Electronic device comprising antenna

Conductive portions on metal frames in foldable devices serve as antennas, addressing communication challenges by ensuring consistent signal performance across different device configurations.

WO2026054611A1PCT designated stage Publication Date: 2026-03-12SAMSUNG ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-09-08
Publication Date
2026-03-12

AI Technical Summary

Technical Problem

Existing electronic devices face challenges in efficiently utilizing metal housings as antennas for wireless communication, particularly in foldable devices where structural changes affect signal transmission and reception.

Method used

The implementation of conductive portions on the side surfaces of metal frames in a foldable electronic device's housing parts, which act as antennas, allowing for effective signal transmission and reception across different device configurations.

Benefits of technology

Enhances wireless communication performance by maintaining signal integrity and efficiency in various device states, including unfolded, partially folded, and fully folded positions.

✦ Generated by Eureka AI based on patent content.

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Abstract

This electronic device comprises: a housing comprising a first housing part, a second housing part, and a third housing part; a first hinge structure rotatably coupling the first housing part and the second housing part; a second hinge structure rotatably coupling the second housing part and the third housing part; at least one wireless communication circuit for transmitting or receiving a signal in a frequency band; and metal frames, wherein a third metal frame comprises a first conductive portion formed at least partially at a side surface thereof, and a second conductive portion formed at least partially at the side surface thereof, a first metal frame or a second metal frame comprises a third conductive portion having a length direction substantially perpendicular to the length direction of the side surface of the third metal frame, and, in a state where the second housing part and the third housing part are folded, the third conductive portion may be used for transmitting or receiving signals.
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Description

Electronic device including an antenna

[0001] The descriptions below relate to electronic devices that include antennas.

[0002] An electronic device may transmit signals via an antenna or receive signals via an antenna. The electronic device may include a conductive portion positioned on a portion of an edge of a metal housing. The conductive portion may function as an antenna radiator for transmitting and / or receiving signals.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a housing including a first housing part, a second housing part, and a third housing part; a first hinge structure rotatably connecting the first housing part and the second housing part; a second hinge structure rotatably connecting the second housing part and the third housing part; and at least one wireless communication circuit for transmitting or receiving a signal in a frequency band. The first housing part may include a first metal frame. The second housing part may include a second metal frame. The third housing part may include a third metal frame having a top, a bottom, and a side surface. The third metal frame may include a first conductive portion formed at least partially on the side surface and a second conductive portion formed at least partially on the side surface. The first metal frame or the second metal frame may include a third conductive portion having a longitudinal direction substantially perpendicular to a longitudinal direction of the side surface of the third metal frame. In a folded state of the second housing part and the third housing part, while signals are transmitted or received through the first conductive part in the frequency band, the third conductive part can be used to transmit or receive signals.

[0005] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a housing including a first housing part, a second housing part, and a third housing part; a first hinge structure rotatably connecting the first housing part and the second housing part; a second hinge structure rotatably connecting the second housing part and the third housing part; and at least one wireless communication circuit for transmitting or receiving a signal in a frequency band. The first housing part may include a first metal frame. The second housing part may include a second metal frame. The third housing part may include a third metal frame having a top, a bottom, and a side surface. The third metal frame may include a first conductive portion formed at least partially on the side surface and a second conductive portion formed at least partially on the side surface. The second metal frame may include a third conductive portion having a length of about 25 millimeters (mm) or more in a direction substantially perpendicular to a longitudinal direction of the side surface of the third metal frame. The first conductive portion and the third conductive portion can be used to transmit or receive signals in the frequency band through the wireless communication circuit.

[0006] Figure 1 is a block diagram of an electronic device within a network environment.

[0007] Figures 2a, 2b, 2c, 3a, and 3b illustrate examples of foldable-type electronic devices.

[0008] Figures 4a and 4b show examples of foldable-type electronic devices.

[0009] FIG. 5a, FIG. 5b, FIG. 5c, FIG. 6a, and FIG. 6b illustrate examples of foldable-type electronic devices.

[0010] Fig. 7 shows an example of a foldable-type electronic device.

[0011] Figure 8a shows examples of states of a foldable-type electronic device.

[0012] Figure 8b shows an example of functional components of a foldable-type electronic device.

[0013] Figure 8c shows an example of functional components of a foldable-type electronic device.

[0014] Figure 9 shows an example of the performance of a foldable-type electronic device by current mode.

[0015] Figure 10 shows an example of an electronic device that uses the conductive portion of the second housing part as a radiator.

[0016] Figures 11a and 11b show examples of radiation performance in the unfolded state.

[0017] Figures 12a and 12b show examples of radiation performance in a half-folded state.

[0018] Figures 13a and 13b show examples of radiation performance in a folded state.

[0019] Figure 14a shows an example of current distribution in an electronic device using the conductive portion of the second housing part.

[0020] Figure 14b shows an example of a radiation pattern of an electronic device utilizing the conductive portion of the second housing part.

[0021] Figure 15 shows an example of an electronic device that uses the conductive portion of the third housing part as a radiator.

[0022] Figure 16a shows an example of current distribution in an electronic device using the conductive portion of the third housing part.

[0023] Figure 16b shows an example of a radiation pattern of an electronic device utilizing the conductive portion of the third housing part.

[0024] Fig. 17 shows an example of an electronic device including a filter circuit.

[0025] Figure 18 shows examples of conductive parts in a foldable-type electronic device.

[0026] Figure 19 shows examples of conductive parts in a foldable-type electronic device.

[0027] Figures 20a and 20b show examples of states of a foldable-type electronic device.

[0028] Figures 21a and 21b show examples of states of a foldable-type electronic device.

[0029] FIG. 22 illustrates an example of an electronic device including at least one sensor.

[0030] Figure 23 shows the operation flow of an electronic device for performing multi-antenna communication according to the state of the electronic device.

[0031] Figure 24 shows the operation flow of an electronic device for performing multi-antenna communication using a grip sensor.

[0032] Figure 25 shows the operation flow of an electronic device for performing multi-antenna communication using a receiver.

[0033] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0034] The various embodiments of the present disclosure described below illustrate a hardware-based approach as an example. However, since the various embodiments of the present disclosure include techniques utilizing both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0035] Terms referring to parts of electronic devices used in the following description (e.g., substrate, PCB (printed circuit board), FPCB (flexible PCB), PBA (printed board assembly), module, antenna, antenna element, circuit, processor, chip, component, or device), terms referring to RF-related parts (FEM (front end module0), PAM (power amplifier module), FEMid (FEM including duplexer), PAMid (power amplifier module including duplexer), LPAMid (low noise amplifier PAM including duplexer), RFFE (radio frequency front end)), RFIC (radio frequency integrated circuit)), terms referring to at least a part of an antenna (e.g., antenna radiator, radiator, conductive part, conductive line pattern, coil, conductive member, radiating member, radiating material, radiating part, antenna structure, antenna structure), terms referring to the shape of a part (e.g., structure, structure, support, contact, or protrusion), terms referring to a connection between structures (e.g., connection, contact, support, contact structure, conductive member, or Terms referring to an assembly), open structure (e.g., slot, slit, or opening), circuit (e.g., PCB, FPCB, signal line, ground line, feeding line, data line, RF signal line, antenna line, RF path, RF module, RF circuit, splitter, divider, coupler, or combiner), etc. are examples for convenience of explanation. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used.Additionally, the terms '...bu', '...gi', '...mul', or '...che' used hereinafter may mean at least one shape structure or a unit that processes a function.

[0036] In addition, in the present disclosure, expressions such as "more than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled, but this is merely a description for expressing an example and does not exclude descriptions such as "more than" or "less than." A condition described as "more than" may be replaced with "more than," a condition described as "less than" may be replaced with "less than," and a condition described as "more than and less than" may be replaced with "more than and less than." In addition, hereinafter, "A" to "B" mean at least one of the elements from A (including A) to B (including B). hereinafter, "C" and / or "D" mean at least one of "C" or "D," that is, including {"C", "D", "C" and "D"}. hereinafter, the meaning of "about E" may be replaced with a value within a margin of error of ±5% or ±10% based on E.

[0037] Figure 1 is a block diagram of an electronic device within a network environment.

[0038] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0039] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0040] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0041] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0042] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0043] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0044] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0045] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0046] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0047] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0048] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0049] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0050] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0051] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0052] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0053] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0054] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0055] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0056] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0057] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0058] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0059] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0060] FIGS. 2A, 2B, 2C, 3A, and 3B illustrate examples of foldable-type electronic devices (e.g., electronic device (101)). FIG. 2A illustrates an example of a first state of the electronic device. FIG. 2B illustrates an example of a second state of the electronic device. FIG. 2C illustrates an example of a third state of the electronic device. The electronic device (200) may be referred to as electronic device (101).

[0061] Referring to FIGS. 2A, 2B, and 2C, an electronic device (200) may include a housing structure (201), a flexible display (240), a first hinge structure (250), a second hinge structure (260), and a display (270). The housing structure (201) may include a first housing part (210), a second housing part (220), and a third housing part (230).

[0062] The first housing part (210) can be rotatably coupled to the second housing part (220) by the first hinge structure (250). The second housing part (220) and the first housing part (210) can be rotated with respect to the first hinge structure (250). While the first housing part (210) is rotated with respect to the first hinge structure (250), the second housing part (220) can be rotated with respect to the first hinge structure (250). For example, when the second housing part (220) and the first housing part (210) are rotated with respect to the first hinge structure (250), the angular displacement of the second housing part (220) can be substantially equal to the angular displacement of the first housing part (210).

[0063] The third housing part (230) can be rotatably coupled to the second housing part (220) by a second hinge structure (260). The second housing part (220) and the third housing part (230) can rotate with respect to the second hinge structure (260). While the second housing part (220) rotates with respect to the second hinge structure (260), the third housing part (230) can rotate with respect to the second hinge structure (260). For example, when the second housing part (220) and the third housing part (230) rotate with respect to the second hinge structure (260), the angular displacement (or angular change) of the second housing part (220) can be substantially equal to the angular displacement of the third housing part (230).

[0064] The first hinge structure (250) and the second hinge structure (260) can change the state of the electronic device. The first hinge structure (250) and the second hinge structure (260) can provide (or enable) a first state (200a) of the electronic device (200) (or a first state (200a) of the housing structure (201)). The first state (200a) of the electronic device (200) (or the first state (200a) of the housing structure (201)) can be described as an unfolded state (or an unfolded state) of the electronic device (200) (or the housing structure (201)). Within the first state (200a), the front surface of the first housing part (210), the front surface of the second housing part (220), and the front surface of the third housing part (230) can define the front surface of the electronic device (200). Within the first state (200a), the front of the first housing part (210), the front of the second housing part (220), and the front of the third housing part (230) can face the same direction. Within the first state (200a), the electronic device (200) can provide a large display area of ​​the flexible display (240) to the user.

[0065] The first hinge structure (250) and the second hinge structure (260) can provide a second state (200b) of the electronic device (200). The second state (200b) of the electronic device (200) can be described as a state in which the electronic device (200) is partially folded and partially unfolded (or a single folded state, a half-folded state, or a semi-folded state). For example, within the second state (200b), the front surface of the second housing part (220) and the front surface of the third housing part (230) may face the same direction, and the front surface of the first housing part (210) and the front surface of the second housing part (220) may face opposite directions. For example, within the third state, the first housing part (210) and the second housing part (220) may be folded, and the second housing part (220) and the third housing part (230) may be unfolded. Within the second state (200b), the electronic device (200) can transmit visual information through a portion of the flexible display (240) (e.g., the third display area (240c)).

[0066] The electronic device (200) can change from the first state (200a) to the third state (200c) through the second state (200b). The electronic device (200) can change from the first state (200a), which is an unfolded state, to the second state (200b), which is a partially unfolded state. For example, the electronic device (200) can change from the first state (200a), in which the first housing part (210), the second housing part (220), and the third housing part (230) face the same direction, to the second state (200b), in which the front of the first housing part (210) faces the front of the second housing part (220). The electronic device (200) can change from the second state (200b), which is a partially unfolded state, to the third state (200c), which is a folded state. For example, when changing from the second state (200b) to the third state (200c), the folded first housing part (210) and second housing part (220) can be placed on the third housing part (230).

[0067] The first hinge structure (250) and the second hinge structure (260) can provide a third state (200c) of the electronic device (200) (or a third state (200c) of the housing structure (201)). The third state (200c) of the electronic device (200) (or the third state (200c) of the housing structure (201)) can be described as a folded state (or a folding state, a multi-folding state, or a full-folding state) of the electronic device (200) (or the housing structure (201)). Within the third state (200c), the front surface of the first housing part (210) and the front surface of the second housing part (220) can face opposite directions, and the front surface of the second housing part (220) and the front surface of the third housing part (230) can face opposite directions. Within the third state (200c), the front of the first housing part (210) and the front of the third housing part (230) may face the same direction. For example, within the third state (200c), the front of the second housing part (220) may face the front of the first housing part (210), and the front of the third housing part (230) may face the rear of the first housing part (210). Within the third state (200c), the rear of the second housing part (220) may be exposed to the outside. The camera (275) may be disposed on the rear of the second housing part (220). Within the third state (200c), the rear of the third housing part (230) may be exposed to the outside. The display (270) may be disposed on the rear of the third housing part (230). Within the third state (200c), the electronic device (200) can be folded to improve portability and provide visual information through a display (270) disposed in the third housing part (230) of the electronic device (200) in the third state (200c).

[0068] The electronic device (200) may further include a key button (239). The key button (239) may be exposed from a structure (e.g., an opening) formed on a side of the third housing part (230) and may partially protrude outside the electronic device (200). The key button (239) may physically provide an input to a processing circuit inside the electronic device (200) by pressure transmitted from the outside. The key button (239) may not be included in the electronic device and may be implemented in another form, such as a soft key displayed on a flexible display (240) or a display (270).

[0069] The key button (239) may be positioned on the side of the third housing part (230) so as to be exposed to the outside in the third state (200c). The key button positioned on the third housing part (230) may move from the left side of the electronic device (200) to the right side of the electronic device (200) as the state of the electronic device (200) changes from the third state (200c) to the first state (200a) by a user looking at the display. For example, referring to FIG. 2a, in the first state (200a), when the flexible display (240) is viewed from above, the key button (239) may be positioned on the right side. Referring to FIG. 2b, in the third state (200c), when the display (270) is viewed from above, the key button (239) may be positioned on the left side.

[0070] A flexible display (240) can at least partially define the appearance of the electronic device (200). The flexible display (240) can be partially disposed within the housing structure (201). The flexible display (240) can define the front surface of the electronic device (200). The flexible display (240) can include a first unbendable portion (241), a second unbendable portion (242), a third unbendable portion (243), a first bendable portion (244), and a second bendable portion (245). The first unbendable portion (241) of the flexible display (240) can be disposed on the front surface of the first housing part (210). The second unbendable portion (242) of the flexible display (240) can be disposed on the front surface of the second housing part (220). The third unbendable part (243) of the flexible display (240) may be disposed on the front side of the third housing part (230). The first bendable part (244) of the flexible display (240) may be disposed between the first unbendable part (241) and the second unbendable part (242) of the flexible display (240). For example, the first bendable part (244) of the flexible display (240) may be disposed on the first hinge structure (250) connecting the first housing part (210) and the second housing part (220). The second bendable part (245) of the flexible display (240) may be disposed between the second unbendable part (242) and the third unbendable part (243) of the flexible display (240). For example, the second bendable portion (245) of the flexible display (240) may be placed on a second hinge structure (260) connecting the second housing part (220) and the third housing part (230).

[0071] The first hinge structure (250) and the second hinge structure (260) may face substantially the same direction as the first unbendable portion (241) of the flexible display (240), the second unbendable portion (242) of the flexible display (240), and the third unbendable portion (243) of the flexible display (240). In the first state (200a), the first bendable portion (244) and the second bendable portion (245) may be arranged in substantially the same horizontal plane as the first unbendable portion (241), the second unbendable portion (242), and the third unbendable portion (243).

[0072] The first hinge structure (250) and the second hinge structure (260) can provide a second state (200b) of the electronic device (200). Within the second state (200b), the first unbendable portion (241) of the flexible display (240) can face the second unbendable portion (242) of the flexible display (240), and the third unbendable portion (243) of the flexible display (240) can face the same direction as the second unbendable portion (242) of the flexible display (240). For example, the second unbendable portion (242) and the third unbendable portion (243) can be arranged in substantially the same horizontal plane.

[0073] In the second state (200b), the first bendable portion (244) of the flexible display (240) is bent by the first hinge structure (250), so that the first bendable portion (244) of the flexible display (240) can be folded so that the first unbendable portion (241) of the flexible display (240) and the second unbendable portion (242) of the flexible display (240) face different directions.

[0074] In the second state (200b), the second bendable portion (245) of the flexible display (240) is maintained in an unfolded state by the second hinge structure (260), so that the second bendable portion (245) of the flexible display (240) can unfold so that the second unbendable portion (242) of the flexible display (240) and the third unbendable portion (243) of the flexible display (240) face the same direction.

[0075] The first hinge structure (250) and the second hinge structure (260) can provide a third state (200c) of the electronic device (200). Within the third state (200c), the second unbendable portion (242) of the flexible display (240) can face the first unbendable portion (241) of the flexible display (240), and the third unbendable portion (243) of the flexible display (240) can face the back of the first housing part (210).

[0076] In the third state (200c), the first bendable portion (244) of the flexible display (240) is bent by the first hinge structure (250), so that the first bendable portion (244) of the flexible display (240) can be folded so that the first unbendable portion (241) of the flexible display (240) and the second unbendable portion (242) of the flexible display (240) face different directions.

[0077] In the third state (200c), the second bendable portion (245) of the flexible display (240) is bent by the second hinge structure (260), so that the second bendable portion (245) of the flexible display (240) can be folded such that the second unbendable portion (242) of the flexible display (240) and the third unbendable portion (243) of the flexible display (240) face different directions. The second bendable portion (245) may further include a first deformable portion (245a), a second deformable portion (245b), and a flat portion (245c). The first deformable portion (245a) may be disposed between the planar portion (245c) and the second unbendable portion (242), and the second deformable portion (245b) may be disposed between the planar portion (245c) and the third unbendable portion (243). The planar portion (245c) may be disposed between the first deformable portion (245a) and the second deformable portion (245b). The planar portion (245c) may be supported by a support plate (e.g., the support plate (364) of FIG. 3a) that is distinct from the hinge plates of the second hinge structure (260) (e.g., the third hinge plate (362) and the fourth hinge plate (363) of FIG. 3a). Regardless of the state of the electronic device (200), the planar portion (245c) may remain flat. The first deformable portion (245a) and the second deformable portion (245b) can be unfolded in the first state (200a) and the second state (200b), and in the third state (200c), the first deformable portion (245a) and the second deformable portion (245b) can be folded so that the second unbendable portion (242) and the third unbendable portion (243) face different directions.

[0078] Within the third state (200c), the first housing part (210) can be positioned between the second housing part (220) and the third housing part (230). Within the third state (200c), the second bendable portion (245) of the flexible display (240) positioned on the second hinge structure (260) can be partially directed toward the side surface (210c) of the first housing part (210).

[0079] The display area of ​​the flexible display (240) may include a first display area (240a), a second display area (240b), and a third display area (240c). The display area represents an area that can provide visual information from the flexible display (240). In the first state (200a), the entire display area of ​​the flexible display (240) may be visible from the front of the housing structure (201). For example, in the first state (200a), the first display area (240a), the second display area (240b), and the third display area (240c) of the flexible display (240) may be visually exposed. The electronic device (200) may provide a user with a large display area that includes the first display area (240a), the second display area (240b), and the third display area (240c).

[0080] Within the second state (200b), the display area of ​​the flexible display (240) may be partially visible from the front of the third housing part (230). For example, the third unbendable portion (243) may be visually exposed, and the first display area (240a) and the second display area (240b) may not be visually exposed.

[0081] Within the third state (200c), the display area of ​​the flexible display (240) may not be visible. For example, within the third state (200c), the first display area (240a), the second display area (240b), and the third display area (240c) of the flexible display (240) may not be visually exposed.

[0082] As a non-limiting example, when the flexible display (240) is used to display a screen within a first state (200a) of the electronic device (200), the first display area (240a), the second display area (240b), and the third display area (240c) of the flexible display (240) may be activated. As a non-limiting example, when the flexible display (240) is used to display a screen within a second state (200b) of the electronic device (200), the third display area (240c) may be activated, and the first display area (240a) and the second display area (240b) of the flexible display (240) may be deactivated. As a non-limiting example, within the third state (200c) of the electronic device (200), the first display area (240a), the second display area (240b), and the third display area (240c) of the flexible display (240) may be deactivated.

[0083] As a non-limiting example, when the flexible display (240) is used to display a screen within a first state (200a) of the electronic device (200), the first display area (240a), the second display area (240b), and the third display area (240c) of the flexible display (240) can display visual information. As a non-limiting example, when the flexible display (240) is used to display a screen within a second state (200b) of the electronic device (200), the third display area (240c) can provide visual information, and the first display area (240a) and the second display area (240b) of the flexible display (240) can provide a black image. As a non-limiting example, within the third state (200c), the first display area (240a), the second display area (240b), and the third display area (240c) of the flexible display (240) can provide a black image.

[0084] Figure 3a is a plan view of an electronic device with the flexible display removed. Figure 3b is a rear view of the electronic device with the back cover and display removed.

[0085] Referring to FIGS. 3A and 3B , the electronic device (200) may include a first hinge structure (250) and a second hinge structure (260). A first width (w1) of the first hinge structure (250) may be narrower than a second width (w2) of the second hinge structure (260). A difference between the first width (w1) of the first hinge structure (250) and the second width (w2) of the second hinge structure (260) may be equal to or greater than a thickness of the first housing part (210). For example, the second hinge structure (260) may have a second width (w2) that is wider than the first width (w1) such that the first housing part (210) is disposed between the second housing part (220) and the third housing part (230) according to the third state (200c). The first hinge structure (250) may be referred to as a narrow hinge structure in that it has a narrower width than the second hinge structure (260). The second hinge structure (260) may be referred to as a wide hinge structure in that it has a wider width than the first hinge structure (250).

[0086] The first hinge structure (250) may include a first set of gears (351), a first hinge plate (352), and a second hinge plate (353). The first hinge plate (352) may be coupled to a first support portion (211) of the first housing part (210). The second hinge plate (353) may be coupled to a second support portion (221) of the second housing part (220). The gears (g11, g12, g13, g14) included in the first set of gears (351) may be configured to rotate the first hinge plate (352) and the second hinge plate (353). For example, the gears (g11, g12, g13, g14) included in the first set of gears (351) can rotate the second hinge plate (353) (or the second housing part (220)) in conjunction with the rotation of the first hinge plate (352) (or the first housing part (210)). When the first hinge plate (352) (or the first housing part (210)) rotates, the gears (g11, g12, g13, g14) included in the first set of gears (351) can rotate in accordance with the rotation of the first hinge plate (352) (or the first housing part (210)). The second hinge plate (353) (or the second housing part (220)) can rotate in conjunction with the rotation of the first hinge plate (352) according to the rotation of the gears (g11, g12, g13, g14) included in the first set of gears (351). The gears (g11, g12, g13, g14) included in the first set of gears (351) can include a first gear (g11), a second gear (g12), a third gear (g13), and a fourth gear (g14). The first gear (g11) can be arranged adjacent to the first hinge plate (352), and the fourth gear (g14) can be arranged adjacent to the second hinge plate (353). The second gear (g12) and the third gear (g13) can be arranged between the first gear (g11) and the fourth gear (g14).The first gear (g11), the second gear (g12), the third gear (g13), and the fourth gear (g14) can be sequentially meshed. According to the rotation of the first gear (g1) in the first rotation direction (e.g., clockwise), the second gear (g2) meshed with the first gear (g1) can be rotated in the second rotation direction (e.g., counterclockwise) opposite to the first rotation direction. According to the rotation of the second gear (g2) in the second rotation direction, the third gear (g3) meshed with the second gear (g2) can be rotated in the first rotation direction. According to the rotation of the third gear (g3) in the first rotation direction, the fourth gear (g4) can be rotated in the second rotation direction. As the first gear (g1) and the fourth gear (g4) rotate in different directions, the first housing part (210) connected to the first hinge plate (352) and the second housing part (220) connected to the second hinge plate (353) can be folded or unfolded.

[0087] The second hinge structure (260) may include a second set of gears (361), a third hinge plate (362), a fourth hinge plate (363), and a support plate (364). The third hinge plate (362) may be coupled to a second support portion (221) of the second housing part (220). The fourth hinge plate (363) may be coupled to a third support portion (231) of the third housing part (230). The gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (361) may be configured to rotate the third hinge plate (362) and the fourth hinge plate (363). For example, the gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (361) can rotate the fourth hinge plate (363) (or the third housing part (230)) in conjunction with the rotation of the third hinge plate (362) (or the second housing part (220)). After the third hinge plate (362) (or the second housing part (220)) is rotated, the gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (361) can be rotated in accordance with the rotation of the third hinge plate (362) (or the second housing part (220)). The fourth hinge plate (363) (or the third housing part (230)) can be rotated in conjunction with the rotation of the third hinge plate (362) according to the rotation of the gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (361).

[0088] The gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (361) may include a first gear (g21), a second gear (g22), a third gear (g23), a fourth gear (g24), a fifth gear (g25), and a sixth gear (g26). The first gear (g21) may be arranged adjacent to the third hinge plate (362), and the sixth gear (g26) may be arranged adjacent to the fourth hinge plate (363). The second gear (g22), the third gear (g23), the fourth gear (g24), and the fifth gear (g25) may be arranged between the first gear (g21) and the sixth gear (g26). The first gear (g21), the second gear (g22), the third gear (g23), the fourth gear (g24), the fifth gear (g25), and the sixth gear (g26) can be sequentially meshed. According to the rotation of the first rotation direction (e.g., clockwise) of the first gear (g21), the second gear (g22) meshed with the first gear (g21) can be rotated in a second rotation direction (e.g., counterclockwise) opposite to the first rotation direction. According to the rotation of the second rotation direction of the second gear (g22), the third gear (g23) meshed with the second gear (g22) can be rotated in the first rotation direction. According to the rotation of the first rotation direction of the third gear (g23), the fourth gear (g24) can be rotated in the second rotation direction. As the fourth gear (g24) rotates in the second rotation direction, the fifth gear (g25) meshed with the fourth gear (g24) can rotate in the first rotation direction. As the fifth gear (g25) rotates in the first rotation direction, the sixth gear (g26) meshed with the fifth gear (g25) can rotate in the second rotation direction. As the first gear (g21) and the sixth gear (g26) rotate in different directions, the second housing part (220) connected to the third hinge plate (362) and the third housing part (230) connected to the fourth hinge plate (363) can be folded or unfolded.

[0089] The first hinge structure (250) and the second hinge structure (260) may further include a spiral structure. The spiral structure may include a spiral groove formed on each hinge plate or a rotating member connected to the hinge plate, and a moving member sliding along the spiral groove. The hinge plates connected to the hinge structure may be configured to rotate at substantially the same angular displacement through the spiral structure.

[0090] The electronic device (200) may include a first printed circuit board (371), a second printed circuit board (372), and a third printed circuit board (373).

[0091] A first printed circuit board (371) may be placed on a first support portion (211) of a first housing part (210). Hardware components within the first housing part (210) may be mounted on the first printed circuit board (371).

[0092] A second printed circuit board (372) may be placed on a second support portion (221) of a second housing part (220). Hardware components within the second housing part (220) may include at least one processor (e.g., an application processor (AP), a communication processor (CP)) including a processing circuit mounted on the second printed circuit board (372), a memory including one or more storage media, a communication circuit, and a rear camera (275). The rear camera (275) may be exposed through a structure (e.g., an opening) on ​​the rear of the second housing part (220).

[0093] A third printed circuit board (373) may be placed on the third support portion (231) of the third housing part (230). Hardware components within the third housing part (230) may be mounted on the third printed circuit board (373). The hardware components placed on the third printed circuit board (373) may support the hardware components placed on the second printed circuit board (372) or operate independently. The hardware components placed on the third printed circuit board (373) may include a speaker, a front camera, and / or a display driving circuit.

[0094] The hardware components placed on the first printed circuit board (371) can support or operate independently of the hardware components placed on the second printed circuit board (372) and / or the hardware components placed on the third printed circuit board (373).

[0095] The electronic device (200) may further include a sub-printed circuit board (375) and flexible printed circuit boards (380, 290). The sub-printed circuit board (375) may be disposed on at least some of the first housing part (210), the second housing part (220), and the third housing part (230). The flexible printed circuit boards (380, 390) may include a first flexible printed circuit board (380) and a second flexible printed circuit board (390). The first flexible printed circuit board (380) may electrically connect printed circuit boards disposed on each of the housing parts (210, 220, 230). The second flexible printed circuit board (390) may connect the sub-printed circuit board (375) to a printed circuit board within the housing part in which the sub-printed circuit board (375) is disposed by the second flexible printed circuit board (390).

[0096] Electronic components within the electronic device (200) may be connected to at least one processor within the second printed circuit board (372) via flexible printed circuit boards (380, 290). For example, a signal received from an antenna disposed in the third housing part (230) may be transmitted to the second printed circuit board (372) on which at least one processor (e.g., AP or CP) is disposed via a signal path (a) provided by the first flexible printed circuit board (380). A driving circuit for the flexible display (240) disposed within the first housing part (210) may be connected to the second printed circuit board (372) on which at least one processor (e.g., AP) is disposed via a signal path (b) provided by the first flexible printed circuit board (380). A driving circuit for a display (270) connected to a sub-printed circuit board (375) disposed on a first housing part (210) may be electrically connected to a second printed circuit board (372) on which at least one processor (e.g., AP) is disposed via a signal path (c) provided by the sub-printed circuit board (375) and the first flexible printed circuit board (380) and the second flexible printed circuit board (390). The electronic device (200) may further include batteries. Each of the batteries may be attached to support parts (211, 221, 231) included in the housing parts (210, 220, 230). The support parts (211, 221, 231) may support rechargeable batteries.

[0097] The arrangement of hardware components is exemplary, and differently from the above, the rear camera (275) and the second printed circuit board (372) may be arranged in the third housing part (230), and the third printed circuit board (373) may be arranged in the second housing part (220).

[0098] Although the first housing part (210) and the third housing part (230) are shown as rotating in opposite directions with respect to the second housing part (220), this is not limited thereto. For example, during the change from the first state (200a) to the third state (200c), the first housing part (210) may rotate counterclockwise with respect to the second housing part (220), and the third housing part (230) may rotate counterclockwise with respect to the second housing part (220). As the first housing part (210) and the third housing part (230) rotate in the same direction, a portion of the display area of ​​the flexible display (240) within the second state may be visually exposed.

[0099] Figures 4a and 4b illustrate examples of foldable-type electronic devices. Figure 4a illustrates an example of a first state of the electronic device. Figure 4b illustrates an example of a second state of the electronic device. The electronic device (400) may be referred to as the electronic device (101).

[0100] Referring to FIGS. 4A and 4B, the electronic device (400) may include a housing structure (401), a flexible display (440), a first hinge structure (450), and a second hinge structure (460). The first housing structure (401) may include a first housing part (410), a second housing part (420), and a third housing part (430).

[0101] The first housing part (410) can be rotatably coupled to the second housing part (420) by a first hinge structure (450). The first housing part (410) and the second housing part (420) can rotate with respect to the first hinge structure (450). The first hinge structure (450) can cause the first housing part (410) to rotate in conjunction with the rotation of the second housing part (420). While the first housing part (410) rotates with respect to the first hinge structure (450), the second housing part (420) can rotate with respect to the first hinge structure (450). For example, when the first housing part (410) and the second housing part (420) rotate about the first hinge structure (450), the angular displacement (or angular change) of the first housing part (410) may be substantially equal to the angular displacement of the second housing part (420).

[0102] The third housing part (430) can be rotatably coupled to the second housing part (420) by a second hinge structure (460). The second housing part (420) and the third housing part (430) can rotate with respect to the second hinge structure (460). The second hinge structure (460) can cause the second housing part (430) to rotate in conjunction with the rotation of the third housing part (430). While the third housing part (430) rotates with respect to the second hinge structure (460), the second housing part (420) can rotate with respect to the second hinge structure (460). For example, when the second housing part (420) and the third housing part (430) are rotated about the second hinge structure (460), the angular displacement of the second housing part (420) may be substantially equal to the angular displacement of the third housing part (430).

[0103] The first hinge structure (450) and the second hinge structure (460) can change the state of the electronic device (400). The first hinge structure (450) and the second hinge structure (460) can provide (or enable) a first state (400a) of the electronic device (400) (or a first state (400a) of the housing structure (401)). The first state (400a) of the electronic device (400) (or the first state (400a) of the housing structure (401)) can be described as an unfolded state (or an unfolded state) of the electronic device (400) (or the housing structure (401)). Within the first state (400a), the front surface of the first housing part (410), the front surface of the second housing part (420), and the front surface of the third housing part (430) can define the front surface of the electronic device (400). Within the first state (400a), the front surface of the first housing part (410), the front surface of the second housing part (420), and the front surface of the third housing part (430) can face the same direction. Within the first state (400a), the electronic device (400) can provide a large display area of ​​the flexible display (440) to the user.

[0104] The first hinge structure (450) and the second hinge structure (460) can provide a second state (400b) of the electronic device (400) (or a second state (400b) of the housing structure (401)). The second state (400b) of the electronic device (400) (or the second state (400b) of the housing structure (401)) can be described as a folded state (or a multi-folding state or a folding state) of the electronic device (400) (or the housing structure (401)). While the state of the electronic device (400) changes from the first state (400a) to the second state (400b), the rotational direction of the first housing part (410) with respect to the second housing part (420) can be the same as the rotational direction of the third housing part (430) with respect to the second housing part (420).

[0105] Within the second state (400b), the front of the first housing part (410) and the front of the second housing part (420) may face in opposite directions, and the front of the second housing part (420) and the front of the third housing part (430) may face in opposite directions. For example, within the second state (400b), the front of the first housing part (410) may face the front of the second housing part (420), and the rear of the second housing part (420) may face the front of the third housing part (430). Within the second state (400b), the electronic device (400) may be folded to enhance portability. Within the folded state, visual information may be provided through a portion of a display area (e.g., a third display area (440c)) of a display (440) disposed on the outside of the electronic device (400).

[0106] The first hinge structure (450) and the second hinge structure (460) can provide a third state of the electronic device (400). The third state of the electronic device (400) can be described as a state in which the electronic device (400) is partially folded and partially unfolded (or a single folded state, a half-folded state, or a semi-folded state). For example, within the third state, the front surface of the second housing part (420) and the front surface of the third housing part (430) may face the same direction, and the front surface of the first housing part (410) may face the front surface of the second housing part (420). For example, within the third state, the first housing part (410) and the second housing part (420) may be folded, and the second housing part (420) and the third housing part (430) may be unfolded.

[0107] However, the present invention is not limited thereto, and within the third state, the front surface of the first housing part (410) and the front surface of the second housing part (420) may face the same direction, and the rear surface of the second housing part (410) may face the rear surface of the third housing part (430). For example, within the third state, the second housing part (420) and the third housing part (430) may be folded, and the first housing part (410) and the second housing part (420) may be unfolded. The electronic device (400) may change from the first state (400a) to the second state (400b) through the third state. The electronic device (400) may change from the first state (400a), which is an unfolded state, to the third state, which is a partially unfolded state. For example, the electronic device (400) can change from a first state (400a) in which the first housing part (410), the second housing part (420), and the third housing part (430) face the same direction, to a third state in which the front of the first housing part (410) faces the front of the second housing part (420). The electronic device (400) can change from a third state (400c) in which the electronic device is partially unfolded, to a second state (400b) in which the electronic device is folded. For example, when changing from the third state (400c) to the second state (400b), the folded first housing part (410) and second housing part (420) can be placed on the third housing part (430). As the state of the electronic device (400) changes to the second state (400b), the rear surface of the second housing part (420) folded with respect to the first housing part (410) may face the rear surface of the third housing part (430).

[0108] A flexible display (440) can at least partially define the exterior appearance of the electronic device (400). The flexible display (440) can be partially disposed within the housing structure (401). The flexible display (440) can define the front surface of the electronic device (400). The flexible display (440) can include a first unbendable portion (441), a second unbendable portion (442), a third unbendable portion (443), a first bendable portion (444), and a second bendable portion (445). The first unbendable portion (441) of the flexible display (440) can be disposed on the front surface of the first housing part (410). The second unbendable portion (442) of the flexible display (440) can be disposed on the front surface of the second housing part (420). The third unbendable part (443) of the flexible display (440) may be disposed on the front side of the third housing part (430). The first bendable part (444) of the flexible display (440) may be disposed between the first unbendable part (441) and the second unbendable part (442) of the flexible display (440). For example, the first bendable part (444) of the flexible display (440) may be disposed on the first hinge structure (450) connecting the first housing part (410) and the second housing part (420). The second bendable part (445) of the flexible display (440) may be disposed between the second unbendable part (442) and the third unbendable part (443) of the flexible display (440). For example, the second bendable portion (445) of the flexible display (440) may be placed on a second hinge structure (460) connecting the first housing part (410) and the second housing part (420).

[0109] The first hinge structure (450) and the second hinge structure (460) may be oriented in substantially the same direction as the first unbendable portion (441) of the flexible display (440), the second unbendable portion (442) of the flexible display (440), and the third unbendable portion (443) of the flexible display (440). In the first state (400a), the first bendable portion (444) and the second bendable portion (445) may be arranged in substantially the same horizontal plane as the first unbendable portion (441), the second unbendable portion (442), and the third unbendable portion (443).

[0110] The first hinge structure (450) and the second hinge structure (460) can provide a second state (400b) of the electronic device (400). In the second state (400b), the first unbendable portion (441) of the flexible display (440) faces the third unbendable portion (443) of the flexible display (440), and the second unbendable portion (442) of the flexible display (440) can be seen through the front of the second housing part (420). In the second state (400b), the first bendable portion (444) of the flexible display (440) can be folded such that the first unbendable portion (441) of the flexible display (440) and the second unbendable portion (442) of the flexible display (440) face different directions. Within the second state (400b), the second bendable portion (445) of the flexible display (440) can be folded such that the first unbendable portion (441) of the flexible display (440) and the third unbendable portion (443) of the flexible display (440) face different directions.

[0111] In the first state (400a), the entire display area of ​​the flexible display (440) can be seen from the front of the housing structure (401). For example, the first display area (440a), the second display area (440b), and the third display area (440c) of the flexible display (440) can be visually exposed. The electronic device (400) can provide a user with a large display area including the first display area (440a), the second display area (440b), and the third display area (440c) in the first state (400a). In the second state (400b), the display area of ​​the flexible display (440) can be partially seen. For example, the first display area (440a) and the second display area (440b) of the flexible display (440) may not be visually exposed, and the third display area (440c) may be visually exposed.

[0112] As a non-limiting example, when the flexible display (440) is used to display a screen within a first state (400a) of the electronic device (400), the first display area (440a), the second display area (440b), and the third display area (440c) of the flexible display (440) may be activated. As a non-limiting example, when the flexible display (440) is used to display a screen within a second state of the electronic device (400), the third display area (440c) may be activated, and the first display area (440a) and the second display area (440b) of the flexible display (440) may be deactivated.

[0113] As a non-limiting example, when the flexible display (440) is used to display a screen within a first state (400a) of the electronic device (400), the first display area (440a), the second display area (440b), and the third display area (440c) of the flexible display (440) can display visual information. As a non-limiting example, when the flexible display (440) of the electronic device (400) is used to display a screen within a second state (400b) or a third state, the third display area (440c) can provide visual information, and the first display area (440a) and the second display area (440b) of the flexible display (440) can provide a black image.

[0114] Although the second housing part (420) and the third housing part (430) are shown as rotating in the same direction with respect to the first housing part (410), this is not limited thereto. For example, during the change from the first state (400a) to the second state (400b), the first housing part (410) may rotate clockwise with respect to the second housing part (420), and the third housing part (430) may rotate counterclockwise with respect to the second housing part (420). As the first housing part (410) and the third housing part (430) rotate in different directions, the display area of ​​the flexible display (440) within the second state may be deactivated without being visually exposed.

[0115] FIGS. 5A, 5B, 5C, 6A, and 6B illustrate examples of foldable-type electronic devices. FIG. 5A illustrates an example of a first state of the electronic device. FIG. 5B illustrates an example of a second state of the electronic device. FIG. 5C illustrates an example of a third state of the electronic device. The electronic device (500) may be referred to as the electronic device (101).

[0116] Referring to FIGS. 5A, 5B, and 5C, an electronic device (500) may include a housing structure (501), a flexible display (540), a first hinge structure (550), a second hinge structure (560), and a display (570). The housing structure (501) may include a first housing part (510), a second housing part (520), and a third housing part (530).

[0117] The first housing part (510) can be rotatably coupled to the second housing part (520) by a first hinge structure (550). The second housing part (520) and the first housing part (510) can be rotated with respect to the first hinge structure (550). While the first housing part (510) is rotated with respect to the first hinge structure (550), the second housing part (520) can be rotated with respect to the first hinge structure (550). For example, when the second housing part (520) and the first housing part (510) are rotated with respect to the first hinge structure (550), the angular displacement of the second housing part (520) can be substantially equal to the angular displacement of the first housing part (510).

[0118] The third housing part (530) can be rotatably coupled to the second housing part (520) by a second hinge structure (560). The second housing part (520) and the third housing part (530) can rotate with respect to the second hinge structure (560). While the second housing part (520) rotates with respect to the second hinge structure (560), the third housing part (530) can rotate with respect to the second hinge structure (560). For example, when the second housing part (520) and the third housing part (530) rotate with respect to the second hinge structure (560), the angular displacement (or angular change) of the second housing part (520) can be substantially equal to the angular displacement of the third housing part (530).

[0119] The first hinge structure (550) and the second hinge structure (560) can change the state of the electronic device. The first hinge structure (550) and the second hinge structure (560) can provide (or enable) a first state (500a) of the electronic device (500) (or a first state (500a) of the housing structure (501)). The first state (500a) of the electronic device (500) (or the first state (500a) of the housing structure (501)) can be described as an unfolded state (or an unfolded state) of the electronic device (500) (or the housing structure (501)). Within the first state (500a), the front surface of the first housing part (510), the front surface of the second housing part (520), and the front surface of the third housing part (530) can define the front surface of the electronic device (500). Within the first state (500a), the front of the first housing part (510), the front of the second housing part (520), and the front of the third housing part (530) can face the same direction. Within the first state (500a), the electronic device (500) can provide a large display area of ​​the flexible display (540) to the user.

[0120] The first hinge structure (550) and the second hinge structure (560) can provide a second state (500b) of the electronic device (500). The second state (500b) of the electronic device (500) can be described as a state in which the electronic device (500) is partially folded and partially unfolded (or a single folded state, a half-folded state, or a semi-folded state). For example, within the second state (500b), the front surface of the second housing part (520) and the front surface of the third housing part (530) may face the same direction, and the front surface of the first housing part (510) and the front surface of the second housing part (520) may face opposite directions. For example, within the third state, the first housing part (510) and the second housing part (520) may be folded, and the second housing part (520) and the third housing part (530) may be unfolded. Within the second state (500b), the electronic device (500) can provide visual information through a portion of the flexible display (540) (e.g., the third display area (540c)).

[0121] The electronic device (500) can change from the first state (500a) to the third state (500c) through the second state (500b). The electronic device (500) can change from the first state (500a), which is an unfolded state, to the second state (500b), which is a partially unfolded state. For example, the electronic device (500) can change from the first state (500a), in which the first housing part (510), the second housing part (520), and the third housing part (530) face the same direction, to the second state (500b), in which the front of the first housing part (510) faces the front of the second housing part (520). The electronic device (500) can change from the second state (500b), which is a partially unfolded state, to the third state (500c), which is a folded state. For example, when changing from the second state (500b) to the third state (500c), the folded first housing part (510) and second housing part (520) can be placed on the third housing part (530).

[0122] The first hinge structure (550) and the second hinge structure (560) can provide a third state (500c) of the electronic device (500) (or a third state (500c) of the housing structure (501)). The third state (500c) of the electronic device (500) (or the third state (500c) of the housing structure (501)) can be described as a folded state (or a folding state, a multi-folding state, or a full-folding state) of the electronic device (500) (or the housing structure (501)). Within the third state (500c), the front surface of the first housing part (510) and the front surface of the second housing part (520) can face opposite directions, and the front surface of the second housing part (520) and the front surface of the third housing part (530) can face opposite directions. Within the third state (500c), the front of the first housing part (510) and the front of the third housing part (530) may face the same direction. For example, within the third state (500c), the front of the second housing part (520) may face the front of the first housing part (510), and the front of the third housing part (530) may face the rear of the first housing part (510). Within the third state (500c), the rear of the second housing part (520) may be exposed to the outside. The camera (575) may be disposed on the rear of the second housing part (520). Within the third state (500c), the rear of the third housing part (530) may be exposed to the outside. The display (570) may be disposed on the rear of the third housing part (530). Within the third state (500c), the electronic device (500) can be folded to improve portability and provide visual information through a display (570) disposed in the third housing part (530) of the electronic device (500) in the third state (500c).

[0123] The electronic device (500) may further include a key button (539). The key button (539) may be exposed from a structure (e.g., an opening) formed on a side of the third housing part (530) and may partially protrude outside the electronic device (500). The key button (539) may physically provide an input to a processing circuit inside the electronic device (500) by pressure transmitted from the outside. The key button (539) may not be included in the electronic device (500) and may be implemented in another form, such as a soft key displayed on a flexible display (540) or a display (570).

[0124] The key button (539) may be positioned on the side of the third housing part (530) so as to be exposed to the outside in the third state (500c). The key button positioned on the third housing part (530) may move from the left side of the electronic device (500) to the right side of the electronic device (500) as the state of the electronic device (500) changes from the third state (500c) to the first state (500a) by a user looking at the display. For example, referring to FIG. 5a, in the first state (500a), when the flexible display (540) is viewed from above, the key button (539) may be positioned on the right side. Referring to FIG. 5b, in the third state (500c), when the display (570) is viewed from above, the key button (539) may be positioned on the left side.

[0125] A flexible display (540) can at least partially define the exterior appearance of the electronic device (500). The flexible display (540) can be partially disposed within the housing structure (501). The flexible display (540) can define the front surface of the electronic device (500). The flexible display (540) can include a first unbendable portion (541), a second unbendable portion (542), a third unbendable portion (543), a first bendable portion (544), and a second bendable portion (545). The first unbendable portion (541) of the flexible display (540) can be disposed on the front surface of the first housing part (510). The second unbendable portion (542) of the flexible display (540) can be disposed on the front surface of the second housing part (520). The third unbendable part (543) of the flexible display (540) may be disposed on the front side of the third housing part (530). The first bendable part (544) of the flexible display (540) may be disposed between the first unbendable part (541) and the second unbendable part (542) of the flexible display (540). For example, the first bendable part (544) of the flexible display (540) may be disposed on the first hinge structure (550) connecting the first housing part (510) and the second housing part (520). The second bendable part (545) of the flexible display (540) may be disposed between the second unbendable part (542) and the third unbendable part (543) of the flexible display (540). For example, the second bendable portion (545) of the flexible display (540) may be placed on a second hinge structure (560) connecting the second housing part (520) and the third housing part (530).

[0126] The first hinge structure (550) and the second hinge structure (560) may face substantially the same direction as the first unbendable portion (541) of the flexible display (540), the second unbendable portion (542) of the flexible display (540), and the third unbendable portion (543) of the flexible display (540). In the first state (500a), the first bendable portion (544) and the second bendable portion (545) may be arranged in substantially the same horizontal plane as the first unbendable portion (541), the second unbendable portion (542), and the third unbendable portion (543).

[0127] The first hinge structure (550) and the second hinge structure (560) can provide a second state (500b) of the electronic device (500). Within the second state (500b), the first unbendable portion (541) of the flexible display (540) can face the second unbendable portion (542) of the flexible display (540), and the third unbendable portion (543) of the flexible display (540) can face the same direction as the second unbendable portion (542) of the flexible display (540). For example, the second unbendable portion (542) and the third unbendable portion (543) can be arranged in substantially the same horizontal plane.

[0128] In the second state (500b), the first bendable portion (544) of the flexible display (540) is bent by the first hinge structure (550), so that the first bendable portion (544) of the flexible display (540) can be folded so that the first unbendable portion (541) of the flexible display (540) and the second unbendable portion (542) of the flexible display (540) face different directions.

[0129] In the second state (500b), the second bendable portion (545) of the flexible display (540) is maintained in an unfolded state by the second hinge structure (560), so that the second bendable portion (545) of the flexible display (540) can unfold so that the second unbendable portion (542) of the flexible display (540) and the third unbendable portion (543) of the flexible display (540) face the same direction.

[0130] The first hinge structure (550) and the second hinge structure (560) can provide a third state (500c) of the electronic device (500). In the third state (500c), the second unbendable portion (542) of the flexible display (540) can face the first unbendable portion (541) of the flexible display (540), and the third unbendable portion (543) of the flexible display (540) can face the back of the first housing part (510).

[0131] In the third state (500c), the first bendable portion (544) of the flexible display (540) is bent by the first hinge structure (550), so that the first bendable portion (544) of the flexible display (540) can be folded so that the first unbendable portion (541) of the flexible display (540) and the second unbendable portion (542) of the flexible display (540) face different directions.

[0132] In the third state (500c), the second bendable portion (545) of the flexible display (540) is bent by the second hinge structure (560), so that the second bendable portion (545) of the flexible display (540) can be folded such that the second unbendable portion (542) of the flexible display (540) and the third unbendable portion (543) of the flexible display (540) face different directions. The second bendable portion (545) may further include a first deformable portion (545a), a second deformable portion (545b), and a flat portion (545c). The first deformable portion (545a) may be disposed between the planar portion (545c) and the second unbendable portion (542), and the second deformable portion (545b) may be disposed between the planar portion (545c) and the third unbendable portion (543). The planar portion (545c) may be disposed between the first deformable portion (545a) and the second deformable portion (545b). The planar portion (545c) may be supported by a support plate (e.g., the support plate (664) of FIG. 6a) that is distinct from the hinge plates of the second hinge structure (560) (e.g., the third hinge plate (662) and the fourth hinge plate (663) of FIG. 6a). Regardless of the state of the electronic device (500), the planar portion (545c) may remain flat. The first deformable portion (545a) and the second deformable portion (545b) can be unfolded in the first state (500a) and the second state (500b), and in the third state (500c), the first deformable portion (545a) and the second deformable portion (545b) can be folded so that the second unbendable portion (542) and the third unbendable portion (543) face different directions.

[0133] Within the third state (500c), the first housing part (510) can be positioned between the second housing part (520) and the third housing part (530). Within the third state (500c), the second bendable portion (545) of the flexible display (540) positioned on the second hinge structure (560) can be partially directed toward the side surface (510c) of the first housing part (510).

[0134] The display area of ​​the flexible display (540) may include a first display area (540a), a second display area (540b), and a third display area (540c). The display area represents an area that can provide visual information from the flexible display (540). In the first state (500a), the entire display area of ​​the flexible display (540) may be visible from the front of the housing structure (501). For example, in the first state (500a), the first display area (540a), the second display area (540b), and the third display area (540c) of the flexible display (540) may be visually exposed. The electronic device (500) may provide a large display area to the user that includes the first display area (540a), the second display area (540b), and the third display area (540c).

[0135] Within the second state (500b), the display area of ​​the flexible display (540) may be partially visible from the front of the third housing part (530). For example, the third unbendable portion (543) may be visually exposed, and the first display area (540a) and the second display area (540b) may not be visually exposed.

[0136] Within the third state (500c), the display area of ​​the flexible display (540) may not be visible. For example, within the third state (500c), the first display area (540a), the second display area (540b), and the third display area (540c) of the flexible display (540) may not be visually exposed.

[0137] As a non-limiting example, when the flexible display (540) is used to display a screen within a first state (500a) of the electronic device (500), the first display area (540a), the second display area (540b), and the third display area (540c) of the flexible display (540) may be activated. As a non-limiting example, when the flexible display (540) is used to display a screen within a second state (500b) of the electronic device (500), the third display area (540c) may be activated, and the first display area (540a) and the second display area (540b) of the flexible display (540) may be deactivated. As a non-limiting example, within the third state (500c) of the electronic device (500), the first display area (540a), the second display area (540b), and the third display area (540c) of the flexible display (540) may be deactivated.

[0138] As a non-limiting example, when the flexible display (540) is used to display a screen within a first state (500a) of the electronic device (500), the first display area (540a), the second display area (540b), and the third display area (540c) of the flexible display (540) can display visual information. As a non-limiting example, when the flexible display (540) is used to display a screen within a second state (500b) of the electronic device (500), the third display area (540c) can provide visual information, and the first display area (540a) and the second display area (540b) of the flexible display (540) can provide a black image. As a non-limiting example, within the third state (500c), the first display area (540a), the second display area (540b), and the third display area (540c) of the flexible display (540) can provide a black image.

[0139] Figure 6a is a plan view of an electronic device with the flexible display removed. Figure 6b is a rear view of the electronic device with the back cover and display removed.

[0140] Referring to FIGS. 6A and 6B, the electronic device (500) may include a first hinge structure (550) and a second hinge structure (560). A first width (w1) of the first hinge structure (550) may be narrower than a second width (w2) of the second hinge structure (560). A difference between the first width (w1) of the first hinge structure (550) and the second width (w2) of the second hinge structure (560) may be equal to or greater than a thickness of the first housing part (510). For example, the second hinge structure (560) may have a second width (w2) that is wider than the first width (w1) such that the first housing part (510) is disposed between the second housing part (520) and the third housing part (530) according to the third state (500c). The first hinge structure (550) may be referred to as a narrow hinge structure in that it has a narrower width than the second hinge structure (560). The second hinge structure (560) may be referred to as a wide hinge structure in that it has a wider width than the first hinge structure (550).

[0141] The first hinge structure (550) may include a first set of gears (651), a first hinge plate (652), and a second hinge plate (653). The first hinge plate (652) may be coupled to a first support portion (511) of the first housing part (510). The second hinge plate (653) may be coupled to a second support portion (521) of the second housing part (520). The gears (g11, g12, g13, g14) included in the first set of gears (651) may be configured to rotate the first hinge plate (652) and the second hinge plate (653). For example, the gears (g11, g12, g13, g14) included in the first set of gears (651) can rotate the second hinge plate (653) (or the second housing part (520)) in conjunction with the rotation of the first hinge plate (652) (or the first housing part (510)). When the first hinge plate (652) (or the first housing part (510)) rotates, the gears (g11, g12, g13, g14) included in the first set of gears (651) can rotate in accordance with the rotation of the first hinge plate (652) (or the first housing part (510)). The second hinge plate (653) (or the second housing part (520)) can be rotated in conjunction with the rotation of the first hinge plate (652) according to the rotation of the gears (g11, g12, g13, g14) included in the first set of gears (651). The gears (g11, g12, g13, g14) included in the first set of gears (651) can include a first gear (g11), a second gear (g12), a third gear (g13), and a fourth gear (g14). The first gear (g11) can be arranged adjacent to the first hinge plate (652), and the fourth gear (g14) can be arranged adjacent to the second hinge plate (653). The second gear (g12) and the third gear (g13) can be arranged between the first gear (g11) and the fourth gear (g14).The first gear (g11), the second gear (g12), the third gear (g13), and the fourth gear (g14) can be sequentially meshed. According to the rotation of the first gear (g11) in the first rotation direction (e.g., clockwise), the second gear (g12) meshed with the first gear (g11) can be rotated in the second rotation direction (e.g., counterclockwise) opposite to the first rotation direction. According to the rotation of the second gear (g12) in the second rotation direction, the third gear (g13) meshed with the second gear (g12) can be rotated in the first rotation direction. According to the rotation of the third gear (g13) in the first rotation direction, the fourth gear (g14) can be rotated in the second rotation direction. As the first gear (g11) and the fourth gear (g14) rotate in different directions, the first housing part (510) connected to the first hinge plate (652) and the second housing part (520) connected to the second hinge plate (653) can be folded or unfolded.

[0142] The second hinge structure (560) may include a second set of gears (661), a third hinge plate (662), a fourth hinge plate (663), and a support plate (664). The third hinge plate (662) may be coupled to a second support portion (521) of the second housing part (520). The fourth hinge plate (663) may be coupled to a third support portion (531) of the third housing part (530). The gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (661) may be configured to rotate the third hinge plate (662) and the fourth hinge plate (663). For example, the gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (661) can rotate the fourth hinge plate (663) (or the third housing part (530)) in conjunction with the rotation of the third hinge plate (662) (or the second housing part (520)). After the third hinge plate (662) (or the second housing part (520)) is rotated, the gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (661) can be rotated in accordance with the rotation of the third hinge plate (662) (or the second housing part (520)). The fourth hinge plate (663) (or the third housing part (530)) can be rotated in conjunction with the rotation of the third hinge plate (662) according to the rotation of the gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (661).

[0143] The gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (661) may include a first gear (g21), a second gear (g22), a third gear (g23), a fourth gear (g24), a fifth gear (g25), and a sixth gear (g26). The first gear (g21) may be arranged adjacent to the third hinge plate (662), and the sixth gear (g26) may be arranged adjacent to the fourth hinge plate (663). The second gear (g22), the third gear (g23), the fourth gear (g24), and the fifth gear (g25) may be arranged between the first gear (g21) and the sixth gear (g26). The first gear (g21), the second gear (g22), the third gear (g23), the fourth gear (g24), the fifth gear (g25), and the sixth gear (g26) can be sequentially meshed. According to the rotation of the first rotation direction (e.g., clockwise) of the first gear (g21), the second gear (g22) meshed with the first gear (g21) can be rotated in a second rotation direction (e.g., counterclockwise) opposite to the first rotation direction. According to the rotation of the second rotation direction of the second gear (g22), the third gear (g23) meshed with the second gear (g22) can be rotated in the first rotation direction. According to the rotation of the first rotation direction of the third gear (g23), the fourth gear (g24) can be rotated in the second rotation direction. According to the rotation of the fourth gear (g24) in the second rotation direction, the fifth gear (g25) meshed with the fourth gear (g24) can be rotated in the first rotation direction. According to the rotation of the fifth gear (g25) in the first rotation direction, the sixth gear (g26) meshed with the fifth gear (g25) can be rotated in the second rotation direction. As the first gear (g21) and the sixth gear (g26) rotate in different directions, the second housing part (520) connected to the third hinge plate (662) and the third housing part (530) connected to the fourth hinge plate (663) can be folded or unfolded.

[0144] The first hinge structure (550) and the second hinge structure (560) may further include a spiral structure. The spiral structure may include a spiral groove formed on each hinge plate or a rotating member connected to the hinge plate, and a moving member sliding along the spiral groove. The hinge plates connected to the hinge structure may be configured to rotate at substantially the same angular displacement through the spiral structure.

[0145] The electronic device (500) may include a first printed circuit board (671), a second printed circuit board (672), and a third printed circuit board (673).

[0146] A first printed circuit board (671) may be placed on a first support portion (511) of a first housing part (510). Hardware components within the first housing part (510) may be mounted on the first printed circuit board (671).

[0147] A second printed circuit board (672) may be disposed on a second support portion (521) of a second housing part (520). Hardware components within the second housing part (520) may include at least one processor (e.g., an application processor (AP), a communication processor (CP)) including a processing circuit mounted on the second printed circuit board (672), a memory including one or more storage media, a communication circuit, and a rear camera (575). The rear camera (575) may be exposed through a structure (e.g., an opening) on ​​the rear of the second housing part (520).

[0148] A third printed circuit board (673) may be placed on a third support portion (531) of a third housing part (530). Hardware components within the third housing part (530) may be mounted on the third printed circuit board (673). The hardware components placed on the third printed circuit board (673) may support or operate independently of the hardware components placed on the second printed circuit board (672). The hardware components placed on the third printed circuit board (673) may include a speaker, a front camera, and / or a display driving circuit.

[0149] The hardware components placed on the first printed circuit board (671) can support or operate independently of the hardware components placed on the second printed circuit board (672) and / or the hardware components placed on the third printed circuit board (673).

[0150] The electronic device (500) may further include a sub-printed circuit board (675) and flexible printed circuit boards (680, 690). The sub-printed circuit board (675) may be disposed on at least some of the first housing part (510), the second housing part (520), and the third housing part (530). The flexible printed circuit boards (680, 690) may include a first flexible printed circuit board (680) and a second flexible printed circuit board (690). The first flexible printed circuit board (680) may electrically connect the printed circuit boards disposed on each of the housing parts (510, 520, 530). The second flexible printed circuit board (690) may connect the sub-printed circuit board (675) to a printed circuit board within the housing part in which the sub-printed circuit board (675) is disposed by the second flexible printed circuit board (690).

[0151] Electronic components within the electronic device (500) may be connected to at least one processor within the second printed circuit board (672) via flexible printed circuit boards (680, 690). For example, a signal received from an antenna disposed in the third housing part (530) may be transmitted to the second printed circuit board (672) on which at least one processor (e.g., an AP or CP) is disposed via a signal path (a) provided by the first flexible printed circuit board (680). A driving circuit for the flexible display (540) disposed within the first housing part (510) may be connected to the second printed circuit board (672) on which at least one processor (e.g., an AP) is disposed via a signal path (b) provided by the first flexible printed circuit board (680). A driving circuit for a display (570) connected to a sub-printed circuit board (675) disposed on a first housing part (510) may be electrically connected to a second printed circuit board (672) on which at least one processor (e.g., AP) is disposed via a signal path (c) provided by the sub-printed circuit board (675) and the first flexible printed circuit board (680) and the second flexible printed circuit board (690). The electronic device (500) may further include batteries. Each of the batteries may be attached to support parts (511, 521, 531) included in the housing parts (510, 520, 530). The support parts (511, 521, 531) may support rechargeable batteries.

[0152] The arrangement of hardware components is exemplary, and differently from the above, the rear camera (575) and the second printed circuit board (672) may be arranged in the third housing part (530), and the third printed circuit board (673) may be arranged in the second housing part (520).

[0153] Although the first housing part (510) and the third housing part (530) are shown as rotating in opposite directions with respect to the second housing part (520), this is not limited thereto. For example, during the change from the first state (500a) to the third state (500c), the first housing part (510) may rotate counterclockwise with respect to the second housing part (520), and the third housing part (530) may rotate counterclockwise with respect to the second housing part (520). As the first housing part (510) and the third housing part (530) rotate in the same direction, a portion of the display area of ​​the flexible display (540) within the second state may be visually exposed.

[0154] FIG. 7 illustrates an example of a foldable-type electronic device (e.g., electronic device (101), electronic device (200), electronic device (400), or electronic device (500)).

[0155] Referring to FIG. 7, the electronic device (101) may include a first housing part (710), a second housing part (720), and a third housing part (730). The electronic device (101) may include a first hinge structure (750) configured to rotatably couple the first housing part (710) and the second housing part (720). The electronic device (101) may include a second hinge structure (760) configured to rotatably couple the second housing part (720) and the third housing part (730). For example, the electronic device (101) may be the electronic device (200) of FIGS. 2A, 2B, and 2C. The first housing part (710), the second housing part (720), and the third housing part (730) may correspond to the first housing part (210), the second housing part (220), and the third housing part (230), respectively. The first hinge structure (750) may correspond to the first hinge structure (250). The second hinge structure (760) may correspond to the second hinge structure (260). For example, the electronic device (101) may be the electronic device (400) of FIGS. 4A and 4B. The first housing part (710), the second housing part (720), and the third housing part (730) may correspond to the first housing part (410), the second housing part (420), and the third housing part (430), respectively. The first hinge structure (750) may correspond to the first hinge structure (450). The second hinge structure (760) may correspond to the second hinge structure (460). For example, the electronic device (101) may be the electronic device (500) of FIGS. 5A, 5B, and 5C. The first housing part (710), the second housing part (720), and the third housing part (730) may correspond to the first housing part (510), the second housing part (520), and the third housing part (530), respectively. The first hinge structure (750) may correspond to the first hinge structure (550).The second hinge structure (760) can correspond to the second hinge structure (560).

[0156] In one embodiment, the metal frame of the first housing part (710) may include a first set of conductive portions. For example, the first set of conductive portions may include a conductive portion (711), a conductive portion (712), a conductive portion (713), a conductive portion (714), a conductive portion (715), a conductive portion (716), and / or a conductive portion (717). For example, each conductive portion may be located on the periphery of the electronic device (101). As a non-limiting example, each conductive portion may be visible to the outside. A non-conductive portion may be formed between two adjacent conductive portions of the first set of conductive portions. For example, the first housing part (710) may include a non-conductive portion (771) between the conductive portion (711) and the conductive portion (712), a non-conductive portion (772) between the conductive portion (712) and the conductive portion (713), a non-conductive portion (773) between the conductive portion (713) and the conductive portion (714), a non-conductive portion (774) between the conductive portion (714) and the conductive portion (715), a non-conductive portion (775) between the conductive portion (715) and the conductive portion (716), and / or a non-conductive portion (776) between the conductive portion (716) and the conductive portion (717).

[0157] In one embodiment, the metal frame of the second housing part (720) may include a first set of conductive portions. For example, the second set of conductive portions may include conductive portion (721), conductive portion (703), conductive portion (723), conductive portion (724), conductive portion (725), and / or conductive portion (726). For example, each conductive portion may be located on the periphery of the electronic device (101). As a non-limiting example, each conductive portion may be visible to the outside. A non-conductive portion may be formed between two adjacent conductive portions of the second set of conductive portions. For example, the second housing part (720) may include a non-conductive portion (781) between the conductive portion (721) and the conductive portion (703), a non-conductive portion (782) between the conductive portion (703) and the conductive portion (723), a non-conductive portion (783) between the conductive portion (724) and the conductive portion (725), and / or a non-conductive portion (784) between the conductive portion (725) and the conductive portion (726).

[0158] In one embodiment, the metal frame of the third housing part (730) may include a third set of conductive portions. For example, the third set of conductive portions may include conductive portion (731), conductive portion (732), conductive portion (702), conductive portion (734), conductive portion (701), conductive portion (736), and / or conductive portion (737). For example, each conductive portion may be located on the periphery of the electronic device (101). As a non-limiting example, each conductive portion may be visible to the outside. A non-conductive portion may be formed between two adjacent conductive portions of the third set of conductive portions. For example, the third housing part (730) may include a non-conductive portion (791) between the conductive portion (731) and the conductive portion (732), a non-conductive portion (792) between the conductive portion (732) and the conductive portion (702), a non-conductive portion (793) between the conductive portion (702) and the conductive portion (734), a non-conductive portion (794) between the conductive portion (734) and the conductive portion (701), a non-conductive portion (795) between the conductive portion (701) and the conductive portion (736), and / or a non-conductive portion (796) between the conductive portion (736) and the conductive portion (737).

[0159] The electronic device (101) may utilize an antenna to transmit or receive signals. For example, the conductive portion (701) of the first housing part (710) may be utilized as a radiator of the antenna. For example, a wireless communication circuit (e.g., a communication module (190) of FIG. 1) within the electronic device (101) may provide signals to the conductive portion (701). For example, the wireless communication circuit may be disposed on a PCB (e.g., a third printed circuit board (373) or a third printed circuit board (673)) of the third housing part (730). The wireless communication circuit may be electrically connected to the conductive portion (701) through wiring on the PCB and / or a connecting member (e.g., a C-clip, a conductive member, or a conductive pattern) in contact with the PCB. The electronic device (101) can have various states depending on the arrangement of the first housing part (710), the second housing part (720), and the third housing part (730). In the electronic device (101), when the first housing part (710), the second housing part (720), and the third housing part (730) are all folded (e.g., the third state (200c), the second state (400b), the third state (500c), or the state (702)) (hereinafter, a multi-folding state), the electronic device (101) can transmit or receive signals through the conductive portion (701).

[0160] According to one embodiment, the conductive portion (701) may include a portion formed on a side surface (e.g., a portion having a surface facing the (+) x-axis direction). For example, the conductive portion (701) may have an 'L' shape. In the multi-folded state, when the electronic device (101) is viewed in one direction (e.g., the (-) z-axis direction), the conductive portion (701) may overlap with a hinge structure (e.g., a first hinge structure (750)). As the first hinge structure (750) is positioned in the radial direction of the conductive portion (701), the antenna performance (e.g., radiation efficiency or overall efficiency) of the conductive portion (701) may decrease. According to one embodiment, the electronic device (101) may transmit or receive signals through the conductive portion (702). The conductive portion (702) may include a portion formed on a side surface (e.g., a portion having a surface facing the (+) x-axis direction). In the multi-folded state, as the first hinge structure (750) is positioned in the radial direction of the conductive portion (702), the antenna performance (e.g., radiation efficiency or overall efficiency) of the conductive portion (702) may decrease.

[0161] Since the conductive portion (701) and / or the conductive portion (702) used as the radiator of the antenna overlaps with the first hinge structure (750) in the z-axis direction, the resonance may change due to the on-ground state. Due to the change in resonance, the amount of interference between the upper antenna (e.g., the antenna using the conductive portion (702)) and the lower antenna (e.g., the antenna using the conductive portion (701)) may increase.

[0162] In embodiments of the present disclosure, a technique is described for using a conductive portion of a third housing part (730) and another housing part (e.g., a first housing part (710) or a second housing part (720)) to reduce interference between an upper antenna and a lower antenna. For example, a current mode may be defined according to the distribution of a current flowing in a metal frame within an electronic device (101). The current mode may vary depending on the shape and / or position of a radiator used to radiate a signal. In order to improve radiation performance in a specific folding state (e.g., a half-folding state or a multi-folding state), a conductive portion (e.g., a conductive portion (703) of the second housing part (720) or a conductive portion (712) of the first housing part (710)) that causes a horizontal current mode (Jx mode) may be used as an antenna radiator.

[0163] In one embodiment, the electronic device (101) may perform multi-antenna communication (e.g., multiple input multiple output (MIMO) multiplexing or diversity) using two conductive portions. The electronic device (101) may transmit or receive a signal using two conductive portions (e.g., conductive portion (701) and conductive portion (702)) of the third housing part (730). As a non-limiting example, the electronic device (101) may transmit or receive a signal on a specific frequency band (e.g., a low frequency band below about 1 gigahertz (GHz)) via the two conductive portions. The conductive portion (701) may be referred to as a first conductive portion (701). The conductive portion (702) may be referred to as a second conductive portion (702). Depending on the folding state of the electronic device (101), a side surface of the third housing part (730) may overlap with the first hinge structure (750) or a side surface of the third housing part (730) may overlap with the display. In the folding state, instead of the conductive portion formed at least partially on the side surface of the third housing part (730), a conductive portion of another housing part (e.g., the first housing part (710) or the second housing part (720)) may be used. For example, the conductive portion (703) may be used to transmit or receive a signal. The conductive portion (703) may be referred to as the third conductive portion (703). As a non-limiting example, the electronic device (101) may transmit or receive a signal on a specific frequency band (e.g., a low frequency band below about 1 GHz) via the first conductive portion (701) and / or the third conductive portion (703).When the side of the third housing part (730) overlaps the first hinge structure (750) or the side of the third housing part (730) overlaps the display depending on the folding state of the electronic device (101), the electronic device (101) can transmit or receive a signal on a specific frequency band (e.g., a low frequency band below about 1 GHz) through the first conductive part (701) and the third conductive part (703). As another example, the electronic device (101) can transmit or receive a signal on a specific frequency band (e.g., a low frequency band below about 1 GHz) through the second conductive part (702) and / or the third conductive part (703). When the side of the third housing part (730) overlaps the first hinge structure (750) or the side of the third housing part (730) overlaps the display depending on the folding state of the electronic device (101), the electronic device (101) can transmit or receive a signal on a specific frequency band (e.g., a low frequency band below about 1 GHz) through the second conductive part (702) and the third conductive part (703).

[0164] In FIG. 7, the conductive portion (703) of the second housing part (720) that is different from the third housing part (730) is exemplified, but embodiments of the present disclosure are not limited thereto. Among the conductive portions of the first housing part (710), a conductive portion (e.g., conductive portion (712) or conductive portion (716)) that causes a horizontal current mode can also be utilized in a folded state. For example, when the side of the third housing part (730) overlaps the first hinge structure (750) or the side of the third housing part (730) overlaps the display, the electronic device (101) can transmit or receive a signal on a specific frequency band (e.g., a low frequency band below about 1 GHz) through the first conductive portion (701) and the conductive portion (712). For example, if a side of the third housing part (730) overlaps with the first hinge structure (750) or if a side of the third housing part (730) overlaps with the display, the electronic device (101) can transmit or receive a signal on a specific frequency band (e.g., a low frequency band below about 1 GHz) through the first conductive part (701) and the conductive part (716). For example, if a side of the third housing part (730) overlaps with the first hinge structure (750) or if a side of the third housing part (730) overlaps with the display, the electronic device (101) can transmit or receive a signal on a specific frequency band (e.g., a low frequency band below about 1 GHz) through the second conductive part (702) and the conductive part (712). For example, if a side of the third housing part (730) overlaps the first hinge structure (750) or a side of the third housing part (730) overlaps the display, the electronic device (101) can transmit or receive a signal on a specific frequency band (e.g., a low frequency band below about 1 GHz) through the second conductive part (702) and the conductive part (716).

[0165] FIG. 8A illustrates examples of states (e.g., a first state (200a), a second state (200b), or a third state (200c)) of a foldable-type electronic device (e.g., an electronic device (101), an electronic device (200)). As an example, the electronic device may be referred to as an e-type foldable electronic device.

[0166] Referring to FIG. 8A, the electronic device (101) may include a first housing part (710), a second housing part (720), and a third housing part (730). A first hinge structure (750) may rotatably couple the first housing part (710) and the second housing part (720). A second hinge structure (760) may rotatably couple the second housing part (720) and the third housing part (730).

[0167] The first state (801) represents a state in which the first housing part (710), the second housing part (720), and the third housing part (730) are all unfolded. The first state (801) may be referred to as an unfolded state or an unfolded state. The first state (801) may correspond to the first state (200a) of FIG. 2A. The second state (802) represents a state in which the first housing part (710) and the second housing part (720) are folded, and the second housing part (720) and the third housing part (730) are unfolded. The second state (802) may be referred to as a first single folded state, a first half folded state, or a first semi-folded state. The second state (802) may correspond to the second state (200b) of FIG. 2B. The third state (803) represents a state in which the first housing part (710) and the second housing part (720) are unfolded, and the second housing part (720) and the third housing part (730) are folded. The third state (803) may be referred to as a second single folding state, a second half folding state, or a second semi-folded state. The fourth state (804) represents a state in which the first housing part (710), the second housing part (720), and the third housing part (730) are all folded. The fourth state (804) may be referred to as a folding state, a multi-folding state, or a full-folding state. The fourth state (804) may correspond to the third state (200c) of FIG. 2c.

[0168] The electronic device (101) may include an antenna. For example, the electronic device (101) may use a portion of a metal frame of the third housing part (730) (e.g., the first conductive portion (701) or the second conductive portion (702)) as a radiator of the antenna. For example, the first conductive portion (701) may be formed across the side and bottom of the electronic device (101) among the metal frames of the third housing part (730). The electronic device (101) may transmit or receive signals using the first conductive portion (701). For example, the second conductive portion (702) may be formed across the side and top of the electronic device (101) among the metal frames of the third housing part (730). The electronic device (101) may transmit or receive signals using the second conductive portion (702).

[0169] In the first state (801) and the second state (802), since the first conductive portion (701) and / or the second conductive portion (702) are located in an open space, the antenna performance can be sufficiently secured. For example, the electronic device (101) can transmit or receive a signal through the second conductive portion (702) while transmitting or receiving a signal through the first conductive portion (701). Depending on the distribution of the current flowing in the metal frame within the housing part, various current modes can be defined. The first conductive portion (701) and the second conductive portion (702) can provide a vertical current mode (e.g., Jy). However, in the third state (803), a portion of the first conductive portion (701) and / or the second conductive portion (702) (e.g., a portion formed on a side facing in a horizontal direction (e.g., in the x-axis direction) among the side surfaces) may overlap with the flexible display (e.g., the flexible display (240)). The overlap may increase interference between the upper antenna (e.g., the first conductive portion (701)) and the lower antenna (e.g., the second conductive portion (702)). Among the multiple current modes, the current mode that provides the highest radiation performance in the third state (803) may not be the vertical current mode. In order to utilize the horizontal current mode, a conductive portion formed in a horizontal direction (e.g., the x-axis direction that faces in a horizontal direction (e.g., in the x-axis direction) among the side surfaces) may be utilized. For example, in the third state (803), different antenna radiators may be used depending on the folding state of the electronic device (101) so that the electronic device (101) operates in a current mode providing high radiation performance. For example, the third conductive portion (703) may be used as the antenna radiator instead of the second conductive portion (702) to reduce interference between the two antennas and improve envelope correlation coefficient (ECC) performance.The electronic device (101) can transmit or receive a signal through the third conductive portion (703) while transmitting or receiving a signal through the first conductive portion (701). In the fourth state (804), a portion of the first conductive portion (701) and / or the second conductive portion (702) (e.g., a portion formed on a side facing in a horizontal direction (e.g., in the x-axis direction) among the side surfaces) can overlap with the second hinge structure (750). To reduce the effect due to the overlap, a horizontal current mode can be used. As the state of the electronic device (101) changes to the fourth state (804), the third conductive portion (703) can be used as an antenna radiator instead of the second conductive portion (702). For example, the electronic device (101) can transmit or receive a signal through the third conductive portion (703) while transmitting or receiving a signal through the first conductive portion (701).

[0170] In one embodiment, the first conductive portion (701) and / or the second conductive portion (702) may be used as a radiator of an antenna for transmitting or receiving signals in a low frequency band (e.g., a frequency band below about 1 GHz). For example, the third conductive portion (703) may be used as a top antenna together with the first conductive portion (701) and / or the second conductive portion (702). The third conductive portion (703) may be used as a radiator of an antenna for transmitting or receiving signals in a low frequency band (e.g., a frequency band below about 1 GHz). In order to support communication in the low frequency band, the third conductive portion (703) may be required to have a length greater than a certain value. In order to describe the frequency draw and current modes supported by the conductive portion, a length direction may be defined. The length direction may refer to the longest direction among the shapes of the corresponding conductive portions. Referring back to FIG. 7, at least a portion of the first conductive portion (701) may be formed on a side surface facing in one direction (e.g., in the x-axis direction) among the side surfaces of the third housing part (730) (e.g., a top surface facing in the (+) y-axis direction, a bottom surface facing in the (-) y-axis direction, a side surface facing in the (+) x-axis direction). In one embodiment, the longitudinal direction (e.g., in the y-axis direction) of the first conductive portion (701) may be substantially perpendicular to the longitudinal direction (e.g., in the x-axis direction) of the third conductive portion (703). Referring again to FIG. 7, at least a portion of the first conductive portion (701) may be formed on a side surface facing in one direction (e.g., in the x-axis direction) among the side surfaces of the third housing part (730) (e.g., a top surface facing in the (+) y-axis direction, a bottom surface facing in the (-) y-axis direction, a side surface facing in the (+) x-axis direction). In one embodiment, the longitudinal direction (e.g., y-axis direction) of the second conductive portion (702) may be perpendicular to the longitudinal direction (e.g., x-axis direction) of the third conductive portion (703).In one embodiment, the third conductive portion (703) may be required to have a length greater than or equal to a certain value in the longitudinal direction (e.g., in the x-axis direction). For example, the third conductive portion (703) may have a length greater than or equal to about 25 mm in the longitudinal direction (e.g., in the x-axis direction) (within a tolerance of 5%). For example, the third conductive portion (703) may have a length greater than or equal to about 40 mm in the longitudinal direction (e.g., in the x-axis direction) (within a tolerance of 5%).

[0171] FIG. 8b illustrates examples of functional components of a foldable-type electronic device (e.g., electronic device (101), electronic device (200), electronic device (400), or electronic device (500)). FIG. 8b illustrates a circuit structure according to a diversity technique among multi-antenna communication techniques.

[0172] Referring to FIG. 8B, the electronic device (101) may include a wireless communication circuit (810) (e.g., the communication module (190) of FIG. 1). The wireless communication circuit (810) may be connected to a divider circuit (820). The wireless communication circuit (810) may be connected to a first conductive portion (701) through the divider circuit (820). The wireless communication circuit (810) may be connected to a second conductive portion (702) or a third conductive portion (703) through the divider circuit (820) and a switching circuit (830) (e.g., a single pole double throw (SPDT)). The switching circuit (830) may be controlled under the control of a processor (e.g., the processor (120)) or the wireless communication circuit (810). For example, the processor (120) may control a change in the connection state of the switching circuit (830) in response to a change in the folding state of the electronic device (101) (e.g., a change from the first state (801) to the third state (803), or a change from the second state (802) to the fourth state (804)).

[0173] In one embodiment, the switching circuit (830) may be controlled to connect a branch of the divider circuit (820) to the second conductive portion (702). For example, in the first state (801) or the second state (802), the electronic device (101) may transmit or receive a signal through the first conductive portion (701) and the second conductive portion (702). As an example, the divider circuit (820) may function as a divider for signal transmission. An RF signal from the wireless communication circuit (810) may be divided into a first RF signal and a second RF signal through the divider circuit (820). Since the first RF signal and the second RF signal are divided from the same signal, the two signals may have equivalent information. The first RF signal may be transmitted through the first conductive portion (701). The second RF signal may be transmitted through the second conductive portion (702). For example, the divider circuit (820) may function as a combiner for signal reception. A first RF signal from the first conductive portion (701) and a second RF signal from the second conductive portion (702) may be combined via the divider circuit (820). The combined RF signal may be provided to the wireless communication circuit (810).

[0174] In one embodiment, the switching circuit (830) may be controlled to connect a branch of the divider circuit (820) to the third conductive portion (703). For example, in the third state (803) or the fourth state (804), the electronic device (101) may transmit or receive a signal through the first conductive portion (701) and the third conductive portion (703). As an example, the divider circuit (820) may function as a divider for signal transmission. An RF signal from the wireless communication circuit (810) may be divided into a first RF signal and a second RF signal through the divider circuit (820). Since the first RF signal and the second RF signal are divided from the same signal, the two signals may have equivalent information. The first RF signal may be transmitted through the first conductive portion (701). The second RF signal may be transmitted through the third conductive portion (703). For example, the divider circuit (820) may function as a combiner for signal reception. A first RF signal from the first conductive portion (701) and a second RF signal from the third conductive portion (703) may be combined through the divider circuit (820). The combined RF signal may be provided to the wireless communication circuit (810).

[0175] In one embodiment, the first conductive portion (701) and the second conductive portion (702) may be included in a third housing part (730). The third housing part (730) may include a PCB (e.g., a third printed circuit board (373)). In one embodiment, a divider circuit (820) may be disposed on the PCB. In one embodiment, a switching circuit (830) may be disposed on the PCB. The third conductive portion (703) may be included in the second housing part (720). In one embodiment, the electronic device (101) may include a flexible substrate (e.g., FPCB, flexible RF cable) for connecting a branch of the switching circuit (830) disposed in the third housing part (730) and the third conductive portion (703) disposed in the second housing part (720). The above flexible substrate can be placed across the second housing part (720) and the third housing part (730).

[0176] As a non-limiting example, the wireless communication circuit (810), the divider circuit (820), and / or the switching circuit (830) may be disposed within a PCB (e.g., the second printed circuit board (372)) of the second housing part (720). Similarly, a flexible substrate for connecting a branch of the switching circuit (830) to the first conductive portion (701) disposed in the third housing part (730) may be disposed across the second housing part (720) and the third housing part (730).

[0177] FIG. 8c illustrates an example of functional components of a foldable-type electronic device (e.g., electronic device (101), electronic device (200), electronic device (400), or electronic device (500)). FIG. 8c illustrates a circuit structure according to a MIMO multiplexing technique among multi-antenna communication techniques.

[0178] Referring to FIG. 8C, the electronic device (101) may include a wireless communication circuit (810) (e.g., the communication module (190) of FIG. 1). The wireless communication circuit (810) may be connected to the first conductive portion (701). The wireless communication circuit (810) may be connected to the second conductive portion (702) or the third conductive portion (703) via a switching circuit (830) (e.g., SPDT). The switching circuit (830) may be controlled under the control of a processor (e.g., the processor (120)) or the wireless communication circuit (810). For example, the processor (120) may control a change in the connection state of the switching circuit (830) in response to a change in the folding state of the electronic device (101) (e.g., a change from the first state (801) to the third state (803), or a change from the second state (802) to the fourth state (804)).

[0179] In one embodiment, the switching circuit (830) may be controlled to connect the wireless communication circuit (810) and the second conductive portion (702). For example, in the first state (801) or the second state (802), the electronic device (101) may transmit or receive a signal through the first conductive portion (701) and the second conductive portion (702). As an example, the electronic device (101) may transmit two independent RF signals (e.g., a first RF signal or a second RF signal). The two RF signals may be provided from the wireless communication circuit (810) to the first conductive portion (701) and the second conductive portion (702), respectively. The first RF signal may be transmitted through the first conductive portion (701). The second RF signal may be transmitted through the second conductive portion (702). For example, the electronic device (101) can receive two signals through two antennas (e.g., a lower antenna using a first conductive portion (701) or an upper antenna using a second conductive portion (702). A first RF signal from the first conductive portion (701) and a second RF signal from the second conductive portion (702) can each be provided to a wireless communication circuit (810).

[0180] In one embodiment, the switching circuit (830) may be controlled to connect the wireless communication circuit (810) and the third conductive portion (703). For example, in the third state (803) or the fourth state (804), the electronic device (101) may transmit or receive a signal through the first conductive portion (701) and the third conductive portion (703). As an example, the electronic device (101) may transmit two independent RF signals (e.g., a first RF signal or a second RF signal). The two RF signals may be provided from the wireless communication circuit (810) to the first conductive portion (701) and the third conductive portion (703), respectively. The first RF signal may be transmitted through the first conductive portion (701). The second RF signal may be transmitted through the third conductive portion (703). For example, the electronic device (101) can receive two signals through two antennas (e.g., a lower antenna using the first conductive portion (701) or an upper antenna using the third conductive portion (703). A first RF signal from the first conductive portion (701) and a second RF signal from the third conductive portion (703) can each be provided to the wireless communication circuit (810).

[0181] In one embodiment, the first conductive portion (701) and the second conductive portion (702) may be included in a third housing part (730). The third housing part (730) may include a PCB (e.g., a third printed circuit board (373)). In one embodiment, a switching circuit (830) may be disposed on the PCB. The third conductive portion (703) may be included in a second housing part (720). In one embodiment, the electronic device (101) may include a flexible substrate (e.g., an FPCB, a flexible RF cable) for connecting a branch of the switching circuit (830) disposed in the third housing part (730) and the third conductive portion (703) disposed in the second housing part (720). The flexible substrate may be disposed across the second housing part (720) and the third housing part (730).

[0182] As a non-limiting example, the wireless communication circuit (810) and / or the switching circuit (830) may be disposed within a PCB (e.g., a second printed circuit board (372)) of the second housing part (720). For example, a flexible substrate for connecting a branch of the switching circuit (830) and a first conductive portion (701) disposed in the third housing part (730) may be disposed across the second housing part (720) and the third housing part (730).

[0183] In FIGS. 8B and 8C , the third conductive portion (703) is exemplified as a conductive portion disposed in a housing part other than the third housing part (730), but embodiments of the present disclosure are not limited thereto. The conductive portion (e.g., conductive portion (712)) of the first housing part (710) can be utilized in the third state (803) or the fourth state (804). For example, the conductive portion (712) can be utilized for multi-antenna communication together with the first conductive portion (701). When the wireless communication circuit (810) is disposed in the third housing part (730), a flexible substrate can be disposed across the first housing part (710), the second housing part (720), and the third housing part (730) for connection between the conductive portion (712) and the switching circuit (830).

[0184] As a non-limiting example, the wireless communication circuit (810) and / or the switching circuit (830) may be disposed within a PCB (e.g., a first printed circuit board (371)) of the first housing part (710). For example, a flexible substrate for connecting a branch of the switching circuit (830) and a first conductive portion (701) disposed in the third housing part (730) may be disposed across the first housing part (710), the second housing part (720), and the third housing part (730).

[0185] In FIGS. 8A to 8C , an example is described in which the first conductive portion (701) and the second conductive portion (702) are used in the unfolded state, and the first conductive portion (701) and the third conductive portion (703) are used in the folded state; however, the embodiments of the present disclosure are not limited thereto. For example, as the state of the electronic device (101) changes to the fourth state (804), the third conductive portion (703) may be used as an antenna radiator instead of the first conductive portion (701). In the folded state, the electronic device (101) may transmit or receive a signal through the third conductive portion (703) while transmitting or receiving a signal through the second conductive portion (702).

[0186] Fig. 9 illustrates an example of performance according to current mode of a foldable-type electronic device (e.g., electronic device (101), electronic device (200), electronic device (400), or electronic device (500)). Various current modes can be defined depending on the distribution of current flowing in a metal frame within a housing part of the electronic device.

[0187] Referring to FIG. 9, a graph (900) represents significance by frequency. The horizontal axis of the graph (900) represents frequency (unit: GHz (gigahertz)), and the vertical axis of the graph (900) represents significance (unit: none). Significance represents the influence of a current mode among five predefined current modes. A first line (901) represents significance according to a first current mode among the five current modes. For example, the first current mode represents a vertical current mode. A second line (902) represents significance according to a second current mode among the five current modes. For example, the second current mode represents horizontal and vertical current modes. A third line (903) represents significance according to a third current mode among the five current modes. For example, the third current mode represents a horizontal current mode. A fourth line (904) represents significance according to a fourth current mode among the five current modes. The fifth line (905) indicates the importance according to the fifth current mode among the five current modes.

[0188] Referring to the graph (900), it can be confirmed that the current mode with the highest importance next to the vertical current mode (i.e., the first current mode) is the second current mode and / or the third current mode. To confirm the current distribution in the horizontal direction, the tables below can be referred to as examples. The tables below indicate the ECC for each mode in the electronic device (101) in the multi-folding state.

[0189] ModeECC%10.80084.720.0596.230.0656.940.0202.150.0000.0

[0190] ModeECC%10.40142.920.32034.230.17218.440.0131.450.0293.1

[0191] [Table 1] shows the ECC performance when the second conductive portion (702) is used together with the first conductive portion (701). [Table 2] shows the ECC performance when the third conductive portion (703) is used together with the first conductive portion (701). The closer the ECC is to 0, the higher the isolation and the more independently the two antennas operate. Referring to [Table 1] and [Table 2], it can be confirmed that the third conductive portion (703) has a greater influence on the second current mode and / or the third current mode than the second conductive portion (702) compared to other current modes.

[0192] According to embodiments of the present disclosure, a technique is described for using different current modes between the lower antenna and the upper antenna to reduce interference between the two antennas in the multi-folding state (e.g., the fourth state (804)) or the second half-folding state (e.g., the third state (803)). According to one embodiment, in the multi-folding state (e.g., the fourth state (804)) or the second half-folding state (e.g., the third state (803)), the electronic device (101) may use the first conductive portion (701) that induces a vertical current mode as the lower antenna. The electronic device (101) may use the third conductive portion (703) that induces a horizontal current mode (Jx mode) as the upper antenna while transmitting or receiving a signal through the lower antenna. By using the third conductive part (703) as a radiator of an antenna having a relatively high importance of the horizontal current mode (Jx mode), the amount of interference between the third conductive part (703) and the first conductive part (701) (the radiator of the antenna providing the vertical current mode (Jy mode)) can be reduced. The influence caused by the side end of the third housing part (730) overlapping with the first hinge structure (750) or the flexible display can be reduced.

[0193] FIG. 10 illustrates an example of an electronic device (e.g., electronic device (101), electronic device (200), electronic device (400), or electronic device (500)) that uses a conductive portion (e.g., third conductive portion (703)) of a second housing part (e.g., second housing part (720)) as a radiator.

[0194] Referring to FIG. 10, an electronic device (101) may include a first housing part (710), a second housing part (720), and a third housing part (730). The electronic device (101) may include a first hinge structure (750) configured to rotatably couple the first housing part (710) and the second housing part (720). The electronic device (101) may include a second hinge structure (760) configured to rotatably couple the second housing part (720) and the third housing part (730). Example (1000) illustrates conductive portions of the electronic device (101) in a state in which the first housing part (710), the second housing part (720), and the third housing part (730) are all unfolded (e.g., a first state (801)). Example (1050) shows conductive portions of the electronic device (101) in a folded state (e.g., fourth state (804)) with the first housing part (710), the second housing part (720), and the third housing part (730) all folded.

[0195] According to one embodiment, the electronic device (101) can transmit or receive a signal through the first conductive portion (701) of the third housing part (730) and the second conductive portion (702) of the third housing part (730). While transmitting or receiving a signal through the first conductive portion (701), in a first state (801), the second conductive portion (702) can be used as an antenna radiator for transmitting or receiving a signal. In the first state (801), the conductive portions (e.g., the first conductive portion (701) or the second conductive portion (702)) at least partially formed on the side surface of the third housing part (730) are positioned in an open space, so that isolation between the two antennas (e.g., the antenna using the first conductive portion (701) or the antennas using the second conductive portion (702)) can be secured.

[0196] According to one embodiment, the electronic device (101) can transmit or receive a signal through the first conductive portion (701) of the third housing part (730) and the third conductive portion (703) of the second housing part (720). While transmitting or receiving a signal through the first conductive portion (701), in a fourth state (804), the third conductive portion (703) can be used as an antenna radiator for transmitting or receiving a signal. In the fourth state (804), since the conductive portions (e.g., the first conductive portion (701) or the second conductive portion (702)) at least partially formed on the side surface of the third housing part (730) come close to another component (e.g., the first hinge structure (750)), it may be difficult to sufficiently provide isolation between the two antennas (e.g., the antenna using the first conductive portion (701) or the antennas using the second conductive portion (702). To reduce interference between antennas of an electronic device (101) and ensure isolation, antennas utilizing orthogonal current modes may be utilized. The electronic device (101) may utilize a first conductive portion (701) and a third conductive portion (703) as antenna radiators for multi-antenna communication. For example, the first conductive portion (701) may induce a vertical current mode (Jy mode). For example, the third conductive portion (703) may induce a horizontal current mode (Jx mode).

[0197] In FIG. 10, an example is described in which the first conductive portion (701) and the second conductive portion (702) are used in the unfolded state, and the first conductive portion (701) and the third conductive portion (703) are used in the folded state; however, embodiments of the present disclosure are not limited thereto. For example, as the state of the electronic device (101) changes from example (1000) to example (1050), the third conductive portion (703) may be used as an antenna radiator instead of the first conductive portion (701). In the folded state, the electronic device (101) may transmit or receive a signal through the third conductive portion (703) while transmitting or receiving a signal through the second conductive portion (702).

[0198] Figures 11a and 11b illustrate examples of radiation performance in an unfolded state (e.g., a first state (801)). The electronic device (101) can transmit or receive signals via the upper antenna and the lower antenna. For example, the electronic device (101) can use the first conductive portion (701) as a radiator of the lower antenna. When the electronic device (101) uses the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) can use the second conductive portion (702) as a radiator of the upper antenna. For example, the electronic device (101) can use the first conductive portion (701) as a radiator of the lower antenna. When the electronic device (101) uses the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) can use the third conductive portion (703) as a radiator of the upper antenna.

[0199] Referring to Fig. 11a, a graph (1100a) represents the total efficiency of the upper antenna by frequency. The horizontal axis of the graph (1100a) represents the frequency (unit: GHz) and the vertical axis represents the total efficiency (unit: dB (decibel)). The first line (1101) represents the total efficiency of the upper antenna using the second conductive portion (702) as a radiator in the first state (801). The second line (1102) represents the total efficiency of the upper antenna using the third conductive portion (703) as a radiator in the first state (801). Referring to the first line (1101) and the second line (1102), it can be confirmed that the overall efficiency of the third conductive portion (703) of the second housing part (720) as the upper antenna is substantially equivalent to the overall efficiency of the second conductive portion (702) of the third housing part (730).

[0200] Referring to Fig. 11b, the graph (1100b) represents the overall efficiency of the lower antenna by frequency. The horizontal axis of the graph (1100b) represents the frequency (unit: GHz) and the vertical axis represents the overall efficiency (unit: dB). The first line (1151) represents the overall efficiency of the lower antenna using the first conductive portion (701) when the second conductive portion (702) is used as the upper antenna in the first state (801). The second line (1152) represents the overall efficiency of the lower antenna using the first conductive portion (701) when the third conductive portion (703) is used as the upper antenna in the first state (801). Referring to the first line (1151) and the second line (1152), it can be confirmed that the overall efficiency of the lower antenna when the third conductive portion (703) of the second housing part (720) is used as the upper antenna is substantially equal to the overall efficiency of the lower antenna when the second conductive portion (702) of the third housing part (730) is used as the upper antenna.

[0201] Figures 12a and 12b illustrate examples of radiation performance in a half-folded state (e.g., the second state (802)). The electronic device (101) can transmit or receive signals via the upper antenna and the lower antenna. The electronic device (101) can utilize the first conductive portion (701) as a radiator of the lower antenna. For example, when the electronic device (101) utilizes the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) can utilize the second conductive portion (702) as a radiator of the upper antenna. As another example, when the electronic device (101) utilizes the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) can utilize the third conductive portion (703) as a radiator of the upper antenna.

[0202] Referring to Fig. 12a, a graph (1200a) represents the overall efficiency of the upper antenna by frequency. The horizontal axis of the graph (1200a) represents the frequency (unit: GHz) and the vertical axis represents the overall efficiency (unit: dB). The first line (1201) represents the overall efficiency of the upper antenna using the second conductive part (702) as a radiator in the second state (802). The second line (1202) represents the overall efficiency of the upper antenna using the third conductive part (703) as a radiator in the second state (802). In the second state (802), the first housing part (710) and the second housing part (720) may be arranged to face each other. Due to the first housing part (710), the radiation performance of the third conductive part (703) may be reduced. Referring to the first line (1201) and the second line (1202), it can be confirmed that the overall efficiency of the third conductive portion (703) of the second housing part (720) as the upper antenna is lower than the overall efficiency of the second conductive portion (702) of the third housing part (730).

[0203] Referring to Fig. 12b, the graph (1200b) represents the overall efficiency of the lower antenna by frequency. The horizontal axis of the graph (1200b) represents the frequency (unit: GHz) and the vertical axis represents the overall efficiency (unit: dB). The first line (1251) represents the overall efficiency of the lower antenna using the first conductive portion (701) when the second conductive portion (702) is used as the upper antenna in the second state (802). The second line (1252) represents the overall efficiency of the lower antenna using the first conductive portion (701) when the third conductive portion (703) is used as the upper antenna in the second state (802). Referring to the first line (1251) and the second line (1252), it can be confirmed that the overall efficiency of the lower antenna when the third conductive part (703) of the second housing part (720) is used as the upper antenna is at the same level as the overall efficiency of the lower antenna when the second conductive part (702) of the third housing part (730) is used as the upper antenna.

[0204] Figures 13a and 13b illustrate examples of radiation performance in a folded state (e.g., the fourth state (804)). The electronic device (101) can transmit or receive signals via the upper antenna and the lower antenna. The electronic device (101) can utilize the first conductive portion (701) as a radiator of the lower antenna. For example, when the electronic device (101) utilizes the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) can utilize the second conductive portion (702) as a radiator of the upper antenna. As another example, when the electronic device (101) utilizes the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) can utilize the third conductive portion (703) as a radiator of the upper antenna.

[0205] Referring to FIG. 13A, a graph (1300a) represents the overall efficiency of the upper antenna by frequency. The horizontal axis of the graph (1300a) represents the frequency (unit: GHz) and the vertical axis represents the overall efficiency (unit: dB). The first line (1301) represents the overall efficiency of the upper antenna using the second conductive portion (702) as a radiator in the fourth state (804). The second line (1302) represents the overall efficiency of the upper antenna using the third conductive portion (703) as a radiator in the fourth state (804). In the fourth state (804), the first hinge structure (750) may be arranged close to the conductive portions of the side surface of the third housing part (730). Due to the first hinge structure (750), the radiation performance of the second conductive portion (702) may be reduced. Referring to the first line (1301) and the second line (1302), it can be confirmed that the overall efficiency of the third conductive portion (703) of the second housing part (720) as the upper antenna is higher than the overall efficiency of the second conductive portion (702) of the third housing part (730) in a certain frequency range (e.g., above about 0.75 GHz). For example, at a frequency of about 0.8 GHz, the overall efficiency of the third conductive portion (703) may be about 4 dB higher than the overall efficiency of the second conductive portion (702). For example, at a frequency of about 0.85 GHz, the overall efficiency of the third conductive portion (703) may be about 2 dB higher than the overall efficiency of the second conductive portion (702).

[0206] Referring to Fig. 13b, the graph (1300b) represents the overall efficiency of the lower antenna by frequency. The horizontal axis of the graph (1300b) represents the frequency (unit: GHz) and the vertical axis represents the overall efficiency (unit: dB). The first line (1351) represents the overall efficiency of the lower antenna using the first conductive portion (701) when the second conductive portion (702) is used as the upper antenna in the fourth state (804). The second line (1352) represents the overall efficiency of the lower antenna using the first conductive portion (701) when the third conductive portion (703) is used as the upper antenna in the fourth state (804). Referring to the first line (1351) and the second line (1352), it can be confirmed that the overall efficiency of the lower antenna when the third conductive portion (703) of the second housing part (720) is used as the upper antenna is higher than the overall efficiency of the lower antenna when the second conductive portion (702) of the third housing part (730) is used as the upper antenna. For example, at a frequency of about 0.8 GHz, it can be confirmed that the overall efficiency of the lower antenna when the third conductive portion (703) is used is improved by about 6 dB compared to the overall efficiency of the lower antenna when the second conductive portion (702) is used. For example, at a frequency of about 0.85 GHz, it can be confirmed that the overall efficiency of the lower antenna when the third conductive portion (703) is used is improved by about 5 dB compared to the overall efficiency of the lower antenna when the second conductive portion (702) is used.

[0207] FIG. 14A illustrates an example of a current distribution in an electronic device (e.g., electronic device (101) or electronic device (200)) that utilizes a conductive portion (e.g., a third conductive portion (703)) of a second housing part (e.g., a second housing part (720)). The electronic device (101) can transmit or receive signals through an upper antenna and a lower antenna. For example, the electronic device (101) can utilize the first conductive portion (701) as a radiator of the lower antenna. When the electronic device (101) utilizes the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) can utilize the third conductive portion (703) as a radiator of the upper antenna.

[0208] Referring to FIG. 14A, an example (1401) shows a current distribution when the electronic device (101) transmits or receives a signal through the radiator (e.g., the first conductive portion (701)) of the lower antenna in a multi-folding state (e.g., the fourth state (804)). A current distribution strongly formed in the vertical direction (e.g., the y-axis direction) can be confirmed. An example (1402) shows a current distribution when the electronic device (101) transmits or receives a signal through the radiator (e.g., the third conductive portion (703)) of the upper antenna in a multi-folding state (e.g., the fourth state (804)). A current distribution strongly formed in the horizontal direction (e.g., the x-axis direction) can be confirmed. Since the current distributions of the upper antenna and the lower antenna are formed in directions perpendicular to each other, isolation between the two antennas can be secured even in the multi-folding state.

[0209] FIG. 14b illustrates an example of a radiation pattern of an electronic device (e.g., electronic device (101) or electronic device (200)) that utilizes a conductive portion (e.g., third conductive portion (703)) of a second housing part (e.g., second housing part (720)).

[0210] Referring to FIG. 14B, example (1451) shows a radiation pattern when the electronic device (101) transmits a signal through the radiator (e.g., the first conductive portion (701)) of the lower antenna in a multi-folding state (e.g., the fourth state (804)). Example (1452) shows a radiation pattern when the electronic device (101) transmits a signal through the radiator (e.g., the third conductive portion (703)) of the upper antenna in a multi-folding state (e.g., the fourth state (804)). Referring to examples (1451) and (1452), independence between the two radiation patterns can be confirmed. This independence can be confirmed by a decrease in ECC. In addition, as an example, when the second conductive portion (702) is used as the radiator of the upper antenna, the pass coefficient (S 21 ) can be about -1.7 dB. When using the third conductive part (703) as the radiator of the upper antenna, the pass coefficient (S 21 ) can be approximately -2.8 dB.

[0211] FIG. 15 illustrates an example of an electronic device (e.g., electronic device (101) or electronic device (200)) that uses a conductive portion (e.g., conductive portion (712)) of a third housing part (e.g., third housing part (730)) as a radiator.

[0212] Referring to FIG. 15, an electronic device (101) may include a first housing part (710), a second housing part (720), and a third housing part (730). The electronic device (101) may include a first hinge structure (750) configured to rotatably couple the first housing part (710) and the second housing part (720). The electronic device (101) may include a second hinge structure (760) configured to rotatably couple the second housing part (720) and the third housing part (730). Example (1500) illustrates conductive portions of the electronic device (101) in a state in which the first housing part (710), the second housing part (720), and the third housing part (730) are all unfolded (e.g., the first state (801)). Example (1550) shows conductive portions of the electronic device (101) in a folded state (e.g., fourth state (804)) of the first housing part (710), the second housing part (720), and the third housing part (730).

[0213] According to one embodiment, the electronic device (101) can transmit or receive a signal through the first conductive portion (701) of the third housing part (730) and the second conductive portion (702) of the third housing part (730). While transmitting or receiving a signal through the first conductive portion (701), in a first state (801), the second conductive portion (702) can be used as an antenna radiator for transmitting or receiving a signal. In the first state (801), the conductive portions (e.g., the first conductive portion (701) or the second conductive portion (702)) at least partially formed on the side surface of the third housing part (730) are positioned in an open space, so that isolation between the two antennas (e.g., the antenna using the first conductive portion (701) or the antennas using the second conductive portion (702)) can be secured.

[0214] According to one embodiment, the electronic device (101) can transmit or receive a signal through the first conductive portion (701) of the third housing part (730) and the conductive portion (712) of the first housing part (710). While transmitting or receiving a signal through the first conductive portion (701), in a fourth state (804), the conductive portion (712) can be used as an antenna radiator for transmitting or receiving a signal. In the fourth state (804), since the conductive portions (e.g., the first conductive portion (701) or the second conductive portion (702)) at least partially formed on the side surface of the third housing part (730) come close to another component (e.g., the first hinge structure (750)), it may be difficult to sufficiently provide isolation between the two antennas (e.g., the antenna using the first conductive portion (701) or the antennas using the second conductive portion (702). To reduce interference between antennas of an electronic device (101) and ensure isolation, antennas utilizing mutually perpendicular current modes may be utilized. The electronic device (101) may utilize the first conductive portion (701) and the conductive portion (712) as antennas for multi-antenna communication. For example, the first conductive portion (701) may induce a vertical current mode (Jy mode). For example, the conductive portion (712) may induce a horizontal current mode (Jx mode).

[0215] In FIG. 15, an example is described in which the first conductive portion (701) and the second conductive portion (702) are used in the unfolded state, and the first conductive portion (701) and the conductive portion (712) are used in the folded state; however, the embodiments of the present disclosure are not limited thereto. For example, as the state of the electronic device (101) changes from example (1500) to example (1550), the conductive portion (712) may be used as an antenna radiator instead of the first conductive portion (701). In the folded state, the electronic device (101) may transmit or receive a signal through the conductive portion (712) while transmitting or receiving a signal through the second conductive portion (702).

[0216] FIG. 16A illustrates an example of a current distribution in an electronic device (e.g., electronic device (101) or electronic device (200)) that utilizes a conductive portion (e.g., conductive portion (712)) of a third housing part (e.g., third housing part (730)). The electronic device (101) can transmit or receive signals through an upper antenna and a lower antenna. For example, the electronic device (101) can utilize the first conductive portion (701) as a radiator of the lower antenna. When the electronic device (101) utilizes the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) can utilize the conductive portion (712) as a radiator of the upper antenna.

[0217] Referring to FIG. 16A, an example (1601) shows a current distribution when the electronic device (101) transmits or receives a signal through the radiator (e.g., the first conductive portion (701)) of the lower antenna in a multi-folding state (e.g., the fourth state (804)). A current distribution strongly formed in the vertical direction (e.g., the y-axis direction) can be confirmed. An example (1602) shows a current distribution when the electronic device (101) transmits or receives a signal through the radiator (e.g., the conductive portion (712)) of the upper antenna in a multi-folding state (e.g., the fourth state (804)). A current distribution strongly formed in the horizontal direction (e.g., the x-axis direction) can be confirmed. Since the current distributions of the upper antenna and the lower antenna are formed in directions perpendicular to each other, isolation between the two antennas can be secured even in the multi-folding state.

[0218] FIG. 16b shows an example of a radiation pattern of an electronic device (e.g., electronic device (101) or electronic device (200)) that utilizes a conductive portion (e.g., conductive portion (712)) of a third housing part (e.g., third housing part (730)).

[0219] Referring to FIG. 16B, example (1651) shows a radiation pattern when the electronic device (101) transmits a signal through the radiator (e.g., the first conductive portion (701)) of the lower antenna in a multi-folding state (e.g., the fourth state (804)). Example (1652) shows a radiation pattern when the electronic device (101) transmits a signal through the radiator (e.g., the conductive portion (712)) of the upper antenna in a multi-folding state (e.g., the fourth state (804)). Referring to examples (1651) and (1652), independence between the two radiation patterns can be confirmed. This independence can be confirmed by a decrease in ECC. In addition, as an example, when the second conductive portion (702) is used as the radiator of the upper antenna, the pass coefficient (S 21) can be about -1.7 dB. When using the conductive part (712) as the radiator of the upper antenna, the pass coefficient (S 21 ) can be approximately -3.9 dB.

[0220] FIG. 17 illustrates an example of an electronic device (e.g., electronic device (101), electronic device (200), electronic device (400), or electronic device (500)) including a filter circuit.

[0221] Referring to FIG. 17, the electronic device (101) may include a first housing part (710), a second housing part (720), and a third housing part (730). The electronic device (101) may include a first hinge structure (750) configured to rotatably couple the first housing part (710) and the second housing part (720). The electronic device (101) may include a second hinge structure (760) configured to rotatably couple the second housing part (720) and the third housing part (730). According to one embodiment, the metal frame of the first housing part (710) may include a first set of conductive portions. For the conductive portions of the first housing part (710), the descriptions of FIG. 7 may be referenced. According to one embodiment, the metal frame of the second housing part (720) may include a second set of conductive portions. For the conductive portions of the second housing part (720), reference may be made to the descriptions of FIG. 7. In one embodiment, the metal frame of the third housing part (730) may include a third set of conductive portions. For the conductive portions of the third housing part (730), reference may be made to the descriptions of FIG. 7.

[0222] An electronic device (101) may utilize an antenna to transmit or receive signals. The electronic device (101) may transmit or receive signals through an upper antenna and a lower antenna. For example, the electronic device (101) may utilize a first conductive portion (701) as a radiator of the lower antenna. When the electronic device (101) utilizes the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) may utilize a second conductive portion (702) as a radiator of the upper antenna. For example, the electronic device (101) may utilize the first conductive portion (701) as a radiator of the lower antenna. When the electronic device (101) utilizes the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) may utilize the third conductive portion (703) as a radiator of the upper antenna.

[0223] According to one embodiment, the electronic device (101) may include a power supply unit (1730). A wireless communication circuit (e.g., a communication module (190) of FIG. 1 or a wireless communication circuit (1830) of FIGS. 8B and 8C) of the electronic device (101) may provide signals to the third conductive portion (703) through the wireless communication circuit (1730). The wireless communication circuit (e.g., a communication module (190) of FIG. 1 or a wireless communication circuit (830) of FIGS. 8B and 8C) of the electronic device (101) may obtain signals received through the third conductive portion (703) through the power supply unit (1730).

[0224] By implementing the antenna in the third housing part (730) and other housing parts (e.g., the second housing part (720)), the degree of freedom in antenna arrangement can be secured. Meanwhile, the first conductive part (701), the second conductive part (702), and / or the third conductive part (703) can be used as a radiator of an antenna for transmitting or receiving a signal in a low frequency band (e.g., a frequency band below about 1 GHz). For example, due to harmonic components in the low frequency band, the resonance characteristics can affect an adjacent antenna (e.g., an antenna that uses the conductive part (721), the conductive part (731), or the conductive part (732) as a radiator). According to one embodiment, in order to remove harmonic components in the low frequency band, the electronic device (101) can include a filter circuit (1740). The harmonic components represent distortion components that occur at frequencies that are integer multiples of the fundamental frequency. For example, the filter circuit (1740) may include a low pass filter (LPF) to remove harmonic frequencies. Interference with adjacent radiators may be reduced through the filter circuit (1740).

[0225] FIG. 18 illustrates examples of conductive portions in a foldable-type electronic device (e.g., electronic device (101), electronic device (200), electronic device (400), or electronic device (500)). In FIGS. 8A to 17 , an example is described in which a first conductive portion (701) is used as a radiator of a lower antenna of the electronic device (101), and a second conductive portion (702) or a third conductive portion (703) is used as a radiator of an upper antenna of the electronic device (101), but embodiments of the present disclosure are not limited thereto. Hereinafter, FIG. 18 illustrates various combinations of two antennas used for multi-antenna communication of the electronic device (101).

[0226] Referring to FIG. 18, the electronic device (101) may include a first housing part (710), a second housing part (720), and a third housing part (730). The electronic device (101) may include a first hinge structure (750) configured to rotatably couple the first housing part (710) and the second housing part (720). The electronic device (101) may include a second hinge structure (760) configured to rotatably couple the second housing part (720) and the third housing part (730). The descriptions of FIG. 7 may be referenced for each component.

[0227] In example (1800a), the electronic device (101) can transmit or receive a signal through the conductive portion (1801a) and the conductive portion (1802a) in a defined state (e.g., a state in which the third housing part (730) is not folded with the second housing part (720), a first state (801), or a second state (802)). Each of the conductive portion (1801a) and the conductive portion (1802a) can be formed at least partially on a side surface of the first housing part (710) (e.g., a side surface facing the transverse direction in which the housing parts are arranged). For example, the longitudinal direction of each of the conductive portion (1801a) and the conductive portion (1802a) can be vertical. The electronic device (101) can transmit or receive a signal through the conductive portion (1802a) and the conductive portion (1803a) in a defined state (e.g., the third housing part (730) folded with the second housing part (720), the third state (803), or the fourth state (804)). The conductive portion (1803a) can be formed at least partially on the top of the second housing part (720). For example, the longitudinal direction of the conductive portion (1803a) can be horizontal. As a non-limiting example, the electronic device (101) can transmit or receive a signal through the conductive portion (1801a) and the conductive portion (1803a) in a defined state (e.g., the third housing part (730) folded with the second housing part (720), the third state (803), or the fourth state (804)).

[0228] In example (1800b), the electronic device (101) can transmit or receive signals through the conductive portion (1801b) and the conductive portion (1802b) in a defined state (e.g., a state in which the third housing part (730) is not folded with the second housing part (720), the first state (801), or the second state (802)). Each of the conductive portion (1801b) and the conductive portion (1802b) can be formed at least partially on a side surface of the first housing part (710) (e.g., a side surface facing the horizontal direction of the electronic device (101). For example, the longitudinal direction of each of the conductive portion (1801b) and the conductive portion (1802b) can be vertical. The electronic device (101) can transmit or receive a signal through the conductive portion (1802b) and the conductive portion (1803b) in a defined state (e.g., the third housing part (730) folded with the second housing part (720), the third state (803), or the fourth state (804)). The conductive portion (1803b) can be formed at least partially on the top of the third housing part (730). For example, the longitudinal direction of the conductive portion (1803b) can be horizontal. As a non-limiting example, the electronic device (101) can transmit or receive a signal through the conductive portion (1801b) and the conductive portion (1803b) in a defined state (e.g., the third housing part (730) folded with the second housing part (720), the third state (803), or the fourth state (804)).

[0229] In example (1800c), the electronic device (101) can transmit or receive signals through the conductive portion (1801c) and the conductive portion (1802c) in a defined state (e.g., a state in which the third housing part (730) is not folded with the second housing part (720), the first state (801), or the second state (802). Each of the conductive portion (1801c) and the conductive portion (1802c) can be formed at least partially on a side surface of the third housing part (730) (e.g., a side surface facing the horizontal direction of the electronic device (101). As an example, the conductive portion (1801c) can have an 'I' shape on the side surface of the third housing part (730). As an example, the conductive portion (1802c) can have an 'L' shape formed across the side surface and the bottom surface of the third housing part (730). For example, the longitudinal direction of each of the conductive portion (1801c) and the conductive portion (1802c) may be vertical. The electronic device (101) may transmit or receive a signal through the conductive portion (1801c) and the conductive portion (1803c) in a defined state (e.g., a state in which the third housing part (730) is folded with the second housing part (720), a third state (803), or a fourth state (804)). The conductive portion (1803c) may be formed at the bottom of the second housing part (720). For example, the longitudinal direction of the conductive portion (1803c) may be horizontal. As a non-limiting example, the electronic device (101) can transmit or receive signals through the conductive portion (1802c) and the conductive portion (1803c) in a defined state (e.g., the third housing part (730) folded with the second housing part (720), the third state (803), or the fourth state (804)).

[0230] In example (1800d), the electronic device (101) can transmit or receive signals through the conductive portion (1801d) and the conductive portion (1802d) in a defined state (e.g., a state in which the third housing part (730) is not folded with the second housing part (720), the first state (801), or the second state (802)). Each of the conductive portion (1801d) and the conductive portion (1802d) can be formed at least partially on a side surface of the third housing part (730) (e.g., a side surface facing the horizontal direction of the electronic device (101). As an example, the conductive portion (1801d) can have an 'I' shape on the side surface of the third housing part (730). As an example, the conductive portion (1802d) can have an 'L' shape formed across the side surface and the bottom surface of the third housing part (730). For example, the longitudinal direction of each of the conductive portion (1801d) and the conductive portion (1802d) may be vertical. The electronic device (101) may transmit or receive a signal through the conductive portion (1801d) and the conductive portion (1803d) in a defined state (e.g., a state in which the third housing part (730) is folded with the second housing part (720), a third state (803), or a fourth state (804)). The conductive portion (1803d) may be formed at least partially at the lower end of the first housing part (710). For example, the longitudinal direction of the conductive portion (1803d) may be horizontal. As a non-limiting example, the electronic device (101) can transmit or receive signals through the conductive portion (1802d) and the conductive portion (1803d) in a defined state (e.g., the third housing part (730) folded with the second housing part (720), the third state (803), or the fourth state (804)).

[0231] In example (1800e), the electronic device (101) can transmit or receive signals through the conductive portion (1801e) and the conductive portion (1802e) in a defined state (e.g., a state in which the third housing part (730) is not folded with the second housing part (720), the first state (801), or the second state (802). Each of the conductive portion (1801e) and the conductive portion (1802e) can be formed at least partially on a side surface of the third housing part (730) (e.g., a side surface facing the horizontal direction of the electronic device (101). As an example, the conductive portion (1801e) can have an 'L' shape formed across the side surface and the top surface of the third housing part (730). As an example, the conductive portion (1802e) can have an 'L' shape formed across the side surface and the bottom surface of the third housing part (730). For example, the longitudinal direction of each of the conductive portion (1801e) and the conductive portion (1802e) may be vertical. The electronic device (101) may transmit or receive a signal through the conductive portion (1801e) and the conductive portion (1803e) in a defined state (e.g., a state in which the third housing part (730) is folded with the second housing part (720), a third state (803), or a fourth state (804)). The conductive portion (1803e) may be formed at the bottom of the second housing part (720). For example, the longitudinal direction of the conductive portion (1803e) may be horizontal. As a non-limiting example, the electronic device (101) can transmit or receive signals through the conductive portion (1802e) and the conductive portion (1803e) in a defined state (e.g., the third housing part (730) folded with the second housing part (720), the third state (803), or the fourth state (804)).

[0232] In example (1800f), the electronic device (101) can transmit or receive signals through the conductive portion (1801f) and the conductive portion (1802f) in a defined state (e.g., a state in which the third housing part (730) is not folded with the second housing part (720), the first state (801), or the second state (802)). Each of the conductive portion (1801f) and the conductive portion (1802f) can be formed at least partially on a side surface of the third housing part (730) (e.g., a side surface facing the horizontal direction of the electronic device (101). As an example, the conductive portion (1801f) can have an 'L' shape formed across the side surface and the top surface of the third housing part (730). As an example, the conductive portion (1802f) can have an 'L' shape formed across the side surface and the bottom surface of the third housing part (730). For example, the longitudinal direction of each of the conductive portion (1801f) and the conductive portion (1802f) may be vertical. The electronic device (101) may transmit or receive a signal through the conductive portion (1801f) and the conductive portion (1803f) in a defined state (e.g., a state in which the third housing part (730) is folded with the second housing part (720), a third state (803), or a fourth state (804)). The conductive portion (1803f) may be formed at least partially at the lower end of the first housing part (710). For example, the longitudinal direction of the conductive portion (1803f) may be horizontal. As a non-limiting example, the electronic device (101) can transmit or receive signals through the conductive portion (1802f) and the conductive portion (1803f) in a defined state (e.g., the third housing part (730) folded with the second housing part (720), the third state (803), or the fourth state (804)).

[0233] In the example (1800g), the electronic device (101) can transmit or receive signals through the conductive portion (1801g) and the conductive portion (1802g) in a defined state (e.g., a state in which the third housing part (730) is not folded with the second housing part (720), the first state (801), or the second state (802)). Each of the conductive portion (1801g) and the conductive portion (1802g) can be formed at least partially on a side surface of the first housing part (710) (e.g., a side surface facing the horizontal direction of the electronic device (101). As an example, the conductive portion (1801g) can have an 'L' shape formed across the side surface and the top surface of the first housing part (710). As an example, the conductive portion (1802g) can have an 'L' shape formed across the side surface and the bottom surface of the first housing part (710). For example, the longitudinal direction of each of the conductive portion (1801g) and the conductive portion (1802g) may be vertical. The electronic device (101) may transmit or receive a signal through the conductive portion (1801g) and the conductive portion (1803g) in a defined state (e.g., a state in which the third housing part (730) is folded with the second housing part (720), a third state (803), or a fourth state (804)). The conductive portion (1803g) may be formed at the bottom of the second housing part (720). For example, the longitudinal direction of the conductive portion (1803g) may be horizontal. As a non-limiting example, the electronic device (101) can transmit or receive signals through the conductive portion (1802g) and the conductive portion (1803g) in a defined state (e.g., the third housing part (730) folded with the second housing part (720), the third state (803), or the fourth state (804)).

[0234] In example (1800h), the electronic device (101) can transmit or receive a signal through the conductive portion (1801h) and the conductive portion (1802h) in a defined state (e.g., a state in which the third housing part (730) is not folded with the second housing part (720), the first state (801), or the second state (802)). Each of the conductive portion (1801h) and the conductive portion (1802h) can be formed at least partially on a side surface of the first housing part (710) (e.g., a side surface facing the horizontal direction of the electronic device (101). As an example, the conductive portion (1801h) can have an 'L' shape formed across the side surface and the top surface of the first housing part (710). As an example, the conductive portion (1802h) can have an 'L' shape formed across the side surface and the bottom surface of the first housing part (710). For example, the longitudinal direction of each of the conductive portion (1801h) and the conductive portion (1802h) may be vertical. The electronic device (101) may transmit or receive a signal through the conductive portion (1801h) and the conductive portion (1803h) in a defined state (e.g., a state in which the third housing part (730) is folded with the second housing part (720), a third state (803), or a fourth state (804)). The conductive portion (1803h) may be formed at least partially at the lower end of the third housing part (730). For example, the longitudinal direction of the conductive portion (1803h) may be horizontal. As a non-limiting example, the electronic device (101) can transmit or receive signals through the conductive portion (1802h) and the conductive portion (1803h) in a defined state (e.g., the third housing part (730) folded with the second housing part (720), the third state (803), or the fourth state (804)).

[0235] FIG. 19 illustrates examples of conductive portions in a foldable-type electronic device (e.g., electronic device (101), electronic device (200), electronic device (400), or electronic device (500)). While FIGS. 8A to 18 illustrate examples in which two conductive portions are used for multi-antenna communication, embodiments of the present disclosure are not limited thereto. Hereinafter, FIG. 19 illustrates various combinations of three or more antennas used for multi-antenna communication of the electronic device (101).

[0236] Referring to FIG. 19, the electronic device (101) may include a first housing part (710), a second housing part (720), and a third housing part (730). The electronic device (101) may include a first hinge structure (750) configured to rotatably couple the first housing part (710) and the second housing part (720). The electronic device (101) may include a second hinge structure (760) configured to rotatably couple the second housing part (720) and the third housing part (730). The descriptions of FIG. 7 may be referenced for each component.

[0237] In example (1900a), the electronic device (101) can transmit or receive signals through the conductive portion (1901a) and the conductive portion (1902a) in a defined state (e.g., a state in which the third housing part (730) is not folded with the second housing part (720), a first state (801), or a second state (802). Each of the conductive portion (1901a) and the conductive portion (1902a) can be formed at least partially on a side surface of the first housing part (710) (e.g., a side surface facing the horizontal direction of the electronic device (101). For example, the longitudinal direction of each of the conductive portions (1901a) and the conductive portions (1902a) can be vertical. The electronic device (101) can transmit or receive signals through the conductive portion (1902a), the conductive portion (1903a), and the conductive portion (1904a) in a defined state (e.g., the third housing part (730) folded with the second housing part (720), the third state (803), or the fourth state (804). The conductive portion (1903a) can be formed at least partially on the top of the second housing part (720). For example, the longitudinal direction of the conductive portion (1903a) can be horizontal. The conductive portion (1904a) can be formed at least partially on the top of the third housing part (730). For example, the longitudinal direction of the conductive portion (1904a) can be horizontal. As a non-limiting example, the length of the conductive portion (1903a) can correspond to the length of the conductive portion (1904a). When the second housing part (720) and the third housing part (730) are folded through the second hinge structure (760), the non-conductive part adjacent to the conductive part (1903a) and the non-conductive part adjacent to the conductive part (1904a) can be aligned with each other.As a non-limiting example, the electronic device (101) can transmit or receive signals through the conductive portion (1901a), the conductive portion (1903a), and the conductive portion (1904a) in defined states (e.g., the third housing part (730) folded with the second housing part (720), the third state (803), or the fourth state (804)).

[0238] In example (1900b), the electronic device (101) can transmit or receive signals through the conductive portion (1901b) and the conductive portion (1902b) in a defined state (e.g., a state in which the third housing part (730) is not folded with the second housing part (720), the first state (801), or the second state (802)). Each of the conductive portion (1901b) and the conductive portion (1902b) can be formed at least partially on a side surface of the third housing part (730) (e.g., a side surface facing the horizontal direction of the electronic device (101). For example, the longitudinal direction of each of the conductive portion (1901b) and the conductive portion (1902b) can be vertical. As an example, the conductive portion (1901b) can have an 'I' shape on the side surface of the third housing part (730). For example, the conductive portion (1902b) may have an 'L' shape formed across the side and bottom of the third housing part (730). The electronic device (101) may transmit or receive signals through the conductive portion (1902b), the conductive portion (1903b), and the conductive portion (1904b) in a defined state (e.g., a state in which the third housing part (730) is folded with the second housing part (720), the third state (803), or the fourth state (804). The conductive portion (1903b) may be formed at the bottom of the second housing part (720). For example, the longitudinal direction of the conductive portion (1903b) may be horizontal. The conductive portion (1904b) may be formed at least partially at the bottom of the first housing part (710). For example, the longitudinal direction of the conductive portion (1904b) may be horizontal. As a non-limiting example, the length of the conductive portion (1903b) may correspond to the length of the conductive portion (1904b). When the first housing part (710) and the second housing part (720) are folded through the first hinge structure (750), the non-conductive portion adjacent to the conductive portion (1903b) and the non-conductive portion adjacent to the conductive portion (1904b) may be aligned with each other.

[0239] In example (1900c), the electronic device (101) can transmit or receive signals through the conductive portion (1901c) and the conductive portion (1902c) in a defined state (e.g., a state in which the third housing part (730) is not folded with the second housing part (720), a first state (801), or a second state (802). Each of the conductive portion (1901c) and the conductive portion (1902c) can be formed at least partially on a side surface of the third housing part (730) (e.g., a side surface facing the horizontal direction of the electronic device (101). For example, the longitudinal direction of each of the conductive portion (1901c) and the conductive portion (1902c) can be vertical. The electronic device (101) can transmit or receive signals through the conductive portion (1902c), the conductive portion (1903c), and the conductive portion (1904c) in a predefined state (e.g., a state in which the third housing part (730) is folded with the second housing part (720), the third state (803), or the fourth state (804)). The conductive portion (1903c) can be formed at the bottom of the second housing part (720). For example, the longitudinal direction of the conductive portion (1903c) can be horizontal. The conductive portion (1904c) can be formed at least partially at the bottom of the first housing part (710). For example, the longitudinal direction of the conductive portion (1904c) can be horizontal. As a non-limiting example, the length of the conductive portion (1903c) can correspond to the length of the conductive portion (1904c). When the first housing part (710) and the second housing part (720) are folded through the first hinge structure (750), the non-conductive part adjacent to the conductive part (1903c) and the non-conductive part adjacent to the conductive part (1904c) can be aligned with each other.

[0240] In example (1900d), the electronic device (101) can transmit or receive signals through the conductive portion (1901d) and the conductive portion (1902d) in a defined state (e.g., a state in which the third housing part (730) is not folded with the second housing part (720), a first state (801), or a second state (802)). Each of the conductive portion (1901d) and the conductive portion (1902d) can be formed at least partially on a side surface of the first housing part (710) (e.g., a side surface facing the horizontal direction of the electronic device (101). For example, the longitudinal direction of each of the conductive portion (1901d) and the conductive portion (1902d) can be vertical. The electronic device (101) can transmit or receive signals through the conductive portion (1902d), the conductive portion (1903d), and the conductive portion (1904d) in a defined state (e.g., the third housing part (730) folded with the second housing part (720), the third state (803), or the fourth state (804)). The conductive portion (1903d) can be formed at least partially on the lower end of the second housing part (720). For example, the longitudinal direction of the conductive portion (1903d) can be horizontal. The conductive portion (1904d) can be formed at least partially on the lower end of the third housing part (730). For example, the longitudinal direction of the conductive portion (1904d) can be horizontal. As a non-limiting example, the length of the conductive portion (1903d) can correspond to the length of the conductive portion (1904d). When the second housing part (720) and the third housing part (730) are folded through the second hinge structure (760), the non-conductive part adjacent to the conductive part (1903d) and the non-conductive part adjacent to the conductive part (1904d) can be aligned with each other.

[0241] FIGS. 20A and 20B illustrate examples of states of a foldable-type electronic device (e.g., electronic device (101) or electronic device (500)). As an example, the electronic device may be referred to as a G-type foldable electronic device.

[0242] Referring to FIGS. 20A and 20B, the electronic device (101) may include a first housing part (710), a second housing part (720), and a third housing part (730). A first hinge structure (750) may rotatably couple the first housing part (710) and the second housing part (720). A second hinge structure (760) may rotatably couple the second housing part (720) and the third housing part (730).

[0243] Referring to FIG. 20A, the first state (2001a) represents a state in which the first housing part (710), the second housing part (720), and the third housing part (730) are all unfolded. The first state (801) may be referred to as an unfolded state or an unfolded state. The first state (2001a) may correspond to the first state (500a) of FIG. 5A. The second state (2002a) represents a state in which the first housing part (710) and the second housing part (720) are folded, and the second housing part (720) and the third housing part (730) are unfolded. The second state (2002a) may be referred to as a single-folded state, a half-folded state, or a semi-folded state. The second state (2002a) may correspond to the second state (500b) of FIG. 5B. The third state (2003a) represents a state in which the first housing part (710), the second housing part (720), and the third housing part (730) are all folded. The third state (2003a) may be referred to as a folding state, a multi-folding state, or a fully folded state. The third state (2003a) may correspond to the third state (500c) of FIG. 5c.

[0244] The electronic device (101) can transmit or receive signals through the upper antenna and the lower antenna. For example, the electronic device (101) can use the first conductive portion (701) as a radiator of the lower antenna. When the electronic device (101) uses the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) can use the second conductive portion (702) as a radiator of the upper antenna. For example, the electronic device (101) can use the first conductive portion (701) as a radiator of the lower antenna. When the electronic device (101) uses the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) can use the third conductive portion (703) as a radiator of the upper antenna. In the first state (2001a) and the second state (2002a), the antenna performance can be secured because the first conductive portion (701) and / or the second conductive portion (702) are located in an open space. For example, the electronic device (101) can transmit or receive a signal through the second conductive portion (702) while transmitting or receiving a signal through the first conductive portion (701). In the third state (2003a), a portion (e.g., a portion formed on a side) of the first conductive portion (701) and / or the second conductive portion (702) can overlap with a hinge structure (e.g., the first hinge structure (750)). In order to reduce the amount of interference between antennas, the third conductive portion (703) can be used as an antenna radiator instead of the second conductive portion (702). For example, the electronic device (101) can transmit or receive a signal through the third conductive portion (703) while transmitting or receiving a signal through the first conductive portion (701).

[0245] In FIG. 20A, an example is described in which the first conductive portion (701) and the second conductive portion (702) are used in the unfolded state, and the first conductive portion (701) and the third conductive portion (703) of the second housing part (720) are used in the folded state, but embodiments of the present disclosure are not limited thereto. For example, as the state of the electronic device (101) changes to the third state (2003a), the third conductive portion (703) of the second housing part (720) may be used as an antenna radiator instead of the first conductive portion (701). In the folded state, the electronic device (101) may transmit or receive a signal through the third conductive portion (703) of the second housing part (720) while transmitting or receiving a signal through the second conductive portion (702).

[0246] Referring to FIG. 20b, the first state (2001b) represents a state in which the first housing part (710), the second housing part (720), and the third housing part (730) are all unfolded. The first state (801) may be referred to as an unfolded state or an unfolded state. The first state (2001b) may correspond to the first state (500a) of FIG. 5a. The second state (2002b) represents a state in which the first housing part (710) and the second housing part (720) are folded, and the second housing part (720) and the third housing part (730) are unfolded. The second state (2002b) may be referred to as a single-folded state, a half-folded state, or a semi-folded state. The second state (2002b) may correspond to the second state (500b) of FIG. 5b. The third state (2003b) represents a state in which the first housing part (710), the second housing part (720), and the third housing part (730) are all folded. The third state (2003b) may be referred to as a folding state, a multi-folding state, or a fully folded state. The third state (2003b) may correspond to the third state (500c) of FIG. 5c.

[0247] The electronic device (101) can transmit or receive signals through the upper antenna and the lower antenna. For example, the electronic device (101) can use the first conductive portion (701) as a radiator of the lower antenna. When the electronic device (101) uses the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) can use the second conductive portion (702) as a radiator of the upper antenna. For example, the electronic device (101) can use the conductive portion (725) as a radiator of the lower antenna. When the electronic device (101) uses the conductive portion (725) as a radiator of the lower antenna, the second conductive portion (702) can be used as a radiator of the upper antenna. In the first state (2001b) and the second state (2002b), the first conductive portion (701) and / or the second conductive portion (702) are located in an open space, so that antenna performance can be secured. For example, the electronic device (101) can transmit or receive a signal through the second conductive portion (702) while transmitting or receiving a signal through the first conductive portion (701). In the third state (2003b), a portion (e.g., a portion formed on a side) of the first conductive portion (701) and / or the second conductive portion (702) can overlap with a hinge structure (e.g., a first hinge structure (750). To reduce interference between antennas, the conductive portion (725) can be used as an antenna radiator instead of the first conductive portion (701). For example, the electronic device (101) can transmit or receive a signal through the conductive portion (725) while transmitting or receiving a signal through the second conductive portion (702).

[0248] In FIG. 20b, an example is described in which the first conductive portion (701) and the second conductive portion (702) are used in the unfolded state, and the second conductive portion (702) and the conductive portion (725) of the second housing part (720) are used in the folded state, but embodiments of the present disclosure are not limited thereto. For example, as the state of the electronic device (101) changes to the third state (2003b), the conductive portion (725) of the second housing part (720) may be used as an antenna radiator instead of the second conductive portion (702). In the folded state, the electronic device (101) may transmit or receive a signal through the conductive portion (725) of the second housing part (720) while transmitting or receiving a signal through the first conductive portion (701).

[0249] FIGS. 21A and 21B illustrate examples of states of a foldable-type electronic device (e.g., electronic device (101) or electronic device (400)).

[0250] Referring to FIGS. 21A and 21B, the electronic device (101) may include a first housing part (710), a second housing part (720), and a third housing part (730). A first hinge structure (750) may rotatably couple the first housing part (710) and the second housing part (720). A second hinge structure (760) may rotatably couple the second housing part (720) and the third housing part (730).

[0251] Referring to FIG. 21A, a first state (2101a) represents a state in which the first housing part (710), the second housing part (720), and the third housing part (730) are all unfolded. The first state (2101a) may be referred to as an unfolded state or an unfolded state. The first state (2101a) may correspond to the first state (400a) of FIG. 4A. A second state (2102a) represents a state in which the first housing part (710) and the second housing part (720) are folded, and the second housing part (720) and the third housing part (730) are unfolded. The second state (2102a) may be referred to as a single-folded state, a half-folded state, or a semi-folded state. The third state (2103a) represents a state in which the first housing part (710), the second housing part (720), and the third housing part (730) are all folded. The third state (2103a) may be referred to as a folding state, a multi-folding state, or a fully folded state. The third state (2103a) may correspond to the second state (400b) of FIG. 4b.

[0252] The electronic device (101) can transmit or receive signals through the upper antenna and the lower antenna. For example, the electronic device (101) can use the first conductive portion (701) as a radiator of the lower antenna. When the electronic device (101) uses the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) can use the second conductive portion (702) as a radiator of the upper antenna. For example, the electronic device (101) can use the first conductive portion (701) as a radiator of the lower antenna. When the electronic device (101) uses the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) can use the conductive portion (712) as a radiator of the upper antenna. In the first state (2101a) and the second state (2102a), since the first conductive portion (701) and / or the second conductive portion (702) are located in an open space, antenna performance can be secured. For example, the electronic device (101) can transmit or receive a signal through the second conductive portion (702) while transmitting or receiving a signal through the first conductive portion (701). In the third state (2103a), a portion (e.g., a portion formed on a side) of the first conductive portion (701) and / or the second conductive portion (702) can overlap with a flexible display (e.g., a flexible display (240)). In order to reduce interference between antennas, the conductive portion (712) can be used as an antenna radiator instead of the second conductive portion (702). For example, the electronic device (101) may transmit or receive a signal through the conductive portion (712) while transmitting or receiving a signal through the first conductive portion (701).

[0253] In FIG. 21A, an example is described in which the first conductive portion (701) and the second conductive portion (702) are used in the unfolded state, and the first conductive portion (701) and the conductive portion (712) of the first housing part (710) are used in the folded state; however, embodiments of the present disclosure are not limited thereto. For example, as the state of the electronic device (101) changes to the third state (2103a), the conductive portion (712) of the first housing part (710) may be used as an antenna radiator instead of the first conductive portion (701). In the folded state, the electronic device (101) may transmit or receive a signal through the conductive portion (712) of the first housing part (710) while transmitting or receiving a signal through the second conductive portion (702).

[0254] Referring to FIG. 21b, the first state (2101b) represents a state in which the first housing part (710), the second housing part (720), and the third housing part (730) are all unfolded. The first state (2101b) may be referred to as an unfolded state or an unfolded state. The first state (2101b) may correspond to the first state (400a) of FIG. 4a. The second state (2102b) represents a state in which the first housing part (710) and the second housing part (720) are folded, and the second housing part (720) and the third housing part (730) are unfolded. The second state (2102b) may be referred to as a single-folded state, a half-folded state, or a semi-folded state. The third state (2103b) represents a state in which the first housing part (710), the second housing part (720), and the third housing part (730) are all folded. The third state (2103b) may be referred to as a folding state, a multi-folding state, or a fully folded state. The third state (2103b) may correspond to the second state (400b) of FIG. 4b.

[0255] The electronic device (101) can transmit or receive signals through the upper antenna and the lower antenna. For example, the electronic device (101) can use the first conductive portion (701) as a radiator of the lower antenna. When the electronic device (101) uses the first conductive portion (701) as a radiator of the lower antenna, the electronic device (101) can use the second conductive portion (702) as a radiator of the upper antenna. For example, the electronic device (101) can use the conductive portion (716) as a radiator of the lower antenna. When the electronic device (101) uses the conductive portion (716) as a radiator of the lower antenna, the second conductive portion (702) can be used as a radiator of the upper antenna. In the first state (2101b) and the second state (2102b), the first conductive portion (701) and / or the second conductive portion (702) are located in an open space, so that antenna performance can be secured. For example, the electronic device (101) can transmit or receive a signal through the second conductive portion (702) while transmitting or receiving a signal through the first conductive portion (701). In the third state (2103b), a portion (e.g., a portion formed on a side) of the first conductive portion (701) and / or the second conductive portion (702) can overlap with a flexible display (e.g., a flexible display (240)). To reduce interference between antennas, the conductive portion (716) can be used as an antenna radiator instead of the first conductive portion (701). For example, the electronic device (101) can transmit or receive a signal through the second conductive portion (702) while transmitting or receiving a signal through the conductive portion (716).

[0256] In FIG. 21b, an example is described in which the first conductive portion (701) and the second conductive portion (702) are used in the unfolded state, and the second conductive portion (702) and the conductive portion (716) of the first housing part (710) are used in the folded state; however, embodiments of the present disclosure are not limited thereto. For example, as the state of the electronic device (101) changes to the third state (2103b), the conductive portion (716) of the first housing part (710) may be used as an antenna radiator instead of the second conductive portion (702). In the folded state, the electronic device (101) may transmit or receive a signal through the conductive portion (716) of the first housing part (710) while transmitting or receiving a signal through the first conductive portion (701).

[0257] FIG. 22 illustrates an example of an electronic device including at least one sensor (e.g., electronic device (101), electronic device (200), electronic device (400), or electronic device (500)).

[0258] Referring to FIG. 22, the electronic device (101) may include a first housing part (710), a second housing part (720), and a third housing part (730). The electronic device (101) may include a first hinge structure (750) configured to rotatably couple the first housing part (710) and the second housing part (720). The electronic device (101) may include a second hinge structure (760) configured to rotatably couple the second housing part (720) and the third housing part (730). Example (2200) illustrates conductive portions of the electronic device (101) in a state in which the first housing part (710), the second housing part (720), and the third housing part (730) are all unfolded (e.g., the first state (801)).

[0259] According to one embodiment, the electronic device (101) may include at least one Hall sensor (or may be referred to as a Hall integrated circuit (IC)). For example, the electronic device (101) may include a first Hall sensor (2211) and / or a second Hall sensor (2212). The first Hall sensor (2211) may be disposed in the third housing part (730). The first Hall sensor (2211) may be configured to detect whether the third housing part (730) is brought closer to the first hinge structure (750) (e.g., within a recognition distance, including contact) depending on the folding state (e.g., the fourth state (804)) and / or whether the third housing part (730) is brought closer to the first hinge structure (750) or the flexible display (e.g., the flexible display (240)) (e.g., within a recognition distance, including contact) depending on the folding state (e.g., the third state (803)). For example, the first Hall sensor (2211) may be used to detect whether the second housing part (720) and the third housing part (730) are folded. The processor (e.g., processor (120)) of the electronic device (101) can determine whether the second housing part (720) and the third housing part (730) are folded through the first Hall sensor (2211). The second Hall sensor (2212) can be disposed on the first housing part (710). The second Hall sensor (2212) can be used to detect whether the first housing part (710) and the second housing part (720) are folded. The processor (e.g., processor (120)) of the electronic device (101) can determine whether the first housing part (710) and the second housing part (720) are folded through the second Hall sensor (2212).

[0260] According to one embodiment, the electronic device (101) may include a grip sensor (2220). The grip sensor (2220) may be used to detect a user's grip of the electronic device (101). For example, the grip sensor (2220) may be disposed at the bottom of the third housing part (730). When the user grips the bottom of the third housing part (730), the value of the electrostatic capacitance may change. The processor (e.g., the processor (120)) of the electronic device (101) may determine whether the user has gripped the electronic device (101) through the grip sensor (2220).

[0261] Hereinafter, a technique for adaptively determining conductive portions for multi-antenna communication based on at least one sensor (e.g., a first Hall sensor (2211), a second Hall sensor (2212), and / or a grip sensor (2220)) illustrated in FIG. 22 is described through FIGS. 23 to 25.

[0262] FIG. 23 illustrates an operation flow of an electronic device for performing multi-antenna communication according to a state of the electronic device (e.g., electronic device (101), electronic device (200), electronic device (400), or electronic device (500)). The electronic device (101) may include a first housing part (710), a second housing part (720), and a third housing part (730). A first hinge structure (750) may rotatably couple the first housing part (710) and the second housing part (720). A second hinge structure (760) may rotatably couple the second housing part (720) and the third housing part (730). For example, the electronic device (101) may be the electronic device (200) of FIGS. 2A, 2B, and 2C. The first housing part (710), the second housing part (720), and the third housing part (730) may correspond to the first housing part (210), the second housing part (220), and the third housing part (230), respectively. The first hinge structure (750) may correspond to the first hinge structure (250). The second hinge structure (760) may correspond to the second hinge structure (260). For example, the electronic device (101) may be the electronic device (400) of FIGS. 4A and 4B. The first housing part (710), the second housing part (720), and the third housing part (730) may correspond to the first housing part (410), the second housing part (420), and the third housing part (430), respectively. The first hinge structure (750) may correspond to the first hinge structure (450). The second hinge structure (760) may correspond to the second hinge structure (460). For example, the electronic device (101) may be the electronic device (500) of FIGS. 5A, 5B, and 5C. The first housing part (710), the second housing part (720), and the third housing part (730) may correspond to the first housing part (510), the second housing part (520), and the third housing part (530), respectively.The first hinge structure (750) may correspond to the first hinge structure (550). The second hinge structure (760) may correspond to the second hinge structure (560).

[0263] Referring to FIG. 23, in operation (2301), the electronic device (101) (e.g., the processor (120)) can detect a state of the electronic device (101) through at least one Hall sensor (e.g., the first Hall sensor (2211) or the second Hall sensor (2212)). For example, the first Hall sensor (2211) can be disposed in the third housing part (730). The first Hall sensor (2211) can be used to detect whether the third housing part (230) and another component (e.g., the first hinge structure (750) or the flexible display (240)) are approaching (or in contact with). For example, the second Hall sensor (2212) can be disposed in the first housing part (710). The second Hall sensor (2212) can be used to detect whether the first housing part (710) and another component (e.g., the second hinge structure (760) or the flexible display (240)) are approaching (or in contact with) each other. The electronic device (101) can determine one of a plurality of folding states (e.g., the first state (801), the second state (802), the third state (803), and / or the fourth state (804)) of the electronic device (101) through the at least one Hall sensor.

[0264] In operation (2303), the electronic device (101) (e.g., the processor (120)) can determine whether the third housing part (730) and the second housing part (720) are in a folded state. If the third housing part (730) and the second housing part (720) are in a folded state, the electronic device (101) can perform operation (2305). If the third housing part (730) and the second housing part (720) are not in a folded state, the electronic device (101) can perform operation (2307).

[0265] In operation (2305), the electronic device (101) (e.g., the processor (120)) can perform communication through a first conductive portion (e.g., the first conductive portion (701)) and a third conductive portion (e.g., the third conductive portion (703), the conductive portion (712)). For example, the first conductive portion can be included in a first housing part (710). The third conductive portion can be included in a second housing part (720) or a third housing part (730), which is different from the first housing part (710). For example, in the fourth state (804), since a side of the third housing part (730) overlaps with the first hinge structure (750) or the flexible display (240), conductive portions that provide current modes in different directions can be used to reduce interference between antennas. For example, as a radiator of the lower antenna of the electronic device (101), the first conductive portion (701) of the third housing part (730) may be used for a vertical current mode. For example, as a radiator of the upper antenna of the electronic device (101), the third conductive portion (703) of the second housing part (720) may be used for a horizontal current mode. As another example, as a radiator of the upper antenna of the electronic device (101), the conductive portion (712) of the first housing part (720) may be used for a horizontal current mode.

[0266] In operation (2307), the electronic device (101) (e.g., the processor (120)) can perform communication through a first conductive portion (e.g., the first conductive portion (701)) and a second conductive portion (e.g., the second conductive portion (702)). For example, the first conductive portion can be included in the first housing part (710). The second conductive portion can be included in the first housing part (710). For example, in the first state (801), since the side of the third housing part (730) is open, the conductive portions of the third housing part (730) can be used. For example, the first conductive portion (701) of the third housing part (730) can be used as a radiator of the bottom antenna of the electronic device (101). For example, as a radiator of the upper antenna of the electronic device (101), the second conductive portion (702) of the third housing part (730) can be used.

[0267] FIG. 24 illustrates an operation flow of an electronic device (e.g., electronic device (101), electronic device (200), electronic device (400), or electronic device (500)) for performing multi-antenna communication using a grip sensor. The electronic device (101) may include a first housing part (710), a second housing part (720), and a third housing part (730). A first hinge structure (750) may rotatably couple the first housing part (710) and the second housing part (720). A second hinge structure (760) may rotatably couple the second housing part (720) and the third housing part (730). For example, the electronic device (101) may be the electronic device (200) of FIGS. 2A, 2B, and 2C. The first housing part (710), the second housing part (720), and the third housing part (730) may correspond to the first housing part (210), the second housing part (220), and the third housing part (230), respectively. The first hinge structure (750) may correspond to the first hinge structure (250). The second hinge structure (760) may correspond to the second hinge structure (260). For example, the electronic device (101) may be the electronic device (400) of FIGS. 4A and 4B. The first housing part (710), the second housing part (720), and the third housing part (730) may correspond to the first housing part (410), the second housing part (420), and the third housing part (430), respectively. The first hinge structure (750) may correspond to the first hinge structure (450). The second hinge structure (760) may correspond to the second hinge structure (460). For example, the electronic device (101) may be the electronic device (500) of FIGS. 5A, 5B, and 5C. The first housing part (710), the second housing part (720), and the third housing part (730) may correspond to the first housing part (510), the second housing part (520), and the third housing part (530), respectively.The first hinge structure (750) may correspond to the first hinge structure (550). The second hinge structure (760) may correspond to the second hinge structure (560).

[0268] Referring to FIG. 24, in operation (2401), the electronic device (101) (e.g., the processor (120)) can perform communication through a first conductive portion (e.g., the first conductive portion (701)) and a second conductive portion (e.g., the second conductive portion (702)). The first conductive portion (e.g., the first conductive portion (701)) can be used as a radiator of a lower antenna of the electronic device (101). The second conductive portion (e.g., the second conductive portion (702)) can be used as a radiator of an upper antenna of the electronic device (101).

[0269] In operation (2403), the electronic device (101) (e.g., the processor (120)) can detect the user's grip through at least one grip sensor (e.g., the grip sensor (2220)). The electronic device (101) can detect the user's grip through the at least one grip sensor (e.g., the grip sensor (2220)) while performing communication through the first conductive portion (e.g., the first conductive portion (701)) and the second conductive portion (e.g., the second conductive portion (702)). For example, the grip sensor (2220) can be disposed at the bottom of the electronic device (101). As an example, the grip sensor (2220) can be disposed at the bottom of the third housing part (730) of the electronic device (101). As the user grips the bottom of the electronic device (101), the electronic device (101) can detect the user's grip. The user's grip may degrade the radiation performance of the antenna positioned at the bottom. To avoid deterioration of the radiation performance due to the user's grip, a conductive portion positioned at the top (e.g., the second conductive portion (702) or the third conductive portion (703)) may be utilized.

[0270] In operation (2405), the electronic device (101) (e.g., the processor (120)) can perform communication through a second conductive portion (e.g., the second conductive portion (702)) and a third conductive portion (e.g., the third conductive portion (703) or the conductive portion (712)). For example, the second conductive portion can be included in the first housing part (710). The third conductive portion can be included in a second housing part (720) or a third housing part (730) that is different from the first housing part (710). The electronic device (101) can use the second conductive portion (702) and the third conductive portion (703) as radiators for multi-antenna communication, instead of the first conductive portion (701) and the second conductive portion (702), through at least one switching circuit.

[0271] In order to adaptively operate the combination of the two antennas according to the user's preference, at least one switching circuit (e.g., switching circuit (830)) may be used. For example, the at least one switching circuit may include a first switching circuit for selectively connecting at least one wireless communication circuit to either the second conductive portion (701) or the third conductive portion (703), and a second switching circuit for selectively connecting at least one wireless communication circuit to either the first conductive portion (701) or the third conductive portion (703). For example, the at least one switching circuit may include a first switching circuit for selectively connecting at least one wireless communication circuit to either the second conductive portion (701) or the third conductive portion (703), and a second switching circuit for selectively connecting at least one wireless communication circuit to either the first conductive portion (701) or the second conductive portion (702).

[0272] FIG. 25 illustrates an operation flow of an electronic device (e.g., electronic device (101), electronic device (200), electronic device (400), or electronic device (500)) for performing multi-antenna communication using a receiver. The electronic device (101) may include a first housing part (710), a second housing part (720), and a third housing part (730). A first hinge structure (750) may rotatably couple the first housing part (710) and the second housing part (720). A second hinge structure (760) may rotatably couple the second housing part (720) and the third housing part (730). For example, the electronic device (101) may be the electronic device (200) of FIGS. 2A, 2B, and 2C. The first housing part (710), the second housing part (720), and the third housing part (730) may correspond to the first housing part (210), the second housing part (220), and the third housing part (230), respectively. The first hinge structure (750) may correspond to the first hinge structure (250). The second hinge structure (760) may correspond to the second hinge structure (260). For example, the electronic device (101) may be the electronic device (400) of FIGS. 4A and 4B. The first housing part (710), the second housing part (720), and the third housing part (730) may correspond to the first housing part (410), the second housing part (420), and the third housing part (430), respectively. The first hinge structure (750) may correspond to the first hinge structure (450). The second hinge structure (760) may correspond to the second hinge structure (460). For example, the electronic device (101) may be the electronic device (500) of FIGS. 5A, 5B, and 5C. The first housing part (710), the second housing part (720), and the third housing part (730) may correspond to the first housing part (510), the second housing part (520), and the third housing part (530), respectively.The first hinge structure (750) may correspond to the first hinge structure (550). The second hinge structure (760) may correspond to the second hinge structure (560).

[0273] Referring to FIG. 25, in operation (2501), the electronic device (101) (e.g., the processor (120)) may perform communication through a second conductive portion (e.g., the second conductive portion (702)) and a third conductive portion (e.g., the third conductive portion (703), the conductive portion (725), or the conductive portion (712)). For example, the second conductive portion may be included in the first housing part (710). The third conductive portion may be included in a second housing part (720) or a third housing part (730) that is different from the first housing part (710). For example, according to operation (2405) of FIG. 24, the electronic device (101) may perform communication through the second conductive portion (702) and the third conductive portion (703). For example, the conductive portion (725) may be located at the bottom of the electronic device (101) (e.g., FIG. 20b).

[0274] In operation (2503), the electronic device (101) (e.g., the processor (120)) can detect that the receiver is activated. While the electronic device (101) performs communication through the second conductive portion (702) and the third conductive portion (703), the electronic device can detect that the receiver for a voice call is activated. For example, the receiver can be disposed on the upper side of the third housing part (730) of the electronic device (101). Since the receiver is disposed on the upper side, for the required call quality, the conductive portion disposed on the lower side (e.g., the first conductive portion (701)) can be used instead of the conductive portion disposed on the upper side (e.g., the second conductive portion (702)).

[0275] In operation (2505), the electronic device (101) (e.g., the processor (120)) can perform communication through a first conductive portion (e.g., the first conductive portion (701)) and a third conductive portion (e.g., the third conductive portion (703), the conductive portion (725), or the conductive portion (712)). The electronic device (101) can utilize the first conductive portion (701) and the third conductive portion (703) as radiators for multi-antenna communication instead of the second conductive portion (702) and the third conductive portion (703) through at least one switching circuit.

[0276] In order to adaptively operate the combination of the two antennas depending on whether the receiver is activated, at least one switching circuit may be used. For example, the at least one switching circuit may include a first switching circuit for selectively connecting at least one wireless communication circuit to either the second conductive portion (701) or the third conductive portion (703), and a second switching circuit for selectively connecting at least one wireless communication circuit to either the first conductive portion (701) or the third conductive portion (703). For example, the at least one switching circuit may include a first switching circuit for selectively connecting at least one wireless communication circuit to either the second conductive portion (701) or the third conductive portion (703), and a second switching circuit for selectively connecting at least one wireless communication circuit to either the first conductive portion (701) or the second conductive portion (702).

[0277] The electronic device (101) can perform multi-antenna communication via two antennas. The electronic device (101) can perform multi-antenna communication via one of the two antennas and an additional antenna in response to a defined folding state (e.g., a third state (803), a fourth state (804)). According to one embodiment, the two antennas may be disposed in a housing part (e.g., a third housing part (730)) including a processor (e.g., a processor (120)), and the additional antenna may be disposed in another housing part (e.g., a second housing part (720), a first housing part (710)). A current mode in one direction (e.g., a vertical direction) may be induced via the two antennas, and a current mode in a direction substantially perpendicular to the one direction (e.g., a horizontal direction) may be induced via the additional antenna. Isolation between the antennas can be ensured through the vertical current modes as well as the positions distinguished by the top and bottom. Additionally, throughput can be improved in terms of diversity due to reduced interference.

[0278] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0279] In embodiments of the present disclosure, an electronic device (101; 200; 400; 500) is provided. The electronic device (101; 200; 400; 500) may include a housing including a first housing part (710), a second housing part (720), and a third housing part (730); a first hinge structure (750) rotatably coupling the first housing part (710) and the second housing part (720); a second hinge structure (760) rotatably coupling the second housing part (720) and the third housing part (730); and at least one wireless communication circuit for transmitting or receiving a signal in a frequency band. The first housing part (710) may include a first metal frame. The second housing part (720) may include a second metal frame. The third housing part (730) may include a third metal frame having a top, a bottom, and a side surface. The third metal frame may include a first conductive portion (701) (visible to the outside) at least partially formed on the side surface and a second conductive portion (702) (visible to the outside) at least partially formed on the side surface. The first metal frame or the second metal frame may include a third conductive portion (703; 712) having a length direction substantially perpendicular to a length direction of the side surface of the third metal frame. When the second housing part (720) and the third housing part (730) are folded, the third conductive portion (703; 712) may be used to transmit or receive signals while signals are transmitted or received through the first conductive portion (701) in the frequency band.

[0280] For example, the length of the third conductive portion (703; 712) along the longitudinal direction of the third conductive portion (703; 712) may be about 25 mm or more.

[0281] For example, while the second housing part (720) and the third housing part (730) are unfolded, while signals are transmitted or received through the first conductive part (701) in the frequency band, the second conductive part (702) can be used to transmit or receive signals in the frequency band. For example, the folded state of the first housing part (710) and the second housing part (720) is a state in which the first housing part (710) and the second housing part (720) are unfolded through the first hinge structure (750) and a state in which the second housing part (720) and the third housing part (730) are unfolded through the second hinge structure (760); And it may include a state in which the first housing part (710) and the second housing part (720) are not folded through the first hinge structure (750) and a state in which the second housing part (720) and the third housing part (730) are folded through the second hinge structure (760).

[0282] For example, the first conductive portion (701) may be formed across the side and the bottom of the third metal frame. The second conductive portion (702) may be formed across the side and the top of the third metal frame. The third conductive portion (703; 712) may be formed across the top of the second metal frame.

[0283] For example, the electronic device (101; 200; 400; 500) may include a first switching circuit configured to selectively connect the at least one wireless communication circuit with either the second conductive portion (702) or the third conductive portion (703; 712).

[0284] For example, the electronic device (101; 200; 400; 500) may include a second switching circuit configured to selectively connect the at least one wireless communication circuit with either the first conductive portion (701) or the third conductive portion (703; 712). When the second housing part (720) and the third housing part (730) are folded, when the first switching circuit connects the at least one wireless communication circuit with the third conductive portion (703; 712), the second switching circuit may be controlled to connect the at least one wireless communication circuit with the first conductive portion (702). When the second housing part (720) and the third housing part (730) are folded, and the first switching circuit connects the at least one wireless communication circuit and the second conductive part (701), the second switching circuit can be controlled to connect the at least one wireless communication circuit and the third conductive part (703; 712).

[0285] For example, the first switching circuit may be arranged on a printed circuit board (PCB) of the third housing part (730). The third conductive portion (703; 712) may be formed on the upper or lower portion of the second metal frame of the second housing part (720). The first switching circuit may be connected to the third conductive portion (703; 712) through a flexible substrate arranged across the second housing part (720).

[0286] For example, the electronic device (101; 200; 400; 500) may further include a grip sensor disposed in an area corresponding to the lower end among the upper and lower ends of the electronic device (101; 200; 400; 500); and a processor. The at least one wireless communication circuit may be configured to transmit or receive signals of the frequency band through the first conductive portion (701) and the third conductive portion (703; 712) under the control of the processor, and to transmit or receive signals of the frequency band through the second conductive portion (702) and the third conductive portion (703; 712) based on detecting a user's grip through the grip sensor when the second housing part (720) and the third housing part (730) are folded.

[0287] For example, the electronic device (101; 200; 400; 500) may further include a receiver circuit; and a processor. The at least one wireless communication circuit may be configured to, under the control of the processor, determine whether the receiver circuit is activated while transmitting or receiving signals of the frequency band through the second conductive portion (702) and the third conductive portion (703; 712), and, when the second housing part (720) and the third housing part (730) are folded, transmit or receive signals of the frequency band through the first conductive portion (701) and the third conductive portion (703; 712) based on a determination that the receiver circuit is not activated.

[0288] For example, when the second housing part (720) and the third housing part (730) are folded, the first conductive part (701) and the third conductive part (703; 712) can be used for MIMO (multiple input multiple output) multiplexing or diversity. When the second housing part (720) and the third housing part (730) are not folded, the first conductive part (701) and the second conductive part (702) can be used for MIMO multiplexing or diversity.

[0289] For example, the electronic device (101; 200; 400; 500) may include a filter circuit configured to pass signals having a frequency below a threshold frequency. The filter circuit may be disposed on a printed circuit board (PCB) disposed within the second housing part (720). The filter circuit may be connected to the third conductive portion (703; 712) of the second metal frame.

[0290] For example, the frequency band may belong to a low frequency band of less than about 1 GHz.

[0291] For example, the electronic device (101; 200; 400; 500) may include a divider circuit disposed on a printed circuit board (PCB) of the third housing part (730) and connected to the at least one wireless communication circuit; and a switching circuit disposed on the PCB of the third housing part (730). The divider circuit may be connected to the first conductive part (701) and the switching circuit. The switching circuit may be configured to selectively connect the divider circuit to one of the second conductive part (702) or the third conductive part (703; 712).

[0292] In embodiments of the present disclosure, an electronic device (101; 200; 400; 500) is provided. The electronic device (101; 200; 400; 500) may include a housing including a first housing part (710), a second housing part (720), and a third housing part (730); a first hinge structure (750) rotatably coupling the first housing part (710) and the second housing part (720); a second hinge structure (760) rotatably coupling the second housing part (720) and the third housing part (730); and at least one wireless communication circuit for transmitting or receiving a signal in a frequency band. The first housing part (710) may include a first metal frame. The second housing part (720) may include a second metal frame. The third housing part (730) may include a third metal frame having a top, a bottom, and a side surface. The third metal frame may include a first conductive portion (701) (visible to the outside) at least partially formed on the side surface and a second conductive portion (702) (visible to the outside) at least partially formed on the side surface. The second metal frame may include a third conductive portion (703; 712) having a length of about 25 mm (millimeters) or more in a direction substantially perpendicular to the longitudinal direction of the side surface of the third metal frame. The first conductive portion (701) and the third conductive portion (703; 712) may be used to transmit or receive signals in the frequency band via the wireless communication circuit.

[0293] For example, the electronic device (101; 200; 400; 500) may include a divider circuit disposed on a printed circuit board (PCB) of the third housing part (730) and connected to the at least one wireless communication circuit. The divider circuit may be connected to the first conductive portion (701) and the third conductive portion (703; 712).

[0294] For example, when the second housing part (720) and the third housing part (730) are folded, the first conductive part (701) and the third conductive part (703; 712) may be used to transmit or receive signals in the frequency band, and the second conductive part (702) may not be used to transmit or receive signals in the frequency band.

[0295] For example, when the second housing part (720) and the third housing part (730) are not folded, the second conductive part and the third conductive part (703; 712) may be used to transmit or receive signals in the frequency band, and the first conductive part (701) may not be used to transmit or receive signals in the frequency band.

[0296] For example, the first conductive portion (701) may include a first portion formed on the side surface of the third metal frame and a second portion formed on the lower surface. The length of the first portion on the side surface may be longer than the length of the second portion at the upper surface. The length of the first portion may be shorter than the length of the third conductive portion (703; 712) in a direction substantially perpendicular to the longitudinal direction of the side surface of the third metal frame.

[0297] For example, the frequency band may belong to a low frequency band of less than about 1 GHz.

[0298] For one or more embodiments, at least one of the components described in one or more of the preceding drawings may be configured to perform one or more operations, techniques, processes, and / or methods as described herein. For example, a processor (e.g., a baseband processor) described herein with respect to one or more of the preceding drawings may be configured to operate according to one or more examples described herein. For another example, circuitry associated with a user equipment (UE), a base station, a network element, and the like, as described above with respect to one or more of the preceding drawings, may be configured to operate according to one or more examples described herein.

[0299] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless explicitly stated otherwise. The foregoing description of one or more implementations provides examples and descriptions, but is not intended to be exhaustive or limit the scope of the embodiments to the precise forms disclosed. Modifications and variations are possible in light of the above teachings or may be learned from practicing various embodiments.

[0300] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0301] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0302] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0303] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0304] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0305] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A housing comprising a first housing part, a second housing part, and a third housing part; A first hinge structure that rotatably connects the first housing part and the second housing part; A second hinge structure that rotatably connects the second housing part and the third housing part; and comprising at least one wireless communication circuit for transmitting or receiving a signal in a frequency band; The above first housing part includes a first metal frame, The second housing part includes a second metal frame, The third housing part includes a third metal frame having a top, a bottom, and a side, and the third metal frame includes a first conductive portion formed at least partially on the side and a second conductive portion formed at least partially on the side, The first metal frame or the second metal frame includes a third conductive portion having a length direction substantially perpendicular to the length direction of the side surface of the third metal frame, In a folded state of the second housing part and the third housing part, while signals are transmitted or received through the first conductive part in the frequency band, the third conductive part is used to transmit or receive signals. Electronic devices.

2. In claim 1, The length of the third conductive portion along the longitudinal direction of the third conductive portion is about 25 mm or more. Electronic devices.

3. In claim 1, While the second housing part and the third housing part are not folded, while signals are transmitted or received through the first conductive part in the frequency band, the second conductive part is used to transmit or receive signals in the frequency band. Electronic devices.

4. In claim 1, The above first housing part and the above second housing part are folded in the following state: The first housing part and the second housing part are not folded through the first hinge structure, and the second housing part and the third housing part are not folded through the second hinge structure; and Including a state in which the first housing part and the second housing part are not folded through the first hinge structure and a state in which the second housing part and the third housing part are folded through the second hinge structure. Electronic devices.

5. In claim 1, The first conductive portion is formed across the side and bottom of the third metal frame, The second conductive portion is formed across the side and top of the third metal frame, The third conductive portion is formed on the top of the second metal frame. Electronic devices.

6. In claim 1, Further comprising a first switching circuit configured to selectively connect the at least one wireless communication circuit to one of the second conductive portion or the third conductive portion; Electronic devices.

7. In claim 6, Further comprising a second switching circuit configured to selectively connect the at least one wireless communication circuit to one of the first conductive portion or the third conductive portion; When the second housing part and the third housing part are folded, and the first switching circuit connects the at least one wireless communication circuit and the third conductive portion, the second switching circuit is controlled to connect the at least one wireless communication circuit and the first conductive portion, When the second housing part and the third housing part are folded, when the first switching circuit connects the at least one wireless communication circuit and the second conductive portion, the second switching circuit is controlled to connect the at least one wireless communication circuit and the third conductive portion. Electronic devices.

8. In claim 6, The above first switching circuit is placed on the PCB (printed circuit board) of the third housing part, The third conductive portion is formed on the upper or lower part of the second metal frame of the second housing part, The first switching circuit is connected to the third conductive portion through a flexible substrate arranged across the second housing part. Electronic devices.

9. In claim 1, a grip sensor disposed in an area corresponding to the lower portion of the upper and lower portions of the electronic device; and Including more processors, The at least one wireless communication circuit, under the control of the processor: Transmitting or receiving signals of the frequency band through the first conductive portion and the third conductive portion, In a folded state of the second housing part and the third housing part, based on detecting the user's grip through the grip sensor, signals of the frequency band are transmitted or received through the second conductive part and the third conductive part. Electronic devices.

10. In claim 9, receiver circuit; and Including more processors, The at least one wireless communication circuit, under the control of the processor: While transmitting or receiving signals of the frequency band through the second conductive portion and the third conductive portion, determining whether the receiver circuit is activated; When the second housing part and the third housing part are folded, the receiver circuit is configured to transmit or receive signals of the frequency band through the first conductive part and the third conductive part, based on a determination that the receiver circuit is not activated. Electronic devices.

11. In claim 1, In a folded state of the second housing part and the third housing part, the first conductive part and the third conductive part are used for MIMO (multiple input multiple output) multiplexing or diversity, In a state where the second housing part and the third housing part are not folded, the first conductive part and the second conductive part are used for MIMO multiplexing or diversity. Electronic devices.

12. In claim 1, Further comprising a filter circuit configured to pass signals having a frequency below a threshold frequency, The above filter circuit is arranged on a printed circuit board (PCB) placed within the second housing part, The above filter circuit is connected to the third conductive portion of the second metal frame, Electronic devices.

13. In claim 1, The above frequency band belongs to the low frequency band of less than about 1 GHz (gigahertz). Electronic devices.

14. In claim 1, A divider circuit arranged on the printed circuit board (PCB) of the third housing part and connected to the at least one wireless communication circuit; and Further comprising a switching circuit arranged on the PCB of the third housing part, The above divider circuit is connected to the first conductive portion and the switching circuit, The switching circuit is configured to selectively connect the divider circuit to one of the second conductive portion or the third conductive portion. Electronic devices.

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