Substrate lifting / lowering mechanism and substrate processing device

Abstract

The present application discloses a substrate lifting / lowering mechanism and a substrate processing device. The substrate lifting / lowering mechanism comprises: a fixed plate having a first side surface and a second side surface arranged opposite to each other; a first support assembly, arranged on the first side surface in a liftable / lowerable manner and configured to support and drive the substrate to ascend and descend; a second support assembly, arranged on the first side surface in a liftable / lowerable manner and configured to support and drive the substrate to ascend and descend, wherein the first support assembly and the second support assembly are configured to have the same symmetrical plane; a driving assembly, configured to drive the second support assembly to ascend and descend; a first connecting rod assembly, arranged on the second side surface, wherein the first connecting rod assembly comprises a first hinge shaft and a second hinge shaft, the first hinge shaft is hingedly connected to the second support assembly, and the second hinge shaft is hingedly connected to the first support assembly; and a guide sliding plate, arranged on the second side surface and working in conjunction with the first connecting rod assembly. The present application improves the reliability of the substrate lifting / lowering mechanism and reduces the risk of the substrate falling.

Description

Substrate lifting mechanism and substrate processing device TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor equipment, and further relates to a substrate lifting mechanism and a substrate processing device. BACKGROUND

[0002] The semiconductor cleaning process is an important process link throughout the entire substrate manufacturing process, and the quality of the cleaning process is the key to improving the substrate yield. Generally, the semiconductor cleaning equipment includes single wafer cleaning equipment and tank cleaning equipment. Among them, the tank cleaning equipment is used for batch wet cleaning of the substrate, and has the characteristics of high cleaning efficiency.

[0003] The existing tank wet cleaning equipment generally includes a cleaning cavity, a drying cavity and a lifting mechanism. The drying cavity is movably arranged above the cleaning cavity. The cleaning cavity is used for cleaning processing of the substrate, and the drying cavity is used for drying processing of the cleaned substrate. The lifting mechanism is used for carrying and driving the substrate to be cleaned to descend into the cleaning cavity, so as to immerse the substrate to be cleaned into the wet chemical liquid for cleaning processing, and then lift the cleaned substrate into the drying cavity for drying processing of the cleaned substrate in the drying cavity.

[0004] A wafer lifting device and a cleaning equipment are disclosed in Chinese Patent No. 202310101720.6. The wafer lifting device includes: a first support assembly for supporting at least two points of the end surface of the wafer to make the wafer stand sideways; a second support assembly for supporting the wafer after being lifted, and the second support assembly avoids the first support assembly when being lifted to support the wafer; a lifting mechanism including a driving assembly, a connecting rod assembly, and a sliding assembly connected with the driving assembly and the connecting rod assembly respectively, the sliding assembly is further connected with the first support assembly and the second support assembly respectively, the driving assembly drives the sliding assembly to move, and the sliding assembly cooperates with the connecting rod assembly to drive the first support assembly to lift the wafer from a first preset position to a second preset position; and when the wafer is lifted to the second preset position, the second support assembly is driven to lift the wafer from the second preset position to a third preset position, so that the wafer is separated from the first support assembly. During the wafer cleaning and drying process: first, the wafer to be processed is loaded onto the first support assembly, and the wafer to be processed is lowered into the tank body by the first support assembly for cleaning processing until the wafer is cleaned; then the wafer is lifted by the first support assembly, and after the wafer is lifted to the second preset position, the wafer is further lifted by the second support assembly, the first support assembly is separated from the wafer, until the wafer is lifted to the drying device for drying processing. Therefore, during the process of lifting the wafer to the drying device, the first contact point of the first support assembly and the wafer is exposed by switching the first support assembly and the second support assembly, so that the first contact point can be further dried to improve the drying effect of the wafer.

[0005] However, in the above patent application, the first support assembly and the second support assembly are located on the first side of the fixed plate, the link assembly is configured on the third side of the fixed plate adjacent to the first side, the gravity of the first support assembly, the second support assembly and the wafer carried thereby exerts a torque on the link assembly, and the force arm of the torque is about half of the width of the fixed plate, resulting in uneven force on the link assembly during the lifting of the wafer, and the risk of wafer falling due to failure of the link assembly. In addition, with the increasing requirement for the production capacity of the cleaning equipment, the single loading number of the wafer lifting device needs to be greater than 100, so that the force of the first support assembly and the second support assembly on the link assembly increases, and the risk of wafer falling due to failure of the link assembly is aggravated. SUMMARY

[0006] In view of the above technical problems, the purpose of the present application is to improve the reliability of the substrate lifting mechanism and reduce the risk of substrate falling.

[0007] In order to achieve the above purpose, the present application provides a substrate lifting mechanism and a substrate processing device.

[0008] In some embodiments, the substrate lifting mechanism comprises: a fixed plate having a first side and a second side arranged opposite to each other; a first support assembly arranged to be lifted on the first side for supporting and lifting the substrate; a second support assembly arranged to be lifted on the first side for supporting and lifting the substrate, and the first support assembly and the second support assembly are configured to have a same symmetry plane; a driving assembly for driving the second support assembly to lift; a first link assembly arranged on the second side, the first link assembly comprising a first hinge shaft and a second hinge shaft, the first hinge shaft being hingedly connected with the second support assembly, the second hinge shaft being hingedly connected with the first support assembly, and the first hinge shaft and the second hinge shaft comprising a connecting line in the vertical direction, the connecting line being located on the symmetry plane; a guide slide plate arranged on the second side and cooperating with the first link assembly, the guide slide plate being configured to make the first support assembly and the second support assembly lift synchronously during the lifting of the substrate by the first support assembly from a first preset height to a second preset height; and during the lifting of the substrate by the second support assembly from the second preset height to a third preset height, the second support assembly is lifted relative to the first support assembly to make the substrate separate from the first support assembly and be supported by the second support assembly.

[0009] In some embodiments, the substrate processing device, including the substrate lifting mechanism of any of the above, further comprises: a cleaning tank for cleaning the substrate; a drying chamber movably arranged above the cleaning tank for drying the substrate; wherein during substrate cleaning, the substrate lifting mechanism is configured to lower the substrate to the first preset height so as to lower the substrate into the cleaning tank for cleaning; and during substrate drying, the substrate lifting mechanism is configured to raise the substrate to the third preset height so as to raise the substrate into the drying chamber for drying.

[0010] Compared with the prior art, the first support assembly and the second support assembly are arranged on the first side of the fixed plate, the first connecting rod assembly and the guide sliding plate are arranged on the second side of the fixed plate, the first support assembly and the second support assembly are configured to have the same symmetry plane, and the line connecting the first hinge shaft and the second hinge shaft of the first connecting rod assembly is located on the symmetry plane, thereby reducing the problem that the connecting rod assembly is not uniformly stressed during wafer lifting in the prior art because the connecting rod assembly is configured on the third side of the fixed plate, and the reliability of the substrate lifting mechanism is improved and the risk of substrate falling is reduced.

[0011] SUMMARY

[0012] The features, performances, and advantages of the present application are further described in the following embodiments and the accompanying drawings.

[0013] The above features, technical characteristics, advantages, and implementation modes of the present application will be further described in the following preferred embodiments in a clear and understandable manner combined with the accompanying drawings.

[0014] Fig. 1 is a schematic diagram of a substrate lifting mechanism according to an embodiment of the present application;

[0015] Fig. 2 is a schematic diagram of the back of Fig. 1;

[0016] Fig. 3 is a schematic diagram of Fig. 1 with the substrate hidden;

[0017] Fig. 4 is a schematic diagram of Fig. 3 with the first support and the second support hidden;

[0018] Fig. 5 is a schematic diagram of Fig. 4 with the first sliding block and the second sliding block hidden;

[0019] Fig. 6 is a schematic diagram of the back of the substrate lifting mechanism (substrate at the first preset height);

[0020] Fig. 7 is a left view of Fig. 6;

[0021] Fig. 8 is a schematic diagram of the back of the substrate lifting mechanism (substrate at the second preset height);

[0022] Fig. 9 is a left view of Fig. 8;

[0023] Fig. 10 is a back view of the substrate lifting mechanism (substrate at a third preset height);

[0024] Fig. 11 is a left view of Fig. 10;

[0025] Fig. 12 is a back view of the substrate lifting mechanism (substrate loading);

[0026] Fig. 13 is a left view of Fig. 12;

[0027] Fig. 14 is a schematic view of a substrate processing device according to an embodiment of the present application; and

[0028] Fig. 15 is a schematic view of main working steps of the substrate processing device.

[0029] Preferred embodiments of the present application

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, specific embodiments of the present application will be described below with reference to the drawings. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings and other embodiments according to these drawings without creative labor.

[0031] In this paper, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0032] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0033] As shown in Figs. 1 and 2, a substrate lifting mechanism 11 according to an embodiment of the present application is disclosed. The substrate lifting mechanism 11 comprises a fixed plate 111, a first support assembly 112, a second support assembly 113, a driving assembly 114, a first connecting rod assembly 115 and a guide slide plate 116.

[0034] Specifically, the fixing plate 111 has a first side surface 1111 and a second side surface 1112 oppositely arranged. The first support assembly 112 is arranged on the first side surface 1111 and used to support and drive the substrate 20 to move up and down. The second support assembly 113 is arranged on the first side surface 1111 and used to support and drive the substrate 20 to move up and down, and the first support assembly 112 and the second support assembly 113 are configured to have the same symmetry plane P.

[0035] In addition, the driving assembly 114 is used to drive the second support assembly 113 to move up and down. Referring to FIG. 6, the first connecting rod assembly 115 is arranged on the second side surface 1112, and the first connecting rod assembly 115 includes a first hinge shaft 1158 and a second hinge shaft 1156. The first hinge shaft 1158 is hingedly connected with the second support assembly 113, the second hinge shaft 1156 is hingedly connected with the first support assembly 112, and the first hinge shaft 1158 and the second hinge shaft 1156 include a connecting line S (as shown by a dashed line in FIG. 6) in the vertical direction, and the connecting line S is located on the symmetry plane P. The guide slide plate 116 is arranged on the second side surface 1112 and cooperates with the first connecting rod assembly 115. The guide slide plate 116 is configured to, during the process that the first support assembly 112 drives the substrate 20 to move up from the first preset height h1 (corresponding to the state shown in FIGS. 6 and 7) to the second preset height h2 (corresponding to the state shown in FIGS. 8 and 9), drive the first support assembly 112 and the second support assembly 113 to move up synchronously; and during the process that the second support assembly 113 drives the substrate 20 to move up from the second preset height h2 to the third preset height h3 (corresponding to the state shown in FIGS. 10 and 11), drive the second support assembly 113 to move up relative to the first support assembly 112, so that the substrate 20 is separated from the first support assembly 112 and is supported by the second support assembly 113. In other words, when the substrate 20 is located between the first preset height h1 and the second preset height h2, the substrate 20 is supported only by the first support assembly 112, and when the substrate 20 is located between the second preset height h2 and the third preset height h3, the substrate 20 is supported by the second support assembly 113 instead of the first support assembly 112. It should be noted that, in the embodiment, the relative positional relationship between the substrate 20 and the first preset height h1, the second preset height h2 and the third preset height h3 is described by taking the lowest point of the substrate 20 as a reference, and other positions of the substrate 20 such as the center or the vertex of the substrate 20 can also be taken as a reference for description without departing from the concept of the present application.

[0036] In the embodiment, the first support assembly 112 and the second support assembly 113 are arranged on the first side 1111 of the fixed plate 111, the first connecting rod assembly 115 and the guide plate 116 are arranged on the second side 1112 of the fixed plate 111, the first support assembly 112 and the second support assembly 113 are configured to have the same symmetry plane P, and the line S connecting the first hinge shaft 1158 and the second hinge shaft 1156 is located on the symmetry plane P, thereby eliminating the problem that the connecting rod assembly is unevenly stressed during the lifting of the wafer in the prior art because the connecting rod assembly is configured on the third side of the fixed plate, and thereby improving the reliability of the substrate lifting mechanism 11 and reducing the risk of dropping the substrate 20.

[0037] In addition, in the embodiment, the guide plate 116 is fixed on the second side 1112 of the fixed plate 111, and the guide plate 116 and the fixed plate 111 are parallel and in surface contact, so that the guide plate 116 has a very stable fixing mode, thereby providing more stable support for the first connecting rod assembly 115 during the lifting of the first support assembly 112 and the second support assembly 113, and thereby improving the reliability of the substrate lifting mechanism 11.

[0038] Preferably, referring again to FIG. 2, the fixed plate 111 is provided with a strip-shaped hole 1113 extending in the vertical direction, and the first support assembly 112 and the second support assembly 113 are connected with the first connecting rod assembly 115 through the strip-shaped hole 1113.

[0039] Preferably, as shown in FIG. 6, the substrate lifting mechanism 11 further comprises a second connecting rod assembly 118, the second connecting rod assembly 118 is symmetrical to the first connecting rod assembly 115 about the symmetry plane P, and one end of the second connecting rod assembly 118 is hingedly connected with the first hinge shaft 1158, and the other end of the second connecting rod assembly 118 is hingedly connected with the second hinge shaft 1156.

[0040] Specifically, the first connecting rod assembly 115 comprises a first connecting rod 1151 and a second connecting rod 1152, and the first connecting rod 1151 and the second connecting rod 1152 are connected through a third hinge shaft 1155. The second connecting rod assembly 118 comprises a third connecting rod 1181 and a fourth connecting rod 1182, and the third connecting rod 1181 and the fourth connecting rod 1182 are connected through a fourth hinge shaft 1183, and the first connecting rod 1151 and the fourth connecting rod 1182 are connected through the first hinge shaft 1158, and the second connecting rod 1152 and the third connecting rod 1181 are connected through the second hinge shaft 1156. Preferably, the first connecting rod 1151, the second connecting rod 1152, the third connecting rod 1181 and the fourth connecting rod 1182 have equal lengths.

[0041] Further, the guide plate 116 comprises a vertical guide groove 1161, a first guide side 1162 and a second guide side 1163. The vertical guide groove 1161 corresponds to the strip-shaped hole 1113, the first guide side 1162 and the second guide side 1163 are respectively located on the two sides of the vertical guide groove 1161 and are symmetrical about the above-mentioned symmetry plane P. The first hinge shaft 1158 and the second hinge shaft 1156 are sequentially arranged in the vertical guide groove 1161 from top to bottom, the third hinge shaft 1155 is used for cooperating with the first guide side 1162, the fourth hinge shaft 1183 is used for cooperating with the second guide side 1163, and the first guide side 1162 and the second guide side 1163 are used for limiting the horizontal distance between the third hinge shaft 1155 and the fourth hinge shaft 1183, so as to adjust the vertical distance between the first hinge shaft 1158 and the second hinge shaft 1156.

[0042] In the embodiment, the first hinge shaft 1158 is connected with the second support assembly 113, the second hinge shaft 1156 is connected with the first support assembly 112, and the first hinge shaft 1158 is located above the second hinge shaft 1156. In the process of driving the second support assembly 113 to rise and fall by the driving assembly 114, the second hinge shaft 1156 extrudes the third hinge shaft 1155 against the first guide side 1162 and extrudes the fourth hinge shaft 1183 against the second guide side 1163 under the action of the gravity of the first support assembly 112, the first guide side 1162 and the second guide side 1163 limit the horizontal distance between the third hinge shaft 1155 and the fourth hinge shaft 1183, so as to adjust the vertical distance between the first hinge shaft 1158 and the second hinge shaft 1156 and the vertical distance between the second support assembly 113 and the first support assembly 112, thereby realizing that the second support assembly 113 supports and lifts the substrate 20 instead of the first support assembly 112. It should be noted that in FIGS. 6 to 11, the driving assembly 114 is hidden in order to show the structures of the first linkage assembly 115 and the guide plate 116, and the driving assembly 114 is shown in other drawings of the present application.

[0043] In the embodiment, the first hinge shaft 1158 and the second hinge shaft 1156 are simultaneously connected by the first linkage assembly 115 and the second linkage assembly 118, the third hinge shaft 1155 and the fourth hinge shaft 1183 are subjected to the same force, the service life of the first linkage assembly 115 and the second linkage assembly 118 is increased, and when any one of the first linkage assembly 115 and the second linkage assembly 118 fails, the other one can continue to work, thereby preventing the substrate 20 from falling and being damaged.

[0044] Preferably, the first guide and slide side surface 1162 and the second guide and slide side surface 1163 comprise, from top to bottom, a first vertical guide and slide surface 1164, a circular arc guide and slide surface 1165 and a second vertical guide and slide surface 1166, respectively, and the horizontal distance from the first vertical guide and slide surface 1164 to the vertical guide and slide groove 1161 is less than the horizontal distance from the second vertical guide and slide surface 1166 to the vertical guide and slide groove 1161.

[0045] During the ascending of the third and fourth hinge shafts 1155 and 1183 along the second vertical guide and slide surface 1166, the second and first hinge shafts 1156 and 1158 are synchronously raised, and when the third and fourth hinge shafts 1155 and 1183 are located at the bottom of the second vertical guide and slide surface 1166, the first support assembly 112 correspondingly carries the substrate 20 to a first preset height h1 (as shown in FIGS. 6 and 7). When the third and fourth hinge shafts 1155 and 1183 are raised to the junction of the second vertical guide and slide surface 1166 and the circular arc guide and slide surface 1165, the first support assembly 112 correspondingly raises the substrate 20 to a second preset height h2 (as shown in FIGS. 8 and 9). During the ascending of the third and fourth hinge shafts 1155 and 1183 along the circular arc guide and slide surface 1165, the height of the second hinge shaft 1156 stays at the center of the circular arc where the circular arc guide and slide surface 1165 is located (the radius of the circular arc is equal to the length of the first and fourth connecting rods 1151 and 1182), and with the change of the horizontal distance between the third and fourth hinge shafts 1155 and 1183, the vertical distance between the first and second hinge shafts 1158 and 1156 changes accordingly, so that the first hinge shaft 1158 is raised relative to the second hinge shaft 1156, the substrate 20 is separated from the first support assembly 112, and the second support assembly 113 replaces the first support assembly 112 to support and raise / lower the substrate 20. When the third and fourth hinge shafts 1155 and 1183 slide to the junction of the circular arc guide and slide surface 1165 and the first vertical guide and slide surface 1164, the second support assembly 113 correspondingly raises / lowers the substrate 20 to a third preset height h3 (as shown in FIGS. 10 and 11).

[0046] Preferably, referring to FIG. 1 again, the first support assembly 112 comprises a first sliding block 1121 and a first support 1122, the first sliding block 1121 is arranged on the first side surface 1111 in a manner that it can be raised / lowered and is connected with the second hinge shaft 1156, and the first support 1122 is arranged on the side of the first sliding block 1121 away from the fixed plate 111. The second support assembly 113 comprises a second sliding block 1131 and a second support 1132, the second sliding block 1131 is arranged on the first side surface 1111 in a manner that it can be raised / lowered and is connected with the first hinge shaft 1158, the second sliding block 1131 is located above the first sliding block 1121 and is drivingly connected with the driving assembly 114, and the second support 1132 is arranged on the side of the second sliding block 1131 away from the fixed plate 111.

[0047] Specifically, as shown in FIG. 3, the first support 1122 comprises a first fixed rod 1123, a second fixed rod 1124, and a first support body 1125, the first support body 1125 is hollow in the middle and is provided with a plurality of first tooth grooves 1126 on both sides for vertically supporting a plurality of substrates 20, and the first support body 1125 is connected with the first sliding block 1121 through the first fixed rod 1123 and the second fixed rod 1124. The second support 1132 comprises a third fixed rod 1133 and a second support body 1134, the third fixed rod 1133 is located between the first fixed rod 1123 and the second fixed rod 1124 and does not interfere with each other in the vertical direction, the second support body 1134 is located in the middle of the first support body 1125 and is provided with a plurality of second tooth grooves 1135 for vertically supporting a plurality of substrates 20, and the second support body 1134 is connected with the second sliding block 1131 through the third fixed rod 1133.

[0048] Preferably, as shown in FIG. 4, the substrate lifting mechanism 11 further comprises a connecting assembly 117, which is configured to fixedly connect the first sliding block 1121 and the second sliding block 1131 during loading of the substrate lifting mechanism 11 (as shown in FIG. 15 step S10), and the substrate is loaded by the first support 1122.

[0049] Specifically, the connecting assembly 117 comprises a pin 1171 and a driver 1172. The driver 1172 is, for example, a linear motor or a pneumatic cylinder. The driver 1172 is in transmission connection with the pin 1171, and the driver 1172 is arranged on the first sliding block 1121. The second sliding block 1131 is provided with a socket 1173. During loading of the substrate lifting mechanism 11, the driver 1172 drives the pin 1171 to insert into the socket 1173, so as to fixedly connect the first sliding block 1121 and the second sliding block 1131. It should be noted that in other embodiments of the present application, the socket 1173 is arranged on a protrusion 1174 fixedly connected with the second sliding block 1131.

[0050] Preferably, the substrate lifting mechanism 11 further comprises a pre-warning device (not shown in the figure) for monitoring the load information of the driver 1172, and the pre-warning device will send a failure warning when the load information abnormally fluctuates. For example, during the loading of the substrate by the substrate lifting mechanism 11, and before the third hinge shaft 1155 and the fourth hinge shaft 1183 are lifted along the second vertical guide surface 1166, the first slider 1121 and the second slider 1131 have a preset interval, the pin 1171 and the hole 1173 should be located on the same axis, and the driver 1172 drives the pin 1171 to be inserted into the hole 1173. If the interval between the first slider 1121 and the second slider 1131 deviates, causing the pin 1171 and the hole 1173 not to be located on the same axis, the pin 1171 will not be inserted into the hole 1173, thereby causing the load information (such as the load force) of the driver 1172 to abnormally fluctuate. At this time, the pre-warning device sends a failure warning to troubleshoot and repair before the first support assembly 112 loads the substrate, so as to avoid loss caused by the falling of the substrate. In addition, in another embodiment of the present application, the pre-warning device is used to monitor the load information of the driving assembly 114, and the pre-warning device sends a failure warning when the load information abnormally fluctuates. For example, as shown in FIG. 5, the driving assembly 114 comprises a lead screw 1141 and a motor 1142, the lead screw 1141 is vertically arranged on the first side surface 1111 and is in transmission connection with the second slider 1131, and the motor 1142 is used to drive the lead screw 1141 to rotate to drive the second slider 1131 to lift. During the process of supporting and lifting the substrate 20 by the first support assembly 112 or the second support assembly 113, if any one of the first linkage assembly 115 and the second linkage assembly 118 suddenly fails, it will cause the load information of the driving assembly 114 to abnormally fluctuate, and at this time, the pre-warning device sends a failure warning to troubleshoot and repair before the other linkage assembly fails, so as to avoid loss caused by the falling of the substrate.

[0051] Preferably, the substrate lifting mechanism 11 further comprises a position sensor (not shown in the figure) in communication connection with the pre-warning device, for monitoring whether the pin 1171 is inserted into the hole 1173 during the loading of the substrate 20 by the substrate lifting mechanism 11 and before the third hinge shaft 1155 and the fourth hinge shaft 1183 are lifted along the second vertical guide surface 1166. When the pin 1171 is not inserted into the hole 1173, the pre-warning device sends a failure warning to troubleshoot and repair before the first support assembly 112 loads the substrate, so as to avoid loss caused by the falling of the substrate.

[0052] Preferably, referring to FIG. 1 again, the substrate lifting mechanism 11 further comprises at least one limit post 119 arranged at the bottom of the first sliding block 1121 for limiting the lowest descending height of the first sliding block 1121. In addition, the limit post 119 comprises a fixed part 1191 and a buffer part 1192 arranged at the top end of the fixed part 1191 and made of elastic material.

[0053] As shown in FIG. 14, a substrate processing device 10 according to an embodiment of the present application is disclosed. The substrate processing device 10 comprises the substrate lifting mechanism 11 in any of the above embodiments, and further comprises a cleaning tank 12 and a drying chamber 13. The cleaning tank 12 is used for cleaning processing of the substrate 20, and the drying chamber 13 is movably arranged above the cleaning tank 12 and used for drying processing of the substrate 20.

[0054] During the substrate cleaning, the substrate lifting mechanism 11 is used for lowering the substrate 20 to the first preset height h1 so as to lower the substrate 20 into the cleaning tank 12 for cleaning processing. During the substrate drying, the substrate lifting mechanism 11 is used for raising the substrate 20 to the third preset height h3 so as to raise the substrate 20 into the drying chamber 13 for drying processing.

[0055] In actual application, as shown in FIG. 15, the substrate processing device 10 comprises the following working steps:

[0056] Step S10, substrate loading: the drying chamber 13 is moved to above the cleaning tank 12, the drive assembly 114 drives the empty first support assembly 112 to rise to the substrate entrance of the cleaning tank 12, and the robot loads the substrate 20 to be cleaned to the first support assembly 112. It should be noted that, in order to stably support the substrate, the robot needs to load the substrate 20 to be cleaned to the first support assembly 112, and in order to avoid interference between the robot and the cleaning tank 12, the substrate 20 to be cleaned needs to be higher than the second preset height h2. Therefore, in order to prevent the second support assembly 113 from being raised to be higher than the first support assembly 112 under the action of the first connecting rod assembly 115 and the guide sliding plate 116, the connecting assembly 117 is used to fixedly connect the first sliding block 1121 and the second sliding block 1131, so that the first support assembly 112 always remains higher than the second support assembly 113 during the loading process, and then the drive assembly 114 drives the empty first support assembly 112 to rise and load the substrate 20 to be cleaned (the substrate lifting mechanism 11 corresponds to FIGS. 12 and 13).

[0057] Step S20, substrate cleaning: the drive assembly 114 drives the first support assembly 112 to lower the substrate 20 to be cleaned to the first preset height h1, the drying chamber 13 is moved to above the cleaning tank 12, and the substrate 20 to be cleaned is cleaned in the cleaning tank 12 (the substrate lifting mechanism 11 corresponds to FIGS. 6 and 7);

[0058] Step S30, drying the substrate: step S31: the connecting assembly 117 releases the fixed connection between the first slider 1121 and the second slider 1131, and the driving assembly 114 drives the first supporting assembly 112 to raise the substrate 20 after the cleaning process from the first preset height h1 to the second preset height h2 (the substrate lifting mechanism 11 corresponds to FIGS. 8 and 9); step S32: the second supporting assembly 113 is used to raise the substrate 20 after the cleaning process from the second preset height h2 to the third preset height h3 (the substrate lifting mechanism 11 corresponds to FIGS. 10 and 11), the substrate 20 is fixed by the clamping piece 131 in the drying cavity 13, and the gas nozzle 132 in the drying cavity 13 sprays organic solvent vapor on the surface of the substrate 20 to dry the substrate 20 while the substrate 20 is raised.

[0059] Step S40, unloading the substrate: the driving assembly 114 drives the second supporting assembly 113 and the first supporting assembly 112 to descend below the drying cavity 13, and the substrate 20 after the drying process is moved to the upper side of the cleaning tank 12 and unloaded by the mechanical hand.

[0060] It should be noted that the above embodiments can be freely combined as needed. The above is only the preferred embodiment of the present application, and those skilled in the art can make several improvements and refinements without departing from the principles of the present application, and these improvements and refinements should be considered as the protection scope of the present application.

Claims

1. A substrate lifting mechanism characterized by, The base plate has a first side and a second side arranged oppositely; The first support assembly is arranged on the first side and used to support and lift the substrate; The second support assembly is arranged on the first side and used to support and lift the substrate, and the first support assembly and the second support assembly are configured to have a same symmetry plane; The driving assembly is used to drive the second support assembly to lift; The first linkage assembly is arranged on the second side, and the first linkage assembly includes a first hinge shaft and a second hinge shaft, the first hinge shaft is hingedly connected with the second support assembly, the second hinge shaft is hingedly connected with the first support assembly, and the first hinge shaft and the second hinge shaft include a connecting line in the vertical direction, and the connecting line is located on the symmetry plane; The guide slide plate is arranged on the second side and cooperates with the first linkage assembly, and the guide slide plate is configured to make the first support assembly and the second support assembly lift synchronously during the lifting of the first support assembly from a first preset height to a second preset height, and make the second support assembly lift relative to the first support assembly during the lifting of the second support assembly from the second preset height to a third preset height, so that the substrate is separated from the first support assembly and supported by the second support assembly.

2. The substrate lifting mechanism according to claim 1, wherein the base plate is provided with a strip-shaped hole extending in the vertical direction, and the first support assembly and the second support assembly are connected with the first linkage assembly through the strip-shaped hole. Further comprising: The second linkage assembly is symmetrical to the first linkage assembly about the symmetry plane, and one end of the second linkage assembly is hingedly connected with the first hinge shaft, and the other end of the second linkage assembly is hingedly connected with the second hinge shaft.

3. The substrate lifting mechanism of claim 2, wherein 4. The substrate lifting mechanism according to claim 3, wherein the first linkage assembly includes a first linkage and a second linkage connected through a third hinge shaft; and the second linkage assembly includes a third linkage and a fourth linkage connected through a fourth hinge shaft, wherein the first linkage and the fourth linkage are connected through the first hinge shaft, and the second linkage and the third linkage are connected through the second hinge shaft. ​ ​ ​ ​ The guide slide plate comprises a vertical guide slot corresponding to the strip-shaped hole, a first guide side and a second guide side, the first guide side and the second guide side are respectively located on two sides of the vertical guide slot and are symmetrical about the symmetry plane, the first hinge shaft and the second hinge shaft are sequentially arranged in the vertical guide slot from top to bottom, the third hinge shaft is used for cooperating with the first guide side, the fourth hinge shaft is used for cooperating with the second guide side, and the first guide side and the second guide side are used for limiting the horizontal distance between the fourth hinge shaft and the third hinge shaft to adjust the vertical distance between the first hinge shaft and the second hinge shaft.

5. The substrate lifting mechanism according to claim 4, wherein, the first guide side and the second guide side sequentially comprise a first vertical guide surface, a circular arc guide surface and a second vertical guide surface from top to bottom, respectively, and the horizontal distance from the first vertical guide surface to the vertical guide slot is less than the horizontal distance from the second vertical guide surface to the vertical guide slot; wherein, during the lifting of the third hinge shaft and the fourth hinge shaft along the second vertical guide surface, the first hinge shaft and the second hinge shaft are lifted synchronously, and when the third hinge shaft and the fourth hinge shaft are lifted to the connection between the second vertical guide surface and the circular arc guide surface, the first support assembly corresponds to lift the substrate to the second preset height; during the lifting of the third hinge shaft and the fourth hinge shaft along the circular arc guide surface, the first hinge shaft is lifted relative to the second hinge shaft, and the substrate is separated from the first support assembly.

6. The substrate lifting mechanism according to claim 1, wherein, the first support assembly comprises a first sliding block and a first support, the first sliding block is arranged to be liftable on the first side and connected with the second hinge shaft, and the first support is arranged on the side of the first sliding block away from the fixed plate; the second support assembly comprises a second sliding block and a second support, the second sliding block is arranged to be liftable on the first side and connected with the first hinge shaft, the second sliding block is located above the first sliding block and is drivingly connected with the driving assembly, and the second support is arranged on the side of the second sliding block away from the fixed plate.

7. The substrate lifting mechanism of claim 6, wherein, Further comprising: a connecting assembly configured to fixedly connect the first sliding block and the second sliding block during the loading of the substrate lifting mechanism with a substrate, and load the substrate by the first support.

8. The substrate lifting mechanism according to claim 7, wherein, the connecting assembly comprises a pin and a driver, the driver is drivingly connected with the pin, the driver is arranged on the first sliding block, the second sliding block is provided with a insertion hole, and during the loading of the substrate lifting mechanism with a substrate, the driver drives the pin to be inserted into the insertion hole, so that the first sliding block and the second sliding block are fixedly connected.

9. The substrate lifting mechanism of claim 8, wherein, Further comprising: An early warning device is arranged to monitor the load information of the driving assembly and / or the driver, and to issue a failure warning when the load information abnormally fluctuates.

10. The substrate lifting mechanism of claim 9, wherein, Further comprising: A position sensor is arranged in communication with the early warning device, and is arranged to monitor whether the pin is inserted into the socket during loading of the substrate by the substrate lifting mechanism, and to issue a failure warning when the pin is not inserted into the socket.

11. A substrate processing apparatus, characterized by comprising: The substrate lifting mechanism according to any one of claims 1-10, further comprising: A cleaning tank is arranged to clean the substrate; A drying chamber is movably arranged above the cleaning tank, and is arranged to dry the substrate; wherein During cleaning of the substrate, the substrate lifting mechanism is arranged to lower the substrate to the first preset height, so that the substrate is lowered into the cleaning tank for cleaning; During drying of the substrate, the substrate lifting mechanism is arranged to raise the substrate to the third preset height, so that the substrate is raised into the drying chamber for drying.

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