Construction and packaging of digitally-beamformed antennas

Abstract

Methods, systems, and devices for digitally-beamformed antennas are described. For example, an antenna assembly in accordance with the described techniques may include components that are coupled (e.g., bonded, adhered, soldered, fused) with one another, with respective components including different portions of circuitry that support digitally-beamformed signaling. A first component may include antenna elements on a first side of a substrate. A second component (e.g., including analog amplification circuitry coupled with the antenna elements) may be bonded over a first location of a second side of the first component, and a third component (e.g., including analog-to-digital and / or digital-to-analog circuitry coupled with the amplification circuitry) may be bonded over a second location of the second side of the first component. The second and third components may implement different types of semiconductor substrates and / or shielding that is tailored to the respective types of circuitry and / or radiation sensitivity or exposure of the respective components.

Description

CONSTRUCTION AND PACKAGING OF DIGITALLY-BEAMFORMED ANTENNASCROSS REFERENCE

[0001] The present Application for Patent claims the benefit of U.S. Provisional Patent Application No. 63 / 694,605 by Franson, entitled “CONSTRUCTION AND PACKAGING OF A DIGITAL BEAMFORMED ANTENNA,” filed September 13, 2024, which is assigned to the assignee hereof, and which is expressly incorporated by reference in its entirety herein.FIELD OF TECHNOLOGY

[0002] The following relates to techniques for wireless communications, including beamformed antenna arrays.BACKGROUND

[0003] Communications devices may communicate with one another using wired connections, wireless (e.g., radio frequency (RF)) connections, or a combination thereof. Wireless communications between devices may be performed using a wireless spectrum that has been designated for a service provider, or a wireless technology, among other examples. Various configurations of antenna arrays may be implemented to support wireless communications (e.g., at microwave frequencies, at millimeter wave frequencies), such as in satellites, aircraft, watercraft, vehicles, and base stations for general land-based communications. Some such antenna arrays may include radiating elements driven with analog beamforming circuitry (e.g., phase shifting beamforming circuitry) to generate a phased array for beam steering, and some implementations may include such an antenna array with integrated beamforming circuitry in a low-profile antenna assembly (e.g., an integrated antenna array). However, some such implementations may be inadequate for relatively higher signal frequencies as a result of relatively high losses or insufficient dimensional accuracy, or may be sensitive to radiation degradation (e.g., associated with space applications), or may not contemplate packaging improvements that may be applicable to other beamforming techniques, among other drawbacks.Attorney Docket No. VS2608-WO-1 (78120.0713)SUMMARY

[0004] The described techniques relate to improved methods, systems, devices, and apparatuses that support construction and packaging of digitally-beamformed antennas. For example, antenna assemblies in accordance with the described techniques may include components (e.g., subcomponents, subassemblies) that are coupled (e.g., bonded, adhered, soldered, fused) with one another, with respective components including different portions of circuitry that support digitally-beamformed signaling.

[0005] Some aspects in accordance with the described techniques may involve an antenna apparatus, including a first component, one or more second components, and one or more third components. A first component may include a substrate, a plurality of antenna elements on a first side of the substrate, and a plurality of first electrical contacts on a second side of the substrate, with each of the plurality of first electrical contacts being electrically coupled with a respective one of the plurality of antenna elements (e.g., by way of conductive vias through the substrate). A second component may be bonded over a respective first location of the second side of the first component (e.g., the second side of the substrate), and a third component may be bonded over a respective second location (e.g., different than respective first location(s)) of the second side of the first component.

[0006] In some aspects (e.g., to support digitally-beamformed reception techniques), a second component may include a plurality of second electrical contacts each electrically coupled with (e.g., soldered with, fused with) a respective one of the plurality of first electrical contacts, a plurality of amplifiers (e.g., low-noise amplifiers) each having an input coupled with a respective one of the plurality of second electrical contacts, and a plurality of third electrical contacts each electrically coupled with an output of a respective one of the plurality of amplifiers. In some such aspects, a third component may include a plurality of fourth electrical contacts each electrically coupled with a respective one of the plurality of third electrical contacts, and a plurality of conversion circuits each having an input coupled with a respective one of the plurality of fourth electrical contacts, each of the plurality of conversion circuits including a respective frequency conversion circuit (e.g., a downconversion circuit), a respective analog-to-digital circuit, or a combination thereof.

[0007] Additionally, or alternatively, in some aspects (e.g., to support digitally- beamformed transmission techniques), a third component may include a plurality ofAttorney Docket No. VS2608-WO-1 (78120.0713)second conversion circuits, each of the plurality of second conversion circuits including a respective digital-to-analog circuit, a respective second frequency conversion circuit (e.g., an upconversion circuit), or a combination thereof. In some such aspects, a second component may include a plurality of amplifiers (e.g., high-power amplifiers) each having an input coupled with a respective one of the plurality of second conversion circuits and having an output coupled with a respective one of the plurality antenna elements of the first component.

[0008] Some aspects in accordance with the described techniques may involve a method of forming an antenna apparatus (e.g., including a first component, one or more second components, and one or more third components described herein). Such a method may include bonding (e.g., soldering, fusing) one or more second components over respective first location(s) of a second side of a first component, and bonding one or more third components over respective second location(s) (e.g., different than respective first location(s)) of the second side of the first component, which may involve a bonding over a shielding component, over a signal redistribution portion, or a combination thereof.BRIEF DESCRIPTION OF THE DRAWINGS

[0009] FIG. 1 shows an example of an antenna assembly that supports construction and packaging of digitally-beamformed antennas in accordance with examples described herein.

[0010] FIGs. 2A and 2B show examples of antenna assemblies that supports construction and packaging of digitally-beamformed antennas in accordance with examples described herein.

[0011] FIG. 3 shows an example of an antenna assembly that supports construction and packaging of digitally-beamformed antennas in accordance with examples described herein.

[0012] FIG. 4 shows a flowchart illustrating methods that support construction and packaging of digitally-beamformed antennas in accordance with examples described herein.Attorney Docket No. VS2608-WO-1 (78120.0713)DETAILED DESCRIPTION

[0013] Antenna arrays may be implemented to support wireless communications (e.g., radio frequency (RF) communications, at microwave frequencies, at millimeter wave frequencies), such as in satellites, aircraft, watercraft, vehicles, base stations, and user terminals, among other implementations. Some antenna arrays may include radiating elements driven with beamforming circuitry (e.g., analog beamforming circuitry, phase shifting beamforming circuitry) to generate a phased array for beam steering. In an effort to reduce packaging size or constraints, or improve aspects of component integration, some antenna implementations may include such an antenna array with integrated beamforming circuitry in a low-profile antenna assembly (e.g., an integrated antenna array). However, some such implementations may be inadequate for relatively higher signal frequencies as a result of relatively high losses or insufficient dimensional accuracy, or may be sensitive to radiation degradation (e.g., associated with space applications), or may not contemplate packaging improvements that may be applicable to other beamforming techniques, among other drawbacks.

[0014] In accordance with aspects as disclosed herein, antenna assemblies that support digitally-beamformed wireless signaling may include components (e.g., subcomponents, subassemblies, integrated circuit (IC) components) that are coupled (e.g., bonded, adhered, soldered, fused) with one another, with respective components including different portions of circuitry that support digitally-beamformed signaling. For example, an antenna assembly in accordance with the disclosed techniques may include a first component, one or more second components, and one or more third components. A first component may include antenna elements (e.g., microstrip radiating elements, patch elements) on a first side of a substrate. A second component (e.g., including analog amplification circuitry coupled with the antenna elements) may be bonded over a first location of a second side of the substrate (e.g., of the first component), and a third component (e.g., including analog-to-digital and / or digital-to- analog circuitry coupled with the amplification circuitry) may be bonded over a second location of the second side of the substrate. The second and third components may implement different types of semiconductor substrates and / or shielding that is tailored to the respective types of circuitry, respective types of signaling (e.g., analog signaling, digital signaling, or both, relatively higher or lower voltages), and / or radiation sensitivity or exposure of the respective components. Forming such an antennaAttorney Docket No. VS2608-WO-1 (78120.0713)assembly may include bonding (e.g., soldering, fusing, electrically coupling) one or more second components over respective first location(s) of a second side of a first component, and bonding one or more third components over respective second location(s) (e.g., different than respective first location(s)) of the second side of the first component, which may involve a bonding over a shielding component, over a signal redistribution portion, or a combination thereof.

[0015] Aspects of the disclosure are further illustrated by and described with reference to antenna assemblies and methods of forming antenna assemblies that relate to construction and packaging of digitally-beamformed antennas.

[0016] FIG. 1 shows an example of an antenna assembly 100 that supports construction and packaging of digitally-beamformed antennas in accordance with examples described herein. Aspects of an antenna assembly 100 may be described with reference to an x-direction, a y-direction, and a z-direction of the illustrated coordinate system.

[0017] An antenna assembly 100 (e.g., an antenna apparatus, an antenna system, an antenna module) may support signal reception, signal transmission, or both signal reception and signal transmission along one or more directions that may be at least partially aligned along the z-direction (e.g., along the z-direction, along one or more directions having a respective angle relative to the z-direction). In some implementations, an antenna assembly 100, or components thereof, may be configured for operation over a millimeter (mm) wave frequency band, which may refer to a band within the 30 GHz to 300 GHz range. In some other implementations, an antenna assembly 100, or components thereof, may be configured for operation below 30 GHz.

[0018] The antenna assembly 100 includes a substrate 110 and a plurality of antenna elements 115 (e.g., an array of elements, of an antenna array) that are spatially arranged across a surface (e.g., a planar surface, in an xy-plane, a non-planar surface) of the substrate 110. Antenna elements 115 may be formed (e.g., deposited, printed, in accordance with a metallization) on a top surface of a substrate 110, or may be disposed within a substrate 110 beneath a top surface (e.g., between a first layer of the substrate 110 and a second layer of the substrate 110, beneath a protective layer formed over the substrate 110). Antenna elements 115 may be formed of one or more metals, such as copper, gold, silver, aluminum, or other metals or combinations thereof. In someAttorney Docket No. VS2608-WO-1 (78120.0713)examples, a substrate 110 may be a low loss tangent material, such as quartz or fused silica, which may be beneficial in relatively high-frequency operation for relatively lower losses than some other substrate materials.

[0019] The quantity of antenna elements 115, their type, sizes, shapes, inter-element spacing, and the manner in which they are driven may be varied by design to achieve targeted performance metrics. Examples of such performance metrics may include beam width, beam direction, polarization, sidelobes, power loss, beam shape, and others in accordance with an operational frequency band (e.g., operational bandwidth). The antenna elements 115 may include microstrip patch antenna elements (e.g., as illustrated), or other element types such as printed dipoles or slotted elements, among other element types. In some implementations, one or more antenna elements 115 may include slits or other features (not shown) that support impedance matching, among other signal characteristics. In some implementations, one or more ground planes may be formed (e.g., printed, in accordance with a metallization) on a surface of the substrate 110 (e.g., a planar surface, in an xy-plane, a non-planar surface) that is opposite from one or more antenna elements 115 (e.g., all of the antenna elements 115, respective subsets of the antenna elements 115, along the z-direction), and may reflect signal energy to or from the one or more antenna elements 115.

[0020] The antenna elements 115 may be coupled with (e.g., electrically connected with) beamforming components for receiving RF signals (e.g., in accordance with reception beamforming techniques), transmitting RF signals (e.g., in accordance with transmission beamforming techniques), or both transmitting and receiving RF signals. Beamforming techniques may be used to steer (e.g., in accordance with angles about or relative to the z-direction or other axis of the antenna assembly 100) or shape (e.g., broaden, narrow, focus, defocus, elongate, across a beamwidth) one or more beams 120 (e.g., communication beams, receive beams, transmit beams, beamformed spot beams, spot beams) along a respective beam direction 125 (e.g., beam orientation, spatial path) between the antenna assembly 100 and a target (e.g., a target device, a target coverage area).

[0021] A beam 120 may be formed by determining weighting coefficients for antenna elements 115 that result in the signals received at or transmitted from the antenna elements 115 being combined, such that signals propagating along a beamAttorney Docket No. VS2608-WO-1 (78120.0713)direction 125 relative to the antenna assembly 100 experience constructive combination (e.g., constructive interference) while signals propagating along other directions experience destructive combination (e.g., destructive interference). Thus, beamforming may be used to receive signals that arrive along a beam direction 125, or transmit signals to depart along a beam direction 125, with energy that is focused along the beam direction 125 with increased signal power (e.g., relative to the absence of beamforming). Such weighting coefficients may be used to apply amplitude offsets, phase offsets, time offsets, or a combination thereof to signals carried via the antennas. In some examples, weighting coefficients applied to antenna elements 115 may be used to form multiple beams 120, each associated with a respective (e.g., different) beam direction 125, in which case multiple beams 120 may be used to communicate multiple signals having the same frequency at the same time to different user terminals. Weighting coefficients used for beamforming may be referred to as beam coefficients, and signals conveyed along beams 120 may be referred to as beam signals.

[0022] In some examples, analog beamforming circuitry may be used to apply amplitude offsets and phase offsets to respective signals conveyed by antenna elements 115. For example, an analog beamforming circuit may include, for each antenna element 115, a respective analog phase shifter configured to apply a phase offset to a signal conveyed by the antenna element 115, and a respective variable amplifier configured to apply an amplitude scaling to the signal conveyed by the antenna element 115. However, some such implementations of analog beamforming circuitry, including those that are mounted with a substrate 110, may be inadequate for relatively higher signal frequencies. For example, relatively higher-frequency signaling may be relatively more sensitive to circuit losses (e.g., resistive losses, capacitive losses, distortions) along signal paths of or between the antenna elements 115 and analog beamforming circuitry. Additionally, or alternatively, relatively higher-frequency signaling may be relatively more sensitive to matching (e.g., impedance matching, propagation matching, or inaccuracies thereof) among antenna elements 115 and coupled analog beamforming circuitry, which may be associated with dimensional accuracy limitations of such antennas (e.g., implementations of such antennas that include printed wiring board (PWB) substrates or mounting), among other shortcomings. Although some aspects of digital beamforming may overcome some drawbacks of analog beamforming, some implementations of digital beamforming may be relatively sensitive to radiationAttorney Docket No. VS2608-WO-1 (78120.0713)degradation (e.g., associated with space applications), or may be relatively complex or costly, which may preclude the use of digital beamforming in some implementations.

[0023] In accordance with aspects as disclosed herein, antenna assemblies 100 that support digitally-beamformed signaling (e.g., digitally-beamformed beams 120) may include components (e.g., subcomponents, subassemblies, IC components) that are coupled (e.g., bonded, adhered, soldered, fused) with one another, with respective components including different portions of circuitry that support the digitally- beamformed signaling. For example, such an antenna assembly 100 may include a first component, one or more second components, and one or more third components. A first component may include antenna elements 115 (e.g., microstrip radiating elements, patch elements) on a first side of a substrate 110. A second component (e.g., a first semiconductor chip, including analog amplification circuitry coupled with the antenna elements) may be bonded over a first location of a second side of the substrate (e.g., a second side of the first component), and a third component (e.g., a second semiconductor ship, including analog-to-digital and / or digital-to-analog circuitry coupled with the amplification circuitry) may be bonded over a second location of the second side of the substrate. The second and third components may implement different types of semiconductor substrates and / or shielding that is tailored to the respective types of circuitry and / or radiation sensitivity or exposure of the respective components. Forming such an antenna assembly 100 may include bonding (e.g., soldering, fusing, electrically coupling) one or more second components over respective first location(s) of a second side of a first component, and bonding one or more third components over respective second location(s) (e.g., different than respective first location(s)) of the second side of the first component, which may involve a bonding over a shielding component, over a signal redistribution portion, or a combination thereof.

[0024] FIG. 2A shows an example of an antenna assembly 100-a that supports construction and packaging of digitally-beamformed antennas in accordance with examples described herein. The antenna assembly 100-a includes an example of a component 210-a (e.g., a first component), a component 220-a (e.g., a second component), and a component 230-a (e.g., a third component). In some implementations, an antenna assembly 100-a also may include or be coupled with a beamforming processor 242-a, a frequency generator 246-a, or both (e.g., physically coupled as part of the antenna assembly 100-a in accordance with an integratedAttorney Docket No. VS2608-WO-1 (78120.0713)assembly, as part of a separate assembly that is coupled or couplable with component s) 230-a via a wired connection). An antenna assembly 100-a may be configured to support at least digitally-beamformed signal reception (e.g., of one or more beams 120, along one or more beam directions 125). Although the example of antenna assembly 100-a includes illustrative quantities of components, an antenna assembly 100-a in accordance with the described techniques may include any quantity of one or more components 210-a, components 220-a, components 230-a, beamforming processor(s) 242-a, frequency generator(s) 246-a, or components thereof.

[0025] The component 210-a includes antenna elements 115-a (e.g., antenna elements 115-a-l, 115-a-2, 115-a-3, and 115-a-4, antenna elements 115 that support at least signal reception). The antenna elements 115-a may be located on (e.g., formed on, mounted on, distributed across, in an xy -plane or other distribution) a substrate 110, such as a fused silica substrate. In some implementations, an antenna assembly 100-a may include a single component 210-a (e.g., a single substrate 110 including all antenna elements 115-a, such as all antenna elements 115-a coupled with a beamforming processor 242-a, for at least signal reception), which may support relatively precise physical tolerances among antenna elements 115-a (e.g., during manufacturing, during operation). In some other examples, one or more components 210-a of an antenna assembly 100-a may include multiple substrates 110, which may positioned in a fixed relationship with one another, or may be physically positionable (e.g., deployable) in accordance with various assembly or actuation techniques.

[0026] A component 220-a may include amplifiers 225-a (e.g., amplifiers 225-a- 1, 225-a-2, 225-a-3, 225-a-4). Each of the amplifiers 225-a may have an input that is coupled (e.g., connected, electrically connected) with a respective one of the antenna elements 115-a. Although the example component 220-a is illustrated with four amplifiers 225-a, a component 220-a in accordance with the described techniques may include any quantity of one or more amplifiers 225-a. A component 220-a may be coupled (e.g., physically, electrically, bonded, soldered, fused, adhered, directly, indirectly via an intervening component) with a component 210-a, with such a coupling between the component 220-a and the component 210-a (e.g., including coupling via respective contacts) supporting the respective coupling between amplifiers 225-a and antenna elements 115-a. Although the illustrated example shows a single componentAttorney Docket No. VS2608-WO-1 (78120.0713)220-a coupled with a component 210-a, an antenna assembly 100-a may include a component 210-a that is coupled with any quantity of one or more components 220-a.

[0027] Amplifiers 225-a may be referred to as low-noise amplifiers (LNAs), and may be configured for signal amplification in an analog domain. Amplifiers 225-a may involve transistors or other circuitry that is formed at least in part from doped portions of a substrate (e.g., a semiconductor substrate) of a component 220-a. For example, a component 220-a may be a semiconductor chip that is bonded (e.g., soldered, fused) with a component 210-a. A component 220-a may involve relatively higher-voltage or higher-power electronics (e.g., amplifiers 225-a) and, in some examples, may be exposed to degrading radiation. Thus, a semiconductor substrate of a component 220-a may be selected for relatively high electron mobility, direct bandgap, or relatively high robustness to radiation effects, and may be a III-V semiconductor, such as gallium nitride, indium phosphide, or other such semiconductor, despite the relatively higher cost of some such semiconductors (e.g., compared to Group IV semiconductors).

[0028] A component 230-a may include conversion circuits 232-a (e.g., conversion circuits 232-a-l, 232-a-2, 232-a-3, 232-a-4). Each of the conversion circuits 232-a may have an input that is coupled with a respective one of the amplifiers 225-a. A component 230-a may be coupled (e.g., electrically, directly, indirectly via an intervening component) with one or more components 220-a, with such a coupling between the component 230-a and the component 220-a (e.g., including coupling via respective contacts) supporting the respective coupling between conversion circuits 232-a and amplifiers 225-a. However, in some implementations, component(s) 230-a may be bonded over different locations of the component 210-a than component(s) 220-a. Although the illustrated example shows a single component 230-a coupled with a component 220-a, an antenna assembly 100-amay include a component 230-a that is coupled with any quantity of one or more components 220-a, or a component 220-a that is coupled with any quantity of one or more components 230-a.

[0029] In some implementations, conversion circuits 232-a may include respective frequency conversion circuits 234-a (e.g., frequency conversion circuits 234-a-l, 234-a-2, 234-a-3, 234-a-4, frequency mixers, downconverters), which may convert relatively higher-frequency signals (e.g., RF signals, received by antenna elements 115-a and amplified by amplifiers 225-a) to relatively lower-frequency signals (e.g.,Attorney Docket No. VS2608-WO-1 (78120.0713)intermediate frequency (IF) signals, baseband signals). In an illustrative example, RF signals may be received by a frequency conversion circuit 234-a at a frequency of 60 GHz, and the frequency conversion circuit 234-a may receive a reference signal (e.g., a clock signal, a local oscillator signal) from a frequency generator 246-a (e.g., a local oscillator, a synthesizer) at a frequency of 61 GHz, such that signals may be output from the frequency conversion circuit 234-a at a frequency of 1 GHz (e.g., at a difference between the input RF frequency and the local oscillator frequency). In some other examples, conversion circuits 232-a may omit frequency conversion circuits 234-a.

[0030] In some implementations, conversion circuits 232-a may additionally, or alternatively, include respective analog-to-digital converters (ADCs) 236-a (e.g., ADCs 236-a-l, 236-a-2, 236-a-3, 236-a-4, analog-to-digital conversion circuits), which may convert (e.g., digitize) from signals in an analog domain to signals in a digital domain. Continuing with the illustrative example, a 1 GHz analog signal may be received at an ADC 236-a (e.g., from a frequency conversion circuit 234-a) and converted into a digital signal of a particular bit width (e.g., resolution, as a 2 -bit digital signal, as a 4-bit digital signal, as an 8-bit digital signal, as a 16-bit digital signal, as a 24-bit signal, as a 32-bit digital signal, or as a 64-bit digital signal, among other examples) which, in some examples, also may be a 1 GHz signal, or may be a signal having a different frequency (e.g., a higher frequency, a lower frequency, a clock frequency) in the digital domain.

[0031] In some examples, a component 230-a may include a serializer 238, which may be coupled with the output of multiple conversion circuits 232-a. In some examples, such techniques may support digital signals from the multiple conversion circuits 232-a being serialized and output along fewer signal paths (e.g., a single signal path, one or more shared signal paths of a digital bus). In some other examples, a serializer 238 may be omitted, and a component 230-a may have a separate output (e.g., an output bus having one or more signal paths) corresponding to each antenna element 115-a.

[0032] Conversion circuits 232-a, serializer(s) 238, or both may involve transistors or other circuitry that is formed at least in part from doped portions of a substrate (e.g., a semiconductor substrate) of a component 230-a. For example, a component 230-a may be another semiconductor chip (e.g., a CMOS chip) that is coupled (e.g., soldered,Attorney Docket No. VS2608-WO-1 (78120.0713)fused) with a component 220-a (e.g., directly or via one or more redistribution layers, such as of a redistribution component). A component 230-a may involve relatively lower-voltage or lower-power electronics and, in some examples, may be shielded from degrading radiation (e.g., by a shielding component). Thus, a semiconductor substrate of a component 230-a may be selected for relatively lower cost or higher-performance digital processing, and may be a Group IV semiconductor, such as silicon or silicongermanium, or other such semiconductor (e.g., a different material composition than a semiconductor substrate of a component 220-a). Thus, formation of a component 230-a may leverage relatively lower-cost manufacturing, or manufacturing that targets relatively higher-performance digital processing (e.g., processor foundries), among other aspects favorable for the formation of a component 230-a (e.g., compared to other aspects that may be favorable for the formation of a component 220-a).

[0033] One or more components 230-a of the antenna assembly 100-a may be coupled with a beamforming processor 242-a (e.g., a reception beamformer), which may refer to one or more components (e.g., a single processing component, multiple distributed processing components) that apply beam weights (e.g., digital beam weights, amplitude manipulation, delay manipulation) to digital signals received from component s) 230, and combine (e.g., add, digitally) the weighted signals to output a beam signal (e.g., in a digital domain) that is conveyed by a beam 120 (e.g., a receive beam). In some examples, aspects of a beamforming processor 242-a may be included in (e.g., distributed among) one or more components 230-a. In some other examples, a beamforming processor 242-a may be part of a standalone component (e.g., a standalone processing chip or module) that is separate from component s) 230-a, or that is separate from the antenna assembly 100-a, among other implementations.

[0034] Thus, in accordance with these and other aspects disclosed herein, an antenna assembly 100-a may support digitally-beamformed signaling (e.g., digitally- beamformed beams 120, digitally-beamformed reception) by integrating component(s) 210-a, 220-a, and 230-a that include different portions of circuitry that support the digitally-beamformed signaling. The components 220-a and 230-a may, for example, implement different types of semiconductor substrates, formation techniques (e.g., foundry techniques, circuitry configurations), and / or shielding that is tailored to the respective types of circuitry, respective types of signaling (e.g., analog signaling, digital signaling, or both), and / or radiation sensitivity or exposure of the respectiveAttorney Docket No. VS2608-WO-1 (78120.0713)components, to provide various advantages for digitally-beamformed signaling in an integrated antenna assembly 100.

[0035] FIG. 2B shows an example of an antenna assembly 100-b that supports construction and packaging of digitally-beamformed antennas in accordance with examples described herein. The antenna assembly 100-b includes an example of a component 210-b (e.g., a first component), a component 220-b (e.g., a second component), and a component 230-b (e.g., a third component). In some implementations, an antenna assembly 100-b also may include or be coupled with a beamforming processor 242-b, a frequency generator 246-b, or both (e.g., physically coupled as part of the antenna assembly 100-b in accordance with an integrated assembly, as part of a separate assembly that is coupled or couplable with component s) 230-b via a wired connection). An antenna assembly 100-b may be configured to support at least digitally-beamformed signal transmission (e.g., of one or more beams 120, along one or more beam directions 125). Although the example of antenna assembly 100-b includes illustrative quantities of components, an antenna assembly 100-b in accordance with the described techniques may include any quantity of one or more components 210-b, components 220-b, components 230-b, beamforming processor(s) 242-b, frequency generator(s) 246-b, or components thereof.

[0036] In some implementations, one or more components 230-b of an antenna assembly 100-b may be coupled with a beamforming processor 242-b (e.g., a transmission beamformer), which may refer to one or more components (e.g., a single processing component, multiple distributed processing components) that apply beam weights (e.g., amplitude manipulation, delay manipulation) to one or more beam signals (e.g., in a digital domain) that are to be conveyed by a respective beam 120 (e.g., a transmit beam, via antenna elements 115-b). Such techniques may be performed to generate a respective signal, in the digital domain, for each of the antenna elements 115-b. In some examples, aspects of a beamforming processor 242-b may be included in (e.g., distributed among) one or more components 230-b. In some other examples, a beamforming processor 242-b may be part of a standalone component (e.g., a standalone processing chip or module) that is separate from component s) 230-b, or that is separate from the antenna assembly 100-b, among other implementations. Although aspects of a beamforming processor 242-b are described in the context of signal transmission, in some implementations, a same beamforming processor 242 may beAttorney Docket No. VS2608-WO-1 (78120.0713)implemented for both signal transmission and signal reception (e.g., implementing aspects of both a beamforming processor 242-b and a beamforming processor 242-a) in accordance with the described techniques.

[0037] A component 230-b may include conversion circuits 262-a (e.g., conversion circuits 262-a- 1, 262-a-2, 262-a-3, 262-a-4), each corresponding to a respective antenna element 115-b. In some examples, a component 230-b may also include a deserializer 268, which may be coupled with the output of a beamforming processor 242-b that communicates signaling for multiple antenna elements 115-b. In some examples, such techniques may support digital signals from the beamforming processor 242-b being serialized and output along fewer signal paths (e.g., a single signal path, one or more shared signal paths of a digital bus). In some other examples, a deserializer 268 may be omitted, and a component 230-b may have a separate input (e.g., an input bus having one or more signal paths) corresponding to each antenna element 115-b.

[0038] In some implementations, conversion circuits 262-a may include respective digital-to-analog converters (DACs) 266-a (e.g., DACs 266-a-l, 266-a-2, 266-a-3, and 266-a-4, digital-to-analog conversion circuits), which may convert from signals in a digital domain to signals in an analog domain. For example, a digital signal of a particular bit width may be received at a DAC 266-a (e.g., from a beamforming processor 242-b), and the DAC 266-a may convert the digital signal and output a corresponding analog signal.

[0039] In some implementations, conversion circuits 262-a may additionally, or alternatively, include respective frequency conversion circuits 264-a (e.g., frequency mixers, upconverters), which may convert relatively lower-frequency signals (e.g., IF signals, baseband signals) to relatively higher-frequency signals (e.g., RF signals, in accordance with transmission frequency via the antenna elements 115-b). In an illustrative example, IF signals may be received by a frequency conversion circuit 264-a at a frequency of 1 GHz, and the frequency conversion circuit 264-a may receive a reference signal (e.g., a clock signal, a local oscillator signal) from a frequency generator 246-b (e.g., a local oscillator, a synthesizer) at a frequency of 59 GHz, such that signals may be output from the frequency conversion circuit 264-a at a frequency of 60 GHz (e.g., at a sum of the input RF frequency and the local oscillator frequency). InAttorney Docket No. VS2608-WO-1 (78120.0713)some other examples, conversion circuits 262-a may omit frequency conversion circuits 264-a.

[0040] Conversion circuits 262-a, deserializer s) 268, or both may involve transistors or other circuitry that is formed at least in part from doped portions of a substrate (e.g., a semiconductor substrate) of a component 230-b. For example, a component 230-b may be a semiconductor chip (e.g., a CMOS chip) that is coupled (e.g., soldered, fused) with a component 220-b (e.g., directly or via one or more redistribution layers, such as of a redistribution component). A component 230-b may involve relatively lower-voltage or lower-power electronics and, in some examples, may be shielded from degrading radiation (e.g., by a shielding component). Thus, a semiconductor substrate of a component 230-b may be selected for relatively lower cost or higher-performance digital processing, and may be a Group IV semiconductor, such as silicon or silicon-germanium, or other such semiconductor (e.g., a different material composition than a semiconductor substrate of a component 220-b). Thus, formation of a component 230-b may leverage relatively lower-cost manufacturing, or manufacturing that targets relatively higher-performance digital processing (e.g., processor foundries), among other aspects favorable for the formation of a component 230-b (e.g., compared to other aspects that may be favorable for the formation of a component 220-b).

[0041] Although aspects of components 230-b are described in the context of signal transmission, in some implementations, a component 230 may be implemented for both signal transmission and signal reception in accordance with the described techniques. For example, a component 230 may include one or more conversion circuits 232, one or more conversion circuits 262, or a combination thereof. In an illustrative example, a component 230 may include conversion circuit(s) 232 that are coupled with a component 220-a (e.g., one or more amplifiers 225), and conversion circuit(s) that are coupled with a component 220-b (e.g., one or more amplifiers 255, separate from the component 220-a). In some implementations, including both conversion circuit(s) 232 and conversion circuit(s) 262 in a same component 230 may support aspects of bidirectional signaling with fewer components. In some other examples, a component 230 may be implemented with conversion circuits 232, or conversion circuits 262, but not both. For example, it may be beneficial to match a spatial distribution (e.g., pitch, in an xy-plane) of conversion circuits 232 or conversion circuits 262 within a spatial distribution of antenna elements 115. In some examples, the spacing of antennaAttorney Docket No. VS2608-WO-1 (78120.0713)elements 115 may be too constraining to distribute a corresponding quantity of both conversion circuits 232 and conversion circuits 262 in a same component 230 (e.g., due to spatial constraints, due to thermal constraints, due to power constraints). Thus, an antenna assembly 100 that supports bidirectional beamformed communications in accordance with the described techniques may separately include both component s) 230-a and component s) 230-b, which may be coupled with a same beamforming processor 242, a same component 210 (e.g., a same set of bidirectional antenna elements 115, different sets of antenna elements 115 allocated to signal transmission or reception), or different beamforming processors 242 (e.g., a beamforming processor 242-a and a beamforming processor 242-b), or different components 210 (e.g., a component 210-a and a component 210-b).

[0042] A component 230-b may be coupled (e.g., electrically, directly, indirectly via an intervening component) with one or more components 220-b, with such a coupling between the component 230-b and the component 220-b (e.g., including coupling via respective contacts) supporting the respective coupling between conversion circuits 262-a and amplifiers 255-a. However, in some implementations, component(s) 230-b may be bonded over different locations of the component 210-b than component s) 220-b. Although the illustrated example shows a single component 230-b coupled with a component 220-b, an antenna assembly 100-b may include a component 230-b that is coupled with any quantity of one or more components 220-b, or a component 220-b that is coupled with any quantity of one or more components 230-b.

[0043] A component 220-b may include amplifiers 255-a (e.g., amplifiers 255-a-l, 255-a-2, 255-a-3, 255-a-4). Each of the amplifiers 255-a may have an input that is coupled (e.g., connected, electrically connected) with a respective conversion circuit 262, and an output that is coupled with a respective one of the antenna elements 115-b. Although the example component 220-b is illustrated with four amplifiers 255-a, a component in accordance with the described techniques may include any quantity of one or more amplifiers 255-a. A component 220-b may be coupled (e.g., physically, electrically, bonded, soldered, fused, adhered, directly, indirectly via an intervening component) with a component 210-b, with such a coupling between the component 220-b and the component 210-b (e.g., including coupling via respective contacts) supporting the respective coupling between amplifiers 255-a and antenna elements 115-b. Although the illustrated example shows a single component 220-b coupled withAttorney Docket No. VS2608-WO-1 (78120.0713)a component 210-b, an antenna assembly 100-b may include a component 210-b that is coupled with any quantity of one or more components 220-b.

[0044] Amplifiers 255-a may be referred to as high-power amplifiers (HP As), and may be configured for signal amplification in an analog domain. Amplifiers 255-a may involve transistors or other circuitry that is formed at least in part from doped portions of a substrate (e.g., a semiconductor substrate) of a component 220-b. For example, a component 220-b may be a semiconductor chip that is bonded (e.g., soldered, fused) with a component 210-b. A component 220-b may involve relatively higher-voltage or higher-power electronics (e.g., amplifiers 255-a) and, in some examples, may be exposed to degrading radiation. Thus, a semiconductor substrate of a component 220-b may be selected for relatively high electron mobility, direct bandgap, or relatively high robustness to radiation effects, and may be a III-V semiconductor, such as gallium nitride, indium phosphide, or other such semiconductor, despite the relatively higher cost of some such semiconductors.

[0045] Although aspects of components 220-b are described in the context of signal transmission, in some implementations, a component 220 may be implemented for both signal transmission and signal reception in accordance with the described techniques. For example, a component 220 may include one or more amplifiers 225, one or more amplifiers 255, or a combination thereof. In some implementations, including both amplifiers 225 and amplifiers 255 in a same component 220 may support aspects of bidirectional signaling with fewer components. In some other examples, a component 220 may be implemented with amplifiers 225, or amplifiers 255, but not both. For example, it may be beneficial to match a spatial distribution (e.g., pitch, in an xy-plane) of amplifiers 225 or amplifiers 255 within a spatial distribution of antenna elements 115. In some examples, spacing of antenna elements 115 may be too constraining to distribute a corresponding quantity of both amplifiers 225 and amplifier 255 in a same component 220 (e.g., due to spatial constraints, due to thermal constraints, due to power constraints). Thus, an antenna assembly 100 that supports bidirectional beamformed communications in accordance with the described techniques may separately include both component(s) 220-a and component(s) 220-b, which may be coupled with a same component 230 (e.g., including conversion circuits 232 and conversion circuits 262), different components 230 (e.g., a component 230-a and a component 230-b), a same component 210 (e.g., a same set of bidirectional antenna elements 115, different sets ofAttorney Docket No. VS2608-WO-1 (78120.0713)antenna elements 115 allocated to signal transmission or reception) or different components 210 (e.g., a component 210-a and a component 210-b).

[0046] The component 210-b includes antenna elements 115-b (e.g., antenna elements 115-b-l, 115-b-2, 115-b-3, and 115-b-4, antenna elements 115 that support at least signal transmission). The antenna elements 115-b may be located on (e.g., formed on, mounted on, distributed across, in an xy -plane or other distribution) a substrate 110, such as a fused silica substrate. In some implementations, an antenna assembly 100-b may include a single component 210-b (e.g., a single substrate 110 including all antenna elements 115-b, such as all antenna elements 115-b coupled with a beamforming processor 242-b, for at least signal transmission), which may support relatively precise physical tolerances among antenna elements 115-b. In some other examples, one or more components 210-b of an antenna assembly 100-b may include multiple substrates 110, which may positioned in a fixed relationship with one another, or may be physically positionable in accordance with various assembly or actuation techniques. Although aspects of antenna elements 115-b are described in the context of signal transmission, in some implementations, a same set of antenna elements 115 (e.g., of a same component 210-b, of multiple components 210) may be implemented for both signal transmission and signal reception (e.g., implementing aspects of both antenna elements 115-a and antenna elements 115-b) in accordance with the described techniques.

[0047] Thus, in accordance with these and other aspects disclosed herein, an antenna assembly 100-b may support digitally-beamformed signaling (e.g., digitally- beamformed beams 120, digitally-beamformed transmission) by integrating component s) 210-b, 220-b, and 230-b that include different portions of circuitry that support the digitally-beamformed signaling. The components 220-b and 230-b may, for example, implement different types of semiconductor substrates, formation techniques (e.g., foundry techniques, circuitry configurations), and / or shielding that is tailored to the respective types of circuitry, respective types of signaling (e.g., analog signaling, digital signaling, or both), and / or radiation sensitivity or exposure of the respective components, to provide various advantages for digitally-beamformed signaling in an integrated antenna assembly 100.Attorney Docket No. VS2608-WO-1 (78120.0713)

[0048] FIG. 3 shows an example of an antenna assembly 100-c that supports construction and packaging of digitally-beamformed antennas in accordance with examples described herein. The antenna assembly 100-c includes an example of a component 210-c, a component 220-c, and a component 230-c. An antenna assembly 100-c may be configured to support digitally-beamformed signal reception, digitally- beamformed signal transmission, or both. In some examples, an antenna assembly 100-c may include one or more beamforming processors 242, one or more frequency generators 246, or both (e.g., being integrated with one or more components 230-c, being part of another component of the antenna assembly 100-c, not shown). In some examples, an antenna assembly 100-c may be couplable with one or more beamforming processors 242, one or more frequency generators 246, or both (e.g., separate from the antenna assembly 100-c, via a soldered connection, via a fusion between electrical contacts, via a wired connection). Aspects of an antenna assembly 100-c may be described with reference to an x-direction, a y-direction, and a z-direction of the illustrated coordinate system. Although the example of antenna assembly 100-c includes illustrative quantities of components, an antenna assembly 100-c in accordance with the described techniques may include any quantity of one or more components 210-c, components 220-c, components 230-c, beamforming processor(s) 242 (not shown), frequency generator(s) 246 (not shown), or components thereof.

[0049] The component 210-a may include a substrate 110-c and a plurality of antenna elements 115-c on a first side 111-c of the substrate 110-c (e.g., a fused silica substrate, having a thickness along the z-direction of 150-500 microns, such as 250 microns). For example, the component 210-a may include an array of antenna elements 115-c that are distributed along the first side 111-c (e.g., an xy-plane). In some implementations, the antenna elements 115-c may be covered (e.g., encapsulated) by a material 306 (e.g., a dielectric material). Additionally, or alternatively, an antenna assembly 100-c (e.g., the first component 210-c) may include a layer 308 (e.g., a protective layer), which also may be formed of fused silica or other relatively low-loss material. In some other examples, a layer 308, a material 306, or both may be omitted.

[0050] The component 210-a may also include a plurality of contacts 302 (e.g., electrical contacts, conductive contacts, solder contacts, fusion contacts, interconnects) on a second side 112-c of the substrate 110-c. In some implementations, the contacts 302 may extend through a material 310 (e.g., a dielectric material, a dielectric fill). EachAttorney Docket No. VS2608-WO-1 (78120.0713)contact 302 may be electrically coupled with a respective antenna element 115-c by a via 304 (e.g., a microstrip probe feed, a through- substrate via) extending through the substrate 110-c (e.g., along the z-direction) and connected with a surface of the antenna element 115-c and the contact 302. Although a single antenna element 115-c is illustrated as being coupled with a respective contact 302, each of the antenna elements 115-c of the component 210-c may be coupled with a respective contact 302, which may involve various routing traces and vias 304 between the antenna element 115-c and the contact 302. A plurality of vias 304 feeding a respective plurality of antenna elements 115-c may be considered an array of vias extending through the substrate 110-c.

[0051] In some examples, the component 210-c may also include a ground plane 312, which may be electrically connected with one or more other ground conductors of the antenna assembly 100-c (e.g., a ground conductor of component(s) 220-c, a ground conductor of the component(s) 230-c, a ground conductor of a power source coupled with the antenna assembly 100-c, such as a power source coupled with the component(s) 220-c and the component(s) 230-c). Although illustrated in a different position in an xy -plane (e.g., along the x-direction) than some antenna elements 115-c, in some implementations, at least a portion of a ground plane 312 may be aligned along the z-direction (e.g., overlapping when viewed along the z-direction) with each of the antenna elements 115-c, but may be separated from (e.g., electrically isolated from) contacts 302 by the material 310. The antenna elements 115-c, vias 304, contacts 302, and ground plane 312 (among other conductive features of the antenna assembly 100-c, such as other contacts or redistribution layers) may be formed of various metals, such as copper, gold, silver, or aluminum, among other metals or combinations thereof.

[0052] Each component 220-c of the antenna assembly 100-c may include a plurality of contacts 322 that are each electrically coupled with a respective one of the contacts 302 (e.g., with a respective antenna element 115-c). In some implementations, such coupling between contacts 302 and 322 may be supported by a solder connection 321. In some other implementations, solder connections 321 may be omitted, and contacts 302 may be coupled with contacts 322 by way of fusion bonding (e.g., direct material fusion. In some implementations, a contact 322 may be coupled with an input of an amplifier 225 of the component 220-c, with an output of an amplifier 255-c of the component 220-c, or both. Each component 220-c of the antenna assembly 100-c mayAttorney Docket No. VS2608-WO-1 (78120.0713)also include a plurality of contacts 324. In some implementations, a contact 324 may be coupled with an output of an amplifier 225 of the component 220-c, with an input of an amplifier 255-c of the component 220-c, or both. In some implementations (e.g., as illustrated), the contacts 322 may be located on a first side of the component 220-c, and the contacts 324 may be located on a second side of the component 220-c (e.g., opposite from the first side, along the z-direction). Circuitry (e.g., transistors) of amplifiers 225, amplifiers 255, or both of the component(s) 220-c may be formed at least in part from a respective semiconductor substrate of the component s) 220-c, which may include a substrate of gallium arsenide or indium phosphide, among other examples. Each component 220-c may be bonded over (e.g., along the z-direction) a respective location (e.g., in an xy-plane) of the second side 112-c (e.g., a second side of the component 210-c), such as being bonded with the component 210-c (e.g., directly, via one or more intervening components). In some examples, such bonding (e.g., in addition to an electrical coupling), may involve an adhesive or other bonding, such as a mold underfill bonding (not shown).

[0053] In some implementations, the component(s) 220-c may be encapsulated (e.g., around a perimeter of the component s) 220-c in an xy-plane, with a back side of the component 210-c, over a back side of the component 210-c) by a material 330, which may be a molding material (e.g., an organic molding material, a mold compound material, an epoxy mold compound (EMC)). For example, the component 210-c and the component(s) 220-c may each be formed separately (e.g., as separate components, in accordance with one or more metallization or semiconductor die formation operations), then the component(s) 220-c may be bonded with the component 210-c, and a back side of the bonded assembly may be covered with the material 330 (e.g., over a back side of the component 210-c, over and around the component(s) 220-c). In some examples, a surface of the material 330 may be planarized to expose at least the contacts 324 for subsequent operations. Forming the component(s) 220-c and bonding them with the component 210-c in such a manner may support improvements to signal path precision, lower losses, and matching structures, may support reduced intrinsic capacitance, and may support relatively shorter electrical connections (e.g., by locating amplifiers 225 or 255 relatively close to antenna elements 115-c in distributed components 220-c), any one or more of which may enable relatively higher frequency signaling and digital beamforming being supported by the antenna assembly 100-c.Attorney Docket No. VS2608-WO-1 (78120.0713)

[0054] Each component 230-c of the antenna assembly 100-c may include a plurality of contacts 336 that are each electrically coupled with a respective one of the contacts 324 (e.g., of the component(s) 220-c, directly, or indirectly via one or more intervening components). In some implementations, such coupling between contacts 336 and 324 may be supported by one or more redistribution layers 332, which may support locating component(s) 230-c in different locations (e.g., non-overlapping positions, in an xy-plane, when viewed along the z-direction) than components 220-c, or coupling multiple components 220-c with a single component 230-c, among other functions. In some examples, redistribution layers 332 may be formed (e.g., layer-by- layer, in accordance with one or more successive conductor and dielectric formation operations) after bonding components 220-c with a component 210-c (e.g., after forming material 330). In some other examples, redistribution layers 332 may be included in a separately formed redistribution component 334 (e.g., an interposer) that is coupled with (e.g., soldered with, fused with) one or more components 220-c after bonding components 220-c with a component 210-c (e.g., after forming material 330). In some implementations, redistribution layers 332 may also be encapsulated in the material 330, or another molding material (not shown), which may involve another encapsulation operation after forming or bonding redistribution layers 332. In some implementations, bonding a component 230-c with one or more redistribution layers 332 (e.g., with a redistribution component 334) may involve solder connections 338. In some other implementations, solder connections 338 may be omitted, and contacts 336 may be coupled with contacts redistribution layers 332 by way of fusion bonding (e.g., direct material fusion).

[0055] In some implementations, a contact 336 may be coupled with an input of a conversion circuit 232 of the component 230-c, with an output of a conversion circuit 262 of the component 230-c, or both. In some examples, an output of such a conversion circuit 232, or an input of a conversion circuit 262, may be coupled with a beamforming processor 242 (e.g., with or without a serializer 238 or deserializer 268, respectively, of the component 230-c). Additionally, or alternatively, such a conversion circuit 232, or a conversion circuit 262, or both may be configured to receive a reference signal from one or more frequency generators 246, which may be separate from the component 230-c but may be coupled with multiple of (e.g., each of) the component s) 230-c of the antenna assembly 100-c (e.g., for frequency synchronization or uniformity). CircuitryAttorney Docket No. VS2608-WO-1 (78120.0713)(e.g., transistors) of conversion circuits 232, conversion circuits 262, serializer(s) 238, or deserializer(s) 268, or any combination thereof of the component(s) 230-c may be formed at least in part from a respective semiconductor substrate of the component(s) 230-c, which may include a substrate of silicon or silicon germanium, among other examples.

[0056] Each component 230-c may be bonded over (e.g., along the z-direction) a respective location (e.g., in an xy-plane) of the second side 112-c that is different from (e.g., non-overlapping with) location(s) of component(s) 220-c (e.g., a bonding directly with the component 210-c, a bonding via one or more intervening components, as illustrated). In some examples, such bonding (e.g., in addition to an electrical coupling), may involve an adhesive or other bonding, such as a mold underfill bonding (not shown). In some examples, a shielding component 350 may be included (e.g., coupled, bonded) between the component(s) 230-c and the component 210-c. For example, component(s) 230-c may be relatively more-sensitive to radiation (e.g., than component(s) 220-c), which may include experiencing relatively greater material degradation of the component(s) 230-c as a result of radiation exposure, or relatively greater signal sensitivity to radiation exposure (e.g., inadvertent bit flips as a result of radiation incident on signal paths carrying relatively lower-voltage signals, inadvertent transistor activations as a result of radiation incident on transistors of the component(s) 230-c). Thus, in some implementations, an antenna assembly 100-c may include one or more shielding components 350, between a component 210-c and one or more components 230-c, that reduce exposure of component(s) 230-c to radiation (e.g., incoming radiation along directions at least partially along the negative z-direction.).

[0057] A shielding component 350 may have a relatively high density (e.g., at least twice the density of surrounding materials), with the relatively higher density supporting a shielding performance of the shielding component 350 with relatively thinner material (e.g., along the z-direction). For example, a shielding component may include tantalum, tungsten, platinum, or lead, among other materials or combinations thereof (e.g., in accordance with a material alloy, in accordance with layers of different materials). In some examples, such materials may be formed (e.g., deposited, directly) on the component 210-c (e.g., on the material 310) in corresponding locations over the component 210-c. In some examples, such a material may be bonded on the component 210-c. After forming or bonding shielding component(s) 350 (e.g., before, after, orAttorney Docket No. VS2608-WO-1 (78120.0713)during bonding of component(s) 220-c with the component 210-c, the material 330 may be formed around the component s) 220-c and the shielding component(s) 350. In some implementations, planarizing the material 330 (e.g., prior to formation or bonding of redistribution layer(s) 332) may expose a surface of the shielding component(s) 350, and formation or bonding of redistribution layer(s) 332 may be performed on the exposed surface. In some other examples, shielding component s) 350 may be embedded in (e.g., covered by) the material 330.

[0058] An antenna assembly 100-c may also include various other external interfaces that support interconnection with one or more components outside the antenna assembly 100-c. For example, an antenna assembly 100-c may include one or more interface components 380, which each may be coupled (e.g., electrically) with one or more components 230-c. In some examples, interface component(s) 380 may support a digital interface, such as for communicating digital signals with one or more beamforming processors 242 external to the antenna assembly 100-c, for communicating one or more reference signals (e.g., clock signals, oscillator signals) with one or more frequency generators 246 external to the antenna assembly 100-c, or for communicating one or more beam signals (e.g., corresponding to one or more beams 120) between a system external to the antenna assembly 100-c and one or more beamforming processors 242 included in the antenna assembly 100-c, among other examples. In some examples, interface component s) 380 may include one or more solder contacts 390 (e.g., of a ball grid array), or one or more RF connectors 395, or a combination thereof. An antenna assembly 100-c may also include one or more other interfaces (not shown) configured to couple with a power source (e.g., for supplying electrical power to the antenna assembly 100-c in accordance with one or more regulated voltages), which may involve one or more solder contacts, pins, or other interfaces that support coupling in accordance with one or more voltages (e.g., a positive voltage, a negative voltage, a ground voltage.

[0059] Thus, in accordance with these and other aspects disclosed herein, an antenna assembly 100-c may support digitally-beamformed signaling (e.g., digitally- beamformed beams 120, digitally-beamformed transmission, reception, or both) by integrating component(s) 210-c, 220-c, and 230-c that include different portions of circuitry that support the digitally-beamformed signaling. The components 220-c and 230-c may, for example, implement different types of semiconductor substrates,Attorney Docket No. VS2608-WO-1 (78120.0713)formation techniques (e.g., foundry techniques, circuitry configurations), and / or shielding components 350 that are tailored to the respective types of circuitry, respective types of signaling (e.g., analog signaling, digital signaling, or both), and / or radiation sensitivity or exposure of the respective components, to provide various advantages for digitally-beamformed signaling in an integrated antenna assembly 100.

[0060] FIG. 4 shows a flowchart illustrating a method 400 that supports construction and packaging of digitally-beamformed antennas in accordance with examples described herein.

[0061] At 405, the method 400 may include bonding one or more second components 220 over respective first locations of a second side 112 of a substrate 110 of a first component 210. In some examples, the first component may include a plurality of antenna elements 115 on a first side 111 of the substrate, and a plurality of first electrical contacts 302 on the second side 112 of the substrate, each of the plurality of first electrical contacts being electrically coupled with a respective one of the plurality of antenna elements. In some examples, each of the one or more second components may include a plurality of second electrical contacts 322 each electrically coupled with a respective one of the plurality of first electrical contacts as a result of bonding the second component, a plurality of amplifiers (e.g., amplifiers 225, amplifiers 255) each coupled with a respective one of the plurality of second electrical contacts, and a plurality of third electrical contacts 324 each electrically coupled a respective one of the plurality of amplifiers.

[0062] At 410, the method 400 may include bonding one or more third components 230 over respective second locations of the second side 112 of the substrate 110. In some examples, each of the one or more third components may include a plurality of fourth electrical contacts 336 each electrically coupled with a respective one of the plurality of third electrical contacts 324 as a result of bonding the third component, a plurality of conversion circuits (e.g., conversion circuit(s) 232, conversion circuit(s) 262) each coupled with a respective one of the plurality of fourth electrical contacts 336, each of the plurality of conversion circuits comprising a respective frequency conversion circuit (e.g., a frequency conversion circuit 234, a frequency conversion circuit 264), a respective ADC 236, a respective DAC 266, or a combination thereof.Attorney Docket No. VS2608-WO-1 (78120.0713)

[0063] In some implementations, the method 400 may also include forming a mold compound material (e.g., a material 330) over the one or more second components 220 before bonding the one or more third components 230.

[0064] In some implementations, the method 400 may also include forming one or more shielding components 350 over the one or more respective second locations before bonding the one or more third components 230, and each of the one or more third components 230 may be bonded over one of the one or more shielding components 350.

[0065] In some implementations, the method 400 may also include forming one or more redistribution layers 332 coupled with the plurality of third electrical contacts 324, and the coupling of the plurality of fourth electrical contacts 336 with the plurality of third electrical contacts 324 may supported via coupling the plurality of fourth electrical contacts 336 with the one or more redistribution layers 332.

[0066] In some implementations, the plurality of amplifiers are formed at least in part from a first semiconductor substrate of the second component 220, and the plurality of conversion circuits are formed at least in part from a second semiconductor substrate of the third component 230 having a different material composition from the first semiconductor substrate

[0067] It should be noted that these methods describe examples of implementations, and that the operations and the steps may be rearranged or otherwise modified such that other implementations are possible. In some examples, aspects from two or more of the methods may be combined. For example, aspects of each of the methods may include steps or aspects of the other methods, or other steps or techniques described herein.

[0068] Information and signals described herein may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout the description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0069] The various illustrative blocks and modules described in connection with the disclosure herein may be implemented or performed with a general purpose processor, a DSP, an ASIC, an FPGA, or other programmable logic device, discrete gate orAttorney Docket No. VS2608-WO-1 (78120.0713)transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration).

[0070] The functions described herein may be implemented in hardware, software executed by a processor, firmware, or any combination thereof. If implemented in software executed by a processor, the functions may be stored on or transmitted over as one or more instructions or code on a computer readable medium. Other examples and implementations are within the scope of the disclosure and appended claims. For example, due to the nature of software, functions described herein can be implemented using software executed by a processor, hardware, firmware, hardwiring, or combinations of any of these. Features implementing functions may also be physically located at various positions, including being distributed such that portions of functions are implemented at different physical locations.

[0071] As used herein, including in the claims, “or” as used in a list of items (e.g., a list of items prefaced by a phrase such as “at least one of’ or “one or more of’) indicates an inclusive list such that, for example, a list of at least one of A, B, or C means A or B or C or AB or AC or BC or ABC (i.e., A and B and C). Also, as used herein, the phrase “based on” shall not be construed as a reference to a closed set of conditions. For example, an exemplary step that is described as “based on condition A” may be based on both a condition A and a condition B without departing from the scope of the present disclosure. In other words, as used herein, the phrase “based on” shall be construed in the same manner as the phrase “based at least in part on.”

[0072] In the appended figures, similar components or features may have the same reference label. Further, various components of the same type may be distinguished by following the reference label by a dash and a second label that distinguishes among the similar components. If just the first reference label is used in the specification, the description is applicable to any one of the similar components having the same firstAttorney Docket No. VS2608-WO-1 (78120.0713)reference label irrespective of the second reference label, or other subsequent reference label.

[0073] The description set forth herein, in connection with the appended drawings, describes example configurations and does not represent all the examples that may be implemented or that are within the scope of the claims. The term “example” used herein means “serving as an example, instance, or illustration,” and not “preferred” or “advantageous over other examples.” The detailed description includes specific details for the purpose of providing an understanding of the described techniques. These techniques, however, may be practiced without these specific details. In some instances, well known structures and devices are shown in block diagram form in order to avoid obscuring the concepts of the described examples.

[0074] The description herein is provided to enable a person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the scope of the disclosure. Thus, the disclosure is not limited to the examples and designs described herein but is to be accorded the broadest scope consistent with the principles and novel features disclosed herein.Attorney Docket No. VS2608-WO-1 (78120.0713)

Claims

CLAIMSWhat is claimed is:

1. An antenna apparatus (100), comprising: a first component (210), comprising: a substrate (110); a plurality of antenna elements (115) on a first side (111) of the substrate; and a plurality of first electrical contacts (302) on a second side (112) of the substrate, wherein each of the plurality of first electrical contacts is electrically coupled with a respective one of the plurality of antenna elements; and a second component (220) bonded over a first location of the second side of the substrate, the second component comprising: a plurality of second electrical contacts (322) each electrically coupled with a respective one of the plurality of first electrical contacts; a plurality of amplifiers (225) each having an input coupled with a respective one of the plurality of second electrical contacts; and a plurality of third electrical contacts (324) each electrically coupled with an output of a respective one of the plurality of amplifiers; and a third component (230) bonded over a second location of the second side of the substrate, the third component comprising: a plurality of fourth electrical contacts (336) each electrically coupled with a respective one of the plurality of third electrical contacts; and a plurality of conversion circuits (232) each having an input coupled with a respective one of the plurality of fourth electrical contacts, each of the plurality of conversion circuits comprising a respective frequency conversion circuit (234), a respective analog-to-digital conversion circuit (236), or a combination thereof.

2. The antenna apparatus of claim 1, wherein the second component, the third component, or both are encapsulated in a mold compound material (330) over the first component.Attorney Docket No. VS2608-WO-1 (78120.0713)3. The antenna apparatus of any one of claims 1 through 2, wherein the plurality of second electrical contacts are located on a first side of the second component, the plurality of third electrical contacts are located on a second side of the second component, and the plurality of fourth electrical contacts are located on a first side of the third component, the antenna apparatus further comprising: one or more redistribution layers (332) located between the second side of the second component and the first side of the third component, wherein one or more conductors in the one or more redistribution layers couple the plurality of third electrical contacts with the plurality of fourth electrical contacts.

4. The antenna apparatus of any one of claims 1 through 3, wherein: the third component further comprises: a plurality of second conversion circuits (262), each of the plurality of second conversion circuits comprising a respective digital-to-analog conversion circuit (266), a respective second frequency conversion circuit (264), or a combination thereof; and the second component further comprises: a plurality of amplifiers (255) each having an input coupled with a respective one of the plurality of second conversion circuits and having an output coupled with a respective one of a plurality of second antenna elements (115) of the first component on the first side of the substrate.

5. The antenna apparatus of any one of claims 1 through 4, wherein the third component further comprises a serializer (238) configured to serialize signals received from the plurality of conversion circuits.

6. The antenna apparatus of any one of claims 1 through 5, wherein the first component further comprises a ground plane (312) on the second side of the substrate opposite the plurality of antenna elements, the ground plane electrically coupled with a ground conductor of the second component.

7. The antenna apparatus of any one of claims 1 through 6, wherein each of the plurality of second electrical contacts is soldered to the respective one of the plurality of first electrical contacts.

8. The antenna apparatus of any one of claims 1 through 7, wherein:Attorney Docket No. VS2608-WO-1 (78120.0713)the plurality of amplifiers are formed at least in part from a first semiconductor substrate of the second component; and the plurality of conversion circuits are formed at least in part from a second semiconductor substrate of the third component having a different material composition from the first semiconductor substrate.

9. The antenna apparatus of claim 8, wherein: the first semiconductor substrate comprises gallium arsenide; and the second semiconductor substrate comprises silicon.

10. The antenna apparatus of any one of claims 1 through 9, further comprising: a shielding component (350) bonded between the first component and the third component.

11. The antenna apparatus of claim 10, wherein the shielding component comprises tungsten, tantalum, platinum, lead, or a combination thereof.

12. The antenna apparatus of any one of claims 1 through 11, wherein the substrate comprises fused silica.

13. The antenna apparatus of any one of claims 1 through 12, further comprising: a synthesizer (246) configured to output a first signal at a first frequency, wherein the plurality of conversion circuits include the respective frequency conversion circuit operable to convert signals from a second frequency to a third frequency based at least in part on the first signal.

14. The antenna apparatus of any one of claims 1 through 13, further comprising: a beamforming processor (242) configured to apply digital beam weights to digital signals received from the plurality of conversion circuits.

15. An antenna apparatus (100), comprising: a first component (210), comprising: a substrate (110);Attorney Docket No. VS2608-WO-1 (78120.0713)a plurality of antenna elements (115) on a first side of the substrate; and a plurality of first electrical contacts on a second side (112) of the substrate, wherein each of the plurality of first electrical contacts is electrically coupled with a respective one of the plurality of antenna elements; a second component (220) bonded over a first location of the second side of the substrate, the second component comprising: a plurality of second electrical contacts each electrically coupled with a respective one of the plurality of first electrical contacts; a plurality of amplifiers (255) each having an output coupled with a respective one of the plurality of second electrical contacts; and a plurality of third electrical contacts each electrically coupled with an input of a respective one of the plurality of amplifiers; and a third component (230) bonded over a second location of the second side of the substrate, the third component comprising: a plurality of fourth electrical contacts each electrically coupled with a respective one of the plurality of third electrical contacts; and a plurality of conversion circuits (262) each having an output coupled with a respective one of the plurality of fourth electrical contacts, each of the plurality of conversion circuits comprising a respective digital-to-analog conversion circuit (266), a respective frequency conversion circuit (264), or a combination thereof.

16. A method of forming an antenna apparatus (100), comprising: bonding one or more second components (220) over respective first locations of a second side (112) of a substrate (110) of a first component (210), wherein: the first component comprises: a plurality of antenna elements (115) on a first side (111) of the substrate; and a plurality of first electrical contacts (302) on the second side (112) of the substrate, each of the plurality of first electrical contacts being electrically coupled with a respective one of the plurality of antenna elements; and each of the one or more second components comprises:Attorney Docket No. VS2608-WO-1 (78120.0713)a plurality of second electrical contacts (322) each electrically coupled with a respective one of the plurality of first electrical contacts as a result of bonding the second component; a plurality of amplifiers (225, 255) each coupled with a respective one of the plurality of second electrical contacts; and a plurality of third electrical contacts (324) each electrically coupled a respective one of the plurality of amplifiers (225, 255); and bonding one or more third components (230) over respective second locations of the second side of the substrate, wherein each of the one or more second components comprises: a plurality of fourth electrical contacts (336) each electrically coupled with a respective one of the plurality of third electrical contacts as a result of bonding the third component; and a plurality of conversion circuits (232, 262) each coupled with a respective one of the plurality of fourth electrical contacts, each of the plurality of conversion circuits comprising a respective frequency conversion circuit (234, 264), a respective analog-to-digital conversion circuit (236), a respective digital- to-analog circuit (266), or a combination thereof.

17. The method of claim 16, further comprising: forming a mold compound material (330) over the one or more second components before bonding the one or more third components.

18. The method of any one of claims 16 through 17, further comprising: forming one or more shielding components (350) over the one or more respective second locations before bonding the one or more third components, wherein each of the one or more third components is bonded over one of the one or more shielding components.

19. The method of any one of claims 16 through 18, further comprising: forming one or more redistribution layers (332) coupled with the plurality of third electrical contacts, wherein the coupling of the plurality of fourthAttorney Docket No. VS2608-WO-1 (78120.0713)electrical contacts with the plurality of third electrical contacts is supported via coupling the plurality of fourth electrical contacts with the one or more redistribution layers.

20. The method of any one of claims 16 through 19, wherein: the plurality of amplifiers are formed at least in part from one or more first semiconductor substrates of the one or more second components; and the plurality of conversion circuits are formed at least in part from one or more second semiconductor substrates of the one or more third components having a different material composition from the one or more first semiconductor substrates.Attorney Docket No. VS2608-WO-1 (78120.0713)

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