Support structure of electronic device, electronic device comprising same, and method for manufacturing support structure of electronic device

Abstract

According to an embodiment, a support structure of an electronic device may comprise: a metal plate that forms a base of the support structure; a weld bead bonded to the metal plate; and a laminated layer that surrounds at least a portion of the outer surface of the weld bead, and is made of a material having a lower density than that of the weld bead.

Description

Support structure of an electronic device, an electronic device including the same, and a method for manufacturing the support structure of an electronic device

[0001] The disclosure below relates to a support structure for an electronic device, an electronic device including the same, and a method for manufacturing the support structure for an electronic device.

[0002] Electronic devices have evolved with technological advancements, becoming slimmer and lighter, while simultaneously improving their performance and enabling them to perform a variety of functions. To achieve this slimming, their supporting structures (e.g., frames) can be made thinner. Research is underway to create thinner supporting structures while still allowing the necessary components to be installed within them.

[0003] The related art mentioned above is possessed or acquired in the process of deriving the present disclosure and cannot necessarily be said to be prior art disclosed to the general public prior to the filing of the present disclosure.

[0004] According to one embodiment, a support structure of an electronic device may include a metal plate forming a base of the support structure, a weld bead bonded to the metal plate, and a laminated layer formed of a material having a lower density than the weld bead and surrounding at least a portion of an outer surface of the weld bead.

[0005] According to one embodiment, an electronic device may include a front plate forming a front surface of the electronic device, a rear plate forming a rear surface of the electronic device, and a support structure disposed between the front plate and the rear plate. For example, the support structure may include a metal plate forming a base of the support structure, a weld bead bonded to the metal plate, and a laminated layer formed of a material having a lower density than the weld bead and surrounding at least a portion of an outer surface of the weld bead.

[0006] According to one embodiment, a method for manufacturing a support structure of an electronic device may include an operation of forming a weld bead by using a welding method on a metal plate forming a base of the support structure, and an operation of forming a laminated layer formed of a material having a lower density than the weld bead and surrounding at least a portion of an outer surface of the weld bead by inserting the metal plate on which the weld bead is formed into a mold by an insert injection molding method.

[0007] The above and other aspects, features and advantages according to specific embodiments of the present disclosure will become more apparent from the detailed description below with reference to the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0009] FIG. 2 is a front perspective view of an electronic device according to one embodiment.

[0010] FIG. 3 is a rear perspective view of an electronic device according to one embodiment.

[0011] Figure 4 is an exploded perspective view of an electronic device according to one embodiment.

[0012] FIG. 5 is a plan view showing the internal structure of an electronic device according to one embodiment.

[0013] Figure 6 is a cross-sectional view taken along the cut line II of Figure 5.

[0014] Figure 7 is a cross-sectional view of a support structure according to one embodiment.

[0015] Figure 8 is a cross-sectional view of a support structure according to one embodiment.

[0016] Fig. 9 is a cross-sectional view taken along the cut line II-II of Fig. 5.

[0017] Fig. 10 is a cross-sectional view taken along the cut line III-III of Fig. 5.

[0018] FIG. 11 is a flowchart illustrating a method for manufacturing a support structure of an electronic device according to one embodiment.

[0019] FIG. 12 is a cross-sectional view showing a method for manufacturing a support structure of an electronic device according to one embodiment.

[0020] FIG. 13 is a flowchart illustrating a method for manufacturing a support structure of an electronic device according to one embodiment.

[0021] FIG. 14 is a cross-sectional view showing a method for manufacturing a support structure of an electronic device according to one embodiment.

[0022] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0023]

[0024] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0025] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0026] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0027] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0028] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0029] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0030] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0031] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0032] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0033] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0034] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0035] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0036] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0037] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0038] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0039] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0040] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0041] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0042] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 eB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0043] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0044] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0045] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0046] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0047] Electronic devices according to the embodiments may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0048] The embodiments and terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to encompass various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0049] The term "module" used in the embodiments may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0050] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0051]

[0052] FIG. 2 is a front perspective view of an electronic device according to one embodiment. FIG. 3 is a rear perspective view of an electronic device according to one embodiment. FIG. 4 is an exploded perspective view of an electronic device according to one embodiment.

[0053] Referring to FIGS. 2 to 4, an electronic device (e.g., the electronic device (101) of FIG. 1) may include a housing structure forming a first side (or front side), a second side (or back side), and a side surface surrounding a space between the first side and the second side. It should be noted that the shape of the housing structure illustrated in the drawings is exemplary.

[0054] An electronic device (201) according to one embodiment may include a housing structure (210) that forms an exterior and accommodates components therein. The housing structure (210) may form a front surface (210a) (e.g., a surface facing the +Z direction), a rear surface (210b) (e.g., a surface facing the -Z direction), and a side surface (211c) that surrounds an internal space between the front surface (210a) and the rear surface (210b). In one embodiment, the housing structure (210) may form the side surface (211c) through a first side surface (211c-1) (e.g., a surface facing the -Y direction), a second side surface (211c-2) (e.g., a surface facing the +Y direction), a third side surface (211c-3) (e.g., a surface facing the +X direction), and a fourth side surface (211c-4) (e.g., a surface facing the -X direction) connecting the front surface (210a) and the rear surface (210b).

[0055] In one embodiment, the front side (210a) may be formed by a front plate (211a) that is at least partially substantially transparent. For example, the front plate (211a) may comprise a glass plate or a polymer plate including at least one coating layer. In one embodiment, the back side (210b) may be formed by a substantially opaque back plate (211b). For example, the back plate (211b) may be formed by a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, magnesium, or a combination thereof), or a combination thereof. In one embodiment, the side side (211c) may be formed by a support structure (240) that is joined to the front plate (211a) and the back plate (211b) and includes a metal and / or a polymer. In one embodiment, the back plate (211b) and the support structure (240) may be formed seamlessly as one body. In one embodiment, the back plate (211b) and the support structure (240) may be formed of substantially the same material (e.g., aluminum).

[0056] In one embodiment, the front plate (211a) may include a plurality of first edge regions (212a-1) facing one direction (e.g., + / - X direction) and extending from at least a portion of the front surface (210a) to the back plate (211b) and having rounded surfaces, a plurality of second edge regions (212a-2) facing another direction (e.g., + / - Y direction) and extending from at least a portion of the front surface (210a) to the back plate (211b) and having rounded surfaces, and a plurality of third edge regions (212a-3) extending from at least a portion of the front surface (210a) to the back plate (211b) and having rounded surfaces, and positioned between the plurality of first edge regions (212a-1) and the plurality of second edge regions (212a-2).

[0057] In one embodiment, the back plate (211b) may include a plurality of fourth edge regions (212b-1) facing one direction (e.g., + / - X direction) and extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface, a plurality of fifth edge regions (212b-2) facing another direction (e.g., + / - Y direction) and extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface, and a plurality of sixth edge regions (212b-3) extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface and positioned between the plurality of fourth edge regions (212b-1) and the plurality of fifth edge regions (212b-2).

[0058] In one embodiment, the support structure (240) may surround at least a portion of the internal space between the front side (210a) and the back side (210b). In one embodiment, a display (261) may be positioned on one surface (e.g., in the +Z direction) of the support structure (240), and a back plate (211b) may be positioned on the other surface (e.g., in the -Z direction) of the support structure (240). In one embodiment, the support structure (240) may include a conductive portion. For example, at least a portion of the support structure (240) may be formed of a conductive material. In one embodiment, the support structure (240) may include a side frame (241) positioned on at least a portion of the side surface (211c), and a middle frame (242) connected to the side frame (241) and forming a space for arranging components of the electronic device (201).

[0059] In one embodiment, the side frame (241) may connect the edges of the front plate (211a) and the rear plate (211b) and surround the space between the front plate (211a) and the rear plate (211b) to form a side surface (211c) of the housing structure (210). In one embodiment, the middle frame (242) may be disposed inside (or a body portion) of the electronic device (201). The side frame (241) and the middle frame (242) may be formed integrally, or may be formed separately and connected to each other. In one embodiment, the side frame (241) and the middle frame (242) may include a conductive portion. For example, the side frame (241) may be formed of a metal and / or a conductive polymer material. In one embodiment, the middle frame (242), like the side frame (241), may be formed of a metal and / or a conductive polymer material. For example, the middle frame (242) may include slots (242a, 242b, 242c) and bulkheads (242-1, 242-2). For example, the slots (242a, 242b, 242c) may provide a space in which at least one component (e.g., a first circuit board (251), a second circuit board (252), or a battery (289)) may be mounted.

[0060] According to one embodiment, the bulkheads (242-1, 242-2) may surround at least a portion of an electronic component (e.g., a first circuit board (251), a second circuit board (252), or a battery (289)) accommodated inside the electronic device (201). For example, the bulkheads (242-1, 242-2) may include a first bulkhead (242-1) surrounding a first side (e.g., a + Y direction) of the battery (289), and a second bulkhead (242-2) surrounding a second side (e.g., a - Y direction) of the battery (289).

[0061] For example, the first bulkhead (242-1) may be positioned between the battery slot (242c) in which the battery (289) is accommodated and the first substrate slot (242a) in which the first circuit board (251) is accommodated. For example, the second bulkhead (242-2) may be positioned between the battery slot (242c) and the second substrate slot (242b) in which the second circuit board (252) is accommodated.

[0062] In one embodiment, the electronic device (201) may include a display (261) (e.g., the display module (160) of FIG. 1). In one embodiment, the display (261) may be located on the front surface (210a) of the electronic device (201). In one embodiment, the display (261) may be exposed through at least a portion of the front plate (211a) (e.g., the first edge regions (212a-1), the second edge regions (212a-2), and the third edge regions (212a-3)). In one embodiment, the display (261) may have a shape substantially the same as the outer contour shape of the front plate (211a). Although not shown in the drawing, the display (261) according to one embodiment may include a touch screen panel (TSP), a pressure sensor, and / or a digitizer (not shown) for detecting a stylus pen.

[0063] In one embodiment, the display (261) may include a screen display area (261a) that is visually exposed to the outside of the electronic device (201) and displays content through pixels or a plurality of cells. In one embodiment, the screen display area (261a) may include a sensing area (261a-1) and a camera area (261a-2). The sensing area (261a-1) may overlap at least a portion of the screen display area (261a). The sensing area (261a-1) may allow transmission of an input signal related to a sensor module (e.g., the sensor module (176) of FIG. 1). The sensing area (261a-1) may display content together with a screen display area (261a) that does not overlap with the sensing area (261a-1).

[0064] In one embodiment, the camera area (261a-2) may overlap at least a portion of the screen display area (261a). The camera area (261a-2) may expose a lens of a first camera module (280a) (e.g., camera module (180) of FIG. 1) positioned to face the front of the electronic device (201). For example, the camera area (261a-2) may allow transmission of an optical signal (e.g., light) associated with the first camera module (280a). In one embodiment, the camera area (261a-2) may display content similarly to the screen display area (261a) that does not overlap the camera area (261a-2). For example, the camera area (261a-2) may display content while the first camera module (280a) is not operating.

[0065] In one embodiment, the electronic device (201) may include a sensor module (276). The sensor module (276) may sense a signal applied to the electronic device (201). The sensor module (276) may be located, for example, on the front surface (210a) of the electronic device (201). The sensor module (276) may be arranged in the electronic device (201) to correspond to a sensing area (261a-1) of a screen display area (261a). For example, the sensor module (276) may be arranged to perform its function without being visually exposed through the display (261) in an internal space of the electronic device (201). The sensor module (276) may receive an input signal penetrating the sensing area (261a-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). As another example, the input signal may include a signal relating to the user's biometric information (e.g., the user's fingerprint or voice).

[0066] In one embodiment, the electronic device (201) may include a camera module (280a, 280b) (e.g., the camera module (180) of FIG. 1). In one embodiment, the camera modules (280a, 280b) may include a first camera module (280a) and a second camera module (280b). In one embodiment, the electronic device (201) may include a flash (280c) disposed near the first camera module (280a) and the second camera module (280b).

[0067] In one embodiment, the first camera module (280a) is disposed on the front side (210a) of the housing structure (210) such that its lens is exposed, and can receive an optical signal from the front side (e.g., +Z direction) of the electronic device (201). The second camera module (280b) is disposed on the rear side (210b) of the housing structure (210) such that its lens is exposed, and can receive an optical signal from the rear side (e.g., -Z direction) of the electronic device (201). In one embodiment, at least a portion of the first camera module (280a) may be disposed on the housing structure (210) such that it is covered by the display (261). For example, the first camera module (280a) may include an under-display camera (UDC). In one embodiment, the first camera module (280a) may receive an optical signal that passes through the camera area (261a-2). In one embodiment, the second camera module (280b) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). In one embodiment, the flash (280c) may include a light-emitting diode or a xenon lamp.

[0068] In one embodiment, the electronic device (201) may include an input module (250) (e.g., the input module (150) of FIG. 1). The input module (250) may receive an operation signal from a user. For example, the input module (250) may include at least one key input device that is positioned so as to be exposed on a side surface (211c) of the housing structure (210).

[0069] In one embodiment, the electronic device (201) may include a connection terminal (278) (e.g., connection terminal (178) of FIG. 1). In one embodiment, the connection terminal (278) may be disposed on an outer surface of the housing structure (210). The electronic device (201) may be wired to an external device (e.g., another electronic device or an external power source) through the connection terminal (278).

[0070] In one embodiment, the electronic device (201) may include one or more printed circuit boards. For example, the electronic device (201) may include a first circuit board (251) (or a main circuit board) and a second circuit board (252) (or a sub-circuit board). The first circuit board (251) and the second circuit board (252) may be disposed inside the electronic device (201), for example, in a middle frame (242). At least one circuit board (251, 252) may be connected to the middle frame (242) via a ground. In one embodiment, the first circuit board (251) may be accommodated in a first substrate slot (242a) of the middle frame (242). In one embodiment, the second circuit board (252) may be accommodated in a second substrate slot (242b) of the middle frame (242). In one embodiment, the circuit board (251, 252) may be a rigid printed circuit board (PCB) or a flexible printed circuit board (FPCB) that is at least partially bendable.

[0071] In one embodiment, the electronic device (201) may include a battery (289) disposed internally. The battery may be disposed in a battery slot (242c) formed in the middle frame (242).

[0072] Meanwhile, the embodiments can be applied to electronic devices of various shapes / forms (e.g., foldable electronic devices, slideable electronic devices, rollable electronic devices, digital cameras, digital video cameras, tablets, note-shaped electronic devices, and other electronic devices) in addition to the electronic devices illustrated in FIGS. 2 to 4.

[0073]

[0074] FIG. 5 is a plan view showing the internal structure of an electronic device according to one embodiment.

[0075] Referring to FIG. 5, an electronic device according to an embodiment (e.g., the electronic device (101) of FIG. 1 or the electronic device (201) of FIG. 2) may include a support structure (540) (e.g., the support structure (240) of FIG. 4), a circuit board (551, 552) (e.g., the first circuit board (251) or the second circuit board (252) of FIG. 4), a terminal (552-1), a camera module (580) (e.g., the first camera module (280a) of FIG. 2 or the second camera module (280b) of FIG. 3)), and a fastener (F).

[0076] According to one embodiment, the support structure (540) may include a side frame (541) (e.g., the side frame (241) of FIG. 4) and a middle frame (542) (e.g., the middle frame (242) of FIG. 4). In this document, it is noted that a part of the support structure (540) (e.g., the side frame (541), the middle frame (542) or a part thereof) may also be referred to as a “support structure.” For example, the side frame (541) may be disposed on a side of the electronic device (500). For example, the side frame (541) may interconnect a front plate (not shown) (e.g., the front plate (211a) of FIG. 2) and a rear plate (not shown) (e.g., the rear plate (211b) of FIG. 3). For example, the middle frame (542) may be placed between a display (not shown) (e.g., display (261) of FIG. 4) and a rear plate (e.g., rear plate (211b) of FIG. 4).

[0077] According to one embodiment, the middle frame (542) may include a partition wall (W) (e.g., the first partition wall (242-1) or the second partition wall (242-2) of FIG. 4). For example, the partition wall (W) may surround at least a portion of an electronic component (e.g., a circuit board (551, 552), a camera module (580), or a battery (289) of FIG. 4) accommodated inside the electronic device (500). For example, the partition wall (W) may improve the durability of the electronic device (500) by allowing the electronic component described above to maintain a constant position. For example, the partition wall (W) may be formed to protrude in a direction perpendicular to the surface of the middle frame (542) (e.g., the + Z direction). For example, the partition wall (W) may function as a reinforcing rib that reinforces the rigidity of the middle frame (542). For example, the bulkhead (W) may be formed linearly (e.g., straight or curved) along a direction (e.g., + / - X direction) across the surface of the middle frame (542).

[0078] According to one embodiment, the side frame (541) may include an antenna contact (C). One end of the antenna contact (C) may be in contact with a terminal (552-1) installed on a second circuit board (552), and the other end of the antenna contact (C) may be electrically and physically connected to the side frame (541). For example, the terminal (552-1) may be electrically connected to a wireless communication module (e.g., the wireless communication module (192) of FIG. 1). With this configuration, the antenna contact (C) may transmit a wireless communication signal from the wireless communication module to the side frame (541), thereby allowing the side frame (541) to function as an antenna. For example, the wireless communication module may be installed on the second circuit board (552).

[0079] According to one embodiment, the fastener (F) can secure an electronic component (e.g., a circuit board (551, 552) or a camera module (580)) accommodated inside the electronic device (500) to the middle frame (542). For example, an internal thread corresponding to the fastener (F) can be formed in the middle frame (542). Hereinafter, an exemplary structure of the internal thread formed in the middle frame (542) will be described.

[0080]

[0081] Figure 6 is a cross-sectional view taken along the cut line II of Figure 5.

[0082] Referring to FIG. 6, an electronic device (500) according to an embodiment (e.g., the electronic device (101) of FIG. 1 or the electronic device (201) of FIG. 2) may include a front plate (511a) (e.g., the front plate (211a) of FIG. 2), a support structure (540) (e.g., the support structure (240) of FIG. 4), a circuit board (551) (e.g., the first circuit board (251) or the second circuit board (252) of FIG. 4), a display (561) (e.g., the display (261) of FIG. 4), and a fastener (F). For example, the support structure (540) may include a side frame (541) (e.g., the side frame (241) of FIG. 4) and a middle frame (542) (e.g., the middle frame (242) of FIG. 4).

[0083] According to one embodiment, the fastener (F) may be fastened to a female screw thread (622) formed in the middle frame (542). For example, the fastener (F) may penetrate at least one electronic component (e.g., circuit board (551)) among a plurality of electronic components (e.g., circuit boards (551, 552) or camera modules (580)) arranged between a front plate (511a) and a rear plate (not shown) (e.g., rear plate (211b) of FIG. 4) and be fastened to the female screw thread (622). Through such a structure, the electronic component may be stably fixed within the electronic device.

[0084] According to one embodiment, the middle frame (542) may include a female screw thread (622) made of a rigid material that is lightweight overall and allows for repeated attachment and detachment of the fastener (F) by being formed of different materials. For example, the middle frame (542) may include a metal plate (610), a weld bead (620), and a laminated layer (630).

[0085] According to one embodiment, the metal plate (610) may form a base of the support structure (540). For example, the metal plate (610) may form a portion of the middle frame (542). The metal plate (610) may provide a surface on which a weld bead (620) is formed. For example, the thickness (t_s) of the metal plate (610) may be smaller than the height (t_b) of the weld bead (620). For example, the metal plate (610) may have a thin thickness of 2 mm or less (e.g., 0.4 to 0.8 mm), thereby reducing excessive weight of the middle frame (542) while increasing the rigidity of the middle frame (542) and, at the same time, making the middle frame (542) thinner may increase the space for accommodating electronic components inside the electronic device. For example, the metal plate (610) may be formed by a rolling process, but is not limited thereto. The rolling process has an economic advantage because it can continuously mass-produce the metal plate (610) compared to the casting process and can be performed with relatively simple equipment. In addition, in the case of the casting process, smut occurs during the anodizing treatment, requiring an additional process, and it is difficult to process a thin metal plate (610) compared to the rolling process. Therefore, the convenience of processing is increased and the entire electronic product can be made slimmer when using the rolling process. Meanwhile, it should be noted that the thickness and / or manufacturing method of the metal plate (610) described above are only examples. It should be noted that the thickness of the metal plate (610) may exceed 2 mm unless otherwise stated. For example, the metal plate (610) may be formed of a material that can be anodized (e.g., aluminum), but is not limited thereto. Through anodizing, the corrosion resistance, heat resistance, and hardness of the metal plate (610) may be improved.

[0086] According to one embodiment, a welding bead (620) may be joined to a metal plate (610). For example, the welding bead (620) may refer to a convex portion formed at a welded portion during a welding operation. For example, when a welding operation is performed using an aluminum wire, a welding bead (620) made of aluminum may be formed on the metal plate (610). For example, the height (t_b) of the welding bead (620) may be 4 to 5 mm, but is not limited thereto. For example, the height (t_b) of the welding bead (620) may be 5 times or more (e.g., 10 times) the thickness (t_s) of the metal plate (610), but is not limited thereto. For example, after the welding bead (620) is formed to have a sufficient height on the metal plate (610), it may be processed to fit the shape of the final result to be formed. Meanwhile, through burring processing, a part of the metal plate (610) can be formed to protrude from the metal plate (610), but in the case of burring processing, there is a problem that the height of the protruding part is limited to a level equivalent to the thickness of the metal plate (610). However, according to one embodiment, the above-described height limitation can be relaxed, so that more diverse parts (e.g., female screw thread (622), bulkhead (e.g., bulkhead (W) of FIG. 5), or antenna contact (e.g., antenna contact (C) of FIG. 5)) can be formed using the welding bead (620). For example, the welding bead (620) can be formed of metal. For example, the welding bead (620) can be formed of a material that can be anodized (e.g., aluminum). According to this configuration, while a welding bead (620) is formed on a metal plate (610), the metal plate (610) and the welding bead (620) can be anodized simultaneously. For example, the welding bead (620) can include a bead body (621), a female screw thread (622), and a surface treatment layer (623).

[0087] According to one embodiment, the bead body (621) may be bonded to a metal plate (610). The outer surface of the bead body (621) may have a shape corresponding to a portion of a spherical shape, for example, as illustrated in FIG. 6, but is not limited thereto. For example, the outer surface of the bead body (621) may be processed while the bead body (621) is bonded to the metal plate (610).

[0088] According to one embodiment, the female thread (622) may be formed on the inner surface of the bead body (621). For example, the female thread (622) may be exposed to the outside of the laminated layer (630) and may be fastened to the fastener (F). When the female thread (622) is formed on the inner surface of the bead body (621) by processing a weld bead (620) made of a rigid material (e.g., metal), the female thread (622) may have higher rigidity than a female thread formed of a synthetic resin. For example, Rockwell hardness is used as a method of measuring the hardness of a material, and there are various hardness scales depending on the material. The difference in the measured values ​​of the Rockwell hardness of the two materials is very large, such that synthetic resins are measured on the E, M, or R scale, and metals are measured on the B or C scale. In addition, the tensile strength of polybutylene terephthalate (PBT), a synthetic resin that can be used as a material for the laminated layer (630), is 98 Mpa, whereas the tensile strength of aluminum, a metal that can be used as a material for the welding bead (620), is about 255 Mpa. In this way, when the female screw thread (622) is formed on the inner surface of the bead body (621), the female screw thread (622) can have higher hardness and higher strength than when the female screw thread is formed on the laminated layer (630), so that the number of times that the fastener (F) can be repeatedly attached and detached to the female screw thread (622) can increase. For example, even if only some parts in the electronic device are damaged, if the female screw thread for fixing the some parts is damaged, not only the some parts but also the middle frame (542) on which the damaged female screw thread is formed may have to be replaced. In one embodiment, the use of a female screw thread (622) made of a rigid material can increase the possibility of rework, thereby reducing the above-described problems and reducing the maintenance and repair costs of the electronic device.

[0089] Meanwhile, instead of machining the female screw thread (622) on the weld bead (620), a method of increasing the possibility of reworking by insert injection molding a brass nut in the operation of forming the laminated layer (630) may be considered. However, brass nuts have the disadvantage of not being able to be anodized. Meanwhile, instead of the weld bead (620), the female screw thread may be formed by insert injection molding an aluminum boss together with a metal plate (610) and then machining the aluminum boss. However, considering the number of female screw threads (e.g., 20) to be formed within the middle frame (542), an increase in material cost is inevitable, and thus, this method is less economical than the embodiment.

[0090] According to one embodiment, the surface treatment layer (623) may be formed on the outer surface of the weld bead (620). For example, the surface treatment layer (623) may be understood as an anodized portion of the outer surface of the weld bead (620). For example, the surface treatment layer (623) may be an oxide coating. For example, a portion of the upper side of the weld bead (620) may be cut to be exposed to the outside, and the upper surface of the weld bead (620) exposed to the outside may be anodized, thereby forming the surface treatment layer (623).

[0091] According to one embodiment, the laminated layer (630) may surround at least a portion of the outer surface of the weld bead (620) and / or the metal plate (610). For example, the laminated layer (630) may be formed of a material (e.g., synthetic resin) having a lower density than the weld bead (620) and / or the metal plate (610). With this configuration, the rigidity of the middle frame (542) can be increased using the metal plate (610), while the overall shape of the middle frame (542) can be formed through the laminated layer (630), thereby reducing excessive weight increase of the middle frame (542). For example, the laminated layer (630) may be formed of a material that is more flexible than the weld bead (620). With this configuration, the area where electronic components placed inside the electronic device directly contact the rigid weld bead (620) can be reduced, thereby reducing the problem of damage to the electronic components. For example, the laminated layer (630) may be formed of an insulating material. With this configuration, since the middle frame (542) itself can function as an insulator, the problem of short-circuits occurring between electronic components placed on the middle frame (542) can be reduced. For example, the laminated layer (630) is formed to surround at least a portion of the outer surface of the weld bead (620), so that even if the weld bead (620) is formed irregularly, a portion of the weld bead (620) other than a necessary portion can be covered so that it is not exposed to the outside.

[0092] Meanwhile, FIG. 6 illustrates an example in which a welding bead (620) is formed at a position corresponding to a fastening hole (F) for fixing a circuit board (551), but it should be noted that the welding bead (620) may be formed at a position corresponding to a fastening hole (F) for fixing electronic components other than the circuit board (551) (e.g., a fastening hole (F) of FIG. 5).

[0093]

[0094] Figure 7 is a cross-sectional view of a support structure according to one embodiment.

[0095] Referring to FIG. 7, a support structure (700) according to one embodiment (e.g., support structure (240) of FIG. 4 or support structure (540) of FIG. 5) may form a portion of a middle frame (e.g., middle frame (242) of FIG. 4 or middle frame (542) of FIG. 5). For example, the support structure (700) may include a metal plate (710) (e.g., metal plate (610) of FIG. 6), a weld bead (720) (e.g., weld bead (620) of FIG. 6), and a laminated layer (730) (e.g., laminated layer (630) of FIG. 6). For example, the weld bead (720) may include a bead body (721) (e.g., bead body (621) of FIG. 6) and a female thread (722) (e.g., female thread (622) of FIG. 6).

[0096] According to one embodiment, the laminated layer (730) may be formed to completely surround the outer surface of the bead body (721). For example, among the welding bead (720), the remaining portion except for the female screw thread (722) formed on the inner surface of the bead body (721) may not be exposed to the outside of the laminated layer (730). For example, the laminated layer (730) may include a communication hole (730a) that mutually connects the female screw thread (722) and the outside.

[0097] According to one embodiment, a female screw thread may be formed on the inner wall of the communication hole (730a). The female screw thread formed on the inner wall of the communication hole (730a) may be referred to as an "additional screw thread" to distinguish it from the female screw thread (722) formed on the inner wall of the bead body (721). For example, the additional screw thread may have a shape that is continuously connected to the female screw thread (722) of the weld bead (720). Meanwhile, it should be noted that, unlike as illustrated, a female screw thread may not be formed on the communication hole (730a).

[0098]

[0099] Figure 8 is a cross-sectional view of a support structure according to one embodiment.

[0100] Referring to FIG. 8, a support structure (800) according to one embodiment (e.g., support structure (240) of FIG. 4, support structure (540) of FIG. 5, or support structure (700) of FIG. 7) may form a portion of a middle frame (e.g., middle frame (242) of FIG. 4, or middle frame (542) of FIG. 5). For example, the support structure (800) may include a metal plate (810) (e.g., metal plate (610) of FIG. 6 or metal plate (710) of FIG. 7), a weld bead (820) (e.g., weld bead (620) of FIG. 6 or weld bead (720) of FIG. 7), and a laminated layer (830) (e.g., laminated layer (630) of FIG. 6 or laminated layer (730) of FIG. 7). For example, the weld bead (820) may include a bead body (821) (e.g., bead body (621) of FIG. 6 or bead body (721) of FIG. 7) and a female thread (822) (e.g., female thread (622) of FIG. 6 or female thread (722) of FIG. 7).

[0101] According to one embodiment, the metal plate (810) may include a multi-layer portion (M) having a plurality of plate layers (811, 812). For example, the multi-layer portion (M) may overlap a weld bead (820) in a direction perpendicular to the metal plate (810) (e.g., + / - Z direction). With such a structure, the thickness of a portion of the metal plate (810) where the weld bead (820) is formed can be increased, thereby reducing the possibility of the metal plate (810) being pierced during a welding process to form the weld bead (820) in the metal plate (810).

[0102] For example, the multi-layer portion (M) may be formed by bending a portion of a metal plate (810). For example, the metal plate (810) may include a first plate layer (811) to which a weld bead (820) is joined, a second plate layer (812) in surface contact with the first plate layer (811), and a bend portion (813) which is a bent portion between the first plate layer (811) and the second plate layer (812). For example, the second plate layer (812) may overlap the first plate layer (811) and the weld bead (820) in a direction perpendicular to the second plate layer (812) (e.g., + / - Z direction). Meanwhile, although the welding bead (820) is exemplarily shown as being formed on the first plate layer (811), the welding bead (820) may alternatively be formed on the second plate layer (812). In this case, the laminated layer (830) may be formed across the second plate layer (812) and the first plate layer (811). With this structure, the step between the first plate layer (811) and the second plate layer (812) may be covered by the laminated layer (830), so that the outer surface of the support structure (800) may be flat.

[0103]

[0104] In the following embodiments, components that have common functions will be described using the same names. Even if there is no explicit description, unless there is a description to the contrary, the description described in one embodiment can be applied to other embodiments, and a specific description will be omitted to the extent of overlap. For example, the embodiment of any one of the drawings among FIGS. 9 to 14 below can be combined with the embodiment of other drawings including FIGS. 9 to 14. For example, it should be noted that the multi-layer portion (M) described in FIG. 8 can be applied to the metal plate (910) of FIG. 9, the metal plate (1010) of FIG. 10, the metal plate (1210) of FIG. 12, or the metal plate (1410) of FIG. 14.

[0105]

[0106] Fig. 9 is a cross-sectional view taken along the cut line II-II of Fig. 5.

[0107] Referring to FIG. 9, an electronic device (500) according to an embodiment (e.g., the electronic device (101) of FIG. 1 or the electronic device (201) of FIG. 2) may include a front plate (511a) (e.g., the front plate (211a) of FIG. 2), a support structure (542) (e.g., the middle frame (242) of FIG. 4), and a display (561) (e.g., the display (261) of FIG. 4). According to an embodiment, the support structure (542) may include a metal plate (910), a weld bead (920), and a laminated layer (930).

[0108] According to one embodiment, the weld bead (920) may be formed to protrude in a direction perpendicular to the surface of the metal plate (910) (e.g., in the - Z direction). For example, the weld bead (920) may have a linear shape (e.g., a straight shape or a curved shape) when viewed in a direction perpendicular to the surface of the metal plate (910) (e.g., the + / - Z direction). For example, the weld bead (920) may form a part of a partition wall (W) of the electronic device (500) (e.g., the partition walls 242-1 and 242-2 of FIG. 4 or the partition wall (W) of FIG. 5). For example, the weld bead (920) may be formed of a material (e.g., metal) that is stiffer than the rest of the partition wall (W), thereby reinforcing the stiffness of the partition wall (W).

[0109] According to one embodiment, the laminated layer (930) may be formed to surround at least a portion of the metal plate (910) and the weld bead (920). For example, the laminated layer (930) may include a horizontal portion (931) formed in a direction parallel to the metal plate (910) (e.g., + / - Y direction) and surrounding at least a portion of the metal plate (910), and a vertical portion (932) formed in a direction perpendicular to the metal plate (910) (e.g., + / - Z direction) and surrounding at least a portion of the weld bead (920). For example, the weld bead (920) may not be exposed to the outside of the laminated layer (930), but is not limited thereto. For example, the vertical portion (932) may be formed to be higher than the height of the weld bead (920) and thicker than the thickness of the weld bead (920). For example, by preventing a welding bead (920) formed of a rigid material (e.g., metal) from being exposed to the outside of the laminated layer (930), the problem of the welding bead (920) interfering with electronic components placed around the bulkhead (W), thereby causing damage to the electronic components, can be reduced.

[0110] According to one embodiment, the bulkhead (W) may surround at least a portion of an electronic component (e.g., a circuit board (251, 252) of FIG. 4, a battery (289), or a circuit board (551, 552) of FIG. 5) housed inside an electronic device (500). For example, the bulkhead (W) may be understood to be formed by a vertical portion (932) of a laminated layer (930) and a weld bead (920).

[0111]

[0112] Figure 10 is a cross-sectional view taken along the cut line III-III of Figure 5.

[0113] Referring to FIG. 10, an electronic device (500) according to an embodiment (e.g., the electronic device (101) of FIG. 1 or the electronic device (201) of FIG. 2) may include a front plate (511a) (e.g., the front plate (211a) of FIG. 2), a support structure (540) (e.g., the support structure (240) of FIG. 4), a circuit board (552) (e.g., the first circuit board (251) or the second circuit board (252) of FIG. 4), a terminal (552-1), and a display (561) (e.g., the display (261) of FIG. 4). For example, the support structure (540) may include a side frame (541) (e.g., the side frame (241) of FIG. 4) and a middle frame (542) (e.g., the middle frame (242) of FIG. 4). For example, the side frame (541) may include a metal plate (1010) (e.g., metal plate (610) of FIG. 6), a weld bead (C) (e.g., weld bead (620) of FIG. 6), and a laminated layer (1030) (e.g., laminated layer (630) of FIG. 6). For example, the metal plate (1010) may form at least a portion of the side frame (541).

[0114] According to one embodiment, the terminal (552-1) may be installed on the circuit board (552) and electrically connected to a wireless communication module (e.g., the wireless communication module (192) of FIG. 1). For example, the wireless communication module may be installed on the circuit board (552) and support wireless communication between the electronic device (500) and an external electronic device (e.g., the electronic device (102) of FIG. 1).

[0115] According to one embodiment, the weld bead (C) can function as an antenna contact that transmits a signal to the side frame (541). For example, one end of the weld bead (C) can be exposed to the outside of the laminated layer (1030). Through this structure, one end of the weld bead (C) can have a structure that can contact a terminal. For example, the other end of the weld bead (C) can be electrically and physically connected to the metal plate (1010). Through this structure, the weld bead (C) can transmit a wireless communication signal from the wireless communication module to the metal plate (1010), thereby allowing the side frame (541) to function as an antenna.

[0116]

[0117] FIG. 11 is a flowchart illustrating a method for manufacturing a support structure of an electronic device according to an embodiment. FIG. 12 is a cross-sectional view illustrating a method for manufacturing a support structure of an electronic device according to an embodiment.

[0118] Referring to FIGS. 11 and 12 , a method for manufacturing a support structure (1200) (e.g., support structure (240) of FIG. 4 , support structure (540) of FIG. 5 , support structure (700) of FIG. 7 , support structure (800) of FIG. 8 , support structure (700) of FIG. 7 , support structure (800) of FIG. 8 , or middle frame (542) of FIG. 9 , or side frame (541) of FIG. 10 ) of an electronic device (e.g., electronic device (101) of FIG. 1 , electronic device (201) of FIG. 2 , or electronic device (500) of FIG. 5 ) according to an embodiment may include an operation (1110) of forming a welding bead on a metal plate, an operation (1120) of forming a laminated layer, and an operation (1130) of processing the welding bead. Meanwhile, it should be noted that, unless otherwise stated, the order of the above-described operations is not necessarily limited to that illustrated in FIG. 11. For example, as described below, the operation (1120) of forming a laminated layer may be performed after the operation (1130) of processing a welding bead, and some operations may be omitted or some operations may be added.

[0119] According to one embodiment, in operation 1110, the metal plate (1210) (e.g., the metal plate (610) of FIG. 6 , the metal plate (610) of FIG. 6 , the metal plate (710) of FIG. 7 , the metal plate (810) of FIG. 8 , the metal plate (910) of FIG. 9 , or the metal plate (1010) of FIG. 10 ) may be formed, for example, by a rolling process. By such a process, a metal plate (1210) having a continuously thin thickness can be formed in a relatively inexpensive and simple manner compared to a casting process. Meanwhile, unless otherwise stated, it is to be noted that the metal plate (1210) may also be formed by a casting process. For example, in operation 1110, a multi-layer portion (e.g., a multi-layer portion (M) of FIG. 8) may be formed by bending a portion of a metal plate (1210) through sheet metal working. The multi-layer portion may reduce the possibility of the thin metal plate (1210) being pierced during the welding process. For example, it should be noted that the multi-layer may be formed by stacking a plurality of metal plates (1210) rather than by bending. For example, the metal plate (1210) may form a base of a support structure (1200) of an electronic device. For example, the support structure (1200) may form a portion of a middle frame (e.g., the middle frame (242) of FIG. 4, or the middle frame (542) of FIG. 5).

[0120] According to one embodiment, in operation 1110, a weld bead (1220) (e.g., a weld bead (620) of FIG. 6 , a weld bead (720) of FIG. 7 , a weld bead (820) of FIG. 8 , a weld bead (920) of FIG. 9 , or a weld bead (C) of FIG. 10 ) may be formed on a metal plate (1210) using a welding method (e.g., see (A) of FIG. 12 ). For example, the weld bead (1220) may include a bead body (1221) (e.g., a bead body (621) of FIG. 6 , a bead body (721) of FIG. 7 , or a bead body (821) of FIG. 8 ) and a female thread (1222) (e.g., a female thread (622) of FIG. 6 , a female thread (722) of FIG. 7 , or a female thread (822) of FIG. 8 ). For example, the welding method may include, but is not limited to, gas welding, arc welding, electric resistance welding (ERW), friction welding, friction stir welding (FSW), ultrasonic welding, thermite welding, laser welding, and / or 3D printing welding and / or electron beam welding (EBW). It is to be noted that the welding method according to one embodiment may include any method that can form a welding bead (1220) to be joined on a metal plate (1210). For example, when using an arc welding method or a laser welding method, it has been experimentally confirmed that by increasing the current and / or voltage applied to the welding tool, a weld bead (1220) having a thickness (e.g., 8 mm or more) and height (e.g., 3.6 mm or more) sufficient to form the final result can be formed.

[0121] According to one embodiment, in operation 1120, a laminated layer (1230) (e.g., laminated layer (630) of FIG. 6 , laminated layer (730) of FIG. 7 , laminated layer (830) of FIG. 8 , laminated layer (930) of FIG. 9 , or laminated layer (1030) of FIG. 10 ) may be formed by inserting a metal plate (1210) on which a weld bead (1220) is formed into a mold by insert injection molding (e.g., see (B) of FIG. 12 ). For example, the laminated layer (1230) may be formed to surround at least a portion of an outer surface of the weld bead (1220). For example, the laminated layer (1230) may be formed of a material (e.g., a synthetic resin) having a lower density than a material (e.g., a metal) forming the weld bead (1220). In this manner, the rigidity of the resulting product can be locally increased in comparison to cases where a metal plate without a weld bead (1220) is insert-injected. Accordingly, by forming a necessary component (e.g., a female screw thread) in a locally increased rigidity area, i.e., a portion where a weld bead (1220) is formed, the rigidity of a portion of the entire product (e.g., an electronic device) requiring high rigidity can be increased, and as a result, the durability and expected life of the entire product can be increased.

[0122] According to one embodiment, in operation 1130, a weld bead (1220) may be machined to form a female thread (1222) on the inner surface of the weld bead (1220) (e.g., see (C) of FIG. 12). For example, operation 1130 may be performed after operation 1120 of forming a laminated layer.

[0123] For example, a weld bead (1220) may be machined through the laminated layer (1230) by drilling (e.g., CNC machining). For example, a continuous female screw thread (1222) may be formed on the inner surface of the laminated layer (1230) and the weld bead (1220).

[0124] For example, as shown in FIG. 6, the laminated layer (1230) and the weld bead (620) may be processed so that a portion of the weld bead (1220) (e.g., the weld bead (620) of FIG. 6) is exposed to the upper portion of the laminated layer (1230). In this manner, since the female screw thread (1222) is formed only on the inner surface of the weld bead (1220) formed of a rigid material (e.g., metal), the rigidity of the female screw thread (1222) may be increased.

[0125] According to one embodiment, a method for manufacturing a support structure of an electronic device may include an anodizing process for a metal plate (1210) on which a weld bead (1220) is formed. For example, the anodizing process described above may be performed before an operation of forming a female screw thread (1222) in the weld bead (1220), but is not limited thereto. According to the above-described order, it is possible to prevent a surface of the female screw thread (1222) from being anodized. For example, the anodizing process described above may be performed in a state in which an upper surface of the weld bead (1220) is cut so as to be exposed to the outside of the laminated layer (1230), but is not limited thereto.

[0126] According to one embodiment, a method for manufacturing a support structure of an electronic device may include an operation of processing a weld bead (1220) formed on a metal plate (1210). For example, the processing operation described above may be performed before performing an operation (1120) of forming a laminated layer, but is not limited thereto. According to the above-described sequence, even when the weld bead (1220) is formed to be larger than the design specification, the shape of the weld bead (1220) can be adjusted so that subsequent operations (e.g., operation 1120) can be performed smoothly.

[0127]

[0128] FIG. 13 is a flowchart illustrating a method for manufacturing a support structure of an electronic device according to one embodiment. FIG. 14 is a cross-sectional view illustrating a method for manufacturing a support structure of an electronic device according to one embodiment.

[0129] Referring to FIGS. 13 and 14 , a method for manufacturing a support structure (1400) (e.g., support structure (240) of FIG. 4 , support structure (540) of FIG. 5 , middle frame (542) of FIG. 9 , side frame (541) of FIG. 10 , or support structure (1200) of FIG. 12 ) of an electronic device (e.g., electronic device (101) of FIG. 1 , electronic device (201) of FIG. 2 , or electronic device (500) of FIG. 5 ) according to an embodiment may include an operation (1310) of forming a welding bead on a metal plate (e.g., operation 1110 of FIG. 11 ), an operation (1320) of processing the welding bead (e.g., operation 1130 of FIG. 11 ), and an operation (1330) of forming a laminated layer (e.g., operation 1120 of FIG. 11 ). Meanwhile, it should be noted that, unless otherwise stated, the order of the above-described operations is not necessarily limited to that illustrated in FIG. 13. For example, as described below, the operation (1320) of processing a welding bead may be performed after the operation (1330) of forming a laminated layer, and some operations may be omitted or some operations may be added.

[0130] Unless otherwise stated, it is to be understood that the contents of operations 1110, 1120, and 1130 of FIG. 11 can also be applied to operations 1310, 1330, and 1320 of FIG. 13, respectively, and any duplicate descriptions will be omitted. For example, the operation (1310) of forming a welding bead on a metal plate can be performed identically or similarly to operation 1110 of FIG. 11 (e.g., see (A) of FIG. 14).

[0131] According to one embodiment, in operation 1320, a weld bead (1420) (e.g., a weld bead (620) of FIG. 6, a weld bead (720) of FIG. 7, a weld bead (820) of FIG. 8, a weld bead (920) of FIG. 9, a weld bead (C) of FIG. 10, or a weld bead (1220) of FIG. 12) formed on a metal plate (1410) (e.g., a metal plate (610) of FIG. 6, a metal plate (710) of FIG. 7, a metal plate (810) of FIG. 8, a metal plate (910) of FIG. 9, a metal plate (1010) of FIG. 10, or a metal plate (1210) of FIG. 12)) may be processed (e.g., see (B) of FIG. 14). For example, operation 1320 may be performed prior to operation 1330 of forming a laminated layer (1430) (e.g., laminated layer 630 of FIG. 6, laminated layer 730 of FIG. 7, laminated layer 830 of FIG. 8, laminated layer 930 of FIG. 9, laminated layer 1030 of FIG. 10, or laminated layer 1230 of FIG. 12). For example, in operation 1320, the width of the weld bead (1420) may be reduced through cutting processing (e.g., CNC processing). For example, when forming a portion of a bulkhead (e.g., bulkheads 242-1 and 242-2 of FIG. 4, bulkhead (W) of FIG. 5, or bulkhead (W) of FIG. 9) using the weld bead (1420), the weld bead (1420) may be processed to be equal to or smaller than the width of the bulkhead. For example, the width of the weld bead (1420) can be reduced by cutting at least one or more of the left (e.g., + Y direction) and right (e.g., - Y direction) sides of the weld bead (1420). For example, when forming an antenna contact (e.g., antenna contact (C) of FIG. 5 or antenna contact (C) of FIG. 10) using the weld bead (1420), the weld bead (1420) can be processed to fit the shape of the antenna contact.

[0132] According to one embodiment, in operation 1330, a laminated layer (1430) may be formed by inserting a metal plate (1410) having a weld bead (1420) formed thereon into a mold using an insert injection molding method (e.g., see (C) of FIG. 14). For example, the laminated layer (1430) may be formed of a material more flexible than the weld bead (1420). With this configuration, the area in which an electronic component (e.g., a circuit board (251, 252) of FIG. 4, a battery (289) or a circuit board (551, 552) of FIG. 5) disposed inside an electronic device directly contacts the rigid weld bead (1420) and / or the metal plate (1410) is reduced, thereby reducing the problem of damage to the electronic component, while allowing the weld bead (1420) to function as a reinforcing material of a partition wall surrounding at least a portion of the electronic component. For example, the laminated layer (1430) may be formed of an insulating material. With this configuration, the portion of the weld bead (1420) except for the portion exposed to the outside is electrically insulated from the outside, thereby allowing the weld bead (1420) to function as a medium (e.g., antenna contact) that transmits electrical signals only to the necessary portion.

[0133] According to one embodiment, a method of manufacturing a support structure of an electronic device may include an operation of removing at least a portion of a laminated layer (1430) so that a weld bead (1420) is exposed to the outside. For example, the operation of removing at least a portion of the laminated layer (1430) described above may be performed after the operation (1330) of forming the laminated layer (1430).

[0134] According to one embodiment, one end of the welding bead (1420) can be formed to be exposed to the outside of the laminated layer (1430) formed through operation 1330 without performing an operation of removing at least a portion of the above-described laminated layer (1430). For example, based on a state in which a metal plate (1410) on which a welding bead (1420) is formed is inserted into a mold, a mold for insert injection molding can be manufactured such that one end of the welding bead (1420) comes into contact with the inner wall of the mold. For example, in operation 1330, when the laminated layer (1430) is formed using the above-described mold, the laminated layer (1430) is not formed at one end of the welding bead (1420) that comes into contact with the inner wall of the mold, thereby reducing the manufacturing time of the entire process.

[0135]

[0136] According to one embodiment, a support structure (240; 241; 242; 540; 541; 542; 700; 800; 1200; 1400) of an electronic device (101; 201; 500) may include a metal plate (610; 710; 810; 910; 1010; 1210; 1410) forming a base of the support structure, a weld bead (620; 720; 820; 920; C; 1220; 1420) bonded to the metal plate, and a laminated layer (630; 730; 830; 930; 1030; 1230; 1430) surrounding at least a portion of an outer surface of the weld bead and formed of a material having a lower density than the weld bead.

[0137] In one embodiment, the height of the weld bead (620; 720; 820; 920; C; 1220; 1420) may be at least five times the thickness of the metal plate (610; 710; 810; 910; 1010; 1210; 1410).

[0138] According to one embodiment, the laminated layers (630; 730; 830; 930; 1030; 1230; 1430) may be formed of a synthetic resin.

[0139] According to one embodiment, the welding bead (620; 720; 820; 1220) may include a bead body (621; 721; 821; 1221) joined to the metal plate (610; 710; 810; 1210), and female screw threads (622; 722; 822; 1222) formed on the inner surface of the bead body. For example, the female screw threads may be exposed to the outside of the laminated layer (630; 730; 830; 1230).

[0140] According to one embodiment, a portion of the upper side of the welding bead (620) may be cut to be exposed to the outside. For example, the upper surface of the welding bead exposed to the outside may be anodized.

[0141] According to one embodiment, the laminated layer (730; 830; 1230) may include a connecting hole (730a) that interconnects the female screw thread (722; 822; 1222) and the exterior.

[0142] According to one embodiment, an additional screw thread having a shape that is continuously connected to the female screw thread (722) of the welding bead (720) may be formed on the inner wall of the communication hole (730a).

[0143] According to one embodiment, the outer surface of the bead body (621; 721; 821; 1221) may have a shape corresponding to a portion of a spherical shape.

[0144] According to one embodiment, the welding bead (920; 1420) may have a linear shape when viewed in a direction perpendicular to the surface of the metal plate (910; 1010; 1410).

[0145] According to one embodiment, the weld bead (920; 1420) may not be exposed to the outside of the laminated layer (930; 1430).

[0146] According to one embodiment, the laminated layer (930; 1430) may be formed of a flexible material.

[0147] According to one embodiment, the metal plate (1010) may form at least a portion of a side frame (241; 541) disposed on a side of the electronic device. For example, one end of the welding bead (C) may be exposed to the outside of the laminated layer (1030). For example, the other end of the welding bead (C) may be electrically and physically connected to the metal plate (1010).

[0148] According to one embodiment, the laminated layer (1030) may be formed of an insulating material.

[0149] According to one embodiment, the metal plate (610; 710; 810; 910; 1010; 1210; 1410) may include a multi-layer portion (M) having a plurality of plate layers (811; 812). For example, the multi-layer portion may overlap the weld bead (620; 720; 820; 920; C; 1220; 1420) in a direction perpendicular to the metal plate.

[0150] According to one embodiment, an electronic device (101; 201; 500) may include a front plate (211a; 511a) forming a front surface of the electronic device, a rear plate (211b) forming a rear surface of the electronic device, and a support structure (240; 241; 242; 540; 541; 542; 700; 800; 1200; 1400) disposed between the front plate and the rear plate. For example, the support structure may include a metal plate (610; 710; 810; 910; 1010; 1210; 1410) forming a base of the support structure, a weld bead (620; 720; 820; 920; C; 1220; 1420) bonded to the metal plate, and a laminated layer (630; 730; 830; 930; 1030; 1230; 1430) formed of a material having a lower density than the weld bead, the laminated layer surrounding at least a portion of an outer surface of the weld bead.

[0151] According to one embodiment, the electronic device may include a display (261; 561) disposed between the front plate (211a; 511a) and the rear plate (211b). For example, the metal plate (610; 710; 810; 1210) may form a part of a middle frame (242; 542) disposed between the display and the rear plate.

[0152] According to one embodiment, the welding bead (620; 720; 820; 1220) may include a bead body (621; 721; 821; 1221) that is joined to the metal plate (610; 710; 810; 1210), and a female screw thread (622; 722; 822; 1222) formed on an inner surface of the bead body. For example, the electronic device may include a fastener (F) that penetrates at least one of a plurality of electronic components (251; 252; 280a; 280b; 551; 552; 580) disposed between the front plate (211a; 511a) and the rear plate (211b) and is fastened to the female screw thread.

[0153] According to one embodiment, the middle frame (242; 542) may include a partition wall (242-1; 242-2; W) that surrounds at least a portion of an electronic component (189; 251; 252; 280a; 280b; 289; 551; 552; 580) accommodated inside the electronic device. For example, the welding bead (920; 1420) may be formed to extend in a direction perpendicular to the surface of the metal plate (910; 1010; 1410). For example, the welding bead may form a portion of the partition wall.

[0154] According to one embodiment, the electronic device may include a circuit board (251; 252; 551; 552) disposed between the front plate (211a; 511a) and the rear plate (211b), a wireless communication module (192) installed on the circuit board to support wireless communication between the electronic device and an external electronic device, and a terminal (552-1) installed on the circuit board and electrically connected to the wireless communication module. For example, the metal plate (1010) may form at least a part of a side frame (241; 541) that interconnects the front plate and the rear plate. For example, one end of the welding bead (C) may be exposed to the outside of the laminated layer (1030) and may be in contact with the terminal, and the other end of the welding bead may be electrically and physically connected to the metal plate. For example, the welding bead may transmit a wireless communication signal from the wireless communication module to the side frame.

[0155] According to one embodiment, a method for manufacturing a support structure (240; 241; 242; 540; 541; 542; 700; 800; 1200; 1400) of an electronic device (101; 201; 500) comprises: an operation (1110; 1310) of forming a weld bead (620; 720; 820; 920; C; 1220; 1420) on a metal plate (610; 710; 810; 910; 1010; 1210; 1410) forming a base of the support structure by using a welding method; and an operation (630; 1310) of inserting the metal plate on which the weld bead is formed into a mold by an insert injection molding method, and forming a laminated layer (630; 1310) that surrounds at least a portion of an outer surface of the weld bead and is formed of a material having a lower density than the weld bead. It may include actions (1120; 1330) forming (730; 830; 930; 1030; 1230; 1430).

[0156] According to one embodiment, the method for manufacturing the support structure of the electronic device may include an operation (1130) of forming female threads (622; 722; 822; 1222) on the inner surface of the weld bead by processing the weld bead. For example, the operation (1130) of forming the female threads described above may be performed after the operation (1120) of forming the laminated layer.

[0157] According to one embodiment, the method for manufacturing the support structure of the electronic device may include anodizing the metal plate on which the weld bead is formed. For example, the anodizing operation described above may be performed before the operation (1130) of forming the female screw threads (622; 722; 822; 1222).

[0158] According to one embodiment, the method for manufacturing the support structure of the electronic device may include an operation (1320) of processing the weld bead to reduce the width of the weld bead. For example, the operation (1320) of reducing the width of the weld bead described above may be performed before the operation (1330) of forming the laminated layer.

[0159] According to one embodiment, the method for manufacturing a support structure of the electronic device may include an operation of removing at least a portion of the laminated layer so that the weld bead is exposed to the outside. For example, the operation of removing at least a portion of the laminated layer described above may be performed after the operation (1330) of forming the laminated layer.

[0160] According to one embodiment, based on the state in which the metal plate is inserted into the mold, one end of the welding bead may contact the inner wall of the mold. For example, the one end of the welding bead may be exposed to the outside of the laminated layer formed through the operation (1330) of forming the laminated layer.

[0161]

[0162] The embodiments described herein are intended to be illustrative and not restrictive. Various modifications to the details of the disclosure, including those included within the scope of the appended claims and their equivalents, may be made. Any of the embodiments described herein may be used in combination with any of the embodiments described herein.

Claims

1. In electronic devices (101; 201; 500), A front plate (211a; 511a) forming the front of the electronic device; A rear plate (211b) forming the rear of the electronic device; and A support structure (240; 241; 242; 540; 541; 542; 700; 800; 1200; 1400) disposed between the front plate and the rear plate, The above support structure is, A metal plate (610; 710; 810; 910; 1010; 1210; 1410) forming the base of the above support structure; Welding beads (620; 720; 820; 920; C; 1220; 1420) bonded to the above metal plate; and A laminated layer (630; 730; 830; 930; 1030; 1230; 1430) comprising at least a portion of the outer surface of the weld bead and formed of a material having a lower density than the weld bead. Electronic devices.

2. In paragraph 1, The electronic device further includes a display (261; 561) disposed between the front plate (211a; 511a) and the rear plate (211b), The above metal plate (610; 710; 810; 1210) forms a part of a middle frame (242; 542) disposed between the display and the rear plate. Electronic devices.

3. In paragraph 1 or 2, The above welding beads (620; 720; 820; 1220) are A bead body (621; 721; 821; 1221) bonded to the above metal plate (610; 710; 810; 1210); and Includes female screw threads (622; 722; 822; 1222) formed on the inner surface of the above bead body, The above electronic device, Further comprising a fastening hole (F) that penetrates at least one of a plurality of electronic components (251; 252; 280a; 280b; 551; 552; 580) arranged between the front plate (211a; 511a) and the rear plate (211b) and is fastened to the female screw thread. Electronic devices.

4. In paragraph 3, The upper part of the above welding bead (620) is cut to be exposed to the outside, and the upper surface of the welding bead exposed to the outside is anodized. Electronic devices.

5. In paragraph 3 or 4, The above laminated layers (730; 830; 1230) are Including the female screw thread (722; 822; 1222) and the external communicating hole (730a), Electronic devices.

6. In any one of paragraphs 3 to 5, On the inner wall of the above-mentioned communication hole (730a), an additional screw thread having a shape that is continuously connected to the female screw thread (722) of the above-mentioned welding bead (720) is formed. Electronic devices.

7. In any one of paragraphs 3 to 6, The outer surface of the above bead body (621; 721; 821; 1221) has a shape corresponding to a part of a spherical shape. Electronic devices.

8. In paragraph 1 or 2, The above middle frame (242; 542) includes a partition (242-1; 242-2; W) that surrounds at least a portion of an electronic component (189; 251; 252; 280a; 280b; 289; 551; 552; 580) accommodated inside the electronic device, The above welding bead (920; 1420) is formed long in a direction perpendicular to the surface of the metal plate (910; 1010; 1410) and forms a part of the bulkhead. Electronic devices.

9. In paragraph 8, The above welding bead (920; 1420) is When viewed in a direction perpendicular to the surface of the above metal plate (910; 1010; 1410), it has a linear shape. Electronic devices.

10. In paragraph 8 or 9, The above welding bead (920; 1420) is not exposed to the outside of the laminated layer (930; 1430). Electronic devices.

11. In paragraph 1 or 2, The above electronic device, A circuit board (251; 252; 551; 552) disposed between the front plate (211a; 511a) and the rear plate (211b); A wireless communication module (192) installed on the circuit board to support wireless communication between the electronic device and an external electronic device; and It further includes a terminal (552-1) installed on the circuit board and electrically connected to the wireless communication module, The above metal plate (1010) forms at least a part of a side frame (241; 541) that interconnects the front plate and the rear plate, One end of the above welding bead (C) is exposed to the outside of the laminated layer (1030) and contacts the terminal, and the other end of the welding bead is electrically and physically connected to the metal plate. The above welding bead transmits a wireless communication signal from the wireless communication module to the side frame, Electronic devices.

12. In any one of paragraphs 1 to 11, The above laminated layers (630; 730; 830; 930; 1030; 1230; 1430) are formed of synthetic resin. Electronic devices.

13. In any one of paragraphs 1 to 12, The above metal plate (610; 710; 810; 910; 1010; 1210; 1410) includes a multi-layer portion (M) having a plurality of plate layers (811; 812), The above multi-layer portion overlaps the welding bead (620; 720; 820; 920; C; 1220; 1420) in a direction perpendicular to the metal plate. Electronic devices.

14. In a method for manufacturing a support structure (240; 241; 242; 540; 541; 542; 700; 800; 1200; 1400) of an electronic device (101; 201; 500), An operation (1110; 1310) of forming a welding bead (620; 720; 820; 920; C; 1220; 1420) on a metal plate (610; 710; 810; 910; 1010; 1210; 1410) forming the base of the above-mentioned support structure by using a welding method; and In an insert injection molding method, the metal plate on which the welding bead is formed is inserted into a mold, and an operation (1120; 1330) is included to form a laminated layer (630; 730; 830; 930; 1030; 1230; 1430) that surrounds at least a portion of the outer surface of the welding bead and is formed of a material having a lower density than the welding bead. A method for manufacturing a support structure of an electronic device.

15. In paragraph 14, A method for manufacturing a support structure of the above electronic device, An operation (1130) performed after the operation (1120) of forming the laminated layer, and processing the welding bead to form female screw threads (622; 722; 822; 1222) on the inner surface of the welding bead; or An operation (1330) of forming the laminated layer is performed before the operation (1330) of forming the weld bead, and further includes an operation (1320) of processing the weld bead to reduce the width of the weld bead. A method for manufacturing a support structure of an electronic device.

Images