Input device

Abstract

[Problem] To provide an input device in which a switch independent of a switch on a main surface can be provided on a side surface. [Solution] This input device is provided with: a substrate having a main surface and at least one side surface substantially orthogonal to the main surface; and a side surface detection electrode portion that is formed on the side surface and detects a change in capacitance.

Description

Input Devices

[0001] The present invention relates to an input device.

[0002] There is known an input device that detects whether or not a user has performed an operation input by detecting a change in capacitance (see, for example, Patent Document 1). In the input device described in Patent Document 1, in order to detect an operation from the side, a detection electrode is formed from the main surface of the substrate to the side and then to the opposite main surface.

[0003] Japanese Patent Application Laid-Open No. 2005-190950

[0004] However, in the input device described in Patent Document 1, operations from both the side surface and the main surface are detected by a single detection electrode, which poses a problem in that an independent switch that detects only operations from the side surface cannot be provided on the side surface.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an input device in which a switch is provided on the side surface thereof independent of a switch on the main surface thereof.

[0006] The present invention provides an input device that includes, for example, a substrate having a main surface and at least one side surface that is approximately perpendicular to the main surface, and a side detection electrode portion formed on the side surface for detecting a change in capacitance.

[0007] 1 is a diagram illustrating an example of the appearance of an input device according to an embodiment; FIG. 2 is a diagram illustrating an example of the appearance of a substrate according to an embodiment; FIGS. A to C are diagrams for explaining a first comparative example; FIGS. A to C are diagrams for explaining a first comparative example; FIGS. A to C are diagrams for explaining a second comparative example; FIGS. A to C are diagrams for explaining an example of the configuration of a substrate according to the first embodiment; FIGS. A to C are diagrams for explaining an example of the configuration of a side surface side detection electrode unit according to the first embodiment; FIGS. A to C are diagrams for explaining the operation of an input device according to the first embodiment; FIGS. A to C are diagrams for explaining an example of the configuration of a side surface side detection electrode unit according to a second embodiment; FIGS. A to C are diagrams for explaining the operation of an input device according to the second embodiment; FIGS. A to C are diagrams for explaining an example of the configuration of a side surface side detection electrode unit according to a third embodiment; FIGS. 1A to 1C are perspective views of a small substrate according to a fourth embodiment; FIGS. A to C are diagrams for explaining an example of the configuration of a substrate according to the fourth embodiment; FIGS. A and B are perspective views for explaining an attachment member according to a fifth embodiment; FIGS. 1A and 1B are diagrams for explaining a state in which the attachment member according to the fifth embodiment is attached to a substrate; and FIGS. 1B and 1C are diagrams for explaining the operation of an input device according to the fifth embodiment.

[0008] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiments described below are preferred examples of the present invention, and the present invention is not limited to these embodiments. The description will be given in the following order: <First Embodiment> <Second Embodiment> <Third Embodiment> <Fourth Embodiment> <Fifth Embodiment> <Modification> Note that the components set forth in the claims are not limited to the components of the embodiments. In particular, the dimensions, materials, shapes, relative positions, and directions (up, down, left, right, etc.) of the components described in the embodiments are not intended to limit the scope of the present invention, and are merely illustrative examples, unless otherwise specified. Note that the size and positional relationships of the components shown in each drawing may be exaggerated for clarity. Furthermore, to avoid cluttering the illustrations, only some reference symbols may be shown or some parts may be simplified. Furthermore, in the following description, the same names and symbols indicate the same or similar components, and redundant explanations will be omitted as appropriate.

[0009] First Embodiment [External Appearance of Input Device] FIG. 1 shows an external appearance of an input device according to an embodiment (hereinafter, referred to as input device 1). The input device 1 according to this embodiment is a capacitance-type input device. Here, a capacitance-type input device refers to a device that detects whether or not an input operation has been performed by detecting a change in capacitance. The input device 1 according to this embodiment is, for example, a remote control device for a toilet that can be attached to a wall or the like. However, the use of the input device 1 is not limited to a remote control device for a toilet. For example, the input device 1 can also be used as a remote control device for electronic devices such as air conditioners and television sets.

[0010] The input device 1 has a housing 10. The housing 10 is made of, for example, resin. The housing 10 has, for example, a rectangular parallelepiped shape. Specifically, the housing 10 has a first main surface 10A and a second main surface 10B opposite the first main surface 10A. In this specification, the main surface means a surface whose area (region) is relatively larger than the other surfaces. Furthermore, the housing 10 has four side surfaces (a first side surface 11A, a second side surface 11B, a third side surface 11C, and a fourth side surface 11D) connecting the first main surface 10A and the second main surface 10B.

[0011] In this embodiment, switches are formed on each of the first main surface 10A, the first side surface 11A, and the second side surface 11B. For example, three switches (switch SW1, switch SW2, and switch SW3) are formed on the first main surface 10A. Switches SW1, SW2, and SW3 have, for example, circular shapes. Furthermore, three switches (switch SW4, switch SW5, and switch SW6) are formed on the first side surface 11A. Furthermore, two switches (switch SW7 and switch SW8) are formed on the second side surface 11B. Switches SW4, SW5, ..., and SW8 have, for example, rectangular shapes.

[0012] Each switch is assigned a function such as "flushing the water" or "opening and closing the toilet seat," as well as a function for making various settings related to the toilet. Letters or marks indicating these functions may be printed on the housing 10. As will be described in detail later, each switch SW is configured as an electrostatic switch. Specifically, when a user touches or brings a finger close to each switch SW, the function assigned to that switch SW is executed. Note that the number, shape, assigned functions, etc. of the switches SW are not limited to the example shown in FIG. 1 and can be changed as appropriate.

[0013] [Exemplary Appearance of Substrate] FIG. 2 shows an exemplary appearance of a substrate (hereinafter, appropriately referred to as substrate 20) according to an embodiment. The substrate 20 has, for example, a rectangular parallelepiped shape, specifically a thin plate shape. The substrate 20 has a first main surface 20A and a second main surface 20B opposite the first main surface 20A. The substrate 20 has, for example, at least one side surface that is approximately perpendicular to the first main surface 20A. In this embodiment, the substrate 20 connects the first main surface 20A and the second main surface 20B and has four side surfaces (first side surface 21A, second side surface 21B, third side surface 21C, and fourth side surface 21D) that are approximately perpendicular to each main surface. As will be described in detail later, detection electrodes for detecting operation inputs are provided on appropriate surfaces of the substrate 20.

[0014] [Explanation of Comparative Examples] Next, comparative examples will be described to facilitate understanding of the present invention. Figures 3A to 3C are diagrams for explaining a first comparative example. The first comparative example is an example in which no detection electrode portion is provided on the first side surface 21A or the second side surface 21B, and the substrate is configured by a single substrate 20. Below, as an example, an example of a detection electrode portion that detects an operation input to switch SW4 will be described, but the same applies to detection electrode portions that detect operation input to switches SW5 to SW8.

[0015] As shown in FIG. 3A , the detection electrode unit (hereinafter, appropriately referred to as the detection electrode unit 23) that detects an operational input to the switch SW4 includes, for example, a detection electrode unit 23A formed near the end of the first main surface 20A on the first side surface 21A side, and a detection electrode unit 23B formed near the end of the second main surface 20B on the first side surface 21A side. The detection electrode unit 23A and the detection electrode unit 23B are separated by the first side surface 21A. As shown in FIG. 3B , for example, a connection unit 23C is connected to the detection electrode unit 23A. The connection unit 23C extends downward from the first main surface 20A, and its tip is connected to a detection circuit (not shown) that detects capacitance changes. FIG. 3C is an end view of the substrate according to the comparative example cut along the cutting line AA-AA in FIG. 3B . As shown in FIG. 3C, a detection electrode portion 23A is provided on the first main surface 20A near the first side surface 21A, and a detection electrode portion 23B is provided on the second main surface 20B near the first side surface 21A.

[0016] FIG. 4 is a diagram illustrating the operation of an input device according to a comparative example. As shown in FIG. 4 , for example, assume that an operation input is made to the side switch SW4 (e.g., near the location shown in the end view of FIG. 3C ) and a finger F approaches the detection electrode unit 23. The proximity of the finger F generates a capacitance component between the finger F and the detection electrode unit 23A or the detection electrode unit 23B. Note that in FIG. 4 , the capacitance component is schematically represented by a capacitor. This also applies to FIGS. 8 , 10 , and 16 . If a change in this capacitance component can be detected, the operation input to the switch SW4 can be detected. However, in the first comparative example, the area of ​​the detection electrode units 23A and 23B facing the finger F is small, so the change in the capacitance component when the finger F approaches is small, making it difficult to detect this change. Therefore, there is a risk that the operation input to the switch SW4 cannot be detected. In other words, there is a problem in that an operation input to the side surface cannot be detected independently of an operation input to the main surface.

[0017] 5A to 5C are diagrams illustrating a second comparative example. The second comparative example is an example in which three substrates are housed in the housing 10 instead of one. As shown in FIG. 5A, a substrate 25A is housed in the housing 10. When viewed from the front, a substrate 25B is disposed above the substrate 25A, and a substrate 25C is disposed to the right of the substrate 25A. FIG. 5B is a diagram of the substrate 25B as viewed from above, and FIG. 5C is a diagram of the substrate 25C as viewed from the right side.

[0018] The main surface 26A of the substrate 25A is provided with a detection electrode portion 27A for detecting an operation input to the switch SW1, a detection electrode portion 27B for detecting an operation input to the switch SW2, and a detection electrode portion 27C for detecting an operation input to the switch SW3.

[0019] The main surface (top surface) 26B of the substrate 25B is provided with a detection electrode portion 27D for detecting an operation input to the switch SW4, a detection electrode portion 27E for detecting an operation input to the switch SW5, and a detection electrode portion 27F for detecting an operation input to the switch SW6.

[0020] A detection electrode portion 27G for detecting an operation input to the switch SW7 and a detection electrode portion 27H for detecting an operation input to the switch SW8 are provided on the main surface 26C (the surface as viewed from the right side in FIG. 5A) of the substrate 25C.

[0021] Substrate 25A and substrate 25B are connected by connection line 28A. Changes in the capacitance components detected by detection electrode portion 27D, detection electrode portion 27E, and detection electrode portion 27F are output via connection line 28A to an IC (Integrated Circuit) or the like provided on substrate 25A.

[0022] Furthermore, substrate 25A and substrate 25C are connected by connection wire 28B, so that changes in the capacitance components detected by detection electrode portion 27G and detection electrode portion 27H are output to an IC or the like provided on substrate 25A via connection wire 28B.

[0023] By providing a substrate (substrate 25B and substrate 25C in this example) separate from substrate 25A on the side surface, the area of ​​the detection electrode portion arranged on the side surface can be increased. However, the configuration according to the second modification requires three substrates, and further requires connecting wires to connect each substrate. The increased number of components increases costs, and the time required to assemble the connecting wires complicates the process. Furthermore, since three substrates must be accommodated in housing 10, there is a risk that the input device will become larger. Based on the above comparative example, the embodiment will be described in more detail.

[0024] [Substrate According to the Present Embodiment] Figures 6A to 6C are diagrams for explaining an example of the configuration of the substrate 20 according to the present embodiment. Figure 6A is a diagram of the substrate 20 viewed toward the first main surface 20A. Figure 6B is a diagram of the substrate 20 viewed toward the first side surface 21A. Figure 6C is a diagram of the substrate 20 viewed toward the second side surface 21B. The above-described substrate 20 is housed within the housing 10.

[0025] Three detection electrodes are formed on the first principal surface 20A for detecting operation inputs to switches SW1, SW2, and SW3, respectively. Specifically, a detection electrode 31A for detecting operation inputs to switch SW1, a detection electrode 31B for detecting operation inputs to switch SW2, and a detection electrode 31C for detecting operation inputs to switch SW3 are formed at a distance from each other on the first principal surface 20A. The detection electrodes 31A, 31B, and 31C are provided relatively close to the center of the first principal surface 20A so as to detect changes in capacitance components independently of the detection electrodes provided on the side surfaces. Note that the detection electrodes are indicated in dark gray in FIG. 6 . This also applies to FIGS. 7 , 9 , 11 , and 13 .

[0026] Each detection electrode is formed by depositing (e.g., plating or foiling) a conductive metal such as copper on the first main surface 20A. Each detection electrode has, for example, a circular shape, but may have another shape such as a rectangle. Each detection electrode provided on the first main surface 20A corresponds to an example of a main surface-side detection electrode. Note that a detection electrode may also be formed on the second main surface 20B.

[0027] A side surface-side detection electrode portion different from the main surface-side detection electrode portion is formed on the side surface of the substrate 20. Here, "different from the main surface-side detection electrode portion" means that the side surface-side detection electrode portion is not continuous with the main surface-side detection electrode portion. In this embodiment, a side surface-side detection electrode portion is formed on each of the first side surface 21A and the second side surface 21B.

[0028] On the first side surface 21A, for example, a detection electrode 31D for detecting an operation input to switch SW4, a detection electrode 31E for detecting an operation input to switch SW5, and a detection electrode 31F for detecting an operation input to switch SW6 are formed at intervals. Each detection electrode is formed by depositing a film (e.g., plating or foil) of a conductive metal such as copper on the first side surface 21A. Each detection electrode has, for example, a rectangular shape, but may also have another shape such as an oval. When there are multiple detection electrodes, the detection electrode portions are formed at intervals so that the operation of the corresponding switch SW can be detected.

[0029] On the second side surface 21B, for example, a detection electrode 31G for detecting an operation input to switch SW7 and a detection electrode 31H for detecting an operation input to switch SW8 are formed at a distance from each other. Each detection electrode is formed by, for example, depositing a conductive metal such as copper on the second side surface 21B (e.g., plating or foil). Each detection electrode has, for example, a rectangular shape, but may have another shape such as an ellipse. Note that detection electrode portions may be formed on sides other than the first side surface 21A and the second side surface 21B. When there are multiple detection electrodes, the detection electrode portions are formed at a distance from each other, so that operation of the corresponding switch SW can be detected.

[0030] The detection electrode portions provided on the first side surface 21A and the second side surface 21B correspond to examples of side surface detection electrodes. The side surface detection electrodes are electrodes for detecting changes in capacitance. The side surface detection electrodes can detect operations from the side surfaces of the housing 10 (e.g., the first side surface 21A and the second side surface 21B).

[0031] 7A to 7C, the side surface detection electrode portions provided on the first side surface 21A and the second side surface 21B will be described in detail. Note that in Fig. 7A to 7C, the detection electrode portion 31D is used as an example of the side surface detection electrode portion, but the matters described below also apply to the other side surface detection electrode portions, such as the detection electrode portion 31E.

[0032] Fig. 7A is an enlarged view of the vicinity of the detection electrode portion 31D formed on the first side surface 21A, as viewed toward the first side surface 21A. Fig. 7B is an enlarged view of the vicinity of the detection electrode portion 31D formed on the first side surface 21A, as viewed toward the first main surface 20A. Fig. 7C is an end view of the substrate 20 cut along the cutting line BB-BB in Fig. 7B.

[0033] The detection electrode 31D further includes a connection portion 32D connected to the detection electrode 31D. The connection portion 32D is formed, for example, by depositing a conductive metal such as copper on the first main surface 20A (e.g., plating or foil). As shown in FIG. 7B , the connection portion 32D is linearly formed downward (toward the fourth side surface 21D) from the first main surface 20A. The tip of the connection portion 32D is connected to a detection circuit (not shown) mounted on the first main surface 20A, for example. The detection circuit detects changes in capacitance caused by an operation input made to the switch SW4. As shown in FIG. 7C , the detection electrode 31D is formed across the entire width W1 direction of the first side surface 21A.

[0034] Similar to the detection electrode portion 31D, the other side surface detection electrodes also have connection portions that are connected to the detection circuit.

[0035] [Operation] The operation of the input device according to the first embodiment will be described with reference to FIG. 8 . For example, when performing an operational input on switch SW4 (e.g., near the location shown in the end view of FIG. 7C ), the user places a finger F in contact with or close proximity to switch SW4 (hereinafter, also referred to as "contact" or the like, as appropriate). As a result, as shown in FIG. 8 , a capacitance component is generated between the finger F and the detection electrode 31D corresponding to switch SW4. By detecting a change in this capacitance component, an operational input on switch SW4 can be detected. In a similar manner, an operational input on the other detection electrodes can be detected.

[0036] [Effects Obtained by the Present Embodiment] According to the present embodiment, for example, the following effects can be obtained. For example, by forming the detection electrode units on the first side surface 21A and the second side surface 21B, the area of ​​the detection electrode units facing the finger F can be made larger compared to the first comparative example described above. This allows for a larger change in capacitance when the finger F comes into contact with the detection electrode units. This allows for reliable detection of operation inputs to the side surfaces. Because operation inputs to the side surfaces can be reliably detected, switches independent of the switches provided on the main surface can be provided on the side surfaces. Since multiple substrates are not required, the input device 1 can be made smaller and lighter. Furthermore, the manufacturing cost of the input device 1 can be reduced. Furthermore, since only a thin conductive metal film (e.g., plating or foil) is required on the side surfaces, the degree of freedom in the arrangement of the detection electrode units can be improved. Furthermore, the degree of freedom in the size, area, shape, etc. of the detection electrode units can be increased. For example, the shape of the detection electrode units can be determined according to the distance and angle from the finger F expected during operation input.

[0037] Second Embodiment Next, a second embodiment will be described. The matters described in the first embodiment are also applicable to the first embodiment unless otherwise specified. The same or similar components are designated by the same reference numerals, and redundant descriptions will be omitted where appropriate.

[0038] The substrate according to this embodiment can be the substrate 20 described in the first embodiment (see FIG. 6 ). In this embodiment, unlike the first embodiment, the side detection electrode portion is formed so that the area of ​​the end face of the side detection electrode portion is larger than the area of ​​the side face (for example, the area of ​​the side face that overlaps with the area of ​​the end face of the side detection electrode portion).

[0039] 9A to 9C, the side surface detection electrode portions provided on the first side surface 21A and the second side surface 21B will be described in detail. Note that in Fig. 9A to 9C, the detection electrode portion 31D will be described as an example of the side surface detection electrode portion, but the matters described below also apply to the other side surface detection electrode portions, such as the detection electrode portion 31E.

[0040] Fig. 9A is an enlarged view of the vicinity of the detection electrode 31D formed at a predetermined position on the first side surface 21A, as viewed toward the first side surface 21A. Fig. 9B is an enlarged view of the vicinity of the detection electrode 31D formed at a predetermined position on the first side surface 21A, as viewed toward the first main surface 20A. Fig. 9C is an end view of the substrate 20 cut along the cutting line CC-CC in Fig. 9B.

[0041] The detection electrode 31D is formed not only on the first side surface 21A, but also continuously from near the end of the first main surface 20A on the first side surface 21A side (near the side end) to the first side surface 21A, and then to near the end of the opposite second main surface 20B on the first side surface 21A side. With this configuration, as shown in FIG. 9A , when viewed toward the first side surface 21A, the width W2 of the detection electrode 31D is larger than the width W1 of the first side surface 21A. This results in the area of ​​the end surface of the detection electrode 31D being larger than the area of ​​the first side surface 21A (the area of ​​the first side surface 21A that overlaps with the area of ​​the end surface of the detection electrode 31D). As shown in FIG. 9C , when viewed from an end surface of the substrate 20 cut along the cutting line CC-CC, the detection electrode 31D has a shape that is a vertically inverted concave shape.

[0042] The detection electrode 31D further includes a connection portion 32D connected to the detection electrode 31D. The connection portion 32D is formed, for example, by forming a film (e.g., plating or foil) of a conductive metal such as copper on the first main surface 20A. As shown in FIG. 9B , the connection portion 32D is formed linearly downward (toward the fourth side surface 21D) from the first main surface 20A. The connection portion 32D is connected, for example, to a portion of the detection electrode 31D that protrudes slightly toward the first main surface 20A. The tip of the connection portion 32D is connected, for example, to a detection circuit (not shown) mounted on the first main surface 20A. The detection circuit is a circuit that detects a change in capacitance component associated with an operation input made to the detection electrode 31D.

[0043] The operation of the input device according to the second embodiment will be described with reference to Fig. 10 . For example, when performing an operational input on switch SW4 (e.g., near the location shown in the end view of Fig. 9C ), the user touches switch SW4 with a finger F. As a result, a capacitance component is generated between the finger F and the detection electrode unit 31D, as shown in Fig. 10 . By detecting a change in this capacitance component, an operational input on switch SW4 can be detected. In a similar manner, an operational input on the other detection electrodes can be detected.

[0044] [Effects Obtained by the Present Embodiment] According to the present embodiment, for example, the following effects can be obtained. For example, by forming the detection electrode units on the first side surface 21A and the second side surface 21B, the area of ​​the detection electrode units facing the finger F can be made larger compared to the first comparative example described above. Furthermore, the area of ​​the end face of the side surface detection electrode unit is configured to be larger than the area of ​​the side surface (the area of ​​the side surface overlapping with the area of ​​the end face of the side surface detection electrode unit). This makes it possible to make the area of ​​the side surface detection electrode unit facing the finger F larger when the finger F makes contact, etc. As a result, as schematically shown by two capacitors in FIG. 10 , the change in the capacitance component (e.g., the increase in the capacitance component) when the finger F makes contact, etc. can be made larger than in the first embodiment. This makes it possible to more reliably detect operation inputs to the side surface.

[0045] <Third Embodiment> Next, a third embodiment will be described. The matters described in the first and second embodiments are also applicable to the third embodiment unless otherwise specified. Furthermore, the same reference numerals are used for the same or similar components, and duplicate descriptions will be omitted as appropriate.

[0046] In the first and second embodiments, the electrostatic switch is of a self-capacitance type, but the electrostatic switch may be of a mutual capacitance type. In the mutual capacitance type, the side detection electrode portion includes a pair of detection electrodes (a transmitting electrode and a receiving electrode).

[0047] The side surface detection electrode unit according to this embodiment will be described. Figures 11A to 11C are enlarged views of the side surface detection electrode unit according to this embodiment, for example, the vicinity of the detection electrode unit 31D according to this embodiment. Figure 11A is a view of the detection electrode unit 31D according to this embodiment when viewed toward the first side surface 21A. Figure 11B is a view of the detection electrode unit 31D according to this embodiment when viewed toward the first main surface 20A. Figure 11C is a view of the detection electrode unit 31D according to this embodiment when viewed toward the second main surface 20B. Note that Figure 11C is a view that is upside down compared to Figures 11A and 11B.

[0048] As shown in FIG. 11A , the detection electrode unit 31D includes, for example, a transmitting electrode 33A and a receiving electrode 33B. The transmitting electrode 33A and the receiving electrode 33B are formed linearly by, for example, forming a film (e.g., plating or foil) of a conductive metal such as copper on the first main surface 20A. As shown in FIGS. 11A to 11C , the transmitting electrode 33A is formed not only on the first side surface 21A but also continuously from near the end of the first main surface 20A on the first side surface 21A side to the first side surface 21A and extending to near the end of the second main surface 20B on the first side surface 21A side. As shown in FIGS. 11A to 11C , the receiving electrode 33B is formed not only on the first side surface 21A but also continuously from near the end of the first main surface 20A on the first side surface 21A side to the first side surface 21A and extending to the lower side (upper side in FIG. 11C ) of the second main surface 20B.

[0049] 11A , when the first side surface 21A is viewed from above, the width W3 of each of the transmitting electrode 33A and the receiving electrode 33B is larger than the width W1 of the first side surface 21A. As a result, the area of ​​the end surface of the side surface-side detecting electrode portion including the transmitting electrode 33A and the receiving electrode 33B is larger than the area of ​​the side surface (the area of ​​the side surface that overlaps with the area of ​​the end surface of the side surface-side detecting electrode portion).

[0050] The tip of the receiving electrode 33B is connected to a detection circuit (not shown) mounted on, for example, the second main surface 20B. The detection circuit is a circuit that detects a change in capacitance component accompanying an operation input made to the detection electrode portion 31D.

[0051] When an operation input is made to the switch SW4, a finger F comes into contact with the detection electrode 31D. The contact of the finger F causes a change (e.g., a decrease) in the capacitance component existing between the transmitting electrode 33A and the receiving electrode 33B. By detecting this change in the capacitance component, the operation input to the switch SW4 is detected.

[0052] In this way, the side detection electrode portion may include a transmitting electrode and a receiving electrode.

[0053] <Fourth Embodiment> Next, a fourth embodiment will be described. The matters described in the first to third embodiments are also applicable to the fourth embodiment unless otherwise specified. Furthermore, the same reference numerals are used for the same or similar components, and duplicate descriptions will be omitted as appropriate.

[0054] In this embodiment, a small substrate (hereinafter referred to as small substrate 40) that is smaller than the substrate 20 and is a separate substrate is used. FIG. 12 is a perspective view of the small substrate 40 according to this embodiment. The small substrate 40 is, for example, rectangular parallelepiped-shaped, specifically, thin plate-shaped. The small substrate 40 has a first main surface 40A and a second main surface 40B opposite the first main surface 40A. The small substrate 40 has, for example, at least one side surface that is substantially perpendicular to the first main surface 40A. In this embodiment, the small substrate 40 connects the first main surface 40A and the fourth main surface 40B and has four side surfaces (first side surface 41A, second side surface 41B, third side surface 41C, and fourth side surface 41D) that are substantially perpendicular to each main surface.

[0055] 13A to 13C are diagrams for explaining the substrate 20 according to the fourth embodiment. Fig. 13A is a diagram of the substrate 20 viewed toward the first main surface 20A. Fig. 13B is a diagram of the substrate 20 viewed toward the first side surface 21A. Fig. 13C is a diagram of the substrate 20 viewed toward the second side surface 21B.

[0056] In this embodiment, the small substrate 40 is attached to an end of the first main surface 20A near the first side surface 21A. The small substrate 40 is attached by an appropriate method such as adhesive, screw fastening, or soldering. Specifically, the small substrate 40 is attached to the first main surface 20A so that the first side surface 21A of the substrate 20 and the first side surface 41A of the small substrate 40 are substantially flush with each other. In this embodiment, the first side surface 41A functions as the flat surface. Of course, the other side surfaces of the small substrate 40 may also function as the flat surface.

[0057] The small boards 40 are attached to locations corresponding to the switches SW. As shown in Figures 13A to 13C, in this embodiment, three small boards 40 are attached near the first side surface 21A of the first main surface 20A. The three small boards 40 are attached spaced apart in the horizontal direction. Furthermore, two small boards 40 are attached near the second side surface 21B of the first main surface 20A. The two small boards 40 are attached spaced apart in the vertical direction.

[0058] This configuration defines a region on the first side surface 41A of the small substrate 40 and a predetermined region on the first side surface 21A adjacent to the first side surface 41A. As shown in Figures 13A and 13C, a conductive metal such as copper is deposited (e.g., plated or foil) on these two regions to form side detection electrodes such as the detection electrode 31D. The metal may be deposited after the small substrate 40 is attached to the substrate 20, or a metal may be deposited on both the small substrate 40 and the substrate 20, and then the small substrate 40 may be attached to the substrate 20.

[0059] By attaching the small substrate 40, for example, the area of ​​the end face of the detection electrode 31D can be made larger than the area of ​​the first side surface 21A (specifically, the area of ​​the first side surface 21A adjacent to the first side surface 41A). This makes it possible to make the area of ​​the side-side detection electrode portion facing the finger F larger when the finger F touches the switch SW4 to perform an operation input. This makes it possible to make the change in the capacitance component larger when the finger F touches the switch SW4. This makes it possible to more reliably detect an operation input to the side surface.

[0060] Although the present embodiment describes an example in which the small substrate 40 is attached to the substrate 20, the substrate used in this embodiment may be a single substrate in which the small substrate 40 and the substrate 20 are integrated. For example, the substrate of this embodiment may be manufactured by removing unnecessary portions from a relatively thick substrate. In this case, the manufacturing process for the substrate can be simplified and costs reduced by first depositing a conductive metal film on the side and then removing the unnecessary portions. The small substrate 40 and the substrate 20 may be cut from the same substrate or from different substrates. The thicknesses of the small substrate 40 and the substrate 20 may be the same or different. Although the present embodiment describes an example in which the small substrate 40 is attached only to the first main surface 20A of the substrate 20, this is not limiting. The small substrate 40 may be attached to both the first main surface 20A and the second main surface 20B, or only to the second main surface 20B.

[0061] Fifth Embodiment Next, a fifth embodiment will be described. The matters described in the first to fourth embodiments are also applicable to the fifth embodiment unless otherwise specified. The same or similar components are designated by the same reference numerals, and redundant descriptions will be omitted where appropriate.

[0062] This embodiment is an example in which the side area is enlarged using a mounting member that can be attached to the substrate 20 .

[0063] 14A and 14B are perspective views illustrating a mounting member according to this embodiment (hereinafter, appropriately referred to as mounting member 50). Mounting member 50 is made of a conductive metal such as copper. The end face of mounting member 50 has, for example, a substantially Ω-shaped configuration. Mounting member 50 has a space 51 inside that communicates with the external space. Space 51 includes a first space 51B that communicates with open end 51A and a second space 51C that widens from first space 51B toward the interior. The widths of open end 51A and first space 51B are slightly larger than the width of the side surface of substrate 20. The tip of second space 51C forms bottom surface 52. Mounting member 50 has a flat portion 53, which is a substantially flat surface, on the opposite side (outside) of bottom surface 52.

[0064] The mounting members 50 are attached, for example, to locations inside the housing 10 (not shown in FIGS. 15 and 16 ) corresponding to the switches SW. For example, the flat portions 53 are fitted into the housing 10. Specifically, the mounting members 50 are attached spaced apart near the locations where the switches SW4, SW5, and SW6 are provided. Furthermore, the mounting members 50 are attached spaced apart near the locations where the switches SW7 and SW8 are provided. In this embodiment, a total of five mounting members 50 are attached inside the housing 10. The boards 20 are attached to these mounting members 50.

[0065] Next, an example of a method for attaching the mounting members 50 will be described. When storing the board 20 in the housing 10, the ends of the board 20 are attached to the mounting members 50 provided inside the housing 10. For example, the first side surface 21A is inserted from the open end 51A, and the board 20 is slid toward the space 51 of the mounting member 50. This causes the board 20 to be inserted into the second space 51C via the first space 51B. When the first side surface 21A of the board 20 abuts against the bottom surface 52, restricting the sliding of the mounting member 50, the mounting of the board 20 to the mounting members 50 is complete. Note that the mounting members 50 may be attached to the board 20 in advance, and then the mounting members 50 and board 20 may be stored in the housing 10. Alternatively, the board 20 may be stored in the housing 10 first, and then the mounting members 50 may be attached to the board 20.

[0066] 15 is an end view showing the mounting member 50 attached to the substrate 20. When the substrate 20 is attached to the mounting member 50, the first side surface 21A abuts against the bottom surface 52. Furthermore, the inner surface of the first space 51B abuts against the first main surface 20A and the second main surface 20B. This allows the substrate 20 to be stably attached to the mounting member 50. Furthermore, the substrate 20 can be stably supported within the housing 10. Note that as long as the mounting member 50 is stably supported, the bottom surface 52 of the mounting member 50 does not necessarily have to abut against the first side surface 21A.

[0067] Although not shown, when the board 20 is attached to the attachment members 50, appropriate locations on the attachment members 50 are connected to a wiring pattern that is connected to a detection circuit. The detection circuit is a circuit that detects a change in capacitance component that accompanies an operation input made to each attachment member 50.

[0068] When the substrate 20 is attached to the mounting member 50, a flat portion 53, which is an area larger than the area of ​​the first side surface 21A (the area of ​​the first side surface 21A at the point where the mounting member 50 is attached), is located outside the first side surface 21A.

[0069] Next, the operation of the mounting member 50 will be described with reference to FIG. 16 . In this embodiment, at least a portion of the mounting member 50 functions as a side detection electrode portion. As shown in FIG. 16 , when a finger F touches a switch SW corresponding to the mounting member 50, a change in the capacitance component (e.g., an increase in the capacitance component) occurs. By detecting this change in the capacitance component with the detection circuit described above, it is possible to detect an operation input to the switch SW corresponding to the location where the mounting member 50 is attached.

[0070] The mounting member may have other shapes. The mounting positions and number of mounting members 50 can also be changed appropriately depending on the positions and number of switches SW. Furthermore, the mounting member 50 may be made of resin instead of conductive metal. In this case, a conductive metal film (e.g., plating or foil) is formed on, for example, the flat portion 53 of the mounting member 50. A metal film may also be formed on the entire outer surface of the mounting member 50. From the perspective of making it easier to detect changes in the capacitance component, it is preferable that the area of ​​the flat portion 53 be larger than the area of ​​the first side surface 21A (the area of ​​the first side surface 21A where the mounting member 50 is attached), but they may also be the same. Furthermore, regardless of the flat portion 53, the area of ​​the mounting member 50 or the electrode portion provided on the mounting member 50 may be larger than the area of ​​the first side surface 21A (the area of ​​the first side surface 21A where the mounting member 50 is attached) or may be the same as the area of ​​the first side surface 21A (the area of ​​the first side surface 21A where the mounting member 50 is attached).

[0071] <Modifications> Although the embodiments of the present invention have been specifically described above, the present invention is not limited to the above-described embodiments, and various modifications based on the technical concept of the present invention are possible.

[0072] In the above-described embodiment, an example in which a detection electrode portion is provided on the main surface has been described, but the detection electrode portion may not be provided on the main surface side. The shape of the substrate may be polygonal, circular, or elliptical. The arrangement position and number of the detection electrode portions are not limited to the examples in the above-described embodiment, and can be changed as appropriate. Furthermore, in the above-described embodiment, an example in which all the switches provided in the input device are capacitance type switches has been described, but the input device may also be provided with switches that are not capacitance type (for example, mechanical switches such as push buttons).

[0073] The configurations, methods, processes, shapes, materials, and numerical values ​​of the above-described embodiments and modifications can be combined or substituted with one another without departing from the spirit of the present invention. Furthermore, one thing can be divided into two or more things, and two or more things can be combined into one thing. Furthermore, some parts can be omitted. Furthermore, the effects described in this specification should not be construed as limiting the content of the present invention.

[0074] DESCRIPTION OF SYMBOLS 1... Input device 10... Housing 20... Board 20A... First main surface 20B... Second main surface 21A... First side surface 21B... Second side surface 21C... Third side surface 21D... Fourth side surface 31A to 31H... Detection electrode portion 40... Board 41A... First side surface 41B... Second side surface 41C... Third side surface 41D... Fourth side surface 50... Mounting member 53... Flat portion

Claims

1. An input device comprising: a substrate having a main surface and at least one side surface that is approximately perpendicular to the main surface; and a side detection electrode portion formed on the side surface for detecting changes in capacitance.

2. The input device according to claim 1, further comprising a main surface side detection electrode portion formed on the main surface, wherein the side surface side detection electrode portion is a detection electrode different from the main surface side detection electrode portion.

3. The input device according to claim 1, wherein the side detection electrode portion is formed so that the area of ​​the end face of the side detection electrode portion is larger than the area of ​​the side surface.

4. An input device according to claim 3, wherein the side detection electrode portion has a shape in which an electrode portion formed at a predetermined location on the side surface and an electrode portion formed near the side edge of the main surface are continuously formed.

5. The input device according to claim 3, wherein the side detection electrode section includes a transmitting electrode and a receiving electrode.

6. An input device as described in claim 3, further comprising another substrate provided in the vicinity of the side surface of the main surface, the another substrate having a flat portion that is substantially flush with the side surface, and the side detection electrode portion being formed in a predetermined area of ​​the side surface and in the flat portion adjacent to the predetermined area.

7. The input device according to claim 1, further comprising a conductive mounting member attached to a side surface of the substrate, at least a portion of the mounting member functioning as the side detection electrode portion.

8. The input device according to claim 1, wherein a plurality of side detection electrodes are formed at a distance from each other on the side surface.

9. An input device according to any one of claims 1 to 8, wherein the main surface side detection electrode portion and the side surface side detection electrode portion are formed by depositing a conductive metal film.

10. An input device according to any one of claims 1 to 8, comprising a housing, the substrate being housed in the housing, and the side detection electrode portion being capable of detecting an operation from the side of the housing.

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