Calibration device and calibration system

Abstract

Provided are a calibration device and a calibration system. The calibration device comprises: a lower column; an upper column formed on one surface of the lower column, the surface being parallel to the short axis of the lower column; and a head comprising markers on surfaces thereof, having a first groove in one of the surfaces, and being coupled to the upper column via the first groove.

Description

Calibration device and calibration system

[0001] The embodiments of this document relate to a calibration device and a calibration system, for example, to a calibration device and a calibration system for calibrating position information and attitude information of a robot.

[0002] Robots equipped with sensors are being used in various fields. Robots can perform complex and variable tasks using information detected by sensors. To perform precise and advanced tasks, calibration operations that define the attitude between the robot and the sensor can be performed.

[0003] The information described above may be provided merely as related art to aid in understanding the present disclosure. None of the foregoing is to be claimed as prior art related to the present disclosure or to be used in determining prior art.

[0004] A calibration device according to various embodiments of the present document may include a lower column, an upper column formed on one surface parallel to the short axis direction of the lower column, and a head having a marker on the surface and a first groove on one surface, which is coupled to the upper column through the first groove.

[0005] A calibration system according to various embodiments of the present document may include a robot and a calibration device. The calibration device may include a lower column, an upper column formed on one surface parallel to the short axis direction of the lower column, and a head having a marker on its surface and a first groove on one surface, which is coupled to the upper column through the first groove.

[0006] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0007] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0008] FIG. 2 is a perspective view of a calibration device according to various embodiments.

[0009] FIG. 3a is a drawing showing a column of a calibration device according to various embodiments.

[0010] FIG. 3b is a plan view of a column of a calibration device according to various embodiments.

[0011] FIG. 4 is a perspective view of the head of a calibration device according to various embodiments.

[0012] FIGS. 5A and 5B are drawings showing the head and column of a calibration device according to various embodiments.

[0013] FIGS. 6A, FIGS. 6B, and FIGS. 6C are drawings showing heads according to various embodiments.

[0014] FIG. 7 is a block diagram illustrating the configuration of a robot according to various embodiments.

[0015] FIG. 8 is a drawing showing a robot according to various embodiments.

[0016] FIG. 9 is a drawing illustrating a slide fit operation according to various embodiments.

[0017] FIG. 10 is a diagram showing sensor data according to various embodiments.

[0018] FIG. 11 is a flowchart illustrating a calibration operation according to various embodiments.

[0019] FIG. 12 is a diagram illustrating the relationship between a sensor, a robot, and a calibration device according to various embodiments.

[0020] FIG. 13 is a diagram comparing calibration results according to various embodiments.

[0021] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily implement them. However, the present disclosure may be embodied in various different forms and is not limited to the examples described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0022] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0023] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0024] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the embodiments described above. The artificial intelligence model may include a plurality of artificial neural network layers.The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the embodiments described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0025] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134). The non-volatile memory (134) may include at least one internal memory (136) and an external memory (138).

[0026] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0027] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0028] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0029] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0030] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0031] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0032] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0033] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0035] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0036] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0037] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0038] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0039] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0040] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0041] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0042] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0043] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0044] The electronic devices according to the various examples disclosed in this document may be of various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or consumer electronics. The electronic devices according to the embodiments of this document are not limited to the devices described above.

[0045] FIG. 2 is a perspective view of a calibration device according to various embodiments. FIG. 3a is a drawing showing a column of a calibration device according to various embodiments. FIG. 3b is a plan view of a column of a calibration device according to various embodiments. FIG. 4 is a perspective view of a head of a calibration device according to various embodiments.

[0046] Referring to FIGS. 2, FIGS. 3a, FIGS. 3b and FIGS. 4, the calibration device (200) may include a lower column (210), an upper column (220), and a head (230).

[0047] Referring to FIGS. 2 and FIGS. 3a, for example, the bottom of the lower column (210) may be connected to a base. The major axis of the lower column (210) may be oriented in a vertical direction. The base may secure the lower column (210). An upper column (220) may be formed at the top of the lower column (210). For example, the upper column (220) may be formed on one side of the upper column (220) parallel to the minor axis direction of the lower column (210). The upper column (220) may be formed with a cross-sectional area smaller than that of the lower column (210). According to one example, the cross-section of the upper column (220) may be formed in the shape of a circle, ellipse, D-cut, or polygon. The upper column (220) may be connected to a head (230). Referring to FIG. 3b, the upper column (220) may include a fastening groove (11) into which a fastening pin is inserted.

[0048] Referring to FIG. 4, for example, the head (230) may include a main groove (13) on one side that can be coupled with an upper column (220). The head (230) may be coupled with the upper column (220) through the main groove (13). The upper column (220) may be coupled with the head (230) by sliding-fitting into the main groove (13) of the head (230). Slide-fitting may mean that the upper column (220) is slid and fitted into the main groove (13) of the head (230). According to one example, if the cross-section of the upper column (220) is formed in a D-cut shape, the main groove (13) of the head (230) may also be formed in a D-cut shape. As an example, the head (230) may include a through hole (15) into which a fastening pin is inserted. A through hole (15) may be formed on one side of the head (230). The through hole (15) may be formed by penetrating from the outside of one side of the head (230) to the main groove (13).

[0049] When the head (230) is coupled to the upper column (220), the through hole (15) of the head (230) and the fastening groove (11) of the upper column (220) may be located on the same axis. According to one example, when a slide-fit operation is not required, the upper column (220) and the head (230) may be fixed. A fastening pin is inserted into the through hole (15) of the head (230) and the fastening groove (11) of the upper column (220), and can be fixed so that the head (230) is not separated from the upper column (220).

[0050] For example, the head (230) may be formed in the shape of a polyhedron or a sphere. The surface of the head (230) may include a marker (60). One or more markers (60) may be formed on the surface of the head (230). According to one example, if the head (230) is in the shape of a polyhedron, each face of the polyhedron may include at least one marker (60). For example, the marker (60) may be formed as an intaglio pattern or a relief pattern. One or more markers (60) may include different patterns. As an example, the marker (60) may include an Arco marker, a QR code, and / or a barcode. As an example, the head (230) may include one or more fiducial markers (or position markers) that can easily extract position information and / or angle information of the head (230). The reference marker may include an Arco marker.

[0051] For example, a calibration device (200) may be included in a calibration system. The calibration system may include a robot and may perform calibration operations on the position and / or orientation of a sensor included in the robot. As an example, the robot may include a gripper, and a sensor (e.g., a tactile sensor) may be located on the gripper. The robot may use the gripper to grip the head (230). When the robot controls the gripper to grip (or, grasp, hold) the head (230), the gripper may come into contact with the surface of the head (230). The tactile sensor included in the gripper may detect a marker located on the surface of the head (230). The calibration system may calibrate the position information and / or orientation information of the sensor based on the shape of the detected marker, the position of the gripper, and the position information of the head (230).

[0052] FIGS. 5A and 5B are drawings showing the head and column of a calibration device according to various embodiments.

[0053] Referring to FIGS. 5a and 5b, the head (230) can be slide-fitted to the upper column (220) and joined to the upper column (220). As an example, the cross-section of the main groove (13) of the head (230) can be formed in the shape of a circle, an ellipse, a D-cut, or a polygon. If the cross-section of the main groove (13) of the head (230) is formed in the shape of a D-cut, the cross-section of the upper column (220) can also be formed in the shape of a D-cut. The cross-section of the main groove (13) of the head (230) and the cross-section of the upper column (220) can be formed in substantially the same shape (or a corresponding shape).

[0054] As an example, the head (230) may be formed in the shape of a polyhedron or a sphere. The surface of the head (230) may include a marker (61). The head (230) may include one or more markers (61). The markers (61) may be formed on the surface of the head (230). According to one example, if the head (230) is in the shape of a polyhedron, each face of the polyhedron may include at least one marker (61). According to one example, as shown in FIG. 5a, four markers may be formed on the first face (1) of the head (230). For example, the markers (61) may be formed as an intaglio pattern or a relief pattern. One or more markers (61) may include different patterns. As an example, the markers (61) may include an Arco marker, a QR code, and / or a barcode.

[0055] As an example, the head (230) may include a through hole (15) into which a fastening pin is inserted. The through hole (15) may be formed on one side of the head (230). The through hole (15) may be formed by penetrating from the outside of one side of the head (230) to the main groove (13). The upper column (220) may include a fastening groove (11) into which a fastening pin is inserted. When the head (230) is coupled to the upper column (220), the through hole (15) of the head (230) and the fastening groove (11) of the upper column (220) may be located on the same axis. According to one example, when a slide-fit operation is not required, the upper column (220) and the head (230) may be fixed. The fastening pin is inserted into the through hole (15) of the head (230) and the fastening groove (11) of the upper column (220), and can be fixed so that the head (230) is not separated from the upper column (220).

[0056] FIGS. 6A, FIGS. 6B, and FIGS. 6C are drawings showing heads according to various embodiments.

[0057] Referring to FIG. 6a, the head (230a) may be formed in the shape of a sphere. The surface (3) of the head (230a) may include markers (63). One or more markers (63) may be formed on the surface (3) of the head (230). According to one example, when the head (230a) is in the shape of a sphere, the multiple markers (63) may be placed at a certain distance and direction. According to one example, the multiple markers (63) may be placed at any position. One or more markers (63) may be formed as an intaglio pattern or a relief pattern. One or more markers (63) may include different patterns.

[0058] Referring to FIG. 6b, the head (230b) may be formed in the shape of a polyhedron. According to one example, the head (230b) may be formed in the shape of a regular dodecahedron, but is not limited thereto. The surface of the head (230b) may include markers (65). One or more markers (65) may be formed on the surface of the head (230b). If the head (230b) is in the shape of a polyhedron, each face of the polyhedron may include at least one marker (65). According to one example, one marker (65) may be formed on one face (5) of the head (230b), but is not limited thereto. As an example, a different number of markers may be formed on each face of the head (230b). One or more markers (65) may be formed in an intaglio pattern or a relief pattern. One or more markers (65) may include different patterns.

[0059] Referring to FIG. 6c, as an example, the head (230c) may be formed in the shape of a hexagonal prism, but is not limited thereto. The surface of the head (230c) may include markers (67a, 67b, 67c, 67d). One or more markers (67a, 67b, 67c, 67d) may be formed on the surface of the head (230c). If the head (230c) is in the shape of a polyhedron, each face of the polyhedron may include at least one marker (67a, 67b, 67c, 67d). According to one example, a plurality of markers (67a, 67b, 67c, 67d), including a first marker (67a), a second marker (67b), a third marker (67c), and a fourth marker (67d), may be formed on one side (7) of the head (230c), but is not limited thereto. As an example, a different number of markers may be formed on each side of the head (230c). One or more of the markers (65) may be formed as an intaglio pattern or a relief pattern. One or more of the markers (65) may include different patterns.

[0060] FIG. 7 is a block diagram illustrating the configuration of a robot according to various embodiments.

[0061] For example, the calibration system may include a calibration device (200) and a robot (300). Referring to FIG. 7, the robot (300) may include a sensor (310), a memory (320), and a processor (330).

[0062] The sensor (310) (e.g., the sensor module (176) of FIG. 1) may include a tactile sensor. The sensor (310) including the tactile sensor may be located on the inner surface of the gripper of the robot (300). When the gripper grips the head (230) of the calibration device (200), the sensor (310) (e.g., the tactile sensor) may come into contact with a marker formed on the surface of the head (230). When the sensor (310) comes into contact with the marker, the sensor (310) may acquire image information of the marker.

[0063] As an example, the sensor (310) may include a force sensor. For example, the robot (300) may be a multi-joint robot including a plurality of arms. When the robot (300) grips the head (230) of the calibration device (200) using a gripper, potential stress may be generated in the joint (or arm). Potential stress may cause an error in posture information and / or position information. The sensor (310) including a force sensor may acquire force information of the joint (or arm). The processor (330) (e.g., the processor (120) of FIG. 1) may acquire potential stress of the joint based on the acquired force information and perform a calibration operation considering the acquired potential stress.

[0064] As an example, the processor (330) can control a plurality of arms, a plurality of connecting parts (or joint parts) and a gripper to slide-fit the head (230) to the upper column (220). The slide-fit operation can reduce potential stress on the joints of the robot (300).

[0065] For example, the memory (320) (e.g., the memory (130) of FIG. 1) can store data, algorithms, programs, instructions, etc. that perform the functions of the robot (300). Instructions, etc. stored in the memory (320) can be loaded into the processor (330) and executed by the processor (330).

[0066] A processor (330) (e.g., processor (120) of FIG. 1) can control each configuration of the robot (300). The robot (200) may include one or more processors (230). For example, the processor (230) may correspond to multiple processors that collectively perform multiple functions by dividing them among the processors.

[0067] As an example, the processor (330) may grip the head (230) of the calibration device (200) to bring the sensor (310) (e.g., a tactile sensor) into contact with a marker on the surface of the head (230). According to one example, the processor (330) may grip the head (230) multiple times to bring the sensor (310) into contact with different markers among multiple markers multiple times. The processor (330) may acquire image information of different markers using the sensor (310). When the sensor (310) acquires image information of the marker(s), the processor (330) may acquire position information of the marker based on the image information of the marker. The processor (330) may calibrate the robot based on the relationship between the position information of the marker and the pre-set position information of the head. As an example, the processor (330) may calibrate the position information and / or attitude information of the robot.

[0068] As an example, when the sensor (310) comes into contact with a marker, the processor (330) can control the arm of the robot (300) to slide-fit the head (230) of the calibration device (200) onto the upper column (220). When the sensor (310) includes a force sensor and the head (230) slide-fits onto the upper column (220), the processor (330) can obtain force information of the arm (or joint) using the force sensor. The processor (330) can obtain potential stress of the arm based on the force information. The processor (330) can correct the calibration error based on the obtained potential stress.

[0069] For example, if precise calibration is not required, the slide fit operation may be excluded (or skipped). For example, the head (230) may include a through hole (15), and the upper column (220) may include a fastening groove (11). When the head (230) and the upper column (220) are joined, the through hole (15) and the fastening groove (11) may be located on the same axis. A fastening pin may be inserted into the through hole (15) and the fastening groove (11). When the fastening pin is inserted, the head (230) and the upper column (220) may not be separated (or may be fixed). The processor (330) may control the gripper to grip the head (230) excluding the slide fit operation.

[0070] FIG. 8 is a drawing showing a robot according to various embodiments.

[0071] Referring to FIG. 8, the robot (300) may include a plurality of arms (330), a plurality of connecting parts (350), a gripper (340), and a tactile sensor (311).

[0072] According to one example, a plurality of arms (330) may include a first arm (331), a second arm (332), and a third arm (333), and a plurality of connecting parts (or joint parts) (350) may include a first connecting part (351), a second connecting part (352), and a third connecting part (353). For example, each of the plurality of connecting parts (350) may include a motor. According to one example, the first connecting part (351) may connect a base (or support) and the first arm (331). The second connecting part (352) may connect the first arm (331) and the second arm (332). The third connecting part (353) may connect the third arm (333) and a gripper (340). The gripper (340) may grip an object. As an example, the gripper (340) is formed in the shape of a pincer, and the pincer can be closed when grasping an object and opened when releasing an object. A tactile sensor (311) may be located on the inner surface of the gripper (340). The structure of the robot (300) illustrated in FIG. 8 is an example and is not limited thereto.

[0073] FIG. 9 is a drawing illustrating a slide fit operation according to various embodiments.

[0074] Referring to FIG. 9, the robot (300) can grip the head (230) by controlling the gripper (340). The robot (300) can move the head (230) toward the upper column (220) by controlling the gripper (340). The upper column (220) can be formed on one end of the lower column (210). The upper column (220) can be coupled to the main groove (13) of the head (230). The robot (300) can combine the upper column (220) and the head (230) by controlling the gripper (340) to slide the upper column (220) into the main groove (13) of the head (230).

[0075] A tactile sensor (311) may be located inside the gripper (340). For example, when the gripper (340) grips the head (230), the tactile sensor (311) located inside the gripper (340) may come into contact with the surface of the head (230). A marker (69) may be formed on the surface of the head (230). The tactile sensor (311) may come into contact with the marker (69) and generate image information of the marker (69). According to one example, the robot (300) may acquire image information of the marker (69) using the tactile sensor (311) after the connection between the head (230) and the upper column (220) is completed.

[0076] FIG. 10 is a diagram showing sensor data according to various embodiments.

[0077] Referring to FIG. 10, an image obtained from a tactile sensor (311) is shown. When the gripper (340) grips the head (230), the tactile sensor (311) may be located at the part where the gripper (340) contacts the head (230). At least one marker may be formed on the surface of the head (230). For example, the marker may be formed as an intaglio pattern or a relief pattern. As an example, as shown in FIG. 10, when the tactile sensor (311) contacts the marker, the tactile sensor (311) may obtain an image (71) of the marker.

[0078] FIG. 11 is a flowchart illustrating a calibration operation according to various embodiments, and FIG. 12 is a diagram illustrating the relationship between a sensor, a robot, and a calibration device according to various embodiments.

[0079] In the following embodiments, each operation may be performed sequentially, but is not necessarily performed sequentially. For example, the order of each operation may be changed, and at least two operations may be performed in parallel.

[0080] According to one embodiment, 1110 to 1160 may be understood to be performed in a processor (e.g., processor (120) of FIG. 1 or processor (330) of FIG. 7) of a robot (300) (e.g., electronic device (101) of FIG. 1 or robot (300) of FIG. 7).

[0081] Referring to FIGS. 11 and 12, the robot (300) can grasp (or grip) the head (230) of the calibration device (200) and slide the head (230) onto the upper column (220). The robot (300) may include a plurality of arms, a plurality of connecting parts, and a gripper. The plurality of connecting parts may include motors. The robot (300) can control the plurality of connecting parts (or motors) to move the gripper toward the calibration device (200) and control the gripper to grip the head (230) of the calibration device (200). The robot (300) can control the plurality of connecting parts and / or gripper to slide the head (230) onto the upper column (220).

[0082] The robot (300) can store position information of each axis of the robot (300) (1120). For example, the robot (300) can collect position information of each axis while gripping the head (230). The robot (300) can acquire N pieces of data. The robot (300) can grip the head (230), insert the head (230) into the upper column (220) N times, and acquire N pieces of data. Referring to FIG. 12, the position of each axis of the robot (300) is obtained through forward kinematics RobotBase T Flange It can be used when acquiring. For example, a T b is defined as a transformation from the b coordinate to the a coordinate, and is the i-th data a T b It can be. For example, RobotBase T Flangecan be a conversion from Flange coordinates to RobotBase coordinates (or, the Flange position from the RobotBase position). All i, j (1 <= i, j <= N) are It can satisfy [this]. As shown in FIG. 12, RobotBase may be the center point of the robot base, and Flange may be the center point of the third connection.

[0083] The robot (300) can acquire marker information (1130), calculate and store the position of the marker (1140). For example, the robot (300) can acquire marker information using a tactile sensor (311) while gripping the head (230) to collect each axis position information. As an example, the marker information may include information of one or more reference markers and may include image data. For example, the robot (300) can perform image processing operations such as noise filtering, boundary extraction, and / or binarization, and estimate the position of the reference marker. Using the estimated reference marker position, the robot (300) obtains position information of each side (jig side) of the head (230). Sensor T JigSide It can be obtained. As shown in FIG. 12, the Sensor may be the center point of the part where the tactile sensor (311) is located, and the Jig side may be the center point of one side of the head (230).

[0084] The robot (300) can determine whether the information of the acquired marker is greater than or equal to a preset number (1150). For example, the preset number may be N. If the information of the acquired marker is less than the preset number (1150-No), the robot (300) can repeat the operation of gripping and sliding fit of the head (230) and the operation of calculating and saving the position of the marker (1140).

[0085] If the information of the acquired markers is greater than or equal to a preset number (1150-Yes), the robot (300) can perform a calibration operation (1160). For example, information collected from each face of the head (230) can be used to acquire position information of any point whose positional relationship with each face is known. As an example, any point may be the jig center of the head (230).

[0086] The robot (300) can be defined as in Equation (1) using collected information.

[0087] ----- (1)

[0088] The robot (300) can perform calibration operations using the equations AX = XB and AX = YB to obtain the collected positional relationship and relative attitude relationship. For example, A and B are known values, and X and Y may be values ​​obtained through optimization.

[0089] X = Flange T Sensor If so, AX = XB can be rearranged as in Equation (2).

[0090] ----- (2)

[0091] X = Flange T Sensor , Y = Robotbase T Jigcenter If so, AX = YB can be rearranged as in Equation (3).

[0092] ----- (3)

[0093] FIG. 13 is a diagram comparing calibration results according to various embodiments.

[0094] Referring to FIG. 13, the results of comparing the calibration method of this document with related technology are illustrated. For example, the related technology may be a method using computer-aided design (CAD) nominal values. The results of FIG. 13 may be the results of comparing the pose estimation error of the sensor (310) for the robot (300). According to the calibration method of this document, the translation error was reduced by about 92%, and the rotation error was reduced by about 36%.

[0095] When a robot grasps an object using a tactile sensor mounted on a gripper, this patent calculates the relative posture between the in-hand object and the robot. That is, the robot can perceive the position and angle of the object relative to the robot. Using this, the robot can perform tasks such as assembling or inserting objects. The in-hand posture of the grasped object relative to the robot is essential information when handling flexible materials and small materials.

[0096] The calibration device and system of this document can perform precise and easy calibration operations of the robot (300).

[0097] The effects of the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by a person skilled in the art from the description below.

[0098] According to one example, the calibration device (200) may include a lower column (210), an upper column (220) formed on one surface parallel to the short axis direction of the lower column (210), and a head (230) that includes a marker on the surface and a first groove on one surface and is coupled to the upper column through the first groove.

[0099] According to one example, the head (230) may include the shape of a polyhedron or the shape of a sphere.

[0100] According to one example, the head (230) may include a plurality of markers. If the shape of the head (230) is a polyhedron, the head (230) may include at least one of the plurality of markers on at least two of the plurality of faces of the polyhedron.

[0101] According to one example, the marker may include an intaglio pattern or a relief pattern.

[0102] According to one example, the marker may include a fiducial marker comprising at least one of an arco marker, a QR code, and a barcode.

[0103] According to one example, the upper column (220) may be formed with a D-cut cross-section.

[0104] According to one example, the upper column (220) may be formed with a cross-sectional area smaller than that of the lower column (210).

[0105] According to one example, the head (230) may include a through hole. The upper column (220) may include a second groove. The calibration device (200) may further include a fastening pin inserted into the through hole and the second groove to secure the head (230) to the upper column (220).

[0106] According to one example, the head (230) can be joined such that the first groove slides to the upper column (220).

[0107] According to one example, the calibration system may include a robot (300) and a calibration device (200). The calibration device (200) may include a lower column (210), an upper column (220) formed on one surface parallel to the short axis direction of the lower column (210), and a head (230) that includes a marker on the surface and a first groove on one surface, and is coupled to the upper column through the first groove.

[0108] According to one example, the head (230) may include the shape of a polyhedron or the shape of a sphere.

[0109] According to one example, the head (230) may include a plurality of markers. If the shape of the head is a polyhedron, the head (230) may include at least one of the plurality of markers on at least two of the plurality of faces of the polyhedron.

[0110] According to one example, the marker may include an intaglio pattern or a relief pattern.

[0111] According to one example, the marker may include a fiducial marker comprising at least one of an arco marker, a QR code, and a barcode.

[0112] According to one example, the upper column (220) may be formed with a D-cut cross-section.

[0113] According to one example, the upper column (220) may be formed with a cross-sectional area smaller than that of the lower column (210).

[0114] According to one example, the head (230) may include a through hole. The upper column (210) may include a second groove. The calibration device (200) may further include a fastening pin inserted into the through hole and the second groove to secure the head (230) to the upper column (220).

[0115] According to one example, the robot (300) may include an arm (330), a gripper (340) located on one side of the arm (330) and gripping an object, a tactile sensor (311) located on the inner surface of the gripper (340), at least one processor (330) including a processing circuit, and a memory (320) that stores commands executed individually or collectively by the at least one processor. The commands stored in the memory (320) may be set to control the gripper (340) so that the robot (300) grips the head (230) so that the tactile sensor (311) comes into contact with the marker. The commands may be set to allow the robot (300) to obtain image information of the marker using the tactile sensor (311). The commands may be set to allow the robot (300) to obtain position information of the marker based on the image information of the marker. The above command can be configured to cause the robot (300) to calibrate the robot (300) based on the relationship between the position information of the marker and the pre-set position information of the head (230).

[0116] According to one example, the command may be configured to cause the robot (300) to control the gripper (340) multiple times so that the tactile sensor (311) comes into contact with different markers among the plurality of markers.

[0117] According to one example, the command may be configured to cause the robot (300) to acquire image information of the different markers using the tactile sensor (311). The command may be configured to cause the robot (300) to acquire position information of the different markers based on the image information of the different markers. The command may be configured to cause the robot (300) to calibrate the robot (300) based on the relationship between the position information of the different markers and the pre-set position information of the head (230).

[0118] According to one example, the robot (300) may further include a force sensor. The command may be set to control the arm (330) so that the head (230) slides into the upper column (220). The command may be set to obtain force information of the arm (330) using the force sensor when the head (230) slides into the upper column (220). The command may be set to obtain potential stress of the arm (330) based on the force information of the arm (330). The command may be set to correct the error of the calibration based on the obtained potential stress.

[0119] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationally,” it means that said component may be connected to said other component directly (e.g., wired), wirelessly, or through a third component.

[0120] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0121] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0122] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0123] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0124] The effects of this document are not limited to those mentioned above, and other unmentioned effects will be clearly understood by a person skilled in the art from the description above.

Claims

1. In a calibration device, Lower column; An upper column formed on one surface parallel to the short axis direction of the lower column; and A calibration device comprising: a head having a marker on its surface, a first groove on one surface, and coupled to the upper column through the first groove.

2. In Paragraph 1, The above head is, A calibration device including the shape of a polyhedron or a sphere.

3. In Paragraph 2, The above head is, Includes multiple markers, A calibration device comprising at least one marker among the plurality of markers on at least two of the plurality of faces of the polyhedron, wherein the shape of the head is the polyhedron.

4. In Paragraph 1, The above marker is, Calibration device including an intaglio pattern or a relief pattern.

5. In Paragraph 1, The above marker is, A calibration device comprising a fiducial marker including at least one of an Arco marker, a QR code, and a barcode.

6. In Paragraph 1, The upper column mentioned above is, Calibration device formed with a D-cut cross-section.

7. In Paragraph 1, The upper column mentioned above is, A calibration device formed with a cross-sectional area smaller than the cross-sectional area of ​​the lower column above.

8. In Paragraph 1, The above head includes a through hole, and The above upper column includes a second groove, and A calibration device further comprising a fastening pin inserted into the through hole and the second groove to fix the head to the upper column.

9. In Paragraph 1, The above head is, A calibration device in which the first groove is slide-fitted to the upper column.

10. In a calibration system, robots; and A calibration device; including, The above calibration device is, Lower column; An upper column formed on one surface parallel to the short axis direction of the lower column; and A calibration system comprising a head that includes a marker on a surface, a first groove on one surface, and is coupled to an upper column through the first groove.

11. In Paragraph 10, The above head is, A calibration system including the shape of a polyhedron or a sphere.

12. In Paragraph 11, The above head is, Includes multiple markers, A calibration system comprising at least one marker among the plurality of markers on at least two of the plurality of faces of the polyhedron, wherein the shape of the head is the polyhedron.

13. In Paragraph 10, The above marker is, A calibration system including an intaglio pattern or a relief pattern.

14. In Paragraph 10, The above marker is, A calibration system comprising a fiducial marker including at least one of an Arco marker, a QR code, and a barcode.

15. In Paragraph 10, The upper column mentioned above is, Calibration system formed with a D-cut cross-section.

Images