Electronic device

Abstract

Embodiments of the present disclosure relate to a foldable electronic device comprising a flexible display including a display panel, a polymer member disposed on the rear surface of the display panel, and a support plate (550) disposed on the rear surface of the polymer member, wherein the support plate (550) includes a bendable portion (553) and at least one differential signal line (630) including a first signal line (631) and a second signal line (632) crossing the bendable portion (553), in the bendable portion (553), the first signal line (631) extends along a first curved path including a plurality of U-shaped portions disposed around a plurality of openings (5531), and in the bendable portion (553), the second signal line (632) extends along a second curved path including a plurality of U-shaped portions disposed around the plurality of openings (5531).

Description

electronic devices

[0001] Embodiments of the present disclosure relate to foldable electronic devices.

[0002] As the functional gap between manufacturers narrows significantly, electronic devices are becoming increasingly slimmer to meet consumer purchasing demands. This trend is driven by increased rigidity, enhanced design, and differentiated functional elements. These devices are moving beyond the standard rectangular form factor and evolving into diverse shapes. For example, electronic devices may be designed to be portable and, when in use, feature a transformable structure that allows for large-screen displays.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] As foldable electronic devices continue to be released as part of the electronic device market, a support plate for a foldable display may include a bendable portion. The bendable portion of the support plate may be configured to be foldable by having multiple openings spaced apart from each other.

[0005] A foldable type electronic device may include a support plate including at least one signal line, which is a path for transmitting a signal, and the signal line of the support plate may be arranged to cross the bendable portion. For example, the signal line may be arranged to bypass a plurality of openings arranged in the bendable portion.

[0006] However, due to the narrow width between the multiple openings, the design of the signal line width may be limited when the signal line crosses the bendable section. If the design of the line width is limited, the signal line width inevitably becomes narrow, which may cause a degradation in the performance of the signal line. For example, the signal line may cause signal loss when transmitting a high-speed signal (e.g., a high-speed signal) due to the narrow line width in the bendable section.

[0007] Embodiments of the present disclosure can provide a support plate including a structure of a signal line capable of reducing signal loss and an electronic device including the same.

[0008] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0009] In one embodiment of the present disclosure, an electronic device comprises a foldable housing including a first housing, a second housing, and a hinge structure connecting the first housing and the second housing, and a flexible display disposed on the foldable housing, the flexible display comprising a display panel, a polymer member disposed on a rear surface of the display panel, and a support plate (550) disposed on a rear surface of the polymer member, wherein the support plate (550) comprises a first flat portion (551) facing the first housing, a second flat portion (552) facing the second housing, a bendable portion (553) disposed between the first flat portion (551) and the second flat portion (552) to face the hinge structure and formed to be bendable through a plurality of openings (5531) disposed at intervals, and a bendable portion (553) extending from at least a portion of the first flat portion (551) across the bendable portion (553) to at least a portion of the second flat portion (552). At least one differential signal line (630) is arranged to extend and includes a first signal line (631) and a second signal line (632), and in the first planar portion (551) and the second planar portion (552), the first signal line (631) and the second signal line (632) are arranged, and in the bendable portion (553), the first signal line (631) can extend along a first curved path including a plurality of U-shaped portions arranged around the plurality of openings (5531), and in the bendable portion (553), the second signal line (632) can extend along a second curved path including a plurality of U-shaped portions arranged around the plurality of openings (5531).

[0010] An electronic device according to one embodiment of the present disclosure comprises a foldable housing including a first housing, a second housing, and a hinge structure connecting the first housing and the second housing, and a flexible display disposed on the foldable housing, the flexible display including a display panel, a polymer member disposed on a rear surface of the display panel, and a support plate (550) disposed on a rear surface of the polymer member, wherein the support plate (550) comprises a first planar portion (551) facing the first housing, a second planar portion (552) facing the second housing, a bendable portion (553) disposed between the first planar portion (551) and the second planar portion (552) so as to face the hinge structure and formed to be bendable through a plurality of openings (5531) disposed at intervals, and extending from at least a portion of the first planar portion (551) across the bendable portion (553) to at least a portion of the second planar portion (552). A differential signal line (630) is disposed and includes a first signal line (631) and a second signal line (632), wherein in the first planar portion (551) and the second planar portion (552), the first signal line (631) and the second signal line (632) are disposed in parallel with a specified interval, and in the bendable portion (553), the first signal line (631) extends along a first curved path that bypasses the plurality of openings (5531), and in the bendable portion (553), the second signal line (632) extends along a second curved path that overlaps at least a portion of the first curved path, wherein the second signal line (632) can be disposed in a different layer from the first signal line (631) in the second curved path.

[0011] According to embodiments of the present disclosure, signal loss can be reduced when designing a signal line crossing a bendable portion in a foldable electronic device.

[0012] In addition, various effects may be provided, either directly or indirectly, through this document.

[0013] Other aspects, features and advantages according to specific embodiments of the present disclosure will become more apparent from the accompanying drawings and the corresponding description.

[0014] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0015] FIG. 2A is a perspective view of an electronic device (101) illustrating a flat state or unfolding state according to various embodiments of the present disclosure.

[0016] FIG. 2b is a plan view illustrating the front of an electronic device (101) in an unfolded state according to various embodiments of the present disclosure.

[0017] FIG. 2c is a plan view illustrating the rear surface of an electronic device (101) in an unfolded state according to various embodiments of the present disclosure.

[0018] FIG. 3A is a perspective view of an electronic device (101) illustrating a folding state according to various embodiments of the present disclosure.

[0019] FIG. 3b is a perspective view of an electronic device (101) illustrating an intermediate state according to various embodiments of the present disclosure.

[0020] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0021] FIG. 5 is an exploded perspective view illustrating a laminated structure of a flexible display (500) according to various embodiments of the present invention.

[0022] Figure 6 is an enlarged plan view of a portion of the support plate illustrated in Figure 5.

[0023] Figure 7 is a plan view schematically illustrating a support plate according to one embodiment.

[0024] FIG. 8A is a front perspective view of a multi-foldable electronic device in a fully unfolded state according to various embodiments of the present disclosure.

[0025] FIG. 8b is a plan view of a multi-foldable electronic device in an unfolded state according to various embodiments of the present disclosure.

[0026] FIG. 8C is a rear perspective view of a multi-foldable electronic device in an unfolded state according to various embodiments of the present disclosure.

[0027] FIG. 9A is a front perspective view of a multi-foldable electronic device in a fully folded state according to various embodiments of the present disclosure.

[0028] FIGS. 9B and 9C are perspective views showing the rear surface of a multi-foldable electronic device in a folded state from various directions according to various embodiments of the present disclosure.

[0029] FIGS. 10 to 13 are schematic plan views illustrating a support plate of a multi-foldable electronic device in an unfolded state according to various embodiments.

[0030] Fig. 14 is a plan view illustrating a portion of a signal line of a support plate according to a comparative example.

[0031] FIG. 15 is a plan view illustrating a portion of a differential signal line of a support plate according to one embodiment.

[0032] FIG. 16 is a plan view illustrating a portion of a ground line of a support plate according to one embodiment.

[0033] FIG. 17 is a plan view illustrating a portion of a differential signal line of a support plate according to another embodiment.

[0034] FIGS. 18a, 18b, 19a, 19b, 20a, 20b, 21a, 21b, and 21c are cross-sectional views of various embodiments illustrating the laminated structure of the support plate illustrated in FIG. 17.

[0035] FIG. 22 is a plan view illustrating a portion of an RF signal line of a support plate according to one embodiment.

[0036] Each of the embodiments described with reference to the drawings of the present disclosure can be independently configured as a single embodiment. For example, the embodiments of FIG. 1 and FIG. 2 can each be independently configured. Each of the embodiments described with reference to the drawings of the present disclosure can operate independently as a single embodiment. For example, the embodiments of FIG. 1 and FIG. 2 can each operate independently.

[0037] At least two embodiments described with reference to the drawings of the present disclosure may be combined and configured. For example, at least a portion of the embodiment of FIG. 1 and at least a portion of the embodiment of FIG. 2 may be combined and configured. At least two embodiments described with reference to the drawings of the present disclosure may be combined and operated. For example, at least a portion of the embodiment of FIG. 1 and at least a portion of the embodiment of FIG. 2 may be combined and operated.

[0038] When at least two embodiments described with reference to the drawings of the present disclosure are combined, at least some of the components and / or at least some of the operations included in each embodiment may be omitted. For example, when the embodiment of FIG. 1 and the embodiment of FIG. 2 are combined, at least some of the components and / or at least some of the operations included in the embodiment of FIG. 1 may be omitted, and at least some of the components and / or at least some of the operations included in the embodiment of FIG. 2 may be omitted.

[0039] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0040] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0041] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0042] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0043] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0044] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0045] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0046] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0047] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0048] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0049] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0050] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0051] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0052] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0053] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0054] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0055] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0056] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0057] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0058] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0059] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0060] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0061] Electronic devices according to various embodiments disclosed in the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0062] The various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0063] The term "module" used in various embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0064] Various embodiments of the present disclosure may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0065] According to one embodiment, the method according to various embodiments disclosed in the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0066] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0067] FIG. 2A is a perspective view of an electronic device (101) in a flat state (or unfolding state) according to various embodiments of the present disclosure. FIG. 2B is a plan view illustrating a front side of the electronic device (101) in a flat state according to various embodiments of the present disclosure. FIG. 2C is a plan view illustrating a rear side of the electronic device (101) in a unfolding state according to various embodiments of the present disclosure. FIG. 3A is a perspective view of an electronic device (101) in a folded state according to various embodiments of the present disclosure. FIG. 3B is a perspective view of an electronic device (101) in an intermediate state according to various embodiments of the present disclosure.

[0068] The electronic device (101) of FIGS. 2A to 3B may be at least partially similar to the electronic device (101) of FIG. 1 or may further include other embodiments of the electronic device.

[0069] Referring to FIGS. 2A and 3B , an electronic device (101) (e.g., the electronic device (101) of FIG. 1 ) may include a pair of housings (310, 320) (e.g., foldable housings) that are rotatably coupled to face each other and foldable based on a hinge structure (e.g., a hinge structure (340) of FIG. 2B ) (e.g., a hinge device or a hinge module). In some embodiments, the hinge structures (340) may be arranged in the x-axis direction or the y-axis direction. In some embodiments, two or more hinge structures (340) may be arranged so as to fold in the same direction or in different directions. In one embodiment, the electronic device (101) may include a first display (330) (e.g., a flexible display) that is arranged in an area formed by the pair of housings (310, 320). In one embodiment, the first housing (310) and the second housing (320) are arranged on both sides with respect to the folding axis (F) and may have a shape that is substantially symmetrical with respect to the folding axis (F). In one embodiment, the angle or distance between the first housing (310) and the second housing (320) may vary depending on whether the state of the electronic device (101) is a flat state (or unfolding state), a folding state, or an intermediate state.

[0070] In one embodiment, a pair of housings (310, 320) may include a first housing (310) (e.g., a first housing structure) coupled with a hinge structure (340) and a second housing (320) (e.g., a second housing structure) coupled with the hinge structure (340). In one embodiment, the first housing (310) may include, in an unfolded state, a first surface (311) (e.g., a front surface) facing in a front direction (e.g., a z-axis direction) and a second surface (312) (e.g., a rear surface) facing in a rear direction (e.g., a -z-axis direction) opposite to the first surface (311). In one embodiment, the second housing (320) may include a third surface (321) (e.g., front) facing the front direction (e.g., z-axis direction) and a fourth surface (322) (e.g., rear) facing the rear direction (e.g., -z-axis direction) in the unfolded state. In one embodiment, the electronic device (101) may be operated in such a manner that, in the unfolded state, the first surface (311) of the first housing (310) and the third surface (321) of the second housing (320) face substantially the same first direction (e.g., z-axis direction), and in the folded state, the first surface (311) and the third surface (321) face each other. In one embodiment, the electronic device (101) may be operated such that, in an unfolded state, the second side (312) of the first housing (310) and the fourth side (322) of the second housing (320) face substantially the same second direction (e.g., the -z-axis direction), and in a folded state, the second side (312) and the fourth side (322) face opposite directions. For example, in a folded state, the second side (312) may face the first direction (e.g., the z-axis direction), and the fourth side (322) may face the second direction (e.g., the -z-axis direction).

[0071] According to one embodiment, the first housing (310) may include a first side member (313) that at least partially forms an exterior of the electronic device (101) and a first rear cover (314) that is coupled to the first side member (313) and forms at least a portion of a second side (312) of the electronic device (101). In one embodiment, the first side member (313) may include a first side surface (313a), a second side surface (313b) that extends from one end of the first side surface (313a), and a third side surface (313c) that extends from the other end of the first side surface (313a). In one embodiment, the first side member (313) may be formed into a rectangular (e.g., square or rectangular) shape through the first side surface (313a), the second side surface (313b), and the third side surface (313c).

[0072] According to one embodiment, the second housing (320) may include a second side member (323) that at least partially forms an exterior of the electronic device (101) and a second rear cover (324) that is coupled to the second side member (323) and forms at least a portion of a fourth side (322) of the electronic device (101). In one embodiment, the second side member (323) may include a fourth side member (323a), a fifth side member (323b) that extends from one end of the fourth side member (323a), and a sixth side member (323c) that extends from the other end of the fourth side member (323a). In one embodiment, the second side member (323) may be formed into a rectangular shape through the fourth side member (323a), the fifth side member (323b), and the sixth side member (323c). In one embodiment, the first housing (310) and the second housing (320) may be configured as a foldable housing (e.g., a foldable housing structure or a housing structure).

[0073] According to one embodiment, the pair of housings (310, 320) are not limited to the illustrated shapes and combinations, and may be implemented by other shapes or combinations and / or combinations of parts. For example, in some embodiments, the first side member (313) may be formed integrally with the first rear cover (314), and the second side member (323) may be formed integrally with the second rear cover (324).

[0074] According to one embodiment, the electronic device (101), in an unfolded state, may be connected to a second side (313b) of the first side member (313) and a fifth side (323b) of the second side member (323). In one embodiment, the electronic device (101), in an unfolded state, may be connected to a third side (313c) of the first side member (313) and a sixth side (323c) of the second side member (323). In one embodiment, the electronic device (101), in an unfolded state, may be configured such that the combined length of the second side (313b) and the fifth side (323b) is longer than the length of the first side (313a) and / or the fourth side (323a). Additionally, the combined length of the third side (313c) and the sixth side (323c) may be configured to be longer than the length of the first side (313a) and / or the fourth side (323a).

[0075] In one embodiment, the first side member (313) and / or the second side member (323) may further include a polymer formed of metal (e.g., a conductive member or conductive region) or injected into the metal (e.g., a non-conductive member or non-conductive region). In one embodiment, the first side member (313) and / or the second side member (323) may also include at least one conductive portion (316 and / or 326) electrically segmented via at least one segment (3161, 3162, and / or 3261, 3262) formed of a polymer (e.g., a non-conductive portion or gap). In such a case, at least one conductive portion (316 and / or 326) may be electrically connected to a wireless communication circuit (e.g., a cellular communication circuit) included in the electronic device (101) (e.g., a wireless communication module (192) of FIG. 1) so as to be used as an antenna operating in at least one designated band (e.g., about 400 MHz to about 6000 MHz).

[0076] According to one embodiment, the first rear cover (314) and / or the second rear cover (324) may be formed by, for example, at least one or a combination of two of coated or colored glass, ceramic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium).

[0077] In one embodiment, the first display (330) may be arranged to extend from a first surface (311) of the first housing (310) across a hinge structure (340) (e.g., a hinge module or hinge assembly) to at least a portion of a third surface (321) of the second housing (320). For example, the first display (330) may include a first portion (330a) substantially corresponding to the first surface (311), a second portion (330b) substantially corresponding to the third surface (321), and a third portion (330c) (e.g., a bendable region) connecting the first portion (330a) and the second portion (330b) and corresponding to the hinge structure (340).

[0078] According to one embodiment, the electronic device (101) may include a first protective member (315) (e.g., a first cover, a first protective frame, a first protective cover, or a first decorative member) coupled along an edge of the first housing (310). In one embodiment, the electronic device (101) may include a second protective member (325) (e.g., a second cover, a second protective frame, a second protective cover, or a second decorative member) coupled along an edge of the second housing (320). In one embodiment, the first protective member (315) and / or the second protective member (325) may be formed of a metal or polymer material. In one embodiment, the first protective member (315) and / or the second protective member (325) may be used as a decoration member. In one embodiment, the first display (330) may be positioned such that an edge of the first portion (330a) is interposed between the first housing (310) and the first protective member (315). In one embodiment, the first display (330) may be positioned such that an edge of the second portion (330b) is interposed between the second housing (320) and the second protective member (325). In one embodiment, the first display (330) may be positioned such that an edge of the first display (330) is protected by a protective cap (335) disposed in an area corresponding to the hinge structure (340). Accordingly, the first display (330) may be substantially protected from the outside at the edge. In one embodiment, the electronic device (101) may include a hinge housing (341) (e.g., a hinge cover) that supports a hinge structure (340) and is exposed to the outside when the electronic device (101) is in a folded state and is positioned so as to be inserted into a first space (3101) of the first housing (310) and a second space (3201) of the second housing (320) so as to be invisible from the outside when the electronic device (101) is in an unfolded state. In some embodiments, the first display (330) may be positioned to extend from at least a portion of the second surface (312) to at least a portion of the fourth surface (322).In this case, the electronic device (101) can be folded so that the first display (330) can be exposed to the outside (out-folding method).

[0079] According to one embodiment, the electronic device (101) may include a second display (400) (e.g., a sub-display) that is arranged separately from the first display (330). In one embodiment, the second display (400) is arranged to be at least partially exposed on the second side (312) of the first housing (310), so that when in a folded state, it can replace the display function of the first display (330) and display status information of the electronic device (101). In one embodiment, the second display (400) may be arranged to be visible from the outside through at least a portion of the first rear cover (314). In some embodiments, the second display (400) may be arranged on the fourth side (322) of the second housing (320). In such a case, the second display (400) may be arranged to be visible from the outside through at least a portion of the second rear cover (324).

[0080] According to one embodiment, the electronic device (101) may include at least one of an input device (303) (e.g., a microphone), an audio output device (301, 302), a sensor module (304), a camera device (305, 308), a key input device (306), or a connector port (307). In the illustrated embodiment, the input device (303) (e.g., a microphone), an audio output device (301, 302), a sensor module (304), a camera device (305, 308), a key input device (306), or a connector port (307) refers to a hole or shape formed in the first housing (310) or the second housing (320), but may also include an actual electronic component (e.g., an input device, an audio output device, a sensor module, or a camera device) disposed inside the electronic device (101) and operating through the hole or shape.

[0081] In one embodiment, the input device (303) may include at least one microphone (303) disposed in the second housing (320). In some embodiments, the input device (303) may include a plurality of microphones (303) disposed so as to detect the direction of sound. In some embodiments, the plurality of microphones (303) may be disposed at appropriate locations in the first housing (310) and / or the second housing (320). In one embodiment, the audio output devices (301, 302) may include speakers (301, 302). In one embodiment, the speakers (301, 302) may include a call receiver (301) disposed in the first housing (310) and a speaker (302) disposed in the second housing (320). In some embodiments, the input device (303), the audio output device (301, 302), and the connector port (307) are disposed in a space provided in the first housing (310) and / or the second housing (320) of the electronic device (101), and can be exposed to the external environment through at least one hole formed in the first housing (310) and / or the second housing (320). In one embodiment, the at least one connector port (307) can be used to transmit and receive power and / or data with an external electronic device. In some embodiments, the at least one connector port (e.g., an ear jack hole) can also accommodate a connector (e.g., an ear jack) for transmitting and receiving audio signals with the external electronic device. In some embodiments, the hole formed in the first housing (310) and / or the second housing (320) can be used in common for the input device (303) and the audio output device (301, 302). In some embodiments, the audio output device (301, 302) may include a speaker (e.g., a piezo speaker) that operates without the holes formed in the first housing (310) and / or the second housing (320).

[0082] According to one embodiment, the sensor module (304) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (304) may detect an external environment, for example, through a first surface (311) of the first housing (310). In some embodiments, the electronic device (101) may further include at least one sensor module arranged to detect the external environment through a second surface (312) of the first housing (310). In one embodiment, the sensor module (304) (e.g., an illuminance sensor) may be arranged under the first display (330) to detect the external environment through the first display (330). In one embodiment, the sensor module (304) may include at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, an ambient light sensor, a proximity sensor, a biometric sensor, an ultrasonic sensor, or an ambient light sensor.

[0083] According to one embodiment, the camera devices (305, 308) may include a first camera device (305) (e.g., a front camera device) disposed on a first side (311) of a first housing (310) and a second camera device (308) disposed on a second side (312) of the first housing (310). The electronic device (101) may further include a flash (309) disposed near the second camera device (308). In one embodiment, the camera devices (305, 308) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (309) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, the camera devices (305, 308) may be arranged such that two or more lenses (e.g., a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors are positioned on one side of the electronic device (101) (e.g., a first side (311), a second side (312), a third side (321), or a fourth side (322)). In some embodiments, the camera devices (305, 308) may also include lenses and / or image sensors for time of flight (TOF).

[0084] According to one embodiment, the key input device (306) (e.g., a key button) may be disposed on a third side (313c) of the first side member (313) of the first housing (310). In some embodiments, the key input device (306) may also be disposed on at least one of the other sides (313a, 313b) of the first housing (310) and / or the sides (323a, 323b, 323c) of the second housing (320). In some embodiments, the electronic device (101) may not include some or all of the key input devices (306), and the key input devices (306) that are not included may be implemented in another form, such as a soft key, on the first display (330). In some embodiments, the key input device (306) may be implemented using a pressure sensor included in the first display (330).

[0085] According to one embodiment, some of the camera devices (305, 308) (e.g., the first camera device (305)) or the sensor module (304) may be arranged to be exposed through the first display (330). For example, the first camera device (305) or the sensor module (304) may be arranged to be in contact with the external environment through an opening (e.g., a through hole) at least partially formed in the first display (330) in the internal space of the electronic device (101). In another embodiment, some of the sensor modules (304) may be arranged to perform their functions without being visually exposed through the first display (330) in the internal space of the electronic device (101). For example, in this case, the opening may be omitted from the area of ​​the first display (330) that faces the sensor module (304).

[0086] Referring to FIG. 3B, the electronic device (101) may be operated to maintain an intermediate state through the hinge structure (340). In this case, the electronic device (101) may control the first display (330) to display different contents on the display area corresponding to the first side (311) and the display area corresponding to the third side (321). In one embodiment, the electronic device (101) may be operated in a substantially unfolded state (e.g., the unfolded state of FIG. 2A) and / or a substantially folded state (e.g., the folded state of FIG. 3A) based on a certain inflection angle (e.g., the angle between the first housing (310) and the second housing (320) when in the intermediate state) through the hinge structure (340). For example, the electronic device (101) may be operated to transition to an unfolded state (e.g., the unfolded state of FIG. 2a) when a pressure is applied in the unfolding direction (R1 direction) from an intermediate state unfolded at a certain inflection angle through the hinge structure (340). For example, the electronic device (101) may be operated to transition to a closed state (e.g., the folded state of FIG. 3a) when a pressure is applied in the folding direction (R2 direction) from an intermediate state unfolded at a certain inflection angle through the hinge structure (340). In one embodiment, the electronic device (101) may be operated to maintain an unfolded state (not shown) at various angles through the hinge structure (340).

[0087] According to one embodiment, the electronic device (101) may include a conductive layer (3151) (e.g., a first conductive pattern or a first conductor) disposed between the first housing (310) and the first protective member (315). In one embodiment, the conductive layer (3151) may be disposed on the inner surface of the first protective member (315), and thus may not be visible from the outside. In one embodiment, the conductive layer (3151) may be electrically connected to a short-range wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed in the inner space of the electronic device (101). In one embodiment, the short-range wireless communication circuit may be configured to transmit and / or receive a wireless signal in a frequency band of about 13.56 MHz through the conductive layer (3151). In one embodiment, the conductive layer (3151) may operate as a short-range communication antenna (NA1) (e.g., a first short-range communication antenna). In one embodiment, the short-range communication antenna (NA1) is arranged near the first side (313a) of the electronic device (101) along the longitudinal direction (e.g., ±x-axis direction) of the first side (313a), so as to form a wireless signal in a direction toward which the front surface (311) of the electronic device (101) faces (e.g., z-axis direction), in a direction toward which the side surface (313a) faces (e.g., y-axis direction), or in a direction between the front surface (311) and the side surface (313a) (e.g., a direction between the z-axis and the y-axis).

[0088] According to one embodiment, the electronic device (101) may include a conductive coil (390) (e.g., an antenna member) (e.g., a second conductive pattern or a second conductor) arranged to form a wireless signal in a rearward direction (e.g., a -z-axis direction) of the electronic device (101) when in an unfolded state. In one embodiment, the conductive coil (390) may be electrically connected to a short-range wireless communication circuit arranged in an internal space of the electronic device (101) (e.g., a second space (3201) of the second housing (320). In one embodiment, the short-range wireless communication circuit may be configured to transmit and / or receive a wireless signal in a frequency band of about 13.56 MHz through the conductive coil (390). In one embodiment, the conductive coil (390) may be operated as another short-range communication antenna (NA2) (e.g., a second short-range communication antenna).

[0089] An electronic device (101) according to an exemplary embodiment of the present disclosure may be configured to form a wireless signal for short-range communication not only in the rear direction of the electronic device (101), but also in the front and / or side direction, thereby helping to improve the usability of the electronic device (101).

[0090] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0091] Referring to FIG. 4, the electronic device (101) may include a first side member (313) (e.g., a first side frame), a second side member (323) (e.g., a second side frame), and a hinge structure (340) (e.g., a hinge module or a hinge assembly) that rotatably connects the first side member (213) and the second side member (223). In one embodiment, the electronic device (101) may include a first extension member (3131) that extends at least partially from the first side member (313), or a second extension member (3231) that extends at least partially from the second side member (323). In one embodiment, the first extension member (3131) may include a first surface (3131a) facing the front direction of the electronic device (101) (e.g., the z-axis direction) and a second surface (3131b) facing in a direction opposite to the first surface (3131a) (e.g., the -z-axis direction). In one embodiment, the second extension member (3231) may include a third surface (3231a) facing in the front direction (e.g., the z-axis direction) and a fourth surface (3231b) facing in a direction opposite to the third surface (3231a) (e.g., the -z-axis direction). In one embodiment, the first extension member (3131) may be formed integrally with the first side member (313) or may be structurally coupled with the first side member (313). In one embodiment, the second extension member (3231) may be formed integrally with the second side member (323) or may be structurally connected to the second side member (323). In one embodiment, the electronic device (101) may include a first display (330) arranged to be supported by a first surface (3131a) of the first extension member (3131) and a third surface (3231a) of the second extension member (3231).In one embodiment, the electronic device (101) may include a first rear cover (314) coupled with the first side member (313) and providing a first space (e.g., the first space (3101) of FIG. 2B) between the first side member (313) and the second side member (323) and providing a second space (e.g., the second space (3201) of FIG. 2B) between the second side member (313) and the fourth side member (3231b) of the second extension member (3231). In one embodiment, the first side member (313) and the first rear cover (314) may be formed integrally. In one embodiment, the second side member (323) and the second rear cover (324) may be formed integrally. In one embodiment, the electronic device (101) may include a first housing (e.g., the first housing (310) of FIG. 2A) (e.g., the first housing structure) provided through a first side member (313), a first extension member (3131), and a first rear cover (314). In one embodiment, the electronic device (101) may include a second housing (e.g., the second housing (320) of FIG. 2A) (e.g., the second housing structure) provided through a second side member (323), a second extension member (3231), and a second rear cover (324). In one embodiment, the electronic device (101) may include a second display (400) positioned between the first rear cover (314) and the second side (3131b) of the first extension member (3131) so as to be visible from the outside through at least a portion of the first rear cover (314).

[0092] According to one embodiment, the electronic device (101) may include a first substrate (361) (e.g., a first printed circuit board (PCB) or main printed circuit board), a camera assembly (363), a first battery (371), or a first bracket (351) disposed in a first space between a first side member (313) and a first rear cover (314). In one embodiment, the camera assembly (363) may include a plurality of camera devices (e.g., camera devices (305, 308) of FIGS. 2A and 3A) and may be electrically connected to the first substrate assembly (361). In one embodiment, the first bracket (351) may provide a support structure and enhanced rigidity for supporting the first substrate (361) and / or the camera assembly (363).

[0093] According to one embodiment, the electronic device (101) may include a second substrate (362) (e.g., a second PCB or sub-printed circuit board), a conductive coil (390) (e.g., an antenna member), a second battery (372), or a second bracket (352) disposed in a second space between the second side member (323) and the second rear cover (324). In one embodiment, the electronic device (101) may include a wiring member (380) (e.g., a flexible printed circuit board (FPCB)) that extends from the first substrate (361) across the hinge structure (340) to a plurality of electronic components (e.g., a second substrate (362), a second battery (372), or a conductive coil (390)) disposed between the second side member (323) and the second rear cover (324) and provides an electrical connection. In one embodiment, the conductive coil (390) may operate as at least one of a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The conductive coil (390) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.

[0094] According to one embodiment, the electronic device (101) may include a hinge housing (341) (e.g., a hinge cover) that supports a hinge structure (340) and is exposed to the outside when the electronic device (101) is in a folded state (e.g., the folded state of FIG. 3A) and is positioned so as to be invisible from the outside by being introduced into the first space and / or the second space when the electronic device (101) is in an unfolded state (e.g., the unfolded state of FIG. 2A).

[0095] In one embodiment, the electronic device (101) may include a first protective member (315) coupled along an edge of the first side member (313). In one embodiment, the electronic device (101) may include a second protective member (325) coupled along an edge of the second side member (323). In one embodiment, the first display (330) may have an edge of a first planar portion (e.g., the first portion (330a) of FIG. 3B) protected by the first protective member (315). In one embodiment, the first display (330) may have an edge of a second planar portion (e.g., the second portion (330b) of FIG. 3B) protected by the second protective member (325). In one embodiment, the electronic device (101) may include a protective cap (335) positioned to protect an edge of a flexible portion (e.g., the third portion (330c) of FIG. 3B) corresponding to a hinge structure (340) of the first display (330). In some embodiments, the protective cap (335) and / or the protective members (315, 325) may be omitted.

[0096] FIG. 5 is an exploded perspective view illustrating a laminated structure of a flexible display (500) according to various embodiments of the present invention.

[0097] The flexible display (500) of FIG. 5 may be at least partially similar to the first display (330) of FIG. 2A or may further include other embodiments of the display.

[0098] Referring to FIG. 5, a flexible display (500) (e.g., a first display (330) of FIG. 2A) may include a window (510) (e.g., a polyimide (PI) film), a polarizer (POL) (520) (e.g., a polarizing film) sequentially disposed on a back surface of the window (510), a display panel (530), a polymer member (540), and / or a support plate (550). According to one embodiment, the flexible display (500) may be arranged to extend from at least a portion of an internal space of a first housing (e.g., the first housing (310) of FIG. 2A) to at least a portion of an internal space of a second housing (e.g., the second housing (320) of FIG. 2A). For example, a flexible display (500) may extend from at least a portion of an interior space of a first housing (e.g., a first housing (310) of FIG. 2A) to at least a portion of an interior space of a second housing (e.g., a second housing (320) of FIG. 2A) across a folding axis (e.g., a folding axis (F) of FIG. 2A) of an electronic device (e.g., an electronic device (101) of FIG. 2A).

[0099] According to one embodiment, the POL (520), the display panel (530), the polymer member (540), and the support plate (550) can be attached to each other via adhesive members (P1, P2, P3). For example, the adhesive members (P1, P2, P3) can include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or a double-sided tape. According to one embodiment, the flexible display (500) can include another adhesive member (P4) (e.g., a double-sided tape or a waterproof member) disposed along a border on the back surface of the support plate (550).

[0100] In one embodiment, the polymer member (540) may be applied with a dark color (e.g., black) to help display the background when the display is off. In one embodiment, the polymer member (540) may act as a cushion to absorb external shocks from the electronic device and prevent damage to the flexible display (500).

[0101] According to one embodiment, the support plate (550) serves to support the display panel (530) and may include glass fiber reinforced plastic (GFRP) or carbon fiber reinforced plastic (CFRP). The support plate (550) includes a multi-layer structure including a plurality of layers, and a high-speed signal line (e.g., a differential signal line (630) of FIG. 15), a ground line (e.g., a ground line (640) of FIG. 16), and / or an RF signal line (e.g., an RF signal line (650) of FIG. 22) may be arranged on at least some of the layers. The high-speed signal lines (e.g., differential signal lines), ground lines, and RF signal lines of the support plate (550) can serve to electrically connect some components (e.g., the first substrate (361) of FIG. 4) placed in the first housing (the first housing (310) of FIG. 2A) and some components (e.g., the second substrate (362) of FIG. 4) placed in the second housing (the second housing (320) of FIG. 2A), and accordingly, the electronic device (e.g., the electronic device (101) of FIG. 2A) can reduce or omit the PCB or FPCB for transmitting signals.

[0102] In one embodiment, the support plate (550) may further include a metal sheet to help reinforce the rigidity of the electronic device (101), shield ambient noise, and disperse heat emitted from a surrounding heat dissipating component (e.g., the processor (120) of FIG. 1). In one embodiment, the support plate (550) may include at least one metal sheet of Cu, Al, SUS, or CLAD (e.g., a laminated member in which SUS and Al are alternately arranged).

[0103] Figure 6 is an enlarged plan view of a portion of the support plate illustrated in Figure 5.

[0104] The support plate (550) of FIG. 6 may be at least partially similar to the support plate (550) of FIG. 5 or may further include other embodiments of the support plate (550).

[0105] Referring to FIG. 6, a support plate (550) according to one embodiment may include a first planar portion (551) facing a first housing (e.g., a first housing (310) of FIG. 2a), a second planar portion (552) facing a second housing (e.g., a second housing (320) of FIG. 2a), and a bendable portion (553) formed to be bendable through a plurality of openings (5531) arranged to face a hinge structure (e.g., a hinge structure (340) of FIG. 2b) between the first planar portion (551) and the second planar portion (552) and arranged at intervals.

[0106] According to one embodiment, the bendable portion (553) may include a plurality of openings (5531) spaced apart from each other. According to one embodiment, the openings (5531) may refer to areas from which a metal material is removed. For example, the support plate (550) may include a multi-layer structure including a plurality of layers, and at least some layers among the plurality of layers may include metal members for high-speed signal lines (e.g., the differential signal line (630) of FIG. 15), ground lines (e.g., the ground line (640) of FIG. 16), and / or RF signal lines (e.g., the RF signal line (650) of FIG. 22). The multi-layer structure of the support plate (550) will be described in detail below with reference to FIGS. 18A, 18B, 19A, 19B, 20A, 20B, 21A, 21B, and 21C.

[0107] In the present disclosure, the openings (5531) of the support plate (550) may mean an area in which a metal member is not placed in the bendable portion (553).

[0108] According to one embodiment, the plurality of openings (5531) may be formed along a first direction (e.g., length direction) (e.g., y-axis direction) of the bendable portion (553) and a second direction (e.g., width direction) perpendicular to the first direction (e.g., x-axis direction) (e.g., x-axis direction). According to one embodiment, the plurality of openings (5531) may be formed in an elliptical shape of a long hole along the first direction (e.g., y-axis direction) of the bendable portion (5533). According to one embodiment, the plurality of openings (5531) may be arranged in an alternating and coincident manner along the second direction (e.g., x-axis direction) of the bendable portion (5533). According to one embodiment, the plurality of openings (5531) may be arranged at regular or irregular intervals along the first direction (e.g., y-axis direction) and / or the second direction (e.g., x-axis direction). According to one embodiment, the plurality of openings (5531) may be formed in the same shape or different shapes. According to one embodiment, the bendable portion (553) may exhibit elasticity to return to its original state after being deformed through the lattice structure formed by the plurality of openings (5531), and this elasticity may help provide flexibility to the bendable portion.

[0109] According to one embodiment, the flexibility of the bendable portion (553) may be determined by the spacing, shape, or arrangement density between the plurality of openings (5531). For example, the flexibility of the bendable portion (553) may be determined by the length (l) of one opening (e.g., a unit opening). According to one embodiment, the flexibility of the bendable portion (553) may be determined by the width (w) of one opening. According to one embodiment, the flexibility of the bendable portion (553) may be determined by the first spacing (d1) between the openings (5531) formed in the second direction (e.g., the x-axis direction). According to one embodiment, the flexibility of the bendable portion (553) may be determined by the second spacing (d2) between the openings (5531) formed in the first direction (e.g., the y-axis direction).

[0110] The support plate (550) of FIG. 7 may be at least partially similar to the support plates (550) of FIGS. 5 and 6 or may further include other embodiments of the support plate (550).

[0111] Referring to FIG. 7, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may include a high-speed signal line (e.g., a differential signal line (630)) and an RF signal line (650). Although not shown, the support plate (550) may further include a ground line to serve as a reference plane. The ground line may extend to overlap at least a portion of the differential signal line (630). In the present disclosure, the ground line will be described in detail below with reference to FIGS. 16, 18A, 18B, 19A, 19B, 20A, 20B, 21A, 21B, and 21C.

[0112] According to one embodiment, the differential signal line (630), the ground line, and the RF signal line (650) can be arranged to extend from at least a portion of the first planar portion (551) across the bendable portion (553) to at least a portion of the second planar portion (552).

[0113] According to one embodiment, the differential signal line (630), the ground line, and the RF signal line (650) may serve to electrically connect a first component (610) (e.g., a first substrate (361) of FIG. 4) disposed in a first housing (a first housing (310) of FIG. 2A) and a second component (620) (e.g., a second substrate (362) of FIG. 4) disposed in a second housing (a second housing (320) of FIG. 2A), and accordingly, an electronic device (e.g., an electronic device (101) of FIG. 2A) may reduce or omit a PCB or FPCB for transmitting a signal.

[0114] According to one embodiment, the differential signal line (630) may be a pair of signal lines, including a first signal line (631) and a second signal line (632). In the present disclosure, the first signal line (631) may be interchangeably referred to as a “positive signal line.” In the present disclosure, the second signal line (632) may be interchangeably referred to as a “negative signal line.”

[0115] FIG. 8A is a front perspective view of a multi-foldable electronic device in a fully unfolded state according to various embodiments of the present disclosure. FIG. 8B is a plan view of the multi-foldable electronic device in an unfolded state according to various embodiments of the present disclosure.

[0116] FIG. 9A is a front perspective view of a multi-foldable electronic device in a fully folded state according to various embodiments of the present disclosure. FIGS. 9B and 9C are perspective views showing the rear surface of the multi-foldable electronic device in a fully folded state from various directions according to various embodiments of the present disclosure.

[0117] The multi-foldable electronic device (700) of FIGS. 8A to 9C may be at least partially similar to the electronic device (101) of FIG. 1, or may further include other embodiments of the multi-foldable electronic device.

[0118] Referring to FIGS. 8A to 9C, a multi-foldable electronic device (700) (e.g., a portable communication device or an electronic device) (e.g., the electronic device (101) of FIG. 1) may include a first housing (710) (e.g., a first housing portion), a second housing (720) (e.g., a second housing portion) rotatably connected to the first housing (710) in a direction (e.g., an x-axis direction) on one side (e.g., a right side) of the first housing (710) with respect to a first folding axis (F1), and a third housing (730) (e.g., a third housing portion) rotatably connected to the first housing (710) in a direction (e.g., a -x-axis direction) on the other side (e.g., a left side) of the first housing (710) with respect to a second folding axis (F2). In one embodiment, the multi-foldable electronic device (700) may include a first hinge housing (766) that accommodates at least one first hinge module (e.g., a first hinge device or a first hinge structure) connecting a first housing (710) and a second housing (720), and a second hinge housing (767) that accommodates at least one second hinge module (e.g., a second hinge device or a second hinge structure) connecting the first housing (710) and a third housing (730). In one embodiment, the first hinge housing (766) may cover the first hinge module so that it is not visible from the outside while the first housing (710) and the second housing (720) are in a fully folded state or a folded state. In one embodiment, the first hinge housing (766) may be arranged so as not to be visible from the outside when the first housing (710) and the second housing (720) are in a fully unfolded state. In one embodiment, the second hinge housing (767) may cover the second hinge module so as not to be visible from the outside when the first housing (710) and the third housing (730) are in a fully folded state or a folded state.In one embodiment, the second hinge housing (767) may be arranged so as not to be visible from the outside when the first housing (710) and the third housing (730) are in a fully unfolded state. In one embodiment, the multi-foldable electronic device (700) may include a foldable housing (e.g., a multi-foldable housing) formed by the first housing (710), the second housing (720), the third housing (730), the first hinge housing (766), and the second hinge housing (767). In some embodiments, the multi-foldable electronic device (700) may include a foldable housing formed by the first housing (710), the second housing (720), and the third housing (730). In one embodiment, the multi-foldable electronic device (700) may include a flexible display (740) (e.g., a first display) that is arranged to be supported by a first housing (710), a second housing (720), and a third housing (730). In one embodiment, the multi-foldable electronic device (700) may include a sub-display (750) (e.g., a second display) that is arranged through the third housing (730). In this document, the surface on which the flexible display (740) is arranged may be defined as the front surface of the multi-foldable electronic device (700), and the surface opposite the front surface may be defined as the back surface of the multi-foldable electronic device (700). In one embodiment, the surface surrounding the space between the front surface and the back surface may be defined as the side surface of the electronic device (700).In this document, a state in which the first housing (710), the second housing (720), and the third housing (730) of the multi-foldable electronic device (700) are fully unfolded may be defined as a 'first state' or a 'fully unfolded state', a state in which the first housing (710), the second housing (720), and the third housing (730) are fully folded with respect to each other may be defined as a 'second state' or a 'fully folded state', and a state in which only the first housing (710) and the second housing (720) are folded with respect to each other may be defined as a 'third state' or an 'intermediate state'.

[0119] According to one embodiment, the first housing (710) may include a first surface (711), a second surface (712) facing opposite to the first surface (711), and a first side member (713) surrounding a first space (7101) between the first surface (711) and the second surface (712). In one embodiment, at least a portion of the first side member (713) may form at least a portion of a side surface of the multi-foldable electronic device (700). In one embodiment, the first side member (713) may include a first side surface (7131) and a second side surface (7132) positioned opposite to the first side surface (7131). In one embodiment, the first housing (710) may include a first rear cover (714) coupled with the first side member (713). In one embodiment, the first space (7101) may be formed through a first rear cover (714) coupled with a first side member (713) on a second surface (712) of the first housing (710).

[0120] In one embodiment, the second housing (720) may include a third side (721), a fourth side (722) facing opposite to the third side (721), and a second side member (723) surrounding a second space (7201) between the third side (721) and the fourth side (722). In one embodiment, at least a portion of the second side member (723) may form at least a portion of a side surface of the multi-foldable electronic device (700). In one embodiment, the second side member (723) may include a third side surface (7231), a fourth side surface (7232) extending in a direction perpendicular to the third side surface (7231), and a fifth side surface (7233) extending from the fourth side surface (7232) and being parallel to the third side surface (7231). In one embodiment, the second housing (720) may include a second rear cover (724) coupled with a second side member (723). In one embodiment, the sub-display (750) may be replaced to be disposed through at least a portion of the second rear cover (724) in the second housing (720). In some embodiments, the multi-foldable electronic device (700) may include an additional sub-display disposed through at least a portion of the second rear cover (724) in the second housing (720). In this case, when the first housing (710) and the second housing (720) are fully folded and the third housing (730) is partially folded (e.g., the third housing (730) is folded at an angle of about 90 degrees with respect to the first housing (710), the sub-display arranged on the fourth side (722) of the second housing (720) can be arranged to be visible from the outside. In one embodiment, the second space (7201) can be formed through the second rear cover (724) coupled with the second side member (723) on the fourth side (722).

[0121] In one embodiment, the third housing (730) may include a fifth side (731), a sixth side (732) facing opposite to the fifth side (731), and a third side member (733) surrounding a third space (7301) between the fifth side (731) and the sixth side (732). In one embodiment, at least a portion of the third side member (733) may form at least a portion of a side surface of the multi-foldable electronic device (700). In one embodiment, the third side member (733) may include a sixth side surface (7331), a seventh side surface (7332) extending perpendicularly from the sixth side surface (7331), and an eighth side surface (7333) extending from the seventh side surface (7332) and being parallel to the sixth side surface (7331). In one embodiment, the third space (7301) may be formed through a third rear cover (734) coupled with a third side member (733) at the sixth side (7331).

[0122] In one embodiment, the first side (7131), the third side (7231), and the sixth side (7331) may form the same side (e.g., the bottom side) of the multi-foldable electronic device (700). In one embodiment, the second side (7132), the fifth side (7233), and the eighth side (7333) may form the same side (e.g., the top side) of the multi-foldable electronic device (700). In one embodiment, the fourth side (7232) may form one side (e.g., the right side) of the multi-foldable electronic device (700). In one embodiment, the seventh side (7332) may form one side (e.g., the left side) of the multi-foldable electronic device (700).

[0123] According to one embodiment, the multi-foldable electronic device (700) may be configured such that, in an unfolded state (e.g., a first state), the first housing (710), the second housing (720), and the third housing (730) are positioned side by side so that the first side (711), the third side (721), and the fifth side (731) face the same direction. In one embodiment, the multi-foldable electronic device (700) may be configured such that, in a folded state (e.g., a second state), the first housing (710), the second housing (720), and the third housing (730) are positioned in a sequentially stacked manner so that the first side (711) and the third side (721) face each other, and the fourth side (722) and the fifth side (731) face each other. In this case, the second side (712) and the sixth side (732) may be visible from the outside, and the third side (721) and the fourth side (722) may be positioned so as not to be visible from the outside through the first housing (710) and the third housing (730). In one embodiment, the sub-display (750) may be positioned so as to be visible from the outside through at least a portion of the sixth side (732) in the unfolded and / or folded state.

[0124] According to various embodiments, the multi-foldable electronic device (700) may include at least one housing, including a first housing (710), a second housing (720), and a third housing (730), and the manner in which these (710, 720, 730) are foldably coupled to each other may be variously changed. For example, the manner in which the first housing (710), the second housing (720), and the third housing (730) are foldably coupled to each other is not limited to the examples of FIGS. 8A to 9C and may be variously changed. According to one embodiment, the first housing (710), the second housing (720), and the third housing (730) may have different sizes. In one embodiment, the first housing (710) may have a first width (HW1), the second housing (720) may have a second width (HW2) smaller than the first width (HW1), and the third housing (730) may have a third width (HW3) larger than the first width (HW1). For example, by defining these widths (HW1, HW2, HW3) of the housings (710, 720, 730), the multi-foldable electronic device (700) may be configured so that, when folded, none of the housings protrudes outward, thereby helping to improve an attractive appearance and portability. However, the present invention is not limited thereto, and at least two of the first, second, and third widths (HW1, HW2, HW3) may be configured to be the same.

[0125] According to one embodiment, the flexible display (740) may include a first region (740a) corresponding to at least a portion of the first housing (710), a second region (740b) extending from one side (e.g., a right side) of the first region (740a) and corresponding to at least a portion of the second housing (720), and a third region (740c) extending from the other side (e.g., a left side) of the first region (740a) and corresponding to at least a portion of the third housing (730). In one embodiment, the flexible display (740) may include a portion of a first region (740a) and a portion of a second region (740b), a fourth region (740d) that is flexible (e.g., a first folding region) corresponding to a first hinge assembly (HA1), and a fifth region (740e) that is flexible (e.g., a second folding region) corresponding to a second hinge assembly (HA2) and a portion of a first region (740a) and a portion of a third region (740c). In one embodiment, the region division of the flexible display (740) is merely an exemplary division by three housings (710, 720, 730) and two hinge assemblies (HA1, HA2), and the flexible display (740) may be displayed as a substantially seamless, single full screen. In one embodiment, the first region (740a) and the second region (740b) may have an overall symmetrical shape or a partially asymmetrical shape with respect to the fourth region (740d) and / or the first folding axis (F1). In one embodiment, the first region (740a) and the third region (740c) may have an overall symmetrical shape or a partially asymmetrical shape with respect to the fifth region (740e) and / or the second folding axis (F2). In one embodiment, the first folding width (BW1) of the fourth region (740d) may be smaller than the second folding width (BW2) of the fifth region (740e) in a direction perpendicular to the first folding axis (F1) (e.g., the x-axis direction). In some embodiments, the area of ​​the fourth region (740d) may be smaller than the area of ​​the fifth region (740e).This may be due to the fact that the first hinge assembly (HA1) connecting the first housing (710) and the second housing (720) and the second hinge assembly (HA2) connecting the first housing (710) and the third housing (730) are different from each other. For example, the size of at least one first hinge module (e.g., narrow hinge module) of the first hinge assembly (HA1) connecting the first housing (710) and the second housing (720) may be smaller than the size of at least one second hinge module (e.g., wide hinge module) of the second hinge assembly (HA2) connecting the first housing (710) and the third housing (730) and folding the flexible display (740) in a folded state. Through this configuration, the second hinge housing (767) can have a first receiving width (W1) that is larger than the thickness of the first housing (710), and the first hinge housing (766) can have a second receiving width (W2) that is smaller than the first receiving width (W1).

[0126] According to one embodiment, the electronic device (700) may include a first rear cover (714) disposed on a second side (712) of a first housing (710), a second rear cover (724) disposed on a fourth side (722) of a second housing (720), and a third rear cover (734) disposed on a sixth side (732) of a third housing (730). In some embodiments, at least a portion of the first rear cover (714) may be formed integrally with the first side member (713). In some embodiments, at least a portion of the second rear cover (724) may be formed integrally with the second side member (723). In some embodiments, at least a portion of the third rear cover (734) may be formed integrally with the third side member (733). In one embodiment, at least one of the first rear cover (714), the second rear cover (724), and the third rear cover (734) may be formed of a substantially transparent plate (e.g., a glass plate including various coating layers, or a polymer plate) or an opaque plate. In one embodiment, the first rear cover (714) and the second rear cover (724) may be formed of an opaque plate, such as, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. In one embodiment, the third rear cover (734) may be formed of a substantially transparent plate, such as, for example, glass or polymer. Accordingly, the sub-display (750) may be arranged so as to be visible from the outside through the third rear cover (734) in the third space (7301) of the third housing (730).

[0127] According to one embodiment, the multi-foldable electronic device (700) may include a first protective frame (761) (e.g., a first decorative member) and a second protective frame (762) (e.g., a second decorative member) disposed in a first housing (710) and arranged to cover an edge of a first region (740a) of a flexible display (740). In one embodiment, the first protective frame (761) may be disposed along a first side (7131) of the first housing (710), and the second protective frame (762) may be disposed along a second side (7132). In one embodiment, an edge of the flexible display (740) corresponding to the first housing (710) may be concealed from the outside through the first and second protective frames (761, 762). In one embodiment, the multi-foldable electronic device (700) may include a third protective frame (763) (e.g., a third decorative member) disposed in the second housing (720) and arranged to cover an edge of a second region (740b) of a flexible display (740). In one embodiment, the third protective frame (763) may be disposed along a third side (7231), a fourth side (7232), and a fifth side (7233) of the second housing (720). In one embodiment, an edge of the flexible display (740) corresponding to the second housing (720) may be concealed from the outside through the third protective frame (763). In one embodiment, the multi-foldable electronic device (700) may include a fourth protective frame (764) (e.g., a fourth decorative member) disposed in the third housing (730) and arranged to cover the edge of the third area (740c) of the flexible display (740). In one embodiment, the fourth protective frame (764) may be disposed along the sixth side (7331), the seventh side (7332), and the eighth side (7333) of the third housing (730).In one embodiment, the edge of the flexible display (740) corresponding to the third housing (730) may be concealed from the outside through the fourth protective frame (764). In some embodiments, at least one of the first, second, third, and fourth protective frames (761, 762, 763, 764) may be omitted.

[0128] According to one embodiment, the multi-foldable electronic device (700) may include a first protective member (765a) (e.g., a first protective cap) disposed between the first protective frame (761) and the third protective frame (763) in the fourth region (740d) and arranged to cover at least a portion of an edge of the flexible display (740), and a second protective member (765b) disposed between the second protective frame (762) and the third protective frame (763) and arranged to cover at least a portion of an edge of the flexible display (740). In one embodiment, the multi-foldable electronic device (700) may include a third protective member (765c) (e.g., a third protective cap) disposed between the first protective frame (761) and the fourth protective frame (764) in the fifth region (740e) and arranged to cover at least a portion of an edge of the flexible display (740), and a fourth protective member (765d) disposed between the second protective frame (762) and the fourth protective frame (764) and arranged to cover at least a portion of an edge of the flexible display (740). In one embodiment, at least one of the first, second, third, and fourth protective members (765a, 765b, 765c, 765d) may be omitted.

[0129] According to one embodiment, the electronic device (700) may include at least one electronic component arranged in at least one space among the first space (7101) of the first housing (710), the second space (7201) of the second housing (720), and / or the third space (7301) of the third housing (730). In one embodiment, at least one electronic component may include a flexible display (740) (e.g., a first display) disposed through a first housing (710), a second housing (720), and a third housing (730), a sub-display (750) (e.g., a second display) disposed in the third housing (730), at least one microphone (771a, 771b) (e.g., an input module or input device), at least one speaker (772a, 772b, 772c, 772d) (e.g., an audio output module or audio output device), at least one camera (773a, 773b, 773c) (e.g., a camera module or camera device), at least one sensor (774a, 774b, 774c) (e.g., a sensor module), at least one key button (775) (e.g., an input device or a physical key), a connector port (776) or a socket device (777). In some embodiments, the electronic device (700) may additionally include at least one other component. In some embodiments, at least one of the above-described components may be omitted.

[0130] In one embodiment, the flexible display (740) may be placed in a receiving space formed by the housings (710, 720, 730). For example, the flexible display (740) may be placed in a recess formed by the housings (710, 720, 730), and may be placed so as to occupy substantially most of the front surface of the electronic device (700) when unfolded. In one embodiment, the sub-display (750) may be placed in the third space (7301) of the third housing (730) so as to be visible from the outside through the third rear cover (734).

[0131] According to one embodiment, the flexible display (740) may be at least partially similar to the flexible display (500) of FIG. 5 or may include other embodiments of the flexible display. For example, the flexible display (740) may include the support plate (550) described with reference to FIGS. 5 and 6 (e.g., the support plate (550) of FIG. 10), and the support plate (550) of the flexible display (740) may include a high-speed signal line (e.g., a differential signal line (630)) and an RF signal line (650). The support plate (550) of the flexible display (740) will be described in detail below with reference to FIGS. 10 to 13.

[0132] In various embodiments, at least one microphone (771a, 771b) may include a first microphone (771a) positioned through a first side (7131) of the first housing (710) and a second microphone (771b) positioned through a second side (7132) of the first housing (710). In some embodiments, at least one microphone (771a, 771b) may be positioned on a third side (7231) and / or a fifth side (7233) of the second housing (720). In some embodiments, at least one microphone (771a, 771b) may be positioned on a sixth side (7331) and / or an eighth side (7333) of the third housing (730).

[0133] In various embodiments, at least one speaker (772a, 772b, 772c, 772d) may include a first speaker (772a) positioned to emit sound through a third side (7231) of the second housing (720), a second speaker (772b) positioned to emit sound through a fifth side (7233), a third speaker (772c) positioned to emit sound through a sixth side (7331) of the third housing (730), and a fourth speaker (772d) positioned to emit sound through an eighth side (7333). In one embodiment, at least one speaker (772a, 772b, 772c, 772d) may be symmetrically arranged to implement stereophonic sound (e.g., three-dimensional sound) in the unfolded or folded state of the multi-foldable electronic device (700). In one embodiment, the second speaker (772b) or the fourth speaker (772d) may be arranged near the user's ear in the folded state and may be used as a call receiver. In some embodiments, the multi-foldable electronic device (700) may further include an additional receiver (not shown) arranged in the third space (7301) of the third housing (730) and arranged to emit sound through a speaker hole provided in at least a portion of the third rear cover (734) or between the third rear cover (734) and the third side member (733). In some embodiments, at least one speaker (772a, 772b, 772c, 772d) may be replaced with a piezo speaker that operates without the hole formed in the second housing (720) and / or the third housing (730).

[0134] According to one embodiment, at least one camera (773a, 773b, 773c) may be disposed in the third space (7301) of the third housing (730), and may include a first camera (773a) disposed through a fifth side (731) of the third housing (730), a second camera (773b) disposed through a second side (712) of the first housing (710), and a third camera (773c) disposed through a sixth side (732) of the third housing (730). In one embodiment, at least one camera (773a, 773b, 773c) may include one or more lenses, an image sensor, and / or an image signal processor. In some embodiments, at least one camera (773a, 773b, 773c) includes two or more lenses (e.g., wide-angle and telephoto lenses) and image sensors, and may be arranged together on one side of a housing of any one of the first housing (710), the second housing (720), or the third housing (730). In some embodiments, the multi-foldable electronic device (700) may include a flash (not shown) arranged near the second camera (773b). In one embodiment, the flash may include, for example, a light-emitting diode or a xenon lamp.

[0135] According to one embodiment, at least one sensor (774a, 774b, 774c) may generate an electrical signal or data value corresponding to an internal operating state of the multi-foldable electronic device (700) or an external environmental state. In one embodiment, at least one sensor (774a, 774b, 774c) may include a first sensor (774a) disposed on a fifth side (731) of the third housing (730), a second sensor (774b) disposed on a second side (712) of the first housing (710), and / or a third sensor (774c) disposed on a sixth side (732) of the third housing (730). In some embodiments, the at least one sensor (774a, 774b, 774c) may include at least one of a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, an ambient light sensor, an ultrasonic sensor, an iris recognition sensor, and a distance detection sensor (e.g., a time of flight (TOF) sensor or a light detection and ranging (LiDAR) sensor). In one embodiment, the multi-foldable electronic device (700) may further include at least one sensor, not shown, such as at least one of a barometric pressure sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, or a fingerprint recognition sensor. In some embodiments, the fingerprint sensor may be arranged to detect a user's fingerprint through at least a portion of the key button (775).

[0136] According to one embodiment, at least one camera (773a, 773b, 773c) and / or at least one sensor (774a, 774b, 774c) may be positioned to detect the external environment through the flexible display (740) and / or the sub-display (750). For example, at least one camera (773a, 773b, 773c) and / or at least one sensor (774a, 774b, 774c) may be arranged in the first space (7101) of the first housing (710) and / or the third space (7301) of the third housing (730), under the non-active display area or the active display area of ​​the flexible display (740) and / or the sub-display (750), and may be arranged to be in contact with the external environment through an opening or transparent area perforated up to the cover member (e.g., window layer) and / or the third rear cover (734). In one embodiment, the area corresponding to at least one camera (773a, 773c) of the flexible display (740) and / or the sub-display (750) may be formed as a transparent area having a certain transmittance as part of an area displaying content. In one embodiment, the transparent region may be formed to have a transmittance in the range of about 5% to about 30%. The transparent region may include an area overlapping with an effective area (e.g., a field of view area) of at least one camera (773a, 773c) through which light passes to be imaged by the image sensor to generate an image. For example, the transparent region of the flexible display (740) and / or the sub-display (750) may include an area with a lower pixel density than the surrounding area. For example, the transparent region may be replaced with an opening. For example, the at least one camera (773a, 773c) may include an under-display camera (UDC) or an under-panel camera (UPC).In one embodiment, some of the cameras (773a, 773c) or some of the sensors (774a, 774c) may be arranged to perform their functions without being visually exposed through the flexible display (740) and / or the sub-display (750). For example, an area of ​​the flexible display (740) and / or the sub-display (750) corresponding to at least one camera (773a, 773c) and / or at least one sensor (774a, 774c) may not require a perforated opening.

[0137] According to one embodiment, at least one key button (775) may be arranged on the seventh side (7332) of the third housing (730). This may help improve usability by arranging the sixth side (732) so that the sub-display (750) faces upward when the multi-foldable electronic device (700) is in a folded state, and at least one key button (775) is positioned on the right side. In some embodiments, the multi-foldable electronic device (700) may not include some or all of the at least one key button (775), and the key buttons that are not included may be implemented in other forms, such as soft keys displayed on the flexible display (740) and / or the sub-display (750). In some embodiments, some of the at least one key button (775) may be implemented using at least one pressure sensor implemented through the flexible display (740) and / or the sub-display (750). In some embodiments, at least one key button (775) may be positioned on at least one of the first side (7131) or the second side (7132) of the first housing (710), the third side (7231) or the fifth side (7233) of the second housing (720), and / or the sixth side (7331) or the eighth side (7333) of the third housing (730), which may be used when the multi-foldable electronic device (700) is in an unfolded state and / or a folded state.

[0138] According to one embodiment, the connector port (776) may be arranged through the first side (7131) of the first housing (710). In one embodiment, the connector port (776) may include a connector (e.g., a USB connector or an IF module (interface connector port module)) structure for transmitting and receiving power and / or data with an external electronic device. In some embodiments, the connector port (776) may also perform a function for transmitting and receiving audio signals with the external electronic device, or may further include a separate connector port (e.g., an ear jack hole) for performing a function for transmitting and receiving audio signals. In some embodiments, the connector port (776) may be located on at least one of the second side (7132) of the first housing (710), the third side (7231), the fourth side (7232), or the fifth side (7233) of the second housing (720), and / or the sixth side (7331), the seventh side (7332), or the eighth side (7333) of the third housing (730), which may be used when the multi-foldable electronic device (700) is in an unfolded state and / or a folded state.

[0139] In one embodiment, the socket device (777) may be disposed on the seventh side (7332) of the third housing (730) so that the multi-foldable electronic device (700) can be used even when folded. In one embodiment, the socket device (777) may include a tray retractably coupled from the seventh side (7332) to accommodate a SIM card or an external memory card. In some embodiments, the socket device (777) may be disposed on the sixth side (7331) and / or the eighth side (7333) of the third housing (730). In some embodiments, the socket device (777) may be positioned on one side of the first housing (710) (e.g., at least one of the first side (7131) or the second side (7132) of FIG. 8B) or one side of the second housing (720) (e.g., at least one of the third side (7231), the fourth side (7232), or the fifth side (7233) of FIG. 8B).

[0140] According to one embodiment, at least one microphone (771a, 771b), at least one speaker (772a, 772b, 772c, 772d), at least one key button (775), connector port (776) or socket device (777) may be exposed to the external environment through at least one hole (e.g., a through hole) formed in the first housing (710), the second housing (720) and / or the third housing (730).

[0141] According to one embodiment, the multi-foldable electronic device (700) may include an antenna member (778) disposed in the first space (7101) of the first housing (710). In one embodiment, the antenna member (778) may be disposed to transmit or receive a wireless signal through the second side (712) of the first housing (710) so that the multi-foldable electronic device (700) can operate even in a folded state. In one embodiment, the antenna member (778) may include an antenna that operates in a neat field communication (NFC), multi-function coil or multi-function core (MFC), and / or magnetic secure transmission (MST) manner to perform a wireless charging function, an electronic payment function, and / or a data transmission and reception function. In one embodiment, the antenna member (778) may also include an ultra-wide band (UWB) antenna that is used to detect a distance to an external electronic device or a position of the external electronic device (e.g., angle of arrival (AoA) positioning technique).

[0142] The multi-foldable electronic device (700) according to exemplary embodiments of the present disclosure can use a large screen display area in an unfolded state through the folding operation of the first housing (710), the second housing (720), and the third housing (730), and can help improve portability because the three housings (710, 720, 730) are deformed in a manner that they overlap each other in a folded state. In addition, the plurality of electronic components can help improve usability by being arranged in appropriate positions that are advantageous for use in the unfolded state and / or the folded state of the multi-foldable electronic device (700).

[0143] FIGS. 10 to 13 are schematic plan views illustrating a support plate (550) of a multi-foldable electronic device in an unfolded state according to various embodiments.

[0144] The support plate (550) of FIGS. 10 to 13 may be a part included in a flexible display (e.g., the flexible display (740) of FIG. 8A) of a multi-foldable electronic device (e.g., the electronic device (700) of FIG. 8A) described with reference to FIGS. 8A to 9C. For example, the support plate (550) of FIGS. 10 to 13 may be a part forming the back surface of the flexible display (740) of FIG. 8A.

[0145] The support plate (550) of FIGS. 10 to 13 may be at least partially similar to the support plate (550) of FIGS. 5, 6, and 7, or may further include other embodiments of the support plate (550).

[0146] Referring to FIG. 10, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may include a first planar portion (551), a second planar portion (552), and a third planar portion (554). The second planar portion (552) may be disposed between the first planar portion (551) and the third planar portion (554).

[0147] According to one embodiment, the second flat portion (552) may be an area facing the first housing (e.g., the first housing (710) of FIG. 8A) of the multi-foldable electronic device (e.g., the electronic device (700) of FIG. 8A) described with reference to FIGS. 8A to 9C.

[0148] According to one embodiment, the first planar portion (551) may be an area facing a third housing (e.g., the third housing (730) of FIG. 8A) of a multi-foldable electronic device (e.g., the electronic device (700) of FIG. 8A) described with reference to FIGS. 8A to 9C.

[0149] According to one embodiment, the third flat portion (554) may be an area facing a second housing (e.g., the second housing (720) of FIG. 8A) of a multi-foldable electronic device (e.g., the electronic device (700) of FIG. 8A) described with reference to FIGS. 8A to 9C.

[0150] According to one embodiment, a first bendable portion (553) may be disposed between the first planar portion (551) and the second planar portion (552), and the first bendable portion (553) may have bendability by including openings (5531) (not shown) at least partially similar to the openings (5531) of the bendable portion (553) described with reference to FIG. 5.

[0151] According to one embodiment, a second bendable portion (555) may be positioned between the second planar portion (552) and the third planar portion (554), and the second bendable portion (555) may have bendability by including openings (5531) (not shown) at least partially similar to the openings (5531) of the bendable portion (553) described with reference to FIG. 5.

[0152] According to one embodiment, the support plate (550) may include a high-speed signal line (e.g., a differential signal line (630)), a power line (not shown), and / or an RF signal line (650). Although not shown, the support plate (550) may further include a ground line (e.g., a ground line (640) of FIG. 16) to serve as a reference plane. The ground line may extend to overlap at least a portion of the differential signal line (630).

[0153] According to one embodiment, the differential signal line (630), the ground line, and the RF signal line (650) can be arranged to extend from at least a portion of the first planar portion (551) across the first bendable portion (553) to at least a portion of the second planar portion (552).

[0154] According to one embodiment, the differential signal line (630), the ground line, and the RF signal line (650) may serve to electrically connect a first component (610) (e.g., a first substrate) disposed in a third housing (a third housing (730) of FIG. 8A) and a second component (620) (e.g., a second substrate) disposed in the first housing (a first housing (710) of FIG. 8A), and accordingly, the multi-foldable electronic device (e.g., a multi-foldable electronic device (700) of FIG. 8A) may reduce or omit a PCB or FPCB for transmitting a signal.

[0155] According to one embodiment, the width of the first bendable portion (553) and the width of the second bendable portion (555) may be the same. For example, in one embodiment of FIG. 8b, in a direction perpendicular to the first folding axis (e.g., F1 of FIG. 8b) and the direction of the x-axis (e.g., x-axis direction of FIG. 8b), a first folding width corresponding to the first bendable portion (553) (e.g., first folding width (BW1) of FIG. 8b) may be substantially the same as a second folding width corresponding to the second bendable portion (555) (e.g., second folding width (BW2) of FIG. 8b).

[0156] Referring to FIG. 11, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may have different widths of the first bendable portion (553) and the second bendable portion (555), unlike the embodiment of FIG. 10. Hereinafter, only the embodiment of FIG. 11 that is different from the embodiment of FIG. 10 will be described. Accordingly, features not described in FIG. 11 will be replaced with the description of the embodiment of FIG. 10.

[0157] According to one embodiment, in the support plate (550) according to one embodiment, the width of the first bendable portion (553) may be smaller than the width of the second bendable portion (555). Therefore, in one embodiment of FIG. 8b, in a direction perpendicular to the first folding axis (e.g., F1 of FIG. 8b) and the direction perpendicular to the x-axis of FIG. 8b, the first folding width (e.g., the first folding width (BW1) of FIG. 8b) corresponding to the first bendable portion (553) may be smaller than the second folding width (e.g., the second folding width (BW2) of FIG. 8b) corresponding to the second bendable portion (555).

[0158] Referring to FIG. 12, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) has a difference from the embodiment of FIG. 10 in that the differential signal line (630), the ground line (e.g., the ground line (640) of FIG. 16), and the RF signal line (650) extend from the first planar portion (551) across the first bendable portion (553) to the second planar portion (552), and extend from the second planar portion (552) across the second bendable portion (555) to the third planar portion (554). Hereinafter, only the embodiment of FIG. 13, which is different compared to the embodiment of FIG. 10, will be described. Therefore, features not described in FIG. 13 will be replaced with the description of the embodiment of FIG. 10.

[0159] According to one embodiment, the differential signal line (630), ground line, and RF signal line (650) of the support plate (550) may serve to electrically connect a first component (610) (e.g., a first substrate) disposed in a third housing (a third housing (730) of FIG. 8A) and a second component (620) (e.g., a second substrate) disposed in a second housing (a second housing (720) of FIG. 8A), and accordingly, the multi-foldable electronic device (e.g., a multi-foldable electronic device (700) of FIG. 8A) may reduce or omit a PCB or FPCB for transmitting a signal.

[0160] Referring to FIG. 13, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may have different widths of the first bendable portion (553) and the second bendable portion (555), unlike the embodiment of FIG. 12. Hereinafter, only the embodiment of FIG. 13 that is different from the embodiment of FIG. 12 will be described. Accordingly, features not described in FIG. 13 will be replaced with the description of the embodiment of FIG. 12.

[0161] According to one embodiment, in the support plate (550) according to one embodiment, the width of the first bendable portion (553) may be smaller than the width of the second bendable portion (555). Therefore, in one embodiment of FIG. 8b, in a direction perpendicular to the first folding axis (e.g., F1 of FIG. 8b) and the direction perpendicular to the x-axis of FIG. 8b, the first folding width (e.g., the first folding width (BW1) of FIG. 8b) corresponding to the first bendable portion (553) may be smaller than the second folding width (e.g., the second folding width (BW2) of FIG. 8b) corresponding to the second bendable portion (555).

[0162] Referring to FIG. 13, according to one embodiment, a differential signal line (630), a ground line (e.g., a ground line (640) of FIG. 16), and an RF signal line (650) may electrically connect a first component (610) (e.g., a first substrate) disposed in a third housing (a third housing (730) of FIG. 8A) and a third component (615) (e.g., a third substrate) disposed in the first housing (a first housing (710) of FIG. 8A). For example, at least some of the differential signal line (630), the ground line, and the RF signal line (650) may branch from the second plane portion (552) and be electrically connected to the third component (615).

[0163] Fig. 14 is a plan view illustrating a portion of a signal line of a support plate (550) according to a comparative example.

[0164] The support plate (550) of FIG. 14 may be at least partially similar to the support plates (550) of FIGS. 5, 6, and 7.

[0165] Referring to FIG. 14, a support plate (550) according to a comparative example may include a differential signal line (630) including a first signal line (631) and a second signal line (632), and an RF signal line (650). The support plate (550) may further include a ground line (not shown) to serve as a reference plane. The ground line may extend to overlap at least a portion of the differential signal line (630).

[0166] According to a comparative example, the first signal line (631) and the second signal line (632) can be spaced apart at a regularly designated interval in the first flat portion (551), the bendable portion (553), and the second flat portion (552).

[0167] According to a comparative example, the bending characteristic of the support plate (550) can be determined by a first spacing (d1) between adjacent openings (5531) defined in a first direction of the bendable portion (553) and / or a second spacing (d2) between adjacent openings (5531) defined in a second direction perpendicular to the first direction. According to a comparative example, the first spacing (d1) and the second spacing (d2) of the openings (5531) in the bendable portion (553) can be designed to be limited to values ​​specified or less in consideration of the bending characteristic of the bendable portion (553). Therefore, due to the narrow width between the plurality of openings (5531), when the differential signal line (630) and the RF signal line (650) cross the bendable portion (553), the design of the line width can be limited. If the design of the line width is limited, performance degradation of the differential signal line (630) and the RF signal line (650) may occur.

[0168] FIG. 15 is a plan view illustrating a portion of a differential signal line (630) of a support plate (550) according to one embodiment.

[0169] The support plate (550) of FIG. 15 may be at least partially similar to the support plates (550) of FIGS. 5, 6, 7, and 10 to 13, or may further include other embodiments of the support plates (550). The features of the support plate (550) described with reference to FIG. 15 may be applied to the support plates (550) of FIGS. 5, 6, 7, and 10 to 13.

[0170] Referring to FIG. 15, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may include a differential signal line (630). The differential signal line (630) is arranged to extend from at least a portion of a first planar portion (551) across a bendable portion (553) (e.g., the first bendable portion (553) or the second bendable portion (555) of FIG. 10) to at least a portion of a second planar portion (552), and may include a first signal line (631) and a second signal line (632).

[0171] According to one embodiment, in the first plane portion (551) and the second plane portion (552), the first signal line (631) and the second signal line (632) can be arranged in parallel with a specified interval.

[0172] In one embodiment, in the bendable portion (553), the first signal line (631) may extend along a first curved path (810) that bypasses the plurality of openings (5531), and the second signal line (632) may extend across the bendable portion (553) via a different path than the first signal line (631). For example, in the bendable portion (553), the second signal line (632) may extend along a second curved path (820) that bypasses the plurality of openings (5531). Here, the second curved path (820) may be a different path than the first curved path (810).

[0173] In one embodiment, the first curved path (810) may include a plurality of U-shaped portions positioned around the plurality of openings (5531). In one embodiment, the second curved path (820) may include a plurality of U-shaped portions positioned around the plurality of openings (5531).

[0174] In one embodiment, the first curved path (810) and the second curved path (820) may be positioned adjacent to different portions of the plurality of openings (5531). For example, the first curved path (810) may be positioned adjacent to a first portion of the plurality of openings (5531), and the second curved path (820) may be positioned adjacent to a second portion of the plurality of openings (5531).

[0175] According to one embodiment, the plurality of U-shaped portions included in the first curved path (810) and the plurality of U-shaped portions included in the second curved path (820) may be arranged symmetrically with respect to each other. For example, the plurality of U-shaped portions included in the first curved path (810) and the plurality of U-shaped portions included in the second curved path (820) may form mirror images of each other.

[0176] According to one embodiment, the plurality of U-shaped portions included in the first curved path (810) and the plurality of U-shaped portions included in the second curved path (820) can bypass different portions of the plurality of openings (5531).

[0177] According to one embodiment, the widths of the first signal line (631) and the second signal line (632) may be maintained constant in the first planar portion (551) and the second planar portion (552), and may be varied in the flexible portion (553). For example, in the first planar portion (551) and the second planar portion (552), each of the first signal line (631) and the second signal line (632) may have a first width (W1). For example, in the flexible portion (553), each of the first signal line (631) and the second signal line (632) may have a first width (W1) or a second width (W2) greater than the first width (W1). For example, in the bendable portion (553), the second width (W2) of each of the first signal line (631) and the second signal line (632) may have a width that is about 50% or more of the spacing between adjacent openings (5531).

[0178] According to one embodiment, the width of each of the first signal line (631) and the second signal line (632) in the bendable portion (553) may vary depending on whether they are adjacent to each other. For example, in the bendable portion (553), the first signal line (631) and the second signal line (632) may have a relatively large second width (W2) in some paths where they are spaced apart from each other, and a relatively small first width (W1) in other paths where they are adjacent to each other.

[0179] According to one embodiment, the first curved path on which the first signal line (631) is arranged includes at least one first adjacent path (811) adjacent to the second signal line (632), wherein the first signal line (631) may have a first width (W1) in the first adjacent path (811). In the present disclosure, the first adjacent path (811) may mean a path in which the first signal line (631) approaches the second signal line (632) within a specified distance in the bendable portion (553). The first signal line (631) may have a second width (W2) in the first curved path (810) of the bendable portion (553) excluding the first adjacent path (811).

[0180] According to one embodiment, the second curved path (820) on which the second signal line (632) is arranged includes at least one second adjacent path (821) adjacent to the first signal line (631), wherein the second signal line (632) may have a first width (W1) in the second adjacent path (821). In the present disclosure, the first adjacent path (811) may mean a path in which the first signal line (631) approaches the second signal line (632) within a specified distance in the bendable portion (553). The second signal line (632) may have a second width (W2) in the second curved path (820) of the bendable portion (553) excluding the second adjacent path (821).

[0181] According to one embodiment, the support plate (550) includes a multi-layer structure including a plurality of layers, and the differential signal line (630) may be disposed on at least some of the plurality of layers. For example, the differential signal line (630) may be disposed on a first metal layer (e.g., the first metal layer (L1) of FIG. 18A) among the plurality of layers.

[0182] FIG. 16 is a plan view illustrating a portion of a ground line (640) of a support plate (550) according to one embodiment.

[0183] The support plate (550) of FIG. 16 may be at least partially similar to the support plates (550) of FIGS. 5, 6, and 7, or may further include other embodiments of the support plate (550). The features of the support plate (550) described with reference to FIG. 16 may be applied to the support plates (550) of FIGS. 5, 6, 7, and 10 to 13.

[0184] Referring to FIG. 16, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may include a ground line (640) to serve as a reference plane. For example, the ground line (640) may extend to overlap at least a portion of the differential signal line (630) described with reference to FIG. 15.

[0185] According to one embodiment, the support plate (550) includes a multi-layer structure including a plurality of layers, and the ground line (640) may be disposed on at least some layers among the plurality of layers. For example, the ground line (640) may be disposed on a second metal layer (L2), a third metal layer (L3), or each of the second metal layer (L2) and the third metal layer (L3) among the plurality of layers. The second metal layer (L2) or the third metal layer (L3) may be a different layer from the first metal layer (L1) on which the differential signal line (630) described in the embodiment of FIG. 15 is disposed. For example, the second metal layer (L2) may be a layer disposed on top of the first metal layer (L1). For example, the third metal layer (L3) may be a layer disposed below the first metal layer (L1).

[0186] According to one embodiment, the ground line (640) is arranged to extend from at least a portion of the first planar portion (551) across the bendable portion (553) (e.g., the first bendable portion (553) or the second bendable portion (555) of FIG. 10) to at least a portion of the second planar portion (552), similar to the differential signal line (630) described in the embodiment of FIG. 15, and may overlap at least a portion of the differential signal line (630).

[0187] According to one embodiment, in the first planar portion (551) and the second planar portion (552), the ground line (640) may have a third width (W3).

[0188] According to one embodiment, in the bendable portion (553), the ground line (640) may have a third width (W3) or a fourth width (W4) that is smaller than the third width (W3).

[0189] According to one embodiment, the ground line (640) may have a third width (W3) in a path overlapping a first adjacent path (e.g., the first adjacent path (811) of FIG. 15) and a second adjacent path (e.g., the second adjacent path (821) of FIG. 15) in which the first signal line (631) and the second signal line (632) are adjacently arranged.

[0190] FIG. 17 is a plan view illustrating a portion of a differential signal line (630) of a support plate (550) according to another embodiment.

[0191] The support plate (550) of FIG. 17 may be at least partially similar to the support plates (550) of FIGS. 5, 6, and 7, or may further include other embodiments of the support plate (550). The features of the support plate (550) described with reference to FIG. 17 may be applied to the support plates (550) of FIGS. 5, 6, 7, and 10 to 13.

[0192] Referring to FIG. 17, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) has a difference in that, unlike the embodiment of FIG. 15, the differential signal line (630) includes a multi-layer structure. Hereinafter, only the embodiment of FIG. 17, which is different from the embodiment of FIG. 15, will be described. Accordingly, features not described in FIG. 17 will be replaced with the description of the embodiment of FIG. 15.

[0193] Referring to FIG. 17, a support plate (550) according to one embodiment is arranged to extend from at least a portion of a first planar portion (551) across a bendable portion (553) to at least a portion of a second planar portion (552), and may include at least one differential signal line (630) including a first signal line (631) and a second signal line (632).

[0194] According to one embodiment, the support plate (550) can arrange the first signal line (631) and the second signal line (632) in a horizontal manner in the first flat portion (551) and the second flat portion (552), and can arrange the first signal line (631) and the second signal line (632) in a vertical manner in the bendable portion (553).

[0195] According to one embodiment, in the first plane portion (551) and the second plane portion (552), the first signal line (631) and the second signal line (632) can be arranged in parallel with a specified interval.

[0196] According to one embodiment, in the bendable portion (553), the first signal line (631) may extend along a first curved path that bypasses the plurality of openings (5531), and the second signal line (632) may extend along a second curved path that overlaps the first curved path. For example, the second signal line (632) may extend along a second curved path that overlaps at least a portion of the first curved path, wherein the second signal line (632) may be disposed in a different layer from the first signal line (631) in the second curved path. In this way, the first signal line (631) may have a single-layer structure disposed in one metal layer, while the second signal line (632) may have a multi-layer structure disposed in a plurality of metal layers.

[0197] According to one embodiment, in the first planar portion (551) and the second planar portion (552), the first signal line (631) and the second signal line (632) may be arranged on the same layer. In the bendable portion (553), the first signal line (631) and the second signal line (632) may be arranged on different layers. For example, the second signal line (632) may be designed as a multi-layer structure including an upper line section arranged on the same layer as the first signal line (631) in the first planar portion (551) and the second planar portion (552), and a lower line section electrically connected to the upper line section through a via (910) and overlapping with at least a portion of the first signal line (631) in the bendable portion (553). In FIG. 17, the upper line section of the second signal line (632) is represented by a solid line, and the lower line section is represented by a dotted line.

[0198] According to one embodiment, the via (910) electrically connecting the upper line section and the lower line section of the second signal line (632) may include a first via (911) disposed at at least a portion of the boundary between the first planar portion (551) and the bendable portion (553), and a second via (912) disposed at at least a portion of the boundary between the second planar portion (552) and the bendable portion (553).

[0199] The support plate (550) according to one embodiment may further include a ground line (640) as described with reference to FIG. 16. For example, the ground line (640) may be arranged on a different layer from the differential signal line (630), may extend from at least a portion of the first planar portion (551) across the bendable portion (553) to at least a portion of the second planar portion (552), and may overlap at least a portion of the differential signal line (630).

[0200] The embodiment of FIG. 17 can increase the line width by having a multi-layer structure in which the first signal line (631) and the second signal line (632) extend while overlapping each other under design conditions in which the width between the openings (5531) in the bendable portion (553) (e.g., d1, d2 in FIG. 6) is limited. Accordingly, the embodiment of FIG. 17 can reduce performance degradation of the differential signal line (630) in the bendable portion (553).

[0201] FIGS. 18a, 18b, 19a, 19b, 20a, 20b, 21a, 21b, and 21c are cross-sectional views of various embodiments illustrating the laminated structure of the support plate (550) illustrated in FIG. 17. For example, FIGS. 18a, 18b, 19a, 19b, 20a, 20b, 21a, 21b, and 21c illustrate cross-sections of portions of the support plate (550) corresponding to the first planar portion (551) and the second planar portion (552) on the left, and cross-sections of other portions of the support plate (550) corresponding to the bendable portion (553) on the right.

[0202] The support plate (550) of FIGS. 18a, 18b, 19a, 19b, 20a, 20b, 21a, 21b, and 21c may be at least partially similar to the support plate (550) of FIGS. 5, 6, and 7, or may further include other embodiments of the support plate (550). The features of the support plate (550) described with reference to FIGS. 18a, 18b, 19a, 19b, 20a, 20b, 21a, 21b, and 21c may be applied to the support plates (550) of FIGS. 5, 6, 7, and 10-13.

[0203] Referring to FIG. 18a, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) includes a multi-layer structure including a plurality of layers, and a differential signal line (630) may be arranged in at least some of the plurality of layers.

[0204] According to one embodiment, the support plate (550) may include a first metal layer (L1), a second metal layer (L2) disposed on top of the first metal layer (L1), a third metal layer (L3) disposed under the first metal layer (L1), and / or a fourth metal layer (L4) disposed under the third metal layer (L3). For example, the support plate (550) may include a second metal layer (L2), and may further include a first metal layer (L1), a third metal layer (L3), and a fourth metal layer (L4) sequentially disposed under the second metal layer (L2). According to various embodiments, the support plate (550) may further include other metal layers in addition to the metal layers illustrated in FIGS. 18a, 18b, 19a, 19b, 20a, 20b, 21a, 21b, and 21c, and the present invention may not be limited thereto.

[0205] According to one embodiment, in the first planar portion (551) and the second planar portion (552), the differential signal line (630) may be arranged on the first metal layer (L1). For example, in the first planar portion (551) and the second planar portion (552), the first signal line (631) and the second signal line (632) may be arranged at a specified interval.

[0206] According to one embodiment, in the first planar portion (551) and the second planar portion (552), the differential signal line (630) may be configured in a stripline shape with a ground line (640) disposed on each of its upper and lower portions. For example, in the first planar portion (551) and the second planar portion (552), the ground line (640) may be disposed on each of the second metal layer (L2) and the third metal layer (L3), and these may be disposed to at least partially overlap the first signal line (631) and the second signal line (632).

[0207] According to one embodiment, in the bendable portion (553), the differential signal line (630) may be arranged in a multi-layer structure. For example, in the bendable portion (553), the first signal line (631) may be arranged in the first metal layer (L1), and in the bendable portion (553), the second signal line (632) may be arranged in the third metal layer (L3). Here, the second signal line (632) may be arranged in the third metal layer (L3), but may be arranged to overlap at least partially with the first signal line (631). The end of the second signal line (632) disposed on the third metal layer (L3) corresponding to the bendable portion (553) can be electrically connected to the second signal lines (632) disposed on the first metal layer (L1) corresponding to the first planar portion (551) and the second planar portion (552) through a via (e.g., via (910) of FIG. 17).

[0208] According to one embodiment, in the bendable portion (553), the differential signal line (630) may be implemented in a stripline form in which a ground line (640) is disposed on each of the upper and lower portions thereof. For example, in the bendable portion (553), the ground line (640) may be disposed on each of the second metal layer (L2) and the fourth metal layer (L4), and may be disposed so as to at least partially overlap the first signal line (631) and the second signal line (632). An end of the ground line (640) disposed on the fourth metal layer (L4) corresponding to the bendable portion (553) may be electrically connected to the ground lines (640) disposed on the third metal layer (L3) corresponding to the first planar portion (551) and the second planar portion (552) through a via (not shown).

[0209] The support plate (550) according to one embodiment illustrated in FIG. 18a can arrange the differential signal line (630) even under design conditions where the spacing between the openings (5531) (5513) is narrow by arranging the first signal line (631) and the second signal line (632) in different layers in the bendable portion (553).

[0210] Referring to FIG. 18b, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may have a difference in that the laminated structure of the ground line (640) is changed, unlike the embodiment of FIG. 18a. Hereinafter, only the embodiment of FIG. 18b, which is different from the embodiment of FIG. 18a, will be described. Accordingly, features not described in FIG. 18b will be replaced with the description of the embodiment of FIG. 18a.

[0211] According to one embodiment, the stacked structure of the ground line (640) serving as a reference plane can be varied. For example, in the first planar portion (551) and the second planar portion (552), the ground line (640) is arranged in each of the second metal layer (L2) and the fourth metal layer (L4), and these can be arranged to at least partially overlap with the first signal line (631) and the second signal line (632).

[0212] The support plate (550) illustrated in FIG. 18b may include a design structure that fillcuts the ground in the third metal layer (L3). According to one embodiment, the ground line (640) of the fourth metal layer (L4) corresponding to the first planar portion (551) and the second planar portion (552) may extend to be continuously connected with the ground line (640) of the fourth metal layer (L4) corresponding to the bendable portion (553).

[0213] In the embodiment of FIG. 18b, compared to the embodiment of FIG. 18a, the distance between the differential signal line (630) and the ground line (640) disposed thereunder (e.g., the ground line (640) of the fourth metal layer (L4)) increases, so that the impedance may increase. Accordingly, the support plate (550) according to one embodiment may consider impedance matching, and the embodiment of FIG. 18b may lower the impedance by increasing the line width of the differential signal line (630) compared to the embodiment of FIG. 18a.

[0214] For reference, the impedance of the differential signal line (630) is inversely proportional to the line width of the differential signal line (630) and proportional to the spacing between the first signal line (631) and the second signal line (632).

[0215] Referring to FIG. 19A, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may have a difference in that the line width of the differential signal line (630) is increased, unlike the embodiment of FIG. 18A. Hereinafter, only the embodiment of FIG. 19A that is different from the embodiment of FIG. 18A will be described. Accordingly, features not described in FIG. 19A will be replaced with the description of the embodiment of FIG. 18A.

[0216] According to one embodiment, the support plate (550) can increase the line width of the differential signal line (630) in the first planar portion (551) and the second planar portion (552) to reduce DCR (DC Resistance) and reduce signal loss. As the line width of the differential signal line (630) increases, impedance can decrease, and the support plate (550) can take this into consideration to reduce the area where the differential signal line (630) and the ground line (640) overlap each other. Similarly, the support plate (550) can be designed so that the differential signal line (630) and the ground line (640) do not completely overlap each other in the bendable portion (553), thereby enabling impedance matching, reducing DCR and reducing signal loss due to the increased line width. For example, in the flexible portion (553), the differential signal line (630) can be divided into a first region (6301) that overlaps with the ground line (640) and a second region (6302) that does not overlap with the ground line (640).

[0217] Referring to FIG. 19b, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may have a difference in that the laminated structure of the ground line (640) is changed, unlike the embodiment of FIG. 19a. Hereinafter, only the embodiment of FIG. 19a that is different from the embodiment of FIG. 19a will be described. Accordingly, features not described in FIG. 19b will be replaced with the description of the embodiment of FIG. 19a.

[0218] According to one embodiment, the stacked structure of the ground line (640) serving as a reference plane can be varied. For example, in the first planar portion (551) and the second planar portion (552), the ground line (640) is arranged in each of the second metal layer (L2) and the fourth metal layer (L4), and these can be arranged to at least partially overlap with the first signal line (631) and the second signal line (632).

[0219] The support plate (550) illustrated in FIG. 19b may include a design structure that fillcuts the ground in the third metal layer (L3). According to one embodiment, the ground line (640) of the fourth metal layer (L4) corresponding to the first planar portion (551) and the second planar portion (552) may extend to be continuously connected with the ground line (640) of the fourth metal layer (L4) corresponding to the bendable portion (553).

[0220] Referring to FIG. 20A, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may have a difference in that, unlike the embodiment of FIG. 18A, a differential signal line (630) is implemented in the form of a microstrip overlapping a single ground line (640). Hereinafter, only the embodiment of FIG. 20A, which is different from the embodiment of FIG. 18A, will be described. Accordingly, features not described in FIG. 20A will be replaced with the description of the embodiment of FIG. 18A.

[0221] According to one embodiment, in the first planar portion (551) and the second planar portion (552), the differential signal line (630) may be arranged on the second metal layer (L2). For example, in the first planar portion (551) and the second planar portion (552), the first signal line (631) and the second signal line (632) may be arranged with a gap therebetween.

[0222] According to one embodiment, in the first planar portion (551) and the second planar portion (552), the differential signal line (630) may be implemented in a microstrip form with a ground line (640) disposed underneath it. For example, in the first planar portion (551) and the second planar portion (552), the ground line (640) may be disposed on the first metal layer (L1) and may be disposed to at least partially overlap the first signal line (631) and the second signal line (632).

[0223] According to one embodiment, in the bendable portion (553), the differential signal line (630) may be arranged in a multi-layer structure. For example, in the bendable portion (553), the first signal line (631) may be arranged in the second metal layer (L2), and in the bendable portion (553), the second signal line (632) may be arranged in the third metal layer (L3). Here, the second signal line (632) may be arranged in the third metal layer (L3), but may be arranged to overlap at least partially with the first signal line (631). The end of the second signal line (632) disposed on the third metal layer (L3) corresponding to the bendable portion (553) can be electrically connected to the second signal lines (632) disposed on the second metal layer (L2) corresponding to the first planar portion (551) and the second planar portion (552) through a via (e.g., via (910) of FIG. 17).

[0224] According to one embodiment, in the bendable portion (553), the ground line (640) may be arranged on the first metal layer (L1) and may be arranged to at least partially overlap with the first signal line (631) and the second signal line (632).

[0225] According to one embodiment, the differential signal line (630) in the bendable portion (553) can be divided into a first region (6301) that overlaps with the ground line (640) and a second region (6302) that does not overlap with the ground line (640), taking impedance matching into consideration.

[0226] Referring to FIG. 20b, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may have a difference in that the laminated structure of each of the differential signal line (630) and the ground line (640) is changed, unlike the embodiment of FIG. 20a. Hereinafter, only the embodiment of FIG. 20b that is different from the embodiment of FIG. 20a will be described. Accordingly, features not described in FIG. 20b will be replaced with the description of the embodiment of FIG. 20a.

[0227] According to one embodiment, in the first planar portion (551) and the second planar portion (552), the differential signal line (630) may be arranged on the third metal layer (L3). For example, in the first planar portion (551) and the second planar portion (552), the first signal line (631) and the second signal line (632) may be arranged with a gap therebetween.

[0228] According to one embodiment, in the first planar portion (551) and the second planar portion (552), the differential signal line (630) may be implemented in a stripline form in which a ground line (640) is disposed on each of its upper and lower portions. For example, in the first planar portion (551) and the second planar portion (552), the ground line (640) may be disposed on the first metal layer (L1) and the fourth metal layer (L4), and these may be disposed to at least partially overlap the first signal line (631) and the second signal line (632).

[0229] According to one embodiment, in the bendable portion (553), the differential signal line (630) may be arranged in a multi-layer structure. For example, in the bendable portion (553), the first signal line (631) may be arranged in the second metal layer (L2), and in the bendable portion (553), the second signal line (632) may be arranged in the third metal layer (L3). Here, the second signal line (632) may be arranged in the third metal layer (L3) so as to overlap at least partially with the first signal line (631). An end of the first signal line (631) arranged in the second metal layer (L2) corresponding to the bendable portion (553) may be electrically connected to the first signal lines (631) arranged in the third metal layer (L3) corresponding to the first planar portion (551) and the second planar portion (552) through a via (not shown).

[0230] According to one embodiment, in the bendable portion (553), the ground line (640) may be arranged on the first metal layer (L1) and may be arranged to at least partially overlap with the first signal line (631) and the second signal line (632).

[0231] According to one embodiment, the differential signal line (630) in the bendable portion (553) can be divided into a first region (6301) that overlaps with the ground line (640) and a second region (6302) that does not overlap with the ground line (640), taking impedance matching into consideration.

[0232] Referring to FIG. 21A, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may have a difference in that the line width of the differential signal line (630) is increased, unlike the embodiment of FIG. 20A. Hereinafter, only the embodiment of FIG. 21A that is different from the embodiment of FIG. 20A will be described. Accordingly, features not described in FIG. 21A will be replaced with the description of the embodiment of FIG. 20A.

[0233] According to one embodiment, the support plate (550) can reduce DCR and reduce signal loss by increasing the line width of the differential signal line (630) in the first planar portion (551) and the second planar portion (552). As the line width of the differential signal line (630) increases, impedance can decrease, and the support plate (550) can take this into consideration to reduce the area where the differential signal line (630) and the ground line (640) overlap each other. Similarly, the support plate (550) can be designed so that the differential signal line (630) and the ground line (640) do not completely overlap each other in the bendable portion (553), thereby enabling impedance matching, reducing DCR and reducing signal loss due to the increased line width. For example, in the flexible portion (553), the differential signal line (630) can be divided into a first region (6301) that overlaps with the ground line (640) and a second region (6302) that does not overlap with the ground line (640).

[0234] According to one embodiment, the first signal line (631) in the bendable portion (553) can be divided into a first region (6301) that overlaps with the ground line (640) and a second region (6302) that does not overlap with the ground line (640), taking impedance matching into consideration.

[0235] According to one embodiment, the second signal line (632) in the bendable portion (553) may not completely overlap with the first signal line (631). According to one embodiment, the second signal line (632) may be divided into a third region (6304) overlapping with the ground line (640) and a fourth region (6305) not overlapping with the ground line (640), taking impedance matching into consideration. For example, the width of the fourth region (6305) of the second signal line (632) may be different from the width of the second region (6302) of the first signal line (631).

[0236] Referring to FIG. 21b, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may have a difference in that the laminated structure of each of the differential signal line (630) and the ground line (640) is changed, unlike the embodiment of FIG. 21a. Hereinafter, only the embodiment of FIG. 21b, which is different compared to the embodiment of FIG. 21a, will be described. Therefore, features not described in FIG. 21b will be replaced with the description of the embodiment of FIG. 21a.

[0237] According to one embodiment, in the first planar portion (551) and the second planar portion (552), the differential signal line (630) may be arranged on the third metal layer (L3). For example, in the first planar portion (551) and the second planar portion (552), the first signal line (631) and the second signal line (632) may be arranged with a gap therebetween.

[0238] According to one embodiment, in the first planar portion (551) and the second planar portion (552), the differential signal line (630) may be implemented in a stripline form in which a ground line (640) is disposed on each of its upper and lower portions. For example, in the first planar portion (551) and the second planar portion (552), the ground line (640) may be disposed on the first metal layer (L1) and the fourth metal layer (L4), and these may be disposed to at least partially overlap the first signal line (631) and the second signal line (632).

[0239] According to one embodiment, in the bendable portion (553), the differential signal line (630) may be arranged in a multi-layer structure. For example, in the bendable portion (553), the first signal line (631) may be arranged in the second metal layer (L2), and in the bendable portion (553), the second signal line (632) may be arranged in the third metal layer (L3). Here, the second signal line (632) may be arranged in the third metal layer (L3) so as to overlap at least partially with the first signal line (631). An end of the first signal line (631) arranged in the second metal layer (L2) corresponding to the bendable portion (553) may be electrically connected to the first signal lines (631) arranged in the third metal layer (L3) corresponding to the first planar portion (551) and the second planar portion (552) through a via (not shown).

[0240] According to one embodiment, in the bendable portion (553), the ground line (640) may be arranged on the first metal layer (L1) and may be arranged to at least partially overlap with the first signal line (631) and the second signal line (632).

[0241] According to one embodiment, the differential signal line (630) in the bendable portion (553) can be divided into a first region (6301) that overlaps with the ground line (640) and a second region (6302) that does not overlap with the ground line (640), taking impedance matching into consideration.

[0242] According to one embodiment, the ground line (640) in the bendable portion (553) may be arranged in a single layer form. For example, the ground line (640) in the bendable portion (553) may be arranged in the first metal layer (L1).

[0243] Referring to FIG. 21c, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may have a difference in that the line width of the differential signal line (630) is reduced, unlike the embodiment of FIG. 21b. Hereinafter, only the embodiment of FIG. 21c, which is different from the embodiment of FIG. 21b, will be described. Accordingly, features not described in FIG. 21c will be replaced with the description of the embodiment of FIG. 21b.

[0244] In the embodiment of FIG. 21c, compared to the embodiment of FIG. 21b, the distance between the differential signal line (630) and the overlapping ground line (640) may be changed. For example, in the first planar portion (551) and the second planar portion (552), the distance (d3) from the differential signal line (630) to the ground line (640) of the first metal layer (L1) positioned thereon may increase. For example, in the first planar portion (551) and the second planar portion (552), the distance (d4, d4 being smaller than d3) from the differential signal line (630) to the ground line (640) of the fourth metal layer (L4) positioned thereon may decrease. In this case, the impedance of the differential signal line (630) may be reduced compared to the embodiment of FIG. 21b. The embodiment of FIG. 21c can increase the impedance by relatively reducing the line width of the differential signal line (630) and relatively increasing the spacing between the first signal line (631) and the second signal line (632), taking into account the reduced impedance of the differential signal line (630) compared to the embodiment of FIG. 21b.

[0245] FIG. 22 is a plan view illustrating a portion of an RF signal line (650) of a support plate (550) according to one embodiment.

[0246] The support plate (550) of FIG. 22 may be at least partially similar to the support plates (550) of FIGS. 5, 6, and 7, or may further include other embodiments of the support plate (550). The features of the support plate (550) described with reference to FIG. 22 may be applied to the support plates (550) of FIGS. 5, 6, 7, and 10 to 13.

[0247] Referring to FIG. 22, a support plate (550) according to one embodiment (e.g., the support plate (550) of FIG. 6) may further include an RF signal line (650) arranged to extend from at least a portion of the first planar portion (551) across the bendable portion (553) to at least a portion of the second planar portion (552). The RF signal line (650) may be arranged at a distance from a differential signal line (630) according to various embodiments described in the present disclosure.

[0248] According to one embodiment, in the bendable portion (553), the RF signal line (650) may include at least one first line segment (1021) branching into a third curved path (1011) and a fourth curved path (1012) bypassing the plurality of openings (5531), and at least one second line segment (1022) in which the third curved path (1011) and the fourth curved path (1012) merge into one path. In the bendable portion (553), the RF signal line (650) may be extended to branch from the first line segment (1021) and then extended to merge again into the second line segment (1022), a structure may be repeated.

[0249] According to one embodiment, the RF signal line (650) may include a first line section (6501) arranged in a first planar portion (551) and a second planar portion (552) and designed to have an impedance of about 50 ohms, a second line section (6502) branched from a bendable portion (553) to form at least one first line section (1021) and designed to have an impedance of about 100 ohms to about 120 ohms, and a third line section (6503) merged into one line at the bendable portion (553) and designed to have an impedance of about 50 ohms.

[0250] According to one embodiment, the RF signal line (650) can be designed to have an impedance of about 100 ohms to about 120 ohms at the flexible portion (553) to improve insertion loss characteristics. According to one embodiment, since the RF signal line (650) has a design section of about 100 ohms to about 120 ohms connected in parallel at the flexible portion (553), the overall impedance of the flexible portion (553) can be an impedance of about 50 ohms.

[0251] According to one embodiment, the width of the RF signal line (650) in the first line section (1021) can be designed to be smaller than the width of the RF signal line (650) in the second line section (1022), and accordingly, the RF signal line (650) can be designed to have an impedance of about 100 ohms to about 120 ohms in the first line section (1021) of the bendable portion (553).

[0252] In one embodiment of the present disclosure, an electronic device comprises a foldable housing including a first housing, a second housing, and a hinge structure connecting the first housing and the second housing, and a flexible display disposed on the foldable housing, the flexible display comprising a display panel, a polymer member disposed on a rear surface of the display panel, and a support plate (550) disposed on a rear surface of the polymer member, wherein the support plate (550) comprises a first flat portion (551) facing the first housing, a second flat portion (552) facing the second housing, a bendable portion (553) disposed between the first flat portion (551) and the second flat portion (552) to face the hinge structure and formed to be bendable through a plurality of openings (5531) disposed at intervals, and a bendable portion (553) extending from at least a portion of the first flat portion (551) across the bendable portion (553) to at least a portion of the second flat portion (552). At least one differential signal line (630) is arranged to extend and includes a first signal line (631) and a second signal line (632), and in the first planar portion (551) and the second planar portion (552), the first signal line (631) and the second signal line (632) are arranged, and in the bendable portion (553), the first signal line (631) can extend along a first curved path including a plurality of U-shaped portions arranged around the plurality of openings (5531), and in the bendable portion (553), the second signal line (632) can extend along a second curved path including a plurality of U-shaped portions arranged around the plurality of openings (5531).

[0253] In the first flat portion (551) and the second flat portion (552), each of the first signal line (631) and the second signal line (632) has a first width, and in the bendable portion (553), each of the first signal line (631) and the second signal line (632) can have the first width or a second width greater than the first width.

[0254] The first curved path on which the first signal line (631) is arranged includes at least one first adjacent path adjacent to the second signal line (632), wherein the first signal line (631) has the first width in the first adjacent path, and the second curved path on which the second signal line (632) is arranged includes at least one second adjacent path adjacent to the first signal line (631), wherein the second signal line (632) can have the first width in the second adjacent path.

[0255] The support plate (550) may further include a ground line (640) disposed on a different layer from the differential signal line (630), disposed to extend from at least a portion of the first planar portion (551) across the bendable portion (553) to at least a portion of the second planar portion (552), and overlapping at least a portion of the differential signal line (630).

[0256] In the first flat portion (551) and the second flat portion (552), the ground line (640) may have a third width, and in the bendable portion (553), the ground line (640) may have a fourth width that is smaller than the third width or the third width.

[0257] The above ground line (640) may have the third width in a path overlapping with the first adjacent path and the second adjacent path in which the first signal line (631) and the second signal line (632) are adjacently arranged.

[0258] The support plate (550) further includes an RF signal line (650) arranged to extend from at least a portion of the first planar portion (551) across the bendable portion (553) to at least a portion of the second planar portion (552), and in the bendable portion (553), the RF signal line (650) may include at least one first line section branching into a third curved path and a fourth curved path bypassing the plurality of openings (5531), and at least one second line section in which the third curved path and the fourth curved path are merged into one path.

[0259] In the first flat portion (551) and the second flat portion (552), the RF signal line (650) may be designed to have an impedance of about 50 ohms, in the flexible portion (553), the first line section of the RF signal line (650) may be designed to have an impedance of about 100 ohms, and in the flexible portion (553), the second line section of the RF signal line (650) may be designed to have an impedance of about 50 ohms.

[0260] The above support plate (550) may include GFRP (glass fiber reinforced plastic).

[0261] The above support plate (550) may include CFRP (carbon fiber reinforced plastic).

[0262] The first curved path and the second curved path may be arranged adjacent to different parts of the plurality of openings.

[0263] The plurality of U-shaped portions included in the first curved path and the plurality of U-shaped portions included in the second curved path can be arranged symmetrically to each other.

[0264] The plurality of U-shaped portions included in the first curved path and the plurality of U-shaped portions included in the second curved path can bypass different portions of the plurality of openings.

[0265] An electronic device according to one embodiment of the present disclosure comprises a foldable housing including a first housing, a second housing, and a hinge structure connecting the first housing and the second housing, and a flexible display disposed on the foldable housing, the flexible display including a display panel, a polymer member disposed on a rear surface of the display panel, and a support plate (550) disposed on a rear surface of the polymer member, wherein the support plate (550) comprises a first planar portion (551) facing the first housing, a second planar portion (552) facing the second housing, a bendable portion (553) disposed between the first planar portion (551) and the second planar portion (552) so as to face the hinge structure and formed to be bendable through a plurality of openings (5531) disposed at intervals, and extending from at least a portion of the first planar portion (551) across the bendable portion (553) to at least a portion of the second planar portion (552). A differential signal line (630) is disposed and includes a first signal line (631) and a second signal line (632), wherein in the first planar portion (551) and the second planar portion (552), the first signal line (631) and the second signal line (632) are disposed in parallel with a specified interval, and in the bendable portion (553), the first signal line (631) extends along a first curved path that bypasses the plurality of openings (5531), and in the bendable portion (553), the second signal line (632) extends along a second curved path that overlaps at least a portion of the first curved path, wherein the second signal line (632) can be disposed in a different layer from the first signal line (631) in the second curved path.

[0266] In the first flat portion (551) and the second flat portion (552), the first signal line (631) and the second signal line (632) are arranged on the same layer, and in the bendable portion (553), the first signal line (631) and the second signal line (632) can be arranged on different layers.

[0267] The second signal line (632) may include an upper line section arranged on the same layer as the first signal line (631) in the first planar portion (551) and the second planar portion (552), and a lower line section electrically connected to the upper line section through a via and overlapping at least a portion of the first signal line (631) in the bendable portion (553).

[0268] The above via can be arranged at at least a portion of the boundary between the first planar portion (551) and the bendable portion (553) and at least a portion of the boundary between the second planar portion (552) and the bendable portion (553).

[0269] In the first flat portion (551) and the second flat portion (552), each of the first signal line (631) and the second signal line (632) has a first width, and in the bendable portion (553), each of the first signal line (631) and the second signal line (632) can have the first width or a second width greater than the first width.

[0270] The support plate (550) may further include a ground line (640) disposed on a different layer from the differential signal line (630), disposed to extend from at least a portion of the first planar portion (551) across the bendable portion (553) to at least a portion of the second planar portion (552), and overlapping at least a portion of the differential signal line (630).

[0271] The support plate (550) further includes an RF signal line (650) arranged to extend from at least a portion of the first planar portion (551) across the bendable portion (553) to at least a portion of the second planar portion (552), and in the bendable portion (553), the RF signal line (650) may include at least one first line section branching into a third curved path and a fourth curved path bypassing the plurality of openings (5531), and at least one second line section in which the third curved path and the fourth curved path are merged into one path.

Claims

1. In electronic devices, A foldable housing including a first housing, a second housing, and a hinge structure connecting the first housing and the second housing; and A flexible display disposed on the above foldable housing, display panel, A polymer member disposed on the back surface of the above display panel, and A flexible display comprising a support plate (550) disposed on the back surface of the polymer member, The above support plate (550) is A first flat surface (551) facing the first housing, A second flat surface (552) facing the second housing, A bendable portion (553) formed to be bendable through a plurality of openings (5531) arranged to face the hinge structure between the first flat portion (551) and the second flat portion (552) and arranged at intervals, and At least one differential signal line (630) is arranged to extend from at least a portion of the first planar portion (551) across the bendable portion (553) to at least a portion of the second planar portion (552), and includes a first signal line (631) and a second signal line (632). In the first plane portion (551) and the second plane portion (552), the first signal line (631) and the second signal line (632) are arranged, In the above bendable portion (553), the first signal line (631) extends along a first curved path including a plurality of U-shaped portions arranged around the plurality of openings (5531), In the above bendable portion (553), the second signal line (632) extends along a second curved path including a plurality of U-shaped portions arranged around the plurality of openings (5531). Electronic devices.

2. In paragraph 1, In the first plane portion (551) and the second plane portion (552), each of the first signal line (631) and the second signal line (632) has a first width, In the above bendable portion (553), each of the first signal line (631) and the second signal line (632) has the first width or a second width greater than the first width. Electronic devices.

3. In paragraph 2, The first curved path on which the first signal line (631) is arranged includes at least one first adjacent path adjacent to the second signal line (632), wherein the first signal line (631) has the first width in the first adjacent path, The second curved path on which the second signal line (632) is arranged includes at least one second adjacent path adjacent to the first signal line (631), wherein the second signal line (632) has the first width in the second adjacent path. Electronic devices.

4. In paragraph 3, The above support plate (550) is A ground line (640) is further included, which is arranged on a different layer from the differential signal line (630), and extends from at least a portion of the first planar portion (551) across the bendable portion (553) to at least a portion of the second planar portion (552), and overlaps at least a portion of the differential signal line (630). Electronic devices.

5. In paragraph 4, In the first plane portion (551) and the second plane portion (552), the ground line (640) has a third width, In the above bendable portion (553), the ground line (640) has a fourth width smaller than the third width or the third width. Electronic devices.

6. In paragraph 5, The ground line (640) has the third width in the path overlapping the first adjacent path and the second adjacent path, where the first signal line (631) and the second signal line (632) are adjacently arranged. Electronic devices.

7. In paragraph 1, The support plate (550) further includes an RF signal line (650) arranged to extend from at least a portion of the first planar portion (551) across the bendable portion (553) to at least a portion of the second planar portion (552). In the above bendable portion (553), the RF signal line (650) includes at least one first line section branching into a third curved path and a fourth curved path bypassing the plurality of openings (5531), and at least one second line section in which the third curved path and the fourth curved path are merged into one path. Electronic devices.

8. In paragraph 7, In the first plane portion (551) and the second plane portion (552), the RF signal line (650) is designed with an impedance of about 50 ohms, In the above bendable portion (553), the first line section of the RF signal line (650) is designed to have an impedance of about 100 ohms, In the above bendable portion (553), the second line section of the RF signal line (650) is designed to have an impedance of about 50 ohms. Electronic devices.

9. In paragraph 1, The above support plate (550) includes GFRP (glass fiber reinforced plastic). Electronic devices.

10. In paragraph 1, The above support plate (550) includes CFRP (carbon fiber reinforced plastic). Electronic devices.

11. In paragraph 1, The first curved path and the second curved path are arranged adjacent to different parts of the plurality of openings, Electronic devices.

12. In paragraph 1, The plurality of U-shaped portions included in the first curved path and the plurality of U-shaped portions included in the second curved path are arranged symmetrically to each other. Electronic devices.

13. In paragraph 1, The plurality of U-shaped portions included in the first curved path and the plurality of U-shaped portions included in the second curved path bypass different portions of the plurality of openings. Electronic devices.

14. In electronic devices, A foldable housing including a first housing, a second housing, and a hinge structure connecting the first housing and the second housing; and A flexible display disposed on the above foldable housing, display panel, A polymer member disposed on the back surface of the above display panel, and A flexible display comprising a support plate (550) disposed on the back surface of the polymer member, The above support plate (550) is A first flat surface (551) facing the first housing, A second flat surface (552) facing the second housing, A bendable portion (553) formed to be bendable through a plurality of openings (5531) arranged to face the hinge structure between the first flat portion (551) and the second flat portion (552) and arranged at intervals, and At least one differential signal line (630) is arranged to extend from at least a portion of the first planar portion (551) across the bendable portion (553) to at least a portion of the second planar portion (552), and includes a first signal line (631) and a second signal line (632). In the first plane portion (551) and the second plane portion (552), the first signal line (631) and the second signal line (632) are arranged in parallel with a specified interval, In the above bendable portion (553), the first signal line (631) extends along a first curved path that bypasses the plurality of openings (5531), In the above bendable portion (553), the second signal line (632) extends along a second curved path that overlaps at least a portion of the first curved path, and the second signal line (632) is arranged in a different layer from the first signal line (631) in the second curved path. Electronic devices.

15. In paragraph 14, In the first plane portion (551) and the second plane portion (552), the first signal line (631) and the second signal line (632) are arranged on the same layer, In the above bendable portion (553), the first signal line (631) and the second signal line (632) are arranged in different layers. Electronic devices.

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