Method for manufacturing electronic device

Abstract

Provided is a method for manufacturing an electronic device that includes a step for preparing a structure (100) that includes an adhesive film (10) provided with a substrate layer (A), an adhesive resin layer (B), and an adhesive resin layer (C), a workpiece (20) temporarily fixed to the adhesive resin layer (B), and a support member (30) temporarily fixed to the adhesive resin layer (C), and a step for processing the workpiece (20) temporarily fixed to the adhesive resin layer (B), wherein the substrate layer (A) is positioned between the adhesive resin layer (B) and the adhesive resin layer (C), the adhesive resin layer (C) contains thermally expandable microspheres, and the number of foreign substances of the adhesive film (10) is less than 10, as observed according to a predetermined method.

Description

Method for manufacturing an electronic device

[0001] The present invention relates to a method for manufacturing an electronic device.

[0002] In the manufacturing process of an electronic device, as a technique using an adhesive film, for example, the techniques described in Patent Documents 1 to 3 can be cited.

[0003] Patent Document 1 aims to provide a dicing tape and a DDAF that are suitable for widening the separation distance while suppressing the floating of a semiconductor chip with a DAF on the dicing tape in an expand process performed using a dicing dicing bond film (DDAF) to obtain a semiconductor chip with a die bond film (DAF), and are suitable for realizing good pick-up properties in the pick-up process. The dicing tape has a laminated structure including a base material and an adhesive layer, and for a dicing tape test piece with a width of 20 mm, the ratio of the second tensile stress that occurs at a strain value of 20% in a tensile test performed under the conditions of an initial chuck distance of 100 mm, 23 °C, and a tensile speed of 1000 mm / min to the first tensile stress that occurs at a strain value of 20% in a tensile test performed under the conditions of an initial chuck distance of 100 mm, 23 °C, and a tensile speed of 10 mm / min is 1.4 or more.

[0004] Patent Document 2 aims to solve the problems that the chip is not held due to the pressure during resin sealing and shifts from the designated position, or that the package is damaged due to the curing of the sealing material or the strong adhesion to the chip surface due to heat when peeling the heat-resistant adhesive sheet for manufacturing a semiconductor device. When resin-sealing a substrate-less semiconductor chip, a heat-resistant adhesive sheet for manufacturing a semiconductor device used by being adhered, the heat-resistant adhesive sheet has a base material layer and an adhesive layer, the adhesive layer has a adhesion to SUS304 of 0.5 N / 20 mm or more after bonding, and cures by the stimulation received until the completion of the resin-sealing process, and has a peel force from the package of 2.0 N / 20 mm or less. A heat-resistant adhesive sheet for manufacturing a semiconductor device characterized by this is described.

[0005] Patent Document 3 describes a method for manufacturing an organic EL panel using an ultrathin glass substrate, in which the ultrathin glass substrate does not "crack" or "chip" during the manufacturing process, organic EL elements can be efficiently formed by vacuum deposition, and the organic EL panel can be recovered after the manufacturing process without damaging the ultrathin glass substrate, and there is no need to include a step to clean the back surface of the ultrathin glass substrate. The method for manufacturing an organic electroluminescent panel in which organic electroluminescent elements are formed on an ultrathin glass substrate by vacuum deposition involves temporarily fixing the ultrathin glass substrate to a support plate via a double-sided adhesive tape having a heat-release adhesive layer containing heat-expandable microspheres that begin to expand and / or foam at a temperature higher than the vacuum deposition temperature on at least one side of the substrate layer, and forming electrodes on the ultrathin glass substrate.

[0006] Patent Document 4 describes an adhesive sheet that achieves both surface smoothness and thin adhesive layer thickness, resulting in less deformation of the adhesive layer during processing, enabling high-precision processing and significantly improving product characteristics and productivity, and is useful as a support sheet for processing electronic components such as small ceramic capacitors. The objective is to provide an adhesive sheet having an adhesive layer containing thermally expandable microspheres on at least one side of a substrate, or an adhesive layer consisting of a resin layer containing thermally expandable microspheres and an adhesive layer, wherein the adhesive layer is laminated on the side opposite to the substrate of the resin layer, and the thickness of the adhesive layer is 10 to 38 μm, and the maximum particle size of the thermally expandable microspheres is less than or equal to the thickness of the adhesive layer, and the mode diameter is 5 to 30 μm.

[0007] Japanese Patent Publication No. 2019-16634, Japanese Patent Publication No. 2011-134811, International Publication No. 2010 / 004703, Japanese Patent Publication No. 2008-45011

[0008] This invention provides a method for manufacturing an electronic device that can reduce the re-adhesion of objects.

[0009] The present invention provides a method for manufacturing an electronic device as follows: [1] A method for manufacturing an electronic device comprising: a step of preparing a structure including an adhesive film having a base layer (A), an adhesive resin layer (B), and an adhesive resin layer (C), a workpiece temporarily fixed to the adhesive resin layer (B), and a support member temporarily fixed to the adhesive resin layer (C); and a step of processing the workpiece temporarily fixed to the adhesive resin layer (B), wherein the base layer (A) is located between the adhesive resin layer (B) and the adhesive resin layer (C), the adhesive resin layer (C) contains thermally expandable microspheres, and the number of foreign objects observed on the adhesive film according to the following (method for observing foreign objects) is less than 10. (Method for observing foreign matter) A structure 1 is fabricated by attaching the adhesive resin layer (C) of the adhesive film to a silicon wafer. Then, the structure 1 is heated at 150°C for 1 hour. Then, the structure 1 is heated at 200°C for 60 seconds. Then, the adhesive film is peeled off from the silicon wafer. Then, the number of foreign matter originating from the adhesive film present in a 1 cm × 1 cm area on the surface of the silicon wafer is observed using a microscope at a magnification of 500x. [2] The method for manufacturing an electronic device according to [1], wherein the thermally expandable microspheres include a thermosetting resin. [3] The method for manufacturing an electronic device according to [2], wherein the thermally expandable microspheres include a shell and a volatile expansion agent within the shell, and the shell includes the thermosetting resin. [4] The method for manufacturing an electronic device according to [2] or [3], wherein the curing temperature of the thermosetting resin is equal to or greater than the foaming temperature of the thermally expandable microspheres. [5] The method for manufacturing an electronic device according to any one of [1] to [4], wherein the foaming temperature of the thermally expandable microspheres is 160°C or higher. [6] The method for manufacturing an electronic device according to any one of [1] to [5], wherein the adhesive resin layer (C) is a layer whose adhesive strength decreases with heat treatment. [7] The method for manufacturing an electronic device according to any one of [1] to [6], wherein the adhesive resin layer (C) includes one or more selected from the group consisting of (meth)acrylic adhesive resins, silicone adhesive resins, urethane adhesive resins, olefin adhesive resins, and styrene adhesive resins.[8] A method for manufacturing an electronic device according to any one of [1] to [7], wherein the content of the thermally expandable microspheres in the adhesive resin layer (C) is 5% by mass or more and 50% by mass or less when the total amount of the adhesive resin layer (C) is 100% by mass. [9] The particle size D at which the cumulative frequency is 50% in the volume-based cumulative frequency distribution curve of the thermally expandable microspheres, measured by a laser diffraction scattering particle size distribution analyzer. ５０ A method for manufacturing an electronic device according to any one of [1] to [8], wherein the thickness of the substrate layer (A) is 5 μm or more and 40 μm or less.

[10] A method for manufacturing an electronic device according to any one of [1] to [9], wherein the substrate layer (A) comprises one or more selected from the group consisting of polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyamide, polyimide, and polyether ether ketone.

[11] A method for manufacturing an electronic device according to any one of [1] to

[10] , wherein the thickness of the adhesive resin layer (C) is 10 μm or more and 100 μm or less.

[12] A method for manufacturing an electronic device according to any one of [1] to

[11] , wherein the thickness of the adhesive resin layer (B) is 1 μm or more and 40 μm or less.

[13] A method for manufacturing an electronic device according to any one of [1] to

[12] , further comprising an intermediate layer (D) between the substrate layer (A) and the adhesive resin layer (B), and between the substrate layer (A) and the adhesive resin layer (C).

[14] The method for manufacturing an electronic device according to

[13] , wherein the thickness of the intermediate layer (D) is 5 μm or more and 100 μm or less.

[15] The method for manufacturing an electronic device according to any one of [1] to

[14] , wherein the electronic device includes a semiconductor package.

[16] The method for manufacturing an electronic device according to

[15] , wherein the semiconductor package includes a fan-out type package.

[0010] According to the present invention, it is possible to provide a method for manufacturing an electronic device that can reduce the re-adhesion of the target object.

[0011] This is a schematic cross-sectional view illustrating an example of a method for manufacturing the electronic device according to this embodiment. This is a schematic cross-sectional view illustrating an example of a method for manufacturing the electronic device according to this embodiment. This is a schematic cross-sectional view illustrating an example of the structure of the adhesive film used in the method for manufacturing the electronic device according to this embodiment, together with the workpiece and support member. This is a schematic cross-sectional view illustrating an example of the structure of the adhesive film used in the method for manufacturing the electronic device according to this embodiment, together with the workpiece and support member.

[0012] In this specification, the term "(meth)acrylate" encompasses both acrylate and methacrylate. The same applies to similar terms such as "(meth)acryloyl." For each component described in this specification, one type may be used, or two or more types may be used in combination. Furthermore, unless otherwise specified, the numerical range "A to B" refers to a range between A and B. To avoid complexity, if there are multiple identical components in the same drawing, only one may be assigned a reference numeral, and none of them may be assigned a reference numeral. Drawings are for illustrative purposes only. The shapes and dimensional ratios of each component in the drawings do not necessarily correspond to actual articles.

[0013] Conventionally, adhesive films sometimes contained thermally expandable microspheres in the adhesive resin layer that came into contact with the object. When heated, these thermally expandable microspheres expand, creating irregularities on the surface of the adhesive resin layer, thereby reducing the contact area between the object and the adhesive resin layer. This makes it easier to peel the object from the adhesive resin layer. The inventors' research revealed that when heating an adhesive film to peel it off, if the heating temperature is high or the heating time is long, the expanded thermally expandable microspheres become prone to rupture. When the thermally expandable microspheres rupture, they contract, causing the contact area between the object and the adhesive resin layer, which had been reduced, to increase again. As a result, the object becomes more likely to reattach to the adhesive resin layer. Furthermore, this led to the discovery that objects become more likely to reattach to the adhesive resin layer during the manufacturing process of electronic devices. Based on the above findings, the inventors conducted further investigations to solve the above problems and found that the number of foreign matter observed under predetermined conditions on a silicon wafer to which an adhesive film is attached is related to the re-adhesion of the adhesive film after heating. Further investigations by the inventors revealed that by reducing the number of foreign matter to a predetermined value or less, an adhesive film that can reduce re-adhesion to the target object can be obtained, thus completing the present invention.

[0014] <Method for Manufacturing Electronic Devices> The present invention includes the following first and second inventions.

[0015] 1. The method for manufacturing an electronic device according to this embodiment of the first invention includes a step of preparing a structure comprising an adhesive film having a base layer (A), an adhesive resin layer (B), and an adhesive resin layer (C), a workpiece temporarily fixed to the adhesive resin layer (B), and a support member temporarily fixed to the adhesive resin layer (C). The method for manufacturing an electronic device according to this embodiment includes a step of processing the workpiece temporarily fixed to the adhesive resin layer (B). In the method for manufacturing an electronic device according to this embodiment, the base layer (A) is located between the adhesive resin layer (B) and the adhesive resin layer (C). In the method for manufacturing an electronic device according to this embodiment, the adhesive resin layer (C) includes thermally expandable microspheres. In the method for manufacturing an electronic device according to this embodiment, the number of foreign objects observed on the adhesive film according to the following (method for observing foreign objects) is less than 10. (Method for observing foreign objects) A structure 1 is made by attaching the adhesive resin layer (C) of the adhesive film to a silicon wafer. Next, the structure 1 is heated at 150°C for 1 hour. Next, structure 1 is heated at 200°C for 60 seconds. Then, the adhesive film is peeled off the silicon wafer. Next, the number of foreign matter originating from the adhesive film present in a 1 cm × 1 cm area on the surface of the silicon wafer is observed using a microscope at a magnification of 500x. The manufacturing method of the electronic device of this embodiment, having the above configuration, can reduce the re-adhesion of the target material.

[0016] The reason for this is not entirely clear, but the following reasons can be inferred. The number of foreign particles mentioned above is thought to represent the degree of reduction in the resistance of the adhesive resin layer (C) surface to other objects before and after heat treatment. In other words, when the number of foreign particles is small (close to zero), it is thought that the surface of the adhesive resin layer (C) of the adhesive film after heat treatment is less likely to adhere to other objects. Since the adhesive film used in the manufacturing method of the electronic device of this embodiment has fewer than 10 foreign particles, it is thought that the surface of the adhesive resin layer (C) of the adhesive film after heat treatment is less likely to adhere to other objects. For this reason, the adhesive film used in the manufacturing method of the electronic device of this embodiment is thought to be less likely to re-adhere to the target object even if the heating temperature is high or the heating time is long when heating to peel off the adhesive film. As a result, it is thought that the manufacturing method of the electronic device of this embodiment can reduce the re-adhesion of the target object.

[0017] 2. The method for manufacturing an electronic device according to this embodiment of the second invention includes the step of preparing a structure comprising an adhesive film having a base layer (A), an adhesive resin layer (B), and an adhesive resin layer (C), a workpiece temporarily fixed to the adhesive resin layer (B), and a support member temporarily fixed to the adhesive resin layer (C). The method for manufacturing an electronic device according to this embodiment includes the step of processing the workpiece temporarily fixed to the adhesive resin layer (B). In the method for manufacturing an electronic device according to this embodiment, the base layer (A) is located between the adhesive resin layer (B) and the adhesive resin layer (C). In the method for manufacturing an electronic device according to this embodiment, the adhesive resin layer (C) contains thermally expandable microspheres. In the method for manufacturing an electronic device according to this embodiment, the particle evaluation value of the adhesive film, measured according to the following (method for evaluating particles), is less than 10,000. (Method for evaluating particles) A ​​silicon wafer is heated at 150°C for 1 hour. Then, the silicon wafer is left to cool in a clean room at 23°C for 30 minutes. Next, the silicon wafer is heated at 200°C for 60 seconds. Then, the particles on the surface of the silicon wafer are counted using a wafer surface inspection device. The total number of particles at this time is defined as the measured value P2. Next, a structure 2 is fabricated by attaching an adhesive resin layer (C) of an adhesive film to the silicon wafer. Next, structure 2 is heated at 150°C for 1 hour. Next, structure 2 is cooled by standing in a clean room at 23°C for 30 minutes. Next, structure 2 is heated at 200°C for 60 seconds. Next, the adhesive film is peeled off the silicon wafer. Then, the particles on the surface of the silicon wafer are counted using a wafer surface inspection device. The total number of particles at this time is defined as the measured value P1. Next, the value obtained by subtracting the measured value P2 from the measured value P1 (P1-P2) is defined as the particle evaluation value. The manufacturing method of the electronic device of this embodiment, having the above configuration, can reduce the re-adhesion of the target object.

[0018] The reason for this is not entirely clear, but the following reasons can be inferred. The particle evaluation value mentioned above is thought to represent the degree of reduction in the resistance of the adhesive resin layer (C) surface to other objects before and after heat treatment. In other words, when the particle evaluation value is small (close to 0), it is thought to indicate that the surface of the adhesive resin layer (C) of the adhesive film after heat treatment is less likely to adhere to other objects. Since the particle evaluation value of the adhesive film used in the manufacturing method of the electronic device of this embodiment is less than 10,000, it is thought that the surface of the adhesive resin layer (C) of the adhesive film after heat treatment is less likely to adhere to other objects. For this reason, the adhesive film used in the manufacturing method of the electronic device of this embodiment is thought to be less likely to re-adhere to the target object even if the heating temperature is high or the heating time is long when heating to peel off the adhesive film. As a result, it is thought that the manufacturing method of the electronic device of this embodiment can reduce the re-adhesion of the target object.

[0019] The first and second inventions will be described together below.

[0020] The following describes a method for manufacturing an electronic device (manufacturing method Y) when the adhesive resin layer (C) of the adhesive film 10 of this embodiment, which will be described later, is in contact with the support member 30.

[0021] [Manufacturing Method Y] Manufacturing method Y includes, for example, the following two steps: (1) A step of preparing a structure 100 including an adhesive film 10 and a workpiece 20 temporarily fixed to the adhesive film 10 (step Y1) (2) A step of processing the workpiece 20 temporarily fixed to the adhesive film 10 (step Y2)

[0022] As described above, the adhesive film 10 of this embodiment can reduce re-adhesion to the object. Therefore, according to the manufacturing method of an electronic device using the adhesive film 10 of this embodiment (manufacturing method Y), re-adhesion of the support member 30 during the manufacturing process can be reduced. As a result, according to the manufacturing method of an electronic device using the adhesive film 10 of this embodiment (manufacturing method Y), re-adhesion of the object can be reduced.

[0023] The following describes each step of manufacturing method Y with reference to Figure 1. The adhesive film 10 used in manufacturing method Y comprises a base layer (A) and an adhesive resin layer (C), as well as an additional adhesive resin layer (B) on the first surface A1 side of the base layer (A). In other words, the adhesive film 10 used in manufacturing method Y comprises a base layer (A), an adhesive resin layer (B), and an adhesive resin layer (C). Furthermore, in the adhesive film 10 used in manufacturing method Y, the base layer (A) is located between the adhesive resin layer (B) and the adhesive resin layer (C).

[0024] (Process Y1) In process Y1, a structure 100 is prepared, which includes an adhesive film 10 and a workpiece 20 temporarily fixed to the adhesive resin layer (B) of the adhesive film 10. The structure 100 is also temporarily fixed to a support member 30 by the adhesive resin layer (C) of the adhesive film 10. In other words, process Y1 includes the process of preparing a structure 100 which includes an adhesive film 10, a workpiece 20 temporarily fixed to the adhesive resin layer (B) of the adhesive film 10, and a support member 30 temporarily fixed to the adhesive resin layer (C) of the adhesive film 10. Note that the temporary fixing of the adhesive resin layer (B) of the adhesive film 10 to the workpiece 20 and the temporary fixing of the adhesive resin layer (C) of the adhesive film 10 to the support member 30 may be performed simultaneously, or one temporary fixing may be performed after the other temporary fixing.

[0025] Such a structure 100 can be manufactured, for example, by the following procedure. First, an adhesive film 10 is attached to the support member 30 so that the adhesive resin layer (C) faces the support member 30. A protective film called a separator may be attached to the adhesive resin layer (C). In this case, the protective film is peeled off and the exposed surface of the adhesive resin layer (C) is attached to the surface of the support member 30.

[0026] Next, the structure 100 can be manufactured by attaching the workpiece 20 to the adhesive resin layer (B) of the adhesive film 10 which is attached to the support member 30.

[0027] (Process Y2) In process Y2, the workpiece 20, which is temporarily fixed to the adhesive film 10, is processed. The content of the processing applied to the workpiece 20 is not particularly limited. In Figure 1, the workpiece 20 is the workpiece 40 after processing. The processing applied to the workpiece 20 may be, for example, the sealing of electronic components with a sealing material. Alternatively, the processing applied to the workpiece 20 may be, for example, the dicing of electronic components using a dicing device. Alternatively, the processing applied to the workpiece 20 may be, for example, the processing of a thin glass substrate, such as forming electronic components on a thin glass substrate.

[0028] (Step Y3) The manufacturing method Y preferably further includes step Y3 after step Y2. In step Y3, the adhesive force of the adhesive resin layer (C) is reduced by applying an external stimulus, thereby peeling the structure 100 from the support member 30.

[0029] For example, after processing the workpiece 20, the support member 30 can be separated from the structure 100 by heating the structure 100 to a temperature of 160°C or higher to reduce the adhesive strength of the adhesive resin layer (C). Specifically, by heating the structure 100, the thermally expandable microspheres in the adhesive resin layer (C) of the adhesive film 10 are foamed, thereby reducing the adhesive strength.

[0030] Furthermore, manufacturing method Y may include additional steps other than steps Y1 to Y3, as needed.

[0031] Next, we will explain manufacturing method Y using a specific example (manufacturing method Ya). Manufacturing method Ya is a manufacturing method Y in which the processing applied to the workpiece 20 is the sealing of an electronic component 24 with a sealing material 50.

[0032] [Manufacturing Method Ya] Manufacturing method Ya includes, for example, the following two steps: (1) A step of preparing a structure 400 including an adhesive film 10 and an electronic component 24 temporarily fixed to the adhesive film 10 (step Y1a) (2) A step of sealing the electronic component 24 with a sealing material 50 (step Y2a)

[0033] The following describes each step of manufacturing method Ya, with reference to Figures 2 and 3.

[0034] (Step Y1a) In step Y1a, a structure 400 is prepared, comprising an adhesive film 10, an electronic component 24 temporarily fixed to an adhesive resin layer (B), and a support substrate 31 temporarily fixed to an adhesive resin layer (C). The structure 400 can be manufactured, for example, by attaching the electronic component 24 to the adhesive resin layer (B) of the adhesive film 10. Step Y1a corresponds to step Y1 of manufacturing method Y.

[0035] (Process Y2a) In process Y2a, the electronic component 24, which has been temporarily fixed to the adhesive film 10, is sealed with a sealing material 50. For example, the electronic component 24 can be sealed by curing the sealing material 50 at a temperature of 150°C or lower while the electronic component 24 is covered with the sealing material 50. Process Y2a corresponds to process Y2 of manufacturing method Y.

[0036] The sealing material 50 is not particularly limited, but for example, it is an epoxy resin-based sealing material using epoxy resin. The form of the sealing material 50 is also not particularly limited, but for example, it is granular, sheet-like, or liquid. In particular, the sealing material 50 is preferably a liquid epoxy resin-based sealing material from the viewpoint of improving the affinity between the adhesive film 10 and the sealing material 50 and reducing uneven sealing of the electronic components 24. As such an epoxy resin-based sealing material, for example, the T693 / R4000 series, T693 / R1000 series, T693 / R5000 series, etc. manufactured by Nagase ChemteX Corporation can be used.

[0037] Examples of sealing methods include transfer molding, injection molding, compression molding, and casting.

[0038] (Step Y3a) The manufacturing method Ya preferably further includes step Y3a after step Y2a. In step Y3a, the adhesive strength of the adhesive resin layer (C) is reduced by applying an external stimulus to peel the support substrate 31 from the structure 400. The support substrate 31 can be separated from the adhesive film 10 by, for example, encapsulating the electronic components 24 and then heating it to a temperature of 160°C or higher to reduce the adhesive strength of the adhesive resin layer (C).

[0039] (Step Y4a) Manufacturing method Ya preferably further includes step Y4a after step Y3a. In step Y4a, the adhesive film 10 is peeled off from the electronic component 24 sealed with the sealing material 50 to obtain the electronic device 500. Examples of the method for peeling the adhesive film 10 from the electronic component 24 sealed with the sealing material 50 include a method of mechanically peeling, a method of peeling after reducing the adhesive force on the surface of the adhesive film 10, and the like.

[0040] (Step Y5a) Manufacturing method Ya preferably further includes step Y5a between step Y1a and step Y2a. In step Y5a, the structure 400 obtained in step Y1a is heated. Thereby, in the adhesive film 10, the adhesive force of the adhesive resin layer (B) with respect to the electronic component 24 can be improved. As a result, in step Y2a of performing the sealing, when the electronic component 24 is sealed with the sealing material 50, it is possible to reduce the displacement of the position of the electronic component 24 due to the pressure caused by the flow of the sealing material 50 or the outgas derived from moisture.

[0041] In step Y5a, the upper limit of the temperature when heating the structure 400 is not particularly limited as long as it is a temperature at which the adhesive force of the adhesive resin layer (B) with respect to the electronic component 24 can be improved. Preferably, it is less than 160°C, more preferably 155°C or less, and still more preferably 150°C or less. Thereby, it is possible to reduce the sudden generation of outgas derived from moisture contained in the adhesive film 10. As a result, in step Y5a and step Y2a, it is possible to further reduce the displacement of the position of the electronic component 24 due to the outgas derived from moisture. Further, when the temperature when heating the structure 400 is less than or equal to the above upper limit value, the thermal expansion of the thermally expandable microspheres in the adhesive resin layer (C) is reduced, so that the reduction in the adhesive force of the adhesive film 10 with respect to the support substrate 31 is reduced. As a result, in step Y2a of sealing the electronic component 24, it is possible to reduce the peeling of the adhesive film 10 from the support substrate 31.

[0042] In step Y5a, the lower limit temperature when heating the structure 400 is not particularly limited as long as it can improve the adhesive strength of the adhesive resin layer (B) with respect to the electronic component 24, but is preferably 70°C or higher, more preferably 80°C or higher, still more preferably 90°C or higher, and still more preferably 100°C or higher. Thereby, the heating time in step Y5a can be shortened. As a result, the manufacturing time of the electronic device 600 can be shortened and the productivity of the electronic device 600 can be improved.

[0043] The heating time of the structure 400 is not particularly limited as long as it can improve the adhesive strength of the adhesive resin layer (B) with respect to the electronic component 24, but is, for example, 1 minute or more and 120 minutes or less, preferably 5 minutes or more and 80 minutes or less. The method of heating the structure 400 is not particularly limited, and examples thereof include heat treatment methods such as an oven, a dryer, a heating roll, and a drying furnace.

[0044] Whether the adhesive strength of the adhesive resin layer (B) with respect to the electronic component 24 has been improved can be determined, for example, by the shear strength between the electronic component 24 and the adhesive film 10.

[0045] (Step Y6a) The manufacturing method Ya preferably further includes step Y6a after step Y4a. In step Y6a, a wiring layer 510 and bumps 520 are formed on the exposed surface of the obtained electronic device 500.

[0046] The wiring layer 510 includes pads (not shown) which are external connection terminals formed on the outermost surface, and wirings (not shown) which electrically connect the electronic component 24 and the pads. The wiring layer 510 can be formed by a conventionally known method and may have a multilayer structure.

[0047] Then, by forming the bumps 520 on the pads of the wiring layer 510, the electronic device 500 can be manufactured. Examples of the bumps 520 include solder bumps and gold bumps. The solder bumps can be formed, for example, by arranging solder balls on the pads which are the external connection terminals of the wiring layer 510 and heating to melt the solder (reflow). The gold bumps can be formed by methods such as the ball bonding method, the plating method, and the Au ball transfer method.

[0048] (Step Y7a) The manufacturing method Ya preferably further includes step Y7a after step Y6a. In step Y7a, multiple electronic devices 600 can be manufactured by dicing the electronic device 500. A known method can be used for dicing the electronic device 500.

[0049] <Applications of the Method for Manufacturing Electronic Devices> The method for manufacturing electronic devices of this embodiment can reduce the re-adhesion of the object, and therefore its applications are not particularly limited and can be used in methods for manufacturing electronic devices that include a step of temporarily fixing various objects. Here, in this specification, "object" means an object that is temporarily fixed by an adhesive film. The object includes, for example, one or more selected from the group consisting of a workpiece and a support member. Here, in this specification, "workpiece" means an object that is processed while it is temporarily fixed to another object by an adhesive film. Also, in this specification, a support member means a member that temporarily fixes the workpiece with an adhesive film. The workpiece includes, for example, one or more selected from the group consisting of electronic components and a substrate.

[0050] Examples of electronic components include semiconductor chips, semiconductor panels, semiconductor packages, electrical elements, display devices, thermal heads, and solar cells. Examples of semiconductor chips include ICs, LSIs, discrete components, light-emitting diodes, and photodetectors. Examples of electrical elements include ceramic capacitors and oscillators. Examples of semiconductor packages include fan-out type packages.

[0051] Examples of electronic components include semiconductor chips, semiconductor panels, semiconductor packages, electrical elements, display devices, thermal heads, and solar cells. Examples of semiconductor chips include ICs, LSIs, discrete components, light-emitting diodes, and photodetectors. Examples of electrical elements include ceramic capacitors and oscillators. Examples of semiconductor packages include fan-out type packages.

[0052] Examples of substrates include semiconductor substrates, package substrates in which multiple semiconductor chips are encapsulated together with a sealing resin, printed circuit boards (multilayer ceramic sheets), green sheets for multilayer ceramic capacitors, and thin glass substrates. Examples of semiconductor substrates include silicon substrates, germanium substrates, gallium-arsenide substrates, gallium-phosphorus substrates, and gallium-arsenide-aluminum substrates. Preferably, the semiconductor substrate includes a semiconductor substrate on which circuits are formed on the surface. Examples of package substrates in which multiple semiconductor chips are encapsulated together with a sealing resin include mold array package substrates, fan-out type package substrates, and wafer-level package substrates. Examples of thin glass substrates include glass substrates having a thickness of 10 μm to 150 μm.

[0053] The support member is not particularly limited as long as it can hold the workpiece with an adhesive film. Examples of support members include support substrates and support bases. Examples of support substrates include silicon substrates, glass substrates, SUS substrates, copper substrates, and acrylic substrates.

[0054] The adhesive film of this embodiment can temporarily fix at least one of electronic components and substrates. Furthermore, the adhesive film of this embodiment can be applied to one or more types selected from the group consisting of, for example, tapes for temporarily fixing electronic components, tapes for processing substrates, dicing tapes, backgrinding tapes, and surface protection tapes.

[0055] The adhesive film of this embodiment can be used as a temporary fixing tape for electronic components, for example, to manufacture an electronic device including a fan-out type package. In this case, the electronic device of this embodiment includes a semiconductor package. The semiconductor package includes, for example, a fan-out type package. The adhesive film of this embodiment may also be used as a temporary fixing tape for electronic components to temporarily fix other types of electronic components.

[0056] Furthermore, the adhesive film of this embodiment can be used as a dicing tape, for example, to temporarily fix electronic components in the dicing process of electronic components. Examples of electronic component dicing processes include the dicing process of semiconductor packages; the dicing process of electrical elements such as ceramic capacitors; and the dicing process of other electronic components such as semiconductor chips, semiconductor panels, display devices, thermal heads, and solar cells.

[0057] Furthermore, the adhesive film of this embodiment can be used as a backgrind tape, for example, to temporarily fix electronic components in the backgrinding process of electronic components.

[0058] Furthermore, the adhesive film of this embodiment can be used as a substrate processing tape, for example, to temporarily fix a thin glass substrate in the processing step of a thin glass substrate. Note that the substrate processing tape is not limited to thin glass substrates and may be used in the processing steps of other types of substrates.

[0059] Furthermore, the adhesive film of this embodiment can be used as a surface protection tape, for example, to protect the surface of an object.

[0060] <Structure of the Adhesive Film> Next, the thermally expandable microspheres and each layer that constitute the adhesive film used in the manufacturing method of the electronic device of this embodiment will be described.

[0061] [Thermally Expandable Microspheres] Thermally expandable microspheres are, for example, tiny spherical resin compositions that expand upon heating. The thermally expandable microspheres of this embodiment include, for example, a thermoplastic resin, a volatile expanding agent, a thermosetting resin, a curing agent, and other additives. The thermally expandable microspheres of this embodiment preferably contain a thermosetting resin from the viewpoint of further reducing re-adhesion to the object.

[0062] The thermally expandable microspheres preferably comprise a shell and a volatile expanding agent within the shell. In this case, the shell more preferably comprises a thermosetting resin. More preferably, the thermally expandable microspheres have a structure that encapsulates the volatile expanding agent in the space inside the shell. With such a structure, for example, the volatile expanding agent volatilizes and turns into a gas upon heating, causing the shell to expand.

[0063] The thermosetting resin includes, for example, one or more selected from the group consisting of epoxy resins, phenolic resins, melamine resins, urea resins, polyimide resins, and bismaleimide resins. From the viewpoint of further reducing re-adhesion to the object, the thermosetting resin preferably includes one or more selected from the group consisting of epoxy resins and phenolic resins. The epoxy resin includes, for example, one or more selected from the group consisting of bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, dicyclopentadiene type epoxy resins, and glycidylamine type epoxy resins. The phenolic resin includes, for example, one or more selected from the group consisting of novolac type phenolic resins, resol type phenolic resins, and benzyl ether type phenolic resins.

[0064] When the thermally expandable microspheres contain a thermosetting resin, the thermally expandable microspheres preferably contain a curing agent from the viewpoint of being able to cure the thermosetting resin. The curing agent can be selected according to the type of thermosetting resin. The thermally expandable microspheres may contain a catalyst used to cure the thermosetting resin as needed.

[0065] The shell may include a thermoplastic resin in addition to a thermosetting resin as a material for forming the shell. The thermoplastic resin used as a material for forming the shell may include, for example, one or more selected from the group consisting of vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone.

[0066] A volatile expanding agent is, for example, a substance that turns into a gas when heated. The volatile expanding agent includes, for example, one or more selected from the group consisting of ethane, ethylene, propane, propene, n-butane, isobutane, butene, isobutene, n-pentane, isopentane, neopentane, n-hexane, heptane, and petroleum ether. From the viewpoint of being able to improve the foaming rate of the thermally expandable microspheres, the volatile expanding agent preferably includes one or more selected from the group consisting of propane, n-butane, isobutane, n-pentane, isopentane, and neopentane.

[0067] Thermally expandable microspheres can be manufactured, for example, by coacervation, interfacial polymerization, or the like.

[0068] The curing temperature of the thermosetting resin is preferably above the foaming temperature of the thermally expandable microspheres, from the viewpoint of reducing damage to the thermally expandable microspheres due to heating. The curing temperature of the thermosetting resin is the temperature at which the thermosetting resin begins to harden due to crosslinking reactions, etc. The foaming temperature of the thermally expandable microspheres is the temperature at which the volume of the thermally expandable microspheres begins to increase due to the vaporization of the volatile expanding agent.

[0069] The foaming temperature of the thermally expandable microspheres is preferably 160°C or higher, more preferably 165°C or higher, even more preferably 170°C or higher, even more preferably 175°C or higher, and even more preferably 180°C or higher, from the viewpoint of facilitating the formation of the adhesive resin layer (C) containing the thermally expandable microspheres. The upper limit of the foaming temperature of the thermally expandable microspheres is not particularly limited, but may be, for example, 300°C or lower, 275°C or lower, 250°C or lower, 225°C or lower, or 200°C or lower. The foaming temperature of the thermally expandable microspheres is preferably 160°C or higher and 300°C or lower, more preferably 165°C or higher and 275°C or lower, even more preferably 170°C or higher and 250°C or lower, even more preferably 175°C or higher and 225°C or lower, and even more preferably 180°C or higher and 200°C or lower, from the viewpoint of facilitating the formation of the adhesive resin layer (C) containing the thermally expandable microspheres.

[0070] In the volume-based cumulative frequency distribution curve of thermally expandable microspheres, measured by a laser diffraction scattering particle size distribution analyzer, the particle size D at 50% cumulative frequency is... ５０ From the viewpoint of improving the peelability of the adhesive film, the thickness is preferably 5 μm to 40 μm, more preferably 10 μm to 30 μm, and even more preferably 15 μm to 25 μm.

[0071] [Base layer (A)] The base layer (A) is a layer provided for the purpose of improving the handling properties, mechanical properties, heat resistance, and other properties of the adhesive film. The base layer (A) is not particularly limited, but an example is a resin film. The base layer (A) has a first surface A1 and a second surface A2 which is the surface opposite to the first surface A1.

[0072] The resins constituting the resin film include, for example, thermoplastic resins. The resins constituting the resin film include, for example, one or more selected from the group consisting of polyolefins, polyesters, polyamides, poly(meth)acrylates, polyvinyl chloride, polyvinylidene chloride, polyimides, polyetherimides, ethylene-vinyl acetate copolymers, polyacrylonitriles, polycarbonates, polystyrenes, ionomers, polysulfones, polyethersulfones, polyphenylene ethers, and aromatic polyetherketones. Polyolefins include, for example, one or more selected from the group consisting of polyethylene, polypropylene, poly(4-methyl-1-pentene), and poly(1-butene). Polyesters include, for example, one or more selected from the group consisting of polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate. Polyamides include, for example, one or more selected from the group consisting of nylon-6, nylon-66, and polymetaxylene adipamide. Aromatic polyether ketones include, for example, one or more selected from the group consisting of polyether ketone (PEK), polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polyether ether ketone ketone (PEEKK), and polyether ketone esters.

[0073] The resin constituting the resin film preferably comprises one or more selected from the group consisting of polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyamide, polyimide, and polyetheretherketone, from the viewpoint of improving the balance of transparency, mechanical strength, and price, more preferably comprising one or more selected from the group consisting of polyethylene terephthalate and polyethylene naphthalate, and even more preferably comprising polyethylene terephthalate.

[0074] The base layer (A) may be a single layer or two or more layers. The resin film used to form the base layer (A) is, for example, a stretched film, and is preferably a film stretched in one or two axes from the viewpoint of improving the mechanical strength of the base layer (A).

[0075] From the viewpoint of improving film properties, the thickness of the substrate layer (A) is preferably 1 μm to 500 μm, more preferably 5 μm to 400 μm, even more preferably 10 μm to 300 μm, even more preferably 20 μm to 200 μm, even more preferably 25 μm to 100 μm, even more preferably 30 μm to 50 μm, and even more preferably 35 μm to 45 μm.

[0076] [Adhesive Resin Layer (B)] The adhesive film of this embodiment may further comprise an adhesive resin layer (B). The adhesive resin layer (B) is a layer located on one side (first surface A1 side) of the base layer (A). The adhesive resin layer (B) is, for example, a layer for temporarily fixing an object by contacting its surface. The adhesive resin layer (B) can, for example, temporarily fix at least one of the workpiece and the support member.

[0077] The adhesive resin (B1) constituting the adhesive resin layer (B) preferably includes one or more selected from the group consisting of (meth)acrylic adhesive resins, silicone adhesive resins, urethane adhesive resins, olefin adhesive resins, and styrene adhesive resins, from the viewpoint of improving the balance between adhesive strength and heat resistance. The adhesive resin (B1) constituting the adhesive resin layer (B) more preferably includes a (meth)acrylic adhesive resin, from the viewpoint of easily adjusting the adhesive strength.

[0078] As the adhesive resin layer (B), for example, a radiation-crosslinked adhesive resin layer whose adhesive strength can be reduced by radiation can be used. The radiation-crosslinked adhesive resin layer (B) becomes easier to peel off the adhesive film from the object because its adhesive strength decreases due to crosslinking upon irradiation with radiation. Examples of radiation include ultraviolet rays, electron beams, and infrared rays. As the radiation-crosslinked adhesive resin layer, an ultraviolet-crosslinked adhesive resin layer is preferred.

[0079] The adhesive resin layer (B) preferably further contains, in addition to the adhesive resin (B1), a crosslinking agent (B2) having two or more crosslinkable functional groups in one molecule. The crosslinking agent (B2) is used to react with the functional groups of the adhesive resin (B1) to adjust the adhesive strength and cohesive strength of the adhesive resin layer (B).

[0080] The crosslinking agent (B2) includes, for example, one or more selected from the group consisting of epoxy crosslinking agents, isocyanate crosslinking agents, aziridine crosslinking agents, tetrafunctional epoxy crosslinking agents, and melamine crosslinking agents, and preferably includes one or more selected from the group consisting of epoxy crosslinking agents, isocyanate crosslinking agents, and aziridine crosslinking agents.

[0081] From the viewpoint of improving the balance between the adhesive strength and heat resistance performance of the adhesive resin layer (B), the content of the crosslinking agent (B2) in the adhesive resin layer (B) is preferably 0.1 parts by mass or more and 15 parts by mass or less, more preferably 1 part by mass or more and 12 parts by mass or less, even more preferably 3 parts by mass or more and 10 parts by mass or less, and even more preferably 5 parts by mass or more and 8 parts by mass or less, when the content of the adhesive resin (B1) in the adhesive resin layer (B) is 100 parts by mass.

[0082] From the viewpoint of improving the balance between adhesive strength and heat resistance, the total content of the adhesive resin (B1) and crosslinking agent (B2) in the adhesive resin layer (B) is preferably 50% to 100% by mass, more preferably 70% to 100% by mass, even more preferably 90% to 100% by mass, and even more preferably 95% to 100% by mass, when the total amount of the adhesive resin layer (B) is 100% by mass.

[0083] In the adhesive film of this embodiment, when the adhesive strength of the adhesive resin layer (C) is reduced by heat treatment and the support member is peeled off from the adhesive resin layer (C), the content of thermally expandable microspheres in the adhesive resin layer (B) is preferably 0.1% by mass or less, more preferably 0.05% by mass or less, even more preferably 0.01% by mass or less, and even more preferably 0% by mass, when the total amount of the adhesive resin layer (B) is 100% by mass.

[0084] The thickness of the adhesive resin layer (B) is preferably 1 μm to 40 μm, more preferably 2 μm to 30 μm, even more preferably 3 μm to 25 μm, even more preferably 4 μm to 20 μm, and even more preferably 5 μm to 15 μm, from the viewpoint of improving the balance between adhesive strength and heat resistance.

[0085] The adhesive resin layer (B) can be formed, for example, by applying an adhesive onto the substrate layer (A). The adhesive may be dissolved in a solvent and applied as a coating solution, applied as an aqueous emulsion, or applied directly as a liquid adhesive. The substrate layer (A) and the adhesive resin layer (B) may be formed by co-extrusion molding, or by laminating (layering) a film-like substrate layer (A) and a film-like adhesive resin layer (B).

[0086] [Adhesive resin layer (C)] The adhesive resin layer (C) is a layer located on the second surface A2 side of the base layer (A). Preferably, the adhesive resin layer (C) is a layer whose adhesive strength decreases with heat treatment. This allows the adhesive film to be peeled off the object by heat treatment.

[0087] The adhesive resin layer (C) of this embodiment includes thermally expandable microspheres, from the viewpoint of improving thermal release properties.

[0088] In the adhesive resin layer (C) of this embodiment, the temperature at which the adhesive strength decreases or is lost is preferably 160°C or higher, more preferably 165°C or higher, even more preferably 170°C or higher, even more preferably 175°C or higher, and even more preferably 180°C or higher. Such an adhesive resin layer (C) can be formed by selecting the type of thermally expandable microspheres in the adhesive resin layer (C).

[0089] Here, the decrease or loss of adhesive strength due to heating at a temperature of 160°C or higher can be evaluated, for example, by the following (Method for Evaluating Decrease in Adhesion Strength). In this specification, loss of adhesive strength means, for example, when the 180° peel strength measured under conditions of 23°C and a tensile speed of 300 mm / min becomes less than 0.5 N / 25 mm. (Method for Evaluating Decrease in Adhesion Strength) The adhesive resin layer (C) side of the adhesive film is attached to a stainless steel plate and heat-treated at 140°C for 1 hour. Next, it is heated at a temperature of 160°C or higher for 2 minutes. After heating, the peel strength of the adhesive film from the stainless steel plate is measured. The specific heating temperature when heating at a temperature of 160°C or higher is appropriately set depending on the type of gas generated, the type of thermally expandable microspheres, the temperature at which the gas is generated, and the temperature at which the thermally expandable microspheres expand (foaming temperature).

[0090] From the viewpoint of improving thermal release properties, the content of thermally expandable microspheres in the adhesive resin layer (C) is preferably 5% to 50% by mass, more preferably 6% to 45% by mass, even more preferably 7% to 40% by mass, even more preferably 8% to 35% by mass, even more preferably 9% to 30% by mass, and even more preferably 10% to 25% by mass, when the total amount of the adhesive resin layer (C) is 100% by mass.

[0091] From the viewpoint of improving thermal release properties, the content of thermally expandable microspheres in the adhesive resin layer (C) is preferably 1 to 150 parts by mass, more preferably 3 to 100 parts by mass, even more preferably 5 to 50 parts by mass, even more preferably 8 to 40 parts by mass, even more preferably 10 to 30 parts by mass, and even more preferably 12 to 28 parts by mass, when the content of adhesive resin (C1) in the adhesive resin layer (C) is 100 parts by mass.

[0092] The adhesive resin (C1) constituting the adhesive resin layer (C) includes, for example, one or more types selected from the group consisting of (meth)acrylic adhesive resins, silicone adhesive resins, urethane adhesive resins, olefin adhesive resins, polyester adhesive resins, polyamide adhesive resins, fluorine adhesive resins, and styrene adhesive resins.

[0093] The adhesive resin (C1) constituting the adhesive resin layer (C) preferably includes one or more selected from the group consisting of (meth)acrylic adhesive resins, silicone adhesive resins, urethane adhesive resins, olefin adhesive resins, and styrene adhesive resins, from the viewpoint of improving thermal release properties. The adhesive resin (C1) constituting the adhesive resin layer (C) more preferably includes a (meth)acrylic adhesive resin, from the viewpoint of easily adjusting the adhesive strength.

[0094] Examples of the (meth)acrylic adhesive resin (c) used in the adhesive resin layer (C) include copolymers comprising a constituent unit (c1) of an alkyl (meth)acrylate and a constituent unit (c2) having a functional group that can react with a crosslinking agent (C2).

[0095] (Meth)acrylic adhesive resin (c) can be produced, for example, by copolymerizing a monomer that forms a constituent unit (c1) of an alkyl (meth)acrylate (hereinafter also referred to as monomer (c1)) and a monomer that forms a constituent unit (c2) having a functional group that can react with a crosslinking agent (C2) (hereinafter also referred to as monomer (c2)).

[0096] The monomer (c1) preferably comprises one or more selected from the group consisting of an alkyl (meth)acrylate having an alkyl group having about 1 to 12 carbon atoms, more preferably an alkyl (meth)acrylate having an alkyl group having 1 to 8 carbon atoms, and even more preferably one or more selected from the group consisting of methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate.

[0097] The content of constituent unit (c1) in the (meth)acrylic adhesive resin (c) is preferably 10% by mass or more and 99% by mass or less, more preferably 50% by mass or more and 97% by mass or less, and even more preferably 85% by mass or more and 95% by mass or less, when the total amount of the (meth)acrylic adhesive resin (c) is 100% by mass.

[0098] The monomer (c2) includes, for example, one or more selected from the group consisting of (meth)acrylic acid, itaconic acid, mesaconic acid, citraconic acid, fumaric acid, maleic acid, monoalkyl itaconic acid, monoalkyl mesaconic acid, monoalkyl citraconic acid, monoalkyl fumaric acid, monoalkyl maleic acid, glycidyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, (meth)acrylamide, and t-butylaminoethyl (meth)acrylate. Preferably, the monomer (c2) includes one or more selected from the group consisting of (meth)acrylic acid, 2-hydroxyethyl (meth)acrylate, and (meth)acrylamide.

[0099] The content of constituent units (c2) in the (meth)acrylic adhesive resin (c) is preferably 1% by mass or more and 40% by mass or less, more preferably 3% by mass or more and 20% by mass or less, and even more preferably 5% by mass or more and 15% by mass or less, when the total amount of the (meth)acrylic adhesive resin (c) is 100% by mass.

[0100] Polymerization reaction mechanisms for (meth)acrylic adhesive resin (c) include radical polymerization, anionic polymerization, and cationic polymerization. From the viewpoint of the manufacturing cost of (meth)acrylic adhesive resin (c), the influence of the functional groups of the monomer, and the influence of ions on the surface of the target object, radical polymerization is preferred as the polymerization reaction mechanism for (meth)acrylic adhesive resin (c).

[0101] The radical polymerization initiator includes, for example, one or more selected from the group consisting of organic peroxides, inorganic peroxides, and azo compounds. The organic peroxide includes, for example, one or more selected from the group consisting of benzoyl peroxide, di-t-butyl peroxide, dicumyl peroxide, 3,3,5-trimethylhexanoyl peroxide, di-2-ethylhexyl peroxydicarbonate, methyl ethyl ketone peroxide, t-butyl peroxyphthalate, t-butyl peroxybenzoate, di-t-butyl peroxyacetate, t-butyl peroxyisobutyrate, t-butyl peroxy-2-hexanoate, t-butyl peroxy-2-ethylhexanoate, t-butyl peroxy-3,5,5-trimethylhexanoate, acetyl peroxide, isobutyryl peroxide, octanoyl peroxide, t-butyl peroxide, and di-t-amyl peroxide. The inorganic peroxide includes, for example, one or more selected from the group consisting of ammonium persulfate, potassium persulfate, and sodium persulfate. The azo compound includes, for example, one or more selected from the group consisting of 2,2'-azobisisobutyronitrile, 2,2'-azobis-2-methylbutyronitrile, and 4,4'-azobis-4-cyanovaleric acid.

[0102] The radical polymerization initiator in the (meth)acrylic adhesive resin (c) preferably includes an organic peroxide, more preferably t-butylperoxy-2-ethylhexanoate, from the viewpoint of improving the balance between the adhesive strength and heat resistance performance of the adhesive resin layer (C).

[0103] The adhesive resin layer (C) further comprises an adhesive resin (C1) and preferably a crosslinking agent (C2) having two or more crosslinkable functional groups per molecule. The crosslinking agent (C2) is used to react with the functional groups of the adhesive resin (C1) to adjust the adhesive strength and cohesive strength of the adhesive resin layer (C).

[0104] The crosslinking agent (C2) includes, for example, one or more selected from the group consisting of epoxy crosslinking agents, isocyanate crosslinking agents, aziridine crosslinking agents, tetrafunctional epoxy crosslinking agents, and melamine crosslinking agents. The epoxy crosslinking agent includes, for example, one or more selected from the group consisting of sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerol polyglycidyl ether, glycerol polyglycidyl ether, neopentyl glycol diglycidyl ether, and resolcin diglycidyl ether. The isocyanate crosslinking agent includes, for example, one or more selected from the group consisting of tetramethylene diisocyanate, hexamethylene diisocyanate, trimethylolpropane toluene diisocyanate 3 adduct, polyisocyanate, diphenylmethane diisocyanate, and tolylene diisocyanate. Aziridine crosslinking agents include, for example, one or more selected from the group consisting of trimethylolpropane-tri-β-aziridinylpropionate, tetramethylolmethane-tri-β-aziridinylpropionate, N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxamide), N,N'-hexamethylene-1,6-bis(1-aziridinecarboxamide), N,N'-toluene-2,4-bis(1-aziridinecarboxamide), and trimethylolpropane-tri-β-(2-methylaziridine)propionate. Tetrafunctional epoxy crosslinking agents include, for example, one or more selected from the group consisting of N,N,N',N'-tetraglycidyl-m-xylenediamine and 1,3-bis(N,N'-diglycidylaminomethyl)cyclohexane. Melamine-based crosslinking agents include, for example, hexamethoxymethylolmelamine.

[0105] In the adhesive resin layer (C), the crosslinking agent (C2) preferably includes one or more selected from the group consisting of epoxy crosslinking agents, isocyanate crosslinking agents, and aziridine crosslinking agents, from the viewpoint of improving the balance between adhesive strength and thermal release properties.

[0106] The amount of crosslinking agent (C2) in the adhesive resin layer (C) is preferably within a range where the number of functional groups in the crosslinking agent (C2) does not exceed the number of functional groups in the adhesive resin (C1). However, if new functional groups are generated in the crosslinking reaction, or if the crosslinking reaction is slow, etc., it may be included in excess as necessary. From the viewpoint of improving the balance between adhesive strength and thermal release properties, the lower limit of the amount of crosslinking agent (C2) in the adhesive resin layer (C) is preferably 0.1 parts by mass or more, more preferably 1 part by mass or more, and even more preferably 2 parts by mass or more, when the amount of adhesive resin (C1) in the adhesive resin layer (C) is 100 parts by mass. Furthermore, from the viewpoint of improving storage stability, the upper limit of the amount of crosslinking agent (C2) in the adhesive resin layer (C) is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 4 parts by mass or less, when the amount of adhesive resin (C1) in the adhesive resin layer (C) is 100 parts by mass.

[0107] The adhesive resin layer (C) preferably further contains a tackifying resin (C3) from the viewpoint of improving adhesive strength. Including the tackifying resin (C3) in the adhesive resin layer (C) makes it easier to adjust the adhesion to the object at or near room temperature.

[0108] The tackifying resin (C3) includes, for example, one or more selected from the group consisting of rosin resins, terpene resins, natural rosin resins, petroleum resins, and coumarone-indene resins. Rosin resins include, for example, rosin derivatives that have undergone treatment such as esterification. Terpene resins include, for example, one or more selected from the group consisting of α-pinene resins, β-pinene resins, dipentene resins, and terpene phenol resins. Natural rosin resins include one or more selected from the group consisting of gum resins, wood resins, and tall oil resins. Petroleum resins include, for example, resins obtained by hydrogenating, disproportionating, polymerizing, or maleating natural rosin resins.

[0109] In the adhesive resin layer (C) of this embodiment, the softening point of the tackifying resin (C3) is preferably 100°C to 160°C, more preferably 120°C to 150°C, from the viewpoint of reducing contamination of the object and improving adhesion to the object.

[0110] From the viewpoint of improving adhesion to the object during work, the content of the tackifying resin (C3) in the adhesive resin layer (C) is preferably 1 part by mass or more, more preferably 2 parts by mass or more, even more preferably 3 parts by mass or more, and even more preferably 4 parts by mass or more, when the content of the adhesive resin (C1) in the adhesive resin layer (C) is 100 parts by mass. From the viewpoint of improving the balance between adhesion to the object and adhesiveness at room temperature, the content of the tackifying resin (C3) in the adhesive resin layer (C) is preferably 100 parts by mass or less, more preferably 50 parts by mass or less, even more preferably 25 parts by mass or less, and even more preferably 10 parts by mass or less, when the content of the adhesive resin (C1) in the adhesive resin layer (C) is 100 parts by mass.

[0111] The adhesive resin layer (C) may also contain additives such as plasticizers as other components.

[0112] The lower limit of the total content of adhesive resin (C1), crosslinking agent (C2), tackifying resin (C3), and thermally expandable microspheres in the adhesive resin layer (C) is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 90% by mass or more, and even more preferably 95% by mass or more, when the total amount of the adhesive resin layer (C) is 100% by mass. The upper limit is not particularly limited, but for example, it is 100% by mass or less.

[0113] The adhesive resin layer (C) may be a single layer or a multi-layer layer.

[0114] The thickness of the adhesive resin layer (C) is preferably 10 μm or more, more preferably 15 μm or more, even more preferably 20 μm or more, and even more preferably 25 μm or more, from the viewpoint of improving the balance of adhesiveness and heat release properties. The thickness of the adhesive resin layer (C) is preferably 100 μm or less, more preferably 75 μm or less, even more preferably 50 μm or less, and even more preferably 40 μm or less, from the viewpoint of improving the handlingability of the adhesive film 10. The thickness of the adhesive resin layer (C) is preferably 10 μm or more and 100 μm or less, more preferably 15 μm or more and 75 μm or less, even more preferably 20 μm or more and 50 μm or less, and even more preferably 25 μm or more and 40 μm or less, from the viewpoint of improving the balance of adhesiveness, heat release properties, and handling properties.

[0115] The adhesive resin layer (C) can be formed, for example, by applying an adhesive coating solution onto the substrate layer (A), or by transferring the adhesive resin layer (C) formed on the separator onto the substrate layer (A). Examples of methods for applying the adhesive coating solution include the roll coater method, the reverse roll coater method, the gravure roll method, the bar coat method, the comma coater method, and the die coater method.

[0116] There are no particular restrictions on the drying conditions for the applied adhesive, but for example, it may be dried at 80 to 170°C for 15 seconds to 5 minutes. In order to sufficiently promote the crosslinking reaction between the crosslinking agent and the adhesive, the adhesive coating solution may be heated at 40 to 80°C for about 5 to 300 hours after the drying is complete.

[0117] The base material layer (A) and the adhesive resin layer (C) may be formed by co-extrusion molding, or they may be formed by laminating (layering) a film-like base material layer (A) and a film-like adhesive resin layer (C).

[0118] [Intermediate layer (D)] The adhesive film of this embodiment may further include an intermediate layer (D). The intermediate layer (D) is a layer provided as, for example, a surface-absorbing resin layer, an impact-absorbing layer, an anchor coat layer, etc.

[0119] The intermediate layer (D) preferably contains a thermoplastic resin. When the adhesive film of this embodiment is used, for example, as a tape for temporarily fixing electronic components, the intermediate layer (D) more preferably contains one or more selected from the group consisting of polyolefin resins, polystyrene resins, (meth)acrylic resins, urethane resins, silicone resins, polyester resins, polyamide resins, and fluororesins, and even more preferably contains one or more selected from the group consisting of polyolefin resins, polystyrene resins, and (meth)acrylic resins.

[0120] When the adhesive film of this embodiment is used, for example, as a tape for temporarily fixing electronic components, the thickness of the intermediate layer (D) is preferably 5 μm to 100 μm, more preferably 10 μm to 50 μm, and even more preferably 15 μm to 25 μm, from the viewpoint of improving the ability of the adhesive film to absorb unevenness.

[0121] The intermediate layer (D) preferably contains a thermoplastic resin. When the adhesive film of this embodiment is used, for example, as a dicing tape, the intermediate layer (D) more preferably contains one or more selected from the group consisting of olefin resins, ethylene-(meth)acrylic acid ester copolymers, ethylene-vinyl ester copolymers, polyvinyl chloride, polyvinylidene chloride, polyolefin-based thermoplastic elastomers, polystyrene-based thermoplastic elastomers, polyurethane-based thermoplastic elastomers, 1,2-polybutadiene-based thermoplastic elastomers, trans-polyisoprene-based thermoplastic elastomers, chlorinated polyethylene-based thermoplastic elastomers, and polyester-based elastomers. Olefin resins include, for example, one or more selected from the group consisting of ethylene resins, propylene polymers, 1-butene polymers, 4-methyl-1-pentene polymers, ethylene-α-olefin copolymers, ethylene-cyclic olefin copolymers, ethylene-α-olefin-cyclic olefin copolymers, ethylene-α-olefin-unconjugated polyene copolymers, ethylene-α-olefin-conjugated polyene copolymers, ethylene-aromatic vinyl copolymers, ethylene-α-olefin-aromatic vinyl copolymers, and copolymers thereof. Furthermore, ethylene resins include, for example, one or more selected from the group consisting of high-density polyethylene resins (HDPE), medium-density polyethylene resins (MDPE), low-density polyethylene resins (LDPE), ultra-low-density polyethylene resins (ULDPE), and linear low-density polyethylene resins (LLDPE). Ethylene-(meth)acrylic acid ester copolymers include, for example, one or more selected from the group consisting of ethylene-(meth)acrylic acid ethyl copolymer, ethylene-(meth)acrylic acid methyl copolymer, ethylene-(meth)acrylic acid propyl copolymer, ethylene-(meth)acrylic acid butyl copolymer, ethylene-(meth)acrylic acid hexyl copolymer, ethylene-(meth)acrylic acid 2-hydroxyethyl copolymer, ethylene-(meth)acrylic acid 2-hydroxypropyl copolymer, and ethylene-(meth)acrylic acid glycidyl copolymer.Ethylene vinyl ester copolymers include, for example, one or more selected from the group consisting of ethylene vinyl acetate copolymer, ethylene vinyl propionate copolymer, ethylene vinyl butyrate copolymer, and ethylene vinyl stearate copolymer.

[0122] When the adhesive film of this embodiment is used, for example, in a dicing tape, the intermediate layer (D) more preferably comprises one or more selected from the group consisting of ethylene-α-olefin copolymer and ethylene-vinyl ester copolymer, more preferably comprises one or more selected from the group consisting of ethylene-α-olefin copolymer and ethylene-vinyl acetate copolymer, and more preferably comprises ethylene-vinyl acetate copolymer.

[0123] When the adhesive film of this embodiment is used, for example, as a dicing tape, the content of vinyl acetate units in the ethylene-vinyl acetate copolymer in the adhesive film of this embodiment is preferably 10% to 35% by mass, more preferably 12% to 30% by mass, and even more preferably 15% to 25% by mass, when the total amount of the ethylene-vinyl acetate copolymer is 100% by mass, from the viewpoint of improving the balance of crosslinkability, flexibility, weather resistance, and transparency. The vinyl acetate content can be measured, for example, in accordance with JIS K6730:1994.

[0124] When the adhesive film of this embodiment is used, for example, in a dicing tape, the number of carbon atoms in the α-olefin of the ethylene-α-olefin copolymer used as the thermoplastic resin in the adhesive film of this embodiment is preferably 3 to 20, more preferably 3 to 10, and even more preferably 3 to 8. The α-olefin used in the ethylene-α-olefin copolymer includes, for example, one or more selected from the group consisting of propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 3,3-dimethyl-1-butene, 4-methyl-1-pentene, 1-octene, 1-decene, and 1-dodecene. From the viewpoint of availability, the α-olefin used in the ethylene-α-olefin copolymer preferably includes one or more selected from the group consisting of propylene, 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, and 1-octene. The ethylene-α-olefin copolymer may be a random copolymer or a block copolymer, but from the viewpoint of flexibility, a random copolymer is preferred.

[0125] The intermediate layer (D) may contain additives such as plasticizers as other components. The intermediate layer (D) may be a single layer or a multilayer layer.

[0126] <Physical Properties of the Adhesive Film> The physical properties of the adhesive film of this embodiment will be described below.

[0127] The number of foreign objects observed in the adhesive film of this embodiment according to the above (method of observing foreign objects) will be described.

[0128] The number of foreign objects observed according to the above (method of observing foreign objects) is preferably less than 10, more preferably less than 7, even more preferably less than 5, even more preferably less than 4, and even more preferably less than 3, from the viewpoint of further reducing contamination of the object. There is no particular lower limit to the number of foreign objects, but it may be 0 or more, 1 or more, or 2 or more.

[0129] Here, the method for observing foreign matter can be more specifically the method described in the examples.

[0130] The number of foreign matter can be adjusted, for example, by adjusting the type of adhesive resin layer (C), the composition of the adhesive resin layer (C), the method of forming the adhesive resin layer (C), the thickness of the adhesive resin layer (C), the type of thermally expandable microspheres, etc.

[0131] The evaluation values ​​of particles measured according to the above (method for evaluating particles) for the adhesive film of this embodiment will now be described.

[0132] The particle evaluation value observed according to the above (method for evaluating particles) is preferably less than 10,000, more preferably less than 5,000, even more preferably less than 2,000, even more preferably less than 1,000, and even more preferably less than 500, from the viewpoint of further reducing contamination of the target object. The lower limit of the particle evaluation value is not particularly limited, but may be, for example, 0 or more, 10 or more, or 100 or more.

[0133] Here, the particle evaluation method can be more specifically the method described in the examples.

[0134] The evaluation values ​​of the above particles can be adjusted, for example, by adjusting the type of adhesive resin layer (C), the composition of the adhesive resin layer (C), the method of forming the adhesive resin layer (C), the thickness of the adhesive resin layer (C), the type of thermally expandable microspheres, etc.

[0135] The tack force of the adhesive film of this embodiment, according to the following (Method 1), will be explained.

[0136] The tack force according to the following (Method 1) is 5 gf or less, preferably 4 gf or less, more preferably 3 gf or less, even more preferably 2 gf or less, and even more preferably 1 gf or less, from the viewpoint of reducing re-adhesion to the target object. The lower limit of the tack force is not particularly limited, but it may be, for example, 0 gf or more.

[0137] (Method 1) Structure a is prepared by attaching the side of a 5cm x 5cm adhesive film opposite to the adhesive resin layer (C) to a 30cm x 30cm, 1.5mm thick SUS substrate. Next, structure a is heated at 150°C for 1 hour using a forced-air constant-temperature incubator. Next, structure a is placed on a hot plate with the SUS substrate side facing down, and structure a is heated at 200°C for 60 seconds using the hot plate. Next, a 1000g weight with a 1cm x 1cm surface is placed on the adhesive resin layer (C) of structure a so that the 1cm x 1cm surface of the weight is in contact with the 1cm x 1cm surface of the adhesive resin layer (C) including the center, and the structure is left standing at 200°C for 1 hour. Next, after removing the weight from structure a, structure a is cooled at 23°C for 5 minutes. Next, using a probe tacking tester and a SUS probe (5 mm in diameter), a contact load of 100 gf / mm was applied. ２ The probe is pressed onto the adhesive resin layer (C) for 1800 seconds at a probe insertion speed of 120 mm / min. Then, the tack force is measured at 23°C and a peeling speed of 30 mm / min.

[0138] The tack force obtained by the above method (Method 1) can be adjusted, for example, by adjusting the type of adhesive resin layer (C), the thickness of the adhesive resin layer (C), the type of thermally expandable microspheres, etc. Specifically, the method for measuring the tack force can be the method described in the examples.

[0139] <Structure of the Adhesive Film> Several examples of the structure of the adhesive film 10 of this embodiment will be described. The adhesive film 10 of this embodiment may have a structure like that shown in Figure 4 or Figure 5 below.

[0140] In the adhesive film 10 of this embodiment, the surface on the side with the adhesive resin layer (C) is in contact with the support member 30. In this case, the workpiece 20 is located on the first surface A1 side of the base material layer (A) of the adhesive film 10, and the support member 30 is located on the second surface A2 side of the base material layer (A). The adhesive film 10 of this embodiment may have a structure as shown in Figures 4 and 5 below, for example.

[0141] The adhesive film 10 in Figure 4 further comprises an adhesive resin layer (B) on the first surface A1 side of the base layer (A). In this case, the base layer (A) is located between the adhesive resin layer (B) and the adhesive resin layer (C).

[0142] In Figure 4, the adhesive film 10 is in contact with the workpiece 20 on the side with the adhesive resin layer (B) and with the support member 30 on the side with the adhesive resin layer (C). The adhesive film 10 in Figure 4 temporarily fixes the workpiece 20 with the adhesive resin layer (B). The adhesive film 10 in Figure 4 is also temporarily fixed to the support member 30 with the adhesive resin layer (C).

[0143] The adhesive film 10 in Figure 4 may further include an intermediate layer (D) selected from at least one of the following: between the base layer (A) and the adhesive resin layer (B), and between the base layer (A) and the adhesive resin layer (C). Note that the intermediate layer (D) is not shown in Figure 4. Furthermore, the adhesive film 10 in Figure 4 may further include an intermediate layer (D) in both the space between the base layer (A) and the adhesive resin layer (B), and between the base layer (A) and the adhesive resin layer (C). In this case, the intermediate layer (D) located between the base layer (A) and the adhesive resin layer (B) may have a different configuration from, or the same configuration as, the intermediate layer (D) located between the base layer (A) and the adhesive resin layer (C).

[0144] The adhesive film 10 in Figure 5 is an example of the adhesive film 10 in Figure 4, in which an intermediate layer (D) is further provided between the base layer (A) and the adhesive resin layer (C).

[0145] <Method for Manufacturing Adhesive Film> Next, an example of a method for manufacturing the adhesive film 10 of this embodiment will be described. The adhesive film 10 of this embodiment can be formed, for example, by applying an adhesive resin layer (C) onto a base layer (A), or by transferring an adhesive resin layer (C) formed on a separator onto the base layer (A). Alternatively, the adhesive film 10 of this embodiment may be formed by laminating (layering) the base layer (A) and the adhesive resin layer (C) in this order. Alternatively, the adhesive film 10 of this embodiment may be formed by co-extrusion molding of the base layer (A) and the adhesive resin layer (C) in this order.

[0146] One method for applying an adhesive resin layer (C) onto a substrate layer (A) is to apply an adhesive coating solution capable of forming an adhesive resin layer (C). Examples of methods for applying the adhesive coating solution include the roll coater method, the reverse roll coater method, the gravure roll method, the bar coat method, the comma coater method, and the die coater method. There are no particular restrictions on the drying conditions of the adhesive coating solution, but it is preferably dried at a temperature range of 80 to 200°C for 10 seconds to 10 minutes, and more preferably at a temperature range of 80 to 170°C for 15 seconds to 5 minutes. In order to sufficiently promote the crosslinking reaction between the crosslinking agent and the adhesive resin, the adhesive coating solution may be heated at a temperature range of 40 to 80°C for about 5 to 300 hours after the drying of the adhesive coating solution is completed.

[0147] If the adhesive film 10 of this embodiment further comprises an adhesive resin layer (B), the adhesive film 10 of this embodiment can be formed, for example, by applying the adhesive resin layer (B) and the adhesive resin layer (C) to a base layer (A), or by transferring the adhesive resin layer (B) and the adhesive resin layer (C) formed on a separator to the base layer (A). Alternatively, if the adhesive film 10 of this embodiment further comprises an adhesive resin layer (B), the adhesive film 10 of this embodiment may be formed by laminating (layering) the adhesive resin layer (B), the base layer (A), and the adhesive resin layer (C) in this order. Alternatively, the adhesive film 10 of this embodiment may be formed by co-extrusion molding of the adhesive resin layer (B), the base layer (A), and the adhesive resin layer (C) in this order.

[0148] If the adhesive film 10 of this embodiment further comprises an intermediate layer (D), the adhesive film 10 of this embodiment can be formed, for example, the adhesive film 10 shown in Figure 5, by laminating (layering) an adhesive resin layer (B), a base layer (A), an intermediate layer (D), and an adhesive resin layer (C) in this order; by co-extruding an adhesive resin layer (B), a base layer (A), an intermediate layer (D), and an adhesive resin layer (C) in this order; by laminating (layering) the base layer (A) and the intermediate layer (D) and then applying the adhesive resin layer (B) and the adhesive resin layer (C), respectively; or by laminating (layering) the base layer (A) and the intermediate layer (D) and then transferring the adhesive resin layer (B) and the adhesive resin layer (C), respectively, that have been formed on a separator.

[0149] Although embodiments of the present invention have been described above, these are merely examples, and various other configurations can be adopted. Furthermore, the present invention is not limited to the embodiments described above, and modifications, improvements, etc., that do not impair the effects of the present invention are included in the present invention.

[0150] This embodiment will be described in detail below with reference to examples and other relevant information. However, this embodiment is not limited in any way to the descriptions of these examples.

[0151] The details of the materials used to produce the adhesive film are as follows:

[0152] <Adhesive Resin Solution SB1> To deionized pure water, 0.5 parts by mass of 4,4'-azobis-4-cyanovaleric acid (manufactured by Otsuka Chemical Co., Ltd., trade name: ACVA) as a polymerization initiator, 74.3 parts by mass of n-butyl acrylate, 13.7 parts by mass of methyl methacrylate, 9 parts by mass of 2-hydroxyethyl methacrylate, and 3 parts by mass of a polymerizable 1-propenyl group introduced to the benzene ring of the ammonium salt of the sulfate ester of polyoxyethylene nonylphenyl ether (manufactured by Daiichi Kogyo Seiyaku Co., Ltd., trade name: Aqualon HS-1025) were added. Emulsion polymerization was carried out at 70-72°C for 8 hours under stirring to obtain an acrylic resin emulsion. This was neutralized with ammonia water (pH = 7.0) to obtain adhesive resin solution SB1 with a solid content concentration of 42.5%.

[0153] <Adhesive Resin Solution SB2> In deionized pure water, 0.5 parts by mass of ammonium persulfate, 63 parts by mass of 2-ethylhexyl acrylate, 21 parts by mass of n-butyl acrylate, 9 parts by mass of methyl methacrylate, 3 parts by mass of 2-hydroxyethyl methacrylate, 1 part by mass of polytetramethylene glycol diacrylate (manufactured by Nippon Oil & Fats Co., Ltd., trade name: ADT-250), and 2 parts by mass of polyoxyethylene nonylphenyl ether sulfate ammonium salt with a polymerizable 1-propenyl group introduced to the benzene ring (manufactured by Daiichi Kogyo Seiyaku Co., Ltd., trade name: Aqualon HS-1025) were added as polymerization initiators. Emulsification polymerization was carried out at 70-72°C for 8 hours under stirring to obtain an acrylic resin emulsion. This was neutralized with ammonia water (pH = 7.0) to obtain adhesive resin solution SB2 with a solid content concentration of 56.5%.

[0154] <Adhesive Coating Solution B1> Adhesive coating solution B1 was obtained by mixing 57.4 parts by mass of adhesive resin solution SB1, 42.6 parts by mass of adhesive resin solution SB2, 0.4 parts by mass of dimethylethanolamine, and 3.4 parts by mass of an epoxy compound (manufactured by Nagase ChemteX, Ex-1610), which is a crosslinking agent.

[0155] <Adhesive Resin Solution SC1> In a mixed solvent containing ethyl acetate and toluene, 0.536 parts by mass of t-butylperoxy-2-ethylhexanoate (manufactured by Nippon Oil & Fats Co., Ltd., trade name: Perbutyl O (registered trademark)) as a polymerization initiator, 34.9 parts by mass of 2-ethylhexyl acrylate, 41 parts by mass of n-butyl acrylate, 14.7 parts by mass of ethyl acrylate, and 9.4 parts by mass of 2-hydroxyethyl methacrylate were added. Solution polymerization was carried out at 83-87°C for 11 hours under stirring to obtain an acrylic resin solution with a solid content of 45% by mass. This was designated as Adhesive Resin Solution SC1.

[0156] <Adhesive Coating Solution C1> 100 parts by mass of adhesive resin solution SC1 and 0.9 parts by mass of isocyanate-based crosslinking agent (manufactured by Mitsui Chemicals, Inc., product name: Olestar P49-75S) (2 parts by mass per 100 parts by mass of adhesive resin) were mixed, and the solid content concentration was adjusted to 40% with ethyl acetate to obtain adhesive coating solution C1.

[0157] <Adhesive Coating Solution C2> Adhesive coating solution C2 was prepared by mixing 100 parts by mass of adhesive resin solution SC1, 2.25 parts by mass of polymerized rosin ester tackifier (manufactured by Arakawa Chemical Industries, Ltd., product name: Pencel D-125) (5 parts by mass per 100 parts by mass of adhesive resin), 1.2 parts by mass of isocyanate crosslinking agent (manufactured by Mitsui Chemicals, Inc., product name: Olestar P49-75S) (2.67 parts by mass per 100 parts by mass of adhesive resin), and 6.75 parts by mass of thermosetting resin-containing thermally expandable microspheres (manufactured by Sekisui Chemical Co., Ltd., product name: Advancell EM701) (15 parts by mass per 100 parts by mass of adhesive resin), and adjusting the solid content concentration to 30% with ethyl acetate. Furthermore, for the thermosetting resin-containing thermally expandable microspheres (Advancel EM701), the particle size D is measured at 50% in the volume-based cumulative frequency distribution curve as measured by a laser diffraction scattering particle size distribution analyzer. ５０ The size was 19.8 μm.

[0158] <Adhesive Coating Solution C3> Adhesive coating solution C3 was prepared by mixing 100 parts by mass of adhesive resin solution SC1, 2.25 parts by mass of polymerized rosin ester tackifier (manufactured by Arakawa Chemical Industries, Ltd., product name: Pencel D-125) (5 parts by mass per 100 parts by mass of adhesive resin), 1.2 parts by mass of isocyanate crosslinking agent (manufactured by Mitsui Chemicals, Inc., product name: Olestar P49-75S) (2.67 parts by mass per 100 parts by mass of adhesive resin), and 11.25 parts by mass of thermosetting resin-containing thermally expandable microspheres (manufactured by Sekisui Chemical Co., Ltd., product name: Advancell EM701) (25 parts by mass per 100 parts by mass of adhesive resin), and adjusting the solid content concentration to 30% with ethyl acetate. Furthermore, for the thermosetting resin-containing thermally expandable microspheres (Advancel EM701), the particle size D is measured at 50% in the volume-based cumulative frequency distribution curve as measured by a laser diffraction scattering particle size distribution analyzer. ５０The size was 19.8 μm.

[0159] <Adhesive Coating Solution C4> Adhesive coating solution C4 was prepared by mixing 100 parts by mass of adhesive resin solution SC1, 2.25 parts by mass of polymerized rosin ester tackifier (manufactured by Arakawa Chemical Industries, Ltd., product name: Pencel D-125) (5 parts by mass per 100 parts by mass of adhesive resin), 1.2 parts by mass of isocyanate crosslinking agent (manufactured by Mitsui Chemicals, Inc., product name: Olestar P49-75S) (2.67 parts by mass per 100 parts by mass of adhesive resin), and 6.75 parts by mass of thermosetting resin-free thermally expandable microspheres (manufactured by Sekisui Chemical Co., Ltd., product name: Advancell EM-504) (15 parts by mass per 100 parts by mass of adhesive resin), and adjusting the solid content concentration to 30% with ethyl acetate. Furthermore, for thermally expandable microspheres (Advancel EM-504) that do not contain thermosetting resin, the particle size D is measured at 50% in the volume-based cumulative frequency distribution curve as measured by a laser diffraction scattering particle size distribution analyzer. ５０ The size was 17.6 μm.

[0160] [Example 1] A polyethylene terephthalate (PET) film (38 μm thick), which is a base layer (A), was covered with a 10 μm thick adhesive resin layer (B) formed by drying adhesive coating liquid B1. Next, a 20 μm thick intermediate layer (D) formed by drying adhesive coating liquid C1 was applied to the surface of the PET film opposite to the adhesive resin layer (B), and a 30 μm thick heat-peelable adhesive resin layer (C) formed by drying adhesive coating liquid C2 was applied on top of that to obtain an adhesive film.

[0161] [Example 2] A polyethylene terephthalate (PET) film (38 μm thick), which is the base layer (A), was covered with a 10 μm thick adhesive resin layer (B) formed by drying adhesive coating liquid B1. Next, a 20 μm thick intermediate layer (D) formed by drying adhesive coating liquid C1 was applied to the surface of the PET film opposite to the adhesive resin layer (B), and a 30 μm thick heat-peelable adhesive resin layer (C) formed by drying adhesive coating liquid C3 was applied on top of that to obtain an adhesive film.

[0162] [Comparative Example 1] A polyethylene terephthalate (PET) film (38 μm thick), which is a base layer (A), was provided with a 10 μm thick adhesive resin layer (B) formed by drying adhesive coating liquid B1. Next, a 20 μm thick intermediate layer (D) formed by drying adhesive coating liquid C1 was provided on the surface of the PET film opposite to the adhesive resin layer (B), and a 30 μm thick heat-peelable adhesive resin layer (C) formed by drying adhesive coating liquid C4 was provided on top of that to obtain an adhesive film.

[0163] (Examples 1-2, Comparative Example 1) The physical properties of the adhesive films in each example were measured and evaluated using the following methods. The measurement and evaluation results are shown in Table 1.

[0164] <Method for Evaluating Adhesive Residue> The following operations were performed using the adhesive film for each example. Structure 1 was fabricated by attaching the adhesive resin layer (C) of the adhesive film to a silicon wafer (product name: 4 inch P-type Bare Si Wafer, manufactured by Shin-Etsu Chemical Co., Ltd.). Next, structure 1 was heated in an oven at 150°C for 1 hour. Next, structure 1 was heated in a hot plate at 200°C for 60 seconds. Next, the adhesive film was peeled off the silicon wafer. Next, the number of foreign matter originating from the adhesive film present in a 1 cm × 1 cm area on the surface of the silicon wafer was observed using a microscope (product name: VHX-5000, manufactured by Keyence Corporation) at a magnification of 500x. All of the above operations were performed in a Class 10,000 cleanroom. This evaluation was performed with a sample size n=3. The average value for each sample was taken as the number of foreign matter. The number of foreign objects was evaluated as A if it was less than 5, B if it was 5 or more but less than 10, and C if it was 10 or more.

[0165] <Method for Evaluating Particles> The following operations were performed using the adhesive film for each example. First, particle measurements were taken without attaching the adhesive film to the silicon wafer. Specifically, the silicon wafer (product name: 4 inch P-type Bare Si Wafer, manufactured by Shin-Etsu Chemical Co., Ltd.) was heated at 150°C for 1 hour. Next, the silicon wafer was left to cool in a clean room at 23°C for 30 minutes. Next, the silicon wafer was heated at 200°C for 60 seconds. Then, using a wafer surface inspection device (product name: WM-7S, manufactured by Takano Corporation), the particles on the surface of the silicon wafer were counted under the conditions (settings) below. The total number of particles at this time was defined as the measured value P2. Next, structure 2 was fabricated by attaching the adhesive resin layer (C) of the adhesive film to the silicon wafer (product name: 4 inch P-type Bare Si Wafer, manufactured by Shin-Etsu Chemical Co., Ltd.). Next, structure 2 was heated at 150°C for 1 hour. Then, structure 2 was allowed to cool in a cleanroom at 23°C for 30 minutes. Next, structure 2 was heated at 200°C for 60 seconds. Next, the adhesive film was peeled off the silicon wafer. Then, using a wafer surface inspection device (product name: WM-7S, manufactured by Takano Corporation), the particles on the surface of the silicon wafer were counted under the following conditions (settings). The total number of particles at this time was defined as the measured value P1. Next, the value obtained by subtracting the measured value P2 from the measured value P1 (P1 - P2) was defined as the value for each sample. All of the above operations were performed in a Class 10,000 cleanroom. This evaluation was performed with a sample size n = 3. The average value for each sample was defined as the particle evaluation value. Particle evaluation values ​​were rated as follows: A if less than 2,000, B if between 2,000 and 10,000, and C if 10,000 or more.

[0166] For each example of adhesive film, pretreatment was performed according to the (pretreatment method) below before the following measurements or evaluations were carried out.

[0167] (Pretreatment method) Structure a was prepared by attaching the adhesive resin layer (B) side of a 5cm x 5cm adhesive film to a 30cm x 30cm, 1.5mm thick SUS substrate (material: SUS304). Next, structure a was heated at 150°C for 1 hour using a forced-air constant temperature incubator (product name: DN63H, manufactured by Yamato Scientific Co., Ltd.). Next, structure a was placed on a hot plate with the SUS substrate side facing down, and structure a was heated at 200°C for 60 seconds using the hot plate. Next, a 1000g weight with a 1cm x 1cm surface was placed on the adhesive resin layer (C) of structure a so that the 1cm x 1cm surface of the weight was in contact with the 1cm x 1cm surface of the adhesive resin layer (C) including the center, and the structure was left standing at 200°C for 1 hour. For the 1000g weight with a 1cm x 1cm surface, a cylindrical weight was placed on top of a 1cm x 1cm x 1cm weight (material: SUS304) so ​​that the total mass of the weight and the cylindrical weight was 1000g. Next, after removing the weight from structure a, structure a was cooled at 23°C for 5 minutes.

[0168] <Method for measuring tack force> For adhesive films treated according to the above (pre-treatment method), a probe tacking tester (product name: TAC-II, manufactured by Resca Co., Ltd.) and a SUS circular probe (diameter 5 mm) were used to measure a contact load of 100 gf / mm. ２ The probe was pressed onto the adhesive resin layer (C) for 1800 seconds at a probe insertion speed of 120 mm / min. Then, the tack force was measured at 23°C and a peeling speed of 30 mm / min. This measurement was performed with a sample size of n=3. The average value for each sample was defined as the tack force.

[0169] <Evaluation Method for Deformation of Foam Spheres> For adhesive films treated according to the above (pretreatment method), the surface of the adhesive resin layer (C) after cooling was observed in a 0.5 cm x 0.5 cm area using a digital microscope (product name: VHX-5000, manufactured by Keyence Corporation). The number of thermally expandable microspheres that had deformed from their post-foaming state (spherical) was counted. Note that thermally expandable microspheres that were sagging or collapsed were defined as thermally expandable microspheres that had deformed from their post-foaming state (spherical). This evaluation was performed under the condition of a sample size n=3. The average value for each sample was taken as the number of deformed thermally expandable microspheres. If the number of thermally expandable microspheres that had deformed from their post-foaming state (spherical) was 0, it was evaluated as A; if it was 1 or more but less than 10, it was evaluated as B; and if it was 10 or more, it was evaluated as C.

[0170] <Evaluation of Re-adhesion> Two adhesive films (one pair) were prepared, treated according to the above (pre-treatment method). Next, one of the two adhesive films was placed on a horizontal surface with the adhesive resin layer (C) facing upwards. Next, the other adhesive film was placed on top of the adhesive film that was placed on the horizontal surface, with the adhesive resin layer (C) facing downwards. Next, a 100g weight measuring 0.8cm x 0.8cm was placed on top of the two overlapping adhesive films and left to stand at 23°C for 1 minute. After standing, the weight was removed and the upper adhesive film was lifted to check whether the two adhesive films were still attached. This evaluation was performed with a sample size of n=3. If 3 samples were not attached, it was evaluated as A; if 2 samples were not attached, it was evaluated as B; and if 1 or fewer samples were not attached, it was evaluated as C.

[0171]

[0172] This application claims priority based on Japanese Patent Application No. 2024-168724, filed on 27 September 2024, and incorporates all of its disclosures herein.

[0173] 10 Adhesive film 20 Object to be processed 24 Electronic component 30 Support member 31 Support substrate 40 Object to be processed after processing 50 Encapsulating material 100 Structure 400 Structure 500 Electronic device 510 Wiring layer 520 Bump 600 Electronic device A Base material layer A1 First surface A2 Second surface B Adhesive resin layer C Adhesive resin layer D Intermediate layer

Claims

1. A method for manufacturing an electronic device, comprising the steps of: preparing a structure including an adhesive film comprising a base layer (A), an adhesive resin layer (B), and an adhesive resin layer (C); a workpiece temporarily fixed to the adhesive resin layer (B); and a support member temporarily fixed to the adhesive resin layer (C); and processing the workpiece temporarily fixed to the adhesive resin layer (B), wherein the base layer (A) is located between the adhesive resin layer (B) and the adhesive resin layer (C), the adhesive resin layer (C) contains thermally expandable microspheres, and the number of foreign objects observed on the adhesive film according to the following (method for observing foreign objects) is less than 10. (Method for observing foreign matter) A structure 1 is fabricated by attaching the adhesive resin layer (C) of the adhesive film to a silicon wafer. Then, the structure 1 is heated at 150°C for 1 hour. Then, the structure 1 is heated at 200°C for 60 seconds. Then, the adhesive film is peeled off from the silicon wafer. Then, the number of foreign matter originating from the adhesive film present in a 1 cm × 1 cm area on the surface of the silicon wafer is observed using a microscope at a magnification of 500x.

2. The method for manufacturing an electronic device according to claim 1, wherein the thermally expandable microspheres include a thermosetting resin.

3. The method for manufacturing an electronic device according to claim 2, wherein the thermally expandable microsphere comprises a shell and a volatile expanding agent within the shell, and the shell comprises the thermosetting resin.

4. The method for manufacturing an electronic device according to claim 2 or 3, wherein the curing temperature of the thermosetting resin is equal to or greater than the foaming temperature of the thermally expandable microspheres.

5. The method for manufacturing an electronic device according to any one of claims 1 to 4, wherein the foaming temperature of the thermally expandable microspheres is 160°C or higher.

6. The method for manufacturing an electronic device according to any one of claims 1 to 5, wherein the adhesive resin layer (C) is a layer whose adhesive strength decreases when heated.

7. The method for manufacturing an electronic device according to any one of claims 1 to 6, wherein the adhesive resin layer (C) comprises one or more selected from the group consisting of (meth)acrylic adhesive resins, silicone adhesive resins, urethane adhesive resins, olefin adhesive resins, and styrene adhesive resins.

8. The method for manufacturing an electronic device according to any one of claims 1 to 7, wherein the content of the thermally expandable microspheres in the adhesive resin layer (C) is 5% by mass or more and 50% by mass or less when the total amount of the adhesive resin layer (C) is 100% by mass.

9. In the volume-based cumulative frequency distribution curve of the thermally expandable microspheres measured by a laser diffraction scattering particle size distribution analyzer, the particle size D at which the cumulative frequency reaches 50% ５０ A method for manufacturing an electronic device according to any one of claims 1 to 8, wherein the thickness is 5 μm or more and 40 μm or less.

10. A method for manufacturing an electronic device according to any one of claims 1 to 9, wherein the substrate layer (A) comprises one or more selected from the group consisting of polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyamide, polyimide, and polyetheretherketone.

11. The method for manufacturing an electronic device according to any one of claims 1 to 10, wherein the thickness of the adhesive resin layer (C) is 10 μm or more and 100 μm or less.

12. The method for manufacturing an electronic device according to any one of claims 1 to 11, wherein the thickness of the adhesive resin layer (B) is 1 μm or more and 40 μm or less.

13. A method for manufacturing an electronic device according to any one of claims 1 to 12, further comprising an intermediate layer (D) between the base material layer (A) and the adhesive resin layer (B), and between the base material layer (A) and the adhesive resin layer (C).

14. The method for manufacturing an electronic device according to claim 13, wherein the thickness of the intermediate layer (D) is 5 μm or more and 100 μm or less.

15. A method for manufacturing an electronic device according to any one of claims 1 to 14, wherein the electronic device includes a semiconductor package.

16. The method for manufacturing an electronic device according to claim 15, wherein the semiconductor package includes a fan-out type package.

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