Light-emitting device

Abstract

According to an aspect of the present invention, provided may be a light-emitting device comprising: a plurality of light-emitting elements configured to generate light; and a thermal conductor unit configured to provide a light-emitting element arrangement area in which the plurality of light-emitting elements are disposed, wherein the thermal conductor unit includes a heat-dissipating thermal conductor configured to dissipate heat generated by the plurality of light-emitting elements, and an area of the heat-dissipating thermal conductor on a plane is formed to be larger than an area of the light-emitting element arrangement area.

Description

light-emitting device

[0001] The present invention relates to a light-emitting device.

[0002] A light-emitting device is a device that generates light and is used in various fields such as display devices, automotive lamps, and general lighting. Generally, automotive light-emitting devices are installed at the front of a vehicle to illuminate the road ahead, thereby helping the driver maintain visibility. Such light-emitting devices may include multiple light-emitting elements that generate light to form low beam and high beam patterns depending on the driver's operation. When emitting light, the light-emitting device may generate heat.

[0003] Recently, due to the need to improve performance and reliability, there is an increasing demand for light-emitting devices with improved heat dissipation characteristics.

[0004] An embodiment of the present invention aims to provide a light-emitting device that efficiently releases heat, thereby increasing heat dissipation efficiency and improving reliability.

[0005] Embodiments of the present invention aim to provide a light-emitting device having a stable structure without damage such as cracking even under heat generation or thermal stress.

[0006] Embodiments of the present invention aim to provide a light-emitting device having high illumination by increasing extraction efficiency.

[0007] According to one aspect of the present invention, a light-emitting device may be provided, comprising: a plurality of light-emitting elements configured to generate light; and a thermal conductor unit configured to provide a light-emitting element placement area in which the plurality of light-emitting elements are arranged, wherein the thermal conductor unit comprises a heat dissipation thermal conductor configured to dissipate heat generated from the plurality of light-emitting elements, and the area of ​​the heat dissipation thermal conductor on a plane is formed to be larger than the area of ​​the light-emitting element placement area.

[0008] Additionally, a light-emitting device may be provided, wherein the heat conductor unit comprises: an upper heat conductor electrically connected to the plurality of light-emitting elements; and a support substrate configured to support the upper heat conductor, the heat dissipation heat conductor.

[0009] In addition, a light-emitting device may be provided in which the light-emitting element placement area overlaps with the heat dissipation thermal conductor on a plane.

[0010] In addition, a light-emitting device may be provided in which the area of ​​the heat dissipation thermal conductor is about 30% to about 80% of the area of ​​the thermal conductor unit on a plane.

[0011] Additionally, a light-emitting device may be provided in which at least one corner of the heat dissipation thermal conductor has a rounded shape, the heat conductor unit includes an insulator, and the heat dissipation thermal conductor is arranged such that its peripheral surface is surrounded by the insulator.

[0012] Additionally, a light-emitting device may be provided in which the heat dissipation thermal conductor is formed to have a predetermined first length in the horizontal direction, a predetermined second length in the thickness direction, and a predetermined third length perpendicular to the first length and the second length, wherein the ratio of the first length to the second length is different from the ratio of the third length to the second length.

[0013] Additionally, the above-described heat conductor unit may include a first insulator disposed between the heat dissipation heat conductor and the plurality of light-emitting elements so as to insulate the heat dissipation heat conductor and the plurality of light-emitting elements, and a light-emitting device may be provided in which the thickness of the first insulator is lower than the thickness of the heat dissipation heat conductor.

[0014] Additionally, the heat conductor unit may further include a second insulator disposed below the first insulator to cover one or more of the upper and lower surfaces of the heat dissipation heat conductor, and a light-emitting device may be provided in which the thickness of the second insulator is greater than the thickness of the first insulator.

[0015] Additionally, a light-emitting device may be provided, further comprising a supporting thermal conductor configured to support the second insulator in order to dissipate heat generated from the plurality of light-emitting elements together with the heat-dissipating thermal conductor.

[0016] In addition, a light-emitting device may be provided in which the second insulator comprises carbon fiber.

[0017] Additionally, a light-emitting device may be provided, comprising a plurality of controllers configured to control the plurality of light-emitting elements, wherein the upper thermal conductors are formed in a plurality, and the plurality of upper thermal conductors extend from the plurality of controllers toward the light-emitting element placement area so as to electrically connect the plurality of light-emitting elements and the plurality of controllers.

[0018] Additionally, a light-emitting device may be provided in which the edge of the heat dissipation thermal conductor is arranged to intersect a virtual line connecting any one of the plurality of controllers and the light-emitting element closest to any one of the plurality of controllers on a plane.

[0019] Additionally, a light-emitting device may be provided, wherein the upper heat conductors are formed in a plurality of units, and the heat conductor unit further provides a first placement area located near the light-emitting element placement area where some of the plurality of upper heat conductors may be placed; and a second placement area located further apart from the light-emitting element placement area than the first placement area where other parts of the plurality of upper heat conductors may be placed.

[0020] Additionally, a light-emitting device may be provided in which the density of some of the plurality of upper heat conductors disposed in the first placement area is greater than the density of other of the plurality of upper heat conductors disposed in the second placement area.

[0021] Additionally, the plurality of light-emitting elements may comprise a first light-emitting element; and a second light-emitting element spaced apart from the first light-emitting element and not electrically connected to the first light-emitting element, wherein each of the first light-emitting element and the second light-emitting element comprises: a second-1 thermal conductor electrically connected to the thermal conductor unit; a second-2 thermal conductor electrically connected to the thermal conductor unit and spaced apart from the second-1 thermal conductor; and a light-emitting part electrically connected to the second-1 thermal conductor and the second-2 thermal conductor to generate light. A light-emitting device may be provided.

[0022] Additionally, a light-emitting device may be provided in which one of the plurality of heat-conducting parts is positioned between the 2-1 heat conductor of the first light-emitting element and the 2-2 heat conductor of the second light-emitting element.

[0023] Additionally, a light-emitting device may be provided in which the distance between the 2-1 thermal conductor of the first light-emitting element and the 2-2 thermal conductor of the second light-emitting element is greater than the distance between the 2-1 thermal conductor of the first light-emitting element and the 2-2 thermal conductor.

[0024] Additionally, a light-emitting device may be provided in which at least some of the plurality of heat conduction sections in a planar shape are bent in a direction offset from the direction of extension.

[0025] Additionally, a light-emitting device may be provided, comprising: a plurality of light-emitting elements configured to generate light; and a thermal conductor unit configured to provide a light-emitting element placement area in which the plurality of light-emitting elements are arranged, wherein the thermal conductor unit includes a heat-dissipating thermal conductor configured to dissipate heat generated from the plurality of light irradiation, and the area of ​​the heat-dissipating thermal conductor when viewed in a first direction is formed to be larger than the area of ​​the light-emitting element placement area.

[0026] Additionally, a light-emitting device may be provided, comprising: a plurality of light-emitting elements configured to generate light; and a thermal conductor unit configured to provide a light-emitting element placement area in which the plurality of light-emitting elements are arranged, wherein the thermal conductor unit includes a heat-dissipating thermal conductor configured to dissipate heat generated from the plurality of light irradiation, and the area of ​​the heat-dissipating thermal conductor on a flat surface is formed to be larger than the area of ​​the light-emitting element placement area.

[0027] A light-emitting device of one embodiment of the present invention can efficiently emit heat, thereby increasing heat dissipation efficiency and reliability.

[0028] In addition, the light-emitting device is small in size and can generate an appropriate amount of light suitable for the purpose.

[0029] In addition, the light-emitting device can generate light to form one or more of a high beam pattern and a low beam pattern.

[0030] FIG. 1 is a schematic plan view showing a light-emitting device according to one embodiment of the present invention.

[0031] FIG. 2 is a schematic diagram showing a first example in which a heat dissipation thermal conductor of a light-emitting device according to one embodiment of the present invention is supported by a second insulator.

[0032] FIG. 3 is a schematic diagram showing a second example in which a heat dissipation thermal conductor of a light-emitting device according to one embodiment of the present invention is supported by a second insulator.

[0033] FIG. 4 is a schematic diagram showing a third example in which a heat dissipation thermal conductor of a light-emitting device according to one embodiment of the present invention is supported by a second insulator.

[0034] FIG. 5 is a schematic diagram showing a light-emitting device according to another embodiment of the present invention.

[0035] FIG. 6 is a schematic diagram showing a light-emitting device according to another embodiment of the present invention.

[0036] FIG. 7 is a schematic diagram showing a light-emitting device according to another embodiment of the present invention.

[0037] In the following description, numerous specific details are described for the purpose of explanation and to provide a complete understanding of the various embodiments or implementations of the present disclosure. As used herein, “Embodiments” and “Implementations” are interchangeable terms indicating non-limiting examples of devices or methods utilizing one or more of the concepts of the invention disclosed herein. However, it will be apparent that various embodiments may be implemented without utilizing these specific details or by utilizing one or more equivalent arrangements. In other examples, known structures and devices are illustrated in block diagram form to avoid unnecessarily obscuring the various embodiments. Furthermore, while various embodiments may differ from one another, they do not need to be exclusive. For example, specific shapes, configurations, and characteristics of an embodiment may be used or implemented in other embodiments without departing from the scope of the concept of the invention.

[0038] Unless otherwise specified, the illustrated embodiments should be understood as providing exemplary features of varying details in some ways in which the concept of the present invention can actually be realized. Therefore, unless otherwise specified, features, components, modules, layers, membranes, panels, regions and / or modes of various embodiments (hereinafter referred to individually or collectively as “elements”) may be combined, separated, interchanged, and / or rearranged differently without departing from the scope of the concept of the present invention.

[0039] The use of cross-hatching and / or shading in the attached drawings is generally provided to clarify the boundaries between adjacent elements. As such, the presence or absence of cross-hatching or shading, unless otherwise specified, does not imply or indicate any preference or requirement regarding the specific material, material properties, dimensions, proportions, commonalities between the exemplified elements, or any other features, attributes, and characteristics of the elements. Additionally, in the attached drawings, the size and relative size of the elements may be exaggerated for clarity and / or illustrative purposes. When embodiments are implemented differently, specific process sequences may be performed differently from the described order. For example, two consecutively described processes may be performed substantially simultaneously or in an order opposite to the described order. Also, the same reference numerals indicate the same elements.

[0040] When an element such as a layer is referred to as being "on", "connected to," or "coupled to" another element or layer, said element may be directly on, connected to, or coupled to the other element or layer, or an interposed element or layer may exist. However, when an element or layer is referred to as being "directly on", "directly connected to," or "directly coupled to" another element or layer, no interposed element or layer exists. To this end, the term "connected" may refer to a physical, electrical, and / or fluid connection with or without an interposed element. Furthermore, the DR1-axis, DR2-axis, and DR3-axis are not limited to the three axes of an orthogonal coordinate system, such as the x, y, and z axes, and may be interpreted in a broader sense. For example, the DR1-axis, DR2-axis, and DR3-axis may be perpendicular to each other, or they may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “one or more of X, Y, and Z” and “one or more selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed articles.

[0041] Although terms such as “first,” “second,” etc., may be used herein to describe various forms of elements, these elements shall not be limited by these terms. These terms are used to distinguish one element from another. Therefore, the first element discussed below may be named the second element without departing from the teachings of the present disclosure.

[0042] Spatially relative terms such as “below,” “under,” “immediately below,” “lower,” “above,” “upper,” “upper,” “higher,” and “side” (e.g., as in “side wall”) may be used for descriptive purposes and thereby to describe the relationship between one element and another element(s) as illustrated in the drawings. Spatially relative terms are intended to include different orientations of the device in use, operation, and / or manufacture in addition to the orientations illustrated in the drawings. For example, if the device in the drawings is inverted, the element described as “below” or “under” another element or feature will be oriented “above” the other element or feature. Therefore, the exemplary term “below” may include both upper and lower orientations. Additionally, the device may be oriented differently (e.g., rotated 90° or oriented in a different orientation), and thus, spatially relative descriptors used herein may also be interpreted accordingly.

[0043] The technical terms used in this specification are intended to describe specific embodiments and are not limiting. The singular form used in this specification also includes the plural form unless the context clearly indicates otherwise. Additionally, the terms “comprising,” “comprising,” “comprising,” and / or “comprising” used in this specification specify the presence of the mentioned features, integers, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Furthermore, the terms “substantially,” “about,” and other similar terms used in this specification are used to indicate approximation rather than degree, and are used to describe inherent deviations of measured, calculated, and / or provided values ​​that may be recognized by a person of ordinary knowledge in the art.

[0044] Various embodiments are described below with reference to cross-sectional and / or exploded drawings, which are schematic examples of idealized embodiments and / or intermediate structures. As such, variations from the shapes in the drawings may be expected, for example, as a result of manufacturing techniques and / or tolerances. Therefore, the embodiments disclosed herein should not be interpreted as being limited to the shapes of specific illustrated regions, but should be interpreted to include, for example, deviations in shape resulting from manufacturing. In this way, the regions illustrated in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and thus are not intended to have a limiting meaning.

[0045] As is customary in the art, some embodiments may be illustrated and described in the accompanying drawings in terms of functional blocks, units, and / or modules. Those skilled in the art will understand that these blocks, units, and / or modules are physically implemented by electronic (or optical) circuits, such as logic circuits, discrete components, microprocessors, wiring circuits, memory elements, and wiring connections, formed using semiconductor-based manufacturing technology or other manufacturing technology. Where blocks, units, and / or modules are implemented by microprocessors or other similar hardware, they may be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and may optionally be driven by firmware and / or software. Additionally, each block, unit, and / or module may be implemented by dedicated hardware, or as a combination of dedicated hardware for performing some functions and a processor for performing other functions (e.g., one or more programmed processors and associated circuits). Additionally, each of the blocks, units, and / or modules of some embodiments may be physically separated into two or more interacting and individual blocks, units, and / or modules without departing from the scope of the concept of the present invention. Additionally, the blocks, units, and / or modules of some embodiments may be physically combined into more complex blocks, units, and / or modules without departing from the scope of the concept of the present invention.

[0046] Unless otherwise defined, all terms used herein (including technical or scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with that meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this specification.

[0047] Hereinafter, a specific configuration of a light-emitting device (1) according to one embodiment of the present invention will be described with reference to the drawings.

[0048] FIG. 1 is a schematic plan view showing a light-emitting device according to an embodiment of the present invention. FIG. 2 is a schematic drawing showing a first example in which a heat dissipation thermal conductor of a light-emitting device according to an embodiment of the present invention is supported by a second insulator. FIG. 3 is a schematic drawing showing a second example in which a heat dissipation thermal conductor of a light-emitting device according to an embodiment of the present invention is supported by a second insulator. FIG. 4 is a schematic drawing showing a third example in which a heat dissipation thermal conductor of a light-emitting device according to an embodiment of the present invention is supported by a second insulator.

[0049] Referring to FIGS. 1 to 4, a light-emitting device (1) according to one embodiment of the present invention can generate light by receiving power from an external source. The light-emitting device (1) may be applied to a vehicle headlamp, but is not limited thereto. For example, the light-emitting device (1) may be positioned at the front of a vehicle to generate light toward a lens, thereby forming one or more of a high beam pattern and a low beam pattern. The light-emitting device (1) may include a light-emitting element (100), a thermal conductor unit (200), a supporting thermal conductor (300), and a controller (400).

[0050] A plurality of light-emitting elements (100) may be formed to generate light. These plurality of light-emitting elements (100) may generate light to form one or more of a high-beam pattern and a low-beam pattern. For example, some of the plurality of light-emitting elements (100) may generate light to form a high-beam pattern, and other parts may generate light to form a low-beam pattern. The size of the said portion of the plurality of light-emitting elements (100) may be formed to be larger than the size of the said other portion of the plurality of light-emitting elements (100).

[0051] A plurality of light-emitting elements (100) may be placed in the light-emitting element placement area (200a) to be described later of the thermal conductor unit (200). For example, a plurality of light-emitting elements (100) may be arranged spaced apart from each other in the horizontal direction (or first direction, x direction) in the light-emitting element placement area (200a). Additionally, a plurality of light-emitting elements (100) may also be arranged in the vertical direction (or second direction, y direction) perpendicular to the first direction and the height direction in the light-emitting element placement area (200a).

[0052] The length of a plurality of light-emitting elements (100) arranged in a first direction (or x-direction) may be formed to be greater than the length of a plurality of light-emitting elements (100) arranged in a second direction (or y-direction). A plurality of light-emitting elements (100) arranged in a first direction (or x-direction) may have different areas in one region from a plurality of light-emitting elements (100) arranged in a second direction (or y-direction). Among the plurality of light-emitting elements (100), the light-emitting elements arranged in the second direction (or y-direction) may have an area that is at least three times larger than the area of ​​the light-emitting elements (100) arranged in the first direction (or x-direction). In order to maintain a constant current density of the light-emitting elements (100), a large amount of current may be applied to the light-emitting elements (100) with a large area. For example, a light-emitting element (100) arranged in the second direction (or y-direction) may have a current of about three times or more applied than a light-emitting element (100) arranged in the first direction (or x-direction). When a large current is applied, a large amount of heat is generated, so for efficient heat dissipation, the area of ​​the first thermal conductor (120) to be described later in the light-emitting element (100) arranged in the second direction (or y-direction) may be larger than the area of ​​the first thermal conductor (120) to be described later in the light-emitting element (100) arranged in the first direction (or x-direction), and may be about three times or more larger. More efficiently, the area of ​​the first thermal conductor (120) of the light-emitting element (100) arranged in the second direction (or y-direction) may be about four times or more compared to the area of ​​the first thermal conductor (120) of the light-emitting element (100) arranged in the first direction (or x-direction).

[0053] Additionally, a plurality of light-emitting elements (100) may be arranged in rows and columns. When the first direction (or x-direction) is a row and the second direction (or y-direction) is a column, the plurality of light-emitting elements (100) arranged in the first row may have a smaller area than the plurality of light-emitting elements (100) arranged in the second or third row, which are spaced apart from the first row (spaced downward in FIG. 1). For example, the sum of the areas of the plurality of light-emitting elements (100) arranged in each row may differ for each row. For example, the sum of the areas of the plurality of light-emitting elements (100) in the first and second rows may be smaller than the sum of the areas of the plurality of light-emitting elements (100) in the third or fourth row. The sum of the areas of the plurality of light-emitting elements (100) arranged in the first or second row is approximately 12 mm 2 It may be. The sum of the areas of the plurality of light-emitting elements (100) in the third row is approximately 30 mm, which is at least 2.5 times wider than the sum of the areas of the plurality of light-emitting elements (100) in the first or second row. 2 It can have an area greater than this. In addition, the area of ​​the plurality of light-emitting elements (100) in the fourth row is more than twice the area smaller than this, i.e., about 25 mm 2 It can have an area greater than this. This allows the light irradiation area to be designed by region.

[0054] In addition, the number of light-emitting elements (100) arranged in each column may differ. For example, two light-emitting elements (100) may be arranged in the first column, three light-emitting elements (100) in the second column, three light-emitting elements (100) in the third column, and four light-emitting elements (100) in the fourth column. This can reduce the difficulty of designing the projection light. For example, if the light-emitting device (1) is a headlamp, multiple light-emitting elements (100) arranged in the first row having a narrow area may be in the low-beam area, and multiple light-emitting elements (100) arranged in the second or third row having a wide area may emit light corresponding to the high-beam pattern area. For example, the beam angle of multiple light-emitting elements (100) arranged in the first row may be wider than the beam angle of multiple light-emitting elements (100) arranged in the third or fourth row. In addition, the irradiation distance of the plurality of light-emitting elements (100) arranged in the first row may be shorter than the irradiation distance of the plurality of light-emitting elements (100) arranged in the second row or the fourth row.

[0055] Additionally, multiple light-emitting elements (100) may have first thermal conductors (120) of different sizes. If the area of ​​the light-emitting element (100) is large, the area of ​​the first thermal conductor (120) may also be formed larger. For example, the area of ​​the first thermal conductor (120) of the light-emitting element (100) placed in the third or fourth row may be formed larger than the area of ​​the first thermal conductor (120) of the light-emitting element (100) placed in the first or second row. For example, the area of ​​the first thermal conductor (120) of the light-emitting element (100) placed in the third or fourth row may be about 3 to 5 times larger than the area of ​​the first thermal conductor (120) of the light-emitting element (100) placed in the first or second row. The area of ​​the first thermal conductor (120) can be increased proportionally to the size of the light-emitting element (100). Since the area of ​​the first thermal conductor (120) can be increased proportionally to the size of the light-emitting element (100), the structural stability of the light-emitting device (1) can be increased.

[0056] Each of the plurality of light-emitting elements (100) may include a light-emitting part (110), a first heat conductor (120), and a second heat conductor (130).

[0057] The light-emitting part (110) can generate light. The total thickness of the light-emitting part (110) may be in the range of about 1 µm to 10 µm in the thickness direction. The light-emitting part (110) may include one or more of aluminum gallium arsenide (AlGaAs), gallium arsenide phosphide (GaAsP), aluminum gallium indium phosphide (AlGaInP), gallium phosphide (GaP), indium gallium nitride (InGaN), aluminum gallium phosphide (AlGaP), and zinc selenide (ZnSe). The light-emitting part (110) may include a first conductivity semiconductor layer, a second conductivity semiconductor layer, and an active layer.

[0058] The first conductivity semiconductor layer may be electrically connected to the first-1 thermal conductor (121) described later. The first conductivity semiconductor layer may contain n-type impurities (e.g., Si, Ge, Sn), and in this case, the first conductivity semiconductor layer may be an n-type semiconductor layer. However, this is merely an example, and the first conductivity semiconductor layer may contain p-type impurities.

[0059] The active layer can be stacked on the first conductivity semiconductor layer. For example, the active layer can be located between the first conductivity semiconductor layer and the second conductivity semiconductor layer.

[0060] The second conductivity semiconductor layer may be laminated to the active layer and electrically connected to the first-second thermal conductor (122). The second conductivity semiconductor layer may contain p-type impurities (e.g., Mg, Sr, Ba). For example, the second conductivity semiconductor layer may be a p-type semiconductor layer. However, this is merely an example, and the second conductivity semiconductor layer may contain n-type impurities.

[0061] The first thermal conductor (120) may be electrically connected to the light-emitting part (110). For example, the first thermal conductor (120) may be electrically connected to the first conductive semiconductor layer and the second conductive semiconductor layer. For example, the first thermal conductor (120) may be a chip pad. Additionally, the first thermal conductor (120) may include a first-1 thermal conductor (121) and a first-2 thermal conductor (122).

[0062] The first-1 thermal conductor (121) is placed in one region of the first conductive semiconductor layer and can be electrically connected to the first conductive semiconductor layer.

[0063] The first-second thermal conductor (122) is placed in one region of the second conductive semiconductor layer and can be electrically connected to the second conductive semiconductor layer.

[0064] The areas of the first-1 heat conductor (121) and the first-2 heat conductor (122) may differ from each other. The area of ​​the first-2 heat conductor (122), which generates a lot of heat, is formed to be wider than that of the first-1 heat conductor (121) so that heat can be efficiently released. However, this is not limited to this, and the areas of the first-1 heat conductor (121) and the first-2 heat conductor (122) may be formed to be the same. If the areas of the first-1 heat conductor (121) and the first-2 heat conductor (122) are the same, the light-emitting element (100) can be placed in the heat conductor unit (200) without left-right tilting, so the light-emitting device (1) can be designed with a stable structure.

[0065] The second heat conductor (130) may be placed in an area of ​​the heat conductor unit (200) so as to be positioned between the first heat conductor (120) and the heat conductor unit (200). For example, the second heat conductor (130) may be electrically connected to the upper heat conductor (210) described later. For example, the second heat conductor (130) may be an electrode pad. The second heat conductor (130) may include a second-1 heat conductor (131) and a second-2 heat conductor (132).

[0066] The second-1 thermal conductor (131) may be placed in a region of the thermal conductor unit (200) so as to be positioned between the first-1 thermal conductor (121) and the thermal conductor unit (200). This second-1 thermal conductor (131) may be electrically connected to the first-1 thermal conductor (121) and the thermal conductor unit (200). Additionally, the second-1 thermal conductor (131) may be electrically connected to the first conductive semiconductor layer of the light-emitting part (110). For example, the second-1 thermal conductor (131) may be electrically connected to a semiconductor layer containing n-type impurities.

[0067] The second-2 thermal conductor (132) may be positioned in a region of the thermal conductor unit (200) so as to be located between the first-2 thermal conductor (122) and the thermal conductor unit (200). This second-2 thermal conductor (132) may be electrically connected to the light-emitting part (110) and the thermal conductor unit (200). Additionally, the second-2 thermal conductor (132) may be positioned so as to be spaced apart from the second-1 thermal conductor (131). The second-2 thermal conductor (132) may be electrically connected to a second conductive semiconductor layer. For example, the second-2 thermal conductor (132) may be connected to a semiconductor layer containing p-type impurities.

[0068] The second-2 heat conductor (132) and the second-1 heat conductor (131) may be spaced apart from each other. An air layer in which heat can accumulate may be formed between the second-2 heat conductor (132) and the second-1 heat conductor (131). To resolve the accumulation of heat caused by the formation of the air layer, an insulating material may be filled between the second-2 heat conductor (132) and the second-1 heat conductor (131). For example, an underfill material made of epoxy or silicone, or a material such as pure silicone rubber (PSR), may be filled between the second-2 heat conductor (132) and the second-1 heat conductor (131) to reduce heat accumulation while keeping them electrically separated.

[0069] The sum of the areas of the 2-1 heat conductor (131) and the 2-2 heat conductor (132) can be formed to be about 40% or more and about 90% or less of the area of ​​the light-emitting part (110) when viewed from the top (when viewed from the top), so that an area where heat can sufficiently escape can be secured.

[0070] The thermal conductor unit (200) can support a plurality of light-emitting elements (100). For example, the thermal conductor unit (200) may be a printed circuit board (PCB) or a lead frame substrate that includes a circuit portion. Additionally, the thermal conductor unit (200) may include an alloy composed of one or more of Cu, Zn, Au, Ni, Al, Mg, Cd, Be, W, Mo, Si, Ag, and Fe, or a portion thereof. However, this is merely an example, and the second insulator (222b) of the thermal conductor unit (200), which will be described later, may include one or more insulating materials such as FR1, CEM-1, FR4, and fluoropolymer. For example, FR1 is a material in which copper foil and laminate paper are laminated, and CEM-1 may be a material in which copper foil, glass fiber fabric, laminate paper, and glass fiber fabric are sequentially laminated. Additionally, FR-4 may be a material in which copper foil and glass fiber fabric or glass fiber fabric are laminated. Furthermore, the thermal conductor unit (200) may include ceramics such as alumina (Al2O3), aluminum nitride (AlN), and ZTA (Zirconia Toughened Alumina). Additionally, the thermal conductor unit (200) may include a light-emitting element placement area (200a), a first placement area (200b), and a second placement area (200c).

[0071] The light-emitting element placement area (200a) may be an area where a plurality of light-emitting elements (100) are placed. The length in the first direction of the light-emitting element placement area (200a) may be the distance from the left side of the light-emitting element (100) placed closest to the left side (one side) of the heat conductor unit (200) among the plurality of light-emitting elements (100) on a plane (when viewed from the top) to the right side of the light-emitting element (100) placed closest to the right side (the other side opposite the one side) of the heat conductor unit (200). The length in the second direction of the light-emitting element placement area (200a) may be the length from the upper side of the light-emitting element (100) positioned closest to the upper side of the thermal conductor unit (200) among the plurality of light-emitting elements (100) when viewed from the upper side to the lower side of the light-emitting element (100) positioned closest to the lower side of the thermal conductor unit (200). The length in the first direction of the light-emitting element placement area (200a) may be greater than the length in the second direction of the light-emitting element placement area (200a). For example, the edge of the light-emitting element placement area (200a) may be formed as a rectangle by extending along at least a portion of the edge of the plurality of light-emitting elements (100), but is not limited thereto.

[0072] The first placement area (200b) may be an area where some part of a plurality of upper thermal conductors (210) are placed. Additionally, some part of the upper thermal conductor (210) may be placed in the first placement area (200b), and another part of the upper thermal conductor (210) may be placed in the second placement area (200c). The first placement area (200b) may be located near the light-emitting element placement area (200a). For example, the first placement area (200b) may surround the light-emitting element placement area (200a) in a planar view (when viewed from above). For example, one side of the upper thermal conductor (210) to be electrically connected to the light-emitting element (100) may be placed in the first placement area (200b). The density of some of the multiple upper thermal conductors (210) placed in the first placement area (200b) may be formed to be greater than the density of other of the multiple upper thermal conductors (210) placed in the second placement area (200c). The density of the multiple upper thermal conductors (210) may increase as they move toward the light-emitting element placement area (200a), thereby facilitating the release of heat generated in the light-emitting element placement area (200a), which has a high heat generation amount, thereby lowering thermal resistance and improving the reliability of the light-emitting element (100). The area of ​​the first placement area (200b) may be the same as the area of ​​the heat dissipation thermal conductor (221) to be described later.

[0073] The second placement area (200c) may be an area where another portion of the plurality of upper thermal conductors (210), which will be described later, is placed. The second placement area (200c) may be positioned further apart from the light-emitting element placement area (200a) than the first placement area (200b). The second placement area (200c) may be an area from the edge of the first placement area (200b) to the edge of the thermal conductor unit (200). For example, the first placement area (200b) may be placed between the second placement area (200c) and the light-emitting element placement area (200a). The density of some of the multiple upper heat conductors (210) placed in this second placement area (200c) can be formed to be smaller than the density of any of the multiple upper heat conductors (210) placed in the first placement area (200b), and the production cost can be lowered by reducing the density of the upper heat conductors (210) in the area far from the heat source, which is the light-emitting element (100).

[0074] Additionally, the thermal conductor unit (200) may include an upper thermal conductor (210) and a support substrate (220).

[0075] The upper thermal conductor (210) may be supported (or placed) on a support substrate (220) and electrically connected to a plurality of light-emitting elements (100) and a controller (400). For example, the upper thermal conductor (210) may be a circuit part, wiring, or wiring pattern of a thermal conductor unit (200).

[0076] The upper thermal conductor (210) may extend from a plurality of controllers (400) toward a light-emitting element placement area (200a) so as to electrically connect a plurality of light-emitting elements (100) and a plurality of controllers (400). One area of ​​the upper thermal conductor (210) may be electrically connected to any one of the plurality of light-emitting elements (100). Additionally, one area of ​​the upper thermal conductor (210) may be located in a first placement area (200b) or in a light-emitting element placement area (200a). The upper thermal conductor (210) may have a shape that extends from a light-emitting element placement area (200a) adjacent to a light-emitting element (100) toward a second placement area (200c). Through this, heat generated from the light-emitting element (100) can diffuse from the light-emitting element placement area (200a) to the placement area (200b), thereby lowering the temperature of the light-emitting element placement area (200a). The other area opposite to one area of ​​the upper heat conductor (210) can be connected to any one of the multiple controllers (400). The other area of ​​the upper heat conductor (210) can be located in the second placement area (200c), allowing heat to be transferred to a wider area. Through this, the temperature of the light-emitting element (100) can be lowered and reliability can be improved. The thickness of the upper heat conductor (210) can be formed to be smaller than the height of the light-emitting element (100), thereby lowering the production cost. In addition, the area of ​​the upper heat conductor (210) can be formed wider than the area of ​​the light-emitting element (100), allowing heat to diffuse over a wider area. Through this, the temperature of the light-emitting element (100) can be lowered and reliability can be improved.

[0077] Additionally, the density of some of the plurality of upper heat conductors (210) arranged in the first direction (or x-direction) in the first arrangement area (200b) may be formed to be greater than the density of other parts of the plurality of upper heat conductors (210) arranged in the first direction (or x-direction) in the second arrangement area (200c). For example, the spacing between the plurality of upper heat conductors (210) in the first arrangement area (200b) may be smaller than the spacing between the plurality of upper heat conductors (210) in the second arrangement area (200c). For example, the spacing between two upper heat conductors (210) arranged in the second arrangement area (200c) may be about 2 to about 4 times wider than the spacing between two upper heat conductors (210) arranged in the first arrangement area (200b). Since these multiple upper heat conductors (210) can perform a heat dissipation function, increasing the density of the multiple upper heat conductors (210) near the multiple light-emitting elements (100) can improve heat dissipation performance.

[0078] Additionally, at least some of the multiple upper heat conductors (210) may be bent in a direction offset from the direction in which they extend to be connected to multiple controllers (400) and multiple light-emitting elements (100) in a planar view (when viewed from above). At least some of the multiple upper heat conductors (210) may be bent multiple times to extend. By widening the area of ​​the upper heat conductors (210) through the bending region, heat dissipation can be facilitated, thereby improving heat dissipation performance. However, this is merely an example, and the shape of each of the multiple upper heat conductors (210) is not limited thereto.

[0079] Meanwhile, a plurality of light-emitting elements (100) may be electrically connected to a plurality of upper thermal conductors (210) and grouped into a plurality of groups. For example, some of the plurality of light-emitting elements (100) may be electrically connected to some of the plurality of upper thermal conductors (210) and grouped into a first group, and other parts of the plurality of light-emitting elements (100) may be electrically connected to other parts of the plurality of upper thermal conductors (210) and grouped into a second group. The light-emitting elements (100) included in the first group and the light-emitting elements (100) included in the second group may not be electrically connected to each other. The light-emitting elements (100) included in the first group and the light-emitting elements (100) included in the second group may be driven independently. The light-emitting elements (100) included in the first group and the light-emitting elements (100) included in the second group may generate light to form the same beam pattern or generate light to form different beam patterns. For example, the light-emitting element (100) included in the first group can be a low beam, and the light-emitting element (100) included in the second group can be a high beam.

[0080] A support substrate (220) may be placed on one side of an upper heat conductor (210). Additionally, a support substrate (220) may be placed on one side of a supporting heat conductor (300). For example, the support substrate (220) may be placed between the upper heat conductor (210) and the supporting heat conductor (300). The height of such a support substrate (220) may be formed to be greater than the height of the upper heat conductor (210). Heat may be discharged to the outside through the support substrate (220).

[0081] The support substrate (220) may include a heat dissipation conductor (221) and an insulator (222).

[0082] The heat dissipation conductor (221) can conduct heat generated from a plurality of light-emitting elements (100) to a single region. For example, the heat dissipation conductor (221) may be a heat dissipator. The heat dissipation conductor (221) may be composed of a metallic material including a heat-releasing material having electrical conductivity. That is, the heat dissipation conductor (221) may be an alloy composed of one or more of Cu, Zn, Au, Ni, Al, Mg, Cd, Be, W, Mo, Si, Ag, and Fe, or some thereof, but is not limited thereto, and may include an insulating heat-releasing material such as alumina (Al2O3), aluminum nitride (AlN), nitride (BN), diamond, and beryllium oxide (BeO).

[0083] The heat dissipation conductor (221) can be positioned so that its periphery is surrounded by an insulator (222). This can increase electrical stability. The area of ​​this heat dissipation conductor (221) can be formed to be larger than the area of ​​the light-emitting element placement area (200a). For example, on a flat surface, the area of ​​the heat dissipation conductor (221) can be formed to be larger than the area of ​​the light-emitting element placement area (200a). Through this, heat generated from the light-emitting element (100) can be easily released to the outside through the heat dissipation conductor (221). Additionally, when viewed in the first direction (or x-direction), the area of ​​the heat dissipation conductor (221) can be formed to be larger than the area of ​​the light-emitting element placement area (200a). In other words, the area of ​​one side of the heat dissipation conductor (221) can be larger than the area of ​​the light-emitting element placement area (200a). The cross-sectional area of ​​one side of the heat dissipation conductor (221) may be at least about 1.2 times larger than the cross-sectional area of ​​the light-emitting element placement area (200a). Additionally, when viewed in the second direction (or y-direction), the area of ​​the heat dissipation conductor (221) may be formed to be larger than the area of ​​the light-emitting element placement area (200a). For example, the cross-sectional area of ​​the other side perpendicular to one side of the heat dissipation conductor (221) may be larger than the cross-sectional area of ​​the light-emitting element placement area (200a). The area of ​​the other side perpendicular to one side of the heat dissipation conductor (221) may be at least about 1.4 times larger than the area of ​​the light-emitting element placement area (200a). Additionally, the area of ​​the heat dissipation conductor (221) in a planar view may be larger than the area of ​​the light-emitting element placement area (200a). In a planar view, the area of ​​the heat dissipation thermal conductor (221) can be at least five times larger than the area of ​​the light-emitting element placement area (200a). If the area of ​​the heat dissipation thermal conductor (221) is formed to be larger than the area of ​​the light-emitting element placement area (200a), the area capable of accommodating heat in the thermal conductor unit (200) can be expanded, thereby lowering the thermal resistance of the light-emitting device (1) and improving reliability.

[0084] The heat dissipation conductor (221) may be formed to have a predetermined first length in a first direction, a predetermined second length in a height direction (or thickness direction), and a predetermined third length in a second direction. The ratio of the first length to the second length of the heat dissipation conductor (221) may be different from the ratio of the third length to the second length. The height of the heat dissipation conductor (221) may be formed to be greater than the height of the light-emitting element (100) and the height of the upper heat conductor (210). The height of the heat dissipation conductor (221) may be at least about 1.2 times the height of the light-emitting element (100) and the height of the upper heat conductor (210). By forming the height of the heat dissipation conductor (221) to be greater, the capacity to accommodate heat is increased, thereby lowering the thermal resistance of the light-emitting device (1) and improving reliability.

[0085] In a planar view, the edge of the heat dissipation conductor (221) may be located between the edge of the light-emitting element placement area (200a) and the edge of the heat conductor unit (200). For example, when viewed from above, the minimum area of ​​the heat dissipation conductor (221) may be equal to the area of ​​the light-emitting element placement area (200a). For example, the minimum area of ​​the heat dissipation conductor (221) may be formed as a rectangle. Through this, heat from the light-emitting element placement area (200a) can be released to the outside through the heat dissipation conductor (221), thereby improving reliability. Additionally, when the maximum area of ​​the heat dissipation conductor (221) is in a planar view, the edge of the heat dissipation conductor (221) may be located near the edge of the heat conductor unit (200). This may increase electrical stability. In a planar view, the area of ​​the heat dissipation thermal conductor (221) can be formed to be approximately 30% or more and approximately 80% or less of the area of ​​the thermal conductor unit (200). This allows for improving thermal conductivity while lowering the process cost. Additionally, the area of ​​the heat dissipation thermal conductor (221) can be the same as the area of ​​the first placement area (200b). Furthermore, the edge of the heat dissipation thermal conductor (221) can intersect, in a planar view, with a virtual line (L) connecting one of the multiple controllers (400) and the light-emitting element (100) among the multiple light-emitting elements (100) that is placed closest to the controller (400).

[0086] These heat dissipation conductors (221) may overlap with at least some of the plurality of light-emitting elements (100) in a planar plane. For example, the heat dissipation conductors (221) may overlap with the light-emitting element placement area (200a). The heat dissipation conductors (221) may be positioned so that their periphery is surrounded by an insulator (222). The heat dissipation conductors (221) may be positioned so as to overlap with a virtual horizontal plane passing through the center of the second insulator (222b), which will be described later. Additionally, at least one corner of the heat dissipation conductors (221) may have a rounded shape. This improves corner cohesion stress and increases structural stability.

[0087] An insulator (222) may be placed in one area of ​​a heat dissipation conductor (221). The insulator (222) may surround the perimeter of the heat dissipation conductor (221). Such an insulator (222) may include a first insulator (222a) and a second insulator (222b).

[0088] The first insulator (222a) may be disposed between the heat dissipation conductor (221) and the plurality of light-emitting elements (100) so as to insulate the heat dissipation conductor (221) and the plurality of light-emitting elements (100). An upper heat conductor (210) may be disposed on the upper surface of the first insulator (222a). The height (or thickness) of the first insulator (222a) may be lower than the height (or thickness) of the second insulator (222b) and the heat dissipation conductor (221). Insulation can be ensured while heat dissipation is easily formed by the first insulator (222a).

[0089] A second insulator (222b) may be positioned below the first insulator (222a) and may be positioned in at least one area of ​​the heat dissipation conductor (221). The height (or thickness) of the second insulator (222b) may be formed to be greater than the height (or thickness) of the heat dissipation conductor (221) and the first insulator (222a). This allows heat to be released through the second insulator (222b). Additionally, the second insulator (222b) may include a fiber layer such as carbon fiber, but is not limited thereto. This can increase structural stability. This second insulator (222b) may surround the perimeter of the heat dissipation conductor (221). Furthermore, the second insulator (222b) may be formed to surround one or more of the upper and lower areas of the heat dissipation conductor (221). The second insulator (222b) can protect the heat dissipation conductor (221) from external impact, so structural stability can be increased.

[0090] The supporting thermal conductor (300) can support the thermal conductor unit (200) and, together with the heat dissipation thermal conductor (221), can dissipate heat generated from a plurality of light-emitting elements (100). The supporting thermal conductor (300) can be positioned below the thermal conductor unit (200). This supporting thermal conductor (300) can transfer heat to the outside and can improve the reliability of the light-emitting device (1) by lowering the thermal resistance of the light-emitting device (1). For example, the supporting thermal conductor (300) can be a heat sink.

[0091] The controller (400) is formed in multiple units and can control the multiple light-emitting elements (100) so that the multiple light-emitting elements (100) generate light. The multiple controllers (400) can be electrically connected to the multiple light-emitting elements (100) by multiple upper thermal conductors (210). For example, the multiple controllers (400) can apply electricity to at least some of the multiple light-emitting elements (100) so that light is generated in at least some of the multiple light-emitting elements (100).

[0092] Additionally, a plurality of controllers (400) may be spaced apart from each other in a first direction and a second direction along the edge of the heat conductor unit (200). The distance between the plurality of controllers (400) may be at least about 0.5 times the size of the controller (400). This allows thermal interference between each controller (400) to be minimized or suppressed to a minimum, and reliability may be improved. Additionally, the controllers (400) may be arranged such that the distance from the edge of the heat conductor unit (200) is smaller than the distance from the center of the heat conductor unit (200). The distance from the controller (400) to the center of the heat conductor unit (200) may be about 2 to 5 times greater than the distance from the edge of the heat conductor unit (200). This allows heat to be easily released to the outside, and at the same time, space utilization can be increased. These controllers (400) may be located in a second placement area (200c). Additionally, a light-emitting element placement area (200a) may be located inside the plurality of controllers (400). Therefore, the light-emitting element placement area (200a) may not overlap with the plurality of controllers (400) on a plane. For example, the plurality of controllers (400) may be spaced apart from the plurality of light-emitting elements (100). The distance between the controllers (400) and the light-emitting elements (100) may be greater than the distance between the plurality of light-emitting elements (100). The distance between the controllers (400) and the light-emitting elements (100) may be about 10 times greater than the distance between the plurality of light-emitting elements (100). Through this, the heat of the controllers (400) and the heat of the light-emitting elements (100) may not affect each other, and reliability may be improved. In addition, the distance between the controller (400) and the light-emitting element (100) may be about 5 to 10 times the length of one cross-section of the light-emitting element (100). Through this, the controller (400) may not affect the light path of the light-emitting element (100), and the increase in electrical resistance due to the increase in distance may be reduced, thereby increasing the efficiency of the light-emitting device (1).

[0093] Meanwhile, the second insulator (222b) may be positioned to cover at least a portion of the heat dissipation thermal conductor (221).

[0094] Referring to FIG. 2, in the first example, the second insulator (222b) can cover both the upper and lower regions of the heat dissipation conductor (221). That is, the second insulator (222b) can include the heat dissipation conductor (221). By means of this second insulator (222b), the heat dissipation conductor (221) can be placed within the second insulator (222b) and spaced apart from the first insulator (222a) and the supporting heat conductor (300), and the heat dissipation conductor (221) can be prevented from being corroded or damaged by the external environment. The thickness of the first region of the second insulator (222b) placed above the heat dissipation conductor (221) can be thinner than the thickness of the heat dissipation conductor (221). In addition, the thickness of the second region of the second insulator (222b) that is positioned below the heat dissipation conductor (221) may be thinner than the thickness of the heat dissipation conductor (221). Also, the sum of the thickness of the first region and the thickness of the second region may be within about 10% to about 30% of the thickness of the heat dissipation conductor (221). Heat can be released and insulation can be ensured by the first region and the second region.

[0095] Referring to FIG. 3, in a second example, the second insulator (222b) may be formed to cover the upper region of the heat dissipation conductor (221). Through this second insulator (222b), at least one surface of the heat dissipation conductor (221) may come into contact with the supporting heat conductor (300). That is, the lower region of the heat dissipation conductor (221) may come into direct contact with the upper region of the supporting heat conductor (300). Since heat from the heat dissipation conductor (221) can be transferred to the supporting heat conductor (300), thermal characteristics may be improved. The thickness of the third region of the second insulator (222b) that is positioned above the heat dissipation conductor (221) may be thinner than the thickness of the heat dissipation conductor (221). The thickness of the third region may be within about 5% to about 20% of the thickness of the heat dissipation conductor (221). Heat can be easily released through the third region, and insulation can be ensured. For example, the heat dissipation conductor (221) may be formed such that the cross-sectional area of ​​the lower portion is larger than the cross-sectional area of ​​the upper portion. The contact cross-sectional area of ​​the region in contact with the supporting heat conductor (300) within the heat dissipation conductor (221) may be larger than the cross-sectional area of ​​the region adjacent to the light-emitting element (100) within the heat dissipation conductor (221). Through this, heat can be transferred toward the supporting heat conductor (300), and thermal characteristics can be improved.

[0096] Referring to FIG. 4, in a third example, the second insulator (222b) may be formed to cover the lower region of the heat dissipation conductor (221). Through this second insulator (222b), the upper surface of the heat dissipation conductor (221) may be connected to the first insulator (222a), and the distance between the heat dissipation conductor (221) and the light-emitting element (100) may be reduced, thereby improving thermal characteristics. Among the second insulators (222b), the thickness of the fourth region disposed below the heat dissipation conductor (221) may be thinner than the thickness of the heat dissipation conductor (221). The thickness of the fourth region may be within approximately 5% to approximately 20% of the thickness of the heat dissipation conductor (221). Through this, heat can be effectively released through the fourth region, and insulation can be ensured. For example, the heat dissipation conductor (221) may be formed such that the cross-sectional area of ​​the lower portion is larger than the cross-sectional area of ​​the upper portion. The contact cross-sectional area of ​​the region of the heat dissipation conductor (221) that contacts the supporting heat conductor (300) may be larger than the cross-sectional area of ​​the region of the heat dissipation conductor (221) that is adjacent to the light-emitting element (100). Through this, heat can be easily transferred toward the supporting heat conductor (300), and thermal characteristics can be improved.

[0097] Hereinafter, a light-emitting device (1) according to another embodiment of the present invention will be described with reference to FIG. 5. FIG. 5 is a schematic diagram showing a light-emitting device (1) according to another embodiment of the present invention. In describing another embodiment, there are differences in that one side of the heat dissipation thermal conductor (221) is directly disposed on the upper thermal conductor (210), and the heat conductor unit (200) further includes a lower thermal conductor (230) disposed below the heat dissipation thermal conductor (221) and having the same components as the upper thermal conductor (210); thus, the description will focus on these differences. Additionally, in describing another embodiment, there are differences in that a connecting thermal conductor (500) may be further included, and the insulator (222) may further include a third insulator (222c); thus, the description will focus on these differences.

[0098] The upper surface of the heat dissipation conductor (221) can be directly connected to the lower surface of the upper heat conductor (210). The upper heat conductor (210) can be laminated to the heat dissipation conductor (221). Since one side of the heat dissipation conductor (221) can be directly connected to the upper heat conductor (210), heat can be transferred directly from the upper heat conductor (210) to the heat dissipation conductor (221) without passing through the insulator (222), so excellent thermal properties can be achieved. The heat dissipation conductor (221) may be one of the non-conductive thermal conductive materials. Additionally, the heat dissipation conductor (221) may have the same height as the second insulator (222b), thereby increasing flatness and improving structural stability.

[0099] The first insulator (222a) can cover at least one area of ​​the upper heat conductor (210). Additionally, the height of the first insulator (222a) can be formed to be greater than the height of the upper heat conductor (210). The second heat conductor (130) can penetrate the first insulator (222a) and be electrically connected to the upper heat conductor (210).

[0100] A third insulator (222c) may be placed between the second insulator (222b) and the heat dissipation conductor (221). The third insulator (222c) may include an adhesive. The third insulating layer (222c) can prevent separation between the heat dissipation conductor (221) and the second insulator (222b) due to thermal stress. At least a portion of the third insulating layer (222c) may cover at least one portion of the upper or lower surface of the heat dissipation conductor (221), and the adhesive area may be increased to enhance structural stability.

[0101] The third insulator (222c) may be positioned so as not to overlap vertically with the upper thermal conductor (210). However, it is not limited thereto. In some embodiments, at least a portion of the third insulator (222c) may be positioned between the upper thermal conductor (210) and the heat dissipation thermal conductor (221). For example, the upper thermal conductor (210) may include an overlapping area that overlaps vertically with the third insulator (222c) and a non-overlapping area that does not overlap vertically with the third insulator (222c). The heights of the non-overlapping area and the overlapping area within the upper thermal conductor (210) may be formed differently from each other. Since the adhesive area can be widened by such a third insulator (222c), structural stability can be improved.

[0102] The lower heat conductor (230) may be placed below the heat dissipation heat conductor (221). However, at least a portion of the third insulator (222c) may be placed between the heat dissipation heat conductor (221) and the lower heat conductor (230). The lower heat conductor (230) may have the same composition as the upper heat conductor (210). Since the lower heat conductor (230) and the upper heat conductor (210) may have the same composition, the thermal conductivity may be increased. Additionally, the lower heat conductor (230) can improve the bending properties caused by residual stress on the upper and lower surfaces of the heat conductor unit (200), thereby preventing bending of the heat conductor unit (200) and increasing structural stability. To further increase structural stability, the area of ​​the lower heat conductor (230) and the area of ​​the upper heat conductor (210) may be similar to each other. The difference in area between the lower heat conductor (230) and the upper heat conductor (210) may be about 70% or less.

[0103] A connecting thermal conductor (500) may be placed between a thermal conductor unit (200) and a supporting thermal conductor (300). For example, the connecting thermal conductor (500) may be placed between a lower thermal conductor (230) and a supporting thermal conductor (300). The connecting thermal conductor (500) may be a material having adhesive properties and thermal conductivity. The connecting thermal conductor (500) can improve the adhesion between the thermal conductor unit (200) and the supporting thermal conductor (300), and can improve heat transfer efficiency and thermal properties by eliminating the air layer between the thermal conductor unit (200) and the supporting thermal conductor (300). The connecting thermal conductor (500) may be an organic material containing ceramic fillers, metal fillers, carbon fillers, etc., in a fluid material such as thermal grease, thermal compound, heat dissipation grease, or HTP (heat transfer paste). The connecting heat conductor (500) can be overlapped with the heat dissipation heat conductor (221) in the vertical direction. For example, the area of ​​the connecting heat conductor (500) may be larger than the area of ​​the heat dissipation heat conductor (221). For example, the area of ​​the connecting heat conductor (500) may be about 10% to about 20% larger than the area of ​​the heat dissipation heat conductor (221). The connecting heat conductor (500) can stably support the heat dissipation heat conductor (221). Additionally, the connecting heat conductor (500) may have an area smaller than the area of ​​the supporting heat conductor (300). The connecting heat conductor (500) may have an area of ​​about 80% to about 99% of the area of ​​the supporting heat conductor (300). This allows for a reduction in material cost loss and a lower production unit cost.

[0104] Hereinafter, a light-emitting device (1) according to another embodiment of the present invention will be described with reference to FIG. 6. FIG. 6 is a schematic diagram showing a light-emitting device according to another embodiment of the present invention. In describing another embodiment, there is a difference in that the heat conductor unit (200) further includes a heat dissipation pad (240) extending from the upper heat conductor (210) toward the heat dissipation heat conductor (221), and the support substrate (220) further includes a transverse heat conductor (223). This description will focus on these differences.

[0105] The heat dissipation pad (240) can transfer heat from the light-emitting part (110) to the heat dissipation thermal conductor (221). The heat dissipation pad (240) can be placed on one side of the upper heat conductor (210). The heat dissipation pad (240) can penetrate the first insulator (222a). For example, the heat dissipation pad (240) can be in direct contact with the heat dissipation thermal conductor (221). The heat dissipation pad (240) can be placed between the upper heat conductor (210) and the heat dissipation thermal conductor (221). Such a heat dissipation pad (240) can transfer a large amount of heat accumulated in the upper heat conductor (210) to the heat dissipation thermal conductor (221). The heat dissipation pad (240) can be formed so that the upper heat conductor (210) and the heat dissipation thermal conductor (221) are not electrically connected. For example, at least one of the upper heat conductor (210) and the heat dissipation heat conductor (221) may be made of an insulating material. This may reduce the difficulty of the design. Alternatively, the heat dissipation pad (240) may be made of the same material as one or more of the upper heat conductor (210) and the heat dissipation heat conductor (221). This may increase structural stability so that the product is not damaged by thermal shock. In addition, the heat dissipation pad (240) can protect the light-emitting part (110) by absorbing vibrations and shocks. In addition, the heat dissipation pad (240) may be formed in multiple units. Multiple heat dissipation pads (240) may be spaced apart from each other in the lateral direction and may increase thermal conductivity by acting as heat conduction fins. In addition, the cross-sectional area of ​​the heat dissipation pad (240) may be smaller than the area of ​​the upper heat conductor (210). Additionally, the heat dissipation pad (240) may have a smaller area than the heat dissipation thermal conductor (221). This prevents the heat dissipation thermal conductor (221) and the heat dissipation pad (240) from detaching from the heat dissipation pad (240), thereby increasing structural stability. At this time, the area of ​​the heat dissipation pad (240) may be approximately 20% to approximately 70% of the area of ​​the heat dissipation thermal conductor (221). This allows for increased structural stability while minimizing the impact on the thermal path.

[0106] The heat dissipation pad (240) may extend downward from the upper heat conductor (210) toward the heat dissipation heat conductor (221) and penetrate the insulator (222). For example, the heat transfer portion (140a) may penetrate the first insulator (222a) and be connected to the heat dissipation heat conductor (221). The heat dissipation pad (240) may be formed such that its width in the horizontal direction decreases as it goes downward, or conversely, it may be formed such that its width increases as it goes upward. If the widths of the upper and lower surfaces of the heat dissipation pad (240) are different from each other, the lateral contact surface of the heat dissipation pad (240) increases, thereby widening the adhesion area with the insulator (222) and reducing the likelihood of the heat dissipation pad (240) separating due to external impact. For example, the difference between the upper surface area of ​​the heat dissipation pad (240) and the lower surface area of ​​the heat dissipation pad (240) may be within 2% to 10%. This can lower the difficulty of the design.

[0107] The transverse heat conductor (223) may be placed between the first insulator (222a) and the second insulator (222b) or placed inside the second insulator (222b) and connected to the heat dissipation heat conductor (221). The thickness of the transverse heat conductor (223) may be thinner than the thickness of the first insulator (222a) or the second insulator (222b). The thickness of the transverse heat conductor (223) may be about 1% to about 10% of the thickness of the first insulator (222a) or the second insulator (222b). The transverse heat conductor (223) can prevent bending of the heat conductor unit (200) and increase structural stability while increasing thermal capacity. One side of the transverse heat conductor (223) may be placed on the heat dissipation heat conductor (221), and the other side opposite to the one side of the transverse heat conductor (223) may be placed at the edge of the heat conductor unit (200). One side of the transverse heat conductor (223) may be placed spaced apart from the heat dissipation heat conductor (221). Additionally, the transverse heat conductor (223) may be placed spaced apart from the upper heat conductor (210). This transverse heat conductor (223) can transfer heat from the heat dissipation heat conductor (221) to the edge of the heat conductor unit (200), allowing heat to be released to the outside.

[0108] Hereinafter, a light-emitting device (1) according to another embodiment of the present invention will be described with reference to FIG. 7. FIG. 7 is a schematic diagram showing a light-emitting device according to another embodiment of the present invention. In describing another embodiment, there is a difference in that the plurality of light-emitting elements (100) include a first light-emitting element (100a) and a second light-emitting element (100b), and this difference will be explained mainly.

[0109] The first light-emitting element (100a) and the second light-emitting element (100b) may be spaced apart from each other. Additionally, the first light-emitting element (100a) and the second light-emitting element (100b) may not be electrically connected to each other. For example, the controller (400) controlling the first light-emitting element (100a) and the controller (400) controlling the second light-emitting element (100b) may be different. In particular, the first light-emitting element (100a) and the second light-emitting element (100b) may be individually controlled by different controllers (400). Furthermore, the first light-emitting element (100a) may be a light-emitting element included in the first group, and the second light-emitting element (100b) may be a light-emitting element included in the second group.

[0110] The second-1 thermal conductor (131) of the first light-emitting element (100a) may be positioned to face the second-2 thermal conductor (132) of the second light-emitting element (100b). The first separation distance (a) between the second-1 thermal conductor (131) of the first light-emitting element (100a) and the second-2 thermal conductor (132) of the second light-emitting element (100b) may be different from the second separation distance (b) between the second-1 thermal conductor (131) of the first light-emitting element (100a) and the second-2 thermal conductor (132). For example, the first separation distance (a) may be greater than the second separation distance (b). Additionally, the first separation distance (a) may be greater than the separation distance between the second-1 thermal conductor (131) and the second-2 thermal conductor (132) of the second light-emitting element (100b). This allows for reducing thermal impact between the first light-emitting element (100a) and the second light-emitting element (100b), thereby reducing thermal damage and increasing reliability. For example, the first separation distance (a) may be about 1.5 to 2.5 times wider than the second separation distance (b). This reduces thermal impact between elements and increases space utilization.

[0111] At least one of the plurality of upper thermal conductors (210) may be located between the first light-emitting element (100a) and the second light-emitting element (100b). For example, at least one of the plurality of upper thermal conductors (210) may extend between the second-1 thermal conductor (131) of the first light-emitting element (100a) and the second-2 thermal conductor (132) of the second light-emitting element (100b). At least one of these plurality of upper thermal conductors (210) may be positioned between the first light-emitting element (100a) and the second light-emitting element (100b) to dissipate heat between the first light-emitting element (100a) and the second light-emitting element (100b). Hereinafter, the upper heat conductor (210) located between the first light-emitting element (100a) and the second light-emitting element (100b) can be referred to as an intermediate upper heat conductor.

[0112] For example, in the first direction, the distance (or horizontal distance) between the intermediate upper heat conductor and the second-1 heat conductor (131) of the first light-emitting element (100a) may have a gap of about 35% to about 65% of the distance between the second-1 heat conductor (131) of the first light-emitting element (100a) and the second-2 heat conductor (132) of the second light-emitting element (100b). As another example, the spacing (or horizontal spacing) between the intermediate upper heat conductor and the second-second heat conductor (132) of the second light-emitting element (100b) may have a spacing of about 35% to about 65% of the spacing between the second-first heat conductor (131) of the first light-emitting element (100a) and the second-second heat conductor (132) of the second light-emitting element (100b). This allows heat to be released to the outside and increases space utilization.

[0113] In addition, the width of the intermediate upper thermal conductor may be about 40% to about 60% of the width of the 2-1 thermal conductor (131) of the first light-emitting element (100a) and the 2-2 thermal conductor (132) of the second light-emitting element (100b). This allows for increased thermal efficiency while maintaining electrical stability.

[0114] The light-emitting device (1) according to an embodiment of the present invention can efficiently release heat to increase heat dissipation efficiency and improve reliability.

[0115] In addition, the light-emitting device (1) according to an embodiment of the present invention can generate an appropriate amount of light suitable for an intended purpose while maintaining a compact size.

[0116] In addition, the light-emitting device (1) according to an embodiment of the present invention can emit light to form at least one of a high beam pattern and a low beam pattern.

[0117] Although the embodiments of the present invention have been described above as specific embodiments, they are merely examples and the present invention is not limited thereto, but should be interpreted as having the broadest scope in accordance with the technical concept disclosed in this specification. Those skilled in the art may implement patterns of shapes not specified by combining or substituting the disclosed embodiments, and this also does not deviate from the scope of the present invention. Furthermore, those skilled in the art may easily modify or alter the disclosed embodiments based on this specification, and it is evident that such modifications or alterations also fall within the scope of the rights of the present invention.

Claims

1. A plurality of light-emitting elements configured to generate light; and It includes a thermal conductor unit configured to provide a light-emitting element placement area in which the plurality of light-emitting elements are arranged, and The above thermal conductor unit is, It includes a heat dissipation thermal conductor configured to dissipate heat generated from the plurality of light-emitting elements, and The area of ​​the heat dissipation thermal conductor on the plane is formed to be larger than the area of ​​the light-emitting element placement area, Light-emitting device.

2. In Paragraph 1, The above thermal conductor unit is, An upper thermal conductor electrically connected to the plurality of light-emitting elements; and A support substrate comprising the above-mentioned heat dissipation thermal conductor and configured to support the above-mentioned upper heat conductor, Light-emitting device.

3. In Paragraph 1, The above light-emitting element placement area overlaps with the heat dissipation thermal conductor on a plane, Light-emitting device.

4. In Paragraph 1, The area of ​​the heat dissipation thermal conductor is approximately 30% to approximately 80% of the area of ​​the thermal conductor unit on a plane, Light-emitting device.

5. In Paragraph 1, At least one corner of the above-mentioned heat dissipation conductor has a rounded shape, The above thermal conductor unit includes an insulator, and The above heat dissipation thermal conductor is arranged such that its surrounding surface is surrounded by the above insulator, Light-emitting device.

6. In Paragraph 1, The above heat dissipation thermal conductor It is formed to have a predetermined first length in the horizontal direction, a predetermined second length in the thickness direction, and a predetermined third length perpendicular to the first length and the second length, The ratio of the first length to the second length is different from the ratio of the third length to the second length. Light-emitting device.

7. In Paragraph 1, The above thermal conductor unit is, It includes a first insulator disposed between the heat dissipation thermal conductor and the plurality of light-emitting elements so as to insulate the heat dissipation thermal conductor and the plurality of light-emitting elements, and The thickness of the first insulator is lower than the thickness of the heat dissipation thermal conductor. Light-emitting device.

8. In Paragraph 7, The above thermal conductor unit is, It further includes a second insulator disposed on the lower side of the first insulator to cover one or more of the upper and lower surfaces of the heat dissipation thermal conductor, and The thickness of the second insulator is greater than the thickness of the first insulator. Light-emitting device.

9. In Paragraph 8, A supporting thermal conductor further comprising a second insulator configured to support the heat generated from the plurality of light-emitting elements together with the above-mentioned heat dissipation thermal conductor, Bladder device.

10. In Paragraph 8, The above second insulator comprises carbon fiber, Light-emitting device.

11. In Paragraph 2, It further includes a plurality of controllers configured to control the plurality of light-emitting elements, and The above upper heat conductor is formed in multiple numbers, and The above plurality of upper heat conductors Extending from the plurality of controllers toward the light-emitting element placement area so that the plurality of light-emitting elements and the plurality of controllers are electrically connected, Light-emitting device.

12. In Paragraph 11, The edge of the above heat dissipation thermal conductor is, Arranged to intersect a virtual line connecting any one of the plurality of controllers and the light-emitting element among the plurality of light-emitting elements that is closest to any one of the plurality of controllers on a plane. Light-emitting device.

13. In Paragraph 2, The above upper heat conductor is formed in multiple numbers, and The above thermal conductor unit is, A first placement area located near the above-mentioned light-emitting element placement area, wherein some of the plurality of upper thermal conductors may be placed therein; and Providing a second placement area positioned further apart from the light-emitting element placement area than the first placement area, wherein another part of the plurality of upper thermal conductors may be positioned therein. Light-emitting device.

14. In Paragraph 13, The density of some of the plurality of upper heat conductors arranged in the first arrangement area is greater than the density of other of the plurality of upper heat conductors arranged in the second arrangement area. Light-emitting device.

15. In Paragraph 13, The above plurality of light-emitting elements are, First light-emitting element; and It includes a second light-emitting element spaced apart from the first light-emitting element and not electrically connected to the first light-emitting element, and Each of the first light-emitting element and the second light-emitting element is, A second-1 thermal conductor electrically connected to the above thermal conductor unit; A second-2 thermal conductor electrically connected to the above thermal conductor unit and spaced apart from the second-1 thermal conductor; and A light-emitting part electrically connected to the 2-1 thermal conductor and the 2-2 thermal conductor so as to generate light, Light-emitting device.

16. In Paragraph 15, One of the plurality of heat-conducting parts is located between the 2-1 heat conductor of the first light-emitting element and the 2-2 heat conductor of the second light-emitting element. Light-emitting device.

17. In Paragraph 15, The separation distance between the 2-1 thermal conductor of the first light-emitting element and the 2-2 thermal conductor of the second light-emitting element is greater than the separation distance between the 2-1 thermal conductor of the first light-emitting element and the 2-2 thermal conductor. Light-emitting device.

18. In Paragraph 11, In a planar view, at least some of the aforementioned multiple heat conduction sections are bent in a direction offset from the direction of extension, Light-emitting device.

19. A plurality of light-emitting elements configured to generate light; and It includes a thermal conductor unit configured to provide a light-emitting element placement area in which the plurality of light-emitting elements are arranged, and The above thermal conductor unit is, It includes a heat dissipation thermal conductor configured to dissipate heat generated from the plurality of light irradiation irradiation saturations mentioned above, and The area of ​​the heat dissipation thermal conductor when viewed in the first direction is formed to be larger than the area of ​​the light-emitting element placement area, Light-emitting device.

20. A plurality of light-emitting elements configured to generate light; and It includes a thermal conductor unit configured to provide a light-emitting element placement area in which the plurality of light-emitting elements are arranged, and The above thermal conductor unit is, It includes a heat dissipation thermal conductor configured to dissipate heat generated from the plurality of light irradiation irradiation saturations mentioned above, and The area of ​​the heat dissipation thermal conductor on the plane is formed to be larger than the area of ​​the light-emitting element placement area, Light-emitting device.

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