Production method for semiconductor module and production method for electronic device

Abstract

According to the present invention, a production method for a semiconductor module has a step for feeding a release liner (5) to which a protective tape (3) is adhered along a release member (6) that peels the protective tape (3) from the release liner (5), a step for causing a swinging part (32) to form while the protective tape (3) is being peeled from the release liner (5) by the release member (6) to separate the adhesive at a ventilation part (30), and a step for adhering the protective tape (3) peeled from the release liner (5) to a package.

Description

Method for manufacturing semiconductor modules and method for manufacturing electronic devices

[0001] This disclosure relates to a method for manufacturing semiconductor modules and a method for manufacturing electronic devices.

[0002] Conventionally, semiconductor modules are known to have a configuration comprising a hollow package and semiconductor device components mounted inside the hollow space of the package. Protective tape is applied to the inside of the hollow space of the package to prevent damage to the semiconductor device components, such as scratches or the adhesion of airborne foreign matter. The material and adhesive strength of the protective tape are selected in consideration of the surface condition of the package or the reliability of the product. In a semiconductor module, it is necessary to mitigate the pressure difference between the inside and outside of the hollow space of the package when the air inside the hollow space, covered with protective tape, expands due to heating or contracts due to cooling. For example, Patent Document 1 discloses a configuration in which ventilation notches are formed to connect the inside and outside of the hollow space of the package.

[0003] Japanese Patent Publication No. 2023-20473

[0004] However, if the protective tape is configured to have notches formed in it, as in the technology disclosed in Patent Document 1, there is a risk that the adhesive in the notches will self-fuse during manufacturing and remain stuck. If the adhesive in the notches remains self-fuse, it will not be possible to ventilate the inside and outside of the hollow of the package, and when the air inside the hollow of the package covered with the protective tape expands due to heating or contracts due to cooling, the pressure difference between the inside and outside of the hollow cannot be alleviated. As a result, there is a risk that the protective tape will peel off the package or fall into the hollow.

[0005] This disclosure has been made in view of the above, and aims to provide a method for manufacturing a semiconductor module that suppresses self-fusing of ventilation portions formed by cutting into protective tape, and allows ventilation between the hollow interior and exterior of the package.

[0006] To solve the above-mentioned problems and achieve the objective, the present disclosure provides a method for manufacturing a semiconductor module comprising a hollow package and a semiconductor device component mounted inside the hollow part of the package, wherein a protective tape having a ventilation portion and a swing portion that functions as a valve for the ventilation portion formed by a cut is attached so as to cover the inside of the hollow part of the package, and the method for manufacturing a semiconductor module comprises the steps of: feeding a release liner to which the protective tape is attached along a release member that peels the protective tape from the release liner; deforming the swing portion while peeling the protective tape from the release liner with the release member to separate the adhesives in the ventilation portion; and attaching the protective tape peeled from the release liner to the package.

[0007] The semiconductor module manufacturing method described herein has the effect of suppressing self-fusing of the ventilation portion formed by cutting into the protective tape, and allowing ventilation between the hollow interior and exterior of the package.

[0008] A perspective view showing how protective tape is applied to a semiconductor module according to the embodiment. An explanatory diagram showing the shape of the ventilation portion and swing portion formed on the protective tape in the embodiment. A perspective view showing tape material with protective tape applied to a release liner in the embodiment. An explanatory diagram showing a modified example 1 of the shape of the ventilation portion and swing portion formed on the protective tape in the embodiment. An explanatory diagram showing a modified example 2 of the shape of the ventilation portion and swing portion formed on the protective tape in the embodiment. An explanatory diagram showing a modified example 3 of the shape of the ventilation portion and swing portion formed on the protective tape in the embodiment. An explanatory diagram showing a modified example 4 of the shape of the ventilation portion and swing portion formed on the protective tape in the embodiment. An explanatory diagram showing a modified example 5 of the shape of the ventilation portion and swing portion formed on the protective tape in the embodiment. A flowchart showing the assembly procedure of an electronic device having a semiconductor module according to the embodiment. An electronic device having a semiconductor module according to a chart embodiment, a perspective view showing the state in which protective tape is attached to the package, an electronic device having a semiconductor module according to a chart embodiment, a perspective view showing the state in which the protective tape has been peeled off the package, an explanatory diagram showing the process of peeling the protective tape from the release liner in an embodiment, a flowchart showing the procedure for attaching the protective tape to the package in an embodiment, an explanatory diagram showing the procedure for peeling the protective tape from the release liner in an embodiment, an explanatory diagram showing a modified example of tape material with protective tape attached to the release liner in an embodiment, an explanatory diagram showing the state in which protective tape is peeled off the release liner in an embodiment, an explanatory diagram showing a modified example of the release member in an embodiment, an explanatory diagram showing a modified example of the position of the ventilation portion formed on the protective tape in an embodiment

[0009] Hereinafter, the methods for manufacturing semiconductor modules and electronic devices according to embodiments of this disclosure will be described in detail with reference to the drawings.

[0010] Embodiment. Figure 1 is a perspective view showing how protective tape is applied to a semiconductor module according to the embodiment. As shown in Figure 1, the semiconductor module 100 according to the embodiment has a hollow package 1 and a semiconductor device component 2 mounted inside the hollow interior 10 of the package 1.

[0011] Package 1 is manufactured, for example, by creating an opening by cutting a laminated glass epoxy substrate or BT resin substrate on which an electrical circuit pattern is formed, by creating a resin frame on the substrate by dispensing, by bonding a separate frame body 11 to the substrate with an adhesive, or by molding it to the substrate by transfer molding. Materials used for dispensing include, for example, silicone, acrylic, or epoxy. The material of the frame body 11 is glass, metal, glass epoxy, BT resin, or other resin parts. Silicone, acrylic, or epoxy are used as adhesives. The frame body 11 may be joined using solder or a metal such as Ag instead of being bonded to the substrate with an adhesive. The hollow interior 10 of Package 1 may be a single space as shown in the figure, or it may be a configuration divided into multiple spaces. A protective tape 3 covering the hollow interior 10 of Package 1 is attached to the frame body 11 that forms the outer circumference of Package 1. The protective tape 3 is provided to prevent damage to the semiconductor device components 2 mounted inside the hollow interior 10, such as scratches or contamination by floating foreign matter. The protective tape 3 is peeled off from the package 1 after the semiconductor module 100 has been mounted on a circuit board or the like.

[0012] The semiconductor device component 2 is, for example, an optical element such as an LED (Light Emitting Diode) or PD (Photo Diode), a MEMS (Micro Electro Mechanical Systems), a high-frequency device, or an integrated module. The semiconductor device component 2 is not limited to the single component shown in the figure, but may consist of multiple components or of multiple types.

[0013] The protective tape 3 is an adhesive tape in which an adhesive is applied to the surface of a base material. The protective tape 3 has sufficient adhesiveness to be able to be attached to the package 1 and to be able to be peeled off from the package 1. The base material can be a film such as polyimide, fluororesin, or cellophane, a metal foil such as aluminum, or a fiber such as paper or cloth. The adhesive material can be acrylic, silicone, urethane, or rubber. The materials of the base material and adhesive are determined by the application, the surface condition of the adherend such as the package 1, and the processing process. For example, if heat resistance is required and outgassing is a problem, the base material can be polyimide and an acrylic adhesive can be used.

[0014] Furthermore, the protective tape 3 may be in a shape other than the rectangular shape shown in Figure 1, such as a circle or other polygon. Also, the protective tape 3 may extend beyond the frame 11 of the package 1, as long as it can cover the hollow interior 10 of the package 1. The protective tape 3 may also have a tab for peeling it off the package 1 using tweezers or the like. In addition, if the hollow interior 10 of the package 1 is divided into multiple spaces, only a portion of the divided hollow interior 10 may be covered with the protective tape 3.

[0015] Furthermore, the protective tape 3 is divided into an adhesive region that is attached to the frame 11 and is in close contact with the package 1, and a non-adherent region that covers the hollow interior 10 and is not in close contact with the package 1. In the non-adherent region of the protective tape 3, a ventilation portion 30 and a swing portion 32 that functions as a valve for the ventilation portion 30 are formed by cuts. The ventilation portion 30 is formed to alleviate the pressure difference with the outside when the air inside the hollow interior 10 of the package 1 covered by the protective tape 3 expands due to heating or contracts due to cooling. As an example, one ventilation portion 30 is formed in the center of the protective tape 3. Note that the number of ventilation portions 30 is not limited to the one shown, and two or more may be formed. Also, the position in which the ventilation portion 30 is formed is not limited to the center shown, and may be formed in other locations, such as a position that avoids being directly above the semiconductor device component 2.

[0016] Figure 2 is an explanatory diagram showing the shapes of the ventilation portion and swing portion formed on the protective tape in the embodiment. As shown in Figure 2, the ventilation portion 30 is formed by a first line segment 30a consisting of a straight cut, and a pair of second line segments 30b consisting of straight cuts that are bent at approximately 90 degrees from both ends of the first line segment 30a and extend in the same direction. Note that the pair of second line segments 30b are not limited to a configuration in which they are bent at approximately 90 degrees from both ends of the first line segment 30a, but may be bent at other angles, such as approximately 45 degrees from both ends of the first line segment 30a. The swing portion 32 is formed by the portion enclosed by the first line segment 30a, the second line segment 30b, and the virtual line segment 31, when the line segment connecting the tips of the pair of second line segments 30b is defined as a virtual line segment 31. The length and number of line segments constituting the ventilation section 30 are not limited to the illustrated configuration and may be determined, for example, by the speed at which a pressure difference occurs between the internal and external air in the hollow interior 10. The width of the cut in the ventilation section 30 may also be determined based on the size of the foreign matter to be suppressed and the constraints of the processing process. Furthermore, if the hollow interior 10 of the package 1 is divided into multiple spaces, the semiconductor module 100 may be structured such that a specific partitioned hollow interior 10 is covered with the protective tape 3 of the above configuration, and the other partitioned hollow interiors 10 are ventilated in a different way.

[0017] Figure 3 is a perspective view showing a tape material in which protective tape is attached to a release liner in an embodiment. As shown in Figure 3, the protective tape 3 is supplied attached to a release liner 5 before being attached to the package 1. The release liner 5 is paper or film with a release coating on its surface. The outer shape and ventilation portion 30 of the protective tape 3 are formed from the tape material 200 that is supplied already attached to the release liner 5 by punching using a Pinnacle® type or Thomson type, or by using laser beams of various wavelengths. After that, excess portions are removed by waste removal to produce tape material 200 in which protective tape 3 is attached to the release liner 5 at a constant pitch. The protective tape 3 is attached to the release liner 5 such that the edges of the swing portion 32 along the ventilation portion 30 face the direction B in which the protective tape 3 is fed out. The tape material 200 shown in Figure 3 is constructed by winding a release liner 5 with protective tape 3 attached in a single row into a roll. As an example, the protective tape 3 is attached to the release liner 5 such that one of its square corners faces the direction B from which the protective tape 3 is dispensed. The tape material 200 is not limited to a roll-shaped configuration; for example, it may be configured such that the protective tape 3 is attached in a grid pattern to a sheet-shaped release liner 5, or it may be configured in any other way.

[0018] Figure 4 is an explanatory diagram showing a modified example 1 of the shape of the ventilation portion and swing portion formed on the protective tape in the embodiment. The ventilation portion 30A of modified example 1 shown in Figure 4 has a first line segment 30a consisting of a straight cut, a pair of second line segments 30b consisting of straight cuts extending in the same direction and bent at approximately 90 degrees from both ends of the first line segment 30a, a pair of third line segments 30c consisting of straight cuts extending in directions away from each other and bent at approximately 90 degrees from the tip of each second line segment 30b, and a pair of fourth line segments 30d consisting of straight cuts facing the second line segment 30b and bent at approximately 90 degrees from the tip of each third line segment 30c. Note that the angle at which the pair of second line segments 30b, the pair of third line segments 30c, and the pair of fourth line segments 30d bend from adjacent line segments is not limited to approximately 90 degrees, and may be other angles. The swing portion 32 is formed by the portion enclosed by the first line segment 30a, the second line segment 30b, and the virtual line segment 31, when the line segment connecting the tips of the pair of second line segments 30b is defined as the virtual line segment 31. In the modified example 1, the ventilation portion 30A has a pair of third line segments 30c and a pair of fourth line segments 30d that function as a return, so that the cut can be prevented from splitting due to deformation of the swing portion 32.

[0019] Figure 5 is an explanatory diagram showing a modified example 2 of the shape of the ventilation portion and swing portion formed on the protective tape in the embodiment. In modified example 2 shown in Figure 5, the ventilation portion 30B is formed by a V-shaped cut. The swing portion 32 is formed by the portion enclosed by the ventilation portion 30B and the imaginary line segment 31, when the line segment connecting both ends of the V is considered an imaginary line segment 31.

[0020] Figure 6 is an explanatory diagram showing a modified example 3 of the shape of the ventilation portion and swing portion formed on the protective tape in the embodiment. In modified example 3 shown in Figure 6, the ventilation portion 30C is formed by an arc-shaped cutout. The swing portion 32 is formed by the portion enclosed by the ventilation portion 30C and the imaginary line segment 31, when the line segment connecting both ends of the arc is defined as the imaginary line segment 31.

[0021] Figure 7 is an explanatory diagram showing a modified example 4 of the shape of the ventilation portion and swing portion formed on the protective tape in the embodiment. In modified example 4 shown in Figure 7, the ventilation portion 30D is formed by a U-shaped cutout including an arc. The swing portion 32 is formed by the portion enclosed by the ventilation portion 30D and the imaginary line segment 31, when the line segment connecting both ends of the U is considered an imaginary line segment 31.

[0022] Figure 8 is an explanatory diagram showing a modified example 5 of the shape of the ventilation portion and swing portion formed on the protective tape in the embodiment. The ventilation portion 30E in modified example 5 shown in Figure 8 is formed by an H-shaped cutout. The swing portion 32 is formed by the portion enclosed by the ventilation portion 30E and the virtual line segment 31, when the line segment connecting the respective ends of two opposing line segments is defined as the virtual line segment 31.

[0023] Next, the assembly procedure for the electronic device 300 equipped with the semiconductor module 100 will be described. Figure 9 is a flowchart showing the assembly procedure for the electronic device having a semiconductor module according to an embodiment. Figure 10 is a perspective view of the electronic device having a semiconductor module according to an embodiment, showing the package with protective tape attached. Figure 11 is a perspective view of the electronic device having a semiconductor module according to an embodiment, showing the package with the protective tape removed.

[0024] First, as shown in Figure 1, a semiconductor device component 2 is mounted in the hollow interior 10 of the package 1 (step S10), and a protective tape 3 is attached to the frame 11 of the package 1, covering the hollow interior 10 of the package 1 with the protective tape 3 (step S11). Next, as shown in Figure 10, the semiconductor module 100 is reflow soldered to the circuit board 4 (step S12). For example, when using Sn-Ag-Cu solder, the reflow temperature is set to 260°C. Finally, as shown in Figure 11, the protective tape 3 is peeled off the package 1 of the semiconductor module 100 to create the electronic device 300 (step S13). To peel off the protective tape 3 from the package 1, for example, a part of the protective tape 3 may be allowed to protrude from the frame 11 of the package 1 and grasped and peeled off with tweezers, or a release tape with a higher adhesive strength than the protective tape 3 may be attached over the protective tape 3 and the protective tape 3 may be peeled off together with the release tape, or an automatic device for peeling off the protective tape 3 may be used. Furthermore, the protective tape 3 may be made of a material whose adhesive strength decreases when heat is applied. Examples of materials whose adhesive strength decreases when heat is applied include silicone or acrylic.

[0025] In step S12, instead of reflow soldering, heating using a hot plate, heating using a drying oven, or heating using an induction heating device may be performed. The heating temperature may be determined by the curing temperature of the material used for fixing. In addition, in step S12, a process that creates a pressure difference between the hollow interior 10 of the package 1 and the outside may be performed. For example, in step S12, instead of reflow soldering, dehumidification by heating or vacuuming, or aging that causes a temperature rise may be performed. Also, the process in step S10 may be omitted. Furthermore, if dehumidification by heating or vacuuming, or aging that causes a temperature rise is performed in step S12, fixing that does not cause a temperature rise may be performed on the circuit board 4 afterward.

[0026] Incidentally, in the protective tape 3, the material and adhesive strength of the tape are selected considering the surface condition of the package 1 or the reliability of the product. For example, if the surface of the adherend such as the package 1 is uneven or has a release surface, it is necessary to use an adhesive tape with high adhesive strength. When a tape with high adhesive strength is manufactured by die-cutting, a thin blade of 10 to 20 microns is used to form the ventilation part 30, so the spacing between the adhesives is very narrow, and there is a risk that the adhesives will self-fuse. If the adhesives of the ventilation part 30 self-fuse, it will not be possible to ventilate between the hollow interior 10 of the package 1 and the outside, and when the air inside the hollow interior 10 expands due to heating, the protective tape 3 may not be able to withstand the internal pressure inside the hollow interior 10 and may peel off from the package 1. Also, when the air inside the hollow interior 10 cools and contracts, the protective tape 3 may bend and come into contact with the semiconductor device component 2. Note that even if the ventilation part 30 is formed on the tape by laser processing, similar problems may occur depending on the processing width.

[0027] Figure 12 is an explanatory diagram showing how the protective tape is peeled off the release liner in the embodiment. As shown in Figure 12, the manufacturing method of the semiconductor module 100 according to the embodiment is characterized by peeling the protective tape 3 from the release liner 5 using a release member 6 made of a triangular prism-shaped block made of metal or the like, while deforming the swing portion 32 surrounded by the ventilation portion 30, thereby separating the adhesives of the ventilation portion 30. The procedure for attaching the protective tape 3 to the package 1 will be described in detail below.

[0028] Figure 13 is a flowchart showing the procedure for attaching the protective tape to the package in the embodiment. Figure 14 is an explanatory diagram showing the procedure for peeling the protective tape from the release liner in the embodiment.

[0029] As shown in Figure 14(a), first, the release liner 5 on which the protective tape 3 is mounted is pulled out in the direction A along the surface of the release member 6. １ From there, the drawer direction A is sharply bent. ２ It is sent out in the direction of (step S20). The peeling liner 5 is sent out in the pulling direction A. ２This is done using a winding machine (not shown) located at the end of the line. The release liner 5 is pulled out in a direction that is switched by the edge portion 60, which is the apex angle of the release member 6, causing it to bend at an acute angle. Also, as shown in Figure 12, the protective tape 3 is fed out so that the first line segment 30a of the ventilation portion 30 is parallel to the edge of the edge portion 60 of the release member 6. The acute angle of the release member 6 is selected so as to allow for slight deformation of the swing portion 32 of the ventilation portion 30. For example, if the adhesive force between the release liner 5 and the protective tape 3 is high, the angle of the edge portion 60 should be reduced.

[0030] Next, as shown in Figure 14(b), one end of the protective tape 3 is peeled off the release liner 5 at the edge portion 60 of the release member 6 (step S21). The release liner 5 is pressed against the release member 6 and bent at an acute angle, and pulled out in the direction A ２ It is fed out in that direction. As a result, the elastic force of the protective tape 3 at the edge portion 60 of the release member 6 becomes greater than the adhesive force of the protective tape 3, and one end of the protective tape 3 can be peeled off at the edge portion 60. As a result, the protective tape 3 is fed out in the pulling direction B, which is in front of the release member 6.

[0031] When feeding the protective tape 3 in the pulling direction B, one end of the protective tape 3 may be chucked to support it and prevent it from sagging under its own weight. When chucking one end of the protective tape 3, the chuck should be done in accordance with the speed at which the release liner 5 is fed out, so as not to cause the protective tape 3 to bend or tear.

[0032] Next, as shown in Figure 14(c), the adhesives of the protective tape 3 that were self-fusing in the ventilation section 30 are separated (step S22). The release liner 5 is pulled out in direction A. ２ It is further extended toward the edge portion 60, and once the first line segment 30a of the protective tape 3 reaches the edge portion 60, the swing portion 32 follows the peeling liner 5 and pulls out in the direction A ２It is fed out in that direction. Meanwhile, the areas of the protective tape 3 other than the swing portion 32 are fed out in the pulling direction B. At this time, the adhesives of the protective tape 3 that were self-fusing in the ventilation portion 30 are separated by the edge portion 60 of the release member 6.

[0033] Next, as shown in Figure 14(d), the release liner 5 is pulled out in direction A. ２ The swing portion 32 is further pushed toward the end, and the swing portion 32 is peeled off the release liner 5 (step S23). At the edge portion 60, the adhesive force of the protective tape 3 on the swing portion 32 becomes smaller than the elastic force of the protective tape 3, and one end of the swing portion 32 can be peeled off from the edge portion 60. At this time, the swing portion 32 springs back due to the elastic force, and moves in the direction that closes the ventilation portion 30. However, because plastic deformation has occurred in the swing portion 32, the adhesive does not return to a state where it is attached to each other in all areas of the first line segment 30a and the second line segment 30b that constitute the ventilation portion 30, and the edge of the swing portion 32 is caught on the adhesive surface of the protective tape 3 that is opposite to the first line segment 30a. In other words, the ventilation portion 30 does not return to the state before step S22 was started. Note that in the first line segment 30a of the ventilation portion 30, the adhesive and the base material may be partially stuck together. However, the adhesive force between the adhesive and the base material is very small compared to the adhesive force between the adhesives themselves. Therefore, even if the adhesive and the substrate partially adhere to the first line segment 30a of the ventilation section 30, it does not obstruct ventilation in the ventilation section 30.

[0034] Next, as shown in Figure 14(e), the release liner 5 is pulled out in direction A. ２ The protective tape 3 is then fed further in the direction of the end and picked up (step S24). At this time, the protective tape 3 is picked up in a way that does not cause it to crease. The means for picking up the protective tape 3 may be to use a suction nozzle to pick up the protective tape 3, or by gripping the end of the protective tape 3. When picking up the protective tape 3, care should be taken not to touch the ventilation part 30 and not to suck in the swing part 32. Note that it is not always necessary to pick up the protective tape 3; it may be fed in the pulling direction B and attached directly to the frame 11 of the package 1.

[0035] Next, the protective tape 3 is attached to the frame 11 of the package 1 (step S25). The protective tape 3 is attached to the frame 11 of the package 1 so as to cover the hollow interior 10 of the package 1. If precision in the positioning of the protective tape 3 is required, relative alignment using image recognition, for example, may be performed.

[0036] Finally, the protective tape 3 is pressed against the frame 11 using a roller or stamp so that it adheres tightly to the frame 11 (step S26). This removes any air bubbles trapped between the protective tape 3 and the surface of the package 1. The part used to press the protective tape 3 can be an elastic material such as urethane or silicone, plastic, or metal. If the frame 11 is soft, a stamp with a hollowed-out shape may be used to press down on the entire surface of the frame 11 at once. Alternatively, a rectangular stamp and an L-shaped stamp may be used to press down on the protective tape 3 attached to each part of the frame 11 in sequence. Step S25 may also be combined with step S26.

[0037] Figure 15 is an explanatory diagram showing a modified example of the tape material in which protective tape is attached to the release liner in the embodiment. The protective tape 3 is not limited to a configuration in which it is attached to the release liner 5 such that one of the corners of the rectangular shape faces the direction B from which it is fed out, as shown in Figure 12. As shown in Figure 15, the protective tape 3 may be attached to the release liner 5 such that one side of the rectangular shape is parallel to the edge of the edge portion 60 of the release member 6. In this case, the ventilation portion 30 is formed such that the first line segment 30a is parallel to the edge of the edge portion 60 of the release member 6.

[0038] Figure 16 is an explanatory diagram showing how the protective tape is peeled off the release liner in an embodiment, and is a different configuration from Figure 12. As shown in Figure 16, the release member 6 may be installed at an inclination with respect to the direction B from which the protective tape 3 is fed out. In this case as well, the ventilation portion 30 is formed such that the first line segment 30a is parallel to the edge of the edge portion 60 of the release member 6.

[0039] FIG. 17 is an explanatory diagram showing a modification example of the peeling member in the embodiment. As shown in FIG. 17, in the method for manufacturing the semiconductor module 100 according to the embodiment, the swing portion 32 surrounded by the ventilation portion 30 is deformed while peeling the protective tape 3 from the peeling liner 5 by the peeling member 6A made of a roller formed of metal or the like, and the adhesives of the ventilation portions 30 may be separated from each other. Even in this case, the peeling liner 5 is bent at an acute angle by the peeling member 6A and is sent out toward the pulling direction A ２ and is fed out.

[0040] FIG. 18 is an explanatory diagram showing a modified example of the position of the ventilation portion formed in the protective tape in the embodiment. The white arrow shown in FIG. 18 indicates the direction in which the protective tape 3 is pulled. The size of the white arrow represents the strength with which the protective tape 3 is pulled. Also, the square dashed line indicates the boundary between the adhesion region and the non-adhesion region. The outside of the dashed line is the adhesion region, and the inside of the dashed line is the non-adhesion region. The ventilation portion 30 shown in FIG. 18 is formed at a position close to the adhesion region where the protective tape 3 is attached to the frame 11 of the package 1. For example, when the air in the hollow interior 10 of the package 1 expands due to heating, as shown by the white arrow, the protective tape 3 in the non-adhesion region that is not in close contact with the package 1 is pulled in the outer peripheral direction. At this time, the protective tape 3 in the adhesion region hardly变形. Also, at the center of the protective tape 3, the force pulling the protective tape 3 by the adhesion region cancels out, so the force pulling the swing portion 32 becomes weak. That is, by forming the ventilation portion 30 at a position close to the adhesion region, the force pulling the swing portion 32 in the outer peripheral direction is suppressed, so the ventilation portion 30 does not expand, and the state where the swing portion 32 is caught on the protective tape 3 facing each other across the first line segment 30a is maintained. If the deformation of the swing portion 32 is large when the air inside the package 1 expands due to heating, the ventilation portion 30 may expand and the state where the swing portion 32 is caught on the protective tape 3 may be released, and the swing portion 32 may return to the position before separating the adhesives. Thereafter, there is a possibility that the adhesives of the ventilation portion 30 self-fuse during cooling and the ventilation portion 30 closes. Note that this configuration is particularly effective when the linear expansion coefficient of the protective tape 3 is larger than the linear expansion coefficient of the package 1.

[0041] As described above, the method for manufacturing the semiconductor module 100 according to the embodiment includes a step of feeding out the release liner 5 with the protective tape 3 attached thereto along the release member 6 that peels the protective tape 3 from the release liner 5, a step of deforming the swing portion 32 while peeling the protective tape 3 from the release liner 5 by the release member 6 to separate the adhesives of the ventilation portion 30 from each other, and a step of attaching the protective tape 3 peeled from the release liner 5 to the package 1. Therefore, in the method for manufacturing the semiconductor module 100 according to the embodiment, by deforming the swing portion 32 to pre-separate the adhesives in the ventilation portion 30, self-fusion of the ventilation portion 30 can be suppressed, and the hollow interior 10 of the package 1 can be ventilated to the outside. Thereby, when the air in the hollow interior 10 of the package 1 covered with the protective tape 3 expands due to heating or contracts due to cooling, the air pressure difference with the outside can be alleviated.

[0042] That is, even when the air in the hollow interior 10 of the package 1 covered with the protective tape 3 expands due to heating, it is possible to suppress a situation where the protective tape 3 partially floats or peels off. Further, since contraction of the air in the hollow interior 10 of the package 1 can be suppressed, it is possible to suppress a situation where the protective tape 3 bends toward the hollow interior 10 and contact with the semiconductor device component 2 can be suppressed. Thereby, for example, the depth of the hollow interior 10 of the package 1 can be made shallower, so that, for example, the semiconductor module 100 can be miniaturized and the material cost can be reduced. Further, since it is possible to use the protective tape 3 with a weak adhesive force, the operation of peeling the protective tape 3 in the manufacturing process of the electronic device 300 becomes easy, and the adhesive residue caused by using the protective tape 3 with a high adhesive force can also be reduced. Further, by manufacturing the protective tape 3 by punching, which is less expensive than laser processing, the manufacturing cost can be reduced.

[0043] The configuration shown in the above embodiment is an example, and it is also possible to combine it with another known technique, and it is also possible to omit or change a part of the configuration without departing from the gist.

[0044] 1 Package, 2 Semiconductor device component, 3 Protective tape, 4 Circuit board, 5 Release liner, 6, 6A Release member, 10 Hollow interior, 11 Frame, 30, 30A, 30B, 30C, 30D, 30E Ventilation section, 30a First line segment, 30b Second line segment, 30c Third line segment, 30d Fourth line segment, 31 Virtual line segment, 32 Swing section, 60 Edge section, 100 Semiconductor module, 200 Tape material, 300 Electronic device.

Claims

1. A method for manufacturing a semiconductor module comprising a hollow package and a semiconductor device component mounted inside the hollow interior of the package, wherein a protective tape having a ventilation portion and a swing portion that functions as a valve for the ventilation portion formed by a cut is attached so as to cover the inside of the hollow interior of the package, the method comprising: feeding a release liner to which the protective tape is attached along a release member that peels the protective tape from the release liner; deforming the swing portion while peeling the protective tape from the release liner with the release member to separate the adhesives in the ventilation portion; and attaching the protective tape peeled from the release liner to the package.

2. The method for manufacturing a semiconductor module according to claim 1, characterized in that, in the step of separating the adhesives in the ventilation portion, the protective tape is peeled off from the release liner with the release member, and the end of the peeled protective tape is chucked.

3. A method for manufacturing a semiconductor module according to claim 1 or 2, characterized in that, in the step of feeding the release liner along the release member, the release liner to which the protective tape is attached is bent at an acute angle by the release member which peels the protective tape from the release liner, and in the step of separating the adhesives in the ventilation portion, the swing portion is deformed while peeling off the protective tape at the portion in which the release liner is bent at an acute angle by the release member, thereby separating the adhesives in the ventilation portion.

4. The method for manufacturing a semiconductor module according to any one of claims 1 to 3, characterized in that the ventilation portion is formed by a cut including line segments or at least an arc on at least two sides.

5. The method for manufacturing a semiconductor module according to any one of claims 1 to 4, characterized in that the ventilation portion is formed at a position close to the portion attached to the package when the protective tape is attached to the package.

6. A method for manufacturing an electronic device, comprising the steps of: mounting a semiconductor module manufactured by the semiconductor module manufacturing method described in any one of claims 1 to 5 onto a circuit board; and, after mounting the semiconductor module onto the circuit board, peeling off the protective tape from the package.

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