Electronic component mounting structure, and method for manufacturing electronic component mounting structure

Abstract

An electronic component mounting structure 1 comprises: a housing 10 including an electronic component mounting part 12, which is a place where an electronic component 20 is mounted, and a bus bar fixing part 13a, which is a bottomed hole for fixing a bus bar 30; the electronic component 20, which has an exterior body 21 and a terminal 23 protruding from the exterior body 21, and which is mounted on the electronic component mounting part 12; the bus bar, which includes a first end part 30a and a second end part 30b positioned at both ends thereof in the length direction, said first end part 30a being joined to the terminal 23 of the electronic component 20, and the bus bar having a fixing hole 31 in the vicinity of the second end part 30b; and a fixing member 50 which penetrates through the fixing hole 31 and is inserted into the bus bar fixing part 13a to fix the bus bar 30 to the bus bar fixing part 13. In a state where the first end part 30a of the bus bar 30 and the terminal 23 are not joined to each other and the bus bar 30 is not fixed to the bus bar fixing part 13a by the fixing member 50, the central axis A31 of the fixing hole 31a is located at a position farther from the terminal 23 than the central axis A13 of the bus bar fixing part 13a.

Description

Mounting structure of electronic component and manufacturing method of mounting structure of electronic component

[0001] The present invention relates to an electronic component mounting structure and a method for manufacturing the electronic component mounting structure.

[0002] In power electronics devices such as inverters and DC-DC converters, bus bars made of copper or aluminum are used as conductors to carry large currents. These bus bars are connected to electronic and electrical components such as capacitors and power semiconductors, and welding is often used to join them. Welding must be performed with the terminals of the electronic components and the bus bar in close contact with each other. If there is a gap between the terminals of the electronic components and the bus bar, the strength of the joint weakens and the resistance increases. Furthermore, if there is a gap between the terminals of the electronic components and the bus bar, the strength and resistance vary depending on the distance of the gap, making it impossible to achieve a stable joint.

[0003] Patent Document 1 describes a technology for laser welding a battery terminal and a metal plate. Patent Document 1 discloses that when welding the terminal and the metal plate, pressure is applied to the metal plate to reduce the gap between the terminal and the metal plate, and that a good joint can be obtained by welding in a state where the gap between the terminal and the metal plate is eliminated by applying pressure.

[0004] JP 2016-97436 A

[0005] The technology described in Patent Document 1 requires a device for applying pressure to the metal plate. In addition, the application of pressure requires time and steps. This results in problems such as increased equipment costs and reduced manufacturing efficiency.

[0006] The present invention has been made to solve the above problems, and aims to provide an electronic component mounting structure and a method for manufacturing an electronic component mounting structure, which have a configuration in which terminals of an electronic component and bus bars are connected without requiring a separate pressure application device or pressure application process.

[0007] The electronic component mounting structure of the present invention includes: a housing including an electronic component mounting portion where an electronic component is mounted and a busbar fixing portion which is a bottomed hole for fixing a busbar; an exterior body; and terminals protruding from the exterior body. The electronic component is mounted on the electronic component mounting portion; a busbar having a first end and a second end located at opposite ends in the longitudinal direction of the electronic component, the first end being joined to the terminal of the electronic component and having a fixing hole near the second end; and a fixing member that passes through the fixing hole and is inserted into the busbar fixing portion to fix the busbar to the busbar fixing portion. When the first end of the busbar is not joined to the terminal and the busbar is not fixed to the busbar fixing portion by the fixing member, the central axis of the fixing hole is located farther from the terminal than the central axis of the busbar fixing portion.

[0008] A method for manufacturing an electronic component mounting structure of the present invention includes the steps of: preparing a housing including an electronic component mounting portion where an electronic component is mounted and a busbar fixing portion that is a bottomed hole for fixing a busbar; an exterior body; an electronic component having terminals protruding from the exterior body; and a busbar having first and second ends located at both ends in the longitudinal direction of the electronic component, the busbar having a fixing hole near the second end; mounting the electronic component on the electronic component mounting portion of the housing; bringing the fixing hole of the busbar close to the busbar fixing portion and bringing the first end of the busbar close to the terminal, so that a central axis of the fixing hole is farther from the terminal than a central axis of the busbar fixing portion; passing a fixing member through the fixing hole and inserting it into the busbar fixing portion to fix the busbar to the busbar fixing portion and bring the first end of the busbar into pressure contact with the terminal; and joining the first end of the busbar to the terminal.

[0009] According to the present invention, it is possible to provide an electronic component mounting structure and a method for manufacturing an electronic component mounting structure, which have a configuration in which terminals of an electronic component and bus bars are connected without requiring a separate pressure application device or pressure application process.

[0010] Fig. 1 is a diagram schematically showing an example of an arrangement step constituting the manufacturing method of an electronic component mounting structure of the present invention. Fig. 2 is a diagram schematically showing an example of a pressure contact step constituting the manufacturing method of an electronic component mounting structure of the present invention. Fig. 3 is a diagram schematically showing an example of a bonding step constituting the manufacturing method of an electronic component mounting structure of the present invention. Fig. 4 is a diagram schematically showing another example of a pressure contact step constituting the manufacturing method of an electronic component mounting structure of the present invention.

[0011] The wiring board of the present invention will be described below. Note that the present invention is not limited to the following configurations and may be modified as appropriate within the scope of the present invention. In addition, a combination of multiple individual preferred configurations described below also constitutes the present invention.

[0012] The drawings shown below are schematic diagrams, and the dimensions, aspect ratio, and other scales may differ from those of the actual product. In the drawings, the same or equivalent parts will be designated by the same reference numerals. In addition, the same elements will be designated by the same reference numerals in each drawing, and duplicate explanations will be omitted.

[0013] In this specification, terms indicating the relationship between elements (e.g., "opposite," "orthogonal," etc.) and terms indicating the shape of elements not only mean the literal strict form, but also mean a range that is substantially equivalent, for example, a range that includes a difference of about a few percent.

[0014] The following embodiments are merely examples, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. In the description of each embodiment, descriptions of matters common to the previously described embodiments will be omitted, and only differences will be described. In particular, similar effects resulting from similar configurations will not be mentioned in each embodiment.

[0015] FIG. 1 is a diagram showing a schematic diagram of an example of an arrangement step constituting a manufacturing method of an electronic component mounting structure according to the present invention.

[0016] The process shown in FIG. 1 is a process of joining bus bars 30 and 40 to terminals 23 and 24 of an electronic component 20 mounted on a housing 10 using fixing members 50 and 51 .

[0017] The housing 10 includes a housing body 11, an electronic component mounting portion 12 on which an electronic component 20 is mounted, and busbar fixing portions 13a and 14a which are bottomed holes for fixing the busbars 30 and 40.

[0018] The housing body 11 functions as a cooler for the electronic components 20 .

[0019] The material constituting the housing body 11 is preferably a metal such as an elemental metal such as aluminum, magnesium, iron, stainless steel, or copper, or an alloy containing at least one of these elemental metals.

[0020] The electronic component mounting portion 12 may be a cavity (recess) provided in the housing main body 11 for mounting the electronic component 20, or may be a predetermined area provided on the surface of the housing main body 11.

[0021] The busbar fixing portions 13a and 14a may be formed as screw holes provided in the fixing bases 13 and 14, respectively, that protrude from the surface of the housing body 11. However, the busbar fixing portions may also be formed directly on the housing body 11. For example, bottomed holes provided on the surface of the housing body 11 may be used as the busbar fixing portions.

[0022] The diameter of the bus bar fixing portion, which is a bottomed hole, is preferably 2.0 mm or more and 7.0 mm or less.

[0023] The material constituting the fixing bases 13 and 14 may be the same as or different from the material of the housing body 11. Examples of materials constituting the fixing bases 13 and 14 include resins such as polycarbonate, polyphenylene ether, polybutylene terephthalate, phenolic resin, and unsaturated polyester.

[0024] The electronic component 20 is mounted on the electronic component mounting portion 12 of the housing 10 .

[0025] Examples of the electronic component 20 include a film capacitor, a power semiconductor, and an inductor.

[0026] An electronic component 20 shown in FIG. 1 has an outer casing 21 and terminals 23 and 24 protruding from the outer casing 21.

[0027] The exterior body 21 constitutes most of the outer shape of the electronic component 20, and its shape is not particularly limited.

[0028] The shape of the terminal is not particularly limited, but examples include a cylindrical shape and a plate shape. Among these, a plate shape is preferred. When the terminal has a plate shape, a bus bar (described later) can be closely attached to the main surface of the plate, improving contact between the terminal and the bus bar.

[0029] When the terminal is plate-shaped, it is preferable that the thickness thereof is 0.2 mm or more and 5 mm or less.When the terminal is cylindrical, it is preferable that the diameter thereof is 0.2 mm or more and 5 mm or less.

[0030] The material for forming the terminals is preferably a metal such as copper or aluminum, or an alloy thereof.

[0031] The terminals may be modified as needed.

[0032] When the electronic component 20 has two terminals, for example, one terminal can be used as a terminal for connecting an anode (anode terminal) and the other terminal can be used as a terminal for connecting a cathode (cathode terminal).

[0033] The periphery of the electronic component 20 may be covered with adhesive 70, and the electronic component 20 may be fixed to the housing 10 by the adhesive 70. The method of fixing the electronic component 20 to the housing 10 is not limited to adhesive 70, and any method that can fix the electronic component 20 to the surface of the housing 10 may be used. For example, adhesive tape may be used, or a part of the exterior body 21 may be fixed to the housing 10 by a fixing means such as a screw.

[0034] The bus bars 30 and 40 are each a substantially plate-shaped body, and insulating paper 60 is disposed between the bus bars 30 and 40. The insulating paper 60 insulates the bus bars 30 and 40 from each other.

[0035] FIG. 1 shows a method for fixing two bus bars (bus bar 30 and bus bar 40) to a housing 10 on which an electronic component 20 having two terminals (terminal 23 and terminal 24) is mounted, but in the mounting structure of an electronic component of the present invention, the number of terminals and bus bars may be one or more.

[0036] The thickness of the bus bar is not particularly limited, but is preferably 0.2 mm or more and 5 mm or less.

[0037] The bus bar 30 has a first end 30a and a second end 30b located at both ends in the longitudinal direction. The first end 30a is the portion that is joined to the terminal 23 of the electronic component 20, and the second end 30b is the end opposite to the first end 30a. A fixing hole 31 is provided near the second end 30b. The diameter of the fixing hole 31 is not particularly limited, but is preferably adjusted appropriately depending on the diameter of the fixing member 50.

[0038] The bus bar 40 has a first end 40a and a second end 40b located at opposite ends in the longitudinal direction. The first end 40a is the portion that is joined to the terminal 24 of the electronic component 20, and the second end 40b is the end opposite to the first end 40a. A fixing hole 41 is provided near the second end 40b. The diameter of the fixing hole 41 is not particularly limited, but is preferably adjusted appropriately depending on the diameter of the fixing member 51.

[0039] A busbar is fixed to a busbar fixing portion and bonded to a terminal of an electronic component. Therefore, the portion of the busbar necessary for fulfilling its function is from the portion bonded to the terminal to the portion fixed to the busbar fixing portion. Therefore, in this specification, only the portion necessary for fulfilling the function of the busbar is identified, the direction in which this portion extends is referred to as the length direction, and both ends of this portion are referred to as the first end and the second end. Therefore, even if the busbar has portions other than the portion necessary for fulfilling its function, these portions are not considered when identifying the first end and the second end. For example, in the busbar 30 shown in FIG. 1 , the portion bonded to the terminal 23 is the first end 30a, and the portion near the fixing hole 31 where the busbar is fixed to the busbar fixing portion 13a is the second end 30b.

[0040] The busbar is preferably made of an elastically deformable material, which makes it easier for the busbar to deform and be pressed against the terminal when a fixing member (described later) is inserted into the busbar fixing portion.

[0041] 1 corresponds to a state in which the first end 30a of the busbar 30 is not joined to the terminal 23 and the busbar is not fixed to the busbar fixing portion by a fixing member, as shown in FIG. 1 , when the first end 30a of the busbar 30 is not joined to the terminal 23 and the busbar is not fixed to the busbar fixing portion by a fixing member, the central axis A of the fixing hole 31 of the busbar 30 is ３１ is the central axis A of the bus bar fixing portion 13a. １３ In other words, the central axis A of the terminal 23 and the fixing hole 31 is farther from the terminal 23 than the central axis A of the terminal 23. ３１ The distance between the two (in FIG. 1, the double-headed arrow L １ The length indicated by the arrow ) is the length between the terminal 23 and the central axis A of the bus bar fixing portion 13a. １３ The distance between the two (in FIG. 1, the double-headed arrow L ２ It is longer than the length indicated by .

[0042] Similarly to the bus bar 30, the central axis A of the fixing hole 41 of the bus bar 40 ４１ is the central axis A of the bus bar fixing portion 14a. １４ In other words, the central axis A of the terminal 24 and the fixing hole 41 is farther from the terminal 24 than the central axis A of the terminal 24. ４１ The distance between the two (in FIG. 1, the double-headed arrow L ３ The length indicated by the arrow ≈ ... １４ The distance between the two (in FIG. 1, the double-headed arrow L ４ It is longer than the length indicated by .

[0043] Central axis A of fixing hole 31 ３１ and the central axis A of the bus bar fixing portion 13a １３ It is preferable that the distance between the terminal 23 and the central axis A of the fixing hole 31 is 0.2 mm or more and 1.0 mm or less. ３１ The distance L between １ and the central axis A of the terminal 23 and the bus bar fixing portion 13a. １３ The distance L between ２ The difference (L １ -L ２ ) is preferably 0.2 mm or more and 1.0 mm or less. The difference is preferably 10% or more and 55% or less of the diameter of the bus bar fixing portion 13a.

[0044] Central axis A of the fixing hole 41 ４１ and the central axis A of the bus bar fixing portion 14a １４ It is preferable that the distance between the terminal 24 and the central axis A of the fixing hole 41 is 0.2 mm or more and 1.0 mm or less. ４１ The distance L between ３ and the central axis A of the terminal 24 and the bus bar fixing portion 14a. １４ The distance L between ４ The difference (L ３ -L ４ ) is preferably 0.2 mm or more and 1.0 mm or less. The difference is preferably 10% or more and 55% or less of the diameter of the bus bar fixing portion 14a.

[0045] 2 is a diagram schematically illustrating an example of a pressure contact step that constitutes a part of the manufacturing method of the electronic component mounting structure of the present invention. In the step shown in Fig. 2, fixing members 50, 51 are inserted through fixing holes 31, 41 and into busbar fixing portions 13a, 14a to fix the busbars to busbar fixing portions 13a, 14a, and first ends 30a, 40a of the busbars are brought into pressure contact with terminals 23, 24.

[0046] When the fixing member 50 is inserted into the fixing hole 31 of the bus bar 30 and the bus bar 30 is fixed to the bus bar fixing portion 13 a, the length (L １ -L ２ 3), the fixing member 50 moves toward the terminal 23 by a distance corresponding to the length of the terminal 23, and is pressed against the terminal 23. Therefore, the contact between the first end 30a of the bus bar 30 and the terminal 23 is improved.

[0047] Furthermore, when the fixing member 51 is inserted into the fixing hole 41 of the bus bar 40 and the bus bar 40 is fixed to the bus bar fixing portion 14 a, the length (L ３ -L ４ 10), the fixing member 51 moves toward the terminal 24 by a distance corresponding to the length of the terminal 24, and is pressed against the terminal 24. Therefore, the contact between the first end 40a of the bus bar 40 and the terminal 24 is improved.

[0048] The fixing member is not particularly limited as long as it can pass through the fixing hole of the bus bar and fix the bus bar to the bus bar fixing portion, and examples thereof include grommets, screws, etc. Of these, screws are preferred.

[0049] 3 is a diagram schematically illustrating an example of a joining step constituting a manufacturing method of an electronic component mounting structure according to the present invention. In the electronic component mounting structure 1 shown in FIG. 3, the first end 30a of the bus bar 30 and the terminal 23 of the electronic component 20 are joined by welding to form a welded portion 80. Also, the first end 40a of the bus bar 40 and the terminal 24 of the electronic component 20 are joined by welding to form a welded portion 81.

[0050] The pressurized contact process shown in Figure 2 improves the contact between the first end 30a of the busbar 30 and the terminal 23, and the contact between the first end 40a of the busbar 40 and the terminal 24, and then the first end 30a of the busbar 30 is joined to the terminal 23, and the first end 40a of the busbar 40 is joined to the terminal 24, respectively, thereby reliably joining the busbar 30 to the terminal 23, and the busbar 40 to the terminal 24, and obtaining an electronic component mounting structure 1.

[0051] Here, the force pressing first end 30a of busbar 30 against terminal 23 and the force pressing first end 40a of busbar 40 against terminal 24 are generated by inserting fixing members 50, 51 into busbar fixing portions 13a, 14a, so there is no need to perform a separate operation to improve contact between the busbar and the terminal in the joining process. Therefore, by using the manufacturing method for an electronic component mounting structure of the present invention, a configuration in which the terminal of an electronic component and the busbar are connected can be obtained without requiring a separate pressure application device or pressure application process.

[0052] An electronic component mounting structure manufactured by the manufacturing method of the electronic component mounting structure of the present invention is the electronic component mounting structure of the present invention. That is, the electronic component mounting structure of the present invention includes: a housing including an electronic component mounting portion where an electronic component is mounted and a busbar fixing portion which is a bottomed hole for fixing a busbar; an exterior housing; and an electronic component having terminals protruding from the exterior housing, the electronic component mounted on the electronic component mounting portion; a busbar having first and second ends located at opposite ends in a longitudinal direction of the electronic component, the first end being joined to the terminal of the electronic component and having a fixing hole near the second end; and a fixing member that passes through the fixing hole and is inserted into the busbar fixing portion to fix the busbar to the busbar fixing portion, wherein when the first end of the busbar is not joined to the terminal and the busbar is not fixed to the busbar fixing portion by the fixing member, a central axis of the fixing hole is located farther from the terminal than a central axis of the busbar fixing portion.

[0053] The electronic component mounting structure obtained through the joining process shown in Fig. 3 is also one example of the electronic component mounting structure of the present invention. In the electronic component mounting structure 1 shown in Fig. 3, the fixing holes 31 of the busbar 30 and the busbar fixing portions 13a are aligned. Furthermore, the fixing holes 41 of the busbar 40 and the busbar fixing portions 14a are aligned. This is because the busbars 30 and 40 are fixed by fixing members 50 and 51. Therefore, when the busbars 30 and 40 are not fixed to the terminals 23 and 24 and are not fixed to the busbar fixing portions 13a and 14a by fixing members 50 and 51, the fixing holes 31 of the busbar 30 and the busbar fixing portions 13a and the fixing holes 41 of the busbar 40 and the busbar fixing portions 14a do not match.

[0054] 3 is subjected to a force by the fixing members 50, 51 pressing the bus bars 30, 40 toward the terminals 23, 24. In other words, when the first ends 30a, 40a of the bus bars 30, 40 are joined to the terminals 23, 24 and the bus bars 30, 40 are fixed to the bus bar fixing portions 13a, 14a by the fixing members 50, 51, the bus bars 30, 40 are elastically deformed and press against the terminals 23, 24. This improves the bondability between the first end 30a of the bus bar 30 and the terminal 23 and between the first end 40a of the bus bar 40 and the terminal 24.

[0055] [Method for manufacturing electronic component mounting structure] A method for manufacturing an electronic component mounting structure of the present invention includes the steps of: preparing a housing including an electronic component mounting portion where an electronic component is mounted and a busbar fixing portion that is a bottomed hole for fixing a busbar; an exterior body; an electronic component having terminals protruding from the exterior body; and a busbar having first and second ends located at both ends in the longitudinal direction of the electronic component, the busbar having a fixing hole near the second end; mounting the electronic component on the electronic component mounting portion of the housing; bringing the fixing hole of the busbar close to the busbar fixing portion and bringing the first end of the busbar close to the terminal, so that a central axis of the fixing hole is farther from the terminal than a central axis of the busbar fixing portion; passing a fixing member through the fixing hole and inserting it into the busbar fixing portion to fix the busbar to the busbar fixing portion and bring the first end of the busbar into pressure contact with the terminal; and joining the first end of the busbar to the terminal.

[0056] (Preparation Step) In the manufacturing method of the electronic component mounting structure of the present invention, a step of preparing a housing including an electronic component mounting portion where an electronic component is mounted and a busbar fixing portion that is a bottomed hole for fixing a busbar, an exterior body, an electronic component having terminals protruding from the exterior body, and a busbar having a first end and a second end located at both ends in the length direction of the electronic component and having a fixing hole near the second end is performed. This step is also simply referred to as the preparation step.

[0057] In the preparation step, a housing, electronic components, and bus bars are prepared.

[0058] The housing can be prepared, for example, by processing a housing body, which is a metal block for cooling electronic components, to form a cavity that will serve as an electronic component mounting portion where the electronic components are mounted. The size of the cavity formed at this time can be determined appropriately taking into account the size of the electronic components to be mounted.

[0059] Next, a resin pillar is provided on the surface of the housing body, and a bottomed hole is formed in the center of the resin pillar, thereby forming a busbar fixing portion, which is a bottomed hole for fixing the busbar.

[0060] An electronic component is prepared that has an exterior body and terminals protruding from the exterior body. If the electronic component to be used does not have terminals formed, terminals may be formed by joining cylindrical or plate-shaped metal to the external electrodes of the electronic component.

[0061] Examples of electronic components include film capacitors, power semiconductors, and inductors.

[0062] The busbar can be prepared by processing a metal plate as needed (forming through holes or grooves, bending, etc.). For example, by forming a U-shaped through groove in the metal plate and bending it, a protruding portion protruding in a direction substantially perpendicular to the metal plate can be formed. This protruding portion becomes, for example, a first end portion to be joined to a terminal of an electronic component. It is preferable that the protruding portion protrudes at an angle of approximately 90 degrees from the direction in which the metal plate extends (longitudinal direction). A fixing hole can be formed by forming a through hole of a predetermined shape in the end portion opposite the first end portion.

[0063] The bus bar may be provided with gaps or through holes, separate from the bus bar fixing portion, for allowing terminals of electronic components to pass therethrough.

[0064] (Mounting Step) In the manufacturing method of the electronic component mounting structure of the present invention, a step of mounting an electronic component on an electronic component mounting portion of a housing is carried out. This step is also referred to as a mounting step.

[0065] In the mounting process, an electronic component is mounted on an electronic component mounting portion of the housing. If the electronic component mounting portion is a cavity provided in the housing body, the electronic component is mounted in the cavity with the terminals protruding from the cavity. At this time, the periphery of the electronic component may be covered with adhesive.

[0066] (Arrangement Step) In the manufacturing method of the electronic component mounting structure of the present invention, a step of arranging the busbar so that the fixing hole of the busbar is close to the busbar fixing portion, the first end of the busbar is close to the terminal, and the central axis of the fixing hole is farther from the terminal than the central axis of the busbar fixing portion is. This step is also referred to as an arrangement step.

[0067] In the placement process, the busbar fixing holes are brought close to the busbar fixing portions, but the busbar fixing portions and the fixing holes are not placed in perfect alignment. Perfect alignment between the busbar fixing portions and the fixing holes means that the central axis of the fixing holes overlaps with the central axis of the busbar fixing portions, which does not satisfy the above condition.

[0068] In the placement process, the fixing holes are placed at positions slightly farther from the busbar fixing portions as viewed from the terminals. By placing the fixing holes of the busbar at such positions, the central axes of the fixing holes are farther from the terminals than the central axes of the busbar fixing portions. At this time, it is preferable to place the busbar so that the misalignment between the busbar fixing portions and the fixing holes, i.e., the distance between the central axes of the fixing holes and the busbar fixing portions, is 0.2 mm or more and 1.0 mm or less.

[0069] Furthermore, the first end of the bus bar placed in the placement step is preferably positioned so that it does not apply pressure to the terminal (slightly touches the terminal).

[0070] When an electronic component has multiple terminals, bus bars corresponding to the respective terminals may be disposed. For example, when an electronic component has both a positive terminal and a negative terminal, it is preferable to dispose a positive bus bar that is a bus bar joined to the positive terminal and a negative bus bar that is a bus bar joined to the negative terminal. In this case, it is preferable to dispose an insulating material such as insulating paper between the bus bars to prevent the positive bus bar and the negative bus bar from coming into contact with each other and causing a short circuit.

[0071] In the manufacturing method of the electronic component mounting structure of the present invention, a step of passing the fixing member through the fixing hole and inserting it into the bus bar fixing portion to fix the bus bar to the bus bar fixing portion and bringing the first end of the bus bar into pressure contact with the terminal is performed. This step is also referred to as a pressure contact step.

[0072] In the pressure contact step, the busbar is inserted through the busbar fixing portion using a fixing member, and the first end of the busbar is brought into pressure contact with the terminal. In the arrangement step, the first end of the busbar is brought close to the terminal, and the busbar is arranged so that the central axis of the fixing hole is farther from the terminal than the central axis of the busbar fixing portion. In this state, the fixing member is inserted through the busbar fixing portion, and the busbar is pressed against the terminal by the fixing member inserted into the busbar fixing portion, thereby bringing the first end of the busbar into pressure contact with the terminal.

[0073] Examples of the fixing member used in this case include grommets and screws. Of these, screws are preferred. When the fixing member is a screw, the bus bar can be fixed to the bus bar fixing portion by screwing.

[0074] (Bonding Step) In the method for manufacturing an electronic component mounting structure of the present invention, a step of joining the first end of the bus bar to the terminal is performed. This step is also referred to as a joining step.

[0075] In the pressure contact step, the first end of the bus bar is in pressure contact with the terminal, and by joining the first end of the bus bar and the terminal in this state, good joining properties are achieved.

[0076] The method for joining the first end of the bus bar and the terminal is not particularly limited, but examples thereof include laser welding, TIG welding, etc. Among these, welding is preferred. That is, in the joining step, it is preferred to join the first end of the bus bar and the terminal by welding.

[0077] (Another embodiment of the electronic component mounting structure and the manufacturing method thereof) In the electronic component mounting structure of the present invention, when the first end of the bus bar and the terminal are not joined and the bus bar is not fixed to the bus bar fixing portion by the fixing member, the first end of the bus bar may be tilted so that its tip is closer to the terminal. This embodiment is described below.

[0078] 4 is a diagram schematically illustrating another example of a pressure contact step constituting the manufacturing method of an electronic component mounting structure of the present invention. In FIG. 4 , busbar 130 includes a fixing hole 131 for fixing busbar 130 to busbar fixing portion 13a, a first end 130a that joins terminal 23, and a second end 130b having fixing hole 131 near the first end 130a. Second end 130b is also the end on the opposite side of fixing hole 131 from first end 130a. Busbar 140 includes a fixing hole 141 for fixing busbar 140 to busbar fixing portion 14a, a first end 140a that joins terminal 24, and a second end 140b having fixing hole 141 near the first end 140a. Second end 140b is also the end on the opposite side of fixing hole 141 from first end 140a.

[0079] The tip of first end 130a of busbar 130 is inclined toward terminal 23. Similarly, the tip of first end 140a of busbar 140 is inclined toward terminal 24. As shown in Fig. 4, when the tip of the first end of the busbar is inclined toward the terminal, the tip of the first end of the busbar is pressed toward the terminal while being deformed in the pressure contact step, thereby improving the contact between the first end of the busbar and the terminal.

[0080] This specification describes the following:

[0081] The present disclosure (1) provides a mounting structure for an electronic component, the mounting structure comprising: a housing having an electronic component mounting portion where an electronic component is mounted and a busbar fixing portion which is a bottomed hole for fixing a busbar; an exterior body; and terminals protruding from the exterior body. The electronic component is mounted on the electronic component mounting portion; a busbar having a first end and a second end located at opposite ends in the longitudinal direction of the busbar, the first end being joined to the terminal of the electronic component and having a fixing hole near the second end; and a fixing member that passes through the fixing hole and is inserted into the busbar fixing portion to fix the busbar to the busbar fixing portion, wherein when the first end of the busbar is not joined to the terminal and the busbar is not fixed to the busbar fixing portion by the fixing member, the central axis of the fixing hole is located farther from the terminal than the central axis of the busbar fixing portion.

[0082] The present disclosure (2) is the mounting structure of an electronic component according to the present disclosure (1), in which, when the first end of the bus bar and the terminal are not joined and the bus bar is not fixed to the bus bar fixing portion by the fixing member, the first end of the bus bar is inclined in a direction such that its tip is closer to the terminal.

[0083] The present disclosure (3) is a mounting structure for an electronic component according to the present disclosure (1) or (2), in which, when the first end of the bus bar and the terminal are joined and the bus bar is fixed to the bus bar fixing portion by the fixing member, the bus bar elastically deforms and presses against the terminal.

[0084] The present disclosure (4) is a mounting structure for an electronic component according to any one of the present disclosures (1) to (3), in which the electronic component is a film capacitor.

[0085] The present disclosure (5) is a mounting structure for an electronic component according to any one of the present disclosures (1) to (4), in which the fixing member is a screw.

[0086] The present disclosure (6) is a mounting structure for an electronic component according to any one of the present disclosures (1) to (5), in which the first end of the bus bar and the terminal are joined by welding.

[0087] The present disclosure (7) is a mounting structure for an electronic component according to any one of the present disclosures (1) to (6), in which, when the first end of the bus bar and the terminal are not joined and the bus bar is not fixed to the bus bar fixing portion by the fixing member, the distance between the central axis of the fixing hole and the central axis of the bus bar fixing portion is 0.2 mm or more and 1.0 mm or less.

[0088] The present disclosure (8) is a method for manufacturing a mounting structure of an electronic component, the method including the steps of: preparing a housing including an electronic component mounting portion where an electronic component is mounted and a busbar fixing portion that is a bottomed hole for fixing a busbar; an exterior body; an electronic component having terminals protruding from the exterior body; and a busbar having a first end and a second end located at both ends in the longitudinal direction of the electronic component and having a fixing hole near the second end; mounting the electronic component on the electronic component mounting portion of the housing; bringing the fixing hole of the busbar close to the busbar fixing portion and bringing the first end of the busbar close to the terminal, and positioning the busbar so that the central axis of the fixing hole is farther from the terminal than the central axis of the busbar fixing portion; passing a fixing member through the fixing hole and inserting it into the busbar fixing portion to fix the busbar to the busbar fixing portion and bring the first end of the busbar into pressure contact with the terminal; and joining the first end of the busbar to the terminal.

[0089] The present disclosure (9) is a manufacturing method for an electronic component mounting structure according to the present disclosure (8), wherein in the step of arranging the bus bar, a tip of the first end of the bus bar is inclined in a direction approaching the terminal.

[0090] The present disclosure (10) is a manufacturing method for a mounting structure of an electronic component according to the present disclosure (8) or (9), in which the electronic component is a film capacitor.

[0091] The present disclosure (11) is a manufacturing method for an electronic component mounting structure according to any one of the present disclosures (8) to (10), in which the fixing member is a screw, and the bus bar is fixed to the bus bar fixing portion by screwing.

[0092] The present disclosure (12) is a manufacturing method for an electronic component mounting structure according to any one of the present disclosures (8) to (11), wherein in the step of joining the first end of the bus bar and the terminal, the first end of the bus bar and the terminal are joined by welding.

[0093] The present disclosure (13) is a manufacturing method for an electronic component mounting structure according to any one of the present disclosures (8) to (12), wherein in the step of arranging the busbar, the busbar is arranged so that the distance between the central axis of the fixing hole and the central axis of the busbar fixing portion is 0.2 mm or more and 1.0 mm or less.

[0094] REFERENCE SIGNS LIST 1 Electronic component mounting structure 10 Housing 11 Housing body 12 Electronic component mounting portion 13, 14 Fixing base 13a, 14a Bus bar fixing portion 20 Electronic component 21 Exterior body 23, 24 Terminal 30, 40, 130, 140 Bus bar 30a, 40a, 130a, 140a First end of bus bar 30b, 40b, 130b, 140b Second end of bus bar 31, 41, 131, 141 Bus bar fixing hole 50, 51 Fixing member 60 Insulating paper 70 Adhesive 80, 81 Welded portion A １３ , A １４ Central axis of busbar fixing part A ３１ , A ４１ Fixing hole center axis L １ , L ３ Distance between the terminal and the center axis of the fixing hole L ２ , L ４ Distance between the center axis of the terminal and the busbar fixing part

Claims

a housing including an electronic component mounting portion where an electronic component is mounted and a bus bar fixing portion which is a bottomed hole for fixing a bus bar; an electronic component having an exterior body and a terminal protruding from the exterior body, the electronic component being mounted on the electronic component mounting portion; a bus bar having a first end and a second end located at opposite ends in a longitudinal direction thereof, the first end being joined to the terminal of the electronic component, and a fixing hole being formed near the second end; a fixing member that passes through the fixing hole and is inserted into the bus bar fixing portion to fix the bus bar to the bus bar fixing portion, a mounting structure for an electronic component, wherein, when the first end of the bus bar and the terminal are not joined together and the bus bar is not fixed to the bus bar fixing portion by the fixing member, the central axis of the fixing hole is located farther from the terminal than the central axis of the bus bar fixing portion.

2. The electronic component mounting structure according to claim 1, wherein when the first end of the bus bar and the terminal are not joined together and the bus bar is not fixed to the bus bar fixing portion by the fixing member, the first end of the bus bar is inclined such that its tip is closer to the terminal.

3. The electronic component mounting structure according to claim 1, wherein when the first end of the bus bar and the terminal are joined together and the bus bar is fixed to the bus bar fixing portion by the fixing member, the bus bar is elastically deformed to press against the terminal.

4. The electronic component mounting structure according to claim 1, wherein the electronic component is a film capacitor.

5. The electronic component mounting structure according to claim 1, wherein the fixing member is a screw.

6. The electronic component mounting structure according to claim 1, wherein the first end of the bus bar and the terminal are joined by welding.

7. The electronic component mounting structure according to claim 1, wherein when the first end of the bus bar and the terminal are not joined together and the bus bar is not fixed to the bus bar fixing portion by the fixing member, a distance between a central axis of the fixing hole and a central axis of the bus bar fixing portion is 0.2 mm or more and 1.0 mm or less. 　 a housing including an electronic component mounting portion where an electronic component is mounted and a bus bar fixing portion which is a bottomed hole for fixing a bus bar; an electronic component having an exterior body and a terminal protruding from the exterior body; preparing a bus bar having a first end and a second end located at opposite ends in a longitudinal direction thereof, the bus bar having a fixing hole near the second end; a step of mounting the electronic component on the electronic component mounting portion of the housing; positioning the bus bar such that the fixing hole of the bus bar is adjacent to the bus bar fixing portion and the first end of the bus bar is adjacent to the terminal, and a central axis of the fixing hole is farther from the terminal than a central axis of the bus bar fixing portion; a step of inserting a fixing member through the fixing hole and into the bus bar fixing portion to fix the bus bar to the bus bar fixing portion and bringing the first end of the bus bar into pressure contact with the terminal; a step of joining the first end of the bus bar and the terminal.

9. The method for manufacturing an electronic component mounting structure according to claim 8, wherein in the step of arranging the bus bar, a tip of the first end of the bus bar is inclined in a direction approaching the terminal.

10. The method for manufacturing an electronic component mounting structure according to claim 8, wherein the electronic component is a film capacitor. 　 The method for manufacturing an electronic component mounting structure according to any one of claims 8 to 10, wherein the fixing members are screws, and the bus bars are fixed to the bus bar fixing portions by screwing.

12. The method for manufacturing an electronic component mounting structure according to claim 8, wherein in the step of joining the first end of the bus bar and the terminal, the first end of the bus bar and the terminal are joined by welding.

13. The method for manufacturing an electronic component mounting structure according to claim 8, wherein in the step of arranging the bus bar, the bus bar is arranged so that a distance between a central axis of the fixing hole and a central axis of the bus bar fixing portion is 0.2 mm or more and 1.0 mm or less.

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