Layered substrate, wiring board, method for manufacturing layered substrate, method for manufacturing wiring board, and semiconductor package

Abstract

Provided is a layered substrate that can reduce the occurrence of cracking in response to mechanical destruction or thermal shock in an inorganic substrate that contains glass. A layered substrate (100) according to the present disclosure has a plurality of wiring boards (110) each having an inorganic substrate (10) that contains glass, one or more insulating resin layers (21, 22) that is or are positioned so as to cover at least a portion of the inorganic substrate (10) that contains glass, and a wiring part (3) that is arranged on the surface of at least one of the inorganic substrate (10) that contains glass and the insulating resin layer or layers (21, 22). In this layered substrate (100), the peel strength between the inorganic substrates (10) that contain glass and the insulating resin layers (21, 22) is greater than or equal to 0.0098 N / cm and less than 4.9 N / cm.

Description

Multilayer substrate, wiring substrate, method for manufacturing a multilayer substrate, method for manufacturing a wiring substrate, and semiconductor package

[0001] This disclosure relates to a multilayer substrate, a wiring substrate, a method for manufacturing a multilayer substrate, a method for manufacturing a wiring substrate, and a semiconductor package.

[0002] In recent years, glass interposers, which use glass plates as the substrate for printed circuit boards, have been developed as a method for increasing the density of semiconductor devices. In the general manufacturing process of glass interposers, via holes are formed through the glass plate, and plating layers are formed inside the via holes and on both sides of the glass plate to form through electrodes and wiring. Subsequently, insulating parts and vias and wiring parts for interlayer connections are formed on both sides of the glass plate, and the lamination process is repeated until the desired number of wiring parts are reached. Through vias enable high-density mounting.

[0003] Previously, sheet materials have been reported in which a thermosetting resin composition layer comprising an epoxy resin, a curing agent, and silica surface-treated with a silane compound is provided on both sides of a glass substrate, and the absolute difference between the linear thermal expansion coefficient (C1) of the glass substrate at 25 to 150°C and the linear thermal expansion coefficient (C2) of the cured product of the thermosetting resin composition layer at 25 to 150°C is 30 ppm / °C or less (see, for example, Patent Document 1).

[0004] Japanese Patent Publication No. 2018-056572

[0005] One embodiment of this disclosure aims to provide a laminated substrate that can reduce the occurrence of cracks in an inorganic substrate including glass due to mechanical failure or thermal shock.

[0006] A laminated substrate according to one embodiment of the present disclosure is a laminated substrate having a plurality of wiring substrates, each having an inorganic substrate containing glass, one or more insulating resin layers arranged to cover at least a portion of the inorganic substrate containing glass, and wiring portions arranged on at least one surface of the inorganic substrate containing glass and the insulating resin layer, wherein the peel strength between the inorganic substrate containing glass and the insulating resin layer is 0.0098 N / cm or more and less than 4.9 N / cm.

[0007] According to one embodiment of this disclosure, it is possible to provide a laminated substrate that can reduce the occurrence of cracks in an inorganic substrate including glass due to mechanical failure or thermal shock.

[0008] Figure 1 is a cross-sectional view showing an example of a laminated substrate according to the first embodiment. Figure 2 is a schematic diagram showing an example of a laminated substrate according to the second embodiment. Figure 3 is a cross-sectional view showing an example of a wiring board according to the first embodiment. Figure 4 is a schematic diagram showing an example of a wiring board according to the second embodiment. Figure 5 is a diagram illustrating the procedure for measuring the peel strength of an inorganic substrate containing glass and an insulating resin layer.

[0009] The embodiments for implementing this disclosure will be described below with reference to the drawings. In each drawing, identical or similar components will be denoted by the same reference numeral, and their descriptions may be omitted. In the specification, the "~" indicating a numerical range means that the numbers written before and after it are included as the lower and upper limits. The numerical range includes the rounded range.

[0010] (Laminated Substrate) The laminated substrate of this embodiment is a laminated substrate having a plurality of wiring substrates, each having an inorganic substrate containing glass, one or more insulating resin layers arranged to cover at least a part of the inorganic substrate containing glass, and wiring portions arranged on at least one surface of the inorganic substrate containing glass and the insulating resin layers, and further including other members such as a cover layer as necessary.

[0011] The peel strength between the inorganic substrate containing the glass and the insulating resin layer is 0.0098 N / cm or more and less than 4.9 N / cm.

[0012] (Wiring board) The wiring board of this embodiment is a wiring board having an inorganic substrate including glass, one or more insulating resin layers arranged to cover at least a part of the inorganic substrate including glass, and wiring portions arranged on at least one surface of the inorganic substrate including glass and the insulating resin layer, and is a wiring board formed by making individual pieces of the laminated substrate, and further includes other members such as a cover layer as necessary.

[0013] The peel strength between the inorganic substrate containing the glass and the insulating resin layer is 0.0098 N / cm or more and less than 4.9 N / cm.

[0014] When manufacturing laminated substrates such as glass interposers, even when using the sheet material described in Patent Document 1, stress is generated inside the laminated substrate during its formation due to the difference in thermal expansion coefficients between the substrate, the insulating resin layer, and the wiring section. Here, we have found that if the adhesion between the insulating resin layer and the substrate is poor, a crack initiation point is generated in response to mechanical failure such as dicing or thermal shock such as thermal cycling, leading to cracks in the substrate.

[0015] The present inventors have diligently studied the problems of the prior art and, as a result of extensive research to solve the aforementioned problems, have found that a laminated substrate having a plurality of wiring boards, each having an inorganic substrate containing glass, one or more insulating resin layers arranged to cover at least a part of the inorganic substrate containing glass, and wiring portions arranged on at least one surface of the inorganic substrate containing glass and the insulating resin layer, wherein the peel strength between the inorganic substrate containing glass and the insulating resin layer is 0.0098 N / cm or more and less than 4.9 N / cm, thereby reducing the occurrence of cracks in the inorganic substrate containing glass due to mechanical failure and thermal shock, and thus have completed the present invention.

[0016] Referring to Figure 1, a laminated substrate according to one embodiment will be described. The laminated substrate 100 shown in Figure 1 has one insulating resin layer 2 on each surface of an inorganic substrate 10 containing glass, and comprises an inorganic substrate 10 containing glass, an insulating resin layer 21 disposed to cover at least a part of the first surface of the inorganic substrate 10 containing glass, an insulating resin layer 22 disposed to cover at least a part of the second surface of the inorganic substrate 10 containing glass, a wiring portion 3 disposed on at least one surface of the inorganic substrate 10 containing glass and the insulating resin layer 2, and connection terminals 4 for electrically connecting to an external semiconductor chip or substrate.

[0017] Referring to Figure 2, a laminated substrate according to one embodiment will be described. The laminated substrate 200 shown in Figure 2 has two or more insulating resin layers 2 on each surface of an inorganic substrate 10 including glass, and comprises an inorganic substrate 10 including glass, insulating resin layers 211, 212 disposed to cover at least a part of the first surface of the inorganic substrate 10 including glass, insulating resin layers 221, 222 disposed to cover at least a part of the second surface of the inorganic substrate 10 including glass, wiring portions 3 disposed on at least one surface of the inorganic substrate 10 including glass and the insulating resin layers 2, and connection terminals 4 for electrically connecting to an external semiconductor chip or substrate.

[0018] Referring to Figures 3 and 4, a wiring board according to one embodiment will be described. The wiring board 110 shown in Figure 3 is a wiring board obtained by dicing the laminated substrate 100 shown in Figure 1. The wiring board 210 shown in Figure 4 is a wiring board obtained by dicing the laminated substrate 200 shown in Figure 2. Dividing can be performed by dicing the laminated substrates 100 and 200 in a plan view, in a region that has an inorganic substrate 10 containing glass and an insulating resin layer 2, but does not have a wiring section 3 or connection terminals 4, thereby obtaining individual wiring boards 110 and 210, respectively.

[0019] The configurations of the laminated substrate and the wiring substrate are described below.

[0020] <Inorganic Substrate Containing Glass> The inorganic substrate 10 containing glass has a first surface and a second surface as its main surfaces. The inorganic substrate 10 containing glass mainly consists of a material (hereinafter also referred to as "inorganic material containing glass") whose coefficient of thermal expansion at 0°C to 400°C is 0.1 ppm / K to 12 ppm / K. Here, "main component" means a component that is contained in an amount of 90% by mass or more.

[0021] Examples of inorganic materials including glass include quartz glass, alkali-free glass, alkali glass, crystallized glass, borosilicate glass, and other types of glass, as well as ceramics such as glass ceramics and alumina ceramics.

[0022] The average thickness of the inorganic substrate 10 containing glass is preferably 100 μm or more, more preferably 200 μm or more. Furthermore, it is preferably 2000 μm or less, more preferably 1500 μm or less, and even more preferably 1100 μm or less. If the average thickness is 100 μm or more, sufficient strength can be obtained in the inorganic substrate 10 containing glass. If the average thickness is 2000 μm or less, it becomes necessary to reduce the stress on the inorganic substrate 10 containing glass, and the stress reduction effect of this embodiment can be fully obtained. The average thickness can be determined by measuring the thickness at 10 or more arbitrary points and calculating the average value.

[0023] As shown in Figures 1 and 2, the inorganic substrate 10 containing glass is provided with one or more through-holes that penetrate the inorganic substrate 10 in the thickness direction. The inside of the through-holes is filled with a conductive material and is provided with wiring sections 3 that electrically connect the first and second surfaces of the inorganic substrate 10 containing glass. In addition, in the wiring board shown in Figures 3 and 4, the inorganic substrate 10 containing glass has end faces 10e, and these end faces correspond to the cut surfaces when manufacturing the wiring board by separating the laminated substrate into individual pieces.

[0024] <Insulating Resin Layer> The insulating resin layer 2 is arranged to cover at least a portion of each main surface of the inorganic substrate 10 containing glass. Depending on the desired configuration, such as a wiring pattern, one layer of the insulating resin layer 2 may be provided on each main surface of the inorganic substrate 10 containing glass, or two or more layers may be provided.

[0025] When an insulating resin layer 2 is provided on each main surface of an inorganic substrate 10 containing glass, as shown in Figures 1 and 3, the insulating resin layer 21 is provided to cover the portion of the first surface of the inorganic substrate 10 containing glass that does not have wiring portions 3 and the wiring portions 3 arranged on the first surface, and the insulating resin layer 22 is provided to cover the portion of the second surface of the inorganic substrate 10 containing glass that does not have wiring portions 3 and the wiring portions 3 arranged on the second surface. In the wiring board 110 shown in Figure 3, the insulating resin layer 21 has an end face 21e, and the insulating resin layer 22 has an end face 22e, and these end faces correspond to the cut surfaces when manufacturing the wiring board by separating the laminated substrate into individual pieces.

[0026] When two or more insulating resin layers 2 are provided on each main surface of the inorganic substrate 10 containing glass, as shown in Figures 2 and 4, the insulating resin layer 211 is arranged to cover the portion of the first surface of the inorganic substrate 10 containing glass that does not have wiring portions 3 and the wiring portions 3 arranged on the first surface, and the insulating resin layer 212 is arranged to cover the portion of the insulating resin layer 211 that does not have wiring portions 3 and the wiring portions 3 provided on the insulating resin layer 211. Furthermore, the insulating resin layer 221 is arranged to cover the portion of the second surface of the inorganic substrate 10 containing glass that does not have wiring portions 3 and the wiring portions 3 arranged on the second surface, and the insulating resin layer 222 is arranged to cover the portion of the insulating resin layer 221 that does not have wiring portions 3 and the wiring portions 3 provided on the insulating resin layer 221. In the wiring substrate 210 shown in Figure 4, each layer of the insulating resin layer 2 has end faces 211e, 212e, 221e, and 222e.

[0027] [Peel strength between the glass-containing inorganic substrate and the insulating resin layer] In one embodiment, the peel strength between the glass-containing inorganic substrate 10 and the insulating resin layer 2 is 0.0098 N / cm or more and less than 4.9 N / cm, preferably 0.098 N / cm or more and less than 4.9 N / cm, and more preferably 0.98 N / cm or more and less than 4.9 N / cm. When the peel strength is 0.0098 N / cm or more and less than 4.9 N / cm, it is possible to reduce the occurrence of crack initiations due to poor interlayer adhesion between the insulating resin layer 2 and the glass-containing inorganic substrate 10 in the event of mechanical fracture such as dicing or thermal shock such as refrigeration cycles, thereby reducing the occurrence of cracks in the glass-containing inorganic substrate 10.

[0028] The peel strength between the inorganic substrate containing glass and the insulating resin layer can be measured based on JIS C6481 Test Methods for Copper-Clad Laminates for Printed Wiring Boards. Specifically, an evaluation substrate B is prepared by disposing an insulating resin layer on an inorganic substrate without vias and making incisions around a region of the insulating resin layer with a width of 10 mm × a length of 100 mm (see FIG. 5). FIG. 5 is a diagram for explaining the measurement procedure of the peel strength between the inorganic substrate containing glass and the insulating resin layer. In FIG. 5, the inorganic substrate 10 containing glass has a width of about 25 mm × a length of 100 mm, and the insulating resin layer 2 has a width of 10 mm × a length of 100 mm. As shown in FIG. 5, one end of this insulating resin layer 2 is peeled off and grasped with a gripping tool, and the load (N / cm) when it is peeled off vertically at a speed of 50 mm / min for 35 mm at room temperature is measured, and the peel strength can be obtained. The peel strength can be measured by a tensile testing machine (for example, device name: Tensilon universal testing machine, manufactured by A&D Company, Limited). When two or more layers of the insulating resin layer 2 are disposed on each main surface of the inorganic substrate 10 containing glass, the insulating resin layers 2 with the number of layers laminated on each main surface of the inorganic substrate 10 containing glass are used as the evaluation substrate B to measure the peel strength. Further, as the evaluation substrate B, it can be prepared by disposing an insulating resin layer on an inorganic substrate without vias.

[0029] The insulating resin layer 2 contains a resin having insulating properties, may contain an inorganic filler, or may be a composite material of a resin and a fiber. The insulating resin layer 2 further contains other components such as a curing agent and a solvent as required. Also, the insulating resin layer 2 is preferably in a sheet form in terms of manufacturing simplicity.

[0030] - Resin - As the resin, for example, epoxy resin, thermosetting modified polyphenylene ether resin, thermosetting polyimide resin, urea resin, allyl resin, silicone resin, benzoxazine resin, phenol resin, unsaturated polyester resin, bismaleimide triazine resin, alkyd resin, furan resin, melamine resin, polyurethane resin, aniline resin, maleimide resin, silicone resin, polycarbonate resin, acrylic resin, polyacetal resin, polypropylene resin, etc. can be mentioned. These may be used alone or in combination of two or more. Among these, epoxy resin is preferable in terms of high mechanical strength, heat resistance, and electrical insulation, and excellent water resistance, chemical resistance, and adhesiveness.

[0031] As the epoxy resin, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, phenol novolac type epoxy resin, tert - butyl - catechol type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, naphthylene ether type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, anthracene type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring - containing epoxy resin, cyclohexanedimethanol type epoxy resin, trimethylol type epoxy resin, halogenated epoxy resin, etc. can be mentioned.

[0032] Among these, bisphenol A type epoxy resin, bisphenol F type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy resin, glycidyl ester type epoxy resin, anthracene type epoxy resin, epoxy resin having a butadiene structure are preferable in terms of more excellent heat resistance and electrical insulation.

[0033] - Inorganic Fillers - Examples of the inorganic fillers include silica, barium sulfate, silicon dioxide, calcined talc, zinc molybdenum-treated talc, barium titanate, titanium dioxide, clay, alumina, mica, boehmite, zinc borate, zinc stannate, other metal oxides or metal hydrates, aluminum hydroxide, calcium carbonate, magnesium hydroxide, magnesium silicate, glass fibers, aluminum borate whiskers, and silicon carbonate whiskers. These may be used individually or in combination of two or more. Among these inorganic fillers, those with silica as the main component are preferred.

[0034] Examples of the silica include amorphous silica, fused silica, crystalline silica, synthetic silica, hollow silica, and spherical silica. Among these, spherical silica and fused silica are preferred.

[0035] Regarding the median diameter of silica, from the viewpoint of electrical insulation and surface smoothness, it is preferably 2 μm or less, more preferably 1 μm or less, even more preferably 0.8 μm or less, and particularly preferably 0.6 μm or less. Furthermore, from the viewpoint of improving the dispersibility of silica, it is preferably 0.01 μm or more, more preferably 0.05 μm or more, and even more preferably 0.1 μm or more.

[0036] The median diameter of silica can be measured by laser diffraction and scattering, based on Mie scattering theory. Specifically, it can be measured using a laser diffraction and scattering particle size distribution analyzer (for example, the LA-950, manufactured by Horiba, Ltd.).

[0037] When the insulating resin layer 2 contains an inorganic filler, the inorganic filler content is preferably 30 parts by mass or more and 80 parts by mass or less per 100 parts by mass of resin. If the content is 30 parts by mass or more, a sufficient effect of reducing the coefficient of thermal expansion can be obtained. If the content is 80 parts by mass or less, sufficient moldability of the insulating resin layer 2 can be obtained.

[0038] - Composite Materials - Examples of composite materials of resin and fiber include composite materials of one or more of the resins and fibers such as inorganic fibers like glass fibers or organic fibers such as polyamide fibers (e.g., woven fabrics, nonwoven fabrics, etc.).

[0039] - Hardener - Examples of the hardener include phenolic hardeners, active ester hardeners, cyanate ester hardeners, benzoxazine hardeners, acid anhydride hardeners, etc. Among these, phenolic hardeners, active ester hardeners, and cyanate ester hardeners are preferred. These may be used alone or in combination of two or more.

[0040] [Average Thickness of Each Layer of Insulating Resin Layer] Regarding the average thickness of each layer of the insulating resin layer 2, in terms of relaxing the stress on the inorganic substrate containing glass and reducing crack generation in the inorganic substrate containing glass, it is preferably 2 μm or more and less than 30 μm, more preferably 2 μm or more and 28 μm or less, still more preferably 2 μm or more and 25 μm or less, and particularly preferably 2 μm or more and 10 μm or less.

[0041] The average thickness of each layer of the insulating resin layer 2 can be calculated by measuring the thickness of each layer of the insulating resin layer 2 at any 10 or more points in a region having only the insulating resin layer 2 without the wiring portion 3 on the inorganic substrate 10 containing glass, using a film thickness meter (for example, Smart Film Thickness Meter SM - 100S, manufactured by Otsuka Electronics Co., Ltd.) or a laser microscope (for example, VK - X3000, manufactured by Keyence Corporation), and obtaining the average value of the measured thicknesses.

[0042] The area of the inorganic substrate 10 containing glass is 10000 mm ２ The volume of each layer of the insulating resin layer 2 per 10000 mm of the area of the inorganic substrate containing glass is preferably 20 mm ３ or more and less than 300 mm ３ more preferably 20 mm ３ or more and 280 mm ３ or less, still more preferably 20 mm ３ or more and 250 mm ３ or less, particularly preferably 20 mm ３ or more and 100 mm ３ or less. Here, the "area of the inorganic substrate 10 containing glass" may include the portion where the insulating resin layer 2 is not provided, specifically, the wiring portion 3.

[0043] The area of the inorganic substrate 10 containing glass is 10000 mm ２The volume of each insulating resin layer 2 is equal to the area of ​​the inorganic substrate 10 containing glass, which is 10,000 mm². ２ For any region having the above characteristics, the thickness of each layer of the insulating resin layer 2 can be measured using a laser microscope (for example, VK-X3000, manufactured by Keyence Corporation), and the volume can be calculated by summing the thicknesses within the region, or the length of the region can be measured using a JIS Class 1 stainless steel ruler, and the area can be calculated by multiplying the lengths of the two sides, and the volume can be calculated by multiplying the thickness and the area. The size of the inorganic substrate 10 containing glass is 10,000 mm². ２ If it is smaller than this, the volume of each layer of the insulating resin layer 2 is measured over the entire area of ​​the inorganic substrate 10 including glass, and the area of ​​the inorganic substrate 10 including glass is 10,000 mm². ２ It can be calculated by converting it to a volume per unit area.

[0044] [Arithmetic surface roughness Sa of the end face of the wiring board] In the wiring board 110, the arithmetic surface roughness Sa of the end face of at least one layer of the insulating resin layer 2 is preferably 0.01 μm or more and 1.00 μm or less, more preferably 0.05 μm or more and 0.50 μm or less, and even more preferably 0.05 μm or more and 0.20 μm or less. When the arithmetic surface roughness Sa is 0.01 μm or more and 1.00 μm or less, the occurrence of crack initiations in the insulating resin layer 2, between multiple insulating resin layers 2, and between the insulating resin layer 2 and the inorganic substrate 10 containing glass can be reduced during dicing, thereby reducing the occurrence of cracks in the insulating resin layer 2.

[0045] In the wiring board 110, the arithmetic surface roughness Sa of the end face of the inorganic substrate 10 containing glass is preferably 0.01 μm or more and 2.00 μm or less, and more preferably 0.05 μm or more and 1.0 μm or less. When the arithmetic surface roughness Sa is 0.01 μm or more and 2.00 μm or less, the occurrence of crack initiations within the inorganic substrate 10 containing glass during dicing, or between the inorganic substrate 10 containing glass and the insulating resin layer 2, can be reduced, thereby reducing the occurrence of cracks in the inorganic substrate 10 containing glass.

[0046] In the wiring board 110, the percentage (%) of the arithmetic surface roughness Sa of the end face of at least one layer of the insulating resin layer 2 is preferably 5% to 400%, more preferably 20% to 100%, and even more preferably 50% to 80%, relative to the arithmetic surface roughness Sa of the end face of the inorganic substrate 10 containing glass. When the percentage of the arithmetic surface roughness Sa is 5% to 400%, the occurrence of crack initiations within the insulating resin layer 2, between multiple insulating resin layers 2, and between the insulating resin layer 2 and the inorganic substrate 10 containing glass can be reduced during dicing, thereby reducing the occurrence of cracks in the inorganic substrate 10 containing glass.

[0047] The arithmetic surface roughness Sa of at least one end face of the insulating resin layer 2, and the arithmetic surface roughness Sa of the end face of the inorganic substrate 10 containing glass, can be measured based on ISO 25178 Surface properties (surface roughness measurement), and specifically, they can be measured using a laser microscope (e.g., VK-X3000, manufactured by Keyence Corporation). Arithmetic surface roughness Sa is a parameter that extends the arithmetic mean height Ra of a line to a surface, and is also referred to as arithmetic mean height Sa.

[0048] In one embodiment, (1) it is preferable that the tensile modulus of the insulating resin layer is 1.0 GPa or more and 30 GPa or less, and / or the tensile strength of the insulating resin layer is 25 MPa or more and 200 MPa or less. In another or additional embodiment, (2) it is preferable that the flexural modulus of the insulating resin layer is 1.0 GPa or more and 50 GPa or less, and / or the flexural strength of the insulating resin layer is 50 MPa or more and 150 MPa or less.

[0049] [Tensile modulus of the insulating resin layer] The tensile modulus of the insulating resin layer 2 is preferably 1.0 GPa or more and 30 GPa or less, more preferably 1.0 GPa or more and 20 GPa or less, and even more preferably 1.0 GPa or more and 15 GPa or less. When the tensile modulus is 1.0 GPa or more and 30 GPa or less, the occurrence of crack initiations within the insulating resin layer 2, between multiple insulating resin layers 2, and between the insulating resin layer 2 and the inorganic substrate 10 containing glass can be reduced during dicing, and the occurrence of cracks in the inorganic substrate 10 containing glass can be reduced.

[0050] [Tensile strength of insulating resin layer] The tensile strength of the insulating resin layer 2 is preferably 25 MPa or more and 200 MPa or less, more preferably 25 MPa or more and 150 MPa or less, and even more preferably 25 MPa or more and 90 MPa or less. When the tensile strength is 25 MPa or more and 200 MPa or less, the occurrence of crack initiations within the insulating resin layer 2, between multiple insulating resin layers 2, and between the insulating resin layer 2 and the inorganic substrate 10 containing glass can be reduced during dicing, and the occurrence of cracks in the inorganic substrate 10 containing glass can be reduced.

[0051] [Flexural modulus of the insulating resin layer] The flexural modulus of the insulating resin layer 2 is preferably 1.0 GPa or more and 50 GPa or less, more preferably 1.0 GPa or more and 30 GPa or less, and even more preferably 1.0 GPa or more and 15 GPa or less. When the flexural modulus is 1.0 GPa or more and 50 GPa or less, the occurrence of crack initiations within the insulating resin layer 2, between multiple insulating resin layers 2, and between the insulating resin layer 2 and the inorganic substrate 10 containing glass can be reduced during dicing, and the occurrence of cracks in the inorganic substrate 10 containing glass can be reduced.

[0052] [Bending strength of insulating resin layer] The bending strength of the insulating resin layer 2 is preferably 50 MPa to 150 MPa, more preferably 65 MPa to 150 MPa, and even more preferably 85 MPa to 145 MPa. When the bending strength is 50 MPa to 150 MPa, the occurrence of crack initiations within the insulating resin layer 2, between multiple insulating resin layers 2, and between the insulating resin layer 2 and the inorganic substrate 10 containing glass can be reduced during dicing, and the occurrence of cracks in the inorganic substrate 10 containing glass can be reduced.

[0053] Tensile modulus, tensile strength, flexural modulus, and flexural strength can be measured according to JIS K7161-1:2014 Method for Determining the Tensile Properties of Plastics, and specifically, they can be measured using a tensile testing device (for example, device name: AGS-X, manufactured by Shimadzu Corporation).

[0054] Here, the tensile modulus, tensile strength, flexural modulus, and / or flexural strength are affected by the material and thickness of the test specimen. Therefore, when two or more insulating resin layers 2 are arranged on each main surface of the inorganic substrate 10 containing glass, these measurements are performed using the number of insulating resin layers 2 laminated on each main surface of the inorganic substrate 10 containing glass as test specimens.

[0055] <Wiring section> In the laminated substrate 100 shown in Figure 1 and the wiring board 110 shown in Figure 3, the wiring section 3 includes a first wiring region located on the surface of the first face of the inorganic substrate 10 containing glass and the surface of the insulating resin layer 21, a second wiring region located on the surface of the second face of the inorganic substrate 10 containing glass and the surface of the insulating resin layer 22, and a through region that penetrates the inorganic substrate 10 containing glass in the thickness direction and electrically connects the first wiring region and the second wiring region. In the laminated substrate 200 shown in Figure 2 and the wiring board 210 shown in Figure 4, the wiring section 3 includes a first wiring region located on the surface of the first face of the inorganic substrate 10 containing glass and the surfaces of the insulating resin layers 211 and 212, a second wiring region located on the surface of the second face of the inorganic substrate 10 containing glass and the surfaces of the insulating resin layers 221 and 222, and a through region that penetrates the inorganic substrate 10 containing glass in the thickness direction and electrically connects the first wiring region and the second wiring region.

[0056] The wiring section 3 is conductive and contains a metal as its main component. Examples of the metal include copper, silver, gold, platinum, nickel, titanium, aluminum, chromium, and alloys thereof. Among these, copper is preferred from the viewpoint of cost and conductivity.

[0057] The average thickness of the wiring section 3 is not particularly limited as long as it is smaller than the average thickness of each layer of the insulating resin layer 2, and can be appropriately selected according to the purpose, but it is preferably 1 μm or more and 28 μm or less, more preferably 2 μm or more and 25 μm or less, and even more preferably 2 μm or more and 10 μm or less. If the average thickness of the wiring section 3 is 1 μm or more, conductivity can be obtained, and if it is smaller than the average thickness of each layer of the insulating resin layer 2 and 28 μm or less, insulation from other wiring sections can be ensured.

[0058] The average thickness of each layer of the insulating resin layer 2 (T ２) the average thickness of the wiring section 3 (T ３ ) proportion (T ３ / T ２ There are no particular restrictions on this, and it can be selected as appropriate depending on the purpose, but 1 / 10 to 9 / 10 is preferred, 2 / 10 to 8 / 10 is more preferred, and 4 / 10 to 6 / 10 is even more preferred.

[0059] <Connection Terminals> The connection terminals 4 are arranged on the surface of the insulating resin layer 2. When the laminated substrate and the wiring substrate have a cover layer, the connection terminals 4 are exposed to the outside of the laminated substrate and the wiring substrate through an opening provided in the cover layer. The connection terminals 4 are conductive and contain a metal as their main component. Examples of the metal include copper, silver, gold, platinum, nickel, titanium, aluminum, chromium, and alloys thereof. Among these, copper is preferred from the viewpoint of cost and conductivity.

[0060] <Cover Layer> The laminated substrate and wiring substrate of this embodiment may have a cover layer disposed on the surface of the insulating resin layer 2. The cover layer has openings in the thickness direction of the cover layer so that the connection terminals 4 disposed on the surface of the insulating resin layer 2 are exposed. The cover layer may be mainly composed of a resin such as solder resist, or it may be formed from an inorganic material containing glass, similar to the inorganic substrate 10 containing glass.

[0061] (Semiconductor Package) The semiconductor package of this embodiment is not particularly limited as long as it has the wiring board of this embodiment described above, and can be appropriately selected according to the purpose. Specifically, it further has one or more integrated circuits (ICs), and the wiring board and the integrated circuits are electrically connected via connection terminals.

[0062] (Method for manufacturing a laminated substrate) The method for manufacturing a laminated substrate according to this embodiment includes arranging patterned wiring portions on at least one surface of an inorganic substrate including glass (step S1), and arranging an insulating resin layer so as to cover at least a part of the inorganic substrate including glass (step S2), and may further include other steps such as arranging connection terminals (step S3) and arranging a cover layer (step S4) as needed.

[0063] The peel strength between the inorganic substrate containing the glass and the insulating resin layer is 0.0098 N / cm or more and less than 4.9 N / cm.

[0064] (Method for manufacturing a wiring board) The method for manufacturing a wiring board according to this embodiment includes manufacturing a laminated substrate by the method for manufacturing a laminated substrate according to this embodiment described above, and dividing the obtained laminated substrate into individual pieces by dicing (step S5), and may further include other steps as necessary.

[0065] A method for manufacturing a laminated substrate according to one embodiment will be described. The method for manufacturing a laminated substrate includes, for example, steps S1 to S4. In step S1, a patterned wiring portion 3 is placed on at least one surface of an inorganic substrate 10 containing glass. In step S2, an insulating resin layer 2 is placed so as to cover at least a portion of the inorganic substrate 10 containing glass. In step S3, connection terminals 4 are placed on the surface of the insulating resin layer 2. In step S4, a cover layer is placed so as to cover at least a portion of the insulating resin layer 2 and expose the connection terminals 4. By doing so, laminated substrates 100 and 200 are manufactured.

[0066] A method for manufacturing a wiring board according to one embodiment will be described. The method for manufacturing a wiring board includes, for example, steps S1 to S5. Steps S1 to S4 are the same as the method for manufacturing a laminated substrate described above, and in step S5, the obtained laminated substrates 100 and 200 are divided into individual pieces by dicing. The wiring boards 110 and 210 are manufactured in this way.

[0067] <Step S1> In Step S1, as shown in Figures 1 and 2, a patterned wiring portion 3 is placed on at least one surface of the inorganic substrate 10 containing glass. The inorganic substrate 10 containing glass and the wiring portion 3 can be appropriately selected from those described in the laminated substrate and wiring substrate of this embodiment.

[0068] There are no particular restrictions on the method of arranging the wiring section 3, and known methods can be appropriately selected depending on the purpose. Examples include copper foil sputtering, chemical vapor deposition (CVD), electroless copper plating, electrolytic copper plating, etching, and conductive paste printing. Furthermore, subtractive, semi-additive, and fully additive methods can be appropriately selected. Specifically, the wiring section can be formed by electrolytic copper plating on a seed layer formed on an inorganic substrate 10 containing glass, and then performing photolithography and etching in a patterned manner. Examples of methods for forming the through-region of the wiring section 3 include electroless copper plating and electrolytic copper plating.

[0069] <Step S2> In step S2, as shown in Figures 1 and 2, an insulating resin layer 2 is placed so as to cover at least a portion of the inorganic substrate 10 containing glass. The insulating resin layer 2 can be appropriately selected from the items described in the laminated substrate and wiring substrate of this embodiment.

[0070] As shown in Figure 2, if the laminated substrate 200 has two or more (multilayer) insulating resin layers and a multilayer wiring section 3 pattern, the multilayer wiring section 3 pattern can be formed by a build-up method in which steps S1 and S2 are repeated alternately to alternately form the wiring section and the insulating layer.

[0071] There are no particular restrictions on the method of arranging the insulating resin layer 2, and a known method can be appropriately selected depending on the purpose. Examples include a vacuum bonding method, and a method in which the insulating resin layer 2 is heat-cured after vacuum bonding.

[0072] <Step S3> In step S3, connection terminals 4 are placed on the surface of the insulating resin layer 2. As connection terminals 4, the items described in the laminated substrate and wiring substrate of this embodiment can be appropriately selected.

[0073] There are no particular restrictions on the method of arranging the connection terminals 4, and a known method can be appropriately selected depending on the purpose. For example, one method is to form a resist pattern by photolithography, masking the area other than the connection terminal 4 formation area at the end of the wiring section 3, forming the connection terminals 4 inside the resist pattern, and then removing the resist pattern.

[0074] Furthermore, it is preferable to apply a surface plating of nickel, palladium, gold, or the like to the surface of the connector terminal 4 after the cover layer has been formed. It is also preferable to roughen the surface of the connector terminal 4 by, for example, plasma treatment. In addition, a reflow solder layer may be formed on the surface of the connector terminal 4. The solder layer is reflowed during component mounting to electrically connect the connector terminal 4 to the component terminal.

[0075] <Step S4> In step S4, a cover layer is placed so as to cover at least a portion of the insulating resin layer 2 and expose the connection terminals 4. The cover layer can be appropriately selected from the items described in the laminated substrate and wiring substrate of this embodiment.

[0076] As described above, as shown in Figures 1 and 2, a laminated substrate can be manufactured as a multi-cavity substrate (a so-called mother substrate) containing multiple wiring boards.

[0077] <Step S5> Next, in step S5, the obtained laminated substrates 100 and 200 are diced (divided into individual pieces). By cutting the portion of the laminated substrate in which the inorganic substrate 10 containing glass and the insulating resin layer 2 are laminated in the lamination direction, individual wiring boards can be manufactured as shown in Figures 3 and 4.

[0078] There are no particular restrictions on the dicing method, and a known method can be appropriately selected depending on the purpose. Examples include blade dicing, laser ablation, and laser stealth. Among these, the blade dicing method is preferred for the laminated substrate of this embodiment because it can effectively reduce the generation of stress during dicing and reduce the occurrence of cracks in the inorganic substrate containing glass.

[0079] The experimental data is described below. Examples 1 to 9 below are examples, and Examples 10 to 14 below are comparative examples.

[0080] (Example 1) <Manufacturing of a Laminated Substrate> As an inorganic substrate containing glass, alkali-free glass with dimensions of 510 mm x 515 mm and an average thickness of 500 μm was used. Next, in order to form the patterned wiring section, electrolytic copper plating was applied to a seed layer formed on the inorganic substrate containing glass, and then photolithography and etching were performed in a patterned manner to form a wiring section with an average thickness of 2.0 μm. An insulating resin film (GX-92, manufactured by Ajinomoto Fine Techno Co., Ltd.) with an average thickness of 5.0 μm was used as the insulating resin layer, and was arranged to cover at least a portion of each surface of the inorganic substrate containing glass, forming one insulating resin layer. The area of ​​the inorganic substrate containing glass at that time was 10,000 mm². ２ The volume per layer of insulating resin is 50 mm³. ３ Next, a solder resist with an average thickness of 25 μm was placed so that the connection terminals were exposed and the remaining portion of the wiring and the resin insulating layer were covered, forming a cover layer. Thus, the laminated substrate of Example 1 was manufactured. The laminated substrate of Example 1 has a single layer of insulating resin on each surface. That is, one layer of insulating resin film is placed on each main surface of the alkali-free glass substrate.

[0081] <Manufacturing of Wiring Boards> The obtained laminated substrate was divided into individual pieces by dicing with a blade to manufacture the wiring boards of Example 1. No defects such as cracks were found in the wiring boards after dicing.

[0082] <Measurement of Peel Strength Between Inorganic Substrate Containing Glass and Insulating Resin Layer> The peel strength between the inorganic substrate containing glass and the insulating resin layer was measured in accordance with JIS C6481 Test Method for Copper-Clad Laminates for Printed Wiring Boards. Specifically, an evaluation substrate B was prepared by placing an insulating resin layer on an inorganic substrate without vias. An incision was made around a 10 mm wide x 100 mm long area of ​​the insulating resin layer on evaluation substrate B. One end of this area was peeled off and grasped with a gripper. The load (N / cm) was measured using a tensile tester (device name: Tensilon Universal Tester, manufactured by A&D Co., Ltd.) when the layer was pulled vertically 35 mm at a speed of 50 mm / min at room temperature, and the peel strength was determined. The peel strength between the inorganic substrate containing glass and the insulating resin layer was 4.5 N / cm.

[0083] <Measurement of average thickness of each layer of insulating resin and arithmetic surface roughness Sa of the edge faces of the wiring board> For the obtained wiring board, the average thickness of each layer of insulating resin, the arithmetic surface roughness Sa of the edge faces of the insulating resin layers, and the arithmetic surface roughness Sa of the edge faces of the inorganic substrate containing glass were measured using a laser microscope (VK-X3000, manufactured by Keyence Corporation) based on ISO 25178 Surface properties (surface roughness measurement). As a result, the arithmetic surface roughness Sa of the edge faces of the insulating resin layers was 0.08 μm, and the arithmetic surface roughness Sa of the edge faces of the inorganic substrate containing glass was 0.06 μm.

[0084] <Measurement of Tensile Modulus, Tensile Strength, Flexural Modulus, and Flexural Strength of the Insulating Resin Layer> The tensile modulus, tensile strength, flexural modulus, and flexural strength of the insulating resin layer were measured using a tensile testing apparatus (apparatus name: AGS-X, manufactured by Shimadzu Corporation) based on JIS K7161-1:2014 Method for Determining the Tensile Properties of Plastics. As a result, the tensile modulus of the insulating resin film was 5 GPa, the tensile strength was 50 MPa, the flexural modulus was 5 GPa, and the flexural strength was 50 MPa. In Example 1, since one insulating resin layer 2 is arranged on each main surface of the inorganic substrate 10 containing glass, these measurements were performed using one insulating resin layer 2 as the test piece.

[0085] The thermal shock test, conducted using the following procedure, revealed no defects such as cracks in the wiring board.

[0086] <Evaluation: Thermal Shock Test> A thermal shock test was performed on individual circuit boards from -40°C to 125°C at a rate of one cycle per hour, including a 15-minute period of residence. This test followed the detailed procedures outlined in JEDEC standard 020D.1, JESD22-A113F, and JEDEC standard JESD22-A104D regarding temperature cycling. Specifically, the temperature cycle from -40°C to 125°C was repeated 500 times.

[0087] (Example 2) As an inorganic substrate containing glass, alkali-free glass with dimensions of 510 mm x 515 mm and an average thickness of 500 μm was used. Next, in order to form the patterned wiring section, electrolytic copper plating was applied to a seed layer formed on the inorganic substrate containing glass, and then photolithography and etching were performed in a patterned manner to form a wiring section with an average thickness of 5.0 μm. An insulating resin film with an average thickness of 10.0 μm was used as the insulating resin layer and was arranged to cover at least a portion of each surface of the inorganic substrate containing glass, forming one insulating resin layer. The area of ​​the inorganic substrate containing glass at that time was 10,000 mm². ２ The volume per layer of insulating resin is 100 mm³. ３ Next, a solder resist with an average thickness of 25 μm was placed so that the connection terminals were exposed and the remaining portion of the wiring and the resin insulating layer were covered, forming a cover layer. Thus, the laminated substrate of Example 2 was manufactured. The laminated substrate of Example 2 has multiple insulating resin layers on each surface. That is, 15 layers of insulating resin film are arranged on each main surface of the alkali-free glass substrate.

[0088] The resulting laminated substrate was diced with a blade to create individual pieces, and the wiring board of Example 2 was manufactured. No defects such as cracks were found in the wiring board after dicing. A thermal shock test was performed, and no defects such as cracks were found in the wiring board.

[0089] (Example 3) As an inorganic substrate containing glass, alkali-free glass with dimensions of 510 mm x 515 mm and an average thickness of 500 μm was used. Next, in order to form the patterned wiring section, electrolytic copper plating was applied to a seed layer formed on the inorganic substrate containing glass, and then photolithography and etching were performed in a patterned manner to form a wiring section with an average thickness of 6.0 μm. An insulating resin film with an average thickness of 12.0 μm was used as the insulating resin layer and was arranged to cover at least a portion of each surface of the inorganic substrate containing glass, forming one insulating resin layer. The area of ​​the inorganic substrate containing glass at that time was 10,000 mm². ２ The volume per layer of insulating resin is 120 mm³. ３ Next, a solder resist with an average thickness of 25 μm was placed so that the connection terminals were exposed and the remaining portion of the wiring and the resin insulating layer were covered, forming a cover layer. Thus, the laminated substrate of Example 3 was manufactured. The laminated substrate of Example 3 has multiple insulating resin layers on each surface. That is, 10 layers of insulating resin film are arranged on each main surface of the alkali-free glass substrate.

[0090] The resulting laminated substrate was diced with a blade to produce individual pieces, and the wiring board of Example 3 was manufactured. No defects such as cracks were found in the wiring board after dicing. A thermal shock test was performed, and no defects such as cracks were found in the wiring board.

[0091] (Example 4) As an inorganic substrate containing glass, alkali-free glass with dimensions of 510 mm x 515 mm and an average thickness of 500 μm was used. Next, in order to form the patterned wiring section, electrolytic copper plating was applied to a seed layer formed on the inorganic substrate containing glass, and then photolithography and etching were performed in a patterned manner to form a wiring section with an average thickness of 7.0 μm. An insulating resin film with an average thickness of 15.0 μm was used as the insulating resin layer and was arranged to cover at least a portion of each surface of the inorganic substrate containing glass, forming one insulating resin layer. The area of ​​the inorganic substrate containing glass at that time was 10,000 mm². ２ The volume per layer of insulating resin is 150 mm³. ３Next, a solder resist with an average thickness of 25 μm was placed so that the connection terminals were exposed and the remaining portion of the wiring and the resin insulating layer were covered, forming a cover layer. Thus, the laminated substrate of Example 3 was manufactured. The laminated substrate of Example 3 has multiple insulating resin layers on each surface. That is, five layers of insulating resin film are arranged on each main surface of the alkali-free glass substrate.

[0092] The resulting laminated substrate was diced with a blade to produce individual pieces, and the wiring board of Example 4 was manufactured. No defects such as cracks were found in the wiring board after dicing. A thermal shock test was performed, and no defects such as cracks were found in the wiring board.

[0093] (Example 5) As an inorganic substrate containing glass, alkali-free glass with dimensions of 550 mm x 650 mm and an average thickness of 500 μm was used. Next, in order to form the patterned wiring section, electrolytic copper plating was applied to a seed layer formed on the inorganic substrate containing glass, and then photolithography and etching were performed in a patterned manner to form a wiring section with an average thickness of 6.0 μm. An insulating resin film with an average thickness of 10.0 μm was used as the insulating resin layer and was arranged to cover at least a portion of each surface of the inorganic substrate containing glass, forming one insulating resin layer. The area of ​​the low thermal expansion coefficient substrate at that time was 10,000 mm². ２ The volume per layer of insulating resin is 100 mm³. ３ Next, a solder resist with an average thickness of 25 μm was placed so that the connection terminals were exposed and the remaining portion of the wiring and the resin insulating layer were covered, forming a cover layer. Thus, the laminated substrate of Example 5 was manufactured. The laminated substrate of Example 5 has a single layer of insulating resin on each surface. That is, one layer of insulating resin film is placed on each main surface of the alkali-free glass substrate.

[0094] The resulting laminated substrate was diced with a blade to produce individual pieces, and the wiring board of Example 5 was manufactured. No defects such as cracks were found in the wiring board after dicing. A thermal shock test was performed, and no defects such as cracks were found in the wiring board.

[0095] (Example 6) In the same manner as in Example 5, except that the average thickness of the insulating resin film was changed to 12.0 μm, a laminated substrate and a wiring substrate of Example 6, each having one insulating resin layer on each surface, were manufactured and evaluated.

[0096] Dicing revealed no defects such as cracks in the circuit board. Thermal shock testing also revealed no defects such as cracks in the circuit board.

[0097] (Example 7) In the same manner as in Example 5, except that the average thickness of the wiring portion was changed to 10.0 μm and the average thickness of the insulating resin film was changed to 15.0 μm, a laminated substrate and a wiring substrate of Example 7, each having one insulating resin layer on each surface, were manufactured and evaluated.

[0098] Dicing revealed no defects such as cracks in the circuit board. Thermal shock testing also revealed no defects such as cracks in the circuit board.

[0099] (Example 8) In Example 8, laminated substrates and wiring substrates having multiple layers of insulating resin on each surface were manufactured and evaluated in the same manner as in Example 7, except that the average thickness of the insulating resin film was changed to 17.0 μm and the number of insulating resin layers on each main surface of the alkali-free glass substrate was changed from one layer to five layers.

[0100] Dicing revealed no defects such as cracks in the circuit board. Thermal shock testing also revealed no defects such as cracks in the circuit board.

[0101] (Example 9) As an inorganic substrate containing glass, alkali-free glass with a size of 150 mm x 150 mm and an average thickness of 500 μm was used. Next, in order to form the patterned wiring section, electrolytic copper plating was applied to a seed layer formed on the inorganic substrate containing glass, and then photolithography and etching were performed in a patterned manner to form a wiring section with an average thickness of 10.0 μm. An insulating resin film with an average thickness of 17.0 μm was used as the insulating resin layer and was arranged to cover at least a portion of each surface of the inorganic substrate containing glass, forming one insulating resin layer. Subsequently, the formation of the wiring section and the formation of the insulating layer were repeated alternately, forming a total of 15 insulating resin layers on each surface of the alkali-free glass substrate. The area of ​​the low thermal expansion coefficient substrate at that time was 10,000 mm². ２ The volume per layer of insulating resin is 170 mm³. ３ Next, a solder resist with an average thickness of 25 μm was placed so that the connection terminals were exposed and the remaining portion of the wiring and the resin insulating layer were covered, forming a cover layer. Thus, the laminated substrate of Example 9 was manufactured. The laminated substrate of Example 9 has multiple insulating resin layers on each surface. That is, 15 layers of insulating resin film are arranged on each main surface of the alkali-free glass substrate.

[0102] The resulting laminated substrate was diced with a blade to produce individual pieces, and the wiring board of Example 9 was manufactured. No defects such as cracks were found in the wiring board after dicing. A thermal shock test was performed, and no defects such as cracks were found in the wiring board.

[0103] (Example 10) In the same manner as in Example 6, except that the average thickness of the wiring portion was changed to 11.0 μm and the average thickness of the insulating resin film was changed to 22.0 μm, a laminated substrate and a wiring substrate of Example 10 were manufactured and evaluated, each having one insulating resin layer on each surface.

[0104] Dicing revealed no defects such as cracks in the circuit board. However, thermal shock testing revealed cracks in the circuit board.

[0105] (Example 11) In Example 8, the laminated substrate and wiring substrate of Example 11 were manufactured and evaluated in the same manner as in Example 8, except that the average thickness of the wiring portion was changed to 12.0 μm and the average thickness of the insulating resin film was changed to 22.5 μm, and each substrate had multiple insulating resin layers on each surface.

[0106] Dicing revealed no defects such as cracks in the circuit board. However, thermal shock testing revealed cracks in the circuit board.

[0107] (Example 12) In Example 4, the average thickness of the wiring portion was changed to 15.0 μm and the average thickness of the insulating resin film was changed to 30.5 μm. The laminated substrate and wiring substrate of Example 12, which have multiple insulating resin layers on each surface, were manufactured in the same manner as in Example 4 and evaluated.

[0108] Dicing revealed no defects such as cracks in the circuit board. However, thermal shock testing revealed cracks in the circuit board.

[0109] (Example 13) In the same manner as in Example 9, except that the average thickness of the wiring portion was changed to 30.0 μm and the average thickness of the insulating resin film was changed to 60.2 μm, a laminated substrate and a wiring substrate of Example 13 having multiple insulating resin layers on each surface was manufactured and evaluated.

[0110] Dicing revealed no defects such as cracks in the circuit board. However, thermal shock testing revealed cracks in the circuit board.

[0111] (Example 14) In Example 14, laminated substrates and wiring substrates were manufactured and evaluated in the same manner as in Example 13, except that the average thickness of the wiring portion was changed to 70.0 μm, the average thickness of the insulating resin film was changed to 150.0 μm, and the number of insulating resin layers on each main surface of the alkali-free glass substrate was changed from 15 layers to 1 layer.

[0112] Cracks were observed in the wiring board during dicing. Therefore, it did not pass the thermal shock test.

[0113]

[0114]

[0115]

[0116] The results for Examples 1 to 14 are shown in Tables 1 to 3. From these results, it was found that by having a peel strength of 0.0098 N / cm or more and less than 4.9 N / cm between the inorganic substrate containing the glass and the insulating resin layer, it is possible to provide a laminated substrate and a wiring substrate that can reduce the occurrence of cracks in the inorganic substrate containing the glass due to mechanical failure and thermal shock.

[0117] The above describes the laminated substrate, wiring substrate, method for manufacturing the laminated substrate, and method for manufacturing the wiring substrate related to this disclosure. However, this disclosure is not limited to the embodiments described above. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These also naturally fall within the technical scope of this disclosure.

[0118] The following appendices are disclosed with respect to the above embodiments, etc. [Appendix 1] A laminated substrate having a plurality of wiring boards, each having an inorganic substrate containing glass, one or more insulating resin layers arranged to cover at least a part of the inorganic substrate containing glass, and a wiring portion arranged on at least one surface of the inorganic substrate containing glass and the insulating resin layer, wherein the peel strength between the inorganic substrate containing glass and the insulating resin layer is 0.0098 N / cm or more and less than 4.9 N / cm. [Appendix 2] A wiring board having an inorganic substrate containing glass, one or more insulating resin layers arranged to cover at least a part of the inorganic substrate containing glass, and a wiring portion arranged on at least one surface of the inorganic substrate containing glass and the insulating resin layer, wherein the peel strength between the inorganic substrate containing glass and the insulating resin layer is 0.0098 N / cm or more and less than 4.9 N / cm. [Appendix 3] The wiring board according to Appendix 2, wherein the average thickness of each layer of the insulating resin layer is 2 μm or more and less than 30 μm. [Note 4] Area of ​​the inorganic substrate including the glass: 10,000 mm² ２ The volume of each layer of the insulating resin layer per unit area is 20 mm ３ 300mm or more ３[Note 5] A wiring board according to any one of the following items, wherein the arithmetic surface roughness Sa of the end face of at least one layer of the insulating resin layer is 0.05 μm or more and 0.20 μm or less. [Note 6] A wiring board according to any one of the following items, wherein the tensile modulus of the insulating resin layer is 1.0 GPa or more and 30 GPa or less, and / or the tensile strength of the insulating resin layer is 25 MPa or more and 200 MPa or less. [Note 7] A wiring board according to any one of the following items, wherein the flexural modulus of the insulating resin layer is 1.0 GPa or more and 50 GPa or less, and / or the flexural strength of the insulating resin layer is 50 MPa or more and 150 MPa or less. [Note 8] A method for manufacturing a laminated substrate, comprising: arranging patterned wiring portions on at least one surface of an inorganic substrate containing glass; and arranging an insulating resin layer so as to cover at least a portion of the inorganic substrate containing glass, wherein the peel strength between the inorganic substrate containing glass and the insulating resin layer is 4.9 N / cm or more and 49 N / cm or less. [Note 9] A method for manufacturing a wiring substrate, comprising: manufacturing a laminated substrate by the method for manufacturing a laminated substrate described in Note 8; and dicing the obtained laminated substrate. [Note 10] A semiconductor package having a wiring substrate described in any one of Notes 2 to 7.

[0119] This application claims priority based on Japanese Patent Application No. 2024-170256, filed on 30 September 2024, and incorporates all of its disclosures herein.

[0120] 10 Inorganic substrate containing glass 2, 21, 22, 211, 212, 221, 222 Insulating resin layer 3 Wiring section 4 Connection terminal 100 Laminated substrate 110 Wiring board 200 Laminated substrate 210 Wiring board

Claims

1. A laminated substrate having a plurality of wiring boards, each having an inorganic substrate containing glass, one or more insulating resin layers arranged to cover at least a portion of the inorganic substrate containing glass, and wiring portions arranged on at least one surface of the inorganic substrate containing glass and the insulating resin layer, wherein the peel strength between the inorganic substrate containing glass and the insulating resin layer is 0.0098 N / cm or more and less than 4.9 N / cm.

2. A wiring board comprising: an inorganic substrate containing glass; one or more insulating resin layers disposed to cover at least a portion of the inorganic substrate containing glass; and a wiring portion disposed on at least one surface of the inorganic substrate containing glass and the insulating resin layer, wherein the peel strength between the inorganic substrate containing glass and the insulating resin layer is 0.0098 N / cm or more and less than 4.9 N / cm.

3. The wiring board according to claim 2, wherein the average thickness of each layer of the insulating resin layer is 2 μm or more and less than 30 μm.

4. Area of ​​the inorganic substrate including the glass: 10,000 mm² ２ The volume of each layer of the insulating resin layer per unit area is 20 mm ３ 300mm or more ３ A wiring board according to claim 2, which is less than [amount missing].

5. The wiring board according to claim 2, wherein the arithmetic surface roughness Sa of the end face of at least one of the insulating resin layers is 0.05 μm or more and 0.20 μm or less.

6. The wiring board according to claim 2, wherein the tensile modulus of the insulating resin layer is 1.0 GPa or more and 30 GPa or less, and / or the tensile strength of the insulating resin layer is 25 MPa or more and 200 MPa or less.

7. The wiring board according to claim 2, wherein the flexural modulus of the insulating resin layer is 1.0 GPa or more and 50 GPa or less, and / or the flexural strength of the insulating resin layer is 50 MPa or more and 150 MPa or less.

8. A method for manufacturing a laminated substrate, comprising: arranging patterned wiring portions on at least one surface of an inorganic substrate containing glass; and arranging an insulating resin layer so as to cover at least a portion of the inorganic substrate containing glass, wherein the peel strength between the inorganic substrate containing glass and the insulating resin layer is 4.9 N / cm or more and 49 N / cm or less.

9. A method for manufacturing a wiring substrate, comprising: manufacturing a laminated substrate by the method for manufacturing a laminated substrate described in claim 8; and dicing the obtained laminated substrate.

10. A semiconductor package having a wiring board as described in any one of claims 2 to 7.

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