Electronic device comprising shield can for return current path

Abstract

This electronic device may comprise: a battery; a printed circuit board (PCB); a shield can; a power amplifier (PA) for a radio frequency (RF) signal; and an electronic component. The PCB may include a first layer and a second layer. The first layer may be electrically connected to the ground of the electronic device. The second layer may comprise: a first conductive pad electrically connected to the first layer; a second conductive pad electrically connected to a capacitor; and a third conductive pad electrically connected to a negative terminal of the battery. The shield can may be attached to the first conductive pad, the second conductive pad, and the third conductive pad of the PCB. The PA may be mounted on the PCB, electrically connected to the first layer of the PCB, and adjacent to the first conductive pad. The electronic component may be adjacent to the second conductive pad.

Description

Electronic device including a shield can for a return current path

[0001] The present disclosure relates to an electronic device comprising a shield can for a return current path.

[0002] An electronic device such as a smartphone may include a printed circuit board (PCB) and various electronic components placed on the PCB. The PCB may support the electronic components and form a circuit for the electronic components. For example, the return current of the electronic components may flow to a power source through the ground layer of the PCB.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] The electronic device may include a battery, a printed circuit board (PCB), a shield can, a power amplifier (PA) for a radio frequency (RF) signal, and electronic components. The PCB may include a first layer and a second layer. The first layer may be electrically connected to the ground of the electronic device. The second layer may include a first conductive pad electrically connected to the first layer, a second conductive pad electrically connected to a capacitor, and a third conductive pad electrically connected to the negative terminal of the battery. The shield can may be attached to the first conductive pad, the second conductive pad, and the third conductive pad of the PCB. The PA may be mounted on the PCB, electrically connected to the first layer of the PCB, and positioned closest to the first conductive pad among the first conductive pad, the second conductive pad, and the third conductive pad. The above electronic component includes a magnet and can be positioned closest to the second conductive pad among the first conductive pad, the second conductive pad, and the third conductive pad. The third conductive pad, which is electrically connected to the negative terminal of the battery, can be electrically connected to the first conductive pad, which is electrically connected to the first layer of the PCB, only through the shield can.

[0005] The electronic device may include a battery, a charging circuit for the battery, a printed circuit board (PCB) on which the charging circuit is mounted, a shield can, and a power amplifier (PA) for a radio frequency (RF) signal. The PCB may include a ground layer, a first conductive pad electrically connected to the ground layer, a second conductive pad electrically connected to a capacitor, a third conductive pad electrically connected to the negative terminal of the battery, and a fourth conductive pad electrically connected to the power ground terminal of the charging circuit. The shield can may be attached to the first conductive pad, the second conductive pad, the third conductive pad, and the fourth conductive pad of the PCB. The PA may be mounted on the PCB and electrically connected to the ground layer of the PCB. The third conductive pad electrically connected to the negative terminal of the battery can be electrically connected to the first conductive pad electrically connected to the first layer of the PCB only through the shield can. The fourth conductive pad electrically connected to the charging circuit can be electrically connected to the third conductive pad electrically connected to the negative terminal of the battery only through the shield can.

[0006] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0007] FIG. 2a is a drawing showing an exemplary electronic device according to one embodiment.

[0008] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0009] FIG. 3a is a block diagram of an electronic device according to one embodiment.

[0010] FIG. 3b is a plan view showing a PCB and a speaker of an electronic device according to one embodiment.

[0011] FIG. 3c is a conceptual diagram showing the return current path of PA according to one embodiment.

[0012] FIG. 3d is a diagram showing the return current path of PA according to one embodiment.

[0013] FIG. 4a is a block diagram of a first electronic device according to a comparative example.

[0014] Figure 4b shows the return current flow of the PA of the first electronic device according to the comparative example.

[0015] Figure 4c shows the return current flow of the PA of the second electronic device according to the comparative example.

[0016] Figure 4d shows the return current flow of the charging circuit of the second electronic device according to the comparative example.

[0017] FIG. 5 shows the return current flow of a charging circuit of an electronic device according to one embodiment.

[0018] Figure 6a shows the magnetic field distribution by the first PA of the first electronic device according to the comparative example.

[0019] Figure 6b shows the magnetic field distribution by the first PA of the second electronic device according to the comparative example.

[0020] FIG. 6c shows the magnetic field distribution by the first PA of the electronic device according to one embodiment.

[0021] Figure 7a shows the magnetic field distribution by the second PA of the first electronic device according to the comparative example.

[0022] Figure 7b shows the magnetic field distribution by the second PA of the second electronic device according to the comparative example.

[0023] FIG. 7c shows the magnetic field distribution by the second PA of the electronic device according to one embodiment.

[0024] Figure 8a shows the heat distribution of the PCB during the charging operation of the second electronic device according to the comparative example.

[0025] FIG. 8b shows the heat distribution of the PCB during the charging operation of an electronic device according to one embodiment.

[0026] In the drawings of the present disclosure, the same reference numerals may be assigned to identical components, and redundant descriptions of components having the same reference numeral may not be repeated. Additionally, in descriptions referring to a specific drawing, reference numerals of other drawings may be referenced.

[0027] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0028] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0029] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0030] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0031] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0032] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0033] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0034] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0035] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0036] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0037] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0038] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0039] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0041] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0042] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0043] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0045] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0046] The antenna module (197) can transmit a signal or power to an external source (e.g., an external electronic device) or receive it from an external source. According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). The signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0047] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0048] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0049] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0050] FIG. 2a is a drawing illustrating an exemplary electronic device according to one embodiment. Referring to FIG. 2a, the electronic device (200) according to one embodiment may include a housing (210) that forms at least partially the exterior of the electronic device (200). For example, the housing (210) may include a first surface (or front) (200A), a second surface (or rear) (200B), and a third surface (or side) (200C) that surrounds the space between the first surface (200A) and the second surface (200B). In one embodiment, the housing (210) may refer to a structure that forms at least some of the first surface (200A), the second surface (200B), and / or the third surface (200C).

[0051] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). In one embodiment, the front plate (202) may form at least a portion of the first surface (200A). In one embodiment, the front plate (202) may include, for example, a glass plate or a polymer plate including various coating layers, but is not limited thereto.

[0052] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). In one embodiment, the back plate (211) may form at least a portion of a second surface (200B). In one embodiment, the back plate (211) may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the materials.

[0053] An electronic device (200) according to one embodiment may include a side bezel structure (e.g., a side member or bracket) (218). In one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a third surface (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire third surface (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the third surface (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0054] In one embodiment, the side bezel structure (218) may comprise a metal and / or a polymer. In one embodiment, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum), but are not limited thereto. For example, the rear plate (211) and the side bezel structure (218) may be formed as separate components and / or may comprise different materials.

[0055] In one embodiment, the electronic device (200) may include a display (201) (e.g., display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., audio module (170) of FIG. 1), a sensor module (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), a light-emitting element (not shown), and a connector hole (208). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., key input device (217) or light-emitting element (not shown)) or additionally include other components.

[0056] In one embodiment, the display (201) may be visually exposed through a significant portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the first surface (200A). The display (201) may be positioned on the back surface of the front plate (202).

[0057] In one embodiment, the display (201) (or the first surface (200A) of the electronic device (200)) may include a screen display area (201A). In one embodiment, the display (201) may provide visual information to the user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is shown to be located on the inner side of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. For example, when the first surface (200A) is viewed from the front, at least a portion of the edge of the screen display area (201A) may substantially coincide with the edge of the first surface (200A) (or the front plate (202)).

[0058] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire the user's biometric information. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" can be understood as at least a portion of the sensing area (201B) being overlapped with the screen display area (201A). For example, the sensing area (201B) may refer to an area that can display visual information by the display (201) just like other areas of the screen display area (201A), and additionally acquire the user's biometric information (e.g., fingerprint). Although the sensing area (201B) is depicted as being formed within the screen display area (201A), it is not limited thereto. For example, the sensing area (201B) may be formed in the key input device (217).

[0059] In one embodiment, the display (201) may include an area where a first camera module (205) is located. For example, an opening may be formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch-hole camera) may be placed at least partially within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of the edge of the opening. In one embodiment, the first camera module (205) (e.g., an under-display camera (UDC)) may be placed below the display (201) so as to overlap with the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera module (205) may acquire an image corresponding to the direction toward the first surface (200A) through the area of ​​the display (201).

[0060] In one embodiment, the display (201) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field type stylus pen.

[0061] In one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0062] In one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a part of the third surface (200C) and a second microphone hole (204) formed in a part of the second surface (200B). A microphone for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones to detect the direction of the sound, but is not limited thereto.

[0063] In one embodiment, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, it is not limited thereto.

[0064] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (200). In one embodiment, the external speaker hole (207) is integrated into the microphone hole (203), and the speaker hole (207) and the microphone hole (203) may be implemented as a single hole. Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the illustration in FIG. 2a, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (200), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (200). However, this is not limited thereto, and in other embodiments, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by the spaced-apart space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0065] In one embodiment, the electronic device (200) may include at least one speaker (not shown) (e.g., the acoustic output module (155) of FIG. 1) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a receiver hole for calls (not shown).

[0066] In one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0067] In one embodiment, the camera module (205, 212, 213) may include a first camera module (205) positioned to face a first surface (200A) of the electronic device (200), a second camera module (212) positioned to face a second surface (200B), and a flash (213).

[0068] In one embodiment, the second camera module (212) may include a plurality of cameras (e.g., a dual camera, a triple camera, or a quad camera). However, the second camera module (212) is not necessarily limited to including a plurality of cameras and may include a single camera.

[0069] In one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor.

[0070] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be disposed on one side of the electronic device (200).

[0071] In one embodiment, the key input device (217) may be placed on a third side (200C) of the electronic device (200). In one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201).

[0072] In one embodiment, a connector hole (208) may be formed on a third surface (200C) of the electronic device (200) so as to accommodate a connector of an external device. A connection terminal (e.g., connection terminal (178) of FIG. 1) that is electrically connected to the connector of the external device may be disposed within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module (e.g., interface (177) of FIG. 1) for processing electrical signals transmitted and received through the connection terminal.

[0073] In one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be placed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide state information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0074] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment. Referring to FIG. 2b, an electronic device (200) according to one embodiment may include a frame structure (240) (e.g., side bezel structure (218) of FIG. 2a), a first printed circuit board (PCB) (250), a second PCB (252), a speaker (255) (e.g., acoustic output module (155) of FIG. 1), and a battery (270) (e.g., battery (189) of FIG. 1).

[0075] In one embodiment, the frame structure (240) may be positioned between the display (201) and the rear plate (211). In one embodiment, the frame structure (240) may support or accommodate components included in the electronic device (200). For example, the display (201) may be placed on one side of the frame structure (240) facing in one direction (e.g., +Z direction). For example, the frame structure (240) may support the front plate (202) to which the display (201) is attached. On the other side of the frame structure (240) facing in the opposite direction (e.g., -Z direction) to the one direction, the first PCB (250), the second PCB (252), the battery (270), and the second camera module (212) may be placed. The first PCB (250), the second PCB (252), the battery (270), and the second camera module (212) can be placed within a recess formed in the frame structure (240).

[0076] In one embodiment, the frame structure (240) may include a first part (241) and a second part (243). The periphery of the second part (243) may be surrounded by the first part (241). The first part (241) may surround the space between the rear plate (211) and the front plate (202) (and / or the display (201)). The first part (241) surrounding the space may at least partially form a side of the electronic device (200) (e.g., the third side (200C) in FIG. 2a), and the second part (243) located within the space may extend inward from the first part (241). The second part (243) may be located below the display (201) (e.g., in the -Z direction). In one embodiment, the first part (241) and / or the second part (243) may be formed of a metal and / or a polymer.

[0077] In one embodiment, a first part (241) of a frame structure (240) forming the side of the electronic device (200) may be referred to as a side member or a lateral structure, and a second part (243) of a frame structure (240) supporting various parts of the electronic device (200) may be referred to as a support member, a support structure, or a bracket.

[0078] In one embodiment, the first PCB (250), the second PCB (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first PCB (250) and the second PCB (252) may be fixedly positioned to the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly positioned to the frame structure (240) through an adhesive member (e.g., double-sided tape). However, it is not limited to the examples described above.

[0079] In one embodiment, the display (201) may be positioned between the frame structure (240) and the front plate (202). For example, the front plate (202) may be positioned on one side (e.g., +Z direction) of the display (201), and the frame structure (240) may be positioned on the other side (e.g., -Z direction).

[0080] In one embodiment, the front plate (202) may be combined with the display (201). For example, the display (201) may be attached to the back surface of the front plate (202) via an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)).

[0081] In one embodiment, the front plate (202) may be combined with a frame structure (240). For example, the front plate (202) may include an outer portion extending outward from the display (201) when viewed in the z-axis direction. The outer portion of the front plate (202) may be attached to the frame structure (240) (e.g., the first part (241)).

[0082] In one embodiment, a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first PCB (250) and / or the second PCB (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first PCB (250) and the second PCB (252) may be operatively or electrically connected to each other through a connecting member (e.g., a flexible printed circuit board).

[0083] In one embodiment, the speaker (255) may be positioned adjacent to the edge of the first PCB (250). For example, at least a portion of the perimeter of the speaker (255) may be wrapped by a portion of the edge of the first PCB (250). For example, the speaker (255) may be positioned within a groove defined by the portion of the edge of the first PCB (250). In one embodiment, the speaker (255) may include a magnet and a coil. In this regard, the speaker (255) may be referred to as an electronic component including a magnet and / or a coil.

[0084] In one embodiment, the battery (270) can supply power to at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell.

[0085] In one embodiment, the first camera module (205) (e.g., front camera) may be placed in at least a part (e.g., second part (243)) of the frame structure (240) so that the lens can receive external light through a part area (e.g., camera area (237)) of the front plate (202) (e.g., front (200A) of FIG. 2a).

[0086] In one embodiment, a second camera module (212) (e.g., rear camera) may be positioned between the frame structure (240) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first PCB (250) through a connecting member (e.g., a connector). In one embodiment, the second camera module (212) may be positioned so that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0087] In one embodiment, the camera area (284) may be formed on the surface of the rear plate (211) (e.g., the rear (200B) of FIG. 2A). In one embodiment, the camera area (284) may be formed at least partially transparent so that external light can be incident on the lens of the second camera module (212). In one embodiment, at least a portion of the camera area (284) may protrude a certain height from the surface of the rear plate (211). However, it is not limited thereto, and in another embodiment, the camera area (284) may form a plane substantially identical to the surface of the rear plate (211).

[0088] In one embodiment, the housing (210) of the electronic device (200) may mean a configuration or structure that forms at least a part of the exterior of the electronic device (200). In other words, the housing (210) may include at least a part of a front plate (202), a frame structure (240), and / or a rear plate (211) that form the exterior of the electronic device (200).

[0089] FIG. 3a is a block diagram of an electronic device according to one embodiment. FIG. 3b is a plan view showing a PCB and a speaker of an electronic device according to one embodiment. FIG. 3c is a conceptual diagram showing the return current path of a PA according to one embodiment. FIG. 3d is a drawing showing the return current path of a PA according to one embodiment.

[0090] Referring to FIG. 3a, according to one embodiment, an electronic device (300) (e.g., electronic device (200) of FIG. 2b) may include a processor (320) (e.g., processor (120) of FIG. 1), a radio frequency transceiver (390), a first power amplifier (PA) (391), a second PA (392), one or more antennas (395), a power management integrated circuit (PMIC) (388) (e.g., power management module (188) of FIG. 1), a battery (370) (e.g., battery (270) of FIG. 2b), a first charging circuit (371), a second charging circuit (372), a shield can (350), at least one lumped element (330), and a PCB (310) (e.g., the first PCB (250) or the second PCB (252) of FIG. 2b).

[0091] According to one embodiment, the processor (320) of the electronic device (300) may include, for example, an application processor (AP) (e.g., the main processor (121) of FIG. 1) and / or a communication processor (CP) (e.g., the auxiliary processor (123) of FIG. 1). The processor (320) may be electrically connected to a PMIC (388) and an RF transceiver (390).

[0092] In one embodiment, the processor (320) can control the PMIC (388) and the RF transceiver (390). For example, the processor (320) can control the PMIC (388) so that the battery (370) is charged based on power received from an external source. For example, the processor (320) can control the PMIC (388) so that power stored in the battery (370) is supplied to other components. For example, the processor (320) can control the RF transceiver (390) so that a signal is transmitted through one or more antennas (395).

[0093] In one embodiment, the RF transceiver (390) can convert a baseband signal generated by the processor (320) into an RF signal. The RF transceiver (390) can provide the RF signal to the first PA (391) and / or the second PA (392).

[0094] In one embodiment, the RF transceiver (390) can control the first PA (391) and the second PA (392) (e.g., via an interface such as MIPI (mobile industry processor interface)). The RF transceiver (390) can be implemented as part of a single chip (e.g., an RFIC chip) or a single package.

[0095] In one embodiment, the first PA (391) and the second PA (392) may each be connected to one or more antennas (395) for transmitting a signal. The first PA (391) and the second PA (392) may each amplify the power of a signal provided from an RF transceiver (390). In one embodiment, the first PA (391) may be included in an RFFE (RF front end) circuit (or RFFE module). In one embodiment, the second PA (392) may be included in the RFFE circuit or another RFFE circuit.

[0096] Although not illustrated, the RF transceiver (390) may be connected to one or more antennas (395) through one or more receiving paths (e.g., the receiving path of the RFFE circuit). In this case, the processor (120) may control the RF transceiver (390) so that a signal is received through one or more antennas (395). Additionally, the RF transceiver (390) may convert the RF signal received from one or more antennas (395) into a baseband signal so that it can be processed by the processor (320).

[0097] In one embodiment, the PMIC (388) may be electrically connected to the battery (370), the first charging circuit (371), and the second charging circuit (372). The PMIC (388) can charge the battery (370) by supplying power supplied from the first charging circuit (371) to the battery (370). The PMIC (388) can charge the battery (370) by supplying power supplied from the second charging circuit (372) to the battery (370).

[0098] In one embodiment, the first charging circuit (371) and the second charging circuit (372) can adjust the input power. For example, the first charging circuit (371) and the second charging circuit (372) can convert the input voltage and / or current into a voltage and / or current suitable for charging the battery (370) and provide it to the PMIC (388). The first charging circuit (371) can be used for a relatively high output power, and the second charging circuit (372) can be used for a relatively low output power.

[0099] In one embodiment, the PCB (310) may include a plurality of layers. For example, the plurality of layers of the PCB (310) may include a first layer (or first conductive layer) (311) and a second layer (or second conductive layer) (312). The second layer (312) of the PCB (310) may include a plurality of conductive pads to which a shield can (350) is attached. For example, the plurality of conductive pads of the second layer (312) may include at least one first conductive pad (1), at least one second conductive pad (2), a third conductive pad (3), a fourth conductive pad (4), and a fifth conductive pad (5). In FIG. 3a, the conductive pads (1, 2, 3, 4, and 5) are shown inside the shield can (350) for convenience of explanation.

[0100] In one embodiment, the first layer (311) of the PCB (310) may be electrically connected to the ground (G) of the electronic device (300). The first layer (311) of the PCB (310) may be a ground layer or a ground plane of the PCB (310). The ground (G) of the electronic device (300) may include, for example, the negative terminal of the battery (370) and / or the metal housing of the electronic device (300) (e.g., the conductive part of the frame structure (240) of FIG. 2B).

[0101] In one embodiment, at least one first conductive pad (1) of the first layer (311) of the PCB (310) may be electrically connected to the second layer (312). At least one first conductive pad (1) of the first layer (311) may be electrically connected to the ground (G) of the electronic device (300) through the second layer (312).

[0102] In one embodiment, the shield can (350) may be attached to at least one first conductive pad (1). The shield can (350) may be electrically connected to the first layer (311) of the PCB (310) through at least one first conductive pad (1). The shield can (350) may be electrically connected to the ground (G) of the electronic device (300) through at least one first conductive pad (1) and the first layer (311).

[0103] In one embodiment, a first end of at least one lumped element (330) may be electrically connected to at least one second conductive pad (2) of the PCB (310). The first end of at least one lumped element (330) may be electrically connected to a shield can (350) attached to at least one second conductive pad (2). A second end of the lumped element (330) may be electrically connected to a first layer (311) of the PCB (310). The second end of the lumped element (330) may be electrically connected to the ground (G) of the electronic device (300) through the first layer (311) of the PCB (310). Alternatively, the second end of the lumped element (330) may be electrically open. In one embodiment, the lumped element (330) may include a capacitor. The capacitor may have a value of, for example, 33 pF or 100 pF, which is not limited.

[0104] In one embodiment, the positive terminal of the battery (370) may be electrically connected to the PMIC (388). In one embodiment, the negative terminal of the battery (370) may be electrically connected to the third conductive pad (3) of the PCB (310). The negative terminal of the battery (370) may be electrically connected to a shield can (350) attached to the third conductive pad (3). The negative terminal of the battery (370) may be electrically connected to the first layer (311) of the PCB (310), which is connected to the ground (G) of the electronic device (300) through the shield can (350) and at least one first conductive pad (1) of the PCB (310).

[0105] In one embodiment, the output terminal of the first charging circuit (371) may be electrically connected to the PMIC (388). In one embodiment, the power ground terminal of the first charging circuit (371) may be electrically connected to the fourth conductive pad (4) of the PCB (310). The power ground terminal of the first charging circuit (371) may be electrically connected to a shield can (350) attached to the fourth conductive pad (4). The power ground terminal of the first charging circuit (371) may be electrically connected to the first layer (311) of the PCB (310), which is connected to the ground (G) of the electronic device (300) through the shield can (350) and at least one first conductive pad (1) of the PCB (310).

[0106] In one embodiment, the output terminal of the second charging circuit (372) may be electrically connected to the PMIC (388). In one embodiment, the power ground terminal of the second charging circuit (372) may be electrically connected to the fifth conductive pad (5) of the PCB (310). The power ground terminal of the second charging circuit (372) may be electrically connected to a shield can (350) attached to the fifth conductive pad (5). The power ground terminal of the second charging circuit (372) may be electrically connected to the first layer (311) of the PCB (310), which is connected to the ground (G) of the electronic device (300) through the shield can (350) and at least one first conductive pad (1) of the PCB (310).

[0107] In one embodiment, the processor (320), PMIC (388), RF transceiver (390), first PA (391), and second PA (392) may be electrically connected to the first layer (311) of the PCB (310). The processor (320), PMIC (388), RF transceiver (390), first PA (391), and second PA (392) may be electrically connected to the ground (G) of the electronic device (300) through the first layer (311) of the PCB (310).

[0108] Referring to FIGS. 3a and 3b, according to one embodiment, an electronic device (300) may include a speaker (355) (e.g., speaker (255) of FIG. 2b) and a connector (315). In one embodiment, the speaker (355) may be positioned around the PCB (310). For example, the speaker (355) may be positioned adjacent to the edge (310E) of the PCB (310). The speaker (355) may be spaced apart from the shield can (350). In one embodiment, a battery (370) (or a connector of the battery (370)) may be coupled to the connector (315).

[0109] In one embodiment, the PCB (310) may include a first surface (310A) and a second surface opposite to the first surface (310A). A shield can (350), a first charging circuit (371), a second charging circuit (372), a first PA (391), a second PA (392), and a connector (315) may be disposed on the first surface (310A) of the PCB (310), but are not limited thereto. For example, one or more of the shield can (350), the first charging circuit (371), the second charging circuit (372), the first PA (391), the second PA (392), and the connector (315) may be disposed on the second surface of the PCB (310).

[0110] An electronic device (300) according to one embodiment may include one or more electronic circuits (305) disposed on a PCB (310) so as to be surrounded by a shield can (350). One or more electronic circuits (305) may include, for example, a processor (320) and / or a PMIC (388).

[0111] In one embodiment, the shield can (350) may include a first lateral side (351) and a second lateral side (352) opposite to the first lateral side (351). For example, the shield can (350) may include a third lateral side (353) and a fourth lateral side (354) opposite to the third lateral side (353). For example, but not limited, the third lateral side (353) of the shield can (350) may connect the first ends of the first lateral side (351) and the second lateral side (352). For example, but not limited, the fourth lateral side (354) of the shield can (350) may connect the second ends of the first lateral side (351) and the second lateral side (352).

[0112] In one embodiment, the PCB (310) (or first surface (310A)) may include at least one first pad area (11), at least one second pad area (12), a third pad area (13), a fourth pad area (14), and a fifth pad area (15).

[0113] In one embodiment, at least one first pad area (11), at least one second pad area (12), a third pad area (13), a fourth pad area (14), and a fifth pad area (15) may correspond to the edge of the shield can (350). For example, at least one first pad area (11), at least one second pad area (12), a third pad area (13), a fourth pad area (14), and a fifth pad area (15) may be arranged along the edge of the shield can (350). For example, the plurality of conductive pads of the second layer (312) of the PCB (310) to which the shield can (350) is attached may be arranged in the at least one first pad area (11), at least one second pad area (12), a third pad area (13), a fourth pad area (14), and a fifth pad area (15).

[0114] For example, at least one first conductive pad (1) of a second layer (312) of the PCB (310) may be disposed in at least one first pad area (11) of the PCB (310). For example, the first pad area (11) may include an area (11-1), and the first conductive pad (1) may be disposed within the area (11-1). For example, the first pad area (11) may further include an area (11-2), in which case the first conductive pads (1) may be disposed in the area (11-1) and the area (11-2), respectively.

[0115] For example, at least one second conductive pad (2) of the second layer (312) of the PCB (310) may be disposed in at least one second pad area (12) of the PCB (310). For example, the second pad area (12) may include an area (12-1), and the second conductive pad (2) may be disposed within the area (12-1). For example, the second pad area (12) may further include at least one of an area (12-2), an area (12-3), and an area (12-4). For example, if the second pad area (12) includes an area (12-1) and an area (12-2), the lumped elements (330) may be electrically connected to the area (12-1) and the area (12-2), respectively.

[0116] For example, a third conductive pad (3) may be disposed in the third pad area (13) of the PCB (310). The negative terminal of the battery (370) may be electrically connected to the third conductive pad (3) located in the third pad area (13) of the PCB (310) through a connector (315). For example, a pin of the connector (315) electrically connected to the negative terminal of the battery (370) may be electrically connected to the third conductive pad (3). For example, the pin of the connector (315) may be electrically connected to the third conductive pad (3) through a conductive path (317) of the PCB (310) electrically separated from the first layer (311).

[0117] For example, a fourth conductive pad (4), to which a first charging circuit (371) is electrically connected, may be disposed in the fourth pad area (14) of the PCB (310). For example, a fifth conductive pad (5), to which a second charging circuit (372) is electrically connected, may be disposed in the fifth pad area (15) of the PCB (310). For example, the third conductive pad (3), the fourth conductive pad (4), and the fifth conductive pad (5) may be formed integrally, without limitation.

[0118] In one embodiment, the first PA (391) may be closer to the first pad area (11) than to the second pad area (12). For example, the first PA (391) may be positioned closest to the first pad area (11) among the first pad area (11), the second pad area (12), and the third pad area (13).

[0119] In one embodiment, the second PA (392) may be closer to the first pad area (11) than to the second pad area (12). For example, the second PA (392) may be positioned closest to the first pad area (11) among the first pad area (11), the second pad area (12), and the third pad area (13).

[0120] In one embodiment, the speaker (355) may be closer to the area (12-1) of the second pad area (12) than to the first pad area (11). For example, the speaker (355) may be positioned closest to the area (12-1) of the second pad area (12) among the first pad area (11), the area (12-1) of the second pad area (12), and the third pad area (13). For example, the speaker (355) may face the first side (351) of the shield can (350). The area (12-1) of the second pad area (12) may be positioned to correspond to the first side (351) of the shield can (350). For example, the first side (351) of the shield can (350) can be attached to at least one second conductive pad (2) within the area (12-1) of the second pad area (12).

[0121] In one embodiment, the connector (315) may be positioned closest to the third pad area (13) among the first pad area (11), the second pad area (12), the third pad area (13), the fourth pad area (14) and the fifth pad area (15).

[0122] In one embodiment, the first charging circuit (371) may be positioned closest to the fourth pad area (14) among the first pad area (11), second pad area (12), third pad area (13), fourth pad area (14) and fifth pad area (15).

[0123] In one embodiment, the fourth pad area (14) may be closest to the third pad area (13) among the first pad area (11), the second pad area (12), the third pad area (13), and the fifth pad area (15). For example, the fourth conductive pad (4) within the fourth pad area (14) may be closest to the third conductive pad (3) placed in the third pad area (13) among the first conductive pad (1), the second conductive pad (2), the third conductive pad (3), and the fifth conductive pad (5).

[0124] In one embodiment, the second charging circuit (372) may be positioned closest to the fifth pad area (15) among the first pad area (11), the second pad area (12), the third pad area (13), the fourth pad area (14), and the fifth pad area (15).

[0125] In one embodiment, the fifth pad area (15) may be closest to the third pad area (13) among the first pad area (11), the second pad area (12), the third pad area (13), and the fourth pad area (14). For example, the fifth conductive pad (5) within the fifth pad area (15) may be closest to the third conductive pad (3) placed in the third pad area (13) among the first conductive pad (1), the second conductive pad (2), the third conductive pad (3), and the fourth conductive pad (4).

[0126] For example, without limitation, the first pad area (11) may be located between the first PA (391) and the third pad area (13). For example, without limitation, the first pad area (11) may be located between the first PA (391) and the third pad area (13). For example, without limitation, the shield can (350) may be located between the first PA (391) and the connector (315). For example, without limitation, the shield can (350) may be located between the second PA (392) and the connector (315).

[0127] For example, without limitation, the first pad area (11), the area of ​​the second pad area (12) (12-1), the area of ​​the second pad area (12) (12-4), the fourth pad area (14), the third pad area (13), the fifth pad area (15), the area of ​​the second pad area (12) (12-2), and the area of ​​the second pad area (12) (12-3) may be positioned in order along the circumference of the shield can (350) (e.g., clockwise).

[0128] In one embodiment, a third conductive pad (3) electrically connected to the negative terminal of the battery (370) can be electrically connected to the first conductive pad (1) of the PCB (310) only through the shield can (350). Accordingly, with reference to FIG. 3c, the return current of the first PA (391) and the second PA (392) can flow to the negative terminal of the battery (370) by passing through the first layer (311) of the PCB (310), at least one first conductive pad (1), the shield can (350), the third conductive pad (3), the conductive path (317), and the connector (315) in order. Since the shield can (350) is connected to at least one lumped element (330) through at least one second conductive pad (2), the return current induced in the shield can (350) can flow to the third conductive pad (3). Accordingly, with reference to FIG. 3d, the flow of return current in area (A) of the PCB (310) adjacent to the speaker (355) may be weaker than the flow of return current flowing to area (B) of the PCB (310) corresponding to the shield can (350). That is, the flow of return current may bypass area (A) closer to the speaker (355) and flow predominantly to area (B) further away from the speaker (355). The magnetic field caused by the current flowing around the speaker (355) may affect the magnets and coils inside the speaker (355), thereby causing unintended noise in the speaker (355). According to the Biot-Savart law, the magnetic field acting on the speaker (355) is proportional to the current strength and inversely proportional to the square of the distance, so as the position of the return current moves further away from the speaker (355) and the strength weakens, the magnetic field acting on the speaker (355) can be reduced.Therefore, by placing the speaker (355) far from the PCB (310), the effect of the return current can be reduced, but this is difficult to apply not only in terms of miniaturization or weight reduction of portable devices such as electronic devices (300), but also in terms of efficient placement of internal components without empty space. An electronic device (300) according to one embodiment can reduce the performance degradation of the speaker (355) caused by the return current by reducing the flow of the return current in the area (A) adjacent to the speaker (355), while densely arranging the speaker (355) and the PCB (310) as shown in FIG. 3d.

[0129] FIG. 4a is a block diagram of a first electronic device according to a comparative example. FIG. 4b shows the return current flow of the PA of the first electronic device according to a comparative example. FIG. 4c shows the return current flow of the PA of the second electronic device according to a comparative example. FIG. 4d shows the return current flow of the charging circuit of the second electronic device according to a comparative example.

[0130] Referring to FIG. 4a, the negative terminal, the first charging circuit (371), and the first charging circuit (371) of the battery (370) of the first electronic device (400-1) according to the comparative example can be directly electrically connected to the first layer (311) of the PCB (310), unlike the electronic device (300) according to one embodiment. Through this, the negative terminal, the first charging circuit (371), and the first charging circuit (371) of the battery (370) of the first electronic device (400-1) according to the comparative example can be electrically connected to the ground (G) of the electronic device (400-1).

[0131] In this case, referring to FIG. 4b, the flow of return current of the first PA (391) and the second PA (392) flowing in the area (A4) of the PCB (310) adjacent to the speaker (355) of the first electronic device (400-1) according to the comparative example may be stronger than the flow of return current flowing in the area (A) of the electronic device (300) according to one embodiment of FIG. 3d. Accordingly, the performance of the speaker (355) of the electronic device (400-1) of the comparative example may be degraded.

[0132] Referring to FIG. 4c, the second electronic device (400-2) according to the comparative example may include a slot (401) formed in the first layer (311) of the PCB (310) to control the return current flow to the speaker (355). Through the slot (401), the return current flow of the first PA (391) and the second PA (392) can be controlled to move away from the speaker (355). However, the ground area may be reduced due to the slot (401) formed in the first layer (311). Furthermore, referring to FIG. 4d, the path of the return current of the charging circuits (371 and 372) of the second electronic device (400-2) according to the comparative example may be longer due to the slot (401) of the first layer (311), and a longer current path may increase resistance. Accordingly, the heat generation of the PCB (310) may increase. In addition, due to the slot (401) of the first layer (311), the shielding provided by the first layer (311) may be weakened, and problems with RE (radiated emission) and / or RSE (radiated spurious emission) due to the slot (401) may occur.

[0133] FIG. 5 shows the return current flow of a charging circuit of an electronic device according to one embodiment.

[0134] Referring to FIG. 5, in one embodiment, a fourth conductive pad (4) electrically connected to a first charging circuit (371) can be electrically connected to a third conductive pad (3) of a PCB (310) only through a shield can (350). In one embodiment, a fifth conductive pad (5) electrically connected to a second charging circuit (372) can be electrically connected to a third conductive pad (3) of a PCB (310) only through a shield can (350).

[0135] Accordingly, the charging return current of the electronic device (300) can flow to the first charging circuit (371) by passing through the connector (315), the conductive path (317), the third conductive pad (3), the shield can (350), and the fourth conductive pad (4) in sequence during a charging operation using the first charging circuit (371). Additionally, the charging return current of the electronic device (300) can flow to the second charging circuit (372) by passing through the connector (315), the conductive path (317), the third conductive pad (3), the shield can (350), and the fifth conductive pad (5) in sequence during a charging operation using the second charging circuit (372).

[0136] Since the connector (315) is adjacent to the third conductive pad (3), the third conductive pad (3) is adjacent to the fourth conductive pad (4), and the fourth conductive pad (4) is adjacent to the first charging circuit (371), the path of the charging return current of the first charging circuit (371) can be shortened.

[0137] Since the connector (315) is adjacent to the third conductive pad (3), the third conductive pad (3) is adjacent to the fifth conductive pad (5), and the fifth conductive pad (5) is adjacent to the second charging circuit (372), the path of the charging return current of the first charging circuit (371) can be shortened.

[0138] Since the conductive path (317), third conductive pad (3), fourth conductive pad (4), and fifth conductive pad (5) connected to the connector (315) are interconnected only through the shield can (350), the charging return current may be degraded or prevented from flowing along a longer path (e.g., a path on the first layer (311)).

[0139] By means of at least one second conductive pad (2) connected to at least one lumped element (330), the charge return current flowing through a longer path can be reduced or prevented.

[0140] In one embodiment, as the charge return current path is shortened, the DC resistance of the charge return current path may be reduced. Accordingly, heat generation during charging operation may be reduced.

[0141] An electronic device (300) according to one embodiment can provide a relatively larger ground area of ​​the PCB (310) because it is possible to control the return current path using the shield can (350) without the slot of the first layer (311) (e.g., the slot (401) of FIG. 4c). Accordingly, the ground of the electronic device (300) can be stabilized, and the shielding of high-import wiring or high-speed wiring within the system can be reinforced.

[0142] FIG. 6a shows the magnetic field distribution by the first PA of a first electronic device according to a comparative example. FIG. 6b shows the magnetic field distribution by the first PA of a second electronic device according to a comparative example. FIG. 6c shows the magnetic field distribution by the first PA of an electronic device according to one embodiment.

[0143] Referring to FIGS. 6a, 6b, and 6c, when the first PA (391) is in operation, the magnetic field of the area of ​​the PCB (310) adjacent to the speaker (355) (e.g., the area corresponding to the dotted circle) may be smaller for the electronic device (300) according to one embodiment than for the first electronic device (400-1) and the second electronic device (400-2) according to the comparative example. For example, the average value of the magnetic field acting on the speaker (355) of the electronic device (300) according to one embodiment may be 3.53 A / m. For example, the average value of the magnetic field acting on the speaker (355) of the second electronic device (400-2) according to the comparative example may be 4.97 A / m. For example, the average value of the magnetic field acting on the speaker (355) of the first electronic device (400-1) according to the comparative example may be 11.07 A / m.

[0144] FIG. 7a shows the magnetic field distribution by the second PA of the first electronic device according to a comparative example. FIG. 7b shows the magnetic field distribution by the second PA of the second electronic device according to a comparative example. FIG. 7c shows the magnetic field distribution by the second PA of the electronic device according to one embodiment.

[0145] Referring to FIGS. 7a, 7b, and 7c, when the second PA (392) is in operation, the magnetic field of the area of ​​the PCB (310) adjacent to the speaker (355) (e.g., the area corresponding to the dotted circle) may be smaller for the electronic device (300) according to one embodiment than for the first electronic device (400-1) and the second electronic device (400-2) according to the comparative example. For example, the average value of the magnetic field acting on the speaker (355) of the electronic device (300) according to one embodiment may be 1.17 A / m. For example, the average value of the magnetic field acting on the speaker (355) of the second electronic device (400-2) according to the comparative example may be 2.77 A / m. For example, the average value of the magnetic field acting on the speaker (355) of the first electronic device (400-1) according to the comparative example may be 1.37 A / m.

[0146] FIG. 8a shows the heat distribution of the PCB during the charging operation of the second electronic device according to a comparative example. FIG. 8b shows the heat distribution of the PCB during the charging operation of the electronic device according to one embodiment.

[0147] Referring to FIG. 8a, a narrow and long hot spot (H1) may be formed on the PCB (310) of the second electronic device (400-2) according to the comparative example due to a relatively long charging return current path, and the maximum temperature within the hot spot (H1) may be about 51 degrees as indicated by the box (L1).

[0148] Referring to FIG. 8b, in the PCB (310) of the electronic device (300) according to one embodiment, a widely diffused hot spot (H2) may be formed due to a relatively short charge return current path, and the maximum temperature within the hot spot (H2) may be about 33 degrees as indicated by the box (L2). This may be about 18 degrees lower than the maximum temperature within the hot spot (H1) of the comparative example.

[0149] In the present disclosure, the electronic component that may be affected by the return current path is exemplified as a speaker (355), but is not limited thereto. For example, embodiments of the present disclosure may be applied to electronic components including magnets and / or coils, or various electronic components that may be affected by the magnetic field of the return current.

[0150] In the present disclosure, a shield can (350) is illustrated for controlling the return current path, but is not limited thereto. For example, embodiments of the present disclosure may also be applied to various metal structures that can be mounted on the PCB (310) through the conductive pads of the PCB (310).

[0151] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure belongs.

[0152] According to one embodiment, an electronic device (101; 200; 300) may include a battery (189; 270; 370), a printed circuit board (PCB) (250; 252; 310), a shield can (350), a power amplifier (PA) (391; 392) for a radio frequency (RF) signal, and electronic components (155; 255; 355). The PCB (250; 252; 310) may include a first layer (311) and a second layer (312). The first layer (311) may be electrically connected to the ground (G) of the electronic device (101; 200; 300). The second layer (312) may include a first conductive pad (1) electrically connected to the first layer (311), a second conductive pad (2) electrically connected to a capacitor (330), and a third conductive pad (3) electrically connected to the negative terminal of the battery (189; 270; 370). The shield can (350) may be attached to the first conductive pad (1), the second conductive pad (2), and the third conductive pad (3) of the PCB (250; 252; 310). The above PA (391; 392) is mounted on the PCB (250; 252; 310), is electrically connected to the first layer (311) of the PCB (250; 252; 310), and can be positioned closest to the first conductive pad (1) among the first conductive pad (1), the second conductive pad (2), and the third conductive pad (3). The electronic component (155; 255; 355) includes a magnet and can be positioned closest to the second conductive pad (2) among the first conductive pad (1), the second conductive pad (2), and the third conductive pad (3).The third conductive pad (3) electrically connected to the negative terminal of the battery (189; 270; 370) can be electrically connected to the first conductive pad (1) electrically connected to the first layer (311) of the PCB (250; 252; 310) only through the shield can (350).

[0153] In one embodiment, the first conductive pad (1) may be located between the PA (391; 392) and the third conductive pad (3).

[0154] In one embodiment, the electronic device (101; 200; 300) may include a connector (315) disposed on the PCB (250; 252; 310). The PCB (250; 252; 310) may include a conductive path (317) electrically connected to the connector (315) and the third conductive pad (3) and electrically separated from the first layer (311). The negative terminal of the battery (189; 270; 370) may be electrically connected to the third conductive pad (3) through the connector (315) and the conductive path (317).

[0155] In one embodiment, the shield can (350) may be located between the PA (391; 392) and the connector (315). In one embodiment, the first terminal of the capacitor (330) may be electrically connected to the second conductive pad (2). The second terminal of the capacitor (330) may be electrically connected to or electrically open to the first layer (311) of the PCB (250; 252; 310).

[0156] In one embodiment, the electronic component (155; 255; 355) may include a speaker (155; 255; 355). The speaker (155; 255; 355) may be positioned adjacent to the edge of the PCB (250; 252; 310) and spaced apart from the shield can (350) on the PCB (250; 252; 310).

[0157] In one embodiment, the shield can (350) may include a side (351) facing the speaker (155; 255; 355). The second conductive pad (2) of the PCB (250; 252; 310) may be positioned to correspond to the side (351) of the shield can (350).

[0158] In one embodiment, the electronic device (101; 200; 300) may include a charging circuit (371). The second layer (312) of the PCB (250; 252; 310) may include a fourth conductive pad (4) to which the charging circuit (371) is electrically connected and to which a part of the shield can (350) is attached. The fourth conductive pad (4) electrically connected to the charging circuit (371) may be electrically connected to the first conductive pad (1) electrically connected to the first layer (311) of the PCB (250; 252; 310) only through the shield can (350).

[0159] In one embodiment, the electronic device (101; 200; 300) may include another charging circuit (372). The second layer (312) of the PCB (250; 252; 310) may include a fifth conductive pad (5) to which the other charging circuit (372) is electrically connected and to which another part of the shield can (350) is attached. The fifth conductive pad (5) electrically connected to the other charging circuit (372) may be electrically connected to the first conductive pad (1) electrically connected to the first layer (311) of the PCB (250; 252; 310) only through the shield can (350).

[0160] In one embodiment, the fourth conductive pad (4) may be positioned closest to the third conductive pad (3) that is electrically connected to the negative terminal of the battery (189; 270; 370) among the first conductive pad (1), the second conductive pad (2), and the third conductive pad (3). The fifth conductive pad (5) may be positioned closest to the third conductive pad (3) that is electrically connected to the negative terminal of the battery (189; 270; 370) among the first conductive pad (1), the second conductive pad (2), the third conductive pad (3), and the fourth conductive pad (4).

[0161] In one embodiment, the fourth conductive pad (4), the third conductive pad (3), and the fifth conductive pad (5) may be positioned in order along the circumference of the shield can (350).

[0162] In one embodiment, the third conductive pad (3), the fourth conductive pad (4), and the fifth conductive pad (5) may be formed integrally.

[0163] In one embodiment, the electronic device (101; 200; 300) may include an RFFE circuit (radio frequency front end circuitry) including the PA (391; 392).

[0164] In one embodiment, the electronic device (101; 200; 300) may include one or more electronic circuits (305) disposed on the PCB (250; 252; 310) so as to be located inside the shield can (350).

[0165] In one embodiment, the first layer (311) may be a ground layer of the PCB (250; 252; 310).

[0166] According to one embodiment, an electronic device (101; 200; 300) may include a battery (189; 270; 370), a charging circuit (371) for the battery (189; 270; 370), a printed circuit board (PCB) (250; 252; 310) on which the charging circuit (371) is mounted, a shield can (350), and a power amplifier (PA) (391; 392) for a radio frequency (RF) signal. The PCB (250; 252; 310) may include a ground layer (311), a first conductive pad (1) electrically connected to the ground layer (311), a second conductive pad (2) electrically connected to a capacitor (330), a third conductive pad (3) electrically connected to a negative terminal of the battery (189; 270; 370), and a fourth conductive pad (4) electrically connected to a power ground (G) terminal of the charging circuit (371). The shield can (350) may be attached to the first conductive pad (1), the second conductive pad (2), the third conductive pad (3), and the fourth conductive pad (4) of the PCB (250; 252; 310). The above PA (391; 392) is mounted on the PCB (250; 252; 310) and can be electrically connected to the ground layer (311) of the PCB (250; 252; 310). The third conductive pad (3), which is electrically connected to the negative terminal of the battery (189; 270; 370), can be electrically connected to the first conductive pad (1), which is electrically connected to the first layer (311) of the PCB (250; 252; 310), only through the shield can (350).The fourth conductive pad (4) electrically connected to the charging circuit (371) can be electrically connected to the third conductive pad (3) electrically connected to the negative terminal of the battery (189; 270; 370) only through the shield can (350).

[0167] In one embodiment, the first conductive pad (1) may be located between the PA (391; 392) and the third conductive pad (3).

[0168] In one embodiment, the electronic device (101; 200; 300) may include a connector (315) disposed on the PCB (250; 252; 310). The PCB (250; 252; 310) may include a conductive path (317) electrically connected to the connector (315) and the third conductive pad (3) and electrically separated from the ground layer (311). The negative terminal of the battery (189; 270; 370) may be electrically connected to the third conductive pad (3) through the connector (315) and the conductive path (317). The shield can (350) may be located between the PA (391; 392) and the connector (315).

[0169] In one embodiment, the first terminal of the capacitor (330) may be electrically connected to the second conductive pad (2). The second terminal of the capacitor (330) may be electrically connected to or electrically open to the ground layer (311) of the PCB (250; 252; 310).

[0170] In one embodiment, the electronic device (101; 200; 300) may include a speaker (155; 255; 355) positioned adjacent to the edge of the PCB (250; 252; 310) and spaced apart from the shield can (350) on the PCB (250; 252; 310). The speaker (155; 255; 355) may be positioned closest to the second conductive pad (2) to which the capacitor (330) is connected, among the first conductive pad (1), the second conductive pad (2), the third conductive pad (3), and the fourth conductive pad (4).

[0171] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0172] The electronic device according to the various embodiments disclosed in this document may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0173] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any component (e.g., the first) is referred to as "coupled" or "connected" to another component (e.g., the second), with or without the terms "functionally" or "communicationally," it means that said component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0174] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0175] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0176] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0177] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, battery; A printed circuit board (PCB) comprising a first layer and a second layer, wherein the first layer is electrically connected to the ground of the electronic device, and the second layer is: A first conductive pad electrically connected to the first layer, A second conductive pad electrically connected to a capacitor, and It includes a third conductive pad electrically connected to the negative terminal of the battery; A shield can attached to the first conductive pad, the second conductive pad, and the third conductive pad of the PCB; A power amplifier (PA) for an RF (radio frequency) signal, mounted on the PCB and electrically connected to the first layer of the PCB, and positioned closest to the first conductive pad among the first conductive pad, the second conductive pad, and the third conductive pad; and The electronic component includes a magnet, and is positioned closest to the second conductive pad among the first conductive pad, the second conductive pad, and the third conductive pad. The third conductive pad electrically connected to the negative terminal of the battery is electrically connected to the first conductive pad electrically connected to the first layer of the PCB only through the shield can. Electronic device.

2. In Claim 1, The first conductive pad is located between the PA and the third conductive pad. Electronic device.

3. In Claim 2, Includes a connector disposed on the above PCB, The PCB electrically connects the connector and the third conductive pad and includes a conductive path electrically separated from the first layer, The negative terminal of the battery is electrically connected to the third conductive pad through the connector and the conductive path. Electronic device.

4. In Claim 3, The above shield can is located between the PA and the connector, Electronic device.

5. In any one of claims 1 to 4, The first terminal of the capacitor is electrically connected to the second conductive pad, and The second terminal of the capacitor is electrically connected to or electrically open to the first layer of the PCB. Electronic device.

6. In any one of claims 1 to 5, The above electronic component includes a speaker, The above speaker is positioned adjacent to the edge of the PCB and spaced apart from the shield can on the PCB. Electronic device.

7. In Claim 6, The above shield can includes a side facing the speaker, and The second conductive pad of the PCB is positioned to correspond to the side of the shield can. Electronic device.

8. In any one of claims 1 to 7, Includes a charging circuit, The second layer of the PCB includes a fourth conductive pad to which the charging circuit is electrically connected and to which a part of the shield can is attached, and The fourth conductive pad electrically connected to the charging circuit is electrically connected to the first conductive pad electrically connected to the first layer of the PCB only through the shield can. Electronic device.

9. In Claim 8, It includes other charging circuits, The second layer of the PCB includes a fifth conductive pad to which the other charging circuit is electrically connected and to which another part of the shield can is attached, and The fifth conductive pad electrically connected to the other charging circuit is electrically connected to the first conductive pad electrically connected to the first layer of the PCB only through the shield can. Electronic device.

10. In Claim 9, The fourth conductive pad is positioned closest to the third conductive pad among the first conductive pad, the second conductive pad, and the third conductive pad, which is electrically connected to the negative terminal of the battery. The fifth conductive pad is positioned closest to the third conductive pad, which is electrically connected to the negative terminal of the battery, among the first conductive pad, the second conductive pad, the third conductive pad, and the fourth conductive pad. Electronic device.

11. In claim 9 or claim 10, The fourth conductive pad, the third conductive pad, and the fifth conductive pad are positioned in order along the circumference of the shield can. Electronic device.

12. In Claim 9, The third conductive pad, the fourth conductive pad, and the fifth conductive pad are integrally formed. Electronic device.

13. In any one of claims 1 to 12, A radio frequency front end circuitry (RFFE) including the above PA Electronic device.

14. In any one of claims 1 to 13, One or more electronic circuits disposed on the PCB so as to be located inside the shield can, Electronic device.

15. In any one of claims 1 to 14, The first layer above is the ground layer of the PCB, Electronic device.

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