed from 30°C to 300°C, and the average value of all measured values ​​was calculated as CTE. Instrument name: TMA4000S manufactured by MAC Sciences Sample length: 20 mm Sample width: 2 mm Heat-up start temperature: 25°C Heat-up end temperature: 300°C Heat-up rate: 5°C / min Atmosphere: Argon

[0116] <Arithmetic mean roughness (Sa)> Measurement was performed by optical interference using a non-contact surface / layer cross-sectional shape measurement system (measuring device: VertScan R3300FL-Lite-AC, analysis software: VertScan4, manufactured by Ryoka Systems Co., Ltd.), and the measurement data was analyzed using the analysis software of the device to determine the arithmetic mean height Sa.

[0117] <HAZE> Haze was measured using a HAZEMETER (NDH5000, manufactured by Nippon Denshoku Co., Ltd.). A D65 lamp was used as the light source. The same measurement was performed three times, and the arithmetic average value was used.

[0118] <Resin Adhesion> A sample was obtained by cutting a piece measuring 100 mm x 100 mm from the rolled sample. An 80 mm x 80 mm resin layer serving as the resin to be adhered was laminated on the A-side of this sample. The resin layer was a resin film obtained by dissolving polyimide (KPI-MX300F) (manufactured by Kawamura Sangyo Co., Ltd.) in a solvent and drying it by heating. The resulting laminate was then thermocompressed for 10 minutes at a pressure of 10 MPa using a heat press machine stable at 400°C. The laminate was removed, cooled to room temperature, and then cut into 10 mm x 100 mm strips. The 90° peel strength between the sample and the resin layer (resin to be adhered) of this strip sample was measured. A measured value of 2 N / cm or greater was deemed acceptable. The conditions for the 90° peel test were as follows: The sample side of the laminate was fixed to the slide table of the measuring instrument with double-sided tape, with the resin layer (resin to be adhered) facing 90 degrees. Measurement was carried out five times, and the average value was taken as the measured value. Measuring device: Peel tester (manufactured by Japan Measurement Systems Co., Ltd., JSV-H1000) Measurement temperature: room temperature (25°C) Peel speed: 100 mm / min Atmosphere: air Sample width: 10 mm

[0119] The dispersion component γd of the surface free energy of the resin layer (a film made of polyimide (KPI-MX300F) manufactured by Kawamura Sangyo Co., Ltd.) was 33.0, and the polar component γp was 5.2.

[0120] <Amount of Peeling Charge> Two samples were designated Film 1 and Film 2. As shown in FIG. 1 , Film 1 was fixed on a table 11 with its upper surface facing Side A. Film 2 was placed on Film 1 so that the lower surface of Film 2, which was in contact with the upper surface of Film 1, was Side B, and they were pressed together using a rubber roller. Using a fixed roll 12, a portion of Film 2 was peeled off so that the peeled portion of Film 2 was perpendicular to the table 11 at the peeling point, and a string 13 was attached. Film 2 was moved in direction A, and Film 1 together with the table 11 were simultaneously moved in direction B at 0.2 m / s, so that Film 2 was peeled off at a 90° angle from Film 1. The amount of charge at the time of peeling was measured using a digital potential meter (Kasuga Electric Co., Ltd., Model KSD-1000) installed at a height of 140 mm from the peeling point and 100 mm away from the measurement point. A sample with a charge of 1.5 kV or less was deemed acceptable.

[0121] <Heat Resistance> A glass transition temperature of 200° C. or higher was evaluated as acceptable.

[0122] <Transportability> A sample having a dynamic friction coefficient of 0.9 or less measured as above was rated as passing.

[0123] <Blocking Resistance> Two samples were obtained by cutting a roll sample into a size of 50 mm x 100 mm. These were stacked so that the opposite sides (side A and side B) were in contact with each other, and a 22 g weight with a base area of ​​50 mm x 50 mm was placed on the lower half (50 mm x 50 mm) of the laminate and pressed. With the weight placed and pressed, the laminate was left standing in an environment of 55 ° C. and 20% RH. After 30 days, the sample was taken out, the weight was removed, and the two samples were peeled from the non-pressed portions. At that time, samples that showed no abnormal appearance (whitening, surface roughness, turbidity, peeling, etc.) on the entire surface were evaluated as passing.

[0124]

Claims

1. A substrate film is provided, and the dispersion component γd1 of the surface free energy of the first surface is 45 mJ / m ２ The range is as follows, and the polar component γp1 is 10 mJ / m ２ or more, and the polar component γp2 of the surface free energy of the second surface opposite to the first surface is 20 mJ / m ２ is less than or equal to, satisfies the following formula (1), √((γd1-γd2) ２ + (γp1-γp2) ２ ) ≧ 10 (1) (γd1: dispersive component of surface free energy of the first surface of the film, γd2: dispersive component of surface free energy of the second surface of the film, γp1: polar component of surface free energy of the first surface of the film, γp2: polar component of surface free energy of the second surface of the film) When the surface resistance of at least one surface is 10 １２ a coefficient of dynamic friction of 0.9 or less when measured by bringing the first surface and the second surface into close contact with each other; and a glass transition temperature of 200°C or more.

2. The film for forming a resin layer according to claim 1, characterized in that 80% by mass or more of the resin constituting the base film is a polyimide resin.

3. The film for forming a resin layer according to claim 1 or 2, characterized in that 80% by mass or more of the resin constituting the base film is polyimidebenzoxazole.

4. A surface resistivity of 10 １２ 3. The film for forming a resin layer according to claim 1, which has a conductive layer having a resistance of Ω / sq or less.

5. The film for forming a resin layer according to claim 4, wherein the conductive layer is a layer containing a thiophene-based conductive polymer.

6. The film for forming a resin layer according to claim 1 or 2, characterized in that at least one surface thereof is subjected to plasma treatment.

7. The film for forming a resin layer according to claim 1 or 2, characterized in that the arithmetic mean roughness (Sa) of at least one surface is 0.5 nm or more and 2.5 nm or less.

8. The film for forming a resin layer according to claim 1 or 2, characterized in that the haze is 2% or less.

9. A method for producing a film for forming a resin layer according to claim 4, comprising: a step A of preparing a base film; and a step B of applying a conductive material solution to a first surface of the base film, a second surface opposite the first surface, or both surfaces of the base film, and drying the solution to form a conductive layer.

10. The method for producing a film for forming a resin layer according to claim 9, characterized in that a lubricant is contained in the conductive material solution.

11. The method for producing a film for forming a resin layer according to claim 9, further comprising a step C of subjecting at least one surface of the substrate film to a surface activation treatment.

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