Aerosol-generating device including plurality of circuit boards

Abstract

According to an embodiment, an aerosol-generating device includes: a first circuit board on which a power source and a processor are mounted; a second circuit board which is spaced apart from the first circuit board and on which an RF signal generation circuit for generating an RF signal by using power supplied from the power source, and at least one amplifier for amplifying the generated RF signal are mounted; and a radiator which heats an aerosol-generating article by radiating the amplified RF signal in the form of an electromagnetic wave to an insertion space into which the aerosol-generating article is inserted, wherein the processor may be configured to control the RF signal generation circuit and the at least one amplifier.

Description

Aerosol generating device including multiple circuit boards

[0001] The invention relates to an aerosol generating device comprising a plurality of circuit boards.

[0002] There is increasing demand for aerosol generating devices that generate aerosols by a non-combustion method, replacing the method of generating aerosols by burning cigarettes. An aerosol generating device is a device that performs the function of, for example, generating aerosols from an aerosol generating material by a non-combustion method and supplying them to a user, or generating aerosols with flavor by passing vapor generated from an aerosol generating material through a flavor medium.

[0003] Aerosol generation devices can heat aerosol-generating materials using various methods, such as resistance heating, induction heating, and ultrasonic transducer-based heating. In addition to the aforementioned methods, research is also being conducted on aerosol generation devices capable of heating aerosol-generating materials using the principle of dielectric heating. However, implementing dielectric heating requires new circuit elements that were not included in existing aerosol generation devices, and a technology for distributing and / or arranging these new circuit elements in an appropriate manner within at least one circuit board may be required.

[0004] Various embodiments of the present disclosure relate to an aerosol generating device comprising a plurality of circuit boards. Since the circuit elements differ in their respective operating conditions and / or operating characteristics, the type of circuit board suitable for each circuit element may differ. Additionally, since circuit elements mounted on the same circuit board may influence each other, a preferred arrangement considering their respective operating conditions and / or operating characteristics may be required. Various embodiments may provide a technique for distributing and / or arranging circuit elements for implementing dielectric heating in an appropriate manner within at least one circuit board.

[0005] The problems to be solved by the embodiments of the present disclosure are not limited to those described above, and problems not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

[0006] An aerosol generating device according to one embodiment comprises: a power source; a first circuit board on which a processor is mounted; a second circuit board spaced apart from the first circuit board and having an RF signal generating circuit for generating an RF (radio frequency) signal using power supplied from the power source, and at least one amplifier for amplifying the generated RF signal mounted thereon; and a radiating unit for heating the aerosol generating article by radiating the amplified RF signal in the form of an electromagnetic wave into an insertion space into which the aerosol generating article is inserted, wherein the processor may be configured to control the RF signal generating circuit and the at least one amplifier.

[0007] An aerosol generating device according to another embodiment comprises: a power source; a processor; a first circuit board on which an RF signal generating circuit for generating an RF (Radio Frequency) signal using power supplied from the power source is mounted; a second circuit board mounted directly on the surface of the first circuit board and on which at least one amplifier for amplifying the generated RF signal is mounted; and a radiating unit for heating the aerosol generating article by radiating the amplified RF signal in the form of electromagnetic waves into an insertion space into which the aerosol generating article is inserted, wherein the processor is configured to control the RF signal generating circuit and the at least one amplifier, and the dielectric constant of the second circuit board may be lower than the dielectric constant of the first circuit board.

[0008] An aerosol generating device according to various embodiments of the present disclosure may each include a circuit board on which circuit elements for controlling the overall operation of the aerosol generating device are mounted, and a circuit board on which circuit elements for generating and / or amplifying RF signals are mounted. In other words, by classifying circuit elements by function and mounting them on different circuit boards, the aerosol generating device can appropriately distribute circuit elements corresponding to each function to circuit boards that are more suitable for implementing each function. Additionally, circuit elements mounted within the same circuit board may be arranged in an appropriate manner considering their respective operating conditions and / or operating characteristics. Accordingly, stable operation of circuit elements implementing dielectric heating can be ensured.

[0009] An aerosol generating device according to various embodiments of the present disclosure may include circuit elements for generating and / or amplifying RF signals in addition to circuit elements for controlling the overall operation of the aerosol generating device. Since the circuit elements for amplifying RF signals process high-frequency and / or high-power signals, it may be desirable to mount them on a circuit board made of a material optimized for high-frequency and high-speed signal transmission. However, since circuit boards made of materials optimized for high-frequency and high-speed signal transmission are more expensive than general circuit boards, mounting all circuit elements on such a circuit board may be inefficient. The aerosol generating device according to the present disclosure can ensure the normal operation of each circuit element without significantly increasing manufacturing costs by classifying circuit elements according to operating conditions and / or operating characteristics and mounting them on different circuit boards.

[0010] In addition, the aerosol generating device according to the present disclosure can achieve mass production and low cost through an automated assembly process, along with miniaturization of the entire circuit board portion, by directly mounting another circuit board on the surface of one circuit board using Surface Mount Technology (SMT).

[0011] In addition, circuit elements mounted on the same circuit board can be arranged in an appropriate manner considering their respective operating conditions and / or operating characteristics. Accordingly, stable operation of the circuit elements implementing dielectric heating can be ensured.

[0012] The effects of the embodiments are not limited to the effects described above, and unmentioned effects will be clearly understood by those skilled in the art from this specification and the accompanying drawings.

[0013] FIG. 1 is a block diagram of an aerosol generating device according to one embodiment.

[0014] FIG. 2 is a schematic cross-sectional view of an aerosol generating device according to one embodiment.

[0015] FIG. 3 is a drawing showing one side of a first circuit board according to one embodiment.

[0016] FIG. 4 is a drawing illustrating a ground layer of a first circuit board according to one embodiment.

[0017] FIG. 5 is a drawing showing one side of a second circuit board according to one embodiment.

[0018] FIG. 6 is a drawing illustrating a ground layer of a second circuit board according to one embodiment.

[0019] FIG. 7 is a drawing for illustrating a preferred arrangement of a directional coupler according to one embodiment.

[0020] FIG. 8 is a schematic cross-sectional view of an aerosol generating device according to another embodiment.

[0021] FIG. 9 is a drawing showing one side of a first circuit board and a second circuit board according to one embodiment.

[0022] FIG. 10 is a drawing illustrating a ground layer of a first circuit board according to one embodiment.

[0023] FIG. 11 is a drawing illustrating a ground layer of a second circuit board according to one embodiment.

[0024] FIG. 12 is a drawing for explaining a shielding part according to one embodiment.

[0025] An aerosol generating device according to one embodiment comprises: a power source; a first circuit board on which a processor is mounted; a second circuit board spaced apart from the first circuit board and having an RF signal generating circuit for generating an RF (radio frequency) signal using power supplied from the power source, and at least one amplifier for amplifying the generated RF signal mounted thereon; and a radiating unit for heating the aerosol generating article by radiating the amplified RF signal in the form of an electromagnetic wave into an insertion space into which the aerosol generating article is inserted, wherein the processor may be configured to control the RF signal generating circuit and the at least one amplifier.

[0026] In one embodiment, the first region in which the RF signal generation circuit is mounted and the second region in which the at least one amplifier is mounted within the second circuit board may be physically separated.

[0027] In one embodiment, the RF signal generating circuit and the at least one amplifier may be positioned close to two edges or corners that face each other with respect to the center of the second circuit board among the edges or corners of the second circuit board.

[0028] In one embodiment, the second circuit board includes a first ground connected to the RF signal generating circuit and a second ground disposed separately from the first ground and connected to the at least one amplifier, and the first ground and the second ground may be electrically connected at a single point by a noise reduction element.

[0029] The above noise reduction element may include at least one of a zero-ohm resistor and a bead.

[0030] In the case where the second circuit board is a multilayer circuit board including at least one ground layer inside, the first ground and the second ground may each be disposed in physically separated regions within the at least one ground layer.

[0031] In one embodiment, the at least one amplifier may include a driving amplifier for amplifying the level of the generated RF signal and a power amplifier for amplifying the power of the RF signal received from the driving amplifier.

[0032] The above aerosol generating device further includes a temperature sensing circuit mounted on the second circuit board, and the temperature sensing circuit may be positioned adjacent to the power amplifier.

[0033] The processor may stop the operation of at least one of the RF signal generation circuit and at least one amplifier in response to the determination that the temperature measured by the temperature sensing circuit exceeds a preset threshold.

[0034] In one embodiment, the aerosol generating device may further include a heat dissipation unit for effectively releasing or dispersing heat generated from the second circuit board to minimize the transfer of heat generated from the second circuit board to the power source.

[0035] The second circuit board is positioned so as not to overlap with the power source in any of the left-right, front-back, and up-down directions, and the heat dissipation portion may be positioned in contact with or adjacent to at least one surface of the second circuit board.

[0036] In one embodiment, the aerosol generating device may further include a directional coupler that separates and receives the amplified RF signal and the reflected electromagnetic wave that is radiated by the radiating unit and reflected from the insertion space.

[0037] The directional coupler and the at least one amplifier may be positioned near each of the two edges or corners of the second circuit board that face each other with respect to the center of the second circuit board.

[0038] The directional coupler and the at least one amplifier may be placed on different sides of the second circuit board.

[0039] In one embodiment, the aerosol generating device is mounted on the first circuit board and further includes at least one power conversion circuit for converting power supplied from the power source into power suitable for each of the processor, the RF signal generating circuit, and the at least one amplifier, and within the first circuit board, an area where a digital circuit including the processor is mounted and an area where an analog circuit including the at least one power conversion circuit is mounted can be electrically and physically separated.

[0040] An aerosol generating device according to another embodiment comprises: a power source; a processor; a first circuit board on which an RF signal generating circuit for generating an RF (Radio Frequency) signal using power supplied from the power source is mounted; a second circuit board mounted directly on the surface of the first circuit board and on which at least one amplifier for amplifying the generated RF signal is mounted; and a radiating unit for heating the aerosol generating article by radiating the amplified RF signal in the form of electromagnetic waves into an insertion space into which the aerosol generating article is inserted, wherein the processor is configured to control the RF signal generating circuit and the at least one amplifier, and the dielectric constant of the second circuit board may be lower than the dielectric constant of the first circuit board.

[0041] In one embodiment, the power source and the first circuit board are arranged parallel to each other, the first circuit board includes a portion extending beyond one end of the power source, and the second circuit board can be mounted on the surface of the extended portion.

[0042] In one embodiment, the second circuit board may be mounted on the side of the first circuit board that does not face the power source.

[0043] In one embodiment, the aerosol generating device may further include a heat dissipation unit for effectively releasing or dispersing heat generated from the second circuit board to minimize the transfer of heat generated from the second circuit board to the power source.

[0044] The second circuit board is positioned so as not to overlap with the power source in any of the left-right, front-back, and up-down directions, and the heat dissipation portion may be positioned in contact with or adjacent to at least one surface of the second circuit board.

[0045] In one embodiment, the aerosol generating device is mounted on the first circuit board and further includes at least one power conversion circuit for converting power supplied from the power source into power suitable for each of the processor, the RF signal generating circuit, and the at least one amplifier, and the first region in which the processor and the RF signal generating circuit are mounted and the second region in which the at least one power conversion circuit is mounted within the first circuit board can be physically separated.

[0046] The first circuit board includes a first ground connected to the processor and the RF signal generation circuit, and a second ground disposed separately from the first ground and connected to the at least one power conversion circuit, and the first ground and the second ground can be electrically connected at a single point by a noise reduction element.

[0047] The above noise reduction element may include at least one of a zero-ohm resistor and a bead.

[0048] In the case where the first circuit board is a multilayer circuit board including at least one ground layer inside, the first ground and the second ground may each be disposed in physically separated regions within the at least one ground layer.

[0049] The second circuit board further includes a third ground connected to the at least one amplifier, and the third ground is directly connected to the second ground but can be connected to the first ground through the noise reduction element.

[0050] The aerosol generating device further includes a shielding part disposed to surround the at least one amplifier on the second circuit board, and the shielding part may be connected to the third ground.

[0051] In one embodiment, the at least one amplifier may include a driving amplifier for amplifying the level of the generated RF signal and a power amplifier for amplifying the power of the RF signal received from the driving amplifier.

[0052] The above aerosol generating device further includes a temperature sensing circuit mounted on the second circuit board, and the temperature sensing circuit may be positioned adjacent to the power amplifier.

[0053] The processor may stop the operation of at least one of the RF signal generation circuit and at least one amplifier in response to the determination that the temperature measured by the temperature sensing circuit exceeds a preset threshold.

[0054] In one embodiment, the aerosol generating device further includes a directional coupler that separates and receives the amplified RF signal and the reflected electromagnetic wave that is radiated by the radiating unit and reflected from the insertion space, respectively, and the directional coupler and the at least one amplifier may be positioned close to two edges or corners of the second circuit board that are opposite each other with respect to the center of the second circuit board.

[0055] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components are assigned the same reference numeral regardless of the drawing symbols, and redundant descriptions thereof will be omitted. In relation to the description of the drawings, similar drawing symbols may be used for similar or related components.

[0056] The suffixes "module" and "unit" for components used in the following description are assigned or used interchangeably solely for the sake of ease of drafting the specification, and do not inherently possess distinct meanings or roles. Meanwhile, the suffixes "module" or "unit" may include units implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. "Module" or "unit" may be a component formed as a whole, or the smallest unit of said component or a part thereof that performs one or more functions. For example, "module" or "unit" may be implemented in the form of an application-specific integrated circuit (ASIC).

[0057] In addition, when describing the embodiments disclosed in this specification, if it is determined that a detailed description of related prior art may obscure the essence of the embodiments disclosed in this specification, such detailed description is omitted. Furthermore, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings; it should be understood that the drawings include all modifications, equivalents, and substitutions that fall within the concept and technical scope of this disclosure.

[0058] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0059] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.

[0060] A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0061] Embodiments of the present disclosure may be implemented as software comprising one or more instructions stored in a storage medium (e.g., memory) that is readable by a machine (e.g., aerosol generating device (1)). For example, a processor (e.g., processor (170)) of the machine (e.g., aerosol generating device (1)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0062] FIG. 1 is a block diagram of an aerosol generating device (1) according to one embodiment.

[0063] According to one embodiment, an aerosol generating device (1) may include a control unit (10), a source unit (20), and a radiating unit (30). The control unit (10) may refer to a circuit for controlling the basic operation of the aerosol generating device (1). The source unit (20) may refer to a circuit for generating an RF (Radio Frequency) signal under the control of the control unit (10). The radiating unit (30) may be a device for radiating the RF signal generated by the source unit (20) in the form of an electromagnetic wave into a space (hereinafter, insertion space) into which an aerosol generating article is inserted. The charges or ions of a dielectric (e.g., glycerin) contained in the aerosol generating article may vibrate or rotate due to the radiated electromagnetic wave (e.g., RF signal), and the aerosol generating article may be heated as the dielectric heats up due to the frictional heat generated during the process of the charges or ions vibrating or rotating. In other words, the aerosol generating device (1) may be a device that generates aerosol by heating an aerosol generating article using a dielectric heating method.

[0064] In one example, the control unit (10) may include a power connector (110), a charging circuit (120), a power source (130), a first power converter (140), a second power converter (150), a third power converter (160) and / or a processor (170). Additionally, the source unit (20) may include an RF signal generation circuit (210), a drive amplifier (220), a power amplifier (230), a directional coupler (240) and / or a temperature sensing circuit (250). However, it will be understood by those skilled in the art related to this embodiment that, depending on the design of the aerosol generating device (1), some of the components shown in FIG. 1 may be omitted or new components may be added.

[0065] The power connector (110) may refer to a physical connection device used to transmit and receive power by being electrically connected to an electronic device or system (e.g., an external power source) outside the aerosol generating device (1). For example, the power connector (110) may receive power from an external power source and transmit the received power to a component that requires charging (e.g., a power source (130)). The power connector (110) may also provide a path for data transmission. In this case, the power connector (110) may be referred to as a data and power connector. The aerosol generating device (1) may transmit and receive data to and from an external electronic device or system (e.g., a smartphone, a computer, etc.) through the power connector (110). The power connector (110) may include a USB (Universal Serial Bus) power connector, a DC (Direct Current) power connector, etc. In one example, the power connector (110) may be a USB-C type connector capable of supplying a 9V DC voltage with a current of 1A, but is not necessarily limited thereto. The power connector (110) may also include an interface for wirelessly transmitting and receiving power.

[0066] The charging circuit (120) may refer to a circuit for charging the power source (130). The charging circuit (120) may charge the power source (130) using power delivered from the power connector (110). In one example, the charging circuit (120) may be implemented as a charger IC, which is an integrated circuit (IC) that performs functions for efficiently and safely charging the power source (130). The charging circuit (120) may monitor the charging status of the power source (130) or optimize the charging process by monitoring the voltage, current, and / or temperature of the power source (130). For example, the charging circuit (120) may detect the state of the power source (130) and prevent overcharging or over-discharging by providing an appropriate charging voltage and current.

[0067] The power source (130) can supply power for the operation of the aerosol generating device (1). The power source (130) may include one or more rechargeable batteries. The power source (130) can supply power to the radiating unit (30) so that the radiating unit (30) can radiate electromagnetic waves (e.g., RF signals) into the insertion space to heat the aerosol generating article. Here, power supply to the radiating unit (30) may have the same meaning as power supply to the source unit (20). Additionally, the power source (130) can supply power required for the operation of the processor (170), RF signal generating circuit (210), driving amplifier (220), power amplifier (230), temperature sensing circuit (250), etc. In one example, the power source (130) may be a lithium polymer (LiPoly) battery, but is not limited thereto. The power source (130) may be a replaceable type (detachable) battery (hereinafter, removable battery). The removable battery may be mounted in a battery housing provided within the aerosol generating device (1) or removed from the battery housing. The removable battery may be charged via wired and / or wireless connections.

[0068] The aerosol generating device (1) may include a power conversion circuit for converting power supplied from a power source (130) into power (e.g., voltage and / or current) suitable for other components. The power conversion circuit may include at least one of a buck converter, a buck-boost converter, a boost converter, a Zener diode, and a low-dropout regulator. Additionally, the power conversion circuit may include a DC / AC converter (e.g., an inverter) as needed.

[0069] In one example, the aerosol generating device (1) may include a first power converter (140), a second power converter (150), and a third power converter (160). The first power converter (140) is an LDO regulator for supplying power (e.g., DC 3.3V) suitable for a processor (170), the second power converter (150) is a buck-boost converter for supplying power (e.g., DC 5V) suitable for a temperature sensing circuit (250), an RF signal generating circuit (210), and a driving amplifier (220), and the third power converter (160) may be a boost converter for supplying power (e.g., DC 12V / 25W) suitable for a power amplifier (230).

[0070] However, the first power converter (140), the second power converter (150), and the third power converter (160) are not limited to the examples described above and may include other types of power converter circuits. Additionally, although FIG. 1 is illustrated as having three power converters, the aerosol generating device (1) may include more than three power converters or fewer power converters. In one example, at least some of the first power converter (140), the second power converter (150), and the third power converter (160) may be integrated into a single power converter.

[0071] The processor (170) can control the overall operation of the aerosol generating device (1). For example, the processor (170) can directly or indirectly control the charging and discharging of the power supply (130) using the charging circuit (120). Additionally, the processor (170) can control the voltage and / or current output by the power conversion circuit by adjusting the frequency and / or duty ratio of the current pulse input to at least one switching element of the power conversion circuit. In addition to the components described above, the processor (170) can control the overall operation of other components to be described later.

[0072] The processor (170) may be implemented as an array of multiple logic gates, or as a combination of a general-purpose MCU (micro controller unit) (or microprocessor) and memory storing a program that can be executed on such MCU. Additionally, it will be understood by those skilled in the art to which this embodiment belongs that the processor (170) may be implemented in other forms of hardware.

[0073] The RF signal generation circuit (210) can generate an RF signal based on power delivered from the power supply (130) or the second power converter (150). The RF signal may mean a signal having a frequency within the range of 300 MHz to 300 GHz. In one example, the RF signal may have a frequency of 1 GHz to 100 GHz. Additionally, the RF signal may have a frequency in the Industrial Scientific and Medical Equipment (ISM) band, for example, 915 MHz, 2.45 GHz, and / or 5.8 GHz.

[0074] The RF signal generation circuit (210) may include a Voltage Controlled Oscillator (VCO) that generates an RF signal having a different frequency depending on the input voltage. The RF signal generation circuit (210) may receive a control signal (e.g., a DC signal) from the processor (170) and generate an RF signal having a frequency corresponding to the received control signal. The processor (170) may store the control signal corresponding to the desired frequency in the form of a look-up table, or calculate the control signal corresponding to the desired frequency in real time through at least one operation.

[0075] In one example, the aerosol generating device (1) may further include a digital-to-analog converter for converting a digital control signal output from a processor (170) into an analog control signal. An RF signal generating circuit (210) may receive an analog control signal and generate an RF signal having a frequency corresponding to the received analog control signal.

[0076] The driving amplifier (220) can amplify the RF signal generated by the RF signal generation circuit (210). For example, the driving amplifier (220) can provide an input signal suitable for the next stage component (e.g., power amplifier (230)) by amplifying the signal level (e.g., amplitude) of the RF signal. The driving amplifier (220) can minimize signal distortion by maintaining high linearity. However, since the driving amplifier (220) is an amplifier focused on raising the signal level, it can provide relatively low output power.

[0077] The power amplifier (230) can amplify the power of the RF signal received from the driving amplifier (220). The power amplifier (230) may be an amplifier focused on providing sufficient power to the final output device (e.g., the radiator (30)). For example, the power amplifier (230) may provide a high-power RF signal to the radiator (30) so that the radiator (30) can radiate electromagnetic waves into the insertion space to heat the aerosol generating article. The power amplifier (230) may perform the amplification operation using power received through a third power converter (160) that provides higher power and / or voltage than the second power converter (150).

[0078] The driving amplifier (220) and the power amplifier (230) may include transistors such as a bipolar junction transistor (BJT) or a field effect transistor (FET), or vacuum tubes. In one example, the driving amplifier (220) and the power amplifier (230) may be GaN (Gallium Nitride) transistors capable of handling high efficiency, high speed, and high voltage, but are not necessarily limited thereto. The driving amplifier (220) and the power amplifier (230) may also include an operational amplifier.

[0079] Meanwhile, in FIG. 1, the driving amplifier (220) and the power amplifier (230) are shown as separate amplifiers, but the driving amplifier (220) and the power amplifier (230) can be integrated into a single amplifier. Additionally, the driving amplifier (220) and / or the power amplifier (230) may be configured as a series connection, a parallel connection, and / or a combination thereof of a plurality of amplifiers.

[0080] The radiating member (30) may include at least one antenna for radiating electromagnetic waves into space. The at least one antenna may have a size and shape suitable for the size and shape of the aerosol generating article. For example, if the aerosol generating article is cylindrical, the at least one antenna may be tubular, surrounding the cylindrical aerosol generating article. Here, the fact that the shape of the antenna is tubular may mean that the overall shape of the antenna is tubular. In other words, if the antenna is formed from a metal (e.g., SUS) track, it may mean that the overall shape of the entire track is tubular. The shape of the at least one antenna is not limited to the examples described above and may include various shapes such as a flat plate shape, a curved plate shape, etc.

[0081] The radiating unit (30) can heat an aerosol generating article by radiating electromagnetic waves (e.g., amplified RF signal or transmitted RF signal) into the insertion space. In order for the heating efficiency of the aerosol generating article to be maximized, resonance of the electromagnetic waves must occur within the insertion space. The resonance condition of the insertion space (e.g., resonance frequency) may vary depending on the amount of dielectric material contained in the inserted aerosol generating article, etc. The processor (170) can control the frequency of the RF signal generated by the RF signal generating circuit (210) so that it corresponds to or approaches the resonance condition of the insertion space by adjusting the control signal input to the RF signal generating circuit (210). The processor (170) may use a directional coupler (240) to obtain information about the resonance condition of the insertion space.

[0082] The directional coupler (240) may refer to a passive element having a waveguide structure capable of separating incident waves and reflected waves. The directional coupler (240) can receive an RF signal transmitted from the power amplifier (230) toward the radiating unit (30) and an electromagnetic wave reflected from the insertion space after being radiated by the radiating unit (30), respectively. The directional coupler (240) can separate the transmitted RF signal and the reflected electromagnetic wave and transmit them to the processor (170).

[0083] In one example, the aerosol generating device (1) may further include an analog-to-digital converter for converting the analog output of a directional coupler (240) into a digital output. The A / D converter may be built into the processor (170) or may exist as a separate configuration outside the processor (170). By monitoring the output of the directional coupler (240), the processor (170) can analyze the characteristics of the transmitted RF signal (e.g., current, voltage, power, phase and / or frequency) and the characteristics of the reflected electromagnetic wave (e.g., current, voltage, power, phase and / or frequency).

[0084] The processor (170) can determine whether the operation of the source unit (20) is being performed as intended based on the characteristics of the transmitted RF signal. Additionally, the characteristics of the transmitted RF signal, along with the characteristics of the reflected electromagnetic waves, can be used to determine the heating efficiency of the source unit (20) or the radiating unit (30). The processor (170) can control the source unit (20) so that the heating efficiency of the source unit (20) or the radiating unit (30) is maximized. For example, the processor (170) can adjust the frequency of the RF signal generated by the RF signal generation circuit (210) so that the power of the reflected electromagnetic waves is minimized. Minimizing the power of the reflected electromagnetic waves may mean that the frequency of the RF signal approaches the resonance condition of the insertion space. The characteristics of the transmitted RF signal can provide a criterion for whether the power of the reflected electromagnetic waves is minimized.

[0085] Since electromagnetic resonance may occur in the insertion space depending on the frequency of the RF signal, the insertion space may be referred to as a resonant section. At least a portion of the insertion space may be surrounded by at least one shielding member to prevent electromagnetic waves from leaking outside the aerosol generating device (1). According to one embodiment, the insertion space may further include a physical structure to ensure that the resonance condition is contained within a controllable range by the processor (170). The physical structure may include at least one conductor, and the resonance condition of the insertion space may vary depending on the arrangement, thickness, length, etc. of the conductor. Additionally, the physical structure may include a space for accommodating a dielectric with low electromagnetic wave absorption, separate from the dielectric included in the aerosol generating article. A dielectric with low electromagnetic wave absorption can change the resonance frequency of the entire resonant section without absorbing the energy that must be transferred to the heated body. Accordingly, even if the resonant section is miniaturized, the resonance condition can be determined within a controllable range by the processor (170).

[0086] A temperature sensing circuit (250) may be placed in contact with or adjacent to components included in the source section (20) to measure the temperature of the source section (20). For example, the temperature sensing circuit (250) may be placed in contact with or adjacent to at least one of the RF signal generation circuit (210), the driving amplifier (220), and the power amplifier (230). Heat may be generated due to limited efficiency during the generation and / or amplification of the RF signal, and if excessive heat is generated, it may have a negative effect on the components included in the source section (20) or other components included in the aerosol generating device (1). The temperature measured by the temperature sensing circuit (250) may be used to prevent overheating of the source section (20).

[0087] The processor (170) receives the temperature (or a value corresponding to the temperature) measured by the temperature sensing circuit (250) and can stop the operation of the source unit (20) if it is determined that the source unit (20) has overheated. For example, the processor (170) can stop the operation of the source unit (20) by stopping the power supply to the source unit (20) or by transmitting a control signal. In the following, the term "power supply to the source unit (20)" is used to mean controlling whether the source unit (20) operates.

[0088] The temperature sensing circuit (250) may include at least one temperature sensor among a thermocouple, an RTD (Resistance Temperature Detector), a thermistor, a semiconductor temperature sensor, and an optical temperature sensor. In one example, the temperature sensing circuit (250) may be implemented as a chip-type sensor (e.g., an NTC (Negative Temperature Coefficient) sensor) to minimize the area occupied, but is not necessarily limited thereto.

[0089] Meanwhile, the aerosol generating device (1) may include additional components in addition to the components shown in FIG. 1. For example, the aerosol generating device (1) may further include a sensor unit, an output unit, an input unit, a communication unit, and a memory. Additionally, if the aerosol generating device (1) is a hybrid type device that uses both an aerosol generating article and a cartridge, the aerosol generating device (1) may further include a cartridge heater. The cartridge heater can heat the medium and / or aerosol generating material within the cartridge by receiving power from the power source (130).

[0090] According to one embodiment, the sensor unit may detect the state of the aerosol generating device (1) or the state of the surroundings of the aerosol generating device (1) and transmit the detected information to the processor (170). For example, the sensor unit may include a temperature sensor, a puff sensor, an insertion detection sensor, a reuse detection sensor, an overly moist detection sensor, a cigarette identification sensor, a cartridge detection sensor, a cap detection sensor, and / or a motion detection sensor. Meanwhile, the sensor unit may further include various sensors, such as a liquid residue sensor for detecting the liquid residue in the cartridge and a water immersion sensor for detecting the water immersion of the aerosol generating device (1).

[0091] According to one embodiment, a temperature sensor can detect the temperature of an insertion space or an aerosol-generating article. The temperature sensor may be positioned in contact with or adjacent to the insertion space or the aerosol-generating article to directly measure the temperature of the insertion space or the aerosol-generating article. Additionally, the temperature sensor may be positioned spaced apart from the insertion space or the aerosol-generating article to indirectly (e.g., non-contact) measure the temperature of the insertion space or the aerosol-generating article. In one example, the temperature sensor may include an optical temperature sensor (e.g., an infrared temperature sensor).

[0092] According to one embodiment, a temperature sensor can detect the temperature of a power source (130). The temperature sensor may be positioned adjacent to the power source (130). For example, the temperature sensor may be attached to one side of the power source (130) (e.g., a battery) or / or mounted on one side of a printed circuit board. For example, the aerosol generating device (1) may include a protection circuit module (PCM), and the temperature sensor may be positioned adjacent to the power source (130) together with the protection circuit module.

[0093] According to one embodiment, the temperature sensor may be placed inside the housing (not shown) of the aerosol generating device (1) to detect the temperature inside the housing (not shown).

[0094] According to one embodiment, the puff sensor can detect the user's puff.

[0095] For example, the puff sensor may include a pressure sensor. The pressure sensor may output a signal corresponding to the internal pressure of the aerosol generating device (1), and the processor (170) may detect the user's puff based on the signal corresponding to the internal pressure. Here, the internal pressure of the aerosol generating device (1) may correspond to the pressure of the airflow path through which the gas flows. The puff sensor may be positioned in the aerosol generating device (1) in correspondence with the airflow path through which the gas flows.

[0096] As another example, the puff sensor may include a temperature sensor. When a user's puff occurs, a temporary temperature drop may occur in the airflow path, insertion space, aerosol generating item, etc. The processor (170) can detect the user's puff based on a signal corresponding to the temperature of the airflow path, etc. output from the temperature sensor.

[0097] As another example, the puff sensor may include both a pressure sensor and a temperature sensor. In this case, the temperature sensor may measure the temperature used to correct the internal pressure measured by the pressure sensor. As an example, the puff sensor may correct a signal corresponding to the internal pressure based on the temperature measured by the temperature sensor and output the corrected signal. As another example, the puff sensor may output a signal corresponding to the temperature measured by the temperature sensor and a signal corresponding to the internal pressure measured by the puff sensor. In this case, the processor (170) may receive the signals and correct the signal corresponding to the internal pressure based on the signal corresponding to the temperature.

[0098] As another example, the puff sensor may include a capacitance sensor. In the present disclosure, the capacitance sensor may also be referred to as a capacitive sensor. When a user's puff occurs, a temperature change and / or aerosol flow may occur within the insertion space, and accordingly, the dielectric constant inside the insertion space may change. The processor (170) can detect the user's puff based on a signal corresponding to the dielectric constant inside the insertion space, etc., output from the capacitance sensor.

[0099] The puff sensor is not limited to the examples described above and can be implemented as various sensors to detect the user's puff.

[0100] According to one embodiment, an insertion detection sensor can detect the insertion and / or removal of an aerosol-generating article. The insertion detection sensor may be installed around the insertion space.

[0101] For example, the insertion detection sensor may include a capacitance sensor. The capacitance sensor may include at least one conductor, and the at least one conductor may be disposed adjacent to the insertion space. When an aerosol-generating article is inserted into or removed from the insertion space, the dielectric constant around the conductor may change. The processor (170) may detect the insertion and / or removal of the aerosol-generating article based on a signal corresponding to the dielectric constant inside the insertion space, etc., output from the capacitance sensor.

[0102] As another example, the insertion detection sensor may include an inductive sensor. The inductive sensor may include at least one coil, and said at least one coil may be positioned adjacent to the insertion space. If the aerosol generating article (e.g., a wrapper of the aerosol generating article) includes a conductor, when the aerosol generating article is inserted into the insertion space or removed from the insertion space, a change in the magnetic field may occur around the coil through which the current flows. The processor (170) may detect the insertion and / or removal of the aerosol generating article including the conductor based on the characteristics of the current output from or detected by the inductive sensor (e.g., frequency of the alternating current, current value, voltage value, inductance value, impedance value, etc.). Alternatively, a susceptor (e.g., SUS) may be included in the aerosol generating article (e.g., the medium portion of the aerosol generating article). In this case as well, a change in the magnetic field around the coil may occur based on the insertion or removal of a susceptor, etc., within the insertion space, and the processor (170) may detect the insertion and / or removal of an aerosol-generating article based on the characteristics of the current of the inductive sensor.

[0103] The insertion detection sensor is not limited to the examples described above and may be implemented as various sensors (e.g., proximity sensors, etc.) for detecting the insertion and / or removal of an aerosol-generating article. Additionally, the insertion detection sensor may include any combination of the examples described above. According to one embodiment, the insertion detection sensor may include a switch, etc., for detecting pressure caused by an aerosol-generating article.

[0104] According to one embodiment, a reuse detection sensor can detect whether an aerosol-generating article is reused. For example, the reuse detection sensor may be a color sensor for detecting the color of the aerosol-generating article. When the aerosol-generating article is used by a user, a change in color may occur in a part of the wrapper covering the outside of the aerosol-generating article due to the generated aerosol or heating. The color sensor may output a signal corresponding to an optical characteristic (e.g., wavelength of light) corresponding to the color of the wrapper based on light reflected from the wrapper. When the processor (170) detects a change in color in a part of the wrapper, it may determine that the aerosol-generating article inserted into the insertion space has already been used.

[0105] According to one embodiment, the over-humidity detection sensor can detect whether the aerosol generating article is in an over-humid state. For example, the over-humidity detection sensor may include a capacitance sensor. The capacitance sensor may include at least one conductor disposed adjacent to an insertion space. The processor (170) can detect whether the aerosol generating article is in an over-humid state based on the level of a signal corresponding to the dielectric constant, etc., output from the capacitance sensor. For example, the processor (170) can determine the level range in which the level of the signal is included based on a look-up table, and determine the amount of moisture for the aerosol generating article based on the confirmed level range.

[0106] According to one embodiment, the cigarette identification sensor can detect whether an aerosol-generating article is genuine or / or detect the type of aerosol-generating article.

[0107] For example, a cigarette identification sensor may include a light sensor for detecting an identification material (or identification mark) located on the outer surface (e.g., wrapper) of an aerosol-generating article. The light sensor may irradiate light toward the identification material (or identification mark) of the aerosol-generating article and detect whether the aerosol-generating article is genuine and / or of a specific type based on the reflected light. For example, the identification material may include a material that emits light of a specific band of wavelength based on the irradiated light. The processor (170) may detect whether the aerosol-generating article is genuine and / or of a specific type based on the range of the wavelengths.

[0108] As another example, the cigarette identification sensor may include a capacitive sensor. The dielectric constant inside the insertion space may vary depending on the type of aerosol-generating item inserted into the insertion space. The processor (170) can detect whether the aerosol-generating item is genuine and / or of the type based on a signal corresponding to the dielectric constant inside the insertion space, etc., output from the capacitive sensor.

[0109] As another example, the cigarette identification sensor may include an inductive sensor. If a conductor is included in the wrapper and / or interior (e.g., the medium) of the aerosol generating article inserted into the insertion space, the characteristics of the current detected by the inductive sensor when the aerosol generating article is inserted into the insertion space (e.g., frequency of alternating current, current value, voltage value, inductance value, impedance value, etc.) may differ depending on the type of aerosol generating article inserted into the insertion space. The processor (170) can detect whether the inserted aerosol generating article is genuine and / or of the type based on the characteristics of the current output from or detected by the inductive sensor.

[0110] The cigarette identification sensor is not limited to the examples described above and may be implemented as various sensors for detecting whether an aerosol-generating article is genuine or / or for detecting the type of an aerosol-generating article. Additionally, the cigarette identification sensor may include any combination of the examples described above.

[0111] According to one embodiment, the cartridge detection sensor can detect the mounting and / or removal of a cartridge. For example, the cartridge detection sensor may include an inductive sensor, a capacitive sensor, a resistive sensor, a Hall sensor (hall IC), and / or an optical sensor.

[0112] According to one embodiment, a cap detection sensor can detect the mounting and / or removal of a cap. For example, the cap detection sensor may include an inductive sensor, a capacitive sensor, a resistive sensor, a contact sensor, a Hall sensor (hall IC), and / or an optical sensor. The cap may include a structure that covers at least a portion of a cartridge mounted or inserted into the aerosol generating device (1), or covers at least a portion of the housing of the aerosol generating device (1). The cap detection sensor may output a signal corresponding to the mounting or removal when the cap is mounted on the housing or removed from the housing, and the processor (170) may detect the mounting or removal of the cap based on the signal corresponding to the mounting or removal.

[0113] According to one embodiment, the motion detection sensor can detect the movement of the aerosol generating device (1). The motion detection sensor may be implemented as at least one of an accelerometer or a gyro sensor.

[0114] According to one embodiment, the sensor unit may further include at least one of a humidity sensor, an atmospheric pressure sensor, a geomagnetic sensor, a position sensor (Global Positioning System, GPS), or a proximity sensor in addition to the aforementioned sensors. Since the function of each sensor can be intuitively inferred by a person skilled in the art from its name, a detailed description may be omitted.

[0115] According to one embodiment, the output unit may output information regarding the state of the aerosol generating device (1). The output unit may include a display, a haptic unit and / or an acoustic output unit, but is not limited thereto. For example, information regarding the aerosol generating device (1) may include the charging / discharging state of the power supply (130) of the aerosol generating device (1), the operating state of the source unit (20) or the radiation unit (30), the insertion / removal state of the aerosol generating article and / or cartridge, the mounting and / or removal state of the cap, or a state in which the use of the aerosol generating device (1) is restricted (e.g., detection of an abnormal article). The display may visually provide information regarding the state of the aerosol generating device (1) to the user. For example, the display may include an LED (light emitting diode) light-emitting element, a Liquid Crystal Display (LCD), an Organic Light Emitting Diodes (OLED), etc. The display can also be used as an input unit if it includes a touch pad. The haptic unit can provide tactile information about the state of the aerosol generating device (1) to the user. For example, the haptic unit may include a vibration motor, a piezoelectric element, an electric stimulation device, etc. The acoustic output unit can provide auditory information about the aerosol generating device (1) to the user. For example, the acoustic output unit can convert an electrical signal into an acoustic signal and output it externally.

[0116] According to one embodiment, the input unit can receive information input by a user. For example, the input unit may include a touch panel, a button, a keypad, a dome switch, a jog wheel, a jog switch, etc.

[0117] According to one embodiment, the memory is hardware that stores various data processed within the aerosol generating device (1), and can store data processed by the processor (170) and data to be processed. For example, the memory may include at least one type of storage medium among a flash memory type, a hard disk type, a multimedia card micro type, a card type memory (e.g., SD or XD memory, etc.), RAM (random access memory), SRAM (static random access memory), ROM (read-only memory), EEPROM (electrically erasable programmable read-only memory), PROM (programmable read-only memory), magnetic memory, a magnetic disk, and an optical disk. For example, the memory may store data such as the operating time of the aerosol generating device (1), the maximum number of puffs, the current number of puffs, at least one temperature profile, and the user's smoking pattern.

[0118] According to one embodiment, the communication unit may include at least one component for communication with another electronic device (e.g., a portable electronic device). For example, the communication unit may include a Bluetooth communication unit, a Bluetooth Low Energy (BLE) communication unit, a Near Field Communication unit, a wireless local area network (WLAN) communication unit, a Zigbee communication unit, an infrared Data Association (IrDA) communication unit, a Wireless Fidelity Direct (WFD) communication unit, an ultra-wideband (UWB) communication unit, an Adaptive Network Topology (ANT)+ communication unit, a cellular network communication unit, an internet communication unit, a computer network (e.g., LAN or WAN) communication unit, etc.

[0119] According to one embodiment, the processor (170) can control the temperature of the insertion space or aerosol generating article by controlling the amplification rate of the source unit (20) (e.g., power amplifier (230)). The processor (170) can control the amplification rate of the source unit (20) (e.g., power amplifier (230)) based on the temperature of the insertion space or aerosol generating article detected using a temperature sensor. The processor (170) can control the amplification rate of the source unit (20) (e.g., power amplifier (230)) based on a temperature profile and / or power profile stored in memory.

[0120] Additionally, the processor (170) can control the temperature of the cartridge heater by controlling the supply of power from the power supply (130) to the cartridge heater. The processor (170) can control the temperature of the cartridge heater and / or the power supplied to the cartridge heater based on the temperature of the cartridge heater detected using a temperature sensor. The processor (170) can control the temperature of the cartridge heater and / or the power supplied to the cartridge heater based on a temperature profile and / or power profile stored in memory.

[0121] According to one embodiment, the processor (170) can prevent the insertion space, the aerosol generating article, and / or the cartridge heater from overheating. For example, the processor (170) can control the operation of the power conversion circuit to reduce the amount of power supplied to the source unit (20) or the cartridge heater, or to stop the power supply to the source unit (20) or the cartridge heater, based on the fact that the temperature of the insertion space, the aerosol generating article, and / or the cartridge heater exceeds a preset limit temperature.

[0122] According to one embodiment, the processor (170) can control the power supply to the source unit (20) or the cartridge heater based on the result detected by the sensor unit.

[0123] According to one embodiment, the processor (170) may control the power supply to the source unit (20) or the cartridge heater based on the insertion and / or removal of an aerosol-generating article into the insertion space. For example, the processor (170) may control the power supply to the source unit (20) or the cartridge heater when it is determined, using an insertion detection sensor, that an aerosol-generating article has been inserted into the insertion space. The processor (170) may cut off the power supply to the source unit (20) or the cartridge heater when it is determined, using an insertion detection sensor, that an aerosol-generating article has been removed from the insertion space. The processor (170) may also determine that an aerosol-generating article has been removed from the insertion space if the temperature of the insertion space or the aerosol-generating article is above a limit temperature or if the temperature change slope of the insertion space or the aerosol-generating article is above a set slope.

[0124] According to one embodiment, the processor (170) can control the power supply time and / or power supply amount for the source unit (20) or cartridge heater based on the state of the aerosol generating article. For example, the processor (170) can increase the power supply time (e.g., preheating time) for the source unit (20) or cartridge heater if it is determined that the aerosol generating article is in an over-humid state using an over-humidity detection sensor.

[0125] According to one embodiment, the processor (170) can control the power supply to the source unit (20) or the cartridge heater based on whether the aerosol generating article is reused. For example, if the processor (170) determines that the aerosol generating article has been used, it can cut off the power supply to the source unit (20) or the cartridge heater.

[0126] According to one embodiment, the processor (170) can control the power supply to the source unit (20) or the cartridge heater based on whether the cartridge is coupled and / or removed. For example, if the processor (170) determines using a cartridge detection sensor that the cartridge is separated, it can stop the power supply to the source unit (20) or the cartridge heater or control the power supply so that power is not supplied to the source unit (20) or the cartridge heater.

[0127] According to one embodiment, the processor (170) can control the power supply to the source unit (20) or the cartridge heater based on whether the aerosol generating material of the cartridge is depleted. For example, the processor (170) may determine that the aerosol generating material of the cartridge is depleted if it determines that the temperature of the cartridge heater exceeds a limit temperature while preheating the cartridge heater (i.e., during the preheating period). If it determines that the aerosol generating material of the cartridge is depleted, the processor (170) may cut off the power supply to the source unit (20) or the cartridge heater.

[0128] According to one embodiment, the processor (170) may control the power supply to the source unit (20) or the cartridge heater based on whether the cartridge is usable. For example, the processor (170) may determine that the cartridge is unusable if, based on data stored in memory, the current number of puffs is determined to be greater than or equal to the maximum number of puffs set for the cartridge. Alternatively, the processor (170) may determine that the cartridge is unusable if the total time the cartridge heater is heated is greater than or equal to a preset maximum time, or if the total amount of power supplied to the cartridge heater is greater than or equal to a preset maximum amount of power. In this case, the processor (170) may stop the power supply to the source unit (20) or the cartridge heater, or control the supply so that power is not supplied to the source unit (20) or the cartridge heater.

[0129] According to one embodiment, the processor (170) can control the power supply to the source unit (20) or the cartridge heater based on the user's puff. For example, the processor (170) can determine whether a puff has occurred and / or the intensity of the puff using a puff sensor. The processor (170) can cut off the power supply to the source unit (20) or the cartridge heater when the number of puffs reaches a preset maximum number of puffs or / or when no puff is detected for a preset time or longer. The processor (170) may also control the power supply to the source unit (20) or the cartridge heater when a puff is detected.

[0130] According to one embodiment, the processor (170) may control the power supply to the source unit (20) or the cartridge heater based on whether the aerosol generating item (or cartridge) is genuine and / or of a specific type. For example, the processor (170) may detect whether the aerosol generating item (or cartridge) is genuine and / or of a specific type using a cigarette identification sensor. For example, if the processor (170) detects that the aerosol generating item (or cartridge) is counterfeit, it may cut off the power supply to the source unit (20) or the cartridge heater. If the processor (170) detects that the aerosol generating item (or cartridge) is genuine, it may control (e.g., initiate) the power supply to the source unit (20) or the cartridge heater. For another example, the processor (170) may control the power supply to the source unit (20) or the cartridge heater differently depending on the specific type of the aerosol generating item (or cartridge). More specifically, the processor (170) can control the amplification rate of the source unit (20) or the temperature and / or power of the cartridge heater based on a first temperature profile (or a first power profile) when the aerosol generating item (or cartridge) is detected to be a first aerosol generating item (or a first cartridge), and control the amplification rate of the source unit (20) or the temperature and / or power of the cartridge heater based on a second temperature profile (or a second power profile) when the aerosol generating item (or a second cartridge) is detected to be a second aerosol generating item (or a second cartridge).

[0131] According to one embodiment, the processor (170) may control the output unit based on the result detected by the sensor unit. For example, the processor (170) may control the output unit to provide visual, tactile, and / or auditory information that the aerosol generating device (1) will soon be terminated when the number of puffs counted using the puff sensor reaches a preset number. For example, the processor (170) may control the output unit to provide visual, tactile, and / or auditory information regarding the temperature of the insertion space, the aerosol generating article, or the cartridge heater.

[0132] According to one embodiment, the processor (170) may store and update a history of the event that occurred in memory based on the occurrence of a predetermined event. For example, the event may include operations performed by the aerosol generating device (1), such as detection of insertion of an aerosol generating item, initiation of heating of the aerosol generating item, puff detection, puff termination, overheating detection, detection of overvoltage application to a cartridge heater, termination of heating of the aerosol generating item, power on / off of the aerosol generating device (1), initiation of charging of the power supply (130), detection of overcharging of the power supply (130), termination of charging of the power supply (130), etc. For example, the history of the event may include the time and date when the event occurred, log data corresponding to the event, etc. For example, if the predetermined event is detection of insertion of an aerosol generating item, the log data corresponding to the event may include data regarding the sensing value of the insertion detection sensor, etc. For example, if a predetermined event is the detection of overheating of the cartridge heater, the log data corresponding to the event may include data regarding the temperature of the cartridge heater, the voltage applied to the cartridge heater, the current flowing through the cartridge heater, etc.

[0133] According to one embodiment, the processor (170) can control the communication unit to form a communication link with an external device, such as a user's mobile terminal.

[0134] According to one embodiment, when the processor (170) receives authentication data from an external device via a communication link, it may release the restriction on the use of at least one function (e.g., heating function) of the aerosol generating device (1). For example, the authentication data may include the user's birthday, a unique number representing the user, whether the user's authentication is complete, etc.

[0135] According to one embodiment, the processor (170) can transmit data regarding the status of the aerosol generating device (1) (e.g., remaining capacity of the power supply (130), operating mode, etc.) to an external device via a communication link. The transmitted data can be output through a display of the external device, etc.

[0136] According to one embodiment, when a processor (170) receives a request to search for the location of an aerosol generating device (1) from an external device via a communication link, the processor (170) may control an output unit to perform an operation corresponding to the location search. For example, the processor (170) may control a haptic unit to generate vibrations or control a display to output an object corresponding to the location search and the end of the search.

[0137] According to one embodiment, the processor (170) can perform a firmware update when firmware data is received from an external device through a communication link.

[0138] According to one embodiment, the processor (170) transmits data regarding the sensing value of at least one sensor unit to an external server (not shown) via a communication link, and receives and stores a learning model generated by learning the sensing value through machine learning, such as deep learning, from the server. The processor (170) can use the learning model received from the server to perform operations such as determining the user's inhalation pattern and generating a temperature profile.

[0139] Although not illustrated in FIG. 1, the aerosol generating device (1) may further include a power protection circuit. The power protection circuit includes at least one switching element and can cut off the circuit to the power source (130) in response to overcharging and / or overdischarging of the power source (130).

[0140] The aerosol generating article mentioned in the present disclosure may include at least one aerosol generating rod (e.g., a medium part) and at least one filter rod. The spinning part (30) may be positioned to correspond to at least one aerosol generating rod and may be designed differently depending on the arrangement order and / or position of the aerosol generating rod and the filter rod. The aerosol generating rod may include at least one of nicotine, an aerosol generating material, and an additive. For example, the aerosol generating material may include glycerin (e.g., vegetable glycerin (VG)) and / or propylene glycol (PG), and may include various other materials. For example, the additive may include flavoring agents and / or organic acids, and may include various other materials. For example, the aerosol generating rod may comprise an aerosol generating substrate (e.g., a sheet) impregnated with a non-tobacco substance in a liquid state (e.g., an aerosol generating substance and / or nicotine), and / or may comprise a tobacco substance in a solid state (e.g., leaf tobacco, reconstituted tobacco, etc.). The tobacco substance may be included in the aerosol generating rod in various forms, such as cut tobacco, granules, or powder. According to one embodiment, the additive of the aerosol generating rod may comprise a basic substance. Based on the basic substance, the nicotine in the tobacco substance included in the aerosol generating rod may have a basic pH (e.g., pH 7.0 or higher). In this case, freebase nicotine may be released from the aerosol generating rod even at low temperatures. According to one embodiment, the aerosol generating rod comprises two or more aerosol generating rods, and said two or more aerosol generating rods may each comprise a tobacco substance and / or a non-tobacco substance.Meanwhile, although not illustrated, at least one aerosol generating rod and at least one filter rod may each and / or integrally be wrapped by at least one wrapper. In the present disclosure, the aerosol generating article may be referred to as a stick.

[0141] The cartridge mentioned in the present disclosure may contain an aerosol generating material having any one of the states, such as a liquid state, a solid state, a gaseous state, or a gel state. The aerosol generating material may include a liquid composition. For example, the liquid composition may be a liquid containing a tobacco-containing material containing a volatile tobacco flavor component, or a liquid containing a non-tobacco material. Meanwhile, the cartridge may include a storage portion containing the aerosol generating material and / or a liquid delivery means impregnated (containing) the aerosol generating material. For example, the liquid delivery means may include a wick such as a cotton fiber, a ceramic fiber, a glass fiber, or a porous ceramic. A cartridge heater may be included in the cartridge in a coil-shaped structure that surrounds (or winds) the liquid delivery means or in a structure that contacts one side of the liquid delivery means. Alternatively, the cartridge heater may be included in an aerosol generating device (1) that is detachable from the cartridge.

[0142] FIG. 2 is a schematic cross-sectional view of an aerosol generating device according to one embodiment.

[0143] Referring to FIG. 2, the aerosol generating device (1) may further include a first circuit board (1010), a second circuit board (1020), and a heat dissipation unit (40) in addition to the components described with reference to FIG. 1 (e.g., power supply (130), radiation unit (30), etc.). However, it will be understood by those skilled in the art related to this embodiment that, depending on the design of the aerosol generating device (1), some of the components shown in FIG. 2 may be omitted or new components may be added.

[0144] The first circuit board (1010) may refer to a printed circuit board (PCB) on which circuit elements for controlling the overall operation of the aerosol generating device (1) are mounted. For example, the first circuit board (1010) may include at least one of the components of the control unit (10) described with reference to FIG. 1 (e.g., a processor (170), etc.). Since the circuit elements mounted on the first circuit board (1010) do not process high-frequency signals (e.g., signals having a frequency of 3 MHz or higher), it may be desirable for the first circuit board (1010) to be a PCB that is inexpensive and easy to process, even if it has limitations in high-frequency characteristics. In one example, the first circuit board (1010) may be an FR4 (Flame Retardant 4) PCB, but is not necessarily limited thereto.

[0145] The second circuit board (1020) may refer to a PCB on which circuit elements for generating and / or amplifying an RF signal are mounted. For example, the second circuit board (1020) may include at least one of the components of the source unit (20) described with reference to FIG. 1 (e.g., RF signal generation circuit (210), driving amplifier (220), power amplifier (230), etc.). Since the circuit elements mounted on the second circuit board (1020) process high-frequency signals (e.g., RF signals), it may be desirable for the PCB to be manufactured from a material optimized for high-frequency and high-speed signal transmission. For example, the second circuit board (1020) may be manufactured from a material with a low dielectric constant to minimize signal loss at high frequencies. Additionally, since a significant amount of heat may be generated during the process of amplifying the RF signal, it may be desirable for the second circuit board (1020) to have better temperature stability than the first circuit board (1010). In one example, the second circuit board (1020) may be a Rogers PCB, but is not necessarily limited thereto.

[0146] The second circuit board (1020) may be spaced apart from the first circuit board (1010). Since the second circuit board (1020) must transmit generated and / or amplified RF signals to the radiating unit (30), the second circuit board (1020) may be placed closer to the radiating unit (30) than the first circuit board (1010). For example, when FIG. 2 is a cross-sectional view of the aerosol generating device (1) viewed from the front, the second circuit board (1020) may be spaced apart along the same axis as the first circuit board (1010) on the upper side of the first circuit board (1010). The second circuit board (1020) may be physically separated from the first circuit board (1010) but may be electrically connected. The second circuit board (1020) can be electrically connected to the first circuit board (1010) through a connection means such as a connector, flexible PCB, wiring, or cable.

[0147] Accordingly, the aerosol generating device (1) according to the present disclosure may each include a first circuit board (1010) on which circuit elements for controlling the overall operation of the aerosol generating device (1) are mounted, and a second circuit board (1020) on which circuit elements for generating and / or amplifying RF signals are mounted. In other words, the aerosol generating device (1) can appropriately distribute circuit elements corresponding to each function to circuit boards that are more suitable for implementing each function by classifying circuit elements by function and mounting them on different circuit boards. Accordingly, circuit elements for implementing dielectric heating can operate more stably.

[0148] Meanwhile, if charging and / or discharging of the power source (130) is performed above a certain critical temperature, normal operation may not occur or the lifespan may be reduced. Therefore, it may be desirable to minimize the transfer of heat generated from the second circuit board (1020) to the power source (130) during the process of generating and / or amplifying the RF signal. To this end, the second circuit board (1020) may be positioned so as not to overlap with the power source (130) in any of the left-right, front-back, and up-down directions. Accordingly, the distance between the point where heat is generated on the second circuit board (1020) and the power source (130) increases, and as the area where heat transfer occurs decreases, the heat transferred to the power source (130) can be minimized.

[0149] Additionally, the aerosol generating device (1) may include a heat dissipation unit (40) for effectively discharging or dispersing heat generated from the second circuit board (1020) to minimize the transfer of heat generated from the second circuit board (1020) to the power source (130). The heat dissipation unit (40) may be placed in contact with or adjacent to at least one surface of the second circuit board (1020). As shown in FIG. 2, the heat dissipation unit (40) may be placed adjacent to the rear surface of the second circuit board (1020) (i.e., the left-facing surface in the cross-sectional view of FIG. 2). At this time, circuit elements for generating and / or amplifying RF signals may be placed on the front surface of the second circuit board (1020) (i.e., the right-facing surface in the cross-sectional view of FIG. 2). Accordingly, heat generated from circuit elements (e.g., the driving amplifier (220) and / or power amplifier (230) of FIG. 1) can be transferred to the power supply (130) through the second circuit board (1020), and thus, heat transfer can be reduced. However, since FIG. 2 is merely an example, the heat dissipation unit (40) may be placed on the front of the second circuit board (1020), or on both the front and rear. Additionally, the heat dissipation unit (40) may be in contact with or coupled to at least one surface of the second circuit board (1020).

[0150] The heat dissipation unit (40) may include at least one of a heat sink, a fan, and a heat pipe. The heat sink may have a large surface area to absorb heat using a material with high thermal conductivity and to effectively release heat into the atmosphere. In one example, the heat sink may be a graphite sheet, but is not necessarily limited thereto. The heat sink may be manufactured from a metal material such as copper or aluminum, or may include a fin or wing structure to increase the surface area. The fan may rapidly move heat through air circulation and facilitate heat exchange with the atmosphere. The heat pipe may have a structure in which a refrigerant is contained inside an outer material comprising at least one of a metal material, a ceramic material, and a carbon material. When heat is applied to one end of the heat pipe, the refrigerant inside the heat pipe evaporates, thereby allowing thermal energy to move to the other end of the heat pipe. The heat pipe can efficiently dissipate heat. Due to the heat dissipation unit (40), stable operation of the power supply (130) is ensured, and the lifespan of the power supply (130) can be increased.

[0151] Meanwhile, although only the first circuit board (1010) and the second circuit board (1020) are illustrated in FIG. 2, the aerosol generating device (1) may include other circuit boards. For example, the aerosol generating device (1) may include modular and / or functional PCBs such as a sensor PCB, a button PCB (e.g., an RGB-KEY PCB), etc. The number of modular and / or functional PCBs included in the aerosol generating device (1) may be determined to an appropriate number depending on the application. The first circuit board (1010) and the second circuit board (1020) will be described in more detail below with reference to FIGS. 3 to 7.

[0152] FIG. 3 is a drawing showing one side of a first circuit board according to one embodiment.

[0153] Referring to FIG. 3, an example is illustrated in which a charging circuit (120), a first power converter (140), a second power converter (150), a third power converter (160), and a processor (170) described with reference to FIG. 1 are arranged on a first circuit board (1010). Since FIG. 3 is an example for explaining a preferred arrangement method of circuit elements mounted on the first circuit board (1010), it will be understood by those skilled in the art that other examples not contradicting said arrangement method may also be included in various embodiments of the present disclosure. Additionally, although not illustrated in FIG. 3, a power connector (110) described with reference to FIG. 1 may also be arranged on the first circuit board (1010).

[0154] A digital area (310) in which a digital circuit including a processor (170) is mounted within a first circuit board (1010) and an analog area (320) in which an analog circuit including at least one power conversion circuit (e.g., a first power converter (140), a second power converter (150), and a third power converter (160)) is mounted may be electrically and physically separated.

[0155] For example, as illustrated in FIG. 3, when the digital area (310) is positioned on the lower side of the first circuit board (1010), the analog area (320) is positioned in the remaining area other than the digital area (310), so that the digital area (310) and the analog area (320) can be physically separated. Additionally, the digital area (310) and the analog area (320) may each include a ground. For example, the first circuit board (1010) may each include a digital ground (3010) connected to a digital circuit and an analog ground (3020) connected to an analog circuit. Accordingly, the digital area (310) and the analog area (320) can be electrically separated.

[0156] An analog circuit including at least one power conversion circuit processes a continuous signal and may use a relatively large voltage and / or current. A digital circuit including a processor (170) processes a discrete signal and may use a relatively small voltage and / or current. As such, since the analog circuit and the digital circuit process signals of different properties, connecting them to a single common ground may result in performance degradation due to noise and signal interference. Therefore, it may be desirable to separate the digital ground (3010) and the analog ground (3020) to prevent the occurrence of noise and signal interference.

[0157] The digital ground (3010) and the analog ground (3020) are separated from each other but can be electrically connected by a noise reduction element (3015) at only one point. Accordingly, the digital ground (3010) and the analog ground (3020) can provide a common reference potential while minimizing the occurrence of noise and signal interference. The noise reduction element (3015) may include at least one of a zero-ohm resistor and a bead. The bead is a type of inductor that can block electromagnetic waves or remove or absorb high-frequency noise.

[0158] The charging circuit (120) corresponds to a hybrid circuit that operates in a combined form of an analog circuit and a digital circuit, but since it performs the function of regulating voltage and / or current, it may be more desirable to place it in the analog area (320). Each of the first power converter (140), the second power converter (150), and the third power converter (160) may be placed in a manner that does not include facing sides to minimize influence on each other (e.g., transmission of heat, noise, etc.). For example, as shown in FIG. 3, the first power converter (140), the second power converter (150), and the third power converter (160) may be placed along a diagonal line passing through the center of the analog area (320) so as not to overlap each other, but are not necessarily limited thereto.

[0159] Meanwhile, FIG. 3 may be a drawing showing the front surface of the first circuit board (1010) (i.e., the right-facing side in the cross-sectional view of FIG. 2). Since some heat may be generated during the process of the power conversion circuit converting power, the power conversion circuit may be placed on a surface of the first circuit board (1010) that does not face the heat-sensitive power source (130). However, it is not necessarily limited to this.

[0160] The first circuit board (1010) may be a double-sided circuit board or a multilayer circuit board. If the first circuit board (1010) is a multilayer circuit board, the first circuit board (1010) may include one or more internal layers (e.g., ground layers) in addition to both sides. If the first circuit board (1010) is a multilayer circuit board that includes at least one ground layer internally, the digital ground (3010) and the analog ground (3020) may also be formed in at least one ground layer. The case where the first circuit board (1010) is a multilayer circuit board will be described below with reference to FIG. 4.

[0161] FIG. 4 is a drawing illustrating a ground layer of a first circuit board according to one embodiment.

[0162] Referring to FIG. 4, a ground layer (1012) inside a first circuit board (1010) is shown. A digital ground (4010) and an analog ground (4020) may each be placed in physically separated regions within the ground layer (1012). For example, the digital ground (4010) may be placed at a position corresponding to a digital region (e.g., digital region (310) of FIG. 3) on the front of the first circuit board (1010) where a digital circuit including a processor (170) is mounted. Additionally, the analog ground (4020) may be placed at a position corresponding to an analog region (e.g., analog region (320) of FIG. 3) on the front of the first circuit board (1010) where an analog circuit including at least one power conversion circuit (e.g., first power converter (140), second power converter (150), and third power converter (160)) is mounted.

[0163] A digital circuit mounted on the front surface of the first circuit board (1010) can be connected to a digital ground (4010) through a connection means such as a via. Additionally, an analog circuit mounted on the front surface of the first circuit board (1010) can be connected to an analog ground (4020) through a connection means such as a via. Accordingly, the digital circuit and the analog circuit can be electrically separated. Since a larger ground area is preferable, the shapes of the digital ground (4010) and the analog ground (4020) are illustrated in a highly simplified manner in FIG. 4; however, if a component sensitive to heat or noise generated from the ground is placed on at least one of the two sides of the first circuit board (1010), a ground may not be formed at a position corresponding to (e.g., overlapping) the area where such a component is placed. Furthermore, it may be preferable for the area of ​​the analog ground (4020) to be larger than the area of ​​the digital ground (4010).

[0164] The digital ground (4010) and the analog ground (4020) may be electrically connected by a noise reduction element (4015) at only one point to provide a common reference potential while minimizing the occurrence of noise and signal interference. The noise reduction element (4015) may include at least one of a 0-ohm resistor and a bead. The bead is a type of inductor and can block electromagnetic waves or remove or absorb high-frequency noise.

[0165] Meanwhile, with reference to FIG. 3, an example in which a ground is formed on the front surface of the first circuit board (1010) has been described, and with reference to FIG. 4, an example in which a ground is formed on the ground layer (1012) has been described, but the ground may be formed on multiple surfaces and / or layers among the two sides of the first circuit board (1010) and at least one ground layer. In this case, digital grounds formed on different layers or surfaces (e.g., digital ground (3010) and digital ground (4010)) may be connected to each other, and analog grounds formed on different layers or surfaces (e.g., analog ground (3020) and analog ground (4020)) may also be connected to each other. However, it may be preferable that the connection between the digital grounds and the analog grounds be formed by a noise reduction element (e.g., the noise reduction element (3015) of FIG. 3 or the noise reduction element (4015) of FIG. 4) only on one of the multiple surfaces and / or layers.

[0166] FIG. 5 is a drawing showing one side of a second circuit board according to one embodiment.

[0167] Referring to FIG. 5, an example is illustrated in which the RF signal generating circuit (210), driving amplifier (220), power amplifier (230), and temperature sensing circuit (250) described with reference to FIG. 1 are arranged on a second circuit board (1020). FIG. 5 may be a drawing showing the front view of the second circuit board (1020) (i.e., the right side in the cross-sectional view of FIG. 2). Since FIG. 5 is an example for explaining a preferred arrangement method of circuit elements mounted on the second circuit board (1020), it will be understood by those skilled in the art that other examples not contradicting said arrangement method may also be included in various embodiments of the present disclosure.

[0168] A first region (510) in which an RF signal generation circuit (210) is mounted within a second circuit board (1020) and a second region (520) in which at least one amplifier (e.g., a driving amplifier (220) and / or a power amplifier (230)) is mounted may be physically separated. For example, as shown in FIG. 5, when the first region (510) is placed on the lower side of the second circuit board (1020), the second region (520) may be placed in the remaining area other than the first region (510), thereby physically separating the first region (510) and the second region (520). Since a significant amount of heat may be generated from at least one amplifier during the process of amplifying the RF signal, it may be desirable for the RF signal generation circuit (210) and at least one amplifier to be placed as far apart as possible to ensure stable operation of the RF signal generation circuit (210).

[0169] The RF signal generating circuit (210) and at least one amplifier may be positioned near two edges or corners of the second circuit board (1020) that face each other with respect to the center of the second circuit board (1020). For example, as shown in FIG. 5, the RF signal generating circuit (210) may be positioned near the lower left corner of the second circuit board (1020), whereas the power amplifier (230) may be positioned near the upper right corner of the second circuit board (1020). Here, being positioned near an edge or corner may mean that the distance between the circuit element and the edge or corner is shorter than the distance between the circuit element and the center of the second circuit board (1020), but is not necessarily limited thereto.

[0170] The second circuit board (1020) may include a first ground (5010) connected to an RF signal generation circuit (210), and a second ground (5020) disposed separately from the first ground (5010) and connected to at least one amplifier. Although both the RF signal generation circuit (210) and at least one amplifier correspond to analog circuits, considering that at least one amplifier uses much greater power (e.g., voltage and / or current) than the RF signal generation circuit (210), it may be desirable to separate the first ground (5010) connected to the RF signal generation circuit (210) and the second ground (5020) connected to at least one amplifier in order to ensure stable operation of the RF signal generation circuit (210). The first ground (5010) and the second ground (5020) may be electrically connected at a single point by a noise reduction element (5015). The noise reduction element (5015) may include at least one of a 0-ohm resistor and a bead. The bead is a type of inductor and can block electromagnetic waves or remove or absorb high-frequency noise.

[0171] A temperature sensing circuit (250) may be placed adjacent to a power amplifier (230). The temperature sensing circuit (250) may be used to prevent overheating of the second circuit board (1020). The most heat may be generated from the power amplifier (230) in the second circuit board (1020). Therefore, the temperature sensing circuit (250) may be placed as close as possible to the power amplifier (230) to sensitively measure temperature changes of the second circuit board (1020). A processor (e.g., processor (170) of FIG. 1 or FIG. 3) may stop the operation of at least one of the RF signal generation circuit (210) and at least one amplifier in response to the determination that the temperature measured by the temperature sensing circuit (250) exceeds a preset threshold. Accordingly, overheating of the second circuit board (1020) may be prevented.

[0172] The second circuit board (1020) may be a double-sided circuit board or a multilayer circuit board. If the second circuit board (1020) is a multilayer circuit board, the second circuit board (1020) may include one or more internal layers (e.g., ground layers) in addition to both sides. If the second circuit board (1020) is a multilayer circuit board that includes at least one ground layer internally, the first ground (5010) and the second ground (5020) may also be formed in at least one ground layer. The case where the second circuit board (1020) is a multilayer circuit board will be described below with reference to FIG. 6.

[0173] FIG. 6 is a drawing illustrating a ground layer of a second circuit board according to one embodiment.

[0174] Referring to FIG. 6, a ground layer (1022) inside a second circuit board (1020) is illustrated. A first ground (6010) and a second ground (6020) may each be placed in physically separated regions within the ground layer (1022). For example, the first ground (6010) may be placed at a position corresponding to a first region (510) on the front of the second circuit board (1020) where an RF signal generating circuit (210) is mounted. Additionally, the second ground (6020) may be placed at a position corresponding to a second region (520) on the front of the second circuit board (1020) where at least one amplifier (e.g., a driving amplifier (220) and / or a power amplifier (230)) is mounted.

[0175] An RF signal generation circuit (210) mounted on the front surface of the second circuit board (1020) can be connected to the first ground (6010) through a connection means such as a via. Additionally, at least one amplifier mounted on the front surface of the second circuit board (1020) can be connected to the second ground (6020) through a connection means such as a via. Accordingly, the first ground (6010) to which the RF signal generation circuit (210) is connected and the second ground (6020) to which the at least one amplifier is connected can be separated. Since a larger ground area is preferable, the shapes of the first ground (6010) and the second ground (6020) are illustrated in a highly simplified manner in FIG. 6; however, if a component sensitive to heat or noise generated from the ground is placed on at least one of the two sides of the second circuit board (1020), a ground may not be formed at a position corresponding to (e.g., overlapping) the area where such a component is placed. In addition, it may be desirable for the area of ​​the second ground (6020) to be larger than the area of ​​the first ground (6010).

[0176] The first ground (6010) and the second ground (6020) may be electrically connected by a noise reduction element (6015) at only one point to provide a common reference potential while minimizing the occurrence of noise and signal interference. The noise reduction element (6015) may include at least one of a 0-ohm resistor and a bead. The bead is a type of inductor and can block electromagnetic waves or remove or absorb high-frequency noise.

[0177] Meanwhile, with reference to FIG. 5, an example in which a ground is formed on the front surface of the second circuit board (1020) is described, and with reference to FIG. 6, an example in which a ground is formed on the ground layer (1022) is described, but the ground may be formed on multiple surfaces and / or layers among the two sides of the second circuit board (1020) and at least one ground layer. In this case, the first grounds formed on different layers or surfaces (e.g., the first ground (5010) and the first ground (6010)) may be connected to each other, and the second grounds formed on different layers or surfaces (e.g., the second ground (5020) and the second ground (6020)) may be connected to each other. However, it may be preferable that the connection between the first grounds and the second grounds be formed by a noise reduction element (e.g., noise reduction element (5015) or noise reduction element (6015)) only on one of the surfaces and / or layers.

[0178] FIG. 7 is a drawing for illustrating a preferred arrangement of a directional coupler according to one embodiment.

[0179] Referring to FIG. 7, the second circuit board (1020) may further include a directional coupler (240) that separates and receives an amplified RF signal and a reflected electromagnetic wave that is radiated by a radiating unit (e.g., the radiating unit (30) of FIG. 1 or FIG. 2) and then reflected from the insertion space. In order for the directional coupler (240) to accurately detect the reflected electromagnetic wave corresponding to a relatively small signal, it may be preferable to position it as far as possible from at least one amplifier (e.g., a driving amplifier (220) and / or a power amplifier (230)) that outputs a relatively large signal.

[0180] The directional coupler (240) and at least one amplifier may each be placed in areas separated by a vertical line (VL) passing through the center (CP) of the second circuit board (1020). For example, as shown in FIG. 7, if the directional coupler (240) is placed in the left area, the driving amplifier (220) and / or power amplifier (230) may be placed in the right area. However, this is not necessarily limited to the directional coupler (240) and at least one amplifier may each be placed in areas separated by a horizontal line (not shown) passing through the center (CP) of the second circuit board (1020).

[0181] Additionally, the directional coupler (240) and at least one amplifier may be positioned near two edges or corners of the second circuit board (1020) that face each other with respect to the center (CP) of the second circuit board (1020). For example, as shown in FIG. 7, the directional coupler (240) may be positioned near the left edge of the second circuit board (1020), whereas the driving amplifier (220) and / or power amplifier (230) may be positioned near the right edge of the second circuit board (1020). Here, being positioned near the edge or corner may mean that the distance between the circuit element and the edge or corner is shorter than the distance between the circuit element and the center of the second circuit board (1020), but is not necessarily limited thereto.

[0182] According to one embodiment, the directional coupler (240) and at least one amplifier may be placed on different sides of the second circuit board (1020). For example, if at least one amplifier is placed on the front side of the second circuit board (1020), the directional coupler (240) may be placed on the rear side of the second circuit board (1020). In this case, the directional coupler (240) and at least one amplifier may be placed so as not to overlap each other when viewed from the front or rear side of the second circuit board (1020). Even in the example where the directional coupler (240) and at least one amplifier are placed on different sides of the second circuit board (1020), the directional coupler (240) may be placed as far apart as possible from the at least one amplifier.

[0183] As described with reference to FIGS. 3 to 7, according to the aerosol generating device (1) of the present disclosure, circuit elements mounted on the same circuit board can be arranged in an appropriate manner considering their respective operating conditions and / or operating characteristics. Accordingly, stable operation of circuit elements implementing dielectric heating can be ensured.

[0184] FIG. 8 is a schematic cross-sectional view of an aerosol generating device according to another embodiment.

[0185] Referring to FIG. 8, the aerosol generating device (1) may further include a first circuit board (1010), a second circuit board (1020), and a heat dissipation unit (40) in addition to the components described with reference to FIG. 1 (e.g., power supply (130), radiation unit (30), etc.). However, it will be understood by those skilled in the art related to this embodiment that, depending on the design of the aerosol generating device (1), some of the components shown in FIG. 8 may be omitted or new components may be added.

[0186] The first circuit board (1010) may refer to a printed circuit board (PCB) on which circuit elements for controlling the overall operation of the aerosol generating device (1) are mounted. For example, the first circuit board (1010) may include at least one of the components of the control unit (10) described with reference to FIG. 1 (e.g., a processor (170), etc.). Since the first circuit board (1010) must mount most of the circuit elements included in the aerosol generating device (1), it may be desirable for it to be an inexpensive and easy-to-process PCB. In one example, the first circuit board (1010) may be an FR4 (Flame Retardant 4) PCB, but is not necessarily limited thereto.

[0187] Since the first circuit board (1010) has limited high-frequency performance despite being relatively inexpensive, it may be desirable to mount circuit elements that do not process high-frequency signals (e.g., signals having a frequency of 3 MHz or higher) on the first circuit board (1010). However, even if a circuit element processes high-frequency signals, if the circuit element ensures normal operation on the first circuit board (1010) or does not have a negative effect on other circuit elements, the circuit element may be mounted on the first circuit board (1010). For example, the RF signal generation circuit (210) described with reference to FIG. 1 generates high-frequency signals but outputs only low power, so it may be mounted on the first circuit board (1010).

[0188] The second circuit board (1020) may refer to a PCB on which circuit elements for amplifying RF signals are mounted. For example, the second circuit board (1020) may include at least one amplifier (e.g., a driving amplifier (220), a power amplifier (230), etc.) among the components of the source section (20) described with reference to FIG. 1. Since the circuit elements mounted on the second circuit board (1020) process high-frequency and / or high-power signals, it may be desirable for the second circuit board (1020) to be a PCB manufactured from a material optimized for high-frequency and high-speed signal transmission. For example, the second circuit board (1020) may be manufactured from a material with a low dielectric constant to minimize signal loss at high frequencies. In addition, since a large amount of heat may be generated during the process of amplifying RF signals, it may be desirable for the second circuit board (1020) to have better temperature stability than the first circuit board (1010). In one example, the second circuit board (1020) may be a Rogers PCB, but is not necessarily limited thereto.

[0189] In this way, the aerosol generating device (1) according to the present disclosure can ensure normal operation of each circuit element without significantly increasing manufacturing costs by classifying circuit elements according to operating conditions and / or operating characteristics and mounting them on different circuit boards.

[0190] The second circuit board (1020) can be directly mounted on the surface of the first circuit board (1010). In this way, the aerosol generating device (1) according to the present disclosure can achieve mass production and low cost through an automated assembly process, along with miniaturization of the entire circuit board portion, by directly mounting another circuit board on the surface of one circuit board using Surface Mount Technology (SMT).

[0191] Meanwhile, if charging and / or discharging is performed at a specific critical temperature or higher, the power supply (130) may not operate normally or its lifespan may be reduced. Therefore, it may be desirable to minimize the transfer of heat generated from the second circuit board (1020) to the power supply (130) during the process of amplifying the RF signal. To this end, the second circuit board (1020) may be positioned so as not to overlap with the power supply (130) in any of the left-right, front-back, and up-down directions.

[0192] In one example, the power source (130) and the first circuit board (1010) are arranged parallel to each other, and the first circuit board (1010) may include a portion that extends beyond one end of the power source (130). The second circuit board (1020) may be mounted on the surface of the extended portion. Additionally, the second circuit board (1020) may be mounted on the side of the first circuit board (1010) that does not face the power source (130). Accordingly, the distance between the point where heat is generated on the second circuit board (1020) and the power source (130) is increased, and as the area where heat transfer occurs is reduced, the heat transferred from the power source (130) can be minimized.

[0193] Additionally, the aerosol generating device (1) may include a heat dissipation unit (40) for effectively discharging or dispersing heat generated from the second circuit board (1020) to minimize the transfer of heat generated from the second circuit board (1020) to the power source (130). The heat dissipation unit (40) may be placed in contact with or adjacent to at least one surface of the second circuit board (1020). As shown in FIG. 8, the heat dissipation unit (40) may be placed adjacent to the portion of the rear surface of the first circuit board (1010) where the second circuit board (1020) is mounted. At this time, circuit elements for amplifying RF signals may be placed on the front surface of the second circuit board (1020) (i.e., the right-facing surface in the cross-sectional view of FIG. 8). Accordingly, heat generated from circuit elements (e.g., the driving amplifier (220) and / or power amplifier (230) of FIG. 1) can be transferred to the power supply (130) through the first circuit board (1010), the second circuit board (1020), and / or the heat dissipation unit (40), and thus, heat transfer can be reduced. However, since FIG. 8 is merely an example, the heat dissipation unit (40) may be placed in contact with or adjacent to the front surface of the second circuit board (1020), or adjacent to both the front and rear surfaces of the second circuit board (1020).

[0194] The heat dissipation unit (40) may include at least one of a heat sink, a fan, and a heat pipe. The heat sink may have a large surface area to absorb heat using a material with high thermal conductivity and to effectively release heat into the atmosphere. In one example, the heat sink may be a graphite sheet, but is not necessarily limited thereto. The heat sink may be manufactured from a metal material such as copper or aluminum, or may include a fin or wing structure to increase the surface area. The fan may rapidly move heat through air circulation and facilitate heat exchange with the atmosphere. The heat pipe may have a structure in which a refrigerant is contained inside an outer material comprising at least one of a metal material, a ceramic material, and a carbon material. When heat is applied to one end of the heat pipe, the refrigerant inside the heat pipe evaporates, thereby allowing thermal energy to move to the other end of the heat pipe. The heat pipe can efficiently dissipate heat. Due to the heat dissipation unit (40), stable operation of the power supply (130) is ensured, and the lifespan of the power supply (130) can be increased.

[0195] Meanwhile, although only the first circuit board (1010) and the second circuit board (1020) are illustrated in FIG. 8, the aerosol generating device (1) may include other circuit boards. For example, the aerosol generating device (1) may include modular and / or functional PCBs such as a sensor PCB, a button PCB (e.g., an RGB-KEY PCB), etc. The number of modular and / or functional PCBs included in the aerosol generating device (1) may be determined to an appropriate number depending on the application. The first circuit board (1010) and the second circuit board (1020) will be described in more detail below with reference to FIGS. 9 to 12.

[0196] FIG. 9 is a drawing showing one side of a first circuit board and a second circuit board according to one embodiment.

[0197] Referring to FIG. 9, an example is illustrated in which a charging circuit (120), a first power converter (140), a second power converter (150), a third power converter (160), a processor (170), and an RF signal generation circuit (210) described with reference to FIG. 1 are mounted on a first circuit board (1010), and a driving amplifier (220), a power amplifier (230), a directional coupler (240), and a temperature sensing circuit (250) described with reference to FIG. 1 are mounted on a second circuit board (1020). Since FIG. 9 is an example for explaining a preferred arrangement method of circuit elements mounted on the first circuit board (1010) and the second circuit board (1020), it will be understood by those skilled in the art that other examples not contradicting said arrangement method may also be included in various embodiments of the present disclosure. In addition, although not shown in FIG. 9, the power connector (110) described with reference to FIG. 1 may also be placed on the first circuit board (1010).

[0198] A first region (910) in which a digital circuit including a processor (170) is mounted within a first circuit board (1010) and a second region (920) in which an analog circuit including at least one power conversion circuit (e.g., a first power converter (140), a second power converter (150), and a third power converter (160)) is mounted may be electrically and physically separated.

[0199] For example, as illustrated in FIG. 9, when a second circuit board (1020) is mounted on the upper side of a first circuit board (1010) and a first region (910) is positioned on the lower side of a first circuit board (1010), the second region (920) is positioned in the remaining area excluding the area where the second circuit board (1020) is mounted and the first region (910), thereby physically separating the first region (910) and the second region (920). Additionally, the first region (910) and the second region (920) may each include a ground. For example, the first circuit board (1010) may each include a first ground (9010) connected to circuit elements positioned in the first region (910), and a second ground (9020) connected to circuit elements positioned in the second region (920). Accordingly, the circuit elements placed in the first region (910) and the circuit elements placed in the second region (920) can be electrically separated.

[0200] An analog circuit including at least one power conversion circuit processes a continuous signal and may use a relatively large voltage and / or current. A digital circuit including a processor (170) processes a discrete signal and may use a relatively small voltage and / or current. As such, since the analog circuit and the digital circuit process signals of different properties, connecting them to a single common ground may result in performance degradation due to noise and signal interference. Therefore, it may be desirable to separate the first ground (9010) and the second ground (9020) to prevent the occurrence of noise and signal interference.

[0201] The first ground (9010) and the second ground (9020) are separated from each other but can be electrically connected by a noise reduction element (9015) at only a single point. Accordingly, the first ground (9010) and the second ground (9020) can provide a common reference potential while minimizing the occurrence of noise and signal interference. The noise reduction element (9015) may include at least one of a zero-ohm resistor and a bead. The bead is a type of inductor that can block electromagnetic waves or remove or absorb high-frequency noise.

[0202] Meanwhile, the RF signal generation circuit (210) corresponds to an analog circuit, but since it handles relatively small power compared to the power conversion circuit, it may be preferable to place it in the first area (910). Additionally, the charging circuit (120) corresponds to a hybrid circuit that operates in a combined form of an analog circuit and a digital circuit, but since it performs the function of regulating voltage and / or current, it may be more preferable to place it in the second area (920). Accordingly, the RF signal generation circuit (210) can be connected to the first ground (9010), and the charging circuit (120) can be connected to the second ground (9020).

[0203] Each of the first power converter (140), the second power converter (150), and the third power converter (160) may be arranged in a manner that does not include facing sides to minimize influence on each other (e.g., transmission of heat, noise, etc.). For example, as shown in FIG. 9, the first power converter (140), the second power converter (150), and the third power converter (160) may be arranged so as not to overlap each other along a diagonal line passing through the center of the second region (920), but are not necessarily limited thereto.

[0204] Meanwhile, FIG. 9 may be a drawing showing the front surface of the first circuit board (1010) (i.e., the right-facing side in the cross-sectional view of FIG. 8). Since some heat may be generated during the process of the power conversion circuit converting power, the power conversion circuit may be placed on a surface of the first circuit board (1010) that does not face the heat-sensitive power source (130). However, it is not necessarily limited to this.

[0205] The second circuit board (1020) may include a third ground (9030) connected to at least one amplifier (e.g., a driving amplifier (220) and / or a power amplifier (230)). The third ground (9030) is directly connected to the second ground (9020), but may be connected to the first ground (9010) through a noise reduction element (e.g., a noise reduction element (9015)). Direct connection between the third ground (9030) and the second ground (9020) may mean that they are connected to each other without passing through a noise reduction element. Since the second ground (9020) and the third ground (9030) are directly connected, they can be viewed as the same ground. The second ground (9020) and the third ground (9030) may be electrically connected to the first ground (9010) only through the noise reduction element (9015).

[0206] The second circuit board (1020) may further include a directional coupler (240) that separates and receives an amplified RF signal and a reflected electromagnetic wave that is radiated by a radiating unit (e.g., the radiating unit (30) of FIG. 1 and FIG. 8) and then reflected from the insertion space. In order for the directional coupler (240) to accurately detect the reflected electromagnetic wave corresponding to a relatively small signal, it may be desirable to be positioned as far as possible from at least one amplifier that outputs a relatively large signal.

[0207] The directional coupler (240) and at least one amplifier may be positioned near two edges or corners of the second circuit board (1020) that face each other with respect to the center of the second circuit board (1020). For example, as shown in FIG. 9, the directional coupler (240) may be positioned near the left edge of the second circuit board (1020), whereas the driving amplifier (220) and / or power amplifier (230) may be positioned near the right edge of the second circuit board (1020). Here, being positioned near the edge or corner may mean that the distance between the circuit element and the edge or corner is shorter than the distance between the circuit element and the center of the second circuit board (1020), but is not necessarily limited thereto.

[0208] A temperature sensing circuit (250) may be placed adjacent to a power amplifier (230). The temperature sensing circuit (250) may be used to prevent overheating of the second circuit board (1020). The most heat may be generated from the power amplifier (230) in the second circuit board (1020). Therefore, the temperature sensing circuit (250) may be placed as close as possible to the power amplifier (230) to sensitively measure temperature changes of the second circuit board (1020). The processor (170) may stop the operation of at least one of the RF signal generation circuit (210) and at least one amplifier in response to the determination that the temperature measured by the temperature sensing circuit (250) exceeds a preset threshold. Accordingly, overheating of the second circuit board (1020) may be prevented.

[0209] The first circuit board (1010) and / or the second circuit board (1020) may be a double-sided circuit board or a multilayer circuit board. If the first circuit board (1010) and / or the second circuit board (1020) are multilayer circuit boards, the first circuit board (1010) and / or the second circuit board (1020) may include one or more internal layers (e.g., ground layers) in addition to the two sides. If the first circuit board (1010) and / or the second circuit board (1020) are multilayer circuit boards that include at least one ground layer internally, the first ground (9010), the second ground (9020), and / or the third ground (9030) may also be formed in at least one ground layer. With reference to FIGS. 10 and 11, the case where the first circuit board (1010) and / or the second circuit board (1020) are multilayer circuit boards will be described below.

[0210] FIG. 10 is a drawing illustrating a ground layer of a first circuit board according to one embodiment.

[0211] Referring to FIG. 10, a ground layer (1012) inside a first circuit board (1010) is shown. The first ground (10010) and the second ground (10020) may each be placed in physically separated regions within the ground layer (1012). For example, the first ground (10010) may be placed at a position corresponding to a region (e.g., the first region (910) of FIG. 9) on the front of the first circuit board (1010) where a digital circuit including a processor (170) is mounted. Additionally, the second ground (10020) may be positioned at a location corresponding to an area (e.g., the second area (920) of FIG. 9) where an analog circuit including at least one power conversion circuit (e.g., the first power converter (140), the second power converter (150), and the third power converter (160)) is mounted on the front of the first circuit board (1010) and / or an area where the second circuit board (1020) is mounted.

[0212] Circuit elements mounted on the front surface of the first circuit board (1010) may be connected to the first ground (10010) or the second ground (10020) through connection means such as vias. For example, the processor (170) and the RF signal generation circuit (210) may be connected to the first ground (10010), and the charging circuit (120), the first power converter (140), the second power converter (150), and the third power converter (160) may be connected to the second ground (10020). In one example, the driving amplifier (220), the power amplifier (230), and the temperature sensing circuit (250) mounted on the second circuit board (1020) may also be connected to the second ground (10020).

[0213] Meanwhile, since a larger ground area is preferable, the shapes of the first ground (10010) and the second ground (10020) are illustrated in a highly simplified manner in FIG. 10. However, if a component sensitive to heat or noise generated from the ground is placed on at least one of the two sides of the first circuit board (1010) and / or the second circuit board (1020), a ground may not be formed at a position corresponding to (e.g., overlapping) the area where such component is placed. Additionally, it may be preferable for the area of ​​the second ground (10020) to be larger than the area of ​​the first ground (10010).

[0214] The first ground (10010) and the second ground (10020) may be electrically connected by a noise reduction element (10015) at only one point to provide a common reference potential while minimizing the occurrence of noise and signal interference. The noise reduction element (10015) may include at least one of a 0-ohm resistor and a bead. The bead is a type of inductor and can block electromagnetic waves or remove or absorb high-frequency noise.

[0215] FIG. 11 is a drawing illustrating a ground layer of a second circuit board according to one embodiment.

[0216] Referring to FIG. 11, a ground layer (1022) inside a second circuit board (1020) is shown. A third ground (11030) may be formed in the ground layer (1022). The third ground (11030) may be positioned at a location corresponding to an area on the front of the second circuit board (1020) where at least one amplifier (e.g., a driving amplifier (220) and / or a power amplifier (230)) is mounted.

[0217] At least one amplifier mounted on the front surface of the second circuit board (1020) can be connected to a third ground (11030) through a connection means such as a via. Accordingly, a first ground (e.g., the first ground (9010) of FIG. 9 or the first ground (10010) of FIG. 10) connected to an RF signal generation circuit (e.g., the RF signal generation circuit (210) of FIG. 1 and FIG. 9)) and a third ground (11030) connected to at least one amplifier can be separated. Although both the RF signal generation circuit and at least one amplifier correspond to analog circuits, considering that at least one amplifier uses much greater power (e.g., voltage and / or current) than the RF signal generation circuit, it may be desirable to separate the first ground connected to the RF signal generation circuit from the third ground (11030) connected to at least one amplifier in order to ensure stable operation of the RF signal generation circuit. The first ground and the third ground (11030) may be electrically connected at a single point by a noise reduction element (e.g., the noise reduction element (9015) of FIG. 9 or the noise reduction element (10015) of FIG. 10). The noise reduction element may include at least one of a 0-ohm resistor and a bead. The bead is a type of inductor and can block electromagnetic waves or remove or absorb high-frequency noise.

[0218] Meanwhile, since a larger ground area is preferable, the shape of the third ground (11030) in FIG. 11 is illustrated in a very simplified manner. However, if a component sensitive to heat or noise generated from the ground is placed on at least one of the two sides of the second circuit board (1020), a ground may not be formed at a position corresponding to (e.g., overlapping) the area where such a component is placed.

[0219] Meanwhile, with reference to FIG. 9, an example in which ground is formed on the front surface of the first circuit board (1010) and the second circuit board (1020) is described, with reference to FIG. 10, an example in which ground is formed on the ground layer (1012) of the first circuit board (1010) is described, and with reference to FIG. 11, an example in which ground is formed on the ground layer (1022) of the second circuit board (1020) is described, but ground may be formed on multiple surfaces and / or layers among the two sides of the first circuit board (1010) and / or the second circuit board (1020) and at least one ground layer. In this case, first grounds formed on different layers or surfaces (e.g., first ground (9010) and first ground (10010)) may be connected to each other, and second and / or third grounds formed on different layers or surfaces (e.g., second ground (9020), third ground (9030), second ground (10020) and third ground (11030)) may be connected to each other. However, it may be preferable that the connection between the first ground and the second and / or third grounds be formed by a noise reduction element (e.g., noise reduction element (9015) of FIG. 9 or noise reduction element (10015) of FIG. 10) only on one of the multiple surfaces and / or layers.

[0220] FIG. 12 is a drawing for explaining a shielding part according to one embodiment.

[0221] Referring to FIG. 12, the second circuit board (1020) may include a shielding part (60) disposed to surround at least one amplifier (e.g., a driving amplifier (220) and / or a power amplifier (230)) on the second circuit board (1020). The shielding part (60) can protect circuit elements sensitive to electromagnetic interference (EMI) by preventing electromagnetic waves generated from at least one amplifier from being emitted to the outside.

[0222] The shielding portion (60) may include at least one of a metal shielding cap (or cover), a shielding plate, and an EMI shielding foam. The metal shielding cap (or cover) is in the form of a metal cap (or cover) that encloses a circuit element and may be manufactured from a metal such as aluminum, copper, or iron. The metal shielding cap (or cover) may be designed to cover the top of at least one amplifier and enclose its sides. The shielding plate may have a flat structure that is placed on the second circuit board (1020) and covers at least one amplifier. The EMI shielding foam may use a conductive foam to gently and flexibly enclose at least one amplifier. The shielding portion (60) may be connected to a third ground (9030) to enhance the shielding effect and improve the stability of the entire circuit board.

[0223] As described with reference to FIGS. 9 to 12, according to the aerosol generating device (1) of the present disclosure, circuit elements mounted on the same circuit board can be arranged in an appropriate manner considering their respective operating conditions and / or operating characteristics. Accordingly, stable operation of circuit elements implementing dielectric heating can be ensured.

[0224] Some or other embodiments of the present disclosure described above are not exclusive or distinct from one another. Some or other embodiments of the present disclosure described above may be used in combination or combined for their respective configurations or functions.

[0225] For example, this means that configuration A described in a specific embodiment and / or drawing and configuration B described in another embodiment and / or drawing can be combined. That is, it means that even if the combination between configurations is not directly described, combination is possible except in cases where it is described that combination is impossible.

[0226] The foregoing detailed description should not be interpreted restrictively in all respects and should be considered exemplary. The scope of the invention shall be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the invention are included within the scope of the invention.

Claims

1. In an aerosol generating device, everyone; A first circuit board on which a processor is mounted; A second circuit board spaced apart from the first circuit board and having an RF signal generating circuit for generating an RF signal using power supplied from the power source, and at least one amplifier for amplifying the generated RF signal mounted thereon; and It includes a radiating unit that heats the aerosol-generating article by radiating the amplified RF signal in the form of electromagnetic waves into an insertion space into which the aerosol-generating article is inserted, and The above processor is configured to control the RF signal generation circuit and the at least one amplifier, an aerosol generating device.

2. In Paragraph 1, An aerosol generating device in which a first region in which the RF signal generating circuit is mounted and a second region in which at least one amplifier is mounted are physically separated within the second circuit board.

3. In Paragraph 1, An aerosol generating device wherein the RF signal generating circuit and the at least one amplifier are each positioned near two edges or corners facing each other with respect to the center of the second circuit board among the edges or corners of the second circuit board.

4. In Paragraph 1, The second circuit board includes a first ground connected to the RF signal generation circuit, and a second ground disposed separately from the first ground and connected to the at least one amplifier. An aerosol generating device in which the first ground and the second ground are electrically connected at a single point by a noise reduction element.

5. In Paragraph 4, The above noise reduction element comprises at least one of a zero-ohm resistor and a bead, an aerosol generating device.

6. In Paragraph 4, An aerosol generating device in which, when the second circuit board is a multilayer circuit board including at least one ground layer inside, the first ground and the second ground are respectively disposed in physically separated regions within the at least one ground layer.

7. In Paragraph 1, The above at least one amplifier is, An aerosol generating device comprising a driving amplifier for amplifying the level of the generated RF signal, and a power amplifier for amplifying the power of the RF signal received from the driving amplifier.

8. In Paragraph 7, It further includes a temperature sensing circuit mounted on the second circuit board, and The above temperature sensing circuit is an aerosol generating device positioned adjacent to the above power amplifier.

9. In Paragraph 8, An aerosol generating device, wherein the processor stops the operation of at least one of the RF signal generating circuit and at least one of the at least one amplifier in response to the determination that the temperature measured by the temperature sensing circuit exceeds a preset threshold.

10. In Paragraph 1, An aerosol generating device further comprising a heat dissipation member for effectively discharging or dispersing heat generated from the second circuit board to minimize the transfer of heat generated from the second circuit board to the power source.

11. In Paragraph 10, The second circuit board is arranged so as not to overlap with the power source in any of the left-right, front-back, and up-down directions, and The above-mentioned heat dissipation part is disposed in contact with or adjacent to at least one surface of the second circuit board, an aerosol generating device.

12. In Paragraph 1, An aerosol generating device further comprising a directional coupler that separates and receives the amplified RF signal and the reflected electromagnetic wave that is radiated by the radiating unit and then reflected from the insertion space.

13. In Paragraph 12, An aerosol generating device in which the directional coupler and the at least one amplifier are each positioned near two edges or corners of the second circuit board that face each other with respect to the center of the second circuit board.

14. In Paragraph 12, An aerosol generating device in which the directional coupler and the at least one amplifier are disposed on different sides of the second circuit board.

15. In Paragraph 1, It further includes at least one power conversion circuit mounted on the first circuit board and for converting power supplied from the power source into power suitable for each of the processor, the RF signal generation circuit, and the at least one amplifier. An aerosol generating device in which a region on which a digital circuit including the processor is mounted and a region on which an analog circuit including the at least one power conversion circuit is mounted are electrically and physically separated.

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