Light-emitting device and display device

Abstract

Provided in the present application are a light-emitting device and a display device. The light-emitting device comprises a drive substrate, a light-emitting element, a base color layer, a packaging layer, a transparent substrate layer, and an ink layer. The drive substrate has a working surface, and the light-emitting element and the base color layer are arranged on the working surface. The packaging layer is arranged on the drive substrate, and the packaging layer covers the light-emitting element and the base color layer. The transparent substrate layer is arranged on the surface of the packaging layer away from the drive substrate. The ink layer is arranged on the surface of the transparent substrate layer away from the packaging layer. The ink layer forms a texture pattern on the surface of the transparent substrate layer.

Description

Light-emitting devices and display equipment

[0001] This application claims priority to Chinese patent application No. 202422368646.7, filed on September 26, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to, but is not limited to, the field of light-emitting device technology, and in particular to a light-emitting device and a display device. Background Technology

[0003] New types of displays, capable of displaying natural or unique textures such as wood grain and stone grain when the screen is off, and displaying normally when the screen is on, are gradually being applied in automotive, commercial, and home displays. The main principle of these always-on textured displays is to superimpose a semi-transparent plastic shell or film onto the display surface, and then print semi-transparent colored ink on the surface to form corresponding patterns. The display then reflects ambient light through the ink, thus displaying the colored texture pattern. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0005] This application provides a light-emitting device and a display device that can achieve uniform display with minimal color deviation, thereby enabling the effect of hiding seams during splicing.

[0006] In a first aspect, embodiments of this application provide a light-emitting device, including a driving substrate, a light-emitting element, a base color layer, an encapsulation layer, a transparent substrate layer, and an ink layer.

[0007] The driving substrate has a working surface, and the light-emitting element and the base color layer are disposed on the working surface.

[0008] The encapsulation layer is disposed on the driving substrate, and the encapsulation layer covers the light-emitting element and the base color layer.

[0009] The transparent substrate layer is disposed on the surface of the encapsulation layer away from the driving substrate, and the ink layer is disposed on the surface of the transparent substrate layer away from the encapsulation layer, wherein the ink layer forms a textured pattern on the surface of the transparent substrate layer.

[0010] In some embodiments, the base color layer is disposed outside the area where the light-emitting element is located, and the base color layer covers the portion of the working surface not covered by the light-emitting element.

[0011] In some embodiments, a side surface of the light emitting element distal to the driving substrate is higher than a side surface of the base color layer distal to the driving substrate.

[0012] In some embodiments, a distance between a side surface of the encapsulation layer distal to the driving substrate and a side surface of the light emitting element distal to the driving substrate is 50 μm to 200 μm.

[0013] In some embodiments, a thickness of the ink layer is 5 μm to 40 μm.

[0014] In some embodiments, a thickness of the transparent substrate layer is 40 μm to 100 μm.

[0015] In some embodiments, a material of the base color layer comprises a fill color ink, the fill color ink comprising the following components in mass fractions: 30 parts to 60 parts of a modified acrylic resin, 2 parts to 4 parts of a red pigment, 2 parts to 4 parts of a matting agent, 5 parts to 10 parts of silica nanoparticles, 30 parts to 60 parts of a dimethyl ester, 10 parts to 20 parts of butyl acetate, and 5 parts to 10 parts of an auxiliary agent.

[0016] In some embodiments, a material of the ink layer comprises a reflective ink, the reflective ink comprising the following components in mass fractions: 70 parts to 90 parts of a transparent light oil, 5 parts to 10 parts of a silicone micro powder, 5 parts to 10 parts of a silica particle, 1 part to 2 parts of a dispersing agent, 1 part to 2 parts of a leveling agent, 1 part to 2 parts of an antifoaming agent, 1 part to 2 parts of an adhesion agent, and 4 parts to 8 parts of a diluent.

[0017] In some embodiments, the light emitting device further comprises an adhesive layer, the adhesive layer being disposed between the encapsulation layer and the transparent substrate layer.

[0018] In some embodiments, a thickness of the adhesive layer is 20 μm to 50 μm.

[0019] In some embodiments, the light emitting device further comprises a protective layer, the protective layer being disposed on a surface of the ink layer distal to the transparent substrate layer, the protective layer covering the ink layer.

[0020] In a second aspect, the embodiments of the present application further provide a display device, comprising the light emitting device according to any one of the above embodiments.

[0021] The light emitting device provided by the embodiments of the present application comprises a base color layer and an ink layer. The ink layer forms a texture pattern on the surface of the transparent substrate layer. The base color layer and the ink layer cooperate to form a texture effect, thereby reducing the influence of the texture of the ink layer on the display effect of a bright screen picture, improving the consistency of the light transmittance and the uniformity of the brightness of the light emitting device when displaying a bright screen. The ink layer and the base color layer jointly form a texture effect, which enables the light emitting device to have the effect of uniform display and being less prone to color deviation, thereby realizing the effect of hiding the joint seam when splicing.

[0022] Other aspects can become apparent from a review of the drawings and detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0023] FIG. 1 is a structural schematic diagram of a light emitting device according to some embodiments of the present application; and

[0024] FIG. 2 is a structural schematic diagram of a light emitting device according to some embodiments of the present application.

[0025] Explanation of Reference Signs:

[0026] 10, driving substrate; 20, light emitting element; 30, base color layer; 40, encapsulation layer; 50, adhesive layer; 60, transparent substrate layer; 70, ink layer; 80, protective layer. Embodiments of the present application

[0027] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of ways other than those described herein without departing from the spirit of the present application, and it is understood that similar modifications of the present application will occur to those skilled in the art upon reading and understanding the description of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0029] In the description of the present application, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of facilitating the description of the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0030] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0031] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0032] In the process of implementing the embodiments of the present disclosure, the applicant finds that in the conventional screen texture display screen, due to the differences in ink thickness and color in different areas of the texture pattern, it is easy to cause local color deviation during display, and it is also easy to cause the problem of seam when multiple display screens are spliced.

[0033] Referring to FIGS. 1-2, the present application provides a light emitting device, which includes a driving substrate 10, a light emitting element 20, a base color layer 30, an encapsulation layer 40, a transparent substrate layer 60 and an ink layer 70. The driving substrate 10 has a working surface, and the light emitting element 20 and the base color layer 30 are disposed on the working surface. The encapsulation layer 40 is disposed on the driving substrate 10, and the encapsulation layer 40 covers the light emitting element 20 and the base color layer 30. The transparent substrate layer 60 is disposed on the surface of the encapsulation layer 40 away from the driving substrate 10. The ink layer 70 is disposed on the surface of the transparent substrate layer 60 away from the encapsulation layer 40, and the ink layer 70 includes a texture pattern on the surface of the transparent substrate layer 60.

[0034] The light-emitting device provided by the embodiments of the present application comprises a base color layer 30 and an ink layer 70, and the ink layer 70 forms a texture pattern on the surface of the transparent substrate layer 60. The base color layer 30 can cooperate with the ink layer 70 to form a texture effect, thereby reducing the influence of the texture of the ink layer 70 on the display effect of the bright screen picture and improving the consistency of the light transmittance and the uniformity of the brightness of the light-emitting device when displaying in the bright screen. The ink layer 70 and the base color layer 30 jointly form a texture effect, which can make the light-emitting device have the effect of uniform display and not easy to deviate from the color, and further can realize the effect of hiding the joint seam when splicing.

[0035] In one embodiment, a plurality of light-emitting elements 20 are distributed on the surface of the driving substrate 10.

[0036] In some embodiments, the light-emitting element 20 can comprise a light-emitting diode (LED) chip.

[0037] In some embodiments, the light-emitting element 20 can comprise a Mini / Micro LED in Package (MIP) lamp bead.

[0038] In some embodiments, the light-emitting element 20 can comprise a discrete Surface Mounted Technology (SMT) lamp bead.

[0039] In some embodiments, the base color layer 30 is a polymer layer with color.

[0040] It can be understood that the base color layer 30 can have one or more colors, and the base color layer 30 can be prepared by using a color-filling ink. In some embodiments, the color-filling ink comprises the following components in the following mass fractions: 30-60 parts of modified acrylic resin, 2-4 parts of red pigment, 2-4 parts of matting agent, 5-10 parts of silicon oxide nanoparticles, 30-60 parts of dimethyl carbonate, 10-20 parts of butyl acetate, and 5-10 parts of auxiliary agent. The auxiliary agent can comprise at least one of a dispersing agent, a leveling agent, a defoaming agent, and an adhesion agent.

[0041] In some embodiments, the base color layer 30 comprises a substrate film layer and a color layer which are arranged in a stack.

[0042] It can be understood that the ink layer 70 forms a texture pattern on the surface of the transparent substrate layer 60, and the ink layer 70 can be made of a reflective ink. In some embodiments, the reflective ink includes the following components in mass fraction: 70-90 parts of transparent light oil, 5-10 parts of silicone powder, 5-10 parts of silica particles, 1-2 parts of dispersing agent, 1-2 parts of leveling agent, 1-2 parts of defoaming agent, 1-2 parts of adhesion agent, and 4-8 parts of diluent.

[0043] In some embodiments, the base color layer 30 is arranged outside the area where the light emitting element 20 is located, and the base color layer 30 covers the part of the working surface which is not covered by the light emitting element 20.

[0044] In some embodiments, the side surface of the light emitting element 20 away from the driving substrate 10 is higher than the side surface of the base color layer 30 away from the driving substrate 10.

[0045] It can be understood that the side surface of the light emitting element 20 away from the driving substrate 10 is higher than the side surface of the base color layer 30 away from the driving substrate 10, which can make the base color layer 30 not affect the light emission of the light emitting element 20, thereby realizing better light emission effect of the light emitting device.

[0046] In some embodiments, the distance between the side surface of the encapsulation layer 40 away from the driving substrate 10 and the side surface of the light emitting element 20 away from the driving substrate 10 is 50-200 μm.

[0047] In some embodiments, the distance between the side surface of the encapsulation layer 40 away from the driving substrate 10 and the side surface of the light emitting element 20 away from the driving substrate 10 can be 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, or 200 μm, or the distance between the side surface of the encapsulation layer 40 away from the driving substrate 10 and the side surface of the light emitting element 20 away from the driving substrate 10 can also be within the range between any two of the above distances.

[0048] In some embodiments, the thickness of the ink layer 70 is 5-40 μm.

[0049] In some embodiments, the thickness of the ink layer 70 can be 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, or 40 μm, or the thickness of the ink layer 70 can also be within the range between any two of the above thicknesses.

[0050] In some embodiments, the thickness of the transparent substrate layer 60 is 40 μm to 100 μm.

[0051] In some embodiments, the thickness of the transparent substrate layer 60 can be 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 95 μm or 100 μm, or the thickness of the transparent substrate layer 60 can also be within a range between any two of the above thicknesses.

[0052] In some embodiments, the light emitting device further comprises an adhesive layer 50, which is disposed between the encapsulation layer 40 and the transparent substrate layer 60.

[0053] In some embodiments, the thickness of the adhesive layer 50 is 20 μm to 50 μm.

[0054] In some embodiments, the thickness of the adhesive layer 50 can be 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm or 50 μm, or the thickness of the adhesive layer 50 can also be within a range between any two of the above thicknesses.

[0055] In some embodiments, the light emitting device further comprises a protective layer 80, which is disposed on a surface of the ink layer 70 away from the transparent substrate layer 60, and the protective layer 80 covers the ink layer 70.

[0056] The present application also provides a preparation method of a light emitting device, which comprises the following steps:

[0057] providing a substrate, which comprises a driving substrate 10 and a light emitting element 20 disposed on a working surface of the driving substrate 10;

[0058] forming a base color layer 30 on a portion of the working surface that is not disposed with the light emitting element 20;

[0059] forming an encapsulation layer 40 on the driving substrate 10, the encapsulation layer 40 covering the light emitting element 20 and the base color layer 30;

[0060] forming a transparent substrate layer 60 on a surface of the encapsulation layer 40 away from the driving substrate 10; and

[0061] forming an ink layer 70 on a surface of the transparent substrate layer 60 away from the encapsulation layer 40, the ink layer 70 comprising a texture pattern on the surface of the transparent substrate layer 60.

[0062] The present application also provides a preparation method of a light emitting device, which is used for preparing the light emitting device in any of the above embodiments. The preparation method of the light emitting device comprises the following steps:

[0063] A substrate is provided, which includes a driving substrate 10 and a light emitting element 20 disposed on a working surface of the driving substrate 10;

[0064] A base color layer 30 is formed on the working surface of the driving substrate 10.

[0065] An encapsulation layer 40 is formed on the driving substrate 10, which covers the light emitting element 20 and the base color layer 30.

[0066] An adhesive layer 50 is formed on a surface of the encapsulation layer 40 away from the driving substrate 10.

[0067] A transparent substrate layer 60 is formed on a surface of the adhesive layer 50 away from the driving substrate 10.

[0068] An ink layer 70 is formed on a surface of the transparent substrate layer 60 away from the encapsulation layer 40, which includes a texture pattern on the surface of the transparent substrate layer 60; and

[0069] A protective layer 80 is formed on the transparent substrate layer 60, which covers the ink layer 70.

[0070] The embodiment of the present application further provides a display device including the light emitting device in any of the above embodiments.

[0071] The following is an embodiment of a preparation method of the light emitting device provided by the embodiment of the present application:

[0072] (1) Setting the base color layer 30: providing an MLED die bonding lamp plate with a process edge. Providing a color filling ink, which includes the following components in mass fraction: 30-60 parts of modified acrylic resin, 2-4 parts of red pigment, 2-4 parts of matting agent, 5-10 parts of silicon oxide nanoparticles, 30-60 parts of dimethyl acid ester, 10-20 parts of butyl acetate, and 5-10 parts of auxiliary agent. The auxiliary agent can include at least one of dispersing agent, leveling agent, defoaming agent and adhesion agent. The color filling ink is sprayed on a printed circuit board (PCB) along the lamp joint by using an inkjet printing process and is heated and cured to form the base color layer 30 covering the part of the working surface not covered by the light emitting element 20, wherein the heating temperature is 80°C and the curing time is 30 min.

[0073] (2) Setting the encapsulation layer 40: providing an AB component thermosetting epoxy resin adhesive, which is set on the surface of the MLED lamp plate by using a film pressure vacuum degassing process and is heated and cured, the heating temperature is 120°C and the curing time is 3 hours.

[0074] (3) Set the ink layer 70: provide a back adhesive PET (polyethylene terephthalate) substrate film with a release film, the thickness of the release film is 70 μm, the thickness of the OCA (adhesive layer 50) is 25 μm, and the thickness of the PET film is 50 μm. Provide a transparent white ink, the transparent white ink comprises the following components in mass fraction: 70-90 parts of transparent gloss oil, 5-10 parts of silicone powder, 5-10 parts of silica particles, 1-2 parts of high molecular dispersant, 1-2 parts of leveling agent, 1-2 parts of defoaming agent, 1-2 parts of acrylic adhesive, and 4-8 parts of diluent. Mix and stir the transparent white ink and the open water according to a mass ratio of (10-5):1, and screen print on the surface of the PET film, the screen printing thickness is 40 μm, the drying temperature is 80°C, and the drying time is 30 min. After the release film is torn off, the PET film is rolled on the surface of the packaging layer 40 by using a vacuum laminating machine.

[0075] (4) Set the protective layer 80: provide a high-hardness silicone resin glue, the high-hardness silicone resin glue is coated on the ink layer 70 by using a 40 μm coating rod, and surface drying and normal temperature curing are performed, the drying temperature is 80°C, the drying time is 30 min, and the normal temperature curing time is 24 h.

[0076] (5) Edge cutting and splicing: use a scribe machine to cut the process edge of the LED lamp panel, and splice into an LED display screen.

[0077] The following is another embodiment of the preparation method of the light emitting device provided by the embodiment of the application: (1) Prepare the base color layer 30: provide a back adhesive PET substrate film with a release film, the thickness of the release film is 70 μm, the thickness of the OCA is 25 μm, and the thickness of the PET film is 50 μm. Provide a single-component dry-type red ink, and print a red wood grain pattern on the surface of the PET film by using a screen printing process and perform drying and curing, the screen printing thickness is 40 μm, the drying temperature is 60°C, and the curing time is 10 min.

[0078] (2) Set the base color layer 30: provide a small-pitch LED display module prepared by using an SMT surface mounting process, remove the release film of the base color film and cover it on the LED lamp surface, focus a laser spot on the surface of the base color film, and use laser marking to remove the position of the base color film corresponding to the LED lamp bead. Provide a grid-shaped jig, the position corresponding to the LED lamp seam of the grid-shaped jig is solid, and the position corresponding to the lamp bead of the grid-shaped jig is empty. Press the base color film on the PCB board at the lamp seam by using the grid jig, and use a high-pressure laminating process to make the base color layer 30 firmly adhere to the PCB board, and then remove the grid jig.

[0079] (3) Set the encapsulation layer 40: provide an AB component epoxy resin glue, after mixing and stirring the AB component epoxy resin glue uniformly according to the corresponding proportion, potting on the surface of the LED lamp plate, and using the GOB film pressing process for normal temperature curing, the curing time is 24h.

[0080] (4) Set the ink layer 70: provide a back adhesive PET substrate film with a release film, the thickness of the release film is 70 μm, the thickness of the OCA is 25 μm, and the thickness of the PET film is 50 μm. Provide a transparent black ink, the transparent black ink comprises the following components in mass fraction: 70-90 parts of transparent gloss oil, 2-10 parts of carbon black, 2-10 parts of flatting agent, 2-8 parts of nano silicon oxide particles, 1-2 parts of high molecular dispersing agent, 1-2 parts of leveling agent, 1-2 parts of defoaming agent, 1-2 parts of acrylic adhesion agent and 4-8 parts of diluent. Screen printing the transparent black ink on the surface of the PET film, the screen printing thickness is 40 μm, the drying temperature is 80℃, and the drying time is 30min. After tearing off the release film, the PET film is rolled on the surface of the transparent adhesive layer using a vacuum laminating machine.

[0081] (5) Set the protective layer 80: provide a high-hardness silicone resin glue, use a 40 μm coating rod to coat the high-hardness silicone resin glue on the ink layer 70, and perform normal temperature curing, the normal temperature curing time is 24h.

[0082] (6) Edge cutting and splicing: use a scribe machine to cut the process edges of the plurality of LED lamp plates, and splice the plurality of LED lamp plates into an LED display screen.

[0083] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not contradict, they should be considered within the scope of the present disclosure.

[0084] The above-described embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims, and the description and drawings can be used to explain the content of the claims.

Claims

1. A light emitting device, comprising: a driving substrate having a working surface; a light emitting element disposed on the working surface; a base color layer disposed on the working surface; an encapsulation layer disposed on the driving substrate, the encapsulation layer covering the light emitting element and the base color layer; a transparent substrate layer disposed on a surface of the encapsulation layer away from the driving substrate; and an ink layer disposed on a surface of the transparent substrate layer away from the encapsulation layer, the ink layer forming a texture pattern on the surface of the transparent substrate layer. The base color layer is disposed outside a region where the light emitting element is located, and the base color layer covers a portion of the working surface that is not covered by the light emitting element.

2. The light-emitting device according to claim 1, wherein A side surface of the light emitting element away from the driving substrate is higher than a side surface of the base color layer away from the driving substrate.

3. The light emitting device according to claim 1 or 2, wherein A distance between a side surface of the encapsulation layer away from the driving substrate and a side surface of the light emitting element away from the driving substrate is 50 μm to 200 μm.

4. A light emitting device according to any of claims 1-3, wherein A thickness of the ink layer is 5 μm to 40 μm.

5. A light emitting device according to any of claims 1-4, wherein A thickness of the transparent substrate layer is 40 μm to 100 μm.

6. A light-emitting device according to any one of claims 1-5, wherein A material of the base color layer comprises a color-filling ink, the color-filling ink comprising the following components in mass fractions: 30 parts to 60 parts of a modified acrylic resin, 2 parts to 4 parts of a red pigment, 2 parts to 4 parts of a matting agent, 5 parts to 10 parts of silica nanoparticles, 30 parts to 60 parts of a dimethyl ester, 10 parts to 20 parts of butyl acetate, and 5 parts to 10 parts of an auxiliary agent.

7. A light emitting device according to any of claims 1-6, wherein A material of the ink layer comprises a reflective ink, the reflective ink comprising the following components in mass fractions: 70 parts to 90 parts of a transparent light oil, 5 parts to 10 parts of a silicone micro powder, 5 parts to 10 parts of a silica particle, 1 part to 2 parts of a dispersing agent, 1 part to 2 parts of a leveling agent, 1 part to 2 parts of an antifoaming agent, 1 part to 2 parts of an adhesion agent, and 4 parts to 8 parts of a diluent.

8. A light emitting device according to any of claims 1-7, wherein 9.The light emitting device according to any one of claims 1 to 8, further comprising: a glue layer disposed between the encapsulation layer and the transparent substrate layer. A thickness of the glue layer is 20 μm to 50 μm.

10. The light-emitting device according to claim 9, wherein 11.The light emitting device according to any one of claims 1 to 10, further comprising: a protective layer disposed on a surface of the ink layer away from the transparent substrate layer, the protective layer covering the ink layer. 12.A display device comprising the light emitting device according to any one of claims 1 to 11. ​

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