Display substrate and manufacturing method therefor

Abstract

Provided are a display substrate and a manufacturing method therefor. The display substrate comprises: a base substrate, a plurality of sub-pixels located on the base substrate, wherein each of the sub-pixels comprises a first electrode, a light-emitting layer, and a second electrode, the first electrode is located on the base substrate, the second electrode is located on a side of the first electrode away from the base substrate, and the light-emitting layer is located between the first electrode and the second electrode; a columnar separating wall located in a middle region of a gap between the first electrodes of adjacent sub-pixels, so that the second electrodes of the adjacent sub-pixels are separated by the columnar separating wall; an electrode connecting layer, wherein the electrode connecting layer crosses over a surface of a side of the columnar separating wall away from the base substrate to electrically connect with the second electrodes of the adjacent sub-pixels, and a distance between the second electrodes of the adjacent sub-pixels and a lapping point of the electrode connecting layer is less than a quarter of a distance between the first electrodes of the adjacent sub-pixels.

Description

Display substrate and manufacturing method thereof TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular to a display substrate and a manufacturing method thereof. BACKGROUND

[0002] With the development of display technology, the requirements for display devices are getting higher and higher. The display effect of the display device is largely related to the structure of the display substrate, but most of the current display substrates cannot meet the growing demand of users for display effect.

[0003] SUMMARY

[0004] According to an aspect of the present disclosure, a display substrate is provided, comprising: a substrate, a plurality of sub-pixels on the substrate, the sub-pixels comprising a first electrode, a light-emitting layer and a second electrode, the first electrode being on the substrate, the second electrode being on a side of the first electrode away from the substrate, the light-emitting layer being between the first electrode and the second electrode; a columnar isolation wall in a middle region of a gap between the first electrodes of adjacent sub-pixels, such that the second electrodes of the adjacent sub-pixels are spaced apart by the columnar isolation wall; an electrode connection layer, the electrode connection layer being electrically connected to the second electrodes of the adjacent sub-pixels across a surface of the columnar isolation wall away from the substrate, a distance between the overlap point of the second electrodes of the adjacent sub-pixels and the electrode connection layer being less than 1 / 4 of a distance between the first electrodes of the adjacent sub-pixels.

[0005] In some embodiments, the distance between the overlap point of the second electrodes of the adjacent sub-pixels and the electrode connection layer is greater than the thickness of the columnar isolation wall and less than 1.1 times the thickness of the columnar isolation wall.

[0006] In some embodiments, the distance between the middle region and the first electrodes of the adjacent sub-pixels is 1 / 3 of the distance between the first electrodes of the adjacent sub-pixels.

[0007] In some embodiments, the display substrate further comprises a planarization layer on a side of the second electrode away from the substrate, the planarization layer having a via, the via at least partially overlapping a projection of the columnar isolation wall on the substrate and a projection of the substrate, the electrode connection layer electrically connecting the second electrodes of the adjacent sub-pixels through the via.

[0008] In some embodiments, the via has a first projection on the substrate extending in a first direction, the columnar isolation wall between the adjacent sub-pixels has a second projection on the substrate extending in a second direction, the first direction being the same as or at a predetermined angle to the second direction.

[0009] In some embodiments, the predetermined angle is greater than 0° and less than or equal to 15°.

[0010] In some embodiments, the first projection has a first width in a direction perpendicular to the first direction, and a perpendicular distance between an end of the first projection near a side of the first projection and the second projection is less than 2 times the first width.

[0011] In some embodiments, a main material of the columnar spacer and a main material of the planarization layer are the same.

[0012] In some embodiments, an oxygen content or a fluorine content of a material of the columnar spacer is greater than an oxygen content or a fluorine content of a material of the planarization layer.

[0013] In some embodiments, a thickness of the columnar spacer is in a range from 10 nm to 50 nm.

[0014] In some embodiments, a main material of the columnar spacer is photoresist.

[0015] In some embodiments, a surface of the columnar spacer away from the substrate substrate forms a recess relative to the second electrode on both sides of the columnar spacer, and a depth of the recess is less than a thickness of the second electrode.

[0016] In some embodiments, the depth of the recess is in a range from 10 nm to 50 nm.

[0017] In some embodiments, a surface of the columnar spacer away from the substrate substrate forms a protrusion relative to the second electrode on both sides of the columnar spacer, and a height of the protrusion is less than a thickness of the second electrode.

[0018] In some embodiments, the height of the protrusion is in a range from 10 nm to 50 nm.

[0019] In some embodiments, the surface of the protrusion away from the substrate substrate is arcuate.

[0020] In some embodiments, the electrode connection layer is a continuous layer, and a thickness of the electrode connection layer at the overlap point is less than a thickness of the electrode connection layer over the first electrode.

[0021] In some embodiments, a slope angle of the planarization layer at the overlap point is less than 45°.

[0022] In some embodiments, the electrode connection layer includes a plurality of separate connection portions, each connection portion is electrically connected to the second electrode of two adjacent sub-pixels, and a projection of the connection portion on the substrate substrate is located in a gap between projections of the first electrodes of the two adjacent sub-pixels on the substrate substrate.

[0023] In some embodiments, the sub-pixel further comprises: a repelling material layer located on a side of the planarization layer away from the substrate, a material of the repelling material layer being repelling to a material of the electrode connecting layer; wherein a projection of the first electrode on the substrate is located within a projection of the repelling material layer on the substrate, and a projection of each connecting part of the electrode connecting layer on the substrate is located outside a projection of the repelling material layer on the substrate.

[0024] In some embodiments, an angle of slope of the planarization layer at the lap joint is greater than 60°.

[0025] In some embodiments, the sub-pixel further comprises: a microlens located on a side of the second electrode away from the substrate; the electrode connecting layer has an opening, and a top of the microlens is exposed through the opening in the electrode connecting layer.

[0026] In some embodiments, a thickness of the electrode connecting layer near the opening is less than a thickness of the electrode connecting layer away from the opening.

[0027] In some embodiments, the planarization layer is located between the second electrode and the microlens, the planarization layer is made of an organic material, and the microlens is made of an inorganic material.

[0028] According to another aspect of the present disclosure, a manufacturing method of a display substrate as shown above is also provided, the display substrate comprising a substrate and a plurality of sub-pixels on the substrate, the sub-pixels comprising a first electrode, a light-emitting layer and a second electrode, the method comprising: forming a plurality of first electrodes on the substrate; forming a first organic material layer, the first organic material layer covering part of the plurality of first electrodes such that for any one first electrode not covered by the first organic material layer, all first electrodes adjacent to the first electrode are covered by the first organic material layer; and performing a first etching on the first organic material layer such that the first organic material layer after the first etching forms a columnar spacer in a middle region of a gap between two adjacent first electrodes.

[0029] In some embodiments, a light emitting layer and a second electrode are formed on the first electrode in the region enclosed by the columnar spacers, wherein the light emitting layer is between the first electrode and the second electrode; a second organic material layer is formed, covering each second electrode and the columnar spacers; the second organic material layer and the columnar spacers are subjected to a second etching, so that the second organic material layer after the second etching forms a planarization layer with vias, and the columnar spacers after the second etching form columnar spacer walls, wherein the projection of the vias and the columnar spacer walls on the substrate substrate are both in the gap between the projections of adjacent first electrodes on the substrate substrate, the adjacent second electrodes are spaced apart by the columnar spacer walls and partially exposed through the vias; and an electrode connection layer is formed, which is electrically connected to the adjacent second electrodes through the vias, the distance between the overlapping points of the second electrodes of the adjacent sub-pixels and the electrode connection layer is less than 1 / 4 of the distance between the first electrodes of the adjacent sub-pixels.

[0030] In some embodiments, the first organic material layer and the second organic material layer are of the same material.

[0031] In some embodiments, the forming of the electrode connection layer comprises: forming a continuous electrode connection layer by depositing a conductive material, the continuous electrode connection layer being electrically connected to the adjacent second electrodes through the vias.

[0032] In some embodiments, the method further comprises: after forming the second organic material layer, covering a repulsive material original layer on the second organic material layer, the material of the repulsive material original layer being repulsive to the material of the electrode connection part; and the repulsive material original layer is subjected to the second etching together with the second organic material layer and the columnar spacers, so that the repulsive material original layer after the second etching forms a repulsive material layer, the projection of the repulsive material layer and the planarization layer on the substrate substrate overlapping; wherein the electrode connection layer comprises a plurality of connection parts, and the forming of the electrode connection layer comprises: depositing a conductive material, so that the conductive material remaining in each via forms a connection part, the connection part being electrically connected to the adjacent second electrode.

[0033] In some embodiments, the method further comprises: forming a plurality of microlenses, each microlens being on the side of the corresponding second electrode away from the substrate substrate.

[0034] In some embodiments, the forming the plurality of microlenses comprises: after forming the second organic material layer, forming an inorganic planarization layer on the second organic material layer; forming an organic microlens layer on the inorganic planarization layer, the organic microlens layer comprising a plurality of original microlenses made of organic material, each original microlens at least partially overlapping the projection of the substrate substrate with the projection of the corresponding first electrode on the substrate substrate; performing the second etching on the organic microlens layer and the inorganic planarization layer together with the second organic material layer and the columnar spacers, such that the organic microlens layer is removed and the etched inorganic planarization layer forms the microlenses.

[0035] In some embodiments, the forming the electrode connection layer comprises: depositing conductive material once such that the deposited conductive material forms the electrode connection layer with openings, the top of the microlenses being exposed through the openings in the electrode connection layer.

[0036] In some embodiments, the second etching is dry etching.

[0037] In some embodiments, the columnar spacers have a height in a direction perpendicular to the substrate substrate in a range from 500 nm to 2 μm, and a thickness in a direction parallel to the substrate substrate in a range from 10 nm to 50 nm. BRIEF DESCRIPTION OF DRAWINGS

[0038] FIG. 1a shows a structural schematic diagram of a display substrate in the related art.

[0039] FIG. 1b shows a structural schematic diagram of another display substrate in the related art.

[0040] FIG. 2a shows a cross-sectional schematic diagram of a display substrate according to an embodiment of the present disclosure.

[0041] FIG. 2a-1 shows an example of the structure of the display substrate in FIG. 2a at a local area A.

[0042] FIG. 2a-2 shows another example of the structure of the display substrate in FIG. 2a at the local area A.

[0043] FIG. 2a-3 shows another example of the structure of the display substrate in FIG. 2a at the local area A.

[0044] FIG. 2b shows a cross-sectional schematic diagram of a display substrate according to another embodiment of the present disclosure.

[0045] FIG. 2c shows a cross-sectional schematic diagram of a display substrate according to another embodiment of the present disclosure.

[0046] FIG. 3a shows a plan schematic diagram of an example of a via of a display substrate according to an embodiment of the present disclosure.

[0047] FIG. 3b shows a plan view of another example of a via hole of a display substrate according to an embodiment of the present disclosure.

[0048] FIG. 3c is an enlarged view of the structure shown in FIG. 3b at region B.

[0049] FIG. 4 shows a flowchart of a manufacturing method of a display substrate according to an embodiment of the present disclosure.

[0050] FIG. 5 shows a flowchart of a manufacturing method of a display substrate according to another embodiment of the present disclosure.

[0051] FIG. 6 shows a flowchart of a manufacturing method of a display substrate according to another embodiment of the present disclosure.

[0052] FIGS. 7a-7n show a manufacturing process of a display substrate according to an embodiment of the present disclosure.

[0053] FIGS. 8a-8b show a manufacturing process of a display substrate according to another embodiment of the present disclosure.

[0054] FIGS. 9a-9b show a manufacturing process of a display substrate according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0055] While the present disclosure will be described in sufficient detail with reference to the Figures to enable those skilled in the art to practice the present disclosure, it is clear that other embodiments can be employed, and that various omissions, substitutions, and changes in the scheme described herein can be made without departing from the spirit of the disclosure.

[0056] Further, in the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the present disclosure. However, it will be apparent to one skilled in the art that one or more embodiments of the present disclosure can be practiced without these specific details. In other instances, well-known structures and devices are not described in detail in order to avoid obscuring aspects of the present disclosure.

[0057] The current mass production technology of silicon-based OLED adopts a technical route of white light plus color film filtering. However, the color film filters at least 2 / 3 of the light, limiting the improvement of brightness and seriously restricting the demand of silicon-based OLED for high brightness. In the related art, a fine silicon mask (FSM) is used to realize independent patterning of RGB to achieve high brightness of silicon-based OLED. However, the fine silicon mask has the problems of high cost and evaporation shadow, thereby affecting the display uniformity.

[0058] To this end, various technical solutions are proposed.

[0059] In one technical solution, as shown in FIG. 1a, after the sub-pixels of R, G and B colors are made, a lap via hole 800A is formed in the pixel area, and a conductive connection layer 900A is connected to the cathodes 400A of the sub-pixels through the lap via hole 800A, so that the cathodes 400A of the sub-pixels are electrically connected to each other. However, since the lap via hole 800A is located in the pixel area and above the organic light-emitting layer, the etching process of the lap via hole 800A will affect the light emitted by the organic light-emitting layer in the pixel area, thereby affecting the display effect.

[0060] In another technical solution, as shown in FIG. 1b, by arranging T-shaped isolation columns 170B between the sub-pixels, the organic light-emitting layer 175 between adjacent pixels can be blocked, and the cathodes 180B of the pixels can be connected. However, the T-shaped isolation columns 170B occupy a large area, affecting the aperture ratio of the display panel, and the large step caused by the T-shaped isolation columns 170B reduces the effectiveness of the electrode connection, thereby failing to ensure the yield of the pixel level.

[0061] Embodiments of the present disclosure at least provide a display substrate, comprising: a substrate, a plurality of sub-pixels on the substrate, the sub-pixels comprising a first electrode, a light-emitting layer and a second electrode, the first electrode being on the substrate, the second electrode being on a side of the first electrode away from the substrate, the light-emitting layer being between the first electrode and the second electrode; a columnar isolation wall in a middle region of a gap between the first electrodes of adjacent sub-pixels, so that the second electrodes of the adjacent sub-pixels are spaced apart by the columnar isolation wall; an electrode connection layer, the electrode connection layer being electrically connected to the second electrodes of the adjacent sub-pixels across a surface of the columnar isolation wall away from the substrate, a distance between the second electrodes of the adjacent sub-pixels and a connection point of the electrode connection layer being less than 1 / 4 of a distance between the first electrodes of the adjacent sub-pixels. In this way, a super-thin columnar isolation wall is realized between the adjacent sub-pixels, the stability of the electrode connection is effectively improved, the damage to the light-emitting layer caused by etching is greatly reduced, the light-emitting area is increased, the aperture ratio is improved, and a high-brightness high-PPI silicon-based OLED display panel can be manufactured.

[0062] FIG. 2a shows a cross-sectional schematic view of a display substrate according to an embodiment of the present disclosure.

[0063] As shown in FIG. 2a, the display substrate 100 includes a substrate 110 and a plurality of sub-pixels SP1, SP2 and SP3 on the substrate 110. Each of the plurality of sub-pixels SP1, SP2 and SP3 can include a first electrode 120, a light-emitting layer 130 and a second electrode 140. The first electrode 120 is on the substrate 110, the second electrode 140 is on a side of the first electrode 120 away from the substrate 110, and the light-emitting layer 130 is between the first electrode 120 and the second electrode 140. The first electrode 120, the light-emitting layer 130 and the second electrode 140 constitute a light-emitting element, such as an OLED light-emitting element, of the sub-pixel. In some embodiments, the first electrode 120 can be an anode of the light-emitting element, the second electrode 140 can be a cathode of the light-emitting element, and the light-emitting layer 130 can be made of an organic light-emitting material.

[0064] The display substrate 100 further includes a columnar isolation wall 170 and an electrode connection layer 160. The columnar isolation wall 170 is in a middle region of a gap between the first electrodes 120 of adjacent sub-pixels, such that the second electrodes 140 of the adjacent sub-pixels are spaced apart by the columnar isolation wall 170. The columnar isolation wall 170 is at an angle γ with a plane in which the substrate 110 lies, and the angle γ is in a range of 80° to 90°. The electrode connection layer 160 is electrically connected to the second electrodes 140 of adjacent sub-pixels across a surface of the columnar isolation wall 170 away from the substrate 110. In some embodiments, the electrode connection layer 160 can be made of a conductive material to achieve electrical connection between the second electrodes 140. For example, the material of the electrode connection layer can include a metal such as Mg, Ag, etc.

[0065] As shown in FIG. 2a, the display substrate 100 can further include a planarization layer 150a located on the side of the second electrode 140 away from the substrate 110. The planarization layer 150a has a via VH. The projection of the via VH on the substrate 110 at least partially overlaps with the projection of the columnar isolation wall 170 on the substrate 110. In FIG. 2a, the electrode connection layer 160 is a continuous layer, and the planarization layer 150a is located between the electrode connection layer 160 and the second electrode 140, and the continuous electrode connection layer 160 electrically connects the second electrodes 140 of adjacent sub-pixels through the via VH in the planarization layer 150a. In some embodiments, the main material of the columnar isolation wall 170 and the main material of the planarization layer 150a can be the same, for example, both are organic materials. Here, the so-called main material can be a material with a proportion of more than 50%. Here, the so-called proportion can be defined as needed, for example, it can be the proportion of size, the proportion of content, etc. For example, the main material of the columnar isolation wall or the planarization layer can refer to a material with a film layer thickness of more than 50% of the total film layer thickness of all materials; or it can also refer to a material with a volume of more than 50% of the total volume of all materials; or it can also refer to a material with a mass of more than 50% of the total mass of all materials, and the present disclosure does not make any limitation thereon. In some embodiments, the so-called main material can refer to a material that plays a main function, for example, the main material of the columnar isolation wall can refer to a material that plays a “separation” function, for example, a photoresist. In addition to the main material, the columnar isolation wall can also include other materials, for example, a material that plays an auxiliary separation function or a protective function, etc., which are not limited here. The main material of the planarization layer can refer to a material that plays a “planarization” function, and in addition to the main material, the planarization layer can also include other materials, for example, a material that plays an auxiliary planarization function or a protective function, etc., which are not limited here. In some embodiments, the main material of the columnar isolation wall 170 and the main material of the planarization layer 150a can both be photoresists. However, embodiments of the present disclosure are not limited thereto, and the main material of the columnar isolation wall and the main material of the planarization layer can also be different, for example, the main material of the columnar isolation wall and the main material of the planarization layer are different organic materials or different inorganic materials; or the main material of the columnar isolation wall is an organic material, and the main material of the planarization layer is an inorganic material; or the main material of the columnar isolation wall is an inorganic material, and the main material of the planarization layer is an organic material, and the present disclosure does not make any limitation thereon. In some embodiments, the columnar isolation wall 170 includes a material with an oxygen content or a fluorine content greater than that of the material included in the planarization layer 150a.

[0066] For the convenience of description, three sub-pixels SP1, SP2 and SP3 adjacent to each other are shown in FIG. 2a, however, embodiments of the present disclosure are not limited thereto, and the display substrate can have any number of sub-pixels as needed.

[0067] FIG. 2a-1 shows a schematic view of the structure of the display substrate in FIG. 2a at a local area A.

[0068] As shown in FIG. 2a-1, the columnar partition wall 170 is located in a middle region CA of the gap between the first electrodes 120 of the adjacent sub-pixels SP1 and SP2. As shown, the middle region CA is equal to the interval between the first electrodes 120 of the adjacent sub-pixels SP1 and SP2, for example, both are d. In some embodiments, the interval d can be 1 / 3 of the interval D1 between the first electrodes 120 of the adjacent sub-pixels SP1 and SP2. In other words, the width of the middle region CA is equal to the interval between it and the two side first electrodes 120, i.e., both are 1 / 3 of D1. However, embodiments of the present disclosure are not limited thereto, and the interval d between the middle region CA and the first electrodes 120 of the adjacent sub-pixels SP1 and SP2 can be set as needed, for example, d / D1 can be any value between 1 / 3 and 1 / 2, for example, 35%. In other embodiments, d / D1 can also be less than 1 / 3, for example, can be 1 / 4, 1 / 5, or 1 / 6, etc. The interval d here can refer to the distance between the outer boundary of the middle region CA and the first electrode 120 of the adjacent sub-pixel SP1 or SP2 in the direction parallel to the substrate 110.

[0069] As shown in FIG. 2a-1, the electrode connecting layer 160 is electrically connected to the second electrodes 140 of the adjacent sub-pixels SP1 and SP2 by means of overlapping across the columnar spacer 170 away from the surface (the upper surface in FIG. 2a-1) of the substrate 110. The overlapping point in the present disclosure refers to the region where the second electrode 140 contacts the electrode connecting layer 160 (as shown by the dashed ellipse). Since the contact region between the second electrode 140 and the electrode connecting layer 160 is very small, the contact region can be regarded as a point, which is referred to as the overlapping point. In some embodiments, the distance between the overlapping points can be defined as the distance between the geometric centers of the contact regions. Of course, embodiments of the present disclosure are not limited thereto, and the distance between the overlapping points can also be defined in other ways, for example, defined as the gap size between the two contact regions, which will not be described here. As shown in FIG. 2a-1, the projections of the overlapping point between the second electrode 140 of the sub-pixel SP1 and the electrode connecting layer 160 and the overlapping point between the second electrode 140 of the sub-pixel SP2 and the electrode connecting layer 160 on the substrate 110 fall within the projection of the via VH on the substrate 110. The distance D2 between the overlapping point between the second electrode 140 of the sub-pixel SP1 and the electrode connecting layer 160 and the overlapping point between the second electrode 140 of the sub-pixel SP2 and the electrode connecting layer 160 is less than 1 / 4 of the interval D1 between the first electrode 120 of the sub-pixel SP1 and the first electrode 120 of the sub-pixel SP2. In some embodiments, the distance D2 can be greater than the thickness D3 of the columnar spacer 170 and less than 1.1 times the thickness D3 of the columnar spacer 170. Here, the thickness of the columnar spacer refers to the thickness of the columnar spacer in the direction parallel to the substrate. In some embodiments, the thickness D3 of the columnar spacer 170 can be in the range of 10 nm to 50 nm. For example, the distance D2 can be less than 50 nm, 40 nm, 30 nm, 20 nm, or 10 nm. Accordingly, the interval D1 can be less than 0.5 μm, for example, between 0.1 μm and 0.3 μm. Such a small interval between the first electrodes of the sub-pixels can significantly improve the pixel density (PPI, Pixels Per Inch) of the silicon-based OLED, and even achieve ultra-high PPI. The "interval" between the first electrodes 120 and the "distance" between the overlapping points herein can both refer to the distance in the direction parallel to the substrate.

[0070] Referring to FIG. 2a-1, the thickness T1 of the electrode connection layer 160 at the overlap point can be less than the thickness T1’ of the electrode connection layer 160 over the first electrode 120. In some embodiments, the thickness T2 of the second electrode 140 at the overlap point is less than the thickness T2’ of the second electrode 140 over the first electrode 120. In some embodiments, the thickness T3 of the light emitting layer 130 at the overlap point is less than the thickness T3’ of the light emitting layer 130 over the first electrode 120. By setting the thickness of the electrode connection layer, the second electrode and the light emitting layer at the overlap point to be less than the thickness over the first electrode of the corresponding sub-pixel, it can be ensured that the light emitting layers of adjacent sub-pixels can be effectively isolated, and the uniformity of the total thickness of the electrode connection layer and the second electrode at each region.

[0071] As shown in FIG. 2a-1, the slope angle a of the planarization layer 150a at the overlap point can be less than 45°, which can ensure the continuity of the electrode connection layer 160 and reduce the resistance. Here, the slope angle of the planarization layer can refer to the angle between the sidewall of the planarization layer and the lower surface of the planarization layer, or the angle with respect to the substrate plane.

[0072] In the example of FIG. 2a-1, the surface (upper surface in the figure) of the columnar isolation wall 170 away from the substrate 110 is substantially flush with the surface (upper surface in the figure) of the second electrode 140 on both sides of the columnar isolation wall 170 away from the substrate 110. However, embodiments of the present disclosure are not limited thereto, and there can be a height difference between the two, thereby forming a protrusion or a depression, which will be described below with reference to FIG. 2a-2 and FIG. 2a-3.

[0073] As shown in FIG. 2a-2, unlike FIG. 2a-1, the columnar isolation walls 170' are recessed relative to the second electrodes 140 on both sides of the columnar isolation walls 170' away from the surface (the upper surface in the figure) of the substrate substrate 110. In some embodiments, the depth of the recess is less than the thickness of the second electrode 140, which makes the height of the upper surface of the columnar isolation wall 170' between the upper surface 1401 and the lower surface 1402 of the second electrode 140. In some embodiments, the depth h1 of the recess is in the range of 10 nm to 50 nm. Here, the depth of the recess and the thickness of the second electrode refer to the depth and thickness in the direction perpendicular to the substrate substrate. The depth of the recess can be defined by the height difference between the upper surface of the columnar isolation wall 170' and the upper surface of the second electrode 140. By providing such a recess structure, as shown in FIG. 2a-2, the surface (the upper surface in the figure) of the columnar isolation wall 170' away from the substrate substrate 110 is higher than the surface (the upper surface in the figure) of the light-emitting layer 130 on both sides of the columnar isolation wall 170' away from the substrate substrate 110, thereby ensuring the isolation effect of the columnar isolation wall on the light-emitting layer on both sides, so that the light-emitting layer of each sub-pixel is effectively encapsulated by the surrounding columnar isolation wall. In some embodiments, as shown in FIG. 2a-2, the portion of the electrode connection layer 160 above the columnar isolation wall 170 also forms a recess structure accordingly, and the depth of the recess can also be less than the thickness T2 of the second electrode 140.

[0074] FIG. 2a-3 shows another example of the structure of the display substrate shown in FIG. 2a at the local area A.

[0075] As shown in FIG. 2a-3, different from FIG. 2a-1, the surface 1701" of the columnar isolation wall 170" away from the substrate 110 forms a protrusion relative to the second electrode 140 on both sides of the columnar isolation wall 170", that is, the surface 1701" of the columnar isolation wall 170" away from the substrate 110 is higher than the surface 1401 of the second electrode 140 away from the substrate 110 at the lap joint. Although the upper surface 1701" of the protrusion shown in FIG. 2a-3 is a plane, embodiments of the present disclosure are not limited thereto. In some embodiments, the upper surface of the protrusion can be arc-shaped, which can be beneficial for the lap of the electrode connection layer. The upper surface of the protrusion can be smoothly connected with the side wall of the protrusion. In other embodiments, the upper surface of the protrusion can be arc-shaped together with the side wall of the protrusion. In some embodiments, the height h2 of the protrusion can be less than the thickness T2 of the second electrode 140. In some embodiments, the height h2 of the protrusion is in the range of 10 nm to 50 nm. The height of the protrusion can be defined as the height difference between the surface of the columnar isolation wall 170" away from the substrate 110 and the surface 1401 of the second electrode 140 away from the substrate 110 in the direction perpendicular to the substrate 110. By providing such a protrusion structure, the electrode connection layer 160 can be better protected from breaking at the lap joint, and the light-emitting layer 130 can be better protected from water and oxygen erosion. In some embodiments, as shown in FIG. 2a-3, the part of the electrode connection layer 160 above the columnar isolation wall 170 can also have a corresponding protrusion structure.

[0076] FIG. 2b shows a schematic cross-sectional view of a display substrate according to another embodiment of the present disclosure. The display substrate 200 shown in FIG. 2b is similar to the display substrate 100 shown in FIG. 2a, except that the structure of the electrode connection layer is different. For the sake of brevity and clarity of description, the following will mainly describe the different parts in detail.

[0077] As shown in FIG. 2b, different from FIG. 2a, the electrode connection layer of the display substrate 200 includes a plurality of separate connection portions, such as a first connection portion 1601 between the adjacent sub-pixels SP1 and SP2 and a second connection portion 1602 between the adjacent sub-pixels SP2 and SP3. The first connection portion 1601 is electrically connected with the second electrode 140 of the sub-pixel SP1 and the second electrode 140 of the sub-pixel SP2. The second connection portion 1602 is electrically connected with the second electrode 140 of the sub-pixel SP2 and the second electrode 140 of the sub-pixel SP3. The projection of the first connection portion 1601 on the substrate 110 is located in the gap between the projections of the first electrodes 120 of the sub-pixels SP1 and SP2 on the substrate 110. The projection of the second connection portion 1602 on the substrate 110 is located in the gap between the projections of the first electrodes 120 of the sub-pixels SP2 and SP3 on the substrate 110.

[0078] In some embodiments, similar to FIG. 2a, the display substrate can further include a planarization layer 150b on the side of the second electrode 140 away from the substrate 110. Different from the planarization layer 150a of FIG. 2a, the planarization layer 150b has a larger slope angle β at the overlap point of the second electrode and each connecting part, which can be greater than 60°, for example. In some embodiments, the slope angle β can reach 90°. By setting a larger slope angle β, the uniformity of the light-emitting area of the sub-pixel can be improved, thereby improving the brightness.

[0079] With continued reference to FIG. 2b, in some embodiments, the display substrate 200 can further include a repulsion material layer 190. The repulsion material layer 190 is on the side of the planarization layer 150b away from the substrate 110. The material of the repulsion material layer 190 has repulsion to the material of the electrode connecting layer. For example, the material of the electrode connecting layer includes metals such as Mg and Ag, and the material of the repulsion material layer 190 can have repulsion to metals such as Mg and Ag. In this way, when the electrode connecting layer is formed, the material of the electrode connecting layer cannot be deposited on the repulsion material layer 190, but is deposited in the area not covered by the repulsion material layer 190, obtaining the electrode connecting layer structure as shown in FIG. 2b. As shown in FIG. 2b, the projection of the first electrode 120 on the substrate 110 is within the projection of the repulsion material layer 190 on the substrate 110, and the projection of each connecting part 1601 or 1602 of the electrode connecting layer on the substrate 110 is outside the projection of the repulsion material layer 190 on the substrate 110. This can make the electrode connecting layer exist only at the overlap via hole VH, thereby avoiding the influence of the electrode connecting layer on the transmittance of the light-emitting area, and improving the brightness. In some embodiments, as shown in FIG. 2b, the electrode connecting layer can exist at the bottom of the via hole VH, and not be formed on the sidewall of the via hole VH.

[0080] In the example of FIG. 2b, the upper surface of the columnar isolation wall 170 and the upper surface of the second electrode 140 on both sides can be substantially flush, and there can be a height difference between the two, thereby forming a protrusion or a depression. For details, reference can be made to the description of FIG. 2a-1, FIG. 2a-2 and FIG. 2a-3, which will not be repeated here.

[0081] FIG. 2c shows a cross-sectional schematic view of a display substrate according to another embodiment of the present disclosure. The display substrate 300 shown in FIG. 2c is similar to the display substrate 100 shown in FIG. 2a, and the difference is that the sub-pixel of the display substrate 300 further includes a microlens. For the sake of brevity and clarity of description, the following will mainly describe the different parts in detail.

[0082] As shown in FIG. 2c, different from FIG. 2a, the sub-pixel SP1 further includes a microlens LEN_1 located on the side of the second electrode 140 away from the substrate 110. The sub-pixel SP2 further includes a microlens LEN_2 located on the side of the second electrode 140 away from the substrate 110. The sub-pixel SP3 further includes a microlens LEN_3 located on the side of the second electrode 140 away from the substrate 110. The arrangement of the microlenses LEN_1, LEN_2 and LEN_3 can be consistent with that of the sub-pixels SP1, SP2 and SP3, such as strip arrangement, dot arrangement, triangle arrangement or mosaic arrangement, etc. In this way, the first electrode, the light-emitting layer and the second electrode and the corresponding microlenses above them form a light-emitting structure, and the light emitted by the light-emitting layer is converged by the microlenses to improve the brightness.

[0083] As shown in FIG. 2c, the electrode connection layer of the display substrate 300 includes openings, such as openings OP1, OP2 and OP3 corresponding to the microlenses LEN1, LEN_2 and LEN_3 one by one. The top of the microlenses LEN1, LEN_2 and LEN_3 is exposed through the corresponding openings OP1, OP2 and OP3.

[0084] In some embodiments, the thickness of the electrode connection layer 160 near the openings is smaller than that far from the openings. For example, as shown in FIG. 2c, the electrode connection layer 160 includes a first part 1603 between the sub-pixels SP1 and SP2 and a second part 1604 between the sub-pixels SP3 and SP3. In some embodiments, the first part 1603 and the second part 1604 of the electrode connection layer 160 can be continuous with each other. In other embodiments, the first part 1603 and the second part 1604 can be separated. Taking the first part 1603 as an example, as shown in FIG. 2c, the first part 1603 has a substantially uniform thickness in the area above the columnar isolation wall 170”, and the thickness gradually decreases as the first part 1603 is closer to the two openings OP1 and OP2 on the sides. However, embodiments of the present disclosure are not limited thereto, and the first part 1603 can gradually decrease from the center to the two openings OP1 and OP2 on the sides, or in other ways. The second part 1604 has a similar structure, which is not described here. The "thickness" here can refer to the thickness in the direction perpendicular to the substrate 110.

[0085] Continuing to refer to FIG. 2c, the display substrate 300 also has a planarization layer 150c on the side of the second electrode 140 away from the substrate 110, which can be between the second electrode 140 and the microlenses LEN_1, LEN_2 and LEN_3. However, embodiments of the present disclosure are not limited thereto, and in some other embodiments, the display substrate 300 can also not have the planarization layer 150c. In some embodiments, the planarization layer 150 is made of an organic material, and the microlenses LEN_1, LEN_2 and LEN_3 are made of an inorganic material.

[0086] In some embodiments, as shown in FIG. 2c, the height H1 of the microlenses LEN_1, LEN_2 and LEN_3 is greater than 1 / 2 of the thickness H2 of the first electrode 120, so that in the process of forming the electrode connection layer 160, the material of the electrode connection layer cannot be deposited on the top of each microlens, thereby improving the transmittance of the light-emitting area and further improving the brightness. The so-called height of the microlens here can refer to the maximum distance between the top and the bottom of the microlens in the direction perpendicular to the substrate, and the so-called height of the first electrode can refer to the thickness of the first electrode in the direction perpendicular to the substrate.

[0087] In the example of FIG. 2c, the upper surface of the columnar isolation wall 170” and the upper surface of the second electrode 140 on both sides have a height difference, thereby forming a protrusion, or can form a depression or be substantially flush, which can be referred to the description of FIG. 2a-1, FIG. 2a-2 and FIG. 2a-3, which will not be repeated here.

[0088] FIG. 3a shows a plan view of an example of a via in a display substrate according to an embodiment of the present disclosure. For convenience of description, FIG. 3a only shows sub-pixels SP1, SP2 and SP3, columnar isolation walls 170 and a via VH in the display substrate.

[0089] As shown in FIG. 3a, the projection of the first electrode of the sub-pixels SP1, SP2 and SP3 on the substrate is a hexagon. However, embodiments of the present disclosure are not limited thereto, and the projection of the first electrode of the sub-pixel can also be other shapes, for example, a rectangle, a diamond, a circle and / or an ellipse, etc. The columnar isolation walls 170 are between adjacent sub-pixels. In the example of FIG. 3a, the columnar isolation wall between each sub-pixel and the surrounding sub-pixels can be implemented as a continuous structure, so that each sub-pixel is surrounded by the continuous wall formed by the surrounding columnar isolation walls 170. In FIG. 3a, the projection of the continuous wall formed by the columnar isolation walls 170 on the substrate has the same shape as the first electrode of the sub-pixel, for example, both are hexagons. However, embodiments of the present disclosure are not limited thereto, and the shapes can be different.

[0090] In this embodiment, as shown in FIG. 3a, the via VH is a long and narrow via arranged between adjacent sub-pixels. For example, the projection of the via VH on the substrate can be a rectangle, and the length-to-width ratio of the rectangle can be set to be greater than a predetermined threshold, so as to realize a long and narrow via. However, the embodiments of the present disclosure are not limited thereto, and the via VH can also be a via of other shapes, for example, an ellipse, a strip, or even an irregular shape, etc. In FIG. 3a, the projection of the via VH on the substrate is substantially the same as the extending direction of the projection of the columnar isolation wall 170 between the sub-pixels on both sides of the via VH on the substrate. In the example of FIG. 3a, the projection of the via VH is a rectangle, and the so-called extending direction can refer to the length direction of the rectangle. In other examples, the extending direction of the projection of the via VH can be defined according to the shape of the via, for example, if the projection of the via is in the shape of a strip, the extending direction of the projection can be the extending direction of the strip, which will not be described here again.

[0091] By setting the via VH as a long and narrow via, the embodiments of the present disclosure can reduce the occupied area of the via VH and improve the aperture ratio of the pixel.

[0092] FIG. 3b shows a plan view of another example of a via of a display substrate according to an embodiment of the present disclosure. The structure shown in FIG. 3b is similar to the structure shown in FIG. 3a, and the difference lies in the relative position relationship between the via and the columnar isolation wall. For the sake of brevity and clarity of description, the following will mainly describe the different parts in detail. As shown in FIG. 3b, the projection of the via VH' on the substrate is different from the extending direction of the projection of the columnar isolation wall 170 below the via VH' on the substrate, and the two form a certain angle. As shown in FIG. 3c, the via VH' has a first projection extending along a first direction X on the substrate, and the columnar isolation wall 170 between the sub-pixel SP1 and the sub-pixel SP2 has a second projection extending along a second direction Y on the substrate. The first direction X and the second direction Y form a predetermined angle θ, which is greater than 0° and less than or equal to 15°. For example, in the example of FIG. 3a described above, the angle θ is substantially 0, and in the examples of FIG. 3b and FIG. 3c, the angle θ is greater than 0° and less than 15°.

[0093] In FIGS. 3a-3c, the projections of the via VH, VH' and the columnar spacer 170 on the substrate are all shown as symmetric patterns, which are in the shape of a strip, and the extension direction of the strip is the direction of the axis of symmetry of the symmetric pattern. As shown in FIG. 3c, the first projection of the via VH' on the substrate has an axis of symmetry extending in the first direction X, and the second projection of the columnar spacer 170 on the substrate has an axis of symmetry extending in the second direction Y, and the axis of symmetry of the first projection and the axis of symmetry of the second projection intersect to form a predetermined angle θ. In the example of FIG. 3a, the axis of symmetry of the first projection of the via VH on the substrate and the axis of symmetry of the second projection of the columnar spacer 170 on the substrate can substantially coincide. However, embodiments of the present disclosure are not limited thereto, and the shape of the projections of the via VH' and the columnar spacer 170 on the substrate can be set as needed. For example, the projections of the via VH, VH' and the columnar spacer 170 on the substrate can also be asymmetric patterns, and the extension direction of the strip can be defined in other ways, such as the middle line between the two side edges.

[0094] With continued reference to FIG. 3c, the first projection of the via VH' on the substrate is shown in the shape of a rectangular strip, which includes end portions A and B at one end of the strip and end portions C and D at the other end of the strip in the extension direction, wherein the end portions A and C are located on the side of the first projection close to the second projection of the columnar spacer 170, and the end portions B and D are located on the side of the first projection away from the second projection of the columnar spacer 170. As shown in FIG. 3c, the first projection of the via VH' on the substrate has a first width W1 in the direction perpendicular to the first direction X, and the perpendicular distance h3 between the end portion A of the first projection of the via VH' and the second projection of the columnar spacer 170 is less than 2 times the first width W1. Here, the perpendicular distance can refer to the perpendicular distance between the end portion A and the edge of the second projection of the columnar spacer 170 close to the end portion A. Similarly, the perpendicular distance between the end portion C of the first projection of the via VH' and the second projection of the columnar spacer 170 can also be less than 2*W1. The present disclosure can improve the reliability of the via overlap while ensuring the pixel aperture ratio by setting the perpendicular distance between the first projection of the via and the second projection of the columnar spacer to be less than 2 times the width of the first projection of the via. In FIG. 3c, the first projection of the via VH' on the substrate is shown as a rectangle, however, embodiments of the present disclosure are not limited thereto, and the planar projection shape of the via can be set as needed, for example, it can be an irregular strip.

[0095] Embodiments of the present disclosure can improve the reliability of the long and narrow via and the probability and stability of the electrode transfer layer overlap at the via by setting the extension direction of the columnar spacer and the extension direction of the long and narrow via to be at an angle, such as an angle in the range of 0° to 15°, without increasing the via.

[0096] The planar structure described above with reference to FIGS. 3a and 3b is applicable to any of the embodiments described above, such as the embodiments described above with reference to FIGS. 2a to 2c.

[0097] FIG. 4 shows a flowchart of a manufacturing method of a display substrate according to an embodiment of the present disclosure.

[0098] As shown in FIG. 4, the manufacturing method 400 of the display substrate can include steps S410 to S470.

[0099] At step S410, a plurality of first electrodes are formed on a substrate.

[0100] At step S420, a first organic material layer is formed, the first organic material layer covering part of the plurality of first electrodes such that one of any two adjacent first electrodes is covered by the first organic material layer and the other is not covered by the first organic material layer.

[0101] At step S430, the first organic material layer is subjected to a first etching such that the first organic material layer after the first etching forms a columnar spacer between the two adjacent first electrodes.

[0102] At step S440, a light-emitting layer and a second electrode are formed on the first electrode within the region enclosed by the columnar spacer, wherein the light-emitting layer is between the first electrode and the second electrode.

[0103] At step S450, a second organic material layer is formed, the second organic material layer covering each second electrode and the columnar spacer.

[0104] At step S460, the second organic material layer and the columnar spacer are subjected to a second etching such that the second organic material layer after the second etching forms a planarization layer with a via, and the columnar spacer after the second etching forms a columnar spacer wall, wherein the projection of the via and the columnar spacer wall on the substrate is within the gap between the projections of the adjacent first electrodes on the substrate, and the adjacent second electrodes are spaced apart by the columnar spacer wall and partially exposed through the via.

[0105] At step S470, an electrode connection layer is formed, the electrode connection layer being electrically connected to the adjacent second electrode through the via, and the distance between the electrode connection layer and the overlap point of the second electrodes of adjacent sub-pixels is less than 1 / 4 of the distance between the first electrodes of the adjacent sub-pixels.

[0106] In some embodiments, step S470 can include the following step: forming a continuous electrode connection layer by depositing a conductive material, the continuous electrode connection layer being electrically connected to the adjacent second electrode through the via.

[0107] FIG. 5 shows a flowchart of a manufacturing method of a display substrate according to another embodiment of the present disclosure.

[0108] As shown in FIG. 5, the manufacturing method 500 of the display substrate includes steps S510 to S570.

[0109] The steps S510 to S550 are the same as the steps S410 to S450, and are not repeated here.

[0110] Next, at step S560, after forming the second organic material layer, a repulsion material original layer is formed on the second organic material layer, the material of the repulsion material original layer is repulsive to the material of the electrode connection layer to be formed later; and the repulsion material original layer is subjected to a second etching together with the second organic material layer and the columnar spacers, so that the second organic material layer after the second etching forms a planarization layer with a via, the columnar spacers after the second etching form columnar spacer walls, and the repulsion material original layer after the second etching forms a repulsion material layer, the repulsion material layer and the planarization layer overlap in projection on the substrate.

[0111] At step S570, an electrode connection layer is formed, wherein the electrode connection layer includes a plurality of connection portions. The electrode connection layer is electrically connected to the adjacent second electrode through the via, and the distance between the lap joint points of the second electrode of the adjacent sub-pixels and the electrode connection layer is less than 1 / 4 of the interval between the first electrodes of the adjacent sub-pixels.

[0112] In some embodiments, the step S570 can include the following steps: depositing a conductive material so that the conductive material remaining in each via forms a connection portion, the connection portion being electrically connected to the adjacent second electrode.

[0113] FIG. 6 shows a flowchart of a manufacturing method of a display substrate according to another embodiment of the present disclosure.

[0114] As shown in FIG. 6, the manufacturing method 600 of the display substrate includes steps S610 to S670.

[0115] The steps S610 to S650 are the same as the steps S410 to S450, and are not repeated here.

[0116] Next, at step S660, after forming the second organic material layer, an inorganic planarization layer is formed on the second organic material layer; an organic microlens layer is formed on the inorganic planarization layer, the organic microlens layer including a plurality of original microlenses made of organic material, each original microlens at least partially overlapping in projection on the substrate with the projection on the substrate of a corresponding first electrode; the organic microlens layer and the inorganic planarization layer are subjected to a second etching together with the second organic material layer and the columnar spacers, so that the organic microlens layer is removed, and the inorganic planarization layer after the etching forms a microlens.

[0117] At step 670, an electrode connecting layer is formed, the electrode connecting layer is electrically connected to the adjacent second electrode through the via, and the distance between the overlap point of the electrode connecting layer and the second electrode of the adjacent sub-pixel is less than 1 / 4 of the interval between the first electrodes of the adjacent sub-pixels.

[0118] In some embodiments, step S670 can include the following steps: depositing the conductive material once so that the deposited conductive material forms an electrode connecting layer with an opening, and the top of the microlens is exposed through the opening in the electrode connecting layer. In this way, the electrode connecting layer with the opening can be obtained by depositing the conductive material once, without the need to use additional processes, for example, without the need to use a pixel-level mask to etch the deposited conductive material to obtain the opening.

[0119] FIGS. 7a-7n illustrate a manufacturing process of a display substrate according to an embodiment of the present disclosure.

[0120] As shown in FIG. 7a, a plurality of first electrodes 120 are formed on a substrate 110. In some embodiments, the material of the second electrode 120 includes ITO or TiAg / ITO.

[0121] Next, a first organic material layer is formed. First, the plurality of first electrodes 120 and the substrate 110 can be covered with a first organic material 170_1 as shown in FIG. 7b. Then, the first organic material 170_1 is patterned to obtain a first organic material layer 170_2 as shown in FIG. 7b-1. The first organic material can be a photoresist. The formed first organic material layer 170_2 can cover part of the plurality of first electrodes 120 as shown in FIG. 7b-2, and for any first electrode not covered by the first organic material layer 170_2, the first electrode adjacent to the first electrode is covered by the first organic material layer.

[0122] Next, the first organic material layer 170_2 is subjected to a first etching, so that the first organic material layer 170_2 after the first etching forms columnar spacers 170_3 between two adjacent first electrodes 120, as shown in FIG. 7c-1. Through the first etching, as shown in FIG. 7c-2, a continuous fence can be formed between each first electrode 120 and the columnar spacers 170_3 between adjacent first electrodes, and each first electrode 120 is surrounded by the corresponding fence, so as to achieve good isolation between pixels in the subsequent process. In some embodiments, the first etching is dry etching. By adjusting the parameters of dry etching, such as adjusting the gas flow (BCL3, Cl2, CF4, Ar, etc.), pressure and other parameters, the first organic material layer 170_2 is formed into an ultra-thin columnar spacer 170_3 with a width of about 10-50 nm and a height of about 500 nm-2 μm between adjacent second electrodes 120. In some embodiments, for a single-layer (Single) EL device, the height of the columnar spacer is, for example, between 500 nm and 1 μm; for a multi-layer (Tandem) EL device, the height of the columnar spacer is, for example, between 1 μm and 2 μm, so as to ensure better isolation effect.

[0123] Next, in each region surrounded by the columnar spacers 170_3 shown in FIG. 7e, a corresponding light-emitting layer and a second electrode are formed on the first electrode 120 to obtain each sub-pixel, which will be described below with reference to FIGS. 7d-7l.

[0124] As shown in FIG. 7d, a first organic light-emitting layer 130_1 and a first metal material layer 140_1 are sequentially deposited on the side of the first electrode 120 away from the substrate 110. Due to the large step of the ultra-thin columnar spacer 170_3, the first organic light-emitting layer 130_1 and the first metal material layer 140_1 are interrupted by the ultra-thin columnar spacer 170_3. The first organic light-emitting layer 130_1 can have a first color, for example, red.

[0125] Next, as shown in FIG. 7e, a first isolation layer 150_1 is covered on the structure shown in FIG. 7d. The surface of the first isolation layer 150_1 away from the substrate can be flat.

[0126] Next, a portion of the first electrodes 120 (e.g., the two first electrodes 120 on the right side in the figure) are removed, leaving the first organic light emitting layer 130_1, the first metal material layer 140_1, and the first isolation layer 150_1 above the remaining first electrodes 120. As shown in FIG. 7f, the remaining first organic light emitting layer 130_1 and the first metal material layer 140_1, together with the first electrodes 120 below them, form a first color sub-pixel SP1, where the first organic light emitting layer 130_1 acts as the light emitting layer 130_2 of the first color sub-pixel, the first metal material layer 140_1 acts as the second electrode 140_2 of the first color sub-pixel, and the first electrodes 120 act as the first electrodes of the first color sub-pixel. In some embodiments, a portion of the first isolation layer 150_1 is preserved on the first color sub-pixel SP1. The preserved portion of the first isolation layer 150_1 forms a second isolation layer 150_2. The second isolation layer 150_2 is used to protect the sub-pixel SP1. In some embodiments, the thickness of the second isolation layer 150_2 is less than the thickness of the light emitting layer 130_2 or the second electrode 140_2 of the first color sub-pixel, so as to avoid affecting the light transmittance of the sub-pixel SP1. In this way, a red color sub-pixel SP1 is formed.

[0127] Next, as shown in FIG. 7g, a second organic light emitting layer 130_3 and a second metal material layer 140_3 are sequentially deposited on the substrate 110. The second organic light emitting layer 130_3 can have a second color, which is used to form a light emitting layer of a second color sub-pixel. The second color can be green. As shown in FIG. 7g, the second organic light emitting layer 130_3 and the second metal material layer 140_3 are separated by the ultra-thin columnar spacers 170_3.

[0128] Next, as shown in FIG. 7h, a third isolation layer 150_3 is formed on the structure shown in FIG. 7g. The thickness of the third isolation layer 150_3 can be large, so that the third isolation layer 150_3 is substantially flat away from the surface of the substrate.

[0129] Next, the third isolation layer 150_3 shown in FIG. 7h is patterned to obtain the structure shown in FIG. 7i. As shown in FIG. 7i, after the third isolation layer 150_3 is patterned, the second organic light emitting layer 130_3, the second metal material layer 140_3, and the third isolation layer 150_3 above the sub-pixel SP1 are removed, while the second organic light emitting layer 130_3, the second metal material layer 140_3, and the third isolation layer 150_3 above the first electrode 120 for forming the third color sub-pixel are removed, and the second organic light emitting layer 130_3 and the second metal material layer 140_3 above the first electrode 120 for forming the second color sub-pixel are retained. The retained second organic light emitting layer 130_3 and the second metal material layer 140_3 respectively act as the light emitting layer 130_4, the second electrode 140_4, and the first electrode of the second color sub-pixel SP2 with the first electrode 120 below them. In some embodiments, a portion of the third isolation layer 150_3 is also retained above the sub-pixel SP2. The retained portion of the third isolation layer 150_3 forms a fourth isolation layer 150_4. The fourth isolation layer 150_4 is used to protect the sub-pixel SP2. In some embodiments, the thickness of the fourth isolation layer 150_4 is less than the thickness of the light emitting layer 130_4 or the second electrode 140_4 of the second color sub-pixel SP2 to avoid affecting the light transmittance of the sub-pixel SP2. Thus, the green sub-pixel SP2 is formed.

[0130] Next, as shown in FIG. 7j, a third organic light emitting layer 130_5 and a third metal material layer 140_5 are sequentially deposited on the substrate 110. The third organic light emitting layer 130_5 and the third metal material layer 140_5 are separated by the ultra-thin columnar spacers 170_3. The third organic light emitting layer 130_5 can have a third color, for example, blue.

[0131] Next, as shown in FIG. 7k, a fifth isolation layer 150_5 is formed on the structure shown in FIG. 7j.

[0132] Next, the fifth isolation layer 150_5 shown in FIG. 7k is patterned to obtain the structure shown in FIG. 71. As shown in FIG. 71, the third organic light emitting layer 130_5 and the third metal material layer 140_5 above the sub-pixel SP1 and the sub-pixel SP2 and the fifth isolation layer 150_5 are removed, and the third organic light emitting layer 130_5 and the third metal material layer 140_5 above the first electrode 120 for forming the third color sub-pixel are reserved. The reserved third organic light emitting layer 130_5 and the third metal material layer 140_5 and the first electrode 120 below them respectively act as the light emitting layer 130_6, the second electrode 140_6 and the first electrode 120 of the third color sub-pixel SP3. The third color organic light emitting layer 130_6 and the third metal layer 140_6 and the first electrode 120 below them are formed as the sub-pixel SP3. In some embodiments, a part of the fifth isolation layer 150_5 is also reserved on the sub-pixel SP3. The reserved part of the fifth isolation layer 150_5 is formed as a sixth isolation layer 150_5. The sixth isolation layer 150_5 is used to protect the sub-pixel SP3. In some embodiments, the thickness of the sixth isolation layer 150_5 is less than the thickness of the light emitting layer 130_6 or the second electrode 140_6 of the third color sub-pixel SP3 to avoid affecting the light transmittance of the sub-pixel SP3. Thus, the blue sub-pixel SP3 is formed.

[0133] In the above manufacturing process, the first organic material 170_1, the first isolation layer 150_1, the second isolation layer 150_2, the third isolation layer 150_3, the fourth isolation layer 150_4, the fifth isolation layer 150_5 and the sixth isolation layer 150_5 used can include the same organic material, for example, can all be photoresist.

[0134] In the above manufacturing process, the first metal material layer 140_1, the second metal material layer 140_3 and the third metal material layer 140_5 used can include the same metal material.

[0135] So far, the manufacturing of the sub-pixels SP1, SP2 and SP3 has been completed.

[0136] Next, as shown in FIG. 7m, a planarization material layer is deposited on the substrate 110. The planarization material layer covers all components on the substrate 110 to achieve planarization at the ultra-thin columnar spacers 170_3, thereby improving the uniformity of etching in subsequent steps. In this embodiment, the second isolation layer 150_2, the fourth isolation layer 150_4, and the sixth isolation layer 150_5 are collectively referred to as a second organic material layer, and are collectively shown by the reference sign 150_7 in the figures. In some embodiments, the material of the planarization material layer is the same as the material of the second isolation layer 150_2, the fourth isolation layer 150_4, and the sixth isolation layer 150_5. In some embodiments, the material of the first organic material layer and the second organic material layer is the same. In other embodiments, the planarization material layer, the first organic material 170_1, the first isolation layer 150_1, the second isolation layer 150_2, the third isolation layer 150_3, the fourth isolation layer 150_4, the fifth isolation layer 150_5, and the sixth isolation layer 150_5 can also use the same or different materials as needed.

[0137] Next, the second organic material layer 150_7 and the ultra-thin columnar spacers 170_3 in FIG. 7m are subjected to a second etching, so that the second organic material layer 150_7 after the second etching forms a planarization layer 150 with a via VH as shown in FIG. 7n, and the ultra-thin columnar spacers 170_3 after the second etching form columnar isolation walls 170. Then, a conductive material is deposited to form a continuous electrode connection layer 160. As shown in FIG. 7n, the continuous electrode connection layer 160 is electrically connected to the second electrode 140 of the adjacent sub-pixel across the columnar isolation walls 170 away from the surface of the substrate 110. In some embodiments, the second etching is dry etching.

[0138] Through the above process described with reference to FIGS. 7a-7n, the structure described above with reference to FIG. 2a is obtained.

[0139] The embodiments of the present disclosure also provide a manufacturing process of a display substrate as shown in FIG. 2b. In manufacturing the display substrate as shown in FIG. 2b, the above steps described with reference to FIGS. 7a-7m are first performed, which will not be described again here. After obtaining the structure as shown in FIG. 7m, the operations shown in FIGS. 8a-8b are performed. FIGS. 8a and 8b will be described in detail below.

[0140] As shown in FIG. 8a, a repulsive material original layer 190_1 is deposited on the second organic material layer 150_7. The material of the repulsive material original layer 190_1 is repulsive to the material of the electrode connection layer to be formed later.

[0141] Next, the repulsion material raw layer 190_1 as shown in FIG. 8a is subjected to a second etching together with the second organic material layer 150_7 and the ultra-thin columnar spacers 170_3, so that the second-etched repulsion material raw layer 190_1 forms a repulsion material layer 190 as shown in FIG. 8b, the second-etched second organic material layer 150_7 forms a planarization layer 150b with vias VH as shown in FIG. 8b, and the second-etched ultra-thin columnar spacers 170_3 form columnar isolation walls 170 as shown in FIG. 8b. Then, a conductive material is deposited, so that the conductive material remaining in each via forms connection portions 1601 and 1602 as shown in FIG. 8b. The connection portions 1601 and 1602 are electrically connected with the adjacent second electrodes 140. In this way, the structure described above with reference to FIG. 2b is obtained.

[0142] The present disclosure also provides a manufacturing process of a display substrate as shown in FIG. 2c. In manufacturing the display substrate as shown in FIG. 2c, the steps described above with reference to FIGS. 7a to 7m are first performed, which will not be repeated here. After obtaining the structure as shown in FIG. 7m, the operations shown in FIGS. 9a to 9b are performed. FIGS. 9a and 9b will be described in detail below.

[0143] As shown in FIG. 9a, an inorganic planarization layer L is formed on the second organic material layer 150_7. An organic microlens layer is formed on the inorganic planarization layer L. The organic microlens layer includes a plurality of raw microlenses LEN_1’, LEN_2’ and LEN_3’ made of organic material. The projection of each raw microlens in the plurality of raw microlenses LEN_1’, LEN_2’ and LEN_3’ on the substrate 110 at least partially overlaps with the projection of the corresponding first electrode 120 on the substrate 110. In some embodiments, the organic microlens layer can be made into the plurality of raw microlenses LEN_1’, LEN_2’ and LEN_3’ by a hot reflow process.

[0144] Next, the structure as shown in FIG. 9a is etched from top to bottom, so as to realize second etching of the organic microlens layer, the inorganic planarization layer L, the second organic material layer 150_7 and the ultra-thin columnar spacers 170_3 together. Through the second etching, the organic microlens layer is removed, the plurality of microlenses LEN_1, LEN_2 and LEN_3 formed by the etched inorganic planarization layer L, and the remaining part of the second organic material layer 150_7 forms a planarization layer 150c with a via VH. Then, a conductive material is deposited on the structure obtained after the second etching, to obtain an electrode connection layer with openings OP1 to OP3 as shown in FIG. 9b. The top parts of the plurality of microlenses LEN_1, LEN_2 and LEN_3 are exposed through the openings OP1 to OP3 in the electrode connection layer respectively. The present disclosure can obtain an electrode connection layer with openings by depositing a conductive material once, without the need to use additional processes, for example, without the need to use a pixel-level mask to etch the deposited conductive material to obtain openings, which is mainly achieved by virtue of the structural characteristics of the plurality of microlenses LEN_1, LEN_2 and LEN_3. As shown in FIG. 9b, each microlens in the plurality of microlenses LEN_1, LEN_2 and LEN_3 has a bottom-cut round shape in the cross section in the direction perpendicular to the substrate base plate 110. Such a round shape can make each microlens have a height difference in the direction perpendicular to the substrate base plate 110, i.e., the height of the microlens gradually decreases from the central region to the edge region of the microlens, so that when the conductive material is deposited, the conductive material cannot be deposited in the middle region of the microlens, but is retained in the gap between the microlenses, thereby forming an electrode connection layer with openings OP1 to OP3.

[0145] The present disclosure also provides a display device. The display device includes the display substrate as described above.

[0146] The display device can include any device or product having a display function. For example, the display device can be a smartphone, a mobile phone, an e-book reader, a desktop PC (personal computer), a laptop PC, a netbook PC, a PDA (personal digital assistant), a PMP (portable multimedia player), a digital audio player, a mobile medical device, a camera, a wearable device (e.g., a head-mounted device, electronic clothing, an electronic bracelet, an electronic necklace, electronic accessories, electronic tattoos, or a smart watch), a television, etc.

[0147] Those skilled in the art can understand that the above-described embodiments are exemplary, and those skilled in the art can make improvements thereto, and the structures described in various embodiments can be freely combined without structural or principle conflicts.

[0148] Those skilled in the art will readily understand that the preferred embodiments of the present disclosure can be varied, and that the foregoing detailed description is intended to cover all such variations and changes as are included within the spirit and scope of the claims.

Claims

1. A display substrate, comprising: a substrate substrate, a plurality of sub-pixels on the substrate substrate, the sub-pixels comprising a first electrode, a light-emitting layer, and a second electrode, the first electrode being on the substrate substrate, the second electrode being on a side of the first electrode away from the substrate substrate, the light-emitting layer being between the first electrode and the second electrode; a columnar spacer in a middle region of a gap between the first electrodes of adjacent sub-pixels, such that the second electrodes of the adjacent sub-pixels are spaced apart by the columnar spacer; an electrode connection layer electrically connecting the second electrodes of the adjacent sub-pixels across a surface of the columnar spacer away from the substrate substrate, a distance between the second electrodes of the adjacent sub-pixels and a lapping point of the second electrodes with the electrode connection layer being less than 1 / 4 of a pitch between the first electrodes of the adjacent sub-pixels. 2.The display substrate of claim 1, wherein, a distance between the second electrodes of the adjacent sub-pixels and the lapping point of the second electrodes with the electrode connection layer being greater than a thickness of the columnar spacer and less than 1.1 times the thickness of the columnar spacer. 3.The display substrate according to claim 1 or 2, wherein, a pitch between the middle region and the first electrodes of the adjacent sub-pixels being 1 / 3 of the pitch between the first electrodes of the adjacent sub-pixels.

4. The display substrate of any one of claims 1 to 3, further comprising a planarization layer on a side of the second electrode away from the substrate substrate, the planarization layer having a via, the via at least partially overlapping a projection of the columnar spacer on the substrate substrate with a projection of the substrate substrate, the electrode connection layer electrically connecting the second electrodes of the adjacent sub-pixels through the via. 5.The display substrate of claim 4, wherein, the via having a first projection on the substrate substrate extending in a first direction, the columnar spacer between the adjacent sub-pixels having a second projection on the substrate substrate extending in a second direction, the first direction being the same as or at a predetermined angle to the second direction. 6.The display substrate of claim 5, wherein, the predetermined angle being greater than 0° and less than or equal to 15°. 7.The display substrate of claim 6, wherein, the first projection having a first width in a direction perpendicular to the first direction, a perpendicular distance between an end of the first projection on a side close to the second projection and the second projection being less than 2 times the first width. 8.The display substrate according to any one of claims 4 to 7, wherein a main material of the columnar spacer and a main material of the planarization layer being the same. 9.The display substrate of claim 4, wherein, an oxygen content or a fluorine content of a material of the columnar spacer being greater than an oxygen content or a fluorine content of a material of the planarization layer. 10.The display substrate according to any one of claims 1 to 9, wherein a thickness of the columnar spacer being in a range of 10 nm to 50 nm. 11.The display substrate according to any one of claims 1 to 10, wherein a main material of the columnar spacer being a photoresist. 12.The display substrate according to any one of claims 1 to 11, wherein a surface of the columnar spacer away from the substrate substrate forming a recess relative to the second electrodes on both sides of the columnar spacer, a depth of the recess being less than a thickness of the second electrode. 13.The display substrate of claim 12, wherein, the depth of the recess being in a range of 10 nm to 50 nm. 14.The display substrate according to any one of claims 1-11, wherein, a surface of the columnar spacer away from the substrate substrate forming a protrusion relative to the second electrodes on both sides of the columnar spacer, a height of the protrusion being less than a thickness of the second electrode. 15.The display substrate of claim 14, wherein, the height of the protrusion being in a range of 10 nm to 50 nm. 16.The display substrate according to claim 14 or 15, wherein the surface of the protrusion away from the substrate substrate being a curved surface.

17. The display substrate according to any one of claims 1 to 16, wherein, The electrode connecting layer is a continuous layer, and a thickness of the electrode connecting layer at the overlap point is less than a thickness of the electrode connecting layer over the first electrode. 18.The display substrate of claim 17, wherein, An angle of slope of the planarization layer at the overlap point is less than 45°. 19.The display substrate according to any one of claims 1-16, wherein, The electrode connecting layer includes a plurality of separate connecting portions, each connecting portion is electrically connected with second electrodes of two adjacent sub-pixels, and a projection of the connecting portion on the substrate substrate is located in a gap between projections of the first electrodes of the two adjacent sub-pixels on the substrate substrate. 20.The display substrate of claim 19, the sub-pixel further comprising: A repelling material layer is located on a side of the planarization layer away from the substrate substrate, and a material of the repelling material layer is repelling to a material of the electrode connecting layer; A projection of the first electrode on the substrate substrate is located within a projection of the repelling material layer on the substrate substrate, and a projection of each connecting portion of the electrode connecting layer on the substrate substrate is located outside the projection of the repelling material layer on the substrate substrate. An angle of slope of the planarization layer at the overlap point is greater than 60°.

21. The display substrate of claim 19 or 20, wherein, The sub-pixel further includes a microlens located on a side of the second electrode away from the substrate substrate.

22. The display substrate of any one of claims 1-16, wherein, The electrode connecting layer has an opening, and a top of the microlens is exposed through the opening in the electrode connecting layer. A thickness of the electrode connecting layer near the opening is less than a thickness of the electrode connecting layer away from the opening.

23. The display substrate of claim 22, wherein, The planarization layer is located between the second electrode and the microlens, the planarization layer is made of an organic material, and the microlens is made of an inorganic material.

24. The display substrate of claim 22 or 23, wherein, 25. A manufacturing method of a display substrate, the display substrate including a substrate substrate and a plurality of sub-pixels located on the substrate substrate, the sub-pixel including a first electrode, a light-emitting layer and a second electrode, the method comprising: forming a plurality of first electrodes on the substrate substrate; forming a first organic material layer, the first organic material layer covering part of the plurality of first electrodes such that for any one first electrode not covered by the first organic material layer, first electrodes adjacent to the first electrode are all covered by the first organic material layer; and performing a first etching on the first organic material layer such that the first organic material layer after the first etching forms a columnar spacer in a middle region of a gap between two adjacent first electrodes.

26. The method of claim 25, further comprising: forming the light-emitting layer and the second electrode on the first electrode in a region enclosed by the columnar spacer, wherein the light-emitting layer is located between the first electrode and the second electrode; forming a second organic material layer, the second organic material layer covering each second electrode and the columnar spacer; performing a second etching on the second organic material layer and the columnar spacer such that the second organic material layer after the second etching forms a planarization layer with a via, and the columnar spacer after the second etching forms a columnar spacer wall, wherein projections of the via and the columnar spacer wall on the substrate substrate are both located within a gap between projections of adjacent first electrodes on the substrate substrate, and adjacent second electrodes are spaced apart by the columnar spacer wall and partially exposed through the via; and ​ forming an electrode connection layer electrically connected to the second electrode through the via hole, a distance between the second electrode of the adjacent sub-pixel and the overlap point of the electrode connection layer is less than 1 / 4 of a pitch between the first electrodes of the adjacent sub-pixels.

27. The method of claim 26, wherein, a distance between the second electrode of the adjacent sub-pixel and the overlap point of the electrode connection layer is greater than a thickness of the columnar spacer and less than 1.1 times the thickness of the columnar spacer.

28. The method of claim 26 or 27, wherein, the via hole has a first projection on the substrate extending in a first direction, and the columnar spacer between the adjacent sub-pixels has a second projection on the substrate extending in a second direction, the first direction being the same as or at a predetermined angle to the second direction.

29. The method of any one of claims 26-28, wherein, the first organic material layer and the second organic material layer are made of the same material.

30. The method of any one of claims 26-29, wherein, the forming of the electrode connection layer includes forming a continuous electrode connection layer by depositing a conductive material, the continuous electrode connection layer being electrically connected to the second electrode through the via hole.

31. The method of any one of claims 26-29, further comprising: forming an exclusion material original layer on the second organic material layer after forming the second organic material layer, the material of the exclusion material original layer being repulsive to the material of the electrode connection layer; and the second etching is performed on the exclusion material original layer together with the second organic material layer and the columnar spacer, so that the exclusion material original layer after the second etching forms an exclusion material layer, the exclusion material layer being projected on the substrate together with the planarization layer; wherein the electrode connection layer includes a plurality of connection portions, and the forming of the electrode connection layer includes depositing a conductive material so that the conductive material remaining in each via hole forms a connection portion, the connection portion being electrically connected to the second electrode adjacent thereto.

32. The method of any one of claims 26 to 29, wherein, further comprising: forming a plurality of microlenses, each microlens being located on a side of a corresponding second electrode away from the substrate.

33. The method of claim 32, wherein, the forming of the plurality of microlenses includes: forming an inorganic planarization layer on the second organic material layer after forming the second organic material layer; forming an organic microlens layer on the inorganic planarization layer, the organic microlens layer including a plurality of original microlenses made of organic material, each original microlens being projected on the substrate at least partially overlapping a corresponding first electrode projected on the substrate; the second etching is performed on the organic microlens layer and the inorganic planarization layer together with the second organic material layer and the columnar spacer, so that the organic microlens layer is removed, and the inorganic planarization layer after the etching forms the microlenses. the forming of the electrode connection layer includes depositing a conductive material once so that the deposited conductive material forms an electrode connection layer having openings, the top of the microlenses being exposed through the openings in the electrode connection layer.

34. The method of claim 32 or 33, wherein, the second etching is dry etching.

35. The method of any one of claims 26-34, wherein, the columnar spacer has a height in a direction perpendicular to the substrate in a range of 500 nm to 2 μm, and a thickness in a direction parallel to the substrate in a range of 10 nm to 50 nm.

36. The method of any one of claims 25-35, wherein, ​

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