Resin film for optical film and method for producing resin film for optical film
The resin film with an amorphous resin and diacetal compound adjusts birefringence in the negative direction, addressing the challenge of positive birefringence in existing films, resulting in improved optical properties.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-09-18
- Publication Date
- 2026-03-26
AI Technical Summary
Existing resin films for optical films struggle with positive birefringence and lack effective methods to adjust birefringence in the negative direction, leading to unsatisfactory optical properties.
A resin film containing an amorphous resin with negative birefringence and a diacetal compound, where the diacetal compound precipitates as crystals or aggregates to adjust birefringence in the negative direction, achieved through a manufacturing process involving heating, mixing, and applying shear force.
The resin film exhibits controlled negative birefringence, enhancing optical properties and achieving desired refractive index characteristics.
Smart Images

Figure JP2025032832_26032026_PF_FP_ABST
Abstract
Description
Resin film for optical film and method for manufacturing resin film for optical film
[0001] The present invention relates to a resin film for an optical film and a method for manufacturing the resin film for an optical film. This application claims priority based on Japanese Patent Application No. 2024-161486 filed on September 18, 2024, Japanese Patent Application No. 2024-205492 filed on November 26, 2024, and Japanese Patent Application No. 2025-072083 filed on April 24, 2025, and incorporates all the descriptions described in the above Japanese patent applications by reference.
[0002] Acrylic resin films having characteristics in optical properties are known. For example, Patent Document 1 discloses a resin film for an optical film comprising a methacrylic acid ester polymer and a diacetal compound having a specific structure. The resin film disclosed in Patent Document 1 is disclosed to have characteristics such that dispersion defects do not occur and birefringence is small. The resin film produced in Patent Document 1 is disclosed to have the orientation birefringence changed in the positive direction by containing the diacetal compound and having smaller birefringence than a resin film not containing the diacetal compound.
[0003] Patent Document 2 discloses a base material for a surface protection film for protecting the surface of an image display device. The base material for the surface protection film disclosed in Patent Document 2 is characterized by having retardation characteristics within a specific range. As a specific composition of this base material for the film, it is disclosed to contain at least one resin selected from polycarbonate, polyester, cycloolefin resin, acrylic resin, and cellulose resin. Further, it is disclosed that the base material for the film may contain a resin having an alicyclic structure or an aromatic ring structure showing negative intrinsic birefringence.
[0004] Japanese Patent Laid-Open No. 2010-254730, WO2020 / 054135
[0005] An object of the present invention is to provide a resin film for an optical film containing a resin having negative birefringence and a diacetal compound and having the birefringence adjusted in the negative direction, and a manufacturing method thereof.
[0006] The resin film for an optical film according to the present disclosure is a film containing an amorphous resin having negative birefringence and a diacetal compound represented by the formula (1). In the film, the diacetal compound is precipitated as crystals or an associated state showing negative birefringence. The resin film for an optical film shows negative birefringence. (In the formula, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 are the same or different and each represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an alkoxycarbonyl group having 1 to 4 carbon atoms, a halogenated alkyl group having 1 to 4 carbon atoms or a halogen atom. R 7 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkenyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an alkoxycarbonyl group having 1 to 4 carbon atoms or a halogenated alkyl group having 1 to 4 carbon atoms.)
[0007] The resin film according to the present disclosure contains a resin having negative birefringence and a diacetal compound, and the birefringence is adjusted in the negative direction.
[0008] FIG. 1 is a TEM image of the resin film of Example 4. FIG. 2 is a TEM image of the resin film of Example 5.
[0009] [Outline of Embodiment] First, embodiments of the resin film for an optical film and its manufacturing method according to the present disclosure will be listed and described. In this specification, unless otherwise specified, "A to B" representing a numerical range means "A or more and B or less".
[0010] The resin film for an optical film according to the present disclosure is a film containing an amorphous resin having negative birefringence and a diacetal compound represented by the formula (1). In the film, the diacetal compound is precipitated as crystals or an associated state showing negative birefringence. The resin film for an optical film shows negative birefringence. (In the formula, R 1 , R 2 , R 3 , R4 , R 5 and R 6 These are identical or different, and each represents a hydrogen atom, a C1-C4 alkyl group, a C1-C4 alkoxy group, a C1-C4 alkoxycarbonyl group, a C1-C4 halogenated alkyl group, or a halogen atom, respectively. 7 (This represents a hydrogen atom, a C1-C4 alkyl group, a C1-C4 alkenyl group, a C1-C4 alkoxy group, a C1-C4 alkoxycarbonyl group, or a C1-C4 halogenated alkyl group.)
[0011] Conventionally, many proposals have been made regarding resin films with adjusted optical properties. As mentioned above, Patent Document 2 proposes a film in which a chemical structure exhibiting negative birefringence is incorporated into the side chains of the resin constituting the film. On the other hand, Patent Document 1 describes kneading a methacrylic acid ester polymer and a diacetal compound, and dissolving the diacetal compound in the molten methacrylic acid ester polymer to obtain a mixture in which the diacetal compound is uniformly dispersed in the polymer.
[0012] Examples 1 and 2 of Patent Document 1 describe obtaining a film in which the diacetal compound was not dissolved in polymethyl methacrylate and was dispersed in a powdery state. Example 3 describes obtaining the same orientation birefringence and photoelastic coefficient as Example 1 for a film produced by a different manufacturing method than Examples 1 and 2. In the examples of Patent Document 1, the film formed by compression molding was stretched at 128 to 129°C, and neither the polymethyl methacrylate nor the diacetal compound would be in a molten state in this temperature range. Furthermore, the specific dispersion state of the diacetal compound is unknown in all cases. Moreover, the presence of the diacetal compound causes a positive change in birefringence.
[0013] In contrast, in the resin film for optical films according to this disclosure, the birefringence is adjusted to the negative direction by a diacetal compound. The film according to this disclosure has excellent birefringence control effect, and a resin film for optical films having negative birefringence is obtained.
[0014] In the aforementioned resin film for optical films, the diacetal compound may be contained in an amount of 1% to 20% relative to the amorphous resin. When the amount is within this range, the diacetal compound can be reliably precipitated in the film, and a film with birefringence adjusted in the negative direction can be obtained.
[0015] In the aforementioned resin film for optical films, the amorphous resin may be one or more selected from the group consisting of polystyrene resin and polymethyl methacrylate resin.
[0016] A method for manufacturing a resin film for optical films according to this disclosure includes the steps of: obtaining a resin composition by heating and mixing an amorphous resin having negative birefringence and a diacetal compound represented by formula (1) at a temperature above the softening point of the amorphous resin to dissolve the diacetal compound in the amorphous resin; heating the resin composition and molding it while applying shear force in a molten state; and cooling it while continuously applying shear force from the molding step. (In the formula, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 These are identical or different, and each represents a hydrogen atom, a C1-C4 alkyl group, a C1-C4 alkoxy group, a C1-C4 alkoxycarbonyl group, a C1-C4 halogenated alkyl group, or a halogen atom, respectively. 7 (This represents a hydrogen atom, a C1-C4 alkyl group, a C1-C4 alkenyl group, a C1-C4 alkoxy group, a C1-C4 alkoxycarbonyl group, or a C1-C4 halogenated alkyl group.)
[0017] In the above manufacturing method, the diacetal compound precipitates in the resin film for optical films as a crystal or aggregated state, and the diacetal compound adjusts the birefringence in the negative direction. According to this manufacturing method, a resin film in which the birefringence characteristics are controlled in the negative direction can be obtained.
[0018] The resin film relating to this disclosure will be described in more detail below. In this specification, the term "(meth)acrylic acid ester" refers collectively to both acrylic acid esters and methacrylic acid esters.
[0019] (Resin) The resin film according to this disclosure contains an amorphous resin having negative birefringence as the resin that constitutes the film. The amorphous resin is not particularly limited as long as it has negative birefringence and transparency appropriate to the application. From the viewpoint of productivity and cost, it is preferable that the resin having negative birefringence includes at least one selected from the group consisting of polystyrene resin, (meth)acrylate resin, polyester resin, and polyimide resin.
[0020] The resin film according to this disclosure exhibits negative birefringence, and the substrate resin also exhibits negative birefringence. In the resin film according to this disclosure, the diacetal compound exists in the film as a crystalline or associated state. Furthermore, the diacetal compound adjusts the birefringence in the negative direction. In this form, the optical tuning effect of the diacetal compound is strongly exerted, making it possible to construct a resin film that exhibits negative birefringence.
[0021] Furthermore, the birefringence of a resin film is determined by the refractive index (n) in two orthogonal axial directions within the film plane. x , n y It is defined as the difference (Δn) between ) and is expressed by the following equation: Δn = n x -n y In the above formula, n x is the refractive index of the slow axis, n y n represents the refractive index of the phase-advancing axis. When the resin film has positive birefringence, n x >n y As a result, the refractive index of the slow axis in the flow or deformation direction is higher than the refractive index of the fast axis in the direction perpendicular to it. When the resin film has negative birefringence, n x <n yAs a result, the refractive index of the leading axis is higher than the refractive index of the lagging axis. The birefringence of the resin film can be measured, for example, using a polarizing microscope in accordance with known methods. Specific methods for measuring birefringence are described in detail in the examples. In this specification, "birefringence adjusted in the negative direction" means the birefringence value (Δn) of a resin film that does not contain the acetal compound specified by formula (1). 0 For ) the birefringence value (Δn) of the resin film containing the acetal compound specified by formula (1) ad This means that it is small.
[0022] When the resin that forms the base of the resin film is polystyrene resin, the polystyrene resin includes resins obtained by polymerizing styrene and styrene derivatives as the main components, and resins that are copolymers of styrene and other resins. Known polystyrene-based thermoplastic resins can be used as the polystyrene resin. In particular, from the viewpoint of film strength and heat resistance, it is preferable to use a styrene-based copolymer resin. Examples of such copolymer resins include styrene-acrylonitrile resins, styrene-acrylic resins, styrene-maleic anhydride resins, or multi-component (binary, ternary, etc.) copolymer polymers thereof. Among these, styrene-acrylic resins and styrene-maleic anhydride resins are preferred from the viewpoint of heat resistance and film strength.
[0023] The styrene-maleic anhydride resin preferably has a mass composition ratio of styrene to maleic anhydride of 95:5 to 50:50, and more preferably 90:10 to 70:30. Hydrogenated styrene resins are also preferably used. Examples of styrene-maleic anhydride resins include "Dayark D332" manufactured by Nova Chemical. Examples of styrene-acrylic resins include "Delpet 980N" manufactured by Asahi Kasei Chemical. The stereoregularity of the polystyrene resin may be either an atactic or syndiotactic structure.
[0024] When the resin that forms the base of the resin film is a methacrylic acid ester polymer, i.e., a methacrylic acid ester resin, a suitable methacrylic acid ester resin is a polymer mainly composed of methacrylic acid ester. Here, "mainly composed of methacrylic acid ester" as used herein means that the methacrylic acid ester content in the raw material monomer of the methacrylic acid ester polymer is 50% by mass or more. From the viewpoint of improving the heat resistance and transparency of the methacrylic acid ester polymer, the methacrylic acid ester content in the raw material monomer is preferably 80% by mass or more, more preferably 85% by mass or more, and even more preferably 90% by mass or more.
[0025] Representative examples of polymers mainly composed of methacrylic acid esters include methacrylic acid ester homopolymers and methacrylic acid ester copolymers obtained by polymerizing raw material monomers mainly composed of methacrylic acid esters, which contain methacrylic acid esters and other monomers.
[0026] Suitable methacrylate monomers for forming polymers mainly composed of methacrylate esters include, from the viewpoint of improving fluidity and heat decomposition resistance during heating and melting, alkyl methacrylates in which the alkyl group in the ester portion has 1 to 18 carbon atoms, such as methyl methacrylate, ethyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate, pentyl methacrylate, hexyl methacrylate, heptyl methacrylate, 2-ethylhexyl methacrylate, nonyl methacrylate, decyl methacrylate, dodecyl methacrylate, isobornyl methacrylate, tridecyl methacrylate, and stearyl methacrylate; cyclohexyl methacrylate and phenyl methacrylate. These can be used individually or in combination of two or more. These methacrylate esters have excellent fluidity and heat decomposition resistance during heating and melting.
[0027] Among the methacrylate esters mentioned above, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate, 2-ethylhexyl methacrylate, dodecyl methacrylate, isobornyl methacrylate, cyclohexyl methacrylate, tridecyl methacrylate, and stearyl methacrylate are preferred due to their availability. Furthermore, from the viewpoint of heat resistance, alkyl methacrylates in which the alkyl group in the ester portion has 1 to 4 carbon atoms are more preferred, and methyl methacrylate is even more preferred.
[0028] In the case of a methacrylic acid ester homopolymer, one of the aforementioned methacrylic acid esters is used as the raw material monomer. When two or more types of methacrylic acid esters are used as raw material monomers, the methacrylic acid ester polymer becomes a methacrylic acid ester copolymer.
[0029] A methacrylic acid ester copolymer obtained by polymerizing a raw material monomer mainly composed of methacrylic acid ester, containing methacrylic acid ester and other monomers, is an example of a copolymer obtained by polymerizing a raw material monomer mainly composed of methacrylic acid ester, containing one or more of the aforementioned methacrylic acid esters and other monomers. The methacrylic acid ester copolymer may be a random copolymer or a block copolymer. The methacrylic acid ester copolymer obtained by polymerizing a raw material monomer mainly composed of methacrylic acid ester is usually a random copolymer, and this random copolymer is readily available commercially.
[0030] Other monomers include, for example, alkyl acrylates such as methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, tert-butyl acrylate, hexyl acrylate, 2-ethylhexyl acrylate, nonyl acrylate, decyl acrylate, dodecyl acrylate, and stearyl acrylate; hydroxyl group-containing alkyl acrylates such as 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, and 4-hydroxybutyl acrylate; other acrylic acid esters such as cyclohexyl acrylate, 2-methoxyethyl acrylate, 3-methoxybutyl acrylate, trifluoromethyl acrylate, trifluoroethyl acrylate, pentafluoroethyl acrylate, glycidyl acrylate, allyl acrylate, phenyl acrylate, tol acrylate, benzyl acrylate, isobornyl acrylate, and 3-dimethylaminoethyl acrylate; unsaturated monocarboxylic acids such as methacrylic acid and acrylic acid; acrylic acid Examples include, but are not limited to, vinyl cyanide compounds such as nitrile and methacrylonitrile; aromatic vinyl compounds such as styrene, α-methylstyrene, p-methylstyrene, p-methoxystyrene, divinylbenzene, and vinylnaphthalene; unsaturated dicarboxylic acid compounds or derivatives such as maleic anhydride, maleic acid, maleic acid monoester, maleic acid diester, fumaric acid, fumaric acid monoester, and fumaric acid diester; maleimide compounds such as maleimide, methyl maleimide, ethyl maleimide, propyl maleimide, butyl maleimide, hexyl maleimide, octyl maleimide, dodecyl maleimide, stearyl maleimide, phenyl maleimide, and cyclohexyl maleimide; conjugated diene compounds such as butadiene and isoprene; halogen-containing unsaturated compounds such as vinyl chloride, vinylidene chloride, tetrafluoroethylene, hexafluoropropylene, vinylidene fluoride, and chloroprene; and silicon-containing unsaturated compounds such as vinyltrimethoxysilane and vinyltriethoxysilane. These other monomers can be used individually or in combination of two or more.
[0031] Among the other monomers mentioned above, alkyl acrylates and vinyl cyanide compounds are preferred from the viewpoint of heat resistance, and alkyl acrylates, acrylonitrile, and methacrylonitrile are more preferred, with alkyl acrylates having 1 to 4 carbon atoms in the alkyl group of the ester portion.
[0032] The content of the other monomers in the raw material monomers of the methacrylic acid ester polymer is 50% by mass or less, preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less, from the viewpoint of improving the heat resistance and transparency of the methacrylic acid ester copolymer.
[0033] In the resin film for optical films according to this disclosure, it is preferable to use a methacrylate ester polymer mainly composed of methyl methacrylate as the raw material monomer, from the viewpoint of heat resistance and transparency.
[0034] When the resin that forms the base of the resin film is an acrylic acid ester polymer, i.e., an acrylic acid ester resin, suitable acrylic acid ester resins include polymers mainly composed of acrylic acid esters. Examples of polymers mainly composed of acrylic acid esters include isobutyl acrylate polymer, 2-ethylhexyl acrylate polymer, isodecyl acrylate polymer, nonyl acrylate polymer, and dodecyl acrylate polymer.
[0035] The (meth)acrylic acid ester polymer that forms the base of the resin film according to this disclosure may be a copolymer of an acrylic acid ester monomer and a methacrylic acid ester monomer. Examples of such copolymers include methyl methacrylate-(meth)acrylic acid copolymer, methyl methacrylate-(meth)acrylic acid ester copolymer, methyl methacrylate-acrylic acid ester-(meth)acrylic acid copolymer, and methyl (meth)acrylate-styrene copolymer. These polymers may have glutarimide structural units or lactone ring structural units introduced into them by modification.
[0036] The melt flow rate (230°C, 37.3N) of the (meth)acrylic acid ester polymer used in the resin film for optical films according to this disclosure is not particularly limited, but from the viewpoint of increasing the fluidity of the (meth)acrylic acid ester polymer when heated and melted, it is preferably 0.5 g / 10 min or more, more preferably 1.5 g / 10 min or more. From the viewpoint of increasing the mechanical strength of the methacrylic acid ester polymer, it is preferably 30 g / 10 min or less, more preferably 25 g / 10 min or less.
[0037] The weight-average molecular weight (Mw) of the (meth)acrylic acid ester polymer used in the resin film for optical films according to this disclosure is preferably 40,000 to 200,000, more preferably 50,000 to 180,000, and even more preferably 55,000 to 160,000. When Mw is 40,000 or higher, the strength and toughness of the resin film are improved. When Mw is 200,000 or lower, the fluidity of the (meth)acrylic acid ester polymer is improved, and the moldability is improved. The weight-average molecular weight (Mw) is a value calculated by converting the chromatogram measured by gel permeation chromatography (GPC) to the molecular weight of standard polystyrene.
[0038] The acid value of the (meth)acrylic ester polymer used in the resin film according to this disclosure is preferably 0.01 to 0.30 mmol / g, more preferably 0.05 to 0.28 mmol / g. The acid value is proportional to the content of carboxylic acid units and carboxylic acid anhydride units in the (meth)acrylic ester polymer. The acid value can be measured, for example, by dissolving the resin to be measured in a mixed solvent of xylene and 2-propanol, and then titrating it with a 0.1 mol / L potassium hydroxide-ethanol solution by potentiometric titration, with the inflection point on the titration curve as the endpoint. When the acid value is within the above range, there is an excellent balance between fluidity and moldability of the film.
[0039] When the resin that forms the base of the resin film is a polyester resin, any known polyester resin that is used as an optical resin and has negative birefringence can be used without particular limitation. The polyester resin is obtained by polymerizing a dicarboxylic acid and a diol, and it is preferable that 70% or more of the dicarboxylic acid constituent units (constituent units derived from dicarboxylic acid) are derived from aromatic dicarboxylic acids, and 70% or more of the diol constituent units (constituent units derived from diols) are derived from aliphatic diols.
[0040] When the resin that forms the base of the resin film is a polyimide resin, the polyimide resin can be any known resin used as an optical resin without particular limitations. The polyimide resin can be an optical resin available on the market, such as the "Surprim" series from Mitsubishi Gas Chemical Company, Inc., or the "Aurum" series from Mitsui Chemicals, Inc.
[0041] (Optical Modifier) The resin film for optical films according to this disclosure is characterized by containing a diacetal compound represented by formula (1). This diacetal compound functions as an optical modifier to adjust the optical properties of the film. According to this disclosure, by containing a diacetal compound of a specific structure, crystals or aggregate states exhibiting negative birefringence precipitate in a fibrous manner, and a resin film exhibiting negative birefringence is obtained.
[0042] (In the formula, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 These are identical or different, and each represents a hydrogen atom, a C1-C4 alkyl group, a C1-C4 alkoxy group, a C1-C4 alkoxycarbonyl group, a C1-C4 halogenated alkyl group, or a halogen atom, respectively. 7 (This represents a hydrogen atom, a C1-C4 alkyl group, a C1-C4 alkenyl group, a C1-C4 alkoxy group, a C1-C4 alkoxycarbonyl group, or a C1-C4 halogenated alkyl group.)
[0043] In a resin film for optical films, from the viewpoint of obtaining a function to precipitate and adjust the birefringence of the resin film, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 Each of these elements may be the same or different from the others, and is preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. 1 , R 2 and R 3 One of them may be a hydrogen atom, and the other two may be alkyl groups having 1 to 4 carbon atoms. Also, R 1 , R 2 and R 3 Two of these may be hydrogen atoms, and one may be an alkyl group having 1 to 4 carbon atoms. 4 , R 5 and R 6 One of them may be a hydrogen atom, and the other two may be alkyl groups having 1 to 4 carbon atoms. Also, R 4 , R 5 and R 6 Two of these may be hydrogen atoms, and one may be an alkyl group having 1 to 4 carbon atoms. 1 , R 2 , R 3 , R 4 , R 5 and R 6 All of these can be hydrogen atoms.
[0044] R 7 It is preferably a hydrogen atom, a C1-C4 alkyl group, or a C1-C4 alkenyl group, and more preferably a hydrogen atom or a C1-C4 alkyl group.
[0045] As shown in equation (1), R 7Specifically, compounds in which the atom is a hydrogen atom include: 1,3:2,4-bis-O-benzylidene-D-sorbitol, 1,3:2,4-bis-O-(o-methylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-methylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-methylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-ethylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-ethylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-ethylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-isopropylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-isopropylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-isopropylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-n-propylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-n-propylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-n-propylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-n-butylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-n-butylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-n-butylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-tert-butylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-tert-butylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-tert-butylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(2',3'-dimethylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(2',4'-dimethylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(2',5'-dimethylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(3',4'-dimethylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(3',5'-dimethylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(2',3'-Diethylbenzylidene)-D-sorbitol, 1,3:2,4-Bis-O-(2',4'-Diethylbenzylidene)-D-sorbitol, 1,3:2,4-Bis-O-(2',5'-Diethylbenzylidene)-D-sorbitol, 1,3:2,4-Bis-O-(3',4'-Diethylbenzylidene)-D-sorbitol, 1,3:2,4-Bis-O-(3',5'-Diethylbenzylidene)-D-sorbitol, 1,3:2,4-Bis-O-(2',4',5'-Trimethylbenzylidene)-D-sorbitol, 1,3:2,4-Bis-O-(3',4',5'-Trimethylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(2',4',5'-triethylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(3',4',5'-triethylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-methoxybenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-methoxybenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-methoxybenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-ethoxybenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-ethoxybenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-ethoxybenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-isopropoxybenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-isopropoxybenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-isopropoxybenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-n-propoxybenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-n-propoxybenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-n-propoxybenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-methoxycarbonylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-methoxycarbonylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-methoxycarbonylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-ethoxycarbonylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-ethoxycarbonylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-ethoxycarbonylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-isopropoxycarbonylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-isopropoxycarbonylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-isopropoxycarbonylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-n-propoxycarbonylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-n-propoxycarbonylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-n-propoxycarbonylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-fluorobenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-fluorobenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-fluorobenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-chlorobenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-chlorobenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-chlorobenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(o-bromobenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(m-bromobenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-bromobenzylidene)-D-sorbitol, 1,3-O-benzylidene-2,4-O-(p-methylbenzylidene)-D-sorbitol, 1,3-O-(p-methylbenzylidene)-2,4-O-benzylidene-D-sorbitol, 1,3-O-benzylidene-2,4-O-(p-ethylbenzylidene)-D-sorbitol, 1,3-O-(p-ethylbenzylidene)-2,4-O-benzylidene-D-sorbitol, 1,3-O-benzylidene-2,4-O-(p-chlorobenzylidene)-D-sorbitol, 1,3-O-(p-chlorobenzylidene)-2,4-O-benzylidene-D-sorbitol, 1,3-O-benzylidene-2,4-O-(2',4'-dimethylbenzylidene)-D-sorbitol, 1,3-O-(2',4'-dimethylbenzylidene)-2,4-O-benzylidene-D-sorbitol, 1,3-O-benzylidene-2,4-O-(3',4'-dimethylbenzylidene)-D-sorbitol, 1,3-O-(3',4'-dimethylbenzylidene)-2,4-O-benzylidene-D-sorbitol, 1,3-O-(p-methylbenzylidene)-2,4-O-(p-ethylbenzylidene)-D-sorbitol, 1,3-O-(p-ethylbenzylidene)-2,4-O-(p-methylbenzylidene)-D-sorbitol, 1,3-(p-methylbenzylidene)-2,4-O-(3',4'-dimethylbenzylidene)-D-sorbitol, 1,3-O-(3',4'-dimethylbenzylidene)-2,4-O-(p-methylbenzylidene)-D-sorbitol, 1,3-(p-ethylbenzylidene)-2,4-O-(3',4'-dimethylbenzylidene)-D-sorbitol, 1,3-O-(3',4'-dimethylbenzylidene)-2,4-O-(p-ethylbenzylidene)-D-sorbitol, 1,3-O-(p-methylbenzylidene)-2,4-O-(p-chlorobenzylidene)-D-sorbitol, Examples include 1,3-O-(p-chlorobenzylidene)-2,4-O-(p-methylbenzylidene)-D-sorbitol.
[0046] As shown in equation (1), R 7Specifically, compounds in which the group is a methyl group include: 1,3:2,4-bis-O-benzylidene-1-methylsorbitol, 1,3:2,4-bis-O-(p-methylbenzylidene)-1-methylsorbitol, 1,3:2,4-bis-O-(p-ethylbenzylidene)-1-methylsorbitol, 1,3:2,4-bis-O-(p-n-propylbenzylidene)-1-methylsorbitol, 1,3:2,4-bis-O-(2',3'-dimethylbenzylidene)-1-methylsorbitol, 1,3:2,4-bis-O-(2',4'-dimethylbenzylidene)-1-methylsorbitol, 1,3:2,4-bis-O-(2',5'-dimethylbenzylidene)-1-methylsorbitol 1,3:2,4-bis-O-(3',4'-dimethylbenzylidene)-1-methylsorbitol, 1,3:2,4-bis-O-(3',5'-dimethylbenzylidene)-1-methylsorbitol, 1,3:2,4-bis-O-(3'-methyl-4'-methoxybenzylidene)-1-methylsorbitol, 1,3:2,4-bis-O-(3',4'-dichlorobenzylidene)-1-methylsorbitol, 1,3:2,4-bis-O-(p-methoxycarbonylbenzylidene)-1-methylsorbitol, 1,3:2,4-bis-O-(3'-methyl-4'-fluorobenzylidene)-1-methylsorbitol Examples include 1,3:2,4-bis-O-(3'-bromo-4'-ethylbenzylidene)-1-methylsorbitol.
[0047] As shown in equation (1), R 7Specifically, compounds in which the group is an ethyl group include: 1,3:2,4-bis-O-benzylidene-1-ethylsorbitol, 1,3:2,4-bis-O-(p-methylbenzylidene)-1-ethylsorbitol, 1,3:2,4-bis-O-(p-ethylbenzylidene)-1-ethylsorbitol, 1,3:2,4-bis-O-(p-n-propylbenzylidene)-1-ethylsorbitol, 1,3:2,4-bis-O-(2',3'-dimethylbenzylidene)-1-ethylsorbitol, 1,3:2,4-bis-O-(2',4'-dimethylbenzylidene)-1-ethylsorbitol, 1,3:2,4-bis-O-(2',5'-dimethylbenzylidene)-1-ethylsorbitol 1,3:2,4-bis-O-(3',4'-dimethylbenzylidene)-1-ethylsorbitol, 1,3:2,4-bis-O-(3',5'-dimethylbenzylidene)-1-ethylsorbitol, 1,3:2,4-bis-O-(3'-methyl-4'-methoxybenzylidene)-1-ethylsorbitol, 1,3:2,4-bis-O-(3',4'-dichlorobenzylidene)-1-ethylsorbitol, 1,3:2,4-bis-O-(p-methoxycarbonylbenzylidene)-1-ethylsorbitol, 1,3:2,4-bis-O-(3'-methyl-4'-fluorobenzylidene)-1-ethylsorbitol Examples include 1,3:2,4-bis-O-(3'-bromo-4'-ethylbenzylidene)-1-ethylsorbitol.
[0048] As shown in equation (1), R 7Specifically, compounds in which the n-propyl group is present include: 1,3:2,4-bis-O-benzylidene-1-n-propylsorbitol, 1,3:2,4-bis-O-(p-methylbenzylidene)-1-n-propylsorbitol, 1,3:2,4-bis-O-(p-ethylbenzylidene)-1-n-propylsorbitol, 1,3:2,4-bis-O-(p-n-propylbenzylidene)-1-n-propylsorbitol, 1,3:2,4-bis-O-(2',3'-dimethylbenzylidene)-1-n-propylsorbitol, 1,3:2,4-bis-O-(2',4'-dimethylbenzylidene)-1-n-propylsorbitol, 1,3:2,4-bis-O-(2',5'-dimethylbenzylidene)-1-n-propylsorbitol 1,3:2,4-bis-O-(3',4'-dimethylbenzylidene)-1-n-propylsorbitol, 1,3:2,4-bis-O-(3',5'-dimethylbenzylidene)-1-n-propylsorbitol, 1,3:2,4-bis-O-(3'-methyl-4'-methoxybenzylidene)-1-n-propylsorbitol, 1,3:2,4-bis-O-(3',4'-dichlorobenzylidene)-1-n-propylsorbitol, 1,3:2,4-bis-O-(p-methoxycarbonylbenzylidene)-1-n-propylsorbitol, 1,3:2,4-bis-O-(3'-methyl-4'-fluorobenzylidene)-1-n-propylsorbitol Examples include 1,3:2,4-bis-O-(3'-bromo-4'-ethylbenzylidene)-1-n-propylsorbitol.
[0049] As shown in equation (1), R 7Specifically, compounds in which the group is an allyl group include: 1,3:2,4-bis-O-benzylidene-1-allylsorbitol, 1,3:2,4-bis-O-(p-methylbenzylidene)-1-allylsorbitol, 1,3:2,4-bis-O-(p-ethylbenzylidene)-1-allylsorbitol, 1,3:2,4-bis-O-(p-n-propylbenzylidene)-1-allylsorbitol, 1,3:2,4-bis-O-(2',3'-dimethylbenzylidene)-1-allylsorbitol, 1,3:2,4-bis-O-(2',4'-dimethylbenzylidene)-1-allylsorbitol, 1,3:2,4-bis-O-(2',5'-dimethylbenzylidene)-1-allylsorbitol 1,3:2,4-bis-O-(3',4'-dimethylbenzylidene)-1-allyl sorbitol, 1,3:2,4-bis-O-(3',5'-dimethylbenzylidene)-1-allyl sorbitol, 1,3:2,4-bis-O-(3'-methyl-4'-methoxybenzylidene)-1-allyl sorbitol, 1,3:2,4-bis-O-(3',4'-dichlorobenzylidene)-1-allyl sorbitol, 1,3:2,4-bis-O-(p-methoxycarbonylbenzylidene)-1-allyl sorbitol, 1,3:2,4-bis-O-(3'-methyl-4'-fluorobenzylidene)-1-allyl sorbitol, Examples include 1,3:2,4-bis-O-(3'-bromo-4'-ethylbenzylidene)-1-allylsorbitol.
[0050] As shown in equation (1), R 7Further examples of compounds in which the atom is a hydrogen atom include, specifically, bis-1,3:2,4-(4'-ethyl-2'-methylbenzylidene)sorbitol, bis-1,3:2,4-(4'-n-propyl-2'-methylbenzylidene)sorbitol, bis-1,3:2,4-(4'-isopropyl-2'-methylbenzylidene)sorbitol, bis-1,3:2,4-(4'-n-butyl-2'-methylbenzylidene)sorbitol, bis-1,3:2,4-(4'-isobutyl-2'-methylbenzylidene)sorbitol, bis-1,3:2,4-(4'-tert-butyl-2'-methylbenzylidene)sorbitol, Examples include bis-1,3:2,4-(4'-n-pentyl-2'-methylbenzylidene)sorbitol, bis-1,3:2,4-(4'-isopentyl-2'-methylbenzylidene)sorbitol, bis-1,3:2,4-(4'-neopentyl-2'-methylbenzylidene)sorbitol, bis-1,3:2,4-(4'-tertiarypentyl-2'-methylbenzylidene)sorbitol, and bis-1,3:2,4-(4'-secpentyl-2'-methylbenzylidene)sorbitol.
[0051] R 7 R may be any of a methyl group, an ethyl group, a propyl group, or a butyl group. For example, R 7 If is a methyl group, then the compounds represented by formula (1) can similarly be listed as 1-methylsorbitol having the benzylidene structure listed above. Instead of 1-methylsorbitol, 1-ethylsorbitol (R 7 (When it is an ethyl group), 1-n-propylsorbitol (R 7 (When it is an n-propyl group), 1-allylsorbitol (R 7 Compounds in which (the group is a 2-propenyl group) can be similarly listed. The resin film according to this disclosure may contain one or more of these compounds.
[0052] More preferably, the compound represented by formula (1) is 1,3:2,4-bis-O-benzylidene-D-sorbitol, 1,3:2,4-bis-O-(p-methylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-ethylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(3',4'-dimethylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-n-propylbenzylidene)-1-methylsorbitol, 1,3:2,4-bis-O-(p-n-propylbenzylidene)-1-ethylsorbitol, 1,3:2,4-bis-O-(p-n-propylbenzylidene)-1-ethylsorbitol, 1,3:2,4-bis-O-(p-n-propylbenzylidene) 1,3:2,4-bis-O-(p-n-propylbenzylidene)-1-n-propylsorbitol, 1,3:2,4-bis-O-(p-n-propylbenzylidene)-1-n-propylsorbitol and 1,3:2,4-bis-O-(p-n-propylbenzylidene)-1-allylsorbitol are more preferred, and 1,3:2,4-bis-O-benzylidene-D-sorbitol, 1,3:2,4-bis-O-(p-methylbenzylidene)-D-sorbitol, 1,3:2,4-bis-O-(p-ethylbenzylidene)-D-sorbitol and 1,3:2,4-bis-O-(p-n-propylbenzylidene)-1-n-propylsorbitol are even more preferred.
[0053] Diacetal compounds are commercially available, for example, as GELOL D, GELOL MD, GELOL DXR, Rika-I Just-100, Rika-I Just-200, Rika-I Just-300, and Milliken Corporation; Millad NX8000J, but the present invention is not limited to these examples.
[0054] (Resin Film) In the resin film according to this disclosure, the mass ratio of the optical modifier, which is a diacetal compound, to the amorphous resin is preferably 1% by mass or more, more preferably 5% by mass or more, from the viewpoint of allowing the optical modifier to exist in a crystalline or aggregated state and improving the dispersibility of the crystalline or aggregated diacetal compound, and preferably 20% by mass or less, more preferably 10% by mass or less, from the viewpoint of maintaining dispersibility and forming a film. At least a portion of the optical modifier contained in the resin film according to this disclosure precipitates in the film as crystals or in an aggregated state. The diacetal compound is typically in the form of fibrous crystals or aggregated states, and may include crystals with a high aspect ratio, such as needle-shaped crystals, columnar crystals, or plate-shaped crystals. The diacetal compound adjusts the birefringence in the negative direction.
[0055] The precipitation of diacetal compounds in the resin film can be confirmed, for example, by the following method. Specifically, as a pretreatment device, the resin film is cryopreserved (-125°C) using a cryomicrotome (with a diamond knife) in a Leica EM UC7 / FC7 frozen sectioning system (manufactured by Leica Microsystems) to produce ultrathin sections with a thickness of approximately 100 nm. The obtained sections are then processed using RuO2. 4 The section is exposed to a vapor atmosphere (room temperature) for 20 minutes to perform staining. The presence of precipitated diacetal compounds can be confirmed in images taken with a transmission electron microscope (TEM) of this stained section. For example, a field emission transmission electron microscope (FE-TEM) JEM-F200 (manufactured by JEOL Ltd.) can be used as the TEM, and imaging can be performed under conditions of an acceleration voltage of 200 kV. Note that the equipment and conditions used are examples and are not limited thereto. In the resin film according to this disclosure, in the TEM image, there may be multiple crystals or aggregated states of the diacetal compound in the form of elongated fibers, which are positioned in unspecified directions and intersect to form a network (mesh). Alternatively, the crystals or aggregated states of the diacetal compound may be oriented in the direction of flow. The precipitation of crystals or aggregated states in the film can also be confirmed by measuring the viscoelasticity of the film using a rheometer.
[0056] The transparency of the resin film according to this disclosure is measured by a haze meter. Preferably, the haze value of the resin film according to this disclosure is 0.5 or less for a resin film with a thickness of 80 μm, and more preferably, the haze value of the resin film according to this disclosure is 0.2 or less for a resin film with a thickness of 40 μm. When the haze value is within this range, the resin film can be evaluated as transparent, and the resin film according to this disclosure can be applied to applications where transparency is required.
[0057] The thickness of the resin film according to this disclosure can be appropriately selected depending on the application and is not particularly limited, but as an example, it may be about 5 to 500 μm, and preferably about 10 to 200 μm. The resin film according to this disclosure has high transparency even in relatively thick films of about 100 μm (0.1 mm).
[0058] The resin film according to this disclosure may have controlled wavelength dispersibility. For example, the resin film according to this disclosure may have reduced wavelength dispersibility compared to a similar resin film that does not contain optical modifiers. In this case, the resin film according to this disclosure can be suitably used in applications where wavelength dispersibility is not required.
[0059] Furthermore, the resin film according to this disclosure may have wavelength dispersibility equivalent to that of a similar resin film that does not contain an optical modifier. That is, it is preferable that the wavelength dispersibility of the base resin does not change even when an optical modifier is added. This is useful when it is desired to use a film in which the birefringence is adjusted in the negative direction while maintaining the wavelength dispersibility of the base resin film. Such a film can be used, for example, as a display film (more specifically, for example, a display film for VR / AR, a foldable display film, a rollable display film), etc.
[0060] Furthermore, the resin film according to this disclosure may have the opposite wavelength dispersion compared to a similar resin film that does not contain an optical modifier. That is, a resin film without an optical modifier may have wavelength dispersion (a property in which birefringence decreases from the short wavelength side to the high wavelength side), while a film to which an optical modifier is added may have inverse wavelength dispersion (a property in which birefringence increases from the short wavelength side to the high wavelength side). In this case, the resin film according to this disclosure can be suitably used, for example, in applications such as phase difference films.
[0061] The resin film relating to this disclosure may, insofar as it exhibits the effects relating to this disclosure, contain additives such as stabilizers, antioxidants, ultraviolet absorbers, antistatic agents, foaming agents, lubricants, fillers, colorants, and plasticizers, as needed, in addition to amorphous resins and optical modifiers (diacetal compounds).
[0062] The resin film of the present invention exhibits negative birefringence and transparency, making it suitable for use as an optical film, such as a polarizing plate protective film or phase difference film used in liquid crystal displays. This film can be applied to advanced displays such as organic EL and 3D displays, as well as pickup lenses.
[0063] (Method for manufacturing a resin film) The resin film according to this disclosure is obtained by mixing an amorphous resin and an optical modifier, heating the mixture to a first temperature which is above the softening temperature of the amorphous resin and below the decomposition temperature of the amorphous resin, and molding the resulting mixture in a specific manner. The manufacturing method includes the steps of: obtaining a resin composition by heating and mixing an amorphous resin having negative birefringence and a diacetal compound represented by formula (1) at a temperature above the softening point of the amorphous resin to dissolve the diacetal compound in the amorphous resin; molding the resin composition into a film; heating the resin composition at a temperature above the glass transition point of the amorphous resin and molding it while applying shear force in a molten state; and cooling while applying shear force.
[0064] In the process of obtaining the resin composition, the amorphous resin and the optical modifier may be mixed and then heated to a temperature above the softening temperature of the amorphous resin and below the decomposition temperature of the amorphous resin. Alternatively, the amorphous resin may be heated to the aforementioned temperature range and then mixed with the optical modifier. The latter method is preferred from the viewpoint of precipitating crystals or aggregated states in the resin film and obtaining a uniform film.
[0065] A mixture of amorphous resin and optical modifier is heated to a temperature above the softening temperature of the amorphous resin in order to dissolve the optical modifier in the molten amorphous resin. The softened amorphous resin then acts as a solvent for the optical modifier. That is, in the molten state, the optical modifier is considered to be dissolved in the amorphous resin. It is preferable to uniformly disperse the optical modifier in this molten mixture in the amorphous resin by known means such as stirring and kneading. Alternatively, the mixing of the amorphous resin and optical modifier may be carried out by solvent mixing (solution casting method).
[0066] The manufacturing method according to this disclosure includes a step of molding the resin composition while applying a shear force at a temperature above the glass transition temperature of the amorphous resin. Before or after this step, the resin composition may be temporarily molded into a film form by pressing, extrusion molding, injection molding, etc.
[0067] The resin composition can be molded into a film by, for example, extruding the obtained resin composition and then cooling it. The molding can be carried out by a general method for manufacturing composite materials made of thermoplastic resins, and is not particularly limited. Examples of manufacturing equipment include single-screw extruders, twin-screw extruders, Banbury mixers, and roll kneaders.
[0068] Next, the obtained resin composition (which may be molded) is heated to a temperature above the glass transition temperature of the amorphous resin, and molded while applying a shear force to the resin composition in a molten state. The shear force is not limited as long as the effects of this disclosure are obtained, but for example, when the thickness of the resin composition before molding is 500 μm, the shear force can be applied at a temperature of about 150 to 230°C. The shear rate is also not limited as long as the effects of this disclosure are obtained, but for example, 0.01 to 1000 s -1 It may be to a certain extent. In the manufacturing method according to this disclosure, the resin composition is molded by applying a shear force while heated to a temperature above its glass transition temperature, so that the diacetal compound is oriented in a form having negative birefringence and precipitates from the substrate resin.
[0069] Next, cooling is performed while applying a shear force. Cooling under shear force causes the diacetal compound to orient itself into a fibrous structure, and the diacetal compound precipitates in the film.
[0070] Next, the present invention will be described in more detail based on examples, but the present invention is not limited to such examples.
[0071] [Example 1] The weight ratio of polystyrene resin (PS, CR-2500, manufactured by DIC Corporation, glass transition temperature approximately 98°C) and 1,3:2,4-bis-O-(4-methylbenzylidene)-D-sorbitol (BMDS, manufactured by Shin Nippon Rika Co., Ltd.) was adjusted to 95:5, and the mixture was kneaded using an internal mixer (Laboplastmill, model 10S100, manufactured by Toyo Seiki Seisakusho Co., Ltd.). First, the raw materials were added at 230°C and 5 rpm for 5 minutes, and then kneaded at the same temperature at 30 rpm for 5 minutes to obtain the resin composition. The polystyrene resin was vacuum dried at 60°C for 4 hours before kneading. The glass transition temperature of the polystyrene resin was determined by dynamic viscoelasticity measurement to find E'' (loss modulus of elasticity), and the peak of this value was taken as the glass transition temperature.
[0072] The obtained resin composition was pressed at 260°C and 1 MPa for 3 minutes using a manual hydraulic heating press (model IMS-481E, manufactured by Imoto Seisakusho Co., Ltd.), followed by pressing at 20 MPa for 3 minutes. Next, it was cooled at 25°C for 2 minutes to obtain a film with a thickness of approximately 500 μm. The obtained film was evaluated as follows.
[0073] <Measurement and calculation of birefringence using a polarizing microscope> The obtained film was placed on a hot stage with a shearing function attached to the polarizing microscope and heated to 240°C. Subsequently, it was heated for 1 to 30 seconds. -1 The temperature was lowered to 200°C at a rate of 10°C / min while applying shear, and during this time, the light transmittance (DLI) was measured using a cross polarizer system. A color filter was installed in the photodetector. The gap between the parallel disks was set to 500 μm. Using the DLI obtained from the measurement, the birefringence Δn was calculated according to the following formula. (DLI: light transmittance [%], I 0 : Light transmittance in an orthogonal polarizer system [-], I / / : Light transmittance in a parallel polarizer system [-], π: Pi, Γ: Phase difference [nm], λ 0 Wavelength: 633 nm, Light source: White light, d: Gap during measurement [nm], Δn: Birefringence [-]) The sign of Δn was determined by inserting a quarter-wave plate into the polarizing microscope after measuring birefringence with a polarizing microscope. x >n y In this case, birefringence is considered "positive", n x <n y In this case, the birefringence was set to "negative". This measurement simulates the "step of heating the resin composition and molding it while applying shear force in a molten state" in the film manufacturing method of this disclosure.
[0074] <Measurement of Shear Stress> The shear stress shown in [Table 1] and [Table 3] was measured using a rheometer (Anton Paar, model 302e). Parallel plates were used, with a gap of 1 mm between the plates. In steady flow measurements, the shear stress was measured at 200°C and a shear rate of 1 to 30 s. -1It was measured at [Table 2]. The measurement of the shear stress shown in [Table 2] was carried out using a capillary rheometer (manufactured by Nippon Seiki Co., Ltd., model RH-7) with a cylindrical die having L / D = 16 / 1 (mm).
[0075] <Calculation of stress optical coefficient> The stress optical coefficient (C R ) was calculated using the following formula with the birefringence Δn calculated by a polarizing microscope and the shear stress (σ) calculated by a rheometer. C R [×10 -9 Pa -1 ] = Δn [×10 4 ] / σ [Pa]
[0076] <Confirmation of precipitation> Since the viscoelastic properties are different between the film in which the diacetal compound is precipitated in a crystalline or associated state and the film in which the diacetal compound exists without being in a crystalline or associated state, precipitation was confirmed using a rheometer (manufactured by Anton Paar GmbH, model 302e). Using parallel plates, the gap between the plates was set to 1 mm, and the measurement was carried out at 200 °C in the frequency dependence measurement. The obtained results were plotted with the angular frequency (log ω) on the horizontal axis and the storage modulus (log G') on the vertical axis, and the slope was calculated from the value of log G' when the range of log ω was from 0 to -1 (log G' / log ω). When the ratio of log G' / log ω of the film containing the diacetal compound to log G' / log ω of the film consisting only of the base resin (shown as "log G' / log ω ratio" in the table) was 0.8 or less, the precipitation was marked as ○.
[0077] [Example 2] A resin composition was obtained in the same manner as in Example 1, except that the ratio of polystyrene resin (CR-2500, manufactured by DIC Corporation) and 1,3:2,4-bis-O-(p-methylbenzylidene)-D-sorbitol (BMDS, manufactured by Shin Nippon Rika Co., Ltd.) was 90:10. The obtained resin composition was pressed at 280 °C and 1 MPa for 3 minutes using a manual hydraulic heating press machine (model IMS-481E, manufactured by Imoto Seisakusho Co., Ltd.), and then pressed at 20 MPa for 3 minutes. Then, it was cooled at 25 °C for 2 minutes to obtain a film with a thickness of about 500 μm. The obtained film was evaluated in the same manner as in Example 1.
[0078] [Example 3] A resin composition was obtained in the same manner as in Example 1, except that 1,3:2,4-bis-O-(3,4-dimethylbenzylidene)-D-sorbitol (BDMDS, manufactured by Shin Nippon Rika Co., Ltd.) was used as the diacetal compound. The obtained resin composition was pressed at 260°C and 1 MPa for 3 minutes, then at 20 MPa for 3 minutes, and cooled at 25°C for 2 minutes to obtain a film with a thickness of approximately 500 μm. The obtained film was evaluated in the same manner as in Example 1.
[0079] [Example 4] A resin composition was obtained in the same manner as in Example 2, except that 1,3:2,4-bis-O-(3,4-dimethylbenzylidene)-D-sorbitol (BDMDS, manufactured by Shin Nippon Rika Co., Ltd.) was used as the diacetal compound. The obtained resin composition was pressed at 280°C and 1 MPa for 3 minutes, then at 20 MPa for 3 minutes, and cooled at 25°C for 2 minutes to obtain a film with a thickness of approximately 500 μm. Frozen sections were prepared from the obtained film using the method described above, and TEM observation was performed. The TEM images are shown in [Figure 1]. The obtained film was evaluated in the same manner as in Example 1.
[0080] [Comparative Example 1] Without mixing in a diacetal compound, polystyrene resin was heated and kneaded in the same manner as in Example 1 to obtain a resin composition. The obtained resin composition was pressed at 260°C and 1 MPa for 3 minutes, then at 20 MPa for 3 minutes, and cooled at 25°C for 2 minutes to obtain a film with a thickness of approximately 500 μm.
[0081] The configurations and evaluation results of Examples 1 to 4 and Comparative Example 1 are summarized in [Table 1]. The evaluation criteria for ○ (good) and ◎ (excellent) were as follows: ○ (good): Δn value less than -0.6 and stress optical coefficient of -5.0 or higher. ◎ (excellent): Δn value of -5.0 or lower and stress optical coefficient of -10 or lower.
[0082]
[0083] As shown in Table 1, in Examples 1 to 4, Δn increased in the negative direction compared to Comparative Example 1. Similarly, the stress optical coefficient also increased in Examples 1 to 4 in the negative direction compared to Comparative Example 1. It was confirmed that diacetal compounds precipitated in all films of Examples 1 to 4. All films exhibited negative birefringence, confirming that the diacetal compounds adjusted the birefringence in the negative direction. Comparing Examples 1, 2, 3, and 4, increasing the concentration of the diacetal compound from 5% to 10% reliably increased Δn in the negative direction. The stress optical coefficient also reliably increased in the negative direction.
[0084] [Example 5] The weight ratio of polystyrene resin (CR-2500, manufactured by DIC Corporation) to 1,3:2,4-bis-O-benzylidene-D-sorbitol (BDS, manufactured by Shin Nippon Rika Co., Ltd.) was adjusted to 90:10, and a resin composition was prepared in the same manner as in Example 1. The obtained resin composition was pressed at 240°C and 1 MPa for 3 minutes, and then at 20 MPa for 3 minutes using a manual hydraulic heating press (model IMS-481E, manufactured by Imoto Seisakusho Co., Ltd.). Next, it was cooled at 25°C for 2 minutes to obtain a film with a thickness of approximately 500 μm.
[0085] The obtained films were subjected to precipitation confirmation, birefringence measurement using a polarizing microscope, and shear stress measurement. However, birefringence and stress measurements were performed at 160°C. The stress optical coefficient was calculated based on the obtained values. To confirm precipitation, frozen sections of the resin film were prepared using the method described above after the birefringence measurement using a polarizing microscope, and TEM observation was performed. The TEM images are shown in [Figure 2]. As shown in [Figure 2], it was confirmed that diacetal compounds precipitated in the film and were oriented in the direction of flow.
[0086] [Comparative Example 2] A film was prepared in the same manner as in Comparative Example 1, and evaluated in the same manner as in Example 5.
[0087] The configurations and evaluation results for Example 5 and Comparative Example 2 are summarized in [Table 2]. The evaluation criteria for ○ (good) and ◎ (excellent) were as follows: ○ (good): Δn value less than -0.6 and stress optical coefficient of -5.0 or higher. ◎ (excellent): Δn value of -5.0 or lower and stress optical coefficient of -10 or lower.
[0088]
[0089] As shown in Table 2, a film containing 1,3:2,4-bis-O-benzylidene-D-sorbitol as the diacetal compound was obtained, in which the diacetal compound precipitated in a fibrous manner. Furthermore, this film exhibited negative birefringence, and Δn increased to the negative side compared to Comparative Example 2. It was confirmed that the diacetal compound in the film adjusted the birefringence in the negative direction. In addition, the stress optical coefficient also increased to the negative side compared to Comparative Example 2.
[0090] <Measurement and Calculation of Wavelength Dispersion> Test specimens were obtained by cutting each of the films from Example 5 and Comparative Example 2 into 10 x 20 mm strips. The temperature was set to obtain a logE' (Pa) value of 8.5 (Pa) by dynamic viscoelasticity measurement. The test specimens were placed on a tensile machine (model DVE-3 S1000; manufactured by UBM Corporation), with an initial distance between clamps of 10 mm, and measured for 0.05 s. -1 The film was stretched at a strain rate of 1.5 times. The film, stretched to 1.5 times its original size, was immediately quenched by blowing cold air to obtain a test specimen for wavelength dispersion measurement. Wavelength dispersion was measured using a phase difference measuring device (model KOBRA-WPR, manufactured by Oji Instruments Co., Ltd.). The phase differences (R449.9nm, R498.0nm, R548.0nm, R588.8nm, R628.8nm, R751.0nm) were measured at each measurement wavelength (449.9nm, 498.0nm, 548.0nm, R588.8nm, R628.8nm, R751.0nm). The birefringence (Δn) at each wavelength was calculated by dividing the phase difference measured at each wavelength by the thickness of the stretched film. The birefringence (Δn) at each wavelength and the birefringence (Δn) at wavelength 588.8nm were calculated. 588.8nm ) and the ratio (Δn / Δn 588.8nm ) was calculated.
[0091] The measurement results for wavelength dispersibility in Example 5 and Comparative Example 2 are summarized in [Table 3].
[0092]
[0093] As shown in Table 3, the film of Example 5 did not exhibit wavelength dispersibility, whereas the film of Comparative Example 2 did. In other words, by adding an optical modifier to Comparative Example 2, which is composed solely of polystyrene resin, it was possible to reduce (eliminate) the wavelength dispersibility.
[0094] [Example 6] Polymethyl methacrylate resin (PMMA, Acrypet VH, manufactured by Mitsubishi Chemical Corporation, glass transition temperature approximately 117°C) and 1,3:2,4-bis-O-(3,4-dimethylbenzylidene)-D-sorbitol (BDMDS, manufactured by Shin Nippon Rika Co., Ltd.) were mixed in a weight ratio of 90:10, and the mixture was kneaded using an internal mixer (Laboplastmill Model 10S100, manufactured by Toyo Seiki Seisakusho Co., Ltd.). First, the raw materials were added at 200°C and 3 rpm for 5 minutes, and then kneaded at the same temperature at 30 rpm for 3 minutes to obtain the resin composition. Vacuum drying was performed at 60°C for 3 hours before kneading. The glass transition temperature of the polymethyl methacrylate resin was determined by dynamic viscoelasticity measurement to find E'' (loss modulus of elasticity), and the peak of this value was taken as the glass transition temperature. The obtained resin composition was pressed at 260°C and 1 MPa for 3 minutes using a manual hydraulic heating press (model IMS-481E, manufactured by Imoto Seisakusho Co., Ltd.), followed by pressing at 20 MPa for 3 minutes. It was then cooled at 25°C for 2 minutes to obtain a film with a thickness of approximately 500 μm.
[0095] [Comparative Example 3] Without mixing in a diacetal compound, the polymethyl methacrylate resin was heated and kneaded in the same manner as in Example 6 to obtain a resin composition. A film with a thickness of 500 μm was prepared in the same manner as in Example 6.
[0096] [Comparative Example 4] A 500 μm thick film was prepared in the same manner as in Example 6, except that the weight ratio of polymethyl methacrylate resin to 1,3:2,4-bis-O-(3,4-dimethylbenzylidene)-D-sorbitol was set to 95:5.
[0097] The obtained films were subjected to precipitation confirmation, birefringence measurement using a polarizing microscope, and shear stress measurement. However, birefringence and stress measurements were performed at 180°C. The stress optical coefficient was calculated based on the obtained values.
[0098] Table 4 summarizes the composition and evaluation results of Example 6 and Comparative Examples 3-4. The evaluation criteria for ○ (good) and × (bad) were as follows: ○ (good): Δn value is -0.2 or less and stress optical coefficient is -0.2 or less. × (bad): No difference from the example without diacetal addition.
[0099]
[0100] As shown in Table 4, Example 6 contained 1,3:2,4-bis-O-(3,4-dimethylbenzylidene)-D-sorbitol as the diacetal compound, and a film with precipitated diacetal compound was obtained. In contrast, Comparative Example 4 contained the same diacetal compound, but the film did not contain any crystals or associated states. Comparative Example 4 had optical properties equivalent to Comparative Example 3, which did not contain a diacetal compound. In contrast, the film of Example 6 showed negative birefringence, and Δn increased to the negative side compared to Comparative Example 3. The stress optical coefficient also increased to the negative side compared to Comparative Example 3. From these results, it was considered that the diacetal compound precipitated in the film has the function of adjusting birefringence in the negative direction.
[0101] The wavelength dispersibility of the films of Example 6 and Comparative Example 3 was measured using the method described above. The measurement results for wavelength dispersibility are summarized in [Table 5].
[0102]
[0103] As shown in Table 5, the film of Example 6 exhibited wavelength dispersibility, and its wavelength dispersibility was equivalent to that of Comparative Example 3, which was composed solely of polymethyl methacrylate resin. In other words, the presence or absence of an optical modifier did not change the wavelength dispersibility.
[0104] The embodiments disclosed herein should be understood to be illustrative in all respects and not restrictive in any way. The scope of the present invention is defined by the claims and is intended to include all modifications in the sense and scope equivalent to the claims.
Claims
1. A resin film for optical films containing an amorphous resin having negative birefringence and a diacetal compound represented by formula (1), wherein the diacetal compound precipitates in the film as a crystalline or aggregated state exhibiting negative birefringence, and exhibits negative birefringence. (In the formula, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 These are identical or different, and each represents a hydrogen atom, a C1-C4 alkyl group, a C1-C4 alkoxy group, a C1-C4 alkoxycarbonyl group, a C1-C4 halogenated alkyl group, or a halogen atom, respectively. 7 (This represents a hydrogen atom, a C1-C4 alkyl group, a C1-C4 alkenyl group, a C1-C4 alkoxy group, a C1-C4 alkoxycarbonyl group, or a C1-C4 halogenated alkyl group.) 2. The resin film for optical films according to claim 1, wherein the diacetal compound is contained in an amount of 1% by mass or more and 20% by mass or less relative to the amorphous resin.
3. The resin film for optical films according to claim 1 or claim 2, wherein the amorphous resin is one or more selected from the group consisting of polystyrene resin and polymethyl methacrylate resin.
4. A step of obtaining a resin composition by heating and mixing an amorphous resin having negative birefringence and a diacetal compound represented by the formula (1) at a temperature not lower than the softening point of the amorphous resin to dissolve the diacetal compound in the amorphous resin; a step of heating the resin composition and molding it while applying a shearing force to make it in a molten state; and a step of cooling while continuously applying a shearing force from the molding step. A method for producing a resin film for an optical film, which includes these steps. (In the formula, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 are the same or different and each represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an alkoxycarbonyl group having 1 to 4 carbon atoms, a halogenated alkyl group having 1 to 4 carbon atoms or a halogen atom. R 7 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkenyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an alkoxycarbonyl group having 1 to 4 carbon atoms or a halogenated alkyl group having 1 to 4 carbon atoms.) 5. The method for producing a resin film for optical films according to claim 4, wherein the diacetal compound precipitates in the resin film for optical films as a crystal or aggregated state and is oriented in the flow direction, and the diacetal compound adjusts the birefringence in the negative direction.
Citation Information
Patent Citations
Methacrylic ester-based resin composition
JP2010254730A
Biodegradable resin compositions and molded objects thereof
WO2006064846A1