Vacuum deposition system and method of coating substrates in a vacuum deposition system

Abstract

A chamber assembly is described. The chamber assembly includes a first vacuum chamber providing a first vacuum region with a first track and having a first back wall with a first recess; a second vacuum chamber providing a second vacuum region with a second track separated from the first vacuum region, and having a second back wall with a second recess, the second back wall facing the first back wall; and one or more rib structures provided in the first recess and the second recess and outside the first vacuum region and the second vacuum region.

Description

VACUUM DEPOSITION SYSTEM AND METHOD OF COATING SUBSTRATES IN A VACUUM DEPOSITION SYSTEMFIELD

[0001] The present disclosure generally relates to substrate processing systems and methods of coating substrates. More specifically, embodiments described herein relate to a vacuum deposition system for coating substrates with a stack of layers, in particularly while the substrate is held in an essentially vertical orientation. Embodiments further relate to a load lock chamber assembly and moving substrates into and out of a vacuum deposition system. Specifically, embodiments relate to a chamber assembly; a vacuum deposition system, a method of moving substrates into and out of a vacuum deposition system, and a method of manufacturing a device layer or device layer stack on a substrate in a vacuum deposition system.BACKGROUND

[0002] In a number of technical applications, layers of different materials are deposited on a substrate to form a layer stack on the substrate, e.g. in a vacuum deposition system. Typically, a vacuum deposition system includes a plurality of vacuum deposition chambers, wherein each vacuum deposition chamber may house a deposition source, such as a sputter source. The substrate to be coated may be transported successively into two or more vacuum deposition chambers to coat the substrate with two or more layers of different coating materials formed on top of each other.

[0003] A typical in-line deposition system includes a number of subsequent processing chambers arranged in-line, wherein processing actions are conducted in one chamber after the other, such that a plurality of substrates can be processed in the in-line deposition system continuously or quasi-continuously. A downtime of the whole in-line deposition system may be caused by a failure of one single vacuumchamber of the deposition chambers arranged in-line. Accordingly, it is beneficial to reduce possible failure of each of the chambers.

[0004] An in-line deposition system may be provided in a “folded” configuration, with a forward transportation in one direction and a backward transportation in the opposite direction. This reduces the length of an in-line deposition system. Further, an in-line system with a first and second transportation path may have chambers providing the first and the second transportation path.

[0005] For loading and unloading of the substrates, a load lock chamber can be provided, wherein the load lock chamber is evacuated from atmospheric pressure after loading of a substrate to a system vacuum pressure to feed a substrate in the in-line deposition system. Further, the load lock chamber is vented from the system vacuum pressure to an atmospheric pressure for unloading a substrate from the inline deposition system. A system with a first transportation path and a second transportation path may, thus, experience cycles of pressure change.

[0006] Accordingly, it would be beneficial to provide improved chamber assemblies, improved vacuum deposition systems, and improved deposition methods.SUMMARY

[0007] In light of the above, a vacuum deposition system for coating a substrate and methods of coating substrates in a vacuum deposition system are provided according to the independent claims. Further aspects, advantages, and beneficial features are apparent from the dependent claims, the description, and the accompanying drawings.

[0008] According to an embodiment, a chamber assembly is provided. The chamber assembly includes a first vacuum chamber providing a first vacuum region with a first track and having a first back wall with a first recess; a second vacuum chamber providing a second vacuum region with a second track separated from the first vacuum region, and having a second back wall with a second recess, the secondback wall facing the first back wall; and one or more rib structures provided in the first recess and the second recess and outside the first vacuum region and the second vacuum region.

[0009] According to an embodiment, a vacuum deposition system for coating substrates in an essentially vertical orientation is provided. The vacuum deposition system includes a track switch module configured to switch a substrate from a first substrate transportation path to a second substrate transportation path; a load lock module comprising a chamber assembly according to any of the embodiments described herein and configured to receive a substrate from the track switch module and to provide the substrate to the track switch module; and at least a first processing module having a vacuum chamber providing a processing vacuum region, the first substrate transportation path and the second substrate transportation path being within the processing vacuum region.

[0010] According to an embodiment, a method of moving substrates into and out of a vacuum deposition system, particularly a vacuum deposition system according to any of the embodiments described herein, is provided. The method includes moving a first substrate onto a first substrate transportation path in a track switch module; venting a first vacuum chamber having a first back wall with a first recess; moving the first substrate into the first vacuum chamber; evacuating a second vacuum chamber having a second back wall with a second recess to provide a vacuum in the second vacuum chamber while the first vacuum chamber is at atmospheric pressure, wherein one or more rib structures are provided in the first recess and the second recess and outside the first vacuum region and the second vacuum region; moving a second substrate into the second vacuum chamber; venting the second vacuum chamber; moving the second substrate out of second chamber into the track switch module; and evacuating the first vacuum chamber while the second vacuum chamber is at atmospheric pressure.

[0011] According to an embodiment, a method of manufacturing a device layer or device layer stack on a substrate in a vacuum deposition system, particularly in a vacuum deposition system according to any of the embodiments described herein, is provided. The method includes moving substrates according to any of the methods of moving substrates according to any of the embodiments described herein; and depositing a layer in a vacuum deposition chamber of the vacuum deposition system.

[0012] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. The method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus and a method for manufacturing the apparatuses and devices described herein. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.BRIEF DESCRIPTION OF THE DRAWINGS

[0013] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

[0014] FIG. 1 shows a schematic top view of a vacuum deposition system according to embodiments described herein;

[0015] FIG. 2A shows a schematic top view of a chamber assembly according to embodiments described herein;

[0016] FIG. 2B shows a schematic cross-sectional top view of a chamber assembly corresponding to FIG. 2A;

[0017] FIG. 3 shows a schematic side view of a chamber assembly according to embodiments described herein;

[0018] FIG. 4 shows a further schematic side view of a chamber assembly according to embodiments described herein; and

[0019] FIG. 5 shows a flowchart of a method moving substrates into and out of a vacuum deposition system according to embodiments described herein.DETAILED DESCRIPTION

[0020] Reference will now be made in detail to the various exemplary embodiments, one or more examples of which are illustrated in each figure. Each example is provided by way of explanation and is not meant as a limitation. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet further embodiments. The intention is that the present disclosure includes such modifications and variations.

[0021] Within the following description of the drawings, the same reference numbers refer to same components. Only the differences with respect to the individual embodiments are described. The structures shown in the drawings are not necessarily depicted true to scale but are instead, intended to enhance the understanding of the embodiments.

[0022] The term “substrate” as used herein shall embrace substrates that are to be coated with one or more deposition materials, such as glass substrates. The substrates are typically large area substrates with a size of 1 m2and above, particularly 5 m2and above. For example, substrate sizes of 1.43 m2(GEN5) and above, such as 5.5 m2(GEN8.5), 9 m2(GEN10) or larger can be realized. Typically, the substrates are essentially vertically-oriented during the transport through the vacuum deposition system and during the coating with the one or more deposition materials. “Essentially vertically oriented” as used herein relates to substrates having a vertical orientation or a deviation from a vertical orientation of 20° or less, particularly 10° or less, in order to allow for a stable transport. A vacuum deposition system configured for vertical substrate processing may be advantageous in terms of a small footprint. In some embodiments, semiconductor substrates, such as wafers, may be processed and coated in the vacuum deposition system.

[0023] Embodiments of the present disclosure provide a chamber assembly and the vacuum deposition system with a chamber assembly, which is particularly usefulfor in-line deposition systems, for example, deposition systems with a first substrate transportation path and a second substrate transportation path. For example, the transportation paths can be a forward substrate transportation path and a backward substrate transportation path. Yet, the transportation path may also switch between “forward” and “backward” during some system operations. Similarly, embodiments can be applied to a hybrid deposition system with an in-line deposition portion and a cluster deposition portion, particularly a cluster deposition portion coupled to an in-line deposition portion.

[0024] Particularly for load lock chambers, repeating pressure cycles from atmospheric pressure to a vacuum pressure, i.e. a technical vacuum, at which the deposition system operates, occur.

[0025] According to an embodiment, a chamber assembly is provided. The chamber assembly includes a first vacuum chamber providing a first vacuum region with a first track and having a first back wall with a first recess, a second vacuum chamber providing a second vacuum region with a second track separated from the first vacuum region, and having a second back wall with a second recess, the second back wall facing the first back wall, and one or more rib structures provided in the first recess and the second recess and outside the first vacuum region and the second vacuum region.

[0026] According to some embodiments, which can be combined with other embodiments described herein, the first vacuum chamber and the second vacuum chamber can be considered interlocked or overlapping, particularly with overlapping regions of rib structures at the respective back walls of vacuum chambers. Accordingly, an interlocked chamber assembly or overlapping chamber assembly can be provided.

[0027] Accordingly, embodiments of the present disclosure have the advantage of reducing or avoiding fluctuating compressive and tensile loads that might occur for a chamber with a single vacuum region. Welds at a center wall are not exposed to reversal weld stress from compressive loads to tensile loads upon pressure cycles. Further, the number of welded joints in a vacuum can be reduced. As compared to a chamber with a single vacuum region and, e.g. a center wall, thechamber assembly according to embodiments described herein may also be considered a split chamber or split chamber assembly.

[0028] A chamber assembly according to embodiments of the present disclosure can be implemented in a vacuum deposition system with small or no impact of the overall system architecture, such as gate lock valves, chamber doors, or substrate transportation system, for example, magnetic levitation systems. Additionally or alternatively, the volume of the chamber or the chamber portion, respectively can be reduced. Accordingly, evacuation and venting of the vacuum regions can be faster.

[0029] FIG. 1 is a schematic view of a vacuum deposition system 10 for coating a substrate, particularly in an essentially vertical orientation, according to embodiments described herein. The vacuum deposition system 10 includes a chamber assembly 100 according to embodiments of the present disclosure.

[0030] The chamber assembly 100 provides a first load lock area with a first vacuum chamber 100a for feeding substrates into the vacuum deposition system 10 and a second load lock area with a second vacuum chamber 100b for feeding the substrates out of the vacuum deposition system, particularly back into the atmospheric environment (ATM).

[0031] Accordingly, the substrate can be fed into the vacuum deposition system through the first vacuum chamber 100a and can be transported into the vacuum deposition system 10, for example, a high-vacuum infeed chamber 111. The substrate transport direction through the first load lock area (during substrate feedin) into the vacuum deposition system 10 may be essentially parallel and opposite to the substrate transport direction through the second load lock area (during substrate feed-out) out of the vacuum deposition system 10.

[0032] Each of the first vacuum chamber 100a and the second vacuum chamber 100b includes a gate valve 104 configured to be opened and closed with respect to the track switch module 102. Further, each of the first vacuum chamber 100a and the second vacuum chamber 100b includes a gate valve 106 configured to be opened and closed with respect to a further vacuum chamber of the vacuum deposition system 10, for example, a high-vacuum infeed chamber 111 or a firstdeposition chamber 131. Accordingly, the first vacuum chamber and the second vacuum chamber can be closed for evacuation and venting between vacuum pressure and atmospheric pressure.

[0033] Accordingly, the first load lock area may include at least one first load lock chamber that provides a vacuum sluice for feeding the substrate into the vacuum deposition system 10 from an atmospheric environment. Closable openings, i.e. the gate valves, may be provided on both sides of the first vacuum chamber, such that the pressure in the vacuum chamber can change between atmospheric pressure and vacuum pressure for feeding a substrate into the vacuum deposition system 10, while continuously maintaining a vacuum pressure in the vacuum deposition system 10. The second load lock area may include at least one second load lock chamber that provides a vacuum sluice for feeding the substrate out of the vacuum deposition system 10 into an atmospheric environment. Closable openings, i.e. the gate valves, may be provided on both sides of the second vacuum chamber, such that the pressure in the vacuum chamber can change between vacuum pressure and atmospheric pressure for feeding a substrate out of the vacuum deposition system 10, while maintaining a vacuum pressure in the vacuum deposition system 10.

[0034] The vacuum deposition system includes, for example a first deposition chamber 131 and a second deposition chamber 132 provided in-line and adjacent to each other along a first substrate transport path P1. In some embodiments, the vacuum deposition system may include one or more deposition chambers arranged in-line and adjacent to each other. Alternatively, the vacuum deposition system 10 may include further deposition chambers arranged in-line with the first and second deposition chambers. Each of the first deposition chamber 131 and optional further deposition chambers, for example, the second deposition chamber 132 includes a first track, i.e. a first substrate transportation path P1 , e.g. a forward transportation path, and a second track, i.e. the second substrate transportation path P2, e.g. a backward transportation path. Further gate valves 14 can be provided. For example, a gate valve can be provided for each of the first substrate transportation path P1 and the second transportation path P2. For some embodiments, application and / or modes of operation of the system, the first substrate transportation path may be operated as the backward transportation path and the second transportation pathmay be operated as forward transportation path. According to some embodiments, which can be combined with other embodiments described herein, the first track is a first substrate transportation track to, e.g. provide the first substrate transportation path and the second track is a second substrate transportation track to, e.g. provide the second substrate transportation path.

[0035] As shown in FIG. 1 , the track switch module 102 can be a first substrate rotation chamber. For example, the substrate rotation chamber can rotate the substrates around the vertical axis, and particularly under atmospheric pressure. After material deposition in one or more of the deposition chambers, the substrate can be moved from the first substrate transportation path to the second substrate transportation path. A second substrate rotation chamber 120 can be provided, particularly a substrate rotation chamber provided at the end of the vacuum deposition system, i.e. a position opposite to the track switch module 102. According to some embodiments, which can be combined with other embodiments described herein, the second substrate rotation chamber is a vacuum rotation chamber.

[0036] The second substrate rotation chamber 120 is configured for transferring the substrate between the first substrate transport path P1 and the second substrate transport path P2, in particular by rotating (or translating, in the event of a second track switch module in general) the substrate between a first position 121 on the first substrate transport path P1 and a second position 122 on the second substrate transport path P2. For transferring the substrate from the first position 121 to the second position 122, the substrate can, for example, be rotated, particularly by 180°, in the second substrate rotation chamber. Transferring the substrate from the first position 121 to the second position 122 can be provided under vacuum, particularly the vacuum of the vacuum deposition system 10.

[0037] The first deposition chamber 131 and the second deposition chamber 132 are arranged adjacent to each other along the first substrate transport path P1 (and the second substrate transportation path P2).

[0038] The first substrate transport path P1 that extends from the first vacuum chamber 100a through the first deposition chamber 131 and optionally further deposition chambers, for example, the second deposition chamber 132 may be alinear transport path, and / or the second substrate transport path P2 that extends from the second substrate rotation chamber 120 through the first deposition chamber 131 and optionally, further deposition chambers, for example, the second deposition chamber 132 may be a linear transport path. A linear substrate transport through the vacuum deposition system 10 is easier than a substrate transport that involves direction changes.

[0039] In some embodiments, which can be combined with other embodiments described herein, the track switch module 102, i.e. the first substrate rotation chamber and the second substrate rotation chamber 120 includes a rotatable support 125 configured to rotate the substrate around an essentially vertical rotation axis A1 , particularly between the first position 121 on the first substrate transport path P1 and the second position 122 on the second substrate transport path P2. For example, the rotatable support 125 can be rotated by 180° for transferring a substrate from the first position 121 on the first substrate transport path P1 to the second position 122 on the second substrate transport path P2, or vice versa.

[0040] The substrates may be supported on, and / or held by, a respective substrate carrier during the transport and / or during the deposition in the respective deposition chambers. A “substrate carrier” may be understood as a substrate carrying device for holding or supporting a substrate during the substrate transport and coating, particularly in an essentially vertical orientation.

[0041] In some embodiments, which can be combined with other embodiments described herein, the vacuum deposition system 10 further includes a first substrate transport system 160 for transporting an exemplary first substrate 11 on the first substrate transportation path P1.

[0042] For example, the first substrate transport system 160 may be configured for a substrate transport in an essentially vertical orientation along the first substrate transport path P1. In some embodiments, the first substrate transport system 160 includes a plurality of transport rollers for supporting the first substrate (particularly for supporting the substrate carrier that carries the first substrate) during the transport along the first substrate transport path P1. Optionally, some of the transport rollers may be drive rollers that can be driven into rotation by a roller drive.Alternatively or additionally, the first substrate transport system 160 may include support magnets, e.g. magnets configured to ensure that an upper part of the substrate is maintained in the essentially vertical orientation, without mechanically contacting the upper part of the substrate. Alternatively or additionally, the first substrate transport system 160 may include a magnetic levitation system configured to generate a levitation force that counteracts at least a part of the weight of the substrate and / or the substrate carrier during the substrate transport. The magnetic levitation system may include passive levitation magnets, such as permanent magnets for generating the levitation force, and / or actively controlled levitation magnets, such as actively controlled levitation coils configured to maintain a constant gap width between the substrate carrier and a stationary base of the first substrate transport system.

[0043] In some embodiments, which can be combined with other embodiments described herein, the vacuum deposition system 10 further includes a second substrate transport system 170 for transporting an exemplary second substrate 12 from the second substrate rotation chamber 120 on the second substrate transportation path P2.

[0044] The second substrate transport system 170 may be configured in analogy to the first substrate transport system 160. Specifically, the second substrate transport system 170 may be configured for a substrate transport in an essentially vertical orientation along the second substrate transport path P2. For example, the second substrate transport system 170 may include a plurality of support rollers and / or drive rollers, and / or may include a magnetic levitation system configured to counteract at least a part of the substrate weight during the transport, or for holding the complete weight of the substrate by magnetic forces.

[0045] In some embodiments, drive units, particularly one or more linear drive motors, may be provided for propelling the substrates along the first substrate transport path P1 and / or along the second substrate transport path P2. According to some embodiments, which can be combined with other embodiments described herein, the drive units can be active magnetic drive units, particularly for contactless driving of the substrates, for example, substrates supported in a substrate carrieralong the first substrate transportation path P1 and / or the second substrate transportation path P2.

[0046] In some embodiments, which can be combined with other embodiments described herein, on the first substrate transportation path P1 , a first material deposition source 191 configured to deposit a first material may be provided in the first deposition chamber and / or a second material deposition source 192 configured to deposit a second material may be provided in the second deposition chamber 132. On the second substrate transportation path P2, a third material deposition source 193 configured to deposit a third material may be provided in the second deposition chamber and / or a fourth material deposition source 194 configured to deposit a fourth material may be provided in the first deposition chamber 131.

[0047] According to some embodiments, which can be combined with other embodiments described herein, the first material, the second material, the third material, and the fourth material can be different materials. However, in the event one of the materials to be deposited on a substrate is supposed to have a larger layer thickness, or in the event of alternating material layers, some of the deposition sources can include the same material.

[0048] In some embodiments, the first deposition chamber and the second deposition chamber may house sputter sources. In particular, all of the deposition chambers may house at least one sputter source, respectively. According to typical embodiments, a DC sputtering source, a sputter source for pulsed sputtering, a middle frequency (MF) sputtering source, and / or a radio frequency (RF) sputtering source can be provided. MF sputtering may be conducted with frequencies in the range of, for example, 5 kHz to 100 kHz, particularly 10 kHz to 50 kHz.

[0049] In some embodiments, a substrate swing station 181 for changing the substrate orientation between a horizontal orientation and a vertical orientation may be connected to the track switch module 102. The substrate orientation can be changed in the substrate swing station 181 from horizontal to vertical before the respective substrate is fed in the vacuum deposition system, i.e., before the processing, and the substrate orientation can be changed from vertical to horizontalafter the respective substrate is fed out of the deposition system, i.e., after the processing.

[0050] According to an embodiment, a vacuum deposition system for coating a substrate in an essentially vertical orientation is provided. The vacuum deposition system includes a track switch module configured to switch a substrate from a first substrate transportation path to a second substrate transportation path, a load lock module comprising a chamber of any of the embodiments of the present disclosure, which is configured to receive a substrate from the track switch module and to provide the substrate to the track switch module. The vacuum deposition system further includes at least a first processing module having a vacuum chamber providing a processing vacuum region, the first substrate transportation path and the second substrate transportation path being within the processing vacuum region. According to some embodiments, which can be combined with other embodiments described herein, the track switch module can be a first substrate rotation chamber. Further, according to some additional or alternative implementations, the vacuum deposition system may further include a second substrate rotation chamber provided at end of the vacuum deposition system opposite the track switch module. For example, the second substrate rotations chamber is a vacuum rotation chamber.

[0051] FIG. 2A shows a schematic top view of the chamber assembly 100. FIG. 2B shows a schematic cross-sectional top view of the chamber assembly. The chamber assembly 100 includes a first vacuum chamber 100a and a second vacuum chamber 100b. According to some embodiments, which can be combined with other embodiments described herein, the first vacuum chamber and the second vacuum chamber, or at least respective bodies of the vacuum chambers, are identical or substantially identical. Accordingly, the same reference numerals are used for components thereof, even though reference is sometimes made to “a first component” or “the second component”, respectively. Further, the reference numerals may be depicted in the drawings only in the first vacuum chamber 100a or the second vacuum chamber 100b.

[0052] Each of the vacuum chambers include a body 201 , i.e. a chamber body. For example, the body 201 can include a top wall (shown in FIG. 2A) and a bottom wall. Further, the body 201 can include two sides walls, i.e. walls through which the substrate may enter or exit the vacuum chamber. The body 201 further includes a back wall 202 and a wall or outer wall opposite the back wall. According to some embodiments, which can be combined with other embodiments described herein, and as indicated by dashed lines 5, the first vacuum chamber 100a and the second vacuum chamber 100b can be arranged to have a gap between the respective back walls 202. For example, the gap can be from about 5 mm to about 30 mm. According to embodiments of the present disclosure, the first back wall of the first vacuum chamber and the second back wall of the second vacuum chamber may face each other, i.e. are adjacent to each other, particularly with the gap between the back walls. The chamber assembly is provided by the first vacuum chamber 100a that may include a first substrate transportation path (e.g. P1 in FIG. 1 ) and by the second vacuum chamber 100b that may include a second substrate transportation path (e.g. P2 in FIG. 1 )

[0053] As shown in FIG. 2B, vacuum chambers provide vacuum regions 203. A recess 204 is provided at each of the back walls. Accordingly, the first vacuum chamber 100a provides a first vacuum region 203. A first recess 204 is provided at the first back wall 202. The second vacuum chamber 100b provides a second vacuum region 203. A second recess 204 is provided at the second back wall 202.

[0054] One or more rib structures 206 are provided in the first recess and the second recess. Particularly, the one or more rib structures 206 are provided outside the first vacuum region 203 and outside the second vacuum region 203. For example, the one or more rib structures can be staggered ribs. A first plurality of rib structures of the one or more rib structures is coupled to the first vacuum chamber. A second plurality of rib structures of the one or more rib structures is coupled to the second vacuum chamber. For example, the rib structures can be welded to the body of the respective vacuum chamber. According to some embodiments, which can be combined with other embodiments described herein, the one or more rib structures can be staggered vertical ribs. According to some embodiments, which can be combined with other embodiments described herein, wherein the first plurality of ribstructures overlap with the second plurality of rip structures in at least one of the first recess and the second recess. An overlap region is provided. Additionally or alternatively, the first plurality of rib structures of the first vacuum chamber extend into the second recess of the second vacuum chamber and / or the second plurality of rib structures of the second vacuum chamber extend into the first recess of the first vacuum chamber. For example, the rib structures have a width (e.g. horizontally extending towards the adjacent vacuum chamber) to extend over a center line between the first vacuum chamber and the second vacuum chamber. Accordingly, the first back wall 202 and the second back wall 202 can be stiffened without jeopardizing the design of the system and / or without severe adaptations of the material properties of he back walls.

[0055] As indicated by dashed circle 250, the rotational symmetry can be provided for the chamber assembly. Accordingly, if the first vacuum chamber 100a is rotated by 180° around an axis illustrated by the dashed circle 250, i.e. a vertical axis, the first vacuum chamber 100a would be in the position of the second vacuum chamber 100b and vice versa. In other words, if the chamber assembly 100 is rotated by 180° around the axis shown in FIG. 2B, the first vacuum chamber and the second vacuum chamber replace each other. Accordingly, the chamber assembly according to embodiments described herein, allow for production of smaller chambers, and particularly smaller identical chambers, while having a first vacuum region and the second vacuum region. The manufacturing effort can be reduced.

[0056] According to some embodiments, which can be combined with other embodiments described herein, the first recess 204 and the second recess 204 can each be provided by a stepped back wall 202. Alternatively, the recess may be provided by a curved back wall or another shape, wherein a space is provided outside of the vacuum regions between the back walls of the vacuum chambers. The one or more rib structures are provided in the space provided by the recesses. The first plurality of rib structures coupled to the first vacuum chamber, for example, welded to the first vacuum chamber, correspond in position to the second plurality of rib structures coupled to the second vacuum chamber after the 180° rotation described above.

[0057] In the arrangement of the chamber assembly the first vacuum chamber and the second vacuum chamber, a rib structure of the first plurality of rib structures is adjacent another rib structure of the second plurality of rib structures. A gap can be provided between two rib structures, i.e. one rib structure coupled to the first vacuum chamber and one rib structure coupled to the second rib structure. For example, the gap between the rib structures can be from about 10 mm to about 40 mm, i.e. in the overlap region. According to some embodiments, the first plurality of first structures can be from 2 to 12 rib structures and the second plurality of rib structures can be from 2 to 12 rib structures.

[0058] According to embodiments of the present disclosure, the one or more rib structures are provided outside the first vacuum region and the second vacuum region. Accordingly, weld joints within the vacuum regions can be reduced. The fatigue lifetime of the vacuum chambers can be improved. Downtimes of a vacuum deposition system can be reduced. In a chamber with alternating pressure cycles (a load lock chamber) in two vacuum regions, the reversal weld stress on welds inside the vacuum chamber, particularly on the center separation wall (due to alternating compressive and tensile loads), can be reduced or eliminated as compared to a single vacuum chamber.

[0059] According to an embodiment, a chamber assembly is provided. The chamber assembly includes a first vacuum chamber providing a first vacuum region with a first track and having a first back wall with a first recess and a second vacuum chamber providing a second vacuum region with a second track separated from the first vacuum region, wherein the second vacuum chamber has a second back wall, with a second recess, and the second back wall facing the first back wall. One or more rib structures are provided in the first recess and the second recess and outside the first vacuum region and the second vacuum region. According to some embodiments, which can be combined with other embodiments described herein, the one or more rib structures can include a first plurality of rib structures coupled to the first vacuum chamber, and a second plurality of rib structures coupled to the second vacuum chamber. According to some embodiments, the first track and the second track can be parallel.

[0060] According to some implementations, a first body of the first vacuum chamber including the first plurality of rib structures has a first shape and a second body of the second vacuum chamber including the second plurality of rib structures has a second shape identical to the first shape. Additionally or alternatively, a first body of the first vacuum chamber has a first shape and a second body of the second vacuum chamber has a second shape identical to the first shape. The first vacuum chamber and the second vacuum chamber can be arranged to be rotational symmetric.

[0061] Further to the one or more rib structures at the respective back walls of the vacuum chambers, outer rib structures 208 can be provided at the walls opposite the back walls. The outer rib structures can be welded to a body of a vacuum chamber. For example, 1 to 5 outer rib structures can be provided. Particularly for large area substrates as described herein, the volume of the vacuum regions and walls of the vacuum chambers are large. For example, the back wall and the wall opposite the back wall can have an area of 1 m2or above, 6 m2or above or even 10 m2or above. Accordingly, the forces acting on the walls upon evacuation of the vacuum regions can be large. Thus, the rib structures reduce deformation of the walls of the vacuum chamber under the vacuum pressure. According to embodiments of the present disclosure, the number of rib structures outside of a vacuum region can be increased by providing a first vacuum chamber and a second vacuum chamber back to back with respective recesses, as compared to a chamber assembly with one vacuum chamber.

[0062] According to some embodiments, which can be combined with other embodiments described herein, the first vacuum chamber can include one or more first outer ribs at a first wall opposite the first back wall, and wherein the second vacuum chamber can include one or more second outer ribs at a second wall opposite the second back wall.

[0063] As shown in FIG. 2B, each of the vacuum regions 203 can include an entrance region 213. The entrance region 213 can be adjacent to an opening 224 at a side wall of the body of the vacuum chamber. Further, each of the vacuum regions can include an exit region 214. The exit region can be adjacent to anopening 226 at an opposing side wall of the vacuum chamber. The central region 212 of the vacuum region can be provided between the entrance region 213 and the exit region 214.

[0064] For example, the opening 224 can be adjacent to the track switch module 102 (see FIG. 1 ). The opening 226 can be adjacent the further chamber, such as high-vacuum infeed chamber 111 , of the vacuum deposition system 10. Accordingly, the opening 224 or the openings 224 can be configured for transferring substrates from and to an atmospheric region into the chamber assembly. The opening 226 or openings 226 can be configured for transferring substrates from and to the vacuum region of the vacuum deposition system 10. According to some embodiments, which can be combined with other embodiments described herein, the first vacuum chamber (and the second vacuum chamber) has an entrance region, an exit region, and a central region between the entrance region and the exit region, and wherein the central region has a width w1 perpendicular to a substrate transportation direction smaller than a width w2 of at least one of the entrance region and the exit region.

[0065] According to some embodiments, which can be combined with other embodiments described herein, one or more diffusers can be provided in at least one of the entrance region and the exit region. A diffuser can provide a conduit for air or a gas in general with an increased flow resistance. Accordingly, upon venting of the vacuum region, the speed of the pressure increase can be controlled. Accordingly, glass breakage can be reduced, which may occur upon the sudden pressure increase up to atmospheric pressure. According to some embodiments, which can be combined with other embodiments described herein, a diffuser can be provided in the entrance region and the exit region. Accordingly, the pressure increase in the vacuum region of the vacuum chamber can be provided to be symmetric, and / or gas flow upon venting of the vacuum region can be provided to be symmetric. The risk of glass breakage can, thus, be further reduced.

[0066] The entrance openings, e.g. openings 224, and exit openings, e.g. openings 226, of two vacuum chambers can be opened and closed during operation of the chamber assembly and the vacuum deposition system. According to someembodiments, which can be combined with other embodiments described herein the first vacuum chamber includes a first gate valve configured to provide a first vacuum seal for the first vacuum region and a second gate valve configured to provide a second vacuum seal for the second vacuum region.

[0067] FIG. 3 exemplarily shows a schematic side view of the first vacuum chamber 100a. The view shown in FIG. 3 corresponds to the substrate transportation path being perpendicular to the paper plane. From the side, one rib structure of the first plurality of rib structures 206 can be seen. The rib structure extends into the recess 204 at the back wall 202. Further, the rib structure 206 extends outwardly from the back wall 202, i.e. into the recess of the second vacuum chamber (not shown in FIG. 3). Accordingly, the combination of the first recess of the first vacuum chamber and the second recess of the second vacuum chamber at the respective back walls facing each other, allows for providing the one or more rib structures configured to support the walls of the vacuum chambers. The one or more rib structures can be provided outside the first vacuum region and outside the second vacuum region. Further, a distance between the two vacuum chambers, and particularly the distance between the first substrate transportation path in the first vacuum chamber and the second substrate transportation path in the second transportation chamber can be limited while keeping the rib structures out of the vacuum region.

[0068] According to some embodiments, which can be combined with other embodiments described herein, a first substrate transportation path extending through the first vacuum chamber is provided and a second substrate transportation path extending through the second vacuum chamber is provided, wherein the first substrate transportation path and the second substrate transportation path have an essentially constant distance within the vacuum deposition system. Thus, the distance between the first substrate transportation track and the second substrate transportation track in the chamber assembly can be adapted to the transportation track distance of the vacuum deposition system, e.g. based upon the recesses. On the one hand, the chamber assembly with a first vacuum chamber and a second vacuum chamber according to embodiments described herein, allows for replacing a vacuum chamber in a vacuum deposition system with a predeterminedtransportation track distance. On the other hand, having a smaller transportation track distance in a vacuum deposition system reduces the footprint of the overall tool.

[0069] Exemplary components of the transportation track are shown in FIG. 4. FIG. 4 is a schematic cross-sectional side view of a vacuum chamber, for example, the first vacuum chamber 100a. The cross-sectional side view is along section A-A in FIG. 2B. A cross section of the components of a substrate transportation track is shown. For example, a substrate transportation track includes one or more holder 412 for magnetic levitation units. The magnetic levitation units generate a levitation force that counteracts at least a portion of the substrate weight and / or the weight of the substrate carrier and the substrate during substrate transportation. For example, the magnetic levitation units can include passive levitation magnets, such as permanent magnets, for generating the levitation force. Alternatively, the magnetic levitation units can include actively controllable levitation magnets, for example, magnets including coils. Further, the substrate transportation track includes drive units. FIG. 4 shows one or more feedthroughs 414 for the drive units. The drive units can include actively controllable magnets configured to provide the driving force on a carrier along the substrate transportation path. According to some embodiments, which can be combined with other embodiments described herein, additionally or alternatively a roller system can be provided. The roller system can be configured to counteract a portion of the weight of the substrate and / or a carrier and the substrate. Further, a roller system may, according to some implementations, include rollers coupled to an actuator for providing the driving force along the substrate transportation path.

[0070] According to some embodiments, which can be combined with other embodiments described herein, ribs internal to the vacuum region may be provided in addition to the one or more rib structures in the recess or the recesses respectively, and the outer ribs. FIG. 4 exemplarily shows six internal ribs 406 at the top wall of the body 201 of the vacuum chamber. Further, FIG. 4 exemplarily shows two internal ribs 408 at the bottom wall of the body of the vacuum chamber. According to some embodiments, which can be combined with other embodiments described herein, the number of ribs at the top wall is larger than the number of ribsat the bottom wall. Particularly, space for components of the substrate transportation tracks can be provided at the bottom of the vacuum chamber. Further, the floor of a manufacturing hall can provide support for a bottom wall of the chamber body.

[0071] According to some embodiments, would can be combined with other embodiments described herein, the chamber assembly can provide a load lock module for a vacuum deposition system. Embodiments of the present disclosure provide the chamber assembly, which may be particularly useful for the load lock module for a vacuum deposition system. The load lock module having a first vacuum region and the second vacuum region, which are alternatingly operated to be at atmospheric pressure and at vacuum pressure, can have a reduced fatigue life of the chamber, particularly for welded components inside the vacuum region. As described in more detail with respect to FIG. 5, a load lock module may be operated to have a substrate on a first substrate transportation path at atmospheric pressure while another substrate on a second substrate transportation path is at vacuum pressure, and vice versa. Accordingly, tensile loads and compressive loads in the vacuum regions alternate. Particularly, the tensile loads and compressive loads alternate at the tact time of the vacuum deposition system.

[0072] By providing the chamber assembly with the first vacuum chamber and a second vacuum chamber having the recessed walls with the one or more rib structures allow for combination of several advantages. For each of the first vacuum chamber and the second vacuum chamber, the tact time is reduced by a factor of two as compared to a single vacuum chamber utilized for both, a forward substrate transportation path and backward substrate transportation path. Further, each of the first vacuum chamber and the second vacuum chamber experiences compression forces only, i.e. tensile forces are avoided. Accordingly, as compared to a single vacuum chamber system, there is no phase shift for the vacuum regions for the two substrate transportation paths. With the first vacuum chamber and the second vacuum chamber in tandem, there is no stress reversal at the tact time of the vacuum deposition system. Embodiments of the present disclosure undergo weld stress switch only between compressive (pump down) to no load condition (venting) and at half of the tact time of the vacuum deposition system. Yet further, rib structures can be external to the vacuum region and internal ribs can be reduced innumber and / or simplified. Accordingly, the fatigue life of the chamber assembly can be improved.

[0073] By having smaller chambers, the overall building effort can be reduced and the overall cost of manufacturing can be reduced in light of ease of manufacturing. The internal volume of each of the first vacuum region and the second vacuum region can be optimized, i.e. utilization of volume reducers inside of vacuum chamber, which may provide further welded joints inside the vacuum chamber, can be reduced. Due to the design of the chamber assembly, identical or almost identical chambers can be used for the first vacuum chamber and the second vacuum chamber, while adapting the distance of the two substrate transportation paths to the substrate transportation path distance of the vacuum deposition system.

[0074] FIG. 5 shows a flowchart of a method of moving substrate into and out of a vacuum deposition system according to embodiments described herein. Particularly, the vacuum deposition system can be a vacuum deposition system according to any of the embodiments described herein and can have a chamber assembly according to any of the embodiments described herein.

[0075] At operation 501 , the first substrate is moved onto a first substrate transportation path in track switch module. For example, the substrate has previously been in a substrate swing station 181 (see FIG. 1 ) and has been moved from one horizontal substrate orientation to the vertical substrate orientation. The substrate can be moved onto the first substrate transportation path (e.g. P1 in FIG. 1 ) in track switch module (e.g. a rotation) or by moving the substrate into the track switch module (e.g. a translation). For example, a track switch between the first substrate transportation path and a second substrate transportation paths can be provided by a rotation along a vertical axis. At operation 502, the first vacuum chamber 100a, for example the upper vacuum chamber in FIG. 1 , can be vented. For example, the first vacuum chamber can be vented after another substrate has been provided into the vacuum deposition system. A gate valve 104, such as a gate valve between the track switch module and the first vacuum chamber, can be opened and the first substrate can be moved into the first vacuum chamber (see operation 503).

[0076] At the same time or during an at least partially overlapping time interval, the second vacuum chamber 100b, for example, the bottom vacuum chamber in FIG. 1 is evacuated at operation 504. The first vacuum chamber and the second vacuum chamber are vacuum chambers of the chamber assembly according to embodiments of the present disclosure. For example, the second vacuum chamber can be evacuated after another substrate has been moved out of the second vacuum chamber towards the track switch module 102 (see FIG. 1 ), and particularly under atmospheric pressure. At operation 505, the second substrate is moved into the second vacuum chamber, for example, from the high-vacuum infeed chamber 111. The second substrate can be moved into the second chamber under vacuum pressure. Thereafter, at operation 506, the second vacuum chamber is amended and the second substrate can be moved out of the second chamber into the track switch module at operation 507. In parallel, or at least partially in parallel, the first vacuum chamber that has received the first substrate at operation 503 can be evacuated at operation 508, particularly such that the first vacuum chamber is at vacuum pressure while the second vacuum chamber is at atmospheric pressure. According to some embodiments, which can be combined with other embodiments described herein, the gate valves 104 and 106 can be closed during venting and evacuation of the respective vacuum chamber. Further, at least one of the gate valves 104 or 106 can be opened to move the substrate from a neighboring component of the vacuum deposition system 10.

[0077] After the first vacuum chamber has been evacuated, the method may further include moving the substrate and the vacuum into one or more further chambers of the vacuum deposition system, for example, the high-vacuum infeed chamber 111 shown in FIG. 1 or another vacuum chamber, for example, the substrate processing chamber or the substrate deposition chamber.

[0078] In light of the above, a method of manufacturing a device layer or device layer stack in the vacuum deposition system can be provided. Particularly, the vacuum deposition system according to embodiments of the present disclosure or a chamber assembly according to embodiments of the present disclosure can be utilized. The substrates can be moved according to any of the methods describedwith respect to FIG. 5 and / or methods according to embodiments described herein. Further, one or more layers can be deposited on the substrate in one or more of the first deposition chamber 131 and optional further deposition chambers, for example, the second deposition chamber 132, either on the forward substrate transportation path, on the backward substrate transportation path, or both.

[0079] In light of the above, the plurality of advantages can be provided for the vacuum deposition system and, particularly a chamber assembly according to embodiments of the present disclosure. For example, fluctuating compressive loads and tensile loads, e.g. at a center wall in a vacuum region can be reduced or avoided, such that there are no bent profiles, which can reduce the fatigue life of the chamber. The number of welded joints in a vacuum region can be reduced. The tact time acting on an individual vacuum chamber of the first vacuum chamber and the second vacuum chamber can be reduced. In light of the improvements, unplanned downtime can be reduced. The chamber assembly has no impact on the overall system architecture (including gate lock valves, chamber doors, and substrate transportation systems) in light of the recessed back walls having the one or more rib structures. Additionally or alternatively, the volume of the first vacuum region and the second vacuum region can be reduced.

[0080] While the foregoing is directed to some embodiments, other and further embodiments may be devised without departing from the scope thereof, and the scope thereof is determined by the claims that follow.

Claims

CLAIMSWhat is claimed is:

1. A chamber assembly, comprising: a first vacuum chamber providing a first vacuum region with a first track and having a first back wall with a first recess; a second vacuum chamber providing a second vacuum region with a second track separated from the first vacuum region, and having a second back wall with a second recess, the second back wall facing the first back wall; and one or more rib structures provided in the first recess and the second recess and outside the first vacuum region and the second vacuum region.

2. The chamber assembly of claim 1 , wherein the one or more rib structures comprises: a first plurality of rib structures coupled to the first vacuum chamber; and a second plurality of rib structures coupled to the second vacuum chamber.

3. The chamber assembly of claim 2, wherein the first plurality of rib structures overlap with the second plurality of rip structures in at least one of the first recess and the second recess to provide an overlap region.

4. The chamber assembly of claim 3, wherein a gap between the rib structures in the overlap region is from about 10 mm to about 40 mm.

5. The chamber assembly of any of claims 2 to 4, the first plurality of rib structures of the first vacuum chamber extends into the second recess of the second vacuum chamber.

6. The chamber assembly of any of claims 2 to 5, wherein a first body of the first vacuum chamber comprising the first plurality of rib structures has a first shape, and a second body of the second vacuum chamber comprising the second plurality of rib structures has a second shape identical to the first shape.

7. The chamber assembly of any of claims 1 to 5, wherein a first body of the first vacuum chamber has a first shape and a second body of the second vacuum chamber has a second shape identical to the first shape.

8. The chamber assembly of any of claims 1 to 7, wherein the first vacuum chamber and the second vacuum chamber are arranged to be rotational symmetric.

9. The chamber assembly of any of claims 1 to 8, wherein the first vacuum chamber comprises one or more first outer ribs at a first wall opposite the first back wall, and wherein the second vacuum chamber comprises one or more second outer ribs at a second wall opposite the second back wall.

10. The chamber assembly of any of claims 1 to 9, wherein the first track is a first substrate transportation path extending through the first vacuum chamber, and the second track is a second substrate transportation path extending through the second vacuum chamber.11 . The chamber assembly of any of claims 1 to 10, wherein the first vacuum chamber comprises: a first gate valve configured to provide a first vacuum seal for the first vacuum region; and a second gate valve configured to provide a second vacuum seal for the second vacuum region.

12. The chamber assembly of any of claims 1 to 11 , wherein the one or more rib structures are staggered vertical ribs.

13. The chamber assembly of any of claims 1 to 12, wherein the chamber assembly provides a load lock module for a vacuum deposition system.

14. The chamber assembly of any of claims 1 to 13, wherein the first vacuum chamber has an entrance region, an exit region, and a central region between the entrance region and the exit region, and wherein the central region has a width perpendicular to a substrate transportation direction smaller than at least one of the entrance region and the exit region.

15. The chamber assembly of claim 14, further comprising: one or more diffusers provided in at least one of the entrance region and the exit region.

16. A vacuum deposition system for coating substrates in an essentially vertical orientation, comprising: a track switch module configured to switch a substrate from a first substrate transportation path to a second substrate transportation path; a load lock module comprising a chamber assembly of any of claims 1 to 10 and configured to receive a substrate from the track switch module and to provide the substrate to the track switch module; and at least a first processing module having a vacuum chamber providing a processing vacuum region, the first substrate transportation path and the second substrate transportation path being within the processing vacuum region.

17. The vacuum deposition system of claim 16, wherein the track switch module is a first substrate rotation chamber.

18. The vacuum deposition system of any of claims 16 to 17, further comprising: a second substrate rotation chamber provided at end of the vacuum deposition system opposite the track switch module.

19. The vacuum deposition system of claim 18, wherein the second substrate rotations chamber is a vacuum rotation chamber.

20. A method of moving substrates into and out of a vacuum deposition system, particularly a vacuum deposition system of any of claims 16 to 19, comprising:moving a first substrate onto a first substrate transportation path in a track switch module; venting a first vacuum chamber having a first back wall with a first recess; moving the first substrate into the first vacuum chamber; evacuating a second vacuum chamber having a second back wall with a second recess to provide a vacuum in the second vacuum chamber while the first vacuum chamber is at atmospheric pressure, wherein one or more rib structures are provided in the first recess and the second recess and outside the first vacuum region and the second vacuum region; moving a second substrate into the second vacuum chamber; venting the second vacuum chamber; moving the second substrate out of second chamber into the track switch module; and evacuating the first vacuum chamber while the second vacuum chamber is at atmospheric pressure.21 . The method of claim 20, further comprising: moving the first substrate under vacuum into one or more further chambers of the vacuum deposition system.

22. A method of manufacturing a device layer or device layer stack on a substrate in a vacuum deposition system, particularly in the vacuum deposition system of any of claims 16 to 19, comprising: moving substrates according to any of the methods of claims 17 to 18; anddepositing a layer in a vacuum deposition chamber of the vacuum deposition system.

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