Electronic packaging device

Abstract

The present invention relates to the technical field of ball mounters. Provided is an electronic packaging device, comprising: a ball-receiving mechanism, which comprises mounting sites for accommodating mounting members; a ball supply assembly, which is arranged above the ball-receiving mechanism and is configured to provide the mounting members for the ball-receiving mechanism; and a pressure assembly, which is arranged on the upper surface of the ball-receiving mechanism and is configured to apply a downward pressure to the ball-receiving mechanism. The ball-receiving mechanism comprises a ball-mounting mesh and a substrate, wherein the substrate is located below the ball-mounting mesh, and sites on the substrate for accommodating the mounting members coincide with openings of the ball-mounting mesh to form the mounting sites for accommodating the mounting members; and the downward pressure applied by the pressure assembly acts on the ball-mounting mesh, such that the ball-mounting mesh fits to the substrate. The pressure assembly applies the downward pressure to the ball-mounting mesh of the ball-receiving mechanism, such that the electronic packaging device can be adapted to perform a ball-spreading operation on a warped ball-receiving product, and a gap between the substrate and the ball-mounting mesh can be prevented during ball spreading, thereby ensuring that solder balls can all correctly fall into the openings of the ball-mounting mesh, and thus improving the ball-mounting yield.

Description

Electronic packaging apparatus TECHNICAL FIELD

[0001] The present application relates to the technical field of ball placement machine, in particular, to an electronic packaging apparatus. BACKGROUND

[0002] Ball placement technology is a key electronic packaging technology for electrical connection between integrated circuit chips and printed circuit boards (PCB), which is a process of precisely placing a ball placement member (usually a solder alloy) on a ball placement member position of a chip.

[0003] Ball placement machine is a special equipment for performing ball placement process. It usually has an automated feeding system, a precise heating and cooling system, a precise position control system and a quality control system. The ball placement machine needs to have flexibility to adapt to different packaging types (such as ball number, ball diameter, pitch, etc.) and different specifications of chips. Therefore, modern ball placement machines usually have adjustable parameters and process settings to meet the needs of different customers and applications.

[0004] In the prior art, the ball placement effect is poor when the ball placement machine is used for ball placement operation on a substrate with large warping degree, and the ball placement yield is greatly reduced. The existing ball placement machine is difficult to solve the problem of ball placement of the warped substrate, because when the substrate is warped, a gap will be generated between the substrate and the ball placement steel mesh, causing multiple solder balls to be missed in the gap and resulting in defects.

[0005] SUMMARY

[0006] In view of the defects in the prior art, the purpose of the present application is to provide an electronic packaging apparatus.

[0007] According to the electronic packaging apparatus provided by the present application, the electronic packaging apparatus comprises:

[0008] The ball placement mechanism comprises a ball placement site for accommodating the ball placement member;

[0009] The ball feeding assembly is arranged above the ball placement mechanism and provides the ball placement member to the ball placement mechanism;

[0010] The pressure assembly is arranged on the upper surface of the ball placement mechanism and applies downward pressure to the ball placement mechanism.

[0011] Preferably, the pressure assembly is configured to move with the ball feeding assembly on the ball placement mechanism.

[0012] Preferably, the ball placement mechanism comprises a ball placement mesh and a substrate, the substrate is located below the ball placement mesh, the point position of the ball placement member on the substrate is coincided with the mesh of the ball placement mesh to form the ball placement site for accommodating the ball placement member, and the downward pressure applied by the pressure assembly acts on the ball placement mesh to make the ball placement mesh adhere to the substrate.

[0013] Preferably, the relative movement mode of the pressure assembly and the upper surface of the ball feeding mechanism includes translation and / or rolling.

[0014] Preferably, the pressure assembly includes one or more of a plunger assembly, a roller assembly, a roller drum assembly, and a forced deformation self-resetting assembly.

[0015] Preferably, the ball feeding assembly includes a ball outlet, the forced deformation self-resetting assembly is installed on the periphery of the ball outlet, and the forced deformation self-resetting assembly protrudes from the bottom surface of the ball feeding assembly.

[0016] The bottom surface of the forced deformation self-resetting assembly is in contact with the ball planting net of the ball feeding mechanism, and the deformation amount of the ball planting net caused by the forced deformation self-resetting assembly can reach or exceed the deformation amount of the product.

[0017] Preferably, the forced deformation self-resetting assembly deforms under an external force, and the shape of the forced deformation self-resetting assembly automatically resets when the external force decreases or disappears.

[0018] Preferably, the movement of the ball feeding assembly includes translation on the upper surface of the ball feeding mechanism.

[0019] At least one set of supports is respectively arranged on the front and back of the translation direction of the ball feeding assembly, and any support gradually approaches the ball outlet of the ball feeding assembly from top to bottom.

[0020] The bottom of the support is configured to install one or more of a plunger assembly, a roller assembly, and a roller drum assembly.

[0021] Preferably, the ball outlet of the ball feeding assembly is provided with an elastic baffle on the front and back of the translation direction of the ball feeding assembly, and the elastic baffle is in contact with the upper surface of the ball planting net.

[0022] Preferably, the application further comprises:

[0023] An air supply system configured to extend the air outlet hole to the direction close to the ball outlet of the ball feeding assembly, and the orifice of the air outlet hole is directed to the position directly below the ball outlet of the ball feeding assembly.

[0024] And / or, a vibration system acting on the ball feeding assembly.

[0025] Compared with the prior art, the application has the following beneficial effects:

[0026] 1. The application can adapt to the ball laying work on the warped ball feeding product by applying downward pressure on the ball planting net of the ball feeding mechanism, and can avoid the gap between the substrate and the ball planting net during the ball laying process, thereby ensuring that all the solder balls can correctly fall into the mesh of the ball planting net, thereby improving the ball planting yield. BRIEF DESCRIPTION OF DRAWINGS

[0027] Other features, objects, and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments thereof, when read in conjunction with the accompanying drawings:

[0028] Fig. 1 is an exploded view of the ball box assembly embodying the present application;

[0029] Fig. 2 is a front view of the ball box assembly embodying the present application;

[0030] Fig. 3 is a sectional view taken along line A-A of Fig. 2;

[0031] Fig. 4 is a schematic view showing the implanting member falling into the mesh hole of the ball implanting net from the ball storing groove and adhering to the base plate in the first embodiment of the present application;

[0032] Fig. 5 is a schematic view showing the three-dimensional structure of the second embodiment of the present application;

[0033] Fig. 6 is a lateral sectional view of the second embodiment of the present application;

[0034] Fig. 7 is an enlarged schematic view of the plunger position in Fig. 6;

[0035] Fig. 8 is a schematic view showing the installation of the plunger in the second embodiment of the present application;

[0036] Fig. 9 is a schematic view showing the structure of the ball box with elastic flaps added beside the ball outlet;

[0037] Fig. 10 is an enlarged schematic view of the lateral sectional view of the ball outlet position;

[0038] Fig. 11 is a schematic view showing the structure of the third embodiment of the present application using elastic rollers;

[0039] Fig. 12 is a schematic view showing the structure of the fourth embodiment of the present application using elastic rollers;

[0040] Fig. 13 is a schematic view showing the installation of the elastic rollers in the fourth embodiment of the present application.

[0041] Fig. 1 Fig. 2 Fig. 3 Fig. 4 Substrate 10 Horizontal drive mechanism 420 Piston head 622 Implant member 20 Horizontal rail 421 Roller assembly 623 Implant net 200 Support slide 423 Roller assembly 624 Ball supply assembly 400 Lifting drive mechanism 430 Elastic baffle 625 Ball box 410 Connection plate 610 Wear-resistant layer 630 Ball storage groove 411 Ball outlet 611 Support 640 Ball outlet 412 Groove 612 Vertical rod 641 Cover plate 413 Air groove 613 Cross rod 642 Insert hole 414 Air outlet 614 Air cylinder seat 650 Ball inlet pipe 415 Forced deformation self-resetting assembly 620 Inclined mounting surface 651 Ball inlet flow channel 416 Piston assembly 621 Air cylinder 652 Vibration device 660 DETAILED DESCRIPTION

[0042] The present application will be described in detail below with reference to specific embodiments. The following examples will help those skilled in the art to further understand the present application, but do not limit the present application in any form. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present application. These are within the scope of the present application.

[0043] It needs to be emphasized that the implant member 20 of the present application can be a columnar structure or a spherical structure. The device of the present application is particularly suitable for spherical implant members 20, and can also be suitable for columnar implant members 20.

[0044] Example 1

[0045] As shown in FIGS. 1-4, according to the electronic packaging device provided by the present application, a ball supply mechanism, a ball supply assembly 400, and a pressure assembly are included. The ball supply mechanism includes an implant site for accommodating an implant member 20. The ball supply assembly 400 is arranged above the ball supply mechanism to provide the implant member 20 to the ball supply mechanism. The pressure assembly is arranged on the upper surface of the ball supply mechanism to apply downward pressure to the ball supply mechanism.

[0046] Specifically, the ball providing mechanism comprises the ball implanting net 200 and the base plate 10, the base plate 10 is located below the ball implanting net 200, the point position of the implanting member 20 is arranged on the base plate 10, and the mesh of the ball implanting net 200 is overlapped with the point position to form the implanting position for accommodating the implanting member 20. The downward pressure applied by the pressure assembly acts on the ball implanting net 200, so that the ball implanting net 200 is attached to the base plate 10.

[0047] More specifically, the base plate 10 is stably installed below the ball implanting net 200 by the supporting device. The application provides a feasible way of supporting the base plate 10, which does not constitute a specific limitation to the content to be protected by the application: the supporting platform is supported by four supporting legs. The supporting platform has an opening. The ball implanting net 200 is fixed in the opening. The ball implanting net 200 is preferably a steel net, and of course other materials can also be used.

[0048] The supporting device is arranged below the ball implanting net 200 and comprises a fixed plate, a carrier plate arranged below the fixed plate, a supporting plate arranged below the carrier plate, and four guide columns. The fixed plate is located below the ball implanting net 200 and is fixed at both ends of the supporting platform. The four guide columns are vertically fixedly connected between the fixed plate and the supporting plate. The carrier plate is provided with four linear bearings. The four linear bearings are sleeved on the four guide columns to enable the carrier plate to be lifted along the guide columns. The fixed plate has a hole in the middle. The carrier plate has a loading platform for positioning and placing the base plate 10 at a position corresponding to the hole. The roots of the four guide columns are provided with limiting pads made of rubber.

[0049] The lower surface of the carrier plate is provided with a handle. By holding the handle, the carrier plate can be lifted, so that the base plate 10 on the carrier plate is lifted through the hole of the fixed plate to the lower surface of the ball implanting net 200. When the base plate 10 is located on the lower surface of the ball implanting net 200, the carrier plate and the fixed plate can be fixed by using bolts, so that the base plate 10 can be stably located on the lower surface of the ball implanting net 200 during implanting. In this embodiment, the lifting of the carrier plate is realized in a manual manner. In addition to this scheme, the lifting of the carrier plate can also be driven by a motor or an air cylinder to realize the automation of the supporting device.

[0050] The ball providing assembly 400 comprises a ball box 410, a horizontal driving mechanism 420 for driving the horizontal movement of the ball box 410, and a lifting driving mechanism 430 for driving the lifting movement of the ball box 410.

[0051] The ball box 410 is provided with a ball storage groove 411 at the bottom. The bottom of the ball storage groove 411 is provided with a ball outlet 412. The top opening of the ball storage groove 411 is provided with a cover plate 413. The cover plate 413 is spaced apart and provided with a plurality of insertion holes 414. Each insertion hole 414 is fixed with a ball inlet pipe 415. The ball inlet pipe 415 is connected with an external ball providing device. The ball providing device can inject the implanting member 20 into the ball storage groove 411 through the ball inlet pipe 415.

[0052] The horizontal driving mechanism 420 includes a horizontal slide rail 421, a horizontal linear module, and a support slide plate 423. The horizontal slide rail 421 and the horizontal linear module are fixed on the support platform and are arranged on opposite sides of the opening. The support slide plate 423 is arranged on one end of the horizontal slide rail 421 and on the other end of the horizontal linear module. The support slide plate 423 is provided with a through hole. The through hole can pass above the hole of the fixed plate under the sliding of the support slide plate 423.

[0053] The lifting driving mechanism 430 is fixed on the support slide plate 423 and is located on one side of the through hole. The ball box 410 is installed on the lifting driving mechanism 430 and is located above the through hole. The ball box 410 can pass through the through hole to make the ball outlet 412 reach above the planting net 200 under the lifting driving of the lifting driving mechanism 430. The lifting driving mechanism 430 is a vertical linear module.

[0054] The horizontal linear module and the vertical linear module are both motor-driven linear modules. Since they are prior art and can be directly purchased from the market, their specific structures will not be described in detail here.

[0055] The pressure assembly is configured to move with the ball feeding assembly 400 on the ball receiving mechanism. The pressure assembly of the present application can be installed on the ball feeding assembly 400, or can be installed on other transmission assemblies, and the transmission assemblies drive the pressure assembly to move with the ball feeding assembly 400 on the ball receiving mechanism. The relative movement mode of the pressure assembly and the upper surface of the ball receiving mechanism includes translation and / or rolling. The pressure assembly includes one or more of a plunger assembly 621, a roller assembly 623, a roller assembly 624, and a forced deformation self-resetting assembly 620.

[0056] The specific embodiment further describes the forced deformation self-resetting assembly 620 as an example of the pressure assembly:

[0057] It should be noted that the forced deformation self-resetting assembly 620 of the present application deforms under the action of an external force, and the shape of the forced deformation self-resetting assembly 620 automatically recovers when the external force decreases or disappears. The forced deformation self-resetting assembly 620 of the present application can include non-metallic elastic members such as rubber, sponge, and foam, or metallic elastic members such as springs and thin-walled metal members, or a composite elastic structure made of elastic elements or materials, for example, a hollow metal roller structure. The hollow roller made of ductility of metal has a certain deformation recovery ability.

[0058] The ball supply assembly 400 comprises a ball outlet 412, the forced deformation self-resetting assembly 620 is embeddedly installed on the periphery of the ball outlet 412, and the forced deformation self-resetting assembly 620 protrudes from the bottom surface of the ball supply assembly 400. The bottom surface of the forced deformation self-resetting assembly 620 is in contact with the implantation net 200 of the ball supply mechanism, the forced deformation self-resetting assembly 620 exerts a downward force on the implantation net 200 by virtue of the self-adapting deformation capability, and the deformation amount of the implantation net caused by the forced deformation self-resetting assembly 620 can reach or exceed the deformation amount of the product.

[0059] Specifically, the bottom lower surface of the ball box 410 is detachably fixed with a connecting plate 610, for example, the connecting plate 610 is fixed on the bottom of the ball box 410 by means of bolt fastening. The connecting plate 610 is provided with a ball falling hole 611 of the same size as the ball outlet 412 below the ball outlet 412. The connecting plate 610 is provided with a groove 612 around the ball outlet 412 on the lower surface. The forced deformation self-resetting assembly 620 around the ball outlet 412 is arranged in the groove 612.

[0060] The forced deformation self-resetting assembly 620 is fixed in the groove 612 by means of glue bonding and protrudes from the lower surface of the connecting plate 610. The forced deformation self-resetting assembly 620 is connected with the bottom of the ball box 410 through the connecting plate 610, which facilitates the replacement of the forced deformation self-resetting assembly 620 and the maintenance of the bottom of the ball box 410.

[0061] The forced deformation self-resetting assembly 620 preferably adopts sponge. The thickness of the forced deformation self-resetting assembly 620 should be greater than the maximum warping amount of the ball supply mechanism. In a feasible embodiment, the thickness of the sponge is 15-25 mm, and the density of the sponge is 90 kg / cm 3 .

[0062] The lower surface of the forced deformation self-resetting assembly 620 is further provided with a wear-resistant layer 630. The wear-resistant layer 630 is a wear-resistant coating applied on the lower surface of the forced deformation self-resetting assembly 620 or a wear-resistant sheet pasted on the lower surface of the forced deformation self-resetting assembly 620. By adding the wear-resistant layer 630, the situation that the forced deformation self-resetting assembly 620 directly contacts and rubs with the implantation net 200 can be avoided. For example, when the wear-resistant layer 630 is a wear-resistant sheet, a film sheet is adopted. The wear-resistant layer 630 can also adopt an anti-static material, for example, a stainless steel sheet or a conductive plastic, with a thickness of 0.1-0.3 mm. It should be further explained that part of the forced deformation self-resetting assembly 620 has a wear-resistant function and an adaptive deformation amount by itself, and in this case, the wear-resistant layer 630 can not be additionally added.

[0063] Further, the air supply system is configured to extend from the air outlet hole 614 to the direction close to the ball outlet 412 of the ball supply assembly 400, and the hole of the air outlet hole 614 is directed to the position right below the ball outlet 412 of the ball supply assembly 400. Specifically, the inner part of the connecting plate 610 is further provided with an air groove 613. The lower surface of the connecting plate 610 is provided with a plurality of air outlet holes 614 in communication with the air groove 613. The plurality of air outlet holes 614 are distributed at intervals around the ball outlet 412. The hole of the air outlet hole 614 is located on the inner side of the forced deformation self-resetting assembly 620, and the air outlet hole 614 is an inclined hole with the hole inclined to the ball outlet 412. The inclined hole enables the air blown out from the air outlet hole 614 to blow on the implanting member 20 of the ball planting net 200, so that the implanting member 20 can jump and be scattered into the mesh holes of the ball planting net 200. In the embodiment, the air inlet channel 416 in communication with the air groove 613 is provided in the plate body at the bottom of the ball box 410. The air inlet channel 416 is connected with the external air source through an air pipe.

[0064] The working process is as follows:

[0065] 1. The base plate 10 is lifted to the position at the lower surface of the ball planting net 200 to wait for ball paving;

[0066] 2. The lifting driving mechanism 430 drives the ball box 410 to descend to the upper surface of the ball planting net 200 and press down the ball planting net 200 to complete the ball paving preparation action;

[0067] 3. The external ball supply device supplies balls into the ball storage groove 411 of the ball box 410;

[0068] 4. The horizontal driving mechanism 420 drives the ball box 410 to move forward. During the forward movement, the ball paving mechanism presses down the ball planting net 200 by means of the elastic force of the sponge, so that the ball planting net 200 is completely attached to the base plate 10, the implanting member 20 is limited in the area surrounded by the sponge, and the implanting member 20 moves forward together with the ball paving. When the implanting member 20 passes through the mesh hole of the ball planting net 200, it enters the mesh hole by its own gravity. After the ball box 410 passes through the mesh hole area of the ball planting net 200, the ball paving action is completed.

[0069] During the ball paving process, the sponge can change to adapt to the warped shape of the base plate 10 due to its elasticity, so that the sponge, the steel mesh and the base plate 10 are completely attached, and the ball paving of the warped base plate 10 is completed.

[0070] During the ball paving process, the gas is also introduced into the air inlet channel 416, and the gas is blown out from the air outlet hole through the air groove 613. The blown gas can blow the implanting member 20 on the surface of the ball planting net 200, so that the implanting member 20 can jump to be scattered into each mesh hole during the ball paving process.

[0071] Embodiment two

[0072] Based on the embodiment one, the electronic packaging device capable of adapting to the warped substrate 10 provided by the application is further described by taking the pressure assembly as the plunger assembly 621 as an example in the specific embodiment:

[0073] As shown in FIGS. 5-10, in the specific embodiment, the ball storage groove 411 of the ball box 410 is a reverse trapezoidal narrow groove, and the ball outlet 412 is a narrow opening with a width of 1-2 mm.

[0074] The movement of the ball supply assembly 400 includes horizontal movement on the upper surface of the ball supply mechanism. The front and rear sides of the horizontal movement direction of the ball supply assembly 400 are provided with at least one set of supports 640, respectively. Any support 640 gradually approaches the ball outlet 412 of the ball supply assembly 400 from top to bottom. The bottom of the support 640 is configured to mount the plunger assembly 621. The plunger assembly 621 includes an elastic plunger, and the plunger head 622 of the elastic plunger is a spherical surface that is pressed on the ball planting net 200 under the action of an internal spring. The elastic plunger can be directly purchased from the market.

[0075] The support 640 includes two vertical rods 641 and a horizontal rod 642 connected between the lower ends of the two vertical rods 641. The support sliding plate 423 is provided with a cylinder seat 650 on the left and right sides of the ball box 410, respectively, and the cylinder seat 650 is provided with symmetrical inclined mounting surfaces 651 with low outside and high inside. Each inclined mounting surface 651 is provided with a cylinder 652. The upper end of the vertical rod 641 is connected with the cylinder 652, and the elastic plungers are arranged and fixed on the horizontal rod 642 with the plunger head 622 downward. In the embodiment, due to the use of the inclined mounting surface 651, the cylinder 652 and the support 640 are both inclined mounting, and finally the plunger head 622 of the elastic plunger is inclinedly mounted on the left and right sides of the ball box 410 in a manner of deflection towards the ball box 410. In addition, the outer walls of the front and rear sides of the ball box 410 are inclined walls with the bottom inclined inward, and the wall thickness of the front and rear sides of the ball box 410 at the position of the ball outlet 412 is 1.2-1.8 mm. This makes the plunger head 622 of the plunger assembly 621 as close as possible to the ball outlet 412 (i.e., the elastic force point is as close as possible to the ball laying point). In order to ensure the linearity and uniformity of the force point, as many elastic plungers as possible are arranged on the left and right sides of the ball box 410.

[0076] It should be noted that the elastic plungers of the technical solution of the application are as much as possible to be arranged in the length direction of the horizontal rod 642 on the horizontal rod 642. The number and size of the elastic plungers can be selected according to the actual working conditions. The more the number of the elastic plungers, the more reasonable the arc-shaped deformation can be achieved when the elastic plungers are pressed on the ball planting net 200, and the situation that a single hole is pressed out of the pressing point can be avoided.

[0077] In the embodiment, the elastic member driving mechanism adopts the air cylinder 652, and of course other driving mechanisms can also be adopted, for example, a motor-driven linear module.

[0078] The plunger assembly 621 can be lifted and lowered under the synchronous driving of the two air cylinders 652 on the same side. During the ball placement process, the plunger assembly 621 on the side in the advancing direction is lowered under the driving of the air cylinder 652 to press the ball placement net 200, and the plunger assembly 621 on the side in the opposite direction is lifted under the driving of the air cylinder 652 to be separated from the ball placement net 200. During the ball placement process, the plunger assembly 621 on the side in the advancing direction is lowered to press the ball placement net 200 by the elastic force, so that the ball placement net 200 is completely attached to the substrate 10.

[0079] Further, a vibration system is also included, which acts on the ball supply assembly 400. The vibration system includes a vibrator 660, and the top of the ball box 410 is also provided with the vibrator 660. Through the vibration of the vibrator 660, the solder balls in the ball box 410 can be made to jump, which can effectively improve the ball placement yield.

[0080] The positioning groove of the carrier is provided with a vacuum suction hole. The substrate 10 is positioned in the positioning groove of the carrier and is sucked by the vacuum, and is fixed by a buckle or a bolt lock or the like.

[0081] Further preferably, the ball outlet 412 of the ball supply assembly 400 is provided with elastic baffle plates 625 on the front and back sides along the horizontal movement direction of the ball supply assembly 400, and the elastic baffle plates 625 are in contact with the upper surface of the ball placement net 200. Specifically, the elastic baffle plates 625 are additionally provided on the front and back sides of the ball outlet 412 of the ball box 410. Specifically, the elastic baffle plates 625 are fixed on the outer walls on the front and back sides of the ball box 410, the end heads thereof are bent inwardly and protrude beyond the lower surface of the bottom of the ball box 410 and are in contact with the ball placement net 200. The addition of the elastic baffle plates 625 can prevent the ball placement member 20 from leaking from the side during the ball placement process. The elastic baffle plates 625 are made of stainless steel or spring steel.

[0082] As can be seen from the above detailed description, the electronic packaging equipment of the present application can adapt to the ball placement work on the warped substrate 10, and can avoid the existence of the gap between the substrate 10 and the ball placement net 200 during the ball placement process, so as to ensure that all the solder balls can correctly fall into the mesh holes of the ball placement net 200, thereby improving the ball placement yield.

[0083] It should be noted that the technical scheme of the present application can be used not only for the ball placement of the substrate 10, but also for the ball placement of other products, for example, the ball placement of chips or wafers.

[0084] The other structures are the same as those of the first embodiment, and will not be described again.

[0085] Embodiment Three

[0086] Based on the electronic packaging device provided in Embodiment Two, the specific embodiment is further described by taking the pressure assembly as the roller assembly 623:

[0087] As shown in FIG. 11, the specific embodiment adopts the roller assembly 623 instead of the plunger assembly 621 in Embodiment Two, and other structures are the same as those in Embodiment Two, which will not be described herein. The roller assembly 623 comprises an elastic roller, which is composed of an elastic telescopic column and a roller installed at the lower end of the elastic telescopic column. The elastic roller can also be directly purchased from the market.

[0088] Similarly, during the ball laying process, the elastic rollers on the side of the advancing direction are driven by the air cylinder 652 to descend to press the ball planting net 200, and the elastic rollers on the opposite side are driven by the air cylinder 652 to ascend to be separated from the ball planting net 200.

[0089] Embodiment Four

[0090] Based on the electronic packaging device provided in Embodiment Two, the specific embodiment is further described by taking the pressure assembly as the roller assembly 624:

[0091] As shown in FIG. 12 and FIG. 13, the specific embodiment adopts the roller assembly 624 instead of the plunger assembly 621 in Embodiment Two, and the roller assembly 624 comprises an elastic roller connected between the lower ends of the two vertical rods 641. The elastic roller can be directly purchased from the market, and the surface of the elastic roller is provided with an elastic rubber coating. The roller assembly 624 can also preferably adopt a hollow roller, which can be made of metal. The hollow roller can utilize the deformation recovery ability of the metal hollow structure to act on the ball planting net 200, so that when the ball planting net 200 is pressed, the ball planting net 200 is deformed in an arc shape, and the single hole is not pressed out.

[0092] Similarly, during the ball laying process, the elastic rollers on the side of the advancing direction are driven by the air cylinder 652 to descend to press the ball planting net 200, and the elastic rollers on the opposite side are driven by the air cylinder 652 to ascend to be separated from the ball planting net 200.

[0093] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0094] The specific embodiments of the present application are described above. It needs to be understood that the present application is not limited to the specific embodiments described above, and various changes or modifications can be made by those skilled in the art within the scope of the claims, which does not affect the essential content of the present application. The embodiments of the present application and the features in the embodiments can be combined with each other at will without conflict.

Claims

1. An electronic packaging apparatus, characterized by, The application relates to a ball implanting device. The ball implanting device comprises: a ball providing mechanism, which comprises implanting sites for implanting members; a ball providing assembly, which is arranged above the ball providing mechanism and provides the implanting members to the ball providing mechanism; 2. The electronic package apparatus of claim 1, wherein, a pressure assembly, which is arranged on the upper surface of the ball providing mechanism and applies downward pressure to the ball providing mechanism.

3. The electronic package apparatus of claim 1, wherein, The pressure assembly is arranged to move with the ball providing assembly on the ball providing mechanism. The ball providing mechanism comprises a ball implanting net and a base plate, the base plate is arranged below the ball implanting net, and the implanting sites for implanting members on the base plate are coincided with the meshes of the ball implanting net to form the implanting sites for implanting members.

4. The electronic package apparatus of claim 1, wherein, The downward pressure applied by the pressure assembly acts on the ball implanting net, so that the ball implanting net is attached to the base plate.

5. The electronic package apparatus of claim 1, wherein, The relative movement mode between the pressure assembly and the upper surface of the ball providing mechanism comprises translation and / or rolling.

6. The electronic package apparatus of claim 5, wherein, The pressure assembly comprises one or more of a plunger assembly, a roller assembly, a roller drum assembly and a forced deformation self-resetting assembly. The ball providing assembly comprises a ball outlet, the forced deformation self-resetting assembly is arranged on the side of the ball outlet, and the forced deformation self-resetting assembly protrudes from the bottom surface of the ball providing assembly.

7. The electronic packaging apparatus of claim 5, wherein, The bottom surface of the forced deformation self-resetting assembly is in contact with the ball implanting net of the ball providing mechanism, and the deformation amount of the ball implanting net caused by the forced deformation self-resetting assembly can reach or exceed the deformation amount of the product.

8. The electronic package apparatus of claim 5, wherein, The forced deformation self-resetting assembly is deformed under external force, and the shape of the forced deformation self-resetting assembly is automatically restored when the external force is reduced or disappears. The movement of the ball providing assembly comprises translation on the upper surface of the ball providing mechanism. At least one set of supports is arranged on the front and back sides of the translation direction of the ball providing assembly respectively, and any support gradually approaches the ball outlet of the ball providing assembly from top to bottom.

9. The electronic package apparatus of claim 8, wherein, The bottom of the support is arranged to install one or more of the plunger assembly, the roller assembly and the roller drum assembly.

10. The electronic packaging apparatus of claim 5, wherein, The ball outlet of the ball providing assembly is arranged with elastic flaps on the front and back sides of the translation direction of the ball providing assembly, and the elastic flaps are in contact with the upper surface of the ball implanting net. The application further relates to: an air supply system, which is arranged to extend towards the ball outlet of the ball providing assembly through an air outlet, and the hole of the air outlet is directed to the position directly below the ball outlet of the ball providing assembly; and / or a vibration system, which acts on the ball providing assembly.

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