Intelligent power module and load driving circuit

Abstract

Embodiments of the present disclosure provide an intelligent power module and a load driving circuit. The intelligent power module comprises a rectifier circuit, an inverter circuit, and a driving circuit, and the rectifier circuit is connected to an alternating current power supply connected to an inductor and a capacitor. The rectifier circuit converts alternating current power provided by the alternating current power supply into direct current power, and provides the direct current power to the inverter circuit and the driving circuit. The driving circuit is configured to receive a logic control signal and, on the basis of the logic control signal, control a power chip of the inverter circuit to turn on and off. The inverter circuit is configured to convert the direct current power into controllable alternating current power on the basis of the logic control signal, so as to control operation of a load via the controllable alternating current power. The intelligent power module in the embodiments of the present disclosure not only integrates the driving circuit and the inverter circuit, but also integrates the rectifier circuit capable of converting alternating current power into direct current power, such that the intelligent power module has a high degree of integration.

Description

Intelligent power module and load driving circuit

[0001] The present disclosure claims priority to and the benefit of the filing date of September 24, 2024 of patent application number 202411335129.8 filed with the China National Intellectual Property Office, and incorporates herein by reference in its entirety. TECHNICAL FIELD

[0002] Embodiments of the present disclosure relate to the technical field of circuit, in particular to an intelligent power module and a load driving circuit. BACKGROUND

[0003] An intelligent power module is an intelligent power switching device, whose full name in English is Intelligent Power Module, and its abbreviation in English is IPM. The IPM module integrates power chips and control chips inside, has the characteristics of high speed and low power consumption, and has the advantages of GTR (Giant Transistor) high current density, low saturation voltage and high voltage resistance, as well as the advantages of MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) high input impedance, high switching frequency and low driving power. In addition, the IPM module has protection functions such as voltage under-voltage protection, over-temperature protection, over-current protection and short-circuit protection, and has the characteristics of small size, compact layout, easy use, etc., and is widely used in household appliances, industry, energy and other industries.

[0004] However, the current intelligent power module uses direct current, so the use of intelligent power module needs to convert normal power (alternating current) into standard direct current, otherwise the intelligent power module cannot work normally. The conversion of alternating current to direct current is completed by the external circuit of the intelligent power module, and it is just for this reason that the intelligent power module needs to be equipped with a rectifier circuit + PFC (Power Factor Correction) circuit to work normally, resulting in low integration of the intelligent power module, which occupies a larger area of the printed circuit board. SUMMARY

[0005] The purpose of the embodiments of the present disclosure is to provide an intelligent power module and a load driving circuit, and the specific technical solutions are as follows:

[0006] In the embodiments of the present disclosure, an intelligent power module is provided, which includes a rectifier circuit, an inverter circuit and a driving circuit, the rectifier circuit is connected with an alternating current power source connected with an inductor and a capacitor, and wherein:

[0007] The rectifier circuit is configured to convert alternating current provided by an alternating current power supply into direct current and provide the direct current to the inverter circuit and the driving circuit;

[0008] The driving circuit is configured to receive a logic control signal and control the opening and closing of the power chips of the inverter circuit according to the logic control signal;

[0009] The inverter circuit is configured to convert the direct current into controllable alternating current based on the logic control signal, so as to control the load to work through the controllable alternating current.

[0010] Optionally, the power chip in the rectifier circuit and the power chip in the inverter circuit are connected with diodes respectively.

[0011] Optionally, the inverter circuit comprises a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip and a sixth power chip, the driving circuit comprises a first control chip and a second control chip; the rectifier circuit comprises a seventh power chip and an eighth power chip, and the driving circuit further comprises a third control chip; the collector of the first power chip is connected with the emitter of the seventh power chip through a capacitor; the collector of the eighth power chip is connected with the collector of the first power chip, the collector of the second power chip and the collector of the third power chip respectively;

[0012] The microcontroller unit is connected with the input pin of the first control chip, the input pin of the second control chip and the input pin of the third control chip respectively;

[0013] The output pin of the first control chip and the output pin of the first control chip are connected with the gate of the first power chip, the gate of the second power chip and the gate of the third power chip respectively;

[0014] The output pin of the second control chip is connected with the gate of the fourth power chip, the gate of the fifth power chip and the gate of the sixth power chip respectively;

[0015] The output pin of the third control chip is connected with the gate of the seventh power chip and the gate of the eighth power chip respectively.

[0016] Optionally, the emitter of the first power chip and the collector of the fourth power chip are connected with the output pin of the first control chip, and then a first control pin is led out and connected to the load;

[0017] The emitter of the second power chip and the collector of the fifth power chip are connected with the output pin of the first control chip, and then a second control pin is led out and connected to the load;

[0018] The emitter of the third power chip and the collector of the sixth power chip are connected with the output pin of the first control chip, and then a third control pin is led out and connected to the load.

[0019] Optionally, the emitter of the fourth power chip, the emitter of the fifth power chip and the emitter of the sixth power chip are connected to ground through a resistor.

[0020] Optionally, the collector of the seventh power chip and the emitter of the eighth power chip are connected to the AC power source through an inductor.

[0021] Optionally, the intelligent power module further comprises a lead frame, an aluminum wire and a gold wire.

[0022] Optionally, the intelligent power module further comprises a heat sink.

[0023] Optionally, the load at least comprises a motor.

[0024] Optionally, the rectification circuit, the inverter circuit and the driving circuit in the intelligent power module are packaged in the plastic package body according to a preset packaging process.

[0025] The embodiments of the present disclosure further disclose a load driving circuit, which comprises an intelligent power module and a peripheral circuit, the peripheral circuit comprising an AC power source, a capacitor, an inductor, a resistor and a load; the intelligent power module comprising a rectification circuit, an inverter circuit and a driving circuit, the rectification circuit being connected to the AC power source connected to the inductor and the capacitor, wherein:

[0026] the rectification circuit is configured to convert AC power provided by the AC power source into DC power and provide the DC power to the inverter circuit and the driving circuit;

[0027] the driving circuit is configured to receive a logic control signal and control the opening and closing of the power chips of the inverter circuit according to the logic control signal;

[0028] the inverter circuit is configured to convert the DC power into controllable AC power based on the logic control signal, so as to control the load to work through the controllable AC power.

[0029] Optionally, the power chips in the rectification circuit and the power chips in the inverter circuit are connected to diodes respectively.

[0030] Optionally, the inverter circuit comprises a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip and a sixth power chip, the driving circuit comprises a first control chip and a second control chip; the rectification circuit comprises a seventh power chip and an eighth power chip, and the driving circuit further comprises a third control chip; the collector of the first power chip is connected to the emitter of the seventh power chip through a capacitor; the collector of the eighth power chip is connected to the collector of the first power chip, the collector of the second power chip and the collector of the third power chip respectively.

[0031] The microcontroller unit is connected with the input pin of the first control chip, the input pin of the second control chip and the input pin of the third control chip respectively.

[0032] The output pin of the first control chip and the output pin of the first control chip are connected with the gate of the first power chip, the gate of the second power chip and the gate of the third power chip respectively.

[0033] The output pin of the second control chip is connected with the gate of the fourth power chip, the gate of the fifth power chip and the gate of the sixth power chip respectively.

[0034] The output pin of the third control chip is connected with the gate of the seventh power chip and the gate of the eighth power chip respectively.

[0035] Optionally, the emitter of the first power chip and the collector of the fourth power chip are connected with the output pin of the first control chip, and then a first control pin is led out and connected to the load.

[0036] The emitter of the second power chip and the collector of the fifth power chip are connected with the output pin of the first control chip, and then a second control pin is led out and connected to the load.

[0037] The emitter of the third power chip and the collector of the sixth power chip are connected with the output pin of the first control chip, and then a third control pin is led out and connected to the load.

[0038] Optionally, the emitter of the fourth power chip, the emitter of the fifth power chip and the emitter of the sixth power chip are connected with the resistance and then grounded.

[0039] Optionally, the collector of the seventh power chip and the emitter of the eighth power chip are connected with the alternating current power supply through the inductor.

[0040] Optionally, the intelligent power module further comprises a lead frame, an aluminum wire and a gold wire.

[0041] Optionally, the intelligent power module further comprises a heat sink.

[0042] Optionally, the load at least comprises a motor.

[0043] Optionally, the rectifier circuit, the inverter circuit and the driving circuit in the intelligent power module are packaged in the plastic package body according to a preset packaging process.

[0044] The disclosure further discloses an air conditioner comprising a load driving circuit, the load driving circuit comprising an intelligent power module and a peripheral circuit, the peripheral circuit comprising an alternating current power supply, a capacitor, an inductor, a resistor and a load; the intelligent power module comprising a rectifier circuit, an inverter circuit and a driving circuit, the rectifier circuit being connected with the alternating current power supply connected with the inductor and the capacitor, wherein:

[0045] a rectifier circuit configured to convert alternating current provided by an alternating current power supply into direct current and provide the direct current to the inverter circuit and the driving circuit;

[0046] the driving circuit is configured to receive a logic control signal and control the turning on and off of the power chips of the inverter circuit according to the logic control signal;

[0047] the inverter circuit is configured to convert the direct current into controllable alternating current based on the logic control signal to control the operation of the load by the controllable alternating current.

[0048] Optionally, the power chip in the rectifier circuit and the power chip in the inverter circuit are connected with diodes respectively.

[0049] Optionally, the inverter circuit comprises a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip and a sixth power chip, the driving circuit comprises a first control chip and a second control chip; the rectifier circuit comprises a seventh power chip and an eighth power chip, and the driving circuit further comprises a third control chip; the collector of the first power chip is connected with the emitter of the seventh power chip through a capacitor; the collector of the eighth power chip is connected with the collector of the first power chip, the collector of the second power chip and the collector of the third power chip respectively;

[0050] the microcontroller unit is connected with the input pin of the first control chip, the input pin of the second control chip and the input pin of the third control chip respectively;

[0051] the output pin of the first control chip is connected with the gate of the first power chip, the gate of the second power chip and the gate of the third power chip respectively;

[0052] the output pin of the second control chip is connected with the gate of the fourth power chip, the gate of the fifth power chip and the gate of the sixth power chip respectively;

[0053] the output pin of the third control chip is connected with the gate of the seventh power chip and the gate of the eighth power chip respectively.

[0054] Optionally, the emitter of the first power chip and the collector of the fourth power chip are connected with the output pin of the first control chip to lead out a first control pin and be connected to the load;

[0055] the emitter of the second power chip and the collector of the fifth power chip are connected with the output pin of the first control chip to lead out a second control pin and be connected to the load;

[0056] the emitter of the third power chip and the collector of the sixth power chip are connected with the output pin of the first control chip to lead out a third control pin and be connected to the load.

[0057] Optionally, the emitter of the fourth power chip, the emitter of the fifth power chip and the emitter of the sixth power chip are connected to ground through resistors.

[0058] Optionally, the collector of the seventh power chip and the emitter of the eighth power chip are connected to the alternating current power supply through an inductor.

[0059] Optionally, the smart power module further comprises a lead frame, an aluminum wire and a gold wire.

[0060] Optionally, the smart power module further comprises a heat sink.

[0061] Optionally, the load at least comprises a motor.

[0062] Optionally, the rectifier circuit, the inverter circuit and the drive circuit in the smart power module are packaged in the plastic package body according to a preset packaging process.

[0063] Compared with the related art, the embodiments of the present disclosure have at least the following advantages:

[0064] In the embodiments of the present disclosure, the smart power module comprises a rectifier circuit, an inverter circuit and a drive circuit, the rectifier circuit is connected to an alternating current power supply connected to an inductor and a capacitor, wherein the rectifier circuit is configured to convert alternating current provided by the alternating current power supply into direct current and provide the direct current to the inverter circuit and the drive circuit, the drive circuit is configured to receive a logic control signal and control the opening and closing of the power chips of the inverter circuit according to the logic control signal, and the inverter circuit is configured to convert the direct current into controllable alternating current based on the logic control signal to control the load to work through the controllable alternating current. The smart power module of the embodiments of the present disclosure not only integrates the drive circuit and the inverter circuit, but also integrates the rectifier circuit, so that the alternating current provided by the alternating current power supply can be converted into direct current inside the smart power module, and then the direct current can be converted into controllable alternating current through the drive circuit and the inverter circuit to control the load to work. The integration degree of the smart power module is high, so that the area of the printed circuit board occupied by the smart power module is smaller, at the same time, the printed circuit board does not need to be laid out with other rectifier circuits, further reducing the area of the printed circuit board occupied by the smart power module, which is more friendly to application engineers, so that it is more convenient for application engineers to layout other circuits or elements. BRIEF DESCRIPTION OF DRAWINGS

[0065] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure or the related art known to the inventors, the following will briefly introduce the drawings needed to be used in the description of the embodiments or the related art known to the inventors.

[0066] FIG. 1 is a structural block diagram of a smart power module provided in the embodiments of the present disclosure;

[0067] Fig. 2 is a schematic diagram of a circuit structure of an intelligent power module provided in an embodiment of the present disclosure;

[0068] Fig. 3 is a schematic diagram of a circuit structure of a traditional intelligent power module;

[0069] Fig. 4 is a schematic diagram of an external shape of an intelligent power module provided in an embodiment of the present disclosure;

[0070] Fig. 5 is a schematic diagram of an internal structure of an intelligent power module provided in an embodiment of the present disclosure;

[0071] Fig. 6 is a front view of an internal structure of an intelligent power module provided in an embodiment of the present disclosure;

[0072] Fig. 7 is a schematic diagram of a power chip patch provided in an embodiment of the present disclosure;

[0073] Fig. 8 is a schematic diagram of a gold wire bonding provided in an embodiment of the present disclosure;

[0074] Fig. 9 is a schematic diagram of a frame assembly provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0075] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the various embodiments of the present disclosure will be described in detail below with reference to the drawings. However, those of ordinary skill in the art can understand that, in the various embodiments of the present disclosure, many technical details are presented in order to make the readers better understand the present disclosure. However, the technical solutions claimed by the present disclosure can be implemented even without these technical details and based on various changes and modifications of the following embodiments. The division of the following various embodiments is for the convenience of description, and should not be construed as a specific implementation of the present disclosure.

[0076] In a specific implementation, the internal part of the intelligent power module can mainly include 6 groups of power chips (power devices) and driving circuits, the driving circuits can include driving ICs (Integrated Circuit, driving circuits), and the power chips mainly control the switching of U, V, W, NU, NV, and NW phases; the driving ICs mainly control the actions of the power chips, and also have various protection functions to prevent damage to the power chips. The circuit of the intelligent power module is mainly an inverter circuit, and the power chips of the inverter circuit can be controlled to be turned on and off through the driving circuit, so as to convert direct current into controllable alternating current. In actual application, the frequency, current size, and conversion efficiency of the alternating current can be controlled by adjusting the parameters of the driving circuit, so as to realize accurate control and optimization of power conversion.

[0077] Current intelligent power modules all use direct current. Using an intelligent power module requires converting normal mains (alternating current) into standard direct current, otherwise the intelligent power module cannot work normally. The conversion of alternating current into direct current is completed by the external circuit of the intelligent power module. As a result, the intelligent power module needs to be equipped with a rectifier circuit (rectifier bridge) + PFC (Power Factor Correction, power factor correction) circuit to work normally, which limits the application of the intelligent power module. At the same time, the external circuit occupies a larger area of the PCB (Printed Circuit Board, printed circuit board), affecting the layout of the power chip in the intelligent power module. In addition, the need for equipment results in higher system cost.

[0078] To solve the above problems, one of the core ideas of the embodiments of the present disclosure is to provide a multifunctional intelligent power module. The intelligent power module contains an inverter circuit and a protection function inside. At the same time, the intelligent power module also contains a rectifier circuit for converting alternating current into direct current. Therefore, the intelligent power module can not need to be converted through the external circuit of the intelligent power module. At the same time, the intelligent power module is small in size, convenient in layout, and low in cost. In addition, the traditional rectifier circuit is connected to the intelligent power module through the printed circuit board trace, and the circuit is longer. The internal circuit trace of the intelligent power module of the embodiments of the present disclosure is shorter than that of the traditional intelligent power module system. Therefore, the intelligent power module can work more stably and has lower stray inductance.

[0079] Referring to FIG. 1, it is a structure block diagram of an intelligent power module provided in the embodiments of the present disclosure. As shown in FIG. 1, the intelligent power module can include a rectifier circuit, an inverter circuit, and a drive circuit. The rectifier circuit is connected with an alternating current power supply connected with an inductor and a capacitor, wherein:

[0080] The rectifier circuit is configured to convert alternating current provided by the alternating current power supply into direct current and provide the direct current to the inverter circuit and the drive circuit;

[0081] The drive circuit is configured to receive a logic control signal and control the opening and closing of the power chip of the inverter circuit according to the logic control signal;

[0082] The inverter circuit is configured to convert the direct current into controllable alternating current based on the logic control signal, so as to control the load to work through the controllable alternating current.

[0083] In the embodiments of the present disclosure, the intelligent power module includes a rectifier circuit, an inverter circuit and a drive circuit. The rectifier circuit is connected with an alternating current power source connected with an inductor and a capacitor. The rectifier circuit is configured to convert alternating current provided by the alternating current power source into direct current and provide the direct current to the inverter circuit and the drive circuit. The drive circuit is configured to receive a logic control signal and control the opening and closing of power chips of the inverter circuit according to the logic control signal. The inverter circuit is configured to convert the direct current into controllable alternating current based on the logic control signal, so as to control the load to work through the controllable alternating current. The intelligent power module of the embodiments of the present disclosure not only integrates the drive circuit and the inverter circuit, but also integrates the rectifier circuit. Therefore, the alternating current provided by the alternating current power source can be converted into direct current inside the intelligent power module. Then, the direct current can be converted into controllable alternating current through the drive circuit and the inverter circuit to control the load to work. The intelligent power module has high integration, thereby occupying a smaller area of a printed circuit board. Meanwhile, the printed circuit board does not need to be laid out with other rectifier circuits, further reducing the area of the printed circuit board occupied by the intelligent power module. The intelligent power module is more friendly to application engineers, so that the application engineers will be more convenient to lay out other circuits or elements.

[0084] In an embodiment of the present disclosure, the power chips in the rectifier circuit and the inverter circuit are respectively connected with diodes. The diodes can be FRD (Fast Recovery Diode). In a specific implementation, the power chips can be IGBT, MOSFET, etc., which can be connected with the fast recovery diodes to achieve specific circuit functions and improve the performance of the system. For example, the main function of the inverter circuit is to convert direct current into alternating current. When the power device is turned off, the inductance in the load will generate a reverse electromotive force, causing the current to continue to flow. At this time, the fast recovery diode provides a low-impedance path to allow the current to continue to flow, thereby preventing voltage spikes and electromagnetic interference (EMI).

[0085] Referring to FIG. 2, it is a schematic diagram of a circuit structure of an intelligent power module provided by an embodiment of the present disclosure. In an embodiment of the present disclosure, the inverter circuit can include a first power chip IGBT1, a second power chip IGBT2, a third power chip IGBT3, a fourth power chip IGBT4, a fifth power chip IGBT5, and a sixth power chip IGBT6. The drive circuit can include a first control chip HVIC1 and a second control chip LVIC. The rectifier circuit can include a seventh power chip IGBT7 and an eighth power chip IGBT8. The drive circuit can further include a third control chip HVIC2. The collector of the first power chip IGBT1 is connected to the emitter of the seventh power chip IGBT7 through a capacitor. The collector of the eighth power chip IGBT8 is connected to the collector of the first power chip IGBT1, the collector of the second power chip IGBT2, and the collector of the third power chip IGBT3, respectively.

[0086] A microcontroller unit (MC control) is connected to the input pin of the first control chip HVIC1, the input pin of the second control chip LVIC, and the input pin of the third control chip HVIC, respectively. The input pin of the first control chip HVIC1 can include a VCCH pin and the like.

[0087] The output pin of the first control chip HVIC1 and the output pin of the first control chip HVIC1 are connected to the gate of the first power chip IGBT1, the gate of the second power chip IGBT2, and the gate of the third power chip IGBT3, respectively.

[0088] The output pin of the second control chip LVIC is connected to the gate of the fourth power chip IGBT4, the gate of the fifth power chip IGBT5, and the gate of the sixth power chip IGBT6, respectively.

[0089] The output pin of the third control chip HVIC2 is connected to the gate of the seventh power chip IGBT7 and the gate of the eighth power chip IGBT8, respectively.

[0090] Referring to FIG. 2, in an embodiment of the present disclosure, the emitter of the first power chip IGBT1 and the collector of the fourth power chip IGBT4 are connected to the output pin of the first control chip HVIC and then lead out a first control pin U and are connected to the load; the emitter of the second power chip IGBT2 and the collector of the fifth power chip IGBT5 are connected to the output pin of the first control chip HVIC and then lead out a second control pin V and are connected to the load; the emitter of the third power chip IGBT3 and the collector of the sixth power chip IGBT6 are connected to the output pin of the first control chip HVIC and then lead out a third control pin W and are connected to the load.

[0091] Referring to FIG. 2, in an embodiment of the present disclosure, the emitter of the fourth power chip IGBT4, the emitter of the fifth power chip IGBT5 and the emitter of the sixth power chip IGBT6 are connected to a resistor and then grounded. The collector of the seventh power chip IGBT7 and the emitter of the eighth power chip IGBT8 are connected to the AC power supply through an inductor. In the embodiment of the present disclosure, the HVIC1 is connected to a bootstrap diode, and the power supply of VCC is connected to VB, so that the IGBT switch can be driven by the power of VB. When the AC power is in the negative half cycle and the IGBT7 is turned on, the IGBT7 needs to be continuously turned on, and the HVIC1 needs to be in the state of bootstrap. The bootstrap diode can prevent high voltage from entering the VCC voltage, thereby protecting the elements such as IGBT in the circuit.

[0092] Referring to FIG. 3, it is a schematic diagram of a circuit structure of a traditional intelligent power module. In the working process of the traditional intelligent power module, the AC 220V input is rectified to DC 310V by a rectifier bridge (rectifier circuit), and then the input is adjusted by a PFC circuit to the inverter circuit of the intelligent power module to provide power supply for the intelligent power module, thereby driving the motor or other load to work. The PFC circuit can automatically adjust the conversion efficiency according to the power grid and load fluctuation, improve the power factor of the power system, and improve the energy utilization efficiency.

[0093] In the working process of the intelligent power module of the embodiment of the present disclosure, the AC 220V input is connected in series with the inductor to provide power supply for the intelligent power module. The AC power is converted into DC power by the switching of the IGBT and the diode (FRD) inside the intelligent power module, and the DC power is transmitted to the inverter circuit inside the intelligent power module to drive the motor or other load to work.

[0094] It can be seen that the traditional intelligent power module needs to be connected to a direct current module (rectifier bridge + PFC circuit) to work, while the intelligent power module of the embodiment of the present disclosure can be directly connected to the mains (220V alternating current) in series with an inductor to work. The intelligent power module integrates a rectifier circuit for converting alternating current to direct current. It can be seen that the embodiment of the present disclosure and the traditional intelligent power module realize the conversion of alternating current to direct current in different ways. The traditional intelligent power module is converted by a rectifier bridge + PFC circuit, while the intelligent power module of the embodiment of the present disclosure is converted by 2 groups of IGBT + FRD, which can be realized by a set of logic for controlling IGBT switching.

[0095] Referring to FIG. 4, it is a schematic diagram of the appearance of an intelligent power module provided in an embodiment of the present disclosure. In an embodiment of the present disclosure, the intelligent power module further comprises a cooling fin, and the rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are packaged in a plastic package according to a preset packaging process.

[0096] Specifically, the appearance of the intelligent power module can be composed of a plastic package, a pin and a cooling fin. The plastic package is mainly used to protect the internal circuit and power chip of the intelligent power module, and improve the reliability and strength of the intelligent power module. The pin of the intelligent power module is used to realize the electrical connection between the internal circuit of the intelligent power module and the peripheral circuit, and play the role of the intelligent power module. The cooling fin is used to conduct the heat generated by the intelligent power module during work, thereby ensuring the stability and reliability of the intelligent power module during work.

[0097] Referring to FIG. 5, it is a schematic diagram of the internal structure of an intelligent power module provided in an embodiment of the present disclosure. In an embodiment of the present disclosure, the intelligent power module can further comprise a lead frame, an aluminum wire and a gold wire.

[0098] Specifically, the internal structure of the intelligent power module is composed of a drive circuit (including a drive IC, i.e. a control chip such as HVIC, LVIC), a lead frame, a power chip (IGBT), an aluminum wire and a gold wire, etc. The main function of the drive IC is to control the switching of the power chip and protection. The main function of the lead frame is to realize the connection of the internal circuit of the intelligent power module, the fixation of the internal chip and the support of the intelligent power module. The function of the power chip is to convert alternating current to direct current, and then convert alternating current to controllable alternating current.

[0099] Referring to FIG. 6, it is a front view of the internal structure of an intelligent power module provided in an embodiment of the present disclosure. Specifically, the internal structure of the intelligent power module mainly comprises 3 parts of circuit, which are: ① drive circuit, controlling the switching action of the power chip and the protection function of the IPM module; ② inverter circuit, mainly converting direct current to controllable alternating current; and ③ rectifier circuit, converting the alternating current of the mains to required direct current.

[0100] In one embodiment of the present disclosure, the rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are packaged in a plastic package according to a preset packaging process. In a specific example of the present disclosure, the packaging process of the intelligent power module (product) can specifically include the following steps:

[0101] 1) Dicing

[0102] The wafer processed in the previous process is cut and separated. If the chip is to be cut, the wafer must be adhered to the chip first, and then sent to the chip cutting machine for cutting. The cut grains are arranged in an orderly manner on the blue film.

[0103] 2) Solder paste printing

[0104] The DBC is placed in a jig and then transferred to a device. The steel mesh of the device is pressed on the fixed position of the DBC (Direct Bonded Copper). The doctor blade prints the solder paste on the fixed position of the DBC.

[0105] 3) Power chip pasting

[0106] Referring to FIG. 7, it is a schematic diagram of a power chip pasting provided in an embodiment of the present disclosure. The printed DBC is transferred to the pasting device by the device. The device grabs the chip from the blue film and places it on the DBC. This process needs to be repeated to complete the pasting work of multiple power chips.

[0107] 4) Frame assembly

[0108] The pasted DBC is placed in a jig, and then the lead frame is placed in the same jig. The DBC, lead frame and jig are transferred to the reflow soldering device. After passing through the reflow soldering device, the lead frame and DBC are assembled.

[0109] 5) Cleaning process

[0110] After reflow soldering, the product is sent to the device, and the solder paste volatiles and other foreign matters in the product are cleaned with chemicals.

[0111] 6) Drive chip pasting

[0112] The lead frame is transferred to the dispensing station of the pasting device. The device dispenses silver glue on the position of the frame. Then it is transferred to the pasting station. The device grabs the chip from the blue film and places it on the fixed position of the frame. After completion, the frame is sent to the high-temperature oven for curing.

[0113] 7) Aluminum wire bonding

[0114] Lead frame is fixed on the device by the device, and the aluminum wire bonding device completes the electrical connection between the chip and the lead frame through aluminum wire bonding.

[0115] 8) Gold wire bonding:

[0116] Referring to FIG. 8, it is a schematic diagram of gold wire bonding provided in an embodiment of the present disclosure. Lead frame is fixed on the device by the device, and the gold wire bonding device completes the electrical connection between the chip and the lead frame and the power chip through gold wire bonding.

[0117] 9) Plastic packaging:

[0118] After the product is assembled, the frame is transferred to the mold cavity of the plastic packaging device, the mold is closed, the device is vacuumized, and after reaching the set vacuum value, the melted plastic packaging material is filled into the cavity of the mold to fill the gap in the cavity. After the plastic packaging material is pre-solidified, the mold is opened to take out the product.

[0119] 10) PMC (Post-Mold Cure, post-mold curing)

[0120] The pre-solidified product is sent to the oven, and after 125°C for 6 hours, the plastic package is completely cured.

[0121] 11) Cutting and forming:

[0122] The cured frame is sent to the mold of the cutting device, the connecting rib of the frame is cut off after the stamping of the mold, and then it is sent to the forming mold to complete the bending of the functional foot of the product.

[0123] 12) Printing

[0124] The product is sent to the laser printing device to complete the identification of the relevant information of the product.

[0125] 13) FT (Final Test, final test) test

[0126] After the product is printed, the final electrical performance test is completed to meet the requirements of being ready for shipment.

[0127] 14) Packaging and shipment

[0128] After the product is tested, it is packaged in a designated form and arranged for shipment.

[0129] In another specific example of the present disclosure, the packaging process of the smart power module (product) can be as follows:

[0130] 1) Scribing

[0131] The crystal grains on the wafer processed in the previous step are cut and separated. If chip cutting is to be performed, wafer die bonding must be performed first, and then the wafer is sent to a chip cutting machine for cutting. The crystal grains are arranged in an orderly manner on the blue film after cutting.

[0132] 2) Solder paste printing

[0133] The DBC is placed in a jig and then transferred to the equipment. The steel mesh of the equipment is pressed against the fixed position of the DBC, and the doctor blade prints the solder paste on the fixed position of the DBC.

[0134] 3) Frame assembly

[0135] Referring to FIG. 9, a schematic diagram of a frame assembly provided in an embodiment of the present disclosure is shown. The DBC after the die bonding is placed in a jig, and then the lead frame is placed in the same jig. The DBC, lead frame, and jig are transferred to the reflow soldering equipment. After passing through the reflow soldering equipment, the lead frame and the DBC are assembled.

[0136] 4) Solder paste printing

[0137] The DBC is placed in a jig and then transferred to the equipment. The steel mesh of the equipment is pressed against the fixed position of the DBC, and the doctor blade prints the solder paste on the fixed position of the DBC.

[0138] 5) Power chip die bonding

[0139] The printed DBC and frame are transferred to the die bonding equipment by the equipment. The equipment picks up the chip from the blue film and places it on the DBC. This process needs to be repeated to complete the die bonding of multiple power chips.

[0140] 6) Vacuum reflow soldering

[0141] After the die bonding, the lead frame is sent to the vacuum reflow soldering equipment. After passing through the equipment, the power chip and the lead frame are combined.

[0142] 7) Cleaning process

[0143] After reflow soldering, the product is sent to the equipment, and the solder paste volatiles and other foreign matter in the product are cleaned using chemical solution.

[0144] 8) Drive chip die bonding

[0145] The lead frame is transferred to the dispensing station of the die bonding equipment, and the equipment dispenses silver adhesive on the fixed position of the frame. Then, the lead frame is transferred to the die bonding station, and the equipment picks up the chip from the blue film and places it on the fixed position of the frame. After completion, the frame is sent to the high-temperature oven for curing.

[0146] 9) Aluminum wire bonding

[0147] Lead frame is fixed on the equipment by lead frame fixing equipment, and electrical connection between chip and lead frame is completed by aluminum wire bonding equipment through aluminum wire bonding.

[0148] 10) Gold wire bonding:

[0149] Lead frame is fixed on the equipment by lead frame fixing equipment, and electrical connection between chip and lead frame and power chip is completed by gold wire bonding equipment through gold wire bonding.

[0150] 11) Plastic packaging:

[0151] After the product is assembled, the frame is transferred to the mold cavity of the plastic packaging equipment, the mold is closed, the equipment is vacuumized, and when the set vacuum value is reached, the melted plastic packaging material is filled into the cavity of the mold to fill the gap in the cavity. After the plastic packaging material is pre-solidified, the mold is opened and the product is taken out.

[0152] 12) PMC

[0153] The pre-solidified product is sent to the oven, and after 125℃ for 6 hours, the plastic package is completely solidified.

[0154] 13) Cutting and forming:

[0155] The solidified frame is sent to the mold of the cutting equipment, the connecting rib of the frame is cut off after the stamping of the mold, and then it is sent to the forming mold to complete the bending of the functional foot of the product.

[0156] 14) Printing

[0157] The product is sent to the laser printing equipment to complete the identification of the relevant information of the product.

[0158] 15) FT test

[0159] After the product is printed, the final electrical performance test is completed to meet the requirements of shipment.

[0160] 16) Packaging and shipment

[0161] After the product is tested, it is packaged in the specified form and arranged for shipment.

[0162] In summary, the embodiment of the present disclosure provides a multifunctional intelligent power module, which is quite different from the traditional intelligent power module. Specifically speaking: (1) the traditional intelligent power module only contains a drive IC and an inverter circuit inside, and its function is relatively single. Its main function is to convert DC into controllable AC to achieve more efficient conversion, and it also integrates detection and protection functions. The traditional intelligent power module cannot complete other work. (2) The embodiment of the present disclosure provides a multifunctional intelligent power module, which integrates the function of converting AC power into DC power (rectifier circuit) inside, so that the intelligent power module can realize the function of AC power (mains) → DC power → controllable AC power, and it also contains many detection and protection functions to ensure the stable and safe operation of the intelligent power module. ① Compared with the traditional intelligent power module, the intelligent power module of the embodiment of the present disclosure needs to connect DC power to fixed pins through a PCB to work normally, and the circuit wiring is long. The intelligent power module of the embodiment of the present disclosure is connected inside the intelligent power module, and the circuit wiring is short, which can reduce the stray inductance of the intelligent power module system and improve the stability and safety of the intelligent power module during operation. ② After the integration of the intelligent power module is improved, the area of the printed circuit board (PCB) occupied by the intelligent power module is smaller, and there is no need to layout the rectification function on the printed circuit board (PCB). ③ The intelligent power module of the embodiment of the present disclosure reduces one rectifier bridge compared with the traditional intelligent power module, which can reduce the BOM (Bill of Materials) cost. ④ The intelligent power module of the embodiment of the present disclosure is small in size and perfect in function, which is more friendly to application engineers and more convenient in layout. ⑤ The intelligent power module of the embodiment of the present disclosure is more efficient in power conversion efficiency and more energy-saving and environmentally friendly.

[0163] Based on the above intelligent power module, the embodiment of the present disclosure further discloses a load driving circuit, which comprises an intelligent power module and a peripheral circuit. The peripheral circuit can comprise an AC power supply, a capacitor, an inductor, a resistor and a load.

[0164] The intelligent power module comprises a rectifier circuit, an inverter circuit and a drive circuit. The rectifier circuit is connected with an AC power supply connected with an inductor and a capacitor, wherein:

[0165] The rectifier circuit is configured to convert AC power provided by the AC power supply into DC power, and provide the DC power to the inverter circuit and the drive circuit;

[0166] The drive circuit is configured to receive a logic control signal and control the opening and closing of the power chip of the inverter circuit according to the logic control signal;

[0167] The inverter circuit is configured to convert the DC power into controllable AC power based on the logic control signal, so as to control the load to work through the controllable AC power.

[0168] In an embodiment of the present disclosure, the power chips in the rectifier circuit and the inverter circuit are connected with diodes respectively.

[0169] In an embodiment of the present disclosure, the inverter circuit comprises a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip and a sixth power chip, the drive circuit comprises a first control chip and a second control chip; the rectifier circuit comprises a seventh power chip and an eighth power chip, the drive circuit further comprises a third control chip; the collector of the first power chip is connected with the emitter of the seventh power chip through the capacitor; the collector of the eighth power chip is connected with the collector of the first power chip, the collector of the second power chip and the collector of the third power chip respectively;

[0170] The microcontroller units are connected with the input pins of the first control chip, the input pins of the second control chip and the input pins of the third control chip respectively;

[0171] The output pins of the first control chip and the output pins of the first control chip are connected with the gates of the first power chip, the gates of the second power chip and the gates of the third power chip respectively;

[0172] The output pins of the second control chip are connected with the gates of the fourth power chip, the gates of the fifth power chip and the gates of the sixth power chip respectively;

[0173] The output pins of the third control chip are connected with the gates of the seventh power chip and the gates of the eighth power chip respectively.

[0174] In an embodiment of the present disclosure, the emitter of the first power chip and the collector of the fourth power chip are connected with the output pins of the first control chip to lead out a first control pin and connected to the load;

[0175] The emitter of the second power chip and the collector of the fifth power chip are connected with the output pins of the first control chip to lead out a second control pin and connected to the load;

[0176] The emitter of the third power chip and the collector of the sixth power chip are connected with the output pins of the first control chip to lead out a third control pin and connected to the load.

[0177] In an embodiment of the present disclosure, the emitter of the fourth power chip, the emitter of the fifth power chip and the emitter of the sixth power chip are connected with resistors and grounded.

[0178] In an embodiment of the present disclosure, the collector of the seventh power chip and the emitter of the eighth power chip are connected to the AC power source through an inductor.

[0179] In an embodiment of the present disclosure, the intelligent power module further comprises a lead frame, an aluminum wire and a gold wire.

[0180] In an embodiment of the present disclosure, the intelligent power module further comprises a heat sink.

[0181] In an embodiment of the present disclosure, the load at least comprises a motor.

[0182] In an embodiment of the present disclosure, the rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are packaged in a plastic package body according to a preset packaging procedure.

[0183] In an embodiment of the present disclosure, the load drive circuit comprises an intelligent power module, the intelligent power module comprising a rectifier circuit, an inverter circuit and a drive circuit, the rectifier circuit being connected to an AC power source connected with an inductor and a capacitor, wherein the rectifier circuit is configured to convert AC power provided by the AC power source into DC power and provide the DC power to the inverter circuit and the drive circuit, the drive circuit is configured to receive a logic control signal and control the opening and closing of the power chip of the inverter circuit according to the logic control signal, and the inverter circuit is configured to convert the DC power into controllable AC power based on the logic control signal to control the load to work through the controllable AC power. The intelligent power module of the embodiment of the present disclosure not only integrates the drive circuit and the inverter circuit, but also integrates the rectifier circuit, so that the AC power provided by the AC power source can be converted into DC power inside the intelligent power module, and then the DC power can be converted into controllable AC power through the drive circuit and the inverter circuit to control the load to work. The intelligent power module has high integration, so it occupies less area of the printed circuit board, at the same time, the printed circuit board does not need to be laid out with other rectifier circuits, further reducing the area of the printed circuit board it occupies, which is more friendly to application engineers, making it more convenient for application engineers to layout other circuits or elements.

[0184] For the above-mentioned embodiments, since they are basically similar to the intelligent power module embodiments, the description is relatively simple, and the relevant parts can be referred to the part of the description of the intelligent power module embodiments.

[0185] Based on the above-mentioned load drive circuit, the present disclosure further discloses an air conditioner, the air conditioner comprising a load drive circuit, the load drive circuit comprising an intelligent power module and a peripheral circuit, the peripheral circuit can comprise an AC power source, a capacitor, an inductor, a resistor and a load.

[0186] The intelligent power module comprises a rectifier circuit, an inverter circuit and a driving circuit, the rectifier circuit is connected with an alternating current power source connected with an inductor and a capacitor, wherein:

[0187] The rectifier circuit is configured to convert alternating current provided by the alternating current power source into direct current and provide the direct current to the inverter circuit and the driving circuit;

[0188] The driving circuit is configured to receive a logic control signal and control the opening and closing of power chips of the inverter circuit according to the logic control signal;

[0189] The inverter circuit is configured to convert the direct current into controllable alternating current based on the logic control signal, so as to control the operation of a load through the controllable alternating current.

[0190] In an embodiment of the present disclosure, the power chips in the rectifier circuit and the inverter circuit are respectively connected with diodes.

[0191] In an embodiment of the present disclosure, the inverter circuit comprises a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip and a sixth power chip, the driving circuit comprises a first control chip and a second control chip; the rectifier circuit comprises a seventh power chip and an eighth power chip, the driving circuit further comprises a third control chip; the collector of the first power chip is connected with the emitter of the seventh power chip through the capacitor; the collectors of the eighth power chip are respectively connected with the collectors of the first power chip, the collectors of the second power chip and the collectors of the third power chip;

[0192] The microcontroller unit is connected with the input pins of the first control chip, the input pins of the second control chip and the input pins of the third control chip;

[0193] The output pins of the first control chip and the output pins of the first control chip are respectively connected with the gates of the first power chip, the gates of the second power chip and the gates of the third power chip;

[0194] The output pins of the second control chip are respectively connected with the gates of the fourth power chip, the gates of the fifth power chip and the gates of the sixth power chip;

[0195] The output pins of the third control chip are respectively connected with the gates of the seventh power chip and the gates of the eighth power chip.

[0196] In an embodiment of the present disclosure, the emitter of the first power chip and the collector of the fourth power chip are connected to the output pin of the first control chip, and then a first control pin is led out and connected to the load.

[0197] The emitter of the second power chip and the collector of the fifth power chip are connected to the output pin of the first control chip, and then a second control pin is led out and connected to the load.

[0198] The emitter of the third power chip and the collector of the sixth power chip are connected to the output pin of the first control chip, and then a third control pin is led out and connected to the load.

[0199] In an embodiment of the present disclosure, the emitter of the fourth power chip, the emitter of the fifth power chip and the emitter of the sixth power chip are connected to ground through a resistor.

[0200] In an embodiment of the present disclosure, the collector of the seventh power chip and the emitter of the eighth power chip are connected to the AC power supply through an inductor.

[0201] In an embodiment of the present disclosure, the intelligent power module further comprises a lead frame, an aluminum wire and a gold wire.

[0202] In an embodiment of the present disclosure, the intelligent power module further comprises a heat sink.

[0203] In an embodiment of the present disclosure, the load at least comprises a motor.

[0204] In an embodiment of the present disclosure, the rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are packaged in a plastic package body according to a preset packaging process.

[0205] In the embodiments of the present disclosure, the air conditioner can include a load driving circuit, the load driving circuit including an intelligent power module, the intelligent power module including a rectifier circuit, an inverter circuit and a driving circuit, the rectifier circuit being connected with an alternating current power supply connected with an inductor and a capacitor, wherein the rectifier circuit is configured to convert alternating current provided by the alternating current power supply into direct current and provide the direct current to the inverter circuit and the driving circuit, the driving circuit is configured to receive a logic control signal and control the opening and closing of a power chip of the inverter circuit according to the logic control signal, and the inverter circuit is configured to convert the direct current into controllable alternating current based on the logic control signal to control the load to work through the controllable alternating current. The intelligent power module of the embodiments of the present disclosure not only integrates the driving circuit and the inverter circuit, but also integrates the rectifier circuit, so that the alternating current provided by the alternating current power supply can be converted into direct current inside the intelligent power module, and then the direct current can be converted into controllable alternating current through the driving circuit and the inverter circuit to control the load to work. The intelligent power module has high integration, so that it occupies a smaller area of a printed circuit board, and meanwhile, the printed circuit board does not need to be laid out with other rectifier circuits, further reducing the area of the printed circuit board it occupies, which is more friendly to application engineers, so that the application engineers will be more convenient to lay out other circuits or elements.

[0206] For the above-mentioned embodiments, since they are basically similar to the intelligent power module embodiments, the description is relatively simple, and the relevant parts can be referred to the part of the description of the intelligent power module embodiments.

[0207] It should be noted that, in this document, the terms such as first and second are merely used to distinguish one entity or operation from another, and do not necessarily require or imply that there is any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or device including the element.

[0208] Each of the embodiments in the specification is described in a relevant manner, and the same and similar parts between each of the embodiments can be referred to each other. Each of the embodiments focuses on the difference from other embodiments. Especially, for the system embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the part of the description of the method embodiments.

[0209] The above merely provides the preferred embodiments of the present disclosure, but not for limiting the present disclosure. Any modification, equivalent replacement, improvement, and the like made within the spirit and principle of the present disclosure shall fall into the scope of protection of the present disclosure.

Claims

1. An intelligent power module, wherein, The intelligent power module comprises a rectifier circuit, an inverter circuit and a driving circuit, the rectifier circuit is connected with an alternating current power source connected with an inductor and a capacitor, wherein: The rectifier circuit is configured to convert alternating current provided by the alternating current power source into direct current and provide the direct current to the inverter circuit and the driving circuit; The driving circuit is configured to receive a logic control signal and control the opening and closing of power chips of the inverter circuit according to the logic control signal; The inverter circuit is configured to convert the direct current into controllable alternating current based on the logic control signal to control the load to work through the controllable alternating current.

2. The intelligent power module according to claim 1, wherein, The power chips in the rectifier circuit and the power chips in the inverter circuit are respectively connected with diodes.

3. The intelligent power module according to claim 2, wherein, The inverter circuit comprises a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip and a sixth power chip, the driving circuit comprises a first control chip and a second control chip; the rectifier circuit comprises a seventh power chip and an eighth power chip, the driving circuit further comprises a third control chip; the collector of the first power chip is connected with the emitter of the seventh power chip through the capacitor; the collectors of the eighth power chip are respectively connected with the collectors of the first power chip, the collectors of the second power chip and the collectors of the third power chip; The microcontroller unit is respectively connected with the input pins of the first control chip, the input pins of the second control chip and the input pins of the third control chip; The output pins of the first control chip and the output pins of the first control chip are respectively connected with the gates of the first power chip, the gates of the second power chip and the gates of the third power chip; The output pins of the second control chip are respectively connected with the gates of the fourth power chip, the gates of the fifth power chip and the gates of the sixth power chip; The output pins of the third control chip are respectively connected with the gates of the seventh power chip and the gates of the eighth power chip.

4. The intelligent power module according to claim 3, wherein, The emitter of the first power chip and the collector of the fourth power chip are connected with the output pins of the first control chip to lead out a first control pin and are connected to the load; The emitter of the second power chip and the collector of the fifth power chip are connected with the output pins of the first control chip to lead out a second control pin and are connected to the load; The emitter of the third power chip and the collector of the sixth power chip are connected with the output pins of the first control chip to lead out a third control pin and are connected to the load.

5. The intelligent power module according to claim 4, wherein, The emitters of the fourth power chip, the fifth power chip and the sixth power chip are connected with a resistor and grounded.

6. The intelligent power module according to claim 4, wherein, The collector of the seventh power chip and the emitter of the eighth power chip are connected with the alternating current power source through an inductor.

7. The intelligent power module according to claim 1, wherein, The intelligent power module further comprises a lead frame, an aluminum wire and a gold wire.

8. The intelligent power module according to claim 1, wherein, The intelligent power module further comprises a heat sink.

9. The intelligent power module according to claim 1, wherein, The load at least comprises a motor.

10. The intelligent power module according to claim 1, wherein, The rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are packaged in a plastic package body according to a preset packaging process.

11. A load driving circuit, wherein, The load drive circuit comprises the intelligent power module according to any one of claims 1-10 and a peripheral circuit, and the peripheral circuit comprises an alternating current power supply, a capacitor, an inductor, a resistor and a load.

12. An air conditioner wherein, The air conditioner comprises the load drive circuit according to claim 11.

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