Water-cooling system

Abstract

A high-performance processing card to which a water-cooling system for the high-performance processing card is applied, according to one embodiment of the present invention, comprises: a processor mounted on a printed circuit board; a radiator assembly including a plurality of heat dissipation path plates aligned to be spaced apart in the width direction; a heat exchange assembly which is positioned below the radiator assembly and which includes a heat absorption path plate fluidly connected to both ends of the plurality of heat dissipation path plates; and a pump which is positioned below the radiator assembly, and which is fluidly connected to the heat absorption path plate so as to circulate cooling water between the plurality of heat dissipation path plates and the heat absorption path plate, wherein the heat, absorbed by the heat absorption path plate, of the processor positioned below the heat exchange assembly is dissipated by the plurality of heat dissipation path plates.

Description

Water-cooled cooling system

[0001] The present invention relates to a water-cooled cooling system, and more specifically, to a water-cooled cooling system for a high-performance processing card in which a high-performance processor is mounted.

[0002] Artificial intelligence (AI) is driving innovative changes across various industries, including education, healthcare, robotics, and logistics, and the emergence of Generative AI, in particular, is dramatically changing human life. For example, conversational AI services such as ChatGPT perform complex tasks such as natural language processing, image recognition, and pattern learning, and this performance is based on advanced neural network models.

[0003]

[0004] Generative AI models must learn and compute massive amounts of data based on millions to trillions of parameters, making advanced AI semiconductors essential for processing this. Graphics Processing Units (GPUs) possess superior parallel processing capabilities, making them suitable for simultaneously handling large-scale data; they have established themselves as indispensable devices, particularly for training AI models. Recently, AI semiconductor technology has been maximizing performance by utilizing innovative memory technologies such as High Bandwidth Memory (HBM). HBM provides high bandwidth by stacking DRAM vertically, playing a crucial role in high-performance computing. Furthermore, with the advancement of System-on-a-Chip (SoC) technology, which integrates GPUs and memory into a single chip, computational performance is significantly improving through high bandwidth and low latency.

[0005] Water-cooled and air-cooled cooling systems are suitable options for efficiently cooling these high-performance processors. Water-cooled systems are an effective method for addressing the heat generation issues in high-performance semiconductors and processors, offering several advantages over air-cooled systems. The most significant advantage is high cooling efficiency. Because water-cooling utilizes water for heat conduction, it can remove heat much faster and more effectively than air-cooling, which transfers heat through air. This allows for the effective management of heat generated by devices such as high-performance processors or GPUs, preventing performance degradation and enabling stable operation. Furthermore, water-cooling provides a quiet operating environment because, unlike the high-speed rotating fans of air-cooling systems, the pumps and radiators that circulate the water operate with relatively low noise.

[0006] However, there are practical difficulties in installing liquid cooling systems for multiple high-performance processing cards of the same standard (e.g., PCI) in environments such as data centers. Liquid cooling systems are complex to install, making them difficult to implement in environments where high-performance processing cards are densely packed. Additionally, liquid cooling systems require additional space for radiators, pumps, and tubes, making them unsuitable for environments with limited space. Complex maintenance is another issue, and managing them becomes more difficult when liquid cooling is installed on a large number of cards. The risk of leaks is also dangerous, as it can cause significant damage to equipment within the data center. Finally, liquid cooling systems are more expensive than air cooling, making them uneconomical to apply to large-scale graphics card systems.

[0007] The present invention aims to solve the problems associated with applying a water-cooling structure to multiple high-performance processing cards in environments such as data centers. Specifically, the goal is to resolve the disadvantages of water-cooling systems, such as installation complexity, space constraints, maintenance difficulties, leakage risks, and high costs. Through this, the invention aims to provide a water-cooling system that enables the implementation of an efficient and safe water-cooling system even in data centers.

[0008] The problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned problems will be clearly understood by a person skilled in the art from the description below.

[0009] A high-performance processing card to which a water-cooled cooling system for a high-performance processing card according to one embodiment of the present invention is applied comprises: a processor mounted on a printed circuit board; a radiator assembly including a plurality of heat dissipation channel plates spaced apart in the width direction and arranged; a heat exchange assembly including a heat absorption channel plate located below the radiator assembly and fluidly connected to both ends of the plurality of heat dissipation channel plates; and a pump located below the radiator assembly and fluidly connected to the heat absorption channel plate to circulate cooling water between the plurality of heat dissipation channel plates and the heat absorption channel plate, and may be configured such that heat from the processor located below the heat exchange assembly, which has absorbed heat from the heat absorption channel plate, is dissipated from the plurality of heat dissipation channel plates. Other embodiments and other specific details of the present invention are included in the detailed description and drawings.

[0010] A water-cooled cooling system for a high-performance processor according to an embodiment of the present invention can provide a high-efficiency water-cooled cooling system by utilizing a heat absorption channel plate and a plurality of heat dissipation channel plates manufactured as thin plates, while maintaining the structure of a conventional air-cooled cooling system, by flowing a refrigerant within the heat absorption channel plate and the heat dissipation channel plate.

[0011] In addition, according to one embodiment of the present invention, a water-cooled cooling system can be provided that allows a high-performance processor requiring more than 300W of power consumption to operate without performance degradation in a data center equipped with an air conditioning system, even if a plurality of fans for heat dissipation are not directly attached.

[0012] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by a person skilled in the art from the description below.

[0013] Various aspects are described with reference to the drawings, wherein similar reference numbers are used to collectively refer to similar components. In the following embodiments, for illustrative purposes, a number of specific details are presented to provide a comprehensive understanding of one or more aspects. However, it will be apparent that such aspect(s) may be practiced without these specific details.

[0014] FIG. 1 is a perspective view of a high-performance processing card to which a water-cooled cooling system according to one embodiment of the present invention is applied.

[0015] FIG. 2 is a plan view of a high-performance processing card to which a water-cooled cooling system according to one embodiment of the present invention is applied.

[0016] FIG. 3 is an exploded view of a high-performance processing card with a water-cooled cooling system applied according to one embodiment of the present invention.

[0017] FIG. 4 is a perspective view of a printed circuit board of a high-performance processing card to which a cooling system according to one embodiment of the present invention is applied.

[0018] FIG. 5 is an exploded perspective view of a heat exchange assembly of a water-cooled cooling system according to one embodiment of the present invention.

[0019] FIG. 6 is an exploded perspective view of a radiator assembly of a water-cooled cooling system according to one embodiment of the present invention.

[0020] FIG. 7 is a cross-sectional view showing a high-performance processing card with a cooling system according to one embodiment of the present invention shown in FIG. 2, cut along A-A'.

[0021] FIG. 8 is a perspective view of an endothermic flow path plate of a water-cooled cooling system according to one embodiment of the present invention.

[0022] FIG. 9 is an assembly diagram of a heat-absorbing channel plate of a water-cooled cooling system according to one embodiment of the present invention.

[0023] FIG. 10 is a flowchart of the manufacturing process of an endothermic flow path plate of a water-cooled cooling system according to one embodiment of the present invention.

[0024] FIG. 11 is a magnified partial view of a portion of the heat-absorbing channel plate of a water-cooled cooling system according to one embodiment of the present invention shown in FIG. 10.

[0025] FIG. 12 is an assembly diagram of a heat dissipation channel plate of a water-cooled cooling system according to one embodiment of the present invention.

[0026] FIG. 13 is a flowchart of the manufacturing process and a partial enlarged view of a heat dissipation channel plate of a water-cooled cooling system according to one embodiment of the present invention.

[0027] FIG. 14 is a cross-sectional view of a radiator assembly of a water-cooled cooling system according to one embodiment of the present invention.

[0028] FIG. 15 is a plan view and a cross-sectional view of a water jacket frame of a radiator assembly of a cooling system according to one embodiment of the present invention.

[0029] FIG. 16 is a perspective view of a high-performance processing card to which a cooling system according to another embodiment of the present invention is applied.

[0030] FIG. 17 is an exploded perspective view of a radiator assembly of a high-performance processing card to which a cooling system according to another embodiment of the present invention is applied.

[0031] FIG. 18 illustrates a portion of a heat dissipation plate of a high-performance processing card to which a cooling system according to another embodiment of the present invention is applied.

[0032] One embodiment and / or aspect is now disclosed with reference to the drawings. For illustrative purposes, many specific details are disclosed in the following description to aid in a general understanding of one or more aspects. However, it will also be apparent to those skilled in the art that these aspect(s) can be practiced without these specific details. The following description and the accompanying drawings describe specific exemplary aspects of one or more aspects in detail. However, these aspects are exemplary, and some of the various methods in the principles of the various aspects may be used, and the description is intended to include all such aspects and their equivalents. Specifically, as used herein, terms such as “embodiment,” “example,” “aspect,” “example,” etc., may not be interpreted as implying that any described aspect or design is superior or advantageous to other aspects or designs.

[0033] Hereinafter, identical or similar components are assigned the same reference numeral regardless of drawing symbols, and redundant descriptions thereof are omitted. Furthermore, in describing the embodiments disclosed in this specification, detailed descriptions of related prior art are omitted if it is determined that such detailed descriptions may obscure the essence of the embodiments disclosed in this specification. Additionally, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings.

[0034] Although terms such as first, second, etc. are used to describe various elements or components, it goes without saying that these elements or components are not limited by these terms. These terms are used merely to distinguish one element or component from another. Therefore, it goes without saying that the first element or component mentioned below may be the second element or component within the technical scope of the present invention.

[0035] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in a meaning commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise.

[0036] Furthermore, the term "or" is intended to mean an implicit "or" rather than an exclusive "or." That is, unless otherwise specified or evident from the context, "X uses A or B" is intended to mean one of the natural implicit substitutions. In other words, if X uses A; if X uses B; or if X uses both A and B, "X uses A or B" may apply to any of these cases. Additionally, the term "and / or" as used herein should be understood to refer to and include all possible combinations of one or more of the enumerated related items.

[0037] Additionally, the terms “comprising” and / or “comprising” should be understood to mean that such features and / or components are present, but not to exclude the presence or addition of one or more other features, components, and / or groups thereof. Furthermore, unless otherwise specified or clearly evident from the context to indicate a singular form, the singular in this specification and claims should generally be interpreted to mean “one or more.”

[0038] When it is stated that one component is “connected” or “connected” to another component, it should be understood that it may be directly connected or connected to that other component, or that there may be other components in between. On the other hand, when it is stated that one component is “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between.

[0039] When elements or layers are referred to as being "on" or "on" another element or layer, it includes not only being directly on top of the other element or layer but also cases where another layer or element is interposed in between. On the other hand, when a component is referred to as being "directly on" or "immediately on," it indicates that no other element or layer is interposed in between.

[0040] Spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used to easily describe the relationship between one component or other components as illustrated in the drawings. Spatially relative terms should be understood as encompassing different orientations of the element during use or operation, in addition to the directions illustrated in the drawings.

[0041] The objectives and effects of the present invention, and the technical configurations for achieving them, will become clear by referring to the embodiments described in detail below in conjunction with the accompanying drawings. In describing the present invention, if it is determined that a detailed description of known functions or configurations may unnecessarily obscure the essence of the invention, such detailed description will be omitted. Furthermore, the terms described below are defined considering their functions in the present invention, and these may vary depending on the intentions or conventions of the user or operator.

[0042] However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to make the present invention complete and to fully inform those skilled in the art of the scope of the disclosure, and the present invention is defined only by the scope of the claims. Therefore, such definition should be based on the content throughout this specification.

[0043] FIG. 1 is a perspective view of a high-performance processing card with a water-cooled cooling system applied according to an embodiment of the present invention. FIG. 2 is a plan view of a high-performance processing card with a water-cooled cooling system applied according to an embodiment of the present invention. FIG. 3 is an exploded perspective view of a high-performance processing card with a water-cooled cooling system applied according to an embodiment of the present invention. FIG. 4 is a perspective view of a printed circuit board of a high-performance processing card with a cooling system applied according to an embodiment of the present invention.

[0044] First, referring to FIG. 1, a high-performance processing card (100) according to one embodiment of the present invention may conform to the PCIe standard. Here, PCIe or PCI Express (Peripheral Component Interconnect Express) refers to a standard interface used to connect various devices of a computer.

[0045] Cards based on PCIe standards are generally classified by form factor, which is a term describing the size and layout of a card. Cards of various sizes exist according to standard specifications, and PCIe card form factors include, for example, Full-Height, Full-Length (FHFL), Full-Height, Half-Length (FHHL), Low-Profile, and Half-Length (LP or LPHL).

[0046] Specifically, Full-Height, Full-Length (FHFL) refers to the largest PCIe card size and can be used in the high-performance processing card (100) of the present invention, which generally requires a lot of space and power.

[0047] The term "FHFL" stands for "Full Height, Full Length." This term is a standard indicating the physical dimensions of a PCIe card and refers to the card's height and length.

[0048] "Full Height" generally refers to a card with a height of about 120 mm. Conversely, the height of a "Low Profile" card is about 80 mm.

[0049] "Full Length" refers to the length of the card, and generally refers to a card with a length of about 312 mm.

[0050] In addition, the width of a card according to the PCIe standard can generally be referred to by a unit called a 'slot'. Basically, PCIe cards can be classified into '1 slot', '2 slots', '3 slots', etc., depending on their width. Since the width of a single slot is approximately 20 mm, for example, a '2 slot' card has a width of approximately 40 mm, and a '3 slot' card can have a width of approximately 60 mm.

[0051] A water-cooled cooling system for a high-performance processor according to the present disclosure can be designed to provide optimal cooling efficiency for a high-performance processing card (100) having a size of FHFL and 2 slots or more in the PCIe standard.

[0052] Referring to FIGS. 1 to 4, according to one embodiment of the present invention, a high-performance processing card (100) has a mounting bracket (101) and a printed circuit board (102), and may include a processor (110), a heat exchange assembly (120), and a radiator assembly (130).

[0053] A printed circuit board (102) (PCB), on which a processor (110), a heat exchange assembly (120), and a radiator assembly (130) are mounted, can be fixed to a mounting bracket (101). A processor (110) responsible for computational operations as a core component of a high-performance processing card (100) can be mounted on the printed circuit board (102). For example, the processor (110) may be a System on Chip (SoC) processor with built-in High Bandwidth Memory (HBM).

[0054] Various electronic components such as memory, a VRM (Voltage Regulator Module) as a power circuit, a connector and / or PCIe controller, a BIOS / UEFI chip, and an auxiliary chipset such as an I / O controller may be further mounted on the printed circuit board (102).

[0055] According to one embodiment, the mounting bracket (101) may further include a reinforcing plate for physically relocating the high-performance processing card (100) and / or the hardware included therein, or for more efficient space utilization.

[0056] The processor (110) can be mounted on a printed circuit board (102). In one embodiment, the processor (110) may have dimensions of approximately 30 mm × 30 mm. In another embodiment, the processor (110) may have dimensions of a rectangular shape with a width of approximately 26 mm to 34 mm on one side, or a square shape with a similar width.

[0057] The heat exchange assembly (120) can be positioned above the processor (110) in the assembled high-performance processing card (100) and can function to effectively dissipate heat by transferring the heat generated by the processor (110) to the radiator assembly (130).

[0058] The radiator assembly (130) can dissipate and / or disperse heat transferred through the heat exchange assembly (120) into the air.

[0059] The radiator assembly (130) may have a structure in which a plurality of thin heat dissipation channel plates (300) are stacked. The direction in which the heat dissipation channel plates (300) are stacked may be perpendicular to the airflow passing through the radiator assembly (130). In one embodiment, the radiator assembly (130) may allow air to pass in a direction toward the mounting bracket (101) from the other end opposite to the end where the mounting bracket (101) is located. In other words, a high-performance processing card (100) to which a water-cooled cooling system according to one embodiment of the present invention is applied may be used in an environment where air flows in a direction toward the mounting bracket (101) (or in the -y-axis direction) from the other end opposite to the end where the mounting bracket (101) is located. In another embodiment, the radiator assembly (130) may dissipate heat by the airflow along the height direction of the high-performance processing card (100).

[0060] The processor (110), heat exchange assembly (120), radiator assembly (130), pump (140) and / or printed circuit board (102) can be secured within a rack or server case in a data center via a mounting bracket (101).

[0061] FIG. 5 is an exploded perspective view of a heat exchange assembly of a water-cooled cooling system according to one embodiment of the present invention.

[0062] Referring to FIG. 5, a heat exchange assembly (120) according to one embodiment of the present invention may include an endothermic flow path plate (200), a heat transfer block (210), and an upper bracket (220).

[0063] In one embodiment, a heat transfer block (210) may be disposed at the bottom and an upper bracket (220) may be disposed at the top, based on the heat-absorbing channel plate (200). The heat-absorbing channel plate (200) may be interposed between the heat transfer block (210) and the upper bracket (220).

[0064] The heat transfer block (210) can be manufactured from a material with high thermal conductivity. For example, the heat transfer block (210) can be made of copper (Cu). An endothermic flow path plate (200) can come into contact with the plate contact portion (211), which is the upper surface of the heat transfer block (210). The micro-flow path portion of the endothermic flow path plate (200) can come into contact with the plate contact portion (211).

[0065] Referring to FIG. 3, the heat bonding portion (213), which is the lower surface of the heat transfer block (210), can come into contact with the processor (110). The heat transfer block (210) can transfer heat from the processor (110) to the heat absorption channel plate (200). The heat bonding portion (213) may be a thermally conductive adhesive or a thermally conductive grease.

[0066] The heat absorption channel plate (200) may include a plurality of microchannels through which a refrigerant can flow. Both ends of the heat absorption channel plate (200) may be fluidically connected to both ends of the heat dissipation channel plate (300) of the radiator assembly (130). The heat generated by the processor (110) may be absorbed by the refrigerant passing through the heat absorption channel plate (200) and then dissipated while passing through the heat dissipation channel plate (300).

[0067] Referring again to FIG. 5, the heat transfer block (210) may include a plurality of block fixing parts (212) for fixing the heat transfer block (210) to the printed circuit board (102). The heat transfer block (210) can be fixed to the printed circuit board (102) by fastening a connecting means, such as a bolt or a screw, to the block fixing parts (212).

[0068] The heat-absorbing channel plate (200), the heat transfer block (210), and the upper bracket (220) can be fixed by connecting means (221), such as bolts or screws. The heat-absorbing channel plate (200) may include a fixing hole (201) through which the connecting means (221) can pass.

[0069] After the heat transfer block (210), the heat absorption channel plate (200), and the upper bracket (220) are stacked sequentially, the members can be fixed through a connecting means (221).

[0070] A radiator assembly (130) may be positioned on a heat exchange assembly (120) according to embodiments of the present invention, and the radiator assembly (130) may be placed on the upper bracket (220). A plurality of connecting means (222) may be used to fix the radiator assembly (130) on the upper bracket (220). The upper bracket (220) may include a plurality of fixing holes for the connecting means (222).

[0071] FIG. 6 is an exploded perspective view of a radiator assembly of a water-cooled cooling system according to one embodiment of the present invention.

[0072] Referring to FIG. 6, the radiator assembly (130) may include a heat dissipation channel plate (300), a main frame (310), a side wall (330), and a water jacket (340).

[0073] A radiator assembly (130) may have a plurality of heat dissipation channel plates (300) disposed on a main frame (310). The main frame (310) may have a shape having side frames formed by bending both sides in the width direction so that the top is open and both ends in the length direction are open.

[0074] The heat dissipation channel plates (300) can be arranged spaced apart in the width direction within the internal space of the main frame (310). Air flows through the space between the plurality of heat dissipation channel plates (300), so that the heat of the refrigerant passing through the heat dissipation channel plates (300) can be dissipated.

[0075] Both ends of the heat dissipation channel plate (300) can be fluidly connected to a water jacket (340). The water jacket (340) may include a chamber in which a refrigerant can be stored.

[0076] In one embodiment, the fluid connection between the water jacket (340) and the heat dissipation channel plate (300) may be made through a water jacket frame (320). The water jacket frame (320) may close the chamber of the water jacket (340). The water jacket frame (320) may also be referred to as a water jacket cover or a water jacket cap. The water jacket frame (320) may be fixed and / or sealed with epoxy while closing the water jacket (340).

[0077] The water jacket frame (320) may include a plurality of slots into which each of a plurality of heat dissipation channel plates (300) can be inserted. After the heat dissipation channel plates (300) are inserted into the slots of the water jacket frame (320), they can be sealed through soldering, brazing, or laser welding.

[0078] In one embodiment, the water jacket (340) may include a Euro port (341) and a refrigerant supply port (342).

[0079] The flow port (341) of the water jacket (340) can be connected to the heat-absorbing flow plate (200) or the pump (140). Referring to FIG. 3, a heat exchange assembly (120) and a pump (140) can be positioned between a pair of water jackets (340) located at both ends of the radiator assembly (130). The flow port (341) of the water jacket (340) on one side can be fluidically connected to one end of the heat-absorbing flow plate (200). The other end of the heat-absorbing flow plate (200) can be connected to the pump (140) through the pump flow (141), and the flow port (341) of the water jacket (340) on the opposite side can be connected to the pump (140) through the pump flow (141).

[0080] The refrigerant supply port (342) can be opened or closed through the port cap (343). In the present invention, the refrigerant in the water jacket (340) can be replenished or removed through the refrigerant supply port (342).

[0081] FIG. 7 is a cross-sectional view showing a high-performance processing card with a cooling system according to one embodiment of the present invention shown in FIG. 2 applied, cut along A-A'.

[0082] Referring to FIG. 7, according to an embodiment of the present invention, both ends of the heat absorption channel plate (200) and the heat dissipation channel plate (300) can be fluidly connected through a water jacket (340). A pump (140) can be disposed between the heat absorption channel plate (200) and one water jacket (340). The pump (140) can function to allow a refrigerant to flow in one direction between the heat absorption channel plate (200) and the heat dissipation channel plate (300).

[0083] A heat transfer block (210) is positioned below the heat absorption channel plate (200) and an upper bracket (220) is positioned above it, and a heat dissipation channel plate (300) of a radiator assembly (130) can be positioned above the upper bracket (220).

[0084] In one embodiment, a heat transfer block (210) may be interposed between the heat-absorbing channel plate (200) and the processor (110), and the heat transfer block (210) may be made of a material with high thermal conductivity so that heat from the processor (110) can be transferred to a refrigerant passing through the heat-absorbing channel plate (200). In another embodiment, the heat-absorbing channel plate (200) may be fixed by directly contacting the processor (110) through a thermally conductive adhesive.

[0085] A high-performance processing card (100) according to one embodiment of the present invention may include a printed circuit board (102) on which a processor (110) is mounted, a radiator assembly (130) comprising a plurality of heat dissipation passage plates (300) arranged spaced apart in the width direction, a heat exchange assembly (120) comprising a heat absorption passage plate (200) located below the radiator assembly (130) and fluidly connected to both ends of the plurality of heat dissipation passage plates (300), and a pump (140) located below the radiator assembly (130) and fluidly connected to the heat absorption passage plate (200) to circulate cooling water between the plurality of heat dissipation passage plates (300) and the heat absorption passage plate (200). The heat of the processor (110) located at the bottom of the heat exchange assembly (120), which is absorbed by the heat absorption channel plate (200), can be configured to be dissipated through the plurality of heat dissipation channel plates (300).

[0086] In addition, according to one embodiment of the present invention, the radiator assembly (130) includes a pair of water jackets (340) each connected to both ends of the plurality of heat dissipation channels (300), and the heat absorption channels (200) and the pump (140) can be fluidly connected through channels (341) each included in the pair of water jackets (340).

[0087] According to one embodiment of the present invention, the water jacket (340) further includes a chamber in which coolant is stored, wherein the chamber is covered by a water jacket frame (320), and the water jacket frame (320) may include a plurality of slots into which the ends of the plurality of heat dissipation channels (300) are each inserted.

[0088] Meanwhile, a high-performance processing card (100) according to one embodiment of the present disclosure can be inserted vertically into a rack in a data center in which racks (or towers) are arranged in rows in a large space.

[0089] A data center can secure high processing and computing power by integrating hundreds of high-performance processors through a structure in which numerous racks are arranged. Since high-performance processing cards (100) generate a large amount of heat, it is important to properly manage their temperature. To this end, the data center can manage the overall temperature through a powerful air conditioning system. For example, the air conditioning system of a data center can usually operate with a large Air Handling Unit (AHU). Air regulated by the air handling unit flows into the space between each rack of the data center and between multiple heat dissipation channels (300), thereby lowering the temperature of the processor (110) mounted on the high-performance processing card (100).

[0090] FIG. 8 is a perspective view of an endothermic flow path plate of a water-cooled cooling system according to an embodiment of the present invention. FIG. 9 is an assembly diagram of an endothermic flow path plate of a water-cooled cooling system according to an embodiment of the present invention. FIG. 10 is a flowchart of the manufacturing sequence of an endothermic flow path plate of a water-cooled cooling system according to an embodiment of the present invention. FIG. 11 is a magnified partial view of a portion of the endothermic flow path plate of a water-cooled cooling system according to an embodiment of the present invention shown in FIG. 10.

[0091] Referring to FIGS. 8 to 10, the heat-absorbing passage plate (200) may be formed by joining two heat-absorbing passage half plates (230) together. The heat-absorbing passage half plate (230) may include a branching passage pattern (231), a micro passage pattern (232), an inflow / outflow passage pattern (233), and a dummy passage (234). The branching passage pattern (231), the micro passage pattern (232), and the inflow / outflow passage pattern (233) may be grooves formed in the plate. Hereinafter, the branching / integrating passage (231), the micro passage (232), and the inflow / outflow passage (233) as passages of the heat-absorbing passage plate (200) may be referred to by the same reference numerals as the branching / integrating passage pattern (231), the micro passage pattern (232), and the inflow / outflow passage pattern (233) formed in the heat-absorbing passage half plate (230).

[0092] Referring to FIG. 19, a dummy channel (234) may be formed in the heat-absorbing half-plate (230) to separate the area where the channel is formed from the attachment area (235). In one embodiment, the dummy channel (234) may be formed on the outer edge to surround the branch / integration channel pattern (231), the micro-channel pattern (232), and the entry / exit channel pattern (233).

[0093] In one embodiment, the attachment area (235) may be formed on the edge portion of the heat-absorbing flow path half plate (230), and in another embodiment, the attachment area (235) may be formed at least partially in the middle of the branch / integration flow path pattern (231). The attachment area (235) formed in the middle of the branch / integration flow path pattern (231) may also be surrounded by a dummy flow path (234).

[0094] Referring again to FIG. 10, when two heat-absorbing half-plates (230) are joined, an adhesive may be applied to the attachment area (235). The adhesive applied to the attachment area (235) may be stored in the dummy channel (234) and function to prevent it from encroaching on the area where the branch / integration channel pattern (231), micro-channel pattern (232), and entry / exit channel pattern (233) are formed.

[0095] An inlet pipe (202) may be fixed to the inlet / outlet passage (233) of the heat-absorbing passage plate (200). The inlet pipe (202) may be used for connection to a pump (140) or a water jacket (340). Specifically, the inlet pipe (202) may fluidly connect the inlet / outlet passage (233) of the heat-absorbing passage plate (200) with the passage port (341). Additionally, the inlet pipe (202) may fluidly connect the inlet / outlet passage (233) of the heat-absorbing passage plate (200) with the pump passage (141).

[0096] Two heat-absorbing half-plates (230) can be formed into a heat-absorbing half-plate (200) by joining the surfaces on which patterns are formed facing each other. When the two heat-absorbing half-plates (230) are joined together, the grooves of the branching path pattern (231), the micropath pattern (232), and the inlet / outlet path pattern (233) can face each other to form a path (or conduit) through which refrigerant flows. The grooves may have a semicircular cross-sectional area, and when the two heat-absorbing half-plates (230) are joined together, the semicircular grooves can form a circular conduit. The process of joining the two heat-absorbing half-plates (230) with the surfaces on which patterns are formed can be performed by brazing, soldering, or laser welding. Brazing, or soldering, is a technique that uses brazing to join thin metal sheets; also known as hard soldering, it involves heating and melting the joint using adhesives such as brass or silver solder. The adhesive used is called hard solder and is often in powder or sheet form. The adhesive must have a melting point lower than that of the materials to be bonded, and a flux (solvent) is used to clean the bonding surface, with boron-based materials being commonly used. The process of heating the entire joint to achieve a bond is called furnace brazing. Laser welding is a method of joining metals using a laser, fusing two metals through very high temperatures and intense focused energy. This method is effective when handling very thin or precision parts and is generally used for precision welding in the automotive, aerospace, and electronic industries. Unlike brazing and soldering, laser welding does not require filler metal at the weld site and can achieve very high joint strength.

[0097] Two inlet and outlet flow patterns (233) that function as the inlet and outlet of the refrigerant may be positioned with the microflow pattern (232) in between. A branch flow pattern (231) may connect the inlet and outlet flow pattern (233) and the microflow pattern (232). In other words, the inlet and outlet flow pattern (233) and the branch flow pattern (231) may be positioned opposite each other with respect to the microflow pattern (232).

[0098] The branching euro pattern (231) may be a groove or euro branched from the entry / exit euro pattern (233). The micro-euro pattern (232) may be a groove or euro branched from the branching euro pattern (231). In other words, the branching euro pattern (231) may be a groove or euro of the micro-euro pattern (232) that is integrated (or merged), and the entry / exit euro pattern (233) may be a groove or euro of the branching euro pattern (231) that is integrated.

[0099] The branched euro pattern (231) may include a first branched / integrated euro, a second branched / integrated euro, and a third branched / integrated euro. The first branched / integrated euro may be a portion branched into three euros from a euro of a single entry / exit euro pattern. The second branched / integrated euro may be a portion branched into three euros from each euro of the first branched / integrated euro, and the third branched / integrated euro may be a portion branched into three euros from each euro of the second branched / integrated euro. Accordingly, in the branched euro pattern (231), one euro may be branched into 27 euros. Each of the 27 branched third branched / integrated euros may be connected to a micro-euro pattern (232). Conversely, in the branched euro pattern (231), the 27 euros may be integrated into one euro. Additionally, each channel in the microchannel pattern (232) can be branched into three channels again, and as a result, 81 microchannels can be formed in the microchannel pattern (232).

[0100] In the present disclosure, the criteria for distinguishing the incoming / outgoing flow path pattern (233), the branching flow path pattern (231), and the micro-flow path pattern (232) are based on whether the flow path is branched, the cross-sectional area of ​​the flow path, and / or whether it protrudes from the heat-absorbing flow path half-plate (230); therefore, the shape and ratio are not limited to the examples shown in the drawings.

[0101] On the opposite side of the surface where the microchannel pattern (232) is formed in the heat-absorbing half-plate (230), there are no convex protrusions or indentations, so flatness can be maintained, and accordingly, it can be closely attached to the heat transfer block (210) or processor (110).

[0102] In one embodiment, when viewed from above, the microchannel pattern (232) area of ​​the heat-absorbing channel plate (200) overlapping with the processor (110) may have a shape of at least the same size or area as the processor (110).

[0103] The heat-absorbing channel plate (200) or heat-absorbing channel half plate (230) may include a plate made of a metal material with high thermal conductivity, for example, copper. The inlet / outlet channel pattern (233), branch channel pattern (231), micro channel pattern (232), and dummy channel (234) may be formed through an etching process, a press process, and / or an intaglio process on the plate.

[0104] Meanwhile, etching technology is a technique that chemically etches and removes material using acids or other corrosive agents to form desired patterns on selected parts of a material's surface, and it is used in semiconductor integrated circuit manufacturing processes. There are three methods of etching: wet etching, dry etching (plasma etching), and ion milling. Wet etching uses an etching solution; it is inexpensive and offers good selectivity, but it contaminates the surface and is prone to undercutting the resist. Plasma etching includes methods using neutral plasma and charged plasma. Undercutting is significantly reduced (especially in the case of charged plasma), but selectivity may decrease. Finally, ion milling removes the resist using an ion beam; while it offers good selectivity and precision, the operation speed is slow, and it can only be used for positive resists (resists are prone to undercutting due to thickness variations).

[0105] In one embodiment, the micro-channel pattern (232) and / or dummy channel (234) included in the endothermic channel half-plate (230) may be formed through an etching process. After forming the micro-channel pattern (232) and / or dummy channel (234) through the etching process, the inflow / outflow channel pattern (233) and the branch channel pattern (231) may be formed by a press process. The endothermic channel plate (200) and the endothermic channel half-plate (230) may include a press process area (242) for forming the branch channel pattern (231) and the inflow / outflow channel pattern (233), and an etching process area (241) for forming the micro-channel pattern (232). The plate may be plastically deformed so that the inflow / outflow channel pattern (233) and the branch channel pattern (231) are formed by the press process.

[0106] If the etching process is performed before the press process, the difficulty of the etching process may be reduced. However, if the micro-flow pattern (232) is formed by the etching process and then the press process is performed, the connection between the micro-flow pattern (232) and the inflow / outflow pattern (233) and / or the branch flow pattern (231) may not be easy. In an embodiment to solve this problem, when forming the micro-flow pattern (232), a part of the branch flow pattern (231) may be formed together by the etching process, and the branch flow pattern (231) and the inflow / outflow pattern (233) may be formed through a press process on the part of the branch flow pattern (231) formed by the etching process.

[0107] Referring to FIG. 11, which is an enlarged view of a part of the process of FIG. 10, a part (252) of a branching channel pattern that integrates or branches a plurality of microchannels and a plurality of microchannels connected to the part (252) can be formed by an etching process. At this time, the edge of the part (252) of the branching channel pattern may have a fillet portion (252a).

[0108] In one embodiment of the present invention, a press process for forming a branching flow path pattern (231) may be further performed on a part (252) of a branching flow path pattern including a fillet portion (252a) formed by an etching process. That is, the part (252) of the branching flow path pattern and the fillet portion (252a) may be a composite process area where both an etching process and a press process are performed.

[0109] FIG. 12 is an assembly diagram of a heat dissipation channel plate of a water-cooled cooling system according to one embodiment of the present invention. FIG. 13 is a manufacturing sequence diagram and a partial enlarged view of a heat dissipation channel plate of a water-cooled cooling system according to one embodiment of the present invention. FIG. 14 is a cross-sectional view of a radiator assembly of a water-cooled cooling system according to one embodiment of the present invention.

[0110] Referring to FIGS. 12 and 14, a heat dissipation channel plate (300) may be formed by joining two heat dissipation channel half plates (301) together. The heat dissipation channel half plates (301) may include a branch channel pattern (302), a micro channel pattern (303), and an inflow / outflow channel pattern (304). The branch channel pattern (302), the micro channel pattern (303), and the inflow / outflow channel pattern (304) may be grooves formed in the plate. The two heat dissipation channel half plates (301) may be formed into a heat dissipation channel plate (300) by joining the patterned surfaces facing each other.

[0111] In one embodiment, the micro-flow pattern (303) included in the heat dissipation flow half-plate (301) can be formed through an etching process. After the micro-flow pattern (303) is formed through the etching process, the inflow / outflow flow pattern (304) and the branch flow pattern (302) can be formed by a press process. The heat dissipation flow plate (300) or the heat dissipation flow half-plate (301) may include a press process area (311) for forming the branch flow pattern (302) and the inflow / outflow flow pattern (304), and an etching process area (312) for forming the micro-flow pattern (303). In one embodiment, when forming the microchannel pattern (303), a part (305) of the branch channel pattern (302) is formed together by an etching process, and the branch channel pattern (302) and the inlet / outlet channel pattern (304) can be formed through a press process on the part (305) of the branch channel pattern (302) formed by the etching process. In one embodiment, the part (305) of the branch channel pattern (302) may further include a fillet portion. The part (305) of the branch channel pattern and the fillet portion may be a composite process area where both the etching process and the press process are performed. A redundant description of the heat endoscopy channel plate (200) and the heat dissipation channel plate (300) will be omitted.

[0112] In one embodiment, a pair of inlet / outlet passages (304) of each of the plurality of heat dissipation passage plates (300) may have a shape that extends in a curved direction from a plurality of micro-passages (303) along the longitudinal direction and faces downward (or in a direction perpendicular to the longitudinal direction). The inlet / outlet passages (304) may have a curved shape that extends by rotating from the micro-passages (303) or the branch / integration passages (302). The inlet / outlet passages (304) may be formed in protruding end regions (306) that partially protrude downward (or in a direction perpendicular to the longitudinal direction) at both ends of a rectangular heat dissipation passage plate (300) or a heat dissipation passage half plate (301). The heat dissipation passage plate (300) may be fluidly connected to the water jacket (340) by inserting the protruding end regions (306) into the slots of the water jacket frame (320). The protruding end region (306) of the heat dissipation channel plate (300) can be inserted into a slot of the water jacket frame (320) and then sealed by soldering, brazing, or laser welding.

[0113] Referring to FIG. 14, the heat dissipation channel plate (300) is fluidly connected to the water jacket (340) through the protruding end region (306), so the water jacket (340) can be located at the lower ends of both ends of the plurality of heat dissipation channel plates (300). Through this, air can freely flow in the longitudinal direction of the heat dissipation channel plate (300), thereby enabling heat dissipation.

[0114] FIG. 15 is a plan view and a cross-sectional view of a water jacket frame of a radiator assembly of a cooling system according to one embodiment of the present invention.

[0115] Referring to FIGS. 14 and 15, in one embodiment, the periphery of the inlet portion of the water jacket (340) may include a periphery groove (345) for receiving a sealing member (344), and the outer circumference of the periphery groove (345) may include a rim (346) protruding upward. The water jacket frame (320) may include a groove (321) for receiving the rim (346) of the water jacket (340). The water jacket frame (320) is joined so that the groove (321) receives the rim of the water jacket (340), and sealing between the water jacket frame (320) and the water jacket (340) can be achieved by being in close contact with the sealing member (344).

[0116] In one embodiment, the refrigerant supply port (342) can be opened and closed by a port cap (343), and the refrigerant supply port (342) can be threaded with the port cap (343). The refrigerant supply port (342) and the port cap (343) may each include a female thread (342a) and a male thread (343a) that thread-couple to each other. In one embodiment, an O-ring (347) for sealing with the refrigerant supply port (342) may be further installed on the port cap (343).

[0117] FIG. 16 is a perspective view of a high-performance processing card with a cooling system applied according to another embodiment of the present invention. FIG. 17 is an exploded perspective view of a radiator assembly of a high-performance processing card with a cooling system applied according to another embodiment of the present invention. FIG. 18 shows a part of a heat dissipation plate of a high-performance processing card with a cooling system applied according to another embodiment of the present invention.

[0118] Referring to FIGS. 16 to 18, one or more fans (400) may be additionally installed in the high-performance processing card (100). The fans (400) can actively generate an airflow directed downward from the top of the radiator assembly (130). The airflow generated by the fans (400) can increase the heat dissipation efficiency in the heat dissipation channel plate (300) of the radiator assembly (130).

[0119] In one embodiment, the main frame (310) of the radiator assembly (130) can support the heat dissipation channel plate (300) from the side. The main frame (310) can support both sides of the heat dissipation channel plate (300) so that air can freely communicate from above and below the plurality of heat dissipation channel plates (300) arranged spaced apart from each other. In one embodiment, an installation frame (410) for fixing a fan (400) may be further installed on the main frame (310). Additionally, the water jacket frame (320) and water jacket (340) included in the radiator assembly (130) may be located on both ends of the heat dissipation channel plate (300). In other words, the water jacket frame (320) and water jacket (340) may be installed at the same height as the plurality of heat dissipation channel plates (300).

[0120] The inlet / outlet passage (304) of the heat dissipation passage plate (300) may be formed by extending in the longitudinal direction from a plurality of micro-passages (303) along the longitudinal direction and may face the lateral direction. The inlet / outlet passages (304) facing each other in the longitudinal direction of the heat dissipation passage plate (300) may be inserted into slots opened in the water jacket frame (320) and fixed.

[0121] When the radiator assembly (130) of such an embodiment is installed on the printed circuit board (102), the radiator assembly (130) may be spaced upward from the printed circuit board (102). The airflow formed by the fan (400) may be discharged through the space above the printed circuit board (102) and the radiator assembly (130').

[0122] The description of the presented embodiments is provided to enable those skilled in the art to use or practice the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments without departing from the scope of the present invention. Accordingly, the present invention is not limited to the embodiments presented herein, but should be interpreted in the broadest possible scope consistent with the principles and novel features presented herein.

Claims

1. In a water-cooled cooling system for high-performance processing cards, The above high-performance processing card is: A processor mounted on a printed circuit board; A radiator assembly comprising a plurality of heat dissipation passage plates spaced apart in the width direction; A heat exchange assembly comprising a heat absorption channel plate located at the bottom of the above radiator assembly and fluidly connected to both ends of the plurality of heat dissipation channel plates; and It includes a pump located at the bottom of the above radiator assembly and fluidly connected to the heat absorption passage plate to circulate coolant between the plurality of heat dissipation passage plates and the heat absorption passage plate, and The heat of the processor located at the bottom of the heat exchange assembly, which has absorbed heat from the heat absorption channel plate, is configured to be dissipated through the plurality of heat dissipation channel plates. Water-cooled cooling system.

2. In Paragraph 1, The above radiator assembly includes a pair of water jackets each connected to both ends of the plurality of heat dissipation passage plates, and The heat-absorbing channel plate and the pump are fluidly connected through Euro ports each included in the pair of water jackets mentioned above. Water-cooled cooling system.

3. In Paragraph 2, The above water jacket further includes a chamber in which coolant is stored, wherein the chamber is covered by a water jacket frame, and The above water jacket frame includes a plurality of slots into which the ends of the plurality of heat dissipation channels are each inserted. Water-cooled cooling system.

4. In Paragraph 1, The above-mentioned heat-absorbing channel plate is formed by joining two heat-absorbing channel half-plates together, The above-mentioned heat-absorbing channel half-plate comprises an inlet / outlet channel pattern at both ends, a plurality of microchannel patterns disposed between the inlet / outlet channel patterns, and a branch / integration channel pattern connecting the inlet / outlet channel pattern and the plurality of microchannel patterns formed as a groove. Water-cooled cooling system.

5. In Paragraph 4, The plurality of microchannel patterns are manufactured by an etching process on the endothermic channel halfplate, and The above entry / exit flow path pattern and the above branch flow path pattern are manufactured by a press process on an endothermic flow path half-plate having the plurality of micro-flow path patterns formed thereon, Water-cooled cooling system.

6. In Paragraph 2, The above heat dissipation channel plate is formed by joining two heat dissipation channel half plates together, and The above heat dissipation channel half-plate comprises an entry / exit channel pattern at both ends, a plurality of micro-channel patterns disposed between the entry / exit channel patterns, and a branch / integration channel pattern connecting the entry / exit channel pattern and the plurality of micro-channel patterns formed as a groove. Water-cooled cooling system.

7. In Paragraph 6, The pair of inlet / outlet flow patterns of each of the plurality of heat dissipation flow plates are formed by extending in a curve from the plurality of micro-flow patterns along the longitudinal direction and facing downward, and the pair of water jackets are located at the lower ends of both ends of the plurality of heat dissipation flow plates. Water-cooled cooling system.

8. In Paragraph 6, Each of the plurality of heat dissipation channel plates has a pair of inlet / outlet channel patterns formed by extending longitudinally from the plurality of microchannel patterns along the longitudinal direction and facing the lateral direction, and the pair of water jackets are located at both ends of the plurality of heat dissipation channel plates. A fan is further installed on the upper portion of the plurality of heat dissipation channels, Water-cooled cooling system.

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