System display panel and manufacturing method therefor, and display device

Abstract

The present invention provides a display panel and a manufacturing method therefor, and a display device. The display panel comprises: a base substrate; at least one insulating layer, disposed on the base substrate; spacer posts, disposed on the side of the insulating layer away from the base substrate, wherein an undercut structure is formed on a side surface of each spacer post; a light-emitting functional layer, disposed on the side of the spacer posts away from the base substrate and interrupted at the positions of the undercut structures; and an inorganic encapsulation layer, disposed on the side of the light-emitting functional layer away from the base substrate, wherein a surface height of a first insulating layer among the at least one insulating layer in a first area where the spacer posts are located is lower than that in second areas on two sides of the spacer posts, and the first insulating layer is an insulating layer closest to the spacer posts among the at least one insulating layer. The present invention can prevent moisture and oxygen from penetrating the display panel, thereby enhancing the display effect.

Description

System display panel, manufacturing method thereof and display device

[0001] Cross-reference to related applications

[0002] The present application claims priority from Chinese Patent Application No. 202411367806.4 filed on September 27, 2024, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] Embodiments of the present application relate to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device. BACKGROUND

[0004] Organic Light-Emitting Diode (OLED) display panels have advantages such as high color performance, high contrast, fast response time, thinness and flexibility, and are currently widely used. In order to realize a full-screen, a camera or other sensors can be arranged by digging a hole in the display area (AA area) of the OLED display panel.

[0005] The light-emitting functional layer in the OLED display panel is usually arranged in an integral layer. When the AA area of the display panel is dug, the light-emitting functional layer forms a section at the cutting line position of the hole, which causes water and oxygen to invade from the section of the light-emitting functional layer, resulting in display problems. SUMMARY

[0006] Embodiments of the present application provide a display panel, a manufacturing method thereof and a display device, which are used to solve the problem that the light-emitting functional layer of the existing OLED display panel generates a section at the cutting line position of the hole, causing water and oxygen to invade and resulting in display problems.

[0007] To solve the above technical problems, the present application is implemented as follows:

[0008] In a first aspect, embodiments of the present application provide a display panel, comprising:

[0009] a substrate substrate;

[0010] at least one insulating layer disposed on the substrate substrate;

[0011] an isolation column disposed on a side of the insulating layer away from the substrate substrate; a side surface of the isolation column forms an undercut structure;

[0012] a light-emitting functional layer disposed on a side of the isolation column away from the substrate substrate and disconnected at the position of the undercut structure;

[0013] an inorganic encapsulation layer disposed on a side of the light-emitting functional layer away from the substrate substrate;

[0014] The first insulating layer in the at least one insulating layer is located at a surface height lower than that of a second region on both sides of the isolation column, and the first insulating layer is the insulating layer closest to the isolation column in the at least one insulating layer.

[0015] Optionally, the display panel has a display area, a cutout area located inside the display area, and a transition area located between the cutout area and the display area; the isolation column is located in the transition area and arranged around the cutout area.

[0016] Optionally, the display panel further comprises:

[0017] The first heightening pattern is arranged in the second region on both sides of the isolation column.

[0018] Optionally, the display panel comprises a plurality of insulating layers; and the first heightening pattern is arranged between the plurality of insulating layers.

[0019] Optionally, the first heightening pattern comprises at least one gate metal pattern, and / or the first heightening pattern comprises at least one source / drain metal pattern.

[0020] Optionally, the display panel further comprises:

[0021] The second heightening pattern is arranged on the side of the isolation column close to the substrate and located in the first region; and the height of the second heightening pattern is lower than that of the first heightening pattern.

[0022] Optionally, at least one of the insulating layers forms an etching groove in the first region where the isolation column is located; and the orthographic projection of the isolation column on the substrate is located in the orthographic projection area of the etching groove on the substrate.

[0023] Optionally, the first insulating layer forms the etching groove.

[0024] Optionally, the isolation column comprises a first film layer, a second film layer and a third film layer arranged in sequence in a direction away from the substrate; the side surface of the second film layer is inwardly recessed relative to the first film layer and the third film layer, forming the undercut structure.

[0025] Alternatively, the isolation column comprises a fourth film layer, a first film layer, a second film layer and a third film layer arranged in sequence in a direction away from the substrate; the side surface of the second film layer is inwardly recessed relative to the first film layer and the third film layer, forming the undercut structure.

[0026] Optionally, the isolation column comprises at least one source / drain metal pattern.

[0027] Optionally, the display panel comprises a plurality of isolation columns, which are sequentially and spacedly arranged from the edge of the transition region to the display region.

[0028] In a second aspect, an embodiment of the present application provides a manufacturing method of a display panel, which is used to manufacture the display panel of the first aspect, and the manufacturing method comprises:

[0029] providing a substrate substrate;

[0030] forming at least one insulating layer on the substrate substrate;

[0031] forming an isolation column on a side of the insulating layer away from the substrate substrate, and a side surface of the isolation column is formed with an undercut structure;

[0032] forming a light-emitting functional layer on a side of the isolation column away from the substrate substrate, and the light-emitting functional layer is disconnected at a position of the undercut structure;

[0033] forming an inorganic encapsulation layer on a side of the light-emitting functional layer away from the substrate substrate;

[0034] wherein a surface height of a first region where the isolation column is located of a first insulating layer in the at least one insulating layer is lower than a surface height of a second region on both sides of the isolation column, and the first insulating layer is the insulating layer closest to the isolation column in the at least one insulating layer.

[0035] In a third aspect, an embodiment of the present application provides a display device comprising the display panel of the first aspect.

[0036] In the embodiment of the present application, the isolation column with the undercut structure can disconnect the light-emitting functional layer, and even if the section formed by cutting the light-emitting functional layer is invaded by water and oxygen, the light-emitting functional layer in the display region will not be affected, which can achieve the effect of isolating water and oxygen. In addition, the surface height of the first region where the isolation column is located of the first insulating layer is lower than the surface height of the second region on both sides of the isolation column, so that the height difference of the light-emitting functional layer between the first region where the isolation column is located and the second region on both sides of the isolation column is small, and when the inorganic encapsulation layer is formed, more inorganic material will accumulate at the interface between the first region and the second region, the film layer of the inorganic encapsulation layer at the position of the undercut structure will be more dense, so that the inorganic encapsulation layer is not easy to crack at the position of the undercut structure, further preventing water and oxygen from invading, and thus improving the display effect. BRIEF DESCRIPTION OF DRAWINGS

[0037] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments with reference made to the accompanying drawings. The drawings provided are for purposes of illustration only and merely depict preferred embodiments of the present application. The drawings disclosed herein are illustrative in nature and not limiting of the scope of the present application. Furthermore, there is no intention or desire to limit the application of the present application to the exact drawings disclosed. In the drawings:

[0038] FIG. 1 is a structural schematic diagram of an OLED display panel in the related art;

[0039] FIG. 2 is a top view of a display panel according to an embodiment of the present application;

[0040] FIG. 3 is a cross-sectional view of a display panel according to an embodiment of the present application;

[0041] FIG. 4 is a cross-sectional view of a display panel according to an embodiment of the present application;

[0042] FIG. 5 is a cross-sectional view of a display panel according to an embodiment of the present application;

[0043] FIG. 6 is a cross-sectional view of a display panel according to an embodiment of the present application;

[0044] FIG. 7 is a cross-sectional view of a display panel according to an embodiment of the present application;

[0045] FIG. 8 is a cross-sectional view of a display panel according to an embodiment of the present application;

[0046] FIG. 9 is a cross-sectional view of a display panel according to an embodiment of the present application;

[0047] FIG. 10 is a cross-sectional view of a display panel according to an embodiment of the present application;

[0048] FIG. 11 is a comparison schematic diagram of a display panel according to an embodiment of the present application and a display panel in the related art at the position of an isolation column;

[0049] FIG. 12 is a cross-sectional view of a display area of a display panel according to an embodiment of the present application;

[0050] FIG. 13 is a flowchart of a manufacturing method of a display panel according to an embodiment of the present application;

[0051] FIG. 14 is a cross-sectional view of a display panel according to an embodiment of the present application. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0053] Please refer to FIG. 1, which is a structural schematic diagram of an OLED display panel in the related art. In the related art, an isolation column with an undercut structure can be arranged on the OLED display panel to disconnect the light-emitting functional layer. The section of the light-emitting functional layer formed due to the cutting will not be affected by water and oxygen even if it is invaded, and the effect of isolating water and oxygen can be achieved. However, due to the undercut structure of the isolation column, the inorganic encapsulation layer formed subsequently can be recessed at the undercut position. The inorganic encapsulation layer film layer at the undercut position is relatively thin and is prone to cracking. Water vapor can propagate along the crack path to the interface of the light-emitting functional layer, resulting in a GDSH (black spot at the edge of the hole) phenomenon, and thus causing display defects.

[0054] To solve the above problems, please refer to FIG. 2, FIG. 3 and FIG. 4, an embodiment of the present application provides a display panel, comprising:

[0055] a substrate 10; the substrate 10 can be a rigid substrate such as a glass substrate, etc., or a flexible substrate such as a polyimide (PI) substrate, etc., to realize flexible display.

[0056] at least one insulating layer 20 arranged on the substrate 10;

[0057] an isolation column 30 arranged on the side of the insulating layer 20 away from the substrate 10, and the side surface of the isolation column 30 is formed with an undercut structure;

[0058] a light-emitting functional layer 40 arranged on the side of the isolation column 30 away from the substrate 10 and disconnected at the position of the undercut structure; the light-emitting functional layer 40 can include at least one of a hole transport layer, a hole injection layer, an electron transport layer, an electron injection layer, etc. in addition to a light-emitting layer (EL).

[0059] an inorganic encapsulation layer 50 arranged on the side of the light-emitting functional layer 40 away from the substrate 10;

[0060] wherein the surface height of the first insulating layer in the at least one insulating layer 20 located in the first region where the isolation column 30 is arranged is lower than the surface height of the second region located on both sides of the isolation column, and the first insulating layer is the insulating layer closest to the isolation column in the at least one insulating layer.

[0061] As can be seen from a comparison between FIG. 1 and FIG. 4, in the related art, the insulating layer closest to the isolation column is located at a surface height of the first region where the isolation column is located that is higher than a surface height of the second region on both sides of the isolation column, so that the inorganic encapsulation layer formed subsequently can produce a recess at the undercut position, the film layer of the inorganic encapsulation layer at the undercut position is thin and is prone to cracks. In the embodiment of the present application, the surface height of the first insulating layer in the first region where the isolation column 30 is located is lower than the surface height of the second region on both sides of the isolation column, so that when the inorganic encapsulation layer is formed, more accumulation of inorganic material occurs at the interface between the first region and the second region, the film layer of the inorganic encapsulation layer at the undercut structure position is more dense, so that the inorganic encapsulation layer at the undercut structure position is not prone to cracks.

[0062] In the embodiment of the present application, by setting the isolation column with the undercut structure, the light-emitting functional layer can be disconnected, and even if the cut surface of the light-emitting functional layer formed by cutting is invaded by water and oxygen, it will not affect the light-emitting functional layer in the display area, and the effect of isolating water and oxygen can be achieved. In addition, the surface height of the first insulating layer in the first region where the isolation column is located is lower than the surface height of the second region on both sides of the isolation column, so that the height difference between the light-emitting functional layer in the first region where the isolation column is located and the light-emitting functional layer in the second region on both sides of the isolation column is small, so that when the inorganic encapsulation layer is formed, more accumulation of inorganic material occurs at the interface between the first region and the second region, the film layer of the inorganic encapsulation layer at the undercut structure position is more dense, so that the inorganic encapsulation layer at the undercut structure position is not prone to cracks, further preventing water and oxygen from invading, and thus improving the display effect.

[0063] In some embodiments, optionally, the display panel has a display area a, a cutout area b located inside the display area a, and a transition area c located between the cutout area b and the display area a; the isolation column 30 is located in the transition area c and is arranged around the cutout area b.

[0064] Optionally, the at least one insulating layer 20 can be located in the display area a and the transition area c, the light-emitting functional layer 40 can be located in the display area a and the transition area c, and the inorganic encapsulation layer 50 can be located in the display area a and the transition area c.

[0065] Optionally, the cutout area is used to set a camera or other sensor.

[0066] In the embodiment of the present application, the isolation column with the undercut structure can disconnect the light-emitting functional layer, and the cross section of the light-emitting functional layer in the transition area formed by cutting will not affect the light-emitting functional layer in the display area even if it is invaded by water and oxygen, so as to achieve the effect of isolating water and oxygen. In addition, the surface height of the first insulating layer in the first area where the isolation column is located is lower than the surface height of the second area on both sides of the isolation column, so that the height difference between the light-emitting functional layer in the first area where the isolation column is located and the light-emitting functional layer in the second area on both sides of the isolation column is reduced, so that when the inorganic encapsulation layer is formed, more accumulation will be generated at the interface between the first area and the second area, and the film layer of the inorganic encapsulation layer at the undercut structure position will be more dense, so that the inorganic encapsulation layer is not easy to crack at the undercut structure position, further preventing water and oxygen from invading, and thus improving the display effect.

[0067] Of course, in some other embodiments of the present application, the isolation column is not limited to being arranged around the dug hole area, for example, in some embodiments, it can also be arranged around the entire display area in the non-display area outside the display area.

[0068] The display panel in the embodiment of the present application can further include an anode and a cathode, and the anode and the cathode are located in the display area, and the anode, the light-emitting functional layer and the cathode in the display area constitute a light-emitting unit of the display panel.

[0069] The inorganic encapsulation layer in the embodiment of the present application can include a first inorganic encapsulation layer (CVD1) and / or a second inorganic encapsulation layer (CVD2) of the display panel.

[0070] The display panel in the embodiment of the present application can further include a driving circuit layer for driving the light-emitting unit to emit light, and the substrate, the driving circuit layer and the above-mentioned insulating layer constitute a back plate of the display panel. The driving circuit layer can include a thin film transistor and a capacitor, and the thin film transistor includes a gate, an active layer, a source and a drain.

[0071] The insulating layer in the embodiment of the present application can be an insulating layer on the back plate, and includes at least one of a barrier layer (Barrier), a buffer layer (Buffer), an interlayer dielectric layer (ILD) and a passivation layer (PVX).

[0072] In some embodiments, as shown in FIG. 4, the isolation column 30 comprises a first film layer 31, a second film layer 32 and a third film layer 33 arranged in sequence in a direction away from the substrate 10, and the side surface of the second film layer 32 is inwardly recessed relative to the first film layer 31 and the third film layer 33 to form the undercut structure. Of course, the film layer structure of the isolation column 30 is not limited to this, for example, in some other embodiments of the present application, the isolation column 30 can only comprise a third film layer 33 and a second film layer 32, and the side surface of the second film layer 32 is inwardly recessed relative to the third film layer 33 to form the undercut structure. As shown in FIG. 10, in the embodiment shown in FIG. 10, the isolation column 30 comprises a fourth film layer 34, a first film layer 31, a second film layer 32 and a third film layer 33 arranged in sequence in a direction away from the substrate 10, and the side surface of the second film layer 33 is inwardly recessed relative to the first film layer 31 and the third film layer 33 to form the undercut structure.

[0073] In some embodiments, as shown in FIG. 4, the first film layer 31, the second film layer 32 and the third film layer 33 of the isolation column 30 can be Ti / Al / Ti, respectively.

[0074] In some embodiments, as shown in FIG. 4, the isolation column 30 comprises at least one source-drain (SD) metal pattern. That is, the isolation column 30 can be formed with the source-drain metal pattern of the display area of the display panel by one patterning process, for example, with the source-drain electrode of the thin film transistor by one patterning process, thereby reducing the process steps and reducing the cost.

[0075] In the embodiment shown in FIG. 10, the fourth film layer can be a source-drain (SD) metal pattern. The first film layer, the second film layer and the third film layer constitute a source-drain (SD) metal pattern. In some embodiments, the first film layer 31, the second film layer 32 and the third film layer 33 can be Ti / Al / Ti, respectively, and the fourth film layer can be a Ti / Al / Ti three-layer structure.

[0076] In some embodiments, as shown in FIG. 2 and FIG. 3, the display panel comprises a plurality of isolation columns 30, and the plurality of isolation columns 30 are arranged in sequence in a direction from the edge of the transition area to the display area. In the embodiment shown in FIG. 2, the display panel comprises one isolation column, and in the embodiment shown in FIG. 3, the display panel comprises seven isolation columns. Of course, the number of isolation columns is not limited to this. The more the number of isolation columns, the better the effect of isolating water and oxygen.

[0077] Please refer to FIG. 5 and FIG. 8, in some embodiments of the present application, optionally, the display panel further comprises: a first raised pattern 60 located in the transition area and arranged around the cutout area, the first raised pattern 60 is arranged in the second area on both sides of the isolation column 30, that is, the orthographic projection of the first raised pattern 60 on the substrate 10 does not overlap with the orthographic projection of the isolation column 30 on the substrate 10, and the isolation column 30 and the first raised pattern 60 are staggered. By arranging the first raised pattern 60, the height of the insulating layer in the second area on both sides of the isolation column 30 can be raised, so that the surface height of the first insulating layer in the second area on both sides of the isolation column 30 is higher than the surface height of the first insulating layer in the first area where the isolation column 30 is located.

[0078] In the embodiments shown in FIG. 5 and FIG. 8, the display panel comprises a first raised pattern 60, and in other embodiments of the present application, the display panel can comprise a plurality of first raised patterns 60 arranged in layers. Please refer to FIG. 6 and FIG. 7, in the embodiment shown in FIG. 6, the display panel can comprise two first raised patterns 60 arranged in layers, and in the embodiment shown in FIG. 7, the display panel can comprise three first raised patterns 60 arranged in layers.

[0079] In some embodiments, optionally, the display panel comprises a plurality of insulating layers 20, for example, in the embodiment shown in FIG. 8, the display panel comprises two insulating layers, namely a first insulating layer 21 and a second insulating layer 22, in the embodiments shown in FIG. 5 and FIG. 6, the display panel comprises three insulating layers, namely a first insulating layer 21, a second insulating layer 22 and a third insulating layer 23, and in the embodiment shown in FIG. 7, the display panel comprises four insulating layers, namely a first insulating layer 21, a second insulating layer 22, a third insulating layer 23 and a fourth insulating layer 24. The first raised pattern 60 is arranged between the plurality of insulating layers 20. Optionally, if the display panel comprises a plurality of first raised patterns, the plurality of first raised patterns are separated by the insulating layers.

[0080] In some embodiments, optionally, the first raised pattern 60 comprises at least one gate metal pattern (please refer to FIG. 5, FIG. 6 and FIG. 7), and / or the first raised pattern comprises at least one source-drain metal pattern (please refer to FIG. 8). That is, at least one of the first raised patterns 60 can be formed with the gate metal layer or the source-drain metal pattern in the display area of the display panel by a one-time patterning process, for example, with the gate or source-drain of a thin film transistor by a one-time patterning process, thereby reducing the process steps and reducing the cost.

[0081] In the embodiment of the present application, the height of the gate metal pattern is generally between 2500A and 3000A, and thus, setting a layer of gate metal pattern in the second region is equivalent to raising the insulating layer of the second region by 2500A-3000A. Setting a layer of gate metal pattern in the second region is equivalent to raising the insulating layer of the second region by 2500A-3000A. The height of the source-drain metal pattern is generally higher than 3000A, and thus, setting a layer of source-drain metal pattern in the second region is equivalent to raising the insulating layer of the second region by a height higher than 3000A, and the raising effect is more obvious.

[0082] In some embodiments, the source-drain metal pattern for forming the first raised pattern 60 and the source-drain metal pattern for forming the second film layer 32 of the isolation column 30 are not the same source-drain metal layer. The source-drain metal pattern for forming the first raised pattern 60 can be SD1, the source-drain metal pattern for forming the second film layer 32 of the isolation column 30 can be SD2 or SD3, or the source-drain metal pattern for forming the first raised pattern 60 can be SD2, and the source-drain metal pattern for forming the second film layer 32 of the isolation column 30 can be SD3. The SD1 can be the first source-drain metal layer 208 in FIG. 12, the SD2 can be the second source-drain metal layer 211 in FIG. 12, and the SD3 is not shown in FIG. 12, which is a source-drain metal layer formed after the SD2, insulated from the SD2 by the PLN and connected to the SD2 through the via on the PLN.

[0083] In some embodiments, the display panel further comprises: a second raised pattern 70 located in the transition region and arranged around the hole region, arranged on the side of the isolation column 30 close to the substrate 10, and located in the first region; the height of the second raised pattern 70 is lower than the height of the first raised pattern 60. That is, the first region where the isolation column is located can also be raised, but the height of the first region needs to be lower than the height of the second region on both sides of the isolation column to ensure that the surface height of the first insulating layer in the first region where the isolation column 30 is located is lower than the surface height of the second region on both sides of the isolation column. It should be noted that if the first raised pattern 60 includes one or more, the second raised pattern 70 also includes one or more, and the total height of the one or more second raised patterns 70 is lower than the total height of the one or more first raised patterns 60.

[0084] In some embodiments, referring to FIG. 9, optionally, at least one of the insulating layers 20 in the first region where the isolation columns 30 are located forms an etching groove 20a, and the orthographic projection of the isolation column 30 on the substrate 10 is located in the orthographic projection area of the etching groove 20a on the substrate 10. By forming the etching groove 20a on at least one of the insulating layers in the first region, the surface height of the first insulating layer in the first region can be reduced, so that the surface height of the first insulating layer in the first region where the isolation columns 30 are located is lower than the surface height of the second region on both sides of the isolation columns. In the embodiment shown in FIG. 9, in addition to the groove formed on the insulating layer 20 in the first region, a first elevation pattern 60 is also provided in the second region.

[0085] Optionally, the etching groove is formed on the first insulating layer, i.e., the etching groove is formed on the insulating layer closest to the isolation column 30, and the other insulating layers can not be formed. Of course, it is also not excluded that the etching groove is formed on multiple insulating layers at the same time.

[0086] Referring to FIG. 11, FIG. 11 is a comparison diagram of the position of the isolation column of the display panel in the embodiment of the present application and the display panel in the related art. As can be seen from FIG. 11, the inorganic encapsulation layer in the related art will produce a recess at the undercut position, the film layer is thin, and cracks are easy to occur, and the water vapor at the undercut structure of the isolation column is serious. However, the film layer of the inorganic encapsulation layer in the embodiment of the present application at the undercut structure position is more dense, so that the inorganic encapsulation layer at the undercut structure position is not easy to produce cracks, and the water and oxygen at the undercut structure of the isolation column are relatively slight.

[0087] The display panel in the embodiment of the present application can be an OLED display panel, and of course, it is not excluded that it is other types of display panels.

[0088] The specific structure of the display area of the display panel in the embodiment of the present application is described below in combination with the sectional view of the display panel. Referring to FIG. 12, which is a sectional view of the display panel according to an embodiment of the present application, the display panel comprises a substrate 200, and a buffer layer 201, an active layer 202, a first gate insulating layer 203, a first gate metal layer (including a gate electrode 204a and a first capacitor electrode 204b), a first gate insulating layer 205, a second gate metal layer (including a second capacitor electrode 206), an interlayer dielectric layer 207, a first source-drain metal layer 208 (including a source electrode and a drain electrode), a passivation layer (PVX) 209, a first planarization layer (PLN1) 210, a second source-drain metal layer 211, a second planarization layer (PLN2) 212, an anode (Anode) 213, a pixel definition layer 214, a light-emitting layer (EL) 215, a cathode (cathode) 216, a first inorganic encapsulation layer (CVD1) 217, an organic encapsulation layer (IJP) 218, a second inorganic encapsulation layer (CVD2) 219, an inorganic insulating layer (buffer) 220, a touch insulation layer (TLD) 221, a touch trace 222, and a planarization layer (OC) 223 arranged in sequence on the substrate 200.

[0089] The anode (Anode) 213, the light-emitting layer (EL) 215, and the cathode (cathode) 216 are used to form a light-emitting unit.

[0090] The active layer 202, the gate electrode 204a, the source electrode, and the drain electrode are used to constitute a thin-film transistor of a drive circuit. The drive circuit is used to drive the light-emitting unit to emit light. The first capacitor electrode 204b and the second capacitor electrode 206 are used to constitute a capacitor of the drive circuit.

[0091] The active layer in the embodiment of the present application can adopt a low-temperature polycrystalline oxide (LTPO) material, i.e., the display panel is an LTPO display panel.

[0092] The first elevation pattern in the above embodiment can be arranged in the same layer and of the same material as at least one of the first gate metal layer, the second gate metal layer, the first source-drain metal layer, and the second source-drain metal layer.

[0093] The second elevation pattern in the above embodiment can also be arranged in the same layer and of the same material as at least one of the first gate metal layer, the second gate metal layer, the first source-drain metal layer, and the second source-drain metal layer.

[0094] Referring to FIG. 13, the embodiment of the present application further provides a manufacturing method of a display panel, which is used to manufacture the display panel described in any of the above embodiments. The manufacturing method comprises:

[0095] Step S1: providing a substrate substrate;

[0096] Step S2: forming at least one insulating layer on the substrate substrate;

[0097] Step S3: forming an isolation column on a side of the insulating layer away from the substrate substrate, a side surface of the isolation column being formed with an undercut structure;

[0098] Step S4: forming a light-emitting functional layer on a side of the isolation column away from the substrate substrate, the light-emitting functional layer being disconnected at a position of the undercut structure;

[0099] Step S5: forming an inorganic encapsulation layer on a side of the light-emitting functional layer away from the substrate substrate;

[0100] In the at least one insulating layer, a first insulating layer is located on a surface of a first region where the isolation column is located, and a surface height of the first region is lower than a surface height of a second region on both sides of the isolation column, and the first insulating layer is the insulating layer closest to the isolation column in the at least one insulating layer.

[0101] In the embodiment of the present application, the isolation column with the undercut structure can disconnect the light-emitting functional layer, and the section formed by cutting the light-emitting functional layer will not affect the light-emitting functional layer in the display region even if it is invaded by water and oxygen, so that the effect of isolating water and oxygen can be achieved. In addition, the surface height of the first region where the isolation column is located is lower than the surface height of the second region on both sides of the isolation column, so that the height difference between the light-emitting functional layer in the first region where the isolation column is located and the light-emitting functional layer in the second region on both sides of the isolation column is small, so that more accumulation will be generated at the interface between the first region and the second region when the inorganic encapsulation layer is formed, and the film layer of the inorganic encapsulation layer at the position of the undercut structure will be more dense, so that the inorganic encapsulation layer is not easy to crack at the position of the undercut structure, further preventing water and oxygen from invading, and thus improving the display effect.

[0102] Optionally, the display panel has a display region, a cutout region located inside the display region, and a transition region located between the cutout region and the display region; the isolation column is located in the transition region and surrounds the cutout region.

[0103] Optionally, the manufacturing method of the display panel in the embodiment of the present application further comprises:

[0104] forming a first elevation pattern, the first elevation pattern being arranged in the second region on both sides of the isolation column.

[0105] Optionally, the display device in the embodiment of the present application comprises a plurality of insulating layers; the first elevation pattern is arranged between the plurality of insulating layers.

[0106] Optionally, the first bump pattern comprises at least one layer of gate metal pattern, and / or the first bump pattern comprises at least one layer of source-drain metal pattern.

[0107] Optionally, the manufacturing method of the display panel further comprises:

[0108] forming a second bump pattern, the second bump pattern is arranged on one side of the isolation column close to the substrate substrate, located in the first area; the height of the second bump pattern is lower than the height of the first bump pattern.

[0109] Optionally, at least one of the insulating layers forms an etching groove in the first area where the isolation column is located, and the orthographic projection of the isolation column on the substrate substrate is located in the orthographic projection area of the etching groove on the substrate substrate.

[0110] Optionally, the first insulating layer forms the etching groove.

[0111] Optionally, the isolation column comprises a first film layer, a second film layer and a third film layer arranged in sequence in the direction away from the substrate substrate, the side surface of the second film layer is inwardly recessed relative to the first film layer and the third film layer, forming the undercut structure.

[0112] Alternatively, the isolation column comprises a fourth film layer, a first film layer, a second film layer and a third film layer arranged in sequence in the direction away from the substrate substrate, the side surface of the second film layer is inwardly recessed relative to the first film layer and the third film layer, forming the undercut structure.

[0113] Optionally, the isolation column comprises at least one layer of source-drain metal pattern.

[0114] Optionally, the display panel comprises a plurality of isolation columns, the plurality of isolation columns are arranged in sequence and spaced apart from each other in the direction from the edge of the transition area to the display area.

[0115] The embodiment of the present application further provides a display device comprising the display panel of any one of the above embodiments. The display device in the embodiment of the present application can be a mobile phone, a tablet computer, a personal computer, a television, a vehicle-mounted display device, etc.

[0116] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above specific embodiments, the above specific embodiments are only illustrative, not restrictive, and those skilled in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims, all of which belong to the protection of the present application.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate substrate; at least one insulating layer disposed on the substrate substrate; an isolation column disposed on the side of the insulating layer away from the substrate substrate; the side surface of the isolation column is formed with an undercut structure; a light-emitting functional layer disposed on the side of the isolation column away from the substrate substrate and broken at the position of the undercut structure; an inorganic encapsulation layer disposed on the side of the light-emitting functional layer away from the substrate substrate; wherein the surface height of the first insulating layer in the at least one insulating layer in the first area where the isolation column is located is lower than the surface height of the second area on both sides of the isolation column, and the first insulating layer is the insulating layer closest to the isolation column in the at least one insulating layer.

2. The display panel of claim 1, wherein, The display panel has a display area, a cutout area inside the display area, and a transition area between the cutout area and the display area; the isolation column is located in the transition area and is arranged around the cutout area.

3. The display panel of claim 1 or 2, wherein, Further comprising: a first elevation pattern disposed on the second area on both sides of the isolation column.

4. The display panel of claim 3, wherein, The display panel comprises a plurality of insulating layers; the first elevation pattern is disposed between the plurality of insulating layers.

5. The display panel of claim 3, wherein, The first elevation pattern comprises at least one gate metal pattern, and / or the first elevation pattern comprises at least one source / drain metal pattern.

6. The display panel of claim 3, wherein, Further comprising: a second elevation pattern disposed on the side of the isolation column close to the substrate substrate and located in the first area; The height of the second elevation pattern is lower than the height of the first elevation pattern.

7. The display panel of claim 1, wherein At least one of the insulating layers forms an etching groove in the first area where the isolation column is located, and the orthographic projection of the isolation column on the substrate substrate is located in the orthographic projection area of the etching groove on the substrate substrate.

8. The display panel of claim 7, wherein, The first insulating layer forms the etching groove.

9. The display panel of claim 1, wherein, The isolation column comprises a first film layer, a second film layer, and a third film layer arranged in sequence in the direction away from the substrate substrate, and the side surface of the second film layer is inwardly recessed relative to the first film layer and the third film layer to form the undercut structure. Alternatively, the isolation column comprises a fourth film layer, a first film layer, a second film layer, and a third film layer arranged in sequence in the direction away from the substrate substrate, and the side surface of the second film layer is inwardly recessed relative to the first film layer and the third film layer to form the undercut structure.

10. The display panel of claim 1 or 9, wherein, The isolation column comprises at least one source / drain metal pattern.

11. The display panel of claim 2, wherein, The display panel comprises a plurality of isolation columns, which are arranged in sequence and spaced apart from each other from the edge of the transition area to the display area.

12. A manufacturing method of a display panel, comprising: A method for manufacturing the display panel of any one of claims 1-11, the manufacturing method comprising: providing a substrate substrate; forming at least one insulating layer on the substrate substrate; forming an isolation column on the side of the insulating layer away from the substrate substrate, and the side surface of the isolation column is formed with an undercut structure; forming a light-emitting functional layer on the side of the isolation column away from the substrate substrate, and the light-emitting functional layer is broken at the position of the undercut structure; forming an inorganic encapsulation layer on the side of the light-emitting functional layer away from the substrate substrate; The first insulating layer in the at least one insulating layer is located at a surface of the first region where the isolation column is located, and the surface height of the first region is lower than that of the second region on both sides of the isolation column. The first insulating layer is the insulating layer closest to the isolation column in the at least one insulating layer.

13. A display device comprising: The display panel comprises the display panel according to any one of claims 1-11.

Images