Fixture for optical module testing and optical module testing apparatus

Abstract

Provided in the embodiments of the present disclosure are a fixture for optical module testing and an optical module testing apparatus. The fixture comprises: a housing; a first temperature control assembly and a second temperature control assembly, both of which are arranged opposite and spaced apart from each other in the housing; a limiting structure provided with a limiting through hole, the limiting structure being sandwiched between the first temperature control assembly and the second temperature control assembly, a first limiting boss and a second limiting boss corresponding to the first temperature control assembly and the second temperature control assembly being respectively arranged on two opposite sides of the limiting through hole, and an insertion cavity for accommodating an optical module to be tested being formed between the first limiting boss and the second limiting boss; and a driving mechanism arranged in the housing, the driving mechanism being in transmission connection with the first temperature control assembly and the second temperature control assembly respectively, so as to drive the first temperature control assembly and the second temperature control assembly to move in a direction close to the limiting structure to abut against the optical module to be tested.

Description

Clamp and optical module testing device

[0001] The present disclosure claims priority to three Chinese patent applications, CN202411380220.1 (with the title of "A clamp and optical module testing device for optical module testing"), CN202411380213.1 (with the title of "A clamp, testing device and temperature control method for optical module testing") and CN202411380217.X (with the title of "An optical module testing device") filed with the China National Intellectual Property Office on September 30, 2024, the contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD

[0002] Embodiments of the present disclosure belong to the technical field of optoelectronic device performance testing, and specifically relate to a clamp and optical module testing device for optical module testing. BACKGROUND

[0003] The optical module testing device includes a bit error rate tester, and the to-be-tested optical module inserted into the clamp is connected in communication with the bit error rate tester by plugging into the test circuit board (DUT board) to test the to-be-tested optical module.

[0004] Generally, different to-be-tested optical modules may have size errors in manufacturing, and when different to-be-tested optical modules are inserted into the clamp by hand or a mechanical hand to be plugged into the test circuit board, not every to-be-tested optical module matches the slot of the clamp, so that it cannot be guaranteed that the positions of every to-be-tested optical module in X, Y and Z directions are consistent. Thus, when the to-be-tested optical module is plugged into the test circuit board, the position of the to-be-tested optical module in any one of X, Y or Z directions is offset, which on one hand causes the test circuit board to be stressed to reduce its service life, and more importantly, the poor contact caused by the offset seriously affects the signal transmission channel, causing the transmission accuracy of the test signal, which will directly affect the accuracy of the test result.

[0005] Therefore, how to solve the above problems has become a technical problem to be solved by the person skilled in the art. SUMMARY

[0006] Embodiments of the present disclosure aim to at least solve one of the technical problems existing in the prior art, and provide a clamp and optical module testing device for optical module testing.

[0007] In a first aspect, the present disclosure provides a fixture for optical module testing, comprising: a housing; a first temperature control assembly and a second temperature control assembly oppositely arranged in the housing; a limiting structure provided with a limiting through hole, the limiting structure being arranged between the first temperature control assembly and the second temperature control assembly, the limiting through hole being provided with a first limiting boss corresponding to the first temperature control assembly and a second limiting boss corresponding to the second temperature control assembly on opposite sides of the limiting through hole, the first limiting boss and the second limiting boss forming an insertion cavity for accommodating a to-be-tested optical module; and a driving mechanism arranged in the housing, the driving mechanism being in transmission connection with the first temperature control assembly and the second temperature control assembly respectively, so as to drive the first temperature control assembly and the second temperature control assembly to move towards the limiting structure to abut against the to-be-tested optical module.

[0008] In a second aspect, the present disclosure provides an optical module testing device, comprising a test box, the fixture for optical module testing, and a test board.

[0009] In a third aspect, the present disclosure provides an optical module testing device, comprising a test box, a test board, and the fixture for optical module testing; the test box is provided with a bit error rate test board group, the bit error rate test board group comprises a high-speed signal board oppositely arranged and a low-speed signal board in detachable electrical connection with the high-speed signal board; the fixture is in detachable connection with the test box, the fixture is provided with an insertion cavity and a mounting cavity corresponding to the insertion cavity; the insertion cavity is used for inserting a to-be-tested optical module, and the mounting cavity is provided with the test board; a first end of the test board is provided with a socket for matching connection with the to-be-tested optical module, and a second end of the test board is in detachable electrical connection with the low-speed signal board and the high-speed signal board respectively. BRIEF DESCRIPTION OF DRAWINGS

[0010] FIG. 1 is a structural schematic diagram of a fixture for optical module testing according to an embodiment of the present disclosure;

[0011] FIG. 2 is a structural schematic diagram of a fixture for optical module testing according to an embodiment of the present disclosure, wherein the positional relationship among a first temperature control assembly, a limiting structure, and a second temperature control assembly is shown;

[0012] FIG. 3 is an enlarged schematic diagram of part of the structure of FIG. 2, wherein the positional relationship among a first limiting boss, a second limiting boss, and an insertion cavity is shown;

[0013] FIG. 4 is a structural schematic diagram of a fixture for optical module testing according to another embodiment of the present disclosure;

[0014] FIG. 5 is an exploded structural schematic diagram of FIG. 4;

[0015] Fig. 6 is an enlarged schematic view of a part of the structure of Fig. 5, wherein the positional relationship between the limiting through hole and the insertion cavity is shown;

[0016] Fig. 7 is an exploded structural schematic view of the first heat sink module and the second heat sink module;

[0017] Fig. 8 is a structural schematic view of a fixture for testing an optical module according to an embodiment of the present disclosure, wherein the positional relationship between the second temperature detecting element and the second heat sink is shown;

[0018] Fig. 9 is an enlarged schematic view of a part of the structure of Fig. 8;

[0019] Fig. 10 is a structural schematic view of a fixture for testing an optical module according to another embodiment of the present disclosure, wherein the positional relationship between the first temperature detecting element and the first heat sink is shown;

[0020] Fig. 11 is an enlarged schematic view of a part of the structure of Fig. 10;

[0021] Fig. 12 is a structural sectional view of a fixture for testing an optical module according to an embodiment of the present disclosure;

[0022] Fig. 13 is an enlarged schematic view of the structure of part A in Fig. 12;

[0023] Fig. 14 is a structural sectional view of another fixture for testing an optical module according to an embodiment of the present disclosure;

[0024] Fig. 15 is an enlarged schematic view of the structure of part B in Fig. 14;

[0025] Fig. 16 is an enlarged schematic view of a part of the structure in Fig. 15;

[0026] Fig. 17 is a structural schematic view of a second limiting block according to an embodiment of the present disclosure, wherein the positional relationship between the limiting main body and the limiting bottom plate is shown;

[0027] Fig. 18 is a structural schematic view of a second limiting block according to another embodiment of the present disclosure, wherein a first installation through slot is shown;

[0028] Fig. 19 is a structural schematic view of a fixture for testing an optical module according to an embodiment of the present disclosure, wherein the positional relationship between the third sub-side plate and the fourth sub-side plate in the second side plate is shown;

[0029] Fig. 20 is a structural schematic view of a fixture for testing an optical module according to another embodiment of the present disclosure, wherein the positional relationship between the third sub-side plate and the fourth sub-side plate in the second side plate is shown;

[0030] Figure 21 is a partial structure exploded view of a fixture for optical module testing according to an embodiment of the present disclosure, showing the positional relationship between a first sub-side plate and a bottom plate in a first side plate;

[0031] Figure 22 is a partial structure exploded view of a fixture for optical module testing according to another embodiment of the present disclosure;

[0032] Figure 23 is a clean surface cross-sectional view of a fixture for optical module testing according to an embodiment of the present disclosure, showing the cross-sectional view of a top plate in a direction perpendicular to the top plate;

[0033] Figure 24 is a structure view of an optical module testing device according to an embodiment of the present disclosure;

[0034] Figure 25 is an exploded structure view of an optical module testing device according to an embodiment of the present disclosure;

[0035] Figure 26 is an enlarged view of a partial structure of Figure 25;

[0036] Figure 27 is a structure view of an optical module testing device according to another embodiment of the present disclosure;

[0037] Figure 28 is an enlarged view of a partial structure of Figure 27;

[0038] Figure 29 is a structure view of a bit error rate testing board set according to an embodiment of the present disclosure;

[0039] Figure 30 is a structure view of an optical module testing device according to another embodiment of the present disclosure;

[0040] Figure 31 is a gas path principle view of an optical module testing device according to an embodiment of the present disclosure, showing the gas supply path of a gas flow channel and a gas hole;

[0041] Figure 32 is a gas path principle view of an optical module testing device according to an embodiment of the present disclosure, showing the gas supply path of a telescopic cylinder;

[0042] Figure 33 is a gas path principle view of an optical module testing device according to an embodiment of the present disclosure, showing the gas supply path of a press cylinder of a driving mechanism. DETAILED DESCRIPTION

[0043] Embodiment one, as shown in FIGS. 1-3, 6, a fixture 10 for testing an optical module, the fixture 10 comprising a housing 11, a first temperature control assembly 12, a second temperature control assembly 13, a limiting structure 14 and a driving mechanism. The first temperature control assembly 12 and the second temperature control assembly 13 are oppositely spaced in the housing 11. Specifically, the first temperature control assembly 12 and the second temperature control assembly 13 are oppositely and respectively arranged at the top and bottom of the housing, wherein the first temperature control assembly 12 and the second temperature control assembly 13 are spaced apart by a predetermined distance.

[0044] The limiting structure 14 is provided with a limiting through hole 141, the limiting structure 14 is clamped between the first temperature control assembly 12 and the second temperature control assembly 13, and the opposite sides of the limiting through hole 141 are respectively provided with a first limiting boss 142 and a second limiting boss 143 corresponding to the first temperature control assembly 12 and the second temperature control assembly 13, and a plug-in cavity 144 for accommodating the optical module 2 to be tested is formed between the first limiting boss 142 and the second limiting boss 143, wherein the plug-in cavity 144 is shaped to match the shape of the optical module 2 to be tested. The first limiting boss 142 and the second limiting boss 143 both extend along the depth direction of the plug-in cavity.

[0045] The driving mechanism is arranged in the housing 11, and the driving mechanism is in driving connection with the first temperature control assembly 12 and the second temperature control assembly 13 respectively, so as to drive the first temperature control assembly 12 and the second temperature control assembly 13 to move towards the limiting structure 14 to abut against the optical module 2.

[0046] In the present disclosure, the plug-in cavity formed by the first limiting boss 142 and the second limiting boss 143 can effectively limit the position of the optical module 2 when the optical module 2 is inserted into the plug-in cavity 144, avoiding the appearance wear caused by the position deviation of the optical module 2 and the friction with the heat sink during the insertion process. Further, the edges of the first limiting boss 142 and the second limiting boss 143 do not exceed the limiting structure 14, so that when the optical module 2 to be tested is inserted into the plug-in cavity 144, the upper surface and the lower surface of the optical module 2 to be tested are lower than the upper surface and the lower surface of the limiting structure 14. Therefore, when the optical module 2 is inserted into the plug-in cavity 144, the first limiting boss 142 can form a certain gap between the first temperature control assembly 12 and the optical module 2, and the second limiting boss 143 can form a certain gap between the second temperature control assembly 13 and the optical module 2, thereby avoiding the direct contact of the heat sink with the first temperature control assembly 12 and the second temperature control assembly 13, and further avoiding the wear of the heat sink. Further, by using the limiting action of the first limiting boss 142 and the second limiting boss 143, the accuracy of the insertion position of the optical module 2 can be ensured, the accuracy of the error code test can be ensured, and the service life of the test circuit board can be prolonged. The test circuit board is a DUT board (Device Under Test), which receives test signals from a BERT board, processes these signals according to its function, and then transmits the processed signals back to the BERT board.

[0047] In some embodiments, the material of the limiting structure 14 is PIG (phosphor in glass) material, which has high heat resistance and high thermal conductivity of inorganic material, and can significantly improve the wear resistance. In addition, in other embodiments, the material of the limiting structure 14 is self-lubricating material, including non-metallic self-lubricating material or high molecular self-lubricating material. The use of self-lubricating material can significantly reduce the friction between the insertion cavity 144 and the optical module 2, thereby effectively reducing the degree of wear.

[0048] In some embodiments, referring to FIGS. 4-6, the limiting structure 14 includes a first limiting block 145 and a second limiting block 146 arranged opposite to each other. The first limiting block 145 and the second limiting block 146 are respectively provided with a first limiting boss 142 near one side of the first temperature control component 12, and are respectively provided with a second limiting boss 143 near one side of the second temperature control component 13. The first limiting boss 142 and the second limiting boss 143 respectively extend along the length direction of the insertion cavity 144. It can be understood that the extension length of the first limiting boss 142 and the second limiting boss 143 is designed according to the actual contact length of the first limiting boss 142 and the second limiting boss 143 with the optical module 2.

[0049] In a specific example, the first temperature control component 12 and the second temperature control component 13 are vertically arranged, the first temperature control component 12 is arranged at the top of the shell, and the second temperature control component 13 is arranged at the bottom of the shell. The first limiting block 145 and the second limiting block 146 are located between the first temperature control component 12 and the second temperature control component 13 and are horizontally arranged, and the first limiting block 145 and the second limiting block 146 are arranged opposite to each other in position and jointly define an insertion cavity 144 extending in the insertion direction of the optical module 2, and a limiting through hole 141 communicating with the insertion cavity 144. The number of limiting through holes 141 is two, one limiting through hole 141 corresponds to the position of the first temperature control component 12, and the first temperature control component 12 abuts against the top end of the optical module 2 in the insertion cavity 144 by penetrating into the limiting through hole 141. The other limiting through hole 141 corresponds to the position of the second temperature control component 13, and the second temperature control component 13 abuts against the bottom end of the optical module 2 in the insertion cavity 144 by penetrating into the limiting through hole 141.

[0050] In the present disclosure, by setting the first limiting boss 142 and the second limiting boss 143, the optical module 2 inserted into the insertion cavity 144 can be circumferentially positioned, thereby avoiding the position deviation of the optical module 2 in the insertion process and the abrasion caused by the friction between the heat sink. Further, in the direction in which the second limiting boss 143 points to the first limiting boss 142, the edges of the first limiting boss 142 and the second limiting boss 143 do not exceed the limiting structure 14. Thus, when the to-be-tested optical module is inserted into the insertion cavity 144, the upper surface and the lower surface of the to-be-tested optical module are lower than the upper surface and the lower surface of the limiting structure 14, i.e., the first limiting boss 142 is lower than the upper surface of the limiting structure 14, and the second limiting boss is higher than the lower surface of the limiting structure 14. Thus, the first limiting boss 142 and the second limiting boss 143 play a guiding role for the optical module 2 in the length direction of the insertion cavity 144, which can effectively ensure the insertion accuracy of the optical module 2 and avoid the damage of the test circuit board caused by inaccurate insertion.

[0051] In some embodiments, the limiting structure 14 is an integral structural member, the limiting structure 14 is provided with the insertion cavity 144 and two limiting through holes 141 communicating with the upper and lower sides of the insertion cavity 144, and the length of the insertion cavity 144 extends along the insertion direction of the optical module 2. The limiting structure 14 in the form of an integral structural member can effectively ensure the structural strength of the limiting structure 14, and is also conducive to the maintenance of the equipment.

[0052] In some embodiments, referring to FIGS. 7-11, the driving mechanism includes a first air cylinder 15 and a second air cylinder 16. The cylinder body of the first air cylinder 15 is located on the side of the first temperature control assembly 12 away from the second temperature control assembly 13 and is connected with the shell 11, and the first piston rod of the first air cylinder 15 corresponds to the first temperature control assembly 12. The cylinder body of the second air cylinder 16 is located on the side of the second temperature control assembly 13 away from the first temperature control assembly 12 and is connected with the shell 11, and the second piston rod of the second air cylinder 16 corresponds to the second temperature control assembly 13.

[0053] In a specific example, the cylinder body of the first air cylinder 15 is connected with the shell top. One end of the first piston rod is connected with the cylinder body piston of the first air cylinder 15, and the other end of the first piston rod is connected with the first temperature control assembly 12. The first temperature control assembly 12 is moved toward the insertion cavity 144 by the piston movement of the first piston rod in the cylinder body of the first air cylinder 15 to abut against the optical module 2.

[0054] The cylinder body of the second air cylinder 16 is connected with the shell bottom. One end of the second piston rod is connected with the cylinder body piston of the second air cylinder 16, and the other end of the second piston rod is connected with the second temperature control assembly 13. The second temperature control assembly 13 is moved toward the insertion cavity 144 by the piston movement of the second piston rod in the cylinder body of the second air cylinder 16 to abut against the optical module 2.

[0055] In the present disclosure, the first cylinder 15 and the second cylinder 16 are adopted as the transmission mechanism, which can reduce the production cost and is easy to maintain and repair. In addition, the cylinder has the characteristics of fast response speed, which can realize fast start and stop and meet the test requirements of the optical module 2. Furthermore, the cylinder has the characteristics of adjustability, which can adjust the transmission speed and force as needed.

[0056] In some embodiments, referring to FIG. 5, the first temperature control assembly 12 includes a first water cooling module 121, a first semiconductor refrigeration module 122 (TEC Thermoelectric Cooling), and a first heat sink module 123. The first water cooling module 121 is in transmission connection with the driving mechanism, the first heat sink module 123 is located on the side of the limiting structure 14 away from the second temperature control assembly 13, and the first semiconductor refrigeration module 122 is clamped between the first water cooling module 121 and the first heat sink module 123.

[0057] Further, the first piston rod of the first cylinder 15 is connected with the first water cooling module 121. The first water cooling module 121 includes a first water cooling seat 1211 and a first water cooling head 1212. The surface of the first water cooling seat 1211 facing the first semiconductor refrigeration module 122 is provided with a first accommodating cavity, and the first water cooling head 1212 is arranged in the first accommodating cavity. The first water cooling head 1212 is provided with a cooling flow channel for the flow of cooling medium. The first water cooling head 1212 further includes a tower head arranged at the inlet and outlet of the cooling flow channel, and a throat clamp arranged on the tower head. The tower head is used to connect with the cooling pipeline. The first cylinder 15 is connected with the first water cooling seat 1211.

[0058] In some embodiments, referring to FIG. 2 and FIG. 8, the clamp 10 further includes a third limiting piece 23 located on the side of the first temperature control assembly 12 away from the second temperature control assembly 13 and connected with the shell 11. The surface of the first water cooling seat 1211 away from the first semiconductor refrigeration module 122 is provided with a first limiting groove 12111 corresponding in position to the third limiting piece 23. When the first cylinder 15 is contracted, the third limiting piece 23 is used to abut against the first limiting groove 12111 to limit the contraction stroke of the first temperature control assembly 12.

[0059] In some embodiments, the third limiting piece 23 is a plurality of third limiting pieces 23, and the surface of the first water cooling seat 1211 away from the first semiconductor refrigeration module 122 is provided with a plurality of first limiting grooves 12111 corresponding in position to the plurality of third limiting pieces 23. In the present disclosure, the third limiting piece 23 and the first limiting groove 12111 are arranged to effectively limit the contraction stroke of the first cylinder 15.

[0060] The second temperature control assembly 13 comprises a second water cooling module 131, a second semiconductor refrigeration module 132 (TEC Thermoelectric Cooling) and a second heat sink module 133. The second water cooling module 131 is in transmission connection with the driving mechanism, the second heat sink module 133 is located on the side of the limiting structure 14 away from the first temperature control assembly 12, and the second semiconductor refrigeration module 132 is clamped between the second water cooling module 131 and the second heat sink module 133.

[0061] Further, the second piston rod of the second cylinder 16 is connected with the second water cooling module 131. The second water cooling module 131 comprises a second water cooling seat 1311 and a second water cooling head 1312, the surface of the second water cooling seat 1311 towards the second semiconductor refrigeration module 132 is provided with a second accommodating cavity, and the second water cooling head 1312 is arranged in the second accommodating cavity. The second water cooling head 1312 is provided with a cooling flow channel for circulation of cooling medium. The second water cooling head 1312 further comprises a tower head arranged at the inlet and outlet of the cooling flow channel, and a throat clamp arranged on the tower head, and the tower head is used for connecting with the cooling pipeline. The second cylinder 16 is connected with the second water cooling seat 1311.

[0062] In some embodiments, the clamp 10 further comprises a fourth limiting piece 24, which is located on the side of the second temperature control assembly 13 away from the first temperature control assembly 12 and connected with the shell 11. The surface of the second water cooling seat 1311 away from the second semiconductor refrigeration module 132 is provided with a second limiting groove (not shown in the figure), which corresponds in position to the fourth limiting piece 24. When the second cylinder 16 is retracted, the fourth limiting piece 24 is used to abut against the second limiting groove to limit the retraction stroke of the second temperature control assembly 13.

[0063] In some embodiments, the fourth limiting piece 24 is a plurality of, the surface of the second water cooling seat 1311 away from the second semiconductor refrigeration module 132 is provided with a plurality of second limiting grooves, and the plurality of fourth limiting pieces 24 are arranged one by one corresponding to the plurality of second limiting grooves. In the present disclosure, the fourth limiting piece 24 and the second limiting groove are arranged to effectively limit the retraction stroke of the second cylinder 16.

[0064] In some embodiments, referring to FIGS. 7 and 10-11, the first heat sink module 123 comprises a first heat sink 1231 and a first heat sink cover plate 1232 covering the first heat sink 1231, the first end of the first heat sink 1231 abuts against the first semiconductor refrigeration module 122, and the second end of the first heat sink 1231 penetrates through the first heat sink cover plate 1232 and corresponds to the limiting through hole 141 of the limiting structure 14.

[0065] In one specific example of the present disclosure, the first heat sink cover plate 1232 is provided with a first avoiding through hole 12321 on one side thereof facing the first heat sink 1231, and a first mounting groove 12322 surrounding the first avoiding through hole 12321. The second end of the first heat sink 1231 is provided with a first protruding portion 12311 protruding towards the first heat sink cover plate 1232, the first heat sink 1231 is arranged in the first mounting groove 12322, the first protruding portion 12311 passes through the first avoiding through hole 12321 and corresponds to the limiting through hole 141, wherein the first temperature control assembly 12 is driven by the first cylinder 15 to make the first protruding portion 12311 pass into the limiting through hole 141 and extend into the insertion cavity 144 to abut against the optical module 2.

[0066] Further, the first mounting groove 12322 corresponds to the position of the first accommodating cavity, and the first heat sink 1231 and the first semiconductor refrigeration module 122 are covered in the first accommodating cavity by the first heat sink cover plate 1232. By adopting this arrangement, the heat sink and the semiconductor refrigeration module can be protected, and normal use of the equipment can be ensured.

[0067] The second heat sink module 133 includes a second heat sink 1331 and a second heat sink cover plate 1332 covering the second heat sink 1331, the first end of the second heat sink 1331 abuts against the second semiconductor refrigeration module 132, and the second end of the second heat sink 1331 passes through the second heat sink cover plate 1332 and corresponds to the limiting through hole 141 of the limiting structure 14.

[0068] In one specific example of the present disclosure, the second heat sink cover plate 1332 is provided with a second avoiding through hole 13321 on one side thereof facing the second heat sink 1331, and a second mounting groove (not shown in the figure) surrounding the second avoiding through hole 13321. The second end of the second heat sink 1331 is provided with a second protruding portion 13311 protruding towards the second heat sink cover plate 1332, the second heat sink 1331 is arranged in the second mounting groove, the second protruding portion 13311 passes through the second avoiding through hole 13321 and corresponds to the limiting through hole 141, wherein the second temperature control assembly 13 is driven by the second cylinder 16 to make the second protruding portion 13311 pass into the limiting through hole 141 and extend into the insertion cavity 144 to abut against the optical module 2.

[0069] Further, the second mounting groove corresponds to the position of the second accommodating cavity, and the second heat sink 1331 and the second semiconductor refrigeration module 132 are covered in the second accommodating cavity by the second heat sink cover plate 1332. By adopting this arrangement, the heat sink and the semiconductor refrigeration module can be protected, and normal use of the equipment can be ensured.

[0070] In some embodiments, the first heat sink module 123 further comprises a first temperature detecting element 1233, and the second heat sink module 133 further comprises a second temperature detecting element 1333. The first end of the first temperature detecting element 1233 is inserted into the first heat sink 1231, and the second end of the first temperature detecting element 1233 is fixed to the first heat sink cover plate 1232.

[0071] In some embodiments, referring to FIGS. 10-11, the first protrusion 12311 is provided with a first insertion hole, and the first end of the first temperature detecting element 1233 is inserted into the first insertion hole. In other embodiments, the first temperature detecting element 1233 is bonded to the first heat sink cover plate 1232. By using the bonding method, the connection reliability of the first temperature detecting element 1233 and the first heat sink cover plate 1232 can be ensured.

[0072] In some embodiments, referring to FIGS. 8-9, the first end of the second temperature detecting element 1333 is inserted into the second heat sink 1331, and the second end of the second temperature detecting element 1333 is fixed to the second heat sink cover plate 1332.

[0073] In some embodiments, the second protrusion 13311 is provided with a second insertion hole, and the first end of the second temperature detecting element 1333 is inserted into the second insertion hole. The second heat sink module 133 further comprises a fixing member 25 for fixing the second temperature detecting element 1333 to the second heat sink cover plate 1332.

[0074] In some embodiments, the second heat sink module 133 further comprises a gasket 26, which is arranged between the fixing member 25 and the second temperature detecting element 1333. The gasket 26 is pressed against the second temperature detecting element 1333 by the connection between the threaded connecting member and the threaded hole, so as to fix the second temperature detecting element 1333 to the second heat sink cover plate 1332. In the present disclosure, the connection between the threaded connecting member and the threaded hole is detachable, which facilitates the subsequent maintenance of the second temperature detecting element 1333 and the user's experience.

[0075] In other embodiments, the second temperature detecting element 1333 is bonded to the second heat sink cover plate 1332. By using the bonding method, the connection reliability of the second temperature detecting element 1333 and the second heat sink cover plate 1332 can be ensured.

[0076] In some embodiments, the clamp 10 further comprises a guide mechanism, which is connected to the housing 11 and movably connected to the first temperature control assembly 12 and / or the second temperature control assembly 13, so as to guide the movement of the first temperature control assembly 12 and / or the second temperature control assembly 13.

[0077] In some embodiments, referring to FIG. 2, FIG. 4-5 and FIG. 8, the guiding mechanism comprises a first guide 17 and a second guide 18, a first end of the first guide 17 is connected with the shell 11, and a second end of the first guide 17 passes through the first temperature control assembly 12 to guide the movement of the first temperature control assembly 12.

[0078] Specifically, the first water-cooled seat 1211 is provided with a first guide through hole (not shown in the figure) penetrating through the thickness thereof, the first guide 17 is arranged in the first guide through hole, and a first end of the first guide 17 is connected with the shell top, and a second end of the first guide 17 passes through the first water-cooled seat 1211. By using the above arrangement, the movement of the first temperature control assembly 12 can be guided, so that the first protruding part 12311 of the first heat sink 1231 can accurately extend into the insertion cavity 144, and the temperature regulation effect of the first temperature control assembly 12 on the optical module 2 can be ensured.

[0079] In some embodiments, the first guide 17 is a plurality of first guides 17, the plurality of first guides 17 are arranged around the first cylinder 15, the first water-cooled seat 1211 is provided with a plurality of first guide through holes penetrating through the thickness thereof, and the plurality of first guides 17 are arranged in one-to-one correspondence with the plurality of first guide through holes. By using the above arrangement, the movement of the first temperature control assembly 12 can be guided more accurately, so that the first protruding part 12311 of the first heat sink 1231 can extend more accurately into the insertion cavity 144, and the temperature regulation effect of the first temperature control assembly 12 on the optical module 2 can be further ensured.

[0080] A first end of the second guide 18 is connected with the shell 11, and a second end of the second guide 18 passes through the second temperature control assembly 13 to guide the movement of the second temperature control assembly 13.

[0081] Specifically, the second water-cooled seat 1311 is provided with a second guide through hole (not shown in the figure) penetrating through the thickness thereof, the second guide 18 is arranged in the second guide through hole, and a first end of the second guide 18 is connected with the shell bottom, and a second end of the second guide 18 passes through the second water-cooled seat 1311. By using the above arrangement, the movement of the second temperature control assembly 13 can be guided, so that the second protruding part 13311 of the second heat sink 1331 can accurately extend into the insertion cavity 144, and the temperature regulation effect of the second temperature control assembly 13 on the optical module 2 can be ensured.

[0082] In some embodiments, the second guide 18 is a plurality of second guides 18, the plurality of second guides 18 are arranged around the second cylinder 16, the second water-cooled seat 1311 is provided with a plurality of second guide through holes penetrating through the thickness of the second water-cooled seat 1311, and the plurality of second guides 18 are arranged in one-to-one correspondence with the plurality of second guide through holes. By using the above arrangement, more accurate guidance can be provided for the movement of the second temperature control assembly 13, so that the second protruding part 13311 of the second heat sink 1331 can be more accurately inserted into the insertion cavity 144, and the temperature regulation effect of the second temperature control assembly 13 on the optical module 2 is further ensured.

[0083] In some embodiments, the guide mechanism further comprises a first limiting part 19, a first elastic part 20, a second limiting part 21 and a second elastic part 22. The first limiting part 19 and the first elastic part 20 are located on the side of the first water-cooled seat 1211 away from the shell top, the first limiting part 19 is arranged at the second end of the first guide 17, the first elastic part 20 is clamped between the first temperature control assembly 12 and the first limiting part 19, and the first elastic part 20 is used to provide a buffering and resetting force for the first temperature control assembly 12. Specifically, the first elastic part 20 is clamped between the first water-cooled seat 1211 and the first limiting part 19.

[0084] The second limiting part 21 and the second elastic part 22 are located on the side of the second water-cooled seat 1311 away from the shell bottom, the second limiting part 21 is arranged at the second end of the second guide 18, and the second elastic part 22 is clamped between the second temperature control assembly 13 and the second limiting part 21. The second elastic part 22 is used to provide a buffering and resetting force for the second temperature control assembly 13. Specifically, the second elastic part 22 is clamped between the second water-cooled seat 1311 and the second limiting part 21.

[0085] In some embodiments, the first limiting part 19 and the first elastic part 20 are a plurality of first limiting parts 19 and a plurality of first elastic parts 20, and the plurality of first limiting parts 19 and the plurality of first elastic parts 20 are arranged in one-to-one correspondence with the plurality of first guides 17. In the present disclosure, the resetting force provided by the first elastic part 20 can reset the first temperature control assembly 12 to the initial position, and the plurality of first elastic parts 20 arranged around the first cylinder 15 can also level the first temperature control assembly 12 to ensure the flatness of the first temperature control assembly 12, and further ensure the parallelism of the abutment between the first protruding part 12311 of the first heat sink 1231 and the optical module 2.

[0086] In some embodiments, the second limiting member 21 and the second elastic member 22 are both in plurality, and the plurality of second limiting members 21 and the second elastic members 22 are arranged one-to-one with the plurality of second guide members 18. In the present disclosure, the resetting force provided by the second elastic member 22 can reset the second temperature control assembly 13 to the initial position, and the plurality of second elastic members 22 arranged around the second cylinder 16 can also level the second temperature control assembly 13 to ensure the flatness of the second temperature control assembly 13, and further ensure the parallelism of the abutting of the second protruding part 13311 of the second heat sink 1331 and the optical module 2.

[0087] In some embodiments, the first elastic member 20 and the second elastic member 22 are spring members.

[0088] In the present disclosure, the optical module insertion state includes that during the insertion of the optical module into the insertion cavity of the insertion limiting structure, the heat sink is driven by the driving mechanism to move away from the limiting structure, so that a gap is formed between the heat sink and the optical module. The optical module test state includes that before the test, the heat sink is driven by the driving mechanism to move towards the limiting structure, so that the heat sink and the optical module are attached, and the semiconductor refrigeration module of the temperature control assembly adjusts the temperature of the optical module through the heat conduction characteristics of the heat sink.

[0089] Embodiment two, as shown in FIG. 1-18, a fixture for testing optical modules, which is different from embodiment one in that the fixture further includes a second temperature detection assembly 4, a second temperature detection element 1333, a master controller, a slave controller and an MCU, and the first semiconductor refrigeration module 122 includes a first TEC thermoelectric refrigeration piece, and the second semiconductor refrigeration module 132 includes a second TEC thermoelectric refrigeration piece.

[0090] Referring to FIG. 4, the second temperature detection element 1333 is used to detect the first detection temperature of the second heat sink 1331, and the second temperature detection assembly 4 is arranged in the limiting structure 14. The second temperature detection assembly 4 is used to detect the second detection temperature of the optical module to be tested.

[0091] The master controller, the slave controller (not shown in the figure) and the MCU, the master controller is in communication connection with the MCU and the second TEC thermoelectric refrigeration piece respectively. The slave controller is in communication connection with the master controller, the first TEC thermoelectric refrigeration piece respectively. The MCU is in communication connection with the second temperature detection element 1333 and the second temperature detection assembly 4 respectively, so as to control the second detection temperature as the target temperature.

[0092] Specifically, the second temperature detection element 1333 sends the first detection temperature acquired in real time to the MCU, and the second temperature detection assembly 4 sends the second detection temperature acquired in real time to the MCU.

[0093] The main controller receives the temperature adjustment instruction sent by the MCU and pushes it to the slave controller. The main controller controls the second TEC thermoelectric cooling fin to adjust the temperature based on the temperature adjustment instruction, and the slave controller controls the first TEC thermoelectric cooling fin to adjust the temperature based on the received temperature adjustment instruction, so as to adjust the second detection temperature of the optical module to the target temperature through the second heat sink 1331 and the first heat sink 1231 respectively. Wherein, the temperature adjustment instruction is obtained based on the first detection temperature, the second detection temperature and the target temperature in the MCU.

[0094] In the present disclosure, the MCU processes the first detection temperature and the second detection temperature, and adjusts the temperature through the main controller and the slave controller according to the processing result. The beneficial effects of this setting include: on the one hand, the main controller is responsible for coordinating and managing the slave controller (slave controller), which can be used for the use requirement of precise temperature control of the optical module, and more precise temperature adjustment can be realized. On the other hand, the master-slave architecture composed of the main controller and the slave controller allows the complex control logic to be concentrated on the main controller, while the slave controller performs simpler tasks, which helps to simplify the design and implementation of the slave controller. Thirdly, the number and configuration of the slave controller can be adjusted according to actual needs to adapt to different scale or complexity of application scenarios. Fourthly, with the change of demand, the system can be easily expanded by increasing or reducing the slave controller, and each slave controller is relatively independent, which is convenient for individual maintenance and upgrading.

[0095] In some embodiments, the first TEC thermoelectric cooling fin and the second TEC thermoelectric cooling fin can convert electrical energy into heat energy. It can be understood that when the TEC thermoelectric cooling fin cools down, one side is low temperature and the other side is high temperature, so the water cooling module is needed to cool the high temperature side of the TEC thermoelectric cooling fin to prevent the TEC from being damaged.

[0096] In some embodiments, the second temperature detection element 1333 and the second temperature detection assembly 4 are both thermocouples.

[0097] In some embodiments, referring to FIG. 6, the clamp further comprises a third temperature detection assembly 3, which is arranged in the limiting structure 14 and corresponds to the first temperature control assembly 12, and is used for measuring the third detection temperature of the first temperature control assembly 12. In the present disclosure, the third temperature detection assembly 3 is arranged in the limiting structure, which avoids opening a hole in the first heat sink of the first temperature control assembly 12, so as to ensure the service life of the first heat sink.

[0098] In some embodiments, referring to FIGS. 12-13, the limiting structure 14 is provided with a first installation through slot 147, and the third temperature detection assembly 3 is accommodated in the first installation through slot 147.

[0099] In some embodiments, the third temperature detection component 3 comprises a first temperature detection piece 311, a first protective sleeve 312, and a first lead-out piece 33. The first temperature detection piece 311 is arranged on the side of the first installation through slot 147 facing the first temperature control component 12. The first end of the first lead-out piece 33 is electrically connected to the first temperature detection piece 311, and the second end of the first lead-out piece 33 penetrates through the first installation through slot 147 away from the side of the first temperature control component 12. The first protective sleeve 312 is arranged outside the first temperature detection piece 311.

[0100] In some embodiments, the outer side wall of the first protective sleeve 312 is provided with a seventh limiting boss 321, and the end of the first installation through slot 147 facing the first temperature control component 12 is provided with an eighth limiting boss 1471. The seventh limiting boss 321 abuts against the eighth limiting boss 1471 to limit the position of the first temperature detection piece 311. With this arrangement, the movement stroke of the first temperature detection piece 311 in the first installation through slot 147 can be effectively limited, and the first temperature detection piece 311 can be prevented from being damaged.

[0101] In some embodiments, the end of the first installation through slot 147 away from the first temperature control component 12 is further provided with a third limiting boss 1472, and the third temperature detection component 3 further comprises a first elastic piece 34. The two ends of the first elastic piece 34 are arranged in compression between the seventh limiting boss 321 and the third limiting boss 1472, so that the first temperature detection piece 311 abuts against the first temperature control component 12 when the first temperature control component 12 abuts against the optical module. With the elastic piece as the driving piece of the third temperature detection component 3, a stable elastic force can be provided to the first temperature detection piece 311, so as to ensure reliable abutment between the first temperature detection piece 311 and the first temperature control component 12. In addition, the elastic piece has a simple structure and is easy to install and maintain, and has good use performance in different working environments, thereby improving the use reliability of the clamp of the present disclosure. It can be understood that the driving piece of the present disclosure includes but is not limited to the elastic piece, and a motor can also be used.

[0102] In some embodiments, the limiting structure 14 comprises a limiting main body 148 and a limiting bottom plate 149. The limiting main body 148 is provided with the first installation through slot 147. The surface of the limiting main body 148 away from the first temperature control component 12 is provided with a fixing groove 1473 communicating with the first installation through slot 147. The limiting bottom plate 149 is fitted and installed with the fixing groove 1473, so as to fix the third temperature detection component 3 to the limiting main body 148. In some embodiments, the second limiting block 146 is provided with the first installation through slot 147. In the present disclosure, the limiting bottom plate 149 is fitted and installed with the fixing groove 1473 to achieve detachable connection of the third temperature detection component 3, which is conducive to later maintenance.

[0103] In some embodiments, the first heat sink cover plate 1232 is provided with an abutting through hole 12323 corresponding to the first mounting through slot. The third temperature detection assembly 3 is inserted into the abutting through hole 12323 to abut against the first heat sink 1231 at one end close to the first temperature control assembly 12 for temperature measurement.

[0104] In some embodiments, the limiting bottom plate 149 and the fixing groove 1473 are provided with position corresponding threaded holes, and the limiting structure 14 further comprises a threaded connecting piece. The threaded connecting piece is used to detachably connect the limiting bottom plate 149 to the fixing groove 1473 through threaded connection with the threaded holes, so as to limit the third temperature detection assembly 3 in the first mounting through slot 147.

[0105] Further, referring to FIG. 13 and FIG. 17, the limiting bottom plate 149 is provided with a second mounting through slot 1491. When the limiting bottom plate 149 is fixed in the fixing groove 1473, the second mounting through slot 1491 is in position corresponding and communication with the first mounting through slot 147, and the second mounting through slot 1491 is used to accommodate the first lead-out piece 33.

[0106] Further, the inner diameter of the second mounting through slot 1491 is smaller than that of the first mounting through slot 147, and the slot wall of the second mounting through slot 1491 defines a third limiting boss 1472 at the end of the first mounting through slot 147 away from the first temperature control assembly 12.

[0107] Further, the second mounting slot is in position corresponding with the second accommodating cavity, and the second heat sink 1331 and the second TEC thermoelectric refrigeration piece cover are arranged in the second accommodating cavity by the second heat sink cover plate 1332. By this arrangement, the heat sink and the semiconductor refrigeration module can be protected, and normal use of the equipment can be ensured.

[0108] In some embodiments, the second temperature detection element 1333 is arranged in the second heat sink 1331 to measure the temperature of the second heat sink 1331. Specifically, the first end of the second temperature detection element 1333 is inserted into the second heat sink 1331, and the second end of the second temperature detection element 1333 is fixed to the second heat sink cover plate 1332.

[0109] In some embodiments, the second temperature detection assembly 4 is arranged in the limiting structure 14 and corresponds to the insertion cavity 144 to measure the temperature of the optical module in the insertion cavity 144.

[0110] In some embodiments, the limiting structure 14 is provided with a mounting cavity 1481 on the surface corresponding to the side wall of the insertion cavity 144, and the mounting cavity 1481 is in communication with the insertion cavity 144, and the second temperature detection assembly 4 is arranged in the mounting cavity 1481.

[0111] In some embodiments, the second temperature detection assembly 4 is further provided with a driving member 46 on the side of the installation cavity 1481 facing away from the insertion cavity 144, and the driving member 46 is configured to drive the second temperature detection assembly 4 to move in the installation cavity 1481 towards the insertion cavity 144 so that the second temperature detection assembly 4 is in contact with the optical module to be measured.

[0112] In some embodiments, as shown in FIG. 16, the second temperature detection assembly 4 includes a second temperature detection member 41, a second protective sleeve 42, a second lead-out member 43, and a plug 44. The second temperature detection member 41 is arranged on the side of the installation cavity 1481 facing the insertion cavity 144, the first end of the second lead-out member 43 is electrically connected to the second temperature detection member 41, the second end of the second lead-out member 43 penetrates through the installation cavity 1481, the second protective sleeve 42 is arranged outside the second temperature detection member 41, and the plug 44 is configured to encapsulate the second temperature detection member 41 in the second protective sleeve 42.

[0113] In some embodiments, the outer wall of the second protective sleeve 42 is provided with a fourth limiting boss 421, and the end of the installation cavity 1481 facing the insertion cavity 144 is provided with a fifth limiting boss 1482. The second temperature detection assembly 4 further includes a second elastic member 45. The second elastic member 45 is arranged between the fourth limiting boss 421 and the fifth limiting boss 1482, the driving member 46 is arranged in the installation cavity 1481 and located at the end of the second temperature detection assembly 4 away from the insertion cavity 144, the driving member 46 is configured to drive the second temperature detection assembly 4 to abut against the optical module in the insertion cavity 144 for temperature measurement, and the second elastic member 45 is configured to provide a buffering and resetting force. By using the elastic member as the resetting member of the second temperature detection assembly 4, a stable resetting elastic force can be provided for the second temperature detection member 41, so as to ensure that the second temperature detection member 41 reliably separates from the optical module. In addition, the elastic member has a simple structure and is easy to install and maintain, and has good performance in different working environments, thereby improving the use reliability of the clamp of the present disclosure.

[0114] In some embodiments, the side of the fifth limiting boss 1482 in the installation cavity 1481 facing away from the insertion cavity 144 is provided with a sixth limiting boss 1483, and the sixth limiting boss 1483 is configured to abut against the fourth limiting boss 421 to limit the position of the second temperature detection member 41. By using this arrangement, the movement stroke of the second temperature detection member 41 in the installation cavity 1481 can be effectively limited, so as to avoid damaging the second temperature detection member 41.

[0115] In some embodiments, the peripheral side of the mounting cavity 1481 is provided with a positioning groove 1484 in communication therewith, and the driving member 46 is further provided with a positioning structure 461, wherein the driving member 46 is fixedly installed in the mounting cavity 1481 through the positioning structure 461 and the positioning groove 1484. The positioning structure 461 and the positioning groove 1484 can ensure the connection reliability of the driving member 46 and the mounting cavity 1481, and the connection mode is simple, convenient and beneficial to maintenance.

[0116] In some embodiments, the driving member 46 is a pen-shaped cylinder, the positioning structure 461 is arranged on the cylinder body of the pen-shaped cylinder, and the piston rod of the pen-shaped cylinder is in transmission connection with the plug 44. It can be understood that the driving member 46 includes but is not limited to the pen-shaped cylinder, and can also be a motor.

[0117] In the present disclosure, the third temperature detection assembly 3 and the second temperature detection assembly 4 are arranged on the limiting structure 14, and the second temperature detection assembly 1333 is arranged on the second heat sink 1331, i.e., the temperature detection function parts of the clamp are located at the lower part of the clamp, so that when the maintenance personnel maintains the equipment, only the lower part of the clamp needs to be disassembled, without disassembling the upper part of the clamp, thereby saving manpower and being beneficial to improving work efficiency.

[0118] In some embodiments, the first water cooling head 1212 is provided with a cooling flow channel for flowing of a cooling medium, and the cooling flow channels corresponding to the first water cooling heads of the test structures are sequentially connected in series. In some embodiments, the second water cooling head 1312 is provided with a cooling flow channel for flowing of a cooling medium, and the cooling flow channels corresponding to the second water cooling heads of the test structures are sequentially connected in series.

[0119] In the present disclosure, the cooling flow channels of the test structures are connected in series, so that the cooling medium can continuously flow between the temperature control assemblies of different test structures, heat is uniformly taken away, and the cooling efficiency is improved. In addition, this design helps to reduce the temperature difference between the temperature control assemblies of the test structures, thereby improving the cooling effect and ensuring the normal operation of the optical module test. Furthermore, since the cooling medium circulates in the clamp, the demand for the cooling medium is reduced, thereby reducing the energy consumption, and the series connection design can also reduce the complexity of the cooling system and reduce the operating cost.

[0120] As shown in FIG. 1-33, a kind of optical module test equipment, optical module test equipment includes test box 210, test board 300 and fixture 10.Test box 210 is provided with bit error rate test board group 220, and bit error rate test board group 220 includes high-speed signal board 221 and low-speed signal board 222 being detachably electrically connected with high-speed signal board 221 and being arranged oppositely spaced.Fixture is detachably connected with test box 210, and the fixture of the embodiment can adopt the fixture disclosed in embodiment one and embodiment two.Fixture is provided with installation cavity corresponding with insertion cavity 144, and insertion cavity 144 is used to insert optical module to be tested, and test board 300 is arranged in installation cavity.Installation cavity is enclosed by fixture 10 and partition plate 228.

[0121] The first end of test board 300 is provided with socket for matching connection with optical module to be tested, and the second end of test board 300 is detachably electrically connected with low-speed signal board 222 and high-speed signal board 221 respectively.Bit error rate test board group 220 is also called Bert (Bit Error Rate Tester) board group, and bit error rate test board group 220 is circuit board for generating known data sequence, which can generate high-quality, high-stability test signal.These signals are used to drive test board 300 (DUT, Device Under Test).

[0122] In the present disclosure, the detachable connection of test board 300 and bit error rate test board group 220 realizes the separate replacement operation of test board 300 and bit error rate test board group 220, without the need for overall replacement of bit error rate test board group 220 and test board 300, wherein the replaceable test board 300 can adapt to optical modules of different packaging types / size, improve test versatility.In addition, the cost of bit error rate test board group 220 is relatively high, and the overall replacement of bit error rate test board group 220 and test board 300 can significantly reduce the cost.Furthermore, the double-board design of bit error rate test board group 220 can significantly improve the space utilization rate in test box 210, and the detachable design of low-speed signal board 222 and high-speed signal board 221 is also conducive to the later equipment maintenance.

[0123] In some embodiments, referring to FIG. 26, the optical module test equipment further includes first plug 223, and high-speed signal board 221 and low-speed signal board 222 are detachably electrically connected through first plug 223.

[0124] In the present disclosure, on the one hand, since the high-speed signal board 221 and the low-speed signal board 222 are connected through the plug-in connector, they can be conveniently replaced or upgraded, and when a certain part fails, the faulty board can be directly replaced, reducing maintenance time and cost. On the other hand, users can select different combinations of high-speed signal boards 221 or low-speed signal boards 222 according to needs to meet the application requirements of flexible configuration. Thirdly, the relative spacing arrangement of the high-speed signal board 221 and the low-speed signal board 222 through the plug-in connector can improve air circulation and help heat dissipation, thereby improving the stability and life of the equipment. Fourthly, appropriate spacing can help reduce electromagnetic interference between the high-speed signal board 221 and the low-speed signal board 222 and improve the signal integrity of the system.

[0125] In some embodiments, the optical module test device further comprises a second plug-in connector 224, and the second end of the test board 300 and the low-speed signal board 222 are detachably electrically connected through the second plug-in connector 224.

[0126] In the present disclosure, on the one hand, by using the second plug-in connector 224 for connection, the test board 300 and the low-speed signal board 222 can be easily detached and replaced without damaging other system components. This not only facilitates maintenance work, but also makes equipment upgrading more convenient. The detachable connection makes it possible to quickly replace different test boards 300 or low-speed signal boards 222 according to different test requirements, thereby adapting to diverse test scenarios.

[0127] In some embodiments, the second plug-in connector 224 comprises a gold finger and a socket, one of the gold finger and the socket is arranged at the second end of the test board 300, the other of the gold finger and the socket is arranged at the low-speed signal board 222, and the gold finger is used for plugging into the socket.

[0128] In some embodiments, the gold finger is arranged at the second end of the test board 300, and the socket is arranged at the low-speed signal board 222, wherein the connection between the test board 300 and the low-speed signal board 222 is achieved through plugging of the gold finger into the socket. The design of the gold finger and the socket makes the connection a simple plug-in operation, so that replacing or maintaining the test board 300 becomes more convenient and can be completed without complex tools or skills.

[0129] In some embodiments, the first end of the test board 300 is provided with a first radio frequency connector 225, the high-speed signal board 221 is provided with a second radio frequency connector 226, and the test board 300 is electrically connected with the high-speed signal board 221 through the first radio frequency connector 225 and the second radio frequency connector 226.

[0130] In the present disclosure, on the one hand, the radio frequency connectors of the test board 300 and the high-speed signal board 221 are communicatively connected, which helps to maintain the integrity and stability of the signals and avoid signal attenuation or distortion caused by long-distance wiring or excessive adapters. On the other hand, the high-speed signal board 221 and the test board 300 are directly connected through the radio frequency connectors, which can simplify the system architecture and significantly improve the communication speed and efficiency, making it easy to develop, test and maintain each module independently, and also facilitating future technology upgrades.

[0131] In some embodiments, the high-speed signal board 221 and the low-speed signal board 222 are arranged in the height direction of the test box 210, and the test box 210 further comprises a support 227 supported between the high-speed signal board 221 and the low-speed signal board 222.

[0132] In the present disclosure, on the one hand, the support 227 can physically support the high-speed signal board 221 to keep it stable when subjected to external vibration or impact, reducing the possibility of deformation or displacement. On the other hand, by designing the support 227, the vibration energy can be absorbed or dispersed, reducing the vibration impact on the high-speed signal board 221 and enhancing the anti-vibration capability of the system. Thirdly, the support 227 can ensure that the plug-in connector between the high-speed signal board 221 and the low-speed signal board 222 maintains good contact, reducing problems caused by poor contact. Fourthly, by physically supporting the high-speed signal board 221, wear or deformation caused by long-term use can be reduced, prolonging the overall service life of the equipment.

[0133] In some embodiments, the support 227 is a plurality of supports 227 arranged in an array between the high-speed signal board 221 and the low-speed signal board 222. The plurality of supports 227 can more evenly distribute the weight and any additional load on the high-speed signal board 221, preventing deformation or damage caused by local stress concentration. In addition, the more support points provided by the plurality of supports 227, the stronger the overall rigidity of the high-speed signal board 221, reducing the possibility of bending and twisting.

[0134] In some embodiments, the low-speed signal board 222 is provided with a first mounting hole (not shown in the figure), and the test box 210 is provided with a second mounting hole (not shown in the figure) at a position corresponding to the first mounting hole, so as to fix the low-speed signal board 222 to the test box 210 by means of a fastener (not shown in the figure) inserted into the first mounting hole and the second mounting hole.

[0135] In the present disclosure, the design of the fastener and the mounting hole makes it easy to replace or repair the low-speed signal board 222 without damaging other components, simplifying the maintenance process. During transportation, the low-speed signal board 222 can be separated from the test box 210, reducing the weight of individual components and facilitating handling.

[0136] In some embodiments, the optical module testing device further comprises a partition 228 arranged in the testing box 210, the partition 228 separates the testing box 210 into a first accommodating space 211 and a second accommodating space 212. The fixture and the testing board 300 are arranged in the first accommodating space 211, and the error rate testing board group 220 is arranged in the second accommodating space 212.

[0137] In the present disclosure, in one aspect, the testing box 210 is divided into different accommodating areas by the partition 228, so that different components can be arranged according to functions and purposes, and the convenience of management and maintenance is improved. The components in each accommodating space have fixed placement positions, which facilitates quick finding of required components and related operations.

[0138] In some embodiments, when the testing board 300 is provided with a first radio frequency connector 225 and the high-speed signal board 221 is provided with a second radio frequency connector 226, the partition 228 is further provided with a communication opening 2281, and the first radio frequency connector 225 is in communication connection with the second radio frequency connector 226 through the communication opening 2281. By arranging the communication opening 2281 on the partition 228, the connection between the testing board 300 and the high-speed signal board 221 can be more compact, the external wiring is reduced, and the integration of the overall system is improved. Since the radio frequency connectors can be directly connected through the communication opening 2281, the complex wiring work is reduced, the installation of the device is more convenient, and subsequent maintenance and upgrading are also facilitated. The reasonably designed communication opening 2281 can effectively control electromagnetic interference (EMI), prevent external electromagnetic interference from affecting the transmission quality of the radio frequency signal, and also reduce the electromagnetic radiation of the device to the outside.

[0139] In some embodiments, the partition 228 is further provided with a connection opening 2282, the second plug-in piece 224 is arranged at the connection opening 2282, and the second end of the testing board 300 and the low-speed signal board 222 are detachably connected through the second plug-in piece 224. The design of the partition 228 can reduce electromagnetic interference between the testing board 300 or the low-speed signal board 222, and different testing boards 300 or low-speed signal boards 222 can be quickly replaced through the quick plug-in and plug-out mode, so as to speed up the testing process and improve the testing efficiency. Compared with the traditional welding or cable connection, the plug-in piece can reduce the complexity of internal wiring, make the internal layout of the device more neat, and also reduce the risk of faults caused by improper wiring. In some embodiments, the testing box 210 is provided with an inspection opening 213 at a position corresponding to the fixture, and the testing box 210 further comprises an inspection cover plate 214 rotatably arranged at the inspection opening 213.

[0140] In the present disclosure, the design of the maintenance cover plate 214 allows the maintenance personnel to conveniently perform maintenance work on the clamps inside the test box 210, and also facilitates the cleaning of the internal space. The design of the detachable clamps allows the user to expand or upgrade the internal configuration at any time according to the needs, without the need to replace the entire test box 210.

[0141] In some embodiments, the clamps comprise TEC cooling modules, and the optical module testing device further comprises a TEC controller and an MCU disposed inside the test box 210, the MCU is electrically connected to the TEC controller and the error rate test board set 220 respectively, and the TEC controller is electrically connected to the TEC cooling modules.

[0142] In some embodiments, the test board 300, the error rate test board set 220, the TEC controller and the MCU are arranged in sequence along the depth direction of the insertion cavity 144.

[0143] In some embodiments, the optical module testing device further comprises a buckle 215, and the clamps 10 are detachably connected to the test box 210 through the buckle 215. In the present disclosure, on the one hand, the design of the buckle 215 allows the clamps 10 to be quickly installed on the test box 210, and also easily detached, which is very useful for occasions that require frequent replacement of clamps to adapt to different types of optical module testing.

[0144] As shown in FIGS. 1-2 and 19-22, the shell 11 comprises a top plate 30, a bottom plate 40, and side plates 50 connected to the top plate 30 and the bottom plate 40 respectively, and the side plates 50 and the top plate 30 and the bottom plate 40 form an accommodation space. The temperature control assembly is disposed in the accommodation space.

[0145] In the present disclosure, the shell 11 is composed of a top plate 30, a bottom plate 40, and side plates 50 connected to the top plate 30 and the bottom plate 40 respectively, and the side plates 50 and the top plate 30 and the bottom plate 40 form a relatively closed accommodation space, thereby improving the airtightness of the shell 11, reducing the exchange of gas between the shell 11 and the outside, and ensuring the normal operation of the optical module testing.

[0146] In some embodiments, the shell 11 has a short axis direction and a long axis direction. It can be understood that the long axis direction refers to the direction of the longest side in the shell 11, and the short axis direction refers to the direction of the shorter side relative to the long axis direction. The side plate 50 includes a first side plate 51 and a second side plate 52 arranged at intervals in the short axis direction, and a third side plate 53 and a fourth side plate 54 arranged at intervals in the long axis direction, which surround the periphery of the top plate 30 and the bottom plate 40. Among them, the first side plate 51 and the second side plate 52 are connected with the first end and the second end of the limiting structure 14 respectively, and the first side plate 51 and the second side plate 52 are respectively provided with a first avoiding opening 60 and a second avoiding opening 70 at the position corresponding to the insertion cavity 144. When the optical module is tested, one end of the optical module is inserted into the insertion cavity 144 through the first avoiding opening 60 of the first side plate 51, and connected with the DUT plate through the second avoiding opening 70 of the second side plate 52. The DUT (Device Under Test) plate refers to the equipment or circuit board being tested in the test process. In the test environment of the optical module test equipment, the DUT plate is usually the measured object connected to the optical module test equipment, which is used to evaluate whether its performance meets the expected standard.

[0147] In the present disclosure, by opening the first avoiding opening 60 in the first side plate 51 and the second avoiding opening 70 in the second side plate 52 for the insertion of the optical module, the structural integrity of the first side plate 51 and the second side plate 52 can be guaranteed, thereby guaranteeing the relative sealing effect of the shell 11.

[0148] In one specific example of the present disclosure, the shell 11 is rectangular, wherein the long axis direction refers to the direction of the longest side in the shell 11, and the short axis direction refers to the direction of the shorter side relative to the long axis direction.

[0149] In some embodiments, the first side plate 51, the second side plate 52, the third side plate 53 and the fourth side plate 54 are respectively detachably connected with the top plate 30 and the bottom plate 40. The beneficial effects of using detachable connection mode include: on the one hand, detachable connection makes it simple and fast to replace damaged or worn side plates, which is beneficial to maintenance. On the other hand, the detachable connection of the side plate can meet the replacement or upgrade in the later stage, and meet the use demand of the user.

[0150] In some embodiments, referring to FIGS. 19-22, the first side plate 51 includes a first sub-side plate 511 and a second sub-side plate 512, and the second side plate 52 includes a third sub-side plate 521 and a fourth sub-side plate 522. The first end of the first sub-side plate 511 and the third sub-side plate 521 is arranged on the bottom plate 40, the second end of the first sub-side plate 511 is provided with a stepped groove 5111, and the second end of the third sub-side plate 521 is provided with a stepped groove 5211, which is used to place the limiting structure 14.

[0151] In some embodiments, the limiting structure 14 is detachably arranged in the stepped groove, and the detachable connection manner includes but is not limited to threaded connection or clamping. The limiting structure 14 and the stepped groove are detachably connected, which is beneficial to the replacement, upgrading and maintenance in the later stage.

[0152] The second sub-side plate 512 is arranged outside the first sub-side plate 511, and the two ends of the second sub-side plate 512 are connected with the top plate 30 and the bottom plate 40 respectively. The second sub-side plate 512 is provided with a first avoiding opening 60 at a position corresponding to the insertion cavity 144, and the optical module is inserted into the insertion cavity 144 through the first avoiding opening 60.

[0153] In some embodiments, the first sub-side plate 511 is detachably connected with the bottom plate 40, and the second sub-side plate 512 is detachably connected with the top plate 30 and the bottom plate 40 respectively. The detachable connection manner includes but is not limited to threaded connection or clamping. The first sub-side plate 511 and the second sub-side plate 512 are detachably connected, which is beneficial to the replacement, upgrading and maintenance in the later stage.

[0154] In some embodiments, the surface of the first sub-side plate 511 facing the second sub-side plate 512 is coplanar with the surface of the bottom plate 40 and the top plate 30 facing the second sub-side plate 512. The projection of the second sub-side plate 512 completely covers the projection of the first sub-side plate 511 in the direction perpendicular to the surface of the second sub-side plate 512. The design can ensure the flatness of the surface of the first sub-side plate 511, the bottom plate 40 and the top plate 30 facing the second sub-side plate 512, which is beneficial to the sealing connection of the second sub-side plate 512 with the first sub-side plate 511, the bottom plate 40 and the top plate 30. Further, the area of the second sub-side plate 512 is greater than that of the first sub-side plate 511, which further ensures the sealing of the shell 11.

[0155] The first end of the fourth sub-side plate 522 is connected with the top plate 30, and the second end of the fourth sub-side plate 522 is arranged at the second end of the third sub-side plate 521. The fourth sub-side plate 522 is spaced apart from the third sub-side plate 521 at a position corresponding to the insertion cavity 144 to form a second avoiding opening 70, and the optical module is connected with the DUT plate through the second avoiding opening 70.

[0156] In one specific example of the present disclosure, the first end of the fourth sub-side plate 522 is detachably connected with the top plate 30, and the second end of the fourth sub-side plate 522 abuts against the second end of the third sub-side plate 521. The second end of the fourth sub-side plate 522 is provided with a through slot, and the through slot 5221 of the fourth sub-side plate 522 and the stepped groove 5211 of the third sub-side plate 521 jointly enclose the second avoiding opening 70 at a position corresponding to the insertion cavity 144. The optical module is connected with the DUT plate through the second avoiding opening 70.

[0157] Referring to FIGS. 31-33, in some embodiments, the optical module testing device further comprises a first air source, a first speed regulating valve, a relay and a first electromagnetic valve arranged in the testing box 210. The shell 11 is provided with an air flow channel 31 provided with air outlets corresponding to opposite ends of the optical module to be tested. The testing plate is arranged in the clamp in position correspondence with the insertion cavity. The testing plate is provided with air holes 301 in communication with the insertion cavity 144. The first speed regulating valve is arranged in a pipeline between the first air source and the input end of the first electromagnetic valve. The output end of the first electromagnetic valve is in communication with the air holes and the air inlets of the air flow channel through a pipeline. The MCU is electrically connected with the first speed regulating valve and is also electrically connected with the first electromagnetic valve through the relay.

[0158] Referring to FIG. 31, in one specific example of the present disclosure, the pipeline is a first main air pipe, and the first electromagnetic valve is a single-way electromagnetic valve. The first speed regulating valve is arranged in the first main air pipe between the first air source and the input end of the single-way electromagnetic valve. The output end of the single-way electromagnetic valve is in communication with a three-way through the first main air pipe. Two air outlets of the three-way are provided with a first branch air pipe and a second branch air pipe, respectively. The first branch air pipe forms two air flows through a three-way. The blowing outlets of the two air flows are blowing outlet A and blowing outlet B, respectively, which are in communication with the air inlets of the air flow channel 31 of the top plate 30, respectively. The second branch air pipe forms four air flows through three three-ways in sequence. The blowing outlets of the four air flows are blowing outlet 1, blowing outlet 2, blowing outlet 3 and blowing outlet 4, respectively, which are in communication with the air holes 301 of the four supporting plates 300, respectively.

[0159] In some embodiments, referring to FIGS. 19 and 23, the top plate 30 is provided with an air flow channel 31. The clamp 10 further comprises a first air path assembly 80 arranged in the top plate 30. The first air path assembly 80 is in communication with the air inlets of the air flow channel 31. The air outlets 32 of the air flow channel 31 are in communication with the containing space. The dry gas provided by the first air path assembly 80 is introduced into the containing space through the air outlets 32 of the air flow channel 31, so as to keep the dryness of the gas in the containing space and reduce the generation of condensed water vapor.

[0160] In the present disclosure, the air flow channel 31 is formed on the top plate 30. On the one hand, the arrangement of the air pipe can be reduced, the design and arrangement of the air path are more simple, and the later maintenance of the device is also facilitated.

[0161] In some embodiments, the top plate 30 is provided with a plurality of air outlets 32 corresponding to the positions of the temperature control assemblies. It can be understood that the plurality of air outlets 32 can be regularly arranged or irregularly arranged, and the specific number of the air outlets 32 is set as required.

[0162] In one embodiment of the present disclosure, a plurality of air outlets 32 corresponding to the positions of the temperature control assemblies are arranged on the top plate 30 along the short axis of the shell 11. It can be understood that the plurality of air outlets 32 can be arranged at equal intervals or at unequal intervals. By arranging the air outlets 32 on the top plate 30 corresponding to the positions of the temperature control assemblies, the air flow can be directly blown to the target position (temperature control assembly), thereby eliminating the condensation problem of the temperature control assembly.

[0163] In some embodiments, the air inlet (not shown in the figure) of the air flow channel 31 is arranged on the surface of the top plate 30 facing the second side plate 52, and the second side plate 52 is provided with a first through groove 523 corresponding to the position of the air inlet, wherein the first air path assembly 80 penetrates the first through groove 523, and the air blowing port A and the air blowing port B are respectively communicated with the air inlet of the air flow channel 31 through the first air path assembly 80. In the present disclosure, by arranging the first through groove 523 on the second side plate 52, the first air path assembly 80 penetrates the first through groove 523 to directly communicate with the air inlet of the air flow channel 31 on the top plate 30, so that the device structure is more simple, and subsequent maintenance is facilitated. In addition, this design is beneficial to the space utilization rate of the optical module test device, and can effectively control the structure size of the optical module test device.

[0164] In some embodiments, the driving mechanism includes a compression cylinder, the cylinder body of the compression cylinder is located on the side of the temperature control assembly away from the limiting structure 14 and is connected with the top plate 30, and the piston rod of the compression cylinder corresponds to the temperature control assembly.

[0165] Specifically, the optical module test device further includes a third gas source, a second speed regulating valve and a third electromagnetic valve arranged on the test box 210, the clamp 10 further includes a temperature control assembly and a compression cylinder in transmission connection with the temperature control assembly, the temperature control assembly corresponds to the position of the insertion cavity, and the third temperature detection element measures the temperature of the optical module in the insertion cavity.

[0166] The second speed regulating valve is arranged on the pipeline between the third gas source and the input end of the third electromagnetic valve, the output end of the third electromagnetic valve is communicated with the compression cylinder through the pipeline, the MCU is electrically connected with the second speed regulating valve, and the MCU is electrically connected with the third electromagnetic valve through the relay.

[0167] Referring to FIG. 33, one specific example provided by the present disclosure includes four temperature control assemblies, four compression cylinders, each of which includes a first cylinder 15 and a second cylinder 16, and four temperature control assemblies correspond to the four first cylinders 15 and the four second cylinders 16 respectively. The optical module test equipment includes a third gas source, a second speed regulating valve, a second four-way electromagnetic valve, and a third main gas pipe arranged in the test box 210. The second speed regulating valve is arranged in the third main gas pipe between the gas source and the second speed regulating valve input end. The second four-way electromagnetic valve configures four gas paths from the third main gas pipe. The four gas paths include blowing ports top1, top2, top3, and top4, which are respectively connected to the corresponding compression cylinders. The second gas source

[0168] Further, the clamp 10 further includes a second gas path assembly 90 arranged on one side of the top plate 30 facing the second side plate 52. The second side plate 52 is provided with a second through slot 524 corresponding to the position of the second gas path assembly 90. The second gas path assembly 90 penetrates the second through slot 524 and the top plate 30 respectively. The blowing ports top1, top2, top3, and top4 are respectively connected to the cylinder bodies of the compression cylinders through the second gas path assembly 90.

[0169] Specifically, the top plate 30 is provided with an airflow passage (not shown in the figure). The second gas path assembly 90 includes a first gas path element and a second gas path element. The first gas path element is connected to the air inlet of the airflow passage. The second gas path element is connected to the air outlet 32 of the airflow passage at one end and to the cylinder body of the compression cylinder at the other end.

[0170] In the present disclosure, the second through slot 524 is arranged on the second side plate 52, so that the second gas path assembly 90 penetrates the second through slot 524 and is directly connected to the air inlet of the airflow passage on the top plate 30. This design is simple and facilitates subsequent maintenance of the equipment. In addition, this design is conducive to the space utilization of the optical module test equipment and can effectively control the structure size of the optical module test equipment.

[0171] The clamp 10 further includes a water path assembly 100 arranged on the third side plate 53 and connected to the water cooling module. The water path assembly 100 is used to provide water cooling medium to the water cooling module.

[0172] In some embodiments, the third side plate 53 includes a fifth sub-side plate 531 and a sixth sub-side plate 532. The first end of the fifth sub-side plate 531 is arranged on the top plate 30. The first end of the sixth sub-side plate 532 is arranged on the bottom plate 40. The second end of the fifth sub-side plate 531 is connected to the second end of the sixth sub-side plate 532. The position of the fifth sub-side plate 531 corresponds to the position of the temperature control assembly.

[0173] In some embodiments, the fifth sub-side plate 531 and the sixth sub-side plate 532 are detachably connected with the top plate 30 and the bottom plate 40, respectively, and the detachable connection includes but is not limited to threaded connection or clamping connection. By using the detachable connection, it is convenient to maintain the device in the shell 11 later.

[0174] In one specific embodiment of the present disclosure, the first end of the fifth sub-side plate 531 is threaded connected with the top plate 30, the first end of the sixth sub-side plate 532 is threaded connected with the bottom plate 40, the second end of the fifth sub-side plate 531 and the second end of the sixth sub-side plate 532 are oppositely arranged in abutment, and the fifth sub-side plate 531 corresponds to the position of the temperature control assembly.

[0175] In the present disclosure, on the one hand, the threaded connection can provide stable connection strength to ensure the firm combination between the fifth sub-side plate 531 and the sixth sub-side plate 532 and the top plate 30 and the bottom plate 40. On the other hand, the threaded connection can be disassembled and reassembled for multiple times without significantly reducing the connection performance between the fifth sub-side plate 531 and the sixth sub-side plate 532 and the top plate 30 and the bottom plate 40. Thirdly, by adjusting the tightness of the threaded connection, the position or pre-tightening force between the fifth sub-side plate 531 and the sixth sub-side plate 532 and the top plate 30 and the bottom plate 40 can be fine-tuned. Fourthly, the position of the fifth sub-side plate 531 corresponds to the position of the temperature control assembly, and the maintenance of the temperature control assembly can be realized by disassembling the fifth sub-side plate 531.

[0176] In some embodiments, the optical module testing device further comprises a second gas source, a pressure regulating valve and a second electromagnetic valve arranged in the test box 210, and the clamp further comprises a third temperature detection element and a telescopic cylinder. The third temperature detection element corresponds to the position of the insertion cavity, and the telescopic cylinder is in transmission connection with the third temperature detection element. The third temperature detection element is used to measure the temperature of the optical module in the insertion cavity.

[0177] The pressure regulating valve is arranged in the pipeline between the second gas source and the input end of the second electromagnetic valve, the output end of the second electromagnetic valve is communicated with the telescopic cylinder through the pipeline, the MCU is electrically connected with the pressure regulating valve, and the MCU is further electrically connected with the second electromagnetic valve through the relay.

[0178] Referring to FIG. 32, in one specific example of the present disclosure, the limiting structure 14 includes four, and the third temperature detection element includes four.

[0179] The optical module testing device comprises a second air source, a pressure regulating valve, a first four-way electromagnetic valve and a second main air pipe arranged in the test box 210. The pressure regulating valve is arranged between the air source and the first four-way electromagnetic valve in the second main air pipe. The first four-way electromagnetic valve configures the air supply of the second main air pipe into four-way air. The blowing ports of the four-way air are blowing port side1, blowing port side2, blowing port side3 and blowing port side4 respectively. The blowing port side1, the blowing port side2, the blowing port side3 and the blowing port side4 are respectively connected to the corresponding telescopic air cylinders, which are used to push the telescopic movement of the third temperature detection element.

[0180] In the present disclosure, the optical module insertion state comprises that, during the insertion of the optical module into the insertion cavity of the limiting structure, the heat sink is driven by the driving mechanism to move away from the limiting structure, so that a gap is formed between the heat sink and the optical module. The optical module testing state comprises that, before testing, the heat sink is driven by the driving mechanism to move towards the limiting structure, so that the heat sink and the optical module are attached, and the semiconductor refrigeration module of the temperature control assembly adjusts the temperature of the optical module through the heat conduction characteristics of the heat sink.

[0181] It can be understood that the above embodiments are only exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also considered to be within the protection scope of the present disclosure.

Claims

1. A jig for testing an optical module, characterized by, The clamp comprises: a shell; a first temperature control assembly and a second temperature control assembly, which are oppositely spaced in the shell; a limiting structure provided with a limiting through hole, the limiting structure being clamped between the first temperature control assembly and the second temperature control assembly, opposite sides of the limiting through hole being respectively provided with a first limiting boss and a second limiting boss corresponding to the first temperature control assembly and the second temperature control assembly, and an insertion cavity for accommodating a to-be-tested optical module being formed between the first limiting boss and the second limiting boss; a driving mechanism arranged in the shell, the driving mechanism being in transmission connection with the first temperature control assembly and the second temperature control assembly respectively, so as to drive the first temperature control assembly and the second temperature control assembly to move towards the limiting structure to abut against the to-be-tested optical module.

2. The optical module test fixture of claim 1, wherein The limiting structure comprises a first limiting block and a second limiting block which are oppositely spaced; the first limiting block and the second limiting block are respectively provided with the first limiting boss on a side close to the first temperature control assembly; the first limiting block and the second limiting block are respectively provided with the second limiting boss on a side close to the second temperature control assembly.

3. The optical module test fixture of claim 1 or 2, wherein The first limiting boss and the second limiting boss extend along the depth direction of the insertion cavity.

4. The optical module test fixture of claim 1, wherein The first temperature control assembly comprises a first water cooling module, a first semiconductor refrigeration module and a first heat sink module; the first water cooling module is in transmission connection with the driving mechanism; the first heat sink module is located on a side of the limiting structure away from the second temperature control assembly; and the first semiconductor refrigeration module is clamped between the first water cooling module and the first heat sink module. The second temperature control assembly comprises a second water cooling module, a second semiconductor refrigeration module and a second heat sink module. The second water cooling module is in transmission connection with the driving mechanism; the second heat sink module is located on a side of the limiting structure away from the first temperature control assembly; and the second semiconductor refrigeration module is clamped between the second water cooling module and the second heat sink module.

5. The optical module test fixture of claim 1 or 2, wherein The driving mechanism comprises a first cylinder and a second cylinder; a cylinder body of the first cylinder is located on a side of the first temperature control assembly away from the second temperature control assembly and is connected with the shell; and a first piston rod of the first cylinder corresponds to the first temperature control assembly; a cylinder body of the second cylinder is located on a side of the second temperature control assembly away from the first temperature control assembly and is connected with the shell; and a second piston rod of the second cylinder corresponds to the second temperature control assembly.

6. The optical module test fixture of claim 4, wherein The first heat sink module comprises a first heat sink and a first heat sink cover plate covering the first heat sink; a first end of the first heat sink abuts against the first semiconductor refrigeration module; and a second end of the first heat sink penetrates through the first heat sink cover plate and corresponds to the limiting through hole of the limiting structure. The second heat sink module comprises a second heat sink and a second heat sink cover plate covering the second heat sink; a first end of the second heat sink abuts against the second semiconductor refrigeration module; and a second end of the second heat sink penetrates through the second heat sink cover plate and corresponds to the limiting through hole of the limiting structure.

7. The optical module test fixture of claim 6, wherein The first heat sink cover plate is provided with a first avoiding through hole and a first mounting groove outside the first avoiding through hole on the side facing the first heat sink; the second end of the first heat sink is provided with a first protruding part protruding towards the first heat sink cover plate, the first heat sink is arranged in the first mounting groove, and the first protruding part passes through the first avoiding through hole and corresponds to the limiting through hole; The second heat sink cover plate is provided with a second avoiding through hole and a second mounting groove outside the second avoiding through hole on the side facing the second heat sink; the second end of the second heat sink is provided with a second protruding part protruding towards the second heat sink cover plate, the second heat sink is arranged in the second mounting groove, and the second protruding part passes through the second avoiding through hole and corresponds to the limiting through hole.

8. The optical module test fixture of claim 1 or 2, wherein The clamp further comprises a guide mechanism connected with the shell and movably connected with the first temperature control assembly and / or the second temperature control assembly to guide the movement of the first temperature control assembly and / or the second temperature control assembly.

9. The optical module test fixture of claim 8, wherein, The guide mechanism comprises a first guide part and a second guide part; The first end of the first guide part is connected with the shell, and the second end of the first guide part passes through the first temperature control assembly to guide the movement of the first temperature control assembly; The first end of the second guide part is connected with the shell, and the second end of the second guide part passes through the second temperature control assembly to guide the movement of the second temperature control assembly.

10. The optical module test fixture of claim 9, wherein, The guide mechanism further comprises a first limiting part, a first elastic part, a second limiting part and a second elastic part; The first limiting part is arranged at the second end of the first guide part, and the first elastic part is clamped between the first temperature control assembly and the first limiting part; The second limiting part is arranged at the second end of the second guide part, and the second elastic part is clamped between the second temperature control assembly and the second limiting part.

11. The optical module test fixture of claim 4, wherein The first semiconductor refrigeration module comprises a first TEC thermoelectric refrigeration piece, the second semiconductor refrigeration module comprises a second TEC thermoelectric refrigeration piece, the first heat sink module comprises a first heat sink, the second heat sink module comprises a second heat sink, and the clamp further comprises: A first temperature detection assembly for detecting a first detection temperature of the second heat sink; A second temperature detection assembly for detecting a second detection temperature of the optical module; A master controller and a slave controller, the master controller is in communication connection with an MCU and the second TEC thermoelectric refrigeration piece respectively, the slave controller is in communication connection with the master controller and the first TEC thermoelectric refrigeration piece respectively, and the MCU is in communication connection with the first temperature detection assembly and the second temperature detection assembly respectively to control the second detection temperature as a target temperature.

12. The optical module test fixture of claim 11, wherein, The first temperature detection assembly is arranged on the second heat sink to measure the temperature of the second heat sink.

13. The optical module test fixture of claim 11 or 12, wherein, The second heat sink is provided with a mounting hole, and the first temperature detection assembly is inserted into the mounting hole.

14. The optical module test fixture of claim 13, wherein, The second temperature control assembly further comprises a fixing member and a gasket, the gasket is clamped between the fixing member and the first temperature detection assembly, and the fixing member fixes the first temperature detection assembly to the second heat sink through the gasket.

15. The optical module test fixture of claim 11 or 12, wherein, The second temperature detection assembly is arranged in the limiting structure and corresponds to the insertion cavity, and is used for measuring the temperature of the optical module in the insertion cavity.

16. The optical module test fixture of claim 15, wherein, A surface of the limiting structure corresponding to the side wall of the insertion cavity is provided with a mounting cavity, and the mounting cavity is in communication with the insertion cavity; and the second temperature detection assembly is arranged in the mounting cavity.

17. The optical module test fixture of claim 16, wherein A side of the second temperature detection assembly away from the insertion cavity in the mounting cavity is further provided with a driving member, and the driving member is used for driving the second temperature detection assembly to move in the mounting cavity towards the insertion cavity, so that the second temperature detection assembly is in contact with the optical module to be measured.

18. An optical module testing apparatus characterized by comprising: The optical module test device comprises a test box, the optical module test clamp according to any one of claims 1-17, and a test board.

19. An optical module testing apparatus characterized by comprising: The optical module test device comprises a test box, a test board, and the optical module test clamp according to any one of claims 1-10. The test box is provided with a bit error rate test board set, and the bit error rate test board set comprises a high-speed signal board and a low-speed signal board in relative spacing and detachable electrical connection with the high-speed signal board. The clamp is detachably connected with the test box, the clamp is provided with an insertion cavity and a mounting cavity corresponding to the insertion cavity; the insertion cavity is used for inserting the optical module to be measured, and the mounting cavity is provided with the test board. A first end of the test board is provided with a socket used for matching connection with the optical module to be measured, and a second end of the test board is detachably electrically connected with the low-speed signal board and the high-speed signal board, respectively.

20. An optical module testing apparatus according to claim 19, wherein The optical module test device further comprises a first plug-in member, and the high-speed signal board and the low-speed signal board are detachably electrically connected through the first plug-in member.

21. An optical module testing apparatus according to claim 19, wherein The optical module test device further comprises a second plug-in member, and the second end of the test board and the low-speed signal board are detachably electrically connected through the second plug-in member.

22. An optical module testing apparatus according to claim 19, wherein A first radio frequency connector is arranged at the first end of the test board, a second radio frequency connector is arranged on the high-speed signal board, and the test board is electrically connected with the high-speed signal board through the first radio frequency connector and the second radio frequency connector.

23. An optical module testing apparatus according to any one of claims 19 to 22, wherein The high-speed signal board and the low-speed signal board are arranged in spacing along the height direction of the test box. The optical module test device further comprises a support member supported between the high-speed signal board and the low-speed signal board.

24. An optical module testing apparatus according to any one of claims 19 to 22, wherein The test box is provided with an access opening at a position corresponding to the clamp. The test box further comprises an access cover plate rotatably arranged in the access opening.

25. An optical module testing apparatus according to any one of claims 19 to 22, wherein The test box is further provided with a conversion board, a TEC controller, and an MCU, and the high-speed signal board is provided with a bit error test chip. The MCU is electrically connected with the TEC controller and the bit error test chip, respectively, and the TEC controller is electrically connected with first and second semiconductor refrigeration modules through the conversion board.

26. An optical module testing apparatus according to claim 25, wherein The test box is further provided with a radiator corresponding to the position of the error code test chip and a fan corresponding to the position of the radiator.

27. An optical module testing apparatus according to claim 25, wherein The test board, the error code rate test board group, the TEC controller and the MCU are arranged in sequence along the depth direction of the insertion cavity.

28. An optical module testing apparatus according to claim 25, wherein The optical module test equipment further comprises a first air source, a first speed regulating valve, a relay and a first electromagnetic valve arranged in the test box. The shell is provided with an air flow channel provided with air outlets corresponding to opposite ends of the optical module to be tested; the test board is arranged in the clamp corresponding to the position of the insertion cavity and is provided with a ventilation hole communicating with the insertion cavity; The first speed regulating valve is arranged in the pipeline between the first air source and the input end of the first electromagnetic valve; the output end of the first electromagnetic valve is connected to the ventilation hole and the air inlet of the air flow channel through pipelines; the MCU is electrically connected with the first speed regulating valve, and the MCU is also electrically connected with the first electromagnetic valve through the relay.

29. An optical module testing apparatus according to claim 25, wherein The optical module test equipment further comprises a second air source, a pressure regulating valve and a second electromagnetic valve arranged in the test box, and the clamp further comprises a telescopic air cylinder, the telescopic air cylinder is drivingly connected with the second temperature detection assembly, and the second temperature detection assembly is used for measuring the temperature of the optical module in the insertion cavity; The pressure regulating valve is arranged in the pipeline between the second air source and the input end of the second electromagnetic valve, the output end of the second electromagnetic valve is connected to the telescopic air cylinder through a pipeline, the MCU is electrically connected with the pressure regulating valve, and the MCU is also electrically connected with the second electromagnetic valve through the relay.

30. An optical module testing apparatus according to claim 25, wherein The optical module test equipment further comprises a third air source, a second speed regulating valve and a third electromagnetic valve arranged in the test box; the driving mechanism comprises a crimping air cylinder; The second speed regulating valve is arranged in the pipeline between the third air source and the input end of the third electromagnetic valve, the output end of the third electromagnetic valve is connected to the crimping air cylinder through a pipeline, the MCU is electrically connected with the second speed regulating valve, and the MCU is electrically connected with the third electromagnetic valve through the relay.

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