Capacitor module

Abstract

A capacitor module according to the present disclosure comprises: a case that has a bottom surface and lateral surfaces; a capacitor element that has a first electrode and a second electrode; a first bus bar that is connected to the first electrode; a second bus bar that is connected to the second electrode; a cooling plate that is placed between the first bus bar and the second bus bar, is in contact with the inner sides of lateral surfaces of the case, and is in contact with at least one of the first bus bar and the second bus bar; a sealing resin that fills the inside of the case; and a locking part that locks the cooling plate and the at least one of the first bus bar and the second bus bar.

Description

Capacitor module

[0001] The present disclosure relates to a capacitor module.

[0002] A capacitor module in which a plurality of capacitor elements are housed in a case and sealed with resin is known (for example, Patent Document 1).

[0003] The capacitor module disclosed in Patent Document 1 includes a plurality of capacitor elements, a capacitor case that houses the plurality of capacitor elements in parallel, and an electrical conduction member electrically connected to the capacitor elements.

[0004] The capacitor module of Patent Document 1 further includes a cooling member that is sandwiched between two adjacent capacitor elements and is arranged so as to be able to transfer the heat of the capacitor element to the outside.

[0005] Japanese Unexamined Patent Application Publication No. 2013 - 59191

[0006] In the capacitor module described in Patent Document 1, there is still room for improvement in terms of improving the reliability of the capacitor module.

[0007] The present disclosure provides a capacitor module with improved reliability.

[0008] The capacitor module of the present disclosure includes a case having a bottom surface and side surfaces, a first electrode facing in a direction opposite to the bottom surface of the case, a capacitor element having a second electrode different from the first electrode, a first bus bar connected to the first electrode of the capacitor element, a second bus bar connected to the second electrode of the capacitor element, a cooling plate that is between the first bus bar and the second bus bar, contacts the inside of the side surface of the case, and contacts at least one of the first bus bar and the second bus bar, a sealing resin filled in the case, and a locking portion to which at least one of the first bus bar and the second bus bar and the cooling plate are locked.

[0009] According to the present disclosure, a capacitor module with improved reliability can be provided.

[0010] Perspective view showing the capacitor module. Disassembled perspective view of the capacitor module with the sealing resin removed. Plan view of the case. Perspective view of the case. Plan view of the first busbar. Plan view of the second busbar. Elevation view of the cooling plate. Enlarged view of the hook portion of the cooling plate in Figure 7. Cross-sectional view showing the state in which the first busbar and the hook of the cooling plate are locked together. Assembly diagram showing the process of housing the capacitor assembly in the case. Perspective view showing the state in which the capacitor assembly is housed in the case. Enlarged view of a part of the A-A section of Figure 11, showing the state in which the hole of the second busbar fits into the second protrusion of the case and the bottom of the second busbar is in contact with the first protrusion of the case. Cross-sectional view of the AA-AA section of Figure 1 with the sealing resin hatched. Cross-sectional view of the BB-BB section of Figure 1 with the sealing resin hatched.

[0011] Capacitor modules are known in which multiple capacitor elements are housed in a case and sealed with resin. When current flows through the capacitor elements, they generate heat, which can exceed the heat resistance temperature of the capacitor module. Therefore, efficient cooling of capacitor modules is being considered. One method being considered for cooling capacitor modules is to install cooling plates made of a material with high thermal conductivity between capacitors arranged in parallel.

[0012] The heat generated by the capacitor element is transferred from the cooling plate through the case to the outside of the capacitor module. In order to ensure higher cooling performance of the capacitor module, we considered a structure in which the cooling plate and busbars are in contact to allow for more efficient heat transfer, which led to the following invention.

[0013] (Embodiment) Figure 1 is a perspective view showing a capacitor module 1 according to an embodiment, and Figure 2 is an exploded perspective view showing a capacitor module 1 according to an embodiment. In Figure 2, the sealing resin 140 is not shown.

[0014] The capacitor module 1 shown in Figures 1 and 2 is a module comprising one or more capacitor elements 40, and is used by being incorporated into various electronic devices, electrical equipment, industrial equipment, vehicle equipment, etc. As shown in Figure 1, the capacitor module 1 has a first external connection terminal 68 and a second external connection terminal 88 for electrically connecting to an external power supply, and functions as a capacitor when current is passed through the first external connection terminal 68 and the second external connection terminal 88.

[0015] As shown in Figure 2, the capacitor module 1 comprises a case 20, a capacitor element 40, a first busbar 60, a second busbar 80, insulating paper 100, a cooling plate 120, and a sealing resin 140 (Figure 1), which is not shown.

[0016] Excluding the case 20 and sealing resin 140, the assembled capacitor element 40, first busbar 60, second busbar 80, insulating paper 100, and cooling plate 120 are referred to as the capacitor assembly 160. In the figure, the X, Y, and Z directions represent the horizontal, height, and vertical directions of the capacitor module 1, respectively.

[0017] The components of the capacitor module 1 will be described below with reference to Figures 3 to 9.

[0018] Figure 3 is a plan view of Case 20, and Figure 4 is a perspective view of Case 20.

[0019] The case 20 shown in Figures 3 and 4 is a component for housing the capacitor assembly 160 shown in Figure 2. The case 20 is made of a material with high thermal conductivity (for example, aluminum).

[0020] The case 20 has a bottom surface 22, a pair of side surfaces 24, and a pair of side surfaces 26, and has a box-like shape with an opening on the opposite side of the bottom surface 22. An opening 34 is provided on the opposite side of the bottom surface 22. In this embodiment, the bottom surface 22 is rectangular, and the pair of side surfaces 24 and the pair of side surfaces 26 are provided according to the outer shape of the bottom surface 22. The side surfaces 24 correspond to the long sides of the bottom surface 22, and the side surfaces 26 correspond to the short sides of the bottom surface 22.

[0021] As shown in Figure 4, the bottom surface 22 is provided with a pair of first protrusions 30 and a pair of second protrusions 32 that are higher than the first protrusions 30. The first protrusions 30 and the second protrusions 32 are portions that protrude from the bottom surface 22 toward the opening 34 (+Y direction) and are used for positioning when housing the capacitor assembly 160, which will be described later, into the case 20.

[0022] The first protrusion 30 has the function of positioning the capacitor assembly 160 in the Y direction, and the second protrusion 32 has the function of positioning the capacitor assembly 160 in the X and Z directions. In this embodiment, the second protrusion 32 is provided on top of the first protrusion 30. However, the first protrusion 30 and the second protrusion 32 may be provided in different positions.

[0023] A groove 28 is provided on each of the pair of side surfaces 26. The pair of grooves 28 are shaped to guide and position the cooling plate 120, which will be described later, and each extends in the Y direction. By moving the cooling plate 120 in the -Y direction along the pair of grooves 28, the capacitor assembly 160 having the cooling plate 120 can be guided to a predetermined position inside the case 20. In this embodiment, each of the grooves 28 is provided at approximately the center position in the Z direction on the side surface 26.

[0024] The capacitor element 40 is a film capacitor, for example, made of a laminate of dielectric films. In this embodiment, as shown in Figure 2, four capacitor elements 40 are arranged. The capacitor element 40 has a first electrode 42 that is electrically connected to a first busbar 60, which will be described later, and a second electrode 44 that is electrically connected to a second busbar 80, which will be described later.

[0025] Figure 5 is a plan view of the first busbar 60, and Figure 6 is a plan view of the second busbar 80.

[0026] The first busbar 60 shown in Figure 5 and the second busbar 80 shown in Figure 6 are components for electrically connecting the capacitor element 40 to an external power supply. The first busbar 60 is joined to the first electrode 42 of the capacitor element 40, and the second busbar 80 is joined to the second electrode 44 of the capacitor element 40. Both the first busbar 60 and the second busbar 80 are made of a material having conductivity and high thermal conductivity (for example, copper). As shown in Figure 2, the first busbar 60 is positioned toward the opening 34 of the case 20, and the second busbar 80 is positioned toward the bottom surface 22 of the case 20.

[0027] The first busbar 60 shown in Figure 5 has a first contact portion 62, a first bent portion 64, and a first external connection terminal 68 (Figure 1).

[0028] The first contact portion 62 is the part that contacts the first electrode 42 of the capacitor element 40, and has a plurality of first terminals 66, a first central hole 70, and a plurality of first holes 72.

[0029] The first terminal 66 is the part that is joined to the first electrode 42 of the capacitor element 40 by solder or the like. The first central hole 70 is a hole that allows the sealing resin 140 to pass through and increases the fluidity of the sealing resin 140.

[0030] The first bent portion 64 is a structure that exposes the first external connection terminal 68 to the outside of the case 20.

[0031] As mentioned above, the first external connection terminal 68 is a terminal for electrically connecting the capacitor element 40 to an external power supply.

[0032] The second busbar 80 shown in Figure 6 has both a common structure and a different structure from the first busbar 60 shown in Figure 5.

[0033] Common structural features include the second terminal 86 and the second central hole 90 provided in the second contact portion 82. The second terminal 86 and the second central hole 90 correspond to the first terminal 66 and the first central hole 70 provided in the first contact portion 62, respectively. Also common structural features include the second bent portion 84 and the second external connection terminal 88. The second bent portion 84 and the second external connection terminal 88 correspond to the first bent portion 64 and the first external connection terminal 68, respectively.

[0034] In terms of structure, the second busbar 80 has a second hole 92 and a slit 94 located in the second contact portion 82.

[0035] The second hole 92 is a hole that engages with the second protrusion 32 of the case 20 described above. The capacitor assembly 160 is positioned within the case 20 when the second protrusion 32 engages with the second hole 92.

[0036] The multiple slits 94 are elongated holes for engaging the cooling plate 120, which will be described later, with the second busbar 80. Each of the slits 94 in this embodiment is an elongated hole extending in the X direction, and multiple slits are provided spaced apart in the X direction (four in this embodiment).

[0037] In this embodiment, the second central hole 90, the second hole 92, and the slits 94 are in positions that overlap each other with respect to their position in the Z direction. Two slits 94 are provided between the second central hole 90 and the second hole 92, and two slits 94 are provided on the outside of the second hole 92.

[0038] Figure 7 is an elevation view of the cooling plate 120, and Figure 8 is a partially enlarged view of Figure 7.

[0039] The cooling plate 120 shown in Figure 7 is a plate-shaped member for cooling the capacitor element 40. The cooling plate 120 is made of a material having high thermal conductivity (for example, aluminum or copper). Alternatively, the cooling plate 120 may have an insulating coating layer made of resin or inorganic material formed on the surface of a metal material having high thermal conductivity, such as aluminum or copper. Furthermore, the cooling plate 120 may be made of a composite material in which a thermal conductive filler, such as aluminum nitride, which has high thermal conductivity while also being highly insulating, is mixed into a resin material.

[0040] The cooling plate 120 has a pair of sides 122 extending in the Y direction and a pair of sides 124 extending in the X direction. Sides 122 are the shorter sides and side 124 are the longer sides.

[0041] When the cooling plate 120 is placed in the groove 28 (Figure 4) of the case 20, the shorter side of the cooling plate 120, which is side 122, is placed in the groove 28.

[0042] On one side of the long side 124, a plurality of hooks 126 are provided. The hook 126 is a portion that is inserted into the slit 94 of the second bus bar 80 shown in FIG. 6, and together with the slit 94, it functions as a locking portion 180 that locks the cooling plate 120 to the second bus bar 80.

[0043] As shown in FIG. 8, each of the hooks 126 has a first portion 128 and a second portion 130. The first portion 128 is a portion extending from the side 124, and the second portion 130 is a portion extending in a direction intersecting the first portion 128.

[0044] FIG. 9 shows a state where the hook 126 of the cooling plate 120 is inserted into the slit 94 of the second bus bar 80 and the cooling plate 120 is locked to the second bus bar 80.

[0045] As shown in FIG. 9, the second portion 130 of the hook 126 of the cooling plate 120 contacts the back surface of the second contact portion 82 of the second bus bar 80 in the +Y direction. This is referred to as the locking portion 180. With the locking portion 180, the cooling plate 120 is locked to the second bus bar 80 while restricting the movement of the cooling plate 120 in the Y direction (arrow Y1). According to such a locking method, even if a force acts to lift the cooling plate 120 in the +Y direction due to the filling of the encapsulating resin 140, the second bus bar 80 restricts the movement of the cooling plate 120, so that the lifting of the cooling plate 120 can be suppressed.

[0046] Returning to FIG. 2, the insulating paper 100 is a member for electrically insulating the first bus bar 60 and the second bus bar 80, and is composed of a material having high insulation. The insulating paper 100 is disposed between the first bent portion 64 of the first bus bar 60 and the second bent portion 84 of the second bus bar 80. By preventing the contact between the first bus bar 60 and the second bus bar 80, a short circuit within the capacitor module 1 is prevented.

[0047] The encapsulating resin 140 shown in FIG. 1 is a member for encapsulating the capacitor assembly 160 disposed in the case 20, and is composed of a thermosetting resin. The encapsulating resin 140 is, for example, composed of an epoxy resin or a urethane resin.

[0048] Next, the procedure for assembling the capacitor module 1 will be described.

[0049] First, assemble the capacitor assembly 160 shown in FIG. 2 and the like. Specifically, lock the cooling plate 120 to the second bus bar 80. More specifically, insert the hook 126 of the cooling plate 120 shown in FIG. 7 into the slit 94 of the second bus bar 80 shown in FIG. 6 in the -Y direction. After that, by moving the cooling plate 120 in the +X direction, as shown in FIG. 9, a part of the second portion 130 of the hook 126 faces the second contact portion 82 of the second bus bar 80 in the Y direction. As a result, the movement of the cooling plate 120 in the +Y direction is restricted by the second bus bar 80.

[0050] Then, prepare a plurality of capacitor elements 40 shown in FIG. 2, join the first electrode 42 of the capacitor element 40 to the first terminal 66 of the first bus bar 60, and join the second electrode 44 of the capacitor element 40 to the second terminal 86 of the second bus bar 80. Place an insulating paper 50 between the first bus bar 60 and the second bus bar 80.

[0051] As shown in FIG. 10, place the assembled capacitor assembly 160 inside the case 20. Specifically, move the capacitor assembly 160 in the -Y direction from the opening 34 of the case 20 toward the bottom surface 22. At this time, slide the side 122 of the cooling plate 120 along the groove 28 of the case 20. Thereby, the capacitor assembly 160 can be moved toward the bottom surface 22 of the case 20 while maintaining the relative position of the capacitor assembly 160 with respect to the case 20 in the XZ plane.

[0052] The capacitor assembly 160 stops at the position where the second bus bar 80 contacts the bottom surface 22 of the case 20. As shown in FIG. 11, the capacitor assembly 160 is housed in the case 20 except for the first external connection terminal 68 of the first bus bar 60 and the second external connection terminal 88 of the second bus bar 80.

[0053] The contact between the side 122 of the cooling plate 120 and the groove 28 of the case 20, which will be described later, restricts the movement of the cooling plate 120 in the -X direction. Therefore, unintentional unlocking does not occur.

[0054] Figure 12 is an enlarged cross-sectional view of a portion of the A-A section in Figure 11.

[0055] As shown in Figure 12, the second protrusion 32 of the case 20 engages with the second hole 92 of the second bus bar 80, and the first protrusion 30 of the case 20 contacts the second contact portion 82 of the second bus bar 80. The second bus bar 80 is supported from below by the first protrusion 30, and the capacitor assembly 160 is positioned in the Y direction. Furthermore, the engagement of the second protrusion 32 with the second hole 92 positions the capacitor assembly 160 in the X and Z directions. In this way, the capacitor assembly 160 is positioned three-dimensionally.

[0056] As explained using Figure 10, when inserting the capacitor assembly 160 into the case 20, the edges 122 of the cooling plate 120 slide along the groove 28 of the case 20, thereby positioning the capacitor assembly 160 in the X and Z directions relative to the case 20. Therefore, by pre-setting the positions of the second hole 92 of the second busbar 80 and the second protrusion 32 of the case 20 to correspond to each other, the second protrusion 32 of the case 20 will engage with the second hole 92 of the second busbar 80 simply by sliding the cooling plate 120 along the groove 28. In this way, the second hole 92 and the second protrusion 32 can be engaged with the capacitor assembly 160 without any position adjustment when housing it in the case 20.

[0057] After the capacitor assembly 160 is housed in the case 20, the sealing resin 140 is filled into the inside of the case 20. The filling of the sealing resin 140 continues until the capacitor assembly 160 is sealed by the sealing resin 140. This completes the capacitor module 1 shown in Figure 1.

[0058] As shown in Figure 12, a gap is maintained between the bottom surface 22 of the case 20 and the second bus bar 80 around the first protrusion 30. Therefore, the sealing resin 140 can be more reliably filled into the space below the capacitor assembly 160 through the first central hole 70 of the first bus bar 60 and the second central hole 90 of the second bus bar 80, and the sealing resin 140 can be efficiently filled into the case 20.

[0059] Figure 13 shows the AA-AA cross-section of Figure 1, where the sealing resin 140 is clearly indicated by hatching. The portion of the sealing resin 140 filled between the side surface 24 of the case 20 and the capacitor element 40 is referred to as the first portion 142. The portion of the sealing resin 140 filled between the side surface 26 of the case 20 and the capacitor element 40 is referred to as the second portion 146. The positioning of the capacitor assembly 160 within the case 20 as described above ensures that there is space to fill the sealing resin 140 to the intended dimensions. As a result, the first portion 142 and the second portion 146 of the sealing resin 140 are formed to the intended dimensions.

[0060] As shown in Figure 13, sealing resin 140 is filled between the capacitor element 40 and the cooling plate 120. This is referred to as the third portion 148. The contact between the edge 122 of the cooling plate 120 and the groove 28 of the case 20 restricts the movement of the cooling plate 120 in the Z direction. As a result, the movement of the cooling plate 120 in the Z direction due to the filling of the sealing resin 140 is also restricted. This ensures that the dimensions of the third portion 148 of the sealing resin 140 are formed to the intended dimensions. For example, if the thickness of the third portion 148 of the sealing resin 140 in the Z direction is made uniform, variations in the cooling of the capacitor element 40 by the cooling plate 120 are suppressed. Also, by narrowing the distance between the capacitor element 40 and the cooling plate 120, the amount of sealing resin 140 flowing in is reduced. This improves the efficiency of heat transfer from the capacitor element 40 to the cooling plate 120.

[0061] Figure 14 shows the BB-BB cross-section of Figure 1, where the sealing resin 140 is clearly indicated by hatching. The portion of the sealing resin 140 filled between the bottom surface 22 of the case 20 and the second busbar 80 is referred to as the fourth portion 150. The positioning of the capacitor assembly 160 within the case 20 as described above ensures that there is space to fill the sealing resin 140 to the intended dimensions. The fourth portion 150 of the sealing resin 140 can be formed to the intended dimensions.

[0062] In this embodiment, the locking of the second busbar 80 and the cooling plate 120 suppresses the inflow of the sealing resin 140 between the second busbar 80 and the cooling plate 120. As a result, the sealing resin 140 does not obstruct heat transfer from the cooling plate 120 to the second busbar 80. In other words, the efficiency of heat transfer from the cooling plate 120 to the second busbar 80 is improved.

[0063] In the embodiment described above, the structure in which the second busbar 80 and the cooling plate 120 are locked together by the slit 94 and the hook 126 was explained, but the embodiment is not limited to this case.

[0064] First, there is the case where both the first busbar 60 and the second busbar 80 are locked to the cooling plate 120. By using the cooling plate 120, which has not only high thermal conductivity but also insulating properties, the first busbar 60 and the second busbar 80 are locked without causing a short circuit. As a result, the efficiency of heat transfer is improved not only between the cooling plate 120 and the second busbar 80, but also between the cooling plate 120 and the first busbar 60, further improving the cooling performance of the capacitor module 1. On the other hand, if the cooling plate 120 is locked only to the second busbar 80, the cooling plate 120 does not need to have insulating properties, and the cost of manufacturing can be reduced. In addition, there is the advantage that high precision is not required for the Y-direction dimension of the cooling plate 120. Taking the above into consideration, in this embodiment, the second busbar 80 and the cooling plate 120 are locked.

[0065] Another example is when the first busbar 60 and the cooling plate 120 are locked together. First, since the first busbar 60 and the second busbar 80 are not locked together by the cooling plate 120, the cooling plate 120 does not need to be insulating. Furthermore, since the first busbar 60 does not need to be mated with the second protrusion 32 of the case 20, it can have a locking portion freely, regardless of the position of the hole for mating. On the other hand, if the locking is limited to the second busbar only, there is the advantage that the capacitor assembly 160 can be aligned more easily. When the capacitor assembly 160 is housed in the case 20 while sliding the groove 28 and the edge 122, if an external force is applied that rotates the capacitor assembly 160 around the X axis, a small elastic deformation occurs near the locking portion 180 of the cooling plate 120, and a rotational displacement around the X axis occurs centered around the locking portion 180. When the locking portion 180 is located on the first bus bar 60, compared to when it is located on the second bus bar 80, the distance between the center of rotation and the second hole 92 is shorter when the locking portion 180 is located on the second bus bar 80, thus suppressing the range of motion of the second hole 92.

[0066] Furthermore, regarding the method of locking at least one of the first busbar 60 and the second busbar 80 with the cooling plate 120, in addition to locking by the slit 94 and hook 126, other methods include locking by welding, locking by adhesive, and locking by interference fit.

[0067] Welding or adhesive fastening can more reliably prevent the sealing resin 140 from flowing between at least one of the first busbar 60 and the second busbar 80 and the cooling plate 120. On the other hand, the fastening in this embodiment is freely detachable, making it easy to assemble the capacitor module 1.

[0068] Similar to welding and bonding as described above, interference fit locking can more reliably prevent the inflow of the sealing resin 140. On the other hand, this embodiment has the advantage of being easy to manufacture as it does not require the high dimensional accuracy required for interference fit.

[0069] [Effects] According to the above-described embodiment, the following effects can be achieved.

[0070] The capacitor module 1 comprises a case 20, a capacitor element 40, a first bus bar 60, a second bus bar 80, a cooling plate 120, and a sealing resin 140. The capacitor module 1 includes a locking portion 180 that locks at least one of the first bus bar 60 or the second bus bar 80 with the cooling plate 120.

[0071] With this configuration, not only the heat from the capacitor element 40 but also the heat from the busbar can be efficiently dissipated to the outside via the cooling plate 120, improving the cooling performance of the capacitor module 1 and enhancing its reliability.

[0072] Furthermore, the locking portion 180 locks the second busbar 80 and the cooling plate 120.

[0073] This configuration makes it easier to assemble the capacitor module 1.

[0074] Furthermore, the locking portion is secured by a slit 94 provided in at least one of the first busbar 60 or the second busbar 80 and a hook 126 provided on the cooling plate 120.

[0075] This configuration allows for locking with a simple structure.

[0076] Furthermore, a groove 28 is provided on the side surface 26 of the case 20, and the edge 122 of the cooling plate 120 makes contact with it.

[0077] This configuration allows the capacitor assembly 160 to be easily and accurately positioned in a predetermined location on the case 20. Furthermore, it can further improve the cooling performance of the capacitor module 1.

[0078] Furthermore, the bottom surface 22 of the case 20 is provided with a first protrusion 30 and a second protrusion 32 that is higher than the first protrusion. The first protrusion 30 contacts the second bus bar 80. In addition, the second protrusion 32 engages with the second hole 92 of the second bus bar.

[0079] With this configuration, the first protrusion 30 of the case 20 contacts the second bus bar 80, and the second protrusion 32 of the case 20 engages with the second hole 92 of the second bus bar 80, thereby improving the positioning accuracy of the capacitor assembly 160 when housed in the case 20, and ensuring a precise gap between the case 20 and the capacitor assembly 160. This improves the dimensional accuracy of the sealing resin 140.

[0080] (Outline of Embodiments) (1) The capacitor module of the present disclosure comprises a case having a bottom surface and a side surface; a capacitor element having a first electrode disposed toward the bottom surface of the case and a second electrode different from the first electrode; a first busbar connected to the first electrode of the capacitor element; a second busbar connected to the second electrode of the capacitor element; a cooling plate located between the first busbar and the second busbar, in contact with the inside of the side surface of the case, and in contact with at least one of the first busbar or the second busbar; a sealing resin filled inside the case; and a locking portion that locks the first busbar, the second busbar, and the cooling plate.

[0081] (2) In the capacitor module of (1), the locking portion may lock the second busbar and the cooling plate and restrict the movement of the cooling plate in the direction from the second busbar to the first busbar.

[0082] (3) In the capacitor modules of (1) and (2), the locking portion may lock a slit provided in the first busbar or the second busbar with a hook provided in the cooling plate.

[0083] (4) In the capacitor modules of (1) to (3), the case may have a groove extending in the height direction on the inside of the side surface, and the edge of the cooling plate may be in contact with the groove.

[0084] (5) In the capacitor modules of (1) to (4), the case has a first protrusion on the inside of the bottom surface and a second protrusion on the inside of the bottom surface that is higher than the first protrusion, the second bus bar has a hole that fits into the second protrusion, the first protrusion is in contact with the second bus bar, and the second protrusion may fit into the hole of the second bus bar.

[0085] This disclosure is described in full with reference to the accompanying drawings in relation to preferred embodiments. On the other hand, various variations and modifications of the invention will be obvious to those skilled in the art. Such variations and modifications should be understood to be included within the scope of the invention as defined by the appended claims, as long as they do not fall outside that scope.

[0086] The capacitor module of this disclosure is useful in various electronic devices, electrical equipment, industrial equipment, vehicle equipment, etc.

[0087] 1 Capacitor module 20 Case 22 Bottom 24, 26 Side 28 Groove 30 First protrusion 32 Second protrusion 40 Capacitor element 42 First electrode 44 Second electrode 60 First busbar 62 First contact part 64 First bend part 66 First terminal 68 First external connection terminal 70 First central hole 72 First hole 80 Second busbar 82 Second contact part 84 Second bend part 86 Second terminal 88 Second external connection terminal 90 Second central hole 92 Second hole 94 Slit 100 Insulating paper 120 Cooling plate 122, 124 Side 126 Hook 128 First part 130 Second part 140 Sealing resin 142 First section 146 Second section 148 Third section 150 Fourth section 152 Fifth part 160 Capacitor assembly 180 Locking part

Claims

1. A capacitor module comprising: a case having a bottom surface and a side surface; a capacitor element having a first electrode positioned toward the bottom surface of the case and a second electrode different from the first electrode; a first busbar connected to the first electrode of the capacitor element; a second busbar connected to the second electrode of the capacitor element; a cooling plate located between the first busbar and the second busbar, in contact with the inside of the side surface of the case, and in contact with at least one of the first busbar or the second busbar; a sealing resin filled inside the case; and a locking portion that locks at least one of the first busbar and the second busbar and the cooling plate.

2. The capacitor module according to claim 1, wherein the locking portion locks the second busbar and the cooling plate, and restricts the movement of the cooling plate in the direction from the second busbar to the first busbar.

3. The capacitor module according to claim 1 or 2, wherein the locking portion locks a slit provided in the first busbar or the second busbar with a hook provided in the cooling plate.

4. The capacitor module according to any one of claims 1 to 3, wherein the case has a groove extending in the height direction on the inside of the side surface, and the edge of the cooling plate contacts the groove.

5. The capacitor module according to any one of claims 1 to 4, wherein the case has a first protrusion on the inside of the bottom surface and a second protrusion on the inside of the bottom surface that is higher than the first protrusion, the second bus bar has a hole that fits into the second protrusion, the first protrusion is in contact with the first bus bar, and the second protrusion fits into the hole of the second bus bar.

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