Display panel and display device

Abstract

The present application provides a display panel and a display device. The display panel comprises a substrate, a first conductive layer, a second conductive layer, and a light-emitting device. The first conductive layer is arranged on the substrate and comprises a first electrical contact portion and a second electrical contact portion. The second conductive layer comprises a first electrical connection portion and a second electrical connection portion. The light-emitting device comprises a first electrode and a second electrode. The first electrode is electrically connected to the first electrical contact portion by means of the first electrical connection portion, and the second electrode is electrically connected to the second electrical contact portion by means of the second electrical connection portion.

Description

Display panel and display device

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202422356341.4, filed on September 26, 2024, entitled “Display panel and display device,” the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] The present application belongs to the technical field of display panels, and in particular relates to a display panel and a display device. BACKGROUND

[0004] With the continuous improvement of indoor display application technology, the current display application products cannot fully meet the market application requirements, and there are still some defects in various aspects, which cannot break through the development of technology. The LED (Light-Emitting Diode) full-color display screen overcomes many defects of the above products, and has become the first choice for indoor and outdoor large-screen displays, such as command centers, outdoor advertising screens, conference centers and other occasions.

[0005] Mini LED and Micro-LED display are gradually being developed and formed, and entering the market. With the development of the times, people's requirements for display quality are gradually increasing, and the pitch is getting smaller and smaller. The corresponding LED size must be gradually reduced, and the conventional Mini LED size gradually cannot meet the requirements. When the LED size is reduced to a certain extent, how to improve the yield of LED preparation becomes a research direction in the technical field of display panels. SUMMARY

[0006] The embodiments of the present application provide a display panel and a display device, which can improve the yield of the display panel.

[0007] Embodiments of the first aspect of the present application provide a display panel, the display panel comprising a substrate, a first conductive layer, a second conductive layer, and a light-emitting device. The first conductive layer is disposed on one side of the substrate and comprises a first electrical contact portion and a second electrical contact portion disposed at intervals. The second conductive layer is disposed on a side of the first conductive layer away from the substrate and comprises a first electrical connection portion and a second electrical connection portion. The light-emitting device is disposed on the substrate, and the light-emitting device comprises a first electrode and a second electrode, the first electrode being electrically connected to the first electrical contact portion through the first electrical connection portion, and the second electrode being electrically connected to the second electrical contact portion through the second electrical connection portion. The first electrical connection portion and the second electrical connection portion are provided with a partition portion therebetween, the partition portion comprising a plurality of sub-layers disposed in layers, and at least one of the first electrical contact portion and the second electrical contact portion forming part of a sub-layer.

[0008] Embodiments of the second aspect of the present application provide a display device comprising the display panel of any of the above embodiments.

[0009] In the display panel and the display device of the embodiments of the present application, the display panel comprises a substrate, a first conductive layer, a second conductive layer, and a light-emitting device. The first electrode of the light-emitting device is electrically connected to the first electrical contact portion through the first electrical connection portion, and the second electrode is electrically connected to the second electrical contact portion through the second electrical connection portion. The first electrical connection portion and the second electrical connection portion are provided with a partition portion therebetween, the partition portion can reduce the risk of short circuit caused by contact between the first electrical connection portion and the second electrical connection portion. In addition, one or all of the first electrical contact portion and the second electrical contact portion are used to form part of the partition portion, which is conducive to reducing the risk of etching the conductive film layer in the substrate during etching of the first conductive layer in the patterning process, and improving the yield of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be briefly introduced below. Those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0011] FIG. 1 is a top view structural schematic diagram of a display panel according to an embodiment of the present application;

[0012] FIG. 2 is an enlarged structural schematic diagram of P in FIG. 1;

[0013] FIG. 3 is a cross-sectional structural schematic diagram of A-A in FIG. 2;

[0014] FIG. 4 is another cross-sectional structural schematic diagram of A-A in FIG. 2;

[0015] FIG. 5 is another cross-sectional structural schematic diagram of A-A in FIG. 2;

[0016] FIG. 6 is another cross-sectional structural schematic diagram of A-A in FIG. 2;

[0017] FIG. 7 is another cross-sectional structure schematic view of A-A in FIG. 2;

[0018] FIG. 8 is a top view schematic view of a display device provided by an embodiment of the present application.

[0019] Label description: 100, display panel; 200, display device; 10, substrate; 20, first conductive layer; 21, first electrical contact; 211, first body part; 212, first extension part; 213, third extension part; 22, second electrical contact; 221, second body part; 222, second extension part; 223, fourth extension part; 30, second conductive layer; 31, first electrical connection; 32, second electrical connection; 40, light emitting device; 41, first electrode; 42, second electrode; 50, partition part; 51, first sub-layer; 52, second sub-layer; 521, first sub-part; 522, second sub-part; 53, third sub-layer; 531, first cover part; 532, second cover part; 54, first sub-partition part; 55, second sub-partition part; 56, groove; 60, limiting part; 61, first layer structure; 62, second layer structure; 63, third layer structure; 64, bearing surface. DETAILED DESCRIPTION

[0020] The features and exemplary embodiments of various aspects of the present application will be described below in detail, in order to make the purposes, technical solutions and advantages of the present application more clear and apparent, the present application will be further described in detail below in combination with the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, but not to limit the present application. The present application can be implemented without some of these specific details for those skilled in the art. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0021] Micro-LED has the advantages of small volume, power saving, wide color gamut, long life, etc., and with the maturity of the process and the decline in price, in recent years, there are more and more Micro-LED related products. However, as the size of the LED gradually decreases, the distance between the anode and the cathode of the Micro-LED is also reduced, which makes it easy to cause short circuit when the Micro-LED is connected with the driving backboard, thereby affecting the yield of the display panel.

[0022] FIG. 1 is a top view schematic view of a display panel provided by an embodiment of the present application. FIG. 2 is an enlarged structure schematic view of P in FIG. 1. FIG. 3 is a cross-sectional structure schematic view of A-A in FIG. 2.

[0023] In view of this, in a first aspect, referring to FIGS. 1-3, an embodiment of the present application provides a display panel 100. The display panel 100 includes a substrate 10, a first conductive layer 20, a second conductive layer 30, and a light emitting device 40. The first conductive layer 20 is disposed on one side of the substrate 10 and includes a first electrical contact 21 and a second electrical contact 22 disposed at intervals. The second conductive layer 30 is disposed on the side of the first conductive layer 20 away from the substrate 10 and includes a first electrical connection 31 and a second electrical connection 32. The light emitting device 40 is disposed on the substrate 10, and the light emitting device 40 includes a first electrode 41 and a second electrode 42, the first electrode 41 is electrically connected to the first electrical contact 21 through the first electrical connection 31, and the second electrode 42 is electrically connected to the second electrical contact 22 through the second electrical connection 32. Wherein, a partition 50 is provided between the first electrical connection 31 and the second electrical connection 32, the partition 50 includes a plurality of sub-layers stacked, and at least one of the first electrical contact 21 and the second electrical contact 22 forms a partial sub-layer.

[0024] Optionally, the substrate 10 includes but is not limited to a PCB (Printed Circuit Board) substrate, a TFT (Thin Film Transistor) glass substrate, an FPC (Flexible Printed Circuit) substrate, etc. Optionally, the substrate 10 can include a driving circuit. The light emitting device 40 is electrically connected to the driving circuit through the second conductive layer 30 and the first conductive layer 20. The driving circuit can drive the light emitting device 40 to emit light.

[0025] The light emitting device 40 can be set in various ways, for example, the light emitting device 40 can be a Micro-LED or a Mini LED. The light emitting device 40 can be set in various ways, when the light emitting device 40 is used to realize the display function of the display panel 100, the light emitting device 40 can include a red light emitting unit, a green light emitting unit and a blue light emitting unit. When the light emitting device 40 is used as a backlight source of the display panel 100, the light emitting device 40 can act as a light source and be used to emit white light.

[0026] Optionally, the display panel 100 further includes an encapsulation layer for encapsulating the light emitting device 40.

[0027] Optionally, the substrate 10 is provided with a plurality of light emitting accommodation regions, each of which is provided with a first electrical contact 21 and a second electrical contact 22, and each of which can accommodate one or more light emitting devices 40. Optionally, the plurality of light emitting accommodation regions are arranged in an array.

[0028] Optionally, the first electrical connection 31 is located in the orthographic projection of the first electrical contact 21 on the substrate 10.

[0029] Optionally, the second electrical connection portion 32 is located within the projection of the second electrical contact portion 22 on the substrate 10.

[0030] Optionally, the material of the first electrical connection portion 31 and the second electrical connection portion 32 comprises tin Sn.

[0031] Optionally, the material of the first conductive layer 20 and the material of the second conductive layer 30 can be different, of course, they can also be the same.

[0032] Optionally, one of the first electrode 41 and the second electrode 42 is a positive electrode, and the other is a negative electrode. For example, the first electrode 41 is a positive electrode, and the second electrode 42 is a negative electrode.

[0033] Optionally, the light emitting device 40 can include a lower surface, which is the surface of the light emitting device 40 on the side facing the substrate 10, and the first electrode 41 and the second electrode 42 are arranged on the lower surface.

[0034] Optionally, the partition portion 50 can be arranged in abutment with the lower surface of the light emitting device 40. Alternatively, a gap can be provided between the partition portion 50 and the lower surface of the light emitting device 40.

[0035] The embodiment of the present application provides a display panel 100. The display panel 100 includes a substrate 10, a first conductive layer 20, a second conductive layer 30, and a light emitting device 40. The first electrode 41 of the light emitting device 40 is electrically connected to the first electrical contact portion 21 through the first electrical connection portion 31, and the second electrode 42 is electrically connected to the second electrical contact portion 22 through the second electrical connection portion 32. The first electrical connection portion 31 and the second electrical connection portion 32 are provided with a partition portion 50, which can prevent the first electrical connection portion 31 and the second electrical connection portion 32 from contacting and causing the risk of short circuit. In addition, one or all of the first electrical contact portion 21 and the second electrical contact portion 22 extend to the position of the partition portion 50 to form part of the partition portion 50, which is conducive to reducing the risk of etching the driving circuit in the substrate 10 during the etching of the first conductive layer 20 in the patterning process, and improving the yield of the display panel 100.

[0036] Figure 4 is another schematic diagram of the cross-sectional structure of A-A in Figure 2. Figure 5 is another schematic diagram of the cross-sectional structure of A-A in Figure 2.

[0037] In some optional embodiments, referring to Figures 3 to 5, the side of the partition portion 50 facing away from the substrate 10 is arranged in contact with the surface of the side of the light emitting device facing the substrate 10.

[0038] Exemplarily, the side of the partition 50 away from the substrate 10 can be a top surface of the partition 50, the side surface of the light emitting device facing the substrate 10 can be a lower surface of the light emitting device, and the top surface of the partition 50 and the lower surface of the light emitting device are arranged in contact, so that the top surface of the partition 50 can carry the light emitting device, thereby reducing the possibility of the light emitting device deviating during soldering with the substrate 10 and improving the production yield.

[0039] In some optional embodiments, referring to FIGS. 3-5, the plurality of sub-layers include a first sub-layer 51, a second sub-layer 52, and a third sub-layer 53, the second sub-layer 52 is arranged on the side of the first sub-layer 51 away from the substrate 10, and the third sub-layer 53 covers at least part of the second sub-layer 52, and at least one of the first electrical contact 21 and the second electrical contact 22 extends to the side of the first sub-layer 51 away from the substrate 10 to form the second sub-layer 52.

[0040] Optionally, the first sub-layer 51, the second sub-layer 52, and the third sub-layer 53 can be three sub-layers with the same thickness; or the thickness of the first sub-layer 51 is greater than the thickness of the second sub-layer 52, thereby reducing the production material of the second sub-layer 52, reducing the manufacturing cost of the second sub-layer 52, and improving the overall thickness of the partition 50; or the thickness of the third sub-layer 53 is greater than the thickness of the second sub-layer 52, so that the third sub-layer 53 can protect the conductive layer in the second sub-layer 52, thereby reducing the possibility of water vapor corroding the conductive layer in the second sub-layer 52.

[0041] Optionally, the first electrical contact 21 can include a first body portion 211 and a first extension portion 212, the first body portion 211 is electrically connected with the first electrical connection portion 31, and the first extension portion 212 is electrically connected with the first body portion 211, and the first extension portion 212 extends to the side of the first sub-layer 51 away from the substrate 10, so that the first extension portion 212 forms the second sub-layer 52. Optionally, the first sub-layer 51 protrudes from the side surface of the first body portion 211 away from the substrate 10 in a direction away from the substrate 10, the first extension portion 212 is located on the side of the first sub-layer 51 away from the substrate 10, and the distance between the first extension portion 212 and the substrate 10 is greater than the distance between the first body portion 211 and the substrate 10.

[0042] Optionally, the second electrical contact 22 can include a second body portion 221 and a second extension portion 222, the second body portion 221 is electrically connected with the second electrical connection 32, the second extension portion 222 is electrically connected with the second body portion 221, the second extension portion 222 extends to a side of the first sub-layer 51 away from the substrate 10, so that the second extension portion 222 forms the second sub-layer 52. Optionally, the second sub-layer 52 protrudes from a side surface of the second body portion 221 away from the substrate 10 in a direction away from the substrate 10, the second extension portion 222 is located at a side of the second sub-layer 52 away from the substrate 10, and a spacing between the second extension portion 222 and the substrate 10 is greater than a spacing between the second body portion 221 and the substrate 10.

[0043] Optionally, a side surface of the first extension portion 212 away from the substrate 10 and a side surface of the second extension portion 222 away from the substrate 10 can be flush.

[0044] In some embodiments, a side of the third sub-layer 53 away from the substrate is in contact with a side surface of the light emitting device 40 facing the substrate 10.

[0045] In some embodiments, as shown in FIG. 4, a portion of the first electrical contact 21 (first extension 212) extends to the side of the first sub-layer 51 opposite to the substrate 10 to form the second sub-layer 52. In other embodiments, as shown in FIG. 5, a portion of the second electrical contact 22 (second extension 222) extends to the side of the first sub-layer 51 opposite to the substrate 10 to form the second sub-layer 52. In yet other embodiments, as shown in FIG. 3, a portion of the first electrical contact 21 (first extension 212) and a portion of the second electrical contact 22 (second extension 222) both extend to the side of the first sub-layer 51 opposite to the substrate 10 to form the second sub-layer 52. It is understood that the second sub-layer 52 in FIG. 4 is formed by a portion of the first electrical contact 21 (as shown in FIG. 4) or by a portion of the second electrical contact 22 (as shown in FIG. 5). The second sub-layer 52 can cover only a portion of the surface of the side of the first sub-layer 51 opposite to the substrate 10, and the third sub-layer 53 covers the area of the surface of the side of the first sub-layer 51 opposite to the substrate 10 that is not covered by the second sub-layer 52, thereby reducing the possibility of short circuit between the first electrical contact 21 and the second electrical contact 22. For example, as shown in FIG. 4, the first extension 212 of the first electrical contact 21 covers a portion of the surface of the side of the first sub-layer 51 opposite to the substrate 10, and a portion of the third sub-layer 53 covers the area of the surface of the side of the first sub-layer 51 opposite to the substrate 10 that is not covered by the first extension 212, such that the first extension 212 and the second electrical contact 22 are separated by the third sub-layer 53, thereby reducing the possibility of short circuit between the first extension 212 and the second electrical contact 22. As shown in FIG. 5, the second extension 222 of the second electrical contact 22 covers a portion of the surface of the side of the first sub-layer 51 opposite to the substrate 10, and a portion of the third sub-layer 53 covers the area of the surface of the side of the first sub-layer 51 opposite to the substrate 10 that is not covered by the second extension 222, such that the second extension 222 and the first electrical contact 21 are separated by the third sub-layer 53, thereby reducing the possibility of short circuit between the second extension 222 and the first electrical contact 21.

[0046] In these alternative embodiments, by forming the second sub-layer 52 of the first conductive layer 20 to form the partition 50, the third sub-layer 53 can protect the first conductive layer 20 to reduce the erosion of the first conductive layer 20 by water vapor, and the first sub-layer 51 can protect the first conductive layer 20 from the conductive film layer in the substrate 10, thereby reducing the risk of damage to the driving circuit in the substrate 10 due to over-etching during the manufacturing process.

[0047] In some optional embodiments, referring to FIG. 3, the second sub-layer 52 includes a first sub-portion 521 and a second sub-portion 522, the first sub-portion 521 is connected with the first electrical contact portion 21, the second sub-portion 522 is connected with the second electrical contact portion 22, the third sub-layer 53 covers at least one of the first sub-portion 521 and the second sub-portion 522 away from the substrate 10.

[0048] In some embodiments, a part (first extension portion 212) of the first electrical contact portion 21 extends to a side of the first sub-layer 51 away from the substrate 10 to form the first sub-portion 521 of the second sub-layer 52. A part (second extension portion 222) of the second electrical contact portion 22 extends to a side of the first sub-layer 51 away from the substrate 10 to form the second sub-portion 522 of the second sub-layer 52.

[0049] Optionally, the third sub-layer 53 can only cover the side of the first sub-portion 521 away from the substrate 10. Alternatively, the third sub-layer 53 can only cover the side of the second sub-portion 522 away from the substrate 10. Alternatively, the side of the first sub-portion 521 away from the substrate 10 and the side of the second sub-portion 522 away from the substrate 10 are both covered by the third sub-layer 53.

[0050] In some embodiments, the first sub-portion 521 and the second sub-portion 522 are spaced apart, the third sub-layer 53 covers the first sub-layer 51 away from the substrate 10 and the part of the first sub-layer 51 not covered by the first sub-portion 521 and the second sub-portion 522, so as to further improve the reliability of the mutual insulation of the first sub-portion 521 and the second sub-portion 522.

[0051] In some optional embodiments, referring to FIG. 3, the third sub-layer 53 includes a first covering portion 531 and a second covering portion 532, the first covering portion 531 covers at least one of the first sub-portion 521 and the second sub-portion 522, the second covering portion 532 covers the first sub-layer 51 away from the substrate 10 and the part of the first sub-layer 51 not covered by the first sub-portion 521 and the second sub-portion 522, the distance between the side of the first covering portion 531 away from the substrate 10 and the substrate 10 is greater than the distance between the side of the second covering portion 532 away from the substrate 10 and the substrate 10.

[0052] Illustratively, the first covering portion 531 includes two, one first covering portion 531 covers the side of the first sub-portion 521 away from the substrate 10, and the other first covering portion 531 covers the side of the second sub-portion 522 away from the substrate 10. Alternatively, the first covering portion 531 only covers the side of the first sub-portion 521 away from the substrate 10. Alternatively, the first covering portion 531 only covers the side of the second sub-portion 522 away from the substrate 10.

[0053] Exemplarily, the first sub-part 521 and the second sub-part 522 of the second sub-layer 52 are arranged in a spaced manner, and the first sub-layer 51 is exposed on the side surface of the substrate 10 opposite to the substrate 10 in the spacing region between the first sub-part 521 and the second sub-part 522, and the second covering part 532 covers the spacing region between the first sub-part 521 and the second sub-part 522.

[0054] Optionally, the first covering part 531 and the second covering part 532 can be connected.

[0055] Optionally, the first covering part 531 is arranged in abutment with the lower surface of the light emitting device 40, and the second covering part 532 has a gap with the lower surface of the light emitting device 40.

[0056] Optionally, the thickness of the first covering part 531 and the thickness of the second covering part 532 can be the same.

[0057] In these optional embodiments, the first covering part 531 can carry the light emitting device, thereby reducing the possibility of the light emitting device being tilted during the transfer process.

[0058] FIG. 6 is another schematic view of the cross-sectional structure of A-A in FIG. 2.

[0059] In some optional embodiments, referring to FIG. 6, the partition part 50 includes a first sub-partition part 54, a second sub-partition part 55, and a groove 56 between the first sub-partition part 54 and the second sub-partition part 55, the first sub-partition part 54 and the second sub-partition part 55 are arranged in contact with the side surface of the substrate 10 facing the light emitting device 40, and the first sub-partition part 54 and the second sub-partition part 55 each include the first sub-layer 51, the second sub-layer 52, and the third sub-layer 53.

[0060] It can be understood that the first sub-partition part 54 and the second sub-partition part 55 are located between the same light emitting device 40 and the substrate 10. The bottom surface of the groove 56 between the first sub-partition part 54 and the second sub-partition part 55 can be the surface of the substrate 10. Optionally, the bottom surface of the groove 56 can also be the surface of the sub-layer in the partition part 50, for example, the bottom surface of the groove 56 is the surface of the first sub-layer 51.

[0061] Optionally, the side surface of the first sub-partition part 54 facing away from the substrate 10 and the side surface of the second sub-partition part 55 facing away from the substrate 10 are arranged in a flush manner.

[0062] Optionally, the third sub-layer 53 in the first sub-partition part 54 can be an undercut structure, for example, the cross-sectional shape of the third sub-layer 53 can be in the shape of a T. The second sub-layer 52 is located on the side of the third sub-layer 53 facing the first electrical connection part 31.

[0063] Optionally, the third sub-layer 53 in the second sub-partition 55 can be an undercut structure, for example, the cross-sectional shape of the third sub-layer 53 can be T-shaped. The second sub-layer 52 is located on the side of the third sub-layer 53 facing the second electrical connection portion 32.

[0064] In these alternative embodiments, the first sub-partition 54 and the second sub-partition 55 can support the light-emitting device 40, thereby reducing the possibility that the light-emitting device 40 will tilt during the transfer process. The trench 56 can reduce the possibility that the material of the second conductive layer 30 will overflow into the trench 56 due to operational errors during the preparation process, thereby causing a short circuit between the first electrical contact 21 and the second electrical contact 22.

[0065] In some optional embodiments, the material of the first sub-layer 51 is an inorganic material, and the material of the third sub-layer 53 is an organic material. The material selected for the first sub-layer 51 can increase the overall height of the partition 50 while reducing the manufacturing cost of the partition 50. The material selected for the third sub-layer 53 can reduce the possibility of the first electrical contact 21 and the second electrical contact 22 being corroded by moisture, and reduce the possibility of the conductive materials in the first electrical contact 21 and the second electrical contact 22 getting close to each other, thereby causing a short circuit between the first electrical contact 21 and the second electrical contact 22.

[0066] Optionally, the material of the first sublayer 51 is silicon nitride or silicon oxide.

[0067] Optionally, the material of the third sublayer 53 is polyimide.

[0068] Optionally, the material of the second sublayer 52 is copper.

[0069] In some optional embodiments, referring to FIG6, the substrate 10 further includes a limiting portion 60, which is disposed around the light-emitting device 40. The distance between the limiting portion 60 and the substrate 10 on the side facing away from the substrate 10 is greater than the distance between the partition portion 50 and the substrate 10 on the side facing away from the substrate 10.

[0070] Optionally, the limiting portion 60 protrudes from the second conductive layer 30 in a direction away from the substrate 10.

[0071] Optionally, the shape of the limiting part 60 projected onto the substrate 10 can be a continuous closed shape; of course, it can also be a plurality of sub-parts spaced apart.

[0072] Optionally, the orthographic projection shape of the light-emitting accommodating area on the substrate 10 and the orthographic projection shape of the limiting portion 60 on the substrate 10 can be similar.

[0073] Optionally, the orthographic projection shape of the light-emitting device 40 on the substrate 10 and the orthographic projection shape of the limiting portion 60 on the substrate 10 can be similar.

[0074] Optionally, the cross-sectional area of the limiting portion 60 perpendicular to the thickness direction of the substrate 10 can gradually decrease in the direction away from the substrate 10. For example, the cross-sectional shape of the limiting portion 60 is trapezoidal, triangular or other shapes.

[0075] Optionally, the light emitting device 40 can further include a side surface and an upper surface, the upper surface of the light emitting device 40 is the surface on the side of the light emitting device 40 opposite to the substrate 10, and the side surface is the surface between the upper surface and the lower surface. A gap can be provided between the limiting portion 60 and the side surface; or the limiting portion 60 can also be in abutment with at least part of the side surface.

[0076] In these optional embodiments, through the above arrangement, the limiting portion 60 can play a guiding role in the transfer process of the light emitting device 40, which is conducive to reducing the precision of the transfer process of the light emitting device 40, and the limiting portion 60 can also reduce the possibility of the light emitting device 40 being tilted and the risk of the second conductive layer 30 overflowing to cause short circuit of adjacent light emitting devices 40.

[0077] In some optional embodiments, referring to FIG. 6, the limiting portion 60 includes a plurality of layer structures arranged in layers, and at least one of the first electrical contact 21 and the second electrical contact 22 forms part of the layer structure.

[0078] Optionally, the limiting portion 60 can include two layer structures, and at least one of the first electrical contact 21 and the second electrical contact 22 can form one of the two layer structures. The limiting portion 60 can also include more than two layer structures, and at least one of the first electrical contact 21 and the second electrical contact 22 can form a layer structure in the middle. For example, the limiting portion 60 includes three layer structures, and at least one of the first electrical contact 21 and the second electrical contact 22 can form the second layer structure in the middle; the limiting portion 60 includes four layer structures, and at least one of the first electrical contact 21 and the second electrical contact 22 can form the third layer structure in the middle.

[0079] In these optional embodiments, by arranging the limiting portion 60 as a multi-layer structure, it is conducive to simplifying the manufacturing difficulty of the limiting portion 60 and reducing the manufacturing cost of the limiting portion 60, and the first electrical contact 21 and the second electrical contact 22 extend to the side of part of the layer structure opposite to the substrate 10 to further reduce the possibility of damage to the driving circuit in the substrate 10 caused by over-etching of the first electrical contact 21 and the second electrical contact 22 during preparation.

[0080] In some optional embodiments, referring to FIG. 6, the layer structure includes a first layer structure 61, a second layer structure 62, and a third layer structure 63, the second layer structure is arranged on the side of the first layer structure away from the substrate, and the third layer structure covers at least part of the second layer structure. At least one of the first electrical contact 21 and the second electrical contact 22 extends along the first layer structure 61 to form the second layer structure 62.

[0081] Optionally, the first layer structure 61, the second layer structure 62, and the third layer structure 63 can be three-layer layer structures with the same thickness; or the thickness of the first layer structure 61 is greater than the thickness of the second layer structure 62, so as to reduce the preparation material of the second layer structure 62, reduce the manufacturing cost of the second layer structure 62, and increase the overall thickness of the limiting portion 60; or the thickness of the third layer structure 63 is greater than the thickness of the second layer structure 62, so that the third layer structure 63 can protect the conductive layer in the second layer structure 62, and reduce the possibility of water vapor corroding the conductive layer in the second layer structure 62.

[0082] Optionally, the first electrical contact 21 can include a first body portion 211 and a third extension portion 213, the first body portion 211 is electrically connected with the first electrical connection portion 31, the third extension portion 213 is electrically connected with the first body portion 211, and the third extension portion 213 extends to the side of the first layer structure 61 away from the substrate 10, so that the third extension portion 213 forms the second layer structure 62. The first layer structure 61 protrudes from the side surface of the first body portion 211 away from the substrate 10 in the direction away from the substrate 10, the third extension portion 213 is located on the side of the first layer structure 61 away from the substrate 10, and the distance between the third extension portion 213 and the substrate 10 is greater than the distance between the first body portion 211 and the substrate 10.

[0083] Optionally, the second electrical contact 22 can include a second body portion 221 and a fourth extension portion 223, the second body portion 221 and the fourth extension portion 223 are electrically connected, the fourth extension portion 223 is electrically connected with the second body portion 221, and the fourth extension portion 223 extends to the side of the second layer structure 62 away from the substrate 10, so that the fourth extension portion 223 forms the second layer structure 62. The second layer structure 62 protrudes from the side surface of the second body portion 221 away from the substrate 10 in the direction away from the substrate 10, the fourth extension portion 223 is located on the side of the second layer structure 62 away from the substrate 10, and the distance between the fourth extension portion 223 and the substrate 10 is greater than the distance between the second body portion 221 and the substrate 10.

[0084] Optionally, the side surface of the third extension portion 213 away from the substrate 10 and the side surface of the fourth extension portion 223 away from the substrate 10 can be flush.

[0085] Optionally, the side surface of the first extension 212 facing away from the substrate 10 and the side surface of the third extension 213 facing away from the substrate 10 can be flush.

[0086] Optionally, the side surface of the second extension 222 facing away from the substrate 10 and the side surface of the fourth extension 223 facing away from the substrate 10 can be flush.

[0087] In some embodiments, a portion (the third extension 213) of the first electrical contact 21 extends to the side of the first layer structure 61 facing away from the substrate 10 to form the second layer structure 62. In other embodiments, a portion (the fourth extension 223) of the second electrical contact 22 extends to the side of the first layer structure 61 facing away from the substrate 10 to form the second layer structure 62. In yet other embodiments, a portion (the third extension 213) of the first electrical contact 21 and a portion (the fourth extension 223) of the second electrical contact 22 both extend to the side of the first layer structure 61 facing away from the substrate 10 to form the second layer structure 62.

[0088] In these optional embodiments, by forming the second layer structure 62 of the first conductive layer 20 to limit the portion 60, the third layer structure 63 can protect the first conductive layer 20 to reduce the corrosion of the first conductive layer 20 by water vapor, while the first layer structure 61 protects the first conductive layer 20 from the conductive film layer in the substrate 10, thereby reducing the risk of damage to the driving circuit in the substrate 10 due to over-etching of the first conductive layer 20 during preparation.

[0089] FIG. 7 is another cross-sectional structure schematic view of A-A in FIG. 2.

[0090] In some optional embodiments, referring to FIG. 7, the side of the first layer structure 61, the second layer structure 62, and the third layer structure 63 facing away from the substrate 10 is provided with a bearing surface 64, and a portion of the surface of the light emitting device 40 and the bearing surface 64 are arranged in overlapping manner.

[0091] Optionally, the surface where the bearing surface 64 is located can be parallel to the surface where the substrate 10 is located; or, the surface where the bearing surface 64 is located can intersect the surface where the substrate 10 is located.

[0092] Optionally, the bearing surface 64 and the surface of the first covering portion facing away from the substrate 10 are arranged in flush manner.

[0093] In these optional embodiments, the bearing surface 64 can bear the light emitting device 40 to further improve the supporting effect of the light emitting device 40, thereby reducing the possibility of the light emitting device 40 tilting.

[0094] In some optional embodiments, referring to FIG. 7, the distance between the side surface of the limiting part 60 facing away from the substrate 10 and the substrate 10 is greater than the distance between the side surface of the second conductive layer 30 facing away from the substrate 10 and the substrate 10, further reducing the risk of the second conductive layer 30 overflowing and causing short circuit of the adjacent light emitting device 40.

[0095] As shown in FIG. 8, in a second aspect, embodiments of the present application provide a display device 200, which comprises the display panel 100 of any of the above embodiments. Since the display device provided by the embodiments of the second aspect of the present application comprises the display panel 100 of any of the above embodiments, the display device provided by the embodiments of the second aspect of the present application has the beneficial effects of the display panel 100 of any of the above embodiments, which will not be described here again.

[0096] The above merely describes the specific embodiments of the present application, and those skilled in the art can clearly understand that, for the convenience and brevity of description, the above-described replacement of other connection modes and the like can refer to the corresponding processes in the foregoing method embodiments, which will not be described here again. It should be understood that the protection scope of the present application is not limited to this, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements should be covered within the protection scope of the present application.

Claims

1. A display panel, comprising: a substrate; a first conductive layer disposed on a side of the substrate and comprising a first electrical contact and a second electrical contact disposed apart from each other; a second conductive layer disposed on a side of the first conductive layer facing away from the substrate and comprising a first electrical connection and a second electrical connection; a light emitting device disposed on the substrate, the light emitting device comprising a first electrode and a second electrode, the first electrode being electrically connected to the first electrical contact through the first electrical connection, the second electrode being electrically connected to the second electrical contact through the second electrical connection; wherein a partition is disposed between the first electrical connection and the second electrical connection, the partition comprising a plurality of sub-layers disposed in a stack, at least one of the first electrical contact and the second electrical contact forming part of the sub-layers.

2. The display panel of claim 1, wherein, a side of the partition facing away from the substrate is disposed in surface contact with a side of the light emitting device facing towards the substrate.

3. The display panel of claim 1, wherein, a footprint of the first electrical connection on the substrate is within a footprint of the first electrical contact on the substrate; and / or a footprint of the second electrical connection on the substrate is within a footprint of the second electrical contact on the substrate.

4. The display panel of claim 1, wherein, the plurality of sub-layers comprises a first sub-layer, a second sub-layer, and a third sub-layer, the second sub-layer being disposed on a side of the first sub-layer facing away from the substrate, the third sub-layer covering at least part of the second sub-layer, at least one of the first electrical contact and the second electrical contact extending along the first sub-layer to form the second sub-layer.

5. The display panel of claim 4, wherein, a thickness of the first sub-layer is greater than a thickness of the second sub-layer, and / or a thickness of the third sub-layer is greater than a thickness of the second sub-layer.

6. The display panel of claim 4, wherein, the thickness of the first sub-layer, the second sub-layer, and the third sub-layer are equal.

7. The display panel of claim 4, wherein, a side of the third sub-layer facing away from the substrate is disposed in surface contact with a side of the light emitting device facing towards the substrate.

8. The display panel of claim 4, wherein, the second sub-layer comprises a first sub-portion and a second sub-portion, the first sub-portion being connected to the first electrical contact, the second sub-portion being connected to the second electrical contact, the third sub-layer covering at least one of the first sub-portion and the second sub-portion.

9. The display panel of claim 8, wherein, the first sub-portion and the second sub-portion are disposed apart from each other, the third sub-layer covering the first sub-layer on a side of the first sub-layer facing away from the substrate and not covered by the first sub-portion and the second sub-portion.

10. The display panel of claim 8, wherein, the third sub-layer comprises a first covering portion and a second covering portion, the first covering portion covering at least one of the first sub-portion and the second sub-portion, the second covering portion covering the first sub-layer on a side of the first sub-layer facing away from the substrate and not covered by the first sub-portion and the second sub-portion, a distance between a side of the first covering portion facing away from the substrate and the substrate being greater than a distance between a side of the second covering portion facing away from the substrate and the substrate.

11. The display panel of claim 4, wherein, The partition portion includes a first sub-partition portion, a second sub-partition portion, and a groove between the first sub-partition portion and the second sub-partition portion, the first sub-partition portion and the second sub-partition portion are both in contact with a side surface of the substrate facing the light-emitting device, and the first sub-partition portion and the second sub-partition portion both include the first sub-layer, the second sub-layer, and the third sub-layer.

12. The display panel of claim 1, wherein, The substrate further includes a limiting portion, the limiting portion is arranged around the light-emitting device, and a distance between a side surface of the limiting portion facing away from the substrate and the substrate is greater than a distance between a side surface of the partition portion facing away from the substrate and the substrate.

13. The display panel of claim 12, wherein, The limiting portion is arranged protruding from the second conductive layer in a direction away from the substrate; and / or, in a direction away from the substrate, a cross-sectional area of the limiting portion perpendicular to a thickness direction of the substrate gradually decreases.

14. The display panel of claim 12, wherein, The limiting portion includes a multi-layer layer structure arranged in layers, and at least one of the first electrical contact portion and the second electrical contact portion forms part of the layer structure.

15. The display panel of claim 14, wherein, The layer structure includes a first layer structure, a second layer structure, and a third layer structure, the second layer structure is arranged on a side of the first layer structure facing away from the substrate, the third layer structure covers at least part of the second layer structure, and at least one of the first electrical contact portion and the second electrical contact portion extends along the first layer structure to form the second layer structure.

16. The display panel of claim 15, wherein, The thickness of the first layer structure is greater than the thickness of the second layer structure, and / or the thickness of the third layer structure is greater than the thickness of the second layer structure.

17. The display panel of claim 15, wherein, The thicknesses of the first layer structure, the second layer structure, and the third layer structure are equal.

18. The display panel of claim 15, wherein, The first electrical contact portion includes a first body portion and a third extension portion, the first body portion is electrically connected to the first electrical connection portion, the third extension portion is electrically connected to the first body portion, the third extension portion extends to a side of the first layer structure facing away from the substrate, so that the third extension portion forms the second layer structure; and / or, the second electrical contact portion includes a second body portion and a fourth extension portion, the second body portion is electrically connected to the fourth extension portion, the fourth extension portion is electrically connected to the second body portion, the fourth extension portion extends to a side of the second layer structure facing away from the substrate, so that the fourth extension portion forms the second layer structure.

19. The display panel of claim 15, wherein, The side of the first layer structure, the second layer structure, and the third layer structure facing away from the substrate is provided with a bearing surface, and part of a surface of the light-emitting device and the bearing surface are arranged in overlap.

20. A display device comprising: A display panel including any one of claims 1 to 19. A display panel including any one of claims 1 to 19.

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