Light-emitting panel, preparation method therefor, and display apparatus

Abstract

Provided is a light-emitting panel, comprising: a base substrate; a light-emitting device located on the base substrate; an organic encapsulation layer located on the side of the light-emitting device away from the base substrate; an encapsulation sealant disposed around the organic encapsulation layer; and an encapsulation cover plate located on the sides of the encapsulation sealant layer and the organic encapsulation layer away from the base substrate. The encapsulation sealant comprises a first sealant, a second sealant, and a water-absorbing portion. The first sealant is disposed around the organic encapsulation layer, the water-absorbing portion is disposed around the layer of the first sealant, and the second sealant is disposed around the water-absorbing portion.

Description

Light-emitting panel, preparation method thereof and display device TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular to a light-emitting panel, a preparation method thereof and a display device. BACKGROUND

[0002] Organic light emitting diode (OLED) as a new type of light-emitting device has great application potential in the fields of display and lighting, and thus has attracted strong attention from the academic and industrial circles. In the field of display, OLED has advantages of self-emission, fast response, wide viewing angle, high brightness, bright color, lightness and thinness, etc. compared with liquid crystal display (LCD), and is considered as the next generation of display technology. In the field of lighting, in response to the market demand for OLED light source, the lighting device with passive matrix organic light emitting diode (PMOLED) as light source is gradually accepted by the market, but it has higher requirements for packaging reliability, especially the lighting device applied in the field of vehicle needs to maintain good performance in the high temperature and high humidity test for 2500 hours. How to improve the packaging reliability of OLED device is one of the topics that the researchers of display products are concerned about.

[0003] The above information disclosed in this section is only for understanding the background of the inventive concept of the present disclosure, and thus can contain information that does not constitute the prior art. SUMMARY

[0004] In one aspect, a light-emitting panel is provided, comprising:

[0005] a substrate substrate;

[0006] a light-emitting device located on the substrate substrate;

[0007] an organic encapsulation layer located on a side of the light-emitting device away from the substrate substrate;

[0008] an encapsulation frame glue disposed around the organic encapsulation layer;

[0009] an encapsulation cover plate located on a side of the encapsulation glue layer and the organic encapsulation layer away from the substrate substrate;

[0010] wherein the encapsulation frame glue comprises a first frame glue, a second frame glue and a water absorption part, the first frame glue is disposed around the organic encapsulation layer, the water absorption part is disposed around the first frame glue layer, and the second frame glue is disposed around the water absorption part.

[0011] According to some exemplary embodiments, a width of the first sealant is less than or equal to a width of the second sealant.

[0012] According to some exemplary embodiments, the light emitting panel further comprises an inorganic encapsulation layer between the light emitting device and the organic encapsulation layer, a footprint of the inorganic encapsulation layer on the substrate is covering a footprint of the light emitting device on the substrate.

[0013] According to some exemplary embodiments, a footprint of the first sealant on the substrate is surrounding a footprint of the inorganic encapsulation layer on the substrate.

[0014] According to some exemplary embodiments, a footprint of the first sealant on the substrate is within a footprint of the inorganic encapsulation layer on the substrate.

[0015] According to some exemplary embodiments, a footprint of the second sealant on the substrate is surrounding a footprint of the inorganic encapsulation layer on the substrate.

[0016] According to some exemplary embodiments, a footprint of the water absorbing portion on the substrate is surrounding a footprint of the inorganic encapsulation layer on the substrate.

[0017] According to some exemplary embodiments, a footprint of the water absorbing portion on the substrate is within a footprint of the inorganic encapsulation layer on the substrate.

[0018] According to some exemplary embodiments, a footprint of the water absorbing portion on the substrate is partially overlapping with a footprint of the inorganic encapsulation layer on the substrate.

[0019] According to some exemplary embodiments, a footprint of the second sealant on the substrate is partially overlapping with a footprint of the inorganic encapsulation layer on the substrate.

[0020] According to some exemplary embodiments, a footprint of the first sealant on the substrate is partially overlapping with a footprint of the inorganic encapsulation layer on the substrate.

[0021] According to some exemplary embodiments, a footprint of the first sealant on the substrate is spaced apart from a footprint of the light emitting device on the substrate.

[0022] According to some exemplary embodiments, a water vapor transmission rate of the second sealant is less than or equal to a water vapor transmission rate of the first sealant.

[0023] According to some exemplary embodiments, a distance between the first sealant and the second sealant is less than or equal to a width of the second sealant.

[0024] In yet another aspect, there is provided a display device comprising the light emitting panel as defined in any one of the preceding aspects.

[0025] In yet another aspect, there is provided a method of manufacturing a light emitting panel, comprising the steps of:

[0026] forming a light emitting device on a substrate;

[0027] forming an organic encapsulation layer and an encapsulation frame on a side of the light emitting device distal to the substrate, the encapsulation frame surrounding the organic encapsulation layer, the encapsulation frame comprising a first frame, a second frame, and a water absorbing portion, the first frame surrounding the organic encapsulation layer, the water absorbing portion surrounding the first frame, the second frame surrounding the water absorbing portion, the forming of the encapsulation frame comprising forming a first frame wet film layer, a water absorbing portion, and a second frame wet film layer, the first frame wet film layer having a viscosity greater than a viscosity of the second frame wet film layer, and curing the first frame wet film layer and the second frame wet film layer to obtain the first frame and the second frame; and

[0028] forming an encapsulation cover on a side of the organic encapsulation layer and the encapsulation frame distal to the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0029] Other objects and advantages of the present disclosure will be readily apparent and become more fully understood as the description proceeds, taken in conjunction with the accompanying drawings.

[0030] FIG. 1 schematically illustrates a plan view of a light emitting panel according to some embodiments of the present disclosure.

[0031] FIG. 2 schematically illustrates a cross-sectional view taken along line AA’ in FIG. 1.

[0032] FIG. 3 schematically illustrates a plan view of a light emitting panel according to some embodiments of the present disclosure.

[0033] FIG. 4 schematically illustrates one of the cross-sectional views taken along line BB’ in FIG. 3.

[0034] FIG. 5 schematically illustrates another one of the cross-sectional views taken along line BB’ in FIG. 3.

[0035] FIG. 6 schematically illustrates a surface topography map of a light emitting panel taken by a camera according to some embodiments of the present disclosure.

[0036] FIG. 7 schematically illustrates a plan view of a light emitting panel according to some embodiments of the present disclosure.

[0037] FIG. 8 schematically illustrates one of the cross-sectional views taken along line CC’ in FIG. 7.

[0038] Figure 9 schematically shows a cross-sectional view of a light-emitting panel according to some embodiments of the present disclosure.

[0039] Figure 10 schematically shows a cross-sectional view of a light-emitting panel according to some embodiments of the present disclosure.

[0040] Figure 11 schematically shows a cross-sectional view of a light-emitting panel according to some embodiments of the present disclosure.

[0041] Figure 12 schematically shows a cross-sectional view of a light-emitting panel according to some embodiments of the present disclosure.

[0042] Figure 13 schematically shows a cross-sectional view of a light-emitting panel according to some embodiments of the present disclosure.

[0043] Figure 14 schematically shows a cross-sectional view of a light-emitting panel according to some embodiments of the present disclosure.

[0044] Figure 15 schematically illustrates a flowchart of a method for preparing a light-emitting panel according to some embodiments of the present disclosure.

[0045] Figures 16A-16D schematically illustrate the fabrication process of a light-emitting panel according to some embodiments of the present disclosure.

[0046] It should be noted that, for clarity, the dimensions of layers, structures, or regions in the accompanying drawings used to describe embodiments of this disclosure may be enlarged or reduced; that is, these drawings are not drawn to actual scale. Detailed Implementation

[0047] In the following description, numerous specific details are set forth for illustrative purposes to provide a comprehensive understanding of various exemplary embodiments. However, it will be apparent that various exemplary embodiments may be implemented without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may be different, but not necessarily exclusive. For example, specific shapes, configurations, and characteristics of exemplary embodiments may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0048] In the accompanying drawings, the dimensions and relative dimensions of the elements may be enlarged for clarity and / or descriptive purposes. Thus, the dimensions and relative dimensions of the individual elements are not necessarily limited to those shown in the drawings. When exemplary embodiments can be implemented differently, the specific process sequence may be performed differently than the order described. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of description. Furthermore, the same reference numerals denote the same elements.

[0049] When an element is referred to as being "on" another element, "connected to" another element, or "coupled to" another element, it can be directly on, directly connected to, or directly coupled to the other element or intervening elements can be present. In contrast, when an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element, there are no intervening elements present. Other terms of relationship between elements, such as "between," "directly between," "adjacent," "directly adjacent," or "on" versus "directly on" and the like, are to be interpreted in a like fashion. In addition, the term "connected" can refer to physical or electrical connection, communication connection, and / or fluid connection. Furthermore, the X-axis, Y-axis and Z-axis are not limited to three axes of a rectangular coordinate system, and can be interpreted in a wider sense. For example, the X-axis, Y-axis and Z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purposes of the present disclosure, "at least one of X, Y and Z" and "at least one selected from the group consisting of X, Y and Z" can be interpreted to be any one of X, Y and Z, or any combination of any two or more of X, Y and Z, such as XYZ, XY, YZ and XZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated items.

[0050] It will be understood that, although the terms first, second, etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of example embodiments.

[0051] FIG. 1 schematically illustrates a plan view of a light emitting panel according to some embodiments of the present disclosure. FIG. 2 schematically illustrates a cross-sectional view taken along line AA' in FIG. 1.

[0052] With reference to FIGS. 1 and 2 in conjunction, the light emitting panel includes a substrate 100, a light emitting device 200 on the substrate 100, an inorganic encapsulation layer 300 on a side of the light emitting device 200 distal to the substrate 100, an organic encapsulation layer 400 on a side of the inorganic encapsulation layer 300 distal to the substrate 100, an encapsulation frame 500 surrounding the organic encapsulation layer 400, and an encapsulation cover 600 on a side of the encapsulation frame 500 and the organic encapsulation layer 400 distal to the substrate 100.

[0053] In the light-emitting panel, the orthographic projection of the inorganic encapsulation layer 300 on the substrate 100 completely covers the orthographic projection of the light-emitting device 200 on the substrate 100, the orthographic projection of the organic encapsulation layer 400 on the substrate 100 completely covers the orthographic projection of the inorganic encapsulation layer 300 on the substrate 100, and the orthographic projection of the encapsulation frame 500 on the substrate 100 surrounds the orthographic projection of the organic encapsulation layer 400 on the substrate 100, i.e., the inorganic encapsulation layer 300 completely covers the light-emitting device 200, the organic encapsulation layer 400 completely covers the inorganic encapsulation layer 300, the encapsulation frame 500 is arranged in a continuous annular shape around the organic encapsulation layer 400, one side of the encapsulation frame 500 is in contact with the substrate 100, and the other side is in contact with the encapsulation cover 600, and the light-emitting device 200 covered by the inorganic encapsulation layer 300 and the organic encapsulation layer 400 is located in a space enclosed by the encapsulation frame 500, the substrate 100, and the encapsulation cover 600, thereby achieving encapsulation of the light-emitting device 200.

[0054] It is found through tests that the light-emitting panel has a problem of light-emitting performance degradation when subjected to reliability tests in a high-temperature and high-humidity environment. The inventors have found that the cause of the problem is that the encapsulation structure of the light-emitting panel has poor water vapor blocking effect, and water vapor still invades from the encapsulation frame 500 and through the gap between the encapsulation frame 500 and the substrate 100 or the encapsulation cover 600, and then invades into the light-emitting device 200, thereby affecting the light-emitting performance of the light-emitting device 200. In order to solve the problem, the inventors have further improved the encapsulation structure of the light-emitting panel, which will be described in detail later.

[0055] FIG. 3 schematically shows a plan view of a light-emitting panel according to some embodiments of the present disclosure. FIG. 4 schematically shows a cross-sectional view taken along line BB’ in FIG. 3.

[0056] With reference to FIGS. 3 and 4, the light-emitting panel includes a substrate 100, a light-emitting device 200 located on the substrate 100, an inorganic encapsulation layer 300 located on a side of the light-emitting device 200 away from the substrate 100, an organic encapsulation layer 400 located on a side of the inorganic encapsulation layer 300 away from the substrate 100, an encapsulation frame 500 arranged around the organic encapsulation layer 400, and an encapsulation cover 600 located on a side of the encapsulation frame 500 and the organic encapsulation layer 400 away from the substrate 100. The encapsulation frame 500 includes an encapsulation frame body 540 and a water absorption portion 520, the water absorption portion 520 is arranged around the organic encapsulation layer 400, and the encapsulation frame body 540 is arranged around the water absorption portion 520.

[0057] In the light emitting panel, the orthographic projection of the inorganic encapsulation layer 300 on the substrate 100 completely covers the orthographic projection of the light emitting device 200 on the substrate 100, the orthographic projection of the organic encapsulation layer 400 on the substrate 100 completely covers the orthographic projection of the inorganic encapsulation layer 300 on the substrate 100, and the orthographic projection of the encapsulation frame 500 on the substrate 100 surrounds the orthographic projection of the organic encapsulation layer 400 on the substrate 100, i.e., the inorganic encapsulation layer 300 completely covers the light emitting device 200, the organic encapsulation layer 400 completely covers the inorganic encapsulation layer 300, the encapsulation frame 500 is continuously annularly arranged around the organic encapsulation layer 400, one side of the encapsulation frame 500 is in contact with the substrate 100, and the other side is in contact with the encapsulation cover plate 600, and the light emitting device 200 covered by the inorganic encapsulation layer 300 and the organic encapsulation layer 400 is located in the space enclosed by the encapsulation frame 500, the substrate 100 and the encapsulation cover plate 600, thereby realizing the encapsulation of the light emitting device 200.

[0058] In order to improve the encapsulation reliability of the encapsulation structure, the encapsulation frame 500 is further provided to include an encapsulation frame body 540 and a water absorption portion 520, i.e., the water absorption portion 520 in the form of a ring is arranged between the encapsulation frame body 540 and the organic encapsulation layer 400, and the water absorption portion 520 is continuously annularly arranged around the organic encapsulation layer 400. The water absorption portion 520 can effectively absorb the water vapor invading from the encapsulation frame 500 or through the gap between the encapsulation frame 500 and the substrate 100 or the encapsulation cover plate 600, thereby avoiding the further invasion of the water vapor into the light emitting device 200.

[0059] According to some exemplary embodiments, the water absorption portion 520 can include a desiccant and a water absorption portion body, and the desiccant is uniformly doped in the water absorption portion body.

[0060] For example, the material of the desiccant includes at least one of an oxide desiccant and a chloride desiccant. For another example, the material of the oxide desiccant includes at least one of calcium oxide and aluminum oxide, and the material of the chloride desiccant includes at least one of zinc chloride, calcium chloride, tin chloride and antimony chloride.

[0061] For example, the material of the water absorption portion body includes a water absorption type resin material. For another example, the water absorption type resin material includes at least one of polyacrylate, polyvinyl alcohol, polyalkylene oxide, polyurethane, general-purpose acrylate and casein.

[0062] FIG. 5 schematically shows another cross-sectional view taken along the line BB' in FIG. 3. FIG. 6 schematically shows a surface topography map of a light emitting panel taken by a camera according to some embodiments of the present disclosure.

[0063] The inventors have found that, in order to ensure the water absorption effect of the water absorption portion 520, the water absorption portion 520 is in a liquid state with a certain viscosity, i.e., has a certain fluidity, so that there is interaction between the organic encapsulation layer 400 and the water absorption portion 520 during the preparation of the light-emitting panel, thereby affecting the shape of the water absorption portion 520. For example, when too much glue is applied during the formation of the organic encapsulation layer 400, the organic encapsulation layer 400 will overflow and push the water absorption portion 520 to flow away from the organic encapsulation layer 400. For another example, when too little glue is applied during the formation of the organic encapsulation layer 400, the water absorption portion 520 will flow towards the organic encapsulation layer 400. Referring to FIG. 6, the water absorption portion 520 after flowing presents an irregular ring structure, with a wider width in some areas and a narrower width in other areas. Referring to FIG. 5, whether the water absorption portion 520 flows towards or away from the organic encapsulation layer 400, it will cause a gap between at least a part of the water absorption portion 520 and the substrate 100 or the encapsulation cover plate 600, so that the water absorption portion 520 cannot form a closed space with the substrate 100 and the encapsulation cover plate 600, and water vapor can still enter the light-emitting device 200 through the gap between the water absorption portion 520 and the substrate 100 or the encapsulation cover plate 600, thereby causing encapsulation failure. In order to solve this problem, the inventors have further improved the encapsulation structure of the light-emitting panel, which will be described in detail later.

[0064] FIG. 7 schematically shows a plan view of a light-emitting panel according to some embodiments of the present disclosure. FIG. 8 schematically shows a cross-sectional view taken along line CC’ in FIG. 7.

[0065] With reference to FIGS. 7 and 8, the light-emitting panel includes a substrate 100, a light-emitting device 200 on the substrate 100, an inorganic encapsulation layer 300 on the light-emitting device 200 away from the substrate 100, an organic encapsulation layer 400 on the inorganic encapsulation layer 300 away from the substrate 100, an encapsulation frame glue 500 surrounding the organic encapsulation layer 400, and an encapsulation cover plate 600 on the encapsulation frame glue 500 and the organic encapsulation layer 400 away from the substrate 100. The encapsulation frame glue 500 includes a first frame glue 510, a second frame glue 530, and a water absorption portion 520. The first frame glue 510 surrounds the organic encapsulation layer 400, the water absorption portion 520 surrounds the first frame glue 510, and the second frame glue 530 surrounds the water absorption portion 520.

[0066] In the light-emitting panel, the orthographic projection of the inorganic encapsulation layer 300 on the substrate substrate 100 completely covers the orthographic projection of the light-emitting device 200 on the substrate substrate 100, the orthographic projection of the organic encapsulation layer 400 on the substrate substrate 100 completely covers the orthographic projection of the inorganic encapsulation layer 300 on the substrate substrate 100, and the orthographic projection of the encapsulation frame glue 500 on the substrate substrate 100 surrounds the orthographic projection of the organic encapsulation layer 400 on the substrate substrate 100, that is, the inorganic encapsulation layer 300 completely covers the light-emitting device 200, the organic encapsulation layer 400 completely covers the inorganic encapsulation layer 300, the encapsulation frame glue 500 is continuously annularly arranged around the organic encapsulation layer 400, one side of the encapsulation frame glue 500 is in contact with the substrate substrate 100, and the other side is in contact with the encapsulation cover plate 600, and the light-emitting device 200 covered by the inorganic encapsulation layer 300 and the organic encapsulation layer 400 is located in the space enclosed by the encapsulation frame glue 500, the substrate substrate 100 and the encapsulation cover plate 600, thereby realizing the encapsulation of the light-emitting device 200.

[0067] In order to improve the encapsulation reliability of the encapsulation structure in the light-emitting panel, the encapsulation frame glue 500 is further provided to include a first frame glue 510, a second frame glue 530 and a water absorption part 520, that is, the first encapsulation frame glue 500 and the second encapsulation frame glue 500 are arranged around the organic encapsulation layer 400, and the water absorption part 520 is arranged between the first encapsulation frame glue 500 and the second encapsulation frame glue 500, the first encapsulation frame glue 500 can act as a barrier structure between the organic encapsulation layer 400 and the water absorption part 520, and in the preparation process of the light-emitting panel, the problem of the flow of the water absorption part 520 caused by the interaction between the organic encapsulation layer 400 and the water absorption part 520 can be effectively avoided, and at the same time, due to the existence of the first encapsulation frame glue 500, the process window of the organic encapsulation layer 400 can be increased, that is, the preparation process difficulty of the organic encapsulation layer 400 is reduced, and the preparation process yield of the organic encapsulation layer 400 is improved. In addition, the first encapsulation frame glue 500 and the second encapsulation frame glue 500 are respectively located on the two sides of the water absorption part 520, which can further limit the flow of the water absorption part 520.

[0068] According to some exemplary embodiments, in combination with reference to FIGS. 7 and 8, the orthographic projection of the first frame glue 510 on the substrate substrate 100 is a continuous annulus, the orthographic projection of the water absorption part 520 on the substrate substrate 100 is a continuous annulus, and the orthographic projection of the second frame glue 530 on the substrate substrate 100 is a continuous annulus, that is, the first frame glue 510 is continuously arranged around the organic encapsulation layer 400, the water absorption part 520 is continuously arranged around the first frame glue 510, and the second frame glue 530 is continuously arranged around the water absorption part 520. At the same time, since the first frame glue 510 and the second frame glue 530 effectively limit the flow of the water absorption part 520, the two sides of the water absorption part 520 are respectively in contact with the substrate substrate 100 and the encapsulation cover plate 600, and the water absorption part 520 can effectively absorb the invading water vapor to avoid further invasion of the water vapor into the light-emitting device 200.

[0069] It should be noted that in the structure shown in FIG. 7 and FIG. 8, the organic encapsulation layer 400 is in contact with the first frame adhesive 510, the first frame adhesive 510 is in contact with the water absorption portion 520, and the water absorption portion 520 is in contact with the second frame adhesive 530. However, in actual products, due to the limitation of the preparation precision of each structure, there can be a certain gap between the organic encapsulation layer 400 and the first frame adhesive 510, a certain gap between the first frame adhesive 510 and the water absorption portion 520, and a certain gap between the water absorption portion 520 and the second frame adhesive 530, for example, the gap is less than or equal to 0.2 mm.

[0070] According to some exemplary embodiments, the width of the first frame adhesive 510 is W1, and the width of the second frame adhesive 530 is W2, and W1 is less than or equal to W2. Since the main function of the first frame adhesive 510 is to block the contact between the water absorption portion 520 and the organic encapsulation layer 400, and the main function of the second frame adhesive 530 is to block the water vapor in the environment from invading the light-emitting panel, the width of the second frame adhesive 530 can be set to be slightly wider, and the width of the first frame adhesive 510 can be set to be slightly narrower, so that the frame of the light-emitting panel can be narrowed on the basis of ensuring the reliability of the encapsulation.

[0071] It should be noted that the width of the first frame adhesive 510 is understood as the width of the orthographic projection of the first frame adhesive 510 on the substrate 100 along the direction perpendicular to the extension direction of the first frame adhesive 510, and similarly, the width of the second frame adhesive 530 is understood as the width of the orthographic projection of the second frame adhesive 530 on the substrate 100 along the direction perpendicular to the extension direction of the second frame adhesive 530.

[0072] In addition, due to the influence of factors such as preparation process precision, the width of the first frame adhesive 510 at different positions has certain differences, and the width of the second frame adhesive 530 at different positions has certain differences, and the width W1 of the first frame adhesive 510 is less than or equal to the width W2 of the second frame adhesive 530. It should be understood that the minimum value of the width of the first frame adhesive 510 is less than or equal to the minimum value of the width of the second frame adhesive 530, and / or the maximum value of the width of the first frame adhesive 510 is less than or equal to the maximum value of the width of the second frame adhesive 530.

[0073] According to some exemplary embodiments, the ratio of the width W2 of the second frame adhesive 530 to the width W1 of the first frame adhesive 510 is less than or equal to 3. The inventors have found through research that setting the ratio of W2 to W1 to be less than or equal to 3 can ensure better encapsulation reliability. For example, the width W2 of the second frame adhesive 530 is in the range of 1 mm to 5 mm.

[0074] According to some exemplary embodiments, the distance between the first frame glue 510 and the second frame glue 530 is G1, and G1 is less than or equal to W2. By setting the distance between the first frame glue 510 and the second frame glue 530 to be small, the flow of the water absorption part 520 can be effectively displayed, so that both sides of the water absorption part 520 can be in contact with the substrate 100 and the packaging cover plate 600, and it is also beneficial to make the light-emitting panel have a narrower frame.

[0075] In addition, due to the influence of factors such as preparation process precision, the distance between the first frame glue 510 and the second frame glue 530 at different positions has certain differences, and the distance G1 between the first frame glue 510 and the second frame glue 530 is less than or equal to the width W2 of the second frame glue 530. It should be understood that the minimum value of the distance between the first frame glue 510 and the second frame glue 530 is less than or equal to the minimum value of the width of the second frame glue 530, and / or the maximum value of the distance between the first frame glue 510 and the second frame glue 530 is less than or equal to the maximum value of the width of the second frame glue 530.

[0076] According to some exemplary embodiments, the water vapor transmission rate of the second frame glue 530 is less than or equal to the water vapor transmission rate of the first frame glue 510. The water vapor transmission rate of the second frame glue 530 plays a more critical role in the packaging reliability of the light-emitting panel, so the water vapor transmission rate of the second frame glue 530 can be set to be smaller, thereby ensuring better packaging reliability. The water vapor transmission rate of the first frame glue 510 and the second frame glue 530 depends on factors such as material and thickness. The stronger the water vapor blocking ability of the material and the thicker the thickness of the frame glue, the smaller the water vapor transmission rate. The materials of the first frame glue 510 and the second frame glue 530 can be the same or different. When the materials of the first frame glue 510 and the second frame glue 530 are different, the second frame glue 530 can use a material with stronger water vapor blocking ability.

[0077] It should be noted that the water vapor transmission rate of the first frame glue 510 is understood as the weight of water vapor that penetrates from the side of the first frame glue 510 away from the light-emitting device 200 to the side close to the light-emitting device 200 under certain time, temperature and humidity conditions. Similarly, the water vapor transmission rate of the second frame glue 530 is understood as the weight of water vapor that penetrates from the side of the second frame glue 530 away from the light-emitting device 200 to the side close to the light-emitting device 200 under certain time, temperature and humidity conditions.

[0078] According to some exemplary embodiments, the orthographic projection of the first frame glue 510 on the substrate 100 is spaced apart from the orthographic projection of the light-emitting device 200 on the substrate 100, and the orthographic projection of the first frame glue 510 on the substrate 100 surrounds the outside of the light-emitting device 200, avoiding the first frame glue 510 blocking the emitted light of the light-emitting device 200.

[0079] According to some exemplary embodiments, the substrate 100 can be a rigid substrate, which can include, for example, a glass substrate, an Ultra-Thin Glass (UTG), a Polymethyl Methacrylate (PMMA) substrate, a silicon substrate, or the like. In this case, the material of the encapsulation cover plate 600 can be consistent with that of the substrate 100, i.e., the encapsulation cover plate 600 can be a rigid cover plate, so that the light-emitting panel can be a rigid light-emitting panel. For example, when applied to an automobile tail light, the substrate 100 can be a glass substrate, and the encapsulation cover plate 600 can be a glass cover plate.

[0080] According to some exemplary embodiments, the substrate 100 can also be a flexible substrate, which can include, for example, a Polyethylene Terephthalate (PET) substrate, a Polyethylene naphthalene-2,6-dicarboxylate (PEN) substrate, a Colorless Polyimide (CPI) substrate, or the like. In this case, the material of the encapsulation cover plate 600 can be consistent with that of the substrate 100, i.e., the encapsulation cover plate 600 can be a flexible cover plate, so that the light-emitting panel can be a flexible light-emitting panel. For example, the substrate 100 can be a Colorless Polyimide substrate, and the encapsulation cover plate 600 can be a Colorless Polyimide cover plate.

[0081] According to some exemplary embodiments, the material of the inorganic encapsulation layer 300 can include at least one of silicon nitride or silicon oxide, and the material of the organic encapsulation layer 400 can include a transparent organic resin material.

[0082] According to some exemplary embodiments, one or more light-emitting devices 200 can be disposed on the substrate 100, and the actual size, shape, and arrangement of the light-emitting devices 200 can be set according to the application scenario of the light-emitting panel.

[0083] According to some exemplary embodiments, the light emitting panel is applied to a lighting device, only one light emitting device 200 can be arranged, and the area of the light emitting device 200 is set according to the required light emitting area. When the light emitting device 200 is in an on state, the entire light emitting panel is lit up, and when the light emitting device 200 is in an off state, the entire light emitting panel is turned off. For example, a plurality of light emitting devices 200 can also be arranged on the substrate 100 in a spaced distribution, and the switching of each light emitting device 200 is independent of each other. In use, different light emitting devices 200 can be configured to be independently controlled to light up, so as to achieve some special lighting effects, for example, the light emitting panel can be controlled to display a preset pattern. The light emitting colors of the plurality of light emitting devices 200 can be the same, and the light emitting colors are set according to the actual application lighting scene, for example, when applied to a tail lamp, each light emitting device 200 can emit red light. Of course, in some lighting scenes, the light emitting colors of each light emitting device 200 can also be different, for example, some light emitting devices 200 emit red light, and some light emitting devices 200 emit white light, and the embodiments of the present disclosure are not limited thereto.

[0084] According to some exemplary embodiments, the light emitting panel can include a plurality of light emitting areas, and the shape, size, arrangement, number of light emitting devices 200 contained, and light emitting color of the light emitting device 200 of each light emitting area can be set according to the needs of the actual application scene. For example, the shape of the light emitting area can be a triangle, a polygon, a rectangle, a circle, an ellipse, a regular pentagon, or a regular hexagon, and the embodiments of the present disclosure are not limited thereto.

[0085] According to some exemplary embodiments, the light emitting panel is applied to a display device, and a plurality of light emitting devices 200 can be arranged on the substrate 100 in a spaced distribution. At this time, the light emitting panel includes a plurality of pixels arranged in an array, each pixel includes a plurality of sub-pixels, and each sub-pixel can display a single color, such as a red sub-pixel displaying red, a green sub-pixel displaying green, and a blue sub-pixel displaying blue. The brightness (gray scale) of the sub-pixels of different colors in each pixel can be adjusted, and a variety of color displays can be achieved through color combination and superposition, so that full-color display of the light emitting panel can be achieved through line-by-line scanning. For example, the red sub-pixel can include a light emitting device 200 for emitting red light, the green sub-pixel can include a light emitting device 200 for emitting green light, and the blue sub-pixel can include a light emitting device 200 for emitting red light.

[0086] According to some exemplary embodiments, the light emitting device 200 can be OLED or QLED (Quantum Dot Light Emitting Diodes), and the embodiments of the present disclosure are not limited thereto.

[0087] According to some exemplary embodiments, the light emitting device 200 can include a first electrode on the substrate 100, a light emitting functional layer on the first electrode away from the substrate 100, and a second electrode on the light emitting functional layer away from the substrate 100. For example, taking the OLED as an example, the first electrode can be used as an anode, the second electrode can be used as a cathode, and the light emitting functional layer can include an organic light emitting material layer, and at least one of a hole injection layer, a hole transport layer and an electron blocking layer arranged between the first electrode and the organic light emitting material layer, and at least one of an electron injection layer, an electron transport layer and a hole blocking layer arranged between the second electrode and the organic light emitting material layer, which are arranged according to actual needs, and the embodiments of the present disclosure are not limited thereto.

[0088] According to some exemplary embodiments, the first electrode can be a reflective electrode, and the second electrode can be a transparent electrode. For example, the second electrode can be a transparent conductive oxide film, and the first electrode can be a metal film or a composite film layer structure of a transparent conductive oxide film / metal film / transparent conductive oxide film.

[0089] According to some exemplary embodiments, referring to FIG. 8, the normal projection of the first frame glue 510 on the substrate 100 surrounds the normal projection of the inorganic encapsulation layer 300 on the substrate 100, the normal projection of the water absorption part 520 on the substrate 100 surrounds the normal projection of the first frame glue 510 on the substrate 100, and the normal projection of the second frame glue 530 on the substrate 100 surrounds the normal projection of the water absorption part 520 on the substrate 100. The two sides of the first frame glue 510, the water absorption part 520 and the second frame glue 530 are in contact with the substrate 100 and the encapsulation cover plate 600 respectively and have high adhesion, which can effectively block the invasion of water vapor in the environment into the light emitting panel.

[0090] FIG. 9 schematically shows a cross-sectional view of a light emitting panel according to some embodiments of the present disclosure.

[0091] According to some exemplary embodiments, referring to FIG. 9, the orthogonal projection of the first frame adhesive 510 on the substrate 100 partially overlaps the orthogonal projection of the inorganic encapsulation layer 300 on the substrate 100, the orthogonal projection of the water absorption portion 520 on the substrate 100 surrounds the orthogonal projection of the first frame adhesive 510 on the substrate 100 and is spaced apart from the orthogonal projection of the inorganic encapsulation layer 300 on the substrate 100, and the orthogonal projection of the second frame adhesive 530 on the substrate 100 surrounds the orthogonal projection of the water absorption portion 520 on the substrate 100. One side of the first frame adhesive 510 is in contact with the encapsulation cover plate 600, and the other side is in contact with the substrate 100, the side of the inorganic encapsulation layer 300 intersecting the substrate 100, and the side of the inorganic encapsulation layer 300 away from the substrate 100, one side of the water absorption portion 520 is in contact with the substrate 100 and the other side is in contact with the encapsulation cover plate 600, and one side of the second frame adhesive 530 is in contact with the substrate 100 and the other side is in contact with the encapsulation cover plate 600.

[0092] With this arrangement, it is beneficial to further narrow the frame of the light emitting panel, and in addition, since part of the first frame adhesive 510 is located between the substrate 100 and the encapsulation cover plate 600, and part is located between the inorganic encapsulation layer 300 and the encapsulation cover plate 600, one side of the first frame adhesive 510 is in contact with the surface of the substrate 100 and the surface of the inorganic encapsulation layer 300 at the same time, the contact area is larger, and the length of the intrusion path of the water vapor and the other side of the first frame adhesive 510 away from the light emitting device 200 to the side close to the light emitting device 200 can be improved.

[0093] FIG. 10 schematically shows a cross-sectional view of a light emitting panel according to some embodiments of the present disclosure.

[0094] According to some exemplary embodiments, referring to FIG. 10, the orthogonal projection of the first frame adhesive 510 on the substrate 100 is located within the orthogonal projection of the inorganic encapsulation layer 300 on the substrate 100, the orthogonal projection of the water absorption portion 520 on the substrate 100 surrounds the orthogonal projection of the inorganic encapsulation layer 300 on the substrate 100, and the orthogonal projection of the second frame adhesive 530 on the substrate 100 surrounds the orthogonal projection of the water absorption portion 520 on the substrate 100. One side of the first frame adhesive 510 is in contact with the encapsulation cover plate 600 and the other side is in contact with the inorganic encapsulation layer 300, one side of the water absorption portion 520 is in contact with the substrate 100 and the other side is in contact with the encapsulation cover plate 600, and one side of the second frame adhesive 530 is in contact with the substrate 100 and the other side is in contact with the encapsulation cover plate 600. With this arrangement, it is beneficial to further narrow the frame of the light emitting panel.

[0095] FIG. 11 schematically shows a cross-sectional view of a light emitting panel according to some embodiments of the present disclosure.

[0096] According to some exemplary embodiments, referring to FIG. 11, the orthographic projection of the first frame adhesive 510 on the substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the substrate 100, the orthographic projection of the water absorption portion 520 on the substrate 100 partially overlaps the orthographic projection of the inorganic encapsulation layer 300 on the substrate 100, and the orthographic projection of the second frame adhesive 530 on the substrate 100 surrounds the orthographic projection of the water absorption portion 520 on the substrate 100 and is spaced apart from the orthographic projection of the inorganic encapsulation layer 300 on the substrate 100. One side of the first frame adhesive 510 is in contact with the inorganic encapsulation layer 300 and the other side is in contact with the encapsulation cover plate 600, one side of the second frame adhesive 530 is in contact with the substrate 100 and the other side is in contact with the encapsulation cover plate 600, and one side of the water absorption portion 520 is in contact with the encapsulation cover plate 600 and the other side is in contact with the substrate 100, the side of the inorganic encapsulation layer 300 intersecting the substrate 100, and the side of the inorganic encapsulation layer 300 away from the substrate 100.

[0097] In the light emitting panel, the orthographic projection of the first frame adhesive 510 on the substrate 100 is spaced apart from the light emitting device 200, the orthographic projection of the first frame adhesive 510 on the substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the substrate 100, and the orthographic projection of the water absorption portion 520 on the substrate 100 partially overlaps the orthographic projection of the inorganic encapsulation layer 300 on the substrate 100, i.e., the width W3 of the portion of the inorganic encapsulation layer 300 located outside the light emitting device 200 (the width of the portion of the inorganic encapsulation layer 300 not overlapping the projection of the light emitting device 200) is increased, which is beneficial to further improve the packaging reliability of the light emitting panel without increasing the frame of the light emitting panel.

[0098] FIG. 12 schematically shows a cross-sectional view of a light emitting panel according to some embodiments of the present disclosure.

[0099] According to some exemplary embodiments, referring to FIG. 12, the orthographic projection of the first frame adhesive 510 on the substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the substrate 100, the orthographic projection of the water absorption portion 520 on the substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the substrate 100, and the orthographic projection of the second frame adhesive 530 on the substrate 100 surrounds the orthographic projection of the inorganic encapsulation layer 300 on the substrate 100. One side of the first frame adhesive 510 is in contact with the inorganic encapsulation layer 300 and the other side is in contact with the encapsulation cover plate 600, one side of the water absorption portion 520 is in contact with the inorganic encapsulation layer 300 and the other side is in contact with the encapsulation cover plate 600, and one side of the second frame adhesive 530 is in contact with the substrate 100 and the other side is in contact with the encapsulation cover plate 600.

[0100] In the light emitting panel, the water absorption part 520 is located between the inorganic encapsulation layer 300 and the encapsulation cover plate 600, the height of the water absorption part 520 perpendicular to the light emitting surface of the light emitting device 200 is low, which can further reduce the flowability of the water absorption part 520, and in addition, the width of the inorganic encapsulation layer 300 located at the outer side of the light emitting device 200 can be further increased, which is beneficial to further improve the packaging reliability of the light emitting panel without increasing the frame of the light emitting panel.

[0101] FIG. 13 schematically shows a cross-sectional view of a light emitting panel according to some embodiments of the present disclosure.

[0102] According to some exemplary embodiments, referring to FIG. 13, the orthographic projection of the first frame glue 510 on the substrate substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the substrate substrate 100, the orthographic projection of the water absorption part 520 on the substrate substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the substrate substrate 100, and the orthographic projection of the second frame glue 530 on the substrate substrate 100 partially overlaps with the orthographic projection of the inorganic encapsulation layer 300 on the substrate substrate 100. One side of the first frame glue 510 is in contact with the inorganic encapsulation layer 300 and the other side is in contact with the encapsulation cover plate 600, one side of the water absorption part 520 is in contact with the inorganic encapsulation layer 300 and the other side is in contact with the encapsulation cover plate 600, and one side of the second frame glue 530 is in contact with the encapsulation cover plate 600 and the other side is in contact with the substrate substrate 100, the side of the inorganic encapsulation layer 300 intersecting the substrate substrate 100, and the side of the inorganic encapsulation layer 300 away from the substrate substrate 100.

[0103] In the light emitting panel, the water absorption part 520 is located between the inorganic encapsulation layer 300 and the encapsulation cover plate 600, the height of the water absorption part 520 perpendicular to the light emitting surface of the light emitting device 200 is low, which can further reduce the flowability of the water absorption part 520, and in addition, the width of the inorganic encapsulation layer 300 located at the outer side of the light emitting device 200 can be further increased, which is beneficial to further improve the packaging reliability of the light emitting panel without increasing the frame of the light emitting panel, and in addition, since part of the second frame glue 530 is located between the substrate substrate 100 and the encapsulation cover plate 600 and part of the second frame glue 530 is located between the inorganic encapsulation layer 300 and the encapsulation cover plate 600, one side of the second frame glue 530 is in contact with the surface of the substrate substrate 100 and the surface of the inorganic encapsulation layer 300 at the same time, the contact area is large, and the length of the intrusion path of the side of the second frame glue 530 away from the light emitting device 200 to the side close to the light emitting device 200 can be increased.

[0104] FIG. 14 schematically shows a cross-sectional view of a light emitting panel according to some embodiments of the present disclosure.

[0105] According to some exemplary embodiments, referring to FIG. 14, the orthogonal projection of the first frame adhesive 510 on the substrate substrate 100 is located within the orthogonal projection of the inorganic encapsulation layer 300 on the substrate substrate 100, the orthogonal projection of the water absorption portion 520 on the substrate substrate 100 is located within the orthogonal projection of the inorganic encapsulation layer 300 on the substrate substrate 100, and the orthogonal projection of the second frame adhesive 530 on the substrate substrate 100 is located within the orthogonal projection of the inorganic encapsulation layer 300 on the substrate substrate 100. One side of the first frame adhesive 510 is in contact with the inorganic encapsulation layer 300 and the other side is in contact with the encapsulation cover plate 600, one side of the water absorption portion 520 is in contact with the inorganic encapsulation layer 300 and the other side is in contact with the encapsulation cover plate 600, and one side of the second frame adhesive 530 is in contact with the inorganic encapsulation layer 300 and the other side is in contact with the encapsulation cover plate 600.

[0106] In the light-emitting panel, the water absorption portion 520 is located between the inorganic encapsulation layer 300 and the encapsulation cover plate 600, the water absorption portion 520 is vertically lower than the light-emitting surface of the light-emitting device 200, the flowability of the water absorption portion 520 can be further reduced, in addition, the width of the inorganic encapsulation layer 300 on the outer side of the light-emitting device 200 can be further increased, which is beneficial to further improve the encapsulation reliability of the light-emitting panel without increasing the frame of the light-emitting panel.

[0107] FIG. 15 schematically shows a flowchart of a preparation method of a light-emitting panel according to some embodiments of the present disclosure.

[0108] The present disclosure also provides a preparation method of a light-emitting panel, referring to FIG. 15, comprising the following steps.

[0109] In step S10, a light-emitting device is formed on a substrate substrate.

[0110] In step S20, an organic encapsulation layer and an encapsulation frame adhesive are formed on the side of the light-emitting device away from the substrate substrate, the encapsulation frame adhesive surrounds the organic encapsulation layer, the encapsulation frame adhesive comprises a first frame adhesive, a second frame adhesive and a water absorption portion, the first frame adhesive surrounds the organic encapsulation layer, the water absorption portion surrounds the first frame adhesive layer, and the second frame adhesive surrounds the water absorption portion. The encapsulation frame adhesive is formed by forming a first frame adhesive wet film layer, a water absorption portion and a second frame adhesive wet film layer, the viscosity of the first frame adhesive wet film layer is greater than the viscosity of the second frame adhesive wet film layer, and then the first frame adhesive wet film layer and the second frame adhesive wet film layer are cured to obtain the first frame adhesive and the second frame adhesive.

[0111] In step S30, an encapsulation cover plate is formed on the side of the organic encapsulation layer and the encapsulation frame adhesive away from the substrate substrate.

[0112] FIGS. 16A-16D schematically show preparation process diagrams of a preparation method of a light-emitting panel according to some embodiments of the present disclosure.

[0113] Referring to FIG. 16A, a light-emitting device 200 is formed on a substrate substrate 100.

[0114] Referring to FIG. 16B, an inorganic encapsulation layer 300 is formed on the side of the light emitting device 200 away from the substrate 100, and a projection of the inorganic encapsulation layer 300 on the substrate 100 covers a projection of the light emitting device 200 on the substrate 100, i.e., the inorganic encapsulation layer 300 completely covers the light emitting device 200.

[0115] Referring to FIG. 16C, an organic encapsulation layer wet film layer 400a is formed on the side of the inorganic encapsulation layer 300 away from the substrate 100, a first frame adhesive wet film layer 510a is formed around the organic encapsulation layer 400, a water absorption portion 520 is formed around the first frame adhesive wet film layer 510a, and a second frame adhesive wet film layer 530a is formed around the water absorption portion 520.

[0116] For example, a projection of the organic encapsulation layer wet film layer 400a on the substrate 100 covers a projection of the inorganic encapsulation layer 300 on the substrate 100, a projection of the first frame adhesive wet film layer 510a on the substrate 100 surrounds a projection of the organic encapsulation layer wet film layer on the substrate 100, a projection of the water absorption portion 520 on the substrate 100 surrounds a projection of the first frame adhesive wet film layer 510a on the substrate 100, and a projection of the second frame adhesive wet film layer 530a on the substrate 100 surrounds a projection of the water absorption portion 520 on the substrate 100.

[0117] With reference to FIGS. 16C and 16D, the encapsulation cover plate 600 is covered on the side of the organic encapsulation layer wet film layer 400a, the first frame adhesive wet film layer 510a, the water absorption portion 520, and the second frame adhesive wet film layer 530a away from the substrate 100, and a curing process is performed on the organic encapsulation layer wet film layer 400a, the first frame adhesive wet film layer 510a, and the second frame adhesive wet film layer 530a, so that the organic encapsulation layer wet film layer 400a is cured into the organic encapsulation layer 400, the first frame adhesive wet film layer 510a is cured into the first frame adhesive 510, and the second frame adhesive wet film layer 530a is cured into the second frame adhesive 530.

[0118] According to some exemplary embodiments, the components of the first frame adhesive wet film layer 510a and the second frame adhesive wet film layer 530a can be configured such that the viscosity of the first frame adhesive wet film layer 510a is greater than the viscosity of the second frame adhesive wet film layer 530a, i.e., the first frame adhesive wet film layer 510a has a higher viscosity, so that the first frame adhesive wet film layer 510a can more effectively block the interaction between the water absorption portion 520 and the organic encapsulation layer wet film layer 400a during the preparation of the light emitting panel, and the flow of the water absorption portion 520 during the preparation is avoided as much as possible, so that the prepared light emitting panel has higher encapsulation reliability.

[0119] Some embodiments of the present disclosure further provide a lighting device, which can include the light emitting panel as described above. The specific structure and technical effects of the light emitting panel have been described in detail above, and will not be repeated here. Thus, the lighting device has technical effects corresponding to the beneficial technical effects of the light emitting panel described above, i.e., has better high packaging reliability.

[0120] Some embodiments of the present disclosure further provide an automobile, which includes the lighting device as described above. For example, the lighting device can be a lamp of the automobile, such as a tail lamp of the automobile.

[0121] Some embodiments of the present disclosure further provide a display device, which includes the light emitting panel as described above. The display device can include any device or product having a display function. For example, the display device can be a smart phone, a mobile phone, an e-book reader, a desktop PC, a laptop PC, a netbook PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a digital audio player, a mobile medical device, a camera, a wearable device (e.g., a head-mounted device, electronic clothing, an electronic bracelet, an electronic necklace, an electronic accessory, an electronic tattoo, or a smart watch), a television, etc.

[0122] As used herein, the terms "substantially," "approximately," "about," and other similar terms are used as terms of approximation and not as terms of degree, and they are intended to account for the inherent deviations in measured or calculated values that would be recognized by those of ordinary skill in the art. In view of the process fluctuations, measurement problems and errors associated with measuring a particular quantity (i.e., limitations of the measurement system), etc., "about" or "approximately," as used herein, includes the stated value and means a value that is within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art. For example, "about" can mean within one or more standard deviations, or within ±10% or ±5% of the stated value.

[0123] While some embodiments in accordance with the overall inventive concept of the present disclosure have been illustrated and described, it is to be understood that changes can be made to these embodiments without departing from the principles and spirit of the overall inventive concept of the present disclosure, the scope of which is defined in the claims and their equivalents.

Claims

1. A light emitting panel, wherein, The light-emitting panel comprises: a substrate substrate; a light-emitting device on the substrate substrate; an organic encapsulation layer on a side of the light-emitting device away from the substrate substrate; an encapsulation frame glue disposed around the organic encapsulation layer; an encapsulation cover plate on a side of the encapsulation glue layer and the organic encapsulation layer away from the substrate substrate; wherein the encapsulation frame glue comprises a first frame glue, a second frame glue, and a water absorption part, the first frame glue is disposed around the organic encapsulation layer, the water absorption part is disposed around the first frame glue layer, and the second frame glue is disposed around the water absorption part.

2. The light emitting panel of claim 1, wherein, The width of the first frame glue is less than or equal to the width of the second frame glue.

3. The light emitting panel according to claim 1 or 2, wherein, The light-emitting panel further comprises an inorganic encapsulation layer between the light-emitting device and the organic encapsulation layer, and a projection of the inorganic encapsulation layer on the substrate substrate covers a projection of the light-emitting device on the substrate substrate.

4. The light emitting panel of claim 3, wherein, A projection of the first frame glue on the substrate substrate surrounds a projection of the inorganic encapsulation layer on the substrate substrate.

5. The light emitting panel of claim 3, wherein, The projection of the first frame glue on the substrate substrate is located within the projection of the inorganic encapsulation layer on the substrate substrate.

6. The light emitting panel of claim 5, wherein, A projection of the second frame glue on the substrate substrate surrounds a projection of the inorganic encapsulation layer on the substrate substrate.

7. The light emitting panel of claim 6, wherein, A projection of the water absorption part on the substrate substrate surrounds a projection of the inorganic encapsulation layer on the substrate substrate.

8. The light emitting panel of claim 6, wherein, The projection of the water absorption part on the substrate substrate is located within the projection of the inorganic encapsulation layer on the substrate substrate.

9. The light emitting panel of claim 6, wherein, The projection of the water absorption part on the substrate substrate partially overlaps the projection of the inorganic encapsulation layer on the substrate substrate.

10. The light emitting panel of claim 5, wherein, The projection of the second frame glue on the substrate substrate partially overlaps the projection of the inorganic encapsulation layer on the substrate substrate.

11. The light emitting panel of claim 3, wherein, The projection of the first frame glue on the substrate substrate partially overlaps the projection of the inorganic encapsulation layer on the substrate substrate.

12. The light emitting panel according to any one of claims 1-11, wherein, The projection of the first frame glue on the substrate substrate is spaced apart from a projection of the light-emitting device on the substrate substrate.

13. The light emitting panel according to any one of claims 1-11, wherein, The water vapor transmission rate of the second frame glue is less than or equal to the water vapor transmission rate of the first frame glue.

14. The light emitting panel according to any one of claims 1-11, wherein, The distance between the first frame glue and the second frame glue is less than or equal to the width of the second frame glue.

15. A display device, wherein, The display device comprises the light-emitting panel according to any one of claims 1-14.

16. A method of manufacturing a light emitting panel, wherein, The preparation method comprises the following steps: forming a light-emitting device on a substrate substrate; forming an organic encapsulation layer and an encapsulation frame glue on a side of the light-emitting device away from the substrate substrate, the encapsulation frame glue being disposed around the organic encapsulation layer, the encapsulation frame glue comprising a first frame glue, a second frame glue, and a water absorption part, the first frame glue being disposed around the organic encapsulation layer, the water absorption part being disposed around the first frame glue layer, and the second frame glue being disposed around the water absorption part, the formation of the encapsulation frame glue comprising the formation of a first frame glue wet film layer, a water absorption part, and a second frame glue wet film layer, the viscosity of the first frame glue wet film layer being greater than the viscosity of the second frame glue wet film layer, and the first frame glue wet film layer and the second frame glue wet film layer being solidified to obtain the first frame glue and the second frame glue; and ​ An encapsulation cover plate is formed on a side of the organic encapsulation layer and the encapsulation frame adhesive away from the substrate.

Images