Light-emitting substrate and lamp panel

Abstract

A light-emitting substrate, comprising a base, a pad unit, a ground wire, a ground jumper wire, and a lighting control wire, the pad unit, the ground wire, the ground jumper wire and the lighting control wire being located at one side of the base. The ground jumper wire and the lighting control wire are located in the same layer, and are located on the side of the ground wire facing away from the base. An orthographic projection of the ground wire onto the base is located on at least one side of an orthographic projection of the pad unit onto the base, the orthographic projections of the ground wire and the pad unit onto the base being arranged along a first direction, and the ground wire extending along a second direction. The pad unit comprises a first pad and a second pad, the first pad and the second pad being arranged along the second direction. The lighting control wire is electrically connected to the first pad, and the ground jumper wire is electrically connected to the second pad and the ground wire. The lighting control wire and the ground jumper wire are disposed at an interval along the second direction, the first direction and the second direction intersecting.

Description

Light-emitting substrate and lamp board Technical Field

[0001] This disclosure pertains to the field of display technology, specifically relating to a light-emitting substrate and a lamp board. Background Technology

[0002] MiniLED is a type of LED (Light-Emitting Diode) technology. MiniLED chips are between 50 and 300 micrometers in size. MiniLED light panels have received widespread attention due to their advantages such as self-illumination, low power consumption, thinness, vibrant colors, high contrast, and fast response speed.

[0003] Summary of the Invention

[0004] In a first aspect, embodiments of this disclosure provide a light-emitting substrate, which includes a substrate, pad units, a ground line, a grounding line, and a light-emitting control line, wherein the pad units, the ground line, the grounding line, and the light-emitting control line are located on one side of the substrate;

[0005] The grounding wire and the light-emitting control wire are located on the same layer, and on the side of the grounding wire that is away from the substrate;

[0006] The orthographic projection of the ground wire onto the substrate is located on at least one side of the orthographic projection of the pad unit onto the substrate. The ground wire and the orthographic projection of the pad unit onto the substrate are arranged along a first direction, and the ground wire extends along a second direction.

[0007] The pad unit includes a first pad and a second pad, and the first pad and the second pad are arranged along the second direction;

[0008] The light-emitting control line is electrically connected to the first pad;

[0009] The grounding wire is electrically connected to the second pad and the ground wire;

[0010] The light-emitting control line and the grounding line are arranged at intervals along the second direction;

[0011] The first direction and the second direction intersect.

[0012] In some embodiments, the first pad has at least one...

[0013] There is at least one light-emitting control line.

[0014] The light-emitting control line and the first pad are electrically connected in a one-to-one correspondence.

[0015] The second pad has at least one.

[0016] The first pad is projected onto the substrate in an orthographic projection at least to one side of the second pad being projected onto the substrate in an orthographic projection.

[0017] At least two of the ground lines are projected onto the substrate on the same side of the pad cell's projection onto the substrate.

[0018] In some embodiments, the first pad includes at least a first first pad.

[0019] The second pad includes the first second pad.

[0020] The light-emitting control line includes a first control line, the first control line and the grounding line are arranged along the second direction, and the first control line is electrically connected to the first first pad.

[0021] The first control line includes a first sub-section and a second sub-section, the first sub-section and the second sub-section are arranged sequentially along a first direction away from the first first pad, the first sub-section extends along a second direction away from the first first pad and one end of it is electrically connected to the first first pad, and the second sub-section extends along the first direction and is electrically connected to the other end of the first sub-section.

[0022] The ground wire includes a first ground wire and a second ground wire. The orthographic projections of the first ground wire and the second ground wire on the substrate are located on the same side of the orthographic projection of the pad unit on the substrate, and the orthographic projection of the first ground wire on the substrate is further away from the orthographic projection of the pad unit on the substrate than the orthographic projection of the second ground wire on the substrate.

[0023] The grounding wire includes a first part and a second part, which are electrically connected.

[0024] The orthographic projection of the first part on the substrate is located between the orthographic projections of the first ground wire and the second ground wire on the substrate, and the first part is electrically connected to the first ground wire and the second ground wire respectively;

[0025] The orthographic projection of the second portion on the substrate is located between the orthographic projections of the second ground line and the first second pad on the substrate, or the orthographic projection of the second portion on the substrate extends from between the orthographic projections of the second ground line and the first second pad on the substrate to between the orthographic projections of the first ground line and the second ground line on the substrate, and the second portion is electrically connected to the first second pad.

[0026] In some embodiments, the first pad further includes a second first pad, wherein the orthographic projections of the second first pad and the first first pad on the substrate are mirror-symmetrical about the orthographic projection of the first second pad on the substrate as a center of symmetry;

[0027] The light-emitting control line also includes a second control line, which is located on the side of the grounding line away from the first control line, and the second control line is electrically connected to the second first pad.

[0028] The second control line includes a third sub-section that extends along the first direction and has one end electrically connected to the second first pad.

[0029] In some embodiments, the first portion extends along the first direction.

[0030] The second part extends in a third direction.

[0031] The first direction is perpendicular to the second direction, and the third direction intersects the first direction at a first acute angle;

[0032] The second part is located on the side of the first part closer to the third sub-part;

[0033] The first sub-part and the second part have a minimum distance between the grounding wire and the light-emitting control wire.

[0034] In some embodiments, the line width of the first portion is at least twice the line width of the second portion;

[0035] A via is provided at the position where the first part is electrically connected to the first ground wire and the second ground wire, and the number of the vias at the position where the first part is electrically connected to the first ground wire is greater than the number of the vias at the position where the first part is electrically connected to the second ground wire;

[0036] The distance between the first part and the third sub-part is greater than the distance between the first part and the second sub-part.

[0037] In some embodiments, the line width of the first portion is equal to the line width of the second portion;

[0038] A via is provided at the location where the first part is electrically connected to the first ground wire and the second ground wire.

[0039] The number of vias at the location where the first part is electrically connected to the first ground wire is greater than the number of vias at the location where the first part is electrically connected to the second ground wire;

[0040] The absolute value of the difference between the distance between the first part and the third sub-part and the distance between the first part and the second sub-part is 20 to 100 μm.

[0041] In some embodiments, the line width of the first portion is equal to the line width of the second portion;

[0042] A via is provided at the location where the first part is electrically connected to the first ground wire and the second ground wire.

[0043] The number of vias at the location where the first part is electrically connected to the first ground wire is greater than the number of vias at the location where the first part is electrically connected to the second ground wire;

[0044] The distance between the first part and the third sub-part is greater than the distance between the first part and the second sub-part.

[0045] In some embodiments, the first portion extends along the first direction, and the second portion extends along the first direction.

[0046] The distance between the second part and the first sub-part is equal to the distance between the second part and the third sub-part, and is the minimum distance between the grounding wire and the light-emitting control wire.

[0047] In some embodiments, the line width of the first portion is at least twice the line width of the second portion.

[0048] In some embodiments, the second portion is located on the side of the first portion closer to the third sub-part;

[0049] The distance between the first part and the third sub-part is greater than the distance between the first part and the second sub-part.

[0050] In some embodiments, the line width of the first portion is at least three times the line width of the second portion.

[0051] In some embodiments, the distance between the first portion and the third sub-part is equal to the distance between the second portion and the third sub-part;

[0052] Furthermore, the distance between the first part and the third sub-part is less than the distance between the first part and the second sub-part.

[0053] In some embodiments, the first pad further includes a third first pad, the third first pad and the first first pad being arranged along the first direction;

[0054] The second pad also includes a second second pad, the second second pad and the first second pad being arranged along the first direction;

[0055] The light emission control line also includes a third control line, which is electrically connected to the third first pad.

[0056] The third control line includes a fourth sub-section and a fifth sub-section, which are electrically connected.

[0057] The orthographic projections of the fourth sub-part and the first sub-part on the substrate are mirror-symmetric about the orthographic projection of the pad unit on the substrate as the center of symmetry; the orthographic projections of the fifth sub-part and the second sub-part on the substrate are mirror-symmetric about the orthographic projection of the pad unit on the substrate as the center of symmetry;

[0058] The ground line also includes a third ground line and a fourth ground line. The orthographic projections of the third ground line and the second ground line on the substrate are mirror-symmetric about the orthographic projection of the pad unit on the substrate as the center of symmetry. The orthographic projections of the fourth ground line and the first ground line on the substrate are mirror-symmetric about the orthographic projection of the pad unit on the substrate as the center of symmetry.

[0059] The grounding wire further includes a third part and a fourth part, which are electrically connected.

[0060] The orthographic projections of the third part and the second part onto the substrate are mirror-symmetric about the orthographic projection of the pad unit onto the substrate as the center of symmetry.

[0061] The third part is electrically connected to the second second pad and the second part, respectively;

[0062] The orthographic projections of the fourth part and the first part onto the substrate are mirror-symmetrical about the orthographic projection of the pad unit onto the substrate as the center of symmetry.

[0063] The fourth part is electrically connected to the third ground wire and the fourth ground wire, respectively.

[0064] In some embodiments, the first pad further includes a fourth first pad, wherein the orthographic projections of the fourth first pad and the third first pad on the substrate are mirror-symmetrical about the orthographic projection of the second second pad on the substrate as the center of symmetry;

[0065] The light-emitting control line further includes a fourth control line, which includes a sixth sub-section electrically connected to the fourth first pad.

[0066] The orthographic projections of the sixth sub-part and the third sub-part onto the substrate are mirror-symmetric with the orthographic projection of the pad unit onto the substrate as the center of symmetry.

[0067] In some embodiments, the angle range of the first acute angle is: arctanF / D≤α≤15°;

[0068] Wherein, α is the first acute angle; F is the maximum distance between the side of the first part closest to the third sub-part and the side of the second part closest to the third sub-part; and D is the distance between the side of the first part furthest from the first sub-part and the first sub-part.

[0069] In some embodiments, the third portion extends along a fourth direction, and the fourth direction intersects the first direction at a second acute angle.

[0070] The fourth sub-part and the third part have the minimum distance;

[0071] The range of the second acute angle is: arctanF' / E ≤ α' ≤ 15°;

[0072] Wherein, α' is the second acute angle; F' is the maximum distance between the side of the fourth part closest to the sixth sub-part and the side of the third part closest to the sixth sub-part; E is the distance between the side of the fourth part furthest from the fourth sub-part and the fourth sub-part.

[0073] In some embodiments, α = α'; F = F';

[0074] When D > E, arctanF / D ≤ α ≤ 15°;

[0075] When D = E, arctanF / D ≤ α ≤ 15°;

[0076] When D < E, arctanF / E ≤ α ≤ 15°.

[0077] In some embodiments, the minimum distance between the orthogonal projections of the light-emitting control line and the grounding line onto the substrate is 0.5 to 0.8 times the width of the first pad or the second pad.

[0078] In some embodiments, the minimum distance ranges from 86 to 89 μm.

[0079] In some embodiments, the pad unit is located on the same layer as the grounding line and the light-emitting control line.

[0080] The light-emitting substrate further includes a first insulating layer located on the side of the pad unit, the grounding line, and the light-emitting control line away from the substrate;

[0081] The first insulating layer has multiple openings, and a portion of the openings are projected onto the substrate in the same area as the light-emitting control line on the substrate. The light-emitting control line is exposed at this portion of the openings, and the exposed portion serves as the first pad.

[0082] The other portion of the opening is projected onto the substrate in the same orthographic projection area as the grounding wire on the substrate, and the grounding wire is exposed at this portion of the opening, with the exposed portion serving as the second pad.

[0083] The width of the area where the light-emitting control line located at the periphery of the first pad and the first insulating layer overlap on the substrate by orthographic projection is greater than 10 μm;

[0084] The width of the area where the grounding wire located at the periphery of the second pad overlaps with the first insulating layer on the substrate by its orthographic projection is greater than 10 μm.

[0085] In some embodiments, the distance between the first portion and the third sub-part ranges from 267 to 327 μm;

[0086] The distance between the first part and the second sub-part ranges from 129 to 157 μm;

[0087] The linewidth of the first part ranges from 370 to 478 μm.

[0088] In some embodiments, the distance between the first portion and the third sub-part ranges from 267 to 327 μm;

[0089] The distance between the first part and the second sub-part ranges from 307 to 367 μm;

[0090] The linewidth of the first part ranges from 160 to 280 μm.

[0091] In some embodiments, the distance between the first portion and the third sub-part ranges from 477 to 537 μm;

[0092] The distance between the first part and the second sub-part ranges from 129 to 157 μm;

[0093] The linewidth of the first part ranges from 160 to 280 μm.

[0094] In some embodiments, the distance between the first portion and the second sub-part ranges from 307 to 367 μm;

[0095] The linewidth of the first part ranges from 398 to 458 μm.

[0096] In some embodiments, the distance between the first portion and the second sub-part ranges from 129 to 157 μm;

[0097] The linewidth of the first part ranges from 576 to 668 μm.

[0098] In some embodiments, it also includes a power line, a first clock line, a second clock line, and a data line, which are located on the same layer as the ground line;

[0099] The power line, the first clock line, the second clock line, and the data line extend along the second direction, respectively.

[0100] The orthographic projection of the power line on the substrate lies between the orthographic projections of the first ground line and the second ground line on the substrate;

[0101] The orthographic projection of the first clock line on the substrate lies between the orthographic projection of the second ground line and the orthographic projection of the pad unit on the substrate;

[0102] The orthographic projection of the second clock line on the substrate is located between the orthographic projections of the pad cell and the third ground line on the substrate;

[0103] The orthographic projection of the data line on the substrate lies between the orthographic projections of the third ground line and the fourth ground line on the substrate;

[0104] The pad unit further includes a third pad, a fourth pad, a fifth pad, and a sixth pad, located on the side of the first pad that is projected onto the substrate away from the second pad that is projected onto the substrate.

[0105] The power line is electrically connected to the third pad.

[0106] The first clock line is electrically connected to the fourth pad.

[0107] The second clock line is electrically connected to the fifth pad.

[0108] The data line is electrically connected to the sixth pad.

[0109] In some embodiments, the line width of the first ground wire is greater than the line width of the second ground wire;

[0110] The line width of the fourth ground wire is greater than the line width of the third ground wire;

[0111] The width of the third ground wire is greater than that of the second ground wire.

[0112] Secondly, this disclosure also provides a lamp board, which includes the above-mentioned light-emitting substrate;

[0113] It also includes a driving circuit and at least one lamp area, wherein the driving circuit is electrically connected to the pad unit in the light-emitting substrate; and the lamp area is electrically connected to the light-emitting control line and the light-emitting control bus in the light-emitting substrate.

[0114] The driving circuit includes at least one first driving terminal.

[0115] The light zone includes multiple LED beads, and the light emission control line connects the multiple LED beads in the light zone in series.

[0116] One end of the light-emitting control line is electrically connected to the first driving end, and the other end is electrically connected to the light-emitting control bus. Attached Figure Description

[0117] The accompanying drawings are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the detailed description of exemplary embodiments with reference to the accompanying drawings, in which:

[0118] Figure 1a is a schematic diagram of the wiring of a MiniLED light board near the driver chip in related technologies.

[0119] Figure 1b is a cross-sectional schematic diagram of a double-layer copper trace in a related technology.

[0120] Figure 1c is a schematic diagram of corrosion occurring at the edges of adjacent LED traces and GND traces in related technologies.

[0121] Figure 2a is a wiring diagram around the pad unit in the light-emitting substrate of this disclosure embodiment.

[0122] Figure 2b is an enlarged top view of part A in Figure 2a.

[0123] Figure 2c is a structural cross-sectional view along the BB' section line in Figure 2b.

[0124] Figure 2d is an enlarged top view of the pad unit location in the light-emitting substrate of the present disclosure embodiment.

[0125] Figure 2e is a structural cross-sectional view along the CC' section line in Figure 2a.

[0126] Figure 3 is another wiring diagram around the pad unit in the light-emitting substrate of this disclosure embodiment.

[0127] Figure 4 is another wiring diagram around the pad unit in the light-emitting substrate of this disclosure embodiment.

[0128] Figure 5a is another wiring diagram around the pad unit in the light-emitting substrate of this disclosure embodiment.

[0129] Figure 5b shows another wiring diagram around the pad unit in the light-emitting substrate of this disclosure embodiment.

[0130] Figure 5c shows another wiring diagram around the pad unit in the light-emitting substrate of this embodiment. Detailed Implementation

[0131] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, a light-emitting substrate and a lamp board provided in the embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0132] Embodiments of this disclosure will be described more fully below with reference to the accompanying drawings; however, the embodiments shown may be embodied in different forms and should not be construed as limited to the embodiments set forth in this disclosure. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the scope of this disclosure.

[0133] This disclosure is not limited to the embodiments shown in the accompanying drawings, but includes modifications to the configuration based on manufacturing processes. Therefore, the areas illustrated in the drawings are schematic, and the shapes of the areas shown illustrate specific shapes of the areas, but are not intended to be limiting.

[0134] In related technologies, a single driver chip (IC) in a MiniLED light board drives multiple light zones, with multiple MiniLEDs connected in series within each zone. MiniLED light boards typically employ a single-layer copper trace design. However, for glass-based MiniLED light boards with narrow bezels and high partitioning (i.e., many light zones), due to limited in-plane space, a double-layer copper trace process is required to fabricate the in-plane driving circuitry. Referring to Figure 1a, which shows a schematic diagram of the traces near the driver chip in a MiniLED light board in related technologies, the traces near the driver chip are quite dense. Multiple product reliability tests have revealed that the current trace design still has flaws, resulting in insufficient product reliability.

[0135] Referring to Figure 1b, a cross-sectional schematic diagram of a double-layer copper trace in the related technology is shown. The MiniLED light board with double-layer copper traces has two layers of traces, Cu1 and Cu2, on the substrate. The Cu2 layer trace is located on the upper layer, covered only by the topmost PVX protective layer (in some products, a PVX protective layer and an OC layer). Its reliability is directly related to the thickness of the top PVX protective layer. When the PVX protective layer thickness is constant, reliability tests have shown that the PVX protective layer cannot completely isolate moisture; the entry of moisture will cause corrosion of the Cu2 layer trace.

[0136] Referring to Figure 1a, both the LED trace (used to control the switching of the LED zones) and the GND trace (ground trace) are Cu2 layer traces and are adjacent to each other. The Data trace and Clock trace are also Cu2 layer traces and are connected in series between adjacent driver chips (ICs) in the same column. VDD is a Cu2 layer trace and supplies power to the driver chips (ICs) in the same column (VDD is connected in parallel among the driver chips in the same column). The minimum spacing e between the LED trace and the GND trace is 51 micrometers. The small spacing poses a significant risk of Cu corrosion migration and short circuits. Some corrosion occurs at the edges of adjacent LED traces and GND traces. Referring to Figure 1c, a schematic diagram of corrosion occurring at the edges of adjacent LED traces and GND traces in related technologies is shown. Because of the large potential difference between the GND traces and the LED traces and the small trace spacing (currently 51μm), corrosion will worsen and migrate, eventually leading to a short circuit between the GND traces and the LED traces, which in turn will cause the MiniLED light board to experience lamp explosion defects.

[0137] To address the problem of corrosion migration and short circuits caused by the small spacing and large potential difference between GND traces and LED traces on the same layer in related technologies, in a first aspect, embodiments of this disclosure provide a light-emitting substrate. Referring to Figures 2a, 2b, and 2c, Figure 2a is a wiring diagram around pad units in the light-emitting substrate of this disclosure embodiment; Figure 2b is an enlarged top view of part A in Figure 2a; Figure 2c is a structural cross-sectional view along the BB' section line in Figure 2b; wherein, the light-emitting substrate includes a substrate 1, pad units 2, ground lines 3, grounding lines 4, and light-emitting control lines 5, with the pad units 2, ground lines 3, grounding lines 4, and light-emitting control lines 5 located on one side of the substrate 1; Grounding wire 4 and light-emitting control wire 5 are located on the same layer and on the side of grounding wire 3 away from substrate 1; the orthographic projection of grounding wire 3 on substrate 1 is located on at least one side of the orthographic projection of pad unit 2 on substrate 1, and the orthographic projections of grounding wire 3 and pad unit 2 on substrate 1 are arranged along the first direction X, and grounding wire 3 extends along the second direction Y; pad unit 2 includes a first pad 20 and a second pad 21, and the first pad 20 and the second pad 21 are arranged along the second direction Y; light-emitting control wire 5 is electrically connected to the first pad 20; grounding wire 4 is electrically connected to the second pad 21 and grounding wire 3; light-emitting control wire 5 and grounding wire 4 are arranged at intervals along the second direction Y; the first direction X and the second direction Y intersect.

[0138] In some embodiments, the minimum distance between the orthographic projections of the light-emitting control line 5 and the grounding line 4 onto the substrate 1 is 0.5 to 0.8 times the width of the first pad 20 or the second pad 21.

[0139] In some embodiments, referring to FIG2a, the pad unit 2 is a collection of pads (such as the first pad 20 and the second pad 21) for electrically connecting the driving circuit (i.e., the driving chip IC, not shown in the figure) and various circuit traces (such as ground line 3, grounding line 4, and light-emitting control line 5). The pad unit 2 includes multiple pads. The pads are electrodes for electrically connecting the driving circuit and various circuit traces. The light-emitting substrate includes at least one lamp area 6, and multiple light-emitting elements 60 are connected in series in each lamp area 6. The light-emitting control line 5 includes at least one, and each light-emitting control line 5 is electrically connected to all the light-emitting elements 60 in one lamp area 6. One end of the light-emitting control line 5 is electrically connected to the first pad 20, and the other end of the light-emitting control line 5 is electrically connected to the light-emitting control bus 7. The light-emitting control bus 7 is located on the same layer as the ground line 3, and the light-emitting control line 5 is electrically connected to the light-emitting control bus 7 through a via. The driving circuit controls the opening and closing of each lamp area 6 through the light-emitting control line 5, and the driving circuit is electrically connected to the ground line 3 through the grounding line 4.

[0140] In some embodiments, the grounding wire 4 and the light-emitting control line 5 are located in the same layer. On the one hand, this means that the grounding wire 4 and the light-emitting control line 5 are formed simultaneously through a single patterning process. On the other hand, this means that the grounding wire 4 and the light-emitting control line 5 are located on the same layer at the same height in a direction perpendicular to the substrate 1.

[0141] In some embodiments, the width dimension of the first pad 20 or the second pad 21 refers to the dimension of the first pad 20 or the second pad 21 along the second direction Y. The dimension of the first pad 20 or the second pad 21 along the second direction Y is less than or equal to the dimension of the first pad 20 or the second pad 21 along the first direction X.

[0142] In some embodiments, the width of the first pad 20 or the second pad 21 ranges from 120 to 156 μm. In some embodiments, the minimum distance between the orthographic projections of the light-emitting control line 5 and the grounding line 4 onto the substrate 1 is 60 μm or more.

[0143] In some embodiments, the minimum distance between the orthographic projections of the light-emitting control line 5 and the grounding line 4 onto the substrate 1 ranges from 86 to 89 μm.

[0144] In some embodiments, referring to FIG2c, the pad unit 2, the grounding line 4, and the light-emitting control line 5 are located on the same layer. The light-emitting substrate further includes a first insulating layer 8, located on the side of the pad unit 2, the grounding line 4, and the light-emitting control line 5 away from the substrate 1. The first insulating layer 8 has a plurality of openings 80. The orthographic projection of a portion of the openings 80 on the substrate 1 is located within the orthographic projection area of ​​the light-emitting control line 5 on the substrate 1. The light-emitting control line 5 is exposed at this portion of the openings 80, and the exposed portion serves as the first pad 20. The orthographic projection of another portion of the openings 80 on the substrate 1 is located within the orthographic projection area of ​​the grounding line 4 on the substrate 1. The grounding line 4 is exposed at this portion of the openings 80, and the exposed portion serves as the second pad 21.

[0145] Among them, the pad unit 2, the grounding line 4, and the light-emitting control line 5 are located on the same layer. This means that the pad unit 2, the grounding line 4, and the light-emitting control line 5 are formed simultaneously through a single patterning process. It also means that the pad unit 2, the grounding line 4, and the light-emitting control line 5 are located on the same layer at the same height in the direction perpendicular to the substrate 1.

[0146] In some embodiments, referring to FIG2d, which is an enlarged top view of the pad unit position in the light-emitting substrate of the present disclosure, the width a of the area where the light-emitting control line 5 located at the periphery of the first pad 20 and the first insulating layer 8 are orthogonally projected onto the substrate 1 is 10 μm or more; the width b of the area where the grounding line 4 located at the periphery of the second pad 21 and the first insulating layer 8 are orthogonally projected onto the substrate 1 is 10 μm or more.

[0147] In some embodiments, referring to FIG2d, the width a of the region where the light-emitting control line 5 located at the periphery of the first pad 20 and the first insulating layer 8 overlap on the substrate 1 by orthographic projection is 29 μm. The width b of the region where the grounding line 4 located at the periphery of the second pad 21 and the first insulating layer 8 overlap on the substrate 1 by orthographic projection is 29 μm.

[0148] In some embodiments, referring to FIG2e, which is a structural cross-sectional view along the CC' section line in FIG2a, the light-emitting substrate further includes a second insulating layer 9 located between the grounding wire 4 and the ground wire 3. A first via 91 is provided in the second insulating layer 9, and the grounding wire 4 is electrically connected to the ground wire 3 through the first via 91.

[0149] In some embodiments, referring to FIG2e, the second insulating layer 9 is also located between the light-emitting control line 5 and the light-emitting control bus 7, and a second via 92 is also provided in the second insulating layer 9, through which the light-emitting control line 5 is electrically connected to the light-emitting control bus 7.

[0150] In some embodiments, the first via 91 has a rectangular shape and a size of 140μm*140μm.

[0151] In some embodiments, the linewidths of the light-emitting control line 5 and the grounding line 4 are narrowed, for example, by narrowing the opposite two edges of the light-emitting control line 5 and the grounding line 4 by 19 μm each in the linewidth direction, i.e., the linewidths of the light-emitting control line 5 and the grounding line 4 are both narrowed by 38 μm. This configuration increases the spacing between adjacent light-emitting control lines 5 and grounding lines 4. For example, compared to the minimum spacing between GND traces and LED traces in related technologies (51 μm), the minimum distance between adjacent light-emitting control lines 5 and grounding lines 4 in this embodiment can be increased to 89 μm (i.e., 51+19+19 μm). This avoids short circuits between the grounding line 4 and the light-emitting control line 5 caused by trace corrosion migration during product reliability testing, thereby preventing lamp explosion defects in the lamp area of ​​the light-emitting substrate.

[0152] In some embodiments, referring to FIG2b, there is at least one first pad 20 and at least one light-emitting control line 5, and the light-emitting control line 5 and the first pad 20 are electrically connected in a one-to-one correspondence; there is at least one second pad 21, and the orthographic projection of the first pad 20 on the substrate 1 is located on at least one side of the orthographic projection of the second pad 21 on the substrate 1; the orthographic projections of at least two ground lines 3 on the substrate 1 are located on the same side of the orthographic projection of the pad unit 2 on the substrate 1.

[0153] In some embodiments, referring to FIG2b, the first pad 20 includes at least a first first pad 201, the second pad 21 includes a first second pad 211, the light emission control line 5 includes a first control line 51, the first control line 51 and the grounding line 4 are arranged along the second direction Y, and the first control line 51 is electrically connected to the first first pad 201.

[0154] The first control line 51 includes a first sub-section 511 and a second sub-section 512. The first sub-section 511 and the second sub-section 512 are arranged sequentially along a first direction X away from the first first pad 201. The first sub-section 511 extends along a second direction Y away from the first first pad 201 and one end of it is electrically connected to the first first pad 201. The second sub-section 512 extends along the first direction X and is electrically connected to the other end of the first sub-section 511.

[0155] The ground line 3 includes a first ground line 31 and a second ground line 32. The orthographic projections of the first ground line 31 and the second ground line 32 on the substrate 1 are located on the same side of the orthographic projection of the pad unit 2 on the substrate 1. The orthographic projection of the first ground line 31 on the substrate 1 is further away from the orthographic projection of the pad unit 2 on the substrate 1 than the orthographic projection of the second ground line 32 on the substrate 1.

[0156] The grounding wire 4 includes a first part 41 and a second part 42, which are electrically connected. The orthographic projection of the first part 41 on the substrate 1 is located between the orthographic projections of the first ground wire 31 and the second ground wire 32 on the substrate 1, and the first part 41 is electrically connected to the first ground wire 31 and the second ground wire 32 respectively. The orthographic projection of the second part 42 on the substrate 1 is located between the orthographic projection of the second ground wire 32 and the first second pad 201 on the substrate 1, and the second part 42 is electrically connected to the first second pad 211.

[0157] In some embodiments, the orthographic projection of the second portion 42 on the substrate 1 extends from the orthographic projection of the second ground line 32 and the first second pad 201 on the substrate 1 to the orthographic projection of the first ground line 31 and the second ground line 32 on the substrate 1.

[0158] In some embodiments, referring to FIG2b, the first pad 20 further includes a second first pad 202, the orthographic projections of the second first pad 202 and the first first pad 201 on the substrate 1 being mirror-symmetrical about the orthographic projection of the first second pad 211 on the substrate 1 as the center of symmetry.

[0159] The light-emitting control line 5 also includes a second control line 52, which is located on the side of the grounding line 4 away from the first control line 51. The second control line 52 is electrically connected to the second first pad 202. The second control line 52 includes a third sub-part 521, which extends along the first direction X and one end is electrically connected to the second first pad 202.

[0160] In some embodiments, referring to FIG2b, the first portion 41 extends along the first direction X, and the second portion 42 extends along the third direction Z. The first direction X is perpendicular to the second direction Y, and the third direction Z intersects the first direction X to form a first acute angle α. The second portion 42 is located on the side of the first portion 41 closer to the third sub-portion 521. The first sub-portion 511 and the second portion 42 have a minimum distance c between the grounding wire 4 and the light-emitting control wire 5.

[0161] In some embodiments, at positions other than the minimum distance c, the distance between the first sub-part 511 and the second part 42 is greater than the minimum distance c. The spacing between adjacent side edges of the first sub-part 511 and the second part 42 is h, where h > c; c = h * cosα. The spacing h between adjacent side edges of the first sub-part 511 and the second part 42 is 89 μm. To ensure that the minimum distance c ≥ 86 μm, according to c = cosα * 89 μm, the angle control range of the first acute angle α is 0 < α ≤ 15°.

[0162] In some embodiments, referring to FIG2b, the line width d1 of the first part 41 is at least twice the line width d2 of the second part 42; a via (i.e., a first via 91) is provided at the position where the first part 41 is electrically connected to the first ground wire 31 and the second ground wire 32, and the number of vias at the position where the first part 41 is electrically connected to the first ground wire 31 is greater than the number of vias at the position where the first part 41 is electrically connected to the second ground wire 32; the distance s1 between the first part 41 and the third sub-part 521 is greater than the distance s2 between the first part 41 and the second sub-part 512.

[0163] In some embodiments, referring to FIG2b, the first portion 41 is electrically connected to the first ground wire 31 via a two-row, three-column via, and the first portion 41 is electrically connected to the second ground wire 32 via a two-row, one-column via. The row direction of the vias is along the first direction X, and the column direction of the vias is along the second direction Y.

[0164] In some embodiments, referring to FIG2b, the distance s1 between the first portion 41 and the third sub-portion 521 ranges from 267 to 327 μm; the distance s2 between the first portion 41 and the second sub-portion 512 ranges from 129 to 157 μm; and the linewidth d1 of the first portion 41 ranges from 370 to 478 μm. The minimum distance c between the first sub-portion 511 and the second portion 42 is 86 μm. The area between the first portion 41 and the third sub-portion 521 is the region with the highest risk of corrosion short circuits, and the trace spacing in the region with the highest risk of corrosion short circuits is greater than 86 μm.

[0165] In Figure 1a of the related technology, the spacing between the GND trace on the left side of the pad and the LED trace below it is 51 μm (minimum spacing). The area between the GND trace on the left side of the pad and the LED trace below it is the region with the highest risk of corrosion and short circuit. In Figure 2b of this embodiment, the distance s1 between the first part 41 and the third sub-part 521 is increased from 51 μm to 267-327 μm, further increasing the spacing between the first part 41 and the third sub-part 521 in the region with the highest risk of corrosion and short circuit, thereby significantly improving the reliability and lifespan of the light-emitting substrate. In Figure 2b of this embodiment, the minimum distance c between the first sub-part 511 and the second part 42 is increased from 51 μm to 86 μm. In Figure 1a of the related technology, the spacing between the GND trace on the left side of the pad and the LED trace above it is 91 μm. In Figure 2b of this embodiment, the distance s2 between the first part 41 and the second sub-part 512 is increased from 91 μm to 129-157 μm. In related technology Figure 1a, the GND trace on the left side of the pad located on the Cu2 layer is electrically connected to the GND bus on the Cu1 layer via a three-row, three-column configuration of nine vias. In this embodiment, Figure 2b reduces the number of vias connecting the first part 41 and the first ground line 31 from nine to six vias in a two-row, three-column configuration. In related technology Figure 1a, the linewidth of the larger portion of the GND trace on the left side of the pad is 674 μm. In this embodiment, Figure 2b controls the linewidth d1 of the first part 41 to be between 370 and 478 μm. The above-mentioned configuration in this embodiment satisfies the electrical and process requirements of the light-emitting control line 5 and the grounding line 4 around the pad unit 2, and greatly improves the corrosion migration problem caused by moisture ingress and large potential difference between the light-emitting control line 5 and the grounding line 4 within the light-emitting substrate, thereby avoiding short circuits and lamp explosions between the light-emitting control line 5 and the grounding line 4.

[0166] In some embodiments, referring to FIG3, another wiring diagram around the pad unit in the light-emitting substrate of this disclosure is shown; wherein, the line width d1 of the first part 41 is equal to the line width d2 of the second part 42; a via (i.e., a first via 91) is provided at the position where the first part 41 is electrically connected to the first ground line 31 and the second ground line 32, and the number of vias at the position where the first part 41 is electrically connected to the first ground line 31 is greater than the number of vias at the position where the first part 41 is electrically connected to the second ground line 32; the absolute value of the difference between the distance s1 between the first part 41 and the third sub-part 521 and the distance s2 between the first part 41 and the second sub-part 512 is 20 to 100 μm.

[0167] The line width d1 of the first part 41 and the line width d2 of the second part 42 are equal, which can be completely equal in an absolute sense, or the line width d1 of the first part 41 and the line width d2 of the second part 42 can differ within ±10μm.

[0168] In some embodiments, referring to FIG3, the first part 41 is electrically connected to the first ground wire 31 through three vias arranged along the first direction X, and the first part 41 is electrically connected to the second ground wire 32 through one via.

[0169] In some embodiments, referring to FIG3, the distance s1 between the first portion 41 and the third sub-portion 521 ranges from 267 to 327 μm; the distance s2 between the first portion 41 and the second sub-portion 512 ranges from 307 to 367 μm; and the linewidth d1 of the first portion 41 ranges from 160 to 280 μm. The minimum distance c between the first sub-portion 511 and the second portion 42 is 86 μm. The area between the first portion 41 and the third sub-portion 521 is the region with the highest risk of corrosion and short circuit. By increasing the distance s1 between the first portion 41 and the third sub-portion 521 from 51 μm to 267 to 327 μm, the spacing between them is further increased, thereby significantly improving the reliability and lifespan of the light-emitting substrate.

[0170] In some embodiments, referring to FIG4, another wiring diagram around the pad unit in the light-emitting substrate of the present disclosure is shown; wherein, the line width d1 of the first part 41 is equal to the line width d2 of the second part 42; a via (i.e., a first via 91) is provided at the position where the first part 41 is electrically connected to the first ground line 31 and the second ground line 32, and the number of vias at the position where the first part 41 is electrically connected to the first ground line 31 is greater than the number of vias at the position where the first part 41 is electrically connected to the second ground line 32; the distance s1 between the first part 41 and the third sub-part 521 is greater than the distance s2 between the first part 41 and the second sub-part 512.

[0171] The line width d1 of the first part 41 and the line width d2 of the second part 42 are equal, which can be completely equal in an absolute sense, or the line width d1 of the first part 41 and the line width d2 of the second part 42 can differ within ±10μm.

[0172] In some embodiments, referring to FIG4, the first portion 41 is electrically connected to the first ground wire 31 through three vias arranged along the first direction X, and the first portion 41 is electrically connected to the second ground wire 32 through one via. The vias connecting the first portion 41 to the first ground wire 31 and the second ground wire 32 are arranged along the first direction.

[0173] In some embodiments, referring to FIG4, the distance s1 between the first portion 41 and the third sub-portion 521 ranges from 477 to 537 μm; the distance s2 between the first portion 41 and the second sub-portion 512 ranges from 129 to 157 μm; and the linewidth d1 of the first portion 41 ranges from 160 to 280 μm. The minimum distance c between the first sub-portion 511 and the second portion 42 is 86 μm. The area between the first portion 41 and the third sub-portion 521 is the region with the highest risk of corrosion and short circuit. By increasing the distance s1 between the first portion 41 and the third sub-portion 521 from 51 μm to 477 to 537 μm, the spacing between them is further increased, thereby significantly improving the reliability and lifespan of the light-emitting substrate.

[0174] In some embodiments, referring to FIG5a, it is another wiring diagram around the pad unit in the light-emitting substrate of the present disclosure; FIG5b, it is another wiring diagram around the pad unit in the light-emitting substrate of the present disclosure; FIG5c, it is another wiring diagram around the pad unit in the light-emitting substrate of the present disclosure; wherein, the first part 41 extends along the first direction X, the second part 42 extends along the first direction X, the distance h between the second part 42 and the first sub-part 511 and the distance h1 between the second part 42 and the third sub-part 521 are equal, and are the minimum distance c between the grounding line 4 and the light-emitting control line 5.

[0175] The distance h between the second part 42 and the first sub-part 511 and the distance h1 between the second part 42 and the third sub-part 521 can be completely equal in an absolute sense, or the difference between the distance h between the second part 42 and the first sub-part 511 and the distance h1 between the second part 42 and the third sub-part 521 can be within ±10μm.

[0176] In some embodiments, referring to Figures 5a and 5b, the line width d1 of the first portion 41 is at least twice the line width d2 of the second portion 42.

[0177] In some embodiments, referring to Figures 5a and 5b, the first portion 41 is electrically connected to the first ground wire 31 via a two-row, three-column via, and the first portion 41 is electrically connected to the second ground wire 32 via a two-row, one-column via. The row direction of the vias is along the first direction X, and the column direction of the vias is along the second direction Y.

[0178] In some embodiments, referring to FIG5a, the second portion 42 is located on the side of the first portion 41 closer to the third sub-portion 521; the distance s1 between the first portion 41 and the third sub-portion 521 is greater than the distance s2 between the first portion 41 and the second sub-portion 512.

[0179] In some embodiments, referring to FIG5a, the distance s1 between the first portion 41 and the third sub-portion 521 ranges from 267 to 327 μm; the distance s2 between the first portion 41 and the second sub-portion 512 ranges from 129 to 157 μm; and the linewidth d1 of the first portion 41 ranges from 370 to 478 μm. The minimum distance c between the first sub-portion 511 and the second portion 42 is 89 μm. The area between the first portion 41 and the third sub-portion 521 is the region with the highest risk of corrosion short circuit. In this embodiment, the distance s1 between the first portion 41 and the third sub-portion 521 is increased from 51 μm to more than 89 μm, further increasing the spacing between the first portion 41 and the third sub-portion 521 in the region with the highest risk of corrosion short circuit, thereby significantly improving the reliability and lifespan of the light-emitting substrate.

[0180] In some embodiments, referring to Figures 5b and 5c, the distance s1 between the first portion 41 and the third sub-part 521 is equal to the distance h1 between the second portion 42 and the third sub-part 521; and the distance s1 between the first portion 41 and the third sub-part 521 is less than the distance s2 between the first portion 41 and the second sub-part 512.

[0181] In some embodiments, referring to FIG5b, the distance s2 between the first portion 41 and the second sub-portion 512 ranges from 307 to 367 μm; the line width d1 of the first portion 41 ranges from 398 to 458 μm.

[0182] In some embodiments, referring to FIG5c, the line width d1 of the first portion 41 is at least 3 times the line width d2 of the second portion 42.

[0183] In some embodiments, referring to FIG5c, the first portion 41 is electrically connected to the first ground wire 31 via a three-row, three-column via, and the first portion 41 is electrically connected to the second ground wire 32 via a three-row, one-column via. The row direction of the vias is along the first direction X, and the column direction of the vias is along the second direction Y.

[0184] In some embodiments, referring to FIG5c, the distance s2 between the first portion 41 and the second sub-portion 512 ranges from 129 to 157 μm; the line width d1 of the first portion 41 ranges from 576 to 668 μm.

[0185] In some embodiments, referring to FIG2b, FIG3 and FIG4, the first pad 20 further includes a third first pad 203, the third first pad 203 and the first first pad 201 being arranged along a first direction X; the second pad 21 further includes a second second pad 212, the second second pad 212 and the first second pad 211 being arranged along a first direction X.

[0186] The light-emitting control line 5 also includes a third control line 53, which is electrically connected to the third first pad 203. The third control line 53 includes a fourth sub-part 531 and a fifth sub-part 532, which are electrically connected. The orthographic projections of the fourth sub-part 531 and the first sub-part 511 on the substrate 1 are mirror-symmetric about the orthographic projection of the pad unit 2 on the substrate 1. The orthographic projections of the fifth sub-part 532 and the second sub-part 512 on the substrate 1 are mirror-symmetric about the orthographic projection of the pad unit 2 on the substrate 1.

[0187] Ground line 3 also includes a third ground line 33 and a fourth ground line 34. The orthographic projections of the third ground line 33 and the second ground line 32 on the substrate 1 are mirror-symmetric with the orthographic projection of the pad unit 2 on the substrate 1 as the center of symmetry. The orthographic projections of the fourth ground line 34 and the first ground line 31 on the substrate 1 are mirror-symmetric with the orthographic projection of the pad unit 2 on the substrate 1 as the center of symmetry.

[0188] The grounding wire 4 also includes a third part 43 and a fourth part 44, which are electrically connected. The orthographic projections of the third part 43 and the second part 42 on the substrate 1 are mirror-symmetrical about the orthographic projection of the pad unit 2 on the substrate 1. The third part 43 is electrically connected to the second pad 212 and the second part 42, respectively. The orthographic projections of the fourth part 44 and the first part 41 on the substrate 1 are mirror-symmetrical about the orthographic projection of the pad unit 2 on the substrate 1. The fourth part 44 is electrically connected to the third ground wire 33 and the fourth ground wire 34, respectively.

[0189] In some embodiments, referring to FIG2b, the first pad 20 further includes a fourth first pad 204, the orthographic projections of the fourth first pad 204 and the third first pad 203 on the substrate 1 being mirror-symmetrical about the orthographic projection of the second second pad 212 on the substrate 1 as the center of symmetry.

[0190] The light emission control line 5 also includes a fourth control line 54, which includes a sixth sub-section 541. The sixth sub-section 541 is electrically connected to the fourth first pad 204. The orthographic projections of the sixth sub-section 541 and the third sub-section 521 on the substrate 1 are mirror-symmetrical about the orthographic projection of the pad unit 2 on the substrate 1 as the center of symmetry.

[0191] Among them, the two structures that are mirror-symmetrical about the orthographic projection of the pad unit 2 on the substrate 1 can be completely symmetrical in size and shape in an absolute sense, or the two structures can be mirror-symmetrical about the orthographic projection of the pad unit 2 on the substrate 1 only in terms of their setting position. The two structures can be slightly different in size and shape, such as a difference of ±10μm in width and / or length.

[0192] In some embodiments, referring to FIG2b, the line width d4 of the fourth part 44 is at least twice the line width d3 of the third part 43; a via (i.e., a first via 91) is provided at the position where the fourth part 44 is electrically connected to the third ground line 33 and the fourth ground line 34, and the number of vias at the position where the fourth part 44 is electrically connected to the fourth ground line 34 is greater than the number of vias at the position where the fourth part 44 is electrically connected to the third ground line 33; the distance s3 between the fourth part 44 and the sixth sub-part 541 is greater than the distance s4 between the fourth part 44 and the fifth sub-part 532.

[0193] In some embodiments, referring to FIG2b, the fourth portion 44 is electrically connected to the fourth ground wire 34 via a two-row, three-column via, and the fourth portion 44 is electrically connected to the third ground wire 33 via a two-row, two-column via. The row direction of the vias is along the first direction X, and the column direction of the vias is along the second direction Y.

[0194] In some embodiments, referring to FIG2b, the distance s3 between the fourth portion 44 and the sixth sub-portion 541 ranges from 267 to 327 μm; the distance s4 between the fourth portion 44 and the fifth sub-portion 532 ranges from 129 to 157 μm; and the linewidth d4 of the fourth portion 44 ranges from 370 to 478 μm. The minimum distance c between the fourth sub-portion 531 and the third portion 43 is 86 μm. The area between the fourth portion 44 and the sixth sub-portion 541 is the region with the highest risk of corrosion short circuits, and the trace spacing in the region with the highest risk of corrosion short circuits is greater than 86 μm.

[0195] Referring to Figure 3 in some embodiments, the line width d4 of the fourth part 44 is equal to the line width d3 of the third part 43; a via (i.e., a first via 91) is provided at the position where the fourth part 44 is electrically connected to the third ground line 33 and the fourth ground line 34, and the number of vias at the position where the fourth part 44 is electrically connected to the fourth ground line 34 is greater than the number of vias at the position where the fourth part 44 is electrically connected to the third ground line 33; the absolute value of the difference between the distance s3 between the fourth part 44 and the sixth sub-part 541 and the distance s4 between the fourth part 44 and the fifth sub-part 532 is 20 to 100 μm.

[0196] The line width d4 of the fourth part 44 is equal to the line width d3 of the third part 43. This can mean that they are completely equal in an absolute sense, or that the line width d4 of the fourth part 44 and the line width d3 of the third part 43 are different within ±10μm.

[0197] In some embodiments, referring to FIG3, the fourth part 44 is electrically connected to the fourth ground wire 34 through three vias arranged along the first direction X, and the fourth part 44 is electrically connected to the third ground wire 33 through two vias.

[0198] In some embodiments, referring to FIG3, the distance s3 between the fourth portion 44 and the sixth sub-portion 541 ranges from 267 to 327 μm; the distance s4 between the fourth portion 44 and the fifth sub-portion 532 ranges from 307 to 367 μm; and the linewidth d4 of the fourth portion 44 ranges from 160 to 280 μm. The minimum distance c between the fourth sub-portion 531 and the third portion 43 is 86 μm. The area between the fourth portion 44 and the sixth sub-portion 541 is the region with the highest risk of corrosion and short circuit. By increasing the distance s3 between the fourth portion 44 and the sixth sub-portion 541 from 51 μm to 267 to 327 μm, the spacing between them is further increased, thereby significantly improving the reliability and lifespan of the light-emitting substrate.

[0199] In some embodiments, referring to FIG4, the line width d4 of the fourth part 44 is equal to the line width d3 of the third part 43; a via (i.e., a first via 91) is provided at the position where the fourth part 44 is electrically connected to the third ground line 33 and the fourth ground line 34, and the number of vias at the position where the fourth part 44 is electrically connected to the fourth ground line 34 is greater than the number of vias at the position where the fourth part 44 is electrically connected to the third ground line 33; the distance s3 between the fourth part 44 and the sixth sub-part 541 is greater than the distance s4 between the fourth part 44 and the fifth sub-part 532.

[0200] The line width d4 of the fourth part 44 is equal to the line width d3 of the third part 43. This can mean that they are completely equal in an absolute sense, or that the line width d4 of the fourth part 44 and the line width d3 of the third part 43 are different within ±10μm.

[0201] In some embodiments, referring to FIG4, the fourth portion 44 is electrically connected to the fourth ground wire 34 through three vias arranged along the first direction X, and the fourth portion 44 is electrically connected to the third ground wire 33 through two vias. The vias connecting the fourth portion 44 to the third ground wire 33 and the fourth ground wire 34 are arranged along the first direction.

[0202] In some embodiments, referring to FIG4, the distance s3 between the fourth portion 44 and the sixth sub-portion 541 ranges from 477 to 537 μm; the distance s4 between the fourth portion 44 and the fifth sub-portion 532 ranges from 129 to 157 μm; and the linewidth d4 of the fourth portion 44 ranges from 160 to 280 μm. The minimum distance c between the fourth sub-portion 531 and the third portion 43 is 86 μm. The area between the fourth portion 44 and the sixth sub-portion 541 is the region with the highest risk of corrosion and short circuit. By increasing the distance s3 between the fourth portion 44 and the sixth sub-portion 541 from 51 μm to 477 to 537 μm, the spacing between them is further increased, thereby significantly improving the reliability and lifespan of the light-emitting substrate.

[0203] In some embodiments, referring to Figures 2b, 3, and 4, the third portion 43 extends along the fourth direction Z', and the fourth direction Z' intersects the first direction X to form a second acute angle α'; the fourth sub-part 531 and the third portion 43 have a minimum distance c; the angle range of the second acute angle is: arctanF' / E≤α'≤15°; where α' is the second acute angle; F' is the maximum distance between the side of the fourth portion 44 closest to the sixth sub-part 541 and the side of the third portion 43 closest to the sixth sub-part 541; E is the distance between the side of the fourth portion 44 furthest from the fourth sub-part 531 and the fourth sub-part.

[0204] In some embodiments, referring to Figures 2b, 3 and 4, the angle range of the first acute angle is: arctanF / D≤α≤15°; where α is the first acute angle; F is the maximum distance between the side of the first part 41 closest to the third sub-part 521 and the side of the second part 42 closest to the third sub-part 521; and D is the distance between the side of the first part 41 furthest from the first sub-part 511 and the first sub-part 511.

[0205] In some embodiments, referring to Figures 2b, 3 and 4, α = α'; F = F'; when D > E, arctanF / D ≤ α ≤ 15°; when D = E, arctanF / D ≤ α ≤ 15°; when D < E, arctanF / E ≤ α ≤ 15°.

[0206] In some embodiments, referring to FIG4, the linewidth d1 of the first part 41 can be controlled between 160 and 280 μm. At this time, the F value ranges from 388 to 448 μm, and the distance s1 between the first part 41 and the third sub-part 521 in the region with the highest risk of corrosion short circuit can be greater than 89 μm. When F = F', D = 2184 μm, and E = 2110 μm, the included angle α of the first acute angle and the included angle α' of the second acute angle are based on tanα = F / E. At this time, α ≈ 10.43°, so 10.43° ≤ α ≤ 15°.

[0207] In some embodiments, considering the schemes in Figures 2b, 3, 4, 5a, 5b and 5c as a whole, the line width d1 of the first part 41 can be varied or can be moved up and down (meaning moved away from or closer to the third sub-part 521). While ensuring that the minimum distance c between the grounding wire 4 and the light-emitting control wire 5 is ≥89μm, the range of F or F' can be defined as 0≤F≤448μm, then 0≤α≤15°.

[0208] In some embodiments, referring to Figures 5a and 5b, the line width d4 of the fourth portion 44 is at least twice the line width d3 of the third portion 43.

[0209] In some embodiments, referring to Figures 5a and 5b, the fourth portion 44 is electrically connected to the fourth ground wire 34 via a two-row, three-column via, and the fourth portion 44 is electrically connected to the third ground wire 33 via a two-row, two-column via. The row direction of the vias is along the first direction X, and the column direction of the vias is along the second direction Y.

[0210] In some embodiments, referring to FIG5a, the third portion 43 is located on the side of the fourth portion 44 closer to the sixth sub-part 541; the distance s3 between the fourth portion 44 and the sixth sub-part 541 is greater than the distance s4 between the fourth portion 44 and the fifth sub-part 532.

[0211] In some embodiments, referring to FIG5a, the distance s3 between the fourth portion 44 and the sixth sub-portion 541 ranges from 267 to 327 μm; the distance s4 between the fourth portion 44 and the fifth sub-portion 532 ranges from 129 to 157 μm; and the linewidth d4 of the fourth portion 44 ranges from 370 to 478 μm. The minimum distance c between the fourth sub-portion 531 and the third portion 43 is 89 μm. The area between the fourth portion 44 and the sixth sub-portion 541 is the region with the highest risk of corrosion short circuit. In this embodiment, the distance s3 between the fourth portion 44 and the sixth sub-portion 541 is increased from 51 μm to more than 89 μm, further increasing the spacing between the fourth portion 44 and the sixth sub-portion 541 in the region with the highest risk of corrosion short circuit, thereby significantly improving the reliability and lifespan of the light-emitting substrate.

[0212] In some embodiments, referring to Figures 5b and 5c, the distance s3 between the fourth part 44 and the sixth sub-part 541 is equal to the distance h2 between the third part 43 and the sixth sub-part 541; and the distance s3 between the fourth part 44 and the sixth sub-part 541 is less than the distance s4 between the fourth part 44 and the fifth sub-part 532.

[0213] In some embodiments, referring to FIG5b, the distance s4 between the fourth portion 44 and the fifth sub-portion 532 ranges from 307 to 367 μm; the line width d4 of the fourth portion 44 ranges from 398 to 458 μm.

[0214] In some embodiments, referring to FIG5c, the line width d4 of the fourth portion 44 is at least three times the line width d3 of the third portion 43.

[0215] In some embodiments, referring to FIG5c, the fourth portion 44 is electrically connected to the fourth ground wire 34 via a three-row, three-column via, and the fourth portion 44 is electrically connected to the third ground wire 33 via a three-row, two-column via. The row direction of the vias is along the first direction X, and the column direction of the vias is along the second direction Y.

[0216] In some embodiments, referring to FIG5c, the distance s4 between the fourth portion 44 and the fifth sub-portion 532 ranges from 129 to 157 μm; the line width d4 of the fourth portion 44 ranges from 576 to 668 μm.

[0217] In some embodiments, referring to Figures 2b, 3, 4, 5a, 5b, and 5c, the light-emitting substrate further includes a power line 10, a first clock line 11, a second clock line 12, and a data line 13, which are located on the same layer as the ground line 3; the power line 10, the first clock line 11, the second clock line 12, and the data line 13 Extending along the second direction Y, the orthographic projection of power line 10 on substrate 1 lies between the orthographic projections of first ground line 31 and second ground line 32 on substrate 1; the orthographic projection of first clock line 11 on substrate 1 lies between the orthographic projections of second ground line 32 and pad unit 2 on substrate 1; the orthographic projection of second clock line 12 on substrate 1 lies between the orthographic projections of pad unit 2 and third ground line 33 on substrate 1; the orthographic projection of data line 13 on substrate 1 lies between the orthographic projections of third ground line 33 and fourth ground line 34 on substrate 1; pad unit 2 also includes third pad 22, fourth pad 23, fifth pad 24 and sixth pad 25, located on the side of the orthographic projection of first pad 20 on substrate 1 away from the orthographic projection of second pad 21 on substrate 1; power line 10 is electrically connected to third pad 22, first clock line 11 is electrically connected to fourth pad 23, second clock line 12 is electrically connected to fifth pad 24, and data line 13 is electrically connected to sixth pad 25.

[0218] The power line 10 provides power to the drive circuit (i.e., the driver chip IC, not shown in the figure) electrically connected to the pad unit 2. The first clock line 11 and the second clock line 12 provide clock signals when the drive circuit drives each lamp zone 6 to display. The data line 13 provides data signals when the drive circuit drives each lamp zone 6 to display. The ground line 3 provides a ground signal or a low voltage signal to the drive circuit and each lamp zone 6.

[0219] In some embodiments, the linewidth of the first ground wire 31 is greater than the linewidth of the second ground wire 32; the linewidth of the fourth ground wire 34 is greater than the linewidth of the third ground wire 33; and the linewidth of the third ground wire 33 is greater than the linewidth of the second ground wire 32. The linewidth of each ground wire 3 refers to the dimension of each ground wire 3 along the first direction X.

[0220] In some embodiments, referring to Figures 2b, 3, 4, 5a, 5b and 5c, the orthographic projections of the first ground line 31 and the fourth ground line 34 on the substrate 1 are mirror-symmetrical about the orthographic projection of the pad unit 2 on the substrate 1 as the center of symmetry.

[0221] In some embodiments, referring to FIG2a, the light emission control bus 7 includes two buses, and the orthographic projections of the two light emission control buses 7 on the substrate 1 are respectively located on the side away from the orthographic projection of the first ground line 31 and the fourth ground line 34 on the substrate 1; and the orthographic projections of the two light emission control buses 7 on the substrate 1 are mirror-symmetrical about the orthographic projection of the pad unit 2 on the substrate 1 as the center of symmetry.

[0222] The light-emitting substrate provided in this embodiment is mainly used in MiniLED light boards. Compared with LCD (liquid crystal) panels or OLED (organic electroluminescent) panels, the circuit traces in the MiniLED light-emitting substrate are only covered by an insulating layer, and the entire MiniLED light-emitting substrate is exposed. External moisture and oxygen can more easily enter the MiniLED light-emitting substrate and corrode the circuit traces, leading to material migration and short circuits between lines. In contrast, the circuit traces in LCD (liquid crystal) panels or OLED (organic electroluminescent) panels are vacuum-sealed, making it difficult for external moisture and oxygen to enter the sealed space. Therefore, the circuit traces in LCD or OLED panels are less prone to corrosion and short circuits. Thus, the trace design and trace spacing design in this embodiment can better prevent short circuits between the light-emitting control line 5 and the grounding line 4 located on the same layer in the MiniLED light-emitting substrate, thereby avoiding the problem of MiniLED light board explosion. Meanwhile, in the MiniLED light-emitting substrate, the Cu1 layer where the ground line 3 is located is thicker, while the Cu2 layer where the grounding line 4 and the light-emitting control line 5 are located is thinner. The wiring design and wiring spacing design in this embodiment can better avoid short circuits between the light-emitting control line 5 and the grounding line 4 located on the same layer in the MiniLED light-emitting substrate, thereby avoiding the problem of MiniLED lamp board exploding.

[0223] The light-emitting substrate provided in this embodiment has a significantly increased distance between the light-emitting control line 5 and the grounding line 4 compared to the spacing between the GND trace and the LED trace in related technologies. By narrowing the line width or changing the trace shape to increase the spacing between the grounding line 4 and the light-emitting control line 5, short circuits between the grounding line 4 and the light-emitting control line 5 caused by trace corrosion migration during product reliability testing can be avoided, thereby preventing lamp explosion defects in the lamp area of ​​the light-emitting substrate and significantly improving the corrosion resistance and product life of the light-emitting substrate.

[0224] Secondly, this disclosure provides a lamp board, which includes the light-emitting substrate described in the above embodiments; it also includes a driving circuit and at least one lamp area, wherein the driving circuit is electrically connected to the pad unit in the light-emitting substrate; the lamp area is electrically connected to the light-emitting control line and the light-emitting control bus in the light-emitting substrate; the driving circuit includes at least one first driving end, the lamp area includes multiple lamp beads, and the light-emitting control line is connected in series with the multiple lamp beads in the lamp area; one end of the light-emitting control line is electrically connected to the first driving end, and the other end is electrically connected to the light-emitting control bus.

[0225] The driving circuit is the driving chip (IC). The LED beads can be MiniLEDs.

[0226] In some embodiments, the light panel can be used as a backlight in the display product. In some embodiments, the light panel can also be used directly for display, that is, the light panel serves as a display panel to display images.

[0227] The lamp board provided in this embodiment can improve its corrosion resistance and lifespan by using the light-emitting substrate in the above embodiment.

[0228] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A light-emitting substrate, wherein, It includes a substrate, pad units, a ground wire, a grounding wire, and a light-emitting control line, wherein the pad units, the ground wire, the grounding wire, and the light-emitting control line are located on one side of the substrate; The grounding wire and the light-emitting control wire are located on the same layer, and on the side of the grounding wire that is away from the substrate; The orthographic projection of the ground wire onto the substrate is located on at least one side of the orthographic projection of the pad unit onto the substrate. The ground wire and the orthographic projection of the pad unit onto the substrate are arranged along a first direction, and the ground wire extends along a second direction. The pad unit includes a first pad and a second pad, and the first pad and the second pad are arranged along the second direction; The light-emitting control line is electrically connected to the first pad; The grounding wire is electrically connected to the second pad and the ground wire; The light-emitting control line and the grounding line are arranged at intervals along the second direction; The first direction and the second direction intersect.

2. The light-emitting substrate according to claim 1, wherein, The first pad has at least one, There is at least one light-emitting control line. The light-emitting control line and the first pad are electrically connected in a one-to-one correspondence. The second pad has at least one. The first pad is projected onto the substrate in an orthographic projection at least to one side of the second pad being projected onto the substrate in an orthographic projection. At least two of the ground lines are projected onto the substrate on the same side of the pad cell's projection onto the substrate.

3. The light-emitting substrate according to claim 2, wherein, The first pad includes at least a first pad. The second pad includes the first second pad. The light-emitting control line includes a first control line, the first control line and the grounding line are arranged along the second direction, and the first control line is electrically connected to the first first pad. The first control line includes a first sub-section and a second sub-section, the first sub-section and the second sub-section are arranged sequentially along a first direction away from the first first pad, the first sub-section extends along a second direction away from the first first pad and one end of it is electrically connected to the first first pad, and the second sub-section extends along the first direction and is electrically connected to the other end of the first sub-section. The ground wire includes a first ground wire and a second ground wire. The orthographic projections of the first ground wire and the second ground wire on the substrate are located on the same side of the orthographic projection of the pad unit on the substrate, and the orthographic projection of the first ground wire on the substrate is further away from the orthographic projection of the pad unit on the substrate than the orthographic projection of the second ground wire on the substrate. The grounding wire includes a first part and a second part, which are electrically connected. The orthographic projection of the first part on the substrate is located between the orthographic projections of the first ground wire and the second ground wire on the substrate, and the first part is electrically connected to the first ground wire and the second ground wire respectively; The orthographic projection of the second portion on the substrate is located between the orthographic projections of the second ground line and the first second pad on the substrate, or the orthographic projection of the second portion on the substrate extends from between the orthographic projections of the second ground line and the first second pad on the substrate to between the orthographic projections of the first ground line and the second ground line on the substrate, and the second portion is electrically connected to the first second pad.

4. The light-emitting substrate according to claim 3, wherein, The first pad also includes a second first pad, wherein the orthographic projections of the second first pad and the first first pad on the substrate are mirror-symmetrical about the orthographic projection of the first second pad on the substrate as the center of symmetry; The light-emitting control line also includes a second control line, which is located on the side of the grounding line away from the first control line, and the second control line is electrically connected to the second first pad. The second control line includes a third sub-section that extends along the first direction and has one end electrically connected to the second first pad.

5. The light-emitting substrate according to claim 4, wherein, The first portion extends along the first direction. The second part extends in a third direction. The first direction is perpendicular to the second direction, and the third direction intersects the first direction at a first acute angle; The second part is located on the side of the first part closer to the third sub-part; The first sub-part and the second part have a minimum distance between the grounding wire and the light-emitting control wire.

6. The light-emitting substrate according to claim 5, wherein, The line width of the first part is at least twice the line width of the second part; A via is provided at the position where the first part is electrically connected to the first ground wire and the second ground wire, and the number of the vias at the position where the first part is electrically connected to the first ground wire is greater than the number of the vias at the position where the first part is electrically connected to the second ground wire; The distance between the first part and the third sub-part is greater than the distance between the first part and the second sub-part.

7. The light-emitting substrate according to claim 5, wherein, The line width of the first part is equal to the line width of the second part; A via is provided at the location where the first part is electrically connected to the first ground wire and the second ground wire. The number of vias at the location where the first part is electrically connected to the first ground wire is greater than the number of vias at the location where the first part is electrically connected to the second ground wire; The absolute value of the difference between the distance between the first part and the third sub-part and the distance between the first part and the second sub-part is 20 to 100 μm.

8. The light-emitting substrate according to claim 5, wherein, The line width of the first part is equal to the line width of the second part; A via is provided at the location where the first part is electrically connected to the first ground wire and the second ground wire. The number of vias at the location where the first part is electrically connected to the first ground wire is greater than the number of vias at the location where the first part is electrically connected to the second ground wire; The distance between the first part and the third sub-part is greater than the distance between the first part and the second sub-part.

9. The light-emitting substrate according to claim 4, wherein, The first portion extends along the first direction, and the second portion extends along the first direction. The distance between the second part and the first sub-part is equal to the distance between the second part and the third sub-part, and is the minimum distance between the grounding wire and the light-emitting control wire.

10. The light-emitting substrate according to claim 9, wherein, The line width of the first part is at least twice the line width of the second part.

11. The light-emitting substrate according to claim 10, wherein, The second part is located on the side of the first part closer to the third sub-part; The distance between the first part and the third sub-part is greater than the distance between the first part and the second sub-part.

12. The light-emitting substrate according to claim 9, wherein, The line width of the first part is at least three times that of the line width of the second part.

13. The light-emitting substrate according to claim 10 or 12, wherein, The distance between the first part and the third sub-part is equal to the distance between the second part and the third sub-part; Furthermore, the distance between the first part and the third sub-part is less than the distance between the first part and the second sub-part.

14. The light-emitting substrate according to claim 5, wherein, The first pad also includes a third first pad, and the third first pad and the first first pad are arranged along the first direction; The second pad also includes a second second pad, the second second pad and the first second pad being arranged along the first direction; The light emission control line also includes a third control line, which is electrically connected to the third first pad. The third control line includes a fourth sub-section and a fifth sub-section, which are electrically connected. The orthographic projections of the fourth sub-part and the first sub-part onto the substrate are mirror-symmetrical about the orthographic projection of the pad unit onto the substrate; the orthographic projections of the fifth sub-part and the second sub-part onto the substrate are mirror-symmetrical about the orthographic projection of the pad unit onto the substrate. Like symmetry; The ground line also includes a third ground line and a fourth ground line. The orthographic projections of the third ground line and the second ground line on the substrate are mirror-symmetric about the orthographic projection of the pad unit on the substrate as the center of symmetry. The orthographic projections of the fourth ground line and the first ground line on the substrate are mirror-symmetric about the orthographic projection of the pad unit on the substrate as the center of symmetry. The grounding wire further includes a third part and a fourth part, which are electrically connected. The orthographic projections of the third part and the second part onto the substrate are mirror-symmetric about the orthographic projection of the pad unit onto the substrate as the center of symmetry. The third part is electrically connected to the second second pad and the second part, respectively; The orthographic projections of the fourth part and the first part onto the substrate are mirror-symmetrical about the orthographic projection of the pad unit onto the substrate as the center of symmetry. The fourth part is electrically connected to the third ground wire and the fourth ground wire, respectively.

15. The light-emitting substrate according to claim 14, wherein, The first pad also includes a fourth first pad, wherein the orthographic projections of the fourth first pad and the third first pad on the substrate are mirror-symmetric about the orthographic projection of the second second pad on the substrate as the center of symmetry; The light-emitting control line further includes a fourth control line, which includes a sixth sub-section electrically connected to the fourth first pad. The orthographic projections of the sixth sub-part and the third sub-part onto the substrate are mirror-symmetric with the orthographic projection of the pad unit onto the substrate as the center of symmetry.

16. The light-emitting substrate according to claim 15, wherein, The angle range of the first acute angle is: arctanF / D≤α≤15°; Wherein, α is the first acute angle; F is the angle of the first part closest to the third sub-part. The maximum distance between one side of the first part and the side of the second part closer to the third sub-part; D is the distance between the side of the first part away from the first sub-part and the first sub-part.

17. The light-emitting substrate according to claim 16, wherein, The third part extends along the fourth direction, and the fourth direction intersects the first direction at a second acute angle. The fourth sub-part and the third part have the minimum distance; The range of the second acute angle is: arctanF' / E ≤ α' ≤ 15°; Wherein, α' is the second acute angle; F' is the maximum distance between the side of the fourth part closest to the sixth sub-part and the side of the third part closest to the sixth sub-part; E is the distance between the side of the fourth part furthest from the fourth sub-part and the fourth sub-part.

18. The light-emitting substrate according to claim 17, wherein, α = α'; F = F'; When D > E, arctanF / D ≤ α ≤ 15°; When D = E, arctanF / D ≤ α ≤ 15°; When D < E, arctanF / E ≤ α ≤ 15°.

19. The light-emitting substrate according to claim 9 or 17, wherein, The minimum distance between the orthogonal projections of the light-emitting control line and the grounding line onto the substrate is 0.5 to 0.8 times the width of the first pad or the second pad.

20. The light-emitting substrate according to claim 19, wherein, The minimum distance ranges from 86 to 89 μm.

21. The light-emitting substrate according to claim 1, wherein, The pad unit is located on the same layer as the grounding wire and the light-emitting control line. The light-emitting substrate further includes a first insulating layer located between the pad unit and the grounding wire. And the side of the light-emitting control line that is away from the substrate; The first insulating layer has multiple openings, and a portion of the openings are projected onto the substrate in the same area as the light-emitting control line on the substrate. The light-emitting control line is exposed at this portion of the openings, and the exposed portion serves as the first pad. The other portion of the opening is projected onto the substrate in the same orthographic projection area as the grounding wire on the substrate, and the grounding wire is exposed at this portion of the opening, with the exposed portion serving as the second pad. The width of the area where the light-emitting control line located at the periphery of the first pad and the first insulating layer overlap on the substrate by orthographic projection is greater than 10 μm; The width of the area where the grounding wire located at the periphery of the second pad overlaps with the first insulating layer on the substrate by its orthographic projection is greater than 10 μm.

22. The light-emitting substrate according to claim 6 or 11, wherein, The distance between the first part and the third sub-part ranges from 267 to 327 μm; The distance between the first part and the second sub-part ranges from 129 to 157 μm; The linewidth of the first part ranges from 370 to 478 μm.

23. The light-emitting substrate according to claim 7, wherein, The distance between the first part and the third sub-part ranges from 267 to 327 μm; The distance between the first part and the second sub-part ranges from 307 to 367 μm; The linewidth of the first part ranges from 160 to 280 μm.

24. The light-emitting substrate according to claim 8, wherein, The distance between the first part and the third sub-part ranges from 477 to 537 μm; The distance between the first part and the second sub-part ranges from 129 to 157 μm; The linewidth of the first part ranges from 160 to 280 μm.

25. The light-emitting substrate according to claim 13, wherein, The distance between the first part and the second sub-part ranges from 307 to 367 μm; The linewidth of the first part ranges from 398 to 458 μm.

26. The light-emitting substrate according to claim 13, wherein, The distance between the first part and the second sub-part ranges from 129 to 157 μm; The linewidth of the first part ranges from 576 to 668 μm.

27. The light-emitting substrate according to claim 14, wherein, It also includes power lines, a first clock line, a second clock line, and data lines, which are located on the same layer as the ground line; The power line, the first clock line, the second clock line, and the data line extend along the second direction, respectively. The orthographic projection of the power line on the substrate lies between the orthographic projections of the first ground line and the second ground line on the substrate; The orthographic projection of the first clock line on the substrate lies between the orthographic projection of the second ground line and the orthographic projection of the pad unit on the substrate; The orthographic projection of the second clock line on the substrate is located between the orthographic projections of the pad cell and the third ground line on the substrate; The orthographic projection of the data line on the substrate lies between the orthographic projections of the third ground line and the fourth ground line on the substrate; The pad unit further includes a third pad, a fourth pad, a fifth pad, and a sixth pad, located on the side of the first pad that is projected onto the substrate away from the second pad that is projected onto the substrate. The power line is electrically connected to the third pad. The first clock line is electrically connected to the fourth pad. The second clock line is electrically connected to the fifth pad. The data line is electrically connected to the sixth pad.

28. The light-emitting substrate according to claim 27, wherein, The width of the first ground wire is greater than the width of the second ground wire; The line width of the fourth ground wire is greater than the line width of the third ground wire; The width of the third ground wire is greater than that of the second ground wire.

29. A light panel, wherein, Includes the light-emitting substrate according to any one of claims 1-28; It also includes a driving circuit and at least one lamp area, wherein the driving circuit is electrically connected to the pad unit in the light-emitting substrate; and the lamp area is electrically connected to the light-emitting control line and the light-emitting control bus in the light-emitting substrate. The driving circuit includes at least one first driving terminal. The light zone includes multiple LED beads, and the light emission control line connects the multiple LED beads in the light zone in series. One end of the light-emitting control line is electrically connected to the first driving end, and the other end is electrically connected to the light-emitting control bus.

Images