End effector, substrate processing apparatus, and substrate processing method
The end effector addresses the need for power-independent substrate rotation and handling by using an elastic body and rotating plate design, enhancing process efficiency and preventing film adhesion and damage in semiconductor and display manufacturing.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-08-07
- Publication Date
- 2026-04-02
Smart Images

Figure KR2025011882_02042026_PF_FP_ABST
Abstract
Description
End effector, substrate processing device and substrate processing method
[0001] The present invention relates to an end effector, a substrate processing apparatus, and a substrate processing method, and more specifically, to an end effector that supports and rotates a substrate, a substrate processing apparatus, and a substrate processing method.
[0002] In order to carry out various unit processes such as deposition, etching, and cleaning in semiconductor and display manufacturing processes, multiple devices suitable for each process characteristic are provided, and each of these different devices is equipped with substrate transfer robots for transferring substrates such as wafers.
[0003] Such a substrate transfer robot can load substrates from a loading chamber onto a substrate boat and is equipped with one or more end effectors that support the substrates. Here, the end effectors have various forms and are required to be designed to prevent slipping or displacement so that the substrates are supported in a fixed position, and to minimize damage to the back of the substrates.
[0004] Conventional end effectors primarily feature structures and / or configurations for aligning substrates, and require a separate power source, such as a motor, when aligning the substrate by rotating it. Additionally, to prevent the substrate from adhering to the substrate boat due to the formed film while forming a thick film on the substrate, the substrate must be lifted periodically during film deposition to detach the film from the substrate boat; for this purpose, an end effector can be used to lift the substrate from the support portion of the substrate boat. Furthermore, to prevent the detached film from reattaching, it is necessary to rotate the substrate and support (or settle) it on the support portion of the substrate boat. Conventionally, rotating the substrate requires a separate rotation process, which leads to the problem of increased process time.
[0005] Therefore, there is a need for a device and method that can rotate a substrate to load it onto a substrate board without increasing process time, and can rotate the substrate without a separate power source.
[0006] (Patent Document 1) Korean Published Patent No. 10-2020-0130058
[0007] The present invention provides an end effector that automatically rotates a substrate while supporting the substrate, a substrate processing device, and a substrate processing method.
[0008] An end effector according to one embodiment of the present invention comprises: a base board extending in one direction; and a lifting and rotating member provided at the center of the base board and providing rotational force while changing height according to pressure; wherein the lifting and rotating member may include an elastic body supported by the base board and compressible by the pressure; and a rotating plate that supports a substrate and is supported by the elastic body and can rotate while descending according to the compression of the elastic body.
[0009] The base board includes a concave portion in the central part, the elastic body is supported on the bottom surface of the concave portion, and the rotating plate may protrude from the concave portion beyond the upper surface of the base board.
[0010] The above-mentioned concave portion includes a spiral groove in the inner wall, and the edge portion of the above-mentioned rotating plate can be coupled to the spiral groove.
[0011] The above-mentioned rotating plate may include a cap portion covering the upper portion of the elastic body; and a wing portion protruding outward from the cap portion and coupled to the spiral groove.
[0012] The above wing portions can be symmetrical to each other and protrude on both sides.
[0013] The elastic body is compressed by the load of the substrate supported by the rotating plate, and the rotating plate can rotate while descending due to the compression of the elastic body while supporting the substrate.
[0014] The above base board may include a guide side wall portion having a guide surface facing the center portion, provided at the edge portion.
[0015] The guide surface of the above guide sidewall may include an inclined surface or a curved surface.
[0016] The above lifting rotating part may further include a coating part provided between the rotating plate and the elastic body to reduce friction when the rotating plate rotates.
[0017]
[0018] A substrate processing device according to another embodiment of the present invention may include: a substrate transfer robot including an end effector according to one embodiment of the present invention; a loading chamber providing a loading space for loading the substrate onto a substrate boat through the substrate transfer robot; and a process tube provided above the loading chamber and having a processing space in which the substrate boat is received and the substrate is processed.
[0019] A vacuum can be formed in the above loading chamber.
[0020]
[0021] A substrate processing method according to another embodiment of the present invention may include: a process of loading a substrate onto a substrate boat using a substrate transfer robot having at least one end effector; a process of bringing the substrate boat loaded with the substrate into a process tube and performing a first deposition; a process of removing the substrate boat from the process tube; a process of lifting the substrate loaded on the substrate boat through the end effector and rotating it to reload it; and a process of bringing the substrate boat with the reloaded substrate into the process tube and performing a second deposition.
[0022] The process of lifting and rotating the substrate to reload it may include: a process of raising the end effector from the bottom of the substrate; a process in which the substrate comes into contact with the lifting and rotating part of the end effector; a process in which the height of the lifting and rotating part is lowered by the load of the substrate, thereby providing rotational force to the substrate to rotate the substrate; a process in which the end effector supporting the substrate is lowered; a process in which the substrate comes into contact with and is supported by the support part of the substrate boat; and a process in which the lifting and rotating part is separated from the substrate and returns to its original position.
[0023] The process of rotating the substrate may include: a process in which the elastic body of the lifting and rotating part is compressed by the load of the substrate; and a process in which the rotating plate of the lifting and rotating part supported by the elastic body rotates while descending due to the compression of the elastic body.
[0024] In the process where the above-mentioned rotating plate rotates while descending due to the compression of the elastic body, the edge portion of the rotating plate is coupled to the spiral groove formed on the inner wall of the concave portion of the base board on which the elastic body is supported, so that the rotating plate can rotate while descending.
[0025] An end effector according to an embodiment of the present invention can rotate while supporting a substrate through a lifting and rotating part, and the elastic body of the lifting and rotating part is compressed by the load of the substrate, causing the rotating plate supported by the elastic body to descend and rotate, and the substrate supported by the rotating plate can rotate together. Accordingly, the substrate can be rotated simply by supporting the substrate in the end effector without the need for a separate power means such as a motor.
[0026] When a substrate transfer robot including such an end effector is used in a substrate processing device, the substrate can be rotated and reloaded into the substrate boat simply by lifting and lowering the substrate from the boat. Accordingly, the substrate can be rotated and loaded without a separate rotation process, thereby reducing process time.
[0027] Meanwhile, in the substrate processing method of the present invention, the substrate can be lifted in the middle of film formation to detach the film from the substrate boat while forming a thick film. Accordingly, adhesion between the substrate and the substrate boat by the film can be prevented, and a thick film can be formed without damage caused by adhesion between the substrate and the substrate boat. Additionally, by using the end effector of the present invention to lift the substrate and then lower it onto the support portion of the substrate boat, the substrate can be rotated and reloaded onto the substrate boat. Accordingly, as the substrate is supported (or seated) on the support portion of the substrate boat, the film that had detached from the support portion of the substrate boat can be prevented from reattaching as is, and adhesion between the substrate and the substrate boat by the formed film can be effectively prevented while forming the thick film.
[0028] FIG. 1 is a schematic perspective view showing an end effector according to an embodiment of the present invention.
[0029] FIG. 2 is a figure for illustrating a base board and a lifting rotating part according to an embodiment of the present invention.
[0030] FIG. 3 is a figure for explaining the spiral groove of the concave part of the base board and the rotating plate of the lifting rotating part according to an embodiment of the present invention.
[0031] FIG. 4 is a conceptual diagram illustrating rotation according to the lifting and lowering of a rotating plate according to an embodiment of the present invention.
[0032] FIG. 5 is a schematic cross-sectional view showing a substrate processing apparatus according to another embodiment of the present invention.
[0033] FIG. 6 is a flowchart illustrating a substrate processing method according to another embodiment of the present invention.
[0034] FIG. 7 is a figure showing the substrate processing method according to another embodiment of the present invention in sequence.
[0035] Embodiments of the present invention will be described in more detail below with reference to the attached drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms; these embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. In the description, the same reference numerals are assigned to identical components, and the drawings may be partially exaggerated in size to accurately describe the embodiments of the present invention, and the same reference numerals in the drawings refer to the same elements.
[0036]
[0037] FIG. 1 is a schematic perspective view showing an end effector according to an embodiment of the present invention.
[0038] Referring to FIG. 1, an end-effector (100) according to one embodiment of the present invention may include a base board (110) extending in one direction; and a lifting rotating part (120) provided in the center of the base board (110) and providing rotational force while changing height according to pressure.
[0039] A base board (110) can be extended in one direction and can form a frame of an end effector (100). For example, the base board (110) may have a fork shape comprising a plurality of fingers arranged (or arranged) in a second direction that intersects the first direction in parallel with the first direction. Here, the second direction may be a direction that intersects the first direction among the horizontal directions, and if the first direction is a front-back direction, it may be a left-right direction. Additionally, the base board (110) may be made of a ceramic material such as quartz, aluminum oxide (Al2O3), aluminum nitride (AlN), silicon carbide (SiC), titanium dioxide (TiO2), or silicon dioxide (SiO2).
[0040] The lifting rotation part (120) can be provided in the center of the base board (110) and can provide rotational force as its height changes according to pressure, and can rotate another connected (or contacted) object (e.g., substrate) by rotating itself by the rotational force.
[0041] FIG. 2 is a drawing for explaining a base board and a lifting rotation part according to an embodiment of the present invention, FIG. 2(a) shows a plan view and a side view of an end effector, FIG. 2(b) is an enlarged view of the lifting rotation part of the end effector in the plan view, FIG. 2(c) is an enlarged view of the guide side wall part of the base board in the plan view of the end effector.
[0042] Referring to FIG. 2, the lifting and rotating part (120) may include an elastic body (121) that is supported on a base board (110) and is compressible by the pressure applied; and a rotating plate (122) that supports a substrate (10) and is supported by the elastic body (121) and is rotatable while descending according to the compression of the elastic body (121). The elastic body (121) may be supported on the base board (110) and may be compressed by the pressure applied, thereby changing the height of the lifting and rotating part (120). For example, the elastic body (121) may have an elasticity (force) that is lower than the load (or weight) of the substrate (10) and higher than the load of the rotating plate (122), so that when the substrate (10) is not supported, it maintains its height (or is not compressed), and when the substrate (10) is supported by the rotating plate (122), it may be compressed by the load of the substrate (10). Here, the elastic body (121) may include a spring or rubber, but is not specifically limited thereto. It is sufficient if it is compressed by the load of the substrate (10) when supporting the substrate (10), and then returns to its original height (or length) by its elasticity (or restoring force) when the support of the substrate (10) is released (or when the substrate is not supported).
[0043] The rotating plate (122) can support the substrate (10), can be supported by the elastic body (121), and can rotate while descending according to the compression of the elastic body (121). Accordingly, rotational force can be applied to the substrate (10) supported by the rotating plate (122) to rotate the substrate (10) together with the rotating plate (122). For example, the rotating plate (122) may have a support surface (or seating surface) to which the substrate (10) is contacted and supported (or seated), and when the substrate (10) is supported on the support surface of the rotating plate (122), it can rotate while descending according to (or by) the compression of the elastic body (121) caused by the load of the substrate (10), and can rotate the substrate (10) by applying rotational force to the supported substrate (10). That is, since the rotating plate (122) contacts and supports the substrate (10), as the rotating plate (122) rotates, the substrate (10) supported on the support surface can also rotate together. At this time, the substrate (10) may be a wafer, but is not specifically limited thereto, and may be a glass substrate, etc.
[0044] Here, the base board (110) may include a concave portion (111) in the central portion, and the elastic body (121) may be supported on the bottom surface of the concave portion (111). The base board (110) may include a concave portion (111) in the central portion, and the concave portion (111) may be formed in the central portion of the base board (110) to provide a receiving space into which at least a portion of the elastic body (121) is inserted (or received), and may be formed by a concave groove or a through hole.
[0045] The elastic body (121) can be supported on the bottom surface of the concave portion (111), and the lower portion can be inserted into the concave portion (111) so that the lower surface is supported on the bottom surface. Here, if the concave portion (111) is formed as a concave groove, the bottom surface may be the bottom surface of the concave groove, and if the concave portion (111) is formed as a through hole, the bottom surface may be formed by blocking the lower part of the through hole with a bottom plate (115). Meanwhile, the bottom plate (115) may be made of stainless steel (STS or Steel Use Stainless; SUS), and even if the elastic body (121) is made of iron (or steel) like a spring, it can suppress or prevent damage such as scratches or cracks that may occur in ceramics, etc.
[0046] At this time, the rotating plate (122) may protrude from the upper surface of the base board (110) (or the upper surface of the concave portion) in the concave portion (111), and at least a portion may protrude from the concave portion (111) when the substrate (10) is not supported. By protruding from the upper surface of the base board (110), the substrate (10) may be supported on the rotating plate (122) (i.e., the supporting surface of the rotating plate) rather than the upper surface of the base board (110), thereby being spaced apart (or floating) from the upper surface of the base board (110). Accordingly, as the substrate (10) is supported, it is first supported on the supporting surface of the rotating plate (122) rather than the upper surface of the base board (110), so that the substrate (10) can rotate together with the rotating plate (122) according to the rotation of the rotating plate (122) without friction with the upper surface of the base board (110).
[0047] FIG. 3 is a diagram illustrating a spiral groove in a concave part of a base board and a rotating plate of a lifting rotating part according to an embodiment of the present invention, where FIG. 3 (a) shows a concave part of a base board, FIG. 3 (b) shows a rotating plate of a lifting rotating part, FIG. 3 (c) shows a rotating plate coupled to the spiral groove of a concave part in a raised position, and FIG. 3 (d) shows a rotating plate coupled to the spiral groove of a concave part in a lowered position.
[0048] Referring to FIG. 3, the concave portion (111) may include a spiral groove (111a) on its inner wall, and the edge portion of the rotating plate (122) may be coupled to the spiral groove (111a). The concave portion (111) may include a spiral groove (111a) on its inner wall, and the spiral groove (111a) may be formed on the inner wall of the concave portion (111) and the edge portion of the rotating plate (122) may be coupled to it. Accordingly, the rotating plate (122) is lowered by the compression of the elastic body (121), and as the edge portion of the rotating plate (122) travels down along the spiral groove (111a), the rotating plate (122) may rotate at a predetermined angle (or a certain angle) according to the length and / or inclination of the spiral groove (111a).
[0049] The edge portion of the rotating plate (122) may be coupled to the spiral groove (111a), and the edge portion of the rotating plate (122) may be coupled to the spiral groove (111a) so that the rotating plate (122) may slide down the spiral groove (111a) as it descends, and in this case, the rotating plate (122) may rotate at a predetermined angle according to the length of the spiral groove (111a) along which the edge portion of the rotating plate (122) has slided down and / or the inclination of the spiral groove (111a).
[0050] For example, the rotating plate (122) may include a cap portion (122a) covering the upper portion of the elastic body (121); and a wing portion (122b) protruding outward from the cap portion (122a) and coupled to the spiral groove (111a). The cap portion (122a) may cover the upper portion of the elastic body (121) and may be supported on the elastic body (121) by covering the upper portion of the elastic body (121). For example, the cap portion (122a) may be formed in the shape of a lid or a cap and may be placed on the upper portion of the elastic body (121), and the upper portion of the elastic body (121) may be fitted and supported on the upper surface of the elastic body (121).
[0051] The wing portion (122b) can protrude outward from the cap portion (122a) and be coupled to the spiral groove (111a), and can protrude vertically from the side (or circumferential surface) of the cap portion (122a), and can be fitted into the spiral groove (111a) and move (or rise / fall) along the spiral groove (111a) according to the compression and restoration of the elastic body (121). For example, the wing portion (122b) can protrude outward (or laterally) from the bottom (part) of the cap portion (122a), and can descend by the compression of the elastic body (121) to contact (or be supported) the bottom surface of the concave portion (111), and the rotating plate (122) can be stably supported on the bottom surface of the concave portion (111), thereby stably supporting the substrate (10).
[0052] At this time, the wing portion (122b) may protrude symmetrically on both sides. The wing portion (122b) may be formed entirely on the circumference (surface) (or side) of the cap portion (122a), but if it is formed entirely on the circumference of the cap portion (122a), the spiral groove (111a) must be formed around the inner wall of the concave portion (111) like a screw root, so that the entire circumference of the inner wall is formed. Accordingly, the contact area between the spiral groove (111a) and the rotating plate (122) increases, and due to the increase in friction (force), the rotation of the rotating plate (122) may not be smooth, and as the rotating plate (122) is pressed (or compressed) by the load of the substrate (10), the wing portion (122b) may get caught (or supported) in the spiral groove (111a), and the rotating plate (122) may not even be able to descend. Additionally, since the wing portion (122b) is formed entirely around the circumference of the cap portion (122a), it may be difficult to insert (or connect) the wing portion (122b) into the spiral groove (111a).
[0053] Accordingly, the wing portions (122b) may be composed of multiple parts and may protrude to both sides (each) symmetrically, and the multiple wing portions (122b) may be spaced apart from each other and may be joined (or fitted) to the spiral groove (111a) respectively. Accordingly, it may be easy to fit (or fit) the wing portions (122b) into the spiral groove (111a), and the contact area between the spiral groove (111a) and the rotating plate (122) may be small (or small), allowing the rotation of the rotating plate (122) to be smooth. Here, the spiral groove (111a) may be formed as multiple (of the spiral grooves) spaced apart from each other corresponding to the (multiple) wing portions (122b), and the multiple spiral grooves (111a) may each have an inclined surface of approximately ± 45° or more (and an angle smaller than ± 90°). Accordingly, the downward movement of the rotating plate (122) due to the load of the substrate (10) is well carried out along the inclined surface, so that the rotating plate (122) can rotate well according to the angle of the inclined surface. At this time, two inclined surfaces may be formed symmetrically to each spiral groove (111a), and '±' merely indicates the direction (or position) of the inclined surface, and '± 45° or more' means +45° to +90° or -45° to -90°. For example, if the angle of one of the inclined surfaces is +60°, the angle of the inclined surface on the opposite side may be -60°, which has the same magnitude of angle (degree) but a different direction (only). In addition, in such cases, the formation of the spiral groove (111a) may be easy.
[0054] FIG. 4 is a conceptual diagram for explaining rotation according to the lifting and lowering of a rotating plate according to an embodiment of the present invention, where FIG. 4 (a) shows the lowering of the rotating plate and FIG. 4 (b) shows the return of the rotating plate.
[0055] Referring to FIG. 4, the elastic body (121) can be compressed by the load of the substrate (10) supported by the rotating plate (122), and the rotating plate (122) can rotate while lowering due to the compression of the elastic body (121) while supporting the substrate (10). The elastic body (121) can be compressed by the load of the substrate (10) supported by the rotating plate (122), and by having elasticity that is lower than the load of the substrate (10) but higher than the load of the rotating plate (122), it maintains its height when not supporting the substrate (10), and can be compressed by the load of the substrate (10) when the substrate (10) is supported by the rotating plate (122). Additionally, when the support of the substrate (10) is released, the elastic body (121) can be restored to its original state by its elasticity.
[0056] And the rotating plate (122) can rotate while lowering due to the compression of the elastic body (121) while supporting the substrate (10). When the substrate (10) is supported on the rotating plate (122), the elastic body (121) is compressed by the load of the substrate (10) supported on the rotating plate (122), and the rotating plate (122) supported on the elastic body (121) can descend according to the compression of the elastic body (121), and the wing portion (122b) of the rotating plate (122) can move down along the spiral groove (111a) of the inner wall of the concave portion (111), and the rotating plate (122) can rotate at a predetermined angle according to the length and / or inclination of the spiral groove (111a). Accordingly, the substrate (10) can be rotated by the load of the substrate (10) simply by supporting the substrate (10) on the end effector (100) through the lifting rotation part (120) without a separate power means such as a motor.
[0057] For example, the rotating plate (122) may rotate only at the moment (or briefly) it contacts the substrate (10) and supports the substrate (10), and may rotate while descending according to the compression of the elastic body (121) only while the load of the substrate (10) is transferred to the elastic body (121) and the elastic body (121) is compressed due to the contact with the substrate (10) and the support of the substrate (10). And the rotating plate (122) may stop rotating at the moment the compression of the elastic body (121) stops (or at the moment the descent of the rotating plate stops), so that the rotating plate (122) may not rotate while the compression of the elastic body (121) stops (or while the descent of the rotating plate stops). Additionally, when the pressure (or the above-mentioned pressure) applied to the elastic body (121) is removed and the elastic body (121) is restored (or returned to its original position), the rotating plate (122) may rise in accordance with the restoration of the elastic body (121) and rotate in the opposite direction to when it descends. In this case, the load of the substrate (10) is not applied (or is not applied) to the rotating plate (122), so the substrate (10) does not rotate, and only the rotating plate (122) can rotate. Even in this case, it may rise and rotate in accordance with the restoration of the elastic body (121) only while the elastic body (121) is being restored, and when the rising of the rotating plate (122) stops, the rotation of the rotating plate (122) may also stop.
[0058] Meanwhile, the rotating plate (122) is lowered while rotating so that the height of the support surface may be equal to the upper surface of the base board (110) or may be maintained higher than the upper surface of the base board (110). If the height of the support surface is equal to the upper surface of the base board (110), the support (or contact) area of the substrate (10) is widened so that the substrate (10) can be stably supported, and if the support surface is higher than the upper surface of the base board (110) even after the rotating plate (122) is lowered, the contact area with the substrate (10) is reduced so that damage to the lower surface of the substrate (10) can be minimized.
[0059] Accordingly, the end effector (100) according to the present invention can be rotated while the substrate (10) is supported through the lifting rotation unit (120), and the elastic body (121) of the lifting rotation unit (120) is compressed by the load of the substrate (10), so that the rotating plate (122) supported by the elastic body (121) can rotate while descending, and the substrate (10) supported by the rotating plate (122) can be rotated together. Accordingly, the substrate (10) can be rotated simply by supporting the substrate (10) on the end effector (100) without the need for a separate power means such as a motor.
[0060] The base board (110) may include a guide sidewall (112) having a guide surface (112a) that is provided at the edge and faces the center. The guide sidewall (112) may have a guide surface (112a) that is provided at the edge of the base board (110) and faces the center, and at least a portion of the guide surface (112a) may face the side of the substrate (10) supported on the rotating plate (122). Accordingly, the side of the substrate (10) may be blocked by the guide surface (112a), and even if the substrate (10) is supported by contacting the rotating plate (122) (only) with a small area, the substrate (10) may not be disengaged from the end effector (100), and the disengagement of the substrate (10) during the movement of the end effector (100) (or the transfer of the substrate) may be prevented.
[0061] Here, the guide surface (112a) of the guide sidewall portion (112) may include an inclined surface or a curved surface. Accordingly, a portion of the guide surface (112a) may face the side of the substrate (10) supported by the rotating plate (122), while the remaining portion of the guide surface (112a) may face the lower surface (or corner) of the substrate (10) supported by the rotating plate (122), and the lower surface edge (or corner) of the substrate (10) may be in contact (or supported) by the guide surface (122a). At this time, the lower surface edge of the substrate (10) may be in contact (or supported) by the guide surface (122a) only when the rotating plate (122) is lowered, or may be in contact with the guide surface (122a) only when the substrate (10) is about to tilt or lean to one side. When the rotating plate (122) is lowered, the lower edge of the substrate (10) is supported by the guide surface (122a), thereby allowing the substrate (10) to be supported stably. Point contact can be made through the guide surface (122a), which is inclined or curved, thereby allowing the substrate (10) to be supported stably while minimizing the contact area. Additionally, when the substrate (10) is about to lean to one side or tilt, the guide surface (122a) supports (or blocks or holds) the lower edge of the substrate (10) so that (or as much as possible) the substrate (10) can be kept horizontal and supported (or positioned) at a certain position (or a predetermined position) with (almost) no positional error, and the movement and / or detachment of the substrate (10) (during transport) can be prevented.
[0062] Additionally, the lifting rotating part (120) may further include a coating part (123) provided between the rotating plate (122) and the elastic body (121) to reduce friction when the rotating plate (122) rotates. The coating part (123) may be provided between the rotating plate (122) and the elastic body (121), and may be interposed between the rotating plate (122) and the elastic body (121) to reduce friction (force) when the rotating plate (122) rotates, and the friction force with the elastic body (121) may be smaller than the friction force between the rotating plate (122) and the elastic body (121). For example, the coating portion (123) may be coated on the lower surface of the rotating plate (122) facing the upper surface of the elastic body (121) (e.g., the upper lower surface or upper inner surface of the cap portion), and may be formed by depositing a film or layer, or by attaching a film or plate, but is not limited thereto, and it is sufficient if it is formed as an integral part with the rotating plate (122). Here, the coating portion (123) may be made of a material resistant to high temperatures and contamination, and may be made of a polytetrafluoroethylene (PTFE) series with a low friction coefficient to allow smooth rotation on the elastic body (121). Accordingly, the rotating plate (122) supporting the substrate (10) can rotate smoothly while descending in accordance with the compression of the elastic body (121).
[0063]
[0064] FIG. 5 is a schematic cross-sectional view showing a substrate processing apparatus according to another embodiment of the present invention.
[0065] Referring to FIG. 5, a substrate processing apparatus according to another embodiment of the present invention will be examined in more detail, and details that overlap with the previously described parts regarding the end effector according to one embodiment of the present invention will be omitted.
[0066] A substrate processing device (200) according to another embodiment of the present invention may include: a substrate transfer robot (210) including an end effector (100) according to one embodiment of the present invention; a loading chamber (220) providing a loading space for loading the substrate (10) onto a substrate boat (225) via the substrate transfer robot (210); and a process tube (230) provided above the loading chamber (220) and having a processing space in which the substrate boat (225) is received and the substrate (10) is processed.
[0067] A substrate transfer robot (210) may include an end effector (100) according to an embodiment of the present invention, and may transfer a substrate (10) by providing power through a motor or the like to move the end effector (110). For example, the substrate transfer robot (210) may load the substrate (10) onto a substrate boat (225) and may remove (or unload) the substrate (10) from the substrate boat (225).
[0068] The loading chamber (220) can provide a loading space for loading a substrate (10) onto a substrate boat (225) via a substrate transfer robot (210), and is provided at the bottom of the process tube (230) so that the substrate (10) can be loaded onto the substrate boat (225) via the substrate transfer robot (210), and the substrate boat (225) loaded with the substrate (10) can be raised and loaded into the process tube (230).
[0069] A process tube (230) may be provided on the upper part of a loading chamber (220) and may have a processing space in which a substrate boat (225) is received and a substrate (10) is processed, and a processing process of the substrate (10) loaded on the substrate boat (225) may be performed in said processing space. The process tube (230) may be formed in a cylindrical shape, and the lower part may be open while the upper part is closed, and when the substrate boat (225) moves up and down to be positioned in the processing space of the process tube (230), the substrate boat (225) may be brought into (or inserted into) or taken out (or withdrawn) into the processing space of the process tube (230) through the opening at the lower part of the process tube (230). At this time, the process tube (230) may be made of a single tube or may be made of multiple tubes consisting of an outer tube and an inner tube.
[0070] Here, a vacuum (VAC) can be formed in the loading chamber (220). Generally, the substrate transfer robot (210) is used in an atmosphere (ATM) state, and in an atmosphere (ATM) state, it may be necessary to physically grasp or adsorb the substrate (10) using pneumatic pressure or vacuum. However, in a vacuum (VAC) state, there is no external air pressure, so there is no external pressure difference acting on the substrate (10), and as a result, the external force that can move the substrate (10) is reduced. For this reason, even if the substrate (10) is supported (or grasped) with minimal contact to prevent damage to the lower surface of the substrate (10), the substrate (10) can be supported stably without slipping, and the substrate (10) can rotate stably with the rotating plate (122) without slipping. Here, forming a vacuum (VAC) in the loading chamber (220) may refer to a substrate processing device (200) for epitaxial growth or deposition, and a vacuum (VAC) may also be formed in the loading chamber (220) for loading the substrate (10) onto the substrate boat (225) so that a single crystal can grow well without foreign matter (material) being interposed.
[0071] Accordingly, the substrate processing device (200) according to the present invention can rotate the substrate (10) and reload it onto the substrate boat (225) by simply lifting the substrate (10) from the substrate boat (225) and lowering it using a substrate transfer robot (210) including an end effector (100) according to an embodiment of the present invention. Accordingly, the substrate (10) can be rotated and loaded without a separate rotation process (or process), and the process time can be shortened.
[0072]
[0073] FIG. 6 is a flowchart illustrating a substrate processing method according to another embodiment of the present invention.
[0074] Referring to FIG. 6, a substrate processing method according to another embodiment of the present invention will be examined in more detail. However, matters that overlap with the previously described parts regarding the end effector according to one embodiment of the present invention and the substrate processing device according to another embodiment of the present invention will be omitted.
[0075] A substrate processing method according to another embodiment of the present invention may include: a process (S100) of loading a substrate (10) onto a substrate boat (225) through a substrate transfer robot (210) having at least one end effector (100); a process (S200) of bringing the substrate boat (225) loaded with the substrate (10) into a process tube (230) and performing a first deposition; a process (S300) of removing the substrate boat (225) from the process tube (230); a process (S400) of lifting the substrate (10) loaded onto the substrate boat (225) through the end effector (100) and rotating it to reload it; and a process (S500) of bringing the substrate boat (225) loaded with the substrate (10) into the process tube (230) and performing a second deposition.
[0076] First, a substrate (10) is loaded onto a substrate boat (225) via a substrate transfer robot (210) having at least one end effector (100) (S100). A substrate (10) can be placed and loaded onto a substrate boat (225) via a substrate transfer robot (210) having at least one end effector (100) in a loading chamber (220), and a substrate (10) can be placed (or supported) on a support portion (225a) of the substrate boat (225), and a plurality of substrates (10) can be loaded onto the substrate boat (225) in multiple stages. Here, loading may mean placing a substrate (10) spaced apart from the support portion (225a) of the substrate boat (225) onto the support portion (225a) of the substrate boat (225) and loading it onto the substrate boat (225).
[0077] Next, the substrate boat (225) loaded with the substrate (10) is brought into the process tube (230) for primary deposition (S200). A substrate boat (225) loaded with (multiple) substrates (10) can be brought into the process tube (230) for primary deposition, and in the case of forming a thick film, deposition can be performed in multiple stages, and primary deposition can be performed on (multiple) substrates (10).
[0078] Next, the substrate boat (225) is removed from the process tube (230) (S300). In the case of forming a thick film, the deposition (or film formation) may be stopped at least once before the thickness of the film is reached where the substrate (10) is adhered to the substrate boat (225) by the formed film (or before a film of the desired thickness (or target thickness) is formed), and the substrate boat (225) may be removed from the process tube (230) to the loading chamber (220), and (multiple) substrates (10) may be removed from the substrate boat (225) and then loaded back into the substrate boat (225) to perform deposition (or film formation) again.
[0079] Then, the substrate (10) loaded on the substrate boat (225) is lifted and rotated to reload it through the end effector (100) (S400). In the loading chamber (220), the substrate (10) loaded on the substrate boat (225) can be lifted and rotated to reload it through the end effector (100), and the substrate (10) loaded on the substrate boat (225) can be lifted by the end effector (100) to detach (or separate) the substrate (10) from the substrate boat (225), and the substrate (10) can be rotated and (re)loaded onto the substrate boat (225) by (re)seating it on the support part (225a) of the substrate boat (225). Accordingly, when the substrate (10) is removed from the substrate boat (225), the broken (or detached) film can be prevented from being reattached as is. After removing the substrate (10) from the substrate boat (225), the substrate (10) is rotated to be (re)seated (or (re)loaded) onto the substrate boat (225), so that when the substrate (10) is (re)seated, the broken film does not fit in the same broken shape. Thus, it is possible to prevent the broken film from fitting in and being reattached as is when the substrate (10) is (re)seated. Here, reloading means separating the substrate (10) from the support portion (225a) of the substrate boat (225) and then (re)seating it onto the support portion (225a) of the substrate boat (225) to (re)load it onto the substrate boat (225). At this time, the reloading may include both a case where only a vertical movement is performed in which the substrate (10) is lifted vertically from the support part (225a) of the substrate boat (225) and lowered, and a case where a horizontal movement is also performed in which the substrate (10) is lifted from the support part (225a) of the substrate boat (225), moved in a horizontal direction, and then (re)seated on the support part (225a) of the substrate boat (225).
[0080] Next, the substrate boat (225) with the substrate (10) reloaded thereon is brought into the process tube (230) for secondary deposition (S500). To form a thick film up to a desired thickness (or target thickness), the substrate boat (225) with the substrate (10) (re)loaded and reloaded thereon can be brought into the process tube (230) for secondary deposition, and can be deposited on (multiple) substrates (10) secondarily, and the thickness of the film formed on the substrate (10) can be further increased. At this time, the remaining thickness can be fully deposited (or film formed) during the secondary deposition process (S500), or the film can be deposited (or film formed) up to the desired thickness by adding n-th depositions, such as a third deposition, thereafter.
[0081] FIG. 7 is a diagram showing a substrate processing method according to another embodiment of the present invention in sequence, where FIG. 7 (a) shows an end effector located at the bottom of the substrate, FIG. 7 (b) shows contact between the rotating lifting part and the substrate, FIG. 7 (c) shows compression of the elastic body by the load of the substrate, FIG. 7 (d) shows support of the substrate by the support part of the substrate boat, and FIG. 7 (e) shows return of the lifting rotating part due to separation from the substrate.
[0082] Referring to FIG. 7, the process of lifting and rotating the substrate (10) to reload it (S400) may include: a process of raising the end effector (100) from the bottom of the substrate (10) (S410); a process of the substrate (10) coming into contact with the lifting rotation part (120) of the end effector (100) (S420); a process of rotating the substrate (10) by providing rotational force to the substrate (10) as the height of the lifting rotation part (120) is lowered by the load of the substrate (10) (S430); a process of lowering the end effector (100) that supports the substrate (10) (S440); a process of the substrate (10) coming into contact with and being supported by the support part (225a) of the substrate boat (225) (S450); and a process of the lifting rotation part (120) returning to its original position while being separated from the substrate (10) (S460).
[0083] The end effector (100) can be raised from the bottom of the substrate (10) (S410). The end effector (100) can be raised from the bottom of the substrate (10) by providing the end effector (100) to the bottom of the substrate (10), and accordingly, the end effector (100) can come into contact with the bottom surface of the substrate (10), and the substrate (10) can be supported by the end effector (100).
[0084] Then, the substrate (10) may come into contact with the lifting and rotating part (120) of the end effector (100) (S420). As the end effector (100) rises, the lower surface of the substrate (10) may come into contact with the lifting and rotating part (120) of the end effector (100), and as the end effector (100) continues to rise, the substrate (10) may be supported by the end effector (100) and separated from the support part (225a) of the substrate boat (225).
[0085] Next, the height of the lifting rotation part (120) is lowered by the load of the substrate (10), and rotational force is provided to the substrate (10) to rotate the substrate (10) (S430). When the substrate (10) is supported by the lifting rotation part (120) of the end effector (100) and separated from the support part (225a) of the substrate boat (225), the height of the lifting rotation part (120) can be lowered by the load of the substrate (10), and at least a part of the lifting rotation part (120) (i.e., the rotation plate of the lifting rotation part) can rotate to provide rotational force to the substrate (10), and the substrate (10) can be rotated while being supported.
[0086] Next, the end effector (100) supporting the substrate (10) can be lowered (S440). After the substrate (10) is rotated, the end effector (100) supporting the substrate (10) can be lowered, and accordingly, the lower surface of the substrate (10) can come into contact with the support portion (225a) of the substrate boat (225), and the substrate (10) can be supported on the support portion (225a) of the substrate boat (225).
[0087] And the substrate (10) can be supported by contacting the support portion (225a) of the substrate boat (225) (S450). When the end effector (100) descends, the substrate (10) can be supported (or seated) by contacting the support portion (225a) of the substrate boat (225), and the load of the substrate (10) applied to the lifting rotation portion (120) can be removed (or eliminated) as the substrate (10) is seated (or supported) on the support portion (225a) of the substrate boat (225).
[0088] Next, the lifting and rotating part (120) can return to its original position while being separated from the substrate (10) (S460). As the lifting and rotating part (120) can return to its original position while being separated from the substrate (10), and as the end effector (100) continues to descend, the end effector (100) can be separated from the substrate (10) supported by the support part (225a) of the substrate boat (225), and as the end effector (100) descends, the load of the substrate (10) applied to the lifting and rotating part (120) can be (gradually) removed. And as the load on the substrate (10) is gradually removed, the lifting rotation part (120) can be returned to its original position (or restored to its original state), and after the lifting rotation part (120) is completely restored (or returned), the lifting rotation part (120) can be separated from the substrate (10) by the (continuous) lowering of the end effector (100), thereby allowing the substrate (10) to be rotated and reloaded onto the substrate boat (225).
[0089] The process of rotating the above substrate (10) (S430) may include a process (S431) in which the elastic body (121) of the lifting rotating part (120) is compressed by the load of the substrate (10); and a process (S432) in which the rotating plate (122) of the lifting rotating part (120) supported by the elastic body (121) rotates while descending due to the compression of the elastic body (121).
[0090] The elastic body (121) of the lifting rotation part (120) can be compressed by the load of the substrate (10) (S431). The lifting rotation part (120) may include an elastic body (121), and the elastic body (121) of the lifting rotation part (120) can be compressed by the load of the substrate (10), and the rotating plate (122) of the lifting rotation part (120) can be lowered.
[0091] And the rotating plate (122) of the lifting rotating part (120) supported by the elastic body (121) can rotate while descending due to the compression of the elastic body (121) (S432). The lifting rotating part (120) may further include a rotating plate (122), and the rotating plate (122) of the lifting rotating part (120) can support the substrate (10) and can descend according to the compression of the elastic body (121) by being supported by the elastic body (121). At this time, the rotating plate (122) can rotate while descending due to the compression of the elastic body (121), and accordingly, can provide rotational force to the substrate (10) supported by the rotating plate (122) and can rotate the substrate (10).
[0092] Here, in the process (S432) where the rotating plate (122) rotates while descending due to the compression of the elastic body (121), the edge portion of the rotating plate (122) is coupled to the spiral groove (111a) formed on the inner wall of the concave portion (111) of the base board (110) where the elastic body (121) is supported, so that the rotating plate (122) can rotate while descending. The edge portion of the rotating plate (122) is coupled to the spiral groove (111a) formed on the inner wall of the concave portion (111) of the base board (110) where the elastic body (121) is supported, so that the rotating plate (122) can rotate while descending, and the rotating plate (122) can rotate on its own and rotate the supported (or contacted) substrate (10). For example, as the rotating plate (122) descends due to the compression of the elastic body (121), the edge portion (i.e., wing portion) of the rotating plate (122) may move down along the spiral groove (111a), and the rotating plate (122) may rotate (or rotate), and the substrate (10) supported on the rotating plate (122) may rotate together with the rotating plate (122).
[0093] Accordingly, the substrate processing method according to the present invention can form a thick film while lifting the substrate (10) in the middle of the film formation to detach the film from the substrate boat (225), thereby preventing adhesion between the substrate (10) and the substrate boat (225) by the film and forming a thick film without damage caused by adhesion between the substrate (10) and the substrate boat (225). In addition, by using an end effector (100) according to an embodiment of the present invention to lift the substrate (10) and then lower it onto the support portion (225a) of the substrate boat (225), the substrate (10) can be rotated and reloaded onto the substrate boat (225). Accordingly, as the substrate (10) is supported (or seated) on the support portion (225a) of the substrate boat (225), the film that had detached from the support portion (225a) of the substrate boat (225) can be prevented from reattaching as is, and the adhesion between the substrate (10) and the substrate boat (225) caused by the formed film can be effectively prevented while forming a thick film. Furthermore, since the substrate (10) can be rotated and reloaded onto the substrate boat (225) simply by lifting and lowering the substrate (10) from the substrate boat (225), the substrate (10) can be rotated and loaded without a separate rotation process (or process), and the process time can be shortened.
[0094]
[0095] As such, in the present invention, a substrate can be supported and rotated through the lifting and rotating part of the end effector. The elastic body of the lifting and rotating part is compressed by the load of the substrate, causing the rotating plate supported by the elastic body to descend and rotate, and the substrate supported by the rotating plate can rotate together. Accordingly, the substrate can be rotated simply by supporting it on the end effector without the need for a separate power source such as a motor. When a substrate transfer robot including such an end effector is used in a substrate processing device, the substrate can be rotated and reloaded onto the substrate boat simply by lifting and lowering the substrate from the substrate boat. Consequently, the substrate can be rotated and loaded without a separate rotation process, thereby shortening the process time. Meanwhile, while forming a thick film, the substrate can be lifted in the middle of film deposition to detach the film from the substrate boat. This prevents adhesion between the substrate and the substrate boat by the film, and allows for the formation of a thick film without damage caused by adhesion between the substrate and the substrate boat. In addition, by using an end effector including a lifting and rotating part to lift the substrate and lower it onto the support of the substrate boat, the substrate can be rotated and reloaded onto the substrate boat. Accordingly, while the substrate is supported on the support of the substrate boat, the film that had detached from the support of the substrate boat can be prevented from reattaching, and the adhesion between the substrate and the substrate boat caused by the formed film can be effectively prevented while forming a thick film.
[0096]
[0097] Although preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the embodiments described above, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible without departing from the gist of the present invention as claimed in the claims. Accordingly, the technical scope of protection of the present invention should be determined by the following claims.
Claims
1. A base board extending in one direction; and A lifting rotating part provided in the central part of the base board and providing rotational force as its height changes according to pressure; comprising The above lifting rotating part is, An elastic body supported on the base board and compressible by the pressure; and An end effector comprising a rotating plate that supports a substrate and is supported by the elastic body and is rotatable while descending according to the compression of the elastic body.
2. In Claim 1, The above base board includes a concave portion in the central part, and The above elastic body is supported on the bottom surface of the above concave portion, and The above-mentioned rotating plate is an end effector that protrudes from the upper surface of the base board in the above-mentioned concave portion.
3. In Claim 2, The above-mentioned concave portion includes a spiral groove on the inner wall, and The above-mentioned rotating plate is an end effector in which the edge portion is coupled to the above-mentioned spiral groove.
4. In Claim 3, The above-mentioned rotating plate is, A cap portion covering the upper part of the above elastic body; and An end effector comprising a wing portion that protrudes outward from the cap portion and is coupled to the spiral groove.
5. In Claim 4, The above wing portions are symmetrical to each other and protrude to both sides as end effectors.
6. In Claim 1, The above elastic body is compressed by the load of the substrate supported on the rotating plate, and The above-mentioned rotating plate is an end effector that rotates while descending due to the compression of the elastic body while supporting the substrate.
7. In Claim 6, The above base board is an end effector comprising a guide side wall portion having a guide surface facing the center portion provided at the edge portion.
8. In Claim 7, The guide surface of the above guide sidewall portion is an end effector including an inclined surface or a curved surface.
9. In Claim 1, The above lifting rotating part further includes a coating part provided between the rotating plate and the elastic body to reduce friction when the rotating plate rotates.
10. A substrate transfer robot comprising an end effector of any one of claims 1 to 9; A loading chamber providing a loading space for loading the substrate onto a substrate boat via the substrate transfer robot; and A substrate processing apparatus comprising: a process tube provided at the top of the loading chamber and having a processing space in which the substrate boat is received and the substrate is processed.
11. In Claim 10, The above loading chamber is a substrate processing device in which a vacuum is formed.
12. A process of loading a substrate onto a substrate boat using a substrate transfer robot having at least one end effector; A process of introducing the substrate boat loaded with the above substrate into a process tube and performing a first deposition; The process of removing the above substrate boat from the above process tube; A process of lifting the substrate loaded on the substrate boat through the end effector and rotating it to reload it; and A substrate processing method comprising the process of introducing the substrate boat, on which the substrate is reloaded, into the process tube and performing a second deposition.
13. In Claim 12, The process of lifting the above substrate and rotating it to reload it is, A process of raising the end effector from the lower part of the above substrate; A process in which the substrate contacts the lifting and rotating part of the above end effector; A process of rotating the substrate by providing rotational force to the substrate as the height of the lifting rotating part is lowered by the load of the substrate; A process of lowering the end effector supporting the above substrate; The process of the above substrate being supported by contacting the support portion of the substrate boat; and A substrate processing method comprising the process of the lifting and rotating part being separated from the substrate and returning to its original position.
14. In Claim 13, The process of rotating the above substrate is, The process of the elastic body of the above lifting rotating part being compressed by the load of the substrate; and A substrate processing method comprising the process in which a rotating plate of the lifting rotating part supported by the elastic body rotates while descending due to compression by the elastic body.
15. In Claim 14, A substrate processing method in which, during the process in which the above-mentioned rotating plate descends and rotates due to the compression of the above-mentioned elastic body, the edge portion of the rotating plate is coupled to a spiral groove formed in the inner wall of a concave portion of a base board supported by the above-mentioned elastic body, and the rotating plate rotates while descending.
Citation Information
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