Picker control system of handler for testing electronic components, and picker assembly

Abstract

The present invention relates to a picker control system of a handler for testing electronic components, and a picker hand. According to the present invention, when lowering a picker, the picker is controlled to descend at a preset speed when in a first descent section, and descend while maintaining a preset pressure when in a second descent section lower than the first descent section. In the event of a power outage, a return mechanism automatically disconnects the picker from the electronic components. Applying the present invention has the effect of preventing damage to the electronic components by means of the picker.

Description

Picker control system and picker assembly for electronic component test handler

[0001] The present invention relates to a handler that supports testing of an electronic component by electrically connecting the electronic component and a tester, and in particular to a picker capable of gripping or releasing an electronic component.

[0002] An electronic component test handler is equipment that handles electronic components to electrically connect them to a tester.

[0003] As the integration density of electronic components, such as semiconductor devices, continues to increase, the line width of circuits is becoming increasingly narrow. Consequently, greater precision is required when connecting electronic components to testers.

[0004] Previously, it was possible to make a proper electrical connection between electronic components and testers with an error range of 20㎛, but now, an error range of 10㎛ or less, or even a few㎛, is required.

[0005] Meanwhile, among electronic components, there are dies that are separated into individual units from the wafer state.

[0006] The die can be completed as a final product by undergoing a packaging process or by stacking it for HBM (High Bandwidth Memory) production and then undergoing a packaging process.

[0007] To perform post-die operations, testing of the die is required.

[0008] Electronic components in die form can be tested by electrically connecting contact pads to a tester.

[0009] Until now, automated testing capable of adequately supporting the testing of electronic components in the dyna HBM state has not been proposed. This is because the dies have fine gaps between contact pads, making precise contact difficult, and are very thin, so they can easily break or shatter.

[0010] Accordingly, the applicant has proposed Korean published patent No. 10-2021-0088373 (hereinafter referred to as the 'prior art').

[0011] The prior art proposes a technique for aligning the positions of electronic components by repositioning them before connecting them to a tester.

[0012] The prior art scans an electronic component on a test table (named a 'chuck' in the prior art) with a camera to determine its current position and readjusts the position of the electronic component to reduce the error range.

[0013] According to the prior art, the precise positioning of electronic components enables automated testing of electronic components at the die level.

[0014] Meanwhile, HBM has a structure in which multiple dies are stacked.

[0015] If even just one of the multiple stacked dies is defective, the produced HBM becomes a defective product.

[0016] The die is very thin and can easily break or be damaged.

[0017] If a defect occurs due to die damage, it creates the inconvenience of having to trace the cause of the defect back to the production line where the die was manufactured.

[0018] Therefore, the handler must handle the die with great precision to prevent damage.

[0019] The handler has a picker for gripping or releasing electronic components for moving electronic components, etc.

[0020] For the picker to grasp an electronic component (ED), the picker and the electronic component must inevitably come into contact.

[0021] Even if manufactured electronic components (ED) have the same specifications, there may be height differences due to tolerances.

[0022] There may also be height differences depending on the flatness or tolerance of the location where the electronic components (ED) are placed.

[0023] As the picker comes into contact with the electronic component, a pressurizing force is generated, which can, in some cases, damage the electronic component.

[0024] However, if the picker is operated very slowly and carefully, the processing speed slows down, resulting in a very low processing capacity for the electronic component test handler.

[0025] [Prior Art Literature]

[0026] [Patent Literature]

[0027] Republic of Korea Published Patent No. 10-2021-0088373

[0028] It is necessary for the picker to quickly contact the electronic component while minimizing contact shock to the electronic component, and it is also necessary to disconnect the contact between the picker and the electronic component in the event of a power outage.

[0029] A picker control system for a handler for testing electronic components according to the present invention comprises: a picker that grips or releases electronic components using vacuum pressure; a lifting motor that raises the picker; and a controller that controls the lifting motor. The controller controls the lifting motor such that when lowering the picker, the picker descends at a preset speed (hereinafter referred to as "set speed") in a first descending section, and descends while maintaining a preset pressure (hereinafter referred to as "set pressure") in a second descending section that is lower than the first descending section.

[0030] The above controller controls the lifting motor so that the picker descends at the set speed even in the second descending section.

[0031] The above controller controls the lifting motor such that the set pressure is smaller than the pressure of the picker in the first lowering section.

[0032] The above controller controls the lifting motor so that when moving an electronic component by the picker hand, the picker is lowered by a set lowering distance (hereinafter referred to as 'set distance'), and the set distance is shorter than the first lowering section.

[0033] The above first descent section is longer than the above second descent section.

[0034] The above picker hand further includes a return mechanism that applies a return force to raise the picker when the picker has descended.

[0035] The above return mechanism includes: a cylindrical cylinder; a piston that moves up and down within the cylinder; a spring that applies an upward elastic force to the piston; and a coupling device, one end of which is coupled to the piston and the other end of which is coupled to the picker, thereby enabling the picker to rise in conjunction with the rise of the piston.

[0036] A picker assembly of a handler for testing electronic components according to the present invention comprises: a picker that grips or releases electronic components by vacuum pressure; a lifting motor that raises the picker; and a return mechanism that applies a return force to raise the picker when the picker has lowered.

[0037] The above return mechanism includes: a cylindrical cylinder; a piston that moves up and down within the cylinder; a spring that applies an upward elastic force to the piston; and a coupling device, one end of which is coupled to the piston and the other end of which is coupled to the picker, thereby enabling the picker to rise in conjunction with the rise of the piston.

[0038] According to the present invention, the following effects are achieved.

[0039] First, the picker can quickly contact the electronic components, ensuring processing capacity while minimizing contact shock to the components, thereby preventing damage to the electronic components.

[0040] Second, in the event of a power outage, the contact between the picker and the electronic component is automatically released, thereby preventing damage to the electronic component caused by maintaining contact between the picker and the electronic component.

[0041] FIG. 1 is a conceptual plan view of a handler for testing electronic components to which the present invention can be applied.

[0042] FIGS. 2 to 11 are reference diagrams for explaining the electronic component test handler of FIG. 1.

[0043] FIGS. 12 to 14 are reference drawings for explaining a picker assembly and a picker control system according to the present invention.

[0044] Preferred embodiments according to the present invention are described with reference to the attached drawings, provided that for the sake of brevity, descriptions of well-known or redundant components are omitted or compressed as much as possible.

[0045] <Description of Handlers for Electronic Component Testing>

[0046] FIG. 1 is a conceptual plan view of an electronic component test handler (TH, hereinafter abbreviated as 'handler') according to the present invention.

[0047] The handler (TH) according to the present invention may be divided into a loading section (LU), a relocation section (RP), a connecting section (CP), and a moving section (MP), and includes a transport shuttle (100), a first picker hand (210), a second picker hand (310), a test table (300), a vacuum device (400), a relocation mechanism (500), a moving mechanism (600), and a controller (800).

[0048] The unloading unit (LU) supplies electronic components (ED) to be tested or retrieves electronic components (ED) that have completed testing.

[0049] In the relocation section (RP), the positions of the electronic components (ED) to be tested, supplied from the unloading section (LU), are precisely relocated.

[0050] In the connection section (CP), electronic components (ED) whose positions have been precisely relocated in the relocation section (RP) are electrically connected to the tester.

[0051] In the moving section (MF), electronic components (ED) can be moved to exchange electronic components (ED) between the unloading section (LU) and the relocation section (RP).

[0052] The moving section (MF) moves electronic components (ED) to be tested from the unloading section (LU) to the relocation section (RP), and moves electronic components (ED) that have completed testing from the relocation section (RP) to the unloading section (LU).

[0053] A transport shuttle (100) for carrying electronic components (ED) is installed in the moving part (MP).

[0054] When viewed in a planar view, the transport shuttle (100) of the moving part (MP) has a portion of one side (the right side in the drawing) overlapping with the unloading part (LU).

[0055] A transport shuttle (100) is provided to transport electronic components (ED) between the unloading section (LU) and the relocation section (RP).

[0056] The transport shuttle (100) has a movable transport table (110).

[0057] The transport shuttle (100) may have at least one transport table (110).

[0058] The transport table (110) can move back and forth in one direction.

[0059] The transport table (110) can move back and forth in the X-axis direction.

[0060] In the case where there are multiple transport tables (100), the multiple transport tables (110) may be provided in parallel in the Y-axis direction. In this case, the multiple transport tables (110) need to be implemented to move back and forth in the X-axis direction independently of each other.

[0061] The transport table (110) can move between the first area (A1) on the side overlapping with the unloading section (LU) and the second area (A2) on the side of the relocation section (RP).

[0062] Electronic components (ED) can be loaded onto the transport table (110).

[0063] The transport table (110) has a vacuum structure that fixes an electronic component (ED) placed on a flat surface by vacuum pressure.

[0064] As shown in the schematic plan view of FIG. 2, the transport table (110) has vacuum holes (VH) and vacuum grooves (VG) formed therein for vacuum-adsorbing electronic components (ED).

[0065] One vacuum hole (VH) and one vacuum groove (VG) form a pair.

[0066] When viewed in a planar view, the vacuum hole (VH) is positioned near the center of the area occupied by the vacuum groove (VG).

[0067] The vacuum pressure coming through the vacuum hole (VH) is evenly distributed through the vacuum groove (VG) and acts on the electronic component (ED).

[0068] Since the electronic component (ED) can be fixed to the transport table (110) by vacuum pressure, no movement of the electronic component (ED) occurs during the process of moving in the X-axis direction while being carried on the transport table (110).

[0069] The vacuum holes (VH) and vacuum grooves (VG) can be arranged in a 2x8 matrix form.

[0070] Since the loading capacity of the transport table (110) can be increased or decreased, the number of vacuum holes (VH) and vacuum grooves (VG) can also be increased or decreased.

[0071] In the unloading section (LU), electronic components (ED) are supplied to the handler (TH) or electronic components (ED) are recovered from the handler (TH).

[0072] Electronic components (ED) to be tested are supplied to the handler (TH) through the unloading section (LU), and electronic components (ED) that have completed testing are recovered from the handler (TH) through the unloading section (LU).

[0073] Electronic components (ED) can be loaded onto a Jetec Tray, Ring Frame, Ring Tray, or other types of customer tray and supplied to or retrieved from the handler (TH).

[0074] The structure of the loading / unloading section (LU) may vary depending on the type of customer tray.

[0075] Electronic components (ED) to be tested in the unloading section (LU) are loaded onto a transport table (110) in the first area (A1), and electronic components (ED) that have completed testing and are loaded onto the transport table (110) in the first area (A1) are unloaded from the transport table (110). To this end, a first picker hand (210) is provided in the unloading section (LU).

[0076] The first picker hand (210) is provided to load electronic components (ED) onto a transport table (110) or to unload them from a transport table (110).

[0077] For unloading operations by the first picker hand (210), the transport table (110) must be moved toward the unloading section (LU) and be in the first area (A1).

[0078] The first picker hand (210) loads electronic components (ED) to be tested onto a transport table (110) in the first area (A1) or unloads electronic components (ED) that have been tested from the transport table (110) in the first area (A1).

[0079] The first picker hand (210) may have one or more pickers capable of gripping or releasing an electronic component (ED). The picker may grip the electronic component (ED) by vacuum pressure.

[0080] Preferably, four pickers can be installed in pairs on the first picker hand (210) to improve processing capacity.

[0081] For example, as shown in the conceptual diagram of FIG. 3, the first picker hand (210) may have four pickers (P) arranged in a 2x2 matrix form.

[0082] Depending on the embodiment, the number of pickers (P) provided in the first picker hand (210) may be increased or decreased.

[0083] The first picker hand (210) can pick up four electronic components (ED) at once, but since the positions of the electronic components (ED) may vary, it is preferable to implement the pickers (P) to pick up one electronic component (ED) at a time sequentially through individual lifting movements.

[0084] In the relocation section (RP), electronic components (ED) to be tested are unloaded from the transport table (110) and loaded onto the test table (300), and the electronic components (ED) loaded onto the test table (300) are relocated.

[0085] In the relocation section (RP), a relocation space (RS) is formed for the relocation of electronic components (ED).

[0086] According to the present embodiment, the relocation portion (RP) is positioned on one side of the connection portion (CP) in the X-axis direction.

[0087] The repositioning part (RP) is equipped with a second picker hand (310).

[0088] The second picker hand (310) unloads electronic components (ED) to be tested from the transport table (110) or loads electronic components (ED) that have been tested onto the transport table (110).

[0089] For unloading operations by the second picker hand (310), the transport table (110) must be moved toward the relocation section (RP) and be in the second area (A2).

[0090] The second picker hand (310) unloads electronic components (ED) to be tested from the transport table (110) in the second area (A2) or loads electronic components (ED) that have been tested from the transport table (110) in the second area (A2).

[0091] The second picker hand (310) can be configured in the same way as the first picker hand (210).

[0092] The number of pickers (P) provided in the second picker hand (310) may be different from the number of pickers (P) provided in the first picker hand (210).

[0093] The second picker hand (310) loads the electronic components (ED) to be tested from the transport table (110) in the second area (A2) onto the test table (300) that has been moved to the relocation area (RP).

[0094] The second picker hand (310) loads the electronic components (ED) that have been tested and are loaded on the test table (300) onto the transport table (110) in the second area (A2).

[0095] In order for the electronic components (ED) to be tested by the second picker hand (310) to be loaded onto the test table (300), the test table (300) must be located in the relocation space (RP).

[0096] The test table (300) is provided to load electronic components (ED) that are unloaded from the transport table (110) by the second picker hand (310).

[0097] As shown in the schematic excerpt of FIG. 4, the test table (300) is in the shape of a disc and has a flat top surface.

[0098] The test table (300) may be in the shape of a square plate when viewed from a flat plane, and in this case, the top surface is also flat.

[0099] The electronic components (ED) are loaded onto the test table (300) in a manner such that they are placed on the flat upper surface of the test table (300).

[0100] The test table (300) can be moved in the X-axis, Y-axis and Z-axis directions.

[0101] The test table (300) can be rotated in the Θ-axis direction with the vertical line (V) passing through the center of the test table (300) in the Z-axis direction as the axis of rotation.

[0102] Generally, when an electronic component (ED) is moved to a test table (300), shock or inertia accompanying the movement occurs.

[0103] Impact or inertia, etc., can disrupt the position of the electronic components (ED) loaded on the test table (300). To prevent this, vacuum holes (h) are formed in the area where the electronic components (ED) are loaded on the test table (300).

[0104] The vacuum structure of the test table (300) for fixing the electronic component (ED) may be the same as the vacuum structure of the transport table (110).

[0105] When the electronic component (ED) is placed on the test table (300) by the second picker hand (310), the electronic component (ED) can be settled in the position where it was placed by vacuum pressure. In that state, when the second picker hand (310) releases the grip on the electronic component (ED), the electronic component (ED) is fixed in the position where it was settled without any misalignment.

[0106] The vacuum device (400) provides vacuum pressure to the vacuum holes (h) in the test table (300) through a vacuum circuit (not shown).

[0107] The vacuum device (400) can be configured with only a structure that is installed in a factory and distributes vacuum pressure supplied from outside the handler (TH) to each electronic component (ED) through a vacuum circuit.

[0108] The vacuum pressure provided by the vacuum device (400) is transmitted to the electronic components (ED) through the vacuum hole (h), and the electronic components (ED) loaded on the test table (300) are fixed in position by the vacuum pressure.

[0109] The vacuum holes (h) are implemented to be selectively opened or closed depending on the control of the vacuum circuit. The electronic components (ED) can be selectively fixed to the test table (300) or removed from the test table (300).

[0110] The electronic component (ED) is electrically connected to the tester while loaded on the test table (300).

[0111] The electrical connection between the electronic components (ED) loaded on the test table (300) and the tester is made via a test board (TB).

[0112] The test board (TB) has test pins that make electrical contact with the electronic components (ED).

[0113] The test board (TB) is fixedly coupled to the handler (TH) at the connection part (CP).

[0114] The electronic components (ED) loaded on the test table (300) that has been moved to the connection part (CP) are electrically connected to the test pins of the test board (TB).

[0115] The test board (TB) may have any structure as long as it has a configuration that allows it to be electrically connected to electronic components (ED).

[0116] The test board (TB) may be a widely known probe card. In this case, it is preferable that the test table (300) be provided in the form of a disc.

[0117] The test board (TB) may have a structure having socket modules. Test pins are provided in the socket modules, and the socket modules are installed in the socket body. In this case, it is preferable that the test table (300) be provided in the shape of a square plate.

[0118] As shown in the bottom view of FIG. 5, test zones (TZ) corresponding to one electronic component are arranged on the test board (TB).

[0119] The test zones (TZ) correspond one-to-one with the electronic components (ED) loaded on the test table (300).

[0120] One test zone (TZ) is equipped with test pins (t) to be electrically connected to one electronic component (ED).

[0121] The test pins (t) in one test zone (TZ) form a set of clusters that form the test zone (TZ) and are electrically connected to the electronic component (ED).

[0122] When the test board (TB) is a probe card, a set of test pins (t) is densely arranged in the test area (TZ). Here, the set of test pins (t) corresponds to terminals on an electronic component (ED). The test pins (t) on the probe card are also commonly referred to as probe pins.

[0123] In the case where the test board (TB) has a structure with a socket module, a set of test pins (t) are installed in one socket module, and one socket module forms one test zone (TZ). Therefore, when one socket module (22) is replaced, one test zone (TZ) is replaced.

[0124] The test area (TZ) and the electronic component (ED) must be aligned. If the coordinates of the electronic component (ED) on the test table (300) on the XY plane do not match the coordinates of the test area (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester.

[0125] As shown in the conceptual example of FIG. 6, if an electronic component (ED) on the test table (300) is in an angular position having a rotation angle (Θ1) twisted in the Θ-axis direction with respect to the test zone (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester. To prevent this, all test zones (TZ) of the test board (TB) and all electronic components (ED) on the test table (300) must be aligned.

[0126] A relocation mechanism (500) is provided to realize alignment between the test zone (TZ) and the electronic component (ED).

[0127] According to the present embodiment, the electronic component (ED) is moved from the transport table (110) to the test table (300) by the second picker hand (310). During this process, an error in the position of the electronic component (ED) may occur due to an operating error or operating shock of the second picker hand (310).

[0128] The positions of the electronic components (ED) loaded onto the test table (300) by the second picker hand (310) on the XY plane or each position may be different, and the electronic components (ED) loaded onto the test table (300) and the test zones (TZ) of the test board (TB) may not coincide with each other.

[0129] It does not matter if the error tolerance between the electronic component (ED) and the test zone (TZ) is wide. However, the packaged semiconductor device requires a precision of within 30㎛, and in the case of the die or HBM, a precision of within 5㎛ is required.

[0130] In the present invention, when the second picker hand (310) moves electronic components (ED) from the transport table (110) to the test table (300), the electronic components (ED) are loaded into temporary zones and then relocated from the temporary zones to the fixed zones.

[0131] The temporary area may not be a set location, but any location where the electronic component (ED) is placed on the test table (300) by the second picker hand (310).

[0132] The temporary area is a location that is not set or fixed by the controller (800) and is arbitrarily determined by the operation of the second picker hand (310).

[0133] For example, when the second picker hand (310) places an electronic component (ED) on the test table (300), the area where the electronic component (ED) is placed becomes a temporary area.

[0134] Exaggerated Figure 7 shows an example of a temporary zone (BZ) on a test table (300).

[0135] All temporary zones (BZ) can have their own positions on the X-axis, Y-axis, and Θ-axis.

[0136] The fixed position zone refers to the location where the electronic component (ED) and the test zone (TZ) coincide. The exaggerated figure 8 shows the relationship between the temporary zone (BZ) and the fixed position zone (RZ) on the test table (300).

[0137] The position zone (RZ) may be pre-set, but it may also be set to match the position and arrangement of the test zones (TZ) on the test board (TB) after the electronic components (ED) to be tested are loaded onto the test table (300).

[0138] The positioning zone (RZ) can be obtained from an image precisely scanned by a separate high-magnification camera attached to the test table (300) before the test operation of the handler (TH).

[0139] In Fig. 8, the temporary zone (BZ) may have errors in the X-axis, Y-axis, and Θ-axis directions with respect to the fixed zone (RZ).

[0140] A relocation mechanism (500) is provided to precisely relocate the position of an electronic component (ED) loaded on a test table (300) in a relocation space (RS).

[0141] The relocation mechanism (500) is provided to relocate the position of an electronic component (ED) loaded on a test table (300) by the second picker hand (310) from a temporary zone (BZ) to a fixed zone (RZ).

[0142] According to the present embodiment, the second picker hand (310) loads the electronic components (ED) to be tested, which are unloaded from the transport table (110), into a temporary zone (BZ). Then, a relocation mechanism (500) is utilized to move the electronic components (ED) in the temporary zone (BZ) to the designated zone (RZ).

[0143] As shown in the schematic diagram of FIG. 9, the relocation mechanism (500) includes a relocation picker (510), a relocation camera (520), and a picker elevator (530).

[0144] The relocation mechanism (500) can be fixedly mounted on the frame forming the skeleton of the handler (TH).

[0145] The repositioning picker (510) can grasp or release the electronic component (ED). The repositioning picker (510) can grasp the electronic component (ED) by vacuum pressure.

[0146] The repositioning picker (510) is fixed in a horizontal position in the X-axis and Y-axis directions.

[0147] The relocation camera (520) is positioned apart from the relocation picker (510).

[0148] The repositioning camera (520) is fixed in position in the horizontal direction, which is the X-axis and Y-axis direction.

[0149] A repositioning camera (520) is provided to photograph electronic components (ED).

[0150] The picker elevator (530) raises the relocation picker (510).

[0151] It is preferable that the picker elevator (530) be equipped with a lifting motor so as to precisely control the lifting speed or lifting distance of the repositioning picker (510).

[0152] As in the example of FIG. 10, the repositioning camera (520) photographs identification marks (M: M1, M2) on the electronic component (ED). The identification marks (M) may be arranged diagonally opposite each other.

[0153] However, the object photographed by the relocation camera (520) to relocate the electronic component (ED) does not need to be limited to the identification mark (M). The object photographed by the relocation camera (520) may be replaced with the corner of the electronic component (ED), the identification pad or identification pattern of the electronic component (ED), or other identifiable objects.

[0154] The relocation picker (510) and the relocation camera (520) are bundled into a single module and fixed. The mutual placement positions of the relocation picker (510) and the relocation camera (520) are fixed.

[0155] The moving mechanism (600) can move the test table (300) in the horizontal direction, which is the X-axis and Y-axis direction.

[0156] The moving mechanism (600) can rotate the test table (300) in the Θ-axis direction.

[0157] The moving mechanism (600) can move the test table (300) up and down in the Z-axis direction.

[0158] As shown in the schematic excerpt of FIG. 11, the moving mechanism (600) includes a rotating mechanism (610), an elevator (620), a first moving mechanism (640), and a second moving mechanism (660).

[0159] The rotator (610) rotates the test table (300) in the Θ-axis direction.

[0160] The test table (300) can be rotated by the rotating mechanism (610) so that the angular position of the electronic component (ED) in the Θ-axis direction can be adjusted.

[0161] The elevator (620) raises the test table (300).

[0162] The test table (300) is connected to the elevator (620) via a rotating mechanism (610).

[0163] When the test table (300) is raised by the elevator (620), the electronic components (ED) of the test table (300) come into contact with the test pins (t), thereby electrically connecting the electronic components (ED) to the tester. When the test table (300) is lowered by the elevator (620), the contact between the electronic components (ED) and the test pins (t) is released, and the test table (300) becomes capable of moving in a horizontal direction.

[0164] The first moving device (640) moves the test table (300) in the X-axis direction.

[0165] By moving the test table (300) in the X-axis direction by the first moving device (640), the test table (300) can be selectively positioned in the relocation space (RS) and the test space (TS). Here, the test space (TS) is a space formed in the connection part (CP), and when the test table (300) is in the test space (TS), an electrical connection between the electronic component (ED) and the tester is made by the raising of the test table (300).

[0166] The second mover (660) moves the test table (300) in the Y-axis direction.

[0167] The above-mentioned moving mechanism (600) has three functions.

[0168] The first function is to move the test table (300) between the relocation space (RS) and the test space (TS).

[0169] The second function is to electrically connect or disconnect electronic components (ED) to the tester.

[0170] The third function is for the relocation of electronic components (ED) in the relocation space (RS).

[0171] Since the repositioning picker (510) is fixed, the test table (300) moves in the horizontal X-axis and Y-axis directions or rotates in the Θ-axis direction to adjust the position of the electronic component (ED) on the horizontal plane.

[0172] Depending on the implementation, the test table (300) is raised and lowered during the relocation process of the electronic component (ED), thereby enabling the relocation picker (510) to grasp or release the electronic component (ED).

[0173] Here, the operation during the relocation of electronic components (ED) is explained.

[0174] As shown in Fig. 8, the temporary zone (BZ) of the electronic component (ED) may differ from the fixed zone (RZ) in the X-axis, Y-axis, and Θ-axis directions.

[0175] The relocation camera (520) photographs the electronic component (ED) on the test table (300) and identifies the temporary zone (BZ) through the location of the identification mark (M).

[0176] When the temporary zone (BZ) is identified, the first mover (640) and the second mover (660) operate to position the center of the temporary zone (BZ) below the relocation picker (510), and the picker elevator (530) operates to lower the relocation picker (510).

[0177] When the lowered repositioning picker (510) adsorbs and grasps the electronic component (ED) of the test table (300) by vacuum pressure, the picker elevator (530) operates to raise the repositioning picker (510). Afterward, the first moving device (640) and the second moving device (660) operate to align the center of the positioning zone (RZ) with the center of the electronic component (ED) grasped by the repositioning picker (510), and the rotating device (610) operates to align the electronic component (ED) with the positioning zone (RZ). In this state, the picker elevator (530) operates to lower the repositioning picker (510), thereby allowing the electronic component (ED) grasped by the repositioning picker (510) to settle in the positioning zone (RZ).

[0178] When the electronic component (ED) is fixed to the test table (300) by vacuum pressure applied through the vacuum hole (h) while the electronic component (ED) is seated in the positioning zone (RZ), the repositioning picker (510) releases the grip of the electronic component (ED). Then, the repositioning picker (510) rises and begins repositioning the next electronic component (ED).

[0179] The controller (800) controls the components necessary for the proper operation of the handler (TH), such as the transport shuttle (100), the first picker hand (210), the second picker hand (310), the vacuum (400), the relocation mechanism (500), and the moving mechanism (600).

[0180] Next, the method of operation of the handler (TH) according to the present invention is explained from the perspective of the logistics of electronic components (ED).

[0181] In the unloading section (LU), the first picker hand (210) loads electronic components (ED) to be tested onto a transport table (110) in the first area (A1).

[0182] When all the electronic components (ED) are loaded onto the transport table (110), the transport shuttle (100) operates and moves the transport table (110) to the second area (A2).

[0183] The second picker hand (310) unloads electronic components (ED) from the transport table (110) in the second area (A2) and moves them to the test table (300) in the relocation area (RS). At this time, the locations of the electronic components (ED) loaded onto the test table (300) by the second picker hand (310) are temporary zones (BZ).

[0184] When all the electronic components (ED) to be tested are loaded onto the test table (300), the controller (800) operates the relocation mechanism (500) and the moving mechanism (600) to relocate the electronic components (ED) from the temporary zones (BZ) to the fixed zones (RZ).

[0185] When the rearrangement of electronic components (ED) on the test table (300) is completed, the moving mechanism (600) operates to move the test table (300) to the test space (TS). Afterwards, the elevator (620) operates to raise the test table (300) toward the test board (TB) so that the electronic components (ED) are electrically connected to the tester.

[0186] When the testing of the electronic components (ED) is finished, the test table (300) is moved to the relocation section (RP) by the moving mechanism (600). Then, the second picker hand (310) moves the electronic components (ED) that have completed testing to the transport tray (110) in the second area (A2), and the transport tray (110) filled with the electronic components (ED) that have completed testing moves to the first area (A1). Subsequently, the first picker hand (210) unloads the electronic components (ED) that have completed testing from the transport table (110) and loads them onto an empty customer tray.

[0187] Based on the basic operation method described above, the electronic component (ED) is supplied to the tester for testing, and is retrieved after the test is completed.

[0188] The handler (TH) above is equipped with a picker (P, 510) for gripping or releasing electronic components on the first picker hand (210), the second picker hand (310), and the repositioning mechanism (500).

[0189] The present invention relates to a picker (P, 510). Accordingly, the picker (P, 510) that can be applied to the first picker hand (210), the second picker hand (310), and the repositioning mechanism (500) is unified by the symbol P, and further details are provided regarding the picker assembly (PA) and the picker control system including the picker (P).

[0190] <Description of the Picker Assembly>

[0191] FIG. 12 is a schematic excerpt of a picker assembly (PA) according to the first embodiment.

[0192] The picker assembly (PA) according to the first embodiment includes a picker (P) and a lifting motor (10).

[0193] The lifting motor (10) raises the picker (P) and is equipped as a linear motor.

[0194] FIG. 13 is a schematic conceptual diagram of a picker assembly (PA) according to a second embodiment.

[0195] A picker assembly (PA) according to the second embodiment includes a picker (P), a lifting motor (10), and a return mechanism (20).

[0196] The return mechanism (20) applies a return force to raise the picker (P) when the picker (P) has descended.

[0197] The return mechanism (20) includes a cylinder (21), a piston (22), a spring (23), and a coupling (24).

[0198] The cylinder (21) has a hollow tubular structure and guides the movement of the piston (22).

[0199] The piston (22) moves up and down within the cylinder.

[0200] The spring (23) is an elastic member that applies an upward elastic force to the piston (22).

[0201] The coupling device (24) combines the piston (22) and the picker (P).

[0202] The piston (22) and the picker (P) are linked by the coupling device (24).

[0203] One side of the coupling device (24) is coupled to the piston (22), and the other side is coupled to the picker (P).

[0204] A power outage may occur while the picker (P) is lowered and pressurizing the electronic component (ED). Then, the picker (P) automatically rises due to the return force of the spring (23), and the pressurizing force applied to the electronic component (ED) by the picker (P) is released.

[0205] Furthermore, the return mechanism (20) may further include a solenoid valve.

[0206] A solenoid valve is provided between the cylinder (21) and the vacuum pump in the factory.

[0207] The vacuum pump is managed separately even during a factory power outage, allowing the vacuum power to be continuously maintained.

[0208] When the solenoid valve opens during a power outage, vacuum pressure is applied to the cylinder, and the picker (P) rises.

[0209] Damage to the electronic component (ED) and other devices that may occur when the picker (P) suddenly drops the electronic component (ED) it was holding or fails to properly control the force it was trying to hold, thereby causing strong pressure on the electronic component (ED), can be prevented by the return mechanism (20).

[0210] <Description of the Picker Control System>

[0211] A picker control system is added to the picker assembly (PA) of FIG. 12 or FIG. 13, with a controller (800).

[0212] The controller (800) controls the lifting motor (10).

[0213] Figure 14 shows the entire lifting section of the picker (P).

[0214] The picker (P) moves up and down, covering the entire lifting section from the upper (U) to the lower (D).

[0215] The total elevator section is approximately 5 mm.

[0216] When the picker (P) descends, the controller (800) controls the lifting motor (10) by dividing the entire lifting section into a first lowering section (S1) and a second lowering section (S2).

[0217] The first descending section (S1) is on the upper side, and the second descending section (S2) is on the lower side.

[0218] The second descent section (S2) is a lower section than the first descent section (S1).

[0219] The first descent section (S1) is longer than the second descent section (S2).

[0220] The second descent section (S2) is shorter than the first descent section (S1).

[0221] The first descent section (S1) is approximately 4.5 mm.

[0222] The second descent section (S2) is approximately 0.5 mm.

[0223] When descending, the point where the first descent section (S1) ends is the starting point of the second descent section (S2).

[0224] The controller (800) controls the picker (P) to descend at a preset speed (hereinafter referred to as 'set speed') in the first descending section (S1).

[0225] The controller (800) controls the lifting motor (10) so that the picker (P) descends while maintaining a preset pressure (hereinafter referred to as 'set pressure') during the second descending section (S2).

[0226] The set pressure is smaller than the pressure of the picker (P) in the first lowering section (S2).

[0227] The controller (800) controls the lifting motor (10) such that the set pressure is smaller than the pressure in the first lowering section (S), thereby reducing the contact impact between the picker (P) and the electronic component (ED).

[0228] In the first lowering section (S), which is the majority of the entire lifting section, the picker (P) can be lowered at a high speed, and in the second lowering section (S2), where there is a possibility of contact with electronic components (ED) at any position, the pressure of the picker (P) is reduced.

[0229] If the controller (800) controls the lifting motor (10) more precisely, the picker (P) can be lowered at the same set speed as in the first lowering section (S1) even in the second lowering section (S2).

[0230] Since the set speed in the first lowering section (S1) can be increased compared to the existing method, the speed for moving the electronic component (ED) can be increased according to the picker control system of the present invention.

[0231] Meanwhile, when electronic components (ED) need to be moved continuously by the picker (P), the controller (800) controls the continuous operation to be performed while the picker (P) is lowered by a preset lowering distance (hereinafter referred to as 'set distance').

[0232] For example, the setting distance can be 2mm.

[0233] When continuous movement of electronic components (ED) is required, the controller (800) controls the lifting motor (10) so that the picker (P) is lowered by 2 mm and maintains that state.

[0234] However, the set distance must be shorter than the first descent section (S1).

[0235] The embodiments described above are merely preferred examples of the present invention and may have various applications. Therefore, the present invention should not be understood as being limited only to the contents described above. Instead, the scope of the present invention should be understood as the separately described claims and their equivalents.

Claims

1. A picker that grips or releases electronic components using vacuum pressure; A lifting motor for raising and lowering the above picker; and A controller for controlling the above-mentioned lifting motor; comprising, The above controller controls the lifting motor so that when lowering the picker, the picker descends at a preset speed (hereinafter referred to as 'set speed') in the first descent section, and descends while maintaining a preset pressure (hereinafter referred to as 'set pressure') in the second descent section, which is lower than the first descent section. Picker control system for a handler for testing electronic components.

2. In Paragraph 1, The above controller controls the lifting motor so that the picker descends at the set speed even in the second descending section. Picker control system for a handler for testing electronic components.

3. In Paragraph 2, The above controller controls the lifting motor such that the set pressure is smaller than the pressure of the picker in the first lowering section. Picker control system for a handler for testing electronic components.

4. In Paragraph 1, The above controller controls the lifting motor so that when moving an electronic component by the picker hand, the picker is lowered by a set lowering distance (hereinafter referred to as 'set distance'), and The above setting distance is shorter than the first descent section Picker control system for a handler for testing electronic components.

5. In Paragraph 1, The above first descent section is longer than the above second descent section Picker control system for a handler for testing electronic components.

6. In Paragraph 1, The above picker hand further includes a return mechanism that applies a return force to raise the picker when the picker has descended. Picker control system for a handler for testing electronic components.

7. In Paragraph 6, The above return mechanism is Cylindrical cylinder; A piston that moves up and down within the above cylinder; A spring that applies an upward elastic force to the above piston; and A coupling device comprising: one side being coupled to the piston and the other side being coupled to the picker, thereby enabling the picker to be raised in conjunction with the rising of the piston. Picker control system for a handler for testing electronic components.

8. A picker that grips or releases electronic components using vacuum pressure; A lifting motor for raising and lowering the above picker; and A return mechanism for applying a return force to raise the picker when the picker has descended; comprising Picker assembly of a handler for testing electronic components.

9. In Paragraph 8, The above return mechanism is Cylindrical cylinder; A piston that moves up and down within the above cylinder; A spring that applies an upward elastic force to the above piston; and A coupling device comprising: one side being coupled to the piston and the other side being coupled to the picker, thereby enabling the picker to be raised in conjunction with the rising of the piston. Picker assembly of a handler for testing electronic components.

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