Display panel and display device

Abstract

The present disclosure relates to the technical field of display. Provided are a display panel and a display device. The display panel of the present disclosure comprises a base substrate, at least one partition structure arranged on the base substrate, a light-emitting layer arranged on the side of the partition structure away from the base substrate, and an encapsulation layer arranged on the side of the light-emitting layer away from the base substrate. The light-emitting layer is cut off at the position of each partition structure. The encapsulation layer, at the position of each partition structure, covers the portion of said partition structure exposed by the light-emitting layer. The partition structure comprises a first isolation layer, a second isolation layer and a third isolation layer which are arranged sequentially in the direction away from the base substrate. The orthographic projection of the first isolation layer on the base substrate covers the orthographic projection of the second isolation layer on the base substrate. The second isolation layer comprises a first isolation portion and a second isolation portion. The third isolation layer protrudes from the second isolation portion. The first side surface of the first isolation portion close to the encapsulation layer is not coplanar with the second side surface of the second isolation portion in contact with the encapsulation layer.

Description

Display panel and display device TECHNICAL FIELD

[0001] The present disclosure belongs to the technical field of display, and particularly relates to a display panel and a display device. BACKGROUND

[0002] In recent years, in order to improve the display area, related organic light-emitting diode (OLED) display panels usually adopt means such as in-screen hole, groove, pad bending technology, etc. Among them, the in-screen hole area can be used to place external components such as sensors and cameras, which can reduce the space occupation of these components and improve the display area. However, the process of opening holes on the screen is relatively complex, which often causes water vapor or foreign matter to extend from the edge of the opening hole to the display area, resulting in device failure, affecting the service life and reliability of the display panel.

[0003] SUMMARY

[0004] The present disclosure aims to at least solve one of the technical problems existing in the prior art, and provide a display panel and a display device.

[0005] In a first aspect, the technical solution adopted to solve the technical problems of the present disclosure is a display panel, which has a display area, a transition area and an opening area; the transition area surrounds the opening area and is located between the display area and the opening area; the display panel comprises a substrate, at least one partition structure arranged on the substrate, a light-emitting layer arranged on a side of the partition structure away from the substrate, and an encapsulation layer arranged on a side of the light-emitting layer away from the substrate.

[0006] The partition structure is located in the transition area, and the light-emitting layer extends from the display area to the edge of the transition area close to the opening area and is broken at the position of each partition structure;

[0007] The encapsulation layer extends from the display area to the transition area and covers the part of the partition structure exposed by the light-emitting layer at the position of each partition structure;

[0008] The partition structure comprises a first isolation column; the first isolation column comprises a first isolation layer, a second isolation layer and a third isolation layer arranged in sequence away from the substrate; the orthographic projection of the first isolation layer on the substrate covers the orthographic projection of the second isolation layer on the substrate;

[0009] The second isolation layer comprises a first isolation part close to the first isolation layer and a second isolation part close to the third isolation layer; the third isolation layer protrudes from the second isolation part;

[0010] The first side surface of the first isolation portion, which is close to the encapsulation layer, is not coplanar with the second side surface of the second isolation portion, which is close to the encapsulation layer.

[0011] In some embodiments, the shortest distance from the first surface of the substrate to the encapsulation layer to the partition structure is between 0.4um and 0.6um.

[0012] In some embodiments, the first isolation portion protrudes from the second isolation portion, and the two form a stepped structure.

[0013] In some embodiments, the first slope angle of the first isolation portion is greater than the second slope angle of the second isolation portion.

[0014] In some embodiments, the first side surface includes a first sub-surface and a second sub-surface connected to one end of the first sub-surface, and the other end of the first sub-surface is connected to the second side surface.

[0015] The third slope angle of the first sub-surface is less than the fourth slope angle of the second sub-surface.

[0016] In some embodiments, the edge of the orthographic projection of the third isolation layer on the substrate falls within the orthographic projection of the first sub-surface on the substrate.

[0017] In some embodiments, the ratio between the maximum height of the second isolation layer and the maximum height of the first isolation portion is between 1.5 and 4.

[0018] In some embodiments, the maximum height of the first isolation portion is between 0.15um and 0.6um.

[0019] In some embodiments, the dihedral angle formed by the tangent plane on the first side surface and the tangent plane on the second side surface at a contact point between the first side surface and the second side surface is between 90° and 150°.

[0020] In some embodiments, the first isolation layer includes a second surface close to the second isolation layer.

[0021] The second surface and the first side surface form a second dihedral angle between a tangent plane on the first side surface and the second surface covered by the first isolation portion between 15° and 90°.

[0022] In some embodiments, the first isolation layer protrudes from the first isolation portion.

[0023] In some embodiments, the first side surface comprises a first sub-surface and a second sub-surface connected to one end of the first sub-surface, the other end of the first sub-surface being connected to the second side surface, the first sub-surface being a plane, and the second sub-surface being a plane.

[0024] The second sub-surface is flush with the third surface of the first isolation layer close to the encapsulation layer.

[0025] In some embodiments, the partition structure comprises a first partition structure and a second partition structure; the first partition structure is closer to the display area than the second partition structure.

[0026] The display panel further comprises at least one blocking dam, the blocking dam being arranged between the first partition structure and the second partition structure.

[0027] The first partition structure comprises a first isolation column, and the second partition structure comprises a first isolation column or a plurality of first isolation columns arranged in a stack.

[0028] In some embodiments, the partition structure comprises a first partition structure and a second partition structure; the first partition structure is closer to the display area than the second partition structure.

[0029] The display panel further comprises at least one blocking dam, the blocking dam being arranged between the first partition structure and the second partition structure.

[0030] The first partition structure comprises a first isolation column, and the second partition structure comprises a plurality of second isolation columns arranged in a stack; the second isolation column comprises a fourth isolation layer, a fifth isolation layer, and a sixth isolation layer arranged in sequence in a direction away from the substrate; the fourth isolation layer and the sixth isolation layer both protrude from the fifth isolation layer.

[0031] The encapsulation layer forms a closed air hole or no air hole at the position where the first isolation column partitions the light-emitting layer, and forms an open air hole at the position where the second isolation column partitions the light-emitting layer.

[0032] In some embodiments, the partition structure comprises a first partition structure and a second partition structure; the first partition structure is closer to the display area than the second partition structure.

[0033] The display panel further comprises at least one blocking dam, the blocking dam being arranged between the first partition structure and the second partition structure.

[0034] The first partition structure comprises a first isolation column, and the second partition structure comprises the first isolation column and at least one second isolation column arranged on a side of the first isolation layer away from the substrate substrate; the second isolation column comprises a fourth isolation layer, a fifth isolation layer and a sixth isolation layer arranged in sequence in a direction away from the substrate substrate; the fourth isolation layer and the sixth isolation layer both protrude from the fifth isolation layer;

[0035] The encapsulation layer forms a closed air hole or no air hole at the position where the first isolation column partitions the light-emitting layer, and forms an open air hole at the position where the second isolation column partitions the light-emitting layer.

[0036] In some embodiments, the ratio of the minimum width dimension of the second isolation layer in the first direction to the minimum width dimension of the third isolation layer in the first direction is between 1 / 3 and 1 / 2.

[0037] The ratio of the minimum width dimension of the fifth isolation layer in the first direction to the minimum width dimension of the sixth isolation layer in the first direction is between 1 / 3 and 1 / 2.

[0038] In some embodiments, the partition structure comprises a first partition structure and a second partition structure; the first partition structure is closer to the display area than the second partition structure;

[0039] The display panel further comprises at least one blocking dam arranged between the first partition structure and the second partition structure.

[0040] The first partition structure comprises a first isolation column, and the second partition structure comprises a plurality of third isolation columns arranged in layers; the third isolation column comprises a seventh isolation layer and an eighth isolation layer arranged in sequence in a direction away from the substrate substrate; the eighth isolation layer protrudes from the seventh isolation layer.

[0041] The encapsulation layer forms a closed air hole or no air hole at the position where the first isolation column partitions the light-emitting layer, and forms an open air hole at the position where the third isolation column partitions the light-emitting layer.

[0042] In some embodiments, the partition structure comprises a first partition structure and a second partition structure; the first partition structure is closer to the display area than the second partition structure;

[0043] The display panel further comprises at least one blocking dam arranged between the first partition structure and the second partition structure.

[0044] The first partition structure comprises a first isolation column, the second partition structure comprises the first isolation column and at least one third isolation column arranged on a side of the first isolation layer away from the substrate substrate, the third isolation column comprises a seventh isolation layer and an eighth isolation layer arranged in sequence in a direction away from the substrate substrate, and the eighth isolation layer protrudes from the seventh isolation layer.

[0045] The encapsulation layer forms a closed air hole or no air hole at a position where the first isolation column partitions the light-emitting layer, and forms an open air hole at a position where the third isolation column partitions the light-emitting layer.

[0046] In some embodiments, the partition structure comprises a first partition structure and a second partition structure, the first partition structure is closer to the display area than the second partition structure, and the display panel further comprises at least one blocking dam arranged between the first partition structure and the second partition structure.

[0047] The encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer arranged in sequence in a direction away from the substrate substrate, the first inorganic encapsulation layer and the second inorganic encapsulation layer both extend from the display area to an edge of the transition area close to the opening area, the orthographic projection of the first inorganic encapsulation layer and the second inorganic encapsulation layer on the substrate substrate covers the orthographic projection of the first partition structure, the second partition structure and the blocking dam on the substrate substrate, and the organic encapsulation layer extends from the display area to the transition area and stops at a side of the blocking dam close to the display area.

[0048] In a second aspect, the embodiments of the present disclosure further provide another display panel, which has a display area, a transition area and an opening area, the transition area surrounds the opening area and is located between the display area and the opening area, the display panel comprises a substrate substrate, at least one partition structure arranged on the substrate substrate, a light-emitting layer arranged on a side of the partition structure away from the substrate substrate, and an encapsulation layer arranged on a side of the light-emitting layer away from the substrate substrate.

[0049] The partition structure is located in the transition area, the light-emitting layer extends from the display area to an edge of the transition area close to the opening area and is interrupted at the position of each partition structure.

[0050] The encapsulation layer extends from the display area to the transition area and covers the part of the partition structure exposed by the light-emitting layer at the position of each partition structure.

[0051] The partition structure includes a first partition structure and a second partition structure; the first partition structure is closer to the display area than the second partition structure; the display panel further includes at least one blocking dam, which is arranged between the first partition structure and the second partition structure.

[0052] The first partition structure includes a second isolation column, and the second partition structure includes a plurality of second isolation columns arranged in a stack; the second isolation column includes a fourth isolation layer, a fifth isolation layer and a sixth isolation layer arranged in sequence in a direction away from the substrate substrate; the fourth isolation layer and the sixth isolation layer both protrude from the fifth isolation layer.

[0053] In a third aspect, the embodiments of the present disclosure further provide a display device, which includes the display panel of any one of the first aspect and the second aspect. BRIEF DESCRIPTION OF DRAWINGS

[0054] FIG. 1 is a schematic plan view of a display panel according to an embodiment of the present disclosure;

[0055] FIG. 2 is a schematic profile view of an isolation structure in a transition area according to an embodiment of the present disclosure;

[0056] FIG. 3 is a cross-sectional view of a display panel in Example 1 in the A-A' direction according to an embodiment of the present disclosure;

[0057] FIG. 4 is a schematic view of a partition structure partitioning a light-emitting layer according to an embodiment of the present disclosure;

[0058] FIG. 5 is a schematic view of an encapsulation layer at an undercut position in one case according to an embodiment of the present disclosure;

[0059] FIG. 6 is a schematic view of an encapsulation layer at an undercut position in another case according to an embodiment of the present disclosure;

[0060] FIGS. 7a and 7b are structural views of different morphologies of a first isolation column in Example 1 according to an embodiment of the present disclosure;

[0061] FIG. 7c is a structural view of another first isolation column according to an embodiment of the present disclosure;

[0062] FIG. 8 is a schematic view of a second isolation column according to an embodiment of the present disclosure;

[0063] FIG. 9 is an encapsulation simulation effect diagram of an encapsulation layer of a first isolation portion at one height according to an embodiment of the present disclosure;

[0064] FIG. 10 is an encapsulation simulation effect diagram of an encapsulation layer of a first isolation portion at another height according to an embodiment of the present disclosure;

[0065] FIG. 11 is a simulation diagram of the first isolation part and the second isolation part according to an embodiment of the present disclosure at a step angle;

[0066] FIG. 12 is a simulation diagram of the first isolation part and the second isolation part according to an embodiment of the present disclosure at another step angle;

[0067] FIG. 13 is a schematic diagram of the first isolation column according to Example 2 of the present disclosure;

[0068] FIG. 14 is an enlarged view of the Q region in FIG. 3;

[0069] FIG. 15 is a cross-sectional view of a display panel in a transition region according to Example 2 of the present disclosure;

[0070] FIG. 16 is a cross-sectional view of a display panel in a transition region according to Example 3 of the present disclosure;

[0071] FIG. 17 is a cross-sectional view of a display panel in a transition region according to Example 4 of the present disclosure;

[0072] FIG. 18 is a cross-sectional view of a display panel in a transition region according to Example 5 of the present disclosure;

[0073] FIG. 19 is a cross-sectional view of a display panel in a transition region according to Example 6 of the present disclosure;

[0074] FIG. 20 is a schematic diagram of a film layer stack of a display panel according to an embodiment of the present disclosure;

[0075] FIG. 21 is a cross-sectional view of a display panel in a transition region according to Example 7 of the present disclosure;

[0076] FIGS. 22a-22g are intermediate stage structural diagrams of forming a partition structure of a display panel according to Example 1 of the present disclosure;

[0077] FIGS. 23a-23f are intermediate stage structural diagrams of forming the first isolation column shown in FIG. 7c according to an embodiment of the present disclosure;

[0078] FIGS. 24a-24g are intermediate stage structural diagrams of forming a partition structure of a display panel according to Example 4 of the present disclosure. DETAILED DESCRIPTION

[0079] In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the following will be combined with the accompanying drawings to make a clear and complete description of the technical solutions of the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. The components of the embodiments of the present disclosure generally described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present disclosure provided in the accompanying drawings is not intended to limit the scope of the claimed present disclosure, but only represents selected embodiments of the present disclosure. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present disclosure.

[0080] Unless otherwise defined, technical or scientific terms used in the present disclosure should be understood as having the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. The terms "first", "second" and similar terms used in the present disclosure do not denote any order, quantity or importance, but are used to distinguish different components. Similarly, the terms "one", "a" or "the" and similar terms do not denote quantity limitation, but mean that there is at least one. The terms "include" or "contain" and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "up", "down", "left", "right" and the like are only used to represent relative positional relationships, and when the absolute positions of the described objects are changed, the relative positional relationships may also be changed accordingly.

[0081] In the present disclosure, "a plurality of or several" refers to two or more. The term "and / or" describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent three cases: A exists alone, A and B exist together, and B exists alone. The character " / " generally represents an "or" relationship between the associated objects before and after it.

[0082] In the related art, due to the open boundary of the in-screen opening hole in the active area (AA), the film layer of the OLED is exposed, so for the whole layer of the light emitting material, a physical isolation column is usually used for physical isolation, although the physical isolation has a certain water vapor blocking effect and solves the growing dark spot (GDS) and other defects to a certain extent. However, the physical isolation does not eliminate the light emitting material at the isolation position, and water vapor still spreads from the opening hole area boundary along the unisolated light emitting material to the display area. With the extension of time, the water vapor will continuously affect the encapsulation ability of the encapsulation layer. Once the encapsulation fails, the water vapor will quickly penetrate into the display area, causing the device to fail, affecting the service life and reliability of the display product.

[0083] Therefore, the display panel provided by the embodiments of the present disclosure substantially improves the encapsulation ability (i.e., encapsulation ability) of the encapsulation layer by optimizing the morphology of the isolation column, reduces the risk of edge failure of the opening hole area, and improves the reliability of the device to avoid GDS defects.

[0084] FIG. 1 is a plan view of a display panel according to an embodiment of the present disclosure; FIG. 2 is a profile view of an isolation structure in a transition area according to an embodiment of the present disclosure; FIG. 3 is a cross-sectional view of a display panel in the A-A' direction according to an embodiment of the present disclosure; FIG. 4 is a schematic view of an isolation structure isolating a light emitting layer according to an embodiment of the present disclosure; FIG. 5 is a schematic view of an encapsulation layer at an undercut position in a certain case according to an embodiment of the present disclosure; and FIG. 6 is a schematic view of an encapsulation layer at an undercut position in another case according to an embodiment of the present disclosure.

[0085] Specifically, as shown in FIGS. 1-3, the display panel in the embodiments of the present disclosure has an active area AA, a transition area BB, and an opening hole area CC; the transition area BB surrounds the opening hole area CC and is located between the active area AA and the opening hole area CC; the display panel includes a substrate 1, at least one isolation structure 2 disposed on the substrate 1, a light emitting layer EL disposed on a side of the isolation structure 2 away from the substrate 1, and an encapsulation layer 3 disposed on a side of the light emitting layer EL away from the substrate 1.

[0086] As shown in FIGS. 3 and 4, the light emitting layer EL is laid in a whole layer, and the light emitting layer EL extends from the active area AA to the edge of the transition area BB close to the opening hole area CC; the part of the light emitting layer EL in the active area AA includes a light emitting part for forming a light emitting device, and the part of the light emitting layer EL in the transition area BB does not emit light. The isolation structure 2 is located in the transition area BB, and the isolation structure 2 is used to isolate the light emitting layer EL at the position thereof.

[0087] The encapsulation layer 3 is entirely laid to encapsulate all the film layers below. As shown in FIGS. 5 and 6, the encapsulation layer 3 extends from the display area AA to the transition area BB and covers the portion 20 exposed by the light-emitting layer EL in each partition structure 2.

[0088] Optionally, the encapsulation layer 3 contacts the portion 20 exposed by the light-emitting layer EL in each partition structure 2. The "contact" here means direct contact, that is, there is no other structure film layer and air (which can be understood as an open pore) between the contact surfaces of the two, and the encapsulation layer 3 does not form an open pore with the portion 20 exposed by the light-emitting layer EL in the partition structure 2 during the forming process.

[0089] As affected by the partition structure 2, as shown in FIGS. 5 and 6, there is no pore or a closed pore H1 between the encapsulation layer 3 and the portion 20 exposed by the light-emitting layer EL in the partition structure 2.

[0090] FIGS. 7a and 7b are structural diagrams of different morphologies of the first isolation column 21 under Example 1 provided by the embodiment of the present disclosure. As shown in FIGS. 7a and 7b, the partition structure 2 includes the first isolation column 21; the first isolation column 21 includes a first isolation layer 211, a second isolation layer 212 and a third isolation layer 213 arranged in sequence in a direction away from the substrate 1. The first isolation layer 211, the second isolation layer 212 and the third isolation layer 213 are located on the same vertical line.

[0091] The orthogonal projection of the first isolation layer 211 on the substrate 1 covers the orthogonal projection of the second isolation layer 212 on the substrate 1. Optionally, the first isolation layer 211 protrudes from the second isolation layer 212.

[0092] The second isolation layer 212 includes a first isolation portion 2121 close to the first isolation layer 211 and a second isolation portion 2122 close to the third isolation layer 213; the third isolation layer 213 protrudes from the second isolation portion 2122. Optionally, the first isolation layer 211 protrudes from the second isolation portion 2122.

[0093] The first side surface S2 of the first isolation portion 2121 close to the encapsulation layer 3 is not coplanar with the second side surface S3 of the second isolation portion 2122 close to the encapsulation layer 3.

[0094] It should be noted that, as shown in FIG. 8, which is a schematic diagram of a related isolation column, denoted as a second isolation column 22, the second isolation column 22 includes a fourth isolation layer 221, a fifth isolation layer 222, and a sixth isolation layer 223 arranged in sequence in a direction away from the substrate base plate 1; the fourth isolation layer 221 and the sixth isolation layer 223 both protrude from the fifth isolation layer 222. The side surface of the fifth isolation layer 222 is a flat surface, and in the embodiment, the side surface of the first isolation column 21 includes a first side surface S2 and a second side surface S3, the first side surface S2 and the second side surface S3 are not coplanar. Through simulation results, it can be known that, in the deposition process of the packaging layer 3 material, for example, the packaging layer 3 is formed by using a plasma enhanced chemical vapor deposition (PECVD) process, such a special-shaped surface is more conducive to material film formation than a flat inclined surface, and the film thickness of the packaging layer 3 material at the undercut position U1 can be improved, thereby improving the packaging capability.

[0095] It should be noted that, due to the influence of the undercut position U1 of the partition structure 2, the packaging layer 3 will fall at the undercut position U1 during the formation process, and therefore the shortest distance L1 from the first surface S1 of the packaging layer 3 to the partition structure 2 is often at the undercut position U1 of the partition structure 2. In some embodiments, as shown in FIGS. 5 and 6, the shortest distance L1 from the first surface S1 of the packaging layer 3 away from the substrate base plate 1 to the partition structure 2 is between 0.4 um and 0.6 um, which means that through the partition structure 2 provided by the embodiments of the present disclosure, the packaging layer 3 can form a relatively thick film thickness at the undercut position U1, thereby improving the coating capability (i.e., packaging capability) of the packaging layer 3, reducing the risk of edge failure of the opening area CC, thereby improving the device reliability and avoiding GDS defects.

[0096] Optionally, the shortest distance from the first surface S1 of the packaging layer 3 away from the substrate base plate 1 to the partition structure 2 is 0.4 um, 0.45 um, 0.5 um, or 0.55 um, 0.6 um.

[0097] In some embodiments, as shown in FIGS. 7a and 7b, the first isolation portion 2121 protrudes from the second isolation portion 2122, and the two form a stepped structure. Specifically, the first side surface S2 includes a first sub-surface S21 and a second sub-surface S22 connected to one end of the first sub-surface S21, and the other end of the first sub-surface S21 is connected to the second side surface S3.

[0098] Optionally, as shown in FIGS. 7a and 7b, the first slope angle β1 of the first isolation portion 2121 is greater than the second slope angle β2 of the second isolation portion 2122.

[0099] For example, as shown in FIG. 7a, the first slope angle β1 of the first isolation portion 2121 is a right angle; and the second slope angle β2 of the second isolation portion 2122 is an acute angle.

[0100] The first slope angle β1 is an acute angle formed by a point on the boundary of the second sub-surface S22 close to the substrate 1 and a horizontal reference plane. The second slope angle β2 is an acute angle formed by a tangent plane of a point on the second side surface S3 at the boundary of the first sub-surface S21 and a horizontal reference plane.

[0101] Optionally, a third slope angle β3 of the first sub-surface S21 is smaller than a fourth slope angle β4 of the second sub-surface S22. As shown in FIG. 7a and FIG. 7b, the first sub-surface S21 is a flat plane, and the third slope angle β3 is 0°. For example, the third slope angle β3 of the first sub-surface S21 is between 0° and 15°, and does not include 15°. The fourth slope angle β4 of the second sub-surface S22 (for example, the second dihedral angle α2 described below) is between 15° and 90°, and includes the end point value.

[0102] Optionally, as shown in FIG. 7a, the second sub-surface S22 is a flat inclined plane, for example, the fourth slope angle β4 is 90°. The second side surface S3 is a flat inclined plane, for example, the second slope angle β2 is 60°.

[0103] Optionally, as shown in FIG. 7b, the second sub-surface S22 is a convex surface. The second side surface S3 is a concave surface.

[0104] In this embodiment, the first isolation portion 2121 and the second isolation portion 2122 form a step structure, and the first sub-surface S21 (flat plane) in the step structure provides effective buffering for the collapse of the encapsulation layer 3 material, thereby facilitating PECVD process film forming, improving the film thickness of the encapsulation layer 3 material at the undercut position U1, and further improving the encapsulation capability.

[0105] In some embodiments, the first isolation layer 211 and the third isolation layer 213 are the same in material, size, and shape.

[0106] In some embodiments, the first isolation layer 211 and the third isolation layer 213 are the same in material and shape. The first isolation layer 211 and the third isolation layer 213 are different in size, specifically, the size (which can be understood as the width of the isolation column) of the first isolation layer 211 in the first direction X is greater than the size of the third isolation layer 213 in the first direction X, and the other sizes are the same.

[0107] In some embodiments, Figure 7c is a structural diagram of another first isolation column 21 provided by an embodiment of the present disclosure. As shown in Figure 7c, in the case where the first isolation column 21 has the structural features of the above-mentioned embodiments, further, the first isolation column 21 provided by the present embodiment, the edge of the orthographic projection of the third isolation layer 213 on the substrate 1 falls within the orthographic projection of the first sub-surface S21 on the substrate 1, meaning that the undercut position U1 is vertically opposite the stepped surface of the second isolation portion 2122, the flat plane can further buffer the falling encapsulation layer 3 material compared to the inclined plane or the picture, and can further improve the film thickness of the encapsulation layer 3 material at the undercut position U1, thereby improving the encapsulation capability.

[0108] Optionally, the edge of the orthographic projection of the first sub-surface S21 on the substrate 1 is slightly away from the edge of the orthographic projection of the third isolation layer 213 on the substrate 1, for example, the distance therebetween is between 0.05um and 0.1um, including the end point value.

[0109] Figure 9 is an encapsulation simulation effect diagram of the encapsulation layer 3 at a height of the first isolation portion 2121 provided by an embodiment of the present disclosure. In some embodiments, as shown in Figure 9, the ratio between the maximum height (d1+d2) of the second isolation layer 212 and the maximum height d1 of the first isolation portion 2121 is between 1.5 and 4, including the end point value. This means that the maximum height (d1+d2) of the second isolation layer 212 is 1.5 to 4 times the maximum height d1 of the first isolation portion 2121.

[0110] Here, the "maximum height d1 of the first isolation portion 2121" refers to the vertical distance between the stepped surface (first sub-surface S21) of the first isolation portion 2121 and the contact surface of the first isolation portion 2121 and the first isolation layer 211.

[0111] Figure 10 is an encapsulation simulation effect diagram of the encapsulation layer 3 at another height of the first isolation portion 2121 provided by an embodiment of the present disclosure. As shown in Figure 10, the ratio between the maximum height (d1+d2) of the second isolation layer 212 and the maximum height d1 of the first isolation portion 2121 is greater than 4. As can be seen from the simulation effects of Figures 9 and 10, the isolation column with a certain step height helps to improve the film thickness of the encapsulation layer 3 at the undercut position U1, thereby improving the encapsulation capability.

[0112] Optionally, the maximum height d1 of the first isolation portion 2121 is between 0.15um and 0.6um, including the end point value. For example, the maximum height of the first isolation portion 2121 is 0.15um, 0.2um, 0.25um, 0.3um, 0.35um, 0.4um, 0.45um, 0.5um, 0.55um and 0.6um.

[0113] Optionally, the maximum height d1 of the first isolation portion 2121 is between 0.15um and 0.35um, inclusive of the end values. For example, the maximum height of the first isolation portion 2121 is 0.15um, 0.2um, 0.25um, 0.3um or 0.35um.

[0114] Optionally, as shown in FIG. 9, the maximum height d2 of the second isolation portion 2122 is less than the maximum height d1 of the first isolation portion 2121.

[0115] Optionally, the ratio of the height of the second isolation layer 212 to the height of the first isolation layer 211 is between 1.5 and 4.

[0116] FIG. 11 is an effect diagram of the first isolation portion 2121 and the second isolation portion 2122 in a step angle packaging simulation according to an embodiment of the present disclosure. In some embodiments, as shown in FIG. 11, the dihedral angle a1 formed by the tangent plane on the first side surface S2 and the tangent plane on the second side surface S3 at a contact point between the first side surface S2 and the second side surface S3 is less than or equal to 150°. Optionally, the dihedral angle a1 formed by the tangent plane on the first side surface S2 and the tangent plane on the second side surface S3 at a contact point between the first side surface S2 and the second side surface S3 is between 90° and 150°, inclusive of the end values. For example, the dihedral angle a1 is 90°, 100°, 110°, 120°, 130°, 140° or 150°.

[0117] It should be noted that the dihedral angle a1 here is the external angle formed by the tangent plane and the second side surface S3.

[0118] FIG. 12 is an effect diagram of the first isolation portion 2121 and the second isolation portion 2122 in another step angle packaging simulation according to an embodiment of the present disclosure. As shown in FIG. 12, the dihedral angle a1 is between 150° and 180°, exclusive of the end values. Comparing the simulation effects of FIG. 11 and FIG. 12, it can be seen that when the dihedral angle a1 is between 90° and 150°, it is helpful for PECVD film formation in packaging, improves the film thickness of the packaging layer 3 at the undercut position U1, and thus improves the packaging capability. In addition, according to the simulation effect, when the dihedral angle a1 is between 90° and 150°, reducing the dihedral angle a1, for example, 110° compared to 120°, is more conducive to improving the film thickness of the packaging layer 3 at the undercut position U1.

[0119] In some embodiments, as shown in FIG. 11, the first isolation layer 211 includes a second surface S4 close to the second isolation layer 212; the dihedral angle a2 formed by the tangent plane on the first side surface S2 and the second surface S4 at a contact point between the second surface S4 and the first side surface S2 is less than or equal to 90°.

[0120] It should be noted that the second dihedral angle a2 here is the internal angle formed by the tangent plane and the second surface S4.

[0121] Optionally, the second dihedral angle a2 is between 15° and 90°, inclusive of the end values. For example, the second dihedral angle a2 is 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°, or 90°.

[0122] In this embodiment, by setting a smaller second dihedral angle a2, it is beneficial for the second isolation portion 2122 to form a stepped topography.

[0123] FIG. 13 is a schematic diagram of the first isolation column 21 under Example 2 according to an embodiment of the present disclosure. In some embodiments, as shown in FIG. 13, the contact surface boundary of the first isolation layer 211 and the second isolation layer 212 is aligned. Specifically, the first side surface S2 includes a first sub-surface S21 and a second sub-surface S22 connected to one end of the first sub-surface S21, the other end of the first sub-surface S21 is in contact with the second side surface S3, the first sub-surface S21 is a plane (horizontal plane), and the second sub-surface S22 is a plane (vertical plane); the second sub-surface S22 is flush with the third surface S5 of the first isolation layer 211 close to the packaging layer 3.

[0124] The other structures of the first isolation column 21 can refer to the description of the first isolation column 21 in Example 1 above, and the repeated parts will not be described herein.

[0125] FIG. 14 is an enlarged view of the Q region in FIG. 3. In some embodiments, as shown in FIG. 14, the partition structure 2 includes a first partition structure 201 and a second partition structure 202; the first partition structure 201 is closer to the display area AA than the second partition structure 202. The display panel further includes at least one blocking dam 4, which is arranged between the first partition structure 201 and the second partition structure 202. With the blocking dam 4 as a boundary, the first partition structure 201 belongs to an inner partition structure and is closer to the display area AA; the second partition structure 202 belongs to an outer partition structure and is closer to the opening area CC. The first partition structure 201 includes at least one, and the second partition structure 202 includes at least one. For example, as shown in FIG. 14, the blocking dam 4 includes two, the first partition structure 201 includes one, and the second partition structure 202 includes multiple, for example, three. The first partition structure 201 includes one first isolation column 21, which belongs to an inner isolation column; the second partition structure 202 includes one first isolation column 21, which belongs to an outer isolation column. Multiple outer isolation columns are beneficial to improve the packaging capability between the opening area CC and the display area AA, improve the packaging effect, and avoid GDS defects.

[0126] Optionally, the height of the blocking dam 4 is greater than the height of the first isolation column 21.

[0127] FIG. 15 is a cross-sectional view of the display panel in the transition area BB according to the example 2 provided by the embodiments of the present disclosure. In some embodiments, as shown in FIG. 15, the first partition structure 201 includes one first isolation column 21, and the second partition structure 202 includes a plurality of first isolation columns 21 stacked.

[0128] In the present embodiment, the outer partition structure 2 includes a plurality of first isolation columns 21 stacked, further improving the packaging capability and packaging effect.

[0129] Optionally, the height of the blocking dam 4 is less than the total height of the plurality of first isolation columns 21 stacked in the second partition structure 202.

[0130] In some embodiments, FIG. 16 is a cross-sectional view of the display panel in the transition area BB according to the example 3 provided by the embodiments of the present disclosure. As shown in FIG. 16, the difference between the example 2 and the example 3 is that the second partition structure 202 adopts a plurality of second isolation columns 22 stacked. Specifically, the partition structure 2 includes a first partition structure 201 and a second partition structure 202; the first partition structure 201 is closer to the display area AA than the second partition structure 202; the display panel further includes at least one blocking dam 4, which is arranged between the first partition structure 201 and the second partition structure 202. The first partition structure 201 includes one first isolation column 21, and the second partition structure 202 includes a plurality of second isolation columns 22 stacked; the second isolation column 22 includes a fourth isolation layer 221, a fifth isolation layer 222 and a sixth isolation layer 223 arranged in sequence away from the substrate 1; the fourth isolation layer 221 and the sixth isolation layer 223 both protrude from the fifth isolation layer 222.

[0131] The packaging layer 3 forms a closed air hole H1 or no air hole at the position (undercut position U1) where the first isolation column 21 partitions the light-emitting layer EL; and forms an open air hole at the position (undercut position U1) where the second isolation column 22 partitions the light-emitting layer EL.

[0132] In the present embodiment, the second partition structure 202 adopts a plurality of second isolation columns 22 stacked, which can improve the film forming height of the packaging layer 3, thereby improving the effective packaging distance, prolonging the side edge water vapor invasion time, and improving the reliability.

[0133] Optionally, the first isolation layer 211, the third isolation layer 213, the fourth isolation layer 221 and the sixth isolation layer 223 are made of the same material, for example, titanium metal material (Ti), or inorganic material, for example, silicon oxynitride (SiON), silicon oxide (SiOx), silicon nitride (SiNx), high molecular resin and the like. The second isolation layer 212 and the fifth isolation layer 222 are made of the same material, for example, aluminum metal material (Al), or organic material, for example, one or more of combinations of acrylic, resin, polyimide, benzocyclobutene and the like, which can be selected according to actual needs.

[0134] Optionally, the first isolation column 21 and the second isolation column 22 are made of titanium-aluminum-titanium (Ti / Al / Ti) structure.

[0135] Optionally, the first isolation layer 211 and the fourth isolation layer 221 are the same in shape and size. The third isolation layer 213 and the sixth isolation layer 223 are the same in shape and size. The second isolation layer 212 adopts a stepped structure, and the fifth isolation layer 222 adopts a trapezoidal structure.

[0136] Optionally, the ratio of the minimum width of the second isolation layer 212 in the first direction X to the minimum width of the third isolation layer 213 in the first direction X is between 1 / 3 and 1 / 2. The minimum width of the second isolation layer 212 in the first direction X is also the minimum width of the second isolation portion 2122 in the first direction X. The ratio of the minimum width of the fifth isolation layer 222 in the first direction X to the minimum width of the sixth isolation layer 223 in the first direction X is between 1 / 3 and 1 / 2. The minimum width of the fifth isolation layer 222 in the first direction X is also the width of the end of the fifth isolation layer 222 closest to the sixth isolation layer 223. As can be seen from the comparison, the undercut width of the first isolation column 21 is greater than the undercut width of the second isolation column 22, which improves the contact area of the isolation column and the packaging layer 3, thereby facilitating the improvement of the wrapping capacity of the packaging layer 3.

[0137] Optionally, the height of the blocking dam 4 is greater than the height of the first isolation column 21. The height of the blocking dam 4 is greater than the height of the second isolation column 22.

[0138] Optionally, the height of the blocking dam 4 is less than the total height of the plurality of second isolation columns 22 stacked in the second partition structure 202.

[0139] In some embodiments, the material of the blocking dam 4 can be selected as an organic material. For example, the material of the blocking dam 4 can include, but is not limited to, one or more combinations of acrylic, resin, polyimide, benzocyclobutene and the like, which can be selected according to actual needs.

[0140] The partition structure 2 includes a plurality of first partition structures 201 and a plurality of second partition structures 202; the first partition structures 201 are closer to the display area AA than the second partition structures 202.

[0141] It should be noted that the number of the first partition structures 201 and the second partition structures 202 is not limited to the number shown in the figure, and can be set according to actual conditions.

[0142] Optionally, the number of the second partition structures 202 is greater than or equal to the number of the first partition structures 201.

[0143] In some embodiments, FIG. 17 is a cross-sectional view of a display panel in a transition area BB according to an example 4 of the present disclosure, as shown in FIG. 17, which is different from the example 3 in that the second partition structure 202 adopts a first isolation column 21 and a second isolation column 22 stacked. Specifically, the first partition structure 201 includes one first isolation column 21, and the second partition structure 202 includes the first isolation column 21 and at least one second isolation column 22 arranged on a side of the first isolation layer 211 away from the substrate 1; the second isolation column 22 includes a fourth isolation layer 221, a fifth isolation layer 222 and a sixth isolation layer 223 arranged in the direction away from the substrate 1 in sequence; the fourth isolation layer 221 and the sixth isolation layer 223 both protrude from the fifth isolation layer 222.

[0144] Here, the structure of the first isolation column 21 and the second isolation column 22 can be referred to the above embodiments, and the repeated parts will not be described herein.

[0145] The second partition structure 202 of the present embodiment adopts a plurality of first isolation columns 21 and second isolation columns 22 stacked, which on the one hand enhances the film thickness of the encapsulation layer 3 by using the first isolation column 21 at the bottom, and on the other hand, the stacked structure can increase the film height of the encapsulation layer 3, thereby increasing the effective encapsulation distance, prolonging the side vapor intrusion time, and improving the reliability.

[0146] In some embodiments, FIG. 18 is a cross-sectional view of a display panel in a transition area BB according to an example 5 of the present disclosure, as shown in FIG. 18, which is different from the example 4 in that the second partition structure 202 adopts a plurality of third isolation columns 23 stacked. Specifically, the partition structure 2 includes a plurality of first partition structures 201 and a plurality of second partition structures 202; the first partition structures 201 are closer to the display area AA than the second partition structures 202; the first partition structure 201 includes one first isolation column 21, and the second partition structure 202 includes a plurality of third isolation columns 23 arranged in layers; the third isolation column 23 includes a seventh isolation layer 231 and an eighth isolation layer 232 arranged in the direction away from the substrate 1 in sequence; the eighth isolation layer 232 protrudes from the seventh isolation layer 231.

[0147] Here, the extending direction of the center line of the seventh isolation layer 231 and the eighth isolation layer 232 is a vertical direction.

[0148] The encapsulation layer 3 forms a closed air hole H1 or no air hole at the position (undercut position U1) where the first isolation column 21 interrupts the light-emitting layer EL. The encapsulation layer 3 forms an open air hole at the position (undercut position U1) where the third isolation column 23 interrupts the light-emitting layer EL.

[0149] Optionally, the material of the seventh isolation layer 231 is an organic material. The material of the eighth isolation layer 232 is an inorganic material.

[0150] Optionally, the third isolation layer 213 and the eighth isolation layer 232 have the same shape and size. The second isolation layer 212 adopts a stepped structure, and the seventh isolation layer 231 adopts a trapezoidal structure.

[0151] Optionally, the ratio of the minimum width size of the second isolation layer 212 in the first direction X to the minimum width size of the third isolation layer 213 in the first direction X is between 1 / 3 and 1 / 2. The minimum width size of the second isolation layer 212 in the first direction X is also the minimum width of the second isolation portion 2122 in the first direction X. The ratio of the minimum width size of the seventh isolation layer 231 in the first direction X to the minimum width size of the eighth isolation layer 232 in the first direction X is between 1 / 3 and 1 / 2. The minimum width size of the seventh isolation layer 231 in the first direction X is also the width of the end of the seventh isolation layer 231 closest to the eighth isolation layer 232. As can be seen from the comparison, the undercut inner recess width of the first isolation column 21 is greater than the undercut inner recess width of the third isolation column 23, which improves the contact area between the isolation column and the encapsulation layer 3, thereby facilitating the improvement of the encapsulation ability of the encapsulation layer 3.

[0152] Here, for the structure of the first isolation column 21, refer to the above description of the first isolation column 21, and the repeated parts will not be described again.

[0153] The second interruption structure 202 of the embodiment adopts a plurality of third isolation columns 23 stacked in layers, which can improve the film forming height of the encapsulation layer 3, thereby improving the effective encapsulation distance, prolonging the side edge water vapor invasion time, and improving the reliability.

[0154] In some embodiments, FIG. 19 is a cross-sectional view of the display panel in the transition region BB under Example 6 provided by the embodiments of the present disclosure, as shown in FIG. 19, which is different from Example 5 in that the second partition structure 202 adopts the first isolation column 21 and the third isolation column 23 stacked. Specifically, the partition structure 2 includes a plurality of, respectively denoted as the first partition structure 201 and the second partition structure 202; the first partition structure 201 is closer to the display region AA than the second partition structure 202; the first partition structure 201 includes one first isolation column 21, and the second partition structure 202 includes the first isolation column 21 and at least one third isolation column 23 disposed on the side of the first isolation layer 211 away from the substrate 1; the third isolation column 23 includes a seventh isolation layer 231 and an eighth isolation layer 232 disposed in the direction away from the substrate 1 in turn; the eighth isolation layer 232 protrudes from the seventh isolation layer 231.

[0155] Here, for the structure of the first isolation column 21 and the third isolation column 23, please refer to the above description of the first isolation column 21 and the third isolation column 23, and the repeated parts will not be described again.

[0156] The second partition structure 202 of the present embodiment adopts the first isolation column 21 and the third isolation column 23 stacked in multiple layers, which on the one hand enhances the film thickness of the encapsulation layer 3 by using the first isolation column 21 at the bottom layer to improve the encapsulation capability; on the other hand, the stacked structure can improve the film height of the encapsulation layer 3, thereby improving the effective encapsulation distance, prolonging the side vapor intrusion time, and improving the reliability.

[0157] In some embodiments, the encapsulation layer 3 can be a single-layer structure, or a multi-layer structure including a structure of inorganic layers and organic layers stacked.

[0158] As shown in FIG. 3, the encapsulation layer 3 includes a first inorganic encapsulation layer 31, an organic encapsulation layer 32, and a second inorganic encapsulation layer 33 disposed in the direction away from the substrate 1 in turn; the first inorganic encapsulation layer 31 and the second inorganic encapsulation layer 33 both extend from the display region AA to the edge of the transition region BB close to the opening region CC, and the orthographic projection of the first inorganic encapsulation layer 31 and the second inorganic encapsulation layer 33 on the substrate 1 covers the orthographic projection of the first partition structure 201, the second partition structure 202, and the blocking dam 4 on the substrate 1; the organic encapsulation layer 32 extends from the display region AA to the transition region BB and stops at the side of the blocking dam 4 close to the display region AA.

[0159] Optionally, the first inorganic encapsulation layer 31 and the second inorganic encapsulation layer 33 are made of the same material. For example, the first inorganic encapsulation layer 31 and the second inorganic encapsulation layer 33 can be made of silicon oxynitride (SiON), silicon oxide (SiOx), silicon nitride (SiNx), or an insulating material such as a polymer resin. The inorganic material such as silicon oxynitride (SiON), silicon oxide (SiOx), and silicon nitride (SiNx) has high compactness, and can prevent water and oxygen from entering. The material of the organic encapsulation layer 32 can be a polymer material containing a desiccant or a polymer material capable of blocking water vapor, such as a polymer resin, to planarize the surface of the display panel, relieve the stress of the first inorganic encapsulation layer 31 and the second inorganic encapsulation layer 33, and further include a hygroscopic material such as a desiccant to absorb water, oxygen, and other substances entering the inside.

[0160] The display panel according to the embodiments of the present disclosure is sealed by the inorganic-organic-inorganic three-layer encapsulation film layer, and the light emitting device in the display area AA is prevented from being eroded and deteriorated by water and oxygen. Most importantly, the encapsulation layer 3 has a strong wrapping ability to the partition structure 2 in the transition area BB, and a high sealing effect is achieved, so that the deterioration of the light emitting device caused by the spread of moisture and / or oxygen in the opening area CC to the display area AA can be effectively prevented.

[0161] In some embodiments, the display panel further includes a first electrode layer 5, a pixel definition layer 6 disposed on the side of the first electrode layer 5 away from the substrate 1, and a second electrode layer 7 disposed on the side of the light emitting layer EL away from the pixel definition layer 6. The pixel definition layer 6 is provided with a pixel opening, and the part of the first electrode layer 5 opposite to the pixel opening, the part of the light emitting layer EL falling into the pixel opening, and the part of the second electrode layer 7 falling into the pixel opening are collectively defined as a light emitting device. Optionally, the light emitting device is an OLED device. The pixel definition layer 6 extends from the display area AA to the side close to the transition area BB and stops at the side of the first partition structure 201 close to the display area AA; the first electrode layer 5 is located in the display area AA, and the second electrode layer 7 extends from the display area AA to the edge of the transition area BB close to the opening area CC.

[0162] The pixel opening defines the light emitting area of the light emitting device. The first electrode layer 5 includes a plurality of first electrodes of the light emitting devices, and the different first electrodes are insulated from each other. The second electrode layer 7 is laid in an entire layer, and the part of the second electrode layer 7 falling into the pixel opening is a second electrode. For example, the first electrode is an anode, and the second electrode is a cathode.

[0163] In some embodiments, the display panel further comprises a driving layer 8 disposed on the side of the first electrode layer 5 close to the substrate 1. The driving layer 8 comprises a pixel driving circuit corresponding to each light emitting device. The pixel driving circuit is configured to drive the light emitting device corresponding thereto to emit light. As shown in FIG. 3, a driving transistor Td in the pixel driving circuit is shown schematically. The driving transistor is electrically connected to the anode of the light emitting device Td and provides a driving voltage to the anode of the light emitting device in the open state thereof.

[0164] The pixel driving circuit comprises not only the driving transistor Td and a storage capacitor Cst, and the driving transistor is only one of a plurality of transistors in the pixel driving circuit, and other structures in the pixel driving circuit are not described herein. The pixel driving circuit can adopt a 7T1C (i.e., 7 transistors and 1 capacitor), 5T2C or 7T2C circuit structure. Of course, the pixel driving circuit can also adopt other circuit structures, which are not listed herein.

[0165] In some embodiments, FIG. 20 is a schematic diagram of a film layer stack of the display panel provided by the embodiments of the present disclosure. As shown in FIG. 20, the display panel further comprises a sensor assembly 100 disposed in the opening area CC, a touch function layer 9 disposed on the side of the encapsulation layer 3 away from the substrate 1, and an optical assembly 10 disposed on the side of the touch function layer 9 away from the substrate 1.

[0166] Optionally, the touch function layer 9 comprises, in sequence from the side away from the substrate 1, a touch buffer layer (Touch Buffer), a first touch metal layer (Touch Metal A, TMA), a touch insulator layer (Touch Insulator, TLD), a second touch metal layer (Touch Metal B, TMB) and a touch protection layer (TOC). The first touch metal layer and the second touch metal layer extend from the display area AA to the transition area BB and stop at the side of the blocking dam 4 close to the display area AA. The touch insulator layer and the touch protection layer extend from the display area AA to the edge of the transition area BB close to the opening area CC.

[0167] For example, as shown in FIG. 2, the opening area CC is provided with an opening H, and the sensor assembly is located in the opening H. The contour shape of the opening H can be circular, oval or rectangular, and the number of openings can be one or more.

[0168] For example, as shown in FIG. 20, the display panel further comprises a cover plate 11 disposed on the side of the optical assembly 10 away from the substrate 1, and the cover plate 11 covers the opening area.

[0169] In some embodiments, the display panel is a flexible OLED display panel.

[0170] In addition, the display panel provided by the embodiment of the present disclosure also has a transition area BB surrounding the opening area CC and located between the display area AA and the opening area CC; the display panel comprises a substrate 1, at least one partition structure 2 arranged on the substrate 1, a light-emitting layer EL arranged on a side of the partition structure 2 away from the substrate 1, and an encapsulation layer 3 arranged on a side of the light-emitting layer EL away from the substrate 1. The partition structure 2 is located in the transition area BB, and the partition structure 2 is used to partition the light-emitting layer EL located at the position of the partition structure 2. The light-emitting layer EL extends from the display area AA to an edge of the transition area BB close to the opening area CC, and is broken at the position of each partition structure 2; the encapsulation layer 3 extends from the display area AA to the transition area BB, and covers the part 20 of the partition structure 2 exposed by the light-emitting layer EL at the position of each partition structure 2.

[0171] The display panel corresponding to the display panel of Example 2 described above is different in that the first isolation column 21 is replaced by a second isolation column 22. Specifically, FIG. 21 is a cross-sectional view of the display panel in the transition area BB according to Example 7 provided by the embodiment of the present disclosure. As shown in FIG. 21, the partition structure 2 comprises a first partition structure 201 and a second partition structure 202; the first partition structure 201 is closer to the display area AA than the second partition structure 202. The display panel further comprises at least one blocking dam 4 arranged between the first partition structure 201 and the second partition structure 202.

[0172] The first partition structure 201 comprises the second isolation column 22, and the second partition structure 202 comprises a plurality of second isolation columns 22 arranged in layers; the second isolation column 22 comprises a fourth isolation layer 221, a fifth isolation layer 222 and a sixth isolation layer 223 arranged in sequence in a direction away from the substrate 1; the fourth isolation layer 221 and the sixth isolation layer 223 both protrude from the fifth isolation layer 222.

[0173] The second partition structure 202 of the embodiment of the present disclosure adopts the second isolation column 22 arranged in multiple layers, which can improve the film forming height of the encapsulation layer 3, thereby improving the effective encapsulation distance, prolonging the side edge water vapor invasion time, and improving the reliability.

[0174] The above is the complete description of the structure of the display panel provided by the embodiment of the present disclosure.

[0175] In addition, the embodiment of the present disclosure also provides a preparation method of a display panel, which is used to prepare the display panel in the above examples, and the preparation process comprises the following steps S11-S14.

[0176] S11, providing a substrate 1.

[0177] S12, forming a partition structure 2 on the substrate 1.

[0178] S13, forming a light-emitting layer EL on the side of the partition structure 2 away from the substrate 1.

[0179] S14, forming an encapsulation layer 3 on the side of the light-emitting layer EL away from the partition structure 2.

[0180] In some embodiments, taking the display panel under example 1 as an example, for S12, a process sequence for forming the partition structure 2 includes: dry etching - first wet etching - filling photoresist - second wet etching - removing photoresist.

[0181] FIGS. 22a-22f are intermediate sectional views of forming the partition structure 2 of the display panel under example 1 according to an embodiment of the present disclosure.

[0182] Specifically, first, as shown in FIG. 22a, a layer of metal is deposited, which is a titanium-aluminum-titanium (Ti / Al / Ti) structure, i.e., a first isolation layer material 211a, a second isolation layer material 212a, and a third isolation layer material 213a. The metal layer can be a certain layer of metal in the driving layer 8, such as the source / drain electrode layer of a transistor, so that it can be prepared at the same time as the structure of the elements in the driving layer 8, saving process steps and improving preparation efficiency. Then, as shown in FIG. 22b, photoresist is coated, and exposure and development are performed in sequence to obtain a photoresist pattern 12, which is the pattern of the first isolation column 21 that needs to be retained. Then, as shown in FIG. 22c, the isolation column material is dry etched to form a first state isolation column 13. Then, as shown in FIG. 22d, the first state isolation column 13 is subjected to first wet etching to form an inscribed structure to obtain a second state isolation column 14. Then, as shown in FIG. 22e, a peelable or removable material (such as photoresist) is filled between adjacent second state isolation columns 14, and the thickness of the filled photoresist 15 is set, for example, to 0.2-0.7 μm, so that the surface of the filled photoresist 15 away from the substrate 1 does not exceed the defined second isolation portion 2122. Then, as shown in FIG. 22f, second wet etching is further performed. Finally, as shown in FIG. 22g, the filled photoresist 15 is removed to form the first isolation column 21.

[0183] Here, the process of ordinary photoresist can also be used, for example, first coat the photoresist all over, and then perform exposure and development in sequence to obtain the pattern of the filled photoresist as shown in FIG. 22e.

[0184] In some embodiments, taking the first isolation column shown in FIG. 7c as an example, for S12, a process sequence for forming the partition structure 2 includes: dry etching - filling photoresist - wet etching - removing photoresist. Compared with the display panel under example 1 in the above embodiment, one step of wet etching is saved.

[0185] FIG. 23a-23f are intermediate stage structural diagrams of forming the first isolation column shown in FIG. 7c according to an embodiment of the present disclosure.

[0186] Specifically, first, as shown in FIG. 23a, a layer of metal is deposited, which is a titanium-aluminum-titanium (Ti / Al / Ti) structure, i.e., the first isolation layer material 211a, the second isolation layer material 212a, and the third isolation layer material 213a. The metal layer can be a certain layer of metal in the driving layer 8, such as the source / drain electrode layer of a transistor, so that it can be prepared at the same time as the structure of the elements in the driving layer 8, saving the process and improving the preparation efficiency. Then, as shown in FIG. 23b, photoresist is coated, and exposure and development are performed in sequence to obtain a photoresist pattern 12, which is the pattern of the first isolation column 21 that needs to be reserved. Then, as shown in FIG. 23c, dry etching is performed on the isolation column material to form a first state isolation column 13. Then, as shown in FIG. 23d, a material that can be peeled off or removed (such as photoresist) is filled between adjacent first state isolation columns 13, and the thickness of the filled photoresist 15 is set, for example, 0.2-0.7 μm, so that the surface of the filled photoresist 15 away from the substrate 1 does not exceed the defined second isolation part 2122. Then, as shown in FIG. 23e, wet etching is performed once; finally, as shown in FIG. 23f, the filled photoresist is removed to form the first isolation column 21.

[0187] In some embodiments, taking the display panel under example 4 as an example, for S12, a process sequence for forming the partition structure 2 includes: double-layer metal deposition film forming-one photoresist coating-forming-second photoresist coating-forming inner isolation column-photoresist removal.

[0188] FIG. 24a-24g are intermediate stage structural diagrams of forming the partition structure 2 of the display panel under example 4 according to an embodiment of the present disclosure.

[0189] Specifically, first, as shown in FIG. 24a, a first metal layer M1 and a second metal layer M2 are formed in sequence, wherein the first metal layer M1 is a titanium-aluminum-titanium (Ti / Al / Ti) structure, and the second metal layer M2 is a titanium-aluminum-titanium (Ti / Al / Ti) structure. The first metal layer M1 and the second metal layer M2 can be different layer metal layers in the driving layer 8, for example, two layer source / drain electrode layers of a transistor. In the display area AA, there is an interlayer insulating layer between the first metal layer M1 and the second metal layer M2; in the transition area BB, the first metal layer M1 and the second metal layer M2 are in direct contact. The isolation column material layer can be prepared at the same time as the structure of the elements in the driving layer 8, saving process steps and improving production efficiency. Then, as shown in FIG. 24b, photoresist is coated, and exposure and development are performed in sequence to obtain a photoresist pattern 12, which is also the pattern of the second partition structure 202 to be retained. Then, as shown in FIG. 24c, dry etching is performed on the second metal layer to form a first state isolation column; and the first state isolation column is subjected to a first wet etching to form an incision structure, thereby obtaining a second state isolation column, which is a second layer second isolation column 22 at this time. Then, photoresist is coated, and exposure and development are performed in sequence to obtain a photoresist pattern 16, which is also the pattern of the first partition structure 201 and the second partition structure 202 to be retained. Then, as shown in FIG. 24d, dry etching is performed on the first metal layer M1 to form a first state isolation column; and the first state isolation column is subjected to a first wet etching to form an incision structure, thereby obtaining a second state isolation column, which is a first layer second isolation column 22 at this time. At this point, the photoresist is removed, and the display panel of Example 7 can be formed.

[0190] Further, as shown in FIG. 24e, a peelable or removable material (for example, photoresist) is filled between adjacent second state isolation columns, and the thickness of the filled photoresist 15 is set, for example, 0.2 μm to 0.7 μm, so that the surface of the filled photoresist 15 away from the substrate 1 does not exceed the defined second isolation portion 2122. Then, as shown in FIG. 24f, a second wet etching is further performed; finally, as shown in FIG. 24g, the filled photoresist 15 is removed to form a first isolation column 21, thereby obtaining a stacked structure of the first isolation column 21 and the second isolation column 22.

[0191] In addition, the display device according to the embodiments of the present disclosure can be any product having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a vehicle-mounted device, etc. Other essential components of the display device are understood by those skilled in the art and are not described here in detail, and should not be considered as a limitation on the present disclosure.

[0192] It is understood that the above embodiments are only exemplary for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display panel having a display area, a transition area and an aperture area; the transition area surrounds the aperture area and is located between the display area and the aperture area; the display panel comprises a substrate, at least one partition structure disposed on the substrate, a light-emitting layer disposed on a side of the partition structure away from the substrate, and an encapsulation layer disposed on a side of the light-emitting layer away from the substrate; the partition structure is located in the transition area, the light-emitting layer extends from the display area to an edge of the transition area close to the aperture area, and is interrupted at the location of each partition structure; the encapsulation layer extends from the display area to the transition area, and covers the part of the partition structure exposed by the light-emitting layer at the location of each partition structure; the partition structure comprises a first isolation column; the first isolation column comprises a first isolation layer, a second isolation layer and a third isolation layer disposed in sequence away from the substrate; a projection of the first isolation layer on the substrate covers a projection of the second isolation layer on the substrate; the second isolation layer comprises a first isolation portion close to the first isolation layer and a second isolation portion close to the third isolation layer; the third isolation layer protrudes from the second isolation portion; a first side surface of the first isolation portion close to the encapsulation layer is not coplanar with a second side surface of the second isolation portion close to the encapsulation layer; a shortest distance from a first surface of the encapsulation layer away from the substrate to the partition structure is between 0.4 um and 0.6 um; the first isolation portion protrudes from the second isolation portion and forms a stepped structure with the second isolation portion; a first slope angle of the first isolation portion is greater than a second slope angle of the second isolation portion; the first side surface comprises a first sub-surface and a second sub-surface connected to one end of the first sub-surface, the other end of the first sub-surface being connected to the second side surface; a third slope angle of the first sub-surface is smaller than a fourth slope angle of the second sub-surface; an edge of a projection of the third isolation layer on the substrate falls within a projection of the first sub-surface on the substrate; a ratio between a maximum height of the second isolation layer and a maximum height of the first isolation portion is between 1.5 and 4; the maximum height of the first isolation portion is between 0.15 um and 0.6 um; a dihedral angle between a tangent plane on the first side surface and a tangent plane on the second side surface at a contact point between the first side surface and the second side surface is between 90° and 150°; the first isolation layer comprises a second surface close to the second isolation layer; a dihedral angle between a tangent plane on the first side surface and the second surface at a contact point between the first side surface and the second surface is between 15° and 90°; the first isolation layer protrudes from the first isolation portion. ​ ​ ​ ​ ​ 2. The display panel of claim 1, wherein, ​ 3. The display panel of claim 1, wherein, ​ 4. The display panel of claim 3, wherein, ​ 5. The display panel of claim 3, wherein, ​ ​ 6. The display panel of claim 5, wherein, ​ 7. The display panel of claim 3, wherein, ​ 8. The display panel of claim 7, wherein, ​ 9. The display panel of claim 1, wherein, ​ 10. The display panel of claim 1, wherein, ​ ​ 11. The display panel according to any one of claims 1 to 10, wherein ​ 12. The display panel according to any one of claims 1 to 10, wherein The first side surface comprises a first sub-surface and a second sub-surface connected to one end of the first sub-surface, the other end of the first sub-surface being connected to the second side surface, the first sub-surface being a plane, and the second sub-surface being a plane; The second sub-surface is flush with the third surface of the first isolation layer close to the encapsulation layer.

13. The display panel according to any one of claims 1 to 10, wherein The partition structure comprises a first partition structure and a second partition structure; the first partition structure is closer to the display area than the second partition structure; The display panel further comprises at least one blocking dam, which is arranged between the first partition structure and the second partition structure; The first partition structure comprises a first isolation column, and the second partition structure comprises a first isolation column or a plurality of first isolation columns arranged in layers.

14. The display panel according to any one of claims 1 to 10, wherein The partition structure comprises a first partition structure and a second partition structure; the first partition structure is closer to the display area than the second partition structure; The display panel further comprises at least one blocking dam, which is arranged between the first partition structure and the second partition structure; The first partition structure comprises a first isolation column, and the second partition structure comprises a plurality of second isolation columns arranged in layers; the second isolation column comprises a fourth isolation layer, a fifth isolation layer and a sixth isolation layer arranged in sequence in a direction away from the substrate substrate; the fourth isolation layer and the sixth isolation layer both protrude from the fifth isolation layer; The encapsulation layer forms a closed air hole or no air hole at the position where the first isolation column partitions the light-emitting layer; the encapsulation layer forms an open air hole at the position where the second isolation column partitions the light-emitting layer.

15. The display panel according to any one of claims 1 to 10, wherein, The partition structure comprises a first partition structure and a second partition structure; the first partition structure is closer to the display area than the second partition structure; The display panel further comprises at least one blocking dam, which is arranged between the first partition structure and the second partition structure; The first partition structure comprises a first isolation column, and the second partition structure comprises a first isolation column and at least one second isolation column arranged on the side of the first isolation layer away from the substrate substrate; the second isolation column comprises a fourth isolation layer, a fifth isolation layer and a sixth isolation layer arranged in sequence in a direction away from the substrate substrate; the fourth isolation layer and the sixth isolation layer both protrude from the fifth isolation layer; The encapsulation layer forms a closed air hole or no air hole at the position where the first isolation column partitions the light-emitting layer; the encapsulation layer forms an open air hole at the position where the second isolation column partitions the light-emitting layer.

16. The display panel of claim 15, wherein, The ratio of the minimum width dimension of the second isolation layer in the first direction to the minimum width dimension of the third isolation layer in the first direction is between 1 / 3 and 1 / 2; The ratio of the minimum width dimension of the fifth isolation layer in the first direction to the minimum width dimension of the sixth isolation layer in the first direction is between 1 / 3 and 1 / 2.

17. The display panel according to any one of claims 1 to 10, wherein, The partition structure comprises a first partition structure and a second partition structure; the first partition structure is closer to the display area than the second partition structure; The display panel further comprises at least one blocking dam, which is arranged between the first partition structure and the second partition structure. The first partition structure comprises a first isolation column, and the second partition structure comprises a plurality of third isolation columns arranged in layers; the third isolation column comprises a seventh isolation layer and an eighth isolation layer arranged in sequence in a direction away from the substrate substrate; the eighth isolation layer protrudes from the seventh isolation layer; The encapsulation layer forms a closed air hole or no air hole at the position where the first isolation column partitions the light-emitting layer; the encapsulation layer forms an open air hole at the position where the third isolation column partitions the light-emitting layer.

18. The display panel according to any one of claims 1 to 10, wherein, The partition structure comprises a first partition structure and a second partition structure; the first partition structure is closer to the display area than the second partition structure; The display panel further comprises at least one blocking dam, which is arranged between the first partition structure and the second partition structure. The first partition structure comprises a first isolation column, and the second partition structure comprises a first isolation column and at least one third isolation column arranged on a side of the first isolation layer away from the substrate substrate; the third isolation column comprises a seventh isolation layer and an eighth isolation layer arranged in sequence in a direction away from the substrate substrate; the eighth isolation layer protrudes from the seventh isolation layer; The encapsulation layer forms a closed air hole or no air hole at the position where the first isolation column partitions the light-emitting layer; the encapsulation layer forms an open air hole at the position where the third isolation column partitions the light-emitting layer. The partition structure comprises a first partition structure and a second partition structure; the first partition structure is closer to the display area than the second partition structure; the display panel further comprises at least one blocking dam, which is arranged between the first partition structure and the second partition structure; 19. The display panel of claim 1, wherein, The encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer arranged in sequence in a direction away from the substrate substrate; the first inorganic encapsulation layer and the second inorganic encapsulation layer both extend from the display area to an edge of the transition area close to the opening area, and the orthographic projections of the first inorganic encapsulation layer and the second inorganic encapsulation layer on the substrate substrate cover the orthographic projections of the first partition structure, the second partition structure and the blocking dam on the substrate substrate; the organic encapsulation layer extends from the display area to the transition area and stops at a side of the blocking dam close to the display area.

20. A display panel having a display area, a transition area and an opening area; the transition area surrounds the opening area and is located between the display area and the opening area; the display panel comprises a substrate substrate, at least one partition structure arranged on the substrate substrate, a light-emitting layer arranged on a side of the partition structure away from the substrate substrate, and an encapsulation layer arranged on a side of the light-emitting layer away from the substrate substrate; The partition structure is located in the transition area, and the light-emitting layer extends from the display area to an edge of the transition area close to the opening area and is interrupted at the position of each partition structure. ​ The encapsulation layer extends from the display area to the transition area, and covers the part of the partition structure exposed by the light-emitting layer at the position of each partition structure; The partition structure comprises a first partition structure and a second partition structure; the first partition structure is closer to the display area than the second partition structure; and the display panel further comprises at least one blocking dam, which is arranged between the first partition structure and the second partition structure. The first partition structure comprises a second isolation column, and the second partition structure comprises a plurality of second isolation columns arranged in a stack; the second isolation column comprises a fourth isolation layer, a fifth isolation layer and a sixth isolation layer arranged in sequence in a direction away from the substrate substrate; and the fourth isolation layer and the sixth isolation layer both protrude from the fifth isolation layer.

21. A display device comprising the display panel according to any one of claims 1-20.

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