Lens assembly
By using conductive silver paste to make electrical connections between the circuit board and the sensor chip, the problems of difficult control of the lens assembly height and unstable electrical connections are solved, resulting in a stable overall structure, reduced risk of drop failure, and improved image quality.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2026-04-02
AI Technical Summary
The height of existing lens assemblies is not easy to control and the electrical connection is unstable, which can easily lead to problems such as broken gold wires or increased height due to soldering of solder balls.
By using conductive silver paste blocks, electrical connections are achieved between the circuit board and the sensor chip through the cured conductive silver paste, avoiding the problems of easily broken wires and increased height of solder balls, thus forming a stable overall structure.
This achieves controllability of the overall height of the lens assembly and stability of the electrical connections, reducing the risk of drop failure and improving image quality.
Smart Images

Figure CN2024120552_02042026_PF_FP_ABST
Abstract
Description
Lens assembly TECHNICAL FIELD
[0001] The utility model relates to optical imaging technical field especially relates to a lens assembly. BACKGROUND
[0002] The lens assembly is the essential component of electronic equipment (for example, mobile phone), in traditional lens assembly structure scheme, the circuit board and sensor chip are all through gold wire (wire) welding and realize electric connection, thereby realizing the transmission purpose of image signal, however, in this scheme, gold wire is easy to swing, and in extreme case, there are some electric problems caused by line collapse and the like, for example, gold wire disconnects.
[0003] In related art, there is also a scheme of setting welding tin ball under the sensor chip, and the welding tin ball is connected between the sensor chip and the circuit board after high-temperature melting, however, due to the increase of the welding tin ball, the height of the lens assembly is increased, which is not conducive to the control of the overall height of the module. TECHNICAL PROBLEM
[0004] Therefore, it is necessary to provide a new lens assembly to solve the above technical problems. TECHNICAL SOLUTION
[0005] The utility model discloses a lens assembly, which aims to solve the problem of unstable electrical connection and the problem of height of the lens assembly being not conducive to control in the prior art.
[0006] In order to achieve the above purpose, the utility model provides a lens assembly, the lens assembly includes: a circuit board, a sensor chip arranged on the circuit board and electrically connected with the circuit board, a support supported on the circuit board and a filter supported on the support and spaced apart from the sensor chip, the circuit board is equipped with the first conductive sheet, the surface of the sensor chip towards the filter is equipped with the second conductive sheet, and the first conductive sheet and the second conductive sheet are electrically connected through the conductive silver glue block.
[0007] Preferably, the conductive silver glue block is formed by solidified conductive silver paste.
[0008] Preferably, the support is provided with a pouring channel penetrating therethrough, and the conductive silver paste is poured through the pouring channel.
[0009] Preferably, the support includes an inner support portion, an outer support portion, and a connecting portion connected between the inner support portion and the outer support portion, the inner support portion supports the filter, the outer support portion is supported on the circuit board, and the pouring channel is arranged on the connecting portion.
[0010] Preferably, the connecting portion of the support is located above the sensor chip and is spaced apart from the sensor chip.
[0011] Preferably, the inner support portion surrounds a through hole, and the filter covers the through hole.
[0012] Preferably, the conductive silver paste block includes a first portion located in the perfusion channel, a second portion connected with the first portion and located on the surface of the sensor chip, and a third portion connected with the second portion and located on the surface of the circuit board, the second portion is connected with the second conductive sheet, and the third portion is connected with the first conductive sheet.
[0013] Preferably, the width of the first portion of the conductive silver paste block is equal to the width of the second portion, and the width of the third portion is less than the width of the second portion.
[0014] Preferably, the first conductive sheet is a plurality of and located on opposite sides of the circuit board, the second conductive sheet is a plurality of and located on opposite sides of the sensor chip, and the first conductive sheet and the second conductive sheet are arranged one by one.
[0015] Preferably, the conductive silver paste is solidified to form the conductive silver paste block. Advantages
[0016] Compared with the related art, the lens assembly provided by the utility model, the lens assembly comprises a circuit board, a sensor chip arranged on the circuit board and electrically connected with the circuit board, a support supported on the circuit board and a filter supported on the support and spaced apart from the sensor chip, the circuit board is provided with a first conductive sheet, the surface of the sensor chip facing the filter is provided with a second conductive sheet, and the first conductive sheet and the second conductive sheet are electrically connected through a conductive silver paste block. The lens assembly of the utility model realizes the electrical connection between the sensor chip and the circuit board through the solidified conductive silver paste block, avoids the risk of easy breakage caused by pulling during wire connection, simultaneously realizes the advantage that the overall height of the lens assembly is easy to control, makes the overall structure of the lens assembly more stable, and reduces the risk of drop failure. BRIEF DESCRIPTION OF DRAWINGS
[0017] Fig. 1 is a perspective structural schematic view of the lens assembly of the utility model.
[0018] Fig. 2 is an exploded view of the lens assembly shown in Fig. 1.
[0019] Fig. 3 is a sectional view along line A-A in Fig. 1. BEST MODE FOR CARRYING OUT THE INVENTION
[0020] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present utility model.
[0021] The utility model provides a lens assembly 100, in actual application, the upper part of lens assembly 100 will be set up the lens containing lens. As shown in figure 1 to 3, the lens assembly 100 includes: circuit board 1, set up on the circuit board 1 and with the electric connection of sensor chip 2 of circuit board 1, support on the circuit board 1's support 3, support on the support 3 and with the interval arrangement of filter 4 of sensor chip 2 and conductive silver glue block 5.
[0022] The circuit board 1 is flexible circuit board. The surface of circuit board 1 facing sensor chip 2 is equipped with a plurality of first conductive sheet 11, the first conductive sheet 11 is two rows, and two rows of first conductive sheet 11 are located on the opposite sides of circuit board 1. The first conductive sheet 11 can be arranged protruding from the surface of the circuit board 1, or can be arranged flush with the surface of the circuit board 1, or even can be arranged below the surface of the circuit board 1.
[0023] The sensor chip 2 is attached to the surface of the circuit board 1, and two rows of the first conductive sheet 11 are located on the two sides of the sensor chip 2, that is, the first conductive sheet 11 is not covered by the sensor chip 2. The surface of the sensor chip 2 facing the filter 4 is provided with a plurality of second conductive sheet 21, the second conductive sheet 21 is two rows, and two rows of the second conductive sheet 21 are located on the opposite sides of the sensor chip 2, the second conductive sheet 21 and the first conductive sheet 11 are one-to-one corresponding arrangement, the first conductive sheet 11 and the second conductive sheet 21 are electrically connected by the conductive silver glue block 5. The second conductive sheet 21 can be arranged protruding from the surface of the sensor chip 2, or can be arranged flush with the surface of the sensor chip 2, or even can be arranged below the surface of the sensor chip 2.
[0024] The support 3 is a ring structure, and comprises an inner support portion 31, an outer support portion 32, and a connecting portion 33 connected between the inner support portion 31 and the outer support portion 32, the inner support portion 31 supports the optical filter 4, and the outer support portion 32 is supported on the circuit board 1. The connecting portion 33 of the support 3 is partially located above the sensor chip 2 and is spaced apart from the sensor chip 2. The inner support portion 31 surrounds a through hole 310, and the optical filter 4 covers the through hole 310. The support 3 is further provided with a filling channel 34 passing therethrough, and the filling channel 34 is arranged on the connecting portion 33. The thicknesses of the inner support portion 31 and the connecting portion 33 are less than the thickness of the outer support portion 32.
[0025] The conductive silver glue block 5 is formed by solidification of conductive silver paste, the conductive silver paste is filled through the filling channel 34, and the conductive silver paste is solidified after being filled into the filling channel 34 to form the conductive silver glue block 5. The conductive silver glue block 5 comprises a first portion 51 located in the filling channel 34, a second portion 52 connected with the first portion 51 and located on the surface of the sensor chip 2, and a third portion 53 connected with the second portion 52 and located on the surface of the circuit board 1, the second portion 52 is connected with the second conductive sheet 21, and the third portion 53 is connected with the first conductive sheet 11, so as to realize electrical connection between the sensor chip 2 and the circuit board 1, and achieve the transmission purpose of image signals. The width of the first portion 51 is equal to the width of the second portion 52, and the width of the third portion 53 is less than the width of the second portion 52. The second portion 52 and the third portion 53 form a stepped shape.
[0026] The conductive silver glue block 5 is used to electrically connect the sensor chip 2 and the circuit board 1, which avoids the problem of increasing the overall height of the lens assembly 100 caused by fixing with soldered tin balls, and avoids the problem of easy breakage of wires caused by fixing with wires. The first conductive sheet 11 and the second conductive sheet 21 are correspondingly fixed by the conductive silver glue block 5, so as to fixedly connect the circuit board 1, the support 3, and the sensor chip 2 to form an integral whole, and further greatly enhance the anti-external force factor of the lens assembly 100.
[0027] The optical filter 4 can filter out non-visible light. The optical filter 4 can be an infrared filter, so that the lens assembly 100 can filter out infrared light, prevent the infrared light from reaching the imaging surface of the lens assembly 100, and prevent interference with normal visible light imaging, thereby improving the imaging quality of the lens assembly 100.
[0028] Compared with the related art, the lens assembly provided by the utility model has the advantages that the lens assembly realizes the electrical connection between the sensor chip and the circuit board through the solidified conductive silver adhesive block, avoids the risk that the lead wire is easily pulled off during the connection, simultaneously realizes the advantage that the overall height of the lens assembly is easy to control, makes the overall structure of the lens assembly more stable, and reduces the risk of falling failure.
[0029] The above is only the embodiment of the utility model, and it should be pointed out here that, for those skilled in the art, improvements can be made without departing from the creative concept of the utility model, but these all belong to the protection scope of the utility model.
Claims
1. A lens assembly, characterized by, The lens assembly comprises a circuit board, a sensor chip arranged on the circuit board and electrically connected with the circuit board, a support supported on the circuit board, and a filter supported on the support and spaced apart from the sensor chip, the circuit board is provided with a first conductive sheet, a surface of the sensor chip facing the filter is provided with a second conductive sheet, and the first conductive sheet and the second conductive sheet are electrically connected through a conductive silver paste block.
2. The lens assembly of claim 1, wherein, The conductive silver paste block is formed by solidified conductive silver paste.
3. The lens assembly of claim 1, wherein, The support is provided with a pouring channel therethrough, and the conductive silver paste is poured through the pouring channel.
4. The lens assembly of claim 3, wherein, The support comprises an inner support portion, an outer support portion, and a connecting portion connected between the inner support portion and the outer support portion, the inner support portion supports the filter, the outer support portion is supported on the circuit board, and the pouring channel is arranged on the connecting portion.
5. The lens assembly of claim 4, wherein, The connecting portion of the support is located above the sensor chip and spaced apart from the sensor chip.
6. The lens assembly of claim 4, wherein, The inner support portion surrounds a through hole, and the filter covers the through hole.
7. The lens assembly of claim 4, wherein, The conductive silver paste block comprises a first part located in the pouring channel, a second part connected with the first part and located on the surface of the sensor chip, and a third part connected with the second part and located on the surface of the circuit board, the second part is connected with the second conductive sheet, and the third part is connected with the first conductive sheet.
8. The lens assembly according to claim 7, wherein, The width of the first part of the conductive silver paste block is equal to the width of the second part, and the width of the third part is less than the width of the second part.
9. The lens assembly of claim 1, wherein, The first conductive sheet is a plurality of and located on opposite sides of the circuit board, the second conductive sheet is a plurality of and located on opposite sides of the sensor chip, and the first conductive sheet and the second conductive sheet are arranged one by one.
10. The lens assembly of claim 2, wherein, The conductive silver paste is solidified to form the conductive silver paste block.
Citation Information
Patent Citations
Camera module and camera equipment provided with same
CN104580856A
Method for connecting sensor and printed circuit board with conductive adhesive
CN107231761A
Camera module and assembly method thereof
CN107301988A
Method of using conductive silver paste to connect sensor and printed circuit board
CN107371325A
Electronic equipment, camera module and circuit board assembly thereof
CN210491015U